Chip thermal management energy recovery device and preparation method and working method thereof

Abstract

This invention discloses a chip thermal management energy recovery device and its preparation and operation methods, belonging to the field of chip thermal management technology. It includes a chip, a thermoelectric generator (TEG) on top of the chip, and a hydroelectric power generation layer (HEG) arrayed on the cold end surface of the TEG. The HEG includes hydroelectric device units arranged in sequence, with adjacent hydroelectric device units connected by printed wires. Each hydroelectric device unit includes a hydroelectric positive electrode material region and a hydroelectric negative electrode material region, which are connected by a hydrogel ion-connector. A cover is disposed above the TEG, covering the HEG, forming a cavity between the cover and the HEG. A flow guiding structure is provided inside the cover. This invention, employing the above-mentioned chip thermal management energy recovery device and its preparation and operation methods, improves thermoelectric power generation efficiency; achieves ion transport and local water retention; and reduces external water replenishment requirements by forming a closed-loop water replenishment system.

Description

Technical Field

[0001] This invention relates to the field of chip thermal management technology, and in particular to a chip thermal management energy recovery device and its preparation and operation methods. Background Technology

[0002] As high heat flux density chips, power devices, advanced packaging modules, and edge electronic systems continue to evolve towards higher integration, miniaturization, and higher power consumption, localized heat accumulation has become a key bottleneck restricting the performance stability, lifespan, and reliability of these devices. Existing thermal management solutions mainly focus on air cooling, liquid cooling, thermal interface material optimization, or phase change heat dissipation. However, most solutions only focus on heat removal and fail to simultaneously achieve waste heat utilization and environmental energy recovery during the cooling process.

[0003] Thermoelectric technology can directly output electricity by utilizing the temperature difference between the hot and cold ends, offering advantages such as compact structure, no moving parts, and ease of integration. However, in practical chip thermal management scenarios, the cold end temperature of thermoelectric chips is often difficult to maintain at a low level for extended periods, resulting in limited sustainable temperature difference and output. On the other hand, hydroelectric or humidification devices can achieve energy conversion through interfacial moisture migration, evaporation-induced ion transport, or humidity gradients, accompanied by certain evaporative heat absorption and surface cooling effects. However, when used alone, they typically suffer from limited output capacity, discontinuous water supply, and insufficient environmental adaptability.

[0004] Therefore, there is an urgent need for a composite system that can integrate and couple TEG with arrayed HEG under chip operating heat conditions. Summary of the Invention

[0005] The purpose of this invention is to provide a chip thermal management energy recovery device and its preparation and operation methods. It utilizes evaporative heat absorption to achieve active cold-end regulation, continuously expanding the effective temperature difference of the heat exchanger (TEG) and improving thermoelectric power generation efficiency. The positive and negative electrodes adopt an arrayed, regularized printing layout, facilitating mass production, patterned design, and compatibility with TEGs or chip packages of different sizes. Ion transport and localized water retention are achieved through hydrogel connectors, improving the operational stability and structural flexibility of the HEG unit. A closed-loop water replenishment system reduces external water replenishment requirements, increasing the device's continuous operating time and engineering adaptability. The system simultaneously outputs TEG and HEG electrical energy, combining chip heat dissipation, waste heat utilization, and environmental moisture energy conversion functions, making it suitable for high heat flux density electronic devices, microsystem packaging, sensor nodes, edge computing modules, and other scenarios.

[0006] To achieve the above objectives, the present invention provides a chip thermal management energy recovery device, comprising a chip, a thermoelectric generator (TEG) on the top of the chip, a TEG positive electrode and a TEG negative electrode respectively disposed on both sides of the TEG, and a hydroelectric power generation layer (HEG) array disposed on the cold end surface of the TEG. The HEG includes hydroelectric device units arranged in sequence, and adjacent hydroelectric device units are connected by printed wires. Each hydroelectric device unit includes a hydroelectric positive electrode material region and a hydroelectric negative electrode material region, which are connected by a hydrogel ion linker. A cover is disposed above the TEG, covering the HEG, and a cavity is formed between the cover and the HEG. A flow guiding structure is provided inside the cover.

