Coordinate measuring apparatus

Abstract

Provided is a coordinate measuring device capable of arbitrarily adjusting the posture of a contact probe. The coordinate measuring device includes a multi-axis translation mechanism, a contact probe, a first probe device, a second probe device, a memory, a measurement control unit, and a measurement unit. The contact probe has a two-axis rotation mechanism, is movable within a measurement space, and is capable of changing the posture. The first probe device probes the position of each axis of the multi-axis translation mechanism. The second probe device has a mark built into one end side of the two-axis rotation mechanism, and a camera built into the other end side and configured to capture the mark, and probes the position and posture of the contact probe based on the captured image of the mark. The memory stores measurement settings. The measurement control unit controls the movement of the contact probe in accordance with the measurement settings to move the contact probe to a measurement position, and controls the posture of the contact probe. The measurement unit performs measurement based on the measurement position based on the probe results of the first probe device and the second probe device measured by the contact probe, and a measurement item using a measurement element.

Description

Technical Field

[0001] This invention relates to a coordinate measuring device. Background Technology

[0002] Coordinate measuring devices that measure the dimensions, positional relationships, contour shapes, and geometric tolerances of a workpiece with high precision by placing a contact probe against any measurement position on the workpiece to be measured and obtaining the coordinates of that measurement position have been put into practical use (for example, see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Description of European Patent No. 3144632 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] Furthermore, conventional coordinate measuring devices include those capable of adjusting the angle of the contact probe at the measuring position. However, conventional coordinate measuring devices can only perform discrete angle adjustments using a so-called clutch mechanism, requiring calibration for each angle adjustment.

[0008] In view of the above-mentioned problems, the present invention aims to provide a coordinate measuring device that can arbitrarily adjust the posture of the contact probe.

[0009] Solution for solving the problem

[0010] For example, the coordinate measuring device according to the present invention includes: a multi-axis translation mechanism; a contact probe having a 2-axis rotation mechanism connected to the multi-axis translation mechanism, capable of moving along each axis of the multi-axis translation mechanism within a measuring space and capable of changing its posture; a first detection device for detecting the position of each axis of the multi-axis translation mechanism; a second detection device having a mark built into one end of the 2-axis rotation mechanism and a camera device built into the other end of the 2-axis rotation mechanism for capturing images of the mark, the second detection device detecting the position and posture of the contact probe based on the captured image pattern of the mark; and a memory storing measurement settings, wherein the measurement settings include settings for... The measurement unit determines the measurement position of the measurement element, the posture of the contact probe relative to the measurement position, and the measurement items using the measurement element based on the shape of the workpiece to be measured; the measurement control unit, when receiving a measurement instruction, moves the contact probe to the measurement position according to the measurement settings stored in the memory via the multi-axis translation mechanism, and controls the posture of the contact probe relative to the measurement position via the 2-axis rotation mechanism; and the measurement unit performs the measurement based on the measurement position determined by the contact probe based on the detection results of the first detection device and the second detection device, and the measurement items using the measurement element.

[0011] Furthermore, other features, elements, steps, advantages, and characteristics become clearer through the following detailed description and the accompanying drawings.

[0012] Invention Effects

[0013] According to the present invention, a coordinate measuring device is provided that allows for arbitrary adjustment of the orientation of the contact probe. Attached Figure Description

[0014] Figure 1 This is a diagram showing the overall structure of the coordinate measuring device.

[0015] Figure 2 This is a diagram illustrating a structural example of a non-contact optical sensor.

[0016] Figure 3 This is a diagram showing the system structure of the coordinate measuring device.

[0017] Figure 4 This is a flowchart illustrating an example of a measurement setup.

[0018] Figure 5 This is a flowchart illustrating an example of continuous measurement.

[0019] Figure 6 This is a diagram showing an example of the structure of a contact probe.

[0020] Figure 7 This is a schematic diagram illustrating the floating structure of the contact probe.

[0021] Figure 8 This is a schematic diagram showing the overall structure of the contact probe.

[0022] Figure 9 This is a diagram schematically showing the main components of a contact probe.

[0023] Figure 10 This diagram schematically shows the A-axis drive unit with its external components removed.

[0024] Figure 11 This is a schematic diagram illustrating a structural example of the outer casing.

[0025] Figure 12 This is a schematic diagram illustrating a structural example of the inner shell.

[0026] Figure 13 This is a schematic diagram illustrating an example of a floating section structure.

[0027] Figure 14 This is a flowchart illustrating an example of point measurement.

[0028] Figure 15 This is a flowchart illustrating an example of contour measurement.

[0029] Figure 16 This is a schematic diagram illustrating an example of 3D CAD data for a workpiece model.

[0030] Figure 17 This is a schematic diagram illustrating an example of a measurement setting document.

[0031] Figure 18 This is a schematic diagram illustrating another example of a measurement setting document.

[0032] Figure 19 This diagram schematically illustrates the situation where a non-contact optical sensor irradiates a workpiece with a strip of laser L.

[0033] Figure 20 This is a schematic diagram showing the obtained three-dimensional point cloud in the measurement space.

[0034] Figure 21 This is a schematic diagram showing the three-dimensional point cloud in the measurement space after unwanted point clouds have been removed.

[0035] Figure 22 It is a diagram schematically showing the matching of the CAD coordinate system with the coordinate system related to the shape of the workpiece W, which is the object of measurement.

[0036] Figure 23 This is a schematic diagram illustrating the measurement path of the contact probe.

[0037] Figure 24 This diagram schematically illustrates the process of setting the measurement position using a teaching pen.

[0038] Figure 25 This is a diagram illustrating an example of a measurement setting file generated using measurement settings based on measured data.

[0039] Figure 26 This is a diagram illustrating another example of a measurement setting file generated using measurement settings based on measured data. Detailed Implementation

[0040] <Coordinate measuring device (overall structure)>

[0041] Figure 1 This is a diagram showing the overall structure of the coordinate measuring device 100. The coordinate measuring device 100 measures the dimensions, positional relationships, contour shape, and geometric tolerances of the workpiece W with high precision by placing a contact probe against any measurement position on the workpiece W to be measured and acquiring the three-dimensional coordinates of that measurement position. In addition to recording the measurement data of the workpiece W, the coordinate measuring device 100 can also calculate various values ​​through various operations. As described in this figure, the coordinate measuring device 100 includes a PC (Personal Computer) 1 and a main body 5.

[0042] PC1 can be understood as the control unit of the coordinate measuring device 100. PC1 can be either a laptop or a desktop. PC1 can also be connected to a mouse 2 as a user input device. The user input device can also be a keyboard, touchpad, touch panel, or stylus, etc.

[0043] The main body 5 comprises a head housing 57, a head 50, a contact probe 60, a non-contact optical sensor 31, a teaching pen 23, a teaching camera 21, a turntable 70, a control console 11, and a remote control 25 as its main components.

[0044] The head housing 57 is a base that supports the head 50, the teaching camera 21, and the rotary table 70. For example, the head housing 57 has a ground contact portion 57a ​​and an upright portion 57b. The ground contact portion 57a ​​can be understood as a base plate that supports the rotary table 70 from below, i.e., a pedestal. The upright portion 57b can be understood as a column that stands upright from the ground contact portion 57a ​​and supports the head 50 and the teaching camera 21 respectively. The PC1 can be connected to the head housing 57 via a communication cable 3. A measurement button 80, a detection button 81, and a power button 82 may also be provided on the front part of the ground contact portion 57a.

[0045] When the measurement button 80 is pressed, a scan is performed by the non-contact optical sensor 31 to detect the position and posture of the workpiece and determine the measurement position for the workpiece. When the measurement button 81 is pressed, a scan is performed by the non-contact optical sensor 31, and based on a comparison with the acquired map data described later, the corresponding workpiece setting file is selected from multiple pre-registered setting files. The measurement position can be defined as the position where the contact probe 60 contacts the workpiece W. When the power button 82 is pressed, the main body 5 is switched on / off.

[0046] The head 50 can be understood as a three-axis translation mechanism that moves the contact probe 60 along the X-axis drive direction 51, the Y-axis drive direction 53, and the Z-axis drive direction 55. When described according to this figure, the head 50 includes an X-axis drive unit 52, a Y-axis drive unit 54, and a Z-axis drive unit 56.

[0047] The X-axis drive unit 52 is disposed at the upper end of the head housing portion 57, particularly the upright portion 57b. The X-axis drive unit 52 cantilever supports the Y-axis drive unit 54 in a manner that allows it to move freely along the X-axis drive direction 51. The X-axis drive unit 52 can be understood as a so-called translation beam. The Y-axis drive unit 54 supports the Z-axis drive unit 56 in a manner that allows it to move freely along the Y-axis drive direction 53. The Y-axis drive unit 54 can be understood as a so-called translational body. The Z-axis drive unit 56 supports the contact probe 60 in a manner that allows it to move freely along the Z-axis drive direction 55. The Z-axis drive unit 56 can be understood as a so-called translational rod.

[0048] The contact probe 60 can be understood as a contact element that contacts the workpiece W, i.e., a touch probe. The contact probe 60 can move within the measurement space along each drive axis of the head 50, specifically along the X-axis, Y-axis, and Z-axis. The measurement space can be understood as the space within which the contact probe 60 can move and perform measurements via the head 50. That is, the measurement space can also be understood as the range of movement of the contact probe 60. Furthermore, the contact probe 60 has a two-axis rotation mechanism connected to the head 50, and its posture when in contact with the workpiece W can be changed. As described in this figure, the contact probe 60 includes a B-axis drive unit 62, an A-axis drive unit 64, a stylus 65, and a workpiece camera 66.

