Packaging substrate magnetic burying method and packaging substrate

Abstract

A packaging substrate magnetic embedding method and a packaging substrate, wherein the packaging substrate magnetic embedding method comprises the following steps: opening a first through hole on the surface of a copper-clad core plate; filling a magnetic core at the first through hole; forming a first channel through the magnetic core on the copper-clad core plate, and forming a second channel through the magnetic core at a position other than the first through hole; arranging a first conductive layer on the inner wall of the first channel and the inner wall of the second channel; filling a non-magnetic material layer on the inner ring of the first conductive layer; covering a second conductive layer on the surface of the copper-clad core plate; and removing the second conductive layer at the positions of the first channel and the second channel on the surface of the copper-clad core plate. The packaging substrate magnetic embedding method and the packaging substrate provided by the application can prevent the magnetic material from being delaminated after being embedded.

Description

Technical Field

[0001] This invention relates to the field of packaging substrate technology, and in particular to a method for embedding magnets in a packaging substrate and a packaging substrate. Background Technology

[0002] With the rapid development of electronic technology, especially in high-frequency, high-speed signal transmission and electromagnetic compatibility, the requirements for packaging substrates are becoming increasingly stringent. Against the backdrop of the rapid development of high-frequency computing chips and AI computing chips in electronic products, the demand for packaging substrates with multifunctionality, high reliability, high quality, and low power consumption continues to grow. Traditional embedded magnetic processes have many quality problems, mainly concentrated in the process of embedding magnetic materials, where delamination, splitting, and weak bonding are prone to occur, affecting the overall performance and reliability of the substrate.

[0003] To address these issues, the industry has begun exploring novel chip packaging solutions in recent years. Among these, the method of directly embedding magnetic materials within the packaging substrate has attracted significant attention. This method can reduce the area occupied by components on the board, shrink the three-dimensional dimensions of electronic products, shorten the minimum distance for electrical signal transmission, and minimize signal attenuation issues in printed circuits, thereby improving signal transmission integrity. However, achieving a good bond between the magnetic material and the packaging substrate while ensuring the performance of the magnetic material remains a key technical challenge. Therefore, there is an urgent need to develop a stable embedded magnetic process for use in packaging substrates. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide a method for embedding magnets in a packaging substrate and a packaging substrate, so that the magnetic material is less likely to delaminate after being embedded.

[0005] To achieve the above objectives, this application provides a method for embedding magnets in a packaging substrate, comprising: A first through hole is made on the surface of the copper-clad laminate; Fill the first through hole with a magnetic core; A first channel penetrating the magnetic core is formed on the copper-clad core board, and a second channel penetrating the magnetic core is formed at locations other than the first through hole; A first conductive layer is provided on the inner wall of the first channel and the inner wall of the second channel; A non-magnetic material layer is filled in the inner circle of the first conductive layer; A second conductive layer is applied to the surface of the copper-clad laminate. Remove the second conductive layer from the non-first channel area and non-second channel area on the surface of the copper-clad laminate.

[0006] Preferably, after the step of filling the magnetic core at the first through hole, the method further includes: The surface of the magnetic core is brushed and polished to make it level with the surface of the copper-clad laminate.

[0007] Preferably, the step of brushing the surface of the magnetic core to make it level with the surface of the copper-clad laminate further includes: Remove the non-insulating material layer from the surface of the copper-clad laminate.

[0008] Preferably, after the step of removing the non-insulating material layer on the surface of the copper-clad laminate, and before the steps of forming a first channel penetrating the magnetic core on the copper-clad laminate and forming a second channel penetrating the magnetic core at locations other than the first through-hole, the method further includes: A dielectric layer is laid on the surface of the copper-clad laminate, and a third conductive layer is laid on the side of the dielectric layer facing away from the copper-clad laminate.

[0009] Preferably, after the step of forming the first channel through the magnetic core on the copper-clad core board, the method further includes: Ultrasonic cleaning of copper-clad laminates is performed in an alternating magnetic field.

[0010] Preferably, the step of forming the first conductive layer includes: First, a chemical copper layer is deposited on the inner wall of the first channel and the inner wall of the second channel, and then an electroplated copper layer is formed on the surface of the chemical copper layer.

[0011] Preferably, the second conductive layer comprises first depositing a chemical copper layer, and then forming an electroplated copper layer on the surface of the chemical copper layer.

