Workpiece handling robot

Abstract

Provided is a workpiece handling robot capable of gripping a thin plate-shaped workpiece even without a pump for vacuum suction and a ventilation flow path inside the robot. A workpiece handling robot (A1) includes a support body (1) that supports a workpiece (W), and a deformable pad (2) disposed on the support body (1). The deformable pad (2) has a pedestal portion (21) and a ring-shaped pad portion (22) that is connected to an outer peripheral portion of the pedestal portion (21) and expands as it goes upward and is capable of elastic deformation. The support body (1) has a first upper surface (1a) and a first recessed portion (13) recessed from the first upper surface (1a) and used to mount the pedestal portion (21), and the support body (1) does not have a ventilation flow path that communicates with the first recessed portion (13).

Description

Technical Field

[0001] This disclosure relates to a workpiece handling robot for handling thin sheet-like workpieces such as substrates. Background Technology

[0002] Handling devices for thin plate-shaped workpieces such as glass substrates used in the manufacture of liquid crystal displays and semiconductor wafers used in the manufacture of semiconductors are configured, for example, to include a hand equipped with a vacuum suction function utilizing negative pressure, serving as an end effector of a robot (see, for example, Patent Document 1). As shown in that document, the hand equipped with vacuum suction function has multiple suction pads on its upper surface, allowing selection between a state where negative pressure is applied and a state where negative pressure is not applied. The plate-shaped workpiece placed on the hand is held in close contact with the suction pads by applying negative pressure using a pump. In this state, high-speed handling is possible without the workpiece slipping from the hand.

[0003] However, when using the aforementioned conventional hand with vacuum adsorption capabilities, a separate pump is required for vacuum adsorption. Furthermore, air piping (airflow path) for vacuum suction via the pump, and valves for switching the negative pressure state, need to be accommodated within the robot's limited space. Therefore, the structure for vacuum adsorption within the robot becomes complex.

[0004] In addition, new semiconductor packaging technologies such as FOPLP (Fan-Out Panel Level Packaging) have attracted much attention in recent years. In FOPLP processing, in addition to the glass substrate used in conventional FPD (Flat Panel Display), resin-molded substrates are sometimes used. As the size of resin-molded substrates increases, they become irregularly shaped like the surface of water. In conventional grippers with suction pads, if the suction pads do not make sufficient contact with the substrate, air leakage reduces the vacuum pressure in the branch flow path, sometimes resulting in insufficient gripping force. This reduced gripping force causes substrate (workpiece) shifting, slippage, or device shutdown due to suction errors, becoming a factor affecting quality and productivity. Furthermore, in robotic grippers used in vacuum environments, it is difficult to properly grip workpieces because the aforementioned vacuum-based suction gripping of workpieces cannot be performed.

[0005] Prior art literature

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2008-132541 Summary of the Invention

[0008] This disclosure was developed under such circumstances, and the main objective is to provide a workpiece handling robot that can grasp thin plate-shaped workpieces even without a pump for vacuum adsorption or an airflow path inside the robot.

[0009] To address the aforementioned issues, the following technical means are employed in this disclosure.

[0010] The workpiece handling robot provided by this disclosure includes: a support body for supporting a workpiece, and a deformable pad disposed on the support body, the deformable pad having a base portion and an annular pad portion connected to the outer periphery of the base portion and expanding upwards to be elastically deformable, the support body having a first upper surface and a first recess recessed from the first upper surface for mounting the base portion, the support body having no air passage communicating with the first recess.

[0011] In a preferred embodiment, the workpiece handling robot further comprises: a plate member disposed in the first recess, the plate member having: a second upper surface and a second recess recessed from the second upper surface, at least a portion of the pedestal portion being received in the second recess.

[0012] In a preferred embodiment, the support body is made of a conductive material, and the plate member is made of a material with a higher resistance value than the support body.

[0013] In a preferred embodiment, the pedestal portion is fixed to the plate member by an adhesive.

[0014] In a preferred embodiment, it is used in a vacuum environment.

[0015] Invention Effects

[0016] According to the workpiece handling robot disclosed herein, during workpiece handling, the pad deforms downwards due to the workpiece's own weight, bringing the workpiece into close contact with the front peripheral edge of the pad. Therefore, workpieces can be handled without using a vacuum suction pump or piping attached to the pump. Furthermore, by appropriately positioning the deformable pad on the support, even when the workpiece has an irregular, uneven, curved shape, the pad portion can deform to follow the workpiece's curvature. Thus, the workpiece is completely in close contact with the front peripheral edge of the pad, and the workpiece is properly gripped by the deformable pad.

