A substrate preparation apparatus for semiconductor material packaging

Abstract

The application relates to the technical field of semiconductor packaging and discloses a substrate preparation device for semiconductor material packaging, which comprises an outer shell body, a plurality of copper foils are arranged in a stacked mode in the outer shell body, through holes for placing semiconductors are formed in the plurality of copper foils, plating layers are arranged in the through holes, and heat dissipation cavities communicated with the through holes are formed between two adjacent copper foils; a plurality of telescopic rods are arranged in the circumferences of the heat dissipation cavities, the output ends of the telescopic rods are connected with clamping pieces, the clamping pieces are used for abutting against the semiconductors, the plurality of telescopic rods in the multilayer heat dissipation cavities are distributed in multiple columns, the output ends of the plurality of telescopic rods in each column are connected through series connection pieces, and a radial displacement mechanism is arranged at the top of the outer shell body. The device can realize stepless adjustment without replacing clamps, the consistency of clamping actions of all layers is guaranteed, the semiconductors are prevented from being inclined, and the heat conduction uniformity and heat dissipation stability in the packaging process are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to an apparatus for preparing a substrate for semiconductor material packaging. Background Technology

[0002] In the semiconductor material packaging process, the substrate fabrication apparatus needs to perform heating, heat dissipation, and fixation operations on the semiconductor chip or substrate. Specifically, in the semiconductor packaging substrate process, through-holes are formed using a copper-clad laminate stacked with copper foil, and the inner surface of the through-holes is plated to electrically connect the upper copper foil to the lower copper foil. Then, photoresist is used to pattern the upper and lower copper foils, thereby manufacturing the semiconductor packaging substrate.

[0003] In existing technologies, the methods for fixing semiconductors in through-holes mostly involve fixed-size slots or grippers, which can only accommodate semiconductor components of a single specification. When the semiconductor diameter or shape changes, different fixtures or mechanical structures need to be replaced, which is cumbersome and affects production efficiency. Especially in multilayer stacked copper foil substrate structures, the internal space of the heat dissipation cavity is limited. How to achieve synchronous, precise, and adaptable centering and clamping of semiconductors of different diameters between different layers has become a key technical challenge restricting packaging quality and yield. Therefore, existing devices generally cannot flexibly adapt to fixing semiconductors of different diameter specifications when performing packaging heating and heat dissipation operations. Summary of the Invention

[0004] The purpose of this invention is to provide a substrate preparation apparatus for semiconductor material packaging, which aims to solve or improve at least one of the above-mentioned technical problems.

[0005] To achieve the above objectives, the present invention provides the following solution: The present invention provides a substrate preparation apparatus for semiconductor material packaging, including an outer shell, in which a plurality of copper foils are stacked, through holes for placing semiconductors are formed in the plurality of copper foils, a plating layer is disposed in the through holes, and a heat dissipation cavity communicating with the through holes is formed between two adjacent copper foils. Multiple telescopic rods are arranged circumferentially in the heat dissipation cavity. The output end of each telescopic rod is connected to a clamping member, which is used to abut against the semiconductor. The multiple telescopic rods in the multi-layer heat dissipation cavity are distributed in multiple rows. The output ends of multiple telescopic rods in each row are connected by a series member. A radial displacement mechanism is provided on the top of the outer shell. The radial displacement mechanism can drive multiple series members to move synchronously toward or away from the axis of the through hole.

[0006] Optionally, the radial displacement mechanism includes: An adjustment ring is rotatably connected to the outer casing via a rotation drive assembly; Multiple displacement plates are connected to the adjusting ring, and the displacement plates are provided with oblique displacement grooves; Multiple connecting plates correspond one-to-one with multiple series components and multiple displacement plates, and the connecting plates are connected to the series components. An adjusting wheel is provided on the connecting plate, and the adjusting wheel is slidably engaged in the displacement groove.

[0007] Optionally, the rotation drive assembly includes: The bearing housing is fixedly mounted on the outer casing by a support plate; A drive motor is fixedly mounted on the support plate. The output shaft of the drive motor is connected to a gear, and the side wall of the adjusting ring is provided with a tooth groove that meshes with the gear.

[0008] Optionally, the connecting component includes multiple collars, each collar being connected to the output end of a multiple telescopic rod and fixed by a fixing pin, and the multiple collars and the connecting plate being connected by a connecting rod.

[0009] Optionally, the clamping element includes a spring rod and an abutment connected together.

