Wafer back surface inspection fixture and wafer inspection apparatus

Abstract

The application relates to a wafer back surface detection fixing device and a wafer detection equipment. When the wafer is subjected to back surface detection, the supporting ring of the wafer assembly is carried on the first abutting part, and the wafer body is located in the range of the liquid accumulation groove. After water is injected into the liquid accumulation groove, the optical detection device 20 at the lower part can realize clear imaging on the back surface of the wafer body through the light transmission area. The first pressing part of the pressing mechanism cooperates with the first abutting part to press and fix the supporting ring, so that the adsorption hole does not need to be arranged on the surface of the wafer carrier, thereby completely avoiding the problem that the water in the liquid accumulation groove is sucked into the adsorption hole after overflowing, and the wafer fixing fails. Moreover, the light transmission area and the liquid film correspond to the whole back surface of the wafer body, the optical detection device 20 can successfully collect the image of any area on the back surface of the wafer body, and the liquid film keeps the position fixed during the detection process. Therefore, the wafer back surface detection fixing device can significantly improve the reliability of wafer fixing and the stability during the detection process.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection technology, and in particular to a fixing device and wafer inspection equipment for back-side inspection of wafers. Background Technology

[0002] In wafer fabrication, defect detection is required at multiple production stages, with back-side internal defect detection being a crucial step. Typically, a support medium, such as a blue film, is attached to the back of the wafer during processing. The high surface roughness of this support medium makes it difficult to clearly detect internal defects on the back side. To address this issue, two approaches exist: one is to create a bottom-transparent groove on the wafer support platform and fill it with water; the other is to directly flip the wafer so its back side is facing up and place it on a standard wafer front-side surface defect detection platform, utilizing a liquid-laden optical inspection module for detection. When the wafer is placed on the platform, the support medium comes into contact with water, altering its optical properties and allowing light to penetrate the blue film and act on the back side and interior of the wafer, thus meeting the requirements for back-side internal defect detection. However, conventional wafer front-side appearance defect inspection stages typically have adsorption holes for adsorbing and fixing the wafer. For the aforementioned approach one (e.g., CN120847135A), if a large groove and liquid supply / return interface are created on the wafer front-side appearance defect inspection stage, or if a vacuum adsorption hole is created on a stage with a liquid supply / return interface and groove, water overflowing from the groove can easily be sucked into the adsorption hole, causing wafer fixation failure and affecting normal inspection. For the aforementioned approach two (e.g., CN120741510A), the liquid film area of ​​the liquid-bearing optical inspection module is extremely small, requiring continuous movement of the liquid film for inspection, resulting in low stability. Summary of the Invention

[0003] Based on this, it is necessary to provide a wafer backside inspection fixture and wafer inspection equipment that can simultaneously achieve stable fixation and stable inspection over a wide range of conditions.

[0004] A wafer backside inspection fixing device, the fixing device comprising a wafer stage and a holding mechanism;

[0005] A liquid accumulation tank and a first abutment are formed on one side of the wafer stage; the first abutment is arranged circumferentially along the outer side of the liquid accumulation tank and can support the support ring of the wafer assembly; the liquid accumulation tank is used to contain light-transmitting liquid to form a liquid film, and the bottom of the liquid accumulation tank has a light-transmitting area corresponding to the liquid accumulation tank.

[0006] The pressing mechanism includes a first pressing part, which can press the support ring onto the first abutting part;

[0007] The wafer stage and the holding mechanism can be combined to clamp and fix the wafer assembly, so as to seal the supporting medium of the wafer assembly to the liquid film, so that the optical inspection device can collect images of any area on the back of the wafer body through the light-transmitting area and the liquid film.

[0008] In one embodiment, a second abutment is formed at the top of the edge of the liquid accumulation tank. The second abutment is arranged in a closed ring shape and is distributed circumferentially along the liquid accumulation tank, and is capable of supporting the supporting medium.

[0009] In one embodiment, the height of the second abutment portion is greater than that of the first abutment portion.

[0010] In one embodiment, the pressing mechanism further includes a second pressing portion, which can press the supporting medium onto the second abutment portion to seal the liquid film between the supporting medium and the light-transmitting area.

