Display device and electronic device including the same

Abstract

A display device and an electronic device including the same are provided, which can include an inorganic encapsulation area surrounding a through-hole, a wiring area surrounding the inorganic encapsulation area, and a display area surrounding the wiring area. The inorganic encapsulation area includes a first organic film including a first sub-organic film having a first inclined surface and a second sub-organic film having a second inclined surface facing the first inclined surface, a first groove between the first sub-organic film and the second sub-organic film, and a protrusion including at least a portion of the first organic film, wherein the protrusion protrudes between the first sub-organic film and the second sub-organic film. The electronic device can include the display device.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2025-0037126, filed with the Intellectual Property Office on March 24, 2025, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] This disclosure relates to a display device and an electronic device including the display device. Background Technology

[0003] With the development of the information society, the demand for display devices for displaying images is increasing in various forms. For example, display devices are being used in various electronic devices such as smartphones, digital cameras, laptops, navigation systems, and smart TVs.

[0004] Display devices include light-receiving display devices such as liquid crystal displays, field emission displays, and light-emitting displays. Light-emitting display devices include, for example, organic light-emitting display devices having organic light-emitting elements, inorganic light-emitting display devices having inorganic light-emitting elements such as inorganic semiconductors, and micro light-emitting display devices having micro light-emitting elements. Summary of the Invention

[0005] One object of this disclosure is to provide a display device with improved durability.

[0006] The purpose of this disclosure is not limited to the above-described purposes, and other purposes not expressly stated will be clearly understood by those skilled in the art based on the following description.

[0007] According to various aspects of this disclosure, a display device includes: an inorganic encapsulation region surrounding a through-hole; a wiring region surrounding the inorganic encapsulation region; and a display region surrounding the wiring region. The inorganic encapsulation region includes: a first organic film including a first sub-organic film having a first opposing inclined surface and a second sub-organic film having a second opposing inclined surface facing the first opposing inclined surface; a first groove formed between the first sub-organic film and the second sub-organic film; and a protrusion formed by at least a portion of the first organic film protruding between the first sub-organic film and the second sub-organic film.

[0008] According to various aspects of this disclosure, the inorganic encapsulation region may further include: a second organic film positioned on the first organic film; and a plurality of tips, each including an exposed portion defined by the first and second organic films.

[0009] According to various aspects of this disclosure, the plurality of tips may include a first tip positioned between the first sub-organic membrane and the second organic membrane.

[0010] According to various aspects of this disclosure, the display area may include: a first organic film comprising the same material as the first organic film in the inorganic encapsulation area; a second connecting electrode positioned on the first organic film and comprising the same material as the first tip; a second organic film positioned on the second connecting electrode and comprising the same material as the second organic film in the inorganic encapsulation area; a plurality of pixel electrodes positioned on the second organic film; a common electrode positioned on the plurality of pixel electrodes; and a light-emitting layer positioned between the plurality of pixel electrodes and the common electrode.

[0011] According to various aspects of this disclosure, the plurality of tips may also include a second tip facing the first tip and positioned between the second sub-organic membrane and the second organic membrane.

[0012] According to various aspects of this disclosure, the portion of the first tip exposed to the first sub-organic membrane and the second organic membrane has a first exposure length, the portion of the second tip exposed to the second sub-organic membrane and the second organic membrane has a second exposure length, and the sum of the first exposure length and the second exposure length may be less than the width of the first groove.

[0013] According to various aspects of the invention, the first groove has an inverted trapezoidal shape, the first groove has a first width and a second width, the second width is greater than the first width, and the sum of the first exposure length and the second exposure length may be less than the second width.

[0014] According to various aspects of this disclosure, the lower surface of the first tip and the first opposing inclined surface form a first angle, and the first angle may be equal to or greater than 45 degrees and less than 90 degrees.

[0015] According to various aspects of this disclosure, the portion of the first tip exposed by the first organic membrane and the second organic membrane has a first exposure length, and the first exposure length can be greater than 0 μm and less than 2 μm.

[0016] According to various aspects of this disclosure, the first groove has an inverted trapezoidal shape, the first groove has a first width and a second width, the second width is greater than the first width, and the second width can be greater than 0 μm and equal to or less than 8 μm.

[0017] According to various aspects of this disclosure, the inorganic encapsulation region may also include a recess formed between the first relatively inclined surface and the protrusion.

[0018] According to various aspects of this disclosure, the display area includes: a plurality of pixel electrodes; a common electrode positioned on the plurality of pixel electrodes; and a light-emitting layer positioned between the plurality of pixel electrodes and the common electrode, and the inorganic encapsulation area may further include a first residue positioned in a first recess and comprising the same material as the light-emitting layer.

[0019] According to various aspects of this disclosure, the inorganic encapsulation region may also include a second residue positioned on the first residue and comprising the same material as the common electrode.

[0020] According to various aspects of this disclosure, the inorganic encapsulation region may further include a first inorganic encapsulation film covering at least a portion of the first relatively inclined surface, at least a portion of the second relatively inclined surface, and the second residue.

[0021] According to various aspects of this disclosure, the inorganic encapsulation region may further include a first inorganic encapsulation film that simultaneously covers at least a portion of the first relatively inclined surface, at least a portion of the recess, and at least a portion of the protrusion.

[0022] According to various aspects of this disclosure, an electronic device includes: a processor configured to provide image signals; a display module configured to receive image signals from the processor and display an image; and a power module configured to supply power to the display module. The display module includes: an inorganic encapsulation region surrounding a through-hole; a wiring region surrounding the inorganic encapsulation region; and a display region surrounding the wiring region. The inorganic encapsulation region includes: a first organic film including a first sub-organic film having a first relatively inclined surface and a second sub-organic film having a second relatively inclined surface facing the first relatively inclined surface; a first groove formed between the first sub-organic film and the second sub-organic film; and a protrusion formed by at least a portion of the first organic film protruding between the first sub-organic film and the second sub-organic film.

[0023] According to various aspects of this disclosure, the inorganic encapsulation region may further include: a second organic film positioned on the first organic film; and a plurality of tips, each including an exposed portion defined by the first and second organic films, and the plurality of tips may include a first tip positioned between the first sub-organic film and the second organic film.

[0024] According to various aspects of this disclosure, the inorganic encapsulation region may also include a recess formed between the first relatively inclined surface and the protrusion.

[0025] According to various aspects of this disclosure, the display area includes: a plurality of pixel electrodes; a common electrode positioned on the plurality of pixel electrodes; and a light-emitting layer positioned between the plurality of pixel electrodes and the common electrode, and the inorganic encapsulation area may further include: a first residue positioned in a first groove and comprising the same material as the light-emitting layer; and a second residue positioned on the first residue and comprising the same material as the common electrode.

[0026] According to various aspects of this disclosure, the inorganic encapsulation region may further include a first inorganic encapsulation film that simultaneously covers at least a portion of the first relatively inclined surface, at least a portion of the recess, and at least a portion of the protrusion.

[0027] According to various aspects of this disclosure, the adhesive strength of the encapsulation layer can be improved by using multiple tips and grooves, thereby preventing damage caused by peeling of the protective film during the manufacturing process.

[0028] It should be noted that the effects of this disclosure are not limited to those described above, and additional effects will become apparent from the following description. Attached Figure Description

[0029] The above and other features of this disclosure will become more apparent from a detailed description of aspects thereof with reference to the accompanying drawings, in which: Figure 1 This is a plan view showing a display panel and a driver IC according to one aspect of this disclosure; Figure 2 This is a cross-sectional view showing an example of a display device in which the circuit board is bent, according to one aspect of the present disclosure; Figure 3 This is a cross-sectional view showing an example of the display area of ​​a display panel according to one aspect of this disclosure; Figure 4 and Figure 5 This is a cross-sectional view showing the steps in the manufacturing process of a display device according to one aspect of the present disclosure; Figure 6 This is a cross-sectional view showing a display device according to one aspect of the present disclosure; Figure 7 yes Figure 1 A magnified view of a portion of region I; Figure 8 yes Figure 7 A magnified view of a portion of region J; Figure 9 yes Figure 8 A magnified view of a portion of region K; Figure 10 It shows along Figure 9 A cross-sectional view of one side of the display panel cut by the line X-X'; Figure 11 yes Figure 10 A magnified view of a portion of region L; Figure 12 yes Figure 11 A magnified view of a portion of region L; Figure 13 and Figure 14 It is shown Figure 11 and Figure 12 A magnified view of the deformed shape of the structure depicted in the image; Figures 15 to 17 This is a cross-sectional view showing the steps in the process of forming a display device according to one aspect of the present disclosure; Figure 18It is a block diagram of an electronic device according to one aspect of this disclosure; and Figure 19 A set of schematic diagrams of electronic devices according to various aspects of this disclosure are presented. Detailed Implementation

[0030] The advantages and features of the aspects disclosed herein, as well as methods of implementing them, will become apparent from the detailed description of the aspects with reference to the accompanying drawings. However, the technical features of this disclosure are not limited to the aspects disclosed herein, but can take many different forms, and these aspects are provided merely to fully and adequately inform those skilled in the art to which this disclosure pertains. It should be understood that this disclosure is limited by the scope of the claims.

