Display panel and display device

Abstract

The application provides a display panel and a display device. The display panel comprises a substrate, a light-emitting layer and a touch layer. The touch layer is located on the side of the light-emitting layer away from the substrate. An encapsulation layer is located between the touch layer and the light-emitting layer. The encapsulation layer comprises an outer stack layer and an inner barrier layer. The outer stack layer comprises a first protective layer and a plurality of second protective layers. The first protective layer is located on the side of the second protective layer away from the inner barrier layer. The thermal expansion coefficient of the material constituting the first protective layer is C1, the thermal expansion coefficient of the material constituting the second protective layer is C2, the thermal expansion coefficient of the material constituting the inner barrier layer is C3, and |C2-C3|<|C1-C3|. In the case of a large temperature change in the preparation process, the deformation degree of the second protective layer can be between the first protective layer and the inner barrier layer, and the second protective layer is equivalent to a deformation buffer layer between the first protective layer and the inner barrier layer. This design helps to avoid the film peeling problem between adjacent film layers in the encapsulation layer due to the large difference in the deformation degree.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and display device. Background Technology

[0002] With the continuous development of display technology, encapsulation and protection structures to prevent the intrusion of external water and oxygen have become a fundamental design feature within current panels. In related technologies, encapsulation and protection structures commonly employ multi-layer designs. However, in these multi-layer designs, there are often differences in the coefficients of thermal expansion between adjacent film layers. When the difference in the coefficients of thermal expansion between two film layers is significant, under panel stress, the problem of film layer delamination can easily occur. Summary of the Invention

[0003] This application provides a display panel and a display device to solve the problem of peeling of some film layers inside the aforementioned panel. In view of the above, this application provides a display panel, including: Substrate; Emissive layer; The touch layer is located on the side of the light-emitting layer away from the substrate.

[0004] An encapsulation layer is located between the touch layer and the light-emitting layer. The encapsulation layer includes an outer stacked layer and an inner barrier layer; the outer stacked layer includes a first protective layer and multiple second protective layers, with the first protective layer located on the side of the second protective layer away from the inner barrier layer.

[0005] The coefficient of thermal expansion of the material constituting the first protective layer is C1, the coefficient of thermal expansion of the material constituting the second protective layer is C2, and the coefficient of thermal expansion of the material constituting the inner barrier layer is C3, where |C2-C3|<|C1-C3|.

[0006] Based on the same inventive concept, this application also provides a display device, including the above-mentioned display panel.

[0007] Compared with the prior art, the display panel and display device provided by the present invention achieve at least the following beneficial effects: In this application, the second protective layer can be considered as an intermediate dielectric layer between the first protective layer and the inner barrier layer. |C2-C3|<|C1-C3| means that the coefficient of thermal expansion of the second protective layer can be between the coefficients of thermal expansion of the first protective layer and the inner barrier layer. That is, under conditions of significant temperature changes during fabrication, the deformation degree of the second protective layer can be between that of the first protective layer and the inner barrier layer. Therefore, the second protective layer is equivalent to a deformation buffer layer between the first protective layer and the inner barrier layer. This design helps to avoid film peeling problems caused by large differences in deformation between adjacent film layers within the encapsulation layer. Attached Figure Description

[0008] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 A schematic diagram of a partial structure of a display panel provided in this application; Figure 2 for Figure 1 The diagram shows a cross-sectional view of the internal structure of the encapsulation layer within the display panel. Figure 3 This is a schematic diagram of the internal structure of a display panel in related technologies; Figure 4 for Figure 3 The diagram shows the fabrication process of the water-oxygen encapsulation layer within the display panel. Figure 5 for Figure 1 Another cross-sectional view of the internal structure of the encapsulation layer within the display panel shown. Figure 6 for Figure 1 Another cross-sectional view of the internal structure of the encapsulation layer within the display panel shown. Figure 7 This is a cross-sectional schematic diagram of the internal structure of the touch layer and encapsulation layer; Figure 8 This is a schematic diagram of a display device provided in this application. Detailed Implementation

[0010] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0011] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0012] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0013] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0014] Figure 1 This is a schematic diagram of a partial structure of a display panel provided in this application. Figure 2 for Figure 1 The diagram shows a cross-sectional view of the internal structure of the encapsulation layer within the display panel. For ease of understanding, Figure 2 A partial structure at region A of the encapsulation layer is illustrated.

