Coordinate measuring apparatus

Abstract

An operation for teaching a measurement setting and a positional relationship with a workpiece as a measurement target is not required. A coordinate measurement device is provided with a 3-axis translation mechanism, a contact probe, a non-contact optical sensor, a memory, a coordinate system matching section, a measurement control section, and a measurement section. The contact probe is movable within a measurement space along each axis of the 3-axis translation mechanism. The non-contact optical sensor is a sensor for acquiring measurement data within the measurement space using light. The memory stores a measurement setting. The coordinate system matching section matches a coordinate system related to the measurement data with a coordinate system related to the shape of the workpiece as the measurement target based on the measurement data and the shape of the workpiece as the measurement target. The measurement control section, upon receiving a measurement instruction, performs movement control of the contact probe based on the coordinate system matched by the coordinate system matching section in accordance with the measurement setting, so as to move the contact probe to a measurement position. The measurement section performs measurement based on the measurement position measured by the contact probe and a measurement item using a measurement element.

Description

Technical Field

[0001] This invention relates to a coordinate measuring device. Background Technology

[0002] Coordinate measuring devices that measure the dimensions, positional relationships, contour shapes, and geometric tolerances of a workpiece with high precision by placing a contact probe against any measurement position on the workpiece to be measured and obtaining the coordinates of that measurement position have been put into practical use (for example, see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2004-93190 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] However, in conventional coordinate measuring devices, the workpiece to be measured is basically placed at a position consistent with the measurement setting. When the workpiece to be measured is not placed at a position consistent with the measurement setting, the operator needs to perform an operation to teach the positional relationship between the measurement setting and the workpiece to be measured.

[0008] In view of the above-mentioned problems, the present invention aims to provide a coordinate measuring device that eliminates the need for teaching the positional relationship between the measuring setting and the workpiece, even when the workpiece being measured is not placed at a position consistent with the measuring setting.

[0009] Solution for solving the problem

[0010] For example, the coordinate measuring device according to the present invention includes: a 3-axis translation mechanism; a contact probe connected to the 3-axis translation mechanism and capable of moving along each axis of the 3-axis translation mechanism within a measuring space; a non-contact optical sensor for acquiring measuring data within the measuring space using light; a memory for storing measuring settings, the measuring settings including measuring positions for determining measuring elements based on the shape of the workpiece being measured, and measuring items using the measuring elements; a coordinate system matching unit for matching a coordinate system related to the measuring data with a coordinate system related to the shape of the workpiece being measured based on the measuring data and the shape of the workpiece being measured; a measuring control unit for controlling the movement of the contact probe via the 3-axis translation mechanism, based on the measuring settings stored in the memory and the coordinate system matched by the coordinate system matching unit, when a measuring instruction is received, so that the contact probe moves to the measuring position; and a measuring unit for performing a measurement based on the measuring position measured by the contact probe and the measuring items using the measuring elements.

[0011] Furthermore, other features, elements, steps, advantages, and characteristics become clearer through the following detailed description and the accompanying drawings.

[0012] The effects of the invention

[0013] According to the present invention, a coordinate measuring device can be provided that, even when the workpiece to be measured is not placed at a position consistent with the measuring setting, it is not necessary to perform an operation to teach the positional relationship between the measuring setting and the workpiece to be measured. Attached Figure Description

[0014] Figure 1 This is a diagram showing the overall structure of the coordinate measuring device.

[0015] Figure 2A This is a diagram illustrating a structural example of a non-contact optical sensor.

[0016] Figure 2B This is a diagram illustrating the principle of triangulation.

[0017] Figure 2C This is a diagram illustrating the method for detecting peak positions.

[0018] Figure 3 This is a diagram showing the system structure of the coordinate measuring device.

[0019] Figure 4 This is a flowchart illustrating an example of a measurement setup.

[0020] Figure 5 This is a flowchart illustrating an example of continuous measurement.

[0021] Figure 6 This is a schematic diagram illustrating an example of 3D CAD data for a workpiece model.

[0022] Figure 7 This is a schematic diagram illustrating an example of a measurement setting document.

[0023] Figure 8 This is a schematic diagram illustrating another example of a measurement setting document.

[0024] Figure 9 This diagram schematically illustrates the situation where a non-contact optical sensor irradiates a workpiece with a strip of laser L.

[0025] Figure 10 This is a schematic diagram showing the obtained three-dimensional point cloud in the measurement space.

[0026] Figure 11 This is a schematic diagram showing the three-dimensional point cloud in the measurement space after unwanted point clouds have been removed.

[0027] Figure 12 It is a diagram schematically showing the matching of the CAD coordinate system with the coordinate system related to the shape of the workpiece W, which is the object of measurement.

[0028] Figure 13 This is a schematic diagram illustrating the measurement path of the contact probe.

[0029] Figure 14 This diagram schematically illustrates the process of setting the measurement position using a teaching pen.

[0030] Figure 15 This is a diagram illustrating an example of a measurement setting file generated using measurement settings based on measured data.

[0031] Figure 16 This is a diagram illustrating another example of a measurement setting file generated using measurement settings based on measured data.

[0032] Figure 17 This is a diagram showing the pattern classification of the measurement setup and continuous measurement process.

[0033] Figure 18 This is a schematic diagram illustrating the tree structure of the measurement settings file.

[0034] Figure 19 This is a diagram illustrating an example of the tree structure of the measurement settings file for Mode A.

[0035] Figure 20 This is a diagram illustrating an example of the tree structure of the measurement settings file for Mode B.

[0036] Figure 21 This is a diagram illustrating an example of the tree structure of the measurement settings file for Mode C.

[0037] Figure 22 This is a diagram illustrating an example of the tree structure of the measurement settings file for Mode D.

[0038] Figure 23 This is a diagram that schematically illustrates an example of a measurement setting file for Mode B.

[0039] Figure 24 This is a diagram illustrating an example of the measurement settings file for Mode C.

[0040] Figure 25 This is a flowchart illustrating an example of a measurement setup.

[0041] Figure 26 This is a flowchart illustrating an example of continuous measurement in a scenario where measurement setting files created in modes A to D can be automatically read.

[0042] Figure 27 This is a flowchart illustrating an example of continuous measurement when it is possible to select measurement setting files created in modes A to D. Detailed Implementation

[0043] <Coordinate measuring device (overall structure)>

[0044] Figure 1 This is a diagram showing the overall structure of the coordinate measuring device 100. The coordinate measuring device 100 measures the dimensions, positional relationships, contour shape, and geometric tolerances of the workpiece W with high precision by placing a contact probe against any measurement position on the workpiece W to be measured and acquiring the three-dimensional coordinates of that measurement position. In addition to recording the measurement data of the workpiece W, the coordinate measuring device 100 can also calculate various values ​​through various operations. As described in this figure, the coordinate measuring device 100 includes a PC (Personal Computer) 1 and a main body 5.

[0045] PC1 can be understood as the control unit of the coordinate measuring device 100. PC1 can be either a laptop or a desktop. PC1 can also be connected to a mouse 2 as a user input device. The user input device can also be a keyboard, touchpad, touch panel, or stylus, etc.

[0046] The main body 5 comprises a head housing 57, a head 50, a contact probe 60, a non-contact optical sensor 31, a teaching pen 23, a teaching camera 21, a turntable 70, a control console 11, and a remote control 25 as its main components.

[0047] The head housing 57 is a base that supports the head 50, the teaching camera 21, and the rotary table 70. For example, the head housing 57 has a ground contact portion 57a ​​and an upright portion 57b. The ground contact portion 57a ​​can be understood as a base plate that supports the rotary table 70 from below, i.e., a pedestal. The upright portion 57b can be understood as a column that stands upright from the ground contact portion 57a ​​and supports the head 50 and the teaching camera 21 respectively. The PC1 can be connected to the head housing 57 via a communication cable 3. A measurement button 80, a detection button 81, and a power button 82 may also be provided on the front part of the ground contact portion 57a. The measurement button 80 is a dedicated button for receiving measurement instructions, and may also be a button that is not assigned any function other than receiving measurement instructions.

[0048] When the measurement button 80 is pressed, a scan is performed by the non-contact optical sensor 31 to detect the position and orientation of the workpiece and determine the measurement position for the workpiece. If the measurement button 80 is pressed after a scan has been performed and the position and orientation of the workpiece have been detected, the scan can be skipped, and the measurement performed by the contact probe 60 based on the measurement position for the workpiece can proceed. When the detection button 81 is pressed, a scan is performed by the non-contact optical sensor 31, and the corresponding workpiece setting file is selected from multiple pre-registered setting files based on a comparison with the acquired map data (described later). The measurement position can be defined as the position where the contact probe 60 contacts the workpiece W. When the power button 82 is pressed, the main body 5 is switched on / off.

[0049] The head 50 can be understood as a three-axis translation mechanism that moves the contact probe 60 along the X-axis drive direction 51, the Y-axis drive direction 53, and the Z-axis drive direction 55. When described according to this figure, the head 50 includes an X-axis drive unit 52, a Y-axis drive unit 54, and a Z-axis drive unit 56.

[0050] The X-axis drive unit 52 is disposed at the upper end of the head housing portion 57, particularly the upright portion 57b. The X-axis drive unit 52 cantilever supports the Y-axis drive unit 54 in a manner that allows it to move freely along the X-axis drive direction 51. The X-axis drive unit 52 can be understood as a so-called translation beam. The Y-axis drive unit 54 supports the Z-axis drive unit 56 in a manner that allows it to move freely along the Y-axis drive direction 53. The Y-axis drive unit 54 can be understood as a so-called translational body. The Z-axis drive unit 56 supports the contact probe 60 in a manner that allows it to move freely along the Z-axis drive direction 55. The Z-axis drive unit 56 can be understood as a so-called translational rod.

[0051] The contact probe 60 can be understood as a contact element that contacts the workpiece W, i.e., a touch probe. The contact probe 60 can move within the measurement space along each drive axis of the head 50, specifically along the X-axis, Y-axis, and Z-axis. The measurement space can be understood as the space within which the contact probe 60 can move and perform measurements via the head 50. That is, the measurement space can also be understood as the range of movement of the contact probe 60. Furthermore, the contact probe 60 has a two-axis rotation mechanism connected to the head 50, and its posture when in contact with the workpiece W can be changed. As described in this figure, the contact probe 60 includes a B-axis drive unit 62, an A-axis drive unit 64, a stylus 65, and a workpiece camera 66.

[0052] The B-axis drive unit 62 is supported at the lower end of the Z-axis drive unit 56. The B-axis drive unit 62 supports the A-axis drive unit 64 in a manner that allows it to rotate freely along the B-axis drive direction 61. The B-axis drive direction 61 can be understood as a circumferential direction with the B-axis as the central axis. The B-axis can also be an axis parallel to the Z-axis. The A-axis drive unit 64 is supported by the B-axis drive unit 62. The A-axis drive unit 64 can also be understood as a component of the B-axis drive unit 62. The A-axis drive unit 64 supports the stylus 65 and the workpiece camera 66 in a manner that allows them to rotate freely along the A-axis drive direction 63. The A-axis drive direction 63 can be understood as a circumferential direction with the A-axis as the central axis. The A-axis can also be an axis on the XY plane that is uniquely determined by the displacement (height) of the Z-axis drive unit 56 and uniquely determined by the displacement (rotation angle) of the B-axis drive unit 62.

[0053] Furthermore, the B-axis drive unit 62 and the A-axis drive unit 64 can be understood as a 2-axis rotation mechanism connected to the head 50. The 2-axis rotation mechanism can change the posture of the contact probe 60, specifically, it can change the posture of the stylus 65 and the workpiece camera 66.

