A semiconductor process apparatus

Abstract

The application provides a semiconductor process equipment, which comprises a process chamber, a wafer carrying device, a pipeline assembly and a controller, the pipeline of the wafer carrying device comprises a cooling medium inlet and a cooling medium outlet, the pipeline assembly comprises a first liquid inlet pipeline, a second liquid inlet pipeline and a liquid return pipeline, and the controller is used for controlling one of the first liquid inlet pipeline and the second liquid inlet pipeline to communicate with the cooling medium inlet in a current process step, and controlling the flow proportion of the cooling medium of a first cooling source and the cooling medium of a second cooling source into the pipeline which does not communicate with the cooling medium inlet among the first liquid inlet pipeline and the second liquid inlet pipeline according to the target temperature of the wafer carrying device required by a next process step, so as to control the temperature of the cooling medium in the pipeline which does not communicate with the cooling medium inlet. The application effectively shortens the control time of the target temperature of the wafer carrying device in the process, and improves the process efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a semiconductor process apparatus. Background Technology

[0002] In high aspect ratio dielectric etching processes for semiconductors, to improve selectivity and control etching rate and morphology, different target temperatures of the wafer carrier are required when etching different dielectric layers. For example, a lower target temperature is needed when etching a shallower upper dielectric layer, while a higher target temperature is needed when etching a deeper lower dielectric layer. To control the target temperature of the wafer carrier at different process steps, the liquid temperature in the tubing under the wafer carrier needs to be controlled. However, the temperature switching speed of this liquid tubing is slow. When multiple temperature switching is required at different process steps, the required temperature switching time is long, which affects the process effect and reduces process efficiency. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide a semiconductor process equipment that can realize rapid switching of the temperature of the wafer carrier device, effectively shorten the control time of the wafer temperature during the process, obtain better process results, and improve process efficiency.

[0004] To achieve the above objectives, the technical solutions adopted in the embodiments of the present invention are as follows:

[0005] In a first aspect, embodiments of the present invention provide a semiconductor process apparatus, including: a process chamber, a wafer carrier, a piping assembly, and a controller. The piping assembly is used to transfer a cooling medium to a pipe in the wafer carrier. The pipe in the wafer carrier includes a cooling medium inlet and a cooling medium outlet. The piping assembly includes a first liquid inlet pipe, a second liquid inlet pipe, and a liquid return pipe.

[0006] One end of the first liquid inlet pipe is connected to the first cooling source and the second cooling source, and the other end is connected to the cooling medium inlet; the liquid temperatures of the first cooling source and the second cooling source are different;

[0007] One end of the second liquid inlet pipe is connected to the first cooling source and the second cooling source, and the other end is connected to the cooling working fluid inlet;

[0008] One end of the return liquid pipe is connected to the cooling working fluid outlet, and the other end is connected to the first cooling source and the second cooling source;

[0009] The controller is configured to, in the current process step, control one of the first liquid inlet pipe and the second liquid inlet pipe to be connected to the cooling medium inlet, and to control the flow rate ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source into the pipes of the first liquid inlet pipe and the second liquid inlet pipe that are not connected to the cooling medium inlet, according to the target temperature of the wafer carrier required for the next process step, thereby controlling the temperature of the cooling medium in the pipes not connected to the cooling medium inlet.

[0010] Furthermore, the pipeline assembly also includes a first flow meter, a second flow meter, a third flow meter, a fourth flow meter, a first liquid mixing device, and a second liquid mixing device;

[0011] The first liquid mixing device is disposed in the first liquid inlet pipe, and the first liquid mixing device is connected to the first cooling source and the second cooling source respectively, and after mixing the cooling working medium of the first cooling source and the cooling working medium of the second cooling source, it is output to the cooling working medium inlet.

[0012] The second liquid mixing device is disposed in the second liquid inlet pipe, and the second liquid mixing device is connected to the first cooling source and the second cooling source respectively, and after mixing the cooling working medium of the first cooling source and the cooling working medium of the second cooling source, it is output to the cooling working medium inlet;

[0013] The first flow meter is connected between the first cooling source and the first liquid mixing device;

[0014] The second flow meter is connected between the first cooling source and the second liquid mixing device;

[0015] The third flow meter is connected between the second cooling source and the first liquid mixing device;

[0016] The fourth flow meter is connected between the second cooling source and the second liquid mixing device.

[0017] Furthermore, the piping assembly also includes a first temperature sensor and a second temperature sensor;

[0018] The first temperature sensor is installed on the pipe between the first liquid mixing device and the cooling working fluid inlet;

[0019] The second temperature sensor is installed on the pipe between the second liquid mixing device and the cooling medium inlet;

[0020] The controller is communicatively connected to the first temperature sensor, the second temperature sensor, the first flow meter, the second flow meter, the third flow meter, and the fourth flow meter, respectively.

[0021] The control of the flow rate ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source into the pipes not connected to the cooling medium inlet in the first and second liquid inlet pipes includes: adjusting the opening of the first flow meter and / or the third flow meter according to the temperature detected by the first temperature sensor; and adjusting the opening of the second flow meter and / or the fourth flow meter according to the temperature detected by the second temperature sensor.

[0022] Furthermore, the piping assembly also includes a first valve, a second valve, a third valve, and a fourth valve;

[0023] The first valve is installed on the pipeline between the first liquid mixing device and the cooling medium inlet; the second valve is installed on the pipeline between the second liquid mixing device and the cooling medium inlet.

[0024] One end of the third valve is connected between the first liquid mixing device and the first valve via a pipe, and the other end is connected to the return liquid pipe via a pipe.

[0025] One end of the fourth valve is connected between the second liquid mixing device and the second valve via a pipe, and the other end is connected to the return liquid pipe via a pipe.

[0026] Furthermore, the return liquid pipeline is equipped with a flow divider, the input end of which is connected to the outlet of the cooling working fluid, the first output end of which is connected to the first cooling source pipeline, and the second output end of which is connected to the second cooling source pipeline;

[0027] And / or,

[0028] The piping assembly further includes a first level gauge and a second level gauge, wherein the first level gauge is disposed in the first cooling source and the second level gauge is disposed in the second cooling source.

[0029] Furthermore, the controller is also used for:

[0030] At the start of the next process step, the pipe connected to the cooling medium inlet in the previous process step is disconnected from the cooling medium inlet, and the pipe not connected to the cooling medium inlet in the previous process step is connected to the cooling medium inlet. Then, the process returns to the step of controlling the flow ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source into the pipes not connected to the cooling medium inlet in the first liquid inlet pipe and the second liquid inlet pipe.