[0012] Preferably, the step of brushing the surface of the magnetic core to make it level with the surface of the copper-clad laminate further includes: Thin the non-insulating material layer on the surface of the copper-clad laminate.

[0013] Preferably, after the step of removing the non-insulating material layer on the surface of the copper-clad laminate, the method further includes: A second magnetic material layer is disposed on the surface of the magnetic core, the second magnetic material layer covers the magnetic core, and the diameter of the second magnetic material layer is larger than the diameter of the magnetic core.

[0014] Preferably, the first channel extends through the second magnetic material layer.

[0015] Preferably, the first conductive layer further includes an inner wall disposed on the second magnetic material layer.

[0016] Preferably, the second conductive layer further includes a layer covering the second magnetic material.

[0017] Preferably, the step of removing the second conductive layer from the non-first channel region and non-second channel region on the surface of the copper-clad laminate further includes: The second conductive layer covering the region of the second magnetic material layer is retained.

[0018] Preferably, the step of filling the first through hole with the magnetic core further includes: The magnetic core is ring-shaped; When the annular magnetic core is placed in the first through hole, the pressing material between the magnetic core and the inner wall of the first through hole is heated. The glass transition temperature of the laminating material is greater than 150 degrees Celsius and less than 200 degrees Celsius.

[0019] Preferably, the heating includes a pre-baking section and a melting section, wherein the temperature of the pre-baking section is 20 degrees Celsius below the glass transition point of the pressed material, and the temperature of the melting section is 20 degrees Celsius above the glass transition point of the pressed material. The temperature rise rate from the pre-baking section to the melting section is 1 to 5 degrees Celsius per minute.

[0020] To achieve the above objectives, a packaging substrate is also included, which is prepared using the above-described method for embedding magnets in a packaging substrate.

[0021] The above technical solutions ensure good adhesion of the embedded magnetic material, preventing delamination. The method of first depositing chemical copper followed by electroplating enhances copper adhesion while reducing production costs. The ring-shaped magnetic core design, combined with the use of bonding materials, further improves the core's bonding strength, preventing delamination. The use of ultrasonic waves and alternating magnetic fields after drilling the magnetic core removes magnetic powder, improving product yield. The second magnetic material layer further increases the contact area during subsequent product use.

[0022] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing this application. Attached Figure Description

[0023] The accompanying drawings are provided to further illustrate the present application and form part of the specification. Together with the embodiments of the present application, they serve to explain the present application but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the method for embedding magnets in a packaging substrate according to an embodiment of this application; Figure 2 This is a schematic diagram of the process structure of a method for embedding magnets in a packaging substrate according to an embodiment of this application; Figure 3 This is a schematic diagram of the process structure of a method for embedding magnets in a packaging substrate according to another embodiment of this application; Figure 4 This is a schematic diagram of the process structure of a method for embedding magnets in a packaging substrate according to another embodiment of this application; Figure 5 This is a schematic diagram of the process structure of a method for embedding magnets in a packaging substrate according to another embodiment of this application.

[0024] Figure label: 100 - Copper-clad laminate; 101 - Insulating layer; 102 - Conductive layer; 103 - First through hole; 104 - Magnetic core; 105 - Dielectric layer; 106 - Third conductive layer; 107 - First channel; 108 - Second channel; 109 - First conductive layer; 110 - Non-magnetic material layer; 111 - Second conductive layer; 112 - Second magnetic material layer. Detailed Implementation

[0025] The preferred embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0026] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While some embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this application. It should be understood that the drawings and embodiments of this application are for illustrative purposes only and are not intended to limit the scope of protection of this application.

[0027] The term "comprising" and its variations as used herein are open-ended inclusions, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the description below.

[0028] It should be noted that the terms "first" and "second" may be used in this application only to distinguish different devices, components or parts, and are not used to define the order of functions performed by these devices, components or parts or their interdependence.

[0029] It should be noted that the terms "one" and "more" used in this application are illustrative rather than restrictive, and those skilled in the art should understand that, unless explicitly stated otherwise in the context, they should be understood as "one or more". "More" should be understood as two or more.

