A packaging device compatible with a lossless unpacking process and a lossless unpacking method

Abstract

The application relates to the technical field of semiconductor high-end manufacturing equipment, in particular to a packaging device compatible with a lossless unpacking process and a lossless unpacking method. The packaging device comprises a cable interface, a vacuum cavity, a vacuum interface, an automatic lifting connecting rod and a material taking window. The application provides a vacuum lossless unpacking design route. When the unpacking process is carried out, the solder is heated to a molten state in the vacuum cavity, the gravity of the base and the connecting rod is used to stably disintegrate the pipe cap and the base, the automatic lifting connecting rod is controlled to descend to completely separate the assembly, and due to the surface tension characteristics of the liquid solder, most of the solder remains on the sidewall of the pipe cap with a higher temperature, so that the chip main body is protected from pollution, and lossless unpacking of the optoelectronic device is realized.

Description

Technical Field

[0001] This application relates to the field of high-end semiconductor manufacturing equipment technology, specifically to a packaging device and a non-destructive packaging method compatible with non-destructive depackaging processes. Background Technology

[0002] With the rapid development of precision instrument technology, the requirements for the working environment of high-end optoelectronic devices are becoming increasingly stringent. For example, high-performance X-ray silicon-based drift detectors typically rely on internally integrated thermoelectric coolers (TECs) to achieve extremely low-temperature (-35°C) operating environments to reduce device thermal noise. Simultaneously, to prevent low-temperature frost formation and isolate external heat conduction, the detector chip must be encapsulated in a high-vacuum metal casing. Currently, the packaging process for high-end optoelectronic devices mainly employs various precision welding technologies such as laser sealing, parallel seam welding, eutectic bonding, and vacuum reflow soldering. The equipment used includes laser sealing machines, parallel seam welding machines, eutectic furnaces, and vacuum reflow furnaces. Decapsulation, on the other hand, requires specialized decapsulation machines or rework stations to remove the sealing materials such as epoxy resin, silicone, and ceramics encapsulating the chip through high-energy laser ablation, chemical etching, or mechanical peeling. Although packaging and decapsulation are functionally complementary, the underlying technologies and hardware equipment are completely different, each requiring a dedicated system to complete the operation.

[0003] During the product development phase, it is necessary to frequently depackage the encapsulated samples in order to test the internal circuits or modify the design, and then repackage them.

[0004] There is no existing technology that can simultaneously achieve these two completely opposite processes—that is, both packaging of optoelectronic precision components and performing non-destructive depackaging. Summary of the Invention

[0005] In view of this, this application discloses a packaging apparatus and a non-destructive packaging method compatible with non-destructive depackaging technology to solve the problems in the prior art, including:

[0006] A packaging device compatible with non-destructive depackaging technology, characterized in that it comprises:

[0007] Cable interface, used to enable electrical signal transmission of the encapsulation device;

[0008] A vacuum chamber, used to provide a vacuum environment for the process, is equipped with a fixed-position cap heating kit; the cap heating kit is used to heat the sidewalls of the optoelectronic device.

[0009] The vacuum interface is located on the outside of the vacuum chamber and is used to evacuate the vacuum chamber to a vacuum state.

[0010] The automatic lifting linkage passes through the bottom of the vacuum chamber and adopts a dynamic sealing design. The top of the linkage is equipped with a device fixing base. The automatic lifting linkage is used to raise the photoelectric device to be combined with the tube cap heating kit, or to lower it to be separated from the tube cap heating kit. The device fixing base is used to mount the photoelectric device and is equipped with energized pins. It has an active heating function independent of the tube cap heating kit.

[0011] The retrieval window, located on the vacuum chamber, is used to install and remove optoelectronic devices on the device mounting base;

[0012] A non-destructive de-packaging method, used in conjunction with a packaging apparatus compatible with the aforementioned non-destructive de-packaging process, includes:

[0013] S1. Install the faulty device to be processed on the device fixing base, control the automatic lifting linkage to rise until it is aligned with the tube cap heating kit, and fix the tube cap of the device.