[0049] The B-axis drive unit 62 is supported at the lower end of the Z-axis drive unit 56. The B-axis drive unit 62 supports the A-axis drive unit 64 in a manner that allows it to rotate freely along the B-axis drive direction 61. The B-axis drive direction 61 can be understood as a circumferential direction with the B-axis as the central axis. The B-axis can also be an axis parallel to the Z-axis. The A-axis drive unit 64 is supported by the B-axis drive unit 62. The A-axis drive unit 64 can also be understood as a component of the B-axis drive unit 62. The A-axis drive unit 64 supports the stylus 65 and the workpiece camera 66 in a manner that allows them to rotate freely along the A-axis drive direction 63. The A-axis drive direction 63 can be understood as a circumferential direction with the A-axis as the central axis. The A-axis can also be an axis on the XY plane that is uniquely determined by the displacement (height) of the Z-axis drive unit 56 and uniquely determined by the displacement (rotation angle) of the B-axis drive unit 62.

[0050] Furthermore, the B-axis drive unit 62 and the A-axis drive unit 64 can be understood as a 2-axis rotation mechanism connected to the head 50. The 2-axis rotation mechanism can change the posture of the contact probe 60, specifically, it can change the posture of the stylus 65 and the workpiece camera 66.

[0051] That is, in the coordinate measuring device 100 of this embodiment, the position of the contact probe 60 is determined by a 3-axis translation mechanism, and the posture of the contact probe 60 is determined by a 2-axis rotation mechanism. Furthermore, the posture of the contact probe 60 can also be understood as the angle of the stylus 65 determined by the 2-axis rotation mechanism, in other words, as the extension direction of the stylus 65.

[0052] In this way, the contact probe 60 employs a structure that allows the stylus 65 to rotate freely via a two-axis rotation mechanism, a so-called free-angle structure. Therefore, unlike conventional structures that only allow discrete angle adjustments, the angle of the stylus 65 can be continuously and steplessly adjusted. Furthermore, unlike conventional structures, with the free-angle structure, calibration is not required for each discrete angle adjustment.

[0053] The stylus 65 is a needle-shaped member supported on the A-axis drive unit 64. The front end of the stylus 65 may, for example, be machined into a spherical shape. In this case, the action of "making the contact probe 60 contact the workpiece W" can be understood as the action of "making the ball provided at the front end of the stylus 65 contact the workpiece W".

[0054] The workpiece camera 66 is a camera device supported on the A-axis drive unit 64. The workpiece camera 66 can also be understood as a component of the A-axis drive unit 64. The workpiece camera 66 is capable of capturing images of the rotary table 70 and the workpiece W placed on the rotary table 70 in an orientation determined by the 2-axis rotation mechanism.

[0055] The non-contact optical sensor 31 is a sensor that acquires three-dimensional point clouds, or so-called map data, within the measurement space. The non-contact optical sensor 31 can also be composed of a profilometer, a 2D camera, or both. As shown in this figure, the non-contact optical sensor 31 can also be mounted on the Y-axis drive unit 54. In this case, the non-contact optical sensor 31 can move arbitrarily within the measurement space along the X-axis and Y-axis. For example, by scanning while moving the non-contact optical sensor 31 along the X-axis drive direction 51, a three-dimensional point cloud within the measurement space can be acquired. The non-contact optical sensor 31 can also be understood as a component of the Y-axis drive unit 54. The structure and measurement principle of the non-contact optical sensor 31 will be described later.

[0056] The teaching pen 23 is one of the instruments used by the user during direct teaching of the measured position. The teaching pen 23 can be understood as a marker probe separately from the contact probe 60. The teaching pen 23 includes, for example, a stylus 24 and multiple optical markers 27.

[0057] The stylus 24 is a needle-shaped component supported at the front end of the teach pen 23. The front end of the stylus 24 may, for example, be machined into a spherical shape. In this case, the action of "bringing the teach pen 23 into contact with the workpiece W" can be understood as the action of "bringing the ball located at the front end of the stylus 24 into contact with the workpiece W". Multiple optical marks 27 are provided at different locations on the teach pen 23.

[0058] The teaching camera 21 can be understood as an optical measuring device that captures images of multiple optical marks 27 set on the teaching pen 23 and determines the position and orientation of the teaching pen 23. The teaching camera 21 may, for example, be supported near the upper end of the head housing 57, particularly the upright portion 57b, in an orientation that includes the entire measuring space in the coordinate measuring device 100 within the camera's field of view. The teaching camera 21 may also include an illumination unit 22 for illuminating the camera's field of view. The teaching camera 21 may also be provided separately from the non-contact optical sensor 31 and the workpiece camera 66. The teaching camera 21 can also be understood as one of the constituent elements of the head housing 57.

[0059] The rotary table 70 includes a disk-shaped stage for placing the workpiece W, and an θ-axis drive mechanism for rotating the stage along the θ-axis drive direction 71. The θ-axis drive direction 71 can be understood as a circumferential direction with the θ-axis as the central axis. The θ-axis can also be an axis parallel to the Z-axis.

[0060] Even if the measurement position on the workpiece W is outside the measurement space, the rotary table 70 can control the rotation angle about the θ axis in a way that positions the measurement position within the measurement space. That is, the measurement space in which the contact probe 60 can move is different from the actual measurable range including the rotary table 70. Furthermore, when the rotary table 70 is driven along the θ axis, the three-dimensional coordinates in the device coordinate system of the measurement space can be converted into three-dimensional coordinates in a virtual global coordinate system by taking into account the displacement (rotation angle) of the rotary table 70 in the θ-axis driving direction 71.

[0061] The control console 11 can be understood as a user input device that accepts manual operations on the head 50 and the contact probe 60. For example, the control console 11 may also be provided with multiple joysticks that accept manual operations on each of the six axes (X-axis, Y-axis, Z-axis, A-axis, B-axis, and θ-axis). In addition, the control console 11 may also be provided with at least one of the aforementioned measurement button 80, detection button 81, and power button 82. The head housing 57 and the control console 11 can be connected via a communication cable 12.

[0062] The remote controller 25 is one of the user input devices used for direct teaching of the measurement position. The remote controller 25 may also be equipped with a trigger button 26 that accepts decision operations regarding the measurement position made via the teaching pen 23. Additionally, the remote controller 25 may also be equipped with at least one of the aforementioned measurement button 80, detection button 81, and power button 82. The PC1 and the remote controller 25 can be connected via a communication cable 4.

[0063] <Non-contact optical sensors>

[0064] Figure 2 This is a diagram illustrating a structural example of a non-contact optical sensor 31. The non-contact optical sensor 31 of this structural example can be understood as a profilometer. As described in this figure, the non-contact optical sensor 31 includes a laser emitter 32, a light-receiving lens 33, and an image sensor 34.

[0065] The laser emitting unit 32 irradiates a strip of laser light L onto the surface of the workpiece W, which is the object of measurement. The laser emitting unit 32 may also include a Powell lens as a unit for extending the laser L into a strip shape. Using a Powell lens is effective in ensuring uniform extension of the incident laser light. Alternatively, the laser emitting unit 32 may include a cylindrical lens as a unit for extending the laser L into a strip shape. Using a cylindrical lens is effective in reducing aberrations caused by the light wavelength. As described in this figure, the laser L extends into a strip shape with the Y-axis driving direction 53 as its long side. The light-receiving lens 33 images the light diffusely reflected from the surface of the workpiece W onto the imaging surface of the imaging unit 34. The larger the aperture of the light-receiving lens 33, the greater the amount of light received in the imaging unit 34. The imaging unit 34 generates imaging data corresponding to the image on the imaging surface. The cross-sectional shape, or so-called profile, of the workpiece W is acquired through imaging.

[0066] For example, during the measurement setup and continuous measurement described later, the non-contact optical sensor 31 moves along the X-axis driving direction 51, that is, in the direction intersecting the long side of the laser L which extends into a strip, while sequentially generating image data. Through scanning in this manner, the contours of each cross-section of the workpiece W are sequentially acquired along the moving direction of the non-contact optical sensor 31. By synthesizing this sequentially acquired contour data by the continuous measurement unit 113 described later, a three-dimensional point cloud corresponding to the position and shape of the workpiece W can be obtained. Furthermore, the three-dimensional point cloud generated by scanning using the non-contact optical sensor 31 can also be understood as the aforementioned map data.

[0067] <Coordinate Measuring Device (System Structure)>

[0068] Figure 3 This is a diagram showing the system structure of the coordinate measuring device 100. In this diagram, the main components of the coordinate measuring device 100 are depicted as follows: PC1, mouse 2, console 11, teaching pen 23, remote control 25, head housing 57, X-axis drive unit 52, Y-axis drive unit 54, Z-axis drive unit 56, θ-axis drive unit 58, and contact probe 60. The components that appear are labeled with [reference to other components]. Figure 1 and Figure 2 Same reference numerals as shown in the attached figures.

[0069] PC1 executes PC application 111 via a CPU (not shown) to function as, for example, a measurement setting unit 112, a continuous measurement unit 113, and a communication / control unit 114. PC1 also includes memory 115 for storing PC application 111 and setting files. Memory 115 can be an HDD (Hard Disk Drive), SSD (Solid State Drive), or cloud storage device, etc.

[0070] The measurement setting unit 112 performs measurement settings for the workpiece W. The measurement settings may include, for example, the measurement position required to determine the measurement elements and measurement items for the shape of the workpiece W, which is the object of measurement; the posture of the contact probe 60 relative to the measurement position; and the measurement items using the measurement elements. In other words, the measurement settings can be understood as a general term for settings related to the measurement of the workpiece W. The content of the measurement settings may also be stored as a measurement setting file in the memory 115.

