A pre-tunable Bosch process semiconductor processing apparatus

Abstract

The application relates to the technical field of wafer processing equipment, in particular to a Bosch process semiconductor processing equipment with pre-adjustable pressure, which comprises a cavity connecting pipe I, a pre-pressure part, a deposition gas pipe, an etching gas pipe, a cavity connecting pipe II, a piston part I and a piston part II; the piston part I moves in a first direction in a gas containing cavity, so that the gas pressure in a first pre-pressure cavity is adjusted to a preset pressure I by adjusting the volume of the first pre-pressure cavity; the piston part II moves in the first direction in the gas containing cavity, so that the gas pressure in a second pre-pressure cavity is adjusted to a preset pressure II by adjusting the volume of the second pre-pressure cavity; the volume of the first pre-pressure cavity and the second pre-pressure cavity is independently adjusted by the piston part I and the piston part II moving in the first direction, and the pressure of two gas paths is matched to the corresponding preset values in advance.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, and more particularly to a pre-adjustable Bosch process semiconductor processing equipment. Background Technology

[0002] The existing Bosch process, as the mainstream technology for deep silicon etching, achieves high aspect ratio processing by periodically alternating the introduction of C4F8 deposition gas and SF6 etching gas. However, its gas delivery system, which uses a fixed-volume rigid pipeline design, has inherent defects: when switching gases, the high-pressure gas remaining in the pipeline after one gas is shut down will surge into the reaction chamber instantly when it is opened again, forming a pressure spike and disrupting the process steady state; the newly opened gas path needs to build up from zero pressure to the target pressure, and the stabilization time is as long as hundreds of milliseconds to several seconds due to the fixed volume limitation, which squeezes the effective process window; and the two gas paths are prone to pressure fluctuation coupling interference due to their proximity. At the same time, the residual pressure after one gas is shut down can be completely wasted, and the opening of the other gas path requires additional energy to build up pressure. Existing solutions are limited to optimizing valve response or adding passive buffer structures, without addressing the active coupling control and energy recovery of the two gas paths, making it difficult to meet the stringent requirements of high-end semiconductor manufacturing for etching precision and efficiency. Summary of the Invention

[0003] This invention relates to a pre-adjustable Bosch process semiconductor processing apparatus, with the aim of solving the problems of pressure spikes during switching, pressure build-up lag, and mutual interference between two gas flows caused by fixed volume pipelines in existing Bosch process gas delivery systems.

[0004] To achieve the above objectives, the present invention provides a pre-adjustable Bosch process semiconductor processing apparatus, comprising a first connecting tube, a pre-pressure component, a deposition gas tube, an etching gas tube, a second connecting tube, a first piston component, and a second piston component; The pre-pressure component is provided with a gas-containing cavity; Both piston component one and piston component two are movably disposed within the gas receiving cavity, dividing the gas receiving cavity into a first pre-compression cavity, a second pre-compression cavity, and an adjustment cavity; the first pre-compression cavity is connected to the deposition gas pipe and is also connected to the reaction chamber via the connecting pipe one; the second pre-compression cavity is connected to the etching gas pipe and is also connected to the reaction chamber via the connecting pipe two; the adjustment cavity is located between the first pre-compression cavity and the second pre-compression cavity. The first piston moves in the first direction within the gas containing chamber to adjust the gas pressure in the first pre-pressurization chamber to a preset pressure one by adjusting the volume of the first pre-pressurization chamber; the second piston moves in the first direction within the gas containing chamber to adjust the gas pressure in the second pre-pressurization chamber to a preset pressure two by adjusting the volume of the second pre-pressurization chamber.

[0005] Optionally, the pre-adjustable Bosch process semiconductor processing equipment further includes a pneumatic drive unit. The driving end of the pneumatic drive component one is connected to the piston component two. The pneumatic drive component one includes a sub-adjustment chamber one, and an air inlet pipe one and an air outlet pipe one that connect the sub-adjustment chamber one. The air inlet pipe one is connected to the deposited gas pipe, and the air outlet pipe one is connected to the connecting pipe one, so that the air pressure in the sub-adjustment chamber one and the first pre-pressure chamber are consistent. The piston component two is driven to move toward or away from the first pre-pressure chamber by the pressure difference between the first pre-pressure chamber and the second pre-pressure chamber, thereby adjusting the volume of the second pre-pressure chamber to make the air pressure in it consistent with the air pressure in the first pre-pressure chamber.

[0006] Optionally, the pre-adjustable Bosch process semiconductor processing equipment further includes a pressure regulating component one, which is disposed on the pneumatic drive component one. The pressure regulating component one is used to adjust the air pressure in the sub-adjustment chamber one, so that the sub-adjustment chamber one and the second pre-pressure chamber form a pressure difference to drive the piston component two to move toward or away from the first pre-pressure chamber, thereby readjusting the volume of the second pre-pressure chamber after pressure adjustment so that its air pressure is adjusted to the preset pressure two.

[0007] Optionally, the pneumatic drive component includes: A support box 1 is fixedly disposed in the adjustment cavity and has a sub-adjustment cavity 1 disposed therein. The side wall of the support box 1 facing the piston component 2 is provided with a through hole 1. Piston 3 is movably disposed within the support box 1 along the first direction and is slidably contacted with the inner sidewall of the support box 1. Piston 3 divides the inner cavity of the support box 1 into a gas storage chamber 1 and a movable chamber 1. The gas storage chamber 1 is connected to the deposited gas pipe through the inlet pipe 1 and to the connecting chamber pipe 1 through the outlet pipe 1. Connecting rod one movably passes through the through hole one, with one end fixed to the side wall of piston three and the other end fixed to the side wall of piston two, so that piston two can be moved toward or away from the first pre-compression chamber by piston three and connecting rod one.