[0015] Based on the aforementioned background issues, this application provides a display panel 10, such as... Figure 1 As shown, the display panel 10 includes a substrate 00, an emissive layer 01, and a touch layer 02, with the touch layer 02 located on the side of the emissive layer 01 away from the substrate 00.

[0016] The display panel 10 may also include a light-emitting device 03, which may be an organic light-emitting diode (OLED). The light-emitting device 03 may include a first electrode 031, a first common layer 032, a light-emitting layer 01, a second common layer 033, and a second electrode 034. The first electrode 031 and the second electrode 034 may be the anode and cathode of the light-emitting device 03, respectively. The first common layer 032 may include film structures such as a hole injection layer and a hole transport layer (not shown in the figure), and the second common layer 033 may include film structures such as an electron injection layer and an electron transport layer (not shown in the figure).

[0017] The touch layer 02 may include a lower electrode layer 021, which is provided with a plurality of lower touch electrodes 211. During the operation of the display panel 10, the lower touch electrodes 211 can receive touch signals and participate in the touch process.

[0018] The display panel 10 also includes an encapsulation layer 04, which is located between the touch layer 02 and the light-emitting layer 01. The touch layer 02 can be considered as being disposed on the encapsulation layer 04.

[0019] like Figure 2 As shown, the encapsulation layer 04 includes an outer stacked layer 041 and an inner barrier layer 042. The constituent materials of the outer stacked layer 041 and the inner barrier layer 042 may be different. Specifically, there may be a difference between the coefficient of thermal expansion of the material included in the outer stacked layer 041 and the coefficient of thermal expansion of the material included in the inner barrier layer 042.

[0020] Figure 3This is a schematic diagram of the internal structure of a display panel in related technologies. Figure 4 for Figure 3 The diagram shows the fabrication process of the water-oxygen encapsulation layer within the display panel. For ease of understanding, Figure 4 The diagram shows some of the steps involved in the fabrication of the water-oxygen encapsulation layer.

[0021] In related technologies, such as Figure 3 As shown, the water-oxygen encapsulation layer 01' within the existing panel 10' may include an outer inorganic layer 011' and an inner organic layer 012'. The outer inorganic layer 011' is typically composed of inorganic materials, while the inner organic layer 012' is typically composed of organic materials. Due to the differences in material properties between inorganic and organic materials, the outer inorganic layer 011' and the inner organic layer 012' typically exhibit a large difference in their coefficients of thermal expansion. Therefore, during the fabrication process of the water-oxygen encapsulation layer 01', if... Figure 4 As shown, the aforementioned difference in thermal expansion coefficients results in a significant difference in deformation between the outer inorganic layer 011' and the inner organic layer 012' under conditions of large temperature changes (during the cooling and curing process of the outer inorganic layer 011' and the inner organic layer 012'), leading to interlayer voids 013' within the water-oxygen encapsulation layer 01'. Therefore, under stress deformation of the existing panel 10', the presence of these interlayer voids 013' increases the risk of delamination between the outer inorganic layer 011' and the inner organic layer 012'.

[0022] To address this issue, this application adopts the following design: like Figure 2 As shown, the outer stacked layer 041 includes a first protective layer 411 and multiple second protective layers 412. The first protective layer 411 is located on the side of the second protective layer 412 away from the inner barrier layer 042, that is, the outer stacked layer 041 can be regarded as a multi-film stacked structure. The first protective layer 411 can be regarded as a film layer on the outer stacked layer 041 that is closer to the outer side of the encapsulation layer 04, and the second protective layer 412 can be regarded as a film layer on the outer stacked layer 041 that is closer to the inner barrier layer 042.

