Chip cartridge, method of mounting chip cartridge, and quantum computer

Abstract

The application discloses a chip box, a mounting method of the chip box and a quantum computer. The chip box comprises a top cover assembly and a bottom plate assembly. The top cover assembly comprises a top cover and a plurality of first elastic pins. Each first elastic pin is arranged at intervals on the top cover, and the first end of each first elastic pin is an elastic end. The bottom plate assembly comprises a bottom plate for carrying a chip. The bottom plate assembly is detachably connected with the top cover assembly. When the chip is carried on the bottom plate, the pins of the chip are directed towards the first ends of the first elastic pins, and the first ends of each first elastic pin are in elastic contact with corresponding pins respectively. The elastic contact between the first elastic pins of a unified specification and the pins of the chip can improve the consistency of connection and the stability of quality. The detachable connection between the bottom plate assembly and the top cover assembly allows the first elastic pins to be arranged vertically above the chip, thereby avoiding the planar connection lead-out mode of arranging a plurality of bonding wires around the chip, reducing the occupation of the internal space of the chip box, and being beneficial to reducing the volume of the chip box.

Description

Technical Field

[0001] This application relates to the field of quantum computer technology, and in particular to a chip box, a method for installing the chip box, and a quantum computer. Background Technology

[0002] In related technologies, the measurement and control system of a quantum computer is connected to a chip box containing a quantum chip via radio frequency (RF) cables. Specifically, the pins of the quantum chip are typically connected to pads on a PCB (Printed Circuit Board) via multiple bonding wires, and signal communication is achieved through RF connectors on the PCB.

[0003] However, the above connection method has at least the following shortcomings: First, multiple bonding wires are placed on the periphery of the quantum chip, occupying a large space inside the chip box; second, the lengths of the multiple bonding wires are different, resulting in poor structural consistency; third, the bonding process has poor consistency, which can easily lead to problems such as poor soldering or bonding misalignment, affecting the reliability of signal transmission. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides a chip box, a method for installing the chip box, and a quantum computer.

[0005] In a first aspect, this application provides a chip box, comprising: The upper cover assembly includes an upper cover and a plurality of first spring pins, each of the first spring pins being spaced apart from the upper cover, and the first end of each of the first spring pins being an elastic end. A base plate assembly, including a base plate for carrying a chip, the base plate assembly being detachably connected to the top cover assembly; When the chip is mounted on the base plate, the pins of the chip face the first end of the first spring pin, and the first end of each of the first spring pins makes elastic contact with the corresponding pin to achieve electrical connection.

[0006] In some embodiments, the top cover assembly further includes a plurality of second spring pins spaced apart on the top cover, wherein each second spring pin and each first spring pin are arranged in an array and alternately on the top cover; the first end of each second spring pin is an elastic end, which is used to elastically contact the corresponding pin to achieve electrical connection.

[0007] In some embodiments, the cross-sectional area of ​​the second spring needle is different from that of the first spring needle.

[0008] In some embodiments, the second end of the first spring needle is also an elastic end, and the second end of the second spring needle is also an elastic end.

[0009] In some embodiments, the upper cover assembly further includes a plurality of positioning elements disposed on the upper cover, and the bottom plate is provided with a plurality of positioning holes, the positioning holes being provided one-to-one with the positioning elements, and the positioning elements being interference-fitted with the positioning holes.

[0010] In some embodiments, the base plate assembly further includes a plurality of positioning elements disposed on the base plate, and the upper cover is provided with a plurality of positioning holes, the positioning holes being provided one-to-one with the positioning elements, and the positioning elements being interference-fitted with the positioning holes.

[0011] In some embodiments, the first spring needle includes a spring needle body and an insulating layer, the insulating layer being sleeved on the spring needle body to insulate the spring needle body from the upper cover.

[0012] In some embodiments, the top cover has a front and a back side disposed opposite to each other, each of the first spring pins is disposed through the top cover, a first end of each of the first spring pins extends from the back side of the top cover, and a second end of each of the first spring pins extends from the front side of the top cover.

[0013] In some embodiments, the base plate is provided with a groove for accommodating the chip; the base plate assembly further includes a plurality of third spring pins spaced apart on the base plate, the elastic end of each third spring pin extending into the groove for elastic contact with the surface of the chip away from the top cover.

[0014] In some embodiments, the base plate is provided with a groove for accommodating the chip; the base plate assembly further includes a chip limiting member and a plurality of third spring pins, the chip limiting member is disposed in the groove and is used to support the chip, each of the third spring pins is spaced apart on the base plate, and the elastic end of each of the third spring pins extends into the groove for elastic contact with the chip limiting member.

[0015] In some embodiments, the chip limiting member is provided with a plurality of notches, each notch corresponding to a positioning member, and the opening width of the notch is adapted to the diameter of the positioning member, so that the positioning member is laterally engaged into the notch and fixes the chip limiting member.

[0016] In some embodiments, the chip limiting member is provided with a plurality of notches, each notch corresponding to a positioning member, and the opening width of the notch is adapted to the diameter of the positioning member, so that the positioning member is laterally engaged into the notch and fixes the chip limiting member.

[0017] In some embodiments, the chip housing further includes a connector assembly detachably connected to the top cover assembly, the connector assembly comprising: The base has a front and a back that are positioned opposite each other; Multiple contacts are disposed on the back of the base and are arranged in an array; A connecting cable is disposed on the front side of the base and is electrically connected to each of the multiple contacts. When the connector assembly is connected to the top cover assembly, the back of the base is attached to the front of the top cover, and the second end of each of the first spring pins abuts against the corresponding contact point, so that the connecting cable is electrically connected to the pin.

[0018] Secondly, this application provides a method for installing a chip box, the chip box including a top cover assembly, a bottom plate assembly, and a plurality of first fixing members, the top cover assembly including a top cover and a plurality of first spring pins, each of the first spring pins being spaced apart from the top cover, and each of the first spring pins having a first end that is an elastic end; the bottom plate assembly including a bottom plate; the installation method includes: The upper cover assembly is placed on the support platform so that the first end of the first spring pin is away from the support platform; The chip is placed on the top cover assembly, with the pins of the chip facing the first end of the first spring pin; The base plate assembly is placed on top of the top cover assembly, and the base plate is fixed on the top cover by the first fastener, so that the first end of each of the first spring pins makes elastic contact with the pin of the corresponding chip to achieve electrical connection.

