Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a display panel and a cover plate. The display panel has a display area and a non-display area, and the non-display area is arranged around the display area. The display panel comprises a substrate and an isolation structure. The isolation structure is located on one side of the substrate, and is distributed in the display area and the non-display area. The cover plate is arranged on the light-emitting side of the display panel. The cover plate comprises a glass layer. The orthographic projection of the edge of the glass layer on the substrate is located on the side of the orthographic projection of the edge of the display panel on the substrate close to the display area. The orthographic projection of the isolation structure on the substrate is located in the orthographic projection of the glass layer on the substrate. In the application, the glass layer of the cover plate is retracted inwards, the edge of the glass layer avoids the stress concentration area on the outermost side of the display panel, and the risk of breakage of the glass layer due to stress is reduced. At the same time, the glass layer covers the area where the isolation structure is located, effectively protects the isolation structure, and ensures the long-term stable operation of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] Organic Light Emitting Diode (OLED) display technology is one of the mainstream display technologies currently available. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology defines the light-emitting areas through isolation structures and achieves pixelation through chemical vapor deposition encapsulation, making it adaptable to the production needs of panels of various sizes and resolutions.

[0004] However, the reliability of current display devices needs to be improved. Summary of the Invention

[0005] In view of this, the purpose of this application is to provide a display module and display device that aims to improve reliability.

[0006] An embodiment of the first aspect of this application provides a display module, which includes a display panel and a cover plate. The display panel has a display area and a non-display area, the non-display area being disposed around the display area. The display panel includes a substrate and an isolation structure, the isolation structure being located on one side of the substrate and distributed between the display area and the non-display area. The cover plate is disposed on the light-emitting side of the display panel, the cover plate including a glass layer, the orthographic projection of the edge of the glass layer on the substrate being located on the side of the orthographic projection of the edge of the display panel on the substrate closer to the display area, and the orthographic projection of the isolation structure on the substrate being located within the orthographic projection of the glass layer on the substrate.

[0007] In one embodiment, the display module further includes a crack barrier dam located in the non-display area, wherein the orthographic projection of the crack barrier dam on the substrate lies between the orthographic projection of the isolation structure on the substrate and the orthographic projection of the edge of the display panel on the substrate.

[0008] In one embodiment, the orthographic projection of the edge of the glass layer onto the substrate lies between the orthographic projection of the isolation structure onto the substrate and the orthographic projection of the crack barrier dam onto the substrate.

[0009] In one embodiment, the orthographic projection of the edge of the glass layer onto the substrate at least partially overlaps with the orthographic projection of the crack barrier dam onto the substrate; Alternatively, the orthographic projection of the crack-blocking dam on the substrate lies within the orthographic projection of the glass layer on the substrate.

[0010] In one embodiment, the display panel further includes a pixel defining layer located on one side of the substrate, wherein the orthographic projection of the glass layer on the substrate lies within the orthographic projection of the pixel defining layer on the substrate.

[0011] In one embodiment, the distance between the edge of the isolation structure and the edge of the display panel is different in the direction corresponding to different sides of the boundary of the display area; and / or, the distance between the edge of the isolation structure and the edge of the glass layer is different in the direction corresponding to different sides of the boundary of the display area.

[0012] In one embodiment, the boundary of the display area includes a first side and a second side. Within the non-display area, the first distance between the edge of the isolation structure located on the side of the first side away from the display area and the first side in a direction parallel to the surface of the substrate is not equal to the second distance between the edge of the isolation structure located on the side of the second side away from the display area and the second side in a direction parallel to the surface of the substrate.

[0013] In one embodiment, the third distance between the edge of the isolation structure on the side of the first side away from the display area and the edge of the glass layer in a direction parallel to the surface of the substrate is not equal to the fourth distance between the edge of the isolation structure on the side of the second side away from the display area and the edge of the glass layer in a direction parallel to the surface of the substrate.

[0014] In one embodiment, the boundary of the display area further includes a third side and a fourth side, wherein the first side and the third side are disposed opposite to each other, and the second side and the fourth side are disposed opposite to each other; Within the non-display area, the fifth distance between the edge of the isolation structure located on the side of the fourth side away from the display area and the fourth side in a direction parallel to the surface of the substrate is not equal to the second distance; and / or, Within the non-display area, the sixth distance between the edge of the isolation structure located on the side of the third side away from the display area and the third side in a direction parallel to the surface of the substrate is not equal to the first distance.

[0015] In one embodiment, the non-display area includes a binding area, and the second side is located on the side of the display area close to the binding area; wherein the first spacing is smaller than the second spacing.

[0016] In one embodiment, the glass layer is an ultra-thin glass layer.

[0017] In one embodiment, the glass layer includes a folded portion and a non-folded portion adjacent to the folded portion, wherein the thickness of the folded portion of the glass layer is less than the thickness of the non-folded portion.

[0018] In one embodiment, a support layer is further included, the support layer being disposed on the side of the display panel opposite to the glass layer, and the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the support layer on the substrate.

[0019] In one embodiment, a backplate layer is further included, the backplate layer being attached to the side of the display panel opposite to the glass layer, and the orthographic projection of the isolation structure on the substrate lies within the orthographic projection of the backplate layer on the substrate.

[0020] In one embodiment, the display panel includes a sensor setting area located within the display area, and the isolation structure has a light-transmitting opening area at a position corresponding to the sensor setting area.

[0021] In one embodiment, the backsheet layer includes an opening that at least partially overlaps with the orthographic projection of the light-transmitting opening area onto the substrate.

[0022] In one embodiment, the cover plate further includes a substrate layer disposed on the side of the glass layer away from the display panel, wherein the orthographic projection of the edge of the substrate layer on the substrate at least partially overlaps with the orthographic projection of the edge of the display panel on the substrate.

[0023] In one embodiment, the isolation structure located in the display area encloses a plurality of isolation openings, and the display panel includes a plurality of light-emitting devices, at least a portion of which are located within the corresponding isolation openings.

[0024] An embodiment of the second aspect of this application provides a display device, including the display module in any embodiment of the first aspect.