[0054] That is, in the coordinate measuring device 100 of this embodiment, the position of the contact probe 60 is determined by a 3-axis translation mechanism, and the posture of the contact probe 60 is determined by a 2-axis rotation mechanism. Furthermore, the posture of the contact probe 60 can also be understood as the angle of the stylus 65 determined by the 2-axis rotation mechanism, in other words, as the extension direction of the stylus 65.

[0055] In this way, the contact probe 60 employs a structure that allows the stylus 65 to rotate freely via a two-axis rotation mechanism, a so-called free-angle structure. Therefore, unlike conventional structures that only allow discrete angle adjustments, the angle of the stylus 65 can be continuously and steplessly adjusted. Furthermore, unlike conventional structures, with the free-angle structure, calibration is not required for each discrete angle adjustment.

[0056] The stylus 65 is a needle-shaped member supported on the A-axis drive unit 64. The front end of the stylus 65 may, for example, be machined into a spherical shape. In this case, the action of "making the contact probe 60 contact the workpiece W" can be understood as the action of "making the ball provided at the front end of the stylus 65 contact the workpiece W".

[0057] The workpiece camera 66 is a camera device supported on the A-axis drive unit 64. The workpiece camera 66 can also be understood as a component of the A-axis drive unit 64. The workpiece camera 66 is capable of capturing images of the rotary table 70 and the workpiece W placed on the rotary table 70 in an orientation determined by the 2-axis rotation mechanism.

[0058] The non-contact optical sensor 31 is a sensor that acquires three-dimensional point clouds, or so-called map data, within the measurement space. The non-contact optical sensor 31 can also be composed of a profilometer, a 2D camera, or both. As shown in this figure, the non-contact optical sensor 31 can also be mounted on the Y-axis drive unit 54. In this case, the non-contact optical sensor 31 can move arbitrarily within the measurement space along the X-axis and Y-axis. For example, by scanning while moving the non-contact optical sensor 31 along the X-axis drive direction 51, a three-dimensional point cloud within the measurement space can be acquired. The non-contact optical sensor 31 can also be understood as a component of the Y-axis drive unit 54. The structure and measurement principle of the non-contact optical sensor 31 will be described later.

[0059] The teaching pen 23 is one of the instruments used by the user during direct teaching of the measured position. The teaching pen 23 can be understood as a marker probe separately from the contact probe 60. The teaching pen 23 includes, for example, a stylus 24 and multiple optical markers 27.

[0060] The stylus 24 is a needle-shaped member supported at the front end of the teach pen 23. The front end of the stylus 24 can, for example, be machined into a spherical shape. In this case, the action of "making the teach pen 23 contact the workpiece W" can be understood as the action of "making the ball provided at the front end of the stylus 24 contact the workpiece W." Multiple optical marks 27 are provided at different locations on the teach pen 23. The multiple optical marks 27 can also be self-emissive elements that emit infrared or visible light. In the case of self-emissive elements, the luminous intensity of each of the multiple optical marks 27 is greater than that of the reflective type described later. Therefore, the teach pendant camera 21 can easily detect (capture) the multiple optical marks 27. Thus, the self-emissive type is effective in terms of good detection accuracy of the teach pen 23. Alternatively, the multiple optical marks 27 can also be reflective elements that reflect light emitted from the illumination unit 22. In this case, for example, a retroreflective sheet can be embedded inside the optical mark 27. In the case of reflective elements, it is not necessary to mount circuitry and electrical systems on the teach pen 23. Therefore, the teaching pen 23 can be made compact. In addition, since it does not require batteries, it is also effective in avoiding the inconvenience of charging or replacing batteries.

[0061] The teaching camera 21 can be understood as an optical measuring device that captures images of multiple optical marks 27 set on the teaching pen 23 and determines the position and orientation of the teaching pen 23. The teaching camera 21 may, for example, be supported near the upper end of the head housing 57, particularly the upright portion 57b, in an orientation that includes the entire measuring space in the coordinate measuring device 100 within the camera's field of view. The teaching camera 21 may also include an illumination unit 22 for illuminating the camera's field of view. The teaching camera 21 may also be provided separately from the non-contact optical sensor 31 and the workpiece camera 66. The teaching camera 21 can also be understood as one of the constituent elements of the head housing 57.

[0062] The rotary table 70 includes a disk-shaped stage for placing the workpiece W, and an θ-axis drive mechanism for rotating the stage along the θ-axis drive direction 71. The θ-axis drive direction 71 can be understood as a circumferential direction with the θ-axis as the central axis. The θ-axis can also be an axis parallel to the Z-axis.

[0063] Even if the measurement position on the workpiece W is outside the measurement space, the rotary table 70 can rotate and move the workpiece W about the θ axis in such a way that the measurement position is brought into the measurement space. That is, the measurement space in which the contact probe 60 can move is different from the actual measurable range including the rotary table 70. Furthermore, when the rotary table 70 is driven along the θ axis, the three-dimensional coordinates in the device coordinate system in the measurement space can also be converted into three-dimensional coordinates in a virtual global coordinate system by taking into account the displacement (rotation angle) of the rotary table 70 in the θ-axis driving direction 71.

[0064] The control console 11 can be understood as a user input device that accepts manual operations on the head 50 and the contact probe 60. For example, the control console 11 may also be provided with multiple joysticks that accept manual operations on each of the six axes (X-axis, Y-axis, Z-axis, A-axis, B-axis, and θ-axis). In addition, the control console 11 may also be provided with at least one of the aforementioned measurement button 80, detection button 81, and power button 82. The head housing 57 and the control console 11 can be connected via a communication cable 12.

[0065] The remote controller 25 is one of the user input devices used for direct teaching of the measurement position. The remote controller 25 may also be equipped with a trigger button 26 that accepts decision operations regarding the measurement position made via the teaching pen 23. Additionally, the remote controller 25 may also be equipped with at least one of the aforementioned measurement button 80, detection button 81, and power button 82. The PC1 and the remote controller 25 can be connected via a communication cable 4.

[0066] <Non-contact optical sensors>

[0067] Figure 2A This is a diagram illustrating a structural example of a non-contact optical sensor 31. The non-contact optical sensor 31 of this structural example can be understood as a profilometer. As described in this figure, the non-contact optical sensor 31 includes a laser emitter 32, a light-receiving lens 33, and an image sensor 34.

[0068] The laser emitting unit 32 irradiates a strip of laser light L onto the surface of the workpiece W, which is the object of measurement. The laser emitting unit 32 may also include a Powell lens as a unit for extending the laser L into a strip shape. Using a Powell lens is effective in ensuring uniform extension of the incident laser light. Alternatively, the laser emitting unit 32 may include a cylindrical lens as a unit for extending the laser L into a strip shape. Using a cylindrical lens is effective in reducing aberrations caused by the light wavelength. As described in this figure, the laser L extends into a strip shape with the Y-axis driving direction 53 as its long side. The light-receiving lens 33 images the light diffusely reflected from the surface of the workpiece W onto the imaging surface of the imaging unit 34. The larger the aperture of the light-receiving lens 33, the greater the amount of light received in the imaging unit 34. The imaging unit 34 generates imaging data corresponding to the image on the imaging surface. Through imaging, the cross-sectional shape, or so-called profile, of the workpiece W is obtained based on the principle of triangulation.

[0069] For example, during the measurement setup and continuous measurement described later, the non-contact optical sensor 31 moves along the X-axis driving direction 51, that is, in the direction intersecting the long side of the laser L which extends into a strip, while sequentially generating image data. Through scanning in this manner, the contours of each cross-section of the workpiece W are sequentially acquired along the moving direction of the non-contact optical sensor 31. By synthesizing this sequentially acquired contour data by the continuous measurement unit 113 described later, a three-dimensional point cloud corresponding to the position and shape of the workpiece W can be obtained. Furthermore, the three-dimensional point cloud generated by scanning using the non-contact optical sensor 31 can also be understood as the aforementioned map data.

[0070] Figure 2B This is a diagram illustrating the principle of triangulation. For example... Figure 2B As shown, the light-receiving axis of the imaging unit 34 is tilted at an angle θ1 relative to the light-projecting axis of the laser-emitting unit 32. Therefore, the reflected light RL from height Z0 is imaged at position V0 in the V direction of the imaging unit 34, the reflected light RL from height Z1 is imaged at position V1 in the V direction of the imaging unit 34, and the reflected light RL from height Z2 is imaged at position V2 in the V direction of the imaging unit 34. That is, the V direction of the imaging unit 34 corresponds to the Z-axis driving direction. The U direction of the imaging unit 34 is not shown, but it corresponds to the Y-axis driving direction. In other words, the vertical direction of the image output by the imaging unit 34 is the V direction, and the horizontal direction is the U direction.

[0071] Furthermore, the positional relationship between the laser emitting part 32, the light receiving lens 33, and the imaging part 34 can also be related to... Figure 2B The positional relationships shown are reversed.

[0072] Figure 2C This diagram illustrates a method for calculating the height of a contour based on the image I1, which is the result of light reception output from the camera unit 34. The strip-shaped laser L has a certain width in the X-axis driving direction. Therefore, the width of the light spot generated by the reflected light RL on the light-receiving surface of the camera unit 34 also becomes the width spanning multiple photoelectric conversion elements.

[0073] Therefore, the non-contact optical sensor 31 calculates an approximate curve P1 representing the change in brightness value based on the brightness value of each pixel, and calculates the position of the peak value in the V direction within the approximate curve P1. Figure 2CIn the diagram, the leftmost column is the column of interest, illustrating the distribution of brightness values ​​(approximate curve P1). The approximate curve P1 is obtained by curve fitting to multiple sampled values. Sampled values ​​below the detection threshold are not considered. The position in the V direction where this peak occurs represents the height of the workpiece W. The non-contact optical sensor 31 calculates the approximate curve P1 for each position (each pixel column) in the U direction, and calculates the position (height) in the V direction where the peak occurs based on the approximate curve P1. By performing this calculation at each position in the U direction, a contour is obtained. This calculation process can also be referred to as sub-pixel processing.

[0074] <Coordinate Measuring Device (System Structure)>

[0075] Figure 3 This is a diagram showing the system structure of the coordinate measuring device 100. In this diagram, the main components of the coordinate measuring device 100 are depicted as follows: PC1, mouse 2, console 11, teaching pen 23, remote control 25, head housing 57, X-axis drive unit 52, Y-axis drive unit 54, Z-axis drive unit 56, θ-axis drive unit 58, and contact probe 60. The components that appear are labeled with [reference to other components]. Figure 1 , Figure 2A and Figure 2B Same reference numerals as shown in the attached figures.

[0076] PC1 executes PC application 111 via a CPU (not shown) to function as, for example, a measurement setting unit 112, a continuous measurement unit 113, and a communication / control unit 114. PC1 also includes memory 115 for storing PC application 111 and setting files. Memory 115 can be an HDD (Hard Disk Drive), SSD (Solid State Drive), or cloud storage device, etc.

[0077] The measurement setting unit 112 performs measurement settings for the workpiece W. The measurement settings may include, for example, the measurement position required to determine the measurement elements and measurement items for the shape of the workpiece W, which is the object of measurement; the posture of the contact probe 60 relative to the measurement position; and the measurement items using the measurement elements. In other words, the measurement settings can be understood as a general term for settings related to the measurement of the workpiece W. The content of the measurement settings may also be stored as a measurement setting file in the memory 115.