[0007] Preferably, the positive electrode material region of the water-voltaic system adopts a carbon-based conductive material, which includes one or more of carbon slurry, carbon nanotube slurry, activated carbon slurry, and conductive carbon black slurry. The negative electrode material region of the water-voltaic system adopts one or more of a metallic material, a slurry containing active metal powder, a metal-organic framework material, and a layered double hydroxide material. The active metal powder includes one or more of Mn, Zn, Al, Fe, and Mg. The metal-organic framework material or layered double hydroxide material includes one or more of ZIF-8, ZIF-67, and NiCoMn-LDH.

[0008] Preferably, the water-voltaic positive electrode material region is in any of the following patterns: circular, square, strip, elliptical, or polygonal, and is arranged according to one of the following regular arrays: matrix, row-column, staggered, or serpentine. The water-voltaic negative electrode material region is set in the same way as the water-voltaic positive electrode material region.

[0009] Preferably, the hydrogel ion linker is one or more of polyvinyl alcohol-based hydrogel, polyacrylamide-based hydrogel, polyacrylate-based hydrogel, ion gel, and salt-containing water-retaining gel.

[0010] Preferably, the printed conductors are formed using one or more of silver paste, copper paste, carbon paste, graphite paste, and liquid metal ink.

[0011] Preferably, the cover is a metal cover, and the flow guiding structure is one or more of the following: capillary pores, microgrooves, hydrophilic coating, and micro / nano texture.

[0012] Preferably, the top of the cover is provided with a pre-cooling structure, heat dissipation fins, or an external heat exchange connection.

[0013] This invention provides a method for preparing a chip thermal management energy recovery device. The method for preparing the chip thermal management energy recovery device includes the following steps: S1, Cleaning and surface activation treatment of the TEG cold end surface; S2, multiple regularly arranged water-voltaic positive electrode material regions and water-voltaic negative electrode material regions are alternately constructed on the cold end surface of TEG; S3, hydrogel is applied between adjacent water-voltaic positive electrode material region and water-voltaic negative electrode material region to form ion linker; S4, Printed wires are formed between adjacent water-volt device units to construct a preset circuit; S5, a cover is installed above the HEG to form a low-pressure or vacuum cavity, thus obtaining the chip thermal management energy recovery device.

[0014] This invention provides a method for operating a chip thermal management energy recovery device. Using the aforementioned chip thermal management energy recovery device, the heat generated by the chip during operation is transferred to the hot end surface of the TEG. The temperature of the cold end of the TEG is reduced by the evaporation and absorption of water in the HEG, enabling the TEG to generate electrical energy. At the same time, electrical energy is generated through water migration, ion transport, and interface charge separation in the HEG. The evaporated water vapor condenses in the enclosure and flows back to the HEG surface to achieve self-circulation and replenishment of the working fluid to maintain continuous operation.

[0015] Therefore, the present invention, employing the above-mentioned chip thermal management energy recovery device and its preparation and operation methods, has the following beneficial effects: 1) By directly constructing HEG on the cold end surface of TEG, active cold end regulation can be achieved by utilizing evaporative heat absorption, which can continuously expand the effective temperature difference of TEG and improve the thermoelectric power generation efficiency. 2) HEG not only serves as a surface evaporation heat dissipation layer, but it can also generate electricity during moisture migration and interfacial charge separation, thus achieving integrated thermal management and energy recovery; 3) The positive and negative electrodes adopt an arrayed and regular printing layout, which facilitates mass production, patterned design, and compatibility with TEG or chip packages of different sizes; 4) Ion transport and local water retention are achieved through hydrogel linkers, which can improve the working stability and structural flexibility of HEG units; 5) A closed-loop water replenishment system is formed by a metal cover, capillary flow structure and vacuum / low-pressure evaporation-condensation reflux chamber, which can reduce the external water replenishment requirements and improve the continuous working time and engineering adaptability of the device. 6) The system simultaneously outputs TEG and HEG power, and has the functions of chip heat dissipation, waste heat utilization and environmental moisture energy conversion. It is suitable for high heat flux density electronic devices, microsystem packaging, sensing nodes, edge computing modules and other scenarios.