[0071] The shape of workpiece W can be defined as information related to the shape of workpiece W contained in the three-dimensional data included in the measurement setting file. When the three-dimensional data is a workpiece model generated by CAD (Computer-Aided Design), the outline, position, and orientation of the workpiece model in the CAD coordinate system are included in the information related to the shape of workpiece W. Alternatively, when the three-dimensional data is pre-measured data, the outline, position, and orientation of workpiece W in the global coordinate system or device coordinate system obtained through pre-measurement are included in the information related to the shape of workpiece W. Basic measurement elements can include geometric shapes such as planes, lines, points, circles, cylinders, cones, or spheres. Measurement items can include the dimensions of each measurement element, such as distances or angles between measurement elements. Furthermore, the measurement position and orientation measured by the contact probe 60, the measurement elements formed through each measurement, and the measurement items using the measurement elements can also be registered in the measurement setting file.

[0072] In particular, the measurement setting unit 112 can arbitrarily and easily set the measurement position where the contact probe 60 contacts the workpiece W, the posture of the contact probe 60 at the measurement position, and the measurement path of the contact probe 60 to the measurement position by direct teaching through the teaching pen 23 and the remote controller 25. The measurement setting of the workpiece W will be described in detail later.

[0073] The continuous measurement unit 113 performs continuous measurement of the workpiece W based on the measurement position measured by the contact probe 60 and the measurement items using the measurement elements. For example, the continuous measurement unit 113 calculates a first measurement element and a second measurement element based on the measurement position measured by the contact probe 60, and measures the dimension between the first measurement element and the second measurement element based on the measurement items. The continuous measurement of the workpiece W will be described in detail later. The measurement position and measurement elements can also be determined based on the aforementioned measurement setting file. In addition, the continuous measurement unit 113 generates a three-dimensional point cloud corresponding to the position and shape of the workpiece W by synthesizing the contour data sequentially acquired by the non-contact optical sensor.

[0074] The communication / control unit 114 controls the communication between PC1 and head housing 57, and the communication between PC1 and remote controller 25.

[0075] The head housing 57 includes a main control unit 121, an X-axis encoder unit 122, a θ-axis encoder unit 123, and a teaching camera 21.

[0076] The main control unit 121 controls the head housing 57, X-axis drive unit 52, Y-axis drive unit 54, Z-axis drive unit 56, θ-axis drive unit 58, and contact probe 60 according to instructions from users received by PC1 or console 11.

[0077] For example, the main control unit 121 functions as a measurement control unit that, when a measurement instruction is received, performs movement control and posture control of the contact probe 60 and rotation control of the rotary table 70 according to the measurement setting file stored in the memory 115.

[0078] As described in this figure, the main control unit 121 controls the movement of the contact probe 60 via the X-axis drive unit 52, Y-axis drive unit 54, and Z-axis drive unit 56, which are equivalent to a 3-axis translation mechanism, so that the contact probe 60 is moved to the measurement position. Furthermore, the main control unit 121 controls the posture of the contact probe 60 relative to the measurement position via the B-axis drive unit 62 and A-axis drive unit 64, which are equivalent to a 2-axis rotation mechanism. In addition, the aforementioned measurement instruction can be defined as a trigger command for reading the measurement setting file and starting the measurement of the workpiece W.

[0079] The main control unit 121 includes a communication unit 124. The communication unit 124 communicates with the console 11, the teaching camera 21, the X-axis drive unit 52, the θ-axis drive unit 58, the X-axis encoder unit 122, and the θ-axis encoder unit 123.

[0080] The X-axis encoder unit 122 obtains the displacement of the X-axis drive unit 52 in the X-axis drive direction 51, i.e., the X coordinate of the contact probe 60 in the device coordinate system, by reading the linear scale of the X-axis drive unit 52. The θ-axis encoder unit 123 obtains the displacement (rotation angle) of the rotary table 70 in the θ-axis drive direction 71 by reading the rotation scale of the θ-axis drive unit 58.

[0081] In addition to the aforementioned illumination unit 22, the teaching camera 21 also includes an image capture unit 125 and a communication / control unit 126. The image capture unit 125 captures images of the plurality of optical marks 27 disposed on the teaching pen 23. The communication / control unit 126 controls the communication between the teaching camera 21 and the main control unit 121.

[0082] The X-axis drive unit 52 includes a communication / control unit 131. The communication / control unit 131 controls the communication between the X-axis drive unit 52 and the head housing unit 57, and the communication between the X-axis drive unit 52 and the Y-axis drive unit 54.

[0083] The Y-axis drive unit 54 includes a communication / control unit 141, a Y-axis encoder unit 142, a Z-axis encoder unit 143, and a non-contact optical sensor 31. The communication / control unit 141 controls the communication between the Y-axis drive unit 54 and the X-axis drive unit 42, and the communication between the Y-axis drive unit 54 and the Z-axis drive unit 56. Furthermore, the communication / control unit 141 also communicates with the Y-axis encoder unit 142, the Z-axis encoder unit 143, and the non-contact optical sensor 31.

[0084] The Y-axis encoder unit 142 obtains the displacement of the Y-axis drive unit 54 in the Y-axis drive direction 53, i.e., the Y coordinate of the contact probe 60 in the device coordinate system, by reading the linear scale of the Y-axis drive unit 54. The Z-axis encoder unit 143 obtains the displacement of the Z-axis drive unit 56 in the Z-axis drive direction 55, i.e., the Z coordinate of the contact probe 60 in the device coordinate system, by reading the linear scale of the Z-axis drive unit 56.

[0085] In addition to the aforementioned laser emitting unit 32 and imaging unit 34, the non-contact optical sensor 31 also includes a contour calculation unit 144 and a communication / control unit 145. The contour calculation unit 144 calculates the cross-sectional shape, or contour, of the workpiece W based on the imaging data sequentially acquired by the imaging unit 34. The continuous measurement unit 113 generates three-dimensional data based on this contour data. This structure reduces the computational load on the contour calculation unit 144 of the non-contact optical sensor 31. Furthermore, the contour calculation unit 144 can also generate a three-dimensional point cloud based on the contour data. The communication / control unit 145 controls the communication between the non-contact optical sensor 31 and the communication / control unit 145.

[0086] The Z-axis drive unit 56 includes a communication / control unit 151. The communication / control unit 151 controls the communication between the Z-axis drive unit 56 and the Y-axis drive unit 54, and the communication between the Z-axis drive unit 56 and the contact probe 60.

[0087] The contact probe 60 includes a communication / control unit 161, a B-axis encoder unit 162, a camera unit 163, and a B-axis drive unit 62. The communication / control unit 161 controls communication between the contact probe 60 and the Z-axis drive unit 56. Furthermore, the communication / control unit 161 also communicates with the B-axis encoder unit 162, the camera unit 163, and the B-axis drive unit 62. The B-axis encoder unit 162 obtains the displacement (rotation angle) of the B-axis drive unit 62 in the B-axis drive direction 61 by reading the rotation scale of the B-axis drive unit 62. The camera unit 163 captures an image of an optical mark (not shown) provided on the A-axis drive unit 64. Based on the captured image pattern of the optical mark, the position and orientation of the A-axis drive unit 64 with the optical mark attached can be detected, thereby detecting the position and orientation of the stylus 65 supported on the A-axis drive unit 64.

[0088] The B-axis drive unit 62 includes a communication / control unit 164 and an A-axis encoder unit 165. The communication / control unit 164 communicates with the communication / control unit 161 of the contact probe 60. Additionally, the communication / control unit 164 also communicates with the A-axis encoder unit 165 and the A-axis drive unit 64. The A-axis encoder unit 165 obtains the displacement (rotation angle) of the A-axis drive unit 64 in the A-axis drive direction 63 by reading the rotation scale of the A-axis drive unit 64.

[0089] In addition to the aforementioned workpiece camera 66, the A-axis drive unit 64 also includes a communication / control unit 166, a Hall sensor unit 167, and an illumination unit 168. The communication / control unit 166 communicates with the communication / control unit 164 of the B-axis drive unit 62. Furthermore, the communication / control unit 166 also communicates with the Hall sensor unit 167, the illumination unit 168, and the workpiece camera 66. The Hall sensor unit 167 generates a detection signal corresponding to the displacement of the stylus 65 relative to the A-axis drive unit 64. The illumination unit 168 illuminates an optical mark (not shown) provided on the A-axis drive unit 64 from the back.

[0090] The workpiece camera 66 includes a camera unit 169. The camera unit 169 may also include photoelectric conversion elements such as a CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor.

[0091] <System Actions>

[0092] Then, while referring to Figure 3 A brief explanation of the system operation of the coordinate measuring device 100 is given.

[0093] For example, during direct teaching of the measurement position, a decision operation for the measurement position is performed using the teaching pen 23 and the remote control 25. More specifically, with the stylus 24 of the teaching pen 23 in contact with the measurement position of the workpiece W, the trigger button 26 of the remote control 25 is pressed. At this time, the camera command is transmitted through the signal path from the remote control 25 via the communication / control unit 114 of the PC1 and the communication unit 124 of the main control unit 121 to the communication / control unit 126 of the teaching camera 21.

[0094] The teaching camera 21 receives the recording command and controls the illumination unit 22 and the camera unit 125 to record images of multiple optical marks 27 set on the teaching pen 23. The recording data acquired by the camera unit 125 is transmitted through a signal path from the camera unit 125 via the communication / control unit 126 of the teaching camera 21 and the communication unit 124 of the main control unit 121 to the communication / control unit 114 of the PC1. The PC1 analyzes the recording data to determine the measurement position indicated by the teaching pen 23.

[0095] Additionally, for example, when scanning using the non-contact optical sensor 31, the scanning command is transmitted via a signal path from the communication / control unit 114 of PC1 through the communication unit 124 of the main control unit 121, the communication / control unit 131 of the X-axis drive unit 52, and the communication / control unit 141 of the Y-axis drive unit 54 to the communication / control unit 145 of the non-contact optical sensor 31.

