substrates, electronic devices

Abstract

Provided are a substrate and an electronic device that can improve degradation of frequency characteristics that can occur due to a through-hole. The substrate of an embodiment is a substrate provided with a transmission line composed of a part of a plurality of conductors on a base material, the transmission line including: a first conductor line provided in the same plane as a first conductor layer; a second conductor line provided in the same plane as a second conductor layer that is a conductor layer in the base material and different from the first conductor layer; a first via that penetrates the base material, electrically connects the first conductor line and the second conductor line, and has a through-hole stub; and a third conductor line provided in the vicinity of the first via in a plane parallel to the first via and having a closed ring shape.

Description

Technical Field

[0001] Embodiments of the present invention relate to substrates and electronic devices. Background Technology

[0002] As substrates with multiple conductor layers, printed circuit boards (PCBs) and packaged substrates (PKGs) are known. Such substrates often have through-holes. Through-holes function as part of the transmission lines connecting the different conductor layers of the substrate. Through-holes extend from the surface of the substrate to the back side to achieve connections between multiple conductor layers; however, depending on the circuit structure on the substrate, sometimes the entire length from the end of the through-hole on the surface side of the substrate to the end of the back side of the substrate is not utilized.

[0003] For example, when a via connects a transmission line consisting of a conductor layer disposed on the surface of the substrate and a transmission line consisting of a conductor layer disposed within the substrate to form a single transmission line, the portion of the via from the transmission line within the substrate to the back side of the substrate does not function as a transmission line. Thus, the remaining portion of the via that is not intended to function as a transmission line becomes a via stub, creating unexpected resonant points and potentially causing degradation of the frequency characteristics of the transmission line.

[0004] Residual piles in through-holes can generally be cut using back drilling, but this incurs additional steps and costs. Furthermore, back drilling needs to be performed as the final step after all wiring is completed, which can lead to corrosion and reduced durability. Summary of the Invention

[0005] The embodiments provide a substrate and an electronic device that can improve the frequency characteristics that may be degraded due to through-holes.

[0006] The substrate of the embodiment is a substrate on which a transmission line composed of a portion of conductors of multiple conductor layers is disposed. The transmission line includes: a first conductor line disposed in the same plane as the first conductor layer; a second conductor line disposed in the same plane as the second conductor layer, the second conductor layer being a conductor layer in the substrate and different from the first conductor layer; a first through hole penetrating the substrate, electrically connecting the first conductor line and the second conductor line, and having a through hole post; and a third conductor line disposed in a plane parallel to the first through hole near the first through hole, and having a closed loop shape. Attached Figure Description

[0007] Figure 1 This is a diagram illustrating an example of the structure of the transmission line according to the first embodiment.

[0008] Figure 2 This is a circuit diagram showing the equivalent circuit of the transmission line in the first embodiment.

[0009] Figure 3 This is a diagram showing the resonant points generated in the transmission line of the first embodiment.

[0010] Figure 4 This is a diagram showing, from perspective, a first specific example of the transmission line of the first embodiment.

[0011] Figure 5 This is a diagram showing a second specific example of the transmission line of the first embodiment from perspective.

[0012] Figure 6 This is a diagram illustrating an example of the structure of the transmission line in the second embodiment.

[0013] Figure 7 This is a circuit diagram showing the equivalent circuit of the transmission line in the second embodiment.

[0014] Figure 8 This is a block diagram illustrating the functional structure of the electronic device according to the third embodiment.

[0015] Figure 9 It is a diagram showing the transmission line of the comparative example from perspective.

[0016] Figure 10 This is a diagram illustrating the structural example of a transmission line for comparison.

[0017] Figure 11 This is a conceptual diagram representing the equivalent circuit of the transmission line in the comparative example.

[0018] Figure 12 This is a circuit diagram representing the equivalent circuit of the transmission line in the comparative example.

