Endoscope image acquisition module and 4K endoscope system

Abstract

The present application relates to a kind of endoscope image acquisition module and 4K endoscope system, belong to electronic endoscope technical field, comprising: heat sink, the heat sink is equipped with chip mounting boss, the chip mounting boss is equipped with the glue groove for accommodating fixed glue;Optical circuit board, set on the heat sink, the optical circuit board is equipped with hollow mounting groove, the chip mounting boss is at least partially located in the hollow mounting groove;Photosensitive chip, set on the chip mounting boss, the photosensitive chip is set in photosensitive area corresponding the glue groove, the fixed glue is located in the glue groove and is connected with the photosensitive chip, the photosensitive chip is located in the area of photosensitive area periphery and the chip mounting boss directly abuts or is connected by thin layer fixed glue;Make the heat dissipation capacity of each area of photosensitive chip and its heating characteristic match, effectively relieve the thermal stress concentration that the chip surface is generated due to uneven temperature distribution.

Description

Technical Field

[0001] This invention belongs to the field of electronic endoscope technology, and in particular relates to an endoscope image acquisition module and a 4K endoscope system. Background Technology

[0002] CMOS image sensors are the core of endoscopic image acquisition units. In existing imaging modules, photosensitive chips mostly use BGA packaging and FR4 PCB boards. However, this traditional approach suffers from the following bottlenecks when applied to high-performance medical endoscopes: 4K CMOS generates significant heat during operation, while the FR4 substrate has extremely low thermal conductivity, causing heat to accumulate within the sealed endoscopic tubing. This temperature rise not only shortens chip lifespan but also generates severe dark current noise, degrading surgical image quality. Furthermore, due to the mismatch in thermal expansion coefficients between the chip, solder balls, and substrate, significant thermal stress is generated during operation, leading to substrate warping. This deformation effect is particularly severe for 4K chips.

[0003] Slight warping of the packaging structure can cause displacement or tilting of the photosensitive surface, causing the center of the chip to detach from the optical axis of the lens, resulting in "temperature drift" phenomena such as blurred images and defocusing at the edges.

[0004] Therefore, developing a CMOS packaging structure that can meet the requirements of efficient heat dissipation, stress control, and miniaturization is currently the key to improving the imaging performance of medical endoscopes. Summary of the Invention

[0005] The purpose of this invention is to provide an endoscope image acquisition module and a 4K endoscope system, which improves the packaging performance of CMOS image sensors.

[0006] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: One aspect proposes an endoscopic image acquisition module, comprising: A heat sink, wherein the heat sink is provided with a chip mounting boss, and the chip mounting boss is provided with an adhesive application groove for accommodating fixing adhesive; An optical circuit board is disposed on the heat sink, and the optical circuit board is provided with a hollow mounting groove, wherein at least part of the chip mounting boss is located in the hollow mounting groove. A photosensitive chip is disposed on the chip mounting protrusion. The photosensitive area of ​​the photosensitive chip is disposed corresponding to the adhesive groove. The fixing adhesive is located in the adhesive groove and connected to the photosensitive chip. The area of ​​the photosensitive chip located outside the photosensitive area is directly abutted against the chip mounting protrusion or connected through a thin layer of fixing adhesive. A first thermally conductive area is formed between the chip mounting boss and the peripheral area of ​​the photosensitive chip, and a second thermally conductive area is formed between the fixing adhesive and the photosensitive area of ​​the photosensitive chip. The thermal conductivity of the first thermally conductive area is greater than that of the second thermally conductive area.