[0096] The non-contact optical sensor 31 receives the scanning command and controls the laser emitting unit 32 to irradiate a strip of laser L toward the surface of the workpiece W, which is the object of measurement. At this time, the imaging unit 34 receives the reflected light from the workpiece W and generates imaging data corresponding to the image on the imaging surface. In addition, the X-axis drive unit 52 receives the scanning command and moves the non-contact optical sensor 31 along the X-axis drive direction 51.

[0097] By scanning in this way, a contour corresponding to the position and shape of the workpiece W can be acquired in the contour calculation unit 144. This contour is transmitted through a signal path from the communication / control unit 145 of the non-contact optical sensor 31, via the communication / control unit 141 of the Y-axis drive unit 54, the communication / control unit 131 of the X-axis drive unit 52, and the communication unit 124 of the main control unit 121, to the communication / control unit 114 of the PC1. The PC1 detects the position and orientation of the workpiece W placed on the rotary table 70 by analyzing this contour.

[0098] Additionally, for example, when using the contact probe 60 to perform point measurement, the lighting command is transmitted through a signal path from the communication / control unit 114 of the PC1 via the communication unit 124 of the main control unit 121, the communication / control unit 131 of the X-axis drive unit 52, the communication / control unit 141 of the Y-axis drive unit 54, the communication / control unit 151 of the Z-axis drive unit 56, the communication / control unit 161 of the contact probe 60, the communication / control unit 164 of the B-axis drive unit 62, and the communication / control unit 166 of the A-axis drive unit 64 to the lighting unit 168.

[0099] The illumination unit 168 receives the illumination command and illuminates an optical mark (not shown) provided on the A-axis drive unit 64 from the back. The imaging unit 163 of the contact probe 60 receives the transmitted light from the optical mark when the contact probe 60 contacts the workpiece W, and generates imaging data corresponding to the image on the imaging surface. This imaging data is transmitted via a signal path from the communication / control unit 161 of the contact probe 60, through the communication / control unit 151 of the Z-axis drive unit 56, the communication / control unit 141 of the Y-axis drive unit 54, the communication / control unit 131 of the X-axis drive unit 52, and the communication unit 124 of the main control unit 121, to the communication / control unit 114 of the PC1.

[0100] Furthermore, when performing point measurement using the contact probe 60, at the moment the contact probe 60 contacts the workpiece W, the displacement amounts in each of the X-axis drive directions 51, 53, 55, and 71 are transmitted from the X-axis encoder 122, Y-axis encoder 142, Z-axis encoder 143, and θ-axis encoder 123 to the communication / control unit 114 of the PC1. Based on the aforementioned camera data and the displacement amounts in each axis drive direction, the PC1 calculates the three-dimensional coordinates of the measurement position.

[0101] Furthermore, the aforementioned camera unit 163, X-axis encoder unit 122, Y-axis encoder unit 142, Z-axis encoder unit 143, and θ-axis encoder unit 123 receive inputs from essentially different clocks and do not operate synchronously. Therefore, in order to accurately determine the three-dimensional coordinates of the measurement position, synchronous detection is preferable to ensure that the timing of the contact probe 60 contacting the workpiece W does not deviate from the timing of referencing the camera data and the displacement in each axis drive direction.

[0102] <Measurement Setup>

[0103] Figure 4 This is a flowchart illustrating an example of measurement setting performed by the measurement setting unit 112. This process can also be started, for example, by pressing the measurement setting button displayed on the PC1's screen as a GUI (Graphical User Interface).

[0104] When this process begins, in step S11, the workpiece W, which is the object of the measurement setting, is placed on the rotary table 70. At this time, the contact probe 60 can also be moved to a position where the workpiece camera 66 can face the rotary table 70 from directly above. In addition, in this step S11, it can also be specified whether the rotation of the rotary table 70 is enabled during measurement. When the rotation of the rotary table 70 is disabled, the measurement is performed within the measurement space of the coordinate measuring device 100, that is, within the movement range of the contact probe 60.

[0105] Next, in step S12, a three-dimensional point cloud is acquired by sequentially generating camera data while moving the non-contact optical sensor 31 along the X-axis driving direction 51. Furthermore, in step S13, unwanted point clouds other than the workpiece W are deleted from the acquired three-dimensional point cloud. Unwanted point clouds to be deleted can be, for example, those whose height relative to the surface of the rotary table 70 is below a predetermined threshold. Through steps S12 and S13, a three-dimensional point cloud corresponding to the position and shape of the workpiece W can be acquired.

[0106] Next, in step S14, the retraction boundary is adjusted. The retraction boundary can be understood as the boundary that allows the contact probe 60 to move without contacting the workpiece W during automatic measurement. The retraction boundary is defined by including the area of ​​the workpiece W. The shape of the retraction boundary can be, for example, a cuboid or a cylinder. Various parameters of the retraction boundary, such as the longitudinal length, transverse length, and height of a cuboid, or the base radius and height of a cylinder, or the rotation angles of each of the three axes, can be manually input. Alternatively, the various parameters of the retraction boundary can be automatically input by setting a margin distance between the retraction boundary and the workpiece W. Alternatively, the various parameters of the retraction boundary can be automatically input by pre-setting a margin distance for the three-dimensional point cloud of the workpiece W acquired by the non-contact optical sensor 31.

[0107] Next, in step S15, pattern registration is performed. For example, the three-dimensional point cloud acquired in step S13 is converted into height data, and any feature region in this height data is registered as pattern data. The registered pattern data is processed as reference data containing information related to the shape of the workpiece W. Furthermore, the shape of the workpiece W in this process refers to the shape of the workpiece W itself, which is placed for the purpose of measurement.

[0108] If a pattern is registered beforehand, even if the workpiece W, the object of measurement, is configured in a different position and posture than when the measurement was set, the position will still be aligned to ensure consistency with the registered pattern. In this step, the position alignment method, the area to be registered as a pattern, the search range during position alignment, exclusion areas, and critical areas can also be set. The area to be registered as a pattern can be either the entire workpiece W or a part of the workpiece W.

[0109] Next, in step S16, the workpiece camera 66 captures a full 360° view of the workpiece W from its perimeter. During this full 360° view, for example, the workpiece camera 66, positioned to view the rotary table 70 from a slightly upward angle, can continuously capture images of the workpiece W during one full rotation of the rotary table 70. By capturing a full 360° view of the workpiece W beforehand, the user can confirm the location of the measurement positions, measurement elements, and measurement items specified in steps S17 and S18 on the workpiece W using the workpiece image on the GUI.

[0110] Next, in step S17, the position is taught. For example, direct teaching can also be performed using the teaching pen 23 and the remote control 25. In this case, with the stylus 24 of the teaching pen 23 in contact with the position of the workpiece W, the trigger button 26 of the remote control 25 is pressed.

[0111] By repeating this operation, arbitrary measurement elements can be temporarily determined. For example, when setting any face of workpiece W as a measurement element, any three points belonging to that face can be designated as measurement positions. Alternatively, for example, when setting any edge of workpiece W as a measurement element, the projection plane and the face to which the edge belongs can be specified using the aforementioned method, and then two points can be specified on the face to which the edge belongs to designate the edge. Furthermore, measurements can also be performed using methods other than those described above.

[0112] After temporarily determining the measurement elements, a single-piece measurement begins with the pressing of the measurement start button in the GUI, performed by the contact probe 60. This single-piece measurement refers to measuring the placed workpiece W before the measurement settings are saved. During direct teaching, the measurement settings for workpiece W can be implemented through a single-piece measurement of workpiece W.

[0113] In the single-piece measurement of workpiece W, the contact probe 60 can be inserted into the aforementioned retraction boundary in the same posture as the teaching pen 23 during teaching, and the contact probe 60 can be brought into contact with workpiece W at the measurement position specified during teaching. After completing the point measurement in this way, the contact probe 60 can be removed from the retraction boundary along the opposite path to its entry. Furthermore, outside the retraction boundary, since there is no risk of collision between the contact probe 60 and workpiece W, the contact probe 60 can move freely in its posture and along its path. In addition, outside the retraction boundary, the contact probe 60 can move at a higher speed than inside the retraction boundary. The measurement path of the contact probe 60, i.e., the sequence and route of the point measurements, can also be automatically set to efficiently traverse multiple specified measurement positions.

[0114] Next, in step S18, the measurement items are registered. As measurement items, distances and angles between measurement elements can also be registered.

[0115] Finally, in step S19, the above series of settings are saved as a measurement setting file in memory 115. It is also possible to save multiple measurement setting files in advance for each type of workpiece W that is the object of measurement.

[0116] Furthermore, this process is basically applicable to measurement settings performed using physical equipment with coordinate measuring device 100, i.e., online measurement settings. Therefore, the above series of descriptions envisions a scenario in which measurement settings including measurement position, measurement elements, and measurement items are performed within the measurable range including the rotary table 70.

[0117] However, this process can also be applied to measurement settings performed using equipment other than the physical coordinate measuring device 100, i.e., offline measurement settings. In this case, the measurement settings, including measurement positions, measurement elements, and measurement items, are performed outside the measurable range of the coordinate measuring device 100. For example, a dedicated measurement setting device equipped with a stage, teaching pen, and teaching camera can be prepared separately from the coordinate measuring device 100. Furthermore, in offline measurement settings, to avoid inconsistencies in the coordinate systems between the coordinate measuring device 100 and the dedicated measurement setting device, the three-dimensional coordinates obtained in the dedicated measurement setting device can be converted into three-dimensional coordinates on a virtual global coordinate system.

[0118] <Continuous Measurement>

[0119] Figure 5 This is a flowchart illustrating an example of continuous measurement performed by the continuous measurement unit 113.