[0019] Figure 13 This is a diagram showing the resonant points generated in the transmission line of the comparative example. Detailed Implementation

[0020] (Comparative Example)

[0021] Reference Figures 9-13 The transmission lines formed on the substrate of the comparative example substrate will be described. The transmission lines include through holes. Figure 9 It is a diagram showing the transmission line of the comparative example from perspective.

[0022] Figure 10 This is a diagram illustrating the structural example of a transmission line for comparison. Figure 11 This is a conceptual diagram representing the equivalent circuit of the transmission line in the comparative example. Figure 12This is a circuit diagram representing the equivalent circuit of the transmission line in the comparative example. Figure 13 This is a diagram showing the resonant points generated in the transmission line of the comparative example. In the following description, common structures are indicated by common reference numerals, and repeated descriptions are omitted.

[0023] Figure 9 and Figure 10 This represents an example of transmission line 9. For example... Figure 9 as well as Figure 10 As shown, transmission line 9 has conductor lines 121a, 121b, conductor lines 122a, 122b, and through holes 130a, 130b. Conductor lines 121a, 121b are disposed in the same plane as the conductor layer formed on the surface of the substrate 91 (a part of the substrate 90) made of a dielectric material or the like. Conductor lines 122a, 122b are disposed in the same plane as the conductor layer formed inside the substrate 91. Through holes 130a, 130b each include a conductor that extends from the surface of the substrate 91 to the back surface, electrically connecting conductor lines 121a, 121b and conductor lines 122a, 122b. Figure 9 In the example shown, the through holes 130a and 130b are not connected to the wiring formed by the conductor layer on the back side of the substrate 91. That is, through hole remnants 131a and 131b are formed from the connection point of the wiring 122a and 122b in the through holes 130a and 130b to the back side of the substrate 91, respectively. The conductor wirings 121a and 121b, as well as 122a and 122b, and the through holes 130a and 130b, are made of conductor materials such as copper and silver.

[0024] Figure 9 The transmission line 9 shown is a differential line consisting of conductor line 121a, through hole 130a, and conductor line 122a, and two transmission lines consisting of conductor line 121b, through hole 130b, and conductor line 122b. However, for convenience, the following description will focus on one line (conductor line 121a, through hole 130a, and conductor line 122a). Figure 10 In the transmission line 9 shown, the electrical signal flows sequentially through conductor line 121a, through-hole 130a, and conductor line 122a. The through-hole stump 131a is not located on the path of the electrical signal flow, but especially when the frequency of the electrical signal is high, the through-hole stump 131a operates as a distributed parameter transmission line. Figure 11 As shown, the through-hole residual pile 131a can be regarded as a distributed parameter transmission line with inductive component L and capacitive component C.

[0025] like Figure 12As shown, observed from signal source E, transmission line 9 becomes a distributed parameter circuit containing a resistance component 2R, an inductance component L, and a capacitance component C. The angular frequency ω of the resonant point of the inductance component L and the capacitance component C of this circuit is... R0 As shown below.

[0026]

[0027] Here, ω R0 For 2πf R0 f R0 The resonant frequency of the transmission line 9, which includes the through-hole pile 131a (131b).

[0028] Figure 13 express Figure 12 The frequency characteristics of transmission line 9 in the equivalent circuit shown. For example... Figure 13 As shown, transmission line 9 at the resonant frequency f R0 A significant attenuation point is observed at this resonant point. This leads to a deterioration in the frequency characteristics of transmission line 9. The transmission line of the embodiment can improve the frequency characteristic degradation caused by this resonant point.

[0029] (First Implementation)

[0030] Hereinafter, the transmission lines formed on the substrate of the substrate of the first embodiment will be described in detail with reference to the accompanying drawings. Figure 1 This is a diagram illustrating an example of the structure of the transmission line according to the first embodiment. Figure 2 This is a circuit diagram showing the equivalent circuit of the transmission line in the first embodiment. Figure 3 This is a diagram showing the resonant points generated in the transmission line of the first embodiment. In the following description, functional elements common to the transmission lines of the comparative example are indicated by common reference numerals, and repeated descriptions are omitted.