[0031] Furthermore, controlling the flow rate ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source entering the pipes in the first and second inlet pipes that are not connected to the cooling medium inlet includes:

[0032] Obtain the current temperature of the first cooling source and the current temperature of the second cooling source;

[0033] Based on the target temperature of the wafer carrier required for the next process step, the current temperature of the first cooling source, and the current temperature of the second cooling source, the liquid mass ratio corresponding to the liquid mixing temperature of the first cooling source and the second cooling source reaching the target temperature of the wafer carrier required for the next process step is determined. Based on the liquid mass ratio, the flow rate ratio of the cooling medium of the first cooling source and the cooling medium of the second cooling source entering the pipes of the first liquid inlet pipe and the second liquid inlet pipe that are not connected to the cooling medium inlet is controlled.

[0034] Furthermore, the controller is also used for:

[0035] The first temperature detection value of the temperature sensor on the pipe connected to the cooling medium inlet in the first liquid inlet pipe and the second liquid inlet pipe is acquired in real time. Based on the first temperature detection value, the flow rate of the two flow meters connected to the pipe connected to the cooling medium inlet is controlled in real time or periodically until the difference between the first temperature detection value and the target temperature of the wafer carrier device required for the current process step is less than a preset error threshold.

[0036] The second temperature detection value of the temperature sensor on the pipes in the first and second liquid inlet pipes that are not connected to the cooling medium inlet is acquired in real time. Based on the second temperature detection value, the flow rate of the two flow meters connected to the pipes that are not connected to the wafer carrier is controlled in real time or periodically until the difference between the second temperature detection value and the target temperature of the wafer carrier required for the next process step is less than a preset error threshold.

[0037] Furthermore, the controller is also used for:

[0038] When the pipe that is not connected to the cooling medium inlet in the previous process step is the first liquid inlet pipe, control the second valve to close, control the fourth valve to open, control the first valve to open, and control the third valve to close;

[0039] When the pipe that is not connected to the cooling medium inlet in the previous process step is the second liquid inlet pipe, the first valve is controlled to close, the third valve is controlled to open, the second valve is controlled to open, and the fourth valve is controlled to close.

[0040] Furthermore, the controller is also used for:

[0041] In the current process step, the flow rates of the first output terminal and the second output terminal are allocated based on the flow rate ratio of the first flow meter to the third flow meter and the flow rate ratio of the second flow meter to the fourth flow meter, so that the output flow rates of the first cooling source and the second cooling source are equal to the input flow rates.

[0042] Furthermore, the controller is also used for:

[0043] Obtain the first liquid level value detected by the first liquid level gauge, and obtain the second liquid level value detected by the second liquid level gauge;

[0044] When the first liquid level value is not equal to the second liquid level value, the opening of the diversion output terminal of the diverter is adjusted based on the difference between the first liquid level value and the second liquid level value so that the first liquid level value is equal to the second liquid level value.

[0045] Furthermore, the controller is also used for:

[0046] Before the start of the process step, the first cooling source and the second cooling source are controlled to enter one of the first liquid inlet pipe and the second liquid inlet pipe at a preset flow rate ratio, so that the liquid temperature in the one of the pipes is the target temperature of the wafer carrier device required for the first process step. When the first process step starts, the pipe that controls the liquid temperature in the first liquid inlet pipe and the second liquid inlet pipe to be the target temperature of the wafer carrier device required for the first process step is connected to the cooling medium inlet.

[0047] This invention provides a semiconductor process apparatus, comprising: a process chamber, a wafer carrier, a piping assembly, and a controller. The piping assembly is used to transfer a cooling medium into the pipes of the wafer carrier. The pipes of the wafer carrier include a cooling medium inlet and a cooling medium outlet. The piping assembly includes a first liquid inlet pipe, a second liquid inlet pipe, and a return pipe. One end of the first liquid inlet pipe is connected to a first cooling source and a second cooling source, and the other end is connected to the cooling medium inlet. The liquid temperatures of the first cooling source and the second cooling source are different. One end of the second liquid inlet pipe is connected to both the first cooling source and the second cooling source. The system consists of a source pipe connected to a cooling medium inlet at one end and a return pipe connected to a cooling medium outlet at the other end. A controller is used to control the connection of one of the first and second inlet pipes to the cooling medium inlet during the current process step. Based on the target temperature of the wafer carrier required for the next process step, the controller controls the flow rate ratio of the cooling medium from the first and second cooling sources into the pipes not connected to the cooling medium inlet within the first and second inlet pipes, thereby controlling the temperature of the cooling medium in the pipes not connected to the cooling medium inlet. This invention achieves multiple temperature controls by proportionally introducing cooling medium sources of different temperatures into the same pipeline during the current process step. By pre-controlling the target temperature of the wafer carrier required for the next process step in the first or second inlet pipe connected to the wafer carrier during the current process step, rapid temperature switching of the wafer carrier can be achieved after process changes, effectively shortening the control time for the target temperature of the wafer carrier during the process, resulting in better process performance and improved process efficiency.

[0048] Other features and advantages of the embodiments of the present invention will be set forth in the following description, or some features and advantages may be inferred from the description or determined without doubt, or may be learned by practicing the techniques described above in the embodiments of the present invention.

[0049] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0050] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0051] Figure 1 A schematic diagram of a piping assembly provided by an embodiment of the present invention is shown;

[0052] Figure 2 A pipeline assembly control flowchart for an etching step process provided by an embodiment of the present invention is shown. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be described below in conjunction with the accompanying drawings. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments.

[0054] Currently, to control the temperature of the liquid piping under the wafer carrier, the relevant wafer carrier control technologies mainly include two types. One type involves setting up two coolers with different temperatures in the piping under the wafer carrier. Each cooler is connected to the wafer carrier via pipes. When the wafer carrier needs to control a lower temperature, the coolant with a lower temperature is introduced into the wafer carrier; when the wafer carrier needs to control a higher temperature, the coolant with a higher temperature is introduced into the wafer carrier. However, this control method can only control the wafer carrier to switch between two temperatures. When the process requires control of more than three target temperatures for the wafer carrier... One approach is to install a liquid mixing device in the pipeline between the coolant and the wafer carrier to mix the low-temperature and high-temperature coolant before introducing it into the wafer carrier. However, this control method can only mix the two coolants in a specific ratio at the same time, producing a mixture of liquids at one temperature that is introduced into the wafer carrier. It cannot control two temperatures simultaneously. When the wafer carrier temperatures required for two process steps are different, the temperature control for the next process step can only be performed after the current process step is completed. When switching temperatures, the liquid mixing ratio needs to be readjusted, which takes a long time and results in unstable temperatures, reducing process efficiency.

[0055] To address the aforementioned problems, this invention provides a semiconductor process apparatus, which will be described in detail below.