[0120] In step S21, the workpiece W, which is to be measured, is placed on the rotary table 70. Next, in step S22, a registered measurement setting file is arbitrarily read from the memory 115. The user can select the file to use from the registered measurement setting files on the GUI of the PC application displayed on the PC1's monitor. Alternatively, by pressing the detection button 81, map data can be acquired by the non-contact optical sensor 31, and a suitable measurement setting file for the workpiece W can be automatically determined and read by comparing the shape data of the placed workpiece W in the map data with the three-dimensional shape data of the workpiece contained in the registered measurement setting file.

[0121] For example, the measurement setting file can be determined by matching the shape data of the workpiece W contained in the map data with the shape data contained in the measurement setting file. By having the user select the measurement setting file on the PC application, the action of pressing the detection button 81 and the scanning action of the non-contact optical sensor 31 can be omitted. The aforementioned method of determining the measurement setting file by pattern matching is effective when the measurement setting file to be used is known. In the method of using the detection button 81, since the measurement setting file to be used can be determined simply by pressing the detection button 81, it is effective when the measurement setting file to be used is unknown.

[0122] In step S23, it is determined whether a measurement start instruction has been given by the continuous measurement unit 13. The measurement start instruction is given by pressing the measurement button 80. Alternatively, the measurement start instruction can be given via the GUI of the PC application. If a measurement start instruction has been given, the process proceeds to step S24 and continuous measurement begins. Otherwise, if no measurement start instruction has been given, the process returns to step S23.

[0123] Furthermore, the order of steps S21 to S23 in this process can be interchanged. For example, after reading the measurement setting file in step S22, the workpiece W can be placed on the rotary table 70 in step S12, and the measurement can begin after confirming the measurement start instruction in step S23. Alternatively, the workpiece W can be placed on the rotary table 70 and the measurement setting file can be read after confirming the measurement start instruction. In this case, a display can be shown on the PC1's screen to prompt the user to place the workpiece W on the rotary table 70 and select the measurement setting file. Furthermore, if the non-contact optical sensor 31 scans map data by pressing the detection button 81, the scanning performed by the non-contact optical sensor 31 after the measurement start instruction is confirmed can be skipped.

[0124] Then, in step S24, the acquisition of a three-dimensional point cloud by the non-contact optical sensor 31 and the deletion of unwanted point clouds are performed sequentially. As a result, a three-dimensional point cloud corresponding to the position and shape of the workpiece W can be acquired.

[0125] Next, in step S25, a comparison is performed with the registered pattern. Specifically, the 3D point cloud acquired in step S24 is converted into height data, and a data portion matching the registered pattern is searched from this height data. Through this search process, the position and orientation of the workpiece W placed on the rotary table 70 are calculated.

[0126] The computational processing in step S25 is equivalent to aligning the coordinate system related to the map data acquired by the non-contact optical sensor 31 with the coordinate system related to the shape of the workpiece W, which is the object of measurement. Here, the coordinate system related to the map data can be understood as the coordinate system of the map data acquired by the non-contact optical sensor 31. On the other hand, the coordinate system related to the shape of the workpiece W can be understood as the coordinate system of the three-dimensional data contained in the measurement setting file.

[0127] Furthermore, the map data acquired by the non-contact optical sensor 31 includes first information related to the position and orientation of the workpiece W placed on the rotary table 70. On the other hand, the three-dimensional data included in the measurement setting file includes second information related to the position and orientation of the workpiece W, which is pre-registered as a pattern, i.e., reference data. Therefore, the two coordinate systems can be matched based on the first and second information to align the position of the workpiece W.

[0128] Alternatively, step S25 can also be understood as 3D position and pose matching. This 3D position and pose matching is used to match the degrees of freedom of the six axes (X-axis, Y-axis, Z-axis, A-axis, B-axis and θ-axis) based on the 3D position and pose of the workpiece W on the map data obtained by the non-contact optical sensor 31 and the 3D position and pose of the workpiece W on the reference data registered in the measurement setting file.

[0129] Next, in step S26, based on the position and posture of the workpiece W, the measurement position where the contact probe 60 contacts the workpiece W, the posture of the contact probe 60 at the measurement position, and the measurement path of the contact probe 60 to reach the measurement position are calculated again.

[0130] Next, in step S27, point measurements are sequentially performed by the contact probe 60 along the measurement path specified in the measurement setting file. Specifically, the contact probe 60 is moved toward the measurement position in a predetermined posture, and the three-dimensional coordinates of the contact position are acquired at the point in time when the contact probe 60 contacts the workpiece W.

[0131] Alternatively, contour measurement can be performed in step S27. Contour measurement is also known as scanning measurement or scanning-type measurement. In contour measurement, from a first measurement position corresponding to the starting point to a second measurement position corresponding to the ending point, the contact probe 60 is moved while maintaining contact between the tip of the stylus 65 and the workpiece W, thereby continuously acquiring three-dimensional coordinates along the shape of the workpiece W.

[0132] Finally, in step S28, the measurement results are displayed in the GUI. The measurement results may include not only the measured values ​​of the measured items, but also, for example, a judgment flag (OK / NG) indicating whether the measured values ​​are within the normal range.

[0133] In the coordinate measuring device 100, steps S24 to S28 described above are performed automatically. That is, the user can continuously perform three-dimensional measurement of the workpiece W simply by performing the actions from step S21 to step S23.

[0134] Furthermore, this process can also be applied to the case where multiple identical workpieces W are placed on the rotary table 70 in step S21, i.e., when multiple workpieces W are measured in batches. In this case, in steps S24 and S25, the position and orientation of each of the multiple workpieces W are calculated by comparing them with the registered pattern.

[0135] Then, in step S26, based on the respective positions and orientations of the multiple workpieces W, the measurement positions where the contact probe 60 contacts each of the multiple workpieces W, the orientation of the contact probe 60 at those measurement positions, and the measurement path of the contact probe 60 to reach those measurement positions are calculated again. Here, the measurement path of the contact probe 60 can also be automatically set to most efficiently circulate among the multiple measurement positions specified for each of the multiple workpieces W.

[0136] <Contact Probe>

[0137] Figure 6 This is a diagram showing a structural example of the contact probe 60. Additionally, Figure 7 This is a schematic diagram illustrating the floating configuration of the contact probe 60. Figure 7 The figures depict the states where the stylus 65 is tilted at an angle φ relative to the vertical axis of 0 degrees, 45 degrees, and 90 degrees.

[0138] As shown in the two figures, in addition to the aforementioned B-axis drive unit 62 and A-axis drive unit 64, the contact probe 60 may also have a fixing part 67 for mounting to the head 50. An optical mark detection camera 68 is provided in the fixing part 67. An optical mark 69 is provided in the A-axis drive unit 64. The optical mark 69 may also be rigidly coupled to the stylus 65. Alternatively, the stylus 65 and the optical mark 69 may be supported in a swingable manner on the A-axis drive unit 64 via a swing support mechanism 6A. The swing support mechanism 6A may also include an elastic member such as a spring.

[0139] The optical mark detection camera 68 captures an image of the optical mark 69 via the hollow B-axis drive unit 62. As a result, an image pattern of the optical mark 69 is obtained in the optical mark detection camera 68. This image pattern varies depending on the relative position and orientation of the optical mark 69 with respect to the optical mark detection camera 68, that is, the rotational orientation of the two axes of the contact probe 60.

[0140] In this way, the optical mark detection camera 68 and the optical mark 69 can be understood as an optical measuring mechanism that optically detects the rotational attitude of the two axes of the contact probe 60. However, the optical measuring mechanism is not limited to this. For example, the optical mark 69 may not be required, and a device such as a scanner that performs stripe projection may be installed at the position of the optical mark detection camera 68. Alternatively, an optical measuring mechanism capable of detecting the rotational attitude of the two axes may be installed separately outside the contact probe 60.

[0141] According to this structure, the coordinates of the measurement position can be calculated based on the three-dimensional coordinates of the contact probe 60 obtained by the head 50, which is a three-axis translation mechanism, and the rotational posture of the two axes detected by the optical measurement mechanism.

[0142] <Contact Probe (Details)>

[0143] Figure 8 This is a schematic diagram showing the overall structure of the contact probe 301. Figure 9 This is a diagram schematically showing the main components of the contact probe 301. Figure 9 Can be understood as showing Figure 8 The diagram shows the situation where the contact probe 301 is disassembled.

[0144] Furthermore, the contact probe 301 can be used as the aforementioned contact probe 60 in the coordinate measuring device 100. In this case, the contact probe 301 can move within the measuring space along each drive axis of the head 50, which is a three-axis translation mechanism, specifically the X-axis, Y-axis, and Z-axis. The position of the contact probe 301 in the measuring space is obtained by the X-axis encoder 122, the Y-axis encoder 142, and the Z-axis encoder 143. That is, the X-axis encoder 122, the Y-axis encoder 142, and the Z-axis encoder 143 can be understood as a first detection device for detecting the position of each axis of the three-axis translation mechanism.

[0145] The contact probe 301 is roughly divided into three parts: a fixing part 311, a B-axis drive part 321, and an A-axis drive part 331. Furthermore, the fixing part 311, the B-axis drive part 321, and the A-axis drive part 331 can be understood as the aforementioned fixing part 67, the B-axis drive part 62, and the A-axis drive part 64, respectively.

[0146] A fixing part 311 is disposed between the head 50 (not shown) and the B-axis drive part 321. A B-axis drive mechanism 305 and an optical mark detection camera 312 are disposed in the fixing part 311. The B-axis drive mechanism 305 rotates the B-axis drive part 321 along the B-axis drive direction 307. The B-axis drive direction 307 can be understood as a circumferential direction with the B-axis 304 as the central axis. The optical mark detection camera 312 is a camera device that captures images of the optical mark 332 disposed on the A-axis drive part 331 by passing through the optical axis of the hollow B-axis drive part 321. The optical axis of the optical mark detection camera 312 can also be the B-axis 304. The optical mark detection camera 312 can be understood as the aforementioned optical mark detection camera 68 or the imaging part 163.