[0031] Referring to an element or layer "on" another element or layer includes both cases where the element or layer is directly on top of the other element or layer, or where other elements are placed between the element or layer and the other element or layer. Throughout this specification, the same reference numerals refer to the same components. The shapes, dimensions, proportions, angles, quantities, etc., disclosed in the drawings for illustrating aspects are exemplary and are not intended to limit the shapes, dimensions, proportions, angles, quantities, etc., shown herein.

[0032] Although the terms "first" and "second" are used to describe various components, these components are not limited to these terms. Therefore, the first component mentioned herein can also be a second component within the technical concept of this disclosure.

[0033] Each of the features disclosed herein can be combined, either partially or entirely, or with one another, and can be technically interlocked and operated in various ways; each aspect can be practiced independently or in combination with one another.

[0034] Specific aspects will now be described with reference to the accompanying drawings. Constructions that are substantially identical in function across the various aspects are given the same reference numerals, and redundant descriptions are omitted.

[0035] Figure 1 This is a plan view showing a display panel and a driver IC according to one aspect of this disclosure. Figure 2 This is a cross-sectional view showing an example of a display device in which the circuit board is bent, according to one aspect of the present disclosure.

[0036] Reference Figure 1 and Figure 2According to one aspect of this disclosure, the display device 10 may include a through-hole TH. The through-hole TH is a hole capable of transmitting light, and may be a physical hole that penetrates not only the display panel 100 but also the panel back cover PB and the polarizing film PF, but is not limited thereto. Optionally, the through-hole TH may penetrate the panel back cover PB but not the display panel 100 or the polarizing film PF. A cover window CW may be arranged to cover the through-hole TH.

[0037] Through-hole TH can penetrate the substrate SUB and thin-film transistor layer TFTL of the display panel 100 (see...) Figure 3 ), encapsulation layer ENC and sensor electrode layer SENL.

[0038] According to one aspect, the electronic device including the display device 10 may also include an optical device OPD positioned in the through-hole TH. The electronic device according to one aspect can be not only a portable electronic device (such as a mobile phone, smartphone, tablet PC, smartwatch, watch phone, mobile communication terminal, e-notebook, e-book reader, portable multimedia player (PMP), navigation device, or ultra-mobile PC (UMPC)), but also a television, laptop computer, monitor, digital signage, or Internet of Things (IoT) device, but is not limited thereto.

[0039] The optical device OPD can be spaced apart from the display panel 100, the panel back cover PB, and the polarizing film PF. The optical device OPD can be an optical sensor (such as a proximity sensor, illuminance sensor, or camera sensor) used to detect light incident through the through-hole TH.

[0040] Reference Figure 2 The display device 10 may include a display panel 100, a polarizing film PF, a cover window CW, and a panel bottom cover PB. The display panel 100 may include a substrate SUB, a display layer DISL, an encapsulation layer ENC, and a sensor electrode layer SENL.

[0041] The substrate SUB can include a rigid material. For example, the substrate SUB can include glass. The substrate SUB can include ultrathin glass (UTG) with a thickness of approximately 200 μm or less.

[0042] The substrate SUB may include flexible materials. For example, the substrate SUB may include polyimide.

[0043] The display layer DISL can be positioned on the first surface of the substrate SUB. The display layer DISL can be a layer for displaying images. The display layer DISL may include a thin-film transistor layer (TFTL) on which thin-film transistors are formed, and a light-emitting element layer (EML) in which light-emitting elements are arranged in the light-emitting regions (see...). Figure 3 ).

[0044] The display panel 100, including the display layer DISL, may include a display area DA and a non-display area NDA surrounding the display area DA. In the display area DA of the display layer DISL, scan lines, data lines, and power lines for enabling light to be emitted from the light-emitting area can be arranged. In the non-display area NDA of the display layer DISL, a scan driver circuit unit for outputting scan signals to the scan lines and fan-out lines connecting the data lines to the driver IC 200 can be arranged, and multiple pads (or solder pads) PDs electrically connected to the driver IC 200 can also be arranged.

[0045] The encapsulation layer ENC prevents oxygen and / or moisture from penetrating into the light-emitting element layer (EML) of the display layer (DISL). The encapsulation layer ENC can be a layer used to encapsulate the EML of the display layer (DISL). The encapsulation layer ENC can be disposed on the display layer (DISL). The encapsulation layer ENC can be disposed on the top and side surfaces of the display layer (DISL). The encapsulation layer ENC can be disposed to cover the display layer (DISL).

[0046] A sensor electrode layer (SENL) can be disposed on a display layer (DISL). The SENL can include sensor electrodes. The SENL can use these sensor electrodes to detect user touches.

[0047] A polarizing film PF can be disposed on the display panel 100 to reduce external light reflection. The polarizing film PF may include a first substrate component, a linear polarizer, a phase retardation film (e.g., a quarter-wave plate), and a second substrate component. The first substrate component, the phase retardation film, the linear polarizer, and the second substrate component of the polarizing film PF may be stacked sequentially on the display panel 100.

[0048] The cover window (CW) can be placed on the polarizing film (PF). The cover window (CW) can be attached to the polarizing film (PF) using a transparent adhesive component such as an optically clear adhesive (OCA) film.

[0049] The panel back cover PB can be disposed on the second surface of the substrate SUB of the display panel 100. The second surface of the substrate SUB can be the surface opposite to the first surface. The panel back cover PB can be attached to the second surface of the substrate SUB of the display panel 100 via an adhesive member. The adhesive member can be a pressure-sensitive adhesive (PSA).

[0050] The panel bottom cover PB may include at least one of the following: a light-shielding member for absorbing light incident from the outside, a buffer member for absorbing external impacts, and a heat dissipation member for effectively dissipating heat from the display panel 100.

[0051] A light-shielding member may be disposed below the display panel 100. The light-shielding member can block the transmission of light and prevent components (such as circuit board 300) disposed below the light-shielding member from being seen from the top of the display panel 100. The light-shielding member may include a light-absorbing material (such as black pigment or black dye).

[0052] A buffer member can be disposed below the light-shielding member. The buffer member can absorb external impacts and prevent damage to the display panel 100. The buffer member can include a single layer or multiple layers. For example, the buffer member can include polymer resins such as polyurethane, polycarbonate, polypropylene, or polyethylene, or can include elastic materials such as sponge formed from foamed rubber, urethane materials, or acrylic materials.

[0053] The heat dissipation component can be arranged below the buffer component. The heat dissipation component may include a first heat dissipation layer containing graphite or carbon nanotubes and a second heat dissipation layer containing a thin metal film (such as copper, nickel, ferrite or silver) with excellent thermal conductivity and the ability to shield electromagnetic waves.

[0054] The circuit board 300 can be bent toward the lower part of the display panel 100. The circuit board 300 can be attached to the lower surface of the panel bottom cover PB by means of an adhesive member 310. The adhesive member 310 can be a PSA.

[0055] Figure 3 This is a cross-sectional view showing an example of the display area of ​​a display panel according to one aspect of this disclosure. Figure 3 It can also be along Figure 1 An illustration of an example of a display panel 100 with Z-Z' cut lines.

[0056] Reference Figure 3 According to one aspect of this disclosure, the display panel 100 may be an organic light-emitting display panel including a light-emitting element LEL containing a light-emitting layer 172.

[0057] The display layer DISL may include a thin film transistor layer TFTL containing multiple thin film transistors (TFTs) and a light-emitting element layer EML containing multiple light-emitting elements (LELs).

[0058] The first buffer film BF1 can be positioned on the substrate SUB. The first buffer film BF1 may include an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide. Optionally, the first buffer film BF1 can be formed as a multilayer film in which multiple layers of silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide are alternately stacked.

[0059] The active layer of a thin-film transistor (TFT), comprising a channel region (TCH), a source region (TS), and a drain region (TD), can be positioned on a first buffer film (BF1). The active layer can be formed of polycrystalline silicon (such as low-temperature polycrystalline silicon), monocrystalline silicon, amorphous silicon, or oxide semiconductor materials. When the active layer comprises polycrystalline silicon or oxide semiconductor materials, the source region (TS) and drain region (TD) of the active layer can be conductive regions doped with ions or impurities to achieve conductivity.