[0016] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a chip thermal management energy recovery device according to the present invention; Figure 2This is a schematic diagram of the unconnected structure of the water-voltaic positive electrode material region and the water-voltaic negative electrode material region of the chip thermal management energy recovery device of the present invention; Figure 3 This is a schematic diagram of the connection between the water-voltaic positive electrode material region and the water-voltaic negative electrode material region in a chip thermal management energy recovery device of the present invention.

[0018] Figure Labels 1. Chip; 2. TEG; 3. HEG; 4. Water-based positive electrode material region; 5. Water-based negative electrode material region; 6. TEG positive electrode; 7. TEG negative electrode; 8. Sheath; 9. Condensation reflux path; 10. Water vapor migration path; 11. Printed wire; 12. Hydrogel ion-connector. Detailed Implementation

[0019] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0021] Example 1 like Figures 1 to 3As shown, this invention provides a chip thermal management energy recovery device, including a chip 1, a thermoelectric generator (TEG2) on top of the chip 1, a TEG positive electrode 6 and a TEG negative electrode 7 respectively disposed on both sides of the TEG, and a hydroelectric power generation layer (HEG3) arrayed on the cold end surface of the TEG2. The HEG3 includes hydroelectric device units arranged in sequence, with adjacent hydroelectric device units connected by printed wires 11. Each hydroelectric device unit includes a hydroelectric positive electrode material region 4 and a hydroelectric negative electrode material region 5, which are connected by a hydrogel ion-connector 12. A cover 8 is disposed above the TEG2, covering the HEG3, forming a cavity between the cover 8 and the HEG3. A flow guiding structure is provided inside the cover 8. In operation, the HEG3 reduces the cold end temperature of the TEG2 through evaporative heat absorption. The TEG2 generates electricity using the temperature difference between the heat source of the chip 1 and its cold end, while the HEG3 simultaneously generates electricity using moisture migration, evaporation-induced potential difference, and interface charge separation. TEG2, HEG3, and the housing 8 together form a closed-loop working fluid circulation system. Water evaporates on the surface of HEG3 and then condenses and flows back inside the housing 8, realizing the self-circulation and replenishment of the working fluid.

[0022] When the device is working, the bottom chip 1 acts as a heat source to supply heat to the hot end of TEG2, and HEG3 evaporates and absorbs heat to reduce the temperature of the cold end of TEG2. TEG2 uses the temperature difference between the upper and lower surfaces to output electrical energy. At the same time, HEG3 outputs electrical energy under the action of evaporation, humidity gradient and ion migration, thereby realizing heat dissipation enhancement and dual-path power generation.

[0023] The positive electrode material region 4 of the water-voltaic system uses carbon-based conductive materials, including one or more of carbon slurry, carbon nanotube slurry, activated carbon slurry, and conductive carbon black slurry. The negative electrode material region 5 of the water-voltaic system uses one or more of metal materials, slurry containing active metal powder, metal-organic framework materials, and layered double hydroxide materials. The active metal powder includes one or more of Mn, Zn, Al, Fe, and Mg. The metal-organic framework materials or layered double hydroxide materials include one or more of ZIF-8, ZIF-67, and NiCoMn-LDH.

[0024] The water-voltaic positive electrode material region 4 is in any pattern of circle, square, strip, ellipse or polygon, and is arranged in a regular array of matrix, row and column, staggered or serpentine. The water-voltaic negative electrode material region 5 is set in the same way as the water-voltaic positive electrode material region 4.

[0025] The hydrogel ion linker 12 is one or more of polyvinyl alcohol-based hydrogels, polyacrylamide-based hydrogels, polyacrylate-based hydrogels, ion gels, and salt-containing water-retaining gels.

[0026] The printed conductor 11 is formed using one or more of silver paste, copper paste, carbon paste, graphite paste, and liquid metal ink to achieve series, parallel, or series-parallel electrical connections between multiple water-volt device units.