[0031] like Figure 1 As shown, the transmission line 1 of the first embodiment includes conductor lines 21 and 22, and a through-hole 30. Conductor lines 21 are disposed in the same plane as a conductor layer formed on the surface of a substrate 11 (a part of the substrate 10) made of a dielectric material or the like. Conductor lines 22 are disposed in the same plane as a conductor layer disposed within the substrate 11. The through-hole 30 includes a conductor extending from the surface of the substrate 11 to its back surface. The through-hole 30 connects conductor lines 21 and 22 by extending from the surface of the substrate 11 to its back surface, but does not connect to conductor lines or the like formed in the same plane as the conductor layer formed on the back surface of the substrate 11. That is, the portion from the connection point of the through-hole 30 inside the substrate 11 with the conductor line 22 to the back surface of the substrate 11 constitutes a through-hole stump 31.

[0032] The transmission line 1 of the first embodiment also has a ring-shaped conductor line 40 adjacent to the through hole residual pile 31. The conductor line 40 has a conductor line 41, a through hole 43, a conductor line 42, and a through hole 44.

[0033] The conductor line 41 is composed of a conductor layer formed in a plane parallel to the surface of the substrate 11. Figure 1 In the example shown, conductor line 41 is disposed on the surface of substrate 11, i.e., in the same plane as conductor line 21, but is not limited thereto. Conductor line 41 may also be composed of a conductor layer formed inside substrate 11 in a plane parallel to the surface of substrate 11.

[0034] The conductor line 42 is composed of a conductor layer formed in a plane parallel to the back surface of the substrate 11. Figure 1 In the example shown, conductor line 42 is disposed within the back surface of substrate 11, but this is not a limitation. Conductor line 42 may also be disposed within substrate 11 in a plane parallel to and different from conductor line 41.

[0035] Through hole 43 is a through-hole made of conductive material that electrically connects one end of conductor line 41 to one end of conductor line 42. Through hole 44 is a hole made of conductive material that electrically connects the other end of conductor line 41 to the other end of conductor line 42. That is, conductor line 41, through hole 43, conductor line 42, and through hole 44 form a ring-shaped conductor line 40 connected in sequence. Conductor line 40 is arranged near through hole 30 (through hole remnant 31) in a plane parallel to through hole 30 and has a closed ring shape.

[0036] Figure 2 This represents the equivalent circuit of transmission line 1 in the first embodiment. For example... Figure 2 As shown, viewed from signal source E, a portion of transmission line 1 becomes a distributed parameter circuit comprising a resistance component 2R, an inductance component L, and a capacitance component C. Furthermore, in transmission line 1 of the first embodiment, the inductance component L constituting the through-hole stump 31 and the inductance component L of the conductor line 40... ring Magnetic coupling circuit. Figure 2 The angular frequency ω of the resonant point of transmission line 1 shown R1 It is represented by the following.

[0037]

[0038] Here, M is the mutual inductance, and k is the coupling coefficient (1 > k > 0).

[0039] As shown in equation (2), by setting a conductor line 40 at a position adjacent to the through hole residual pile 31, the angular frequency ω is thus achieved. R1 The offset is a large value. Angular frequency ω R1For 2πf R1 f R1 This is the resonant frequency of the transmission line 1 in the first embodiment. That is, the resonant frequency is shifted in a direction higher than that of the comparative example.

[0040] Figure 3 This indicates the frequency characteristics of transmission line 1, which has conductor line 40, and the frequency characteristics of transmission line 9, a comparative example, which does not have conductor line 40. For example... Figure 3 As shown, the transmission line 1 of the first embodiment has a ring-shaped conductor line 40 at a position adjacent to the through hole residual pile 31, so that the attenuation point of the frequency characteristics can be shifted to suppress the deterioration of the frequency characteristics.