[0007] On the other hand, a packaging method for an endoscopic image acquisition module is proposed, including the following steps: S1. A chip mounting boss is formed on the heat sink, and an adhesive groove for accommodating the fixing adhesive is formed on the chip mounting boss. S2. The optical circuit board with the hollow mounting groove is mounted on the heat sink, so that the chip mounting boss is at least partially located in the hollow mounting groove; S3. Apply fixing adhesive to the adhesive groove; S4. Mount the photosensitive chip onto the chip mounting protrusion, so that the photosensitive area of ​​the photosensitive chip corresponds to the adhesive groove, and make the area of ​​the photosensitive chip located outside the photosensitive area directly abut against the chip mounting protrusion or connected by a thin layer of fixing adhesive. S5. The electrical connection between the photosensitive chip and the optical circuit board is completed by gold wire bonding, welding or other conductive connection methods. S6. Complete the encapsulation of the image acquisition unit.

[0008] On the other hand, this disclosure also proposes a 4K endoscope system, which is equipped with an endoscope image acquisition module. Beneficial effects

[0009] This disclosure creates differentiated heat conduction paths in different areas by setting chip mounting protrusions on a heat sink and creating adhesive grooves on the protrusions corresponding to the photosensitive areas of the photosensitive chip. This ensures that the adhesive is primarily distributed at the corresponding locations of the photosensitive areas, while the peripheral area of ​​the photosensitive chip forms direct contact or an ultra-thin adhesive layer connection with the chip mounting protrusions. Because the peripheral area, which generates more heat, has higher thermal conductivity, it can quickly conduct heat to the heat sink, thereby reducing the overall temperature of the photosensitive chip and the local temperature gradient, and improving heat dissipation efficiency.

[0010] This disclosure, by centrally placing the fixative at the corresponding position of the photosensitive area and connecting the surrounding area with direct contact or a thin layer of fixative, ensures that the heat dissipation capacity of each area of ​​the photosensitive chip matches its heat generation characteristics. This effectively alleviates the thermal stress concentration caused by uneven temperature distribution on the chip surface, reduces thermal warping and saddle-shaped deformation, and improves the flatness and structural stability of the photosensitive surface.

[0011] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 This is an exploded view of the image acquisition unit provided in an embodiment of the present invention; Figure 3 A schematic diagram of the packaging structure of a CMOS image sensor provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the heat sink and chip mounting boss provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the photosensitive chip mounted on the chip mounting boss according to an embodiment of the present invention; Figure 6 This is a comparison diagram of the existing packaging structure and the packaging structure of the embodiments disclosed herein; Figure 7 Finite element analysis contour plot of the temperature field of the existing packaging structure under working conditions; Figure 8 This is a finite element analysis cloud diagram of the temperature field of the packaging structure in the working state according to an embodiment of the present invention; Figure 9 A finite element analysis cloud diagram of the temperature field of the existing packaging structure; Figure 10 This is a finite element analysis cloud diagram of the temperature field of the packaging structure in an embodiment of the present invention; Figure 11 Finite element analysis cloud diagram of thermal deformation of existing packaging structure; Figure 12 This is a finite element analysis cloud diagram of the thermal deformation of the packaging structure in an embodiment of the present invention; Figure 13 This is a diagram of the endoscope system of the present invention; in: 1-Image acquisition unit; 11-Power circuit board, 12-Heat sink, 13-Optical circuit board, 14-Photosensitive chip, 15-UV adhesive, 16-Mounting bracket, 17-Mounting plate, 18-Lens module; 121-Chip mounting boss, 122-Glue application groove, 123-Heat dissipation microhole; 131 - Hollowed-out mounting groove; 141 - Connecting gold thread; 161-Glass plate, 162-Glass plate mounting groove, 163-Light-transmitting hole; 171 - Bracket mounting slot; 100 - Insertion part, 200 - Arthroscopy sheath, 300 - Handle grip. Detailed Implementation

[0014] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0015] This invention discloses an endoscope image acquisition module and a 4K endoscope system. The device includes an image acquisition module 1. The image acquisition module 1 is based on the power circuit board 11, heat sink 12, and optical circuit board 13, and integrates functional sub-components such as power supply, light sensing conversion, fixed installation, and lens imaging.

[0016] In some specific embodiments, the heat sink 12 is the core heat dissipation and load-bearing foundation of the module. The heat sink 12 is provided with chip mounting bosses 121 for precise positioning and assembly of the optical circuit board 13, ensuring the coaxiality of the chip mounting.