[0011] In one embodiment, the lateral dimension of the liquid accumulation tank at least covers the area where the wafer body of the wafer assembly is located, and the lateral dimension of the light-transmitting area matches the liquid accumulation tank.

[0012] In one embodiment, the pressing mechanism includes a base and adsorption members. A plurality of adsorption members are assembled on the base. The adsorption members are capable of absorbing the support ring and placing and pressing the support ring against the first abutment portion. The base is provided with the first pressing portion.

[0013] In one embodiment, a portion of the adsorption element constitutes the first press-fit portion.

[0014] In one embodiment, a second abutment portion is formed at the top of the edge of the liquid accumulation tank. The second abutment portion is arranged circumferentially along the liquid accumulation tank and is capable of supporting the supporting medium.

[0015] The pressing mechanism further includes a pressure plate, which is assembled on the base, and a portion of the pressure plate forms a second pressing part, which can press the supporting medium onto the second abutment part.

[0016] In one embodiment, the pressure plate has an annular boss on the side facing away from the base, and the boss constitutes the second pressing part.

[0017] In one embodiment, the pressure plate has a clearance groove in the middle that is adapted to the wafer body.

[0018] In one embodiment, the pressure plate is capable of elastic expansion and contraction relative to the base along the axial direction of the pressure plate.

[0019] In one embodiment, a connecting seat is provided on the side of the pressure plate facing the base, and a guide post is fixedly provided on the connecting seat. The guide post is slidably assembled to the base along the axial direction of the pressure plate, and an elastic element is provided between the base and the connecting seat.

[0020] A wafer inspection device includes an optical inspection unit and a wafer backside inspection fixing device as described in any of the preferred embodiments above. The optical inspection unit is disposed on the side of the wafer stage facing away from the liquid accumulation tank opening, and the optical inspection unit is movable within the range of the light-transmitting area, and can acquire images of any area on the backside of the wafer body through the light-transmitting area and the liquid film.

[0021] In the aforementioned wafer backside inspection fixing device and wafer inspection equipment, during backside inspection of the wafer, the wafer assembly's support ring rests on the first abutment portion, while the wafer body is located within the liquid accumulation tank. After a transparent liquid is injected into the liquid accumulation tank, the optical inspection device below can achieve a clear image of the backside of the wafer body through the transparent area and the liquid film. The first pressing portion of the holding mechanism cooperates with the first abutment portion to press and fix the support ring, thus eliminating the need for adsorption holes on the wafer stage surface, thereby completely avoiding the problem of water overflowing from the liquid accumulation tank being sucked into the adsorption holes and causing wafer fixing failure. Moreover, the transparent area and the liquid film correspond to the entire backside of the wafer body, allowing the optical inspection device to successfully acquire images of any area on the backside of the wafer body, while the wafer body and the liquid film remain in a fixed position during the inspection process. Therefore, the aforementioned wafer backside inspection fixing device can significantly improve the reliability of wafer fixing and the stability during the inspection process. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a wafer backside inspection fixing device in one embodiment of the present invention;

[0024] Figure 2 for Figure 1 The diagram shows a partial structural schematic of the wafer stage and the holding mechanism in the wafer backside inspection fixture used to fix the wafer assembly.

[0025] Figure 3 for Figure 1 A schematic diagram of the wafer stage in the wafer backside inspection fixture shown;

[0026] Figure 4 for Figure 1 A schematic diagram of the holding mechanism in the wafer backside inspection fixture shown;

[0027] Figure 5 for Figure 4 The diagram shows a partial structure of the holding mechanism after omitting the multi-axis manipulator.

[0028] Figure 6 for Figure 5 A cross-sectional view of a portion of the wafer handling mechanism shown.

[0029] Figure 7 for Figure 5 A bottom view of the pressure plate in the wafer handling mechanism shown;

[0030] Figure 8 This is a schematic diagram of a wafer assembly in one embodiment of the present invention;

[0031] Figure 9 This is a schematic diagram of a partial structure of a wafer inspection device in one embodiment of the present invention;

[0032] Figure 10 for Figure 9 The bottom view of a partial structure of the wafer inspection equipment shown.