[0019] In some embodiments, the upper cover assembly further includes a plurality of positioning members disposed on the upper cover, the bottom plate is provided with a plurality of positioning holes, the positioning holes being disposed one-to-one with the positioning members; the bottom plate is provided with a groove, and the bottom plate assembly further includes a plurality of third spring pins spaced apart on the bottom plate, the elastic end of each of the third spring pins extending into the groove; the step of covering the upper cover assembly with the bottom plate assembly includes: Align the positioning hole with the corresponding positioning element; The base plate is pressed onto the top cover so that the positioning member is inserted into the positioning hole, the groove accommodates the chip, and the elastic end of the third spring pin is in elastic contact with the chip.

[0020] In some embodiments, the chip housing further includes a connector assembly and a plurality of second fasteners. The connector assembly includes a base and a plurality of contacts. The base has a front and a back side disposed opposite to each other, and the plurality of contacts are disposed on the back side of the base. The mounting method further includes: The assembled base plate assembly and the top cover assembly are flipped over so that the first end of the first spring pin faces the support platform. The base is placed on the upper cover and fixed to the upper cover by the second fastener, so that the second end of each of the first spring pins abuts against the corresponding contact point.

[0021] Thirdly, this application provides a quantum computer, including a quantum chip and the aforementioned chip housing, wherein the quantum chip is disposed within the chip housing.

[0022] This application provides a chip box, a chip box mounting method, and a quantum computer. The chip box includes a top cover assembly and a base plate assembly. The top cover assembly includes a top cover and multiple first spring pins, each first spring pin being spaced apart from the top cover, with its first end being an elastic end. The base plate assembly includes a base plate for supporting the chip, and the base plate assembly is detachably connected to the top cover assembly. When the chip is supported on the base plate, the chip's pins face the first ends of the first spring pins, and the first ends of each first spring pin elastically contact their corresponding pins to achieve electrical connection. Therefore, by using uniformly sized first spring pins to elastically contact the chip pins, connection consistency and quality stability can be improved. This elastic contact method can eliminate microscopic gaps on the contact surface through elastic compensation, reducing contact resistance and ensuring signal transmission stability. The elastic contact method has vibration absorption and shock resistance capabilities, ensuring connection reliability under complex operating conditions. The detachable elastic contact method facilitates the disassembly and maintenance of the chip box, avoiding the problem of needing complete rework once permanent connections such as bonding are damaged, thus extending the overall service life of the product. Meanwhile, through the detachable connection between the base plate assembly and the top cover assembly, the first spring pin can be vertically positioned above the chip, thereby avoiding the planar connection lead-out method of arranging multiple bonding wires around the chip, reducing the space occupied inside the chip box, and helping to reduce the size of the chip box. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the structure of one embodiment of the chip box provided in this application; Figure 2 yes Figure 1 An exploded view of an embodiment of the chip box; Figure 3 yes Figure 1 A schematic diagram of the structure of an embodiment of the upper cover component; Figure 4 yes Figure 3A cross-sectional schematic diagram of an embodiment of the upper cover assembly along section line AA; Figure 5 yes Figure 1 A schematic diagram of the structure of an embodiment of the base plate assembly; Figure 6 yes Figure 5 A cross-sectional schematic diagram along section line BB of one embodiment; Figure 7 yes Figure 2 A bottom view schematic diagram of an embodiment of the connector in the diagram; Figure 8 This is a schematic diagram of another embodiment of the connector provided in this application; Figure 9 This is a schematic flowchart of an embodiment of the chip box installation method provided in this application; Figure 10 yes Figure 9 A schematic flowchart of an embodiment of step S103; Figure 11 This is a flowchart illustrating another embodiment of the chip box installation method provided in this application.

[0024] Among them, 200 is the chip; 100 is the chip box; 10 is the top cover assembly; 11 is the top cover; 12 is the first spring pin; 13 is the second spring pin; 14 is the positioning component; 20 is the base plate assembly; 21 is the base plate; 22 is the positioning hole; 23 is the groove; 24 is the third spring pin; 25 is the chip limiting component; 30 is the connector; 31 is the base; 32 is the contact point; 33 is the connecting cable; 34 is the back side; 35 is the front side; and 40 is the second fixing component. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0026] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0027] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0028] Current quantum chips typically connect their pins to pads on a PCB using multiple bonding wires, and then achieve signal communication via an RF connector on the PCB. However, this connection method has at least the following drawbacks: 1) Multiple bonding wires are placed on the periphery of the quantum chip and must be used with a PCB board and connectors, occupying a large space inside the chip box; 2) The lengths of the multiple bonding wires vary slightly, resulting in poor structural consistency and unstable impedance; 3) Poor consistency in bonding process can easily lead to problems such as poor solder joints or bonding misalignment, affecting the reliability of signal transmission.

[0029] Based on the above considerations, this application provides a chip box, including a top cover assembly and a bottom plate assembly. The top cover assembly includes a top cover and a plurality of first spring pins, each first spring pin being spaced apart from the top cover, and each first spring pin having a first end that is elastic. The bottom plate assembly includes a bottom plate for supporting the chip, and the bottom plate assembly is detachably connected to the top cover assembly. When the chip is supported on the bottom plate, the chip's pins face the first ends of the first spring pins, and the first ends of each first spring pin elastically contact the corresponding pins to achieve electrical connection. Therefore, by using uniformly sized first spring pins to elastically contact the chip pins, connection consistency and quality stability can be improved. Furthermore, it should be emphasized that this elastic contact method can eliminate microscopic gaps on the contact surface through elasticity compensation, reducing contact resistance and ensuring signal transmission stability. The elastic contact method has vibration absorption and shock resistance capabilities, ensuring connection reliability under complex operating conditions. The detachable elastic contact method facilitates the disassembly and maintenance of the chip box, avoiding the problem of needing complete rework once permanent connections such as bonding are damaged, thus extending the overall service life of the product. In addition, through the detachable connection between the base plate assembly and the top cover assembly, the first spring pin can be vertically set above the chip, which avoids the need to use multiple bonding wires to set out in a planar connection on the periphery of the chip, reducing the space occupied inside the chip box and helping to reduce the size of the chip box.

[0030] According to some embodiments of this application, please refer to Figures 1 to 6 As shown, Figure 1 This is a schematic diagram of the structure of one embodiment of the chip box provided in this application; Figure 2 yes Figure 1 An exploded view of an embodiment of the chip box; Figure 3 yes Figure 1 A schematic diagram of the structure of an embodiment of the upper cover component; Figure 4 yes Figure 3 A cross-sectional schematic diagram of an embodiment of the upper cover assembly along section line AA; Figure 5 yes Figure 1 A schematic diagram of the structure of an embodiment of the base plate assembly; Figure 6 yes Figure 5 A cross-sectional schematic diagram along section line BB of one embodiment.