[0017] The optical circuit board 13 has a mounting groove 131 for accommodating the chip mounting boss 121, so that the photosensitive chip 14 can be closely fitted and assembled with the chip mounting boss 121. The photosensitive chip 14 is the core component for converting light signals into electrical signals. The chip is provided with a connecting gold wire 141 to complete the electrical connection with the optical circuit board 13, so as to realize the rapid transmission of imaging signals.

[0018] The chip mounting boss 121 has a coating groove 122 for applying conductive adhesive, which helps to fix the photosensitive chip 14, improving the sealing and stability of the bonding. It is understood that the size and position of the coating groove 122 match the size and position of the photosensitive area of ​​the photosensitive chip 14. During installation, adhesive is applied to the coating groove 122, and then the photosensitive chip 14 is placed on the chip mounting boss 121 for fixation. This ensures that the periphery of the photosensitive chip 14 directly contacts the chip mounting boss 121, rather than indirectly contacting it through adhesive. It is understood that during installation, some adhesive will also fill the microscopic gaps between the chip and the boss contact surface through capillary action, ensuring direct heat conduction over a large area of ​​metal while eliminating microscopic air gaps. This "dry contact + local filling" method is far more efficient than the traditional "full adhesive layer mounting," and it also ensures that the adhesive layer in the ADC array distribution area is much thinner than the normally set adhesive thickness. The thickness of the adhesive directly affects its heat conduction efficiency.

[0019] The thermal conductivity of aluminum alloys or copper is typically between 200 and 400. W / (mK) Conductive silver paste, on the other hand, typically has a thermal conductivity of only 5–30. W / (mK) Furthermore, as the thickness increases, its thermal conductivity decreases exponentially.

[0020] Furthermore, the adhesive is a conductive adhesive, which enables the chip substrate and the heat sink 12 to be effectively grounded, constructing an electromagnetic shielding structure and reducing electromagnetic interference under high-frequency sampling.

[0021] Understandably, to achieve extremely high readout speeds (such as 4K / 60fps), existing CMOS components often employ a dual-sided readout architecture. The ADC array is distributed above and below the photosensitive area. The chip exhibits a temperature gradient with concentrated heat generation at the top and bottom, and relatively lower heat generation in the middle. This temperature difference can cause the chip to undergo saddle-shaped deformation or bending in the longitudinal direction, directly affecting the focusing plane of the endoscope lens.

[0022] Through the above-mentioned packaging structure design, a thicker layer of adhesive is concentrated at the photosensitive area of ​​the photosensitive chip 14, while the ADC array around the photosensitive area is directly contacted between metals or filled with ultra-thin adhesive. This allows the heat dissipation of the ADC array area to be better than that of the photosensitive area. This arrangement can reduce the lateral and longitudinal temperature gradient difference of the photosensitive chip 14 in the working state.

[0023] By implementing high-intensity heat dissipation through "direct metal contact" or "ultra-thin adhesive layer" in the ADC array area with the highest heat generation, while utilizing a thicker adhesive layer within the adhesive groove 122 to provide thermal resistance buffering in the central part of the photosensitive area with relatively low heat generation, differentiated heat conduction paths are constructed. This ensures that the heat dissipation rate of each area of ​​the photosensitive chip 14 matches its heat generation, forcibly intervening in and smoothing the temperature distribution on the chip surface, making the thermal expansion of the entire large-size silicon wafer more uniform.

[0024] Understandably, the above thermal management solution can effectively eliminate the internal stress mismatch caused by excessive heat difference at a single point, effectively suppress the tendency of the chip to produce saddle-shaped warping or nonlinear bending, and maintain the extremely high flatness of the photosensitive surface.

[0025] In this case, during full-power operation, the photosensitive center of the image sensor 14 remains strictly perpendicular to the optical axis of the lens module 18, and its physical position is always within the focal depth range of the lens, thus avoiding edge blurring and increased noise caused by thermal deformation.

