Water-vapor double-channel heat recovery chip heat dissipation device and preparation method thereof

Abstract

The application discloses a water-vapor dual-channel heat recovery chip heat dissipation device and a preparation method thereof, and belongs to the technical field of semiconductor packaging heat management. The heat dissipation device comprises a chip, a thermoelectric power generation sheet and a heat dissipation sheet which are sequentially and thermally coupled and connected from top to bottom. The heat dissipation sheet comprises a heat dissipation base and a plurality of outwardly extending heat dissipation fins, and the surface of the heat dissipation fin is integrated with a water-vapor power generation unit. The method comprises the following steps: first, pretreating the heat dissipation fin, then manufacturing the fin-integrated water-vapor power generation unit, then assembling the thermoelectric power generation sheet, and finally connecting the two types of power generation components and the power management module to manufacture the dual-channel heat recovery chip heat dissipation device. The water-vapor dual-channel heat recovery chip heat dissipation device and the preparation method thereof have the advantages that the problems of no energy recovery of the traditional heat dissipation sheet, limited single-temperature difference power generation efficiency and incompatibility between the water-vapor device and the heat dissipation structure are solved, and the device has good adhesion, moisture permeability, ion conductivity and electrode stability.

Description

Technical Field

[0001] This invention relates to the fields of semiconductor packaging thermal management, thermoelectric power generation and water-voltaic energy conversion, and in particular to a water-voltaic dual-channel heat recovery chip heat dissipation device and its preparation method. Background Technology

[0002] In existing technologies, high heat flux density chips, power devices, and edge computing modules generate a large amount of low-grade waste heat during operation. Traditional heat dissipation relies solely on passive heat conduction, resulting in significant energy waste. Thermoelectric generators (TEGs) can recover waste heat; however, in actual chip-scale operating environments, the temperature difference that can be maintained is usually limited, and the efficiency of thermoelectric generators will further decrease when the cold end is not adequately cooled.

[0003] Hydrovoltaic power generation utilizes moisture adsorption and evaporation to induce charge separation to output electrical energy and assist in cooling. However, existing hydrovoltaic devices require independent substrates, have poor compatibility with commercial heat sinks, are complex to assemble, and are costly, making them difficult to promote in engineering. Summary of the Invention

[0004] The purpose of this invention is to provide a water-voltaic dual-channel heat recovery chip heat dissipation device and its preparation method, which solves the problems of traditional heat sinks having no energy recovery, limited power generation efficiency due to single temperature difference, and incompatibility between water-voltaic devices and heat dissipation structures. At the same time, it has good adhesion, moisture permeability, ion conduction ability and electrode stability.

[0005] To achieve the above objectives, the present invention provides a water-volt dual-channel heat recovery chip heat dissipation device, comprising a chip, a thermoelectric generator, and a heat sink connected in sequence from top to bottom; the heat sink includes a heat dissipation base and multiple outwardly extending heat dissipation fins, and a water-volt power generation unit is integrated on the surface of the heat dissipation fins, the water-volt power generation unit including a water-volt negative electrode layer, a water-volt membrane layer, and a water-volt positive electrode layer arranged in sequence from the inside to the outside.

[0006] Preferably, the heat sink is one of the following: plate fin type, needle fin type, comb fin type, corrugated fin type, slotted fin type, and the material is one of the following: copper, aluminum, iron, graphite, and carbon / metal composite thermal conductive material.

[0007] Preferably, the heat dissipation fins have a fin height of 2-80 mm, a thickness of 0.1-5.0 mm, a spacing of 0.2-10 mm between adjacent heat dissipation fins, and a number of heat dissipation fins of 2-500. The coverage rate of the hydro-voltaic power generation unit on one side of a single heat dissipation fin is 20%-95%.

[0008] Preferably, the hydroelectric power generation unit is arranged on the surface of the heat dissipation fins in a strip, block, dot, comb, segmented, or partially island manner, and is disposed on one side, two sides, the top surface of the fins, or a combination of the above-mentioned parts.