[0027] The cover 8 is a metal cover, and the flow guiding structure is one or more of the following: capillary pores, microgrooves, hydrophilic coating, micro-nano texture, so as to promote the liquid after water vapor condensation to form a condensation return path 9 along the inner wall and return to the HEG3 surface.

[0028] The top of the cover 8 is provided with a pre-cooling structure, heat dissipation fins or external heat exchange connection to enhance the condensation effect when the evaporated water vapor migrates to the top or upper area of ​​the cover 8 along the water vapor migration path 10.

[0029] This invention provides a method for preparing a chip thermal management energy recovery device. The method for preparing the chip thermal management energy recovery device includes the following steps: S1, Cleaning and surface activation treatment of the TEG cold end surface; S2, multiple regularly arranged water-voltaic positive electrode material regions and water-voltaic negative electrode material regions are alternately constructed on the cold end surface of TEG; S3, hydrogel is applied between adjacent water-voltaic positive electrode material region and water-voltaic negative electrode material region to form ion linker; S4, Printed wires are formed between adjacent water-volt device units to construct a preset circuit; S5, a cover is installed above the HEG to form a low-pressure or vacuum cavity, thus obtaining the chip thermal management energy recovery device.

[0030] This invention provides a method for operating a chip thermal management energy recovery device. Using the aforementioned chip thermal management energy recovery device, the heat generated by the chip during operation is transferred to the hot end surface of the TEG. The temperature of the cold end of the TEG is reduced by the evaporation and absorption of water in the HEG, enabling the TEG to generate electrical energy. At the same time, electrical energy is generated through water migration, ion transport, and interfacial charge separation in the HEG. The evaporated water vapor condenses in the enclosure and flows back to the HEG surface to achieve self-circulation and replenishment of the working fluid to maintain continuous operation.

[0031] Example 2 Arrayed TEG-HEG integrated structure A sheet-shaped thermoelectric generator is selected as the substrate, with its lower surface in thermal coupling contact with the chip or other heat source, and its upper surface serving as the cold-end functional construction surface. After pretreatment of the upper surface, multiple regularly arranged water-voltaic positive and negative electrode material regions are alternately formed by screen printing, inkjet printing, micro-dispensing, direct writing printing, or 3D printing, preferably in a matrix, row-column, or serpentine array structure.

[0032] The preferred materials for the hydrovoltaic cathode region are carbon slurry, carbon nanotube slurry, activated carbon slurry, conductive carbon black slurry, or any combination thereof, to provide a stable conductive interface and good surface wetting / evaporation activity. The preferred materials for the hydrovoltaic anode region are slurries containing active metal powders such as Mn, Zn, Al, Fe, and Mg, or MOF / LDH materials such as ZIF-8, ZIF-67, and NiCoMn-LDH, to improve ion exchange activity, interfacial potential difference, or electron transfer capability. Both the hydrovoltaic cathode and anode material regions can be replaced with any conductive / semiconductive / porous composite material capable of forming an evaporation-driven interfacial potential difference, ion gradient, or electrochemical potential difference.

[0033] A hydrogel connector is applied between adjacent hydrovoltaic positive and negative electrode material regions. The hydrogel can be polyvinyl alcohol-based, polyacrylamide-based, polyacrylate-based, ion-conducting gel, or salt-containing water-retaining gel. The hydrogel provides an ion transport channel between the positive and negative electrodes and maintains local moisture storage, enhancing the continuity of the evaporation process. Subsequently, Ag, Cu, or carbon conductive pastes are printed between adjacent hydrovoltaic device units to form wires, realizing preset series, parallel, or grouped output circuits.