[0030] The method for embedding magnets in the packaging substrate of this application includes: A first through hole 103 is made on the surface of the copper-clad core board 100; A magnetic core 104 is filled into the first through hole 103; A first channel 107 is formed on the copper-clad core 100 to penetrate the magnetic core 104, and a second channel 108 is formed at a location other than the first through hole 103 to penetrate the magnetic core 104. A first conductive layer 109 is provided on the inner wall of the first channel 107 and the inner wall of the second channel 108; A non-magnetic material layer 110 is filled in the inner ring of the first conductive layer 109; A second conductive layer 111 is covered on the surface of the copper-clad laminate 100; Remove the second conductive layer 111 from the non-first channel 107 region and non-second channel 108 region on the surface of the copper clad laminate 100.

[0031] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0032] Example 1 Figure 1 This is a schematic diagram of the method for embedding magnets in a packaging substrate according to an embodiment of this application. Figure 2 This is a schematic diagram of the process structure of a method for embedding magnets in a packaging substrate according to an embodiment of this application. Figure 3 This is a schematic diagram of the process structure of a method for embedding magnets in a packaging substrate according to another embodiment of this application. Figure 4 This is a schematic diagram of the process structure of a method for embedding magnets in a packaging substrate according to another embodiment of this application. Figure 5 This is a schematic diagram of the process structure of a method for embedding magnets in a packaging substrate according to another embodiment of this application, as shown below. Figure 1-5 As shown in the embodiment of this application, the method for embedding magnets in a packaging substrate is used to perform magnetization treatment on the packaging substrate.

[0033] First, in step S10, a first through hole is opened on the surface of the copper-clad laminate.

[0034] In an exemplary embodiment, the substrate used in this application is a copper-clad laminate 100, i.e., a copper-clad laminate (CCL), in which there is an insulating dielectric layer, i.e., an insulating layer 101, and a conductive copper foil is covered on the surface to form a conductive layer 102; the conductive copper foil is, for example, an electrolytic copper foil or a rolled copper foil; the middle insulating dielectric layer is made of resin or a composite structure of resin and glass fiber.

[0035] In one exemplary embodiment, a first through hole 103 is first opened on the surface of the copper-clad core board 100. The size and number of the first through holes 103 and the spacing between them can be set as needed.

[0036] In step S20, a magnetic core is filled into the first through hole.

[0037] In an exemplary embodiment, after the first through hole 103 is opened, a magnetic core 104 is also required to be filled into the first through hole 103. The magnetic core 104 is made by selecting a magnetic material, which can be formed by solidifying the magnetic material in the first through hole 103, for example, by filling with magnetic ink and then solidifying it. That is, the magnetic core 104 in this embodiment is filled by a paste-like flow.

[0038] In one exemplary embodiment, when filling the magnetic core 104, the length dimension of the magnetic core 104 corresponds to the depth dimension of the first through hole 103, and is usually chosen to be the same or the length dimension of the magnetic core 104 is slightly larger than the depth dimension of the first through hole 103.

[0039] In one exemplary embodiment, the process of filling the magnetic core 104 includes, but is not limited to, printing, horizontal plugging, and vertical plugging; the plugging method includes, but is not limited to, vacuum plugging or non-vacuum plugging.

[0040] In one exemplary embodiment, the magnetic core 104 may also be a ring-shaped magnetic core, in which the cured magnetic material is filled into the first through-hole 103. Figure 5 As shown in step S20, when the annular magnetic core 104 is placed inside the first through hole 103, the pressing material disposed between the magnetic core 104 and the inner wall of the first through hole 103 is heated; that is, pressing material is filled between the annular magnetic core 104 and the inner wall of the first through hole 103. The glass transition temperature of the pressing material is greater than 150 degrees Celsius and less than 200 degrees Celsius. The heating of the pressing material is divided into two heating sections: a pre-baking section and a melting section. The temperature of the pre-baking section is 20 degrees Celsius below the glass transition point of the pressing material, and the temperature of the melting section is 20 degrees Celsius above the glass transition point of the pressing material. The heating slope from the pre-baking section to the melting section is 1 to 5 degrees Celsius per minute. Taking a glass transition temperature of 175 degrees Celsius for the laminating material as an example, it is first pre-baked at 155 degrees Celsius, and then heated to 195 degrees Celsius at a rate of 2 degrees Celsius per minute to melt the laminating material. The melting of the laminating material makes the magnetic core 104 adhere more firmly to the inner wall of the first through-hole 103, preventing subsequent delamination. Of course, after the melting process, a cooling process is also included; the cooling process can be the reverse of the heating process.