[0008] Optionally, the pneumatic drive component one further includes a sealing ring three; The sealing ring three is fixed to the inner wall of the through hole one and is movably sleeved on the outside of the connecting rod one, so as to seal the sub-adjustment cavity one.

[0009] Optionally, the pneumatic drive component one further includes an elastic connector one; The elastic connector is wound around the outer wall of the connecting rod, with one end fixed to the outer wall of the support box and the other end extending along the first direction and fixed to the side wall of the piston.

[0010] Optionally, the pre-adjustable Bosch process semiconductor processing equipment further includes a pneumatic drive unit two; The driving end of the second pneumatic drive component is connected to the first piston component. The second pneumatic drive component includes a second sub-adjustment chamber, and an inlet pipe and an outlet pipe that connect the second sub-adjustment chamber. The inlet pipe is connected to the etching gas pipe, and the outlet pipe is connected to the connecting pipe, so that the air pressure in the second sub-adjustment chamber and the second pre-pressure chamber are consistent. The piston component is driven to move toward or away from the second pre-pressure chamber by the pressure difference between the second pre-pressure chamber and the first pre-pressure chamber, thereby adjusting the volume of the first pre-pressure chamber to make the air pressure in it consistent with the air pressure in the second pre-pressure chamber.

[0011] Optionally, the pre-adjustable Bosch process semiconductor processing equipment further includes a pressure regulator. The second pressure regulating component is disposed on the second pneumatic drive component. The second pressure regulating component is used to regulate the air pressure in the second sub-regulating chamber so that the second sub-regulating chamber and the first pre-pressurization chamber form a pressure difference, thereby driving the first piston component to move toward or away from the second pre-pressurization chamber, thereby readjusting the volume of the first pre-pressurization chamber after pressure adjustment so that its air pressure is adjusted to the preset pressure.

[0012] Optionally, the second pneumatic drive component includes: Support box 2 is fixedly disposed in the adjustment cavity and has sub-adjustment cavity 2 disposed therein. The side wall of support box 2 facing the piston component 1 is provided with through hole 2. Piston component four is movably disposed within the support box two along the first direction and is slidably contacted with the inner sidewall of the support box two. Piston component four divides the inner cavity of the support box two into a gas storage chamber two and a movable chamber two. The gas storage chamber two is connected to the etching gas pipe through the gas inlet pipe two and to the connecting chamber pipe two through the gas outlet pipe two. Connecting rod two movably passes through the through hole two, with one end fixed to the side wall of piston component four and the other end fixed to the side wall of piston component one, so that piston component four and connecting rod two can move piston component one toward or away from the second pre-compression chamber.

[0013] Optionally, the pneumatic drive component two further includes a sealing ring four: The sealing ring four is fixed to the inner wall of the through hole two and is movably sleeved on the outside of the connecting rod two, so as to seal the sub-adjustment cavity two.

[0014] Optionally, the pneumatic drive component two further includes an elastic connecting component two; The second elastic connector is wound around the outer wall of the second connecting rod, with one end fixed to the outer wall of the second support box and the other end extending along the first direction and fixed to the side wall of the first piston component.

[0015] Optionally, the pre-adjustable Bosch process semiconductor processing equipment further includes a sealing ring one and a sealing ring two; The piston component has an annular groove on its sliding sidewall that extends circumferentially in a ring-shaped structure. The sealing ring is disposed in the annular groove and is in sliding contact with the sliding sidewall of the pre-pressure component. The piston component 2 has an annular groove 2 recessed on its sliding sidewall, which extends circumferentially in a ring-shaped structure. The sealing ring 2 is disposed in the annular groove 2 and is in sliding contact with the sliding sidewall of the pre-pressure component.

[0016] Optionally, the pre-adjustable Bosch process semiconductor processing equipment further includes pressure detection element one and pressure detection element two; The pressure detection element one and the pressure detection element two are respectively disposed in the first pre-pressure chamber and the second pre-pressure chamber. The pressure detection element one is used to detect the air pressure in the first pre-pressure chamber, and the pressure detection element two is used to detect the air pressure in the second pre-pressure chamber.

[0017] Optionally, the pre-adjustable Bosch process semiconductor processing equipment may further include several regulating valves; Several regulating valves are respectively disposed on the first connecting tube, the deposition gas tube, the etching gas tube, and the second connecting tube to control the on / off state of the first connecting tube, the deposition gas tube, the etching gas tube, and the second connecting tube.

[0018] The beneficial effects of this invention are as follows: This invention provides a first pre-pressurization chamber, a second pre-pressurization chamber, and an adjustment chamber separated by pistons 1 and 2 within the gas-containing cavity of the pre-pressurization component. The first and second pre-pressurization chambers are connected to the deposition gas pipe, the etching gas pipe, and connecting pipes 1 and 2 leading to the reaction chamber, respectively. Before switching Bosch process gases, the volumes of the first and second pre-pressurization chambers can be independently adjusted by the movement of pistons 1 and 2 in a first direction, pre-matching the pressures of the two gas paths to the corresponding preset values. This avoids the pressure spikes caused by the instantaneous influx of residual high-pressure gas into the reaction chamber after one path is closed, as is the case in traditional solutions. It also eliminates the need to open a new gas path to rebuild pressure from zero, significantly shortening the pressure stabilization time and releasing an effective process window. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a pre-adjustable Bosch process semiconductor processing device in some embodiments of the present invention; Figure 2 for Figure 1 An enlarged schematic diagram of the structure at position A in the diagram.