[0060] The gate insulating film 130 can be positioned on the active layer of the thin-film transistor TFT. The gate insulating film 130 may include an inorganic film (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0061] The gate electrode TG of the thin-film transistor TFT, the first capacitor electrode CAE1 of the capacitor Cst, and the first gate metal layer of the scan line can be positioned on the gate insulating film 130. The gate electrode TG of the thin-film transistor TFT can be stacked with the channel region TCH in a third direction (e.g., the Z-axis direction). The first gate metal layer can be formed as a single layer or multiple layers of one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0062] The first interlayer insulating film 141 may be positioned on the first gate metal layer. The first interlayer insulating film 141 may include an inorganic film (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). The first interlayer insulating film 141 may include multiple inorganic films.

[0063] The second gate metal layer, including the second capacitor electrode CAE2 of capacitor Cst, can be positioned on the first interlayer insulating film 141. The second capacitor electrode CAE2 can be stacked with the first capacitor electrode CAE1 in a third direction (e.g., the Z-axis direction). Therefore, capacitor Cst can be formed from the first capacitor electrode CAE1, the second capacitor electrode CAE2, and an inorganic insulating dielectric film, which serves as the dielectric layer between the first capacitor electrode CAE1 and the second capacitor electrode CAE2. The second gate metal layer can be formed as a single layer or multiple layers of one or more of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, or alloys thereof.

[0064] The second interlayer insulating film 142 may be positioned on the second gate metal layer. The second interlayer insulating film 142 may include an inorganic film (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). The second interlayer insulating film 142 may include multiple inorganic films.

[0065] A first data metal layer, including a first connection electrode CE1 and a data line, can be positioned on a second interlayer insulating film 142. The first connection electrode CE1 can be connected to the drain region TD through a first contact hole CT1 penetrating the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142. The first data metal layer can be formed as a single layer or multiple layers of one or more of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, or alloys thereof.

[0066] A first organic film 160 for planarizing the steps formed by the thin-film transistor (TFT) can be positioned on the first connection electrode CE1. The first organic film 160 may include organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0067] A second data metal layer, including the second connecting electrode CE2, can be positioned on the first organic film 160. The second data metal layer can be connected to the first connecting electrode CE1 through a second contact hole CT2 penetrating the first organic film 160. The second data metal layer can be formed as a single layer or multiple layers of one or more of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu or alloys thereof.

[0068] The second organic film 180 may be positioned on the second connecting electrode CE2. The second organic film 180 may comprise an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. The first organic film 160 and the second organic film 180 in the display area DA may be respectively connected to the inorganic encapsulation area IEA (see...). Figure 7 The first organic membrane 160 and the second organic membrane 180 in the ) comprise the same material.

[0069] The second data metal layer and the second organic film 180, including the second connecting electrode CE2, can be omitted.

[0070] The light-emitting element layer (EML) can be positioned on the thin-film transistor layer (TFTL). The EML may include a light-emitting element (LEL) and a 190° fin.

[0071] Each of the light-emitting elements (LELs) may include a pixel electrode 171, a light-emitting layer 172, and a common electrode 173. The light-emitting region EA may be a region in which the pixel electrode 171, the light-emitting layer 172, and the common electrode 173 are sequentially stacked such that holes from the pixel electrode 171 and electrons from the common electrode 173 recombine in the light-emitting layer 172 to emit light. In this case, the pixel electrode 171 can be used as the anode, and the common electrode 173 can be used as the cathode.

[0072] A pixel electrode layer, including pixel electrode 171, can be formed on the second organic film 180. Pixel electrode 171 can be connected to the second connection electrode CE2 through a third contact hole CT3 penetrating the second organic film 180. The pixel electrode layer can be formed as a single layer or multiple layers of one or more of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu or alloys thereof.

[0073] In the top-emitting structure in which light is emitted from the light-emitting layer 172 toward the common electrode 173, the pixel electrode 171 can be formed as a single layer of Mo, Ti, Cu, or Al, or as a stacked structure (such as Ti / Al / Ti, ITO / Al / ITO, or ITO / APC / ITO) to increase reflectivity. Here, APC is an alloy of silver (Ag), palladium (Pd), and Cu.

[0074] Dike 190 is used to limit the pixel SP (see Figure 1 The light-emitting region EA of the pixel electrode 171 is exposed. For this purpose, a dam 190 can be formed on the second organic film 180 to expose a portion of the pixel electrode 171. The dam 190 can cover the edge of the pixel electrode 171. The dam 190 can be positioned within the third contact hole CT3. That is, the third contact hole CT3 can be filled by the dam 190. The dam 190 can comprise an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0075] Spacer 191 may be positioned on dam 190. Spacer 191 may be used to support the mask during the fabrication of light-emitting layer 172. Spacer 191 may comprise organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0076] A light-emitting layer 172 can be formed on the pixel electrode 171. The light-emitting layer 172 can emit light of a predetermined color by including organic materials. For example, the light-emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer. The organic material layer may include a host and a dopant. The organic material layer may include materials for emitting the predetermined light and may be formed using phosphorescent or fluorescent materials.

[0077] A common electrode 173 can be formed on the light-emitting layer 172. The common electrode 173 can be formed to cover the light-emitting layer 172. The common electrode 173 can be a common layer covering the light-emitting region EA. A capping layer can be formed on the common electrode 173.

[0078] In the top-emitting structure, the common electrode 173 may include a transparent conductive oxide (TCO) material that transmits light (such as ITO or IZO) or a semi-transmissive conductive material (such as magnesium (Mg), silver, or alloys thereof). When the common electrode 173 includes a semi-transmissive conductive material, the luminous efficiency can be improved due to the microcavity effect.

[0079] An encapsulation layer (ENC) can be formed on the light-emitting element layer (EML). The ENC may include at least one inorganic film (such as a first inorganic encapsulation film TFE1 and a second inorganic encapsulation film TFE3) to prevent oxygen or moisture from penetrating into the EML. Alternatively, the ENC may include at least one organic film to protect the EML from foreign matter such as dust. For example, the ENC may include a first inorganic encapsulation film TFE1, an organic encapsulation film TFE2, and a second inorganic encapsulation film TFE3.

[0080] A first inorganic encapsulation film TFE1 can be positioned on the common electrode 173, an organic encapsulation film TFE2 can be positioned on the first inorganic encapsulation film TFE1, and a second inorganic encapsulation film TFE3 can be positioned on the organic encapsulation film TFE2. The first inorganic encapsulation film TFE1 and the second inorganic encapsulation film TFE3 can be formed as a multilayer film in which one or more of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The organic encapsulation film TFE2 can include organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0081] The sensor electrode layer SENL is positioned on the encapsulation layer ENC. The sensor electrode layer SENL may include sensor electrodes TE and RE.

[0082] The second buffer film BF2 can be positioned on the encapsulation layer ENC. The second buffer film BF2 may include at least one inorganic film. For example, the second buffer film BF2 can be formed as a multilayer film in which one or more of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are stacked alternately. The second buffer film BF2 may be omitted.

[0083] The first connecting portion BE1 can be positioned on the second buffer film BF2. The first connecting portion BE1 can be formed as a single layer of Mo, Ti, Cu or Al, or as a stacked structure of Ti / Al / Ti, ITO / Al / ITO or ITO / APC / ITO.

[0084] The first sensor insulating film TINS1 can be positioned on the first connection portion BE1. The first sensor insulating film TINS1 may include an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0085] The sensor electrodes TE and RE (i.e., the driving electrode TE and the sensing electrode RE) can be positioned on the first sensor insulating film TINS1. Additionally, the dummy pattern TCNT1 can be positioned on the first sensor insulating film TINS1. The driving electrode TE, the sensing electrode RE, and the dummy pattern TCNT1 are not superimposed on the light-emitting region EA. The driving electrode TE, the sensing electrode RE, and the dummy pattern TCNT1 can be formed as a single layer of Mo, Ti, Cu, or Al, or as a stacked structure of Ti / Al / Ti, ITO / Al / ITO, or ITO / APC / ITO.

[0086] The second sensor insulating film TINS2 can be positioned on the driving electrode TE, the sensing electrode RE, and the dummy pattern TCNT1. The second sensor insulating film TINS2 can include at least one of an inorganic film and an organic film. The inorganic film can be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic film can include acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0087] Figure 4 and Figure 5 This is a cross-sectional view showing the steps in the manufacturing process of a display device according to one aspect of the present disclosure.

[0088] The manufacturing process of a display device according to one aspect of this disclosure may include multiple steps.

[0089] As a step, multiple display units can be formed on the first surface of the mother substrate MSUB.

[0090] As a subsequent step, a plurality of first protective films PRF1 can be attached to the display unit. Each of the first protective films PRF1 can be a buffer film for protecting the display unit from external impacts. The first protective films PRF1 may include a transparent material. Furthermore, the display unit can be inspected.

[0091] As a subsequent step, the first laser can be irradiated onto a second surface of the mother substrate MSUB facing the first surface. Multiple first laser irradiation areas can be formed along the edge of the display unit. In one aspect, various types of lasers can be used as the first laser.