[0033] Explanation of reference numerals in the attached figures:

[0034] Wafer backside inspection fixture 10; wafer stage-100; liquid collection tank-101; first abutment part-110; second abutment part-120; pressing mechanism-200; first pressing part-210; second pressing part-220; base-230; adsorption element-240; pressure plate-250; clearance groove-251; connecting seat-252; guide post-523; elastic element-254; arc groove-255; multi-axis robot-260; wafer assembly-20; wafer body-21; support medium-22; support ring-23; optical inspection module-20. Detailed Implementation

[0035] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0040] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0041] Please see Figure 1 , Figure 8 , Figure 9 and Figure 10 The present invention provides a wafer backside inspection fixing device 10 and a wafer inspection device. The wafer inspection device includes the wafer backside inspection fixing device 10 and an optical inspection device 20.

[0042] The wafer backside inspection fixing device 10 is used to support and fix the wafer assembly 20 to be inspected. Typically, the wafer assembly 20 includes a wafer body 21, a support medium 22, and a support ring 23. The wafer body 21 is the core part, and the purpose of backside inspection is to detect whether there are defects such as scratches or microcracks on the back side of the wafer body 21. The support medium 22 can be a blue film, and the back side of the wafer body 21 is attached to the surface of the support medium 22. The support ring 23 can be an iron ring, which is arranged circumferentially around the wafer body 21 and is also attached to the surface of the support medium 22, thereby playing a role in shaping the wafer assembly 20 as a whole.

[0043] During back-side inspection, the wafer back-side inspection fixture 10 remains in a fixed position, while the optical inspection device 20 can move horizontally relative to the wafer back-side inspection fixture 10, thereby sequentially acquiring images of any area on the back side of the wafer body 21. By analyzing and processing the acquired image information, it can be determined whether there are defects on the back side of the wafer body 21.

[0044] Please refer to the following: Figure 2 and Figure 3 In one embodiment of the present invention, the wafer backside inspection fixing device 10 includes a wafer stage 100 and a holding mechanism 200.

[0045] A liquid accumulation tank 101 is formed on one side of the wafer stage 100. The liquid accumulation tank 101 is used to contain a light-transmitting liquid (such as pure water) to form a liquid film. Furthermore, the bottom of the liquid accumulation tank 101 has a light-transmitting area corresponding to the liquid accumulation tank 101. Specifically, the wafer stage 100 can adopt a split structure, formed by combining a frame and a light-transmitting plate, or it can be formed as a single piece. Light-transmitting holes (such as circular through holes) are formed on the frame, and the light-transmitting plate sealably covers the lower end of the light-transmitting holes. Thus, the inner surface of the light-transmitting plate and the wall of the light-transmitting hole together form the liquid accumulation tank 101, and the area where the light-transmitting plate is located constitutes the light-transmitting area.

[0046] The optical inspection device 20 is disposed on the back side of the wafer stage 100, specifically on the side facing away from the opening of the liquid accumulation tank 101. When the wafer assembly 20 is mounted on the wafer stage 100, the wafer body 21 is precisely located within the liquid accumulation tank 101, and the lower surface of the support medium 22 is in close contact with the liquid film within the liquid accumulation tank 101. This liquid film is typically made of pure water or other refractive index-matching liquids, which effectively improve the optical properties of the support medium 22 surface, allowing light to penetrate the support medium 22 with low attenuation and accurately act on the back side of the wafer body 21. Thus, the optical inspection device 20 disposed on the back side of the wafer stage 100 can clearly acquire images of any area on the back side of the wafer body 21 through the light-transmitting area and the liquid film, thereby enabling defect detection on the back side of the wafer body 21.