[0031] The chip box 100 in this embodiment can be used to carry the chip 200 for encapsulation and connection. The chip 200 can be a quantum chip. The chip box 100 in this embodiment includes an upper cover assembly 10 and a base plate assembly 20; the upper cover assembly 10 includes an upper cover 11 and a plurality of first spring pins 12, and the base plate assembly 20 includes a base plate 21 for carrying the chip 200.

[0032] Each first spring pin 12 is spaced apart on the upper cover 11, for example, the first spring pins 12 are arranged in an array on the upper cover 11, and the first spring pin 12 can be a spring pin. The first end of each first spring pin 12 is an elastic end, wherein the first end of the first spring pin 12 has elastic deformation capability, which is used to elastically expand and contract when pressed, so as to achieve elastic contact with the pin of the chip 200.

[0033] In some embodiments, the top cover 11 has a front and a back side disposed opposite to each other, and each first spring pin 12 is inserted through the top cover 11. The first end of each first spring pin 12 extends from the back side of the top cover 11, and the second end of each first spring pin 12 extends from the front side of the top cover 11. That is, the first end of the first spring pin 12 is exposed on the back side of the top cover 11, and the second end of the first spring pin 12 is exposed on the front side of the top cover 11.

[0034] Chip 200 is carried on base plate 21, and base plate assembly 20 is detachably connected to top cover assembly 10. For example, chip box 100 also includes a plurality of first fasteners (not shown in the figure), which fix base plate 21 to top cover 11 to achieve connection between base plate assembly 20 and top cover assembly 10; by removing the first fasteners, base plate assembly 20 and top cover assembly 10 can be separated, thereby achieving detachable connection between the two.

[0035] When the chip 200 is mounted on the base plate 21, the pins of the chip 200 face the first end of the first spring pin 12, and the first end of each first spring pin 12 makes elastic contact with the corresponding pin to achieve electrical connection. For example, the chip 200 has multiple pins, which are arranged one-to-one with multiple first spring pins 12, and the surface of the pin faces the first end of the first spring pin 12, so that the first end of each first spring pin 12 makes elastic contact with the corresponding pin, thereby achieving electrical connection between the first spring pin 12 and the pin.

[0036] In some embodiments, when the base plate 21 is fixed to the top cover 11, the base plate 21 is attached to the back of the top cover 11, and the first end of each first spring pin 12 makes elastic contact with the corresponding pin, so that each first spring pin 12 is electrically connected to the corresponding pin. The elastic contact refers to the first end of the first spring pin 12 elastically contracting under the pressure of the chip 200, thereby generating contact pressure between the first spring pin 12 and the pin. This contact pressure causes the first spring pin 12 to fit tightly with the pin, forming a stable electrical connection.

[0037] In some embodiments, each first spring pin 12 is manufactured with uniform specifications to obtain each first spring pin 12 with the same specifications and structure. For example, the contact area between the first end of each first spring pin 12 and the corresponding pin is the same, and the distance between the first end of each first spring pin 12 and the corresponding pin is the same, so as to improve the connection consistency and quality stability of each first spring pin 12.

[0038] It should be noted that during the assembly process, the elastic end can compensate for dimensional deviations caused by manufacturing tolerances through elastic deformation, reducing the requirements for consistency in the length of the first spring pin 12, chip thickness, and pin height; at the same time, the elastic contact method allows for certain angular and positional deviations, and reliable contact can be achieved without precise alignment, thereby reducing assembly difficulty and operational requirements.

[0039] The chip box 100 in this embodiment includes an upper cover assembly 10 and a base plate assembly 20. The upper cover assembly 10 includes an upper cover 11 and a plurality of first spring pins 12. The base plate assembly 20 includes a base plate 21 for carrying the chip 200. The base plate assembly 20 is detachably connected to the upper cover assembly 10. When the chip 200 is carried on the base plate 21, the pins of the chip 200 face the first ends of the first spring pins 12, and the first ends of each first spring pin 12 are in elastic contact with the corresponding pins to achieve electrical connection.

[0040] Therefore, by using a standardized first spring pin 12 to make elastic contact with the pins of the chip 200, the connection consistency and quality stability of the first spring pin 12 can be improved. Simultaneously, through the detachable connection between the base plate assembly 20 and the top cover assembly 10, the first spring pin 12 can be vertically positioned above the chip 200, avoiding the need for multiple bonding wires to be connected and led out in a planar manner around the chip 200. This reduces the space occupied inside the chip housing 100 and helps to reduce the size of the chip housing 100.

[0041] Furthermore, compared to bonding connections, the elastic contact method between the first spring pin 12 and the pins of the chip 200 used in this application does not involve the multi-variable control of temperature, pressure, time, etc., in the bonding process, fundamentally avoiding the problem of poor soldering caused by fluctuations in process parameters. At the same time, this elastic contact completes the electrical connection of all pins in one go through the overall assembly of the upper cover assembly 10 and the base plate assembly 20, without the need for point-by-point identification and positioning by the bonding machine, thus eliminating the risk of missoldering. Therefore, the contact state and impedance between the first spring pin 12 and the pins are determined by the structural design and material properties of the spring pin, exhibiting high consistency, thereby effectively improving the reliability of signal transmission and communication quality of the chip 200.

[0042] It is understandable that the elastic contact method between the first spring pin 12 and the pin of the chip 200 has at least the following beneficial effects: the elastic contact method can eliminate the micro gaps on the contact surface through elasticity compensation, reduce contact resistance, and ensure the stability of signal transmission; the elastic contact method has vibration absorption and shock resistance capabilities, ensuring connection reliability under complex working conditions; the use of a detachable elastic contact method facilitates the disassembly and maintenance of the chip box 100, avoids the problem that once permanent connections such as bonding are damaged, the whole thing needs to be reworked, and extends the overall service life of the product.

[0043] According to some embodiments of this application, please refer to Figure 3 and Figure 4 As shown, the upper cover assembly 10 of this embodiment also includes a plurality of second spring pins 13 spaced apart from the upper cover 11, and each first spring pin 12 and each second spring pin 13 spaced apart from the upper cover 11.

[0044] Each first spring pin 12 and each second spring pin 13 are arranged in an array and alternately on the upper cover 11. Specifically, in each row of the array, each second spring pin 13 and each first spring pin 12 are alternately arranged; in each column of the array, each second spring pin 13 and each first spring pin 12 are alternately arranged. For example, multiple first spring pins 12 and multiple second spring pins 13 are arranged in a matrix on the upper cover 11; in the first row of the matrix, second spring pins 13, first spring pins 12, second spring pins 13, and first spring pins 12 are alternately arranged in sequence; in the first column of the matrix, second spring pins 13, first spring pins 12, second spring pins 13, and first spring pins 12 are alternately arranged in sequence. The first end of each second spring pin 13 is an elastic end, which is used to make elastic contact with the corresponding pin to achieve electrical connection; the second spring pin 13 can be a spring pin.