[0034] Evaporative cooling and thermoelectric power generation working in tandem When the bottom chip operates, it generates heat, which is conducted from the chip to the hot end of the TEG. Because the TEG cold end surface integrates a water-containing HEG array layer, water evaporates from the hydrogel and electrode surfaces. This evaporation absorbs heat, causing the temperature of the upper surface of the TEG to drop, thus establishing a larger temperature difference between the top and bottom of the TEG. The TEG outputs the first portion of electrical energy based on this. Simultaneously, water migration within the HEG, ion diffusion, interfacial evaporation-induced potential difference, and charge separation at the positive and negative electrode interfaces work together to output the second portion of electrical energy. The chip's heat is continuously dissipated in the pathway from chip to TEG to HEG to the environment, resulting in a decrease in chip temperature. The hydrogel can be doped with salts, acids, alkalis, ionic liquids, humectants, hydrophilic nanoparticles, or photothermal components to improve water retention, conductivity, or environmental adaptability.

[0035] In this process, HEG is not only a power generation device, but also a heat coupling and regulation layer; the more complete its evaporation behavior, the more significant the cooling of the TEG cold end, while the heat provided by the TEG hot end can enhance the driving force of water phase change and migration in HEG, and the two form a multi-field coupling synergy relationship of heat-humidity-electricity.

[0036] Closed-loop water supply structure with condensate return hood A metal enclosure is placed above the HEG array, and a low-pressure or vacuum chamber is formed between the enclosure and the HEG through a sealed structure. The low-pressure environment inside the enclosure can be created by evacuation or by filling with an inert atmosphere and reducing the vapor partial pressure. The inner wall, top, or side walls of the metal enclosure are provided with capillaries, microgrooves, hydrophilic layers, or flow-guiding textures so that the evaporated water vapor condenses in the cooler areas of the enclosure, forming a liquid film or droplets, and automatically flows back to the HEG surface along the inner wall of the enclosure.

[0037] Preferably, the top of the enclosure can be equipped with a pre-cooling end, heat dissipation fins, or connected to external heat exchange components to enhance the condensation effect. Preferably, the inner wall surface of the enclosure can be designed to facilitate condensation spreading at the top and liquid flow back at the bottom, thus forming a cycle of evaporation-migration-condensation-reflux-re-evaporation. This closed-loop structure reduces working fluid loss and improves the long-term stability of the device. The metal enclosure material can be aluminum, stainless steel, copper, nickel, titanium, or their alloys, and a coating or composite film can be applied to its surface to regulate condensation and reflux behavior.

[0038] Array cell and packaging form expansion The morphology of the water-based photovoltaic (VPS) device cells is not limited to circular, square, or strip electrode pairs. Multi-scale array designs can be implemented based on TEG size, chip thermal distribution, trace space, and expected electrical output. Cells can be connected in series to increase voltage output, in parallel to increase current output, or in a partitioned series-parallel configuration to optimize energy extraction for localized hot zones.

[0039] The thermoelectric generator (TEG) can be a single thermoelectric generator or a multi-element cascaded structure; the heat exchanger (HEG) and the housing can be fixed together by a frame, sealing ring, adhesive, welded frame, or mechanical clips. The chip, TEG, HEG, and housing can be further integrated into a modular thermal management power supply assembly.

[0040] This invention is applicable not only to chips, but also to LEDs, power modules, battery thermal management components, flexible electronic heat sources, and other systems that require simultaneous heat dissipation and energy recovery.

[0041] Therefore, the present invention employs the above-mentioned chip thermal management energy recovery device and its preparation and operation methods, which has the following beneficial effects: By directly constructing HEG on the cold end surface of TEG, active cold end regulation is achieved by utilizing evaporative heat absorption, which can continuously expand the effective temperature difference of TEG and improve the thermoelectric power generation efficiency; HEG not only serves as a surface evaporative heat dissipation layer, but also generates electricity during moisture migration and interface charge separation, realizing the integration of thermal management and energy recovery; the positive and negative electrodes adopt an arrayed and regular printed layout, which is convenient for mass production, patterned design, and compatibility with TEG or chip packages of different sizes; ion transport and local water retention are achieved through hydrogel connectors, which can improve the working stability and structural flexibility of HEG units; a closed-loop water replenishment system is formed by a metal cover, capillary flow structure, and vacuum / low-pressure evaporation-condensation reflux cavity, which can reduce the external water replenishment requirements and improve the continuous working time and engineering adaptability of the device; the system simultaneously outputs TEG power and HEG power, and has the functions of chip heat dissipation, waste heat utilization, and environmental moisture energy conversion, which is suitable for high heat flux density electronic devices, microsystem packaging, sensing nodes, edge computing modules, and other scenarios.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of the present invention, and these modifications or equivalent substitutions cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A chip thermal management energy recovery device, characterized in that: The device includes a chip, a thermoelectric generator (TEG) on top of the chip, a TEG positive electrode and a TEG negative electrode on both sides of the TEG, and a hydroelectric power generation layer (HEG) arrayed on the cold end surface of the TEG. The HEG includes hydroelectric device units arranged in sequence, with adjacent hydroelectric device units connected by printed wires. Each hydroelectric device unit includes a hydroelectric positive electrode material region and a hydroelectric negative electrode material region, which are connected by a hydrogel ion-connector. A cover is placed above the TEG, covering the HEG and forming a cavity between the cover and the HEG. A current-guiding structure is provided inside the cover.