[0047] The lateral dimensions of the liquid accumulation tank 101 at least cover the area where the wafer body 21 of the wafer assembly 20 is located, and the lateral dimensions of the light-transmitting area match those of the liquid accumulation tank 101. The lateral dimensions of the light-transmitting area and the liquid accumulation tank 101 can be equal, or there can be slight differences within an acceptable range. This ensures that the light-transmitting area and the liquid film completely correspond to the wafer body 21, thereby achieving large-scale fixation of the wafer body 21 area and maintaining stable and consistent optical conditions throughout the entire detection area. Specifically, because the light-transmitting area and the liquid accumulation tank 101 are highly dimensionally corresponding, the optical path of the optical detection device 20 can penetrate the liquid film and the supporting medium 22 without obstruction and cover any position on the back side of the wafer body 21. Therefore, stable scanning of any area of ​​the wafer body 21 can be completed without frequent adjustments to the wafer body 21 and the liquid film, thereby effectively improving the accuracy and reliability of back-side detection.

[0048] Furthermore, the wafer stage 100 also has a first abutment portion 110, which is arranged circumferentially along the outer side of the liquid accumulation tank 101 and is capable of supporting the support ring 23 of the wafer assembly 20. The holding mechanism 200 includes a first pressing portion 210, which is capable of pressing the support ring 23 onto the first abutment portion 110.

[0049] After the wafer assembly 20 is placed on the wafer stage 100, its support ring 23 rests on the first abutment portion 110 and is pressed and fixed by the first pressing portion 210. It can be seen that the wafer stage 100 and the holding mechanism 200 can be combined to clamp and fix the wafer assembly 20, thus eliminating the need for adsorption holes on the surface of the wafer stage 100 to adsorb and fix the wafer assembly 20. This completely avoids the problem of water overflowing from the liquid accumulation tank 101 being sucked into the adsorption holes, causing wafer fixation failure.

[0050] In this embodiment, a second abutment portion 120 is formed at the top edge of the liquid accumulation tank 101. The second abutment portion 120 is arranged in a closed ring shape and is distributed circumferentially along the liquid accumulation tank 101, and is capable of supporting the support medium 22 of the wafer assembly 20. It can be understood that the second abutment portion 120 extends upward from the inner wall or edge of the liquid accumulation tank 101 (i.e., towards the support medium 22), thereby forming an annular support surface that is higher than the surface of the wafer stage 100.

[0051] When the wafer assembly 20 is supported on the wafer stage 100, the second abutment portion 120 directly contacts the lower surface of the support medium 22, keeping the support medium 22 under appropriate tension above the liquid accumulation tank 101. This ensures a more balanced force distribution on the wafer assembly 20 and improves the stability of the support. Furthermore, the tensioned support medium 22 adheres more tightly to the liquid film without wrinkles, effectively preventing air bubbles from remaining or being trapped at the interface between the liquid film and the support medium 22. This avoids air bubbles interfering with the optical path and ensures imaging quality.

[0052] Furthermore, a contact seal structure can be formed between the upper surface of the second contact portion 120 and the supporting medium 22. Since the second contact portion 120 is continuously arranged circumferentially, a closed annular sealing interface can be formed between it and the supporting medium 22, which significantly improves the sealing effect, prevents the liquid in the liquid accumulation tank 101 from overflowing or leaking to the side, and further prevents external air from entering below the liquid film, thereby minimizing the generation of air bubbles.

[0053] Furthermore, in this embodiment, the height of the second abutment portion 120 is greater than that of the first abutment portion 110. Here, height refers to the protrusion height of both portions relative to the upper surface of the wafer stage 100.

[0054] Through this highly differentiated design, when the wafer assembly 20 is placed on the wafer stage 100, the second abutment portion 120 contacts the lower surface of the support medium 22 before the first abutment portion 110 contacts the support ring 23. As the support ring 23 continues to descend and gradually approaches the first abutment portion 110, the second abutment portion 120 exerts an upward supporting effect on the support medium 22, thereby applying a certain tensile force to the support medium 22. This tensile effect can further tighten and flatten the support medium 22, which may otherwise be loose or have minor wrinkles, so that the support medium 22 maintains a uniform tension distribution above the liquid accumulation tank 101.

[0055] After the support medium 22 is fully tensioned, the positions of the multiple diced chips in the wafer body 21 are more stable, and they are less prone to displacement or vibration due to external vibration or liquid flow, significantly improving the overall support stability of the wafer assembly 20. At the same time, the uniformly tensioned support medium 22 adheres more tightly to the liquid film without air bubbles, which helps to further improve the imaging quality of optical inspection.

