Optically functional multilayer structures and related manufacturing methods

Abstract

An integrated optical functional multi-layer structure (100, 500) comprising: a flexible, optionally 3D formable and further optionally thermoplastic substrate film (102) configured with a circuit design (106) comprising at least a plurality of electrical conductors on a first side of the substrate film (102); at least one light source (104) disposed on the first side of the substrate film (102) and connected to the circuit design (106), the at least one light source (104) configured to internally illuminate at least a portion of the structure for external perception; and an optically transmissive layer (108), optionally made of plastic or thermoplastic material, such as polycarbonate, thermoset, silicone, epoxy or other material, produced on the first side of the substrate film (102) and the at least one light source (104), the optically transmissive layer (108) at least partially covering the substrate film (102) and embedding the at least one light source (104); wherein at least one of the substrate film (102) or the optically transmissive layer defines an output coupling surface, preferably tilted (101) away from a surface plane or direction of an adjacent region of the substrate film (102), configured to preferably redirect and reflect by TIR (total internal reflection) incident light emitted by one or more of the at least one light source (104). Related manufacturing methods are presented.

Description

Technical Field

[0001] This invention generally relates to functionally integrated structures having various functional features such as electronic, mechanical, or optical elements. In particular, but not exclusively, this invention relates to such structures providing at least one or more photoelectric light sources comprising internal components or environments for illumination structures. Background Technology

[0002] In the context of different functional groups, such as in the field of electronic devices and electronic products, there are many different stack-up assemblies and multi-layer structures. The motivations behind the integration of functions involving, for example, electronic, mechanical, or optical features can be as diverse as the relevant use cases. When the resulting solution ultimately takes on a multi-layered nature, there is often a desire to reduce component size, weight, cost savings, or simply to achieve efficient integration. Consequently, the associated use cases may relate to product packaging or encapsulation, visual design of device housings, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, tags, vehicle electronics, and so on.

[0003] Electronic devices, such as electronic components, integrated circuits (ICs), and conductors, can typically be provided on substrate elements using a variety of different technologies. For example, off-the-shelf electronics, such as various surface mount devices (SMDs), can be mounted on the surface of a substrate, which ultimately forms a multilayered internal or external interface layer. Additionally, technologies categorized under the term "printed electronics" can be applied to directly and additively produce electronics onto an associated substrate. In this context, the term "printing" refers to printing technologies capable of producing electronics / electronic components from printed materials in a substantially additive printing process, including but not limited to screen printing, flexography, and inkjet printing. The substrate used can be flexible, stretchable, and of organic printable material, however, this is not always the case.

[0004] Furthermore, the concept of Injection Molded Structure Electronics (IMSE) involves constructing functional devices and their corresponding parts in a multi-layered structure, encapsulating electronic functionality as seamlessly as possible. A key characteristic of IMSE is that the electronics are typically manufactured in a true 3D (non-planar) form based on a 3D model of the entire target product, part, or overall design. To achieve the desired 3D layout of the electronics on a 3D substrate and in the associated final product, the electronics may still be provided on an initial planar substrate, such as a thin film, using two-dimensional (2D) methods for assembling electronics. The substrate already carrying the electronics can then be formed into the desired three-dimensional (i.e., 3D) shape and, for example, overmolded by covering and embedding underlying components such as the electronics with a suitable plastic material, thus protecting and potentially concealing these components from environmental influences. Other layers and components can be naturally added to the construction.

[0005] The optical features and functionality to be provided in the aforementioned integrated structure may include multiple light sources intended to illuminate, for example, selected internal components of the structure or the environment of the structure. The illumination itself may have different motivations, such as decorative / aesthetic or functional, such as guiding or indicative motivations.

[0006] However, various challenges may arise in the described and other lighting applications and usage scenarios.

[0007] For example, from the perspective of the desired optical path and the initial illumination target, unwanted light leakage or seepage between structures or their different internal volumes and regions can easily cause functional and aesthetic problems as well as transmission losses, as will be readily understood by those skilled in the art. However, the perceptibility of the light source itself is another potential problem. In some applications, the light source should ideally be kept hidden, or only weakly or occasionally exposed.

[0008] Furthermore, for highly integrated structures, achieving sufficient resolution and, in many cases, dynamic or adaptive control of the internal transmission and final output coupled light in terms of, for example, the shape, size, or location of the illuminated surface area can become difficult, at least occasionally. Among various solutions, controlling or specifically improving, for example, the uniformity of light over its output coupling area (which sometimes spans a considerable area relative to the total size of the structure or its selected surface) has previously been found to be cumbersome. This also applies to the more general spatial control of illumination and light output coupling. For example, this can be a significant issue when the surface contains, for instance, symbols or signs that need to be uniformly illuminated to indicate to an external observer the functionality or status of a device associated with a symbol or sign. Simply using several light sources to more effectively illuminate the target area or feature (such as a symbol) can still result in illumination hotspots and additional leakage, while also requiring more power and space, which are typically precious. Achieving a proper blend of brightness or color can also be challenging, and requires a relatively long distance between the light source and the area or feature to be illuminated, especially in large-area lighting applications. This can increase the size of the required structure or reduce the area where proper blending of light is available.

[0009] Incorporating multiple potentially complex guiding, input coupling, output coupling, confinement, or general processing elements into the structure has its own drawbacks, such as increased space consumption, weight, and other design constraints. Maintaining high optical performance of the structure, with reference to, for example, low leakage, loss, and similar objectives, can easily be further constrained to a suboptimal shape for its intended use by limiting the structure or its included elements to another, less desirable shape.

[0010] However, if optical features such as illumination features are to be combined with other features in the structure, the other features may negatively affect the luminous efficiency due to, for example, their shadowing or shading effects, and occasionally the optical features may also hinder or complicate the implementation of other features due to, for example, the spatial constraints they face.

[0011] In terms of manufacturing processes, in addition to the overall process complexity, the use of various optical features in the structure can further increase the level of complexity. This is due to the incompatibility between the added features or with the remaining materials and features, as well as with related process stages (considering, for example, overmolding), leading to increased failure rates / reduced yields. For example, if a material associated with a lower melting temperature (e.g., polymethyl methacrylate, PMMA) is used with a molding material with a higher melting temperature (e.g., polycarbonate, PC), features printed or otherwise established on the lower melting temperature material may degrade or be washed away during molding. Summary of the Invention

[0012] The objective of this invention is to at least mitigate one or more of the disadvantages associated with known solutions in the context of functionally integrated structures and related manufacturing methods of electronic devices, such as optoelectronic light sources.

[0013] The objective is achieved through various embodiments of integrated functional multilayer structures and related manufacturing methods for providing multilayer structures.

[0014] According to one category, an integrated optical functional multilayer structure includes A flexible, 3D-formable and, further, thermoplastic substrate film, configured with a circuit design comprising at least a plurality of electrical conductors on a first side of the substrate film; At least one light source disposed on the first side of the substrate film and connected to the circuit design, the at least one light source being configured to internally illuminate at least a portion of the structure for external sensing; and An optical transmission layer, which may be made of plastic or thermoplastic material, such as polycarbonate, is formed and preferably molded on the first side of the substrate film and the at least one light source, the optical transmission layer at least partially covering the substrate film and embedded in the at least one light source; The substrate film or at least one of the optical transmission layer defines an output coupling surface, which is preferably tilted away from a surface plane or orientation adjacent to the substrate film and configured to preferably redirect and reflect incident light emitted from one or more of the at least one light source by TIR (total internal reflection).

[0015] In some embodiments, the output coupling surface may define or include one or more light processing or redirecting features, which may be substantially specular or diffuse reflective scattering features, and may include a rough surface texture or, more specifically, a surface bump pattern.

[0016] In some embodiments, the substrate film may define one or more holes therethrough, wherein the output coupling surface is defined by the optical transmission layer on the one or more holes.

[0017] Incorporating one or more holes in the substrate film, the structure may include a larger cavity, which is limited at least by the output coupling surface of the optical transmission layer and / or the sidewalls of the substrate film defining the holes. The cavity may be filled with a fluid such as air or other gaseous substances, or preferably with a molding material.

[0018] In some embodiments, the substrate film may include at least one elongated bridging portion carrying a part of the circuit design, thereby providing an electrical connection to the at least one light source and, where appropriate, an electrical connection to an external device or additional electronic or electrical functional element from another layer of the structure.

[0019] When the substrate film includes an island-shaped portion, which is substantially a central portion, the island-shaped portion is at least partially separated from other portions of the substrate film by one or more of the one or more holes, while being maintained connected to it by the at least one bridging portion.

[0020] The structure may further include at least one light guiding or scattering feature, which may be configured, as appropriate, in or on the substrate film and / or the optical transmission layer, to guide or disperse incident light onto the bridging portion of the substrate film. The at least one light guiding or scattering feature may include printed diffusion ink, diffusion surface embossing, and / or diffusion particles.