[0056] This embodiment provides a semiconductor process apparatus, including: a process chamber, a wafer carrier, a piping assembly, and a controller. The piping assembly is used to transfer cooling medium to the pipes of the wafer carrier. The pipes of the wafer carrier include a cooling medium inlet and a cooling medium outlet.

[0057] See also Figure 1 The diagram shows a piping assembly, which includes a first inlet pipe 10, a second inlet pipe 20, and a return pipe 30.

[0058] One end of the first liquid inlet pipe 10 is connected to the first cooling source 31 and the second cooling source 32, and the other end is connected to the cooling medium inlet of the wafer carrier device 40; the liquid temperatures of the first cooling source 31 and the second cooling source 32 are different.

[0059] One end of the second liquid inlet pipe 20 is connected to the first cooling source 31 and the second cooling source 32, and the other end is connected to the cooling medium inlet of the wafer carrier device 40.

[0060] One end of the return liquid pipe 30 is connected to the cooling medium outlet of the wafer carrier device 40, and the other end is connected to the first cooling source 31 and the second cooling source 32.

[0061] The aforementioned controller is used to control, in the current process step, one of the first liquid inlet pipe and the second liquid inlet pipe to be connected to the cooling medium inlet, and to control the flow rate ratio of the cooling medium from the first cooling source and the second cooling source entering the pipe not connected to the cooling medium inlet in the first liquid inlet pipe and the second liquid inlet pipe according to the target temperature of the wafer carrier required in the next process step, thereby controlling the temperature of the cooling medium in the pipe not connected to the cooling medium inlet, so that the liquid temperature in the pipe not connected to the cooling medium inlet in the first liquid inlet pipe and the second liquid inlet pipe is the target temperature of the wafer carrier required in the next process step.

[0062] The aforementioned wafer carrier can be a device that carries wafers and has internal pipes, such as an electrostatic chuck. By introducing a cooling medium of a certain temperature into the cooling medium inlet of the pipes of the wafer carrier, the wafer on the wafer carrier can quickly reach the required process temperature.

[0063] After each process step begins, valves can be installed on the first and second liquid inlet pipes respectively. The controller controls the opening and closing of the valves to connect one of the first and second liquid inlet pipes to the cooling medium inlet of the wafer carrier device. For the pipe not connected to the cooling medium inlet, the cooling medium from the first and second cooling sources is controlled to enter the pipe in a certain proportion so that the temperature of the mixed liquid is the target temperature of the wafer carrier device required for the next process step. This way, the temperature of the cooling medium in the pipe not currently connected to the cooling medium inlet is controlled in advance to the target temperature of the wafer carrier device required for the next process step.

[0064] Depending on the process formulation, the target temperature of the wafer (or wafer carrier) to be controlled varies. Therefore, the temperature control of the wafer carrier can be flexibly adjusted by setting different temperatures for the cooling medium stored in the first and second cooling sources. In some processes (such as high aspect ratio etching), a lower wafer temperature is required; the lower the temperature, the higher the etching rate. To better achieve the target temperature of the wafer carrier required for etching, the temperature of the cooling medium in the first cooling source can be greater than 0 degrees Celsius, such as 50 to 70 degrees Celsius. To control a lower target temperature for the wafer (or wafer carrier), the temperature of the cooling medium in the second cooling source can be -50 to -30 degrees Celsius, and the final mixed cooling medium can be, for example, below -30 degrees Celsius.

[0065] The semiconductor process equipment provided in this embodiment can achieve multiple different temperature controls by introducing cooling media sources of different temperatures into the same pipeline in proportion during each current process step. By controlling the target temperature of the wafer carrier device required for the next process step in advance in the first or second liquid inlet pipe connected to the wafer carrier device during the current process step, the temperature of the wafer carrier device can be quickly switched after the process step change, effectively shortening the control time of the target temperature of the wafer carrier device during the process, resulting in better process effects and improved process efficiency.

[0066] like Figure 1 As shown, the pipeline assembly provided in this embodiment also includes a first flow meter FM1, a second flow meter FM2, a third flow meter FM3, a fourth flow meter FM4, a first liquid mixing device MV1, and a second liquid mixing device MV2;

[0067] The first liquid mixing device MV1 is installed in the first liquid inlet pipe 10, and the first liquid mixing device MV1 is connected to the first cooling source 31 and the second cooling source 32 respectively. After mixing the cooling working medium of the first cooling source 31 and the cooling working medium of the second cooling source 32, it is output to the cooling working medium inlet.

[0068] The second liquid mixing device MV2 is installed in the second liquid inlet pipe 20, and the second liquid mixing device MV2 is connected to the first cooling source 31 and the second cooling source 32 respectively. After mixing the cooling working medium of the first cooling source 31 and the cooling working medium of the second cooling source 32, it is output to the cooling working medium inlet.

[0069] The first flow meter FM1 is connected between the first cooling source pipe 31 and the first liquid mixing device MV1;

[0070] The second flow meter FM2 is connected between the first cooling source pipe 31 and the second liquid mixing device MV2;

[0071] The third flow meter FM3 is connected between the second cooling source pipe 32 and the first liquid mixing device MV1;

[0072] The fourth flow meter FM4 is connected between the second cooling source pipe 32 and the second liquid mixing device MV2;

[0073] like Figure 1 As shown, the pipeline assembly provided in this embodiment also includes a first temperature sensor T1 and a second temperature sensor T2;

[0074] The first temperature sensor T1 is installed on the pipe between the first liquid mixing device MV1 and the cooling working fluid inlet;

[0075] The second temperature sensor T2 is installed on the pipe between the second liquid mixing device MV2 and the cooling working fluid inlet;

[0076] like Figure 1 As shown, the flow and valve control units 50 and 60 provided in this embodiment are communicatively connected to the first temperature sensor T1, the second temperature sensor T2, the first flow meter FM1, the second flow meter FM2, the third flow meter FM3, and the fourth flow meter FM4, respectively. The controller can send electrical signals to each flow meter to control the opening degree of each flow meter and thus control the liquid flow in the pipeline where the flow meter is located.

[0077] The controller provided in this embodiment is used to adjust the opening degree of the first flow meter and / or the third flow meter according to the temperature detected by the first temperature sensor; and to adjust the opening degree of the second flow meter and / or the fourth flow meter according to the temperature detected by the second temperature sensor.

[0078] To ensure that the temperature in the inlet pipe connected to the cooling medium inlet in the current process step is the target temperature of the wafer carrier required for the current process step, and to ensure that the temperature in the inlet pipe not connected to the cooling medium inlet in the current process step is the target temperature of the wafer carrier required for the next process step, the opening of the first flow meter and / or the third flow meter is adjusted in real time based on the temperature detected by the first temperature sensor, and the opening of the second flow meter and / or the fourth flow meter is adjusted in real time based on the temperature detected by the second temperature sensor, so that the cooling medium temperature in both the first inlet pipe and the second inlet pipe meets the requirements.

