Probe device

Abstract

A probe device for performing electrical measurement of a test object substrate provided with an electrode pad portion in a test region, the probe device comprising: a stage holding the test object substrate in a manner that the electrode pad portion is exposed; a probe substrate having flexibility; a probe arranged in a standing manner in a probe formation region of a surface of the probe substrate; a probe substrate holding member having a fixing portion holding a peripheral portion of the probe substrate in a manner that the probe opposes the electrode pad portion of the test object substrate held to the stage; and an elastic member arranged on a back surface side of the probe substrate, wherein the elastic member applies a force to the probe substrate to make the probe substrate curve by bulging toward a direction of the stage, and the probe substrate holding member is arranged to be relatively movable with respect to the stage in a direction that is at a right angle with respect to the stage.

Description

Technical Field

[0001] The present invention relates to a probe apparatus for performing electrical measurements and inspections on a substrate by contacting a probe with an electrode pad formed on the surface of the substrate to be inspected. Background Technology

[0002] Multiple electrode pads are formed on the surface of a packaging substrate used to mount semiconductor chips. In measuring and inspecting the electrical characteristics of such packaging substrates or other inspection substrates, a probe device equipped with multiple probes is used. In the probe device, it is required that multiple probes simultaneously contact the electrode pads even if there are height variations. Conventional probe devices include those with a two-dimensional arrangement of a mechanical structure using coils to apply force, allowing the probe tips to extend and retract (retract) (see, for example, Patent Document 1). Other types of probes include those with a two-dimensional arrangement of multiple cantilever structures manufactured using MEMS (Micro Electro Mechanical Systems) technology.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-315775 Summary of the Invention

[0006] Summary of the invention

[0007] The problem that the invention aims to solve

[0008] In recent years, advancements in manufacturing technology have led to increasingly higher integration of semiconductor chips. Along with this, the number of electrode pads on the surface of the packaging substrate used to mount these semiconductor chips has increased, and the miniaturization and narrowing of these electrode pads have also progressed. However, probes with the aforementioned spring-coil mechanical structure, probes fabricated using MEMS technology, and the like are difficult to integrate and configure in two dimensions to face the miniaturized and narrowed electrode pads on the surface of the packaging substrate. When inspecting with a probe device, the substrate to be inspected, such as the packaging substrate, is placed on a substrate adsorption plate (stage). When the surface of the substrate adsorption plate and the substrate to be inspected have undulations, the following phenomenon was observed: before the tip of the probe contacts the electrode pads of the substrate to be inspected, interference occurs between other probes and other parts of the probe device and the substrate to be inspected, making contact between the probe and the electrode pads difficult. Furthermore, in the probe device, undulations sometimes occur on the surface (imaginary surface) formed by connecting the tips of multiple probes, further complicating contact between the probe and the electrode pads.

[0009] The present invention was made in view of the above-mentioned problems, and its object is to provide a probe device that can reliably measure and inspect even when the surface of the substrate to be inspected is uneven, when the substrate to be inspected is uneven, when the stage on which the substrate to be inspected is placed is uneven, or when the surface on which the tips of multiple probes are connected to each other is uneven.

[0010] Solution for solving the problem

[0011] To address the aforementioned issues, the present invention provides a probe apparatus for performing electrical measurements on an inspection substrate having electrode pads disposed in the inspection area. The probe apparatus comprises: a stage that holds the inspection substrate in a manner that exposes the electrode pads; a flexible probe substrate; a probe disposed upright in a probe forming area on the surface of the probe substrate; a probe substrate holding member having a fixing portion that holds a peripheral portion of the probe substrate such that the probe faces the electrode pads of the inspection substrate held on the stage; and an elastic member disposed on the back side of the probe substrate, wherein the elastic member applies force to the probe substrate to cause the probe substrate to bulge and bend toward the stage, and the probe substrate holding member is configured to be movable relative to the stage in a direction perpendicular to the stage.

[0012] As a preferred embodiment of the above solution, a gap is formed between the probe substrate holding member and the probe substrate, the elastic member is disposed in the gap, and the deformation of the elastic member is allowed to accompany the bending of the probe substrate.