[0045] In some embodiments, the first end of each second spring pin 13 and the first end of each first spring pin 12 extend from the back of the top cover 11, and the second end of each second spring pin 13 and the second end of each first spring pin 12 extend from the front of the top cover 11.

[0046] Understandably, the spacing between multiple spring pins can be flexibly adjusted according to the pin layout of chip 200 to adapt to different specifications of chip 200. For example, the spacing between two adjacent first spring pins 12, the spacing between two adjacent second spring pins 13, or the spacing between adjacent first spring pins 12 and second spring pins 13 can be adjusted according to the pin layout of chip 200. For chips 200 with different pin layouts, spring pin arrays with corresponding spacing can be designed to effectively meet the connection and lead-out requirements of chip 200.

[0047] To further enhance flexibility, the top cover assembly 10 can be configured as an adjustable structure—the top cover 11 has arrayed receiving holes, and the first spring pin 12 or the second spring pin 13 is detachably disposed in the receiving holes. The spacing can be adjusted by changing the number of receiving holes between adjacent spring pins. Thus, there is no need to redesign the chip box for each type of chip; only the arrangement of the spring pins needs to be adjusted, which helps to reduce manufacturing costs and shorten the development cycle.

[0048] When the chip 200 is mounted on the base plate 21 and the base plate 21 is fixed to the top cover 11, the first end of each first spring pin 12 and the first end of each second spring pin 13 elastically contact the corresponding pins to achieve electrical connection between each first spring pin 12 and each second spring pin 13 and the corresponding pins. Specifically, the first end of each first spring pin 12 and the first end of each second spring pin 13 elastically contracts under the pressure of the chip 200, thereby generating contact pressure between the first spring pin 12 and the corresponding pin, and between the second spring pin 13 and the corresponding pin. This contact pressure ensures that the first end of the first spring pin 12 and the corresponding pin are tightly fitted together, forming a stable electrical connection.

[0049] In some embodiments, multiple second spring pins 13 are manufactured using uniform specifications, resulting in multiple second spring pins 13 with identical specifications and structures, thereby improving the connection consistency and quality stability of the second spring pins 13. For example, multiple first spring pins 12 and multiple second spring pins 13 are manufactured using uniform specifications, with parameters such as contact area and distance completely consistent with the corresponding pins, which is equivalent to multiple first spring pins 12 being arranged in an array within the upper cover 11 in the above embodiments.

[0050] In some embodiments, see Figure 4 As shown, the cross-sectional area of ​​the second spring pin 13 is different from the cross-sectional area of ​​the first spring pin 12; for example, the cross-sectional area of ​​the second spring pin 13 is smaller than the cross-sectional area of ​​the first spring pin 12. The cross-sectional area of ​​the first spring pin 12 refers to the cross-sectional area obtained by cutting with a plane perpendicular to the axial direction of the first spring pin 12; the cross-sectional area of ​​the second spring pin 13 refers to the cross-sectional area obtained by cutting with a plane perpendicular to the axial direction of the second spring pin 13.

[0051] Specifically, the length of the second spring pin 13 is the same as the length of the first spring pin 12, and the cross-sectional area of ​​the second spring pin 13 is smaller than that of the first spring pin 12. By setting the cross-sectional area of ​​the second spring pin 13 to be smaller than that of the first spring pin 12, it is beneficial to reduce the space occupied by the second spring pin 13 inside the chip box 100. In other embodiments, the cross-sectional area of ​​the second spring pin 13 may be larger than that of the first spring pin 12, in which case their lengths remain the same, which will not be elaborated further here.

[0052] It should be noted that by setting two spring pins with different cross-sectional areas, this embodiment of the application can achieve a balance between current carrying capacity, contact resistance, mechanical strength, service life, and space utilization according to different functional requirements, thus realizing the optimized design of the electrical connection structure of the chip box 100. It is understood that in other embodiments, three, four, or even more spring pins with different cross-sectional areas can be designed according to actual needs, which will not be elaborated here.

[0053] In some embodiments, the first spring pin 12 can be configured as a test signal transmission channel for the quantum chip, and the second spring pin 13 can be configured as a control signal transmission channel for the quantum chip. Since test signals are typically sensitive to contact resistance, using the first spring pin 12 with a larger cross-sectional area can reduce contact resistance, improve signal amplitude accuracy, and enhance test consistency. Conversely, control signals are typically high-frequency signals, and using the second spring pin 13 with a smaller cross-sectional area helps reduce stray capacitance and parasitic inductance, ensuring signal integrity. Therefore, this application allows for the configuration of the spring pin cross-sectional area as needed according to different signal types, improving the space utilization and test maintainability of the chip housing 100 while ensuring signal transmission quality.

[0054] According to some embodiments of this application, please refer to Figure 3 and Figure 4 As shown, in this embodiment, the second end of the first spring pin 12 is also an elastic end, and the second end of the second spring pin 13 is also an elastic end; that is, the first end and the second end of the first spring pin 12 are both elastic ends, and the first end and the second end of the second spring pin 13 are both elastic ends.

[0055] In this embodiment, the second end of the first spring pin 12 is also an elastic end, and the second end of the second spring pin 13 is also an elastic end. During the assembly process, the elastic end can compensate for the dimensional deviation caused by manufacturing tolerance through elastic deformation, which reduces the requirements for the consistency of spring pin length and external connection line height. At the same time, the elastic contact method allows for a certain angular deviation and positional deviation, and reliable contact can be achieved without precise alignment, thereby reducing the assembly difficulty and operation requirements.

[0056] According to some embodiments of this application, please refer to Figures 1 to 6 As shown, the upper cover assembly 10 of this embodiment also includes a plurality of positioning members 14 disposed on the upper cover 11.

[0057] In some embodiments, the top cover assembly 10 includes four positioning members 14, which are disposed at the four corners of an array formed by a plurality of first spring pins 12 and a plurality of second spring pins 13. For example, the positioning members 14 are positioning pins, which are disposed on the back side of the top cover 11.

[0058] In this embodiment, the base plate 21 is provided with a plurality of positioning holes 22, each of which corresponds to a positioning member 14, and the positioning member 14 and the positioning hole 22 are interference fit. The interference fit means that the diameter of the positioning hole 22 is smaller than the outer diameter of the positioning member 14.

[0059] In some embodiments, the base plate 21 is provided with four positioning holes 22, and the four positioning holes 22 are provided one-to-one with four positioning elements 14; for example, the positioning element 14 is a positioning pin, the positioning hole 22 is a pin hole, and the positioning pin and the positioning hole are interference fit.