[0078] The shape of workpiece W can be defined as information related to the shape of workpiece W contained in the three-dimensional data included in the measurement setting file. When the three-dimensional data is a workpiece model generated by CAD (Computer-Aided Design), the outline, position, and orientation of the workpiece model in the CAD coordinate system are included in the information related to the shape of workpiece W. Alternatively, when the three-dimensional data is pre-measured data, the outline, position, and orientation of workpiece W in the global coordinate system or device coordinate system obtained through pre-measurement are included in the information related to the shape of workpiece W. Basic measurement elements can include geometric shapes such as planes, lines, points, circles, cylinders, cones, or spheres. Measurement items can include the dimensions of each measurement element, such as distances or angles between measurement elements. Furthermore, the measurement position and orientation measured by the contact probe 60, the measurement elements formed through each measurement, and the measurement items using the measurement elements can also be registered in the measurement setting file.

[0079] In particular, the measurement setting unit 112 can arbitrarily and easily set the measurement position where the contact probe 60 contacts the workpiece W, the posture of the contact probe 60 at the measurement position, and the measurement path of the contact probe 60 to the measurement position by direct teaching through the teaching pen 23 and the remote controller 25. The measurement setting of the workpiece W will be described in detail later.

[0080] The continuous measurement unit 113 performs continuous measurement of the workpiece W based on the measurement position measured by the contact probe 60 and the measurement items using the measurement elements. For example, the continuous measurement unit 113 calculates a first measurement element and a second measurement element based on the measurement position measured by the contact probe 60, and measures the dimension between the first measurement element and the second measurement element based on the measurement items. The continuous measurement of the workpiece W will be described in detail later. The measurement position and measurement elements can also be determined based on the aforementioned measurement setting file. In addition, the continuous measurement unit 113 generates a three-dimensional point cloud corresponding to the position and shape of the workpiece W by synthesizing the contour data sequentially acquired by the non-contact optical sensor.

[0081] The communication / control unit 114 controls the communication between PC1 and head housing 57, and the communication between PC1 and remote controller 25.

[0082] The head housing 57 includes a main control unit 121, an X-axis encoder unit 122, a θ-axis encoder unit 123, and a teaching camera 21.

[0083] The main control unit 121 controls the head housing 57, X-axis drive unit 52, Y-axis drive unit 54, Z-axis drive unit 56, θ-axis drive unit 58, and contact probe 60 according to instructions from users received by PC1 or console 11.

[0084] For example, the main control unit 121 functions as a measurement control unit that, upon receiving a measurement instruction, performs movement and posture control of the contact probe 60 according to a measurement setting file stored in the memory 115. As described with reference to this figure, the main control unit 121 controls the movement of the contact probe 60 using the X-axis drive unit 52, Y-axis drive unit 54, and Z-axis drive unit 56, which are equivalent to a 3-axis translation mechanism, to move the contact probe 60 to the measurement position. Furthermore, the main control unit 121 performs posture control of the contact probe 60 relative to this measurement position using the B-axis drive unit 62 and A-axis drive unit 64, which are equivalent to a 2-axis rotation mechanism. Moreover, the aforementioned measurement instruction can be defined as a trigger command for reading the measurement setting file and initiating the measurement of the workpiece W.

[0085] The main control unit 121 includes a communication unit 124. The communication unit 124 communicates with the console 11, the teaching camera 21, the X-axis drive unit 52, the θ-axis drive unit 58, the X-axis encoder unit 122, and the θ-axis encoder unit 123.

[0086] The X-axis encoder unit 122 obtains the displacement of the X-axis drive unit 52 in the X-axis drive direction 51, i.e., the X coordinate of the contact probe 60 in the device coordinate system, by reading the linear scale of the X-axis drive unit 52. The θ-axis encoder unit 123 obtains the displacement (rotation angle) of the rotary table 70 in the θ-axis drive direction 71 by reading the rotation scale of the θ-axis drive unit 58.

[0087] In addition to the aforementioned illumination unit 22, the teaching camera 21 also includes an image capture unit 125 and a communication / control unit 126. The image capture unit 125 captures images of the plurality of optical marks 27 disposed on the teaching pen 23. The communication / control unit 126 controls the communication between the teaching camera 21 and the main control unit 121.

[0088] The X-axis drive unit 52 includes a communication / control unit 131. The communication / control unit 131 controls the communication between the X-axis drive unit 52 and the head housing unit 57, and the communication between the X-axis drive unit 52 and the Y-axis drive unit 54.

[0089] The Y-axis drive unit 54 includes a communication / control unit 141, a Y-axis encoder unit 142, a Z-axis encoder unit 143, and a non-contact optical sensor 31. The communication / control unit 141 controls the communication between the Y-axis drive unit 54 and the X-axis drive unit 42, and the communication between the Y-axis drive unit 54 and the Z-axis drive unit 56. Furthermore, the communication / control unit 141 also communicates with the Y-axis encoder unit 142, the Z-axis encoder unit 143, and the non-contact optical sensor 31.

[0090] The Y-axis encoder unit 142 obtains the displacement of the Y-axis drive unit 54 in the Y-axis drive direction 53, i.e., the Y coordinate of the contact probe 60 in the device coordinate system, by reading the linear scale of the Y-axis drive unit 54. The Z-axis encoder unit 143 obtains the displacement of the Z-axis drive unit 56 in the Z-axis drive direction 55, i.e., the Z coordinate of the contact probe 60 in the device coordinate system, by reading the linear scale of the Z-axis drive unit 56.

[0091] In addition to the aforementioned laser emitting unit 32 and imaging unit 34, the non-contact optical sensor 31 also includes a contour calculation unit 144 and a communication / control unit 145. The contour calculation unit 144 calculates the cross-sectional shape, or contour, of the workpiece W based on the imaging data sequentially acquired by the imaging unit 34. The continuous measurement unit 113 generates three-dimensional data based on this contour data. This structure reduces the computational load on the contour calculation unit 144 of the non-contact optical sensor 31. Furthermore, the contour calculation unit 144 can also generate a three-dimensional point cloud based on the contour data. The communication / control unit 145 controls the communication between the non-contact optical sensor 31 and the communication / control unit 145.

[0092] The Z-axis drive unit 56 includes a communication / control unit 151. The communication / control unit 151 controls the communication between the Z-axis drive unit 56 and the Y-axis drive unit 54, and the communication between the Z-axis drive unit 56 and the contact probe 60.

[0093] The contact probe 60 includes a communication / control unit 161, a B-axis encoder unit 162, a camera unit 163, and a B-axis drive unit 62. The communication / control unit 161 controls communication between the contact probe 60 and the Z-axis drive unit 56. Furthermore, the communication / control unit 161 also communicates with the B-axis encoder unit 162, the camera unit 163, and the B-axis drive unit 62. The B-axis encoder unit 162 obtains the displacement (rotation angle) of the B-axis drive unit 62 in the B-axis drive direction 61 by reading the rotation scale of the B-axis drive unit 62. The camera unit 163 captures an image of an optical mark (not shown) provided on the A-axis drive unit 64. Based on the captured image pattern of the optical mark, the position and orientation of the A-axis drive unit 64 with the optical mark attached can be detected, thereby detecting the position and orientation of the stylus 65 supported on the A-axis drive unit 64.

[0094] The B-axis drive unit 62 includes a communication / control unit 164 and an A-axis encoder unit 165. The communication / control unit 164 communicates with the communication / control unit 161 of the contact probe 60. Additionally, the communication / control unit 164 also communicates with the A-axis encoder unit 165 and the A-axis drive unit 64. The A-axis encoder unit 165 obtains the displacement (rotation angle) of the A-axis drive unit 64 in the A-axis drive direction 63 by reading the rotation scale of the A-axis drive unit 64.

[0095] In addition to the aforementioned workpiece camera 66, the A-axis drive unit 64 also includes a communication / control unit 166, a Hall sensor unit 167, and an illumination unit 168. The communication / control unit 166 communicates with the communication / control unit 164 of the B-axis drive unit 62. Furthermore, the communication / control unit 166 also communicates with the Hall sensor unit 167, the illumination unit 168, and the workpiece camera 66. The Hall sensor unit 167 generates a detection signal corresponding to the displacement of the stylus 65 relative to the A-axis drive unit 64. The illumination unit 168 illuminates an optical mark (not shown) provided on the A-axis drive unit 64 from the back.

[0096] The workpiece camera 66 includes a camera unit 169. The camera unit 169 may also include photoelectric conversion elements such as a CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor.

[0097] <System Actions>

[0098] Next, while referring to Figure 3 A brief explanation of the system operation of the coordinate measuring device 100 is given.

[0099] For example, during direct teaching of the measurement position, a decision operation for the measurement position is performed using the teaching pen 23 and the remote control 25. More specifically, with the stylus 24 of the teaching pen 23 in contact with the measurement position of the workpiece W, the trigger button 26 of the remote control 25 is pressed. At this time, the camera command is transmitted through the signal path from the remote control 25 via the communication / control unit 114 of the PC1 and the communication unit 124 of the main control unit 121 to the communication / control unit 126 of the teaching camera 21.

[0100] The teaching camera 21 receives the recording command and controls the illumination unit 22 and the camera unit 125 to record images of multiple optical marks 27 set on the teaching pen 23. The recording data acquired by the camera unit 125 is transmitted through a signal path from the camera unit 125 via the communication / control unit 126 of the teaching camera 21 and the communication unit 124 of the main control unit 121 to the communication / control unit 114 of the PC1. The PC1 analyzes the recording data to determine the measurement position indicated by the teaching pen 23.

[0101] Additionally, for example, when scanning using the non-contact optical sensor 31, the scanning command is transmitted via a signal path from the communication / control unit 114 of PC1 through the communication unit 124 of the main control unit 121, the communication / control unit 131 of the X-axis drive unit 52, and the communication / control unit 141 of the Y-axis drive unit 54 to the communication / control unit 145 of the non-contact optical sensor 31.

[0102] The non-contact optical sensor 31 receives the scanning command and controls the laser emitting unit 32 to irradiate a strip of laser L toward the surface of the workpiece W, which is the object of measurement. At this time, the imaging unit 34 receives the reflected light from the workpiece W and generates imaging data corresponding to the image on the imaging surface. In addition, the X-axis drive unit 52 receives the scanning command and moves the non-contact optical sensor 31 along the X-axis drive direction 51.

[0103] By scanning in this way, a contour corresponding to the position and shape of the workpiece W can be acquired in the contour calculation unit 144. This contour is transmitted through a signal path from the communication / control unit 145 of the non-contact optical sensor 31, via the communication / control unit 141 of the Y-axis drive unit 54, the communication / control unit 131 of the X-axis drive unit 52, and the communication unit 124 of the main control unit 121, to the communication / control unit 114 of the PC1. The PC1 detects the position and orientation of the workpiece W placed on the rotary table 70 by analyzing this contour.

[0104] Additionally, for example, when using the contact probe 60 to perform point measurement, the lighting command is transmitted through a signal path from the communication / control unit 114 of the PC1 via the communication unit 124 of the main control unit 121, the communication / control unit 131 of the X-axis drive unit 52, the communication / control unit 141 of the Y-axis drive unit 54, the communication / control unit 151 of the Z-axis drive unit 56, the communication / control unit 161 of the contact probe 60, the communication / control unit 164 of the B-axis drive unit 62, and the communication / control unit 166 of the A-axis drive unit 64 to the lighting unit 168.

[0105] The illumination unit 168 receives the illumination command and illuminates an optical mark (not shown) provided on the A-axis drive unit 64 from the back. The imaging unit 163 of the contact probe 60 receives the transmitted light from the optical mark when the contact probe 60 contacts the workpiece W, and generates imaging data corresponding to the image on the imaging surface. This imaging data is transmitted via a signal path from the communication / control unit 161 of the contact probe 60, through the communication / control unit 151 of the Z-axis drive unit 56, the communication / control unit 141 of the Y-axis drive unit 54, the communication / control unit 131 of the X-axis drive unit 52, and the communication unit 124 of the main control unit 121, to the communication / control unit 114 of the PC1.