[0092] The laser used to form the first laser irradiation area can be irradiated with a repetition rate of 10 kHz to 250 kHz, a processing speed of 10 mm / s to 250 mm / s, and a pulse energy of 10 μJ to 300 μJ. However, in order to achieve a depth of approximately 225 μm from the first surface of the mother substrate MSUB, the first laser can be irradiated with, for example, a repetition rate of approximately 17.5 kHz to 125 kHz, a processing speed of 17.5 mm / s to 125 mm / s, and a pulse energy of 25 μJ to 178 μJ.

[0093] As a subsequent step, a second laser can be applied to the second surface of the mother substrate MSUB. Multiple second laser-irradiated areas CH2 can be formed for creating vias TH in each display unit. In one aspect, to shorten process time, multiple laser devices can be used to simultaneously irradiate the first and second lasers.

[0094] The second cutting line can be defined as a virtual line connecting the second laser irradiation area CH2 on a plane. The second cutting line can be formed by irradiating the via TH with a second laser to create the second laser irradiation area CH2 along the edge of the via TH. The second cutting line can depend on the shape and / or form of the via TH. For example, when the via TH has a circular planar shape, the second cutting line can be formed as a circle.

[0095] Although various types of lasers can be used as the first and second lasers according to one aspect, in this disclosure, the first and second lasers are exemplified as Bessel beams with an infrared range having a wavelength of approximately 1030 nm.

[0096] The depth of the first laser irradiation region formed by the first laser and the depth of the second laser irradiation region CH2 formed by the second laser can be different. The depth of the first laser irradiation region can be defined as the longitudinal depth (or sketch length) of the first laser irradiation region, and the depth of the second laser irradiation region CH2 can be defined as the longitudinal depth (or sketch length) of the second laser irradiation region CH2.

[0097] As a subsequent step, refer to Figure 4 The second protective film PRF2 can be attached to the first protective film PRF1.

[0098] A second protective film PRF2 can be attached to the first protective film PRF1 and the exposed portions of the mother substrate MSUB not covered by the first protective film PRF1. The second protective film PRF2 can cover the first laser irradiation area and the second laser irradiation area CH2. The second protective film PRF2 can be an acid-resistant film used to protect the display unit from the etchant during the etching process performed on the mother substrate MSUB in subsequent steps.

[0099] As a subsequent step, refer to Figure 4 This allows the etchant to be sprayed onto the second surface of the mother substrate MSUB without a separate mask. Therefore, the thickness of the mother substrate MSUB can be reduced.

[0100] Alternatively, the mother substrate MSUB can be cut along CH2 of the first laser irradiation area and the second laser irradiation area.

[0101] When the etchant is sprayed onto the second surface of the parent substrate MSUB, the thickness of the parent substrate MSUB can be reduced from a first thickness to a second thickness. Since the parent substrate MSUB is etched without a separate mask, the parent substrate MSUB can be uniformly etched over its entire second surface.

[0102] Each of the second laser irradiation regions CH2 may include a physical aperture formed by the second laser and a region surrounding the physical aperture in which the physical properties have been altered by the second laser. Optionally, each of the second laser irradiation regions CH2 may be a region in which the physical properties have been altered by the second laser and there is no physical aperture. Therefore, the etch rate of the etchant at each of the second laser irradiation regions CH2 can be higher than the etch rate in other regions of the mother substrate MSUB that are not irradiated by the second laser.

[0103] Because the depth of each of the second laser-irradiated regions CH2 is greater than the depth of the first laser-irradiated region, the etchant can penetrate into the second laser-irradiated region CH2 earlier than into the first laser-irradiated region. That is, as the thickness of the parent substrate MSUB is reduced using the etchant-based thinning process, the second laser-irradiated region CH2 is etched, and a tapered profile can be formed at the substrate SUB within the via TH formed by the second laser-irradiated region CH2 through isotropic etching. In contrast, etching may not be performed in the first laser-irradiated region during the thinning process.

[0104] As a subsequent step, refer to Figure 5 After the etching process is completed, the second protective film PRF2 can be peeled off. Additionally, the driver IC and circuit board can be attached to each of the multiple display units, and the first protective film PRF1 can be peeled off from the display unit.

[0105] During the process of peeling off the second protective film PRF2, one side of the cut portion of the second protective film PRF2 can be lifted. The lifted side can be adjacent to the through-hole TH.

[0106] When one side of the second protective film PRF2 is peeled off, the adhesive forces between the second protective film PRF2 and the display layer DISL, encapsulation layer ENC, and sensor electrode layer SENL may affect components positioned beneath the second protective film PRF2. For example, the light-emitting element layer EML positioned beneath the second protective film PRF2 may tear during the peeling of the second protective film PRF2. Compared to other components (e.g., the sensor electrode layer SENL and encapsulation layer ENC), the light-emitting element layer EML can have a smaller thickness in the thickness direction (e.g., the Z-axis direction). For example, the light-emitting layer positioned in the light-emitting element layer EML can have a very small thickness. Therefore, tearing damage caused by the adhesive forces of the second protective film PRF2 may occur relatively frequently.

[0107] Reference Figure 5 The enlarged view shows that when one side of the light-emitting element layer (EML) is divided into upper and lower parts, one side of the sensor electrode layer (SENL) and the encapsulation layer (ENC) may be lifted together with the upper part of the EML in the upward direction of the display device. A gap may be generated between the upper and lower parts of the EML.

[0108] During the peeling of the second protective film PRF2, moisture or oxygen may penetrate the gaps in the light-emitting element layer EML, which could affect the display area. As a result, the durability of the display device may be reduced.

[0109] Figure 6 This is a cross-sectional view showing a display device according to one aspect of the present disclosure.

[0110] Reference Figure 6 According to one aspect of this disclosure, a display device may include an inorganic encapsulation region (IEA). The display region (DA) may include a substrate (SUB) and a light-emitting element layer (EML) and an encapsulation layer (ENC) disposed on the substrate (SUB). The light-emitting element layer (EML) may include a light-emitting layer. The inorganic encapsulation region (IEA) may include a substrate (SUB) and an encapsulation layer (ENC) positioned on the substrate (SUB). The inorganic encapsulation region (IEA) may also include a light-emitting layer. The light-emitting layer positioned in the inorganic encapsulation region (IEA) may not actually emit light, but may be a residue (or a first residue) of the light-emitting layer left after it has been disposed over the entire display panel. The substrate (SUB) may be derived from the aforementioned parent substrate (MSUB).

[0111] The impact on the light-emitting element layer (EML) during the peeling of the second protective film (PRF2) can be reduced by using an encapsulation layer (ENC) positioned within the inorganic encapsulation region (IEA). For example, in a display device according to one aspect of this disclosure, the adhesion between the encapsulation layer (ENC) positioned within the inorganic encapsulation region (IEA) and the components below the encapsulation layer (ENC) (e.g., the thin-film transistor layer (TFTL) and the substrate (SUB)) can be enhanced, thus preventing the light-emitting layer positioned within the inorganic encapsulation region (IEA) from being separated. Consequently, external moisture or oxygen can not penetrate, and the pixels positioned within the display region (DA) can be protected.

[0112] Figure 7 yes Figure 1 A magnified view of a portion of region I.

[0113] Reference Figure 7 The display panel may include an inorganic encapsulation area IEA surrounding the through-hole TH and a wiring area WLA surrounding the inorganic encapsulation area IEA.

[0114] The inorganic encapsulation area (IEA) can be a region used to prevent oxygen or moisture from penetrating into the light-emitting element layer (EML) of the display layer (DISL) through the via (TH). For example, since the first inorganic encapsulation film (TFE1) and the second inorganic encapsulation film (TFE3) of the encapsulation layer (ENC) are in contact with each other, the penetration of oxygen or moisture can be prevented.

[0115] The inorganic encapsulation area (IEA) may include at least one dam, at least one tip, and at least one groove.

[0116] The wiring area WLA can be an area where circuitous wiring is arranged due to the presence of vias TH. Some of the circuitous wiring can connect to data lines, and others can connect to second power lines that are subjected to a second power voltage higher than the first power voltage. Still others can connect to scan lines. The wiring area WLA can be surrounded by the display area DA.

[0117] Figure 8 yes Figure 7 A magnified view of a portion of region J.

[0118] Reference Figure 7 and Figure 8 The inorganic package area (IEA) may include a recess GR. The recess GR may have a width GRW that is the length in one direction (e.g., the X-axis direction). The recess GR may be formed to surround a via TH in a closed curve shape. Multiple recess GRs may be formed. Among multiple recess GRs, since one recess GR surrounds the via TH in a closed curve shape, it may not include points of intersection with other recess GRs.