[0060] Based on the above configuration, the positioning member 14 undergoes radial elastic deformation when pressed into the positioning hole 22, creating continuous radial pressure and static friction between them. This radial pressure eliminates the clearance between the positioning member 14 and the positioning hole 22, ensuring precise alignment of the upper cover 11 and the base plate 21; the static friction provides a connecting and fastening force, enhancing the connection stability between the upper cover assembly 10 and the base plate assembly 20, which helps the chip box 100 maintain structural integrity under vibration or impact conditions. Simultaneously, the interference fit positioning method eliminates the need for additional adjustments when the upper cover 11 and the base plate 21 are closed, improving assembly efficiency.

[0061] In other embodiments, the base plate assembly 20 also includes a plurality of positioning elements 14 disposed on the base plate 21, and the upper cover 11 is provided with a plurality of positioning holes 22, the positioning holes 22 and the positioning elements 14 are respectively provided in a one-to-one correspondence, and the positioning elements 14 and the positioning holes 22 are interference fit. The principle and technical effect are similar to those of the aforementioned embodiments, and will not be repeated here.

[0062] According to some embodiments of this application, please refer to Figure 4 As shown, the first spring needle 12 in this embodiment includes a spring needle body 1 and an insulating layer 2. The insulating layer 2 is sleeved on the spring needle body 1 so that the spring needle body 1 is insulated from the upper cover 11.

[0063] Specifically, the material of the spring needle body 1 is metal, which is used to realize electrical connection and signal transmission. The material of the insulating layer 2 is insulating. The insulating layer 2 is sleeved on the spring needle body 1 to insulate the spring needle body 1 from the upper cover 11, thereby increasing the dielectric isolation between the two, reducing parasitic coupling, and thus preventing signal leakage.

[0064] According to some embodiments of this application, please refer to Figures 1 to 6 As shown, the base plate 21 of this embodiment is provided with a groove 23, which is used to accommodate the chip 200.

[0065] The base plate assembly 20 in this embodiment also includes a plurality of third spring pins 24 spaced apart on the base plate 21. The elastic end of each third spring pin 24 extends into the groove 23 for elastic contact with the surface of the chip 200 away from the top cover 11.

[0066] Specifically, the other end of each third spring pin 24 is disposed within the base plate 21, and the elastic end of each third spring pin 24 extends into the groove 23, that is, the elastic end of each third spring pin 24 protrudes relative to the bottom of the groove 23. The elastic end of each third spring pin 24 makes elastic contact with the surface of the chip 200 away from the upper cover 11 to support the chip 200. The chip 200 has a first surface and a second surface disposed opposite to each other, and the pins are disposed on the first surface.

[0067] When chip 200 is mounted on base plate 21, and base plate 21 is fixed to top cover 11, the first surface of chip 200 is positioned facing the first ends of each first spring pin 12 and each second spring pin 13. The first ends of each first spring pin 12 and each second spring pin 13 are in elastic contact with their corresponding pins, and the elastic ends of each third spring pin 24 are in elastic contact with the second surface of chip 200. Thus, the first spring pins 12, second spring pins 13, and third spring pins 24 apply elastic forces from opposite sides of chip 200, dynamically adjusting the orientation of chip 200 and preventing poor contact caused by excessive localized force on chip 200.

[0068] In this embodiment, the base plate 21 is provided with a groove 23 for accommodating the chip 200. The base plate assembly 20 also includes a plurality of third spring pins 24 spaced apart from the base plate 21. The elastic ends of each third spring pin 24 provide support for the chip 200. When the base plate 21 is fixed to the top cover 11, each first spring pin 12, each second spring pin 13, and each third spring pin 24 are located on opposite sides of the chip 200. The orientation of the chip 200 is adjusted by the dynamic balance of the elastic forces on both sides to avoid excessive local stress and ensure reliable electrical connection between the first spring pin 12 and the second spring pin 13 and their corresponding pins. At the same time, the groove 23 allows the chip 200 to be partially embedded in the base plate 21, which helps to reduce the overall thickness of the chip box 100.

[0069] According to some embodiments of this application, please refer to Figures 1 to 6 As shown, the base plate 21 of this embodiment is provided with a groove 23 for accommodating the chip 200; the base plate assembly 20 also includes a chip limiting member 25 and a plurality of third spring pins 24. The chip limiting member 25 is disposed in the groove 23 and is used to support the chip 200. Each third spring pin 24 is disposed at intervals on the base plate 21, and the elastic end of each third spring pin 24 extends into the groove 23 for elastic contact with the chip limiting member 25.

[0070] The chip 200 is supported on the chip limiting member 25, which is used to protect the chip 200. The chip 200 and the chip limiting member 25 are disposed in the groove 23 so that the elastic ends of each third spring pin 24 are in elastic contact with the chip limiting member 25, providing elastic support for one side of the chip 200. The principle and technical effect are similar to those of the aforementioned embodiments, and will not be repeated here.

[0071] In some embodiments, the chip limiting member 25 is provided with a plurality of notches, which are provided one-to-one with the positioning member 14, and the opening width of the notch is adapted to the diameter of the positioning member 14, so that the positioning member 14 is inserted into the notch from the side and fixes the chip limiting member 25.

[0072] According to some embodiments of this application, please refer to Figures 1 to 7 As shown, Figure 7yes Figure 2 The diagram shows a bottom view of one embodiment of the connector. The chip box 100 of this embodiment also includes a connector assembly 30, which is detachably connected to the top cover assembly 10.

[0073] In some embodiments, the chip box 100 further includes a plurality of second fasteners 40, which fix the connector assembly 30 to the cover assembly 10 via the second fasteners 40; by removing the second fasteners 40, the connector assembly 30 can be separated from the cover assembly 10 to achieve a detachable connection between the connector assembly 30 and the cover assembly 10.

[0074] The connector assembly 30 in this embodiment includes a base 31, a plurality of contacts 32, and a connecting cable 33. The base 31 has a front side 35 and a back side 34 disposed opposite to each other.

[0075] Multiple contacts 32 are disposed on the back surface 34 of the base 31, and the multiple contacts 32 are arranged in an array. The multiple contacts 32 are insulated from the base 31; and the multiple contacts 31 are configured one-to-one with multiple first spring pins 12; or, the multiple contacts 31 are configured one-to-one with multiple first spring pins 12 and multiple second spring pins 13.

[0076] The connecting cable 33 is disposed on the front side 35 of the base 31, and the connecting cable 33 is electrically connected to a plurality of contacts 32 in a one-to-one correspondence. When the connector assembly 30 is connected to the top cover assembly 10, the back side 34 of the base 31 is attached to the front side of the top cover 11, and the second end of each first spring pin 12 abuts against the corresponding contact 32, so that the connecting cable 33 is electrically connected to the pin.

