A method, device and medium for real-time offset detection and differential compensation of a die bonder

Abstract

The application discloses a kind of real-time offset detection and differential compensation method, equipment and medium of die bonder, it is related to die bonder technical field, the method includes: obtaining post-die-bonding image, the post-die-bonding image contains N chips die-bonded in the same pixel, wherein N is greater than or equal to 3;Based on the post-die-bonding image, the position offset of each of the N chips relative to the target position is determined;Based on the position offset, the offset type of the N chips is determined from the pre-set multiple offset types;According to the offset type, the corresponding compensation amount is generated, and the compensation amount is applied to the motion control parameter in subsequent die-bonding process.The application can provide an effective solution for accurately locating and compensating chip offset during die bonding.

Description

Technical Field

[0001] This invention relates to the field of die bonding technology, and in particular to a method, equipment and medium for real-time offset detection and differential compensation of a die bonding machine. Background Technology

[0002] In the semiconductor packaging and LED manufacturing industries, the die bonding machine's precise mounting of light-emitting chips onto substrate pads is a critical process that determines product yield and performance. As pixel density increases and substrate size grows, the challenges of the die bonding process become increasingly complex. Even minute deviations in the mounting position can cause color differences or display defects, thus requiring extremely stringent control over die bonding precision.

[0003] In existing technologies, die bonding equipment mainly employs two architectures. The first is a single-color die bonding architecture, where each machine is responsible for bonding only one color of chip, and multiple machines need to work together to complete the bonding of chips of all colors. In this architecture, the offset data of chips of different colors are scattered across different machines and motion cycles, making it impossible for engineers to perform lateral comparative analysis of the offsets of multiple chips within the same pixel in the same coordinate system. Furthermore, the second is a single-platform multi-color sequential die bonding architecture, where the same die bonding platform sequentially bonds chips of different colors within the same pixel. This architecture allows the offset data of multiple chips to be acquired within the same motion cycle.

[0004] However, existing solutions, after acquiring offset data, typically attribute all die-bonding deviations uniformly to "die-bonding error," lacking effective means to distinguish the specific source of the offset. In actual production, chip offset may originate from decreased mechanical stability of the die-bonding arm, platform movement and positioning drift, or overall changes in pad position caused by factors such as substrate heating and moisture absorption. Because it is impossible to accurately diagnose these different root causes, engineers often need to spend a significant amount of time troubleshooting each one, which can easily lead to misjudgments and ineffective repairs, thereby increasing the process debugging cycle and maintenance costs. Summary of the Invention

[0005] This invention provides a method, device, and medium for real-time offset detection and differential compensation in a die bonder. The technical problem it aims to solve is: how to provide an effective solution that can accurately locate and compensate for chip offset during the die bonder process.

[0006] In a first aspect, the present invention provides a method for real-time offset detection and differential compensation of a die bonder, comprising: Acquire an image after die bonding, wherein the image after die bonding contains N chips that are die bonded to the same pixel, where N≥3; Based on the post-die bonding image, determine the position offset of each of the N chips relative to the target position; Based on the position offset, the offset type of the N chips is determined from a preset variety of offset types; Based on the offset type, a corresponding compensation amount is generated, and the compensation amount is applied to the motion control parameters in the subsequent die bonding process.

[0007] Optionally, determining the offset type of the N chips from a preset range of offset types based on the position offset includes: When the position offsets of the N chips all meet the preset global consistency condition, the offset type is determined to be substrate expansion / contraction mode. The global consistency condition is that the offset directions of the N chips are consistent and the difference between the offset amplitudes is less than the preset consistency threshold. When the position offset of only the first die-bonded chip among the N chips meets the preset direction association condition, and the other chips do not meet the global consistency condition, the offset type is determined to be platform offset mode. The direction association condition is that the offset direction of the first die-bonded chip is consistent with the cross-pixel jump direction of the platform between adjacent pixels. When the position offset of only one non-first die-bonded chip among the N chips meets the preset single-chip offset condition, and the remaining chips do not meet the global consistency condition, the offset type is determined to be swing arm offset mode, and the single-chip offset condition is that the offset of the chip exceeds the preset swing arm offset threshold. When the position offset directions of the N chips are consistent and the difference between the offset amplitudes is not less than a preset consistency threshold, the offset type is determined to be a mixed offset mode.

[0008] Optionally, generating the corresponding compensation amount based on the offset type includes: When the offset type is the substrate expansion / contraction mode, calculate the average of the position offsets of the N chips, determine the global compensation amount based on the average, and use the global compensation amount as the compensation amount; When the offset type is the platform offset mode, the correction value of the target position of the cargo platform is calculated based on the position offset amount, and the correction value is used as the compensation amount; When the offset type is the swing arm offset mode, the correction value of the mounting coordinate of the corresponding die bond arm is calculated according to the position offset amount, and the correction value is used as the compensation amount; When the offset type is the mixed offset mode, the global compensation amount and the mechanism compensation amount are determined according to the position offset amount, and the global compensation amount and the mechanism compensation amount are used as the compensation amount.

[0009] Optionally, determining the global compensation amount based on the mean includes: After each pixel is detected, the average value of the position offset of the current pixel is obtained; Multiply the mean by a preset coefficient to obtain the compensation increment for the current step; The current step's compensation increment is combined with the accumulated global compensation amount to obtain the updated global compensation amount.