[0023] The coefficient of thermal expansion of the material constituting the first protective layer 411 is C1, the coefficient of thermal expansion of the material constituting the second protective layer 412 is C2, and the coefficient of thermal expansion of the material constituting the inner barrier layer 042 is C3, where |C2-C3|<|C1-C3|.

[0024] In this embodiment, the second protective layer 412 can be considered as an intermediate dielectric layer between the first protective layer 411 and the inner barrier layer 042. |C2-C3|<|C1-C3| means that the coefficient of thermal expansion of the second protective layer 412 can be between the coefficients of thermal expansion of the first protective layer 411 and the inner barrier layer 042. That is, under conditions of significant temperature changes during fabrication, the deformation degree of the second protective layer 412 can be between that of the first protective layer 411 and the inner barrier layer 042. Therefore, the second protective layer 412 is equivalent to a deformation buffer layer between the first protective layer 411 and the inner barrier layer 042. This design helps avoid film peeling problems caused by large differences in deformation between adjacent film layers within the encapsulation layer 04.

[0025] Furthermore, the first protective layer 411 can be a film structure prepared using atomic layer deposition (ALD) technology. Specifically, it can be deposited layer by layer on a single atomic layer basis, achieving atomic-level film growth through alternating introduction of gaseous precursors and relying on surface self-limiting chemical reactions, thereby obtaining a relatively thin first protective layer 411. On the other hand, considering that the first protective layer 411 is a film structure relatively close to the outer side of the encapsulation layer 04, the first protective layer 411 can have certain structural rigidity and corrosion resistance. The constituent materials of the first protective layer 411 can include alumina, silicon oxide, silicon nitride, etc.

[0026] The inner barrier layer 042 can be made of a polymer compound, specifically, it can include a dimethyl polysilicon polymer compound.

[0027] The second protective layer 412 can be a film structure prepared by molecular layer deposition (MLD). Unlike the ALD process described above, the MLD process can deposit layer by layer on a monolayer basis, and the alternation order of the gas phase precursor introduced can be different from that of ALD. The constituent materials of the second protective layer 412 can include organic-like materials, which may contain elements such as titanium and chlorine.

[0028] It is worth noting that the first protective layer 411 can contact the nearest second protective layer 412. During the preparation process, the material of the first protective layer 411 prepared based on the above-mentioned ALD process and the material of the second protective layer 412 prepared based on the above-mentioned MLD process can repair each other during the material growth process. For example, the material in the first protective layer 411 can grow and contact the material in the second protective layer 412, and repair and fill the defects in the material in the second protective layer 412.

[0029] In some embodiments of this application, combined with Figure 1 and Figure 2The inner barrier layer 042 includes an overlapping portion 421, which overlaps with the light-emitting layer 01 in a direction perpendicular to the plane of the display panel 10.

[0030] The display panel 10 may also include a pixel defining layer 05, which has a pixel opening 051. At least a portion of the light-emitting layer 01 may be located within the pixel opening 051. The pixel opening 051 can be considered as an opening design recessed into the substrate 00 on the pixel defining layer 05. This structural design feature allows a portion of the film structure above the light-emitting layer 01 to be recessed into the pixel opening 051. Considering the flatness requirements for the encapsulation layer 04, the thickness of the overlapping portion 421 can be larger than that of other portions on the inner barrier layer 042.

[0031] The thickness of the overlapping portion 421 is h1, the thickness of the outer stacked layer 041 is h2, and h2 / h1≤0.05.

[0032] In the embodiments of this application, h2 / h1≤0.05 means that there is a large difference between the thickness of the outer stacked layer 041 and the thickness of the inner barrier layer 042. On the one hand, this is beneficial to achieve a larger thickness of the inner barrier layer 042, which enhances its elastic properties under stress and avoids breakage due to excessive bending. On the other hand, it is beneficial to set a smaller thickness of the outer stacked layer 041, thereby limiting the overall thickness of the encapsulation layer 04 and reducing the impact of stress on the overall structural integrity of the encapsulation layer 04.

[0033] In some embodiments of this application, h1 ≥ 2um.