[0014] S2. Evacuate the vacuum chamber to the set vacuum state;

[0015] S3. Control the heating kit of the tube cap to heat the side wall of the tube shell until the solder at the connection between the tube shell and the tube cap is in a molten state.

[0016] S4. Control the automatic lifting linkage to move downwards;

[0017] S5. Cool the separated components in a vacuum or nitrogen-protected environment to complete the non-destructive depackaging process.

[0018] The beneficial effects of this application include:

[0019] This application pioneers a vacuum-based, non-destructive unpacking design. Utilizing a molten solder separation process under vacuum negative pressure, the solder is heated to a molten state within the vacuum chamber during the unpacking process. The gravity of the base and connecting rod allows the cap to smoothly separate from the base. An automatically lifting connecting rod descends to completely separate the components. Due to the surface tension of the liquid solder, most of the solder remains on the higher-temperature sidewall of the cap, thus protecting the chip from contamination. This vacuum negative pressure anti-splash unpacking design completely solves the problems of solder oxidation and splashing, as well as mechanical cutting damage, in traditional capping methods. This allows expensive detector components, optoelectronic chips, and other components to be recycled, repaired, or have their windows replaced without damage, significantly reducing production losses and after-sales maintenance costs. It also lowers maintenance costs and improves the reworkability of optoelectronic devices. This provides a new design approach for those skilled in the art.

[0020] To address the challenge of the conflict between the getter activation temperature and the chip's temperature tolerance threshold during the vacuum packaging and soldering process for photosensitive devices such as X-ray detectors, single-photon detectors, and lasers, a solution combining thermal-cold partitioning isolation and linear stage drive is provided. Utilizing the thermal blocking characteristics of a vacuum environment, high-temperature degassing and getter activation are achieved on the device cap, while maintaining the device body in a safe, relatively low-temperature zone, ensuring controllable process quality. The dual-mode getter activation mechanism is suitable for various types of optoelectronic device processes. The vacuum flange interface design facilitates arraying of the device, reducing equipment investment costs and improving industrial production efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a packaging device compatible with non-destructive depackaging technology in an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the vacuum cavity in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram showing the automatic lifting linkage being raised to the point where the photoelectric device and the cap heating kit are combined, as described in the embodiments of this application.

[0024] Figure 4 This is a schematic diagram of the packaging devices cascaded via a vacuum flange interface in an embodiment of this application. Detailed Implementation

[0025] To make the objectives, technical solutions, features, and advantages of this application clearer and to enable those skilled in the art to better understand the technical solutions of this application, the following detailed description of this application is provided in conjunction with the accompanying drawings and embodiments.

[0026] Example 1:

[0027] This embodiment includes a packaging device compatible with non-destructive depackaging technology, such as... Figure 1 As shown, it includes:

[0028] The cable interface is used to enable the transmission of electrical signals in the encapsulation device.

[0029] A vacuum chamber, used to provide a vacuum environment for the process, is equipped with a fixed-position cap heating assembly; the cap heating assembly is used to heat the sidewalls of optoelectronic devices. For example... Figure 2 As shown, this embodiment uses a heatable cavity as a vacuum cavity, which is covered by insulation material to maintain a high temperature. After heating, it helps the water vapor or other gases attached to various surfaces to dissipate, resulting in a better vacuum environment and allowing the high vacuum environment inside the device to be maintained for a longer period of time.

[0030] The vacuum interface is located on the outside of the vacuum chamber and is used to evacuate the vacuum chamber to a vacuum state.

[0031] The automatic lifting linkage passes through the bottom of the vacuum chamber and adopts a dynamic sealing design. The top of the linkage is equipped with a device fixing base.