[0119] When the through-hole TH is circular in the plan view, the groove GR can be shown as a straight line in the enlarged plan view. For example, the grooves GR can be arranged to extend in a second direction (e.g., the Y-axis direction) and may not intersect each other. Dams can be arranged between the grooves GR, and their details will be described later.

[0120] The adhesive strength of the encapsulation layer ENC can be enhanced by forming grooves GR in the inorganic encapsulation region IEA. Therefore, tearing due to the separation of the second protective film PRF2 during the manufacturing process can be prevented.

[0121] In one aspect, the width GRW of the groove GR can be from 0.1 μm to 8 μm. By forming the width GRW to be sufficiently small, the adhesive strength of the encapsulation layer ENC can be enhanced. Details of enhancing adhesive strength will be described later.

[0122] Figure 9 yes Figure 8 A magnified view of a portion of region K. Figure 10 It shows along Figure 9 A cross-sectional view of an example display panel cut by the line X-X'.

[0123] The cross-sectional view taken along line X-X' includes the light-emitting layer 172, the common electrode 173, the second organic film 180, and the dam 190. Since region K is located between display region DA and via TH, the light-emitting layer 172, the common electrode 173, the second organic film 180, and the dam 190 may not actually be arranged in region K, but are shown to aid in understanding their relevance to the cross-sectional view taken along line Z-Z'.

[0124] For example, in a cross-sectional view taken along line X-X', the second organic film 180 may be a sub-dam, the dam 190 may be another sub-dam, the light-emitting layer 172 may be a light-emitting layer residue (or a first residue) that extends along each break region and does not emit light, and the common electrode 173 may be a common electrode residue (or a second residue) that extends along each break region and does not perform the function of an electrode.

[0125] However, for convenience, reference numerals are provided in the accompanying drawings to directly indicate the relationship with the light-emitting elements arranged in the display area DA.

[0126] Reference Figure 3 , Figure 9 and Figure 10In the inorganic packaging area (IEA), the first dummy pattern DP1 can be positioned on the same layer as the second gate metal layer, which includes the second capacitor electrode CAE2 (Cst), and comprises the same material. For example, the first dummy pattern DP1 can be positioned on the first interlayer insulating film 141. The first dummy pattern DP1 can be formed as a single layer or multiple layers of one or more of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, or alloys thereof.

[0127] The second dummy pattern DP2 can be positioned on the same layer as the first data metal layer, which includes the first connecting electrode CE1 and the data line, and can comprise the same material. For example, the second dummy pattern DP2 can be positioned on the second interlayer insulating film 142. The second dummy pattern DP2 can be formed as a single layer or multiple layers of one or more of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu or alloys thereof.

[0128] The second dummy pattern DP2 can be superimposed on the first dummy pattern DP1 in a third direction (e.g., the Z-axis direction).

[0129] The first tip T1 to the eighth tip T8 may be located on the same layer as the second data metal layer including the second connecting electrode CE2 and may comprise the same material. For example, the first tip T1 to the eighth tip T8 may be located on the first organic film 160. Each of the first tip T1 to the eighth tip T8 may be formed as a single layer or multiple layers of one or more of Mo, Al, Cr, Au, Ti, Ni, Nd and Cu or alloys thereof.

[0130] The first tips T1 to the eighth tips T8 can be connected to the second dummy pattern DP2 respectively through contact holes penetrating the first organic film 160. Each of the first tips T1 to the eighth tips T8 may have an eaves structure in which portions of its upper and lower surfaces are not covered by the first organic film 160, the second organic film 180, the first dam HDAM1, or the second dam HDAM2. For example, some of the first tips T1 to the eighth tips T8 (e.g., the fourth tip T4 and the fifth tip T5) may be integrally formed. Each of the first tips T1 to the eighth tips T8 may be a protrusion or groove pattern for forming a groove (or channel).

[0131] The recess GR located in the inorganic packaging area IEA can have an inverted conical shape. Multiple recesses GR can be formed. A first recess GR1 can be formed between a first tip T1 and a second tip T2, a second recess GR2 can be formed between a third tip T3 and a fourth tip T4, a third recess GR3 can be formed between a fifth tip T5 and a sixth tip T6, and a fourth recess GR4 can be formed between a seventh tip T7 and an eighth tip T8. The first recess GR1 can include an eaves structure formed by the first tip T1 and the second tip T2, the second recess GR2 can include an eaves structure formed by the third tip T3 and the fourth tip T4, the third recess GR3 can include an eaves structure formed by the fifth tip T5 and the sixth tip T6, and the fourth recess GR4 can include an eaves structure formed by the seventh tip T7 and the eighth tip T8.

[0132] Since the light-emitting layer 172 is deposited by evaporation and the common electrode 173 is deposited by sputtering, the light-emitting layer 172 and the common electrode 173 can have poor step coverage and can therefore be formed discontinuously in the first groove GR1 to the fourth groove GR4. In contrast, the first inorganic encapsulation film TFE1 and the second inorganic encapsulation film TFE3 formed by chemical vapor deposition (CVD) or atomic layer deposition (ALD) can have high step coverage and can therefore extend continuously through the first groove GR1 to the fourth groove GR4. Step coverage refers to the ratio of the film coverage of the inclined portion to the flat portion. Each of the first groove GR1 to the fourth groove GR4 may include the light-emitting layer 172, the light-emitting layer residue 172_D, the common electrode 173, and the common electrode residue 173_D.

[0133] The first dam HDAM1 may include multiple subdams comprising the first subdam HDA1 through the fourth subdam HDA4. The first dam HDAM1 is shown as including only four subdams (i.e., the first subdam HDA1 through the fourth subdam HDA4), but is not limited thereto. Optionally, like the second dam HDAM2, the first dam HDAM1 may include three subdams.

[0134] The first sub-dam HDA1 may be positioned on the first organic membrane 160 and comprises the same material as the second organic membrane 180. The first sub-dam HDA1 may be disposed on the second tip T2 and the third tip T3. The second sub-dam HDA2 may be disposed on the first sub-dam HDA1 and comprises the same material as the dam 190. The third sub-dam HDA3 and the fourth sub-dam HDA4 may be disposed on the second sub-dam HDA2 and comprise the same material as the spacer 191, but are not limited thereto. The thickness of the fourth sub-dam HDA4 may be greater than the thickness of the third sub-dam HDA3, but this disclosure is not limited thereto.

[0135] The second dam, HDAM2, may include subdams HDA5 through HDA7. Like the first dam, HDAM1, the second dam, HDAM2, may also include four subdams.

[0136] The fifth sub-dam HDA5 may be positioned on the first organic membrane 160 and comprises the same material as the second organic membrane 180. The fifth sub-dam HDA5 may be positioned on the seventh tip T7. The sixth sub-dam HDA6 may be positioned on the fifth sub-dam HDA5 and comprises the same material as the dam 190. The seventh sub-dam HDA7 may be positioned on the sixth sub-dam HDA6 and comprises the same material as the spacer 191, but is not limited thereto.

[0137] Since the light-emitting layer 172 and the common electrode 173 are disconnected in each of the first grooves GR1 to the fourth groove GR4 formed by the first tip T1 to the eighth tip T8, they can be prevented from becoming pathways for oxygen, moisture or other penetrants.

[0138] Figure 11 yes Figure 10 A magnified view of a portion of region L. Figure 11 The shape of the first organic membrane 160 before deformation is shown.

[0139] Reference Figure 11 The first organic membrane 160 may include a first sub-organic membrane 161 and a second sub-organic membrane 162 facing each other. The second organic membrane 180 may be positioned on the first organic membrane 160 and may include a third sub-organic membrane 181 and a fourth sub-organic membrane 182. The fourth sub-organic membrane 182 corresponds to the first sub-dam, but for convenience, will be referred to as an organic membrane hereinafter. The first sub-dam may comprise the same material as the second organic membrane 180.

[0140] A display device according to one aspect may include a first residue 172_D1, a second residue 173_D1, a third residue 172_D2, and a fourth residue 173_D2. Reference numerals are included in the figures to indicate their relevance to the light-emitting elements in the display area DA. However, the light-emitting layer 172 and common electrode 173 shown in some enlarged views on the first tip T1 may actually be residues. Since the light-emitting layer 172 and common electrode 173 are disconnected at the first tip T1, the first residue 172_D1 and the second residue 173_D1 can be formed. Furthermore, the third residue 172_D2 and the fourth residue 173_D2 can be formed from the second tip T2. The third residue 172_D2 may comprise the same material as the light-emitting layer 172 and the first residue 172_D1, and the fourth residue 173_D2 may comprise the same material as the common electrode 173 and the second residue 173_D1.

[0141] The third sub-organic membrane 181 can be positioned on the first sub-organic membrane 161, and the fourth sub-organic membrane 182 can be positioned on the second sub-organic membrane 162.