[0077] In some embodiments, the second end of the first spring pin 12 is an elastic end, and the second end of each first spring pin 12 is in elastic contact with the corresponding contact 32. The connecting cable 33 is connected to the corresponding pin through the corresponding contact 32 and the first spring pin 12, so that the connecting cable 33 is electrically connected to the pin. Since the second end of the first spring pin 12 is elastic, it can adaptively compensate for the position deviation and height tolerance of the contact 32, and reduce the installation accuracy requirements of the connector assembly 30.

[0078] In some embodiments, when the connector assembly 30 is connected to the top cover assembly 10, the back side 34 of the base 31 is attached to the front side of the top cover 11, and the second ends of each first spring pin 12 and each second spring pin 13 abut against the corresponding contact 32 to make the connecting cable 33 electrically connected to the pin. The second ends of the first spring pin 12 and the second ends of the second spring pin 13 are also elastic ends. The second ends of each first spring pin 12 and each second spring pin 13 elastically abut against the corresponding contact 32 to make the connecting cable 33 electrically connected to the pin. Since the second ends of the first spring pin 12 and the second ends of the second spring pin 13 are both elastic, they can adaptively compensate for the position deviation and height tolerance of the contact 32, thereby reducing the installation accuracy requirements of the connector assembly 30.

[0079] In some embodiments, the contact 32 is circular, square, or cylindrical. For example, the contact 32 is square to facilitate elastic contact between each first spring pin 12 and the corresponding contact 32. The connecting cable 33 can be multiple independent cables or a ribbon cable.

[0080] The chip box 100 in this embodiment also includes a connector assembly 30, which includes a base 31, a plurality of contacts 32, and a connecting cable 33. The base 31 has a back side 34 and a front side 35 disposed opposite to each other. The plurality of contacts 32 are disposed on the back side 34 and are arranged in an array. The connecting cable 33 is disposed on the front side 35 of the base 31 and is electrically connected to the plurality of contacts 32 in a one-to-one correspondence. The connecting cable 33 is used to transmit the signals of the chip 200 to other components of the quantum computer to realize signal interaction between the chip 200 and external devices.

[0081] According to some embodiments of this application, please refer to Figure 8 As shown, Figure 8 This is a schematic diagram of another embodiment of the connector provided in this application. The connecting cable 33 in this embodiment includes a flexible cable assembly, which is disposed on the front side 35 of the base 31.

[0082] According to some embodiments of this application, please refer to Figures 1 to 9 As shown, Figure 9 This is a flowchart illustrating an embodiment of the chip box installation method provided in this application. The installation method of this embodiment is applied to the chip box 100 of the above embodiment. The chip box 100 includes a top cover assembly 10, a bottom plate assembly 20, and a plurality of first fixing members. The top cover assembly 10 includes a top cover 11 and a plurality of first spring pins 12, each first spring pin 12 being spaced apart from the top cover 11, and each first spring pin 12 having a first elastic end. The bottom plate assembly 20 includes a bottom plate 21. The first fixing members include, but are not limited to, screws. The installation method of the chip box 100 in this embodiment includes the following steps.

[0083] Step S101: Place the upper cover assembly 10 on the support platform so that the first end of the first spring pin 12 is away from the support platform.

[0084] Place the top cover assembly 10 on the support platform so that the first end of the first spring pin 12 is away from the support platform. For example, place the top cover assembly 10 upside down on the support platform so that the front of the top cover 11 is against the support platform and the back of the top cover 11 is facing upward, so that the first end (elastic end) of the first spring pin 12 is facing upward and away from the support platform.

[0085] Step S102: Place the chip 200 on the upper cover assembly 10, with the pins of the chip 200 facing the first end of the first spring pin 12.

[0086] Chip 200 is placed on the top cover assembly 10, with the pins of chip 200 facing the first end of the first spring pin 12. For example, chip 200 is placed on an array formed by the first ends of each of the first spring pins 12, with the pins of chip 200 facing the first ends of the first spring pins 12. The first ends of each of the first spring pins 12 are elastically compressed under the gravity of chip 200, thereby making elastic contact between the first ends of each of the first spring pins 12 and the corresponding pins.

[0087] Step S103: Cover the bottom plate assembly 20 onto the top cover assembly 10, and fix the bottom plate 21 onto the top cover 11 by the first fastener, so that the first end of each first spring pin 12 makes elastic contact with the pin of the corresponding chip 200 to achieve electrical connection.

[0088] The base plate assembly 20 is placed on the top cover assembly 10, that is, the base plate 21 is installed on the top cover 11, and the base plate 21 is fixed on the top cover 11 by screws or other first fasteners, so that the first end of each first spring pin 12 makes elastic contact with the pin of the corresponding chip 200.

[0089] In some embodiments, the top cover assembly 10 further includes a plurality of second spring pins 13, and each first spring pin 12 and each second spring pin 13 are disposed on the top cover 11; the base plate 21 is fixed to the top cover 11 by screws or other first fasteners, and the first ends of each first spring pin 12 and each second spring pin 13 are elastically compressed under the gravity of the chip 200, so that the first ends of each first spring pin 12 and the corresponding pins are elastically in contact, and the first ends of each second spring pin 13 and the corresponding pins are elastically in contact.

[0090] In this embodiment, the upper cover assembly 10 is placed on a support platform so that the first end of the first spring pin 12 is away from the support platform; the chip 200 is placed on the upper cover assembly 10 with the pins of the chip 200 facing the first end of the first spring pin 12; the base plate assembly 20 is placed on the upper cover assembly 10, and the base plate 21 is fixed to the upper cover 11 by a first fixing member, so that the first end of each first spring pin 12 makes elastic contact with the corresponding pin of the chip 200 to achieve electrical connection. Through this method, the base plate assembly 20 can be mounted on the upper cover assembly 10, and each first spring pin 12 is vertically arranged above the chip 200, which reduces the space occupied inside the chip box 100 and helps to reduce the size of the chip box 100. Since each first spring pin 12 has the same specifications, the connection consistency and quality stability of the first spring pin 12 can be improved by making elastic contact with the pins of the chip 200 using uniformly sized first spring pins 12.

[0091] Furthermore, compared to bonding connections, the elastic contact method between the first spring pin 12 and the pins of the chip 200 used in this application does not involve the multi-variable control of temperature, pressure, time, etc., in the bonding process, fundamentally avoiding the problem of poor soldering caused by fluctuations in process parameters. At the same time, this elastic contact completes the electrical connection of all pins in one go through the overall assembly of the upper cover assembly 10 and the base plate assembly 20, without the need for point-by-point identification and positioning by the bonding machine, thus eliminating the risk of missoldering. Therefore, the contact state and impedance between the first spring pin 12 and the pins are determined by the structural design and material properties of the spring pin, exhibiting high consistency, thereby effectively improving the reliability of signal transmission and communication quality of the chip 200.