[0079] like Figure 1 As shown, the piping assembly provided in this embodiment also includes a first valve V1, a second valve V2, a third valve V3, and a fourth valve V4;

[0080] The first valve V1 is installed on the pipe between the first liquid mixing device MV1 and the cooling medium inlet of the wafer carrier device 40; the second valve V2 is installed on the pipe between the second liquid mixing device MV2 and the cooling medium inlet of the wafer carrier device 40.

[0081] One end of the third valve V3 is connected between the first liquid mixing device MV1 and the first valve V1 via a pipe, and the other end is connected to the return liquid pipe 30 via a pipe.

[0082] One end of the fourth valve V4 is connected between the second liquid mixing device MV2 and the second valve V2 via a pipe, and the other end is connected to the return liquid pipe 30 via a pipe.

[0083] like Figure 1 As shown, the return pipe 30 provided in this embodiment is equipped with a distributor DP. The input end of the distributor DP is connected to the cooling medium outlet, the first output end of the distributor DP is connected to the first cooling source 31 pipe, and the second output end of the distributor DP is connected to the second cooling source 32 pipe.

[0084] like Figure 1 As shown, the pipeline assembly provided in this embodiment also includes a first liquid pump P1 and a second liquid pump P2. The first liquid pump P1 provides power to the liquid in the first liquid inlet pipe 10, and the second liquid pump P2 provides power to the liquid in the second liquid inlet pipe 20.

[0085] The piping assembly provided in this embodiment also includes a first level gauge and a second level gauge. Figure 1 (Not shown in the image), the first level gauge is installed in the first cooling source, and the second level gauge is installed in the second cooling source.

[0086] like Figure 1 As shown, the flow and valve control units 50 and 60 are also communicatively connected to the first valve V1, the second valve V2, the third valve V3 and the fourth valve V4, respectively. The flow and valve control unit 50 can send electrical signals to each valve to control the opening and closing status of each valve.

[0087] like Figure 1 As shown, the controller may include, for example, an industrial computer 60 and a flow and valve control unit 50. The industrial computer 60 is electrically connected to a first temperature sensor T1 and a second temperature sensor T2. The first temperature sensor T1 and the second temperature sensor T2 can transmit the collected temperature values ​​to the industrial computer 60. The industrial computer 60 receives the target temperature setpoint of the wafer carrier device for each process step input by the user, and sends the temperature detection values ​​of the first temperature sensor T1 and the second temperature sensor T2 and the target temperature setpoint of the wafer carrier device for each process step to the flow and valve control unit 50. The flow and valve control unit 50 controls the opening degree of each flow meter according to the temperature detection values ​​of the first temperature sensor T1 and the second temperature sensor T2 and the target temperature setpoint of the wafer carrier device for each process step, so as to regulate the temperature in each pipeline.

[0088] The first flow meter FM1 to the fourth flow meter FM4 are used to detect and control the liquid flow rate in the pipeline. The liquid mixing device is used to mix the liquid in the two connected pipelines. Temperature sensors T1 and T2 are used to detect the liquid temperature in the pipeline. The first valve V1 to the fourth valve V4 are used to control the liquid flow into the cooling medium inlet or the return pipe 30.

[0089] Liquid can be pumped into the first liquid inlet pipe and the second liquid inlet pipe respectively by the first liquid pump P1 and the second liquid pump P2. By controlling the flow rate of the first flow meter FM1 and the third flow meter FM3, the first cooling source 31 and the second cooling source 32 can enter the first liquid inlet pipe 10 in a certain proportion. The liquid is mixed in the first liquid mixing device MV1. The first valve V1 is opened and the third valve V3 is closed. The mixed liquid can flow into the wafer carrier device 40 through the first liquid inlet pipe 10. The first valve V1 is closed and the third valve V3 is opened. The mixed liquid can flow back to the liquid distributor DP through the return pipe 30.

[0090] By controlling the flow rates of the second flow meter FM2 and the fourth flow meter FM4, the first cooling source 31 and the second cooling source 32 can enter the second liquid inlet pipe 20 at a certain ratio. The liquid is mixed in the second liquid mixing device MV2. The second valve V2 is opened and the fourth valve V4 is closed. The mixed liquid can flow into the wafer carrier device 40 through the second liquid inlet pipe 20. The second valve V2 is closed and the fourth valve V4 is opened. The mixed liquid can flow back to the liquid distributor DP through the return pipe 30.

[0091] After passing through the wafer carrier device 40, the liquid can be returned to the distributor DP through the return pipe 30. The liquid distributor DP distributes the flow and returns the distributed flow to the first cooling source 31 and the second cooling source 32.

[0092] In one embodiment, the controller provided in this embodiment is further used for:

[0093] At the start of the next process step, the pipe connected to the cooling medium inlet in the previous process step is disconnected from the cooling medium inlet, and the pipe not connected to the cooling medium inlet in the previous process step is connected to the cooling medium inlet. Then, the process returns to the step of controlling the flow ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source into the pipes not connected to the cooling medium inlet in the first liquid inlet pipe and the second liquid inlet pipe.

[0094] When entering the next process step, the pipe connected to the cooling medium inlet in the previous process step is disconnected from the wafer carrier, and the pipe not connected to the cooling medium inlet in the previous process step is connected to the cooling medium inlet. The next process step is then set as the current process step, and the process returns to step S202 above, which controls the flow rate ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source entering the pipes not connected to the cooling medium inlet in the first and second liquid inlet pipes, until the process ends. Since the liquid temperature in the pipe not connected to the cooling medium inlet in the previous process step is the target temperature of the wafer carrier required in the next process step, by switching the connected pipes, the wafer carrier can be quickly controlled to reach the required target temperature, effectively shortening the temperature control time of the wafer carrier, thereby shortening the temperature control speed of the wafer and improving the process efficiency.

[0095] For example, in the first process step, when the first liquid inlet pipe is connected to the cooling medium inlet, the cooling medium from the first and second cooling sources is controlled to enter the second liquid inlet pipe, which is not connected to the cooling medium inlet, at a certain ratio, so that the temperature of the mixed liquid is the target temperature of the wafer carrier required for the second process step. At the beginning of the second process step, the first liquid inlet pipe is disconnected from the cooling medium inlet, and the second liquid inlet pipe is connected to the cooling medium inlet. At the same time, the cooling medium from the first and second cooling sources is controlled to enter the first liquid inlet pipe, which is not connected to the cooling medium inlet, at a certain ratio, so that the temperature of the mixed liquid in the first liquid inlet pipe is the target temperature of the wafer carrier required for the third process step.