[0010] Optionally, determining the global compensation amount and the mechanism compensation amount based on the position offset includes: The global expansion / contraction component is determined based on the position offset. The remaining offset is obtained by subtracting the global expansion / contraction component from the position offset. Determine whether the remaining offset meets the preset platform offset determination condition or swing arm offset determination condition; If the remaining offset satisfies the platform offset determination condition, then the corresponding platform compensation amount is generated as the mechanism compensation amount, and the global expansion and contraction component is used as the global compensation amount. If the remaining offset satisfies the swing arm offset determination condition, then the corresponding swing arm compensation amount is generated as the mechanism compensation amount, and the global expansion and contraction component is used as the global compensation amount. If the remaining offset does not satisfy both the platform offset determination condition and the swing arm offset determination condition, then only the global expansion and contraction component is used as the global compensation amount, and the mechanism compensation amount is determined to be 0.

[0011] Optionally, the method further includes: Monitor whether the compensation amount exceeds the preset compensation limit; An alarm signal is triggered when the compensation amount exceeds the compensation limit.

[0012] Optionally, the compensation limit includes the swing arm compensation limit, the platform compensation limit, and the global compensation limit; the swing arm compensation limit and the platform compensation limit do not exceed one-third of the preset die bonding accuracy.

[0013] Optionally, the method further includes: Associate the offset type with the compensation amount to generate pattern compensation data; The pattern compensation data is recorded in real time and uploaded to the manufacturing execution system.

[0014] Secondly, the present invention also provides a computer device including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above-described method.

[0015] Thirdly, the present invention also provides a computer-readable storage medium storing a computer program that, when executed by a processor, can implement the above-described method.

[0016] This invention provides a method, device, and medium for real-time offset detection and differential compensation in a die bonder. By acquiring images after die bonding and calculating the positional offset of each chip, quantitative detection of bonding deviations is achieved. Since the positional offset reflects the actual deviation of chip bonding, and different offset types correspond to different offset patterns, the root cause category of the current offset can be determined from a set of preset offset types based on the positional offset. Based on this, the invention generates a corresponding compensation amount according to the determined offset type and applies this compensation amount to the motion control parameters of subsequent die bonding processes. The above technical means achieve precise matching between the identification of the root cause of offset and the generation of the compensation amount, thereby effectively solving the technical problems of difficulty in locating the root cause of chip offset during die bonding and poor correction effects due to a single compensation strategy. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart illustrating a real-time offset detection and differential compensation method for a die bonder provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the offset features of the swing arm offset mode in an embodiment of the present invention; Figure 3 This is a schematic diagram of the offset features of the platform offset mode in an embodiment of the present invention; Figure 4 This is a schematic diagram of the offset characteristics of the substrate expansion and contraction mode in an embodiment of the present invention; Figure 5 This is a schematic block diagram of a computer device provided in an embodiment of the present invention. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0021] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0022] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0023] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if [described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [described condition or event] is detected," or "in response to detection of [described condition or event]."

[0024] Please see Figure 1 This invention provides a real-time offset detection and differential compensation method for a die bonder. This invention is applied to a pixel die bonder with a single-platform, multi-color sequential die bonder architecture. In this architecture, the same die bonder platform sequentially completes the die bonding operations for N different color chips within the same pixel, where N≥3. The core of this invention lies in utilizing the physical difference between the large-distance cross-pixel jump of the platform during the die bonding of the first chip within the same pixel and the small-distance movement within the same pixel during the die bonding of subsequent chips. By analyzing the distribution pattern of positional offset, the root cause of chip offset is accurately diagnosed, and a differential compensation amount is generated based on the diagnosis result, thereby achieving real-time maintenance of die bonding accuracy. Specifically, this invention includes the following steps: S1, Obtain the image after die bonding, wherein the image after die bonding contains N chips bonded to the same pixel, where N≥3.

[0025] In practice, firstly, after the die bonder completes the die bonding operation for all N chips within the same pixel, a post-die bonding visual inspection unit acquires the post-die bonding image. The post-die bonding image refers to a data object containing complete image information of the N chips bonded within the same pixel. Furthermore, the post-die bonding visual inspection unit typically employs a high-resolution industrial camera, whose resolution is sufficient to distinguish minute positional deviations of the chips. Further, to ensure the accuracy of subsequent analysis, the offset data of the N chips should be acquired within the same coordinate system and the same motion cycle; that is, the die bonding process for all chips is completed within the same motion cycle, and the reference coordinate system remains consistent during image acquisition. The purpose of this is that only by ensuring the spatiotemporal consistency of data acquisition can the root cause of the offset be deduced by comparing the offset characteristics of different chips laterally.

[0026] S2, based on the post-die bonding image, determine the position offset of each of the N chips relative to the target position.

[0027] In specific implementation, based on the post-die-bonding image, the center coordinates of each chip are extracted using an image processing algorithm. These coordinates are then compared with the pre-set target mounting coordinates to calculate the deviation values ​​of each chip in the X-axis and Y-axis directions. This deviation value is the position offset. For the i-th chip, its position offset is denoted as (Δx). i , Δy i ), where Δx i Let Δy represent the offset of the i-th chip in the X direction. i This represents the offset of the i-th chip in the Y direction.

[0028] S3, based on the position offset, determine the offset type of the N chips from a preset variety of offset types.