[0010] Optionally, multiple blocking boxes are arranged circumferentially inside the heat dissipation cavity. Multiple ventilation holes are symmetrically opened on the two side walls of the blocking boxes. A sliding block is slidably fitted inside the blocking box via a temperature memory alloy component. The sliding block has an oblique hole that allows two asymmetrical ventilation holes to connect. A pair of shielding tapes are connected to each side of the sliding block. The shielding tapes are used to shield the ventilation holes on both sides of the sliding block. A roller is connected to the end of the shielding tape away from the sliding block. The roller is installed in the blocking box via a coil spring shaft. The roller is located outside the ventilation hole at the far end.

[0011] Optionally, a heat conduction plate is connected to the blocking box, and the heat conduction plate is connected to the telescopic rod and the temperature memory alloy component.

[0012] Optionally, it also includes a plurality of air ducts for connecting two adjacent heat dissipation cavities. The air ducts are disposed on the copper foil and have Z-shaped holes at both ends that are respectively connected to the two adjacent heat dissipation cavities. One end of the Z-shaped hole of the air duct at the top of the displacement is connected to the heat dissipation cavity, and the other end is connected to the outside of the device.

[0013] Optionally, a plurality of pads are also included, which are respectively disposed between two adjacent copper foils, so that the heat dissipation cavity is formed between two adjacent copper foils.

[0014] Optionally, each of the two adjacent copper foils is provided with an annular band at its opposite ends to prevent airflow from directly exiting the heat dissipation cavity.

[0015] This invention discloses the following technical advantages: By stacking multiple copper foils within the housing and arranging multiple rows of telescopic rods and clamping components around the through-hole, a top radial displacement mechanism drives multiple series components to move synchronously toward the axis of the through-hole. This allows the output end of each row of telescopic rods to drive the clamping components to move radially in a coordinated manner, thereby enabling the clamping of semiconductor components of different diameters and ensuring that they are always centered and fixed. This solution achieves stepless adjustment without changing the clamps. Simultaneously, the telescopic rods in the multi-layer heat dissipation cavity are linked through series components, ensuring the consistency of clamping actions across each layer and preventing semiconductor misalignment, thus improving the uniformity of heat conduction and the stability of heat dissipation during the packaging process. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 for Figure 1 A magnified view of part A in the image; Figure 3 This is a schematic diagram of the copper foil structure of the present invention; Figure 4 This is a cross-sectional view of the blocking box of the present invention; Figure 5 This is a cross-sectional view of the air duct of the present invention; Figure 6 This is a cross-sectional view of the annular band of the present invention.

[0017] In the diagram: 1. Outer shell; 2. Copper foil; 3. Through hole; 4. Plating layer; 5. Heat dissipation cavity; 6. Telescopic rod; 7. Clamping component; 8. Connecting component; 9. Adjusting ring; 10. Displacement plate; 11. Displacement groove; 12. Connecting plate; 13. Adjusting wheel; 14. Bearing seat; 15. Support plate; 16. Drive motor; 17. Gear; 18. Collar; 19. Connecting rod; 20. Spring rod; 21. Abutment joint; 22. Blocking box; 23. Ventilation hole; 24. Temperature memory alloy component; 25. Sliding block; 26. Inclined hole; 27. Shielding tape; 28. Roller; 29. ​​Spring shaft; 30. Heat conduction plate; 31. Air duct; 32. Z-shaped hole; 33. Pad; 34. Ring belt. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] Reference Figures 1 to 6 This invention provides a substrate fabrication apparatus for semiconductor material packaging, comprising a housing 1, within which multiple copper foils 2 are stacked, and through holes 3 for placing semiconductors are formed within the copper foils 2. A plating layer 4 is disposed within each through hole 3, and a heat dissipation cavity 5 communicating with the through hole 3 is formed between adjacent copper foils 2. Multiple telescopic rods 6 are circumferentially arranged within the heat dissipation cavity 5, and clamping members 7 are connected to the output ends of the telescopic rods 6. The clamping members 7 are used to abut against the semiconductors. The multiple telescopic rods 6 in the multi-layer heat dissipation cavity 5 are distributed in multiple rows, and the output ends of the multiple telescopic rods 6 in each row are connected by series members 8. A radial displacement mechanism is provided at the top of the housing 1, which can drive the multiple series members 8 to move synchronously toward or away from the axis of the through hole 3. This achieves the core functions of simultaneous clamping and radial synchronous adjustment of multi-layer semiconductors. It not only solves the problem of adaptable clamping of semiconductors with different diameters, but also ensures the displacement consistency of the telescopic rods 6 in the same row through the series component 8, avoiding semiconductor tilting or damage caused by uneven clamping force in each layer; the radial displacement mechanism can provide precise feed control and is suitable for automated packaging production lines.