[0021] The optical transmission layer may substantially define a recess or protrusion on at least one of the one or more holes extending away from the substrate film and / or in the optical path of light incident and reflected from the output coupling surface, wherein the protrusion may be at least rectangular in cross-section or angled. The light output coupling surface, the recess or protrusion in the optical transmission layer, and the associated light emitting regions on the outer surface of the structure may substantially be aligned or tilted to each other in the thickness direction of the structure or otherwise diverge from the structure.

[0022] In some embodiments, the structure may include an optically shielding, preferably substantially opaque, and optionally dyed, painted, or otherwise colored constituent layer, or an optically translucent, optionally still translucent constituent layer. In some embodiments, the constituent layer may comprise polymethyl methacrylate or other materials, preferably having a lower melting temperature than the optically translucent layer, disposed, preferably molded on the optically translucent layer.

[0023] The substrate film and the optical transmission layer can be configured to define an injection hole that extends through both the substrate film and the optical transmission layer and is filled with material supplied to the constituent layer via the injection hole. When the injection hole is provided, the constituent layer can be formed such that it is positioned on the side of the structure intended to face the environment (such as a user) without leaving any visual markings of the injection hole on the constituent layer.

[0024] The structure may include an additional thin film on the side of the optically transmissive layer opposite to the side facing the substrate thin film, the additional thin film preferably facing the usage environment and potential user of the structure, the additional thin film optionally including a plurality of at least partially physically separated portions having holes therein, and the structure optionally further including a preferably molded shell layer on the additional thin film. The shell layer may be at least partially optically clear, opaque, or translucent, and may further optionally be coated.

[0025] Additionally, the film may include optical shielding capabilities—providing a translucent or opaque surface or volume, such as a stained or colored surface or volume, one or more light-processing features, and, depending on the case, scattering features, such as a semi-transparent print or a surface texture.

[0026] In some embodiments, the substrate film may include on its first side and / or opposite second side at least one functional element selected from the group consisting of: data processing element, SIP (system-in-package), photovoltaic cell, energy storage device, capacitor, supercapacitor, memory element, sensor, electrode, connector such as an electrical connector, capacitive sensor or sensing element, force sensor or sensing element, pressure sensor or sensing element, light sensor or sensing element, strain gauge, heating or de-icing element, and a camera.

[0027] The structure may further include a molding layer on the second side of the substrate film, the molding layer being at least partially embedded in one or more of the at least one functional element.

[0028] A portion of the circuit design may extend to the second side of the substrate film via conductive vias and be electrically connected to at least one functional element thereon.

[0029] The structure may include a conductive shielding layer, which may comprise or be composed of a conductive ink such as silver ink, a copper film or other conductive material film, located on a second opposite side of the substrate film, preferably disposed at a distance from the substrate film provided by at least one intermediate layer, such as an adhesive layer or, if applicable, a tape layer.

[0030] The structure may further include at least one additional layer, such as an additional adhesive layer, such as an adhesive tape layer, located on the side of the shielding layer opposite to the side facing the substrate film, and preferably configured to face and contact an external and potentially conductive host surface, wherein the shielding layer, the intermediate layer and the at least one additional layer are integrated into a multilayer adhesive tape.

[0031] The shielding layer may be electrically connected to the circuit design on the first substrate film via conductive vias through the substrate film or at least partially in externally configured wiring portions.

[0032] According to another aspect of the present invention, a method for manufacturing an integrated optical functional multilayer structure is provided, the method comprising: Obtain a flexible, 3D-formable, and thermoplastic substrate film containing one or more perforations; Preferably, at least one first side of the substrate film is provided by printed electronics technology, the substrate film having a circuit design including a plurality of electrical conductors; At least one light source is disposed on the first side of the substrate film as connected to the circuit design; and Preferably, an optically transmissive layer is formed on the first side of the substrate film and the at least one light source by molding, such as injection molding, high-pressure molding, low-pressure molding, silicone molding, or using one or more other manufacturing methods, the optically transmissive layer at least partially covering the substrate film and embedding the at least one light source. A light output coupling surface is established from at least one of the substrate thin film or the optical transmission layer, the light output coupling surface preferably being at least partially tilted away from a surface plane or direction defined by the adjacent region of the substrate thin film.

[0033] The substrate film may be obtained to include one or more perforations, wherein forming the optical transmission layer may include partially guiding a molding tool through the substrate film from a second side opposite to the first side of the substrate film via the one or more perforations, wherein a material that subsequently flows around the molding tool on the first side of the substrate film and defines the optical transmission layer forms the light output coupling surface, the light output coupling surface being adjacent to a cavity formed on the first side of the substrate film during molding, free from the space occupied by the molding tool.

[0034] The provided molding tool can be shaped to provide a larger cavity to the optical transmission layer in conjunction with the one or more holes, the larger cavity being limited at least by the output coupling surface of the optical transmission layer and / or the sidewalls defining the holes of the substrate film, wherein the method further comprises filling the cavity with a fluid such as air or other gaseous substance, or preferably a molding material, as appropriate.

[0035] The method may include obtaining a substrate film and providing the substrate film having one or more perforations, such that the one or more perforations are determined to couple light output from an internal component of the structure to a desired pattern or region of an environment of the structure.

[0036] One or more perforations may be provided in the substrate film to retain at least one elongated bridging portion of the substrate film, the method comprising providing at least a portion of the circuit design on the elongated bridging portion, thereby providing an electrical connection to the at least one light source and, where appropriate, providing additional electronic or electrical functional elements from an external device or an additional layer of the structure.

[0037] The method may further include providing at least one light guiding or scattering feature, wherein the at least one light guiding or scattering feature is configured, as appropriate, in or on the substrate film and / or the optical transmission layer, to guide or disperse incident light thereon onto the bridging portion of the substrate film, wherein the at least one light guiding or scattering feature may include printed diffusion ink, diffusion surface embossing, and / or diffusion particles.

[0038] The optical transmission layer may be configured to define a recess or protrusion, wherein the recess or protrusion is at least rectangular or angled in cross-section, on at least one of the one or more apertures extending away from the substrate film and / or in the optical path of light incident and reflected from the output coupling surface. The light output coupling surface, the recess or protrusion in the optical transmission layer, and the associated light emitting region or light output coupling region on the outer surface of the structure may be substantially aligned or tilted to each other in the thickness direction of the structure or otherwise diverge from the structure.

[0039] The method may further include, as appropriate, producing an optically shielding, and preferably substantially opaque, constituent layer, or an optically translucent, and as appropriate, constituent layer, before or after molding the optically translucent layer, via molding such as injection molding.

[0040] The method may further include providing the substrate film and the optical transmission layer to define a preferred concentric injection hole, the preferred concentric injection hole extending through both the substrate film and the optical transmission layer and through which the material molding the constituent layer is injected.

[0041] The method may include, as appropriate, providing an additional film on the side of the optically transmissive layer opposite to the side facing the substrate film, the additional film preferably facing the usage environment and potential users of the structure, the additional film being provided as including a plurality of at least partially physically separated portions having holes therebetween, the method further including, as appropriate, molding a shell layer on the additional film.

[0042] Embodiments of the method may include providing at least one functional element selected from the group consisting of the following on the first side and / or the opposite second side of the substrate film: data processing element, SIP (system-in-package), photovoltaic cell, energy storage device, capacitor, supercapacitor, memory element, sensor, electrode, connector such as an electrical connector, capacitive sensor or sensing element, force sensor or sensing element, pressure sensor or sensing element, light sensor or sensing element, strain gauge, heating or de-icing element, and a camera.

[0043] The molding layer may be molded on the second side of the substrate film to at least partially embed one or more of the at least one functional element.

[0044] Part of the circuit design may be provided to extend, as appropriate, to the second side of the substrate film via conductive vias to electrically connect with at least one functional element thereon.

[0045] A conductive shielding layer comprising, where appropriate, conductive ink such as silver ink, copper film or other conductive material film, or composed thereof, may be further disposed on a second opposite side of the substrate film, and at least one intermediate layer, such as an adhesive layer, or, where appropriate, an adhesive tape layer, may be provided between the conductive shielding layer and the substrate film.

[0046] At least one additional layer, such as an additional adhesive layer, such as an adhesive tape layer, may be disposed on the side of the conductive shielding layer opposite to the side facing the substrate film, and preferably configured to face and contact an external and potentially conductive body surface. The shielding layer, the intermediate layer, and the at least one additional layer may be integrated into a multilayer adhesive element, such as a tape.

[0047] An electrical connection may be provided between the shielding layer and the circuit design on the first substrate film via conductive vias through the substrate film or at least partially in externally configured wiring portions.

[0048] In some embodiments of the method, at least a surface portion of the optical transmission layer and / or an additional layer or a thin film thereon may be colored, as appropriate, with opaque paint or dye to provide an optical mask.