[0106] Furthermore, when performing point measurement using the contact probe 60, at the moment the contact probe 60 contacts the workpiece W, the displacement amounts in each of the X-axis drive directions 51, 53, 55, and 71 are transmitted from the X-axis encoder 122, Y-axis encoder 142, Z-axis encoder 143, and θ-axis encoder 123 to the communication / control unit 114 of the PC1. Based on the aforementioned camera data and the displacement amounts in each axis drive direction, the PC1 calculates the three-dimensional coordinates of the measurement position.

[0107] Furthermore, the aforementioned camera unit 163, X-axis encoder unit 122, Y-axis encoder unit 142, Z-axis encoder unit 143, and θ-axis encoder unit 123 receive inputs from essentially different clocks and do not operate synchronously. Therefore, in order to accurately determine the three-dimensional coordinates of the measurement position, synchronous detection is preferable to ensure that the timing of the contact probe 60 contacting the workpiece W does not deviate from the timing of referencing the camera data and the displacement in each axis drive direction.

[0108] <Measurement Setup>

[0109] Figure 4 This is a flowchart illustrating an example of measurement setting performed by the measurement setting unit 112. This process can also be started, for example, by pressing the measurement setting button displayed on the PC1's screen as a GUI (Graphical User Interface).

[0110] When this process begins, in step S11, the workpiece W, which is the object of the measurement setting, is placed on the rotary table 70. At this time, the contact probe 60 can also be moved to a position where the workpiece camera 66 can face the rotary table 70 from directly above. In addition, in this step S11, it can also be specified whether the rotation of the rotary table 70 is enabled during measurement. When the rotation of the rotary table 70 is disabled, the measurement is performed within the measurement space of the coordinate measuring device 100, that is, within the movement range of the contact probe 60.

[0111] Next, in step S12, a three-dimensional point cloud is acquired by sequentially generating camera data while moving the non-contact optical sensor 31 along the X-axis driving direction 51. Furthermore, in step S13, unwanted point clouds other than the workpiece W are deleted from the acquired three-dimensional point cloud. Unwanted point clouds to be deleted can be, for example, those whose height relative to the surface of the rotary table 70 is below a predetermined threshold. Through steps S12 and S13, a three-dimensional point cloud corresponding to the position and shape of the workpiece W can be acquired.

[0112] Next, in step S14, the retraction boundary is adjusted. The retraction boundary can be understood as the boundary that allows the contact probe 60 to move without contacting the workpiece W during automatic measurement. The retraction boundary is defined by including the area of ​​the workpiece W. The shape of the retraction boundary can be, for example, a cuboid or a cylinder. Various parameters of the retraction boundary, such as the longitudinal length, transverse length, and height of a cuboid, or the base radius and height of a cylinder, or the rotation angles of each of the three axes, can be manually input. Alternatively, the various parameters of the retraction boundary can be automatically input by setting a margin distance between the retraction boundary and the workpiece W. Alternatively, the various parameters of the retraction boundary can be automatically input by pre-setting a margin distance for the three-dimensional point cloud of the workpiece W acquired by the non-contact optical sensor 31.

[0113] Next, in step S15, pattern registration is performed. For example, the three-dimensional point cloud acquired in step S13 is converted into height data, and any feature region in this height data is registered as pattern data. The registered pattern data is processed as reference data containing information related to the shape of the workpiece W. Furthermore, the shape of the workpiece W in this process refers to the shape of the workpiece W itself, which is placed for the purpose of measurement.

[0114] If a pattern is registered beforehand, even if the workpiece W, the object of measurement, is configured in a different position and posture than when the measurement was set, the position will still be aligned to ensure consistency with the registered pattern. In this step, the position alignment method, the area to be registered as a pattern, the search range during position alignment, exclusion areas, and critical areas can also be set. The area to be registered as a pattern can be either the entire workpiece W or a part of the workpiece W.

[0115] Next, in step S16, the workpiece camera 66 captures a full 360° view of the workpiece W from its perimeter. During this full 360° view, for example, the workpiece camera 66, positioned to view the rotary table 70 from a slightly upward angle, can continuously capture images of the workpiece W during one full rotation of the rotary table 70. By capturing a full 360° view of the workpiece W beforehand, the user can confirm the location of the measurement positions, measurement elements, and measurement items specified in steps S17 and S18 on the workpiece W using the workpiece image on the GUI.

[0116] Next, in step S17, the position is taught. For example, direct teaching can also be performed using the teaching pen 23 and the remote control 25. In this case, with the stylus 24 of the teaching pen 23 in contact with the position of the workpiece W, the trigger button 26 of the remote control 25 is pressed.

[0117] By repeating this operation, arbitrary measurement elements can be temporarily determined. For example, when setting any face of workpiece W as a measurement element, any three points belonging to that face can be designated as measurement positions. Alternatively, for example, when setting any edge of workpiece W as a measurement element, the projection plane and the face to which the edge belongs can be specified using the aforementioned method, and then two points can be specified on the face to which the edge belongs to designate the edge. Furthermore, measurements can also be performed using methods other than those described above.

[0118] After temporarily determining the measurement elements, a single-piece measurement begins with the pressing of the measurement start button in the GUI, performed by the contact probe 60. This single-piece measurement refers to measuring the placed workpiece W before the measurement settings are saved. During direct teaching, the measurement settings for workpiece W can be implemented through a single-piece measurement of workpiece W.

[0119] In the single-piece measurement of workpiece W, the contact probe 60 can be inserted into the aforementioned retraction boundary in the same posture as the teaching pen 23 during teaching, and the contact probe 60 can be brought into contact with workpiece W at the measurement position specified during teaching. After completing the point measurement in this way, the contact probe 60 can be removed from the retraction boundary along the opposite path to its entry. Furthermore, outside the retraction boundary, since there is no risk of collision between the contact probe 60 and workpiece W, the contact probe 60 can move freely in its posture and along its path. In addition, outside the retraction boundary, the contact probe 60 can move at a higher speed than inside the retraction boundary. The measurement path of the contact probe 60, i.e., the sequence and route of the point measurements, can also be automatically set to efficiently traverse multiple specified measurement positions.

[0120] Next, in step S18, the measurement items are registered. As measurement items, distances and angles between measurement elements can also be registered.

[0121] Finally, in step S19, the above series of settings are saved as a measurement setting file in memory 115. It is also possible to save multiple measurement setting files in advance for each type of workpiece W that is the object of measurement.

[0122] Furthermore, this process is basically applicable to measurement settings performed using physical equipment with coordinate measuring device 100, i.e., online measurement settings. Therefore, the above series of descriptions envisions a scenario in which measurement settings including measurement position, measurement elements, and measurement items are performed within the measurable range including the rotary table 70.

[0123] However, this process can also be applied to measurement settings performed using equipment other than the physical coordinate measuring device 100, i.e., offline measurement settings. In this case, the measurement settings, including measurement positions, measurement elements, and measurement items, are performed outside the measurable range of the coordinate measuring device 100. For example, a dedicated measurement setting device equipped with a stage, teaching pen, and teaching camera can be prepared separately from the coordinate measuring device 100. Furthermore, in offline measurement settings, to avoid inconsistencies in the coordinate systems between the coordinate measuring device 100 and the dedicated measurement setting device, the three-dimensional coordinates obtained in the dedicated measurement setting device can be converted into three-dimensional coordinates on a virtual global coordinate system.

[0124] <Continuous Measurement>

[0125] Figure 5 This is a flowchart illustrating an example of continuous measurement performed by the continuous measurement unit 113.

[0126] In step S21, the workpiece W, which is to be measured, is placed on the stage. Next, in step S22, a registered measurement setting file is arbitrarily read from the memory 115. The user can select the file to use from the registered measurement setting files on the GUI of the PC application displayed on the PC1's monitor. Alternatively, by pressing the detection button 81, map data can be acquired by the non-contact optical sensor 31, and a suitable measurement setting file for the workpiece W can be automatically determined and read by comparing the shape data of the placed workpiece W in the map data with the three-dimensional shape data of the workpiece contained in the registered measurement setting file.

[0127] For example, the measurement setting file can be determined by matching the shape data of the workpiece W contained in the map data with the shape data contained in the measurement setting file. By having the user select the measurement setting file on the PC application, the action of pressing the detection button 81 and the scanning action of the non-contact optical sensor 31 can be omitted. The aforementioned method of determining the measurement setting file by pattern matching is effective when the measurement setting file to be used is known. In the method of using the detection button 81, since the measurement setting file to be used can be determined simply by pressing the detection button 81, it is effective when the measurement setting file to be used is unknown.

[0128] In step S23, it is determined whether a measurement start instruction has been given by the continuous measurement unit 13. The measurement start instruction is given by pressing the measurement button 80. Alternatively, the measurement start instruction can be given via the GUI of the PC application. If a measurement start instruction has been given, the process proceeds to step S24 and continuous measurement begins. Otherwise, if no measurement start instruction has been given, the process returns to step S23.

[0129] Furthermore, the order of steps S21 to S23 in this process can be interchanged. For example, after reading the measurement setting file in step S22, the workpiece W can be placed on the stage in step S21, and the measurement can begin after confirming the measurement start instruction in step S23. Alternatively, the workpiece W can be placed on the stage and the measurement setting file can be read after confirming the measurement start instruction. In this case, a display can be shown on the PC1's screen to prompt the user to place the workpiece W on the stage and select the measurement setting file. Furthermore, if the non-contact optical sensor scans map data by pressing the detection button 81, the scanning performed by the non-contact optical sensor after the measurement start instruction has been confirmed can be skipped.

[0130] Then, in step S24, the acquisition of a three-dimensional point cloud by the non-contact optical sensor 31 and the deletion of unwanted point clouds are performed sequentially. As a result, a three-dimensional point cloud corresponding to the position and shape of the workpiece W can be acquired.

[0131] Next, in step S25, a comparison is performed with the registered pattern. Specifically, the 3D point cloud acquired in step S24 is converted into height data, and a data portion matching the registered pattern is searched from this height data. Through this search process, the position and orientation of the workpiece W placed on the rotary table 70 are calculated.

[0132] The computational processing in step S25 is equivalent to aligning the coordinate system related to the map data acquired by the non-contact optical sensor 31 with the coordinate system related to the shape of the workpiece W, which is the object of measurement. Here, the coordinate system related to the map data can be understood as the coordinate system of the map data acquired by the non-contact optical sensor 31. On the other hand, the coordinate system related to the shape of the workpiece W can be understood as the coordinate system of the three-dimensional data contained in the measurement setting file.

[0133] Furthermore, the map data acquired by the non-contact optical sensor 31 includes first information related to the position and orientation of the workpiece W placed on the rotary table 70. On the other hand, the three-dimensional data included in the measurement setting file includes second information related to the position and orientation of the workpiece W, which is pre-registered as a pattern, i.e., reference data. Therefore, the two coordinate systems can be matched based on the first and second information to align the position of the workpiece W.

[0134] Alternatively, step S25 can also be understood as 3D position and pose matching. This 3D position and pose matching is used to match the degrees of freedom of the six axes (X-axis, Y-axis, Z-axis, A-axis, B-axis and θ-axis) based on the 3D position and pose of the workpiece W on the map data obtained by the non-contact optical sensor 31 and the 3D position and pose of the workpiece W on the reference data registered in the measurement setting file.