[0147] The B-axis drive unit 321 is mounted on the fixing unit 311. The B-axis drive unit 321 supports the A-axis drive unit 331 in a manner that allows it to rotate freely along the B-axis drive direction 307. An A-axis drive mechanism 303 is provided in the B-axis drive unit 321. The A-axis drive mechanism 303 causes the A-axis drive unit 331 to rotate along the A-axis drive direction 308. The A-axis drive direction 308 can be understood as a circumferential direction with the A-axis 302 as the central axis.

[0148] The A-axis drive unit 331 is mounted on the B-axis drive unit 321, and in particular the A-axis drive mechanism 303, via the A-axis drive shaft 334. The A-axis drive unit 331 supports the stylus 376, the workpiece camera 306, and the optical marker 332 in a manner that allows them to rotate freely along the A-axis drive direction 308.

[0149] The stylus 376 is a needle-shaped member supported on the A-axis drive unit 331. Alternatively, the workpiece camera 306 can be supported on the A-axis drive unit 331 in a posture that keeps the tip of the stylus 376 within the camera's field of view. The stylus 376 and the workpiece camera 306 can be understood as the aforementioned stylus 65 and workpiece camera 66, respectively.

[0150] For example, the stylus 376 can also be supported to rotate freely between a first rotational position in which its tip faces vertically downward and a second rotational position in which its tip faces horizontally. That is, the first rotational position can be understood as a position in which the tilt angle φ of the stylus 376 relative to the B-axis 304 is 0 degrees. Furthermore, the second rotational position can be understood as a position in which the tilt angle φ of the stylus 376 relative to the B-axis 304 is 90 degrees.

[0151] The optical mark 332 is backlit by an illumination substrate (not shown) disposed on its back side. The optical mark 332 can be understood as the aforementioned optical mark 69. The optical mark 332 can also be disposed within an internal space shielded by the light-shielding outer casing 333 of the A-axis drive unit 331. The optical mark 332 can also have a 45-degree angle relative to the optical axis of the optical mark detection camera 312 when the stylus 376 is in the first rotational position (φ=0 degrees). According to this structure, regardless of the position of the stylus 376 between the first rotational position (φ=0 degrees) and the second rotational position (φ=90 degrees), the optical mark 332 is not parallel to the optical axis of the optical mark detection camera 312. Therefore, regardless of the posture of the stylus 376, the optical mark detection camera 312 can obtain an image pattern of the optical mark 332. This image pattern changes with the relative position and posture of the optical mark 332 relative to the optical mark detection camera 312.

[0152] Thus, the contact probe 301 employs a structure that allows the stylus 376 to rotate freely via the A-axis drive unit 331 and the B-axis drive unit 321, which are equivalent to a two-axis rotation mechanism; this is known as a free-angle structure. Therefore, unlike conventional structures that can only perform discrete angle adjustments, the angle of the stylus 376 can be continuously and steplessly adjusted.

[0153] In particular, with the contact probe 301 of this structural example, the position and orientation of the A-axis drive unit 321, on which the optical mark 332 is provided, can be detected based on the image pattern of the optical mark 332 acquired by the optical mark detection camera 312, and thus the position and orientation of the stylus 376 supported on the A-axis drive unit 321 can be detected. Therefore, unlike conventional structures using a clutch mechanism, calibration is not required for each discrete angle adjustment.

[0154] In addition, the optical mark 332 built into one end side (root side) of the two-axis rotating mechanism and the optical mark detection camera 312 built into the other end side (front end side) of the two-axis rotating mechanism can each be understood as constituent elements of a second detection device that detects the position and posture of the contact probe 301 based on the imaging pattern of the optical mark 332. According to this structure, regardless of the state of the two-axis rotating mechanism, the relative position and posture of the stylus 376 with respect to the fixed portion 311 can be detected. Furthermore, according to this structure, not only rotation but also positional deviation can be measured. Therefore, seamless position and posture control can also be flexibly addressed.

[0155] <A-axis driving portion>

[0156] Figure 10 is a schematic view showing the A-axis driving portion 331 with the outer cover 333 removed. As shown in this figure, the A-axis driving portion 331 is roughly decomposed into three parts: an outer shell portion 351, an inner shell portion 361, and a floating portion 371. The structure of each part will be described in detail below.

[0157] Figure 11 is a schematic view showing an example of the structure of the outer shell portion 351. The outer shell portion 351 is Figure 7 rigidly coupled to the A-axis driving shaft 334. Hall ICs (Integrated Circuits) 352 to 354 are provided on the outer shell portion 351 as Hall sensors for detecting contact between the contact probe 301 and the workpiece W. The Hall ICs 352 to 354 can be understood as the aforementioned Hall sensor portion 167.

[0158] Hall IC 352 detects the relative displacement of the floating portion 371 with respect to the outer shell portion 351, particularly the displacement in the X-axis driving direction. Hall IC 353 detects the relative displacement of the floating portion 371 with respect to the outer shell portion 351, particularly the displacement in the Y-axis driving direction. Hall IC 354 detects the relative displacement of the floating portion 371 with respect to the outer shell portion 351, particularly the displacement in the Z-axis driving direction.

[0159] Specifically, Hall ICs 352-354 detect the magnetic flux density of the magnets 372-374 disposed on the floating part 371 and output voltage signals respectively. For example, when the tip of the stylus 376 contacts the workpiece W, the floating part 371 undergoes relative displacement with respect to the outer casing 351. That is, the distance between Hall IC 352 and magnet 372, the distance between Hall IC 353 and magnet 373, and the distance between Hall IC 354 and magnet 374 change respectively. At this time, Hall ICs 352-354 output voltage signals proportional to the detected change in magnetic flux density. Therefore, by monitoring the output signals of Hall ICs 352-354 respectively, the timing of contact between the tip of the stylus 376 and the workpiece W can be detected.

[0160] Figure 12 This diagram schematically illustrates a structural example of the inner shell portion 361. The inner shell portion 361 has an XY spring 362 and a Z spring 363. The XY spring 362 supports the floating portion 371 so that it can swing freely relative to the inner shell portion 361 along the X-axis drive direction and the Y-axis drive direction. The Z spring 363 supports the inner shell portion 361 so that it can swing freely relative to the outer shell portion 351 along the Z-axis drive direction. In this way, the floating portion 371 is supported in a swinging manner on the A-axis drive portion 331 via the outer shell portion 351 and the inner shell portion 361. The XY spring 362 and the Z spring 363 can be understood as the aforementioned swinging support mechanism 6A.

[0161] Figure 13 This is a schematic diagram showing a structural example of the floating part 371. The floating part 371 has the aforementioned stylus 376 and optical marker 332, and also has magnets 372-374 and an XY spring fixing part 375.

[0162] The stylus 376 and optical marker 332, as components of the floating part 371 supported by the A-axis drive unit 331 in a swinging manner, are rigidly connected to each other via the XY spring fixing part 375. Therefore, detecting the posture (angle) of the optical marker 332 is simply detecting the posture (angle) of the stylus 376. Furthermore, the stylus 376 and optical marker 332 can also be integrally formed. Magnets 372-374 are each provided in pairs facing each other at a position that sandwiches the aforementioned Hall ICs 352-354. Alternatively, magnets 372-374 can each be provided in a position facing the aforementioned Hall ICs 352-354. In other words, Hall ICs 352-354 can be either unipolar or bipolar detection types. The XY spring fixing part 375 is fixed to the aforementioned XY spring 362.

[0163] <Point Measurement>

[0164] Figure 14This is a flowchart illustrating an example of point measurement using contact probe 301. The main components executing this process can be understood as the continuous measurement unit 113 and the main control unit 121.

[0165] When this process begins, in step S41, before the proximity contact in step S42, the output signals of Hall ICs 352~354 are each reset to zero.

[0166] Next, in step S42, a proximity contact is performed on the contact probe 301. During the proximity contact, the contact probe 301 moves toward the measurement position in a prescribed posture along the measurement path specified by the measurement setting document.

[0167] During the proximity contact process, in step S43, a contact determination is made as to whether the contact probe 301 is in contact with the workpiece W. If the determination is "yes," the process proceeds to step S44. Conversely, if the determination is "no," the process returns to step S42 to continue the proximity contact. Furthermore, the contact determination in step S43 may also determine whether the tip of the stylus 376 is in contact with the workpiece W, thereby causing at least one of the output signals of the Hall ICs 352-354 to exceed a threshold.

[0168] In step S44, when the tip of the stylus 376 contacts the workpiece W, the aforementioned approach contact is stopped, and the synchronous detection of the first detection device and the second detection device is performed.

[0169] For example, in the first detection device, the X-axis encoder 122, the Y-axis encoder 142, and the Z-axis encoder 143 acquire the X, Y, and Z coordinates of the contact probe 301, respectively. Furthermore, when using the rotary table 70, the θ-axis encoder 123 may also be assembled in the first detection device.

[0170] On the other hand, in the second detection device, the optical mark 332 is captured by the optical mark detection camera 312. Furthermore, in the second detection device, the position and orientation of the optical mark 332 are calculated based on the image data from the optical mark detection camera 312, and then the position and orientation of the stylus 376 are calculated. In this calculation process, for example, image classification processing may be performed to determine which of a plurality of pre-registered basic patterns the image pattern of the optical mark 332 formed on the imaging surface of the optical mark detection camera 312 matches.

[0171] The image pattern of the optical marker 332 changes with the position and orientation of the optical marker 332. On the other hand, multiple basic patterns are associated with information related to the position and orientation of the optical marker 332. Therefore, the position and orientation of the optical marker 332 can be calculated by image classification processing that compares the two, and then the position and orientation of the stylus 376 can be calculated.