[0041] In the example described above, conductor line 21 is formed on the surface of substrate 11, and conductor line 22 is disposed within substrate 11, but this is not a limitation. Both conductor line 21 and conductor line 22 may also be disposed within substrate 11. That is, the structure of the first embodiment can also be applied even when through-hole remnants are formed on both the surface and back sides of substrate 11.

[0042] Furthermore, in the example described above, the conductor line 40 is composed of a conductor line 41 disposed on the surface of the substrate 11, a through hole 43, a conductor line 42 disposed on the back side of the substrate 11, and a through hole 44, but is not limited thereto. Either or both of the conductor lines 41 and 42 may also be disposed inside the substrate 11. That is, the conductor line 40 only needs to magnetically couple with the through hole post 31 to produce an effect of increasing the resonant frequency; its position and shape are not limited.

[0043] (Specific examples of the first embodiment)

[0044] Next, refer to Figure 4 A specific example of the transmission line in the first embodiment will be described. Figure 4 This is a diagram showing, from perspective, a first specific example of the transmission line of the first embodiment. Figure 5 This is a diagram showing a second specific example of the transmission line of the first embodiment from perspective.

[0045] Figure 4 The transmission line 1a shown is formed by parallel pairings of conductor lines A and B in the substrate 11a of the substrate 10a, and is configured to transmit differential signals. Conductor line A has a path consisting of conductor line 21a, through-hole 30a, and conductor line 22a, and conductor line B has a path consisting of conductor line 21b, through-hole 30b, and conductor line 22b. Line A has a through-hole remnant 31a, and line B has a through-hole remnant 31b.

[0046] Transmission line 1a has a loop-shaped conductor line 40 near the through-hole remnant 31a of conductor line A and the through-hole remnant 31b of conductor line B, which are sequentially connected to conductor line 41, through-hole 43, conductor line 42, and through-hole 44. That is, a circuit is formed having an inductive component magnetically coupled to both the inductive component of through-hole remnant 31a and the inductive component of through-hole remnant 31b. Figure 4 In the example shown, the conductor line 40 is disposed in the plane between the through hole 30a and the through hole 30b, respectively, parallel to the through hole 30a and the through hole 30b.

[0047] According to a first specific example of the first embodiment, since the loop conductor lines are arranged between pairs of transmission lines, the deterioration of frequency characteristics can be suppressed without setting up special wiring space.

[0048] Figure 5 The transmission line 1b shown is formed by parallel pairings of conductor lines A and B in the substrate 11b of the substrate 10b, and is configured to transmit differential signals. Conductor line A has a path consisting of conductor line 21a, through-hole 30a, and conductor line 22a, and conductor line B has a path consisting of conductor line 21b, through-hole 30b, and conductor line 22b. Line A has a through-hole remnant 31a, and line B has a through-hole remnant 31b.

[0049] Transmission line 1b has conductor line 40a, which is located near the through hole remnant 31a of conductor line A and on the opposite side of conductor line B, separated by conductor line A. Additionally, transmission line 1b has conductor line 40b, which is located near the through hole remnant 31b of conductor line B and on the opposite side of conductor line A, separated by conductor line B. Figure 5 As shown, conductor line 40a is a loop conductor line connected in the order of conductor line 41a, through hole 43a, conductor line 42a, and through hole 44a. Similarly, conductor line 40b is a loop conductor line connected in the order of conductor line 41b, through hole 43b, conductor line 42b, and through hole 44b. That is, a circuit is formed consisting of conductor line 40a magnetically coupled to the inductive component of the through hole residual post 31a, and conductor line 40b magnetically coupled to the inductive component of the through hole residual post 31b. Figure 5 In the example shown, conductor lines 40a are disposed parallel to and separated from through holes 30a and 30b, respectively, on the surface opposite to the through hole 30b. Similarly, conductor lines 40b are disposed parallel to and separated from through holes 30a and 30b, respectively, on the surface opposite to the through hole 30a.