[0032] The automatic lifting linkage is used to raise the optoelectronic device to be combined with the cap heating kit, or to lower it to be separated from the cap heating kit; the device fixing base is used to mount the optoelectronic device, and is equipped with energized pins, and has an active heating function independent of the cap heating kit.

[0033] The dynamic seal design ensures the airtightness of the vacuum chamber during the reciprocating motion of the automatic lifting linkage. The sealing method allows the linkage to move axially without disrupting the vacuum environment.

[0034] The retrieval window, located on the vacuum chamber, is used to install and remove optoelectronic devices from the device mounting base.

[0035] The cap heating kit is a contact-type upper thermal field assembly located at the top of the vacuum chamber. It includes a clamping bracket for positioning the device cap and a heat conduction unit surrounding the cap. When the encapsulation device is in operation, the cap heating kit and the device fixing base form a variable-pitch thermal gradient field in space, ensuring that heating the cap does not affect the device on the base.

[0036] During the packaging process, the cap is installed on the cap heating kit, and the optoelectronic chip is installed on the device mounting base. The getter is activated at high temperature, at which point a significant temperature gradient is formed between the upper and lower parts. After the getter is activated, the temperatures of the cap heating kit and the device mounting base are adjusted to the welding temperature zone, and the automatic lifting linkage is controlled to rise, closing the cap and the device body to complete the hermetic welding.

[0037] For getters on the cap side, traditional sealing equipment such as vacuum reflow ovens, when performing overall isothermal heating, will inevitably cause TEC solder joints to melt and collapse or window seals to fail and leak when activating the non-evaporable getter used to maintain vacuum (low-temperature activation is usually around 200°C) during the overall isothermal heating process. (The TEC cooler inside the detector usually uses low-temperature solder with a melting point of around 130°C-180°C, and the transmission window of the detector, such as the beryllium window used in X-ray detectors, is mostly bonded with epoxy resin, and its temperature resistance usually does not exceed about 150°C). If the device needs to be protected, the getter cannot be effectively activated, resulting in a shortened product life. However, the contact-type upper thermal field assembly establishes a high-temperature activation zone for the getter on the cap sidewall through direct contact and provides the heat required for welding based on heat conduction. It also maintains the transmission window at the top of the cap in a relatively low-temperature safe zone through indirect contact.

[0038] For getters in optoelectronic devices, current is supplied to the energized pins on the device mounting base via a cable interface, and the getter is activated by electrothermal heating.

[0039] Thermal activation is performed on the getter on the cap side, or electrothermal activation is performed on the getter on the optoelectronic device side. During the activation process, the temperature of the getter on the side component (cap or chip) is always maintained below the safe threshold, effectively avoiding damage to sensitive chips or structures caused by high temperature.

[0040] Furthermore, the position movement of the automatic lifting linkage in the vacuum is achieved through an external linear drive mechanism. The linear drive mechanism has a limiter and mechanical self-locking function or a constant torque output function, which is used to provide continuous axial pressure during the packaging and soldering stage, ensuring that the solder is fully filled under this pressure, and eliminating the risk of poor soldering and porosity.

[0041] Furthermore, the vacuum interface employs a multi-stage expandable vacuum flange interface; in some embodiments, different packaging devices are connected via the vacuum flange interface. The sidewall vacuum expansion interface design allows a single pump unit to drive multiple processing chambers. This modular design reduces equipment investment costs and significantly improves industrial production efficiency.

[0042] During the depackaging process, the solder is heated to a molten state in a vacuum chamber. The gravity of the base and connecting rod is used to smoothly separate the cap from the base. The automatic lifting connecting rod is controlled to descend so that the components are completely separated. Due to the surface tension of the liquid solder, most of the solder remains on the side wall of the cap at a higher temperature, thus protecting the chip body from contamination.