[0135] Next, in step S26, based on the position and posture of the workpiece W, the measurement position where the contact probe 60 contacts the workpiece W, the posture of the contact probe 60 at the measurement position, and the measurement path of the contact probe 60 to reach the measurement position are calculated again.

[0136] Next, in step S27, point measurements are sequentially performed by the contact probe 60 along the measurement path specified in the measurement setting file. Specifically, the contact probe 60 is moved toward the measurement position in a predetermined posture, and the three-dimensional coordinates of the contact position are acquired at the point in time when the contact probe 60 contacts the workpiece W.

[0137] Alternatively, contour measurement can be performed in step S27. Contour measurement is also known as scanning measurement or scanning-type measurement. In contour measurement, from a first measurement position corresponding to the starting point to a second measurement position corresponding to the ending point, the contact probe 60 is moved while maintaining contact between the tip of the stylus 65 and the workpiece W, thereby continuously acquiring three-dimensional coordinates along the shape of the workpiece W.

[0138] Finally, in step S28, the measurement results are displayed in the GUI. The measurement results may include not only the measured values ​​of the measured items, but also, for example, a judgment flag (OK / NG) indicating whether the measured values ​​are within the normal range.

[0139] In the coordinate measuring device 100, steps S24 to S28 described above are performed automatically. That is, the user can continuously perform three-dimensional measurement of the workpiece W simply by performing the actions from step S21 to step S23.

[0140] Furthermore, this process can also be applied to the case where multiple identical workpieces W are placed on the rotary table 70 in step S21, i.e., when multiple workpieces W are measured in batches. In this case, in steps S24 and S25, the position and orientation of each of the multiple workpieces W are calculated by comparing them with the registered pattern.

[0141] Then, in step S26, based on the respective positions and orientations of the multiple workpieces W, the measurement positions where the contact probe 60 contacts each of the multiple workpieces W, the orientation of the contact probe 60 at those measurement positions, and the measurement path of the contact probe 60 to reach those measurement positions are calculated again. Here, the measurement path of the contact probe 60 can also be automatically set to most efficiently circulate among the multiple measurement positions specified for each of the multiple workpieces W.

[0142] <Flowchart for setting up continuous measurements using a workpiece model generated from CAD>

[0143] The following uses Figures 6 to 13 This section explains the process of setting up measurements and performing continuous measurements using a workpiece model generated by CAD.

[0144] Figure 6 This is a schematic diagram illustrating an example of 3D CAD data for a workpiece model. Figure 6 The 3D CAD data shown has a CAD coordinate system with mutually orthogonal Xc, Yc and Zc axes.

[0145] against Figure 6 The 3D CAD data shown specifies the measurement location, measurement elements, and at least one of the measurement items. This specification, along with the 3D CAD data serving as the shape data of the workpiece model, is saved as a measurement setting file. The measurement setting process ends upon saving the measurement setting file.

[0146] Figure 7 This is a schematic diagram illustrating an example of a measurement setting document. Figure 7The measurement setup file shown includes information related to measurement positions MP1-MP3, measurement element ME1, measurement positions MP4-MP6, measurement element ME2, and measurement item MI1. Measurement element ME1 is a plane containing the upper surface of a cuboid defined by measurement positions MP1-MP3. Measurement element ME2 is a plane containing the upper surface of a cylinder defined by measurement positions MP4-MP6. Measurement item MI1 is the distance between measurement element ME1 and measurement element ME2. Furthermore, the measurement setup file may also include information related to... Figure 8 The information shown pertains to measurement positions MP7-MP11, measurement elements ME3-ME5, and measurement item MI2. Measurement element ME3 is a plane containing the cuboid side surface defined by measurement positions MP7-MP9. Measurement element ME4 is a cylinder containing the cylindrical side surface defined by measurement positions MP10-MP11. Measurement element ME5 is the axis of measurement element ME4, which is a cylinder. Measurement item MI2 is the distance between measurement elements ME3 and ME5.

[0147] After the measurement setup is completed, continuous measurement begins. During continuous measurement, the non-contact optical sensor 31, as shown... Figure 9 As shown, a strip of laser L is irradiated onto the workpiece W placed on the stage, and a non-contact optical sensor 31 receives the reflected light from the measurement space, thereby acquiring contour data. The non-contact optical sensor 31 scans the workpiece W while moving along the X-axis, thereby continuously acquiring contour data. Then, by synthesizing the continuously acquired contour data, a three-dimensional point cloud in the measurement space is obtained.

[0148] Figure 10 This is a schematic diagram showing the acquired three-dimensional point cloud within the measurement space. Figure 10 The 3D point cloud shown lacks data corresponding to the portion of workpiece W where reflected light was not received. Additionally, in Figure 10 The 3D point cloud shown contains unwanted point cloud data corresponding to the portion of the rotating stage 70 that received reflected light. This unwanted point cloud is removed using methods such as utilizing the known distance between the rotating stage 70 and the non-contact optical sensor 31, or using identification markers positioned on the side of the rotating stage 70. Figure 10 When unwanted points are deleted from the 3D point cloud shown, it becomes... Figure 11 The three-dimensional point cloud shown.

[0149] based on Figure 7 The shape data of the workpiece model in the measurement setting file shown and Figure 11 The three-dimensional point cloud shown is as follows: Figure 12As shown, the position and orientation of the workpiece model are made consistent with the position and orientation of the workpiece W, so that the CAD coordinate system is matched with the coordinate system related to the shape of the workpiece W, which is the object of measurement. Figure 12 In the middle, use dashed lines to depict Figure 7 The shape data of the workpiece model in the measurement setting file shown. Additionally, in Figure 12 In it, it also depicts Figure 7 The measurement locations shown are MP1~MP6 and Figure 8 The measurement locations shown are MP7~MP11. Furthermore, in... Figure 12 In this context, the coordinate system related to the shape of the workpiece W, which is the object of measurement, is the device coordinate system, but it can also be converted to the global coordinate system.

[0150] After the CAD coordinate system is matched with the coordinate system related to the shape of the workpiece W being measured, the coordinates of the matched measurement positions MP1~MP6 contained in the measurement setting file (coordinates in the coordinate system related to the shape of the workpiece W being measured) are calculated. Figure 13 The measurement path RT of the contact probe 60 is shown. Furthermore, the posture of the contact probe 60 at each measurement position can be based on a retraction boundary, Figure 11 The three-dimensional point cloud shown Figure 7 The shape data of the workpiece model in the measurement setting file shown can be used to automatically determine the measurement path, or it can be determined based on user instructions received by the user input device. If the measurement setting file contains information related to measurement positions MP7-MP11, the measurement path of the contact probe 60 is calculated based on the matched coordinates (coordinates in a coordinate system related to the shape of the workpiece W being measured) of the measurement positions MP1-MP11 contained in the measurement setting file. In this case, the posture of the contact probe 60 at each measurement position MP7-MP11 is determined using the same method as used to determine the posture of the contact probe 60 at each measurement position MP1-MP6.

[0151] Alternatively, the CAD coordinate system can be mismatched with the coordinate system related to the shape of the workpiece W being measured, and the measurement path RT of the contact probe 60 can be calculated based on the relative relationship between the position and orientation of the workpiece model and the position and orientation of the workpiece W. Furthermore, the measurement position, measurement elements, and measurement items can also be set to relative positional relationships with the shape of the workpiece model in the CAD data. In this case, based on the shape data of the workpiece model in the measurement setting file and the three-dimensional point cloud of the workpiece W, the position and orientation of the workpiece model are matched with the position and orientation of the workpiece W, and the measurement is performed using the contact probe 60 based on this relative positional relationship.

[0152] <Procedure for setting up continuous measurements using measured data>

[0153] The following uses Figures 14-16 This will explain the process of setting up measurements using actual data and then performing continuous measurements.

[0154] Figure 14 This diagram schematically illustrates the setting of the measurement position using the teach pendant 23. The measurement position is determined by bringing the teach pendant 23 into contact with the workpiece W, which is the object of the measurement setting, placed on the stage. The posture of the teach pendant 23 when determining the measurement position is associated with the measurement position and is saved as part of the measurement setting file. The posture of the teach pendant 23 is defined, for example, by two parameters: the B-axis rotation of the contact probe 60 and the A-axis rotation of the contact probe 60.

[0155] Then, the non-contact optical sensor 31 scans the workpiece W, which is the object of the measurement setting, while moving along the X-axis, thereby continuously acquiring contour data. Then, by synthesizing the continuously acquired contour data, a three-dimensional point cloud within the measurement space is acquired. Furthermore, by deleting unwanted point clouds from the three-dimensional point cloud within the measurement space, a three-dimensional point cloud of the workpiece W, which is the object of the measurement setting, is acquired and saved as part of the measurement setting file. Figure 15 This is a diagram illustrating an example of a measurement setting file generated using measurement settings based on measured data. Figure 15 The measurement setup file shown includes information related to measurement positions MP1-MP3, measurement element ME1, measurement positions MP4-MP6, measurement element ME2, and measurement item MI1. Measurement element ME1 is a plane containing the upper surface of a cuboid defined by measurement positions MP1-MP3. Measurement element ME2 is a plane containing the upper surface of a cylinder defined by measurement positions MP4-MP6. Measurement item MI1 is the distance between measurement element ME1 and measurement element ME2. Furthermore, the measurement setup file may also include information related to... Figure 16 The information shown pertains to measurement positions MP7-MP11, measurement elements ME3-ME5, and measurement item MI2. Measurement element ME3 is a plane containing the cuboid side surface defined by measurement positions MP7-MP9. Measurement element ME4 is a cylinder containing the cylindrical side surface defined by measurement positions MP10-MP11. Measurement element ME5 is the axis of measurement element ME4, which is a cylinder. Measurement item MI2 is the distance between measurement elements ME3 and ME5. The measurement setup is complete by saving the measurement setup file.

[0156] Regarding the continuous measurement, except that the coordinate system related to the shape of the workpiece W, which is the object of the measurement setting, is matched with the coordinate system related to the shape of the workpiece W, which is the object of the measurement, and the posture of the contact probe 60 is determined based on the posture of the teaching pen 23 contained in the measurement setting file, the continuous measurement is the same as that performed at the end of the measurement setting using the workpiece model generated by CAD.

[0157] <Classification of measurement setup and continuous measurement process patterns>

[0158] The process of setting up the measurement and continuing measurement is, for example, categorized as follows: Figure 17 Patterns A through D are shown. Details about patterns A through D will be described later. Furthermore, through... Figures 6 to 13 The described process of setting up continuous measurement using a workpiece model generated by CAD corresponds to mode D, through... Figures 14 to 16 The described procedure for setting up measurements using measured data to perform continuous measurements corresponds to Mode A.

[0159] Figure 18 This is a schematic diagram illustrating the tree structure of the measurement settings file. Figure 19 This is a diagram illustrating an example of the tree structure of the measurement settings file for Mode A. Figure 20 This diagram schematically illustrates an example of the tree structure of the measurement setup file in Mode B. In Mode B, reference shape data (reference data) is replaced from CAD data to scan data midway through the measurement setup process. Figure 21 This diagram schematically illustrates an example of the tree structure of the measurement setup file in Mode C. In Mode C, reference shape data is replaced from CAD data with feature point information midway through the measurement setup process. Figure 22 This is a diagram illustrating an example of the tree structure of the measurement settings file for Mode D.

[0160] A schematic diagram illustrating an example of a measurement setup file for Mode A is shown below. Figure 15 .exist Figure 15 In the example shown, the measurement positions MP1~MP6, measurement elements ME1 and ME2, measurement items MI1, and measurement postures are assigned based on the relative positions of the scan data.