[0020] Explanation of reference numerals in the attached figures: 1. Reaction chamber; 2. Connecting tube 1; 3. Pre-pressure component; 31. First pre-pressure chamber; 32. Second pre-pressure chamber; 33. Adjusting chamber; 34. Pressure relief through hole; 4. Pressure detection component 1; 5. Deposited gas pipe; 6. Piston component 1; 7. Sealing ring 1; 8. Piston component 2; 9. Sealing ring 2; 10. Etching gas pipe; 11. Connecting tube 2; 12. Pressure detection component 2; 13. Support box 1; 131. Through hole 1; 14. Piston component 3; 15. Connecting rod 1; 16. Sealing ring 3; 17. Elastic connector 1; 18. Pressure regulating component 1; 19. Pressure regulating component 2; 20. Inlet pipe 1; 21. Outlet pipe 1; 22. Adjusting valve. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.

[0022] This invention relates to a pre-adjustable Bosch process semiconductor processing apparatus, with the aim of solving the problems of pressure spikes during switching, pressure build-up lag, and mutual interference between two gas flows caused by fixed volume pipelines in existing Bosch process gas delivery systems.

[0023] To address the problems existing in the prior art, embodiments of the present invention provide a pre-adjustable Bosch process semiconductor processing apparatus, such as... Figure 1 As shown, the pre-adjustable Bosch process semiconductor processing equipment includes a connecting tube 2, a pre-pressure unit 3, a deposition gas tube 5, an etching gas tube 10, a connecting tube 11, a piston 6, and a piston 8. The piston 6 and piston 8 can be in the shape of an inverted cylinder or a rectangle, preferably a cylinder.

[0024] In some embodiments, such as Figure 1As shown, the pre-pressure component 3 has a gas-containing cavity. The shape of the gas-containing cavity can be a horizontally laid-down cylindrical structure or a rectangular structure, preferably a cylindrical structure.

[0025] In some embodiments, such as Figure 1 As shown, both piston element 6 and piston element 8 are movably disposed within the gas receiving cavity, dividing the gas receiving cavity into a first pre-compression cavity 31, a second pre-compression cavity 32, and an adjustment cavity 33. The first pre-compression cavity 31 is connected to the deposition gas pipe 5 and to the reaction chamber 1 via the connecting pipe 2. Preferably, the central axis of the inlet end of the connecting pipe 2 and the central axis of the outlet end of the deposition gas pipe 5 are on the same vertical line.

[0026] In some embodiments, such as Figure 1 As shown, the second pre-compression chamber 32 is connected to the etching gas pipe 10 and is connected to the reaction chamber 1 through the connecting pipe 2 11; the central axis of the gas outlet end of the etching gas pipe 10 and the central axis of the gas inlet end of the connecting pipe 2 11 are on the same vertical line.

[0027] In some embodiments, such as Figure 1 As shown, the adjustment chamber 33 is located between the first pre-compression chamber 31 and the second pre-compression chamber 32.

[0028] In some embodiments, such as Figure 1 As shown, the piston 6 moves in the gas receiving cavity along the first direction (which can be understood as the horizontal direction) to adjust the gas pressure in the first pre-pressure cavity 31 to a preset pressure 1 by adjusting the volume of the first pre-pressure cavity 31 (which can be adjusted by increasing or decreasing the volume of the first pre-pressure cavity 31); the preset pressure 1 can be flexibly set according to the needs of the current process step.

[0029] In some embodiments, such as Figure 1 As shown, the piston 8 moves along a first direction within the gas receiving cavity to adjust the gas pressure within the second pre-pressure cavity 32 to a preset pressure 2 by adjusting the volume of the second pre-pressure cavity 32 (which can be increased or decreased by adjusting the volume of the second pre-pressure cavity 32). The preset pressure 2 can be flexibly set according to the requirements of the current process step.

[0030] In this embodiment, the pressure regulation action is performed in the closed first pre-pressure chamber 31 and second pre-pressure chamber 32 before the gas enters the reaction chamber 1. Precise pressure regulation is achieved by directly changing the gas density through variable volume, without relying on the downstream valve throttling, thus avoiding the flow field disturbance and temperature fluctuation caused by the throttling process. At the same time, the two gas streams are regulated in parallel in the independent first pre-pressure chamber 31 and second pre-pressure chamber 32 without crosstalk. For example, the second pre-pressure chamber 32 can be pressurized to a preset pressure in advance during the deposition process, achieving seamless switching of "processing while preparing pressure".

[0031] In some embodiments, such as Figure 1 As shown, the pre-adjustable Bosch process semiconductor processing equipment also includes a pneumatic drive unit.

[0032] In some embodiments, such as Figure 1 As shown, the driving end of the pneumatic drive component one is connected to the piston component two 8. The pneumatic drive component one includes a sub-adjustment chamber one, and an inlet pipe one 20 and an outlet pipe one 21 that connect the sub-adjustment chamber one. The central axis of the outlet end of the inlet pipe one 20 and the central axis of the inlet end of the outlet pipe one 21 are arranged on the same vertical line.

[0033] In some embodiments, such as Figure 1 As shown, the inlet pipe 20 is connected to the deposited gas pipe 5, and the outlet pipe 21 is connected to the connecting pipe 2, so that the gas pressure in the sub-adjustment chamber 1 and the first pre-pressure chamber 31 is consistent. The piston 8 is driven to move toward or away from the first pre-pressure chamber 31 by the pressure difference between the first pre-pressure chamber 31 and the second pre-pressure chamber 32, thereby adjusting the volume of the second pre-pressure chamber 32 so that the gas pressure in it is consistent with the gas pressure in the first pre-pressure chamber 31.