[0049] The output coupling surface may be provided or established to define or include one or more light processing or redirecting features, which may be substantially specular or diffuse reflective scattering features, and may include a rough surface texture or, more specifically, a surface bump pattern.

[0050] This solution naturally yields different advantages over various previously applied solutions depending on its various embodiments.

[0051] For example, at least the transmission and (output) coupling of light can be effectively controlled, and the associated optical efficiency and various other characteristics of interest (such as the achieved illumination uniformity) are optimized in the relevant optical structure by means of the clever combination of the included materials and components (such as the light source and the output coupling surface) with respect to, for example, their mutual positioning, orientation, size and other characteristics.

[0052] The substrate, light source, optical transmission layer and output coupling surface can be configured together with possible additional layers such as constituting layers to provide a structure in which the structure itself is illuminated at selected locations and the light is guided in a selected manner, thereby presenting the desired appearance, at least in terms of illumination, to an observer from outside the structure.

[0053] In terms of manufacturing processes, in addition to using prepared components such as films, assemblies or modules, printing and other cost-effective, flexible and versatile controllable methods (such as various molding techniques) can also be cleverly applied to manufacture the desired features.

[0054] By fabricating an output coupling surface to be provided as an optical transmission layer and / or a substrate thin film, the need for separate output coupling features such as reflectors can be eliminated. No separate step is required to provide the output coupling features, and the mutual positioning of output coupling features such as individual output coupling elements and transmission layers does not need to be ensured through, for example, proper placement of the output coupling elements.

[0055] By advantageously shaping the output coupling feature integrally and monolithically into the output coupling surface in the optical transmission layer through local deformation of the associated material during the molding process, in addition to simplifying the structure and potentially simplifying the manufacturing process, it can also provide highly efficient optical solutions and potential space, material and weight savings.

[0056] Different embodiments of the present invention can be utilized in many ways and included in various applications, such as in electronic devices or electrical appliances containing electronic devices, including but not limited to computers, tablets, smartphones, other communication devices, wearable devices, AV devices, optical devices, home appliances, vehicles, displays, panels, medical devices, smart textiles, furniture, works of art, etc.

[0057] The various additional benefits provided by this invention will become clear to those skilled in the art based on the following more detailed description.

[0058] The expression "multiple" in this text can refer to any positive integer starting from one (1).

[0059] Correspondingly, the expression "multiple" can refer to any positive integer starting from two (2).

[0060] The terms "first" and "second" are used herein to distinguish one element from another, and unless otherwise expressly stated, do not specifically indicate their priority or order.

[0061] The exemplary embodiments of the invention presented herein are not to be construed as limiting the applicability of the appended claims. The verb "comprising" is used herein as an open-ended limitation and does not exclude the presence of features not described. Unless expressly stated otherwise, the features described in the various embodiments and, for example, in the appended claims, can be freely combined with each other. Attached Figure Description

[0062] Selected embodiments of the invention are illustrated in the figures provided as examples rather than as limitations.

[0063] Figure 1 Various features and scopes of the invention according to embodiments of the multilayer structure are described at 1A, 1B and 1C.

[0064] Figure 2 exhibit Figure 1 A top view of the multi-layered structure of A.

[0065] Figure 3 Another example illustrating a multilayer structure, demonstrating features that can be contained beneath a substrate thin film in a structure according to embodiments of the invention, such as... Figure 1, 2 A multi-layered structure of any one of 5 or 6.

[0066] Figure 4 Examples of multilayer structures are shown, demonstrating features that can be included beneath a substrate thin film in a structure according to embodiments of the invention, such as... Figure 1 , 2 A multi-layered structure of any one of 5 or 6.

[0067] Figure 5 Examples of multi-layered structures are shown.

[0068] Figure 6 This describes a part of a multi-layered structure.

[0069] Figure 7 This is a flowchart of an embodiment of the method according to the present invention. Detailed Implementation

[0070] Figure 1 A, 1B, and 1C are typically illustrated at 100 in a cross-sectional sketch, illustrating embodiments of the multilayer structure according to the invention.

[0071] The multilayer structure includes at least one substrate film 102, which preferably has a flexible and 3D-formable (3D-shaping) material, such as a thermoformable (plastic) material.

[0072] Item 108 refers to at least one, and where applicable, plastic or thermoplastic optically transmissive layer, preferably provided by molding onto substrate film 102. Optically transmissive layer 108 should be capable of transmitting light, taking into account at least selected wavelengths, such as substantially all or selected wavelengths of visible light, or generally at least a portion of the wavelengths emitted by included light sources, which generally, but not necessarily, include visible wavelengths.

[0073] The optically transmissive layer 108 includes a first side and an associated first surface, which may be oriented toward the usage environment of the structure and, for example, the user 113 of the structure located in this environment, depending on the application. However, the optically transmissive plastic layer 108 includes a opposing second side and an associated second surface, which are substantially oriented toward, for example, the substrate film 102 and at least one instance of a possible host device or structure.

[0074] Because the optical transmission layer 108 is intended to transmit or guide light, it should comprise an optically at least semi-transparent, and in some cases substantially transparent, material. The overall optical transmittance of the optical transmission layer 108 may preferably be at least 50% in some applications, but the desired transmittance can vary substantially across all possible applications. In some embodiments, at least about 80% or 90% transmittance may be preferred for maximizing the light output from the structure and for low loss, while in other applications, a lower value may be perfectly adequate (even if disadvantageous) if minimizing, for example, issues related to light leakage is desired. Considering the wavelength of interest, which typically includes visible light wavelengths as described above, the transmittance may be defined or measured in a selected direction (e.g., the dominant direction of light propagation) and / or in the lateral direction (i.e., the thickness direction) of the surface of the substrate film 102.

[0075] Regarding the applicable materials, the optical transmission layer 108 may generally comprise, for example, at least one material selected from the group consisting of: polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermosetting materials, elastic resins, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (PS or GPPS, general-purpose polystyrene), silicone, TPSiV (thermoplastic silicone vulcanizate), epoxy resins, and MS resins.

[0076] The substrate film 102 may, depending on the circumstances, contain the same material or material layer as the optically transmissive plastic layer 108, or at least have a similar or lower refractive index. Therefore, the resulting interfaces 102, 108 can be made optically transparent, or can respectively achieve total internal reflection (TIR) ​​type functionality for light arriving at the interface from within the optically transmissive layer 108.

[0077] In some embodiments, a colored or more intensely colored resin, used as the material for the optical transmission layer 108, can be a viable option to limit unwanted light leakage inside and outside the structure 100 to enclose elements or substantially close off, and to conceal internal components such as the light source 104 or other circuitry from external perception. Thus, an initially optically substantially transparent substrate material (such as PC or other plastic resins) can be doped with a colored masterbatch. In many applications where the total thickness of the structure 100 should be only, for example, a few millimeters or a centimeter, the optical transmission layer 108 should be even thinner; using a plastic resin layer about 2 mm to 4 mm (such as 3 mm) thick can provide very satisfactory results, provided the plastic resin layer is supplied with a selected masterbatch (e.g., a white or desired wavelength-selective resin, or, where appropriate, an IR resin, for example, IR (infrared) remote control applications) at the desired concentration (e.g., a dilution ratio of about 1%) to form the optical transmission layer 108. Typically, in many embodiments within the context of this invention, a feasible dilution (doping or metering) is practically about 5%, 4%, 3%, 2%, 1%, or less. For example, suitable industrial-grade masterbatch for the stated purpose is provided by Lifocolor™. The so-called "hide-to-illuminate" effect can be achieved for the light source 104 or other features included in the structure 100, for example by adding a translucent (e.g., displaying a selected color) masterbatch to the injection-molded base resin constituting the optical transmission layer 108.

[0078] The substrate film 102 and / or other film or general material layers included in the multilayer structure may contain at least one material selected from the group consisting of: polymers, thermoplastic materials, electrically insulating materials, polymethyl methacrylate (PMMA), polycarbonate (PC), flame retardant (FR) PC film, FR700 type PC, copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneer, plywood, stem bark, bark, birch bark, cork, natural leather, natural textiles or fabric materials, naturally grown materials, cotton, wool, flax, silk, and any combination of the above.

[0079] Depending on the embodiments discussed, and considering the wavelength of interest, such as visible light, having an associated optical transmittance of, for example, about 80%, 90%, 95%, or higher, the substrate film 102 and / or other films or layers that may be included in the structure may comprise or have optically substantially transparent or at least translucent materials. This may be particularly true when the substrate film 102 is configured in the structure 100 to effectively transmit or transfer light emitted by the light source 104. However, in some embodiments, the substrate film 102 used may be substantially opaque, black, and / or otherwise dark in appearance to block incident light from passing through it (masking function).