[0026] It is also understandable that different dispensing shapes and amounts will affect chip mounting and Z-axis stability. Currently, the relatively advantageous solution is the snowflake-shaped dispensing method, but its dispensing shape is complex and the process requirements are high. The chip mounting boss 121 combined with the dispensing groove 122 not only optimizes heat dissipation, but also provides a unique reference for the mechanical axis, reduces the dependence on dispensing process precision, and improves the yield and coaxiality quality of large-size CMOS components in the micro endoscope packaging process.

[0027] In some disclosures, the heat sink 12 is provided with heat dissipation micro-holes 123 to increase the heat dissipation contact area, quickly dissipate the heat generated by the photosensitive chip during operation, and avoid high temperature affecting imaging performance.

[0028] Furthermore, the heat dissipation micropores 123 can be connected to a heat dissipation liquid for active heat dissipation to ensure the heat dissipation effect.

[0029] In some embodiments, a power circuit board 11 is provided below the heat sink 12, and the optical circuit board 13 is connected by flexible ribbon cable or soldered pins. This arrangement realizes the layered modular arrangement of circuit functions in the axial direction, which reduces the radial diameter of the image acquisition unit 1 while ensuring electrical independence, and ensures the space constraint requirements of the medical endoscope for the ultra-fine tube diameter.

[0030] In some disclosures, the power circuit board 11 is used to convert the raw power input from the outside into various precision voltages required by the photosensitive chip 14, providing a stable power supply for the image acquisition module, using onboard capacitors to suppress power ripple and high-frequency noise, and avoiding power interference coupling to the optical circuit board 13, thereby improving the signal-to-noise ratio of the photosensitive chip 14 in high-speed readout mode and reducing the snow and stripe effect in the image. With this configuration, the power circuit board 11 can serve as the bottom base of the image acquisition unit 1, reducing the thermal radiation impact of the power heating element on the photosensitive area through physical spacing, and acting as an electrical connection hub between the internal precision circuit and the external transmission cable.

[0031] In some embodiments, the image acquisition module 1 includes a lens module 18, which is responsible for acquiring external optical images. The light signal is transmitted to the back-end photosensitive chip 14 through an internal set of optical lenses. To ensure image sharpness and edge quality, the optical axis of the lens module 18 must be strictly aligned with the photosensitive center of the photosensitive chip 14.

[0032] The lens module 18 is physically positioned by the mounting plate 17, and the lens module 18 is located in the central mounting through hole of the mounting plate 17. The mounting plate 17 is fixed to the optical circuit board 13 by adhesive.

[0033] The image acquisition module 1 also includes a glass plate 161, which is disposed between the lens module 18 and the photosensitive chip 14. The glass plate 161 is a filter used to filter the infrared light component entering the light path, eliminate infrared interference in CMOS sensor imaging, and improve the color reproduction of endoscopic imaging in the human tissue environment.

[0034] Furthermore, the mounting plate 17 is provided with a bracket mounting groove 171 for mounting the bracket 16, and the mounting bracket 16 is provided with a glass plate mounting groove 162. The glass plate 161 is installed in the glass plate mounting groove 162, and radial positioning is achieved by the groove wall.

[0035] The lens module 18, mounting plate 17 and mounting bracket 16 are nested in sequence, and the cooperation between the components ensures that the optical path can achieve extremely high positioning accuracy within the limited space of the miniature endoscope.

[0036] Verification of thermal-mechanical coupling finite element analysis of image acquisition unit; To verify the heat dissipation performance and thermal deformation control effect of the image acquisition unit packaging structure of this disclosure, a finite element thermal-structural coupling analysis was conducted on the traditional integral adhesive layer packaging scheme and the packaging scheme of this disclosure which uses chip mounting boss 121 in conjunction with adhesive groove 122 to form a differentiated heat conduction path.