[0017] Other features and advantages of this disclosure will become apparent from the following detailed description with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a top view showing the workpiece handling robot according to the first embodiment of this disclosure.

[0019] Figure 2 It is along Figure 1 An enlarged sectional view of line II-II.

[0020] Figure 3 This illustrates the state of adsorption and gripping of the workpiece using deformable pads. Figure 2 The same sectional view.

[0021] Figure 4 This is a top view showing a workpiece handling robot according to a first variation of the first embodiment of the present disclosure.

[0022] Figure 5 It is along Figure 4 An enlarged sectional view of the VV line.

[0023] Figure 6 This is a partially enlarged top view showing a workpiece handling robot according to a second variation of the first embodiment of this disclosure.

[0024] Figure 7 It is along Figure 6 A sectional view along line VII-VII.

[0025] Figure 8 This is a partially enlarged cross-sectional view showing the workpiece handling robot according to the second embodiment of this disclosure, indicating that... Figure 2 The same cross-section.

[0026] Explanation of reference numerals in the attached figures

[0027] A1, A11, A12: Workpiece handling robot; 1: Support body; 1a: First upper surface; 13: First recess; 2: Deformation pad; 21: Base part; 22: Pad part; 3: Plate component; 3a: Second upper surface; 31: Second recess; 4: Adhesive; W: Workpiece. Detailed Implementation

[0028] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0029] The terms “first”, “second”, etc. in this disclosure are used as labels only and are not necessarily intended to indicate the order of these objects.

[0030] Figure 1 as well as Figure 2 The workpiece handling robot according to the first embodiment of this disclosure is shown. The workpiece handling robot A1 of this embodiment includes a support body 1 and a deformation pad 2.

[0031] Detailed illustrations are omitted, but the workpiece handling robot A1 is assembled into a handling robot for handling thin, plate-shaped workpieces W, such as substrates. In this embodiment, the support body 1 is a plate that holds the workpiece W and extends horizontally integrally from a base member connected to the arm end of the handling robot (not shown). The support body 1 has a base 11 and a pair of forks 12. The base 11 is fixed to the aforementioned base member of the handling robot. The pair of forks 12 are connected to each base 11 and extend bifurcatedly from the base 11 in plan view. The material of the support body 1 is not particularly limited, but it may be made of, for example, a high-rigidity, lightweight material such as aluminum alloy, ceramic material, or carbon fiber reinforced plastic. Furthermore, the handling robot equipped with the workpiece handling robot A1 can be used in an atmospheric environment or a vacuum environment, depending on the intended use.

[0032] like Figure 2 As shown, the support 1 has a first upper surface 1a facing upward and a first recess 13. The first upper surface 1a is a flat surface along the horizontal direction. The first recess 13 is recessed from the first upper surface 1a and is formed for mounting the base portion 21 of the deformation pad 2, which will be described later.

[0033] Deformation pads 2 grip the workpiece W, and multiple deformation pads 2 are arranged on the support body 1. In the illustrated example, multiple (5) deformation pads 2 are arranged in a straight line across the base 11 and one fork 12. Furthermore, the arrangement of the multiple deformation pads 2 is not limited to the illustrated example.

[0034] like Figure 2 As shown, the deformable pad 2 has a base portion 21 and a pad portion 22. The deformable pad 2 is integrally molded from a rubber material, for example. The deformable pad 2 has moderate elasticity. The material of the deformable pad 2 is not particularly limited, but it may be made of, for example, silicone rubber or fluororubber.

[0035] The pedestal portion 21 is approximately cylindrical, and its lower part is embedded in the first recess 13. A through hole 211 is formed in the center of the pedestal portion 21. The through hole 211 extends from the upper surface 21a of the pedestal portion 21 to the lower surface 21b in a vertical direction. A screw member 91 is inserted into the through hole 211. The pedestal portion 21 (deformation pad 2) is fixed to the fork portion 12 (support body 1) by means of the screw member 91. In this embodiment, the upper surface 21a of the pedestal portion 21 is a flat surface in the horizontal direction. Furthermore, the means of fixing the pedestal portion 21 (deformation pad 2) to the support body 1 is not limited to the means of using the screw member 91 described above; suitable means such as adhesive bonding can be used.

[0036] The pad portion 22 is connected to the outer periphery near the upper end of the pedestal portion 21 and is annular. The pad portion 22 has a relatively small thickness. As a result, the pad portion 22 can easily deform elastically and is flexible. The pad portion 22 expands and tilts upwards. The front peripheral edge 221 of the pad portion 22 is located above the upper surface 21a of the pedestal portion 21. In this embodiment, the pedestal portion 21 and the pad portion 22 are circular in plan view.