[0009] Preferably, the water-voltaic positive electrode layer is one of carbon slurry, activated carbon slurry, conductive carbon black slurry, carbon nanotube slurry, graphene slurry, carbon fiber slurry, or a composite conductive layer thereof, with a thickness of 1~500μm; the water-voltaic negative electrode layer is one of Zn, Al, Fe powder film, metal slurry, metal foil, ZIF-8 slurry layer, LDH slurry layer, or a composite slurry layer thereof, with a thickness of 1~1000μm; the water-voltaic membrane layer includes a moisture-absorbing membrane layer or an electrolyte layer, and the water-voltaic membrane layer is one of hydrogel, ionogel, porous cellulose membrane, porous polymer membrane, salt-modified moisture-absorbing membrane, or a composite layer thereof, with a thickness of 10μm~5mm.

[0010] Preferably, the heat dissipation fins and the hydrovoltaic power generation unit are further provided with one of the following: a base coating layer, a roughening layer, an oxide layer, a coupling agent layer, a conductive transition layer, or an adhesive layer, to enhance adhesion, durability, and interface stability; the base coating layer is a resin base layer or a metal base plating layer, the surface roughening layer is a sandblasting roughening layer or a chemical etching roughening layer, and the conductive transition layer is a metal transition layer or a conductive adhesive transition layer. The outer side of the hydroelectric power generation unit is provided with one of the following: a local moisture-permeable protective layer, an edge insulating limiting layer, a hydrophobic and water-blocking layer, and a mesh mechanical support layer, or a combination layer formed by stacking at least two of the above layers, so as to maintain the moisture exchange and evaporation channel while suppressing liquid water accumulation, material shedding and electrode short circuit.

[0011] Preferably, multiple hydro-voltaic power generation units are connected in series, in parallel, or in a series-parallel manner; the hydro-voltaic power generation units on multiple heat dissipation fins are connected in series in segments along the length of the fins, or connected in parallel along the direction of adjacent heat dissipation fins to achieve arrayed output of hydro-voltaic power generation units.

[0012] Preferably, the hot end of the thermoelectric generator faces the chip, the cold end faces the heat sink, and the thickness of the thermoelectric generator is 0.2~5mm; The hydro-voltaic power generation unit is equipped with a hydro-voltaic positive busbar and a hydro-voltaic negative busbar that are connected to an external power management module. The power management module is electrically connected to the thermoelectric generator and the hydro-voltaic power generation unit respectively, and is used to perform rectification, backflow prevention, voltage boosting, voltage bucking, voltage stabilization, maximum power matching, energy storage charging, or load switching. The two output power can be selected to be output independently, output after merging, output with thermoelectric generator as the main hydro-voltaic supplement, output with hydro-voltaic to maintain standby, or output together to charge the energy storage unit.

[0013] This invention also provides a method for preparing a water-cooled dual-channel heat recovery chip heat dissipation device, comprising the following steps: S1. Degrease, clean, roughen, oxidize, plasma activate, anodize, sandblast, or pre-treat the surface of the heat sink fins; S2. A composite structure of a hydrovoltaic positive electrode layer, a hydrovoltaic membrane layer and a hydrovoltaic negative electrode layer is formed on the surface of the heat dissipation fins to obtain a fin-integrated hydrovoltaic power generation unit. S3. Assemble the thermoelectric generator between the chip and the heat sink; S4. Connect the hydrovoltaic power generation unit and the thermoelectric generator to the power management module to obtain a hydrovoltaic dual-channel heat recovery chip heat dissipation device.

[0014] Preferably, step S2 uses one of the following methods to deposit the hydrovoltaic positive electrode layer, hydrovoltaic separator layer, and hydrovoltaic negative electrode layer: screen printing, scraping, spraying, dripping, stencil transfer, inkjet printing, 3D printing, immersion adhesion, lamination, or molding. The water-based membrane layer is dried, cross-linked, gelled, freeze-thawed, heat-cured, UV-cured, or ion-exchange treated to form a stable hygroscopic and ion-conducting structure; The water-based negative electrode layer and water-based positive electrode layer are subjected to low-temperature drying, compaction or secondary coating to improve conductivity and interfacial bonding strength. After step S2 or S4, moisture permeability protection and limiting encapsulation are performed, that is, an insulating enclosure is set at the boundary of the hydroelectric power generation unit, a moisture permeability protection layer is set on its outer surface, and a waterproof insulating encapsulation is set at the lead-out end to ensure that the ambient moisture can be exchanged and the device can maintain stable operation under vibration, condensation or long-term operation conditions.