[0034] In this embodiment, the thickness h1 of the overlapping portion 421 can be as small as 2 μm, which is beneficial to achieve a smaller overall thickness of the inner barrier layer 042, thereby achieving a thinner and lighter encapsulation layer 04. In addition, this embodiment also limits the thickness h1 of the overlapping portion 421 to not less than 2 μm, which can reduce the risk of the inner barrier layer 042 breaking under stress due to being too thin.

[0035] Figure 5 for Figure 1 This is another cross-sectional view of the internal structure of the encapsulation layer within the display panel. For ease of understanding, Figure 5 A partial structure at region A of the encapsulation layer is illustrated.

[0036] In some embodiments of this application, such as Figure 5As shown, the multilayer second protective layer 412 includes a first sublayer 4121 and a second sublayer 4122. The first sublayer 4121 is in contact with the first protective layer 411, and the second sublayer 4122 is in contact with the inner barrier layer 042. The first sublayer 4121 can be considered as the film layer closest to the first protective layer 411 among the multiple second protective layers 412, and the second sublayer 4122 can be considered as the film layer closest to the inner barrier layer 042 among the multiple second protective layers 412. It should be noted that in the encapsulation layer 04, the smaller the difference in the coefficient of thermal expansion between two adjacent film layers, the smaller the deformation difference between the two film layers can be under conditions of large temperature changes. Therefore, to ensure a low risk of peeling between the second protective layer 412 and the first protective layer 411, the difference in the coefficient of thermal expansion between the first sublayer 4121 and the first protective layer 411 can be set to be small; correspondingly, to ensure a low risk of peeling between the second protective layer 412 and the inner barrier layer 042, the difference in the coefficient of thermal expansion between the second sublayer 4122 and the first protective layer 411 can be set to be small.

[0037] The difference in thermal expansion coefficient between the first sub-layer 4121 and the first protective layer 411 is Δc1, and the difference in thermal expansion coefficient between the second sub-layer 4122 and the inner barrier layer 042 is Δc2, where |Δc2| < |Δc1|.

[0038] In this embodiment, the absolute value of Δc2 is smaller than that of Δc1. This design implies that, compared to the deformation difference between the first sublayer 4121 and the first protective layer 411, this embodiment specifically prioritizes reducing the risk of peeling between the second sublayer 4122 and the inner barrier layer 042. This is because the inner barrier layer 042 itself has a larger thickness than the first protective layer 411; that is, the thickness difference between the inner barrier layer 042 and the second sublayer 4122 is greater than the thickness difference between the first protective layer 411 and the first sublayer 4121. During stress processes, peeling is more likely to occur between two film layers with a large thickness difference. Therefore, by setting Δc2 to be smaller in this embodiment, the significance lies in minimizing the risk of peeling between the inner barrier layer 042 and the second protective layer 412 in terms of the difference in thermal expansion coefficients, thereby offsetting the impact caused by the large thickness difference between the inner barrier layer 042 and the second protective layer 412.

[0039] Figure 6 for Figure 1 This is another cross-sectional view of the internal structure of the encapsulation layer within the display panel. For ease of understanding, Figure 6 A partial structure at region A of the encapsulation layer is illustrated.

[0040] In some embodiments of this application, such as Figure 6As shown, the coefficient of thermal expansion of the inner barrier layer 042 is greater than that of the first protective layer 411. That is, under the temperature change conditions caused during the preparation of the encapsulation layer 04, the deformation of the first protective layer 411 can be less than that of the inner barrier layer 042.

[0041] The multilayer second protective layer 412 located on one side of the inner barrier layer 042 includes a third sublayer 4123 and a fourth sublayer 4124. The fourth sublayer 4124 is located on the side of the third sublayer 4123 closest to the inner barrier layer 042, and the coefficient of thermal expansion of the fourth sublayer 4124 is greater than that of the third sublayer 4123. Therefore, in the multilayer second protective layer 412, the closer the second protective layer 412 is to the inner barrier layer 042, the larger its coefficient of thermal expansion can be; that is, its coefficient of thermal expansion can be closer to that of the inner barrier layer 042.