[0092] It is understandable that the elastic contact method between the first spring pin 12 and the pin of the chip 200 has at least the following beneficial effects: the elastic contact method can eliminate the micro gaps on the contact surface through elasticity compensation, reduce contact resistance, and ensure the stability of signal transmission; the elastic contact method has vibration absorption and shock resistance capabilities, ensuring connection reliability under complex working conditions; the use of a detachable elastic contact method facilitates the disassembly and maintenance of the chip box 100, avoids the problem that permanent connections such as bonding need to be reworked as soon as they are damaged, and extends the overall service life of the product.

[0093] According to some embodiments of this application, please refer to Figures 1 to 10 As shown, Figure 10 yes Figure 9A schematic flowchart of an embodiment of step S103 is shown. In this embodiment, the upper cover assembly 10 further includes a plurality of positioning members 14 disposed on the upper cover 11, and the bottom plate 21 is provided with a plurality of positioning holes 22, each corresponding to one of the positioning members 14; the bottom plate 21 is provided with a groove 23, and the bottom plate assembly 20 further includes a plurality of third spring pins 24 spaced apart from the bottom plate 21, with the elastic end of each third spring pin 24 extending into the groove 23. Step S103 in this embodiment also includes the following steps.

[0094] Step S201: Align the positioning hole 22 with the corresponding positioning part 14.

[0095] Align the positioning hole 22 with the corresponding positioning part 14 to achieve rapid positioning between the upper cover 11 and the base plate 21. Through the guiding effect of the positioning part 14 and the positioning hole 22, the alignment time of the base plate 21 when it is installed on the upper cover 11 can be effectively shortened, and the assembly efficiency can be improved.

[0096] Step S202: Press the base plate 21 onto the top cover 11 so that the positioning member 14 is inserted into the positioning hole 22, the groove 23 accommodates the chip 200, and the elastic end of the third spring pin 24 is in elastic contact with the chip 200.

[0097] The chip 200 has a first surface and a second surface that are arranged opposite to each other, and the pins are disposed on the first surface. The base plate 21 is pressed onto the top cover 11 so that the positioning member 14 is inserted into the positioning hole 22 and the groove 23 accommodates the chip 200, and the elastic end of the third spring pin 24 is in elastic contact with the second surface of the chip 200. At this time, the first spring pin 12 is located on the first surface of the chip 200, thereby forming elastic contact on the opposite sides of the chip 200, which can dynamically adjust the posture of the chip 200 and avoid poor contact caused by excessive local force.

[0098] According to some embodiments of this application, please refer to Figures 1 to 11 As shown, Figure 11 This is a schematic flowchart of another embodiment of the chip box installation method provided in this application. The chip box 100 in this embodiment further includes a connector assembly 30 and a plurality of second fasteners 40, the second fasteners 40 including but not limited to screws; the connector assembly 30 includes a base 31 and a plurality of contacts 32, the base 31 having a front side 35 and a back side 34 disposed opposite to each other, and the plurality of contacts 32 disposed on the back side 34 of the base 31. After step S103, the installation method of this embodiment further includes the following steps.

[0099] Step S301: Flip the assembled base plate assembly 20 and the top cover assembly 10 together so that the first end of the first spring pin 12 faces the support platform.

[0100] After the base plate assembly 20 and the top cover assembly 10 are assembled, the assembled base plate assembly 20 and the top cover assembly 10 are flipped over so that the first end of the first spring pin 12 faces the support platform, that is, the front of the top cover 11 faces upward.

[0101] Step S302: Place the base 31 on the upper cover 11 and fix the base 31 on the upper cover 11 by the second fastener 40, so that the second end of each first spring pin 12 abuts against the corresponding contact 32.

[0102] The base 31 is placed on the top cover 11 so that the back side 34 of the base 31 fits against the front side of the top cover 11; the base 31 is fixed to the top cover 11 by the second fastener 40 so that the second end of each first spring pin 12 abuts against the corresponding contact point 32.

[0103] In this embodiment, the assembled base plate assembly 20 and the top cover assembly 10 are flipped over so that the first end of the first spring pin 12 faces the support platform. Then, the base 31 is placed on the top cover 11 and the base 31 is fixed on the top cover 11 by the second fastener 40 so that the second end of each first spring pin 12 abuts against the corresponding contact 32, thereby realizing the installation of the connector assembly 30 and the top cover assembly 10.

[0104] In this way, a signal transmission link is formed sequentially via "first spring pin 12 (and / or second spring pin 13) - contact 32 - connecting cable 33", which can transmit the signal of chip 200 to other components of quantum computer, thereby realizing signal interaction between chip 200 and external devices.

[0105] This application also provides a quantum computer, which includes a quantum chip and a chip box 100, with the quantum chip disposed within the chip box 100. The chip box 100 can be the chip box 100 disclosed in the above embodiments, and the quantum chip can be the chip 200 disclosed in the above embodiments, which will not be described further here.

[0106] The quantum computer in this embodiment includes a quantum chip and a chip box 100, with the quantum chip disposed within the chip box 100. Since the volume of the chip box 100 is reduced, more chip boxes 100 can be accommodated without changing the total volume of the quantum computer, thereby placing more quantum chips and effectively improving the quantum bit density of the quantum computer.

[0107] In summary, the chip box 100 of this application includes an upper cover assembly 10 and a base plate assembly 20; the upper cover assembly 10 includes an upper cover 11 and a plurality of first spring pins 12, and the base plate assembly 20 includes a base plate 21 for carrying the chip 200. The base plate assembly 20 is detachably connected to the upper cover assembly 10; when the chip 200 is carried on the base plate 21, the pins of the chip 200 face the first ends of the first spring pins 12, and the first ends of each first spring pin 12 are elastically in contact with the corresponding pins to achieve electrical connection.

[0108] Therefore, by using a standardized first spring pin 12 to make elastic contact with the pins of the chip 200, the connection consistency and quality stability of the first spring pin 12 can be improved. Simultaneously, through the detachable connection between the base plate assembly 20 and the top cover assembly 10, the first spring pin 12 can be vertically positioned above the chip 200, avoiding the need for multiple bonding wires to be connected and led out in a planar manner around the chip 200. This reduces the space occupied inside the chip housing 100 and helps to reduce the size of the chip housing 100.