[0056] Furthermore, in this embodiment, the pressing mechanism 200 also includes a second pressing portion 220, which can press the support medium 22 onto the second abutment portion 120 to seal the liquid film between the support medium 22 and the light-transmitting area.

[0057] The annular second abutment portion 120 itself serves to support and initially seal the liquid film. Combined with the downward pressing force applied from above by the second pressing portion 220, the supporting medium 22 is more firmly clamped between the second abutment portion 120 and the second pressing portion 220. This vertical clamping method not only further enhances the sealing performance of the liquid film area but also significantly improves the overall stability of the wafer assembly 20. Even when the optical inspection device 20 performs rapid scanning or the wafer stage 100 experiences slight vibrations, the imaging quality remains unaffected.

[0058] In addition, please refer to the following: Figure 4 and Figure 5 In this embodiment, the pressing mechanism 200 includes a base 230 and an adsorption member 240. Multiple adsorption members 240 are assembled on the base 230. The adsorption members 240 can absorb the support ring 23 and place and press the support ring 23 on the first abutment part 110. The base 230 is provided with a first pressing part 210.

[0059] The base 230 can be mounted on the drive end of the multi-axis robot 260. The multi-axis robot 260 can be a three-axis Cartesian coordinate robot or a six-axis articulated robot, etc., which can drive the base 230 to achieve multi-degree-of-freedom movement in space. The adsorption component 240 can be a vacuum suction cup, usually with multiple (e.g., three or four) evenly arranged circumferentially to ensure the stability of the adsorption on the support ring 23.

[0060] Typically, the multiple adsorption components 240 can move closer together or further apart as needed, thus flexibly adapting to wafer assemblies 200 of different sizes. For example, when the diameter of the wafer assembly 20 is small, the adsorption components 240 can be slid radially inward to bring them closer together, accurately adsorbing the narrow area of ​​the support ring 23; while when the diameter of the wafer assembly 20 is large, the adsorption components 240 can be slid outward to move them further apart, thereby expanding the adsorption span and ensuring stable gripping of the support ring 23. This allows the holding mechanism 200 to be compatible with various sizes of wafer assemblies 20 (such as 8-inch, 12-inch, etc.), improving the versatility of the equipment.

[0061] Driven by the multi-axis robot 260, the suction member 240 places the sucked support ring 23 onto the first abutment portion 110. Then, by applying downward pressure through the first pressing portion 210 provided on the base 230, the support ring 23 is reliably clamped between the first abutment portion 110 and the first pressing portion 210. Thus, the holding mechanism 200 not only holds and fixes the wafer assembly 20 but also performs the function of transporting the wafer assembly 20. It is evident that the holding mechanism 200 can be integrated with the wafer transport mechanism, both sharing a base 230 and the multi-axis robot 260, thereby simplifying the overall structure of the equipment, reducing the number of parts, and lowering manufacturing costs.

[0062] It should be noted that in other embodiments, the holding mechanism 200 can also be provided separately. That is, the adsorption member 240 and the holding mechanism 200 are two independent components. For example, the holding mechanism 200 can be provided at the edge of the wafer stage 200 and is composed of holding members such as cylinders, motors, etc., driven by the driving elements, and grippers, etc. Each holding member can switch between a holding state and a releasing state under the drive of the driving elements. When the adsorption member 240 places the wafer assembly 20 on the wafer stage 100 and then withdraws, the holding mechanism 200 is driven to press the wafer assembly 20 onto the wafer stage 100.

[0063] Furthermore, in this embodiment, a portion of the adsorption member 240 constitutes a first pressing portion 210. That is, there is no need to provide an additional independent pressing part for the pressing mechanism 200, but a portion of the adsorption member 240 itself (e.g., the lower end face of the suction cup body) is used as the pressing surface.