[0042] In this embodiment, along the direction from the first protective layer 411 to the inner barrier layer 042, the coefficients of thermal expansion of the multiple second protective layers 412 gradually increase. At this time, the multiple second protective layers 412 can be stacked in a gradient manner according to the coefficient of thermal expansion, which is beneficial to achieve a natural transition in the arrangement of the second protective layers 412 between the first protective layer 411 and the second protective layer 412 in terms of coefficient of thermal expansion, thereby further reducing the risk of peeling between adjacent film layers in the encapsulation layer 04.

[0043] In some embodiments of this application, the modulus of the inner barrier layer 042 is less than the modulus of the first protective layer 411.

[0044] In this embodiment, the inner barrier layer 042 can be a relatively thick film layer in the encapsulation layer 04, and its position in the film layer can be considered as a near-central position in the encapsulation layer 04. Considering that the encapsulation layer 04 needs to have a certain degree of bending adaptability, the modulus of the inner barrier layer 042 can be adjusted to be smaller to enhance its elastic characteristics, so as to achieve the overall structural stability of the encapsulation layer 04 under stress bending of the display panel 10. In addition, combined with Figure 1 and Figure 2 The first protective layer 411 can be regarded as the bearing film layer of the internal structure of the touch layer 02 (such as the touch electrode 211 below). The first protective layer 411 has a large modulus, which means that the bending characteristics of the first protective layer 411 are weak. Correspondingly, it can have a certain structural rigidity, which is conducive to its bearing role for the internal structure of the touch layer 02.

[0045] In some embodiments of this application, the modulus of the second protective layer 412 is between that of the inner barrier layer 042 and the modulus of the first protective layer 411.

[0046] In this embodiment, besides the difference in thermal expansion coefficients, the modulus difference between the two film layers can also be considered as one of the factors affecting the risk of peeling between the two film layers. The greater the modulus difference between the two film layers, the greater the elastic difference between them, and the greater the risk of peeling between the two film layers. Therefore, this embodiment designs the modulus of the second protective layer 412 to be between the inner barrier layer 042 and the first protective layer 411, which is equivalent to setting a modulus transition layer between the inner barrier layer 042 and the first protective layer 411. Compared with the design where the first protective layer 411 and the inner barrier layer 042 are directly adjacent, this embodiment design can avoid the situation where the modulus difference between the two film layers in the encapsulation layer 04 is too large, thereby further reducing the risk of peeling between film layers.

[0047] Figure 7 This is a cross-sectional schematic diagram of the internal structure of the touch layer and encapsulation layer.

[0048] In some embodiments of this application, such as Figure 7 As shown, the multilayer second protective layer 412 includes a first sublayer 4121 and a fifth sublayer 4125. The first sublayer 4121 is in contact with the first protective layer 411, and the fifth sublayer 4125 is located on the side of the first sublayer 4121 away from the first protective layer 411. Compared to the first sublayer 4121, the fifth sublayer 4125 is further away from the first protective layer 411.

[0049] Specifically, the difference between the modulus of the first sub-layer 4121 and the modulus of the first protective layer 411 is Δv1, and the difference between the modulus of the fifth sub-layer 4125 and the modulus of the first protective layer 411 is Δv2, where |Δv1| < |Δv2|. Therefore, the elastic properties of the first sub-layer 4121 and the first protective layer 411 are closer than those of the fifth sub-layer 4125.

[0050] In this embodiment, the first sub-layer 4121 is closer to the first protective layer 411 than the fifth sub-layer 4125. By limiting Δv1 to be smaller, the first sub-layer 4121 can serve as a second protective layer 412 with a modulus close to that of the first protective layer 411. That is, the elastic properties of the first sub-layer 4121 and the first protective layer 411 are similar. Therefore, the first sub-layer 4121 can be regarded as an elastic transition layer between the first protective layer 411 and the fifth sub-layer 4125. This design can reduce the risk of peeling due to the modulus difference between the first protective layer 411 and the second protective layer 412.

[0051] In some embodiments of this application, such as Figure 7 As shown, the touch layer 02 includes a lower touch electrode 211, which is in contact with the side of the first protective layer 411 away from the inner barrier layer 042.