[0025] The display module provided in this application embodiment reduces the risk of damage to the glass layer edge due to stress by shrinking the glass layer of the cover plate inward, thus avoiding the stress concentration area on the outermost side of the display panel. At the same time, the glass layer covers the area where the isolation structure is located, effectively protecting the isolation structure and ensuring the long-term stable operation of the display panel. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a top view of the display module in the embodiments of this application; Figure 2 yes Figure 1 A schematic diagram of the partial film layer cross-section structure of the display area of ​​the display module in the BB direction; Figure 3 yes Figure 1 A schematic diagram of the cross-sectional structure of a portion of the film layer in the CC direction of the non-display area of ​​the display module; Figure 4 yes Figure 1 A schematic diagram of the partial film layer cross-section structure of the non-display area of ​​the display module in the DD direction; Figure 5 yes Figure 1 A schematic diagram of the cross-sectional structure of the film layer in one side bezel area of ​​the display module; Figure 6 yes Figure 1 A schematic diagram of the cross-sectional structure of the film layer in the lower bezel area of ​​the display module; Figure 7 This is a top view of the display module in the embodiment of this application, showing the bending axis; Figure 8 This is a schematic cross-sectional view of the substrate and pixel limiting layer of a display panel according to one embodiment of this application. Figure 9 This is a schematic diagram of the pixel circuit within the substrate of a display panel according to one embodiment of this application; Figure 10 This is a top view schematic diagram of the isolation structure of a display panel according to one embodiment of this application; Figure 11 This is a schematic diagram of the light-emitting structure of a display panel according to one embodiment of this application; Figure 12 This is a partial cross-sectional structural diagram of a display panel according to one embodiment of this application; Figure 13 This is a flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0028] Marker explanation: 100. Display module; 10. Display panel; 101. Bending axis; 11. Substrate; 12. Isolation structure; 120. Isolation opening; 1201. First isolation opening; 1202. Second isolation opening; 1203. Third isolation opening; 121. Blocking portion; 122. Isolation portion; 123. Base; 13. Light-emitting device; 131. First electrode; 132. Light-emitting structure; 133. Second electrode; 13a. First light-emitting device; 13b. Second light-emitting device; 13c. Third light-emitting device; 14. Encapsulation portion; 14a. First encapsulation portion; 14b. Second encapsulation portion; 14c. Third encapsulation portion; 141. First segment; 142. Second segment; 140. Gap space; 15. Second encapsulation layer; 16. Third encapsulation layer; 17. Pixel defining layer; 18. Transistor; 19. Planarization layer; 20. Cover plate; 21. Glass layer; 211. Folded / bent section; 212. Non-bent section; 22. Substrate layer; 23. Protective film; 30. Crack-resistant dam; 40. Support layer; 50. Back panel layer; 60. Filter layer; 70. Bending protective layer; 80. Touch layer; 90. Driver chip. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0031] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0032] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0033] For certain elements, terms like "above" or "overhead" are sometimes used when describing the position of an element in the Z direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "overhead," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0034] With the rapid development of Organic Light Emitting Diode (OLED) display technology, medium and large sizes, ultra-high resolution, high yield, and long lifespan have become the core development trends in the industry. Traditional OLED pixel fabrication relies on fine metal mask (FMM) evaporation processes, but these processes have inherent bottlenecks such as severe thermal deformation, poor adaptability to large sizes, low material utilization, high mold costs, and limited resolution limits, making them unable to meet the needs of mass production on high-generation lines and the iterative demands of high-end display products.

[0035] Based on this, maskless pixel evaporation technology has become the mainstream innovation direction in the industry, gradually replacing the traditional FMM process and achieving high-precision, high-yield, and low-cost mass production of OLED pixels. The core principle of maskless pixel evaporation technology is: abandoning the patterned masking method of traditional metal masks, a raised isolation structure is prepared on the basis of the pixel definition layer. By utilizing the physical isolation effect of the isolation structure, the light-emitting materials of different pixel areas and different light-emitting colors are isolated, and the precise patterned preparation of RGB pixels can be completed without a mask.

[0036] The conventional packaging structure for maskless pixel evaporation technology currently consists of: a substrate, a thin-film transistor (TFT) circuit layer, a pixel confinement layer, an isolation structure, a light-emitting functional layer, an encapsulation layer, and a cover plate structure. In foldable display products, ultra-thin glass (UTG) is commonly used for the cover plate. Due to its advantages of being ultra-thin, highly transparent, bend-resistant, and high-strength, UTG has become the mainstream cover plate material for flexible OLEDs, integrated automotive displays, and IT display panels.

[0037] In related technologies, the dimensions of each layer of the cover glass are basically consistent with the overall shape of the display panel, the boundary of the cover glass is flush with the edge of the display panel, and the cover glass is bonded to the display panel through an optical adhesive layer. However, when the UTG boundary of the cover glass is flush with the display panel, when the edge of the display module is subjected to force, the stress will be directly applied to the glass edge, which can easily cause micro-cracks or even overall breakage, reducing the product life.

[0038] The embodiments of this application provide a display module, such as... Figures 1 to 4 As shown, the display module 100 includes a display panel 10 and a cover plate 20.

[0039] The display panel 10 has a display area AA and a non-display area NA, with the non-display area NA surrounding the display area AA. The display area AA (Active Area) is the area of ​​the screen that can actually display images. In the display panel 10, the boundary of the display area AA represents the boundary of the effective light-emitting area of ​​the display panel 10. The display panel 10 includes a substrate 11 and an isolation structure 12. The substrate 11 can be a TFT array substrate, which includes a substrate and a TFT circuit layer formed on the substrate. The isolation structure 12 is located on one side of the substrate 11, specifically on the side of the pixel definition layer on the substrate 11 away from the substrate 11. The isolation structure 12 is used to isolate the light-emitting materials of different sub-pixels in a maskless evaporation process, achieving precise patterning of pixels. The isolation structure 12 is located in the display area AA and the non-display area NA, meaning that the isolation structure 12 extends from the display area AA to the non-display area NA.

[0040] A cover plate 20 is disposed on the light-emitting side of the display panel 10. The cover plate 20 includes a glass layer 21, which can be made of ultra-thin glass (UTG). The orthographic projection of the edge of the glass layer 21 onto the substrate 11 is located on the side of the orthographic projection of the edge of the display panel 10 onto the substrate 11 closer to the display area AA. That is, in a direction parallel to the plane of the substrate 11, the edge of the glass layer 21 is recessed inward relative to the edge of the display panel 10, and there is a certain gap between the edge of the glass layer 21 and the edge of the display panel 10.

[0041] Specifically, the UTG glass layer 21 is the core cover material of the foldable display module, which can balance high hardness, scratch resistance and bendability, and can replace the traditional transparent polyimide plastic film.

[0042] Meanwhile, the orthographic projection of the isolation structure 12 on the substrate 11 lies within the orthographic projection of the glass layer 21 on the substrate 11. From a top view, the glass layer 21 covers the isolation structure 12, meaning that the entire isolation structure 12 is covered by the glass layer 21.

[0043] It should be noted that, in the embodiments of this application, "edge of the display panel" refers to the boundary corresponding to the cutting line of the display panel 10, that is, the outermost boundary of the entire display panel 10. When comparing orthographic projection positions, the orthographic projection of the "edge of the display panel" on the substrate 11 is the orthographic projection of the cutting line on the substrate 11.

[0044] Since the outermost boundary of the display panel 10 is the cutting line, microcracks and residual stress will be generated near the cutting line during the cutting process, making this area a stress concentration area. After the edge of the glass layer 21 is recessed relative to the edge of the display panel 10, there is a horizontal gap between the edge of the glass layer 21 and the cutting line. The stress concentration area near the cutting line corresponds to the edges of other film layers in the cover plate 20 located outside the glass layer 21, not the edge of the glass layer 21 itself. When the display module 100 is subjected to external impact or bending stress, the stress is mainly transmitted inward through the area near the cutting line. Because there is a gap between the edge of the glass layer 21 and this area, the stress transmitted to the edge of the glass layer 21 is significantly attenuated, thereby reducing the risk of microcracks or breakage due to stress concentration at the edge of the glass layer 21. In contrast, if the edge of the glass layer 21 is flush with the edge of the display panel 10, the edge of the glass layer 21 is directly located in the stress concentration area corresponding to the cutting line, and the external stress will act directly on the edge of the glass layer 21, easily causing breakage.

[0045] The isolation structure 12 is located in the display area AA and the non-display area NA, with its boundary within the non-display area NA. In the maskless vapor deposition process, the sidewalls of the isolation structure 12 may have an interface with the encapsulation layer, which is a potential path for moisture and oxygen to permeate. If the glass layer 21 fails to cover the isolation structure 12, i.e., the boundary of the isolation structure 12 is exposed outside the coverage area of ​​the glass layer 21, external moisture and oxygen may permeate into the display area AA along the boundary of the isolation structure 12, leading to degradation of the light-emitting device 13. After the glass layer 21 covers the isolation structure 12, the glass layer 21 acts as a dense protective layer, ensuring the integrity of the encapsulation, preventing external moisture and oxygen from entering the display area AA due to damage to the encapsulation layer, and ensuring the long-term display quality and lifespan of the display panel 10.