[0037] In this embodiment, as according to Figure 2 As is understood, the support 1 does not have an airflow path communicating with the first recess 13 where the pedestal portion 21 (deformation pad 2) is mounted. That is, the deformation pad 2 in this embodiment does not have the function of vacuum adsorption.

[0038] Figure 3 This figure shows an example of a state in which the workpiece W is held by the deformable pad 2. As can be understood from the figure, when the workpiece W is held by the deformable pad 2, the workpiece W approaches or abuts against the upper surface 21a of the pedestal portion 21. Regarding the pad portion 22, the workpiece W is in close contact with the front peripheral portion 221.

[0039] Next, the function of this embodiment will be explained.

[0040] The workpiece handling robot A1 includes a support body 1 for supporting a workpiece W and a deformable pad 2 disposed on the support body 1. The deformable pad 2 has a base portion 21 and a pad portion 22. The pad portion 22 is connected to the outer periphery of the base portion 21 and is annular. The pad portion 22 expands and tilts as it moves upward, and can elastically deform. The support body 1 has a first recess 13 for mounting the base portion 21. On the other hand, the support body 1 does not have an air passage communicating with the first recess 13.

[0041] Based on this structure, when the workpiece handling robot A1 handles the thin plate-shaped workpiece W, the workpiece W is supported by the support body 1. Here, as... Figure 3 As shown, the workpiece W is placed on the pad 22, and the pad 22 deforms downwards due to the weight of the workpiece W. Furthermore, the workpiece W is in close contact with the front peripheral edge 221 of the pad 22. Therefore, the workpiece handling robot A1 according to this embodiment can handle the workpiece W without using a vacuum suction pump or the piping attached to the pump. In addition, by appropriately arranging the deformation pads 2 (in this embodiment, multiple deformation pads 2) on the support 1, even if the workpiece W has an irregular, uneven, curved shape, the pad portion 22 of the deformation pad 2 can deform following the curved surface of the workpiece W. Thus, the workpiece W is in complete close contact with the front peripheral edge 221 of the pad 22, and the workpiece W is properly held by the deformation pads 2.

[0042] Furthermore, when the workpiece handling robot A1 is used in a vacuum environment, the workpiece W is in close contact with the front peripheral edge 221 of the pad 22 when the support body 1 supports the workpiece W. Here, a large frictional resistance is generated between the pad 22 and the workpiece W, which allows the pad 22 (deformable pad 2) to properly grip the workpiece W.

[0043] Figures 4-8 Modifications and other embodiments of the workpiece handling robot of this disclosure are shown. Furthermore, in these figures, elements identical or similar to those in the workpiece handling robot A1 of the above embodiments are labeled with the same reference numerals as in the above embodiments, and repeated descriptions are omitted. Additionally, the structures of the various modifications and components in each embodiment can be appropriately combined with each other without creating technical inconsistencies.

[0044] <First Variation>

[0045] Figure 4 as well as Figure 5 A first modification of the workpiece handling robot A1 is shown. The shape and configuration of the deformation pad 2 of the workpiece handling robot A11 in this modification are different from those of the workpiece handling robot A1 in the above embodiment.

[0046] In the workpiece handling robot A11, the deformable pad 2 extends along the direction of the fork 12 and is approximately rectangular in shape when viewed from above. In the workpiece handling robot A11, multiple deformable pads 2 are arranged on the support body 1. In the illustrated example, two deformable pads 2 are arranged in a straight line across the base 11 and one fork 12. Alternatively, two deformable pads 2 can be arranged in a straight line across the base 11 and the other fork 12. Furthermore, unlike the illustrated example, it could also be... Figure 4 The structure consists of a long deformable pad 2 arranged across the base 11 and the fork 12. Furthermore, as understood from the above embodiments and this modified example, the top view shape of the deformable pad 2 (base portion 21 and pad portion 22) can be varied in many ways.

[0047] In this modified example, the pedestal portion 21 and the pad portion 22 are approximately rectangular in shape when viewed from above. A plurality of through holes 211 are formed at intervals along the long side of the pedestal portion 211. A screw member 91 is inserted into each of the plurality of through holes 211. The pedestal portion 21 (deformation pad 2) is fixed to the fork portion 12 (support body 1) by means of the plurality of screw members 91 inserted into the plurality of through holes 211.