[0161] The schematic diagram showing an example of the measurement setup file for Mode B is as follows: Figure 23 .exist Figure 23In the example shown, initially, measurement positions MP1-MP6, measurement elements ME1 and ME2, measurement item MI1, and measurement posture are assigned relative to the 3D CAD data. Then, the 3D CAD data and scanned data are matched, and finally, the matching result is used to replace the measurement positions MP1-MP6, measurement elements ME1 and ME2, measurement item MI1, and measurement posture with their relative positions relative to the scanned data. Furthermore, in Mode B, the reference shape data is also replaced from the 3D CAD data with the scanned data.

[0162] A schematic diagram illustrating an example of a measurement setup file for Mode C is shown below. Figure 24 .exist Figure 24 In the example shown, initially, measurement positions MP1~MP6, measurement elements ME1 and ME2, measurement item MI1, and measurement posture are assigned relative to the 3D CAD data. Then, the 3D points corresponding to the assigned information, i.e., CAD feature points, are extracted. Finally, the measurement positions MP1~MP6, measurement elements ME1 and ME2, measurement item MI1, and measurement posture are replaced with information from CAD feature points. Furthermore, in Mode C, the reference shape data is also replaced from the 3D CAD data with information from CAD feature points.

[0163] A schematic diagram illustrating an example of the measurement setup file for Mode D is shown below. Figure 7 .exist Figure 7 In the example shown, the measurement positions MP1~MP6, measurement elements ME1 and ME2, measurement items MI1, and measurement postures are assigned relative to the three-dimensional CAD data.

[0164] When setting the measurement in mode B or mode C, the measurement setting unit 112 replaces the measurement position, measurement element, measurement item and measurement posture associated with the three-dimensional CAD data contained in the measurement setting file with the measurement position, measurement element, measurement item and measurement posture associated with the scanning data obtained by scanning the workpiece W, which is the object of the measurement setting, by the non-contact optical sensor 31, that is, the three-dimensional point cloud of the workpiece W, which is the object of the measurement setting.

[0165] Figure 25This is a flowchart illustrating an example of a measurement setup. When the measurement setup begins, in step S101, it is determined whether to read the 3D CAD data, which serves as shape data for the workpiece model. For example, a display prompting the user to select whether to read the 3D CAD data can be shown on the PC1's monitor, and the PC1 accepts the user's selection via the display. If the selection to read the 3D CAD data is accepted, it is determined that the 3D CAD data will be read; if the selection not to read the 3D CAD data is accepted, it is determined that the 3D CAD data will not be read. This determination is performed, for example, by the PC1. If it is determined that the 3D CAD data will be read, the process proceeds to step S104. If it is determined that the 3D CAD data will not be read, the process proceeds to step S102. In step S102, the workpiece W, which is the object of the measurement setup, is scanned. The scanned data obtained becomes the reference shape data. In step S103, following step S102, the measurement position, measurement element, and measurement item are assigned according to the relative position of the scanned data. When the assignment is complete, the process proceeds to step S121. Furthermore, in step S103, the measurement posture can also be assigned according to the relative position of the scanned data. In step S121, a measurement setting file is created, containing at least one of the measurement position, measurement element, measurement item, and measurement posture allocated relative to the scan data, as well as the scan data. This measurement setting file is then output to and stored in the memory 15. As described above, in the state where the 3D CAD data is not read, the measurement setting file is created based on the measurement position, measurement element, measurement item, and measurement posture allocated relative to the scan data. This corresponds to the creation of the measurement setting in mode A described above.

[0166] In step S104, the 3D CAD data (CAD model) is read out. For example, the user can select a file containing 3D CAD data to be read from a file stored in memory 115 on the GUI of a PC application displayed on the monitor of PC1. This selection is handled by PC1, for example, and PC1 reads the file containing the 3D CAD data from memory 115 based on the accepted selection. The read 3D CAD data becomes the reference shape data. In step S105, following step S104, measurement positions, measurement features, and measurement items are assigned according to the relative positions of the 3D CAD data. When the assignment is completed, the process proceeds to step S106. Furthermore, in step S105, measurement poses may also be assigned according to the relative positions of the 3D CAD data.

[0167] In step S106, it is determined whether to scan the workpiece W, which is the object of the measurement setting. For example, a display prompting the user to select whether to perform a scan may be shown on the PC1's monitor, and the PC1 accepts the user's selection via the display. If the selection to perform a scan is accepted, it is determined that the workpiece W, which is the object of the measurement setting, will be scanned; if the selection not to perform a scan is accepted, it is determined that the workpiece W, which is the object of the measurement setting, will not be scanned. This determination is performed by the PC1, for example. If it is determined that the workpiece W, which is the object of the measurement setting, will be scanned, the process proceeds to step S107. If it is determined that the workpiece W, which is the object of the measurement setting, will not be scanned, the process proceeds to step S117. In step S107, the workpiece W, which is the object of the measurement setting, is scanned. In step S108, following step S107, a pattern for pattern matching is set based on the scan data. For example, the user can specify and set the area containing the pattern for pattern matching in the scan data on the GUI of a PC application displayed on the PC1's monitor. In this case, it is effective in that the user's desired setting can be performed. Alternatively, step S108 can be skipped. If step S108 is skipped, the entire area of ​​the scanned data can be used for pattern matching, or feature quantities can be calculated based on the shape of the scanned data, and a pattern for pattern matching can be set based on these feature quantities. Skipping step S108 simplifies the measurement setup. In step S109 following step S108, the top surface of the 3D CAD data is specified using a user input device. Alternatively, step S109 can be skipped. If step S109 is skipped, CAD feature point extraction (described later) can be performed on the entire area of ​​the CAD data, or more than one surface can be determined based on the shape of the CAD data, and feature points can be extracted. This simplifies the measurement setup. In step S110 following step S109, CAD feature points are extracted from the 3D CAD data. If the top surface was specified in step S108, the feature points of the specified top surface are extracted. Compared to extracting the entire area of ​​the 3D CAD data, the amount of feature point data can be reduced. Furthermore, extracting user-specified feature points sometimes improves the accuracy of matching with the scanned data (described later). In step S111, following step S110, the scanned data is matched with the 3D CAD data. The matching is performed, for example, based on the normals of each point in the scanned data point cloud and the normals of each point in the point cloud composed of feature points extracted from the 3D CAD data.In step S112, following step S111, using the matching results, data on measurement positions, measurement elements, and measurement items allocated relative to the scanned data are generated based on the data of measurement positions, measurement elements, and measurement items allocated relative to the 3D CAD data. In step S113, following step S112, the measurement positions, measurement elements, and measurement items allocated relative to the 3D CAD data in the measurement setting file are replaced with measurement positions, measurement elements, and measurement items allocated relative to the scanned data. Additionally, the reference shape data is replaced from the 3D CAD data with the scanned data. In step S114, following step S113, the contact probe 60 measures the workpiece W, which is the object of the measurement setting, according to the measurement setting file. Thus, workpiece W is measured individually. Alternatively, step S114 can be skipped. In step S115, following step S114, it is determined whether the measurement setting has been completed without problems. A user input device is used in this determination. If it is determined that the measurement setting is not completed, the process proceeds to step S116. In step S116, the matching conditions are adjusted, and measurement positions, measurement elements, and measurement items are added as needed, before returning to step S115. If it is determined in step S115 that the measurement setup is complete, the process proceeds to step S121. In step S121, a measurement setup file is created containing at least one of the measurement positions, measurement elements, measurement items, and measurement postures allocated relative to the scanned data, as well as the scanned data. This measurement setup file is output to and stored in memory 15. In this way, the reference shape data is replaced from 3D CAD data to scanned data, and based on matching, the measurement positions, measurement elements, measurement items, and measurement postures allocated relative to the 3D CAD data are replaced with those allocated relative to the scanned data to create a measurement setup file. This corresponds to the creation of the measurement setup in Mode B described above.

[0168] In step S117, it is determined whether to extract CAD feature points from the 3D CAD data. For example, a display prompting the user to choose whether to perform CAD feature point extraction can be shown on the PC1's monitor, and the PC1 accepts the user's selection via the display. If the selection to perform CAD feature point extraction is accepted, it is determined that CAD feature point extraction will be performed; if the selection not to perform CAD feature point extraction is accepted, it is determined that CAD feature point extraction will not be performed. This determination is performed, for example, by the PC1. If it is determined that CAD feature point extraction will be performed, the process proceeds to step S118. If it is determined that CAD feature point extraction will not be performed, the process proceeds to step S121.

[0169] In step S118, the top surface of the 3D CAD data is specified using a user input device. Alternatively, step S118 can be skipped. In step S119, following step S118, CAD feature points are extracted from the 3D CAD data. The reference shape data is replaced with the CAD feature points extracted from the 3D CAD data. In step S120, following step S119, in the measurement setting file, the measurement positions, measurement elements, and measurement items allocated relative to the 3D CAD data are replaced with the relative positions of the point cloud data composed of the CAD feature points corresponding to the measurement positions, measurement elements, and measurement items, and the process proceeds to step S121. In step S121, a measurement setting file is created containing the CAD feature points extracted from the 3D CAD data, and at least one of the measurement positions, measurement elements, measurement items, and measurement poses allocated relative to the point cloud data composed of the CAD feature points. This measurement setting file is output to and stored in memory 15. In this way, the reference shape data is replaced from the 3D CAD data with CAD feature points extracted from the 3D CAD data, and the measurement position, measurement element, measurement item, and measurement posture assigned to the relative position of the 3D CAD data are replaced with the measurement position, measurement element, measurement item, and measurement posture assigned to the relative position of the point cloud data composed of CAD feature points, to create a measurement setting file. This corresponds to the creation of the measurement setting in Mode C above.

[0170] If, in step S117, it is determined that CAD feature points will not be extracted from the 3D CAD data and the process proceeds to step S121, a measurement setting file is created, containing at least one of the measurement position, measurement element, measurement item, and measurement posture assigned relative to the 3D CAD data. This measurement setting file is then output to and stored in memory 15. As described above, setting the reference shape data as 3D CAD data and creating the measurement setting file with the measurement position, measurement element, measurement item, and measurement posture assigned relative to the 3D CAD data corresponds to the creation of the measurement setting in mode D described above.

[0171] In step S121, the measurement setting file is output to memory 15 and saved in memory 15, and the measurement setting ends.

[0172] Alternatively, a measurement setting file that has been assigned measurement positions, measurement elements, and measurement items through measurement settings in mode C or mode D can be read from memory 15, replacing steps S110 to S113 related to the scan data obtained through scanning in step S107, and the measurement positions, measurement elements, and measurement items assigned relative to the three-dimensional CAD data can be determined using the read measurement setting file.

[0173] Figure 26 This is a flowchart illustrating an example of continuous measurement in a scenario where measurement setting files created in modes A to D can be automatically read. In step S201, it is determined whether the detection button 81 is pressed. When it is determined that the detection button 81 is pressed, step S202 is performed, and the workpiece W is scanned. In step S203, following step S202, the measurement setting file is automatically determined and read. At this time, in order to determine the measurement setting file suitable for the scan data of the workpiece W through matching described later, one or more measurement setting files included in the memory 15 are determined. For example, a measurement setting file can be randomly selected from the measurement setting files included in the memory 15, or multiple measurement setting files can be read.

[0174] In step S204, following step S203, it is determined which of modes A to D the measurement setting file read in step S203 conforms to. For example, a measurement setting file that uses scan data as reference shape data is determined to be a measurement setting file created in mode A or mode B. A measurement setting file that uses CAD feature point data as reference shape data is determined to be a measurement setting file created in mode C, and if CAD data is used as reference shape data, it is determined to be a measurement setting file created in mode D. For example, the reading and determination of the measurement setting file can be performed by the PC application 111 (continuous measurement unit 113).