[0046] Therefore, in the display module 100 provided by the embodiments of this application, the glass layer 21 is recessed relative to the display panel 10, and the edge of the glass layer 21 avoids the outermost stress concentration area of ​​the display panel 10. When the display module 100 is subjected to external impact or bending stress, the stress mainly acts on the edges of other parts of the cover plate 20, rather than directly on the edge of the glass layer 21, thereby effectively reducing the risk of damage to the glass layer 21 due to stress on its edges. At the same time, the recessed glass layer 21 still covers the area where the isolation structure 12 is located, providing effective protection for the isolation structure 12, helping to maintain the integrity of the encapsulation, and ensuring the long-term stable operation of the display panel 10.

[0047] In some embodiments, the display module 100 further includes a crack dam 30. The crack dam 30 is located in the non-display area NA, that is, the crack dam is disposed on the side of the display panel 10 away from the boundary of the display area AA. Specifically, the orthographic projection of the crack dam 30 on the substrate 11 lies between the orthographic projection of the isolation structure 12 on the substrate 11 and the orthographic projection of the edge of the display panel 10 on the substrate 11. The crack dam 30 is used to prevent microcracks generated during the cutting process of the display panel 10 from extending into the interior of the display area AA, thereby protecting the light-emitting devices within the display area AA.

[0048] In some embodiments, the orthographic projection of the edge of the glass layer 21 onto the substrate 11 lies between the orthographic projection of the isolation structure 12 onto the substrate 11 and the orthographic projection of the crack-blocking dam 30 onto the substrate 11. Specifically, the edge of the glass layer 21 is on the side of the crack-blocking dam 30 closest to the display area AA (defined as the inner side), and the crack-blocking dam 30 is not covered by the glass layer 21. This structure is suitable for scenarios with high requirements for narrow bezels, where the inward reduction of the glass layer 21 is small, the bezel width can be made narrower, and the crack-blocking dam 30 can block microcracks by its own structure.

[0049] In other embodiments, the orthographic projection of the edge of the glass layer 21 onto the substrate 11 overlaps with the orthographic projection of the crack barrier dam 30 onto the substrate 11.

[0050] Alternatively, the orthographic projection of the crack-blocking dam 30 on the substrate 11 lies within the orthographic projection of the glass layer 21 on the substrate 11.

[0051] Specifically, the edge of glass layer 21 extends further outward, covering the crack-blocking dam 30. When glass layer 21 covers the crack-blocking dam 30, it provides physical protection for the dam, preventing it from being damaged by external forces, thereby maintaining the reliability of the edge sealing. This structure is suitable for scenarios with high reliability requirements. Glass layer 21 completely covers the crack-blocking dam 30, providing physical protection against external forces and enhancing the edge sealing performance. Alternatively, the edge of glass layer 21 can be located above the crack-blocking dam 30, partially covering it. A balance can be achieved between frame width and reliability.

[0052] In some embodiments, the orthographic projection of the glass layer 21 onto the substrate 11 lies within the orthographic projection of the pixel limiting layer 17 onto the substrate 11. The outer boundary of the pixel limiting layer 17 lies outside the outer boundary of the glass layer 21, and the glass layer 21, even after being recessed, still covers the area where the pixel limiting layer 17 is located, further ensuring the protection of the pixel limiting layer 17.

[0053] In some embodiments, the distance between the edge of the isolation structure 12 and the edge of the display panel 10 is different in directions corresponding to different sides of the boundary of the display area AA. For example, the distance between the edge of the isolation structure 12 and the edge of the display panel 10 in the direction corresponding to the left side of the display area AA is different from the distance between the edge of the isolation structure 12 and the edge of the display panel 10 in the direction corresponding to the lower side of the display area AA. And / or, the distance between the edge of the isolation structure 12 and the edge of the glass layer 21 is also different in directions corresponding to different sides of the boundary of the display area AA.

[0054] By varying the spacing between the edge of the isolation structure 12 and the edge of the display panel 10 in different directions on different sides, the non-display area NA of the display panel 10 can have different bezel widths on different sides to accommodate the space requirements of different sides. For example, a larger bezel width can be used on the side where the driver chip 90 or flexible circuit board needs to be installed, while a smaller bezel width can be used on other sides to achieve a narrow bezel effect.

[0055] By making the distance between the edge of the isolation structure 12 and the edge of the glass layer 21 different in the directions corresponding to different sides, the inward amount of the glass layer 21 on different sides can be flexibly adjusted to ensure that the glass layer 21 can effectively cover the isolation structure 12 on each side, while avoiding stress concentration caused by the edge of the glass layer 21 being too close to the edge of the display panel 10.

[0056] In some embodiments, the boundary of the display area AA includes a first side S1 and a second side S2. For example, the first side S1 is the left side of the display area AA, and the second side S2 is the lower side of the display area AA. Within the non-display area NA, the first distance d1 between the edge of the isolation structure 12 on the side of the first side S1 away from the display area AA and the first side S1 in a direction parallel to the surface of the substrate 11 is not equal to the second distance d2 between the edge of the isolation structure 12 on the side of the second side S2 away from the display area AA and the second side S2 in a direction parallel to the surface of the substrate 11.

[0057] In some embodiments, the third distance d3 between the edge of the isolation structure 12 on the side of the first side S1 away from the display area AA and the edge of the glass layer 21 in the direction parallel to the surface of the substrate 11 is not equal to the fourth distance d4 between the edge of the isolation structure 12 on the side of the second side S2 away from the display area AA and the edge of the glass layer 21 in the direction parallel to the surface of the substrate 11.

[0058] In some embodiments, the boundary of the display area AA further includes a third side S3 and a fourth side S4. The first side S1 and the third side S3 are arranged opposite to each other; for example, the first side S1 is the left side of the display area AA, and the third side S3 is the right side of the display area AA. The second side S2 and the fourth side S4 are arranged opposite to each other; for example, the second side S2 is the lower side of the display area AA, and the fourth side S4 is the upper side of the display area AA.

[0059] Within the non-display area NA, the fifth distance d5 between the edge of the isolation structure 12 on the fourth side S4 (away from the display area AA) and the fourth side S4 in the direction parallel to the surface of the substrate 11 is not equal to the second distance d2. That is, the position of the isolation structure corresponding to the fourth side S4 (upper side) can be different from the position of the isolation structure corresponding to the second side S2 (lower side). And / or, the sixth distance d6 between the edge of the isolation structure 12 on the third side S3 (away from the display area AA) and the third side S3 in the direction parallel to the surface of the substrate 11 is not equal to the first distance d1. That is, the position of the isolation structure corresponding to the third side S3 (right side) can also be different from the position of the isolation structure corresponding to the first side S1 (left side).

[0060] The non-display area NA includes border areas. Specifically, the left border area corresponds to the first side S1, the bottom border area corresponds to the second side S2, the right border area corresponds to the third side S3, and the top border area corresponds to the fourth side S4.

[0061] This application implements differentiated design for the bezel widths on different sides. For example, the bottom bezel area corresponds to the bonding area where the driver chip 90 or flexible circuit board needs to be installed, and the bezel width can be appropriately increased. For the left and right sides, the width of the corresponding bezel areas can be appropriately reduced to achieve a narrow bezel effect. Accordingly, the edge position of the glass layer 21 is also adjusted according to the position of the isolation structure 12 on different sides to ensure that the glass layer 21 can effectively cover the isolation structure 12 on different sides.