[0064] After the adsorption member 240 picks up the support ring 23 and accurately places it on the first abutment portion 110, the adsorption member 240 does not immediately withdraw or release, but continues to maintain the adsorption state on the support ring 23. At the same time, it applies continuous pressure to the support ring 23 from above using its local structure (i.e., the first pressing portion 210), so that the support ring 23 is firmly pressed on the first abutment portion 110. In this way, the adsorption member 240 performs the function of pressing and fixing while completing the adsorption task, eliminating the need to design additional pressure claws or corresponding drive cylinders. This significantly simplifies the overall structure of the pressing mechanism 200, further reduces the number of parts, and lowers the assembly complexity and manufacturing cost.

[0065] Furthermore, since the adsorption component 240 does not need to be removed before the backside inspection is completed, the adsorption component 240 maintains stable contact with the support ring 23 throughout the entire inspection process. This avoids additional actions caused by midway removal and fundamentally prevents the risk that the adsorption component 240 may deviate from the support ring 23 at the moment of removal, further ensuring the positional accuracy of the wafer assembly 20.

[0066] It should be noted that in other embodiments, a pressure claw or similar structure may be separately provided on the base 230 as the first pressing part 210. After the adsorption member 240 places the support ring 23 on the first abutment part 110, it immediately withdraws, and then drives the pressure claw to press the support ring 23 onto the first abutment part 110.

[0067] Please refer to the following: Figure 6 and Figure 7 In this embodiment, the pressing mechanism 200 further includes a pressing plate 250, which is assembled on the base 230, and a portion of the pressing plate 250 forms a second pressing part 220, which can press the supporting medium 22 onto the second abutment part 120.

[0068] Specifically, the pressure plate 250 can be fixedly connected to the lower part or periphery of the base 230 and can rise and fall together with the base 230. When the base 230 is lowered to a certain height under the drive of the multi-axis robot 260, the second pressing part 220 on the pressure plate 250 can simultaneously press the support medium 22 onto the second abutment part 120.

[0069] As can be seen, the second pressing part 220 is also integrated into the base 230 of the pressing mechanism 200, so there is no need to set up a separate drive source or transmission mechanism for the second pressing part 220. While the adsorption member 240 (which also serves as the first pressing part 210) presses the support ring 23, the second pressing part 220 on the pressure plate 250 also automatically presses the support medium 22 as the base 230 presses down. In this way, the entire pressing mechanism 200 only requires one descent of the base 230 to simultaneously achieve the pressing of the support ring 23 and the sealing of the support medium 22, greatly simplifying the driving logic and structural complexity.

[0070] During assembly, the adsorption component 240 needs to pass through the pressure plate 250. To facilitate the installation of the adsorption component 240, the pressure plate 250 has arc-shaped grooves 255 corresponding to the position of each adsorption component 240, and each adsorption component 240 passes through the corresponding arc-shaped groove 255. The arc-shaped grooves 255 not only provide an adjustable installation path for the adsorption component 240, but also play a precise limiting and guiding role in its movement direction. The arc-shaped grooves 255 can guide the adsorption component 240 to move along an arc trajectory, ensuring that multiple adsorption components 240 always maintain a uniform circumferential distribution during the position adjustment process, avoiding skewness or jamming.

[0071] Specifically, in this embodiment, an annular boss is formed on the side of the pressure plate 250 facing away from the base 230, and the boss constitutes the second pressing part 220. The shape of the boss is adapted to the shape of the lower second abutment part 120. The boss can concentrate the pressing force on a specific annular area of ​​the supporting medium 22 with a smaller contact area, thereby generating higher local pressure and obtaining a more reliable sealing effect. Moreover, since the contact area between the two is narrow and uniform, it can avoid uneven force or excessive stretching of the supporting medium 22 that may be caused by pressing with a large-area flat plate, reducing the risk of damage to the supporting medium 22.

[0072] To prevent scratches on the surface of the supporting medium 22, the edges of the boss can be rounded. Using a boss as the second pressing part 220 has the advantages of simple structure and easy processing. Moreover, since the boss can be integrated with the pressure plate 250, there is no need to install additional sealing rings or pressure strips for sealing effect, which helps to further simplify the overall structure of the equipment.