[0029] In specific implementation, based on the positional offset, the offset type of the N chips is determined from a set of preset offset types. The preset offset types include substrate expansion / contraction mode, platform offset mode, swing arm offset mode, and mixed offset mode. The core of this step is to pinpoint the root cause of the offset by analyzing the distribution pattern of the offset among different chips. Specifically, when the offset of all chips is basically the same, it indicates that the offset is unrelated to the chip bonding sequence and should be identified as substrate expansion / contraction mode; further, when only the first chip bonded shows an offset related to the platform jump direction, it indicates insufficient platform positioning accuracy and should be identified as platform offset mode; further, when only a single subsequent chip (a chip other than the first chip bonded) shows an offset, it indicates a problem with the stability of the corresponding bonding arm and should be identified as swing arm offset mode; further, when the offset direction of all chips is the same, but there are differences in the offset amplitude and this difference is not less than a preset threshold, it indicates a superposition effect of overall substrate expansion / contraction and a single mechanism problem and should be identified as mixed offset mode.

[0030] For example, in some preferred embodiments, determining the offset type of the N chips from a preset range of offset types based on the position offset includes: when the position offsets of the N chips all satisfy a preset global consistency condition, determining the offset type as a substrate expansion / contraction mode; the global consistency condition is that the offset directions of the N chips are consistent and the difference between the offset amplitudes is less than a preset consistency threshold; when only the position offset of the first die-bonded chip among the N chips satisfies a preset direction association condition, and the remaining chips do not satisfy the global consistency condition, determining the offset type as a platform offset. In the shift mode, the direction association condition is that the offset direction of the first die-bonded chip is consistent with the cross-pixel jump direction of the platform between adjacent pixels; when only one of the N chips, which is not the first die-bonded chip, satisfies the preset single-chip offset condition, and the remaining chips do not satisfy the global consistency condition, the offset type is determined to be the swing arm offset mode, and the single offset condition is that the offset of the chip exceeds the preset swing arm offset threshold; when the position offset directions of the N chips are consistent, and the difference between the offset amplitudes is not less than the preset consistency threshold, the offset type is determined to be the mixed offset mode.

[0031] In practical implementation, in a single-platform, multi-color sequential die-bonding architecture, the platform needs to perform a large-distance jump across pixels when bonding the first chip, with the movement distance on the order of pixel pitch. However, when bonding the second to Nth chips, the platform only moves a small distance within the same pixel, with the movement distance on the order of pad pitch. This difference in the magnitude of the movement distance is the core physical basis for distinguishing the root cause of the offset. The specific determination logic is as follows: To facilitate clear description, we first define the relevant symbols: Let the position offset of the first die-bonded chip, i.e., the first chip, be denoted as (Δx). 1st , Δy 1st ), where Δx 1st Δy represents the offset of the first chip in the X direction. 1st Let (Δx) represent the offset of the first chip in the Y direction; let the cross-pixel jump direction vector of the platform between adjacent pixels be denoted as (Δx). 平台 , Δy 平台 ), where Δx 平台 Δy represents the platform's movement component in the X direction. 平台 This represents the movement component of the platform in the Y direction.

[0032] Scenario 1: Substrate expansion and contraction mode Specifically, when the positional offsets of the N chips all meet a preset global consistency condition, the offset type is determined to be a substrate expansion / contraction mode. The global consistency condition requires that the offset directions of the N chips are consistent, and the difference between their offset amplitudes is less than a preset consistency threshold. To quantitatively describe this consistency, the standard deviation σ of the offsets of the N chips can be calculated. When σ is less than the consistency threshold T... c If the offset of all chips is basically the same, it means that the offset is not related to the platform movement distance during chip bonding. The only reasonable explanation is that the substrate itself has undergone overall expansion or contraction.

[0033] For example, such as Figure 4 As shown, taking RGB three-color pixels as an example, the die bonding order is RGB. The R chip, G chip and B chip all show the same regular positional offset, that is, the offset direction of the three chips is consistent and the offset amplitude is similar. This schematic diagram is used to intuitively illustrate the offset characteristics in the substrate expansion and contraction mode.

[0034] Scenario 2: Platform Offset Mode Specifically, when the positional offset of only the first die-bonded chip among the N chips satisfies a preset directional association condition, and the remaining chips do not satisfy the global consistency condition, the offset type is determined to be a platform offset mode. The directional association condition is that the offset direction of the first die-bonded chip is consistent with the cross-pixel jump direction of the platform between adjacent pixels. The specific determination process is as follows: calculate the dot product of the offset direction of the first chip and the platform movement vector, i.e., calculate (Δx... 1st × Δx 平台 + Δy 1st × Δy 平台When the dot product is greater than 0, it indicates that the angle between the offset direction and the platform movement direction is less than 90°, meaning the directions are consistent and the direction association condition is met. Furthermore, to ensure the reliability of the determination, this condition can be further required to be continuously met across multiple consecutive pixels.

[0035] For example, such as Figure 3 As shown, taking RGB three-color pixels as an example, the die bonding order is RGB. The first die bonded R chip is offset, and the offset direction is related to the cross-pixel jump direction of the platform. The G and B chips are in normal positions. This diagram is used to intuitively illustrate the offset characteristics in the platform offset mode.

[0036] Scenario 3: Swing Arm Offset Mode Specifically, when the positional offset of only one non-first die-bonded chip among the N chips meets a preset single-chip offset condition, and the remaining chips do not meet the global consistency condition, the offset type is determined to be a swing arm offset mode. The single-chip offset condition requires the chip's offset to exceed a preset swing arm offset threshold. The physical basis for this determination is that when the second to Nth chips are die-bonded, the mounting platform is already in place, moving only a small distance within the same pixel; the platform positioning error has a negligible impact on the mounting accuracy. If a chip at this time exhibits an offset exceeding a reasonable threshold, the offset can only originate from the stability issue of the die-bonding arm responsible for that chip itself.