[0062] If the spacing between the isolation structures on all sides and the display area is equal (i.e., equal spacing design), the bezel width on one side of the bonding area will be the same as the bezel width on the left and right sides, resulting in insufficient space in the bonding area or excessively wide left and right bezels. This embodiment sets different spacings on different sides (e.g., the first spacing d1 is smaller than the second spacing d2), allowing one side of the bonding area to have a larger bezel width to accommodate the bonding structure of the driver chip 90 or the flexible circuit board, while maintaining a narrower bezel width on the left and right sides to achieve a narrow bezel design. This asymmetrical bezel design optimizes the screen-to-body ratio of the display module while ensuring functional requirements.

[0063] The four sides of the display module can be configured with different isolation structure positions according to actual design requirements, thus achieving flexible bezel design. For example, the bezel widths of the top, bottom, left, and right sides of the display panel can be different to adapt to different structural layout requirements. Correspondingly, the distance between the edge of the isolation structure 12 and the edge of the glass layer 21 on different sides is also different, allowing the inward amount of the glass layer 21 on each side to be flexibly adjusted according to actual design requirements.

[0064] In some implementations, reference Figure 4 The non-display area NA includes the bonding area BA. The bonding area BA is used to bond the driver chip 90 or the flexible printed circuit (FPC). The second side S2 is located on the side of the display area AA closest to the bonding area BA, that is, the second side S2 is the lower side of the display area AA.

[0065] Since the lower border area corresponding to the second side S2 needs to house the driver chip 90 or a flexible circuit board, its overall border width requirement is greater than that of the left border area corresponding to the first side S1. With the non-display area width outside the isolation structure being basically the same, the distance from the lower isolation structure to the display area AA (second spacing d2) is greater than the distance on the left side (first spacing d1), meaning the first spacing d1 is less than the second spacing d2. This application adapts to the border width requirements of different sides through this asymmetrical spacing design.

[0066] Correspondingly, the seventh distance between the edge of the display panel 10 and the edge of the glass layer 21 on the side of the first side S1 away from the display area AA, in the direction parallel to the surface of the substrate 11, is smaller than the eighth distance between the edge of the display panel 10 and the edge of the glass layer 21 on the side of the second side S2 away from the display area AA, in the direction parallel to the surface of the substrate 11. Because the lower side of the display panel bezel is wider, the inward distance (eighth distance) of the glass layer 21 on the lower side is correspondingly larger; while the left side of the display panel bezel is narrower, the inward distance (seventh distance) of the glass layer 21 on the left side is correspondingly smaller. This design ensures that the glass layer 21 terminates near the edge of the display panel 10 on both sides, while simultaneously ensuring coverage of the isolation structure 12.

[0067] For example, the distance between the orthographic projection of the edge of the glass layer 21 onto the substrate 11 and the orthographic projection of the edge of the display panel 10 onto the substrate 11 is 200 μm to 800 μm. When this distance is less than 200 μm, the edge of the glass layer 21 is too close to the edge of the display panel 10, the improvement effect of edge stress concentration is not significant, and the glass layer 21 still has a large risk of breakage. When this distance is greater than 800 μm, the inward shrinkage of the glass layer 21 is too large, which may expose some important structures (such as packaging structures, signal traces, etc.) in the non-display area NA of the display panel 10, affecting the long-term reliability of the display module. Preferably, the distance between the orthographic projection of the edge of the glass layer 21 onto the substrate 11 and the orthographic projection of the edge of the display panel 10 onto the substrate 11 is 300 μm to 600 μm, within which the dual requirements of stress dispersion and structural protection can be well balanced. More preferably, the distance is 400μm to 500μm, at which point there is a sufficient safe distance between the edge of the glass layer 21 and the edge of the display panel 10, without excessively sacrificing the protective coverage of the cover plate.

[0068] By setting an isolation structure 12 in the display panel 10 and recessing the glass layer 21 in the cover plate 20 relative to the edge of the display panel 10 while maintaining the glass layer 21 covering the isolation structure 12, the risk of stress concentration at the edge of the glass layer 21 is effectively reduced, decreasing the possibility of the glass layer 21 breaking due to edge stress. Furthermore, by setting different isolation structure positions and glass layer recess distances on different sides, a differentiated bezel design is achieved, balancing the requirements of narrow bezels and structural reliability.

[0069] In some embodiments, the glass layer 21 is an ultrathin glass layer.

[0070] In some implementations, reference Figure 7The glass layer 21 includes a folded and bent portion 211 and a non-bent portion 212 adjacent to the folded and bent portion 211. The thickness of the folded and bent portion 211 of the glass layer 21 is less than the thickness of the non-bent portion 212. The folded and bent portion 211 corresponds to the bending area where the display module 100 performs the folding and bending action, and the non-bent portion 212 corresponds to the area where the display module maintains its flatness.

[0071] Specifically, the ultra-thin glass layer can be formed by locally thinning the folded portion 211, for example, by chemical etching, laser processing, or mechanical grinding, to create grooves (i.e., slots) in the ultra-thin glass layer corresponding to the bending area, making the thickness of the folded portion 211 less than the thickness of the non-bending portion 212. This structure is called UFG (Ultra-Thin Flexible Glass). Through local thinning, the ultra-thin glass layer has lower bending stiffness at the folded portion 211, making it easier to fold and bend, reducing bending stress, and improving bending life. A larger thickness is maintained at the non-bending portion 212 to maintain good support strength and protective performance.

[0072] In the display module 100 provided in this application embodiment, by setting the glass layer 21 to a structure that is thinned at the folding and bending portion 211, the structural strength of the non-bending area is ensured, and the flexibility of the bending area is improved, thereby further optimizing the bending performance and reliability of the folding display module.

[0073] In some implementations, reference Figure 5 , Figure 6 The display module 100 also includes a support layer 40. The support layer 40 is disposed on the side of the display panel 10 opposite to the glass layer 21, i.e., on the back side of the display panel 10. The support layer 40 is a support film layer attached to the back of the display panel, used to provide support and protection for the display panel 10. The support layer 40 can be made of PET (polyethylene terephthalate) or UTG (ultra-thin glass). When the support layer 40 is made of PET, it has the advantages of being bend-resistant and having a lower cost; when the support layer 40 is made of UTG, it can provide higher support stiffness and better dimensional stability, allowing the display panel 10 to have better flatness in non-bending areas.

[0074] In some embodiments, the display module 100 further includes a backplate layer 50. The backplate layer 50 is disposed on the side of the display panel 10 opposite to the glass layer 21. Specifically, the backplate layer 50 is attached to the side of the support layer 40 opposite to the display panel 10. The backplate layer 50 can be bonded to the support layer 40 using an optical adhesive layer or a pressure-sensitive adhesive layer. Alternatively, if the support layer 40 is not provided, the backplate layer 50 can be directly bonded to the back of the display panel 10 using an optical adhesive layer or a pressure-sensitive adhesive layer. The backplate layer 50, also known as the BKT (Bracket), is the bottom support structure of the module and is typically made of metal materials (such as stainless steel, titanium alloy, etc.) or composite materials. It provides mechanical support for the display module 100 and prevents the display module from being excessively stretched when bent.

[0075] The back panel layer 50 has multiple through holes at the locations corresponding to the folding and bending portions 211. These through holes can be formed by laser drilling, chemical etching, or mechanical stamping. By providing multiple through holes at the locations corresponding to the folding and bending portions 211 on the back panel layer 50, the bending stiffness of the back panel layer 50 in the bending area can be effectively reduced, making the display module fold and bend more smoothly, reducing the torque required for bending, and reducing stress concentration during bending, thereby improving bending life. In the non-bending areas, the back panel layer 50 maintains its complete structure, providing sufficient mechanical support for the display panel 10 and preventing the display panel 10 from denting or deforming in the non-bending areas.