[0015] Therefore, the present invention employs the above-mentioned water-cooled dual-channel heat recovery chip heat dissipation device and its preparation method, and the technical effects are as follows: (1) The present invention has low manufacturing threshold, strong structural compatibility, and is suitable for upgrading existing chip heat dissipation systems.

[0016] (2) The present invention forms a first path of thermoelectric recovery through “chip-TEG-heat sink” and a second path of interface energy recovery through “fin-water-voltaic unit-moisture adsorption / evaporation”, thereby realizing dual-channel heat recovery of TEG and water-voltaic and improving the comprehensive utilization efficiency of low-grade heat.

[0017] (3) The evaporation process of the hydrovoltaic power generation unit can continuously remove latent heat, which helps to reduce the fin temperature, suppress the temperature rise of the cold end of the thermoelectric generator, and indirectly maintain a more favorable thermoelectric power generation condition, reflecting the coupled synergistic effect of thermal management and energy recovery.

[0018] (4) By parametrically designing the fin size, layer thickness range, coverage, protective layer and electrical connection method, the present invention can achieve engineering adaptation for different power chips and different environmental humidity conditions.

[0019] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0020] Figure 1 This is a side view of an embodiment of a water-cooled dual-channel heat recovery chip heat dissipation device according to the present invention; Figure 2 This is a schematic diagram of the electrical connection and output mode of an embodiment of a water-cooled dual-channel heat recovery chip heat dissipation device of the present invention; Figure 3 This is a schematic diagram of the fin array and water-cooled unit arrangement in an embodiment of a water-cooled dual-channel heat recovery chip heat dissipation device of the present invention; Figure 4 This is a schematic diagram of the water-cooled layered structure on the surface of a single fin in an embodiment of a water-cooled dual-channel heat recovery chip heat dissipation device of the present invention; Figure 5 This is a flowchart of an embodiment of the preparation method of a water-cooled dual-channel heat recovery chip heat dissipation device according to the present invention.

[0021] Figure Labels 1. Chip; 2. Thermoelectric generator; 3. Heat sink; 4. Hydroelectric negative electrode layer; 5. Hydroelectric separator layer; 6. Hydroelectric positive electrode layer; 7. Hydroelectric negative electrode busbar; 8. Hydroelectric positive electrode busbar; 9. Heat sink fins. Detailed Implementation

[0022] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] Example 1 I. Overall Application Scenarios like Figures 1-4As shown, this invention provides a water-based dual-channel heat recovery chip heat dissipation device. This embodiment is applied to the heat dissipation and waste heat recovery scenarios of high-power GPU chips in industrial control. The chip has a rated power consumption of 180W and operates in an ambient temperature of 25℃ and an ambient relative humidity of 45%~75%. It is required to balance efficient heat dissipation and low-grade waste heat recovery power supply. It is compatible with the modification and upgrading of existing standard plate-fin aluminum heat sinks and can realize autonomous energy storage to power micro sensors, status indicator lights and low-power peripherals.

[0025] II. Overall Structure of the Device The components are arranged from top to bottom as follows: chip 1, upper thermal grease layer, thermoelectric generator (TEG) 2, lower thermal grease layer, heat sink 3, and power management module. Chip 1 can be a CPU, GPU, power device chip, laser chip, LED chip, or other heat-generating electronic components. The upper and lower thermal grease layers are used to reduce the contact thermal resistance between chip 1 and thermoelectric generator 2, and between thermoelectric generator 2 and heat sink 3.

[0026] The heat sink 3 can be an aluminum extruded heat sink, a copper finned heat sink, a composite thermally conductive heat sink, or a carbon-based heat sink, and includes a heat sink base and multiple heat sink fins 9 extending from the heat sink base. The height of the heat sink fins 9 is preferably 2~80mm, the thickness is preferably 0.1~5mm, and the spacing is preferably 0.2~10mm; the specific dimensions can be selected according to the heat flux density of the chip 1, the installation space, and the target convection conditions.