[0096] In one embodiment, this embodiment provides a specific implementation method for controlling the flow rate ratio of the cooling working fluid of the first cooling source and the cooling working fluid of the second cooling source into the pipes of the first and second inlet pipes that are not connected to the cooling working fluid inlet:

[0097] Get the current temperature of the first cooling source and the current temperature of the second cooling source;

[0098] Based on the target temperature of the wafer carrier required for the next process step, the current temperature of the first cooling source and the current temperature of the second cooling source, determine the liquid mass ratio corresponding to the liquid mixing temperature of the first cooling source and the second cooling source reaching the target temperature of the wafer carrier required for the next process step. Based on the liquid mass ratio, control the flow rate ratio of the cooling medium of the first cooling source and the cooling medium of the second cooling source into the pipes of the first liquid inlet pipe and the second liquid inlet pipe that are not connected to the cooling medium inlet.

[0099] Both the first and second cooling sources store cooling media at a set temperature. Let the temperature of the cooling media stored in the first cooling source be t1, and the temperature of the cooling media stored in the second cooling source be t2. Let t be the target temperature of the wafer carrier required for the next process step after mixing. Then, the formula for calculating the required liquid mass ratio of the first and second cooling sources is:

[0100] m1t1+m2t2 / m1+m2=t

[0101] m1 / m2=(t2-t) / (t-t1)

[0102] Where m1 is the liquid mass of the first cooling medium at temperature t1, and m2 is the liquid mass of the second cooling medium at temperature t2.

[0103] In one embodiment, this embodiment provides a specific implementation method for controlling the flow rate ratio of the cooling working fluid of the first cooling source and the cooling working fluid of the second cooling source into the pipes of the first and second inlet pipes that are not connected to the cooling working fluid inlet, based on the liquid mass ratio:

[0104] When the pipe that is not connected to the pipe of the wafer carrier is the first liquid inlet pipe, the opening ratio of the first flow meter and the third flow meter is controlled to be the liquid flow ratio calculated above.

[0105] When the pipe not connected to the wafer carrier is the second liquid inlet pipe, the opening ratio of the second flow meter and the fourth flow meter is controlled to be the liquid flow ratio calculated above.

[0106] By inputting the target temperature t of the wafer carrier device required for the next process step into the above liquid mass ratio calculation formula, the corresponding liquid mass ratio of the first cooling source and the second cooling source can be calculated. Based on the liquid mass ratio of the first cooling source and the second cooling source, the opening of the corresponding flow meter is controlled so that the temperature of the mixed liquid in the pipe not connected to the cooling medium inlet is the target temperature t of the wafer carrier device required for the next process step.

[0107] In one embodiment, the controller provided in this embodiment is also used for

[0108] The system acquires the first temperature detection value of the temperature sensor on the pipe connected to the cooling medium inlet in the first and second liquid inlet pipes in real time. Based on the first temperature detection value, the system controls the flow rate of the two flow meters connected to the pipe connected to the cooling medium inlet in real time or periodically until the difference between the first temperature detection value and the target temperature of the wafer carrier device required for the current process step is less than a preset error threshold.

[0109] The system acquires the second temperature detection value of the temperature sensor on the pipes in the first and second liquid inlet pipes that are not connected to the cooling medium inlet in real time. Based on the second temperature detection value, the system controls the flow rate of the two flow meters connected to the pipes that are not connected to the cooling medium inlet in real time or periodically until the difference between the second temperature detection value and the target temperature of the wafer carrier device required for the next process step is less than a preset error threshold.

[0110] In the current process step, let the target temperature of the wafer carrier required for the current process step be st(j). The detection value of the temperature sensor on the pipe connected to the cooling medium inlet is recorded as the first temperature detection value T1. When |T1-st(j)| is greater than the preset error threshold, the flow rate of the two flow meters connected to the pipe connected to the cooling medium inlet is adjusted based on T1-st(j) (for example, if the pipe connected to the wafer carrier is the first liquid inlet pipe, the liquid flow rate of the first flow meter and the third flow meter is continuously adjusted) until |T1-st(j) is less than the preset error threshold.

[0111] In the current process step, cooling medium is simultaneously introduced into a pipe that is not connected to the cooling medium inlet. The detection value of the temperature sensor on the pipe that is not connected to the cooling medium inlet is recorded as the second temperature detection value T2. When |T2-st(j+1)| is greater than the preset error threshold, the flow rate of the two flow meters connected to the pipe that is not connected to the cooling medium inlet is adjusted based on T2-st(j+1) (for example, if the pipe that is not connected to the cooling medium inlet is the second liquid inlet pipe, the liquid flow rate of the second flow meter and the fourth flow meter is continuously adjusted) until |T2-st(j+1)| is less than the preset error threshold.

[0112] In one embodiment, the controller provided in this embodiment is further used for:

[0113] When the pipe not connected to the cooling medium inlet in the previous process step is the first liquid inlet pipe, the second valve is controlled to close, the fourth valve is controlled to open, the first valve is controlled to open, and the third valve is controlled to close. That is, when the second liquid inlet pipe is connected to the cooling medium inlet in the current process step, if the next process step begins, the second valve is controlled to close and the fourth valve is controlled to open to cut off the connection between the second liquid inlet pipe and the cooling medium inlet, so that the liquid in the second liquid inlet pipe flows back to the liquid distributor; the first valve is controlled to open and the third valve is controlled to close to keep the first liquid inlet pipe connected to the cooling medium inlet.

[0114] When the pipe not connected to the cooling medium inlet in the previous process step becomes the second liquid inlet pipe, the first valve is closed, the third valve is opened, the second valve is opened, and the fourth valve is closed. That is, if the first liquid inlet pipe is connected to the cooling medium inlet in the current process step, and the next process step begins, the first valve is closed and the third valve is opened to disconnect the first liquid inlet pipe from the cooling medium inlet, allowing the liquid in the first liquid inlet pipe to flow back to the liquid distributor; the second valve is opened and the fourth valve is closed to maintain connection between the second liquid inlet pipe and the cooling medium inlet.

[0115] In one embodiment, the controller provided in this embodiment is further used for:

[0116] In the current process step, the flow rates of the first output terminal and the second output terminal are allocated based on the flow rate ratio of the first flow meter to the third flow meter and the flow rate ratio of the second flow meter to the fourth flow meter, so that the output flow rates of the first cooling source and the second cooling source are equal to the input flow rates.