[0080] The thickness of the substrate film 102 and other films or layers included in the structure 100, as appropriate, may vary depending on the embodiment; for example, it may be only tens or hundreds of millimeters, or quite thick, in the amount of one millimeter or a few millimeters.

[0081] The thickness of the optical transmission layer 108 can be selected depending on the specific circumstances, but a thickness of several millimeters, such as about 3 to 5 millimeters, can be applied. In some embodiments, if not optimal, a thickness of only about 2 millimeters or less (potentially only a few millimeters, for example) may be sufficient, while in some other embodiments, the thickness can be quite large, for example, at least in some places about 1 cm or more. The thickness can vary practically locally. For example, the optical transmission layer 108 may include additional recesses or additional internal cavities for accommodating various elements such as electronic or optical elements for further light guiding, processing, and / or thermal management purposes.

[0082] The thin film 102, the optical transmission layer 108, and other layers (such as additional substrate films, additional optical transmission layers, and / or optical shielding layers) of the structure can be substantially planar (width and length greater than the thickness, for example, differing from the thickness by orders of magnitude). This generally also applies to the overall structure illustrated in the figure, but other non-planar shapes are also perfectly feasible.

[0083] Item 104 refers to a light source that is preferably of the optoelectronic type. Light source 104 may be or include semiconductors, packaged semiconductors, wafer-level semiconductors, bare wafers, electroluminescent and / or printed light sources, preferably LEDs (light-emitting diodes) or OLEDs (organic LEDs). Light source 104 may preferably be at least side-emitting, or also top-emitting. However, depending on the characteristics of each specific application, multi-side emitters or bottom emitters may be used.

[0084] Regarding packaging, the light source 104 may be of the flip-chip type. In some embodiments, the light source may contain multiple (two, three, four or more) light emitting units, such as LEDs packaged or at least grouped together. For example, multicolor or specifically RGB LEDs of several LED emitters may be provided within a single package.

[0085] The light source 104 is provided, such as by fabrication (see, for example, OLED printing), or, where at least partly as an off-the-shelf component, mounted on the first side and associated surface of the substrate film 102 facing the optical transmission layer 108, but not on the opposite second side and surface of the film 102. However, an additional host layer, such as a film, may be included in the structure to accommodate additional components, such as the light source or other electronic devices. For mounting, an adhesive (conductive or non-conductive) may typically be applied, for example.

[0086] The light source 104 may be at least partially embedded in the material of the optical transmission layer 108.

[0087] At least one of the substrate thin film 102 or the optical transmission layer 108 defines an output coupling surface 101, which is configured to redirect and reflect incident light emitted by one or more of the at least one light source 104.

[0088] The output coupling surface 101 configured to redefine and reflect incident light may refer to an associated portion of the optical transmission layer 108 or an associated portion of the substrate thin film 102, selectively shaped in terms of an associated tilt angle of the surface or one or more dimensions of an associated larger cavity. The configuration of the output coupling surface may also refer to selecting a depth of the output coupling surface 101 relative to the thickness of the transmission layer 108.

[0089] like Figure 1 As shown in A and 1B, the substrate thin film 102 may define one or more holes 102a passing through it, and on one or more of the holes 102a (or in combination with said one or more), the optical transmission layer 108 may define the output coupling surface 101.

[0090] Alternatively, such as Figure 1 As shown in C, the substrate thin film 102 can be shaped to define the output coupling surface 101.

[0091] Of course, different embodiments of the multilayer structure may include output coupling surfaces established by different methods, i.e., one or more output coupling surfaces 101 may be established via holes in the substrate film and associated surfaces of the optical transmission layer 108, and one or more additional output coupling surfaces 101 may be established via locally shaped portions of the substrate film 102, wherein such portions of the substrate film 102 establish the output coupling surfaces 101.

[0092] The output coupling surface 101 can be configured to reflect incident light emitted by one or more light sources 104 by total internal reflection (TIR).

[0093] In some embodiments, the output coupling surface may define or include one or more light processing or redirecting features. These features may be substantially specular or diffuse reflection / scattering features, and may include, where appropriate, rough surface textures or, more specifically, surface bump patterns.

[0094] One or more holes 102a may be provided as shaped such that the one or more perforations determine the desired pattern or area for coupling light output from the internal components of the structure to the environment of the structure. In embodiments where the substrate film 102 does not include holes 102a, the substrate film 102 may be shaped at the location where the output coupling surface 101 is formed to determine the desired pattern or area for coupling light output from the internal components of the structure to the environment.

[0095] The output coupling surface 101 can be tilted away from the surface plane or orientation of the adjacent region of the substrate thin film 102, such as... Figure 1 As shown in A, 1B and 1C.

[0096] At least one of the substrate film 102 or the optical transmission layer 108 may thus be formed to include one or more output coupling surfaces 101, which are tilted at a selected tilt angle away from a plane or axis that is generally oriented with respect to at least the substrate film adjacent to the output coupling surface 101.

[0097] The output coupling surface 101 may include surface configurations that are not flat surfaces, such as... Figure 1 The surface configuration shown is illustrated. A portion of the output coupling surface 101 may be shaped to include a sloped surface. In another embodiment, the output coupling surface 101 may include any other shape, however, it is configured to reflect and redirect incident light to a selected direction. Light may at least be reflected and redirected to a selected direction, while at least a portion of the incident light may naturally be additionally reflected and redirected to one or more other directions.

[0098] The light initially emitted by the light source 104 and propagating within the optical transmission layer 108 will therefore be reflected by the surface 101. The output coupling surface 101 can thus be configured in the optical transmission layer 108 and / or the substrate film 102, wherein the layer 108 and / or the substrate film 102 defines the output coupling surface 101, such as a molding layer and / or substrate, to reflect and manipulate the light emitted by the light source 104 and incident on the output coupling surface 101 to propagate at least in a selected direction.

[0099] At least some of the light may be reflected toward the output coupling region 122 (as a selected direction), the output coupling region defining an area of ​​structure 100, through which at least a portion of the light emitted by at least one light source 104 should be output coupled from and to the environment of structure 100, for example, for perception by an external observer 113 (such as a user of structure 100 or a device associated with structure 100).

[0100] The light source 104 can be positioned relative to the respective output coupling surface 101 as needed. For various reasons, the light source 104 may be located adjacent to or further away from the associated output coupling surface. These reasons may include better concealing or shielding the source 104 from external perception or enhancing the uniformity of illumination (e.g., brightness and / or color) provided to external components of the structure 100 via the output coupling region 122 by allowing light emitted from the source 104 to propagate a longer distance and period within the optical transmission layer 108. This facilitates, for example, improved blending. To improve sharpness, Figure 1 Only a single light source 104 is shown, and in many embodiments, one light source 104 may be sufficient if not advantageous. However, as will be readily understood by those skilled in the art, numerous embodiments exist, for example, in the field of large-area lighting, in which several light sources 104 are included and a shared or individual output coupling surface 101 is utilized in the structure, having at least a partially engaged or individual output coupling region 122 associated therewith, thereby influencing the positioning and orientation of the light source 104.

[0101] For selected, and where appropriate, substantially all visible light wavelengths (such as at least a portion of the wavelengths emitted by source 104), the reflectivity of output coupling surface 101 is preferably at least locally about 75%, more preferably at least about 90%, and most preferably at least about 95%. The reflectivity is preferably such that the achieved reflection system is realized by TIR (total internal reflection).

[0102] Figure 1 A and 1B illustrate a hole 102a as a through-hole, wherein a portion of the substrate film 102 is removed. However, in some embodiments, the hole 102a may be provided as, for example, a cut-out hole or cut into the substrate film 102. In such cases, the output coupling surface 101 may be formed at least partially from the surface of the substrate film 102.

[0103] Incorporating one or more apertures 102a, the structure may include a larger cavity 107, which is limited by at least a portion of the optical transmission layer 108 defining the output coupling surface 101 and / or the sidewalls of the apertures defining the substrate film 102 and / or a portion of the substrate film 102 shaped to form the output coupling surface 101. The cavity 107 may be filled with a fluid such as air or other gaseous material, or preferably with a molding material. The fluid or other material filling the larger cavity 107 should preferably have a refractive index less than that of the material of the optical transmission layer 108, at least when the output coupling surface is formed by the optical transmission layer 108.

[0104] The optical transmission layer 108 may further include at least one recess or protrusion 108a. The protrusion may be rectangular or angled at least in cross-section. The recess or protrusion 108a may be substantially disposed on at least one of one or more holes 102a extending away from the substrate film 102, on a portion of the substrate film 102 shaped to form the output coupling surface 101, and / or in the optical path of light incident and reflected from the output coupling surface 101. Figure 1 A shows a protrusion 108a that is substantially disposed on the hole 102a and the associated output coupling surface 101. Figure 1 B shows a protrusion in the optical path of light reflected from the self-output coupling surface 101. Figure 1 C shows a protrusion 108a that is substantially disposed on the substrate thin film 102 and shaped to form a portion of the output coupling surface 101. The recess or protrusion 108a may be disposed substantially below the output coupling region 122 in the thickness direction of the structure.