[0043] Compared to existing technologies that involve heating and prying open the casing in an atmospheric environment or mechanically cutting it (such as the destructive mechanical cutting unsealing of vacuum energy storage soldering devices), the technical solution designed in this application avoids damage to the device casing structure, short circuits caused by flying metal debris, and oxidation and slagging of molten solder in the air. This also prevents irreversible damage to core components caused by airflow impact due to internal and external pressure differences, and solder splashing that contaminates the chip surface. This vacuum negative pressure anti-spatter unsealing design effectively prevents solder oxidation and boiling over. Reverse operation using the same device enables non-destructive opening and repair of faulty devices, thus solving the current industry dilemma of "if it breaks, it's scrapped," resulting in significant resource waste.

[0044] Example 2:

[0045] This embodiment includes a packaging device compatible with non-destructive depackaging technology. The difference from Embodiment 1 is that this embodiment will describe the device in conjunction with more specific packaging settings.

[0046] The packaging device consists of a vacuum operation unit, a bottom transfer component, a vacuum pump, and a control system.

[0047] The vacuum chamber is made of stainless steel and has excellent airtightness.

[0048] A visual access window is located at the front of the cavity. The window is made of high-strength quartz glass and has a flange structure that is easy to open and close, allowing operators to visually monitor the internal components and the melting state of the solder.

[0049] The top of the cavity is equipped with an electrical signal feedthrough interface, which is used to lead the signals from the internal heating power supply, temperature sensor and other signals to the external control computer. The side wall of the cavity is equipped with a vacuum pump interface, which is connected to the molecular pump assembly.

[0050] The linear drive mechanism is located at the bottom of the cavity, and its core consists of a servo motor with a self-locking function and a lifting linkage.

[0051] The connecting rod is inserted into the vacuum chamber through a sealed connector kit, and the sealing method allows the connecting rod to move axially without disrupting the vacuum environment.

[0052] like Figure 2 As shown, the contact-type upper thermal field assembly is fixed to the upper half of the vacuum chamber. The assembly is equipped with a heatable fixing metal kit for inserting the device cap. Its support structure is fixed inside the chamber with a low thermal conductivity stainless steel or titanium alloy bracket to reduce heat loss to the chamber wall.

[0053] The height of the heatable kit is pre-calculated and designed so that it only covers the side wall area of ​​the cap, i.e., the conventional getter installation location and welding bonding area. The lower half of the vacuum chamber is a copper platform at the top of the automatic linkage, used to place the optoelectronic device stage and the optoelectronic device body. A heating rod and temperature sensor are embedded at the top of the linkage, allowing independent temperature control of the device body via a central control system.

[0054] Furthermore, the central control system is equipped with a temperature difference protection algorithm. When executing the getter high-temperature activation procedure, it controls the linear drive mechanism to keep the base in a separated position away from the top thermal field, and always controls the base temperature to be lower than the thermal damage threshold of the device chip during the hot baking process. At the same time, it controls the upper thermal field temperature to meet the getter activation requirements. The central control system can also control the upper thermal field components to reach the corresponding welding or melting temperature during the packaging and unpacking process.

[0055] like Figure 3 As shown, when the automatic lifting linkage is raised to the point where the optoelectronic device and the cap heating kit are combined, the main body of the optoelectronic device will be inserted into the upper cap, and the cap and the optoelectronic device will make contact with each other at the lip, forming a closed cap-device assembly, and the welding process will be executed.

[0056] like Figure 4 As shown, to meet the needs of industrial mass production, this embodiment also features a standardized vacuum flange interface on the side wall of the vacuum chamber. Users can connect multiple... Figure 2The independent vacuum chambers within the system are connected in parallel to the same main vacuum pipe via interfaces, allowing the encapsulation devices to be cascaded through vacuum flange interfaces. The resulting cascaded array will share a single high-power molecular pump unit. Its advantage lies in enabling multiple devices to simultaneously undergo time-consuming degassing, dehumidification, and activation steps, thereby improving production efficiency. It also significantly increases the utilization rate of expensive vacuum pump units, ultimately enhancing overall production capacity.