[0076] The back panel layer 50 may include a back panel bracket with pressure-sensitive adhesive (PSA). The back panel layer 50 is bonded and fixed to the support layer 40 by the PSA, serving a supporting and cushioning function. In the bending area, shims may also be provided as auxiliary support components. These shims fill the bending area to control the minimum bending radius during folding, preventing excessive bending of the screen and reducing crease formation.

[0077] The display module 100 provided in this application, through the provision of the support layer 40 and the back plate layer 50, effectively improves the overall structural strength and reliability of the display module 100 while ensuring bending performance.

[0078] In some implementations, reference Figure 6 The display module 100 may also include a light filter layer 60, which is disposed between the display panel 10 and the glass layer 21. Specifically, the light filter layer 60 includes a color filter formed on the encapsulation layer of the display panel. The use of a color filter instead of a traditional polarizer makes the screen thinner, has higher light transmittance, and is easier to bend.

[0079] In some implementations, reference Figure 6The display module 100 may further include a bending protection layer 70. The bending protection layer 70 is disposed in the bonding bending area of ​​the display panel 10, which is located between the display area AA and the bonding area BA. The bending protection layer 70 is used to protect the bent portion of the substrate 11.

[0080] refer to Figure 3 , Figure 4 The display module 100 may also include a touch layer 80. The touch layer 80 may be disposed between the cover plate 20 and the display panel 10, or it may be integrated inside the cover plate 20. The touch layer 80 is used to implement touch sensing functionality.

[0081] In some embodiments, the cover plate 20 may further include a substrate layer 22. The substrate layer 22 is disposed on the side of the glass layer 21 away from the display panel 10. The orthographic projection of the edge of the substrate layer 22 onto the substrate 11 at least partially overlaps with the edge of the display panel 10.

[0082] Specifically, the substrate layer 22 serves as a support film for the cover plate 20, enhancing the stability of the bending area and reducing crease formation. The substrate layer 22 is made of PET (Polyethylene Terephthalate). PET is a flexible plastic film that can serve as a support substrate for the cover plate 20, offering advantages such as bend resistance and low cost. The cover plate 20 may also include a protective film 23, which is disposed on the side of the glass layer 21 away from the display panel 10, specifically on the side of the substrate layer 22 away from the display panel 10. This protective film serves as a temporary protective layer during the manufacturing or production process of the display module 100, preventing the cover plate 20 from being scratched or contaminated during transportation and assembly. It can be removed after assembly.

[0083] The edge of the substrate layer 22 at least partially overlaps with the edge of the display panel 10, meaning the substrate layer 22 is not recessed or has a small amount of recess. The edge of the glass layer 21 is protected by the substrate layer 22 and / or the protective film 23. When the display module is subjected to an edge impact, the impact force first acts on the edge area of ​​the substrate layer 22, and is attenuated by the buffering effect of the substrate layer 22 before reaching the glass layer 21. Simultaneously, the substrate layer 22 covers the edge of the display panel 10, ensuring the overall coverage area and appearance integrity of the cover plate 20, while the recess of the glass layer 21 avoids the risk of the glass layer 21's edge directly bearing impact stress. Together, these two elements ensure the overall coverage area of ​​the cover plate while providing edge buffer protection for the glass layer 21.

[0084] In the display module 100, adjacent film layers can be bonded together using optical clear adhesive (OCA). OCA is a bubble-free, highly transparent adhesive material used to bond upper and lower layers together, while also buffering stress during bending to prevent peeling or misalignment between film layers. For example, a first optical adhesive layer is provided between the display panel 10 and the glass layer 21, and a second optical adhesive layer is provided between the glass layer 21 and the substrate layer 22.

[0085] In the boundary area between the display area AA and the non-display area NA, dummy pixels can also be set. The structure of a dummy pixel is the same as a normal pixel within the display area AA, but it is masked by a black matrix or masking layer and is not used for actual display. Dummy pixels can act as a process buffer, ensuring the display uniformity of pixels at the edge of the display area, while also absorbing mechanical stress and potential micro-crack propagation, protecting the integrity of pixels within the display area.

[0086] The embodiments of this application also provide a display module, the display module 100 including a display panel 10 and a cover plate 20.

[0087] The display panel 10 has a display area AA and a non-display area NA, with the non-display area NA surrounding the display area AA. The display area AA (Active Area) is the area of ​​the screen that can actually display images. In the display panel 10, the boundary of the display area AA represents the boundary of the effective light-emitting area of ​​the display panel 10. The display panel 10 includes a substrate 11 and an isolation structure 12. The substrate 11 can be a TFT array substrate, which includes a substrate and a TFT circuit layer formed on the substrate. The isolation structure 12 is located on one side of the substrate 11, specifically on the side of the pixel definition layer on the substrate 11 away from the substrate 11. The isolation structure 12 is used to isolate the light-emitting materials of different sub-pixels in a maskless evaporation process, achieving precise patterning of pixels. The isolation structure 12 is located in the display area AA and the non-display area NA, meaning that the isolation structure 12 extends from the display area AA to the non-display area NA.

[0088] A cover plate 20 is disposed on the light-emitting side of the display panel 10. The cover plate 20 includes a glass layer 21, which can be made of ultra-thin glass (UTG). The orthographic projection of the edge of the glass layer 21 onto the substrate 11 is located on the side of the orthographic projection of the edge of the display panel 10 onto the substrate 11 closer to the display area AA. That is, in a direction parallel to the plane of the substrate 11, the edge of the glass layer 21 is recessed inward relative to the edge of the display panel 10, and there is a certain gap between the edge of the glass layer 21 and the edge of the display panel 10.

[0089] refer to Figure 7The display module 100 is a foldable display module, comprising a bending area and a non-bending area adjacent to the bending area. The display module 100 can be folded along the bending area to achieve screen folding for storage or unfolding for use. The number of bending areas can be one or more; for example, the display module can have one bending area for single folding, or two bending areas for multiple folding. The display module can be folded inward along the bending area, so that the cover plate 20 is located on the inner side of the fold; or the display module can be folded outward along the bending area, so that the cover plate 20 is located on the outer side of the fold.

[0090] Specifically, the display module 100 can be folded along the bending area. During the folding process, the display module 100 folds around the bending center line within the bending area, i.e., the bending axis 101.

[0091] Figure 7 This is a top view of the display module in the embodiment of this application, showing that the bending axis 101 extends in the left-right direction.

[0092] The display module 100 provided in this application has a glass layer 21 recessed relative to the display panel 10, and the edge of the glass layer 21 avoids the outermost stress concentration area of ​​the display panel 10. When the display module 100 is subjected to external impact or bending stress, the stress mainly acts on the edges of other parts of the cover plate 20, rather than directly on the edge of the glass layer 21, thereby effectively reducing the risk of damage to the glass layer 21 due to stress on its edges. At the same time, the recessed glass layer 21 still covers the area where the isolation structure 12 is located, providing effective protection for the isolation structure 12, helping to maintain the integrity of the encapsulation, and ensuring the long-term stable operation of the display panel 10.

[0093] The isolation structure located in the display area encloses and forms multiple isolation openings. At least a portion of the light-emitting device is located in the corresponding isolation opening. The physical isolation effect of the isolation structure enables precise patterning of light-emitting materials of different sub-pixels, thereby improving the pixel accuracy and production yield of the display panel.

[0094] The detailed structure of the display area AA of the display panel 10 is described below with reference to the accompanying drawings.

[0095] refer to Figure 8 The substrate 11 includes a pixel circuit layer and a planarization layer 19. The pixel circuit layer includes pixel circuits for driving the light-emitting device 13 to emit light. Figure 8A transistor 18 in a pixel circuit is shown. A via is provided in the planarization layer 19, and a first electrode 131 is electrically connected to the transistor 18 in the pixel circuit layer through the via. Furthermore, the pixel circuit layer includes at least one insulating layer, which may include at least one of an inorganic layer and an organic layer. Additionally, the substrate 11 includes scan lines providing the scan signal Scan and data lines providing the data signal Data to the pixel circuit.