[0105] Item 106 refers to a circuit design in which conductors (such as traces and / or contact pads) are electrically and additively produced (e.g., screen-printed or otherwise printed), which may further serve as thermal conductors. The conductors may be used, for example, between components of structure 100 and / or with external components for electrical and data transmission purposes. Circuit design 106 may provide control signals and power to light source 104 from controller and power circuitry, among other uses. Circuit design 106 may be connected to external devices via, for example, the external surface or edge of structure 100 containing wiring or connectors. Alternatively or additionally, wireless connectivity may be applied based on, for example, electromagnetic or, in particular, other options of inductive coupling.

[0106] The multilayer structure 100 may contain any number of additional functional elements. Figure 1(Not described in A or 1B). Other functional elements may include one or more of the following: data processing elements, SIP (system-in-package), photovoltaic cells, energy storage devices, capacitors, supercapacitors, memory elements, sensors, electrodes, connectors such as electrical connectors (116), capacitive sensors or sensing elements, force sensors or sensing elements, pressure sensors or sensing elements, light sensors or sensing elements, strain gauges, heating or de-icing elements, and / or cameras.

[0107] Structure 100 may further include at least one optically shielding, and preferably substantially opaque, constituent layer 109, or an optically translucent, and optionally still translucent constituent layer 109. Constituent layer 109 may comprise polymethyl methacrylate or other materials preferably having a lower melting temperature than the optically translucent layer 108. Constituent layer 109 may be disposed, preferably molded, on the optically translucent layer 108. Constituent layer 109 may alternatively be produced in other ways, such as pre-prepared and subsequently placed on the optically translucent layer 108.

[0108] In some embodiments providing the constitutive layer 109, recesses or protrusions 108a may be configured to extend away from the substrate film 102 such that reflected light can substantially traverse the transmissive layer 108 in a selected direction and reach the output coupling region 122, such that light reflected and directed in the selected direction can reach the output coupling region 122 substantially without passing through the constitutive layer 109. When the constitutive layer 109 is substantially opaque, in some embodiments, light from at least one light source 104 may therefore exit the multilayer structure only substantially via one or more output coupling regions 112.

[0109] The multilayer structure 100 may additionally include at least one additional film 103 on the side of the optical transmission layer 108 opposite to the side facing the substrate film 102. The additional film 103 may be oriented toward the environment of use of the structure 100 and the potential user 113. The additional film 103 may, where appropriate, include a plurality of at least partially physically separated portions having holes therein.

[0110] Additionally, the film 103 may include optical shielding capabilities that provide translucent or opaque surfaces or volumes (such as stained or colored surfaces or volumes).

[0111] Additionally, the thin film 103 may further include one or more light processing features 103a, which may be scattering features, such as translucent printing or surface texture. The light processing features 103a may be located at the output coupling region 112.

[0112] Structure 100 may further include a preferably molded shell 110 on another thin film 103. Shell 110 may be at least partially optically clear, opaque, or translucent, and may further be painted, depending on the situation.

[0113] Figure 2 Explain the multi-layer structure 100 (such as...) Figure 1 A top or plan view of at least a portion of structure A. Section AA illustrates a portion of structure 100, in which... Figure 1 A describes the cross-sectional view. Figure 2 In particular, it displays the substrate thin film 102 and associated features as well as the electronic features disposed thereon, and has multiple light sources 104 and additional functional elements 105.

[0114] Figure 2 An embodiment of a multilayer structure 200 with a substrate film 102 is shown, wherein an elongated bridging portion 102b is provided to carry at least a portion of a circuit design 106, thereby providing electrical connections to a light source 104 and, where appropriate, to additional functional elements 105 disposed on the substrate film 102. Electrical connections may be provided from external devices or additional layers of the multilayer structure 100.

[0115] exist Figure 2 In one embodiment, a hole 102a is disposed in the substrate film 102 such that the substrate film 102 includes an island portion 102c, which is shown here as a substantially central portion, at least partially separated from the other portions of the substrate film 102, while remaining connected to the remaining portions of the substrate film 102 by a bridging portion 102b. Figure 2 An example of aperture 102a, bridging portion 102b, and island portion 102c is shown, but naturally, other possible shapes and numbers of aperture 102a, bridging portion 102b, and island portion 102c are also possible. The elongated bridging portion 102b can provide electrical connections to one or more light sources 104 and, where appropriate, additional functional elements 105, while at least one island portion 102c is otherwise substantially isolated from the rest of the substrate film 102. A selected visual form of the light coupled from the structure can then be displayed through the structure of the aperture shape, while still providing functionality to the electronics.

[0116] Instead of via 102a, the substrate film 102 can be shaped into a non-planar form at desired locations, wherein the substrate film is formed to establish output coupling surfaces at these locations. In one example, the multilayer structure 200 can be provided in other ways, such as Figure 2 As shown in the figure, but includes a shaped non-planar portion of the substrate film 102 at the location involving hole 102a.

[0117] Figure 2 The substrate film 102 further includes an injection hole 502. The injection hole 503 extends through the substrate film 102 (and preferably also extends through the optical transmission layer 108, which is not shown in the image). Figure 2(Middle). The injection holes can be used in the injection molding process for injection molding of at least layer 109. Where appropriate, the optical transmission layer 108 can be injection molded via injection holes 502 of the substrate thin film 102. At least a portion of the optical transmission layer 108 can also be injection molded via at least one of the holes 102a.

[0118] Figure 3 (at 300) and Figure 4 (At 400) portions of the multilayer structures 300, 400 are shown, exhibiting features that may be included beneath the substrate film 102 of the structure according to an embodiment of the present invention. Figure 3 and 4 Structures 300 and 400 may include any features of, for example, substrate 102 and its features (holes 102a, bridging 102b and island portions 102c), light source 104, circuit design 106, optical transmission layer 108 and constituent layer 109, as described elsewhere herein.

[0119] Figure 3 A secondary layer structure 112 is described on the second side of the substrate film 102 (i.e., the side opposite to the side facing the optical transmission layer 108). The secondary layer structure 112 may include at least one conductive shielding layer 112b, which can be separated from the substrate film 102 by an intermediate layer 112a. As a third layer below the substrate film 102, the secondary layer structure 112 may include at least one additional layer 112c facing the second side of the conductive shielding layer 112b.

[0120] The conductive shielding layer 112b may comprise or consist of a conductive ink such as silver ink, a copper film, or other conductive material film. At least one intermediate layer 112a may be an adhesive layer, such as an adhesive tape layer. At least one additional layer 112c may also be an adhesive layer, such as an adhesive tape layer. The secondary layer structure 112 may be provided as an integrated multilayer adhesive tape.

[0121] The shielding layer 112b can be electrically connected 111 to the circuit design 106 on the first substrate film 102. For this purpose, at least one conductive via can be provided through the substrate film 102, or can be implemented by wiring portions that are at least partially configured externally.

[0122] When the multilayer structure includes at least one capacitive element (such as a capacitive sensor or sensing element) as an additional functional element 105 on the first side of the substrate thin film 102, Figure 3The embodiment can be advantageous. Structure 300 can be configured to face and contact the external body surface 114 via secondary layer structure 112. Body surface 114 can be a conductive surface, such as a metal sheet. Especially when body surface 114 is conductive and potentially not grounded and at an unknown potential, the performance of the capacitive sensing element in the structure can be reduced. Conductive shielding layer 112b can be used to shield the functionality of the capacitive sensing element from undesirable effects. Dual-function adhesive tape can be used regularly to attach the structure to the body surface, thereby in this embodiment, the integrated multilayer adhesive tape 112 can be provided to include conductive shielding layer 112b to enhance the functionality of the capacitive sensing element. If conductive shielding layer 112b directly contacts substrate film 102 and only one additional material layer is provided as adhesive tape layer as additional layer 112c, then only the thickness of substrate film 102 exists between the capacitive sensing element and conductive shielding layer 112b. However, in an advantageous embodiment of the invention, the provided secondary layer structure 112 can increase the distance between the capacitive sensing element and the conductive shielding layer 112b. This can increase the performance of the capacitive sensor and the readout distance.

[0123] Figure 4 A multilayer structure 400 is shown, which includes additional functional elements 105, 116 on a second side of a substrate film 102. Structure 400 may then include a molded layer 115 on the second side of the substrate film 102, which at least partially embeds the additional functional elements 105, 116. At least a portion of a circuit design 106 may extend to the second side of the substrate film 102, for example, via conductive vias and be electrically connected to the additional functional elements 105, 116 thereon. Specifically, at least one of the additional functional elements may include at least one connector 116 for connection to an external entity.