[0041] In one exemplary embodiment, the annular magnetic core 104 may be a solid magnetic blank made by pre-pressing dry magnetic powder with a small amount of binder and then embedding it into the first through hole 103.

[0042] In one exemplary embodiment, after filling the first through hole 103 with the magnetic core 104 as needed, the surface of the magnetic core 104 may optionally be brushed and polished so that it is at the same level as the surface of the copper-clad laminate 100; that is, the end face of the magnetic core 104 is flush with the surface of the copper-clad laminate 100.

[0043] In one exemplary embodiment, if necessary, the surface of the copper-clad laminate 100 can be brushed and polished simultaneously with the magnetic end face to ensure the surface flatness of the copper-clad laminate 100. If necessary, brushing and polishing the surface of the copper-clad laminate 100 also includes removing the non-insulating material layer from the surface of the copper-clad laminate 100, that is, directly brushing away the copper foil from the surface of the copper-clad laminate 100, so that the insulating dielectric layer is directly exposed. Figure 2 As shown in step S21, a dielectric layer 105 can be laid on the surface of the copper-clad laminate 100, that is, a dielectric layer 105 can be laid on the upper and lower surfaces of the insulating dielectric layer to improve the strength of the insulating dielectric layer and also improve the insulation performance; then, a third conductive layer 106 is laid on the side of the dielectric layer 105 facing away from the copper-clad laminate 100, and the structure is as follows. Figure 2 Step S22 is shown in the diagram.

[0044] As needed, the third conductive layer 106 can be prepared using the same process as the first conductive layer 109 and the second conductive layer 111.

[0045] In one exemplary embodiment, the dielectric material used for the dielectric layer 105 includes, for example, PP (prepreg), BT resin (Bismaleimide Triazine), PI (Polyimide), and ABF film (Ajinomoto Build-up Film). In this embodiment, the dielectric layer is bonded to the copper foil, for example, the dielectric layer 105 and the third conductive layer 106 are pressed together during use to ensure the bonding strength between the dielectric layer 105 and the third conductive layer 106.

[0046] In one exemplary embodiment, the surface of the copper-clad laminate 100 may be further thinned, as needed, by brushing the surface of the copper-clad laminate 100 to reduce the thickness of a non-insulating material layer; that is, the copper foil on the surface of the copper-clad laminate 100 is thinned. Thinning, as the name suggests, means that the surface brushing process does not completely remove the copper foil layer. Its structure is as follows: Figure 3 As shown in step S211, or Figure 4 The steps S21 / S211 are shown in the diagram. Figure 4 Steps S21 / S211 in the text can be understood as follows: Figure 4 The copper-clad laminate 100 can be processed by either thinning the copper foil or removing it directly.

[0047] In one exemplary embodiment, after removing the non-insulating material layer from the surface of the copper-clad laminate 100, the method further includes: depositing a second magnetic material layer 112 on the surface of the magnetic core 104, the second magnetic material layer 112 covering the magnetic core 104, and the diameter of the second magnetic material layer 112 being larger than the diameter of the magnetic core 104, as shown in the figure. Figure 4 As shown in step S23; the purpose of this setting is to increase the contact area of ​​the subsequent first channel 107, for example, to increase the contact area with the first conductive layer 109.

[0048] Step S30: A first channel penetrating the magnetic core is formed on the copper-clad core board, and a second channel penetrating the magnetic core is formed at a location other than the first through hole.

[0049] In an exemplary embodiment, when the magnetic core 104 fills the first through hole 103, a through hole needs to be drilled in the magnetic core 104 in order to form the first channel 107; that is, the first channel 107 is formed through the interior of the magnetic core 104.

[0050] In an exemplary embodiment, a second channel 108 penetrating the magnetic core 104 is formed on the copper-clad core board 100 at a location other than the first through hole 103. That is, the first through hole 103 and the second channel 108 are two channels parallel to each other on the copper-clad core board 100, and the first through hole 103 and the second channel 108 do not overlap each other. As needed, the second channel 108 can be a channel opened after the magnetic core 104 is filled in the first through hole 103, or it can be a through hole formed by drilling through the copper-clad core board 100 at the same time as the first through hole 103. For ease of explanation, the second channel 108 in this application is explained as a through hole formed on the copper-clad core board 100 after the magnetic core 104 is filled in the first through hole 103.