[0117] Calculate the sum of the flow ratio of the first flow meter to the third flow meter and the flow ratio of the second flow meter to the fourth flow meter to obtain (FM1+FM2) / (FM3+FM4). Based on this ratio, allocate the output flow into the first cooling source and the second cooling source so that the output flow of the first cooling source and the second cooling source is equal to the return flow.

[0118] In one embodiment, the controller provided in this embodiment is further used for:

[0119] Obtain the first liquid level value detected by the first liquid level gauge, and obtain the second liquid level value detected by the second liquid level gauge;

[0120] When the first liquid level value is not equal to the second liquid level value, the opening of the diversion output terminal of the diverter is adjusted based on the difference between the first liquid level value and the second liquid level value so that the first liquid level value is equal to the second liquid level value.

[0121] When the first liquid level is greater than the second liquid level, the opening of the distributor to the output end of the second cooling source is increased to increase the liquid level height of the second cooling source; when the first liquid level is less than the second liquid level, the opening of the distributor to the output end of the first cooling source is increased to increase the liquid level height of the first cooling source until the first liquid level is equal to the second liquid level.

[0122] In one specific implementation, the difference between the first liquid level value and the second liquid level value can be input into a PID controller, and the output opening of the distributor can be controlled based on the PID algorithm to keep the difference between the first liquid level value and the second liquid level value near 0, thereby ensuring the liquid level balance of the two cooling fluid sources.

[0123] In one embodiment, the controller provided in this embodiment is further used for:

[0124] Before the start of a process step, a first cooling source and a second cooling source are controlled to enter one of a first liquid inlet pipe and a second liquid inlet pipe at a preset flow ratio, so that the liquid temperature in said one pipe reaches a target temperature of a wafer carrier required by a first process step, and when the first process step starts, the pipe, among the first liquid inlet pipe and the second liquid inlet pipe, whose liquid temperature reaches the target temperature of the wafer carrier required by the first process step is controlled to communicate with a cooling working medium inlet.

[0125] As an example, the present embodiment provides a control mode for a pipeline assembly during an etching process step, see Figure 2 the flow chart of controlling the pipeline assembly during the etching process step shown, which can be specifically implemented with reference to the following steps:[NEWLINE]

[0126] Step S301: before the start of the process, acquire a target temperature st1 of the wafer carrier required by the first process step, set the flow rates of a first flow meter FM1 and a third flow meter FM3 connected to the first liquid inlet pipe according to st1, so that the first cooling source and the second cooling source enter the first liquid inlet pipe at a preset flow ratio, wherein the preset flow ratio can be calculated based on the target temperature st1 of the wafer carrier and the calculation formula of the above liquid mass ratio;

[0127] Step S302: set the flow rates of a second flow meter FM2 and a fourth flow meter FM4 to 0, open a first valve V1, and close a second valve V2, a third valve V3 and a fourth valve V4;

[0128] Step S303: read a temperature detection value T1 of a first temperature sensor, if T1 does not satisfy st1-d < T1 < st1+d, continuously adjust the flow rates of the first flow meter FM1 and the third flow meter FM3 until st1-d < T1 < st1+d is satisfied, wherein d is a preset temperature error threshold, that is, a preset allowable range of temperature fluctuation up and down;

[0129] Step S304: after the process step starts started, continuously adjust the flow rates of the first flow meter FM1 and the third flow meter FM3 according to a first temperature detection value T1 from the first temperature sensor.

[0130] Step S305: acquire a target temperature st2 of the wafer carrier required by a second process step, set the flow rates of the second flow meter FM2 and the fourth flow meter FM4 according to st2, close the second valve V2, and open the fourth valve V4;

[0131] Step S306: read a second temperature detection value T2 of a second temperature sensor, if T2 does not satisfy st2-d < T2 < st2+d, continuously adjust the flow rates of the second flow meter FM2 and the fourth flow meter FM4 until st2-d < T2 < st2+d is satisfied.

[0132] In step S307, at the start of the next process step, close the first valve V1 and the fourth valve V4, and open the second valve V2 and the third valve V3, so that the temperature-stable liquid mixed in the second inlet pipe of the first process step flows directly into the cooling working fluid inlet of the wafer carrier. Continuously adjust the flow rates of the second flow meter FM2 and the fourth flow meter FM4 until st2-d is met. <T2<st2+d。

[0133] Step S308: Obtain the target temperature st3 of the wafer carrier required for the third process step; set the flow rates of the first flow meter FM1 and the third flow meter FM3 according to st3; continuously adjust the flow rates of the first flow meter FM1 and the third flow meter FM3 according to the temperature detection value T1 of the first temperature sensor until st3-d is met. <T1<st3+d。

[0134] The first and second liquid inlet pipes are controlled to alternately introduce pre-controlled cooling medium into the cooling medium inlet of the wafer carrier device until the process is completed.

[0135] The control method for the semiconductor process equipment provided in this embodiment can realize various temperature controls for the wafer carrier device and rapid switching between various temperatures according to process requirements. By adding multiple temperature sensors at specific locations in the circuit, the temperature control of the next process step can be achieved in advance without affecting the current process step. This can better maintain the consistency of the morphology of the bottom layer etched holes and the upper layer etched holes in the high aspect ratio etching process, and obtain better process results.

[0136] Based on the foregoing embodiments, this embodiment provides a specific example of using the aforementioned semiconductor process equipment control method to control the ESC temperature of the electrostatic chuck during the deep hole etching process:

[0137] In this embodiment, the deep hole etching process mainly uses HBr, Cl2, and fluorocarbon gases, which can etch up to 400 layers with a hole diameter to depth ratio of 100:1. Depending on the number of etching layers, the process can be divided into four steps. Besides differences in gas flow rate and RF power, different etching steps also require different electrostatic chuck target temperatures. The first etching step mainly etches 1 to 100 layers. Since the current etching step involves relatively shallow layers, good hole morphology can be maintained even at higher etching rates (the lower the current process temperature, the higher the etching rate), requiring a lower electrostatic chuck target temperature. Generally, etching processes require straighter holes, but as the number of etching layers increases, the hole size decreases. Therefore, it is necessary to increase the electrostatic chuck target temperature to improve the etching accuracy and widen the hole diameter. Thus, the electrostatic chuck target temperature gradually increases in the second, third, and fourth steps.

[0138] First step etching process: The first step etching mainly etches 1 to 100 layers. The current process step etches relatively shallow layers, and can maintain good hole morphology even under high etching rate (the lower the target temperature of the electrostatic chuck, the higher the etching rate). The target temperature of the electrostatic chuck in the first process step is set to -40 degrees. The first flow meter FM1 is set to be fully open and the third flow meter FM3 is set to be closed. At this time, the temperature of the first liquid inlet pipe is -40 degrees. The first valve V1 is opened and the third valve V is closed; liquid flows into the electrostatic chuck from the first liquid inlet pipe.