[0172] Thus, the first and second detection devices can also use the output signals of Hall ICs 352-354 as triggers to synchronize the detection timing. However, the triggering of the detection timing is not limited to the above.

[0173] Next, in step S45, the coordinates of the measured position on the workpiece W are calculated based on the detection results of the first and second detection devices. Specifically, in step S45, the three-dimensional coordinates of a point where the tip of the stylus 376 contacts the workpiece W are calculated based on the position of the contact probe 301 and the position and orientation of the optical mark 322. Furthermore, the position of the tip of the stylus 376 can be calculated based on the positional relationship between the optical mark 322 and the tip of the stylus 376.

[0174] Finally, in step S47, the contact probe 301 is driven in the opposite direction to the aforementioned approach contact, so that the contact probe 301 is disengaged from the workpiece W.

[0175] <Contouring Measurement>

[0176] Figure 15 This is a flowchart illustrating an example of contour measurement using contact probe 301. This procedure is based on the aforementioned... Figure 12 Based on this, step S46 is added between step S45 and step S47.

[0177] In steps S41 to S45, the starting position of the contour measurement is calculated. That is, the starting position of the contour measurement is determined based on the XYZ coordinates (linear scale) obtained by the 3-axis translation mechanism and the position and orientation of the contact probe 301 obtained by the 2-axis rotation mechanism (the image pattern of the optical mark 322 obtained by the optical mark detection camera 312).

[0178] After calculating the starting position of the contour measurement, in step S46, while maintaining contact between the stylus 376 and the workpiece W, the contact probe 301 is moved via a 3-axis translation mechanism. Furthermore, during the movement of the contact probe 301, the 2-axis rotation mechanism can be fixed. Additionally, during the movement of the contact probe 301, the displacement (XYZ directions) of the contact probe 301 from its initial position is continuously acquired by Hall ICs 352-354.

[0179] In this way, in contour measurement, the coordinates of the trajectory of the tip of the stylus 376 along the shape of the workpiece W can be calculated sequentially based on the starting position of the contact probe 301, the amount of movement of the contact probe 301, and the output values ​​continuously acquired by the Hall ICs 352-354 during the movement of the contact probe 301.

[0180] When the tip of the stylus 376 reaches the end position of the contour measurement, in step S47, the contact probe 301 disengages from the workpiece W.

[0181] When aiming to increase the speed of contour measurement, using a marking camera 312 for optical marking detection results in a heavy processing load and potential speed limitations. On the other hand, while Hall effect ICs 352-354 can handle higher speeds in contour measurement, their range of motion is limited, and a single unit cannot cover the movable range of the contact probe 301. Therefore, by obtaining the coordinates of an initial point—the starting position of the contour measurement—through marking camera-based point measurement, and then utilizing the output values ​​of the Hall effect ICs 352-354 during the contour measurement process, the increased speed of contour measurement can be achieved.

[0182] <Flowchart for setting up continuous measurements using a workpiece model generated from CAD>

[0183] The following uses Figures 16 to 23 This section explains the process of setting up measurements and performing continuous measurements using a workpiece model generated by CAD.

[0184] Figure 16 This is a schematic diagram illustrating an example of 3D CAD data for a workpiece model. Figure 16 The 3D CAD data shown has a CAD coordinate system with mutually orthogonal Xc, Yc and Zc axes.

[0185] against Figure 16 The 3D CAD data shown specifies the measurement location, measurement elements, and at least one of the measurement items. This specification, along with the 3D CAD data serving as the shape data of the workpiece model, is saved as a measurement setting file. The measurement setting process ends upon saving the measurement setting file.

[0186] Figure 17 This is a schematic diagram illustrating an example of a measurement setting document. Figure 17The measurement setup file shown includes information related to measurement positions MP1-MP3, measurement element ME1, measurement positions MP4-MP6, measurement element ME2, and measurement item MI1. Measurement element ME1 is a plane containing the upper surface of a cuboid defined by measurement positions MP1-MP3. Measurement element ME2 is a plane containing the upper surface of a cylinder defined by measurement positions MP4-MP6. Measurement item MI1 is the distance between measurement element ME1 and measurement element ME2. Furthermore, the measurement setup file may also include information related to... Figure 18 The information shown pertains to measurement positions MP7-MP11, measurement elements ME3-ME5, and measurement item MI2. Measurement element ME3 is a plane containing the cuboid side surface defined by measurement positions MP7-MP9. Measurement element ME4 is a cylinder containing the cylindrical side surface defined by measurement positions MP10-MP11. Measurement element ME5 is the axis of measurement element ME4, which is a cylinder. Measurement item MI2 is the distance between measurement elements ME3 and ME5.

[0187] After the measurement setup is completed, continuous measurement begins. During continuous measurement, the non-contact optical sensor 31, as shown... Figure 19 As shown, a strip of laser L is irradiated onto the workpiece W placed on the stage, and a non-contact optical sensor 31 receives the reflected light from the measurement space, thereby acquiring contour data. The non-contact optical sensor 31 scans the workpiece W while moving along the X-axis, thereby continuously acquiring contour data. Then, by synthesizing the continuously acquired contour data, a three-dimensional point cloud in the measurement space is obtained.

[0188] Figure 20 This is a schematic diagram showing the acquired three-dimensional point cloud within the measurement space. Figure 20 The 3D point cloud shown lacks data corresponding to the portion of workpiece W where reflected light was not received. Additionally, in Figure 20 The 3D point cloud shown contains unwanted point cloud data corresponding to the portion of the rotating stage 70 that received reflected light. This unwanted point cloud is removed using methods such as utilizing the known distance between the rotating stage 70 and the non-contact optical sensor 31, or using identification markers positioned on the side of the rotating stage 70. Figure 20 When unwanted points are deleted from the 3D point cloud shown, it becomes... Figure 21 The three-dimensional point cloud shown.

[0189] based on Figure 17 The shape data of the workpiece model in the measurement setting file shown and Figure 21 The three-dimensional point cloud shown is as follows: Figure 22As shown, the position and orientation of the workpiece model are made consistent with the position and orientation of the workpiece W, so that the CAD coordinate system is matched with the coordinate system related to the shape of the workpiece W, which is the object of measurement. Figure 22 In the middle, use dashed lines to depict Figure 17 The shape data of the workpiece model in the measurement setting file shown. Additionally, in Figure 22 In it, it also depicts Figure 17 The measurement locations shown are MP1~MP6 and Figure 18 The measurement locations shown are MP7~MP11. Furthermore, in... Figure 22 In this context, the coordinate system related to the shape of the workpiece W, which is the object of measurement, is the device coordinate system, but it can also be converted to the global coordinate system.

[0190] After the CAD coordinate system is matched with the coordinate system related to the shape of the workpiece W being measured, the coordinates of the matched measurement positions MP1~MP6 contained in the measurement setting file (coordinates in the coordinate system related to the shape of the workpiece W being measured) are calculated. Figure 23 The measurement path RT of the contact probe 60 is shown. Furthermore, the posture of the contact probe 60 at each measurement position can be based on a retraction boundary, Figure 21 The three-dimensional point cloud shown Figure 17 The shape data of the workpiece model in the measurement setting file shown can be used to automatically determine the measurement path, or it can be determined based on user instructions received by the user input device. If the measurement setting file contains information related to measurement positions MP7-MP11, the measurement path of the contact probe 60 is calculated based on the matched coordinates (coordinates in a coordinate system related to the shape of the workpiece W being measured) of the measurement positions MP1-MP11 contained in the measurement setting file. In this case, the posture of the contact probe 60 at each measurement position MP7-MP11 is determined using the same method as used to determine the posture of the contact probe 60 at each measurement position MP1-MP6.

[0191] Alternatively, the CAD coordinate system can be mismatched with the coordinate system related to the shape of the workpiece W being measured, and the measurement path RT of the contact probe 60 can be calculated based on the relative relationship between the position and orientation of the workpiece model and the position and orientation of the workpiece W. Furthermore, the measurement position, measurement elements, and measurement items can also be set to relative positional relationships with the shape of the workpiece model in the CAD data. In this case, based on the shape data of the workpiece model in the measurement setting file and the three-dimensional point cloud of the workpiece W, the position and orientation of the workpiece model are matched with the position and orientation of the workpiece W, and the measurement is performed using the contact probe 60 based on this relative positional relationship.

[0192] <Procedure for setting up continuous measurements using measured data>

[0193] The following uses Figures 24-26 This will explain the process of setting up measurements using actual data and then performing continuous measurements.

[0194] Figure 24 This diagram schematically illustrates the setting of the measurement position using the teach pendant 23. The measurement position is determined by bringing the teach pendant 23 into contact with the workpiece W, which is the object of the measurement setting, placed on the stage. The posture of the teach pendant 23 when determining the measurement position is associated with the measurement position and is saved as part of the measurement setting file. The posture of the teach pendant 23 is defined, for example, by two parameters: the B-axis rotation of the contact probe 60 and the A-axis rotation of the contact probe 60.

[0195] Then, the non-contact optical sensor 31 scans the workpiece W, which is the object of the measurement setting, while moving along the X-axis, thereby continuously acquiring contour data. Then, by synthesizing the continuously acquired contour data, a three-dimensional point cloud within the measurement space is acquired. Furthermore, by deleting unwanted point clouds from the three-dimensional point cloud within the measurement space, a three-dimensional point cloud of the workpiece W, which is the object of the measurement setting, is acquired and saved as part of the measurement setting file. Figure 25 This is a diagram illustrating an example of a measurement setting file generated using measurement settings based on measured data. Figure 25 The measurement setup file shown includes information related to measurement positions MP1-MP3, measurement element ME1, measurement positions MP4-MP6, measurement element ME2, and measurement item MI1. Measurement element ME1 is a plane containing the upper surface of a cuboid defined by measurement positions MP1-MP3. Measurement element ME2 is a plane containing the upper surface of a cylinder defined by measurement positions MP4-MP6. Measurement item MI1 is the distance between measurement element ME1 and measurement element ME2. Furthermore, the measurement setup file may also include information related to... Figure 26 The information shown pertains to measurement positions MP7-MP11, measurement elements ME3-ME5, and measurement item MI2. Measurement element ME3 is a plane containing the cuboid side surface defined by measurement positions MP7-MP9. Measurement element ME4 is a cylinder containing the cylindrical side surface defined by measurement positions MP10-MP11. Measurement element ME5 is the axis of measurement element ME4, which is a cylinder. Measurement item MI2 is the distance between measurement elements ME3 and ME5. The measurement setup is complete by saving the measurement setup file.