[0142] The first tip T1 can be positioned between the first sub-organic membrane 161 and the third sub-organic membrane 181. The first tip T1 can also be positioned between the first sub-organic membrane 161 and the second organic membrane 180. The second tip T2 can be positioned between the second sub-organic membrane 162 and the fourth sub-organic membrane 182. The second tip T2 can also be positioned between the second sub-organic membrane 162 and the second organic membrane 180. Both the first tip T1 and the second tip T2 can include exposed portions not covered by the first organic membrane 160 and the second organic membrane 180. The first tip T1 and the second tip T2 can be arranged facing each other.

[0143] The exposed portion of the first tip T1 not covered by the first sub-organic membrane 161 and the second organic membrane 180 may have a first exposure length EXL1. The exposed portion of the second tip T2 not covered by the second sub-organic membrane 162 and the second organic membrane 180 may have a second exposure length EXL2. The sum of the first exposure length EXL1 and the second exposure length EXL2 may be smaller than the first width GRW1 or the second width GRW2 of the first groove GR1.

[0144] In one aspect, the first exposure length EXL1 or the second exposure length EXL2 can be within 2 μm. If the first exposure length EXL1 or the second exposure length EXL2 exceeds 2 μm, the first inorganic encapsulation film TFE1 covering the first tip T1 and the second tip T2 may be formed too thin. If the thickness of the first inorganic encapsulation film TFE1 is reduced, its connectivity in the first groove GR1 may be reduced, resulting in weakened adhesive strength. In order to form the first residue 172_D1, the second residue 173_D1, and the third residue 172_D2, the first exposure length EXL1 or the second exposure length EXL2 needs to be a positive number and should not be too large to ensure good adhesion of the first inorganic encapsulation film TFE1.

[0145] The first groove GR1 may have an inverted trapezoidal shape. Therefore, the first groove GR1 may have a first width GRW1 and a second width GRW2. In one aspect, the first width GRW1 and the second width GRW2 may be greater than 0 μm and equal to or less than 8 μm (e.g., 0.1 μm to 8 μm). The first width GRW1 may be less than the second width GRW2. The sum of the first exposure length EXL1 and the second exposure length EXL2 may be less than the second width GRW2.

[0146] The first inorganic encapsulation film TFE1 can be formed simultaneously covering the first tip T1 and the second tip T2. The first inorganic encapsulation film TFE1 can also cover a first relatively inclined surface (also referred to as the first inclined surface) 161a and a second relatively inclined surface (also referred to as the second inclined surface) 162a. In one aspect, the lower surface of the first tip T1 and the first relatively inclined surface 161a can form a first angle θ1. The portion of the first inorganic encapsulation film TFE1 in contact with the lower surface of the first tip T1 and the portion in contact with the first relatively inclined surface 161a can both form the first angle θ1. The first angle θ1 can be 45 degrees or greater and 90 degrees or less.

[0147] When the first inorganic encapsulation film TFE1 is formed at such an angle, it functions similarly to a buckle. The first inorganic encapsulation film TFE1, in contact with the lower surface of the first tip T1, can generate a force that pushes away the lower surface of the first tip T1 during the separation of the second protective film PRF2. The first tip T1 is positioned between the first sub-organic film 161 and the second organic film 180, and is secured by the second organic film 180. Therefore, the force of the first tip T1 pushing away the first inorganic encapsulation film TFE1 can react as a force that pushes away the lower surface of the first tip T1. The first inorganic encapsulation film TFE1 can be secured to the bottom of the first tip T1 like a buckle, and the reaction force of the first tip T1 can become a force resisting the peeling force of the second protective film PRF2. Therefore, the adhesive strength of the first inorganic encapsulation film TFE1 can be enhanced.

[0148] The first inorganic encapsulation film TFE1 can be formed to simultaneously cover at least a portion of the first opposing inclined surface 161a, at least a portion of the lower surface of the first tip T1, and the lower surface of the first groove GR1. In a display device according to one aspect, in addition to the resistance provided by the first tip T1, the adhesive strength of the first inorganic encapsulation film TFE1 can be further enhanced by the protrusions and recesses, which will be described later. The adhesive strength of the first inorganic encapsulation film TFE1 can be increased not only by contact with the first tip T1, but also by contact with these protrusions and recesses.

[0149] Figure 12 It is shown Figure 11 A magnified view of a portion of the structure depicted in the image. Figure 13 and Figure 14 It is shown Figure 11 and Figure 12 A magnified view of the shape of the structure after deformation, as depicted in the image.

[0150] Reference Figure 12A first sub-organic film 161, a second sub-organic film 162, and a first residue 172_D1 and a second residue 173_D1 positioned between the first sub-organic film 161 and the second sub-organic film 162 can be arranged in a display device according to one aspect of the present disclosure. Thereafter, a first inorganic encapsulation film TFE1 and an organic encapsulation film TFE2 can be deposited on the first residue 172_D1 and the second residue 173_D1 using a CVD method. The first inorganic encapsulation film TFE1 can be conformally formed with a small thickness along the surface shape of the first residue 172_D1 and the second residue 173_D1.

[0151] The first inorganic encapsulation film TFE1 deposited on the first residue 172_D1 and the second residue 173_D1 can have a compressive stress that is greater than approximately -500 MPa and less than 0 MPa. This compressive stress can serve as a force Fc that pushes the first inorganic encapsulation film TFE1 and causes it to bend downwards.

[0152] If the compressive stress falls outside the above range, the quality of the film formed on the first inorganic encapsulation film TFE1 may deteriorate, thereby reducing the electrical characteristics of the display device according to one aspect of the present disclosure, or dislocations may occur at the interface between the first inorganic encapsulation film TFE1 and other films formed thereon due to excessive stress. Furthermore, it may be difficult to form a protrusion UP between the first sub-organic film 161 and the second sub-organic film 162 by depositing the first inorganic encapsulation film TFE1 alone.

[0153] Furthermore, when the modulus of the first inorganic encapsulation film TFE1 is less than the modulus of the first organic film 160, which includes the first sub-organic film 161 and the second sub-organic film 162, the first organic film 160 can have greater rigidity or strength than the first inorganic encapsulation film TFE1, making it difficult to generate compressive stress, repulsive force, or protrusions solely through the deposition process. Therefore, it is necessary to adjust the modulus of the first inorganic encapsulation film TFE1 so that it has a greater modulus than the first organic film 160. In this case, the desired compressive stress or protrusion phenomenon can be achieved between the first sub-organic film 161 and the second sub-organic film 162 simply by depositing the first inorganic encapsulation film TFE1.

[0154] When this compressive stress is applied, a repulsive force can be generated between the inorganic materials in opposite horizontal directions as much as possible, and due to the horizontal pushing force Fc at the two edge portions of the first inorganic encapsulation film TFE1 deposited on the first residue 172_D1 and the second residue 173_D1, a repulsive force Fs can be generated that horizontally pushes the lower part of the relatively inclined surfaces of the first sub-organic film 161 and the second sub-organic film 162.

[0155] Thus, when a repulsive force Fs is generated that pushes the lower part of the relatively inclined surfaces of the first sub-organic film 161 and the second sub-organic film 162, the adhesion between the first inorganic encapsulation film TFE1 and the first organic film 160 can be enhanced, or the adhesion between the first inorganic encapsulation film TFE1 and a component (e.g., an interlayer insulating film) positioned below the first inorganic encapsulation film TFE1 can be enhanced.

[0156] In one aspect, the formation of protrusions can vary depending on the material of the substrate in the display device according to one aspect of this disclosure. For example, when the substrate comprises a rigid material, only repulsive forces may be generated. When the substrate comprises a ductile material, the protrusion phenomenon described below may occur, and protrusions and / or depressions may be generated. The following description is based on the case where the substrate is ductile and protrusions and / or depressions are generated, but this disclosure is not limited thereto.

[0157] Reference Figure 13 A counterclockwise torque can occur at the lower part of the first sub-organic membrane 161, and a clockwise torque can occur at the lower part of the second sub-organic membrane 162. As a result, a protrusion UP can be formed.

[0158] The relatively inclined surfaces (or the first relatively inclined surface 161a and the second relatively inclined surface 162a) of the first sub-organic membrane 161 and the second sub-organic membrane 162 may include partially curved surfaces, and protrusions UP with convex curvature in the thickness direction (e.g., the Z-axis direction) may be formed between the first sub-organic membrane 161 and the second sub-organic membrane 162.

[0159] The recessed DP can be formed at the region where the lower part of the first and second relatively inclined surfaces 161a and 162a of the first and second sub-organic membranes 161 and 162 intersects with the upper surface of the protrusion UP between the first and second sub-organic membranes 161 and 162.