[0050] According to a second specific example of the first embodiment, for each of the through-hole remnants of the paired transmission lines, a ring-shaped conductor line is provided that is independently magnetically coupled to each through-hole remnant, thereby enabling more precise suppression of the deterioration of frequency characteristics.

[0051] (Second Implementation)

[0052] Next, refer to Figure 6 as well as Figure 7 The transmission lines disposed on the substrate in the substrate of the second embodiment will be described. Figure 6 This is a diagram illustrating an example of the structure of the transmission line in the second embodiment. Figure 7 This is a circuit diagram showing the equivalent circuit of the transmission line in the second embodiment. The transmission line in the second embodiment adds a coupling circuit to the transmission line in the first embodiment. In the following description, functional elements common to the first embodiment are indicated by common reference numerals, and repeated descriptions are omitted.

[0053] like Figure 6 As shown, the transmission line 2 of the second embodiment includes conductor lines 21 and 22, and a through-hole 30. Conductor line 21 is disposed in the same plane as the conductor layer disposed on the surface of the substrate 11c (a part of the substrate 10c). Conductor line 22 is disposed in the same plane as the conductor layer disposed within the substrate 11c. The through-hole 30 includes a conductor extending from the surface of the substrate 11c to the back surface. The through-hole 30 extends from the surface of the substrate 11c toward the back surface, connecting conductor lines 21 and 22, but not connecting to conductor lines formed in the same plane as the conductor layer formed on the back surface of the substrate 11c. That is, the portion of the through-hole 30 from the connection point of the through-hole 30 with the conductor line 22 inside the substrate 11c to the back surface of the substrate 11c constitutes a through-hole stump 31.

[0054] In the second embodiment, the transmission line 2 has a ring-shaped conductor line 40 adjacent to the through hole residual pile 31. The conductor line 40 includes conductor line 41, through hole 43, conductor line 42, and through hole 44.

[0055] Conductor line 41 is composed of a conductor layer formed in a plane parallel to the surface of substrate 11c. Conductor line 42 is composed of a conductor layer formed in a plane parallel to the back surface of substrate 11c. Through hole 43 is a through-hole made of conductive material electrically connecting one end of conductor line 41 to one end of conductor line 42. Through hole 44 is a hole made of conductive material electrically connecting the other end of conductor line 41 to the other end of conductor line 42. That is, conductor line 41, through hole 43, conductor line 42, and through hole 44 constitute a ring-shaped conductor line 40 connected in sequence.

[0056] The transmission line 2 in the second embodiment also includes a coupling circuit 50 composed of conductor lines formed in a loop. Figure 6 In the example shown, the coupling circuit 50 is a functional element that magnetically couples the through-hole remnant 31 to the ring-shaped conductor line 40. Figure 6 The coupling circuit 50 shown has a rectangular shape connecting two conductor lines and two conductor lines. The first two conductor lines are arranged in the same plane as the conductor layer between conductor lines 22 and 42 and extend in the same direction as conductor line 21. The second two conductor lines are arranged in the same plane as these two conductor lines and extend in a direction orthogonal to conductor line 21. The coupling circuit 50 has an annular shape surrounding the through hole residual post 31 and the through hole 43.

[0057] exist Figure 6 In the example shown, the coupling circuit 50 has a rectangular shape when viewed from the plane of the substrate 11c, but it is not limited to this. The coupling circuit 50 can be any shape that magnetically couples the through-hole residual post 31 to a loop-shaped line (conductor line 40), or it can be circular, etc. Furthermore, in Figure 6 In the example shown, the coupling circuit 50 is formed to surround the through-hole residual pile 31 and the through passage 43, but it is not limited to this. It can also be formed to surround the through-hole residual pile 31 and the through passages 43 and 44. Furthermore, in Figure 6 In the example shown, the coupling circuit 50 is formed in a layer parallel to the main surface of the substrate 11c, but it is not limited to this. The coupling circuit 50 may also have vias for interlayer connections along its path.