[0109] Furthermore, compared to bonding connections, the elastic contact method between the first spring pin 12 and the pins of the chip 200 used in this application does not involve the multi-variable control of temperature, pressure, time, etc., in the bonding process, fundamentally avoiding the problem of poor soldering caused by fluctuations in process parameters. At the same time, this elastic contact completes the electrical connection of all pins in one go through the overall assembly of the upper cover assembly 10 and the base plate assembly 20, without the need for point-by-point identification and positioning by the bonding machine, thus eliminating the risk of missoldering. Therefore, the contact state and impedance between the first spring pin 12 and the pins are determined by the structural design and material properties of the spring pin, exhibiting high consistency, thereby effectively improving the reliability of signal transmission and communication quality of the chip 200.

[0110] It should be emphasized that the elastic contact method between the first spring pin 12 and the pin of the chip 200 has at least the following beneficial effects: the elastic contact method can eliminate the micro gaps on the contact surface through elasticity compensation, reduce contact resistance, and ensure the stability of signal transmission; the elastic contact method has vibration absorption and shock resistance capabilities, ensuring connection reliability under complex working conditions; the use of a detachable elastic contact method facilitates the disassembly and maintenance of the chip box 100, avoiding the problem that permanent connections such as bonding require overall rework once damaged, thus extending the overall service life of the product.

[0111] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A chip box, characterized in that, include: The upper cover assembly includes an upper cover and a plurality of first spring pins, each of the first spring pins being spaced apart from the upper cover, and the first end of each of the first spring pins being an elastic end. A base plate assembly, including a base plate for carrying a chip, the base plate assembly being detachably connected to the top cover assembly; When the chip is mounted on the base plate, the pins of the chip face the first end of the first spring pin, and the first end of each of the first spring pins makes elastic contact with the corresponding pin to achieve electrical connection.

2. The chip box according to claim 1, characterized in that, The upper cover assembly further includes a plurality of second spring pins spaced apart on the upper cover. Each second spring pin and each first spring pin are arranged in an array on the upper cover and are alternately arranged. The first end of each second spring pin is an elastic end, which is used to elastically contact the corresponding pin to achieve electrical connection.

3. The chip box according to claim 2, characterized in that, The cross-sectional area of ​​the second spring needle is different from that of the first spring needle.

4. The chip box according to claim 2, characterized in that, The second end of the first spring needle is also an elastic end, and the second end of the second spring needle is also an elastic end.

5. The chip box according to claim 2, characterized in that, The upper cover assembly also includes a plurality of positioning elements disposed on the upper cover, and the bottom plate is provided with a plurality of positioning holes, the positioning holes being provided one-to-one with the positioning elements, and the positioning elements being interference-fitted with the positioning holes.

6. The chip box according to claim 2, characterized in that, The base plate assembly also includes a plurality of positioning elements disposed on the base plate, and the upper cover is provided with a plurality of positioning holes, the positioning holes being provided one-to-one with the positioning elements, and the positioning elements being interference-fitted with the positioning holes.

7. The chip box according to claim 1, characterized in that, The first spring needle includes a spring needle body and an insulating layer. The insulating layer is sleeved on the spring needle body to insulate the spring needle body from the upper cover.

8. The chip box according to any one of claims 1-7, characterized in that, The top cover has a front and a back side arranged opposite to each other. Each of the first spring pins passes through the top cover, with the first end of each of the first spring pins extending from the back side of the top cover and the second end of each of the first spring pins extending from the front side of the top cover.

9. The chip box according to claim 8, characterized in that, The base plate is provided with a groove for accommodating the chip; the base plate assembly also includes a plurality of third spring pins spaced apart on the base plate, the elastic end of each third spring pin extending into the groove for elastic contact with the surface of the chip away from the top cover.

10. The chip box according to claim 5 or 6, characterized in that, The base plate is provided with a groove for accommodating the chip; the base plate assembly also includes a chip limiting member and a plurality of third spring pins, the chip limiting member is disposed in the groove and is used to support the chip, and each of the third spring pins is spaced apart on the base plate, with the elastic end of each of the third spring pins extending into the groove for elastic contact with the chip limiting member.

11. The chip box according to claim 10, characterized in that, The chip limiting component has multiple notches, each notch corresponding to a positioning component, and the opening width of the notch is adapted to the diameter of the positioning component, so that the positioning component can be inserted into the notch from the side and fix the chip limiting component.

12. The chip box according to claim 9, characterized in that, The chip housing also includes a connector assembly detachably connected to the top cover assembly, the connector assembly comprising: The base has a front and a back that are positioned opposite each other; Multiple contacts are disposed on the back of the base and are arranged in an array; A connecting cable is disposed on the front side of the base and is electrically connected to each of the multiple contacts. When the connector assembly is connected to the top cover assembly, the back of the base is attached to the front of the top cover, and the second end of each of the first spring pins abuts against the corresponding contact point, so that the connecting cable is electrically connected to the pin.

13. A method for mounting a chip box, characterized in that, The chip box includes a top cover assembly, a bottom plate assembly, and a plurality of first fixing members. The top cover assembly includes a top cover and a plurality of first spring pins, each of the first spring pins being spaced apart from the top cover, and each of the first spring pins having a first end that is elastic. The bottom plate assembly includes a bottom plate. The installation method includes: The upper cover assembly is placed on the support platform so that the first end of the first spring pin is away from the support platform; The chip is placed on the top cover assembly, with the pins of the chip facing the first end of the first spring pin; The base plate assembly is placed on top of the top cover assembly, and the base plate is fixed on the top cover by the first fastener, so that the first end of each of the first spring pins makes elastic contact with the pin of the corresponding chip to achieve electrical connection.

14. The installation method according to claim 13, characterized in that, The upper cover assembly further includes a plurality of positioning members disposed on the upper cover; the bottom plate is provided with a plurality of positioning holes, each positioning hole corresponding to one of the positioning members; the bottom plate is provided with a groove; the bottom plate assembly further includes a plurality of third spring pins spaced apart on the bottom plate, each third spring pin having an elastic end extending into the groove; the step of covering the upper cover assembly with the bottom plate assembly includes: Align the positioning hole with the corresponding positioning element; The base plate is pressed onto the top cover so that the positioning member is inserted into the positioning hole, the groove accommodates the chip, and the elastic end of the third spring pin is in elastic contact with the chip.

15. The installation method according to claim 13, characterized in that, The chip box also includes a connector assembly and a plurality of second fasteners. The connector assembly includes a base and a plurality of contacts. The base has a front and a back side disposed opposite to each other, and the plurality of contacts are disposed on the back side of the base. The installation method further includes: The assembled base plate assembly and the top cover assembly are flipped over so that the first end of the first spring pin faces the support platform. The base is placed on the upper cover and fixed to the upper cover by the second fastener, so that the second end of each of the first spring pins abuts against the corresponding contact point.

16. A quantum computer, characterized in that, It includes a quantum chip and a chip housing as described in any one of claims 1-12, wherein the quantum chip is disposed within the chip housing.

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