[0037] In the simulation model, both schemes use the same CMOS photosensitive chip, the same size heat sink and the same operating power. The ambient temperature is set to 25℃, the chip works continuously in high-speed readout state, and the concentrated heat generation characteristics of the ADC array area are taken into account.

[0038] The comparative scheme uses the existing technology of bonding and fixing with conductive adhesive on the entire surface, and the bottom surface of the chip is connected to the heat dissipation substrate with conductive adhesive of uniform thickness. The scheme disclosed in this paper uses chip mounting protrusion 121 to directly attach to the photosensitive chip, and sets adhesive groove 122 in the corresponding photosensitive area to form a relatively thick adhesive layer in the photosensitive area, while the ADC array area forms a metal direct contact or ultra-thin adhesive layer heat conduction structure.

[0039] Simulation results show that, under the same power consumption conditions, the proposed solution can quickly transfer the heat generated by the ADC array to the heat sink 12. The overall maximum temperature of the chip is slightly lower than that of the traditional solution, but the temperature distribution on the chip surface is more uniform, and the longitudinal and lateral temperature gradients are significantly reduced.

[0040] Further analysis of the chip's thermal deformation reveals that traditional integral adhesive layer packaging causes significant saddle-shaped warping of the chip due to concentrated heat generation in the upper and lower ADC areas, with varying degrees of Z-direction displacement at the chip's center and edges. In contrast, the proposed solution constructs differentiated heat conduction paths, resulting in more consistent thermal expansion across different regions, significantly reducing the overall chip deformation, and effectively maintaining the flatness of the photosensitive surface.

[0041] The Von Mises stress cloud diagram shows that the thermal stress distribution inside the chip and at the packaging interface of the disclosed solution is more uniform, the local stress concentration phenomenon is significantly reduced, and the risk of packaging failure, solder joint fatigue and chip cracking during long-term thermal cycling is reduced.

[0042] Understandably, due to the reduced chip warpage, the relative position of the optical axis of the lens module 18 and the photosensitive surface of the photosensitive chip 14 remains stable. During continuous operation, this effectively avoids focal plane shift caused by thermal drift, reduces problems such as edge defocus, image blur and increased noise, thereby ensuring the imaging stability of the endoscope during long-term operation.

[0043] In summary, the combination of chip mounting boss 121, adhesive coating groove 122, and differentiated heat conduction structure not only reduces the overall operating temperature of the image acquisition unit, but also effectively smooths the chip temperature distribution, reduces thermal stress and thermal deformation, and improves optical axis stability and packaging reliability, providing a reliable guarantee for the long-term stable operation of high-resolution electronic endoscopes.

[0044] In some alternative embodiments, in order to meet the strict constraints of medical endoscopes on the outer diameter of extremely fine probes and to take into account cost control, the native physical pixel resolution of the photosensitive chip 14 can be configured to a lower-than-standard 4K resolution (e.g., using a CMOS image sensor with a 1080P or lower reference).

[0045] In order to ultimately output high-quality 4K ultra-high-definition real-time video images, the image acquisition unit of this invention adopts a reconstruction algorithm that fuses multiple frame image sequences or stitches together features from multiple low-resolution images. The low-resolution images acquired multiple times or from multiple channels are pixel-level aligned, edge-sharpened, and noise-reduced and stitched together to synthesize a high-fidelity 4K video stream.

[0046] In this operating mode, the photosensitive chip 14 must continuously acquire video data at a high sampling frequency. This ultra-high frequency readout, extremely high data throughput, and stringent requirement for extremely low noise at image edges lead to a dramatic increase in instantaneous power consumption and heat generation of the ADC array and internal digital processing circuitry at the chip edges. Therefore, the differentiated thermal management architecture constructed by the chip mounting boss 121 and the adhesive groove 122 described in this invention can precisely address the industry pain points of severe localized heat generation, thermal distortion, and focal plane temperature drift in this high-frequency super-resolution sampling mode, ensuring low noise and high imaging quality at image edges during multi-frame fusion array operations.