[0058] In addition, Figure 6 In the example shown, for Figure 1 The transmission line 1 shown in the first embodiment has an added coupling circuit 50, but it is not limited to this. Alternatively, in... Figure 4 and Figure 5 In the specific example of the first embodiment shown, a coupling circuit 50 is added to the transmission lines 1a and 1b. For example, in Figure 4 In the transmission line 1a shown, a ring-shaped conductor line can also be provided, formed by surrounding the through hole remnant 31a of conductor line A, the through hole remnant 31b of conductor line B, and the through hole 43 of conductor line 40. Additionally, in Figure 5 The transmission line 1b shown may also be equipped with a ring-shaped conductor line formed by surrounding the through hole remnant 31a of conductor line A and the through hole 43a of conductor line 40a, and a ring-shaped conductor line formed by surrounding the through hole remnant 31b of conductor line B and the through hole 43b of conductor line 40b.

[0059] Figure 7This represents the equivalent circuit of transmission line 2 in the second embodiment. For example... Figure 7 As shown, viewed from signal source E, a portion of transmission line 2 becomes a distributed parameter circuit containing a resistance component 2R, an inductance component L, and a capacitance component C. Furthermore, in transmission line 2 of the second embodiment, the inductance component L of the through-hole residual post 31 and the inductance component L of the ring-shaped conductor line 40... ring Magnetic coupling, and then through coupling circuit 50, a circuit with increased coupling degree is formed. Figure 7 The angular frequency ω of the resonant point of transmission line 2 shown R2 It is represented by the following.

[0060]

[0061] Here, M' is mutual inductance, and k' is coupling coefficient (1 > k' > k > 0).

[0062] As shown in equation (3), the coupling coefficient k' of the transmission line 2 in the second embodiment with coupling circuit 50 is greater than the coupling coefficient k of the transmission line 1 in the first embodiment without coupling circuit 50. That is, the angular frequency ω R2 Move to a frequency ω higher than that in the first embodiment R1 Large values. Angular frequency ω R2 It is 2πf R2 f R2 This is the resonant frequency of the transmission line 2 in the second embodiment. That is, the resonant frequency is shifted to a higher direction than that in the first embodiment. Therefore, compared with the transmission line 1 in the first embodiment, the transmission line 2 in the second embodiment has a higher attenuation point frequency in its frequency characteristics, and can obtain a higher bandwidth extension effect.

[0063] According to the transmission lines of the first and second embodiments, since two annular conductor lines are respectively arranged near the through-hole, the operating frequency can be extended inexpensively. Furthermore, since it is not necessary to drill holes in the substrate, the problems of corrosion and durability can be solved.

[0064] (Third Implementation)

[0065] like Figure 8As shown, the electronic device 200 of the third embodiment constitutes a memory system. The electronic device 200 includes a power management IC (PMIC) 220, a controller 230, and a memory 240. The power management IC 220, controller 230, and memory 240 are examples of semiconductor components. The electronic device 200 can be connected to the host 300 via a signal line L1 and a power supply line Vdd. The signal line L1 is, for example, a bus for transmitting and receiving signals between the electronic device 200 and the host 300. The wiring on the electronic device 200 between the signal line L1 and the controller 230 can utilize either the transmission line 1 of the first embodiment or the transmission line 2 of the second embodiment. The power supply line Vdd is, for example, a power line capable of supplying a predetermined voltage from the host 300 to the electronic device 200.

[0066] The controller 230 is a circuit element that receives instructions from the host 300 to perform functions such as reading, writing, and deleting data from the memory 240. The controller 230 is, for example, an electronic circuit with a processor to implement these functions, configured as a System-on-a-Chip (SoC). The memory 240 is, for example, a semiconductor storage device containing NAND flash memory. The memory 240 is connected to the controller 230 via, for example, a bus including a signal line L2 based on a specified standard. The signal line L2 can use either the transmission line 1 of the first embodiment or the transmission line 2 of the second embodiment.