[0124] Figure 5 This describes a cross-sectional view of a multi-layered structure 500. This view can be compared with... Figure 2 The cross-sectional view of section BB is shown, but it also shows the optical transmission layer 108 and the constituent layer 109. Figure 5 The output coupling surface 101 and the associated larger cavity 107 are shown. Note that... Figure 5 The outermost output coupling surface 101 on the left and right sides and the larger cavity 107 are parts of the same structure, that is, associated with the same hole 102a. Figure 5 The different output coupling surfaces 101 (and larger cavities 107) are similar; however, they can of course vary at different locations relative to the same hole 102a.

[0125] In different embodiments, such as Figure 5 The structure is as described above, but the substrate 102 does not have holes 102a. Here, the substrate 102 may be shaped or formed at the desired location to form the output coupling surface 101.

[0126] Protrusion 108a is disposed in the optical transmission layer 108 in conjunction with output coupling surface 101. Light source 104 is shown to guide light toward output coupling surface 101. A light source 104 can be configured to guide light to one or more output coupling surfaces 101. Light from a light source 104 can be configured to redirect, for example, to a plurality of output coupling regions 122.

[0127] The constituent layer 109 is depicted as being disposed on the optical transmission layer 108. It can be combined as follows: Figure 1 The examples shown in A and 1B provide a constituent layer 109, in which there is essentially no constituent layer 109 located at the output coupling region 122.

[0128] Figure 5 The injection hole 502 extends through both the substrate thin film 102 and the optical transmission layer 108. The injection hole 502 may be substantially concentric with respect to the holes provided in the substrate thin film 102 and the optical transmission layer 108. In the resulting multilayer structure, the injection hole 502 may be (at least partially) filled with the material constituting layer 109.

[0129] Figure 6 A cross-sectional view of a portion of the multilayer structure 600 is shown. Here, the substrate film 102 includes a bridging portion 102b. The structure 600 may include at least one light guiding or scattering feature 124. The at least one light guiding or scattering feature 124 may be disposed in or on the substrate film 102 and / or in the optical transmission layer 108. The light guiding or scattering feature 124 may be configured to guide or disperse incident light onto the bridging portion 102b of the substrate film 102, or at least such that light emitted by one or more light sources 104 can be guided toward the bridging output coupling region 132 with respect to the bridging output coupling region 132. The at least one light guiding or scattering feature may include printed diffusion ink, diffusion surface embossing, and / or diffusion particles. Thus, light guidance can be compensated at the bridging portion 102b, such that even at the bridging portion 102b of the substrate film 102, light is guided toward at least one bridging output coupling region 132, wherein the bridging portion 102b is not associated with the output coupling surface 101. Figure 6 Additional features that may be included elsewhere in structure 600 are shown, such as the aperture 102a of the substrate thin film 102, the output coupling surface 101, and the protrusion 108a. The light source 104 and the circuit design 106 are not depicted, but structure 600 will naturally also include these features, as well as any other features that may be selected as appropriate.

[0130] Figure 7A flowchart of an embodiment of a method for manufacturing an integrated optical functional multilayer structure according to the present invention is shown at 700. Since the applicable manufacturing processes and related features of the possible constituent elements and materials of various embodiments of the structure have already been discussed above, such discussions need not be repeated here to facilitate clarity of the already lengthy method description. However, those skilled in the art will understand that they can return to the preceding paragraphs to find valuable details also regarding applicable manufacturing methods and considerations, and this also applies in the opposite direction with regard to the structural or functional details potentially included in the multilayer structure.

[0131] At the start of a method for manufacturing a multilayer structure, a startup phase 702 can be performed. During startup, necessary preparatory tasks can be carried out, such as material, component, and tool selection, acquisition, calibration, and other configuration tasks. Special attention must be paid to the fact that individual component and material selections work together and undergo selected manufacturing and assembly processes, which are preferably based on manufacturing process specifications and component data sheets or pre-checked through prototypes produced, for example, through investigation and testing. Equipment used for processes such as molding, IMD (in-mold decoration), lamination, bonding, (thermo) forming, electronic component assembly, cutting, drilling, perforation, printing, and / or measurement (such as equipment providing the required optical measurements, etc.) can thus be brought to operational status during this phase.

[0132] In some cases, the initiation phase 702 may include designing, selecting, or otherwise providing a molding tool with selected characteristics, such as shape, for insertion into one or more holes in the substrate film to establish a selected output coupling surface from the transmissive optical layer. The shape of the molding tool may then determine the shape of the associated larger cavity.

[0133] At point 702, at least one, preferably flexible, substrate film of plastic or other material is obtained for housing, for example, a light source and potentially other electronic devices. The substrate film may initially be substantially planar or, for example, curved. The substrate film may at least primarily have a substantially electrically insulating material. Off-the-shelf elements, such as rolls or sheets of plastic film, may be available for use as substrate material. In some embodiments, the substrate film itself may be initially prepared by molding from selected starting material using a mold or molding apparatus or other methods. The substrate film may be further processed at this stage, depending on the circumstances.

[0134] At 702, the method may include obtaining a substrate film having at least one hole, or the method may include generating one or more holes in the substrate film at this stage. One or more holes, essentially perforations or at least slits, can be determined as the desired pattern or area for coupling light output from the internal components of the structure to the environment of the structure.

[0135] Alternatively, the method may include obtaining or forming a substrate film at a selected location at 702 to determine a pattern or region for coupling light output from the internal components of the structure to the environment of the structure, such that the substrate film at the selected location forms an output coupling surface. In the case where the output coupling surface is established via the formed portion of the substrate film, the formation of the substrate film may alternatively occur at step 710.

[0136] At 706, preferably by one or more additive techniques such as printed electronics or 3D printing, multiple conductive and, where appropriate, thermally conductive elements are formed on the substrate film to define, for example, various wires (traces), sensing elements such as electrodes, and / or contact areas such as pads to construct the circuit design. Thus, the circuit design may comprise several circuits or circuit sub-designs on different layers of the overall structure, connected, where appropriate, by conductive wiring through intermediate layers or via the edges of the structure. For example, screen printing, inkjet printing, flexographic printing, gravure printing, or offset printing can be applied by one or more printing devices suitable for producing at least a portion of the circuit design. In some cases, subtractive or semi-additive processes may also be used. Further actions on the substrate film involving, for example, printing or typically providing graphics, visual indicators, optical elements (such as masks or output coupling elements), holes / fillers, etc., on or at this location, if not already performed, may be done here, for example, at 1004.

[0137] In various embodiments, conductive and thermally conductive elements (traces, pads, connecting elements, electrodes, etc.) may include at least one material selected from the group consisting of: conductive inks, conductive nanoparticle inks, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesives, carbon fibers, graphene, alloys, silver alloys, zinc, brass, titanium, solders, and any components thereof. For example, the conductive material used may be optically opaque, translucent, and / or transparent at at least a portion of the desired wavelengths, such as visible light, in order to mask radiation such as visible light or to reflect, absorb, or allow said radiation to pass through. For example, DuPont™ ME602 or ME603 conductive inks may be used as practical examples of feasible conductive materials.

[0138] At 708, at least one or more light sources (e.g., LEDs) are disposed on a substrate film together with possible additional circuitry, such as one or more typically off-the-shelf components, including electronic components, such as various SMDs, attached to contact areas on the film by solder and / or adhesive. For example, depending on the embodiment, different elements may also be provided, such as control and / or drive electronics, communication, sensing, connectivity (e.g., connectors), carriers (circuit boards, carriers, etc.), and / or power supply (e.g., batteries).

[0139] For example, suitable pick-and-place or other mounting devices may be used for this purpose. Alternatively or additionally, printed electronics techniques may be applied to virtually fabricate at least a portion of a component (such as an OLED (organic LED)) directly in situ onto a thin film. Thus, as those skilled in the art will understand, the execution of items 706, 708 for providing a multilayer structure having the desired circuit system may overlap in time. However, the components prepared or mounted herein may also include various optical elements such as lenses, reflectors, diffusers, masks, filters, etc.

[0140] Non-conductive and / or conductive adhesives may be used to fasten components. In some embodiments, mechanical fastening is implemented or at least reinforced by non-conductive adhesive materials, while solder or other highly conductive (but to a lesser extent, adhesive-type) materials are used for electrical connections.

[0141] Selected components may undergo further processing such as encapsulation.

[0142] Item 709 specifically refers to the fabrication and attachment of one or more, at least partially, prefabricated modules (such as 'sub-assemblies'), which may have initially separate secondary substrates, such as circuit boards, having local circuit designs and electronic devices, such as multiple light sources, ICs and / or various other elements or components, such as optical or structural components (e.g., wall structures, diffusers, lenses, carrier elements, etc.).