[0034] This embodiment achieves self-driven coupling of the etching and deposition pressure regulation processes. No external power source is required; the pressure of the deposition gas already prepared in the first pre-pressure chamber 31 is directly used as power. The gas pressure is synchronously transmitted to the first sub-regulation chamber through the inlet pipe 20 and outlet pipe 21. The existing pressure difference between the first and second pre-pressure chambers 31 drives the piston 8 to move automatically, adaptively matching the volume of the second pre-pressure chamber 32 to equalize the pressures of the first and second pre-pressure chambers 31. This eliminates the need for independent electronically controlled drive components, simplifies the structure, and converts pressure fluctuations at the deposition end into real-time adjustment power at the etching end, allowing the two gas streams to naturally tend towards pressure balance. This physically avoids pressure mismatch caused by manual setting deviations. Furthermore, the driving process is entirely driven by the pressure of the process gas itself, with a response speed synchronized with pressure changes and no additional delay.

[0035] In some embodiments, such as Figure 1As shown, the pre-adjustable Bosch process semiconductor processing equipment also includes a pressure regulating component 18, which is disposed on the pneumatic drive component 1. The pressure regulating component 18 is used to adjust the air pressure in the sub-adjustment chamber 1 so that the sub-adjustment chamber 1 and the second pre-pressure chamber 32 form a pressure difference, thereby driving the piston component 2 8 to move toward or away from the first pre-pressure chamber 31, thereby readjusting the volume of the second pre-pressure chamber 32 after pressure adjustment so that its air pressure is adjusted to the preset pressure 2.

[0036] The pressure regulating component 18 artificially constructs a controllable pressure difference by fine-tuning and locking the air pressure of the sub-regulating chamber 1, breaking the natural equilibrium state and upgrading the pressure of the second pre-pressurizing chamber 32 from "passively following the first pre-pressurizing chamber 31" to "precisely locking the preset pressure 2". This allows for flexible setting of the pressure difference or isobaric relationship between the two gas paths according to the etching process requirements, and also offsets the slight pressure drift caused by gas flow resistance and temperature changes, achieving closed-loop fine-tuning. At the same time, the adjustment action only acts on the sub-regulating chamber 1 without changing the main gas path diameter, taking into account both pressure regulation accuracy and flow path cleanliness. This allows the equipment to be both self-adaptive and energy-saving, and to meet the stringent customized requirements of different aspect ratio etching processes for air pressure difference.

[0037] In some embodiments, the pressure regulating component 18 includes a proportional pressure regulating valve disposed on the inlet pipe 20 or the outlet pipe 21, or a miniature air supply and / or pressure relief branch connected to the sub-regulating chamber. The pressure is precisely controlled by slightly increasing or decreasing the amount of gas in the sub-regulating chamber. The structure is simple and the response is fast. The differential pressure can be continuously adjusted without modifying the piston body structure. It retains the energy-saving characteristics of pneumatic self-drive and brings the pressure control accuracy within the allowable range of the process.

[0038] In some embodiments, the pressure regulating component 18 further includes two control valves, which are respectively located on the inlet pipe 20 and the outlet pipe 21. These control valves close the inlet pipe 20 and the outlet pipe 21 during the process of fine-tuning the pressure in the second pre-pressure chamber 32 to the preset pressure 2 via the pressure regulating component 18. The advantage of this configuration is that during adjustment, the connection between the inlet pipe 20 and the outlet pipe 21 and the external air path is first cut off, turning the sub-regulating chamber 1 into a closed, independent pressure chamber. The pressure regulating component 18 only needs a small amount of gas replenishment or depressurization to quickly change the pressure difference to drive the piston component 8, unaffected by fluctuations in the deposited gas and the pressure in the downstream reaction chamber 1. This results in higher adjustment accuracy, faster response, and avoids the waste of process gas caused by continuous inflow and outflow of deposited gas during adjustment, achieving "static fine-tuning and precise pressure locking."

[0039] In some embodiments, such as Figure 1 As shown, the pneumatic drive component includes a support box 13, a piston 14, and a connecting rod 15.

[0040] In some embodiments, such as Figure 1 As shown, the support box 13 is fixedly disposed within the adjustment cavity 33 and contains the sub-adjustment cavity 1. The support box 13 has a through hole 131 on its side wall (which can be understood as the right side wall) facing the piston component 8. The sub-adjustment cavity 1 can be a tilted cylindrical structure or a rectangular structure.

[0041] In some embodiments, such as Figure 1 As shown, the piston component 3 14 is movably disposed within the support box 1 13 along the first direction and is in sliding contact with the inner sidewall of the support box 1 13. The piston component 3 14 can be a folded cylindrical structure or a rectangular structure. The sliding contact arrangement can achieve a better sealing effect.

[0042] In some embodiments, such as Figure 1 As shown, the piston component 14 divides the inner cavity of the support box 13 into a gas storage chamber 1 (located on the left) and a movable chamber 1 (located on the right). The gas storage chamber 1 is connected to the deposited gas pipe 5 through the air inlet pipe 20 and to the connecting chamber pipe 2 through the air outlet pipe 21.

[0043] In some embodiments, such as Figure 1 As shown, the connecting rod 15 moves through the through hole 131, with one end (which can be understood as the left end) fixed to the side wall of the piston 14 and the other end (which can be understood as the right end) fixed to the side wall of the piston 8, so that the piston 8 can move towards or away from the first pre-compression chamber 31 through the piston 14 and the connecting rod 15.