[0057] Example 3:

[0058] This embodiment provides a packaging method, which is executed in conjunction with the packaging apparatus compatible with non-destructive depackaging technology described in Embodiment 1 or Embodiment 2, including:

[0059] S1. Separate the optoelectronic device and the cap to be welded;

[0060] The main body of the optoelectronic device with a pre-placed solder ring is installed in the lower part of the cavity temperature control base, i.e., the device fixing base. The cap containing a non-evaporable getter is installed in the clamping position in the cap heating kit, so that the two are physically separated in the vertical direction.

[0061] S2. Exhaust the vacuum chamber until the vacuum level reaches the preset pressure, then perform baking, exhaust, and dehumidification operations. The cap heating kit and the device mounting base are heated independently according to preset requirements to remove adsorbed moisture from the surfaces of each component. During the heating process, the temperature of the device mounting base must be strictly controlled within the safe range for the device chip and the main structure.

[0062] S3. Activate the inhaler in situ according to its type. Specifically:

[0063] If it is a side-entry agent for the pipe cap, then control the temperature rise of the upper thermal field assembly;

[0064] If it is a getter for optoelectronic devices, it is activated by electrothermal heating by passing current through the electrical interface.

[0065] During this process, the temperature of the component opposite the getter is always kept below the safe threshold, effectively avoiding damage to sensitive chips or structures caused by high temperatures.

[0066] S4. Perform pressure welding.

[0067] Once the getter is activated and all components are adjusted to the solder preheating temperature, the automatic lifting linkage moves upward until the lip of the tube seat of the optoelectronic device body is fully closed and in contact with the bottom of the tube cap.

[0068] At this point, the upper thermal field assembly is heated to the welding temperature, and the connecting rod drive mechanism maintains appropriate and constant axial pressure. Because the system is in a vacuum environment, the molten solder can effectively and fully wet and fill the joint.

[0069] S5. Cool down to a safe range, fill the vacuum chamber with protective gas and release the vacuum to complete the device packaging.

[0070] Example 4:

[0071] This embodiment provides a non-destructive de-packaging method, which is executed in conjunction with the packaging apparatus compatible with non-destructive de-packaging technology described in Embodiment 1 or Embodiment 2, including:

[0072] S1. Install the faulty device to be processed on the device fixing base, control the automatic lifting linkage to rise until it is aligned with the tube cap heating kit, and fix the tube cap of the device.

[0073] S2. Evacuate the vacuum chamber to the set vacuum state to establish a negative pressure environment, thereby eliminating the pressure difference inside and outside the device casing and creating a safe oxygen-free environment to prevent the solder from oxidizing rapidly.

[0074] S3. Control the heating kit to heat the side wall of the tube shell until the solder at the connection between the tube shell and the tube cap is in a molten state; as the solder melts, the optoelectronic device disintegrates from the tube cap due to gravity.

[0075] During the heating process, the shell and the chip are still connected to the substrate by solder. Since the melting points of the connection points of different parts of the device are different, and the melting point of the solder is slightly lower, it will not have an impact. What needs to be paid attention to is whether the device itself will be affected by the high temperature, so the selection of solder is extremely important.

[0076] S4. Control the automatic lifting linkage to move downwards, and complete the smooth separation of the cap assembly and the device assembly under vacuum conditions.

[0077] S5. Cool the separated components in a vacuum or nitrogen-protected environment to complete the non-destructive depackaging process, ultimately achieving non-destructive opening of the faulty device, followed by chip measurement, repair, or high-value component recycling, or cap replacement, etc.

[0078] Finally, it should be noted that the above description only depicts some embodiments of this application. For those skilled in the art, various changes, modifications, substitutions, and variations can be conceived of these embodiments without departing from the principles and spirit of this application. The scope of protection of this application is defined by the appended claims and their equivalents, and all the above-mentioned behaviors should be covered within the scope of protection of this application.