[0073] Specifically, in this embodiment, a clearance groove 251 adapted to the wafer body 21 is formed in the middle of the pressure plate 250. The clearance groove 251 is preferably circular, and its diameter is generally set to be larger than the diameter of the wafer body 21, thereby forming a recessed space between the pressure plate 250 and the wafer assembly 20 to accommodate the wafer body 21. The clearance groove 251 can be a through groove extending through the pressure plate 250 along the thickness direction, or it can be a groove with a thickness greater than the thickness of the wafer body 21.

[0074] When the adsorption member 240 adsorbs the wafer assembly 20 and the support medium 22 abuts against the lower surface of the pressure plate 250, the wafer body 21 is located exactly in the clearance groove 251, thereby maintaining a non-contact state with the pressure plate 250. This effectively avoids the pressure plate 250 directly pressing on the wafer body 21 during the pressing process, which would damage the circuit structure on its surface or cause scratches.

[0075] Furthermore, in this embodiment, the pressure plate 250 is capable of elastic expansion and contraction relative to the base 230 along the axial direction of the pressure plate 250.

[0076] On the one hand, since wafer assemblies 20 of different specifications may vary in overall thickness, the pressure plate 250 can automatically adapt to thickness changes through elastic expansion and contraction, avoiding excessive compression or failure to contact the wafer assemblies 20 due to rigid connections, thus facilitating compatibility with wafer assemblies 20 of different thicknesses. On the other hand, after the adsorption member 240 picks up the wafer assembly 20 into place, the pressure plate 250 can also apply a continuous pre-tightening force to the wafer assembly 20, ensuring that the second pressing part 220 and the second abutting part 120 always maintain a tight fit, further improving the sealing effect and fixing reliability. In addition, elastic expansion and contraction can also play a buffering and protective role, preventing impact damage to the wafer assembly 20 caused by deviations in the downward stroke control or positioning errors.

[0077] Furthermore, please refer again. Figure 5 and Figure 6 In this embodiment, a connecting seat 252 is provided on the side of the pressure plate 250 facing the base 230. A guide post 523 is fixedly provided on the connecting seat 252. The guide post 253 is slidably assembled on the base 230 along the axial direction of the pressure plate 250. An elastic member 254 is provided between the base 230 and the connecting seat 230.

[0078] Multiple connecting seats 252 can be provided, spaced apart circumferentially along the pressure plate 250. The base 230 may have corresponding guide holes for the assembly and extension / retraction of the guide posts 253. When the pressure plate 250 moves axially relative to the base 230, the elastic element 254 is further compressed or released, thereby providing the required elastic preload. The cooperation between the guide posts 523 and the base 230 ensures that the pressure plate 250 can only move axially, avoiding skewness and jamming.

[0079] Specifically, the elastic element 254 is configured as a compression spring, which is sleeved on the guide post 253, with its two ends abutting against the base 230 and the connecting seat 252, respectively. The compression spring itself is also well guided and limited by the guide post 253, which can prevent its lateral instability.

[0080] In the aforementioned wafer backside inspection fixing device 10 and wafer inspection equipment, during backside inspection of the wafer, the support ring 23 of the wafer assembly 20 is supported by the first abutment portion 110, while the wafer body 21 is located within the liquid accumulation tank 101. After water is injected into the liquid accumulation tank 101, the optical inspection device 20 below can achieve a clear image of the backside of the wafer body 21 through the light-transmitting area. The first pressing portion 210 of the holding mechanism 200 cooperates with the first abutment portion 110 to press and fix the support ring 23, so there is no need to set an adsorption hole on the surface of the wafer stage 100, thereby completely avoiding the problem of water overflowing from the liquid accumulation tank 101 being sucked into the adsorption hole and causing wafer fixing failure. Moreover, the light-transmitting area and the liquid film correspond to the entire backside of the wafer body 21, and the optical inspection device 20 can successfully acquire images of any area on the backside of the wafer body 21, while the liquid film remains fixed in position during the inspection process. Therefore, the aforementioned wafer backside inspection fixing device 10 can significantly improve the reliability of wafer fixing and the stability during the inspection process.