[0067] PMIC220 is a circuit element capable of generating multiple output voltages with different values. PMIC220 receives a specified voltage supplied from host 300 via power supply wiring Vdd and generates various output voltages such as V+, and supplies them to controller 230, memory 240, etc.

[0068] According to the third embodiment of the electronic device 200, since it has the transmission line 1 of the first embodiment or the transmission line 2 of the second embodiment as a signal line, the frequency characteristics of signal transmission can be improved.

[0069] Several embodiments of the present invention have been described, but these embodiments are given by way of example and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, and are included in the scope of the invention as set forth in the claims and its equivalents.

[0070] 1, 1a, 1b, 2, 9… transmission lines

[0071] 10, 10a, 10b, 10c, 90...Substrate

[0072] 11, 11a, 11b, 11c, 91… Substrates

[0073] 21, 21a, 21b… conductor lines

[0074] 22, 22a, 22b… conductor circuits

[0075] 30, 30a, 30b... Through holes

[0076] 31, 31a, 31b... Residual piles from through holes

[0077] 40, 40a, 40b… conductor circuits

[0078] 41, 41a, 41b… conductor lines

[0079] 42, 42a, 42b… conductor circuits

[0080] 43, 43a, 43b... Through holes

[0081] 44, 44a, 44b... Through holes

[0082] 50…Coupled circuit

[0083] 121a, 121b... conductor circuits

[0084] 122a, 122b... conductor circuits

[0085] 130a, 130b... Through holes

[0086] 131a, 131b... Residual piles from through holes

[0087] 200…electronic devices

[0088] 220… Power Management IC

[0089] 230… controller

[0090] 240…memory

[0091] 300… host

[0092] A…conductor circuit

[0093] B…conductor circuit

Claims

1. A substrate having a transmission line formed by a portion of conductors of multiple conductor layers disposed on the substrate. The transmission line includes: The first conductor line is disposed in the same plane as the first conductor layer; The second conductor line is disposed in the same plane as the second conductor layer, which is a conductor layer within the substrate and is different from the first conductor layer. The first through hole penetrates the substrate, electrically connecting the first conductor line and the second conductor line, and has a through hole residual post; as well as The third conductor line is disposed near the first through hole in a plane parallel to the first through hole, and has a closed loop shape.

2. The substrate according to claim 1, wherein, The first conductor line is disposed on the surface of the substrate or within the substrate.

3. The substrate according to claim 1, wherein, The third conductor line has: A fourth conductor line is formed on one main surface of the substrate; The fifth conductor line is formed on another main surface of the substrate; as well as The second and third through holes penetrate the substrate and connect the fourth and fifth conductor lines.

4. The substrate according to claim 1, wherein, It also has: The sixth conductor line is disposed adjacent to and parallel to the first conductor line in the same plane as the first conductor line; The seventh conductor line is disposed adjacent to and parallel to the second conductor line in the same plane as the second conductor line; as well as The fourth through hole penetrates the substrate, electrically connecting the sixth conductor line and the seventh conductor line, and has a through hole residual post. The third conductor line is disposed parallel to the first through hole and the fourth through hole in the plane between the first through hole and the fourth through hole.

5. The substrate according to claim 1, wherein, It also has: The sixth conductor line is disposed adjacent to and parallel to the first conductor line in the same plane as the first conductor line; The seventh conductor line is disposed adjacent to and parallel to the second conductor line in the same plane as the second conductor line; as well as The fourth through hole penetrates the substrate, electrically connecting the sixth conductor line and the seventh conductor line, and has a through hole residual post. The third conductor line is parallel to the first through hole and the fourth through hole, respectively, and is disposed in the surface opposite to the fourth through hole, separated by the first through hole.

6. The substrate according to claim 1, wherein, It also includes an eighth conductor line, which is formed in a ring shape that surrounds a portion of the first through-hole and the third conductor line respectively.

7. An electronic device comprising: The transmission lines disposed on the substrate according to any one of claims 1 to 6; and A semiconductor component is connected to the transmission line.

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