[0037] For example, such as Figure 2 As shown, taking RGB three-color pixels as an example, the die bonding order is RGB. The figure shows two scenarios of the swing arm offset mode: the first is that the G chip is offset while the R and B chips are normal; the second is that the B chip is offset while the R and G chips are normal. This schematic diagram is used to intuitively illustrate the offset characteristics in the swing arm offset mode.

[0038] Scenario 4: Hybrid Offset Mode Specifically, when the positional offset directions of the N chips are consistent, and the difference in offset amplitude is not less than the preset consistency threshold, the offset type is determined to be a mixed offset mode. In this case, all chips have the same offset direction, but the amplitudes differ significantly, indicating a combined effect of overall substrate expansion / contraction and individual mechanism issues.

[0039] This embodiment establishes four judgment scenarios, corresponding to substrate expansion / contraction mode, platform offset mode, swing arm offset mode, and mixed offset mode, respectively, to accurately distinguish the root causes of offset. The judgment logic fully utilizes the inherent characteristic of the difference in the order of magnitude of platform movement distance, providing a precise basis for subsequent differential compensation. In particular, the quantitative determination of directional correlation through dot product operation ensures the rigor of the judgment logic.

[0040] S4. Based on the offset type, generate a corresponding compensation amount and apply the compensation amount to the motion control parameters in the subsequent die bonding process.

[0041] In practice, a corresponding compensation amount is generated based on the offset type, and this compensation amount is applied to the motion control parameters in the subsequent die bonding process. The motion control parameters include the target position of the platform and the mounting coordinates of each die bonding arm. For substrate expansion / contraction mode, the average of all chip offsets is calculated as the global compensation amount; for platform offset mode, the correction value for the target position of the platform is calculated based on the offset of the first chip; for swing arm offset mode, the correction value for the die bonding arm mounting coordinates is calculated based on the offset of the corresponding chip; for mixed offset mode, both substrate expansion / contraction components and mechanism deviation components need to be processed simultaneously. After applying the compensation amount to the motion control parameters, subsequent die bonding operations will automatically execute the corrected actions, thereby eliminating the detected deviations.

[0042] This embodiment achieves real-time detection of chip offset by acquiring post-die-bonding images of multiple chips within the same pixel and determining their positional offsets. Based on this, the distribution pattern of positional offsets among different chips is used as a diagnostic criterion to effectively distinguish offsets from three different sources: substrate expansion / contraction, platform positioning drift, and swing arm stability issues. Corresponding compensation amounts are generated based on the diagnostic results and applied to subsequent motion control parameters, achieving precise correction of the offset and avoiding the miscompensation problem caused by a single compensation strategy in traditional solutions.

[0043] In some preferred embodiments, generating the corresponding compensation amount according to the offset type includes: when the offset type is the substrate expansion / contraction mode, calculating the average of the position offsets of the N chips, determining a global compensation amount based on the average, and using the global compensation amount as the compensation amount; when the offset type is the platform offset mode, calculating a correction value for the target position of the platform movement based on the position offset, and using the correction value as the compensation amount; when the offset type is the swing arm offset mode, calculating a correction value for the mounting coordinates of the corresponding die-bonding arm based on the position offset, and using the correction value as the compensation amount; when the offset type is the mixed offset mode, determining a global compensation amount and a mechanism compensation amount based on the position offset, and using the global compensation amount and the mechanism compensation amount as the compensation amount.

[0044] In specific implementation, this embodiment designs differentiated compensation amount generation strategies for four different offset types.

[0045] Compensation Scenario 1: Substrate Expansion / Contraction Mode Specifically, when the offset type is the substrate expansion / contraction mode, the average positional offset of the N chips is calculated, a global compensation amount is determined based on the average, and the global compensation amount is used as the compensation amount. Specifically, the average offset in the X and Y directions is calculated respectively: Δx 全局 = (Δx 1st + Δx 2nd + … + Δx Nth ) / N, Δy 全局 = (Δy 1st + Δy 2nd + … + Δy Nth ) / N。(Δx 全局 , Δy 全局 This is the global compensation amount, which represents the positional offset of the substrate pads in the X and Y directions. Where, Δx 1st Δx 2nd , … , Δx Nth Δy represents the positional offset of the 1st, 2nd, ... Nth die-bonding chip in the X direction; 1st , Δy 2nd , … , Δy Nth , representing the position offset of the 1st, 2nd...Nth die-bonding chip in the Y direction, respectively.

[0046] Compensation Scenario 2: Platform Offset Mode Specifically, when the offset type is the platform offset mode, a correction value for the target position of the loading platform is calculated based on the position offset, and this correction value is used as the compensation amount. The correction value is calculated based on the offset (Δx) of the first chip. 1st , Δy 1st The reverse calculation determines the adjustment value that the target position of the platform should be adjusted. For example, if the first chip is offset by Δx in the +X direction... 1st Then the target position of the cargo platform should be moved Δx in the -X direction. 1st .