[0160] In one aspect, the recessed DP may be defined by a first relatively inclined surface 161a and a second relatively inclined surface 162a of the first organic film 160 and the upper surface of the protrusion UP. Specifically, the recessed DP may be formed at the region where the lower portion of the first relatively inclined surface 161a and the second relatively inclined surface 162a intersects with the two end edges of the upper surface of the protrusion UP, and may include a first side surface defined by the first relatively inclined surface 161a and the second relatively inclined surface 162a and a second side surface defined by the top surface of the protrusion UP. The width between the first side surface and the second side surface may decrease in the direction from the top of the recessed DP toward the bottom, and the first side surface and the second side surface may overlap at the ends of the recessed DP.

[0161] Furthermore, the end of the recessed DP can be aligned with the upper surface of the first organic membrane 160 located outside the first sub-organic membrane 161 and the second sub-organic membrane 162, but this disclosure is not limited thereto.

[0162] The upper surface of the protrusion UP can be positioned higher than the upper surface of the first organic membrane 160 located outside the first sub-organic membrane 161 and the second sub-organic membrane 162. Specifically, the central portion of the upper surface of the protrusion UP can be located at a first height h1 above the upper surface of the first organic membrane 160, and the portion of the upper surface of the protrusion UP adjacent to the depression DP can be located at a second height h2. The first height h1 can be greater than the second height h2, and can be in the range of approximately 31.5 μm to 52 μm, but is not limited thereto.

[0163] The first residue 172_D1 and the second residue 173_D1, the first inorganic encapsulation film TFE1, the organic encapsulation film TFE2 and the second inorganic encapsulation film TFE3 can be sequentially arranged on the first sub-organic film 161 and the second sub-organic film 162, the protrusion UP and the depression DP.

[0164] The first residue 172_D1 and the second residue 173_D1 may be arranged along the upper surface of the first organic film 160 and the protrusion UP. The first residue 172_D1 and the second residue 173_D1 may be in direct contact with the upper surface of the protrusion UP, and the first residue 172_D1 and the second residue 173_D1 on the protrusion UP may include a convex curvature in the thickness direction.

[0165] The first inorganic encapsulation film TFE1 disposed on the protrusion UP may have an upper surface in contact with the organic encapsulation film TFE2 and a lower surface in contact with the first residue 172_D1 and the second residue 173_D1. The curvature of the upper surface of the first inorganic encapsulation film TFE1 may be greater than the curvature of the lower surface of the first inorganic encapsulation film TFE1, and the radius of curvature of the upper surface of the first inorganic encapsulation film TFE1 may be smaller than the radius of curvature of the lower surface of the first inorganic encapsulation film TFE1.

[0166] The first inorganic encapsulation film TFE1 can be positioned on the first residue 172_D1 and the second residue 173_D1. Specifically, the first inorganic encapsulation film TFE1 can be positioned on the upper surface of the first organic film 160 and on the first relatively inclined surface 161a and the second relatively inclined surface 162a.

[0167] In one aspect, the first residue 172_D1 and the second residue 173_D1 may not be located on at least some portions of the first organic membrane 160 and the protrusion UP. In this case, the first inorganic encapsulation membrane TFE1 can directly contact the protrusion UP or the first organic membrane 160.

[0168] The organic encapsulation film TFE2, positioned on the first inorganic encapsulation film TFE1, can form a protrusion toward the recess DP in the gap between the first sub-organic film 161 and the second sub-organic film 162.

[0169] The following will refer to Figure 14 Describe the situation where bending stress is applied. (Refer to...) Figure 14 When bending stress is applied, a force can be generated that peels the first inorganic encapsulation film TFE1 and the organic encapsulation film TFE2 from the first organic film 160 and the protrusion UP. This delamination force Fb is typically vertically oriented.

[0170] Due to the compressive stress between the inorganic materials, a horizontally pushing force Fc can be generated in the first inorganic encapsulation film TFE1 on the protrusion UP. As a result, a repulsive force Fs can occur, horizontally pushing the lower region between the first sub-organic film 161 and the second sub-organic film 162. To allow the compressive stress to act, the spacing between the first sub-organic film 161 and the second sub-organic film 162 can be sufficiently narrow. For example, the spacing between the first sub-organic film 161 and the second sub-organic film 162, which is the width of the groove, can be approximately 0.1 μm to 8 μm.

[0171] Therefore, due to the repulsive force Fs, shear stress can be generated at the lower part of the first and second relatively inclined surfaces 161a and 162a of the first and second sub-organic films 161 and 162, thereby weakening the delamination force Fb in the vertical direction. That is, the first inorganic encapsulation film TFE1 in the recess DP can push the first and second relatively inclined surfaces 161a and 162a, and can enhance the adhesion between the first and second sub-organic films 161 and 162 and the first inorganic encapsulation film TFE1. The shear stress can act as a resistance to the delamination force Fb, thereby improving the adhesion of the first inorganic encapsulation film TFE1 to the first organic film 160.

[0172] In one aspect, the outwardly inclined surface of the first inorganic encapsulation film TFE1 on the first relatively inclined surface 161a of the first sub-organic film 161 and the second relatively inclined surface 162a of the second sub-organic film 162 can cover the first residue 172_D1 and the second residue 173_D1 in the recess DP as well as the first inorganic encapsulation film TFE1, thereby directly resisting the delamination force Fb.

[0173] Since the widths of the first residue 172_D1 and the second residue 173_D1, the first inorganic encapsulation film TFE1 and the organic encapsulation film TFE2 arranged in the recessed DP decrease towards the bottom of the recessed DP, the adhesion between the first residue 172_D1 and the second residue 173_D1, the first inorganic encapsulation film TFE1 and the organic encapsulation film TFE2 can be enhanced, thereby inhibiting or preventing the encapsulation layer ENC from delaminating from the recessed DP.

[0174] As a result, the resistance to the vertically acting delamination force Fb can be increased, thereby weakening the delamination force Fb and enhancing the adhesive strength of the first inorganic encapsulation film TFE1. Specifically, the adhesion between the first inorganic encapsulation film TFE1 and the first residue 172_D1 and the second residue 173_D1, as well as the adhesion between the first inorganic encapsulation film TFE1 and the first organic film 160, can be enhanced.

[0175] Figures 15 to 17 This is a cross-sectional view showing the steps in the process of forming a display device according to one aspect of the present disclosure.

[0176] As a step, refer to Figure 15 and Figure 16 The first sub-organic membrane 161 and the second sub-organic membrane 162, which are adjacent to each other, can be protruding portions of the first organic membrane 160, and a gap can be arranged between the first sub-organic membrane 161 and the second sub-organic membrane 162. Since there is no external force in the lower region between the first sub-organic membrane 161 and the second sub-organic membrane 162, the upper surface of the first organic membrane 160 can remain flat between the first sub-organic membrane 161 and the second sub-organic membrane 162.

[0177] The spacing between the first sub-organic film 161 and the second sub-organic film 162, which is the width of the groove, can be from 0.1 μm to 10 μm. Specifically, the spacing between the first sub-organic film 161 and the second sub-organic film 162 can be from about 0.1 μm to 8 μm. If the spacing between the first sub-organic film 161 and the second sub-organic film 162 is outside this range, no horizontal force caused by compressive stress between the stacked inorganic materials will occur. Therefore, no external force can act on the lower region between the first sub-organic film 161 and the second sub-organic film 162, and the upper surface of the first organic film 160 can remain flat between the first sub-organic film 161 and the second sub-organic film 162. However, even in this case, some repulsive forces can still be exerted, and the first inorganic encapsulation film TFE1 exhibits relatively high adhesion.

[0178] In one aspect, after forming a first residue 172_D1 and a second residue 173_D1 on the upper surface of the first organic film 160, a first inorganic encapsulation film TFE1 can be deposited between the first sub-organic film 161 and the second sub-organic film 162 using a CVD method on the first residue 172_D1 and the second residue 173_D1. The first inorganic encapsulation film TFE1 can be conformally formed with a small thickness along the surface shape of the first residue 172_D1 and the second residue 173_D1.

[0179] The first inorganic encapsulation film TFE1 deposited on the first residue 172_D1 and the second residue 173_D1 may have compressive stress (e.g., compressive stress in the range of approximately -500 MPa to 0 MPa). This compressive stress may act as a force Fc that pushes the first inorganic encapsulation film TFE1 and causes it to bend downwards.

[0180] When this compressive stress is applied, an outward pushing force can be generated between the inorganic materials in opposite horizontal directions, and due to the horizontal pushing force Fc from the two edges of the first inorganic encapsulation film TFE1 deposited on the first residue 172_D1 and the second residue 173_D1, a repulsive force Fs can be generated that horizontally pushes the lower parts of the first and second relatively inclined surfaces 161a and 162a of the first and second sub-organic films 161 and 162.

[0181] Therefore, when the repulsive force Fs acts on the lower part of the first relatively inclined surface 161a and the second relatively inclined surface 162a of the first sub-organic membrane 161 and the second sub-organic membrane 162, a counterclockwise torque Fq_1 can be generated at the lower part of the first sub-organic membrane 161, and a clockwise torque Fq_2 can be generated at the lower part of the second sub-organic membrane 162.