[0051] In one exemplary embodiment, after forming a first channel 107 through the magnetic core 104 on the copper-clad substrate 100, the copper-clad substrate is further subjected to ultrasonic cleaning in an alternating magnetic field. The purpose of this step is to remove magnetic powder introduced by drilling holes in the magnetic field.

[0052] In one exemplary embodiment, when a second magnetic material layer 112 is provided, the first channel 107 also extends through the second magnetic material layer 112.

[0053] Step S40: A first conductive layer is provided on the inner wall of the first channel and the inner wall of the second channel.

[0054] In one exemplary embodiment, the first conductive layer 109 may be a copper layer, such as a copper layer produced by pulse electroplating, which improves the uniformity of the copper layer through intermittent reverse pulses. Alternatively, the copper layer may be formed by first depositing a chemical copper layer on the inner wall of the first channel 107 and the inner wall of the second channel 108, and then forming an electroplated copper layer on the surface of the chemical copper layer. This arrangement makes the copper layer more robust while also considering economic efficiency and reducing production costs.

[0055] In one exemplary embodiment, as needed, the first conductive layer 109 may be formed on the inner walls of the first channel 107 and the second channel 108, and may also include layers formed on the upper and lower surfaces of the copper-clad laminate 100, such as... Figure 4 As shown.

[0056] In one exemplary embodiment, when a second magnetic material layer 112 is provided, the first conductive layer 109 further includes an inner wall disposed on the second magnetic material layer 112.

[0057] Step S50: Fill the inner ring of the first conductive layer with a non-magnetic material layer.

[0058] In one exemplary embodiment, the inner ring of the first conductive layer 109 is the inner wall of the first conductive layer 109.

[0059] In one exemplary embodiment, after the first conductive layer 109 is provided on the inner wall of the first channel 107 and the inner wall of the second channel 108, a non-magnetic material layer 110 is then filled, such as non-magnetic ink.

[0060] In one exemplary embodiment, after the non-magnetic ink has been filled and cured, the ink surface may optionally be brushed and polished so that the upper and lower end faces of the ink are flush with the upper and lower surfaces of the copper-clad laminate 100.

[0061] In one exemplary embodiment, when the first conductive layer 109 is also formed on the upper and lower surfaces of the copper-clad laminate 100, a non-magnetic material layer 110 is filled to the point that its ends are flush with the first conductive layer 109 on the upper and lower surfaces of the copper-clad laminate 100, as shown in the following structure. Figure 4 The steps are shown in step S50.

[0062] Step S60: Cover the surface of the copper-clad laminate with a second conductive layer.

[0063] In an exemplary embodiment, after non-magnetic ink is applied to both the first channel 107 and the second channel 108, a second conductive layer 111 is applied to the upper and lower surfaces of the copper-clad laminate 100; the second conductive layer 111 simultaneously covers the first channel 107 and the second channel 108.

[0064] In one exemplary embodiment, the second conductive layer 111 may also be a copper layer, which may be completed using the same process as the first conductive layer 109, i.e., first depositing a chemical copper layer and then placing an electroplated copper layer.

[0065] In one exemplary embodiment, when the second magnetic material layer 112 is provided, the second conductive layer 111 further includes covering the second magnetic material layer 112.

[0066] Step S70: Remove the second conductive layer from the non-first channel area and non-second channel area on the surface of the copper-clad laminate.

[0067] In one exemplary embodiment, for ease of explanation and subsequent use of the product, the first channel 107 region is circularly arranged on the surface of the substrate with the central axis of the first through hole 103 as the center. The diameter of this circle is slightly larger than the diameter of the first through hole 103, thus providing a larger contact area during subsequent product use. Similarly, the second channel 108 region has the same structure as the first channel 107 region. The second channel 108 region refers to a circular structure on the substrate surface. Removing the second conductive layer 111 means retaining the circular areas corresponding to the first channel 107 region and the second channel 108 region, and removing all other parts. In this way, the substrate surface, except for these two types of circular areas, is entirely exposed with insulating material.

[0068] Example 2 Example 2 is a packaging substrate, which is prepared using the packaging substrate embedding magnetization method described in the above examples.