[0139] To obtain the target temperature of the electrostatic chuck required for the second etching step, which mainly etches 101 to 200 layers, as the etching depth increases, the etching aperture becomes smaller. In addition to changing the gas and chamber pressure, it is necessary to increase the target temperature of the electrostatic chuck to widen the etching aperture and keep the upper and lower diameters of the etching aperture equal. The target temperature of the electrostatic chuck set in the second process step is higher than that set in the first step, which is -35 degrees Celsius. The liquid mixing ratio of the two temperatures can be calculated to be 1:19 using the above liquid mass ratio calculation formula. The opening of the second flow meter FM2 is set to 1 / 19, the fourth flow meter FM4 is fully open, the fourth valve V4 is opened, and the second valve V2 is closed. The liquid flows through the fourth valve V4 to the distributor DP and then back to the first and second cooling source housings. Ignoring temperature loss during mixing, the temperature after mixing by the second liquid mixing device MV2 is approximately assumed to be -35 degrees Celsius. However, there is a difference between the actual temperature and the theoretically calculated temperature. The second temperature detection value T2 detected by the second temperature sensor is read, and the opening of the second flow meter FM2 and the fourth flow meter FM4 is finely adjusted using a PID algorithm based on the second temperature detection value T2 until the second temperature detection value T2 is close to -35 degrees Celsius.

[0140] Second step process: After the second step process begins, the temperature is quickly switched directly by switching valves. First valve V1 is closed, third valve V3 is opened, second valve V2 is opened, and fourth valve V4 is closed. The liquid with a temperature of -35 degrees Celsius, which was mixed in the first process step, flows into the electrostatic chuck through the second liquid inlet pipe. The liquid in the first liquid inlet pipe flows back to the first cooling source and the second cooling source tank through the distributor DP.

[0141] Simultaneously, the target temperature of the electrostatic chuck required for the third step process is obtained. The third step process mainly etches 201 to 300 layers, further deepening the etching depth compared to the second step process. Under the same gas, pressure, and electrostatic chuck target temperature as the second step process, the aperture will be narrower, so it is necessary to further increase the electrostatic chuck target temperature. The target temperature of the electrostatic chuck in the third step process is set to -30 degrees Celsius, and the mixing ratio of the two liquids is calculated to be 1:9. The opening of the first flow meter FM1 is set to 1 / 9, and the third flow meter FM3 is fully open. Ignoring the temperature loss of the mixed liquid, the temperature of the liquid after mixing by the first liquid mixing device MV1 is -30 degrees Celsius. The first temperature detection value T1 of the first temperature sensor is read. Based on the first temperature detection value T1, the opening of the first flow meter FM1 and the third flow meter FM3 is finely adjusted using a PID algorithm until the first temperature detection value T1 is close to -30 degrees Celsius.

[0142] Third step process: After the third step process begins, the temperature can be quickly switched directly by cutting the valve. Close the third valve V3, open the first valve V1, open the fourth valve V4, and close the second valve V2. At this time, the liquid that was mixed in the second step of the process and has a temperature of -30 degrees Celsius flows into the electrostatic chuck through the first liquid inlet pipe. The liquid in the second liquid inlet pipe flows back to the first cooling source and the second cooling source tank through the distributor DP. Simultaneously, the target temperature of the electrostatic chuck required for the fourth step process is obtained. The fourth step process mainly etches layers 301 to 400, which are the 100 layers with the deepest etching depth and narrowest aperture in the process. It is necessary to further increase the target temperature of the electrostatic chuck, increase the lateral etching capability, and widen the bottom aperture. The target temperature of the electrostatic chuck for the fourth step process is set to -20 degrees Celsius. The mixing ratio of the first cooling source and the second cooling source is calculated to be 1:4. The opening of the second flow meter FM2 is set to 1 / 4, and the fourth flow meter FM4 is fully open. Ignoring the temperature loss of the mixed liquid, the temperature of the liquid after mixing by the second liquid mixing device MV2 is -20 degrees Celsius. The second temperature detection value T2 of the second temperature sensor is read. Based on the second temperature detection value T2, the opening of the second flow meter FM2 and the fourth flow meter FM4 is finely adjusted using a PID algorithm until the second temperature detection value T2 is close to -20 degrees Celsius.

[0143] Step 4: After the fourth step begins, temperature switching can be quickly achieved directly through valve switching. Close the first valve V1, open the third valve V3, open the second valve V2, and close the fourth valve V4. At this time, the liquid, pre-mixed in step 3 and at a temperature of -20 degrees Celsius, flows into the electrostatic chuck through the second inlet pipe. The liquid in the first inlet pipe flows back to the first and second cooling source housings via the distributor DP. Simultaneously, the target temperature of the electrostatic chuck required for step 5 is obtained, and this cycle continues until the process ends.

[0144] Furthermore, in the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0145] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0146] Finally, it should be noted that the above-described embodiments are merely specific implementations of the present invention, used to illustrate the technical solutions of the present invention, and not to limit it. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the technical scope disclosed in the present invention, or make equivalent substitutions for some of the technical features; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A semiconductor process apparatus, comprising: A process chamber, a wafer carrier, a piping assembly, and a controller are provided. The piping assembly is used to transfer a cooling medium to the pipes of the wafer carrier. The pipes of the wafer carrier include a cooling medium inlet and a cooling medium outlet. The piping assembly includes a first liquid inlet pipe, a second liquid inlet pipe, and a liquid return pipe. One end of the first liquid inlet pipe is connected to the first cooling source and the second cooling source, and the other end is connected to the cooling medium inlet; the liquid temperatures of the first cooling source and the second cooling source are different; One end of the second liquid inlet pipe is connected to the first cooling source and the second cooling source, and the other end is connected to the cooling working fluid inlet; One end of the return liquid pipe is connected to the cooling working fluid outlet, and the other end is connected to the first cooling source and the second cooling source; The controller is configured to, in the current process step, control one of the first liquid inlet pipe and the second liquid inlet pipe to be connected to the cooling medium inlet, and to control the flow rate ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source into the pipes of the first liquid inlet pipe and the second liquid inlet pipe that are not connected to the cooling medium inlet, according to the target temperature of the wafer carrier required for the next process step, thereby controlling the temperature of the cooling medium in the pipes not connected to the cooling medium inlet.