[0143] Ultimately, at least a portion of the multilayered electronic devices and / or other components can thus be conveniently provided to the substrate film via fully or partially prefabricated modules or sub-assemblies / multiple assemblies. Where appropriate, the modules or sub-assemblies may be at least partially molded over or typically covered by a protective material (such as a plastic layer) before being attached to the main substrate.

[0144] For example, adhesives, pressure, and / or heat can be used for the mechanical bonding of a module or subassembly to the main (body) substrate. Solder, wiring, and conductive inks are examples of suitable options for providing electrical and / or thermal connections between components of a module or subassembly and remaining electrical and / or thermal components on the main substrate.

[0145] Items 706 and 708 may include providing circuit design or associated wiring and providing at least one light source and possible additional functional elements on at least a first side of the substrate film and, where appropriate, on a second side of the substrate film.

[0146] In some embodiments, a substrate film that already contains at least a portion of electronic devices, such as circuit designs and / or light sources or other circuit systems, may be further formed into a 3D shape using thermoforming or cold forming, for example, to exhibit a desired shape such as at least a partially three-dimensional (substantially non-planar) shape. Suitable forming apparatuses, such as thermoforming machines, may be used for this purpose. Alternatively or additionally, at least some of the forming may be performed after molding if a multilayer stack design has been established to undergo this process.

[0147] At 712, an optically transmissive plastic layer is preferably formed at least on the first side of the substrate film and on the light source thereon, and the optically transmissive layer at least partially covers the light source.

[0148] Preferably, the optical transmission layer, or in some embodiments, the provided multilayer comprising a plastic or thermoplastic, or in some embodiments, a thermosetting layer, is manufactured on the substrate via molding (such as injection molding). Other possible molding methods may include, for example, injection molding, high-pressure molding, low-pressure molding, silicone molding, or epoxy molding. Considering, for example, a light-emitting module or a cover portion of another module intended to host replaceable or generally accessible (e.g., detectable or reprogrammable) components, the desired portion may remain clear or subsequently cleaned with mechanical or chemical treatment. This module may then also include a removable cover portion for providing access to its internal components.

[0149] For example, the molding material may be provided using several molding steps, injection, or via a single step, wherein the molding material may flow from one side to the opposite side of the substrate film, even if, where appropriate, through holes formed therein or by penetrating the substrate material itself (e.g., via a thinned / thinner portion). The molding material may be at least primarily electrically insulating, and in many embodiments preferably at least primarily electrically insulating. An adhesion-promoting material may be used on a film adjacent to the molding plastic.

[0150] However, item 712 may include, if such holes are provided, guiding a molding tool through the substrate film from a second side of the substrate film opposite to the first side via one or more holes in the substrate film. Material flowing around the molding tool on the first side of the substrate film during molding can then establish and define an optically transmissive layer to include a light output coupling surface. The light output coupling surface may then preferably be at least partially angled away from a surface plane or orientation defined by an adjacent region of the substrate film. The formed light output coupling surface then abuts a cavity established on the first side of the substrate film in the space free from the molding tool during molding.

[0151] The formation of the plastic layer 712 may also include the formation of an optically transmissive layer, such as comprising one or more recesses or protrusions extending away from the substrate film, as previously described herein.

[0152] At 712, one or more additional molding layers may also be formed, such as a molding layer on the second side of the substrate film.

[0153] The method may include producing, at 712 and preferably via molding such as injection molding, an optically shielding, and preferably substantially opaque, constituent layer, or an optically translucent, and if applicable, still translucent constituent layer. The constituent layer may be produced before or after molding the optically translucent layer.

[0154] In some embodiments, the optical transmission layer is molded prior to the constituent layer, and the method further includes providing an injection hole extending through both the substrate film and the optical transmission layer, and the method further includes injecting material for molding the constituent layer through the injection hole.

[0155] At 714, additional features may be provided. These additional features may include, for example, the possible molding of one or more additional films and their shell layers. Providing additional features may further include, for example, providing multilayer adhesive tape between the layers of the adhesive tape, the multilayer adhesive tape including a conductive shielding layer. In some embodiments of the method, at least a surface portion of the optical transmission layer and / or additional layers or films may be colored, as appropriate, with opaque paint or dye to provide an optical mask.

[0156] Regarding the resulting total thickness of the stacked multilayer structure, the thickness depends, for example, on the materials used and the relevant minimum material thickness that provides the necessary strength for manufacturing and subsequent use. These categories will be considered on a case-by-case basis. For instance, the total thickness of the structure can be on the order of several millimeters, as discussed elsewhere herein, but considerably thicker or thinner embodiments are also feasible.

[0157] Item 716 refers to several potential additional tasks, such as post-processing and installation tasks. Additional layers, single-layer or multi-layer films, or generally additional features, can be added to a multilayer structure by molding, printing, lamination, for example by heat, adhesives or pressure, or suitable coating (e.g., deposition) processes, as well as other possible positioning or fixing techniques and subtractive techniques (such as laser). Instead of plastic or other materials, the layers may have protective, indicative, and / or aesthetic values ​​(graphics, colors, patterns, text, digital data, etc.) and contain materials such as textiles, leather, or rubber.

[0158] Depending on the specific implementation, additional elements such as electronics, modules, internal components or parts of modules, and / or optics may be mounted and fixed to, for example, the outer surface of an existing structure, such as the outer surface of a included film or molded layer. For instance, optical features such as lens structures or diffusers may be constructed or completed here by processing a thermoplastic layer or any other layer or element thereon by adding or removing material therefrom (laser processing is an option).

[0159] At point 718, the method execution ends.

[0160] The scope of this invention is determined by the appended claims together with their equivalents. Those skilled in the art will understand that the non-closed embodiments are constructed for illustrative purposes only, and that other configurations applying many of the above principles can be readily prepared to best suit various potential use cases.

Claims

1. An integrated optical functional multilayer structure (100, 500), characterized in that... Include: A flexible, 3D-formable and further thermoplastic substrate film (102) configured with a circuit design (106) comprising at least a plurality of electrical conductors on a first side of the substrate film (102); At least one light source (104) disposed on the first side of the substrate thin film (102) and connected to the circuit design (106), the at least one light source (104) being configured to internally illuminate at least a portion of the structure for external sensing; and An optical transmission layer (108), which may be made of plastic or thermoplastic material, such as polycarbonate, thermosetting material, silicone, epoxy resin or other material, is formed on the first side of the substrate film (102) and the at least one light source (104), the optical transmission layer (108) at least partially covering the substrate film (102) and embedded in the at least one light source (104). The substrate film (102) or at least one of the optical transmission layers defines an output coupling surface, which is preferably tilted (101) away from a surface plane or orientation adjacent to the substrate film (102), and configured to preferably redirect and reflect incident light emitted by one or more of the at least one light source (104) by TIR (total internal reflection).

2. The structure of claim 1, wherein the output coupling surface (101) defines or includes one or more light processing or redirecting features, which are substantially specular or diffuse reflective scattering features, and which include a rough surface texture or, more specifically, a surface bump pattern.

3. The structure of any of the preceding claims, wherein the substrate thin film (102) defines one or more holes (102a) therethrough, wherein the output coupling surface is defined by the optical transmission layer on the one or more holes (102a).

4. The structure of claim 3, wherein the one or more holes (102a) include a larger cavity (107), the larger cavity being limited at least by the output coupling surface (101) of the optical transmission layer (108) and / or the sidewalls defining the holes of the substrate film (102), the cavity being filled with a fluid such as air or other gaseous substance, or preferably with a molding material.

5. The structure of any of the preceding claims, wherein the substrate film (102) includes at least one elongated bridging portion (102b) carrying a portion of the circuit design (106) thereby providing an electrical connection to the at least one light source (104) and, where appropriate, an electrical connection to an external device or another electronic or electrical functional element (105) from another layer of the structure, advantageously further wherein the substrate film (102) includes an island portion (102c), which is substantially a central portion, said island portion being at least partially separated from other portions of the substrate film (102) by one or more of the one or more holes (102a), while being maintained connected thereto by said at least one bridging portion (102b).

6. The structure of claim 5, comprising (600) at least one light guiding or scattering feature (124), wherein the at least one light guiding or scattering feature is configured in or on the substrate film (102, 102b) and / or the optical transmission layer (108, 108a) to guide or disperse incident light onto the bridging portion (102b) of the substrate film (102), wherein the at least one light guiding or scattering feature comprises, as appropriate, printed diffusion ink, diffusion surface embossing and / or diffusion particles.

7. The structure of any of the preceding claims, wherein the optical transmission layer (108) substantially defines a recess or protrusion (108a) on at least one of the one or more holes (102a) extending away from the substrate film (102) and / or in the optical path of light incident and reflected from the output coupling surface (101), wherein the recess or protrusion is, in case, at least rectangular or angled in cross-section, and in case the associated light emitting regions on the output coupling surface (101), the recess or protrusion (108a) in the transmission layer (108), and the outer surface of the structure are substantially aligned or inclined to each other in the thickness direction of the structure or otherwise diverge from the structure.