[0069] It will be understood by those skilled in the art that the above are merely preferred embodiments of this application and are not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for embedding magnets in a packaging substrate, characterized in that, include: A first through hole is made on the surface of the copper-clad laminate; Fill the first through hole with a magnetic core; The magnetic core is ring-shaped; When the annular magnetic core is placed in the first through hole, the pressing material disposed between the magnetic core and the inner wall of the first through hole is subjected to heat treatment; The glass transition temperature of the laminating material is greater than 150 degrees Celsius and less than 200 degrees Celsius. A first channel penetrating the magnetic core is formed on the copper-clad core board, and a second channel penetrating the magnetic core is formed at a location other than the first through hole; A first conductive layer is provided on the inner wall of the first channel and the inner wall of the second channel; A non-magnetic material layer is filled in the inner circle of the first conductive layer; A second conductive layer is applied to the surface of the copper-clad laminate. Remove the second conductive layer from the non-first channel region and non-second channel region on the surface of the copper-clad laminate.

2. The method for embedding magnets in a packaging substrate according to claim 1, characterized in that, After the step of filling the first through hole with the magnetic core, the method further includes: The surface of the magnetic core is brushed and polished to make it level with the surface of the copper-clad core board.

3. The method for embedding magnets in a packaging substrate according to claim 2, characterized in that, The step of brushing the surface of the magnetic core to make it level with the surface of the copper-clad core board further includes: Remove the non-insulating material layer from the surface of the copper-clad laminate.

4. The method for embedding magnets in a packaging substrate according to claim 3, characterized in that, After the step of removing the non-insulating material layer from the surface of the copper-clad laminate, and before the steps of forming a first channel penetrating the magnetic core on the copper-clad laminate and forming a second channel penetrating the magnetic core at a location other than the first through-hole, the method further includes: A dielectric layer is disposed on the surface of the copper-clad laminate, and a third conductive layer is disposed on the side of the dielectric layer opposite to the copper-clad laminate.

5. The method for embedding magnets in a packaging substrate according to claim 4, characterized in that, After the step of forming a first channel through the magnetic core on the copper-clad core board, the method further includes: The copper-clad laminate is cleaned using ultrasonic cleaning in an alternating magnetic field.

6. The method for embedding magnets in a packaging substrate according to claim 1, characterized in that, The steps for forming the first conductive layer include: First, chemical copper layers are deposited on the inner walls of the first channel and the second channel, and then an electroplated copper layer is formed on the surface of the chemical copper layers.

7. The method for embedding magnets in a packaging substrate according to claim 1, characterized in that, The second conductive layer comprises first depositing a chemical copper layer, and then forming an electroplated copper layer on the surface of the chemical copper layer.

8. The method for embedding magnets in a packaging substrate according to claim 2, characterized in that, The step of brushing the surface of the magnetic core to make it level with the surface of the copper-clad core board further includes: Thin the non-insulating material layer on the surface of the copper-clad laminate.

9. The method for embedding magnets in a packaging substrate according to claim 3, characterized in that, After the step of removing the non-insulating material layer from the surface of the copper-clad laminate, the method further includes: A second magnetic material layer is disposed on the surface of the magnetic core, the second magnetic material layer covers the magnetic core, and the diameter of the second magnetic material layer is larger than the diameter of the magnetic core.

10. The method for embedding magnets in a packaging substrate according to claim 9, characterized in that, The first channel extends through the second magnetic material layer.

11. The method for embedding magnets in a packaging substrate according to claim 10, characterized in that, The first conductive layer also includes an inner wall disposed on the second magnetic material layer.

12. The method for embedding magnets in a packaging substrate according to claim 11, characterized in that, The second conductive layer also includes a layer covering the second magnetic material.

13. The method for embedding magnets in a packaging substrate according to claim 12, characterized in that, The step of removing the second conductive layer from the non-first channel region and non-second channel region on the surface of the copper-clad laminate further includes: The second conductive layer covering the region of the second magnetic material layer is retained.

14. The method for embedding magnets in a packaging substrate according to claim 1, characterized in that, The heating includes a pre-baking section and a melting section. The temperature of the pre-baking section is 20 degrees Celsius below the glass transition point of the pressed material, and the temperature of the melting section is 20 degrees Celsius above the glass transition point of the pressed material. The temperature rise rate from the pre-baking section to the melting section is 1 to 5 degrees Celsius per minute.

15. A packaging substrate, characterized in that, It is prepared by the method of embedding magnets in the packaging substrate as described in any one of claims 1-14.

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