[0096] refer to Figure 9 The pixel circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to the data line that provides the data signal Data, the gate of the data transistor T2 is connected to the scan line that provides the scan signal Scan, and the drain of the data transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting device 13.

[0097] refer to Figure 2 , Figure 10 An isolation structure 12 is located on one side of the substrate 11, and the isolation structure 12 within the display area AA encloses a plurality of isolation openings 120. The plurality of isolation openings 120 include a plurality of first isolation openings 1201, a plurality of second isolation openings 1202, and a plurality of third isolation openings 1203. A plurality of light-emitting devices 13 are located on one side of the substrate 11, and the plurality of light-emitting devices 13 include a plurality of first light-emitting devices 13a, a plurality of second light-emitting devices 13b, and a plurality of third light-emitting devices 13c. First light-emitting devices 13a are disposed corresponding to first isolation openings 1201, second light-emitting devices 13b are disposed corresponding to second isolation openings 1202, and third light-emitting devices 13c are disposed corresponding to third isolation openings 1203. In one embodiment, one light-emitting device 13 is disposed corresponding to one isolation opening 120. For example, one-to-one correspondence between first light-emitting devices 13a and first isolation openings 1201, one-to-one correspondence between second light-emitting devices 13b and second isolation openings 1202, and one-to-one correspondence between third light-emitting devices 13c and third isolation openings 1203. At least a portion of the first light-emitting device 13a is disposed within the corresponding first isolation opening 1201, at least a portion of the second light-emitting device 13b is disposed within the corresponding second isolation opening 1202, and at least a portion of the third light-emitting device 13c is disposed within the corresponding third isolation opening 1203. In another embodiment, multiple light-emitting devices 13 are correspondingly disposed with one isolation opening 120; for example, multiple light-emitting devices with the same emission color are corresponding to one isolation opening 120.

[0098] Multiple isolation openings are formed by the isolation structure within the display area, with at least a portion of the light-emitting device located within the corresponding isolation opening. The physical isolation effect of the isolation structure enables precise patterning of light-emitting materials for different sub-pixels, thereby improving the pixel accuracy and production yield of the display panel.

[0099] The display module has a bending area and can be folded along the bending area, which not only meets the need for foldable portability, but also ensures the structural reliability in the folded state through the inward shrinkage design of the glass layer.

[0100] In one example, the isolation structure 12 includes an isolation portion 122 and a blocking portion 121 stacked along a direction away from the substrate 11 (i.e., the Z direction), with the width of the blocking portion 121 being greater than the width of the isolation portion 122. Consequently, both ends of the blocking portion 121 protrude relative to the sides of the isolation portion 122, and this shape of the isolation structure 12 is also referred to as a cantilever shape. The isolation portion 122 and the blocking portion 121 are made of different materials, and the etching rate of the blocking portion 121 is lower than that of the isolation portion 122. The material of the isolation portion 122 includes a conductive material, specifically including at least one of aluminum (Al), aluminum alloys, and aluminum alloys including at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The blocking portion 121 can be a single-layer structure or a multi-layer structure. If the blocking portion 121 is a single-layer structure, the material of the blocking portion 121 can include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. When the blocking part 121 has a multi-layer structure, one layer of the blocking part 121 is made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy or molybdenum-niobium alloy, and the other layer of the blocking part 121 may be made of conductive oxide or inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0101] In some embodiments, reference Figure 2 The isolation structure 12 may further include a base 123 located on the side of the isolation portion 122 near the substrate 11. The base 123 protrudes relative to the isolation portion 122 in the direction toward the isolation opening 120, and the orthographic projection of the isolation portion 122 on the substrate 11 lies within the orthographic projection of the base 123 on the substrate 11. The material of the base 123 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0102] In one embodiment, the display panel 10 may further include a pixel defining layer 17, on which an isolation structure 12 is disposed. The pixel defining layer 17 has pixel openings communicating with the isolation openings 120. Specifically, the pixel defining layer 17 has a first pixel opening communicating with a first isolation opening 1201, a second pixel opening communicating with a second isolation opening 1202, and a third pixel opening communicating with a third isolation opening 1203. The areas of the orthographic projections of the first, second, and third pixel openings onto the substrate 11 may be the same or different. The shapes of the orthographic projections of the pixel openings and the corresponding isolation openings 120 onto the substrate 11 may be the same or different. Generally, the area of ​​the orthographic projection of the isolation opening 120 onto the substrate 11 is larger than the area of ​​the orthographic projection of the pixel opening communicating with the isolation opening 120 onto the substrate 11. The orthographic projections of the pixel openings of the light-emitting device 13 onto the substrate 11 overlap with the orthographic projections of the isolation openings 120 onto the substrate 11. The pixel defining layer 17 is made of an inorganic material, for example, the pixel defining layer 17 is formed using an inorganic insulating material selected from at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0103] In one embodiment, the pixel defining layer 17 includes a plurality of sub-layers, including a first sub-layer and a second sub-layer stacked sequentially along a direction away from the substrate 11, that is, the pixel defining layer 17 can adopt a double-layer design.

[0104] For example, the first sublayer exhibits better film-forming properties than the second sublayer. That is, under the same thickness conditions, the first sublayer can better cover the stepped structure formed by the first electrode compared to the second sublayer, without causing cracks. Conversely, to achieve the same stepped coverage effect, the thickness of the first sublayer needs to be thinner than that of the second sublayer, meaning the thickness requirement for the first sublayer is relatively low, which is beneficial for product thinning. Furthermore, better film-forming properties are reflected in the better coverage of the formed film, making it denser and more effective at isolating moisture.

[0105] For example, the second sublayer has better etching resistance than the first sublayer. Since the side of the pixel defining layer 17 facing away from the substrate 11 will be etched during the display panel manufacturing process, by selecting a material with stronger etching resistance as the second sublayer, the etching resistance of the pixel defining layer 17 can be improved, further enhancing the reliability of the display panel.

[0106] For example, the first sublayer and the second sublayer are made of different materials. For instance, the first sublayer is made of silicon nitride, and the second sublayer is made of silicon oxide.

[0107] For example, the thickness of the first sublayer is greater than or equal to 1000 angstroms and less than or equal to 5000 angstroms. For instance, the thickness of the first sublayer is 1000 angstroms, 2000 angstroms, 3000 angstroms, 4000 angstroms, 5000 angstroms, etc.

[0108] For example, the thickness of the second sublayer is greater than or equal to 500 angstroms and less than or equal to 3000 angstroms. For instance, the thickness of the second sublayer is 500 angstroms, 1000 angstroms, 2000 angstroms, 3000 angstroms, etc.

[0109] In another embodiment, the isolation structure 12 is disposed within the recess of the pixel limiting layer 17. Alternatively, the pixel limiting layer 17 may not be provided in the display panel 10, and the isolation structure 12 may be disposed on one side of the substrate 11, with the isolation structure 12 in contact with one side of the substrate 11.

[0110] The first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c each emit light of different colors. Each of these devices includes a first electrode 131, a light-emitting structure 132, and a second electrode 133 stacked together. The first electrode 131 is disposed on the substrate 11, and a pixel defining layer 17 covers the end of the first electrode 131. A pixel opening is provided on the pixel defining layer 17, through which the first electrode 131 is exposed. The light-emitting structure 132 of the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c covers the sidewall of the pixel opening of the pixel defining layer 17 and the side of the pixel defining layer 17 facing away from the substrate 11. Each light-emitting structure 132 is located within the pixel opening and is in contact with the first electrode 131.