2. The chip thermal management energy recovery device according to claim 1, characterized in that: The positive electrode region of the water-voltaic system uses carbon-based conductive materials, including one or more of carbon slurry, carbon nanotube slurry, activated carbon slurry, and conductive carbon black slurry. The negative electrode region of the water-voltaic system uses one or more of metallic materials, slurries containing active metal powders, metal-organic framework materials, and layered double hydroxide materials. The active metal powders include one or more of Mn, Zn, Al, Fe, and Mg. The metal-organic framework materials or layered double hydroxide materials include one or more of ZIF-8, ZIF-67, and NiCoMn-LDH.

3. The chip thermal management energy recovery device according to claim 2, characterized in that: The water-voltaic positive electrode material area is in any pattern of circle, square, strip, ellipse or polygon, and is arranged in a regular array of matrix, row and column, staggered or serpentine. The water-voltaic negative electrode material area is set in the same way as the water-voltaic positive electrode material area.

4. The chip thermal management energy recovery device according to claim 3, characterized in that: The hydrogel ion linker is one or more of the following: polyvinyl alcohol-based hydrogel, polyacrylamide-based hydrogel, polyacrylate-based hydrogel, ion gel, and salt-containing water-retaining gel.

5. The chip thermal management energy recovery device according to claim 4, characterized in that: Printed conductors are formed using one or more of the following: silver paste, copper paste, carbon paste, graphite paste, and liquid metal ink.

6. The chip thermal management energy recovery device according to claim 5, characterized in that: The cover is a metal cover, and the flow guiding structure is one or more of the following: capillary pores, microgrooves, hydrophilic coating, and micro-nano texture.

7. The chip thermal management energy recovery device according to claim 6, characterized in that: The top of the cover is equipped with a pre-cooling structure, heat dissipation fins, or an external heat exchange connection.

8. A method for preparing a chip thermal management energy recovery device, comprising preparing a chip thermal management energy recovery device according to any one of claims 1-7, characterized in that: Specifically, the steps include the following: S1, Cleaning and surface activation treatment of the TEG cold end surface; S2, multiple regularly arranged water-voltaic positive electrode material regions and water-voltaic negative electrode material regions are alternately constructed on the cold end surface of TEG; S3, hydrogel is applied between adjacent water-voltaic positive electrode material region and water-voltaic negative electrode material region to form ion linker; S4, Printed wires are formed between adjacent water-volt device units to construct a preset circuit; S5, a cover is installed above the HEG to form a low-pressure or vacuum cavity, thus obtaining the chip thermal management energy recovery device.

9. A method for operating a chip thermal management energy recovery device, employing the chip thermal management energy recovery device according to any one of claims 1-7, characterized in that: The heat generated by the chip during operation is transferred to the hot end surface of the TEG. The temperature of the cold end of the TEG is reduced by the evaporation of water in the HEG, enabling the TEG to generate electricity. At the same time, electricity is generated through water migration, ion transport and interfacial charge separation in the HEG. The evaporated water vapor condenses in the enclosure and flows back to the HEG surface to achieve self-circulation and replenishment of the working fluid to maintain continuous operation.

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