[0048] In this modified example, when the workpiece handling robot A11 handles the thin plate-shaped workpiece W, the pad portion 22 also flexes and deforms downwards due to the weight of the workpiece W, and the workpiece W comes into close contact with the front peripheral edge 221 of the pad portion 22. Therefore, according to the workpiece handling robot A11 of this modified example, the workpiece W can be handled by adsorbing and gripping without using a vacuum suction pump or the piping attached to the pump. In addition, by properly arranging the deformation pads 2 (in this modified example, multiple deformation pads 2) on the support body 1, even if the workpiece W has an irregular, uneven, curved shape, the pad portion 22 of the deformation pad 2 can deform to follow the curved surface of the workpiece W. As a result, the workpiece W comes into close contact with the front peripheral edge 221 of the pad portion 22, and the workpiece W is properly gripped by the deformation pads 2.

[0049] Furthermore, when the workpiece handling robot A11 is used in a vacuum environment, when the workpiece W is supported by the support body 1, the workpiece W is also in close contact with the front peripheral edge 221 of the pad 22. Here, a large frictional resistance is generated between the pad 22 and the workpiece W, which allows the pad 22 (deformable pad 2) to properly grip the workpiece W.

[0050] <Second Variation>

[0051] Figure 6 as well as Figure 7 A second modification of the workpiece handling robot A1 is shown. The shape of the deformable pad 2 of the workpiece handling robot A12 in this modification is different from that of the workpiece handling robot A1 in the above embodiment.

[0052] In the workpiece handling robot A12, the front end of the base portion 21 of the deformable pad 2 (including the portion containing the upper surface 21a) is designed with a partially cut-out shape. Therefore, the upper surface 21a of the base portion 21 is partially cut out. Figure 6 In the diagram, the area formed on the upper surface 21a is shaded for clarity. Furthermore, the method by which the front end of the pedestal portion 21 is partially cut is not limited to the example shown; for example, it could also be formed by creating multiple grooves.

[0053] In this modified example, when the workpiece handling robot A12 handles the thin plate-shaped workpiece W, the pad portion 22 also flexes and deforms downwards due to the weight of the workpiece W, and the workpiece W comes into close contact with the front peripheral portion 221 of the pad portion 22. Therefore, according to the workpiece handling robot A12 of this modified example, the workpiece W can be handled by adsorbing and gripping without using a vacuum suction pump or the piping attached to the pump. In addition, by properly arranging the deformation pads 2 (in this modified example, multiple deformation pads 2) on the support body 1, even if the workpiece W has an irregular, uneven, curved shape, the pad portion 22 of the deformation pad 2 can deform to follow the curved surface of the workpiece W. As a result, the workpiece W comes into close contact with the front peripheral portion 221 of the pad portion 22 as a whole, and the workpiece W is properly gripped by the deformation pads 2.

[0054] Furthermore, in the workpiece handling robot A12, the upper surface 21a of the pedestal portion 21 is partially cut out. According to this structure, when the workpiece W is gripped by the deformation pad 2, if the workpiece W abuts against the upper surface 21a of the pedestal portion 21, a greater frictional resistance can be generated relative to the workpiece W. Therefore, according to this modified example, an increase in the gripping force of the workpiece W can be expected.

[0055] Furthermore, when the workpiece handling robot A12 is used in a vacuum environment, when the workpiece W is supported by the support body 1, the workpiece W is also in close contact with the front peripheral portion 221 of the pad 22. Here, a large frictional resistance is generated between the pad 22 and the workpiece W, which allows the pad 22 (deformable pad 2) to properly grip the workpiece W.

[0056] Figure 8 The workpiece handling robot A2 according to the second embodiment of this disclosure is shown. Figure 8 This is a partially enlarged cross-sectional view showing the workpiece handling robot A2 according to this embodiment, indicating its relationship with... Figure 2 The same cross-section.

[0057] The workpiece handling robot A2 also includes a plate member 3 and an adhesive 4. The plate member 3, used to mount the deformation pad 2 (base portion 21), is disposed in the first recess 13 of the support body 1. In this modified example, the first recess 13 of the support body 1 has increased planar dimensions and depth compared to the first recess 13 in the above embodiments, etc. In the illustrated example, the plate member 3 is entirely accommodated in the first recess 13.

[0058] The plate member 3 has a second upper surface 3a facing upwards and a second recess 31. The second upper surface 3a is a flat surface along the horizontal direction. The second recess 31 is recessed from the second upper surface 3a and is formed for mounting the pedestal portion 21 of the deformation pad 2. At least a portion of the pedestal portion 21 is accommodated in the second recess 31. In this embodiment, the lower part of the pedestal portion 21 is embedded in the second recess 31. In this embodiment, the deformation pad 2 (pedestal portion 21 and pad portion 22) and the plate member 3 are circular in plan view. The plate member 3 overlaps entirely with the deformation pad 2 in plan view.