[0111] The second electrodes 133 of the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c respectively cover the corresponding light-emitting structure 132. The second electrodes 133 are electrically connected to the isolation structure 12. For example, the second electrodes 133 are connected to the isolation portion 122 of the isolation structure 12, or the second electrodes 133 are connected to the base portion 123, or the second electrodes 133 are connected to both the isolation portion 122 and the base portion 123. Specifically, when the isolation structure 12 includes a three-layer structure of a blocking portion 121, an isolation portion 122, and a base portion 123, the second electrodes 133 can extend to the side surface of the base portion 123 facing away from the substrate 11 to connect with the base portion 123. In this case, the second electrodes 133 may or may not be connected to the isolation portion 122.

[0112] The first electrode 131 can be an anode, and the second electrode 133 can be a cathode. The first electrode 131 of each light-emitting device 13 can be connected to the pixel circuit through a via, so that the pixel circuit drives the light-emitting device 13 to emit light.

[0113] The first electrode 131 may include a multilayer structure, for example, the first electrode 131 includes a reflective layer and a pair of conductive oxide layers respectively covering the upper and lower surfaces of the reflective layer. The reflective layer can be formed using a metallic material with excellent light reflectivity, such as silver. Each conductive oxide layer can be formed of a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 133 is formed, for example, of a metallic material such as an alloy of magnesium and silver (MgAg).

[0114] Figure 11 This is a schematic diagram of a light-emitting structure 132 according to one embodiment of this application. The light-emitting structure 132 of at least one of the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the substrate 11 (i.e., the Z direction). The light-emitting structure 132 may include a single light-emitting material layer EML, or a stacked light-emitting structure including multiple light-emitting material layers EML.

[0115] In order for the light-emitting structure 132 to emit light, a pixel voltage is provided to the first electrode 131 and a common voltage is provided to the second electrode 133, forming a potential difference between the first electrode 131 and the second electrode 133, so that the light-emitting structure 132 disposed between the first electrode 131 and the second electrode 133 emits light. In one embodiment, if a potential difference is formed between the first electrode 131 and the second electrode 133 of the first light-emitting device 13a, the light-emitting material layer EML of the light-emitting structure 132 emits blue light; if a potential difference is formed between the first electrode 131 and the second electrode 133 of the second light-emitting device 13b, the light-emitting material layer EML of the light-emitting structure 132 emits green light; and if a potential difference is formed between the first electrode 131 and the second electrode 133 of the third light-emitting device 13c, the light-emitting material layer EML of the light-emitting structure 132 emits red light.

[0116] In this configuration, the pixel voltage of the first electrode 131 is provided by the pixel circuit, and the common voltage of the second electrode 133 is provided by the isolation structure 12. Specifically, the second electrode 133 is electrically connected to the isolation structure 12, and the common voltage is supplied to the second electrode 133 by providing the isolation structure 12. That is, the isolation structure 12 has the function of supplying a common voltage to the second electrode 133.

[0117] The display panel 10 also includes a first encapsulation layer, which includes a plurality of encapsulation portions 14. The encapsulation portions 14 are located on the side of the second electrode 133 facing away from the substrate 11, and extend through the sidewall of the isolation structure 12 to the side of the isolation structure 12 facing away from the substrate 11. The plurality of encapsulation portions 14 include a plurality of first encapsulation portions 14a corresponding to a plurality of first light-emitting devices 13a, a plurality of second encapsulation portions 14b corresponding to a plurality of second light-emitting devices 13b, and a plurality of third encapsulation portions 14c corresponding to a plurality of third light-emitting devices 13c. The first encapsulation portions 14a are disposed on the side of the corresponding first light-emitting device 13a facing away from the substrate 11, the second encapsulation portions 14b are disposed on the side of the corresponding second light-emitting device 13b facing away from the substrate 11, and the third encapsulation portions 14c are disposed on the side of the corresponding third light-emitting device 13c facing away from the substrate 11.

[0118] refer to Figure 12 The encapsulation portion 14 includes a first segment 141 and a second segment 142 that are connected to each other. The first segment 141 is located inside the isolation opening 120 and is disposed on the side of the light-emitting device 13 away from the substrate 11. The second segment 142 is located on the side of the isolation structure 12 facing the isolation opening 120. The surface of the first segment 141 away from the substrate 11 and the surface of the second segment 142 away from the isolation structure 12 are at least partially connected to each other to enclose and form a gap space 140.

[0119] For example, the side surface of the first segment 141 facing away from the substrate 11 and the side surface of the second segment 142 facing away from the isolation structure 12 may not be connected.

[0120] refer to Figure 12 The display panel 10 further includes a second encapsulation layer 15 and a third encapsulation layer 16. The second encapsulation layer 15 covers the isolation structure 12 and the encapsulation portion 14, and the third encapsulation layer 16 covers the second encapsulation layer 15. Both the first encapsulation layer and the third encapsulation layer 16 are inorganic materials, and the materials of the first encapsulation layer and the third encapsulation layer 16 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 15 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The second encapsulation layer 15 and the third encapsulation layer 16 are continuously disposed at least over the entire display area AA, with a portion of them also disposed in the bezel area NA.

[0121] In some embodiments, the display panel 10 includes a sensor setting area for mounting optical sensors (such as an under-display camera, fingerprint sensor, light sensor, etc.). An isolation structure 12 located in the display area has a light-transmitting opening at the position corresponding to the sensor setting area. The isolation structure 12 is not provided within the light-transmitting opening area or is removed, allowing external light to pass through the display panel 10 and reach the optical sensor. The backplate layer 50 has an opening at the position corresponding to the light-transmitting opening area, ensuring unobstructed light path. When the sensor is a camera module, the camera hole penetrates at least a portion of the film layer of the display panel 10. An isolation structure 12 can be provided around the camera hole to prevent external moisture and oxygen from entering the display area AA along the sidewall of the camera hole.

[0122] By setting a light-transmitting opening area at the isolation structure position corresponding to the sensor setting area and setting an opening at the corresponding position on the back panel layer, the light path of the optical sensor is kept unobstructed, and the under-display sensing function and the protection of the display module structure are effectively compatible.

[0123] The following is combined Figure 13 The fabrication method of the display panel 10 according to the embodiments of this application will be described. This fabrication method utilizes the physical isolation effect of the isolation structure 12, and selectively etches the entire film layer to form light-emitting devices of different emission colors in different isolation openings, achieving precise patterning of RGB pixels without the need for a fine metal mask. (Reference) Figure 13 The method for preparing the display panel 10 includes steps S11 to S15.

[0124] Step S11: Provide substrate 11.

[0125] Step S12: An isolation structure 12 is formed on one side of the substrate 11. The isolation structure 12 encloses a plurality of isolation openings 120. The plurality of isolation openings 120 include a plurality of first isolation openings 1201, a plurality of second isolation openings 1202 and a plurality of third isolation openings 1203.

[0126] Step S13: Fabricate the film layer of the first light-emitting device 13a. The film layer of the first light-emitting device 13a includes the light-emitting structure layer and the second electrode layer of the first light-emitting device 13a.

[0127] Step S14: Fabricate the first encapsulation layer of the first light-emitting device 13a. Since the film layer and the first encapsulation layer of the first light-emitting device 13a are both fabricated as a single layer, the positions of the multiple first isolation openings 1201, the multiple second isolation openings 1202, and the multiple third isolation openings 1203 all have the film layer and the first encapsulation layer of the first light-emitting device 13a.