Claims

1. A packaging device compatible with non-destructive depackaging technology, characterized in that, include: Cable interface, used to enable electrical signal transmission of the encapsulation device; A vacuum chamber, used to provide a vacuum environment for the process, is equipped with a fixed-position cap heating kit; the cap heating kit is used to heat the sidewalls of the optoelectronic device. The vacuum interface is located on the outside of the vacuum chamber and is used to evacuate the vacuum chamber to a vacuum state. The automatic lifting linkage passes through the bottom of the vacuum chamber and adopts a dynamic sealing design. The top of the linkage is equipped with a device fixing base. The automatic lifting linkage is used to raise the photoelectric device to be combined with the tube cap heating kit, or to lower it to be separated from the tube cap heating kit. The device fixing base is used to mount the photoelectric device and is equipped with energized pins. It has an active heating function independent of the tube cap heating kit. The retrieval window, located on the vacuum chamber, is used to install and remove optoelectronic devices from the device mounting base.

2. The packaging apparatus compatible with non-destructive de-packaging technology according to claim 1, characterized in that, The cap heating kit is a contact-type upper thermal field assembly, located at the top of the vacuum chamber. It includes a clamping bracket for positioning the device cap and a heat conduction unit surrounding the cap. When the encapsulation device is working, the cap heating kit and the device fixing base form a variable-spacing thermal gradient field in space, so that the heating of the cap will not affect the device on the base.

3. The packaging apparatus compatible with non-destructive depackaging technology according to claim 1, characterized in that, The vacuum chamber is a heatable chamber.

4. The packaging apparatus compatible with non-destructive depackaging technology according to claim 1, characterized in that, The vacuum interface adopts a vacuum flange interface that can be expanded in multiple stages.

5. The packaging apparatus compatible with non-destructive de-packaging technology according to claim 1, characterized in that, The automatic lifting linkage moves in a vacuum through an external linear drive mechanism.

6. The packaging apparatus compatible with non-destructive de-packaging technology according to claim 1, characterized in that, During the packaging process, the cap is installed on the cap heating kit, and the optoelectronic chip is installed on the device mounting base; the getter is activated at high temperature; after the getter is activated, the temperature of the cap heating kit and the device mounting base is adjusted to the welding temperature zone, and the automatic lifting linkage is controlled to rise, closing the cap and the device body to complete the hermetic welding.

7. The packaging apparatus compatible with non-destructive depackaging technology according to claim 6, characterized in that, During the encapsulation process, for the getter on the cap side, the cap heating kit establishes a high-temperature activation zone for the getter on the cap sidewall based on heat conduction and provides the heat required for welding. It maintains the transmission window on the top of the cap in a relatively low-temperature safe zone through non-direct contact.

8. The packaging apparatus compatible with non-destructive depackaging technology according to claim 6, characterized in that, During the encapsulation process, for the getter on the optoelectronic device side, current is supplied to the energized pin on the device mounting base through the cable interface, and the getter is activated by electrothermal heating.

9. The packaging apparatus compatible with non-destructive depackaging technology according to claim 1, characterized in that, During the decapsulation process, the solder is heated to a molten state in a vacuum chamber, causing the cap to separate from the base; the automatic lifting linkage is controlled to descend so that the components are completely separated.

10. A non-destructive de-packaging method, performed by a packaging apparatus compatible with the non-destructive de-packaging process according to any one of claims 1 to 9, characterized in that, include: S1. Install the faulty device to be processed on the device fixing base, control the automatic lifting linkage to rise until it is aligned with the tube cap heating kit, and fix the tube cap of the device. S2. Evacuate the vacuum chamber to the set vacuum state; S3. Control the heating kit of the tube cap to heat the side wall of the tube shell until the solder at the connection between the tube shell and the tube cap is in a molten state. S4. Control the automatic lifting linkage to move downwards; S5. Cool the separated components in a vacuum or nitrogen-protected environment to complete the non-destructive depackaging process.

Images