8. The structure of any of the preceding claims, comprising an optically shielding and preferably substantially opaque constituent layer (109) which may be dyed, painted or otherwise colored, or an optically translucent constituent layer (109) which may still be translucent.

9. The structure of claim 8, wherein (500) the substrate film (102) and the optical transmission layer (108) define an injection hole (502) that extends through both the substrate film and the optical transmission layer and is filled with material supplied to the constituent layer (109) via the injection hole (502).

10. The structure of any of the preceding claims, comprising an additional film (103) on a side of the optical transmission layer (108) opposite to the side facing the substrate film (102), the additional film (103) preferably facing the environment of use of the structure (100) and potential users (113), the additional film (103) optionally comprising a plurality of at least partially physically separated portions having holes therebetween, the structure optionally further comprising a preferably molded shell (110) on the additional film (103), the shell optionally being at least partially optically clear, opaque or translucent, and further optionally painted.

11. The structure of claim 10, wherein the additional film (103) comprises optical shielding capability—providing a translucent or opaque surface or volume, such as a stained or colored surface or volume, one or more light-processing features (103a), and, depending on the circumstances, scattering features, such as a semi-transparent print or a surface texture.

12. The structure of any of the preceding claims, wherein the substrate film (102) comprises on its first side and / or opposite second side at least one functional element (105, 116) selected from the group consisting of: data processing element, SIP (system-in-package), photovoltaic cell, energy storage device, capacitor, supercapacitor, memory element, sensor, electrode, connector (116) such as an electrical connector, capacitive sensor or sensing element, force sensor or sensing element, pressure sensor or sensing element, light sensor or sensing element, strain gauge, heating or de-icing element, and a camera.

13. The structure of claim 12, comprising (400) a molding layer (115) on the second side of the substrate film, the molding layer being at least partially embedded in one or more of the at least one functional element (105).

14. The structure of any one of claims 12 to 13, wherein a portion of the circuit design (106) of (400) extends, as appropriate, to the second side of the substrate film (102) via a conductive via and is electrically connected thereto to the at least one functional element (105, 116).

15. The structure of any of the preceding claims, comprising (300) a conductive shielding layer (112b), which may comprise or be composed of a conductive ink such as silver ink, a copper film or other conductive material film, located on an opposite second side of the substrate film (102), preferably disposed at a distance from the substrate film (102) from at least one intermediate layer (112a) of choice, such as an adhesive layer or, where choice is available.

16. The structure of claim 15, further comprising at least one additional layer (112c), such as an additional adhesive layer, such as an adhesive tape layer, said at least one additional layer being located on the side of said shielding layer (112b) opposite to the side facing said substrate film (102), and preferably configured to face and contact an external and potentially conductive host surface (114), said shielding layer (112b), said intermediate layer (112a) and said at least one additional layer (112c) being integrated as a multilayer adhesive tape (112).

17. The structure of any one of claims 15 to 16, wherein the shielding layer (112b) is electrically connected (111) to the circuit design (106) on the first substrate film (102) via a conductive via through the substrate film (102) or at least partially in an externally configured wiring portion.

18. A method (700) for manufacturing an integrated optical functional multilayer structure, characterized in that... Include: Obtain (704) a flexible, customizable, and thermoplastic substrate film; Preferably, at least one first side of the substrate film is provided by printed electronics technology, the substrate film having a circuit design including a plurality of electrical conductors; At least one light source is configured (708) on the first side of the substrate film as connected to the circuit design; and Preferably, an optically transmissive layer (712) is formed on the first side of the substrate film and the at least one light source by molding, such as injection molding, high-pressure molding, low-pressure molding, silicone molding, or using one or more other manufacturing methods, the optically transmissive layer at least partially covering the substrate film and embedded in the at least one light source. The method includes establishing a light output coupling surface from at least one of the substrate film or the optical transmission layer, the light output coupling surface preferably being at least partially tilted (101) away from a surface plane or orientation defined by a neighboring region of the substrate film.

19. The method of claim 18, wherein the substrate film is obtained to include one or more perforations, wherein generating the optical transmission layer includes partially guiding a molding tool through the substrate film from a second side opposite to the first side of the substrate film via the one or more perforations, wherein a material subsequently flowing around the molding tool on the first side of the substrate film and defining the optical transmission layer forms the light output coupling surface, the light output coupling surface being adjacent to a cavity formed on the first side of the substrate film during molding, free from the space occupied by the molding tool.

20. The method of claim 19, wherein the provided molding tool is shaped to provide a larger cavity to the transmissive layer in conjunction with the one or more holes, the larger cavity being limited at least by the inclined output coupling surface of the optical transmissive layer and / or the sidewalls defining the holes of the substrate film, wherein the method further comprises, where appropriate, filling the cavity with a fluid such as air or other gaseous substance, or preferably a molding material.

21. The method of claim 19 or claim 20, wherein the method comprises obtaining a substrate film and providing the substrate film having one or more perforations, such that the one or more perforations are determined to couple light output from an internal component of the structure to a desired pattern or region of an environment of the structure.

22. The method of any one of claims 19 to 21, wherein the substrate film is obtained by processing to include one or more perforations or one or more shaped portions to retain at least one elongated bridging portion of the substrate film, the method comprising providing at least a portion of the circuit design on the elongated bridging portion, thereby providing an electrical connection to the at least one light source and, where appropriate, providing additional electronic or electrical functional elements from an external device or an additional layer of the structure.

23. The method of claim 22, further comprising providing at least one light guiding or scattering feature, wherein the at least one light guiding or scattering feature is configured, as appropriate, in or on the substrate film and / or the optical transmission layer, to guide or disperse incident light thereon onto the bridging portion of the substrate film, wherein the at least one light guiding or scattering feature may comprise, as appropriate, printed diffusion ink, diffusion surface embossing, and / or diffusion particles.

24. The method of any one of claims 18 to 23, wherein the optical transmission layer is formed to define a recess or protrusion on at least one of the one or more holes extending remotely from the substrate film.

25. The method of any one of claims 18 to 24, the method further comprising, as appropriate, producing, before or after the molding of the optically transmissive layer, a molding process such as injection molding of an optically shielding, preferably substantially opaque, constituent layer, or an optically transmissive, as appropriate, still translucent constituent layer.

26. The method of claim 25, wherein the method comprises providing the substrate film and the optical transmission layer to define a preferred concentric injection hole, the preferred concentric injection hole extending through both the substrate film and the optical transmission layer and injecting the material molding the constituent layer through the injection hole.

27. The method of any one of claims 18 to 26, the method comprising providing an additional film on the side of the optically transmissive layer opposite to the side facing the substrate film, the additional film preferably facing the usage environment and potential user of the structure, the additional film being provided as comprising a plurality of at least partially physically separated portions having holes therebetween, the method further comprising molding a shell layer on the additional film.

28. The method of any one of claims 18 to 27, the method comprising providing at least one functional element selected from the group consisting of: data processing element, SIP (system-in-package), photovoltaic cell, energy storage device, capacitor, supercapacitor, memory element, sensor, electrode, connector such as an electrical connector, capacitive sensor or sensing element, force sensor or sensing element, pressure sensor or sensing element, light sensor or sensing element, strain gauge, heating or de-icing element, and a camera on the first side and / or opposite second side of the substrate film.

29. The method of any one of claims 18 to 28, comprising providing a conductive shielding layer, the conductive shielding layer comprising or composed of a conductive ink such as silver ink, a copper film or other conductive material film, located on an opposite second side of the substrate film, and wherein, if appropriate, at least one intermediate layer, such as an adhesive layer, or if appropriate, an adhesive tape layer, is provided between the conductive shielding layer and the substrate film.

30. The method of claim 29, further comprising providing at least one additional layer, such as an additional adhesive layer, such as an adhesive tape layer, said at least one additional layer being located on the side of the conductive shielding layer opposite to the side facing the substrate film, and preferably configured to face and contact an external and potentially conductive body surface, said shielding layer, said intermediate layer and said at least one additional layer being integrated as a multilayer adhesive element, such as a tape.

31. The method of any one of claims 29 to 30, comprising, as appropriate, providing an electrical connection between the shielding layer and the circuit design on the first substrate film via a conductive via through a conductive via in the substrate film or at least partially in a wiring portion configured externally.

32. The method of any one of claims 18 to 31, wherein at least a surface portion of the optical transmission layer and / or an additional layer or a film thereon is colored, as appropriate, with an opaque paint or dye to provide an optical mask.

33. The method of any one of claims 18 to 32, wherein the output coupling surface is provided to define or include one or more light processing or redirecting features, which may be substantially specular or diffuse reflective scattering features, and may include a rough surface texture or, in particular, a surface bump pattern.

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