[0027] When chip 1 is running, heat is first transferred to thermoelectric generator 2, where a temperature difference is established between the hot and cold ends, generating the first electrical output. Subsequently, the remaining heat continues to be transferred to heat sink 3 and diffuses along the heat sink base to multiple heat sink fins 9. Since the surface of the heat sink fins 9 integrates a hydroelectric power generation unit, the surface of the fins evaporates after absorbing ambient moisture. The latent heat of evaporation causes the fin temperature to drop, generating a second electrical output between the hydroelectric negative electrode layer 4 and the hydroelectric positive electrode layer 6, forming a dual-channel energy recovery structure of thermoelectric power generation + hydroelectric power generation.

[0028] III. Specific Selection and Parameters of Each Component 1. Heat sink type 3: Aluminum plate heat sink fins 9; Fin material: 6063 thermally conductive aluminum alloy; Thermal conductive medium: Thermal grease with a thermal conductivity of 8.5 W / (m·K) is used to fill the gaps between chip 1 and thermoelectric generator 2, and between thermoelectric generator 2 and heat sink 3.

[0029] 2. Thermoelectric Generator (TEG) Specifications: Square thin sheet, 1.5mm thick; Installation method: The hot end is attached to the cold side of the GPU chip, and the cold end is tightly attached to the heatsink base 3; Function: Collects waste heat from chip 1 and generates electricity through the first stage of thermoelectric conversion based on the temperature difference between the hot and cold ends.

[0030] 3. Fin-integrated hydroelectric power generation unit (single fin, double-sided arrangement) like Figure 4 As shown, one or more sets of water-voltaic power generation units can be constructed on the surface of a single heat dissipation fin 9. The water-voltaic power generation units can be constructed in the order of "water-voltaic negative electrode layer 4 - water-voltaic membrane layer 5 - water-voltaic positive electrode layer 6" or in the order of "water-voltaic positive electrode layer 6 - water-voltaic membrane layer 5 - water-voltaic negative electrode layer 4". Without damaging the functions of moisture absorption, ion migration and charge collection, a partitioned staggered construction method can also be adopted.

[0031] The positive electrode layer 6 of the water-voltaic system is preferably made of carbon paste, activated carbon paste, carbon nanotube paste, graphene paste, conductive carbon black paste or a composite paste thereof, in order to provide a stable conductive network and a large effective interface; the negative electrode layer 4 of the water-voltaic system is preferably made of Zn, Al, Fe powder film, metal paste, metal foil, or a composite paste layer formed by mixing ZIF-8, LDH and other metal powders, in order to enhance the interfacial potential difference and charge collection capability.

[0032] The water-based membrane layer 5 includes a moisture-absorbing membrane layer or an electrolyte layer, preferably made of hydrogel, porous cellulose membrane, ion gel, salt-modified gel membrane or a composite membrane thereof. This layer performs both moisture absorption and water transport functions, as well as ion conduction and electrode isolation functions.

[0033] Water-based negative electrode layer 4: aluminum-zinc composite metal paste, 220μm thick; Water-based membrane layer 5: Salt-modified porous cellulose hygroscopic ionogel membrane, thickness 0.8 mm; Water-based cathode layer 6: graphene composite conductive carbon paste, 120μm thick; The layout parameters include a 65% coverage rate on both sides of each fin to balance moisture permeability, evaporation capacity, material adhesion, and air circulation, and a strip-shaped arrangement; all finned water-cooled units are connected in series in the same column and in parallel arrays in adjacent columns to merge the current.

[0034] To improve the interfacial bonding strength between the hydro-voltaic power generation unit and the heat sink fins 9, a base coating, roughening layer, anodized layer, coupling agent layer, conductive transition layer, or adhesive layer can be applied to the fin surface. For example, when the heat sink 3 is made of aluminum, it can be degreased, cleaned, and micro-etched first, and then a silane coupling agent or polymer base coating can be used to enhance the adhesion of subsequent slurry. When the heat sink 3 is made of copper, it can be lightly oxidized or roughened to improve the interlayer mechanical bonding ability.

[0035] To ensure long-term operational stability, a localized moisture-permeable protective layer, an edge insulation limiting layer, a hydrophobic and water-blocking layer, and a mesh mechanical support layer can be installed on the outside of the hydro-voltaic power generation unit. The moisture-permeable protective layer can be made of a moisture-permeable but non-conductive polymer porous membrane; the edge insulation limiting layer is used to define the electrode boundaries and reduce short circuits caused by liquid water bridging; the hydrophobic and water-blocking layer is used to suppress the accumulation of condensate at the fin roots or lead wire areas.