[0128] Step S15: Etch away the film layer and the first encapsulation layer of the first light-emitting device 13a at the locations of the multiple second isolation openings 1202 and the multiple third isolation openings 1203, and form the light-emitting structure 132 and the second electrode 133 of the first light-emitting device 13a, as well as the first encapsulation portion 14a of the first light-emitting device 13a, only at the locations of the multiple first isolation openings 1201.

[0129] Based on steps S13 to S15 above, a light-emitting structure 132 and a second electrode 133 of a second light-emitting device 13b, as well as a first encapsulation portion 14b of the second light-emitting device 13b, are respectively provided at the positions of multiple second isolation openings 1202. A light-emitting structure 132 and a second electrode 133 of a third light-emitting device 13c, as well as a first encapsulation portion 14c of the third light-emitting device 13c, are provided at the positions of multiple third isolation openings 1203.

[0130] This application also provides a display device, including the display module 100 described in any of the above embodiments. This display device can be a terminal product with display functions, such as a mobile phone, tablet computer, laptop computer, automotive display, or smart wearable device. Due to the use of the aforementioned display module 100, this display device has the advantages of low risk of stress concentration at the cover plate edge, high structural reliability, and good display effect.

[0131] The display module and display device provided in this application have at least the following technical effects.

[0132] By shrinking the glass layer of the cover plate inward, the edge of the glass layer avoids the stress concentration area on the outermost side of the display panel. The stress mainly acts on the non-edge area of ​​the glass layer, reducing the risk of glass layer breakage due to stress on the edge of the glass layer.

[0133] Even after the glass layer is recessed, it still covers the area where the isolation structure is located, providing effective protection for the isolation structure, helping to maintain the integrity of the encapsulation, and ensuring the long-term stable operation of the display panel.

[0134] By setting different isolation structure positions and glass layer indentation distances on different sides, a differentiated bezel design can be achieved, balancing the requirements of narrow bezels and structural reliability. In particular, for the bonding area side, a larger bezel width and a larger glass layer indentation distance can be used to accommodate the bonding requirements of driver chips or flexible circuit boards.

[0135] By setting up crack-blocking dams and placing them within the coverage area of ​​the glass layer or overlapping with the edge of the glass layer, it is possible to effectively prevent cutting microcracks from extending into the display area. At the same time, the coverage of the glass layer provides additional physical protection for the crack-blocking dams.

[0136] By setting the ultra-thin glass layer as a structure that reduces the thickness of the folding section, the structural strength of the non-bending area is ensured, while the flexibility of the bending area is improved, further optimizing the bending performance of the folding display module.

[0137] By using a composite cover plate structure in which the edge of the substrate layer at least partially overlaps with the edge of the display panel and the edge of the glass layer is recessed, the overall coverage area of ​​the cover plate is guaranteed while providing edge buffer protection for the glass layer, further reducing the risk of breakage at the edge of the glass layer.

[0138] The isolation structure located in the display area encloses and forms multiple isolation openings. At least a portion of the light-emitting device is located in the corresponding isolation opening. The physical isolation effect of the isolation structure enables precise patterning of light-emitting materials of different sub-pixels, thereby improving the pixel accuracy and production yield of the display panel.

[0139] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0140] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized in that, include: A display panel has a display area and a non-display area, wherein the non-display area is arranged around the display area; The display panel includes a substrate and an isolation structure, the isolation structure being located on one side of the substrate and distributed in the display area and the non-display area; A cover plate is disposed on the light-emitting side of the display panel. The cover plate includes a glass layer. The orthographic projection of the edge of the glass layer on the substrate is located on the side of the orthographic projection of the edge of the display panel on the substrate that is closer to the display area. The orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the glass layer on the substrate.

2. The display module according to claim 1, characterized in that, Also includes: A crack blocking dam is located in the non-display area, and the orthographic projection of the crack blocking dam on the substrate lies between the orthographic projection of the isolation structure on the substrate and the orthographic projection of the edge of the display panel on the substrate.

3. The display module according to claim 2, characterized in that, The orthographic projection of the edge of the glass layer on the substrate lies between the orthographic projection of the isolation structure on the substrate and the orthographic projection of the crack barrier dam on the substrate.

4. The display module according to claim 2, characterized in that, The orthographic projection of the edge of the glass layer onto the substrate at least partially overlaps with the orthographic projection of the crack barrier dam onto the substrate. Alternatively, the orthographic projection of the crack-blocking dam on the substrate lies within the orthographic projection of the glass layer on the substrate.

5. The display module according to claim 1, characterized in that, The display panel further includes a pixel defining layer located on one side of the substrate, and the orthographic projection of the glass layer on the substrate is located within the orthographic projection of the pixel defining layer on the substrate.

6. The display module according to claim 1, characterized in that, In directions corresponding to different sides of the boundary of the display area, the distance between the edge of the isolation structure and the edge of the display panel along a direction parallel to the surface of the substrate is different; and / or, In directions corresponding to different sides of the boundary of the display area, the distance between the edge of the isolation structure and the edge of the glass layer along the direction parallel to the surface of the substrate is different.

7. The display module according to claim 6, characterized in that, The boundary of the display area includes a first side and a second side, the first side and the second side intersect. In the non-display area, the first distance between the edge of the isolation structure on the side of the first side away from the display area and the first side in a direction parallel to the surface of the substrate is not equal to the second distance between the edge of the isolation structure on the side of the second side away from the display area and the second side in a direction parallel to the surface of the substrate.

8. The display module according to claim 7, characterized in that, The third distance between the edge of the isolation structure on the first side away from the display area and the edge of the glass layer in a direction parallel to the surface of the substrate is not equal to the fourth distance between the edge of the isolation structure on the second side away from the display area and the edge of the glass layer in a direction parallel to the surface of the substrate.

9. The display module according to claim 7, characterized in that, The boundary of the display area further includes a third side and a fourth side, the first side and the third side are arranged opposite to each other, and the second side and the fourth side are arranged opposite to each other; in the non-display area, the fifth distance between the edge of the isolation structure located on the side of the fourth side away from the display area and the fourth side in the direction parallel to the surface of the substrate is not equal to the second distance; Preferably, within the non-display area, the sixth distance between the edge of the isolation structure located on the side of the third side away from the display area and the third side in a direction parallel to the surface of the substrate is not equal to the first distance; Preferably, the non-display area includes a binding area, and the second side is located on the side of the display area closer to the binding area; wherein the first spacing is smaller than the second spacing.

10. The display module according to claim 1, characterized in that, The glass layer includes a folded portion and a non-bent portion adjacent to the folded portion, wherein the thickness of the folded portion of the glass layer is less than the thickness of the non-bent portion; Preferably, the glass layer is an ultra-thin glass layer.

11. The display module according to claim 1, characterized in that, It also includes a support layer, which is disposed on the side of the display panel away from the glass layer, and the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the support layer on the substrate.

12. The display module according to claim 1, characterized in that, It also includes a backplate layer, which is attached to the side of the display panel away from the glass layer, and the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the backplate layer on the substrate.

13. The display module according to claim 12, characterized in that, The display panel includes a sensor setting area, which is located within the display area, and the isolation structure has a light-transmitting opening area at a position corresponding to the sensor setting area; Preferably, the backplate layer includes an opening, the orthographic projection of the opening on the substrate at least partially overlapping the orthographic projection of the light-transmitting opening area on the substrate.

14. The display module according to claim 1, characterized in that, The cover plate further includes a substrate layer disposed on the side of the glass layer away from the display panel, wherein the orthographic projection of the edge of the substrate layer on the substrate at least partially overlaps with the orthographic projection of the edge of the display panel on the substrate.

15. A display device, characterized in that, Includes the display module as described in any one of claims 1-14.

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