[0047] To quantitatively verify the heat dissipation performance and thermal deformation control effect of the image acquisition unit packaging structure proposed in this invention under extreme working conditions, this embodiment uses the three-dimensional finite element analysis (FEA) method to conduct a thermal-structural strong coupling finite element simulation comparison and verification between the traditional integral adhesive layer packaging scheme and the scheme of this invention.

[0048] In this comparative simulation model, to ensure the objectivity and rigor of the results, both schemes used the same high-definition CMOS photosensitive chip (OV07251), the same heat sink material and size (copper alloy substrate), and the same rated power. Heat and power load: Based on the heat generation characteristics of the high-speed readout architecture, the actual non-uniform heat generation of the chip was strictly simulated, and the chip core load was divided into two heat generation regions. The ADC array region (heat generation region 2), located on the upper and lower sides of the photosensitive area with extremely high heat generation density, had its power consumption set at 0.3W; the photosensitive center region (heat generation region 1), located in the center with relatively low heat generation density, had its power consumption set at 0.1W.

[0049] The external ambient temperature was set to a constant 25°C, and the equivalent convective heat transfer coefficient was set on the bottom surface and outer periphery of the heat sink to simulate the heat transfer process to the endoscope micro-tubes and heat dissipation structure.

[0050] The entire bottom surface of the comparative photosensitive chip is bonded to a flat heat dissipation substrate using conductive silver paste of uniform thickness (50um).

[0051] The heat sink of this invention has a chip mounting boss, and a coating groove with a depth matching the contour of the photosensitive area is formed in the center of the boss. After mounting, a relatively thick (50µm) fixing adhesive layer is formed in the coating groove below the photosensitive area, forming the second heat-conducting area; while the ADC array areas on the periphery and the upper and lower sides are in direct metal-to-metal physical contact with the chip mounting boss, or are filled by capillary action to form an ultra-thin adhesive layer with a thickness of less than 5µm, forming the first heat-conducting area.

[0052] like Figures 7-8 As shown in the simulation comparison, under the same heat generation power, the junction temperature of the chip in this new patented packaging structure is reduced from 83.365℃ to 47.992℃ compared with the traditional packaging structure, and the chip junction temperature reduction is about 42.43%.

[0053] like Figures 9-10 As shown in the simulation comparison, under the same heating power conditions, the maximum stress of the traditional packaging structure is 70.106 MPa, while the maximum stress of the packaging structure of this patent is 44.718 MPa, and the total packaging stress is reduced by about 36.21%.

[0054] like Figures 11-12 As shown, through simulation comparison: under the same heat generation power, the first principal stress of the chip in the traditional packaging structure is 63.597MPa, while the first principal stress of the chip in the packaging structure of this patent is 25.457MPa, and the reduction in the first principal stress of the chip is about 63.12%.

[0055] Comparison Table of Finite Element Analysis of the Publicly Available Solutions This invention successfully maintains an extremely high level of flatness on the photosensitive surface of the chip. This ensures that during continuous full-power operation of the image acquisition unit, the photosensitive center of the photosensitive chip and the optical axis of the lens module remain strictly vertically aligned, with the physical position locked within the lens's depth of field. This fundamentally avoids edge defocusing and non-linear image blurring caused by thermal deformation, achieving high-definition imaging stability for the image acquisition unit during prolonged, high-intensity surgical procedures using medical electronic endoscopes.

[0056] On the other hand, this disclosure also proposes a 4K endoscope system. For example... Figure 13 As shown, the 4K endoscope system includes a hardware execution terminal and a signal processing backend; The hardware execution terminal includes: Insertion section 100: As the core optical channel for entering the human anatomical cavity, the distal end of the insertion section 100 is integrated with the endoscope image acquisition module described in the above embodiment.

[0057] Arthroscopic sleeve 200: It is fitted around the outer periphery of the insertion part 100 to provide mechanical protection and fluid passage, and to provide support and fluid perfusion during joint surgery.