[0036] like Figure 3 As shown, the water-based photovoltaic power generation units on the surfaces of multiple heat dissipation fins 9 can be constructed in segments along the length of the fins, or alternately along adjacent fins. For scenarios requiring higher output voltage, multiple adjacent or segmented units can be connected in series; for scenarios requiring higher output current, similar units on multiple fins can be connected in parallel to combine current; for scenarios requiring both voltage and current, a series-parallel hybrid connection can be used to form an array.

[0037] Each heat sink fin 9 can be equipped with 1 to 6 groups of strip-shaped, block-shaped, dot-matrix-shaped, or comb-shaped units; the entire heat sink can form an array of water-cooled units. Lead-out electrodes can be arranged on the top of the fin, the root of the fin, the side of the base, or on a dedicated busbar, and are isolated by insulating encapsulation.

[0038] 4. Power Management Module like Figure 2 As shown, both the thermoelectric generator 2 and the hydroelectric power generation unit are connected to the power management module. The power management module may include a rectifier unit, an anti-backflow unit, a DC-DC / buck-buck unit, a maximum power matching unit, an energy storage management unit, and a load switching unit, used to process the two outputs individually or in combination.

[0039] In one operating mode, the thermoelectric generator 2 supplies power to the load alone, while the hydroelectric generator unit is used to assist in heat dissipation. In another operating mode, the hydroelectric generator unit maintains the standby load alone when the ambient humidity is high. In a further operating mode, the two outputs are rectified and power matched together to charge the supercapacitor or micro battery, and then the energy storage unit supplies power to the sensor, micro fan, indicator light or wireless transmitter unit.

[0040] IV. Device Working Principle The main heat dissipation path of the GPU chip generates a lot of heat during operation, which is transferred to the thermoelectric generator 2 via thermal grease, and then conducted to the aluminum heat sink. Basic heat dissipation is completed by convection through the heat sink fins 9, ensuring the stable operating temperature of the chip 1.

[0041] First-stage energy recovery (thermal energy conversion): Thermoelectric generator 2 relies on the high-temperature hot end of chip 1 and the low-temperature cold end of heat sink 3 to form a stable temperature difference, directly converting the waste heat of chip 1 into electrical energy, thus completing the initial recovery of waste heat.

[0042] Secondary energy recovery (hydrovoltaic power generation): After the heat dissipation fins 9 absorb waste heat, their temperature rises. The hydrovoltaic power generation unit integrated on the surface of the fins adsorbs ambient moisture. The adsorption and natural evaporation of moisture generate charge separation, realizing secondary interface energy power generation. At the same time, the evaporation of moisture carries away the latent heat of the fins, actively reducing the overall temperature of the heat dissipation fins 3, reducing the temperature rise of the cold end of the thermoelectric generator fins 2, and in turn improving the working efficiency of thermoelectric power generation, forming a synergistic effect of heat dissipation and power generation.

[0043] The system integrates the power generated from two sources and connects them to a power management module. After voltage stabilization and energy storage, it can independently power peripherals such as low-power sensors, operation indicator lights, and miniature cooling auxiliary fans, thereby realizing the utilization of waste heat resources.

[0044] Example 2 This invention also provides a method for fabricating a water-cooled dual-channel heat recovery chip heat dissipation device, such as... Figure 5 As shown, it includes the following steps: Step S1, Surface pretreatment of heat dissipation fins 9: Select finished aluminum plate heat sink fins 9, first use alkaline degreaser to remove oil and impurities from the surface of the fins, then use pure water for ultrasonic cleaning and drying; then roughen the surface of the fins by sandblasting, perform hard anodizing treatment, and finally apply a silane coupling agent primer to improve the adhesion of the functional layer, and let it cure at room temperature for later use.

[0045] Step S2: Fabrication of a hydro-voltaic power generation composite unit on the fin surface: Using screen printing technology, aluminum-zinc composite negative electrode paste is uniformly coated on the surface of the pre-treated heat dissipation fins 9, dried and compacted at a low temperature of 60°C to form a water-based negative electrode layer 4. Salt-modified ion-gel membrane slurry is coated onto the surface of the negative electrode layer using a scraping process, and then cured under ultraviolet light to form a stable moisture-absorbing and ion-conducting membrane layer. The graphene composite carbon paste cathode material is screen-printed again, and after natural air drying, it is lightly pressed a second time to form a water-based cathode layer 6. After all functional layers are prepared, an insulating limiting adhesive is applied to the edge of the water-voltaic unit, a porous and moisture-permeable protective film is attached to the outer surface, and the water-voltaic positive electrode busbar 8 and water-voltaic negative electrode busbar 7 are led out and waterproof encapsulated.