[0044] In this embodiment, piston 14 directly senses the pressure of sub-adjustment chamber 1 and transmits the axial thrust generated by the pressure difference to piston 8 without delay through rigid connecting rod 15, eliminating the intermediate electro-pneumatic conversion link; at the same time, through hole 131 limits the movement trajectory of connecting rod 15, allowing the thrust to be accurately transmitted along the first direction. Piston 14 and piston 8 always maintain coaxial movement, without any off-center loading or jamming, and the entire drive mechanism is completely built into adjustment chamber 33, without occupying external space.

[0045] In some embodiments, such as Figure 2 As shown, the pneumatic drive component one further includes a sealing ring three 16; the sealing ring three 16 is preferably an annular structure, and its material is preferably fluororubber or perfluoroether rubber resistant to plasma corrosion.

[0046] In some embodiments, such as Figure 2As shown, the sealing ring 16 is fixed to the inner wall of the through hole 131 and is movably sleeved outside the connecting rod 15 to seal the sub-adjustment cavity.

[0047] This embodiment adopts a sealing layout of "fixed static parts and through-hole moving parts". The sealing ring 16 is firmly embedded in the inner wall of the through hole 131 as a static part, and only slides in contact with the outer wall of the connecting rod 15 which moves linearly. This completely blocks the only leakage channel between the sub-regulating chamber 1 and the external regulating chamber 33, ensuring that the pressure change in the sub-regulating chamber 1 is completely dominated by the pressure regulating component 18 and will not be diluted or interfered with by the gap leakage rate. This ensures that the force value of the differential pressure driven piston component 2 8 is stable and the response is linear.

[0048] In some embodiments, such as Figure 1 As shown, the bottom wall of the pre-pressure component 3 is provided with a plurality of pressure relief through holes 34 that communicate with the adjustment cavity 33.

[0049] This allows for the provision of a normal pressure or controlled pressure relief channel in the regulating chamber 33, preventing back pressure from being formed by the compression of stagnant gas in the regulating chamber 33 when piston 6 and piston 8 move. This ensures that piston 6 and piston 8 can slide smoothly and without obstruction under pressure differential drive. At the same time, it can promptly discharge process gas that has seeped into the regulating chamber 33 due to minute sealing leaks, preventing the accumulation of deposited or etching gases inside, which could cause corrosion or cross-contamination. Furthermore, it allows the regulating chamber 33 to be directly depressurized to atmospheric pressure during maintenance, facilitating disassembly and repair, and further improving the stability and maintainability of the equipment.

[0050] In some embodiments, such as Figure 2 As shown, the pneumatic drive component 1 further includes an elastic connector 17; the elastic connector 17 is preferably a helical spring.

[0051] In some embodiments, such as Figure 2 As shown, the elastic connector 17 is wrapped around the outer wall of the connecting rod 15, with one end fixed to the outer wall of the support box 13 and the other end extending along the first direction and fixed to the side wall of the piston 8.

[0052] The elastic connector 17 acts as a passive reset element. When the sub-adjustment chamber 1 is depressurized and the pressure difference disappears, the elastic connector 17 uses its own elastic force to reset the piston 8 to the initial position. No additional electronically controlled reset mechanism is required, and the structure is simple and reliable. At the same time, the direction of the elastic force is coaxial with the direction of piston movement, providing only the restoring force without generating a lateral bending moment, thus avoiding the connecting rod 15 from wearing the sealing ring 16.

[0053] In some embodiments, such as Figure 1 As shown, the pre-adjustable Bosch process semiconductor processing equipment also includes a pneumatic drive unit two.

[0054] In some embodiments, such as Figure 1 As shown, the driving end of the second pneumatic drive component is connected to the first piston component 6. The second pneumatic drive component includes a second sub-adjustment chamber, and an inlet pipe and an outlet pipe that connect the second sub-adjustment chamber. The inlet pipe is connected to the etching gas pipe 10, and the outlet pipe is connected to the connecting pipe 11, so that the air pressure in the second sub-adjustment chamber and the second pre-pressure chamber 32 is consistent. The piston component 6 is driven to move toward or away from the second pre-pressure chamber 32 by the pressure difference between the second pre-pressure chamber 32 and the first pre-pressure chamber 31, thereby adjusting the volume of the first pre-pressure chamber 31 so that the air pressure in it is consistent with the air pressure in the second pre-pressure chamber 32.

[0055] This embodiment constructs a bidirectional mutually driven symmetrical structure. Conversely, the etching gas pressure in the second pre-pressure chamber 32 is used as a power source and synchronously transmitted to the second sub-regulation chamber. The pressure difference between the second pre-pressure chamber 32 and the first pre-pressure chamber 31 drives the piston 6 in the opposite direction, so that the volume of the first pre-pressure chamber 31 adaptively follows the pressure change of the second pre-pressure chamber 32. The two pressure regulation paths form a closed-loop interlock. During deposition, the first pre-pressure chamber 31 actively adjusts, which in turn adjusts the pressure of the second pre-pressure chamber 32 until it is consistent with the pressure of the first pre-pressure chamber 31. During etching, the second pre-pressure chamber 32 actively adjusts, which in turn pulls the first pre-pressure chamber 31 to match the pressure. Throughout the process, there is no need for two independent external drives, which in turn adjust the pressure of the first pre-pressure chamber 31 until it is consistent with the pressure of the second pre-pressure chamber 32.

[0056] In some embodiments, such as Figure 1 As shown, the pre-adjustable Bosch process semiconductor processing equipment also includes a pressure regulator 19.