[0047] Compensation Scenario 3: Swing Arm Offset Mode Specifically, when the offset type is the swing arm offset mode, a correction value for the mounting coordinates of the corresponding die-bonding arm is calculated based on the position offset, and this correction value is used as the compensation amount. The correction value is calculated based on the offset (Δx) of the chip corresponding to the swing arm. k , Δy k The mounting coordinates of the die bond arm should be adjusted by reverse calculation.

[0048] Compensation Scenario 4: Hybrid Offset Mode Specifically, when the offset type is the hybrid offset mode, a global compensation amount and a mechanism compensation amount are determined based on the position offset, and the global compensation amount and the mechanism compensation amount are used as the compensation amount. The global compensation amount is used to compensate for the overall expansion and contraction of the substrate, and the mechanism compensation amount is used to compensate for the deviation of a single mechanism (platform or swing arm).

[0049] This embodiment designs three strategies—global compensation, platform compensation, and swing arm compensation—for the four types of offset, ensuring that the compensation method accurately matches the root cause. The three strategies do not interfere with each other, avoiding the miscompensation problems that may occur with a single compensation strategy in traditional solutions.

[0050] In some preferred embodiments, determining the global compensation amount based on the mean includes: after each pixel detection is completed, obtaining the mean of the position offset of the current pixel; multiplying the mean by a preset coefficient as the compensation increment for the current step; and combining the compensation increment for the current step with the accumulated global compensation amount to obtain an updated global compensation amount.

[0051] In practice, considering that the expansion and contraction of the substrate may be a slow process and that a single detection may contain noise, this embodiment achieves a smooth update of the global compensation amount through a progressive correction mechanism.

[0052] Specifically, after each pixel is detected, the average position offset of the current pixel is obtained, denoted as (Δx). 均值_当前 , Δy 均值_当前 Further, the mean is multiplied by a preset coefficient to obtain the compensation increment for the current step. The preset coefficient is between 0.5 and 1.0, used to control the magnitude of each compensation to prevent overshoot caused by single-detection noise. Further, the compensation increment for the current step is combined with the accumulated global compensation to obtain the updated global compensation. The combination method uses a moving average, and the specific formula is: Updated global compensation = Original accumulated global compensation × (1...) α) + Current step compensation increment × α. Where α is a preset smoothing coefficient, ranging from 0.01 to 0.1, used to control the smoothness of the moving average, so that the global compensation amount can smoothly follow the long-term trend of substrate expansion and contraction.

[0053] It should be noted that in the above moving average formula, the "original cumulative global compensation amount" refers to the total historical compensation amount used to compensate for the overall expansion and contraction of the substrate, which has been stored by the die bonder before the current pixel detection. Initially, the original cumulative global compensation amount is initialized to zero; thereafter, after each pixel detection is completed, the die bonder calculates a new compensation amount according to the formula and stores this new compensation amount as the "original cumulative global compensation amount" for the next calculation.

[0054] The "updated global compensation amount" refers to the new global compensation amount obtained by weighting and summing the original cumulative global compensation amount and the current step compensation increment according to a preset weight. This new compensation amount will replace the original cumulative global compensation amount and serve as the currently effective global compensation amount for coordinate correction in subsequent pixel die bonding processes.

[0055] The "current step compensation increment" refers to the value obtained by multiplying the average position offset obtained from the current pixel detection by the preset coefficient, and is used to introduce the latest information of the current detection in this update.

[0056] Through the above-mentioned moving average mechanism, the global compensation amount can smoothly follow the long-term trend of substrate expansion and contraction, avoiding drastic fluctuations in compensation amount caused by single detection noise, thereby achieving the technical effect of gradual correction.

[0057] This embodiment achieves a gradual correction of substrate expansion and contraction by multiplying the average position offset obtained from each detection by a preset coefficient as the compensation increment for the current step, and accumulating and updating the global compensation amount using a moving average method. This mechanism ensures timely response to significant offsets while avoiding compensation overshoot caused by noise in a single detection through a partial compensation mechanism.

[0058] In some preferred embodiments, determining the global compensation amount and the mechanism compensation amount based on the position offset includes: determining a global expansion / contraction component based on the position offset; subtracting the global expansion / contraction component from the position offset to obtain a remaining offset; determining whether the remaining offset satisfies a preset platform offset determination condition or a swing arm offset determination condition; if the remaining offset satisfies the platform offset determination condition, generating a corresponding platform compensation amount as the mechanism compensation amount, and using the global expansion / contraction component as the global compensation amount; if the remaining offset satisfies the swing arm offset determination condition, generating a corresponding swing arm compensation amount as the mechanism compensation amount, and using the global expansion / contraction component as the global compensation amount; if the remaining offset does not satisfy both the platform offset determination condition and the swing arm offset determination condition, only the global expansion / contraction component is used as the global compensation amount, and the mechanism compensation amount is determined to be 0.

[0059] In practice, the hybrid offset mode refers to a scenario where the overall expansion / contraction of the substrate and the deviation of a single mechanism (platform or swing arm) coexist. In this case, the final offset of the chip is the result of the superposition of the two factors. If they are not distinguished and the original offset is directly compensated, it will lead to incorrect compensation direction or inaccurate compensation amount. Therefore, this embodiment first separates the substrate expansion / contraction component and then determines the single mechanism failure of the remaining component, thereby achieving accurate decoupling and separate compensation of the hybrid offset. The specific implementation method is as follows.

[0060] First, a global expansion / contraction component is determined based on the positional offset. This global expansion / contraction component reflects the overall positional offset of the substrate pads, and is calculated as follows: the average positional offset of the N chips is calculated. This average value is taken as the global expansion / contraction component, denoted as (Δx). 涨缩 , Δy 涨缩 This component represents the overall displacement of the substrate itself due to factors such as thermal expansion and contraction.