[0182] As a subsequent step, refer to Figure 17 The torques Fq_1 and Fq_2 generated at the lower portions of the first sub-organic membrane 161 and the second sub-organic membrane 162 can act on the central portion of the upper surface of the first organic membrane 160 positioned between the first sub-organic membrane 161 and the second sub-organic membrane 162, generating a force Fu that causes the central portion of the lower surface of the first organic membrane 160 to be positioned as a protrusion in the thickness direction. Therefore, a protrusion UP can be formed.

[0183] As described above, the protrusions UP, depressions DP, and shear stresses formed in this manner can help enhance the adhesion between the first inorganic encapsulation film TFE1 and the first residue 172_D1 and the second residue 173_D1, as well as the adhesion between the first inorganic encapsulation film TFE1 and the organic encapsulation film TFE2.

[0184] Figure 18 It is a block diagram of an electronic device according to one aspect of this disclosure, and Figure 19 A set of schematic diagrams of electronic devices according to various aspects of this disclosure are presented.

[0185] Reference Figure 18 The electronic device 1000 may include a display module 11, a processor 12, a memory 13 and a power module 14, and may also include an input module 15, an output module 16 and a communication module 17.

[0186] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0187] The memory 13 can store the data and information required for the operation of the processor 12 or the display module 11. When the processor 12 executes the application stored in the memory 13, video data signals and / or input control signals can be transmitted to the display module 11, and the display module 11 can process the received signals and output image information via the display screen.

[0188] The power module 14 may include a power supply module (such as a power adapter or battery device). The power module 14 may also include a power conversion module. The power conversion module can convert the power supplied by the power supply module and thus generate the power required for the operation of the electronic device 1000.

[0189] At least one of the components of the electronic device 1000 described above may be included in a display device according to any of the foregoing aspects of this disclosure. Furthermore, among individual modules functionally grouped into a single module, some modules may be included in a display device according to any of the foregoing aspects of this disclosure, while other modules may be configured separately. For example, a display device according to any of the foregoing aspects of this disclosure may include a display module 11, while a processor 12, a memory 13, and a power module 14 may be configured within the electronic device 1000 as other devices besides the display device according to any of the foregoing aspects of this disclosure.

[0190] Reference Figure 19Various electronic devices 1000 that can be used with display devices according to any of the foregoing aspects of this disclosure may include image display electronic devices (such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, TVs 10_1d, or desktop monitors 10_1e). Furthermore, various electronic devices 1000 may include wearable electronic devices (such as smart glasses 10_2a, head-mounted displays 10_2b, or smartwatches 10_2c) that include display modules, or vehicle electronic devices 10_3 (such as dashboards, central instrument panels, central information displays (CIDs) arranged on the dashboard, or interior mirror displays) that include display modules.

[0191] The advantages and features of the aspects disclosed herein, as well as methods of implementing them, will become apparent from the detailed description of the aspects with reference to the accompanying drawings. However, the aspects according to this disclosure are not limited to those disclosed herein, but will take many different forms, and these aspects are provided merely to fully and completely inform those skilled in the art to which this disclosure pertains, and the scope of this disclosure is defined by the scope of the claims.

Claims

1. A display device, the display device comprising: Inorganic packaging area, surrounding the through-hole; Wiring area, surrounding the inorganic packaging area; as well as The display area surrounds the wiring area. The inorganic encapsulation region includes: a first organic film, comprising a first sub-organic film having a first inclined surface and a second sub-organic film having a second inclined surface, wherein the second inclined surface faces the first inclined surface; a first groove between the first sub-organic film and the second sub-organic film; and a protrusion comprising at least a portion of the first organic film, wherein the protrusion is between the first sub-organic film and the second sub-organic film.

2. The display device as claimed in claim 1, wherein, The inorganic encapsulation region further includes: a second organic film on the first organic film; and a plurality of tips, each of the plurality of tips including an exposed portion defined by the first organic film and the second organic film.

3. The display device as claimed in claim 2, wherein, The plurality of tips includes a first tip positioned between the first sub-organic membrane and the second organic membrane.

4. The display device as claimed in claim 3, wherein, The display area includes: The first organic film comprises the same material as the first organic film in the inorganic encapsulation region; The second connecting electrode is on the first organic film, and the second connecting electrode comprises the same material as the first tip. The second organic film, on the second connecting electrode, comprises the same material as the second organic film in the inorganic encapsulation region; Multiple pixel electrodes are disposed on the second organic film; Common electrode, on the plurality of pixel electrodes; and The light-emitting layer is positioned between the plurality of pixel electrodes and the common electrode.

5. The display device as claimed in claim 3, wherein, The plurality of tips also includes a second tip facing the first tip and positioned between the second sub-organic membrane and the second organic membrane.

6. The display device as claimed in claim 5, wherein, The portion of the first tip exposed by the first sub-organic membrane and the second organic membrane has a first exposure length. The portion of the second tip exposed to the second sub-organic membrane and the second organic membrane has a second exposure length, and The sum of the first exposure length and the second exposure length is less than the width of the first groove.

7. The display device as claimed in claim 6, wherein, The first groove has an inverted trapezoidal shape. The first groove has a first width and a second width. The second width is greater than the first width, and The sum of the first exposure length and the second exposure length is less than the second width.

8. The display device as claimed in claim 3, wherein, The lower surface of the first tip and the first inclined surface of the first sub-organic film form a first angle, and The first angle is equal to or greater than 45 degrees and less than 90 degrees.

9. The display device as claimed in claim 3, wherein, The portion of the first tip exposed to the first sub-organic membrane and the second organic membrane has a first exposure length, and The first exposure length is greater than 0 μm and less than 2 μm.

10. The display device as claimed in claim 1, wherein, The first groove has an inverted trapezoidal shape. The first groove has a first width and a second width. The second width is greater than the first width, and The second width is greater than 0 μm and equal to or less than 8 μm.

11. The display device as claimed in claim 1, wherein, The inorganic encapsulation region also includes a recess between the first inclined surface and the protrusion.

12. The display device as claimed in claim 1, wherein, The display area includes: a plurality of pixel electrodes; a common electrode positioned on the plurality of pixel electrodes; and a light-emitting layer positioned between the plurality of pixel electrodes and the common electrode. The inorganic encapsulation region also includes a first residue in the first groove, the first residue being made of the same material as the light-emitting layer.

13. The display device as claimed in claim 12, wherein, The inorganic encapsulation region also includes a second residue on the first residue, the second residue being made of the same material as the common electrode.

14. The display device as claimed in claim 13, wherein, The inorganic encapsulation region further includes a first inorganic encapsulation film covering at least a portion of the first inclined surface, at least a portion of the second inclined surface, and the second residue.

15. The display device as claimed in claim 11, wherein, The inorganic encapsulation region further includes a first inorganic encapsulation film that simultaneously covers at least a portion of the first inclined surface, at least a portion of the recess, and at least a portion of the protrusion.

16. An electronic device, the electronic device comprising: The processor is configured to provide image signals; The display module is configured to receive the image signal from the processor and display the image; as well as A power module is configured to supply power to the display module. in: The display module includes: an inorganic encapsulation region surrounding a through-hole; a wiring region surrounding the inorganic encapsulation region; and a display region surrounding the wiring region. The inorganic encapsulation region includes: a first organic film, comprising a first sub-organic film having a first inclined surface and a second sub-organic film having a second inclined surface, wherein the second inclined surface faces the first inclined surface; a first groove between the first sub-organic film and the second sub-organic film; and a protrusion comprising at least a portion of the first organic film, wherein the protrusion is between the first sub-organic film and the second sub-organic film.

17. The electronic device of claim 16, wherein: The inorganic encapsulation region further includes: a second organic film on the first organic film; and a plurality of tips, each of the plurality of tips including an exposed portion defined by the first organic film and the second organic film, and The plurality of tips includes a first tip positioned between the first sub-organic membrane and the second organic membrane.

18. The electronic device of claim 16, wherein, The inorganic encapsulation region also includes a recess between the first inclined surface and the protrusion.

19. The electronic device of claim 16, wherein, The display area includes: a plurality of pixel electrodes; a common electrode positioned on the plurality of pixel electrodes; and a light-emitting layer positioned between the plurality of pixel electrodes and the common electrode. The inorganic encapsulation region further includes: a first residue in the first groove, the first residue comprising the same material as the light-emitting layer; and a second residue on the first residue, the second residue comprising the same material as the common electrode.

20. The electronic device of claim 18, wherein, The inorganic encapsulation region further includes a first inorganic encapsulation film that simultaneously covers at least a portion of the first inclined surface, at least a portion of the recess, and at least a portion of the protrusion.

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