[0057] In some embodiments, such as Figure 1 As shown, the pressure regulating component 2 19 is disposed on the pneumatic drive component 2. The pressure regulating component 2 19 is used to regulate the air pressure in the sub-regulating chamber 2 so that the sub-regulating chamber 2 and the first pre-pressure chamber 31 form a pressure difference and drive the piston component 1 6 to move toward or away from the second pre-pressure chamber 32, thereby readjusting the volume of the first pre-pressure chamber 31 after pressure adjustment so that its air pressure is adjusted to the preset pressure 1.

[0058] By adjusting the pressure in chamber two through the pressure regulator 19, a controllable pressure difference is artificially constructed to drive piston 6 in reverse. This allows for precise locking of the deposition gas pre-pressurization to the preset pressure 1 during the etching stage, and also enables the active expansion of the pressure difference to quickly release the pressure in the first pre-pressurization chamber 31 during the deposition stage, achieving asymmetric customization of etching gas and deposition gas pressures. Simultaneously, in conjunction with pressure regulator 18, it is equivalent to equipping piston 6 and piston 8 with a "fine-tuning knob" to control the gas pressure in the first pre-pressurization chamber 31 during the etching stage and the gas pressure in the second pre-pressurization chamber 32 during the deposition stage, meeting the different pressure requirements of the deposition and etching stages. One set of hardware can cover multiple aspect ratio process windows.

[0059] It is worth noting that the structure of the second pressure regulating component 19 is preferably consistent with the structure of the first pressure regulating component 18, which will not be described again here.

[0060] In some embodiments, such as Figure 1 As shown, the pneumatic drive component two includes a support box two, a piston component four, and a connecting rod two.

[0061] In some embodiments, such as Figure 1 As shown, the second support box is fixedly disposed within the adjustment cavity 33 and contains the second sub-adjustment cavity. The side wall of the second support box facing the piston component 6 has a through hole. In some specific embodiments, the second support box and the first support box 13 are fixed together. The second support box and the first support box 13 are symmetrically arranged about the vertical centerline of the pre-pressure component 3.

[0062] In some embodiments, such as Figure 1 As shown, the piston component four is movably disposed within the support box two along the first direction and is in sliding contact with the inner wall of the support box two. The shape of the piston component four is adapted to the inner cavity shape of the support box two, and both can be a folded cylindrical structure or a rectangular structure. The sliding contact arrangement can achieve better sealing.

[0063] In some embodiments, such as Figure 1 As shown, the piston component four divides the inner cavity of the support box two into a gas storage chamber two and a movable chamber two; the gas storage chamber two is connected to the etching gas pipe 10 through the air inlet pipe two, and is connected to the connecting pipe two 11 through the air outlet pipe two. The central axis of the air outlet end of the air inlet pipe two and the central axis of the air inlet end of the air outlet pipe two are arranged on the same vertical line.

[0064] In some embodiments, such as Figure 1As shown, the second connecting rod movably passes through the second through hole, with one end fixed to the side wall of the fourth piston and the other end fixed to the side wall of the first piston 6, so that the fourth piston and the second connecting rod can move the first piston 6 toward or away from the second pre-compression chamber 32. In this embodiment, the shape and function of the second connecting rod are the same as those of the first connecting rod 15, and will not be described again here.

[0065] In some embodiments, such as Figure 1 The pneumatic drive component two further includes a sealing ring four. The sealing ring four is fixed to the inner wall of the through hole two and movably sleeved outside the connecting rod two to seal the sub-adjustment cavity two. The function and material of the sealing ring four are the same as those of the sealing ring three 16, and will not be described again here.

[0066] In some embodiments, such as Figure 1 As shown, the pneumatic drive component two further includes an elastic connector two; the elastic connector two is wound around the outer wall of the connecting rod two, one end of which is fixed to the outer wall of the support box two, and the other end extends along the first direction and is fixed to the side wall of the piston component one 6. The shape and function of the elastic connector two are the same as those of the elastic connector one 17, and will not be described again here.

[0067] In some embodiments, such as Figure 1 As shown, the pre-adjustable Bosch process semiconductor processing equipment further includes a sealing ring 7 and a sealing ring 9; the shapes of both the sealing ring 7 and the sealing ring 9 are preferably annular structures. The materials of both the sealing ring 7 and the sealing ring 9 are preferably perfluoroether rubber or filled polytetrafluoroethylene that are resistant to corrosion by fluorine-based and oxygen-based etching gases.

[0068] In some embodiments, such as Figure 1 As shown, the sliding sidewall of the piston component 6 has an annular groove extending circumferentially in a ring-shaped structure. The groove cavity of the annular groove is preferably annular. The sealing ring 7 is arranged in the annular groove and is in sliding contact with the sliding sidewall of the pre-pressure component 3.

[0069] The sealing ring 7 is confined within the annular groove 1, which not only prevents the sealing ring 7 from circumferentially torturing or axially shifting when the piston 6 reciprocates, but also allows the sealing ring 7 to undergo slight radial deformation and rebound after being compressed, so that it always adheres tightly to the inner wall of the pre-pressure component 3, ensuring the long-term airtightness of the first pre-pressure chamber 31.

[0070] In some embodiments, such as Figure 1As shown, the sliding sidewall of the piston component 2 8 has an annular groove 2 extending circumferentially in a ring-shaped structure. The cavity of the annular groove 2 is preferably annular. The sealing ring 2 9 is arranged within the annular groove 2 and is in sliding contact with the sliding sidewall of the pre-pressure component 3. The annular groove 2 circumferentially limits the sealing ring 2 9, preventing the sealing component from tilting, rolling, or being squeezed out when the piston component 2 8 reciprocates, ensuring that the boundary of the second pre-pressure chamber 32 is always tight and leak-proof.