[0081] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A wafer backside inspection fixing device (10), characterized in that, The fixing device includes a wafer stage (100) and a holding mechanism (200). A liquid accumulation tank (101) and a first abutment portion (110) are formed on one side of the wafer stage (100); the first abutment portion (110) is arranged circumferentially along the outer side of the liquid accumulation tank (101) and can support the support ring (23) of the wafer assembly (20); the liquid accumulation tank (101) is used to contain a light-transmitting liquid to form a liquid film, and the bottom of the liquid accumulation tank (101) has a light-transmitting area corresponding to the liquid accumulation tank (101); The pressing mechanism (200) includes a first pressing part (210) which can press the support ring (23) onto the first abutting part (110); The wafer stage (100) and the holding mechanism (200) can be combined to clamp and fix the wafer assembly (20) so as to seal the support medium (22) of the wafer assembly (20) to the liquid film, so that the optical detection device (20) can collect images of any area on the back of the wafer body (21) through the light-transmitting area and the liquid film.

2. The wafer backside inspection fixing device (10) according to claim 1, characterized in that, A second abutment (120) is also formed at the top edge of the liquid collection tank (101). The second abutment (120) is arranged in a closed ring and is arranged around the circumference of the liquid collection tank (101). The second abutment (120) can bear the supporting medium (22).

3. The wafer backside inspection fixing device (10) according to claim 2, characterized in that, The height of the second abutment (120) is greater than that of the first abutment (110).

4. The wafer backside inspection fixing device (10) according to claim 2, characterized in that, The pressing mechanism (200) further includes a second pressing part (220), which can press the support medium (22) onto the second abutment part (120) to seal the liquid film between the support medium (22) and the light-transmitting area.

5. The wafer backside inspection fixing device (10) according to claim 1, characterized in that, The lateral dimension of the liquid accumulation tank (101) covers at least the area where the wafer body (21) of the wafer assembly (20) is located, and the lateral dimension of the light-transmitting area matches that of the liquid accumulation tank (101).

6. The wafer backside inspection fixing device (10) according to any one of claims 1 to 5, characterized in that, The pressing mechanism (200) includes a base (230) and an adsorption member (240). A plurality of adsorption members (240) are assembled on the base (230). The adsorption member (240) can absorb the support ring (23) and place and press the support ring (23) on the first abutment part (110). The base (230) is provided with the first pressing part (210).

7. The wafer backside inspection fixing device (10) according to claim 6, characterized in that, The adsorption element (240) partially constitutes the first pressing part (210).

8. The wafer backside inspection fixing device (10) according to claim 6, characterized in that, A second abutment (120) is also formed at the top edge of the liquid collection tank (101). The second abutment (120) is arranged circumferentially along the liquid collection tank (101) and can bear the supporting medium (22). The pressing mechanism further includes a pressure plate (250), which is assembled on the base (230), and a portion of the pressure plate (250) forms a second pressing part (220), which can press the support medium (22) onto the second abutment part (120).

9. The wafer backside inspection fixing device (10) according to claim 8, characterized in that, The pressure plate (250) has an annular boss on the side facing away from the base (230), and the boss constitutes the second pressing part (220).

10. The wafer backside inspection fixing device (10) according to claim 8, characterized in that, The pressure plate (250) has a clearance groove (251) in the middle that is adapted to the wafer body.

11. The wafer backside inspection fixing device (10) according to claim 9, characterized in that, The pressure plate (250) is capable of elastic expansion and contraction relative to the base (230) along the axial direction of the pressure plate (250).

12. The wafer backside inspection fixing device (10) according to claim 11, characterized in that, A connecting seat (252) is provided on the side of the pressure plate (250) facing the base (230). A guide post (253) is fixedly provided on the connecting seat (252). The guide post (253) is slidably assembled to the base (230) along the axial direction of the pressure plate (250). An elastic element (254) is provided between the base (230) and the connecting seat (252).

13. A wafer inspection device, characterized in that, The device includes an optical inspection device (20) and a wafer backside inspection fixing device (10) as described in any one of claims 1 to 12. The optical inspection device (20) is disposed on the side of the wafer stage (100) facing away from the opening of the liquid accumulation tank (101). The optical inspection device (20) is movable within the range of the light-transmitting area and acquires images of any area on the backside of the wafer body (21) through the light-transmitting area and the liquid film.

Images