[0052] In this embodiment, the first protective layer 411 can be considered as the supporting film layer of the lower touch electrode 211. Based on the large modulus of the first protective layer 411 and its resistance to deformation, the first protective layer 411 exhibits superior load-bearing characteristics and provides a better flatness support effect for the fabrication of the lower touch electrode 211. Furthermore, the film structure between the lower touch electrode 211 and the inner barrier layer 042 can mainly include an outer stacked layer 041. The first protective layer 411 and the second protective layer 412 are fabricated using similar processes such as atomic layer deposition and molecular layer deposition. Compared to related designs that place the lower touch electrode 211 on other film layers (e.g., a touch buffer layer, TP buffer), this embodiment avoids the need for a film structure fabricated using multiple processes between the lower touch electrode 211 and the inner barrier layer 042, thereby preventing film peeling.

[0053] Figure 8 This is a schematic diagram of a display device provided in this application.

[0054] This application provides a display device 20, such as... Figure 8 As shown, the display device 20 includes the aforementioned display panel 10. The display device 20 can be a mobile phone, or it can also be an electronic device such as a computer or television.

[0055] In the display device 20 provided in this application embodiment, the probability of interlayer delamination in the display panel 10 is effectively reduced.

[0056] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

Claims

1. A display panel, characterized in that, include: Substrate; Emissive layer; A touch layer, wherein the touch layer is located on the side of the light-emitting layer away from the substrate; An encapsulation layer is located between the touch layer and the light-emitting layer; the encapsulation layer includes an outer stacked layer and an inner barrier layer; the outer stacked layer includes a first protective layer and multiple second protective layers, wherein the first protective layer is located on the side of the second protective layer away from the inner barrier layer; Wherein, the coefficient of thermal expansion of the material constituting the first protective layer is C1, the coefficient of thermal expansion of the material constituting the second protective layer is C2, the coefficient of thermal expansion of the material constituting the inner barrier layer is C3, and |C2-C3|<|C1-C3|.

2. The display panel according to claim 1, characterized in that, The inner barrier layer includes an overlapping portion, which overlaps with the light-emitting layer along a direction perpendicular to the plane of the display panel; Wherein, the thickness of the overlapping portion is h1, the thickness of the outer stacked layer is h2, and h2 / h1≤0.

05.

3. The display panel according to claim 2, characterized in that, h1≥2um.

4. The display panel according to claim 1, characterized in that, The multilayer second protective layer includes a first sublayer and a second sublayer, wherein the first sublayer is in contact with the first protective layer and the second sublayer is in contact with the inner barrier layer; The difference in thermal expansion coefficients between the first sub-layer and the first protective layer is Δc1, and the difference in thermal expansion coefficients between the second sub-layer and the inner barrier layer is Δc2, where |Δc2| < |Δc1|.

5. The display panel according to claim 4, characterized in that, The coefficient of thermal expansion of the inner barrier layer is greater than that of the first protective layer. The second protective layer, located on one side of the inner barrier layer, includes a third sub-layer and a fourth sub-layer. The fourth sub-layer is located on the side of the third sub-layer closer to the inner barrier layer. The coefficient of thermal expansion of the fourth sub-layer is greater than that of the third sub-layer.

6. The display panel according to claim 1, characterized in that, The modulus of the inner barrier layer is less than that of the first protective layer.

7. The display panel according to claim 6, characterized in that, The modulus of the second protective layer is between that of the inner barrier layer and that of the first protective layer.

8. The display panel according to claim 7, characterized in that, The multilayer second protective layer includes a first sublayer and a fifth sublayer, wherein the first sublayer is in contact with the first protective layer, and the fifth sublayer is located on the side of the first sublayer away from the first protective layer; The difference between the modulus of the first sub-layer and the modulus of the first protective layer is Δv1, and the difference between the modulus of the fifth sub-layer and the modulus of the first protective layer is Δv2, where |Δv1| < |Δv2|.

9. The display panel according to claim 6, characterized in that, The touch layer includes a lower touch electrode, which is in contact with the side of the first protective layer away from the inner barrier layer.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.

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