[0046] Step S3: Assemble thermoelectric generator 2: Apply thermal grease evenly to the heat dissipation surface of the GPU chip and attach it to the hot end of the thermoelectric generator 2; apply thermal grease to the cold end of the thermoelectric generator 2 as well, precisely align and attach it to the center of the aluminum heat sink base, and press it firmly to eliminate contact gaps.

[0047] Step S4: Overall circuit connection and finished product forming: All the water-based photovoltaic power generation unit bus lines and thermoelectric generator positive and negative lines led out from the heat sink 9 are connected to the preset power management module. The circuit layout, insulation fixation and functional debugging are completed, and finally the water-based photovoltaic dual-channel heat recovery chip heat dissipation device is produced.

[0048] The actual usage effect is as follows: Heat dissipation performance: Compared with traditional pure aluminum heat sinks, the operating temperature of chip 1 is reduced by 7~12℃ under the same power consumption, and the heat dissipation stability is greatly improved; Power generation benefits: Under normal temperature and humidity conditions, the dual-channel power generation of thermoelectric power generation and hydroelectric power generation can stably meet the daily power needs of low-power auxiliary devices of industrial control equipment without the need for external auxiliary power supply. Adaptability: No need to create a new mold to make a special heat dissipation structure. It can be directly modified and prepared based on the commercially available heat sinks. The processing technology is simple, the modification cost is low, and it can be promoted and applied in batches. Stability: With pretreatment and multi-layer protection structure design, the device can operate stably for a long time in humid and vibrating industrial environments without electrode short circuits or functional layer delamination failure.

[0049] Applicable expansion scope: The structure and manufacturing process of this embodiment can be directly adapted to the heat dissipation scenarios of various high heat flux density electronic components such as server chips, automotive power devices, laser driver chips, and new energy electronic control modules. Adaptation and modification can be completed simply by adjusting the size of the heat sink, the fin parameters, and the thickness of the water-cooled functional layer as needed.

[0050] Therefore, the present invention adopts the above-mentioned water-voltaic dual-channel heat recovery chip heat dissipation device and its preparation method to solve the problems of traditional heat sinks having no energy recovery, limited power generation efficiency of single temperature difference, and incompatibility between water-voltaic devices and heat dissipation structures, while having good adhesion, moisture permeability, ion conduction ability and electrode stability.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of the present invention, and these modifications or equivalent substitutions cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A water-cooled dual-channel heat recovery chip heat dissipation device, characterized in that: It includes a chip, a thermoelectric generator and a heat sink that are thermally coupled together from top to bottom; the heat sink includes a heat sink base and multiple outwardly extending heat sink fins, and a water-voltaic power generation unit is integrated on the surface of the heat sink fins. The water-voltaic power generation unit includes a water-voltaic negative electrode layer, a water-voltaic membrane layer and a water-voltaic positive electrode layer arranged from the inside to the outside.

2. The water-cooled dual-channel heat recovery chip heat dissipation device according to claim 1, characterized in that: The heat sink is one of the following types: plate fin, needle fin, comb fin, corrugated fin, and slotted fin, and the material is one of the following: copper, aluminum, iron, graphite, and carbon / metal composite thermal conductive materials.

3. The water-cooled dual-channel heat recovery chip heat dissipation device according to claim 1, characterized in that: The heat dissipation fins have a fin height of 2-80mm, a thickness of 0.1-5.0mm, a spacing of 0.2-10mm between adjacent heat dissipation fins, and a number of 2-500 heat dissipation fins. The coverage rate of the hydro-voltaic power generation unit on one side of a single heat dissipation fin is 20%-95%.

4. The water-cooled dual-channel heat recovery chip heat dissipation device according to claim 1, characterized in that: The hydroelectric power generation unit is arranged on the surface of the heat dissipation fins in a strip, block, dotted, comb-like, segmented, or partially island-like manner, and is located on one side, two sides, the top surface of the heat dissipation fins, or a combination of one side, two sides, and the top surface of the fins.