[0058] Handle 300: Connected to the proximal end of the insertion part 100, and equipped with a signal transmission bus inside for surgical operators to guide and adjust the angle of the hand.

[0059] Furthermore, the 4K endoscope system also includes: Endoscope main unit: electrically connected to the grip handle 300 via a transmission cable.

[0060] Display unit: connected to the signal output terminal of the endoscope host.

[0061] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0062] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. An endoscopic image acquisition module, characterized in that, include: A heat sink, wherein the heat sink is provided with a chip mounting boss, and the chip mounting boss is provided with an adhesive application groove for accommodating fixing adhesive; An optical circuit board is disposed on the heat sink, and the optical circuit board is provided with a hollow mounting groove, wherein at least part of the chip mounting boss is located in the hollow mounting groove. A photosensitive chip is disposed on the chip mounting protrusion. The photosensitive area of ​​the photosensitive chip is disposed corresponding to the adhesive groove. The fixing adhesive is located in the adhesive groove and connected to the photosensitive chip. The area of ​​the photosensitive chip located outside the photosensitive area is directly abutted against the chip mounting protrusion or connected through a thin layer of fixing adhesive. A first thermally conductive area is formed between the chip mounting boss and the peripheral area of ​​the photosensitive chip, and a second thermally conductive area is formed between the fixing adhesive and the photosensitive area of ​​the photosensitive chip. The thermal conductivity of the first thermally conductive area is greater than that of the second thermally conductive area.

2. The endoscopic image acquisition module according to claim 1, characterized in that: The first heat-conducting area corresponds to the heat-concentrating area of ​​the photosensitive chip, and the second heat-conducting area corresponds to the photosensitive area of ​​the photosensitive chip.

3. The endoscopic image acquisition module according to claim 1, characterized in that: The outline of the adhesive-coated groove corresponds to the outline of the photosensitive area of ​​the photosensitive chip.

4. The endoscopic image acquisition module according to claim 1, characterized in that: The fixing adhesive is a conductive adhesive, a thermally conductive adhesive, or a conductive and thermally conductive adhesive.

5. The endoscopic image acquisition module according to claim 1, characterized in that: An ultra-thin adhesive layer is formed between the peripheral area of ​​the photosensitive chip and the chip mounting boss through capillary action.

6. The endoscopic image acquisition module according to claim 1, characterized in that: The peripheral area of ​​the photosensitive chip is in direct contact with the chip mounting boss at least in part.

7. The endoscopic image acquisition module according to claim 1, characterized in that: The heat sink is provided with multiple heat dissipation micro-holes, which are distributed along the circumference or bottom of the chip mounting boss.

8. The endoscopic image acquisition module according to claim 1, characterized in that: The image acquisition unit also includes a lens module, a mounting plate, a mounting bracket, and a glass plate; The lens module is fixed by the mounting plate, the glass plate is disposed between the lens module and the photosensitive chip, and the mounting bracket is used to fix the glass plate.

9. A packaging method for the electronic endoscope image acquisition unit of claim 8, characterized in that, Includes the following steps: S1. A chip mounting boss is formed on the heat sink, and an adhesive groove for accommodating the fixing adhesive is formed on the chip mounting boss. S2. The optical circuit board with the hollow mounting groove is mounted on the heat sink, so that the chip mounting boss is at least partially located in the hollow mounting groove; S3. Apply fixing adhesive to the adhesive groove; S4. Mount the photosensitive chip onto the chip mounting protrusion, so that the photosensitive area of ​​the photosensitive chip corresponds to the adhesive groove, and make the area of ​​the photosensitive chip located outside the photosensitive area directly abut against the chip mounting protrusion or connected by a thin layer of fixing adhesive. S5. The electrical connection between the photosensitive chip and the optical circuit board is completed by gold wire bonding, welding or other conductive connection methods. S6. Complete the encapsulation of the image acquisition unit.

10. A 4K endoscope system, characterized in that, The endoscope system is equipped with the endoscope image acquisition module as described in claim 1.

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