[0021] In one embodiment of the present invention, the radial displacement mechanism includes: an adjusting ring 9, rotatably connected to the outer shell 1 via a rotation drive assembly; multiple displacement plates 10 connected to the adjusting ring 9, each displacement plate 10 having an oblique displacement groove 11; and multiple connecting plates 12 corresponding one-to-one with the multiple series members 8 and the multiple displacement plates 10, with the connecting plates 12 connected to the series members 8, and an adjusting wheel 13 mounted on the connecting plate 12, the adjusting wheel 13 slidingly engaging in the displacement groove 11. The rotation of the adjusting ring 9 is converted into radial linear motion of the connecting plate 12, resulting in a compact structure and smooth transmission. The design of the oblique displacement groove 11 creates a linear mapping between rotational motion and radial movement, facilitating precise adjustment of the clamping diameter by controlling the rotation angle. Simultaneously, the multiple connecting plates 12 correspond one-to-one with the series members 8, ensuring synchronous movement of all telescopic rods 6, avoiding asynchronous clamping between different heat dissipation cavity layers 5, and improving the repeatability positioning accuracy of multilayer semiconductor alignment.

[0022] In one embodiment of the present invention, the rotation drive assembly includes: a bearing housing 14, fixedly mounted on the housing 1 via a support plate 15; and a drive motor 16, fixedly mounted on the support plate 15. The output shaft of the drive motor 16 is connected to a gear 17, and the side wall of the adjusting ring 9 is provided with a toothed groove that meshes with the gear 17. By using the drive motor 16 to drive the gear 17 to mesh with the toothed groove, the precise electric rotation of the adjusting ring 9 is achieved. Compared with manual adjustment, this solution can be integrated into an automated control system, allowing for real-time feedback adjustment of clamping force and position based on semiconductor dimensions. Simultaneously, the bearing housing 14 and the support plate 15 provide a stable mounting base, reducing the impact of vibration on clamping accuracy.

[0023] In one embodiment of the present invention, the connecting member 8 includes multiple collars 18, each collar 18 being fitted onto the output end of a plurality of telescopic rods 6 and fixed by a fixing pin. The multiple collars 18 and the connecting plate 12 are connected by a connecting rod 19. The collars 18 are respectively fitted onto the output end of each telescopic rod 6 and fixed by a fixing pin, and then all collars 18 and connecting plates 12 are connected into one unit by the connecting rod 19. This structure is simple and reliable, ensuring the mechanical linkage of the output ends of multiple telescopic rods 6 in the same row, avoiding the stroke difference caused by the independent driving of each layer of telescopic rods 6; the connecting rod 19 can transmit tension and thrust, so that all telescopic rods 6 can extend and retract completely synchronously under the drive of the radial displacement mechanism, which is suitable for long-distance linkage in multi-layer stacking devices.

[0024] In one embodiment of the present invention, the clamping member 7 includes a spring rod 20 and an abutment 21 connected together. The spring rod 20 provides an elastic buffer function, which can absorb certain dimensional tolerances or positional deviations when clamping the semiconductor, avoiding chipping of the semiconductor edge due to rigid clamping; at the same time, the spring rod 20 can maintain a constant elastic preload, so that even if the semiconductor undergoes slight thermal expansion during heating, the clamping member can still adaptively fit, preventing over-positioning or loosening; the abutment 21 can be made of a soft or high-friction material to increase the contact area and protect the semiconductor surface.