[0196] Regarding the continuous measurement, except that the coordinate system related to the shape of the workpiece W, which is the object of the measurement setting, is matched with the coordinate system related to the shape of the workpiece W, which is the object of the measurement, and the posture of the contact probe 60 is determined based on the posture of the teaching pen 23 contained in the measurement setting file, the continuous measurement is the same as that performed at the end of the measurement setting using the workpiece model generated by CAD.

[0197] Explanation of reference numerals in the attached figures

[0198] 1: PC

[0199] 2: Mouse

[0200] 3: Communication cable (between the head housing and the PC)

[0201] 4: Communication cable (between remote control and PC)

[0202] 5: Main Body

[0203] 11: Console

[0204] 12: Communication cable (between console and head housing)

[0205] 21: Teaching Camera

[0206] 22: (Lighting section of the teaching camera)

[0207] 23: Demonstration pen

[0208] 24: (of the teaching pen) stylus

[0209] 25: Remote Control

[0210] 26: Trigger Button

[0211] 27: (The optical markings of the teaching pen)

[0212] 31: Non-contact optical sensor

[0213] 32: Laser light-emitting part

[0214] 33: Light-receiving lens

[0215] 34: (Non-contact optical sensor) Camera section

[0216] 50: Head

[0217] 51: X-axis drive direction

[0218] 52: X-axis drive unit

[0219] 53: Y-axis drive direction

[0220] 54: Y-axis drive unit

[0221] 55: Z-axis drive direction

[0222] 56: Z-axis drive unit

[0223] 57: Head shell section

[0224] 57a: Ground contact part

[0225] 57b: Erect part

[0226] 58: θ-axis drive unit

[0227] 60: Contact probe

[0228] 61: B-axis drive direction

[0229] 62: B-axis drive unit

[0230] 63: A-axis drive direction

[0231] 64: A-axis drive unit

[0232] 65: (Contact probe) stylus

[0233] 66: Workpiece Camera

[0234] 67: Fixing part

[0235] 68: Camera for optical mark detection

[0236] 69: Optical Markings

[0237] 6A: Swing support mechanism

[0238] 70: Rotary table

[0239] 71: θ-axis driving direction

[0240] 80: Measurement Button

[0241] 81: Detection button

[0242] 82: Power button

[0243] 100: Coordinate measuring device

[0244] 111: PC Applications

[0245] 112: Measurement and Setting Section

[0246] 113: Continuous Measurement Section

[0247] 114: Communications / Control Department

[0248] 115: Memory

[0249] 121: Main Control Unit

[0250] 122: X-axis encoder section

[0251] 123: θ-axis encoder section

[0252] 124: Ministry of Communications

[0253] 125: (The camera section of the teaching camera)

[0254] 126: (Teaching camera) Communication / Control Unit

[0255] 131: (X-axis drive unit) Communication / control unit

[0256] 141: (Y-axis drive unit) Communication / control unit

[0257] 142: Y-axis encoder section

[0258] 143: Z-axis encoder section

[0259] 144: Contour Calculation Department

[0260] 145: (Communication / Control Unit for Non-Contact Optical Sensors)

[0261] 151: (Z-axis drive unit) Communication / control unit

[0262] 161: (Contact probe) Communication / Control Unit

[0263] 162: B-axis encoder section

[0264] 163: (The camera section that contacts the probe)

[0265] 164: (B-axis drive unit) Communication / control unit

[0266] 165: A-axis encoder section

[0267] 166: (A-axis drive unit) Communication / control unit

[0268] 167: Hall Sensor Section

[0269] 168: (Illumination unit of A-axis drive section)

[0270] 169: (Workpiece camera) Camera section

[0271] 301: Contact probe

[0272] 302: A-axis

[0273] 303: A-axis drive mechanism

[0274] 304: B-axis

[0275] 305: B-axis drive mechanism

[0276] 306: Workpiece Camera

[0277] 307: B-axis drive direction

[0278] 308: A-axis drive direction

[0279] 311: Fixing part

[0280] 312: Camera for optical marker detection

[0281] 321: B-axis drive unit

[0282] 331: A-axis drive unit

[0283] 332: Optical Markings

[0284] 333: Exterior

[0285] 334: A-axis drive shaft

[0286] 351: Outer shell

[0287] 352: Hall effect IC (for X-axis detection)

[0288] 353: Hall effect IC (for Y-axis detection)

[0289] 354: Hall effect IC (for Z-axis detection)

[0290] 361: Inner shell

[0291] 362: XY spring

[0292] 363: Z Spring

[0293] 371: Floating section

[0294] 372: Magnet (for X-direction detection)

[0295] 373: Magnet (for Y-direction detection)

[0296] 374: Magnet (for Z-axis detection)

[0297] 375: XY Spring Fixing Part

[0298] 376: Stimulus

[0299] L: Laser

[0300] ME1~ME5: Measurement Elements

[0301] MI1, MI2: Measurement items

[0302] MP1~MP11: Measurement location

[0303] RT: Measurement Path

[0304] W: Workpiece

Claims

1. A coordinate measuring device, comprising: Multi-axis translation mechanism; The contact probe has a 2-axis rotation mechanism connected to the multi-axis translation mechanism, which can move along each axis of the multi-axis translation mechanism in the measurement space and can change its posture. The first detection device detects the position of each axis of the multi-axis translation mechanism; The second detection device has a mark built into one end of the 2-axis rotating mechanism and a camera built into the other end of the 2-axis rotating mechanism to capture images of the mark. The second detection device detects the position and posture of the contact probe based on the image pattern of the mark. The memory stores measurement settings, wherein the measurement settings include a measurement position for determining the measurement element for the shape of the workpiece being measured, the posture of the contact probe relative to the measurement position, and the measurement items using the measurement element. When the measurement control unit receives a measurement instruction, it moves the contact probe to the measurement position by means of the multi-axis translation mechanism according to the measurement settings stored in the memory, and controls the posture of the contact probe relative to the measurement position by means of the 2-axis rotation mechanism. The measuring unit performs measurements based on the measuring position determined by the contact probe based on the detection results of the first and second detection devices, and the measuring items using the measuring elements.

2. The coordinate measuring device according to claim 1, wherein, The contact probe has: an A-axis drive unit that supports the stylus in a manner that allows it to rotate freely along the A-axis drive direction; The B-axis drive unit supports the A-axis drive unit in such a way that it can rotate freely along the B-axis drive direction; And a fixing part, which is disposed between the multi-axis translation mechanism and the B-axis drive part. The mark is set on the A-axis drive unit, and the camera device is set on the fixed unit.

3. The coordinate measuring device according to claim 2, wherein, The stylus and the mark are rigidly joined together or integrally formed as floating parts supported by the A-axis drive in a swinging manner.

4. The coordinate measuring device according to claim 3, wherein, The stylus is supported to rotate freely between a first rotational position with its front end pointing vertically downward and a second rotational position with its front end pointing horizontally. The mark has a 45-degree angle relative to the optical axis of the camera device when the stylus is in the first rotational position.

5. The coordinate measuring device according to claim 1, wherein, The detection timing of the first detection device and the second detection device is controlled synchronously.

6. The coordinate measuring device according to claim 5, wherein, It also features a Hall sensor to detect the contact between the contact probe and the workpiece. The detection timing of the first detection device and the second detection device is synchronously controlled by triggering the output signal of the Hall sensor.

7. The coordinate measuring device according to claim 1, further comprising: A marking probe, which is equipped with optical markings and is disposed separately from the contact probe; An optical measuring device that photographs the optical mark and determines the position and orientation of the mark probe; and The measurement setting unit, when performing measurement settings including the measurement position for determining the measurement element for the shape of the workpiece to be measured, the posture of the contact probe relative to the measurement position, and the measurement item using the measurement element, sets the measurement position for determining the measurement element for the shape of the workpiece to be measured, and the posture of the contact probe relative to the measurement position, based on each measurement position indicated by the marker probe determined by the optical measurement device and the posture of the marker probe at each measurement position.

8. The coordinate measuring device according to claim 1, wherein, It also features a non-contact optical sensor that acquires map data within the measurement space. The measurement settings include reference data, which contains information related to the shape of the workpiece being measured. The measuring unit performs positional alignment to match the coordinate system associated with the map data acquired by the non-contact optical sensor with the coordinate system associated with the reference data included in the measuring settings.

9. The coordinate measuring device according to claim 1, wherein, The measuring unit calculates a first measuring element and a second measuring element based on the measuring position measured by the contact probe, and measures the dimension between the first measuring element and the second measuring element based on the measuring item.

10. The coordinate measuring device according to claim 1, wherein, It also features a Hall sensor that detects the displacement of the stylus in the contact probe. In contour mapping, the contact probe is moved while maintaining contact between the stylus and the workpiece from the starting position to the ending position to continuously acquire three-dimensional coordinates along the shape of the workpiece. The coordinates of the starting point are calculated based on the detection results of the second detection device. The coordinates after the starting position are calculated sequentially based on the starting position, the amount of movement of the contact probe, and the output values ​​continuously acquired by the Hall sensor during the movement of the contact probe.

Images