[0071] In some embodiments, such as Figure 1 As shown, the pre-adjustable Bosch process semiconductor processing equipment also includes pressure detection element 4 and pressure detection element 12.

[0072] In some embodiments, such as Figure 1 As shown, the pressure detection element 4 and the pressure detection element 12 are respectively disposed in the first pre-pressure chamber 31 and the second pre-pressure chamber 32. The pressure detection element 4 is used to detect the air pressure in the first pre-pressure chamber 31, and the pressure detection element 12 is used to detect the air pressure in the second pre-pressure chamber 32.

[0073] In this embodiment, the pressure sensing point is placed directly in the first pre-pressure chamber 31 and the second pre-pressure chamber 32 during the pressure regulation action. The detected value is the actual gas pressure in the first pre-pressure chamber 31 and the second pre-pressure chamber 32, rather than the indirect pressure of the remote pipeline or gas source. The data has zero lag and no pipe resistance attenuation. The two pressures are fed back to the control system in real time, which can verify whether the displacement of piston 6 or piston 8 has reached the target volume, and can also dynamically correct the fine adjustment of pressure regulator 18 and pressure regulator 19, forming a closed-loop control of "detection, pressure regulation, and re-detection". At the same time, it can trigger an alarm in time when there is an abnormal pressure difference between the first pre-pressure chamber 31 and the second pre-pressure chamber 32, sealing failure, or gas residue.

[0074] In some embodiments, such as Figure 1 As shown, the pre-adjustable Bosch process semiconductor processing equipment also includes several regulating valves 22. These regulating valves 22 are respectively disposed on the first connecting tube 2, the deposition gas tube 5, the etching gas tube 10, and the second connecting tube 11, for controlling the on / off states of the first connecting tube 2, the deposition gas tube 5, the etching gas tube 10, and the second connecting tube 11.

[0075] By using independent regulating valves 22 distributed on each branch, the supply of etching gas and deposition gas and the timing of their introduction into the reaction chamber 1 are precisely controlled, achieving process decoupling of "gas supply, pressure preparation, gas supply, and cut-off". Specifically, during the deposition stage, the etching gas pipe 10 and connecting pipe 21 on the etching side are closed, while the deposition gas pipe 5 and connecting pipe 12 on the deposition side are opened, allowing the first pre-pressure chamber 31 to directly supply gas to the reaction chamber 1. At the same time, the second pre-pressure chamber 32 on the etching side is safely pressure-prepared under the cut-off of the regulating valve 22, preventing the two gas lines from prematurely converging and interfering with each other. When switching processes, the deposition gas pipe 5 or etching gas pipe 10 can be closed first, followed by the connecting pipe 12 or connecting pipe 21, leaving the gas in the corresponding first pre-pressure chamber 31 or second pre-pressure chamber 32 instead of a dead end in the pipeline, providing a pressure source for subsequent pneumatic drive.

[0076] In some embodiments, the semiconductor processing equipment can be a high aspect ratio etching equipment such as inductively coupled plasma etching equipment or reactive ion etching equipment, or it can be an ashing and resist removal equipment or an atomic layer deposition equipment. As long as the process involves the periodic alternation of two or more gases, this pre-pressure regulating structure can be used to complete the pressure matching before the gas enters the reaction chamber 1, so as to avoid pressure shock during switching.

[0077] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the present invention. Furthermore, the present invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A pre-adjustable Bosch process semiconductor processing apparatus, characterized in that, It includes connecting tube 1, pre-pressure component, deposition gas tube, etching gas tube, connecting tube 2, piston component 1 and piston component 2; The pre-pressure component is provided with a gas-containing cavity; Both piston component one and piston component two are movably disposed within the gas receiving cavity, dividing the gas receiving cavity into a first pre-compression cavity, a second pre-compression cavity, and an adjustment cavity; the first pre-compression cavity is connected to the deposition gas pipe and is also connected to the reaction chamber via the connecting pipe one; the second pre-compression cavity is connected to the etching gas pipe and is also connected to the reaction chamber via the connecting pipe two; the adjustment cavity is located between the first pre-compression cavity and the second pre-compression cavity. The piston moves in the first direction within the gas receiving cavity to adjust the gas pressure in the first pre-pressure cavity to a preset pressure by adjusting the volume of the first pre-pressure cavity. The piston component 2 moves in the first direction within the gas receiving cavity to adjust the gas pressure in the second pre-pressure cavity to a preset pressure 2 by adjusting the volume of the second pre-pressure cavity.

2. The pre-adjustable voltage Bosch process semiconductor processing apparatus according to claim 1, characterized in that, It also includes pneumatic drive components; The driving end of the pneumatic drive component one is connected to the piston component two. The pneumatic drive component one includes a sub-adjustment chamber one, and an air inlet pipe one and an air outlet pipe one that connect the sub-adjustment chamber one. The air inlet pipe one is connected to the deposited gas pipe, and the air outlet pipe one is connected to the connecting pipe one, so that the air pressure in the sub-adjustment chamber one and the first pre-pressure chamber are consistent. The piston component two is driven to move toward or away from the first pre-pressure chamber by the pressure difference between the first pre-pressure chamber and the second pre-pressure chamber, thereby adjusting the volume of the second pre-pressure chamber to make the air pressure in it consistent with the air pressure in the first pre-pressure chamber.