[0061] Further, the global scaling component is subtracted from the position offset to obtain the remaining offset. Specifically, for the i-th chip, its original offset is (Δx) i , Δy i After deducting the global scaling component, the remaining offset of the chip is obtained. The formula for calculating the remaining offset is as follows: Δx i_剩余 = Δx i Δx 涨缩 Δy i_剩余 = Δy i Δy 涨缩 Where, Δx i_剩余 Δy represents the residual offset of the i-th chip in the X direction after removing the effects of overall substrate expansion and contraction. i_剩余 This represents the residual offset of the i-th chip in the Y direction after removing the effects of overall substrate expansion and contraction. The residual offset represents the deviation component that may be caused by a single mechanism (platform or swing arm).

[0062] Further, determine whether the remaining offset meets the preset platform offset determination condition or swing arm offset determination condition.

[0063] The platform offset determination condition refers to the following: only the remaining offset of the first chip satisfies the direction association condition, while the remaining offsets of the other chips do not satisfy the global consistency condition. Specifically, the direction association condition means that the remaining offset direction of the first chip is consistent with the cross-pixel jump direction of the platform between adjacent pixels. This can be determined by calculating the dot product of the remaining offset direction of the first chip and the cross-pixel jump direction vector of the platform. When the dot product is greater than 0, the direction association condition is considered satisfied.

[0064] Furthermore, the swing arm offset determination condition refers to the following: only one chip (not the first chip) has a remaining offset that satisfies the single-chip offset condition, while the remaining offsets of the other chips do not satisfy the global consistency condition. The single-chip offset condition refers to the remaining offset of the chip exceeding a preset swing arm offset threshold.

[0065] It should be noted that the distinction between "the first chip" and "not the first chip" in the above determination criteria relies on the die bonding sequence information. The die bonding sequence information is used to determine the die bonding order of the 1st to the Nth chips, thereby distinguishing the first chip from the remaining chips.

[0066] Furthermore, if the remaining offset satisfies the platform offset determination condition, it is determined that after deducting the substrate expansion and contraction component, the remaining offset exhibits a regular deviation that is only related to the first chip and whose direction is consistent with the platform movement. The root cause is abnormal platform positioning.

[0067] Furthermore, if the remaining offset satisfies the swing arm offset determination condition, it is determined that after deducting the substrate expansion and contraction component, the remaining offset exhibits an isolated deviation that is only related to a specific chip. The root cause is the stability problem of the die bond arm corresponding to that chip.

[0068] Furthermore, if the remaining offset does not meet both the platform offset determination condition and the swing arm offset determination condition, it is determined that after deducting the substrate expansion and contraction component, the remaining offset does not have obvious single mechanism failure characteristics and may be caused by the superposition of multiple small random factors.

[0069] Furthermore, based on the above judgment results, the corresponding compensation amount generation logic is executed: If the remaining offset satisfies the platform offset determination condition, then the corresponding platform compensation amount is generated as the mechanism compensation amount, and the global expansion / contraction component (Δx) is used. 涨缩 , Δy 涨缩 ) is used as the global compensation amount.

[0070] Furthermore, if the remaining offset satisfies the swing arm offset determination condition, a corresponding swing arm compensation amount is generated as the mechanism compensation amount, and the global expansion / contraction component (Δx) is used as the compensation amount. 涨缩 , Δy 涨缩 ) is used as the global compensation amount.

[0071] Furthermore, if the remaining offset does not satisfy both the platform offset determination condition and the swing arm offset determination condition, it indicates that after deducting the global expansion / contraction component, the remaining offset does not conform to the characteristics of any single mechanism problem. In this case, only the global expansion / contraction component (Δx) is considered. 涨缩 , Δy 涨缩 The global compensation amount is set as 0, and the institutional compensation amount is set to 0.

[0072] Through the above steps, the compensation amount is determined to be a combination of the global compensation amount and the mechanism compensation amount (which may be 0). In the subsequent die bonding process, the compensation amount will be applied to the corresponding motion control parameters: the global compensation amount applies to the overall mounting coordinate system to compensate for substrate expansion and contraction; the mechanism compensation amount applies to the corresponding target position of the platform or the die bonding arm mounting coordinates to compensate for individual mechanism deviations.

[0073] This embodiment achieves effective decoupling of substrate expansion / contraction and single-mechanism problems under mixed offset mode by adopting a technical approach of "first separating the global expansion / contraction component, and then determining the fault of a single mechanism based on the remaining offset." By subtracting the global expansion / contraction component from the original position offset, this embodiment can separate the mechanism deviation component superimposed on the substrate expansion / contraction, avoiding the confusion of two offsets from different sources. Furthermore, when the remaining offset meets the determination conditions of the platform or swing arm, this embodiment can generate corresponding mechanism compensation amounts respectively, which, together with the global compensation amount, achieve separate compensation, significantly improving the compensation accuracy. Furthermore, when the remaining offset does not meet any single mechanism characteristics, this embodiment only performs global compensation, avoiding unnecessary compensation actions. This refined processing method significantly improves the system's adaptability and compensation effect under complex working conditions.

[0074] In some preferred embodiments, the method further includes: monitoring whether the compensation amount exceeds a preset compensation limit; and triggering an alarm signal when the compensation amount exceeds the compensation limit.