[0025] In one embodiment of the present invention, a plurality of blocking boxes 22 are arranged circumferentially inside the heat dissipation cavity 5. A plurality of ventilation holes 23 are symmetrically opened on the two side walls of the blocking boxes 22. A sliding block 25 is slidably fitted inside the blocking box 22 through a temperature memory alloy part 24. An oblique hole 26 is opened on the sliding block 25, which allows the two asymmetrical ventilation holes 23 to be connected. A pair of shielding rolls 27 are respectively connected to the two sides of the sliding block 25. The shielding rolls 27 are used to shield the ventilation holes 23 on both sides of the sliding block 25. A roller 28 is connected to the end of the shielding rolls 27 away from the sliding block 25. The roller 28 is installed in the blocking box 22 through a coil spring shaft 29. The roller 28 is located outside the ventilation hole 23 at the far end. When the heat in the heat dissipation cavity 5 is carried away, the temperature of the heat dissipation cavity 5 decreases. At this point, the temperature environment of the temperature memory alloy component 24 decreases, its volume shrinks, and it causes the sliding block 25 to slide towards the through hole. This causes the starting and ending points of the vortex to approach the through hole, thus reducing the radius of the vortex. This achieves the effect of stripping heat layer by layer from the heat dissipation ring until the temperature in the heat dissipation cavity 5 drops to room temperature. This indicates that the temperature inside the through hole is the same as the temperature inside the heat dissipation cavity 5, and it no longer has a heat transfer function. At this point, the cooling effect of blowing on the heat-generating semiconductor is complete. The tilting and blocking tape 27 ensures that only one pair of ventilation holes 23 are in the ventilation state, while the other ventilation holes 23 are closed. It should be noted that the higher the temperature, the larger the radius of the resulting vortex, meaning the further the sliding block 25 is from the through hole. This ensures that the heat ring around the through hole during heat dissipation will be gradually blown away starting from the outermost ring, causing the radius of the heat ring to decrease slowly. This effectively and quickly blows away the heat, achieving adaptive adjustment of the cooling airflow and direction based on the actual temperature inside the heat dissipation cavity 5, improving heat dissipation efficiency and reducing fan energy consumption. The shape memory alloy does not require an external power supply, has high reliability, and is suitable for high-temperature packaging environments.

[0026] In one embodiment of the invention, a heat conduction plate 30 is connected to the blocking box 22, and the heat conduction plate 30 is connected to the telescopic rod 6 and the temperature memory alloy component 24. The heat conduction plate 30 can quickly transfer the heat absorbed by the telescopic rod 6 (metal material) to the temperature memory alloy component 24, making it more sensitive to the actual operating temperature; at the same time, the heat conduction plate 30 also serves as part of the heat dissipation path, helping to reduce local hot spots near the telescopic rod 6. This design enhances the timeliness of temperature feedback, making the ventilation adjustment action in the blocking box 22 more accurately match the actual heat load, and avoiding insufficient heat dissipation or overcooling due to thermal hysteresis.

[0027] In one embodiment of the present invention, a plurality of air ducts 31 are further included for connecting two adjacent heat dissipation cavities 5. The air ducts 31 are disposed on the copper foil 2, and each air duct 31 has a Z-shaped hole 32 at both ends that are respectively connected to the two adjacent heat dissipation cavities 5. One end of the Z-shaped hole 32 of the topmost air duct 31 is connected to the heat dissipation cavity 5, and the other end is connected to the outside of the device. The starting end of the vortex-like vortex originates from the air outlet of the Z-shaped hole 32, and the end of the vortex-like vortex enters the air inlet of the Z-shaped hole 32. Since both ends of the air ducts 31 extend into the heat dissipation cavities 5 on both sides of the copper foil 2, a vortex-like vortex and spiraling upward airflow are formed in the multi-layer heat dissipation cavities 5, thereby blowing away the heat in the multi-layer heat dissipation cavities 5, achieving the effect of heat removal.

[0028] In one embodiment of the present invention, a plurality of pads 33 are further provided between two adjacent copper foils 2, so that a heat dissipation cavity 5 is formed between two adjacent copper foils 2.

[0029] In one embodiment of the present invention, two adjacent copper foils 2 are respectively provided with rings 34 at opposite ends to prevent airflow from directly exiting the heat dissipation cavity. Due to the obstruction of the rings 34, airflow can be effectively prevented from flowing out of the heat dissipation cavity 5. The rings 34 on the two copper foils 2 are staggered, that is, the space where the two rings 34 are located is a wavy and tortuous space. This can effectively prevent airflow from passing over the rings 34 and blowing out of the heat dissipation cavity 5, while not blocking the heat emitted by the heat-generating semiconductor from passing over the space where the rings 34 are located. That is, the heat on one side of the rings 34 is better blown away, while the heat on the other side of the rings 34 will continue to enter, thus completing the effect of blowing away the heat of the heat-generating semiconductor.

[0030] Furthermore, the ring 34 is provided with a notch for avoiding the telescopic rod 6.