3. The pre-adjustable voltage Bosch process semiconductor processing apparatus according to claim 2, characterized in that, It also includes a pressure regulating component 1, which is disposed on the pneumatic drive component 1. The pressure regulating component 1 is used to regulate the air pressure in the sub-regulating chamber 1 so that the sub-regulating chamber 1 and the second pre-pressure chamber form a pressure difference and drive the piston component 2 to move toward or away from the first pre-pressure chamber, thereby readjusting the volume of the second pre-pressure chamber after pressure adjustment so that its air pressure is adjusted to the preset pressure 2.

4. The pre-adjustable voltage Bosch process semiconductor processing apparatus according to claim 2, characterized in that, The pneumatic drive component includes: A support box 1 is fixedly disposed in the adjustment cavity and has a sub-adjustment cavity 1 disposed therein. The side wall of the support box 1 facing the piston component 2 is provided with a through hole 1. Piston 3 is movably disposed within the support box 1 along the first direction and is slidably contacted with the inner sidewall of the support box 1. Piston 3 divides the inner cavity of the support box 1 into a gas storage chamber 1 and a movable chamber 1. The gas storage chamber 1 is connected to the deposited gas pipe through the inlet pipe 1 and to the connecting chamber pipe 1 through the outlet pipe 1. Connecting rod one movably passes through the through hole one, with one end fixed to the side wall of piston three and the other end fixed to the side wall of piston two, so that piston two can be moved toward or away from the first pre-compression chamber by piston three and connecting rod one.

5. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 4, characterized in that, The pneumatic drive component one also includes a sealing ring three; The sealing ring three is fixed to the inner wall of the through hole one and is movably sleeved on the outside of the connecting rod one, so as to seal the sub-adjustment cavity one.

6. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 4, characterized in that, The pneumatic drive component one also includes an elastic connector one; The elastic connector is wound around the outer wall of the connecting rod, with one end fixed to the outer wall of the support box and the other end extending along the first direction and fixed to the side wall of the piston.

7. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 1, characterized in that, It also includes pneumatic drive component two; The driving end of the second pneumatic drive component is connected to the first piston component. The second pneumatic drive component includes a second sub-adjustment chamber, and an inlet pipe and an outlet pipe that connect the second sub-adjustment chamber. The inlet pipe is connected to the etching gas pipe, and the outlet pipe is connected to the connecting pipe, so that the air pressure in the second sub-adjustment chamber and the second pre-pressure chamber are consistent. The piston component is driven to move toward or away from the second pre-pressure chamber by the pressure difference between the second pre-pressure chamber and the first pre-pressure chamber, thereby adjusting the volume of the first pre-pressure chamber to make the air pressure in it consistent with the air pressure in the second pre-pressure chamber.

8. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 7, characterized in that, It also includes pressure regulating component two; The second pressure regulating component is disposed on the second pneumatic drive component. The second pressure regulating component is used to regulate the air pressure in the second sub-regulating chamber so that the second sub-regulating chamber and the first pre-pressurization chamber form a pressure difference, thereby driving the first piston component to move toward or away from the second pre-pressurization chamber, thereby readjusting the volume of the first pre-pressurization chamber after pressure adjustment so that its air pressure is adjusted to the preset pressure.

9. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 7, characterized in that, The second pneumatic drive component includes: Support box 2 is fixedly disposed in the adjustment cavity and has the sub-adjustment cavity 2 disposed therein. The side wall of support box 2 facing the piston component 1 is provided with through hole 2. Piston component four is movably disposed within the support box two along the first direction and is slidably contacted with the inner sidewall of the support box two. Piston component four divides the inner cavity of the support box two into a gas storage chamber two and a movable chamber two. The gas storage chamber two is connected to the etching gas pipe through the gas inlet pipe two and to the connecting chamber pipe two through the gas outlet pipe two. Connecting rod two movably passes through the through hole two, with one end fixed to the side wall of piston component four and the other end fixed to the side wall of piston component one, so that piston component four and connecting rod two can move piston component one toward or away from the second pre-compression chamber.

10. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 9, characterized in that, The pneumatic drive component two also includes a sealing ring four; The sealing ring four is fixed to the inner wall of the through hole two and is movably sleeved on the outside of the connecting rod two, so as to seal the sub-adjustment cavity two.

11. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 9, characterized in that, The second pneumatic drive component also includes a second elastic connector; The second elastic connector is wound around the outer wall of the second connecting rod, with one end fixed to the outer wall of the second support box and the other end extending along the first direction and fixed to the side wall of the first piston component.

12. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 1, characterized in that, It also includes sealing ring one and sealing ring two; The piston component has an annular groove on its sliding sidewall that extends circumferentially in a ring-shaped structure. The sealing ring is disposed in the annular groove and is in sliding contact with the sliding sidewall of the pre-pressure component. The piston component 2 has an annular groove 2 recessed on its sliding sidewall, which extends circumferentially in a ring-shaped structure. The sealing ring 2 is disposed in the annular groove 2 and is in sliding contact with the sliding sidewall of the pre-pressure component.

13. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 1, characterized in that, It also includes pressure testing component one and pressure testing component two; The pressure detection element one and the pressure detection element two are respectively disposed in the first pre-pressure chamber and the second pre-pressure chamber. The pressure detection element one is used to detect the air pressure in the first pre-pressure chamber, and the pressure detection element two is used to detect the air pressure in the second pre-pressure chamber.

14. The pre-adjustable Bosch process semiconductor processing apparatus according to claim 1, characterized in that, It also includes several regulating valves; Several regulating valves are respectively disposed on the first connecting tube, the deposition gas tube, the etching gas tube, and the second connecting tube to control the on / off state of the first connecting tube, the deposition gas tube, the etching gas tube, and the second connecting tube.

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