[0075] In practice, while generating the compensation amount and applying it to the subsequent die bonding process, the system monitors in real time whether the compensation amount exceeds a preset compensation upper limit. Furthermore, the compensation upper limit is a threshold set for different offset types to determine whether the current compensation amount has exceeded a reasonable range. When the compensation amount exceeds the compensation upper limit, the system triggers an alarm signal. Further, the alarm signal can be an audible and visual alarm, a pop-up notification on the screen, or an alarm message sent to the factory monitoring system via a network protocol. The alarm information can include the compensation amount exceeding the upper limit, the corresponding offset type, and the identifier of the affected mechanism, so that maintenance personnel can quickly locate the problem.

[0076] This embodiment provides a key safety protection mechanism for the die bonder by monitoring whether the compensation amount exceeds the preset compensation limit and triggering an alarm signal, thus avoiding the risk that the compensation amount will continue to increase due to hardware failure and thus mask the real problem of the equipment.

[0077] In some preferred embodiments, the compensation upper limit includes a swing arm compensation upper limit, a platform compensation upper limit, and a global compensation upper limit; the swing arm compensation upper limit and the platform compensation upper limit do not exceed one-third of a preset die bonding accuracy.

[0078] In specific implementation, the compensation upper limit includes the upper limit of the swing arm compensation, the upper limit of the platform compensation, and the upper limit of the global compensation. The upper limit of the swing arm compensation and the upper limit of the platform compensation do not exceed one-third of the preset die bonding accuracy. For example, if the die bonding accuracy is ±15 μm, then the upper limit of the swing arm compensation and the upper limit of the platform compensation are both set to 5 μm. When the swing arm compensation or platform compensation exceeds 5 μm, it indicates that the corresponding mechanism may have experienced severe hardware wear or failure, and software compensation alone is no longer sufficient to maintain process accuracy. The upper limit of the global compensation is set according to the substrate specifications and process requirements, for example, ±30 μm. When the global compensation exceeds this range, it indicates that the expansion and contraction of the substrate has exceeded the range allowed by the normal process, which may indicate an abnormality in the incoming material.

[0079] This embodiment provides an objective quantitative standard for evaluating the hardware status of the equipment by setting the upper limits of the swing arm compensation and platform compensation to no more than one-third of the die bonding accuracy. Simultaneously, the setting of the global compensation upper limit provides real-time feedback on the quality of incoming substrates, encouraging suppliers to improve substrate quality.

[0080] In some preferred embodiments, the method further includes: associating the offset type with the compensation amount to generate pattern compensation data; recording the pattern compensation data in real time; and uploading the pattern compensation data to the manufacturing execution system.

[0081] In specific implementation, the offset type and the compensation amount are first associated to generate pattern compensation data. This pattern compensation data is a dataset that associates and formats the offset type, corresponding compensation amount, occurrence time, pixel coordinates, and other information for each detection. Furthermore, the pattern compensation data is recorded in real time, either through local database storage or log file writing, ensuring that no compensation data is lost. Finally, the pattern compensation data is uploaded to the manufacturing execution system (MES). The MES can aggregate data from multiple devices and perform trend analysis. For example, it can predict the wear trend of the swing arm by analyzing the change curve of the swing arm compensation amount over time, and assess the consistency of incoming material quality by analyzing the distribution of substrate expansion and contraction compensation amount on different batches of substrates.

[0082] This embodiment compensates data by associating offset type with compensation amount generation mode, and records and uploads the data to the manufacturing execution system in real time, realizing the transparency and traceability of die bonding process data, providing a data foundation for predictive maintenance and incoming material quality improvement, and forming a closed-loop mechanism from detection to compensation and then to process improvement.

[0083] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0084] Please see Figure 5 , Figure 5 This is a schematic block diagram of a computer device provided in an embodiment of this application. The computer device 500 can be a terminal or a server, wherein the server can be a standalone server or a server cluster composed of multiple servers.

[0085] The computer device 500 includes a processor 502, a memory, and a network interface 505 connected via a system bus 501. The memory may include a non-volatile storage medium 503 and internal memory 504.

[0086] The non-volatile storage medium 503 can store an operating system 5031 and a computer program 5032. When the computer program 5032 is executed, it enables the processor 502 to perform a real-time offset detection and differential compensation method for a die bonder.

[0087] The processor 502 provides computing and control capabilities to support the operation of the entire computer device 500.

[0088] The internal memory 504 provides an environment for the operation of the computer program 5032 in the non-volatile storage medium 503. When the computer program 5032 is executed by the processor 502, the processor 502 can execute a real-time offset detection and differential compensation method for a die bonder.

[0089] The network interface 505 is used for network communication with other devices. Those skilled in the art will understand that the above structure is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device 500 to which the present application is applied. A specific computer device 500 may include more or fewer components than shown in the figures, or combine certain components, or have different component arrangements.

[0090] The processor 502 is used to run a computer program 5032 stored in a memory to implement the steps of a real-time offset detection and differential compensation method for a die bonder provided in any of the above method embodiments.

[0091] It should be understood that in the embodiments of this application, the processor 502 may be a central processing unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor.

[0092] It will be understood by those skilled in the art that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program may be stored in a storage medium, which is a computer-readable storage medium. The computer program is executed by at least one processor in the computer system to implement the process steps of the embodiments of the above methods.