[0031] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0032] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. An apparatus for fabricating a substrate for semiconductor material packaging, characterized in that, The device includes an outer casing (1), in which multiple copper foils (2) are stacked, through holes (3) for placing semiconductors are formed in the multiple copper foils (2), a plating layer (4) is provided in the through holes (3), and a heat dissipation cavity (5) connected to the through holes (3) is formed between two adjacent copper foils (2). Multiple telescopic rods (6) are arranged circumferentially in the heat dissipation cavity (5). The output end of the telescopic rod (6) is connected to a clamping member (7). The clamping member (7) is used to abut against the semiconductor. The multiple telescopic rods (6) in the multi-layer heat dissipation cavity (5) are distributed in multiple rows. The output ends of the multiple telescopic rods (6) in each row are connected by a series member (8). A radial displacement mechanism is provided on the top of the outer shell (1). The radial displacement mechanism can drive the multiple series members (8) to move synchronously toward or away from the axis of the through hole (3).

2. The semiconductor material packaging substrate fabrication apparatus according to claim 1, characterized in that, The radial displacement mechanism includes: The adjusting ring (9) is rotatably connected to the outer casing (1) via a rotation drive assembly; Multiple displacement plates (10) are connected to the adjustment ring (9), and the displacement plates (10) are provided with oblique displacement grooves (11). Multiple connecting plates (12) correspond one-to-one with multiple serial links (8) and multiple displacement plates (10), and the connecting plates (12) are connected to the serial links (8). An adjusting wheel (13) is provided on the connecting plate (12), and the adjusting wheel (13) slides in the displacement groove (11).

3. The semiconductor material packaging substrate preparation apparatus according to claim 2, characterized in that, The rotation drive assembly includes: The bearing housing (14) is fixedly mounted on the outer casing (1) by a support plate (15); A drive motor (16) is fixedly mounted on the support plate (15). The output shaft of the drive motor (16) is connected to a gear (17). The side wall of the adjusting ring (9) is provided with a tooth groove that meshes with the gear (17).

4. The semiconductor material packaging substrate preparation apparatus according to claim 2, characterized in that, The connecting component (8) includes multiple collars (18), each collar (18) is connected to the output end of a multiple telescopic rod (6) and fixed by a fixing pin, and the multiple collars (18) and the connecting plate (12) are connected by a connecting rod (19).

5. The semiconductor material packaging substrate fabrication apparatus according to claim 1, characterized in that, The clamping member (7) includes a spring rod (20) and an abutment (21) connected together.

6. The semiconductor material packaging substrate fabrication apparatus according to claim 1, characterized in that, Multiple blocking boxes (22) are arranged circumferentially inside the heat dissipation cavity (5). Multiple ventilation holes (23) are symmetrically opened on both sides of the blocking box (22). A sliding block (25) is slidably fitted inside the blocking box (22) through a temperature memory alloy part (24). An oblique hole (26) is opened on the sliding block (25). The oblique hole (26) allows the two asymmetrical ventilation holes (23) to be connected. A pair of shielding rolls (27) are connected to both sides of the sliding block (25). The shielding rolls (27) are used to shield the ventilation holes (23) on both sides of the sliding block (25). A roller (28) is connected to one end of the shielding roll (27) away from the sliding block (25). The roller (28) is installed in the blocking box (22) through a coil spring shaft (29). The roller (28) is located outside the ventilation hole (23) at the far end.

7. The semiconductor material packaging substrate fabrication apparatus according to claim 6, characterized in that, A heat conduction plate (30) is connected to the blocking box (22), and the heat conduction plate (30) is connected to the telescopic rod (6) and the temperature memory alloy part (24).

8. The semiconductor material packaging substrate fabrication apparatus according to claim 1, characterized in that, It also includes a plurality of air ducts (31) for connecting two adjacent heat dissipation cavities (5). The air ducts (31) are disposed on the copper foil (2). The air ducts (31) are provided with Z-shaped holes (32) at both ends that are connected to the two adjacent heat dissipation cavities (5). One end of the Z-shaped hole (32) of the air duct (31) at the top of the displacement is connected to the heat dissipation cavity (5), and the other end is connected to the outside of the device.

9. The semiconductor material packaging substrate fabrication apparatus according to claim 1, characterized in that, It also includes multiple pads (33) respectively disposed between two adjacent copper foils (2) so that the heat dissipation cavity (5) is formed between two adjacent copper foils (2).

10. The semiconductor material packaging substrate fabrication apparatus according to claim 1, characterized in that, Each of the two adjacent copper foils (2) is provided with a ring (34) at its opposite end to prevent airflow from directly flowing out of the heat dissipation cavity.

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