[0175] If either Mode A or Mode B is met, proceed to step S205 to match the scan data obtained in step S202 with the scan data contained in the measurement setting file, and then proceed to step S209.

[0176] If pattern D is met, proceed to step S206 to extract CAD feature points corresponding to the 3D CAD data contained in the measurement setting file. In step S207, following step S206, match the scan data obtained in step S202 with the CAD feature points extracted in step S206. At this point, based on the matching result, the measurement positions, measurement elements, and measurement items assigned relative to the 3D CAD data (CAD feature points) can be replaced with measurement positions, measurement elements, and measurement items assigned relative to the scan data. Then proceed to step S209.

[0177] If the condition meets the criteria of mode C, proceed to step S208 to match the scan data obtained in step S202 with the CAD feature points contained in the measurement setting file, and then proceed to step S209.

[0178] In step S209, it is determined whether the matching was successful. If the matching was unsuccessful, proceed to step S210 to determine if there is an unread measurement setting file. If there is an unread measurement setting file, return to step S203 to read the unread measurement setting file. If there is no unread measurement setting file, manually specify the measurement setting file and adjust the matching conditions. If the matching was successful, proceed to step S211 to reflect the measurement settings of the read measurement setting file, and in step S212, use the contact probe 60 to measure the workpiece W. As described above, the measurement setting file corresponding to the workpiece W among the multiple measurement setting files included in the memory 15 can be automatically determined based on the matching result with the scan data.

[0179] Furthermore, since continuous measurement requires measuring multiple workpieces W with the same measurement settings, steps S209 and S210 are omitted, and after matching, the process can proceed directly to step S211. In the case of mode D, step S206 involves extracting CAD feature points corresponding to the measurement positions, measurement elements, and measurement items allocated relative to the 3D CAD data contained in the measurement setting file. Therefore, this process is more prone to deviations in matching compared to other modes. Therefore, a step can be set immediately before step S206 to specify the top surface of the 3D CAD data using a user input device, and immediately after step S206 to determine whether matching is complete. If matching is determined to be incomplete, the process returns to the step set immediately before step S206; if matching is determined to be complete, the process proceeds to step S211.

[0180] Furthermore, the measurement setting file can be updated using scan data obtained by scanning the first workpiece W in continuous measurement. For example, the reference shape data contained in the measurement setting file obtained in mode C or mode D can be replaced with scan data. In this case, the measurement setting file created in mode C or mode D is determined to be the measurement setting file obtained in mode B, and matching of the scan data with the scan data serving as reference shape data is performed. Alternatively, the condition that the first workpiece in continuous measurement is successfully matched can be considered to impose restrictions on matching in subsequent continuous measurements, such as limiting the search range for matching. For example, the measurement setting file obtained in mode D can be updated to the measurement setting file obtained in mode C by utilizing the CAD feature points when the first workpiece W in continuous measurement is successfully matched.

[0181] Figure 27This is a flowchart illustrating an example of continuous measurement when measurement setting files created in modes A to D can be selected. In step S301, the measurement setting file is read from memory 15. For example, the user can select the measurement setting file to be read from a file saved in memory 115 on the GUI of the PC application displayed on the PC1's monitor. This selection is handled by PC1, for example, and PC1 reads the measurement setting file from memory 115 based on the accepted selection. Afterwards, step S302 is performed, and the workpiece W, which is the object of the measurement setting, is scanned. Afterwards, step S303 is performed.

[0182] In step S303, following step S302, it is determined which of modes A to D the measurement setting file read in step S301 conforms to. For example, a measurement setting file that uses scan data as reference shape data is determined to be a measurement setting file created in mode A or mode B. A measurement setting file that uses CAD feature point data as reference shape data is determined to be a measurement setting file created in mode C, and if it uses three-dimensional CAD data as reference shape data, it is determined to be a measurement setting file created in mode D. For example, the reading and determination of the measurement setting file can be performed by the PC application 111 (continuous measurement unit 113).

[0183] If either Mode A or Mode B is met, proceed to step S304 to match the scan data obtained in step S302 with the scan data included in the measurement setting file as reference shape data, and then proceed to step S310.

[0184] If mode D is met, proceed to step S305, accept the designation of the top surface of the 3D CAD data included in the measurement setting file as reference shape data, and proceed to step S306. In step S306, extract the CAD feature points corresponding to the 3D CAD data included in the measurement setting file. CAD feature point extraction is performed on the top surface accepted in step S305. Alternatively, step S305 can be skipped, in which case the CAD feature points of the entire 3D CAD data can be extracted. In step S307 following step S306, match the scan data obtained through step S302 with the CAD feature points extracted through step S306. At this time, based on the matching result, the measurement position, measurement element, and measurement item assigned relative to the 3D CAD data (CAD feature points) can be replaced with the measurement position, measurement element, and measurement item assigned relative to the scan data. Then proceed to step S308. In step S308, determine whether the matching was successful. If the match fails, the process returns to one of steps S305, S306, or S307. At this point, adjustments are made to the matching conditions, and the top surface is re-specified. If the match is successful, the process proceeds to step S310. Alternatively, step S308 can be skipped.

[0185] If the condition meets mode C, proceed to step S309, where the scan data obtained through step S302 is matched with the CAD feature points included in the measurement setting file as reference shape data, and then proceed to step S310.

[0186] In step S310, based on the matching result, the measurement position, measurement element, and measurement item included in the measurement setting file, which are allocated relative to the reference shape data, are replaced with the relative position of the measurement setting file relative to the scan data. This allows the measurement settings (measurement position, measurement element, measurement item, measurement posture) included in the measurement setting file to be reflected in the scan data. Then, in step S311, a contact measurement is performed using the contact probe 60 based on the measurement settings allocated relative to the scan data.

[0187] Furthermore, the measurement setting file can be updated using scan data obtained by scanning the first workpiece W in continuous measurement. For example, the reference shape data contained in the measurement setting file obtained in mode C or mode D can be replaced with scan data. In this case, the measurement setting file created in mode C or mode D is determined to be the measurement setting file obtained in mode B, and matching of the scan data with the scan data serving as reference shape data is performed. Alternatively, the condition that the first workpiece in continuous measurement is successfully matched can be considered to impose restrictions on matching in subsequent continuous measurements, such as limiting the search range for matching. For example, the measurement setting file obtained in mode D can be updated to the measurement setting file obtained in mode C by utilizing the CAD feature points when the first workpiece W in continuous measurement is successfully matched.

[0188] <Variation Example>

[0189] In the above embodiments, 3D matching is performed, which is the matching of the 3D position and posture of the workpiece W, which is the object of measurement, with the 3D position and posture of the workpiece W registered in the reference data in the measurement setting file. Alternatively, 2D matching can be performed instead of 3D matching, which is the matching of a 2D image of the workpiece W, which is the object of measurement, obtained by a 2D camera device, with a 2D image of the workpiece W registered in the reference data in the measurement setting file.

[0190] For example, the non-contact optical sensor 31 includes a profilometer and a 2D camera. The main control unit 121 detects the position and orientation of the workpiece W within the measurement space based on low-resolution map data acquired using the profilometer and a workpiece image captured by the 2D camera. More specifically, the main control unit 121 determines the position of the object to be measured based on the low-resolution map data acquired using the profilometer, and based on the determined position, moves the 2D camera via the head 50 to a position where the measurement can be performed to compare the shape of the workpiece (e.g., directly above the determined position, i.e., a position separated by a predetermined distance in the Z-axis driving direction from the determined position). Then, the main control unit 121 detects the position and orientation of the workpiece W within the measurement space based on the two-dimensional image captured by the 2D camera at the measurement position, determines the measurement path based on the detected position and orientation of the workpiece W and the measurement settings, and moves the contact probe 60 via the head 50 to move the contact probe 60 to the measurement position along the measurement path.

[0191] Alternatively, for example, the non-contact optical sensor 31 is a 2D camera with an object-side non-telecentric optical system. The main control unit 121 acquires one or more images representing the entire measurement space to determine the position of the object to be measured. Based on the determined position, the head 50 controls the movement of the 2D camera to move it to a position where the shape of the workpiece being measured can be compared (e.g., directly above the determined position, i.e., a position separated by a predetermined distance in the Z-axis driving direction from the determined position). Then, the main control unit 121 detects the position and orientation of the workpiece W within the measurement space based on the two-dimensional image captured by the 2D camera at the measurement position. Based on the detected position and orientation of the workpiece W and the measurement settings, it determines the measurement path and controls the movement of the contact probe 60 via the head 50 to move the contact probe 60 to the measurement position along the measurement path. The aforementioned one or more images representing the entire measurement space can be captured by the non-contact optical sensor 31 or by a 2D camera separately mounted on the coordinate measuring device 100 from the non-contact optical sensor 31.

[0192] In the above embodiment, an example of acquiring a three-dimensional point cloud by scanning while moving the non-contact optical sensor 31 along the X-axis drive direction 51 was described, but it is not limited to this. For example, it may be configured such that, with the non-contact optical sensor 31 fixed in a predetermined position, the workpiece W is rotated by the rotary table 70 while multiple measurements are performed at different rotation angles. In this case, the non-contact optical sensor 31 acquires multiple measurement data at different rotation angles, and the continuous measurement unit 113 synthesizes the multiple measurement data to generate three-dimensional data of the workpiece W. For example, if the non-contact optical sensor 31 is a profilometer, multiple profile data at different rotation angles can be synthesized to generate a three-dimensional point cloud of the workpiece W. Alternatively, if the non-contact optical sensor 31 is a 2D camera, multiple two-dimensional images can be captured from different rotation angles, and they can be synthesized using techniques such as photogrammetry to generate a three-dimensional point cloud of the workpiece W. The three-dimensional data generated in this way is sent as measurement data to PC1 (PC application 111). For example, PC1 (PC application 111) performs coordinate system matching based on the three-dimensional data and the shape of the workpiece included in the measurement settings stored in the memory 115. For example, the relative positional relationship between the non-contact optical sensor 31 and the workpiece W can be determined based on the rotation angle of the rotary table 70, and coordinate system matching can be performed based on the determined relative positional relationship. Alternatively, for more precise positional alignment, coordinate system matching based on the shape of the workpiece can be performed. Of course, it is also possible to combine the example of moving the non-contact optical sensor 31 as described in the above embodiment with rotation performed using the rotary table 70 to change the relative positional relationship between the workpiece W and the non-contact optical sensor 31.

[0193] Alternatively, consider the case where the non-contact optical sensor 31 is a 2D camera. A possible structure is as follows: the measurement control unit 121 controls at least one of the X-axis drive unit 52, Y-axis drive unit 54, Z-axis drive unit 56, B-axis drive unit 62 connected to the contact probe 60, and A-axis drive unit 64 of the head 50, to rotate or move the non-contact optical sensor 31 around the workpiece W while capturing multiple two-dimensional images from different camera positions. In other words, the workpiece W side on the rotary table 70 is fixed, and the measurement control unit 121 allows at least one of the X-axis drive unit 52, Y-axis drive unit 54, Z-axis drive unit 56, B-axis drive unit 62 connected to the contact probe 60, and A-axis drive unit 64 to move. In this case, it is also possible to generate three-dimensional data of the workpiece W by synthesizing the multiple captured two-dimensional images. Then, the coordinate system matching unit matches the coordinate system related to the measurement data with the coordinate system related to the shape of the workpiece as the object of measurement based on the three-dimensional data generated by this synthesis.