[0093] Therefore, the present invention also provides a storage medium. This storage medium can be a computer-readable storage medium. The storage medium stores a computer program. When executed by a processor, the computer program causes the processor to perform the steps of the real-time offset detection and differential compensation method for a die bonder provided in any of the above-described method embodiments.

[0094] The storage medium is a physical, non-transient storage medium, such as a USB flash drive, external hard drive, read-only memory (ROM), magnetic disk, or optical disk, or any other physical storage medium capable of storing program code. The computer-readable storage medium can be non-volatile or volatile.

[0095] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0096] In the several embodiments provided by this invention, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For example, the division of each unit is merely a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0097] The steps in the method of this invention can be adjusted, merged, or reduced in order according to actual needs. The units in the device of this invention can be merged, divided, or reduced according to actual needs. Furthermore, the functional units in the various embodiments of this invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0098] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, a terminal, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention.

[0099] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0100] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, this invention is also intended to include these modifications and variations as long as they fall within the scope of the claims of this invention and their equivalents.

[0101] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for real-time offset detection and differential compensation in a die bonder, characterized in that, include: Acquire an image after die bonding, wherein the image after die bonding contains N chips that are die bonded to the same pixel, where N≥3; Based on the post-die bonding image, determine the position offset of each of the N chips relative to the target position; Based on the position offset, the offset type of the N chips is determined from a preset variety of offset types; Based on the offset type, a corresponding compensation amount is generated, and the compensation amount is applied to the motion control parameters in the subsequent die bonding process.

2. The method according to claim 1, characterized in that, The step of determining the offset type of the N chips from a preset range of offset types based on the position offset includes: When the position offsets of the N chips all meet the preset global consistency condition, the offset type is determined to be substrate expansion / contraction mode. The global consistency condition is that the offset directions of the N chips are consistent and the difference between the offset amplitudes is less than the preset consistency threshold. When the position offset of only the first die-bonded chip among the N chips meets the preset direction association condition, and the other chips do not meet the global consistency condition, the offset type is determined to be platform offset mode. The direction association condition is that the offset direction of the first die-bonded chip is consistent with the cross-pixel jump direction of the platform between adjacent pixels. When the position offset of only one non-first die-bonded chip among the N chips meets the preset single-chip offset condition, and the remaining chips do not meet the global consistency condition, the offset type is determined to be swing arm offset mode, and the single-chip offset condition is that the offset of the chip exceeds the preset swing arm offset threshold. When the position offset directions of the N chips are consistent and the difference between the offset amplitudes is not less than a preset consistency threshold, the offset type is determined to be a mixed offset mode.

3. The method according to claim 2, characterized in that, The step of generating the corresponding compensation amount based on the offset type includes: When the offset type is the substrate expansion / contraction mode, calculate the average of the position offsets of the N chips, determine the global compensation amount based on the average, and use the global compensation amount as the compensation amount; When the offset type is the platform offset mode, the correction value of the target position of the cargo platform is calculated based on the position offset amount, and the correction value is used as the compensation amount; When the offset type is the swing arm offset mode, the correction value of the mounting coordinate of the corresponding die bond arm is calculated according to the position offset amount, and the correction value is used as the compensation amount; When the offset type is the mixed offset mode, the global compensation amount and the mechanism compensation amount are determined according to the position offset amount, and the global compensation amount and the mechanism compensation amount are used as the compensation amount.

4. The method according to claim 3, characterized in that, The step of determining the global compensation amount based on the mean includes: After each pixel is detected, the average value of the position offset of the current pixel is obtained; Multiply the mean by a preset coefficient to obtain the compensation increment for the current step; The current step's compensation increment is combined with the accumulated global compensation amount to obtain the updated global compensation amount.

5. The method according to claim 3, characterized in that, The step of determining the global compensation amount and the mechanism compensation amount based on the position offset includes: The global expansion / contraction component is determined based on the position offset. The remaining offset is obtained by subtracting the global expansion / contraction component from the position offset. Determine whether the remaining offset meets the preset platform offset determination condition or swing arm offset determination condition; If the remaining offset satisfies the platform offset determination condition, then the corresponding platform compensation amount is generated as the mechanism compensation amount, and the global expansion and contraction component is used as the global compensation amount. If the remaining offset satisfies the swing arm offset determination condition, then the corresponding swing arm compensation amount is generated as the mechanism compensation amount, and the global expansion and contraction component is used as the global compensation amount. If the remaining offset does not satisfy both the platform offset determination condition and the swing arm offset determination condition, then only the global expansion and contraction component is used as the global compensation amount, and the mechanism compensation amount is determined to be 0.

6. The method according to claim 1, characterized in that, The method further includes: Monitor whether the compensation amount exceeds the preset compensation limit; An alarm signal is triggered when the compensation amount exceeds the compensation limit.

7. The method according to claim 6, characterized in that, The compensation upper limit includes the swing arm compensation upper limit, the platform compensation upper limit, and the global compensation upper limit; the swing arm compensation upper limit and the platform compensation upper limit do not exceed one-third of the preset die bonding accuracy.

8. The method according to claim 1, characterized in that, The method further includes: Associate the offset type with the compensation amount to generate pattern compensation data; The pattern compensation data is recorded in real time and uploaded to the manufacturing execution system.

9. A computer device, characterized in that, The computer device includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the method as described in any one of claims 1-8.

10. A computer-readable storage medium, characterized in that, The storage medium stores a computer program that, when executed by a processor, can implement the method as described in any one of claims 1-8.

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