5. The water-cooled dual-channel heat recovery chip heat dissipation device according to claim 1, characterized in that: The water-based positive electrode layer is one of carbon slurry, activated carbon slurry, conductive carbon black slurry, carbon nanotube slurry, graphene slurry, carbon fiber slurry, or a composite conductive layer thereof, with a thickness of 1~500μm; the water-based negative electrode layer is one of Zn, Al, Fe powder film, metal slurry, metal foil, ZIF-8 slurry layer, LDH slurry layer, or a composite slurry layer thereof, with a thickness of 1~1000μm; the water-based membrane layer includes a moisture-absorbing membrane layer or an electrolyte layer, and the water-based membrane layer is one of hydrogel, ionogel, porous cellulose membrane, porous polymer membrane, salt-modified moisture-absorbing membrane, or a composite layer thereof, with a thickness of 10μm~5mm.

6. The water-cooled dual-channel heat recovery chip heat dissipation device according to claim 1, characterized in that: The heat dissipation fins and the hydrovoltaic power generation unit are further provided with one of the following: a base coating layer, a surface roughening layer, an oxide layer, a coupling agent layer, a conductive transition layer, or an adhesive layer. The base layer is a resin base layer or a metal base layer, the surface roughening layer is a sandblasting roughening layer or a chemical etching roughening layer, and the conductive transition layer is a metal transition layer or a conductive adhesive transition layer. The outer side of the hydroelectric power generation unit is provided with one of the following: a local moisture-permeable protective layer, an edge insulation limiting layer, a hydrophobic and water-blocking layer, and a mesh mechanical support layer, or a combination layer formed by stacking at least two of the above layers.

7. The water-cooled dual-channel heat recovery chip heat dissipation device according to claim 1, characterized in that: Multiple hydro-voltaic power generation units are connected in series, in parallel, or in a series-parallel manner; the hydro-voltaic power generation units on multiple heat dissipation fins are connected in series in segments along the length of the fins, or connected in parallel along the direction of adjacent heat dissipation fins.

8. The water-cooled dual-channel heat recovery chip heat dissipation device according to claim 1, characterized in that: The hot end of the thermoelectric generator faces the chip, and the cold end faces the heat sink. The thickness of the thermoelectric generator is 0.2~5mm. The hydro-voltaic power generation unit is equipped with a hydro-voltaic positive busbar and a hydro-voltaic negative busbar that are connected to an external power management module. The power management module is electrically connected to the thermoelectric generator and the hydro-voltaic power generation unit respectively, and is used to perform rectification, backflow prevention, voltage boosting, voltage bucking, voltage stabilization, maximum power matching, energy storage charging or load switching.

9. A method for preparing a water-cooled dual-channel heat recovery chip heat dissipation device as described in any one of claims 1 to 8, characterized in that, Includes the following steps: S1. Degrease, clean, roughen, oxidize, plasma activate, anodize, sandblast, or pre-treat the surface of the heat sink fins; S2. A composite structure of a hydrovoltaic positive electrode layer, a hydrovoltaic membrane layer and a hydrovoltaic negative electrode layer is formed on the surface of the heat dissipation fins to obtain a fin-integrated hydrovoltaic power generation unit. S3. Assemble the thermoelectric generator between the chip and the heat sink; S4. Connect the hydrovoltaic power generation unit and the thermoelectric generator to the power management module to obtain a hydrovoltaic dual-channel heat recovery chip heat dissipation device.

10. The method for preparing a water-cooled dual-channel heat recovery chip heat dissipation device according to claim 9, characterized in that: Step S2 involves depositing the hydrovoltaic positive electrode layer, hydrovoltaic separator layer, and hydrovoltaic negative electrode layer using one of the following methods: screen printing, scraping, spraying, dripping, stencil transfer, inkjet printing, 3D printing, impregnation, lamination, or molding. The hydrovoltaic separator layer undergoes drying, cross-linking, gelation, freeze-thaw, thermal curing, UV curing, or ion exchange treatment. The hydrovoltaic negative electrode layer and hydrovoltaic positive electrode layer undergo low-temperature drying, compaction, or secondary coating treatment.

Images