2. The semiconductor process equipment according to claim 1, characterized in that, The pipeline assembly also includes a first flow meter, a second flow meter, a third flow meter, a fourth flow meter, a first liquid mixing device, and a second liquid mixing device; The first liquid mixing device is disposed in the first liquid inlet pipe, and the first liquid mixing device is connected to the first cooling source and the second cooling source respectively, and after mixing the cooling working medium of the first cooling source and the cooling working medium of the second cooling source, it is output to the cooling working medium inlet. The second liquid mixing device is disposed in the second liquid inlet pipe, and the second liquid mixing device is connected to the first cooling source and the second cooling source respectively, and after mixing the cooling working medium of the first cooling source and the cooling working medium of the second cooling source, it is output to the cooling working medium inlet; The first flow meter is connected between the first cooling source and the first liquid mixing device; The second flow meter is connected between the first cooling source and the second liquid mixing device; The third flow meter is connected between the second cooling source and the first liquid mixing device; The fourth flow meter is connected between the second cooling source and the second liquid mixing device.

3. The semiconductor process equipment according to claim 2, characterized in that, The piping assembly also includes a first temperature sensor and a second temperature sensor. The first temperature sensor is installed on the pipe between the first liquid mixing device and the cooling working fluid inlet; The second temperature sensor is installed on the pipe between the second liquid mixing device and the cooling medium inlet; The controller is communicatively connected to the first temperature sensor, the second temperature sensor, the first flow meter, the second flow meter, the third flow meter, and the fourth flow meter, respectively. The control of the flow rate ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source into the pipes not connected to the cooling medium inlet in the first and second liquid inlet pipes includes: adjusting the opening of the first flow meter and / or the third flow meter according to the temperature detected by the first temperature sensor; and adjusting the opening of the second flow meter and / or the fourth flow meter according to the temperature detected by the second temperature sensor.

4. The semiconductor process equipment according to claim 1, characterized in that, The piping assembly also includes a first valve, a second valve, a third valve, and a fourth valve; The first valve is installed on the pipeline between the first liquid mixing device and the cooling medium inlet; the second valve is installed on the pipeline between the second liquid mixing device and the cooling medium inlet. One end of the third valve is connected between the first liquid mixing device and the first valve via a pipe, and the other end is connected to the return liquid pipe via a pipe. One end of the fourth valve is connected between the second liquid mixing device and the second valve via a pipe, and the other end is connected to the return liquid pipe via a pipe.

5. The semiconductor process equipment according to claim 1, characterized in that, The return liquid pipeline is equipped with a flow divider. The input end of the flow divider is connected to the outlet of the cooling working fluid, the first output end of the flow divider is connected to the first cooling source pipeline, and the second output end of the flow divider is connected to the second cooling source pipeline. And / or, The piping assembly further includes a first level gauge and a second level gauge, wherein the first level gauge is disposed in the first cooling source and the second level gauge is disposed in the second cooling source.

6. The semiconductor process equipment according to any one of claims 1-5, characterized in that, The controller is also used for: At the start of the next process step, the pipe connected to the cooling medium inlet in the previous process step is disconnected from the cooling medium inlet, and the pipe not connected to the cooling medium inlet in the previous process step is connected to the cooling medium inlet. Then, the process returns to the step of controlling the flow ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source into the pipes not connected to the cooling medium inlet in the first liquid inlet pipe and the second liquid inlet pipe.

7. The semiconductor process equipment according to claim 6, characterized in that, The control of the flow rate ratio of the cooling medium from the first cooling source and the cooling medium from the second cooling source entering the pipes not connected to the cooling medium inlet in the first and second liquid inlet pipes includes: Obtain the current temperature of the first cooling source and the current temperature of the second cooling source; Based on the target temperature of the wafer carrier required for the next process step, the current temperature of the first cooling source, and the current temperature of the second cooling source, the liquid mass ratio corresponding to the liquid mixing temperature of the first cooling source and the second cooling source reaching the target temperature of the wafer carrier required for the next process step is determined. Based on the liquid mass ratio, the flow rate ratio of the cooling medium of the first cooling source and the cooling medium of the second cooling source entering the pipes of the first liquid inlet pipe and the second liquid inlet pipe that are not connected to the cooling medium inlet is controlled.

8. The semiconductor process equipment according to claim 3, characterized in that, The controller is also used for: The first temperature detection value of the temperature sensor on the pipe connected to the cooling medium inlet in the first liquid inlet pipe and the second liquid inlet pipe is acquired in real time. Based on the first temperature detection value, the flow rate of the two flow meters connected to the pipe connected to the cooling medium inlet is controlled in real time or periodically until the difference between the first temperature detection value and the target temperature of the wafer carrier device required for the current process step is less than a preset error threshold. The second temperature detection value of the temperature sensor on the pipes in the first and second liquid inlet pipes that are not connected to the cooling medium inlet is acquired in real time. Based on the second temperature detection value, the flow rate of the two flow meters connected to the pipes that are not connected to the wafer carrier is controlled in real time or periodically until the difference between the second temperature detection value and the target temperature of the wafer carrier required for the next process step is less than a preset error threshold.

9. The semiconductor process equipment according to claim 4, characterized in that, The controller is also used for: When the pipe that is not connected to the cooling medium inlet in the previous process step is the first liquid inlet pipe, control the second valve to close, control the fourth valve to open, control the first valve to open, and control the third valve to close; When the pipe that is not connected to the cooling medium inlet in the previous process step is the second liquid inlet pipe, the first valve is controlled to close, the third valve is controlled to open, the second valve is controlled to open, and the fourth valve is controlled to close.

10. The semiconductor process equipment according to claim 5, characterized in that, The controller is also used for: In the current process step, the flow rates of the first output terminal and the second output terminal are allocated based on the flow rate ratio of the first flow meter to the third flow meter and the flow rate ratio of the second flow meter to the fourth flow meter, so that the output flow rates of the first cooling source and the second cooling source are equal to the input flow rates.

11. The semiconductor process equipment according to claim 5, characterized in that, The controller is also used for: Obtain the first liquid level value detected by the first liquid level gauge, and obtain the second liquid level value detected by the second liquid level gauge; When the first liquid level value is not equal to the second liquid level value, the opening of the diversion output terminal of the diverter is adjusted based on the difference between the first liquid level value and the second liquid level value so that the first liquid level value is equal to the second liquid level value.

12. The semiconductor process equipment according to claim 1, characterized in that, The controller is also used for: Before the start of the process step, the first cooling source and the second cooling source are controlled to enter one of the first liquid inlet pipe and the second liquid inlet pipe at a preset flow rate ratio, so that the liquid temperature in the one of the pipes is the target temperature of the wafer carrier device required for the first process step. When the first process step starts, the pipe that controls the liquid temperature in the first liquid inlet pipe and the second liquid inlet pipe to be the target temperature of the wafer carrier device required for the first process step is connected to the cooling medium inlet.

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