[0194] The non-contact optical sensor 31 can also be a stereo camera with at least two camera units arranged separately from each other. According to the stereo camera method, based on the principle of triangulation, three-dimensional information of the workpiece W within the shooting range can be acquired in a single shot without moving the non-contact optical sensor 31 or the workpiece W. This structure is effective in reducing the time spent moving the workpiece W or the non-contact optical sensor 31. The acquired three-dimensional information is equivalent to measurement data, used for coordinate system matching by the coordinate system matching unit.

[0195] Furthermore, when the non-contact optical sensor 31 is a stereo camera, in order to generate 3D data with a wider range or fewer blind spots, at least one of the workpiece W and the non-contact optical sensor 31 can be moved or rotated. For example, the measurement control unit 121 uses the X-axis drive unit 52, the Y-axis drive unit 54, the Z-axis drive unit 56, etc., to move the non-contact optical sensor 31, or uses the rotary table 70 to rotate the workpiece W. Thus, while changing the relative position or posture of the workpiece W and the non-contact optical sensor 31, multiple local 3D information is acquired from multiple different positions and orientations. Then, the continuous measurement unit 113 or PC1 can generate high-precision 3D data of the entire workpiece W by aligning and synthesizing the acquired multiple 3D information. The coordinate system matching unit uses the synthesized 3D data to match the coordinate system related to the measurement data with the coordinate system related to the shape of the workpiece being measured.

[0196] Another example of posture detection for the contact probe 60 will be described. In the above embodiment, the camera unit 163 captures an image of an optical mark (not shown) provided on the A-axis drive unit 64. The position and posture of the A-axis drive unit 64 with the optical mark attached can be detected based on the captured image pattern of the optical mark, and further, the position and posture of the stylus 65 supported on the A-axis drive unit 64 can be detected. However, the posture detection of the contact probe 60 is not limited to this. An A-axis encoder unit 165 and a B-axis encoder unit 162 may also be provided to detect the rotation angles of the A-axis drive unit 64 and the B-axis drive unit 62, which control the posture of the contact probe 60. These can be general encoders such as optical encoders, magnetic encoders, or electrostatic capacitive encoders that read a rotating scale. Alternatively, an absolute encoder that detects the absolute position of the rotation angle or an incremental encoder that detects the amount of rotation from the origin may be used. The rotation angle (posture) information detected by these encoders is used by the measurement and control unit 121 to control the posture of the contact probe 60.

[0197] Explanation of reference numerals in the attached figures

[0198] 1: PC

[0199] 2: Mouse

[0200] 3: Communication cable (between the head housing and the PC)

[0201] 4: Communication cable (between remote control and PC)

[0202] 5: Main Body

[0203] 11: Console

[0204] 12: Communication cable (between console and head housing)

[0205] 21: Teaching Camera

[0206] 22: (Lighting section of the teaching camera)

[0207] 23: Demonstration pen

[0208] 24: (of the teaching pen) stylus

[0209] 25: Remote Control

[0210] 26: Trigger Button

[0211] 27: (The optical markings of the teaching pen)

[0212] 31: Non-contact optical sensor

[0213] 32: Laser light-emitting part

[0214] 33: Light-receiving lens

[0215] 34: (Non-contact optical sensor) Camera section

[0216] 50: Head

[0217] 51: X-axis drive direction

[0218] 52: X-axis drive unit

[0219] 53: Y-axis drive direction

[0220] 54: Y-axis drive unit

[0221] 55: Z-axis drive direction

[0222] 56: Z-axis drive unit

[0223] 57: Head shell section

[0224] 57a: Ground contact part

[0225] 57b: Erect part

[0226] 58: θ-axis drive unit

[0227] 60: Contact probe

[0228] 61: B-axis drive direction

[0229] 62: B-axis drive unit

[0230] 63: A-axis drive direction

[0231] 64: A-axis drive unit

[0232] 65: (Contact probe) stylus

[0233] 66: Workpiece Camera

[0234] 70: Rotary table

[0235] 71: θ-axis driving direction

[0236] 80: Measurement Button

[0237] 81: Detection button

[0238] 82: Power button

[0239] 100: Coordinate measuring device

[0240] 111: PC Applications

[0241] 112: Measurement and Setting Section

[0242] 113: Continuous Measurement Section

[0243] 114: Communications / Control Department

[0244] 115: Memory

[0245] 121: Main Control Unit

[0246] 122: X-axis encoder section

[0247] 123: θ-axis encoder section

[0248] 124: Ministry of Communications

[0249] 125: (The camera section of the teaching camera)

[0250] 126: (Teaching camera) Communication / Control Unit

[0251] 131: (X-axis drive unit) Communication / control unit

[0252] 141: (Y-axis drive unit) Communication / control unit

[0253] 142: Y-axis encoder section

[0254] 143: Z-axis encoder section

[0255] 144: Contour Calculation Department

[0256] 145: (Communication / Control Unit for Non-Contact Optical Sensors)

[0257] 151: (Z-axis drive unit) Communication / control unit

[0258] 161: (Contact probe) Communication / Control Unit

[0259] 162: B-axis encoder section

[0260] 163: (The camera section that contacts the probe)

[0261] 164: (B-axis drive unit) Communication / control unit

[0262] 165: A-axis encoder section

[0263] 166: (A-axis drive unit) Communication / control unit

[0264] 167: Hall Sensor Section

[0265] 168: (Illumination unit of A-axis drive section)

[0266] 169: (Workpiece camera) Camera section

[0267] ME1~ME5: Measurement Elements

[0268] MI1, MI2: Measurement items

[0269] MP1~MP11: Measurement location

[0270] L: Laser

[0271] RL reflected light

[0272] RT: Measurement Path

[0273] W: Workpiece

Claims

1. A coordinate measuring device, comprising: 3-axis translation mechanism; The contact probe is connected to the 3-axis translation mechanism and can move within the measurement space along each axis of the 3-axis translation mechanism. A non-contact optical sensor used to acquire measurement data within the measurement space using light; The memory stores measurement settings, which include measurement positions for determining measurement elements for the shape of the workpiece being measured, and measurement items using the measurement elements. The coordinate system matching unit matches the coordinate system related to the measurement data with the coordinate system related to the shape of the workpiece being measured, based on the measurement data and the shape of the workpiece being measured. When the measurement control unit receives a measurement instruction, it moves the contact probe to the measurement position according to the measurement settings stored in the memory and based on the coordinate system matched by the coordinate system matching unit, using the 3-axis translation mechanism. as well as The measurement unit performs measurements based on the measurement location determined by the contact probe and the measurement items using the measurement elements.

2. The coordinate measuring device according to claim 1, wherein, The non-contact optical sensor is mounted on any axis of the 3-axis translation mechanism. By utilizing the movement of the 3-axis translation mechanism to multiple positions, measurements are taken from various positions within the measurement space, thereby generating measurement space data. The measurement data is based on the measurement spatial data.

3. The coordinate measuring device according to claim 2, wherein, The non-contact optical sensor includes a profilometer that illuminates a strip of measurement light and measures the profile based on reflected light from the measurement space. The non-contact optical sensor moves along a direction intersecting the long side of the measurement light. The contour is the measured spatial data. The measurement control unit detects the position and posture of the workpiece in the measurement space based on the measurement data, determines the measurement path based on the detected position and posture of the workpiece and the measurement settings, and controls the movement of the contact probe through the 3-axis translation mechanism so that the contact probe moves to the measurement position according to the measurement path.

4. The coordinate measuring device according to claim 3, wherein, The non-contact optical sensor also includes a two-dimensional camera device for capturing images of at least a portion of the measurement space. The measurement and control unit detects the position and posture of the workpiece within the measurement space based on the measurement data and the workpiece image captured by the two-dimensional camera device.

5. The coordinate measuring device according to claim 2, wherein, The optical measuring device is a two-dimensional imaging device with an object-side non-telecentric optical system that generates two-dimensional images as the measuring spatial data. The measurement control unit acquires one or more images representing the entire measurement space to determine the location of the measurement object. Based on the determined position, the measurement control unit uses the 3-axis translation mechanism to move the 2D camera device to a position where it can be compared with the shape of the workpiece being measured. The measurement control unit generates a two-dimensional image at the measurement location as measurement space data, detects the position and posture of the workpiece in the measurement space based on the generated measurement space data, determines the measurement path based on the detected workpiece position and posture and the measurement settings, and controls the movement of the contact probe through the 3-axis translation mechanism so that the contact probe moves to the measurement location according to the measurement path.

6. The coordinate measuring device according to claim 2, wherein, The measurement settings include reference data, which contains information related to the shape of the workpiece being measured. The measurement data obtained during the measurement setup will be set as the baseline data.

7. The coordinate measuring device according to claim 6, wherein, The coordinate system matching unit matches the coordinate system associated with the measurement data obtained after receiving the measurement instruction with the coordinate system associated with the reference data.

8. The coordinate measuring device according to claim 1, wherein, The contact probe has a 2-axis rotation mechanism connected to the 3-axis translation mechanism, and is capable of changing its posture. The measurement settings include the orientation of the contact probe relative to the measurement position. When the measurement control unit receives the measurement instruction, it detects the position and posture of the workpiece in the measurement space based on the measurement data. Based on the detected position and posture of the workpiece, the measurement settings, and the coordinate system matched by the coordinate system matching unit, it determines the measurement path and the posture of the contact probe relative to the measurement position. The 3-axis translation mechanism is used to control the movement of the contact probe so that the contact probe moves to the measurement position according to the measurement path. The 2-axis rotation mechanism is used to control the posture of the contact probe relative to the measurement position.

9. The coordinate measuring device according to claim 8, further comprising: A marking probe, which is equipped with optical markings and is disposed separately from the contact probe; An optical measuring device that photographs the optical mark and detects the position and orientation of the mark probe; and The measurement setting unit, when performing the measurement setting, sets the measurement position and the posture of the contact probe relative to the measurement position based on each measurement position indicated by the marker probe detected by the optical measurement device and the posture of the marker probe at each measurement position.

10. The coordinate measuring device according to claim 1, wherein, When the measurement control unit determines multiple workpieces within the measurement space based on the measurement data, it detects the position and posture of each of the determined multiple workpieces based on the measurement data. Based on the detected position and posture of the workpieces, the measurement settings, and the coordinate system matched by the coordinate system matching unit, it determines the measurement path and uses the 3-axis translation mechanism to control the movement of the contact probe so that the contact probe moves to the measurement position according to the measurement path.

11. The coordinate measuring device according to claim 10, wherein, The measurement settings include reference data, which contains information related to the shape of the workpiece being measured. The measurement data obtained during the measurement setup will be set as the baseline data.

12. The coordinate measuring device according to claim 10, wherein, The contact probe has a 2-axis rotation mechanism connected to the 3-axis translation mechanism, and is capable of changing its posture. The measurement settings include the orientation of the contact probe relative to the measurement position. When the measurement control unit determines multiple workpieces within the measurement space based on the measurement data, it detects the position and posture of each workpiece based on the measurement data. Based on the detected position and posture of the workpiece, the measurement settings, and the coordinate system matched by the coordinate system matching unit, it determines the measurement path. The 3-axis translation mechanism is used to control the movement of the contact probe so that the contact probe moves to the measurement position according to the measurement path. The 2-axis rotation mechanism is used to control the posture of the contact probe relative to the measurement position.

13. The coordinate measuring device according to any one of claims 1 to 12, wherein, It also has a dedicated measurement button, which is located on the main body including the measurement control unit and is used to receive the measurement instruction.

14. The coordinate measuring device according to any one of claims 1 to 12, wherein, It also includes a rotary table for placing the workpiece. The measurement control unit controls the rotation angle of the rotary table in such a way that the measurement position is configured within the measurement space.

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