[0059] Adhesive 4 is located between the second recess 31 (plate member 3) and the pedestal portion 21. Adhesive 4 is in contact with a portion of the lower surface 21b and side surface of the pedestal portion 21. The pedestal portion 21 is fixed to the plate member 3 via adhesive 4.

[0060] Through holes 32 are formed at appropriate locations on the plate member 3. In the illustrated example, multiple through holes 32 are formed near the periphery of the plate member 3. The through holes 32 extend from the second upper surface 3a of the plate member 3 in a vertical direction to the lower surface. Screw members 92 are inserted into each through hole 32. The plate member 3 is fixed to the fork portion 12 (support body 1) by means of the multiple screw members 92.

[0061] In this embodiment, the support 1 is made of a conductive material. Examples of such conductive materials include aluminum alloy and carbon fiber reinforced plastic. The plate member 3 is made of a material with a higher resistivity than the support 1. Examples of materials used to make the plate member 3 include semiconductor materials such as silicon (Si) and carbon fiber reinforced plastic. Furthermore, in this embodiment, the deformation pad 2 and the adhesive 4 are made of conductive materials. Examples of materials used to make the conductive deformation pad 2 include conductive silicone rubber containing fillers.

[0062] In this embodiment, when the workpiece handling robot A2 is used to handle a thin plate-shaped workpiece W, the pad portion 22 deforms downwards due to the weight of the workpiece W, and the workpiece W comes into close contact with the front peripheral portion 221 of the pad portion 22. Therefore, the workpiece handling robot A2 according to this embodiment can handle the workpiece W without using a vacuum suction pump or the piping attached to the pump. In addition, by properly arranging the deformation pads 2 (in this embodiment, there are multiple deformation pads 2) on the support body 1, even if the workpiece W has an irregular, uneven, curved shape, the pad portion 22 of the deformation pad 2 can deform to follow the curved surface of the workpiece W. As a result, the workpiece W comes into close contact with the front peripheral portion 221 of the pad portion 22, and the workpiece W is properly held by the deformation pads 2.

[0063] Furthermore, when the workpiece handling robot A2 is used in a vacuum environment, the workpiece W is in close contact with the front peripheral edge 221 of the pad 22 when the support body 1 supports the workpiece W. Here, a large frictional resistance is generated between the pad 22 and the workpiece W, which allows the pad 22 (deformable pad 2) to properly grip the workpiece W.

[0064] The workpiece handling robot A2 includes a plate component 3, and a deformable pad 2 is mounted on a support body 1 via the plate component 3. More specifically, the deformable pad 2, made of rubber material, is fixed to the plate component 3 by an adhesive 4, and the plate component 3, which is harder than the deformable pad 2, is fixed to the support body 1. With this structure, when replacing the deformable pad 2, only the hard plate component 3 needs to be removed from the support body 1, thus making the replacement of the deformable pad 2 highly operable.

[0065] In this embodiment, the support 1 is made of a conductive material. Furthermore, the plate member 3 is made of a material with a higher resistivity than the support 1. This structure prevents sparks from forming between the workpiece W and the support 1 when the workpiece W is placed on the support 1 (deformation pad 2) if the workpiece W is charged. Additionally, since the deformation pad 2 and the adhesive 4 are made of conductive materials, the resistivity can be adjusted throughout the plate member 3, the deformation pad 2, and the adhesive 4, increasing the freedom of material selection for these components.

[0066] The workpiece handling robot disclosed herein is not limited to the embodiments described above. The specific structure of each part of the workpiece handling robot disclosed herein can be freely modified in various ways.

Claims

1. A workpiece handling robot, characterized in that, have: Support body, supporting the workpiece; and Deformation pads are disposed on the support body. The deformable pad has a base portion and an annular pad portion, the pad portion being connected to the outer periphery of the base portion and expanding upwards, thus being elastically deformable. The support body has: a first upper surface and a first recess recessed from the first upper surface for mounting the pedestal portion. The support body has no airflow path communicating with the first recess.

2. The workpiece handling robot according to claim 1, wherein, The workpiece handling robot also includes: a plate component disposed in the first recess. The plate member has a second upper surface and a second recess recessed from the second upper surface. At least a portion of the pedestal portion is accommodated in the second recess.

3. The workpiece handling robot according to claim 2, wherein, The support is made of a conductive material. The plate component is made of a material with a higher resistivity than the support body.

4. The workpiece handling robot according to claim 3, wherein, The pedestal portion is fixed to the plate component by an adhesive.

5. The workpiece handling robot according to any one of claims 1 to 4, wherein, The workpiece handling robot is used in a vacuum environment.

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