[0013] As a preferred embodiment of the above-mentioned solution, the elastic member is made of an elastic resin material, and the gap is set to a capacity capable of absorbing the deformation of the elastic member.

[0014] Another aspect of the present invention is a probe device for performing electrical measurements on an inspection substrate having electrode pads disposed in an inspection area on its surface. The probe device comprises: a probe substrate in which probes are erected in a probe forming area on the surface; a probe substrate holding member for holding the probe substrate; a stage having a fixing portion that holds a peripheral portion of the inspection substrate such that the electrode pads face the probe substrate holding member; and an elastic member disposed on the back side of the inspection substrate, wherein the elastic member applies force to the inspection substrate to cause the inspection substrate to bulge and bend toward the probe substrate holding member, and the probe substrate holding member is configured to be movable relative to the stage in a direction perpendicular to the stage.

[0015] As a preferred embodiment of the above solution, a gap is formed between the stage and the substrate to be inspected, the elastic member is disposed in the gap, and the deformation of the elastic member is allowed to accompany the bending of the substrate to be inspected.

[0016] As a preferred embodiment of the above-mentioned solution, the elastic member is made of an elastic resin material, and the gap is set to a capacity capable of absorbing the deformation of the elastic member.

[0017] Invention Effects

[0018] The probe device according to the present invention has the following effect: reliable measurement and inspection can be performed even when the surface of the substrate to be inspected is uneven, the substrate to be inspected is uneven, the stage on which the substrate to be inspected is uneven, or the surface on which the tips of multiple probes are connected to each other is uneven. Attached Figure Description

[0019] Figure 1 This is a bottom view showing the state of the probe substrate holding member holding the probe substrate in the probe device of the first embodiment of the present invention, viewed from below.

[0020] Figure 2-1 This is a cross-sectional view of the probe device according to the first embodiment of the present invention, showing the deformation of the stage by bending upwards.

[0021] Figure 2-2 This is a cross-sectional view of the probe device according to the first embodiment of the present invention, showing the state in which the probe is pressed against the electrode pad portion, indicating that the stage has undergone upward bending deformation.

[0022] Figure 3-1 This is a cross-sectional view of the probe device according to the first embodiment of the present invention, showing the deformation of the stage bending downwards.

[0023] Figure 3-2 This is a cross-sectional explanatory diagram of the probe device according to the first embodiment of the present invention, showing the state in which the stage is bent downwards. It shows the probe being pressed against the electrode pad.

[0024] Figure 4-1 This is a cross-sectional explanatory diagram of the probe device according to the second embodiment of the present invention, showing the process of positioning the probe above the electrode pad portion and moving the probe toward the electrode pad portion.

[0025] Figure 4-2 This is a cross-sectional view of the probe device according to the second embodiment of the present invention, showing the state in which the probe is pressed against the electrode pad portion.

[0026] Figure 4-3 This is a cross-sectional explanatory diagram of the probe device according to the second embodiment of the present invention, showing the process of raising the probe substrate and raising the inspection target substrate together with the fixing part.

[0027] Figure 4-4 This is a cross-sectional explanatory diagram of the probe device according to the second embodiment of the present invention, showing the process of moving the substrate to be inspected and the fixing part together to the side.

[0028] Figure 5 This is a cross-sectional explanatory diagram showing a modified example of the probe device according to the first embodiment of the present invention. Detailed Implementation

[0029] The details of the probe device according to an embodiment of the present invention will now be described based on the accompanying drawings. However, it should be noted that the drawings are schematic and the number of components, dimensions, ratios, and shapes may differ from reality. Furthermore, the drawings also include portions with different dimensional relationships, ratios, and shapes.

[0030] [First Implementation Method]

[0031] (Simplified structure of the probe device)

[0032] use Figures 1 to 3-2 The structure of the probe device 1A according to the first embodiment of the present invention will be described below.

[0033] The substrate 2 for electrical measurement using the probe device 1A of this embodiment is made of insulating resin, glass, ceramic, or the like, and has multiple electrode pads 2A arranged in the central (not shown) inspection area. Wiring (not shown) is connected to each electrode pad 2A.

[0034] The probe device 1A includes a stage 3, a probe substrate 4, multiple probes 5, a probe substrate holding member 6, and an elastic member 7.

[0035] The stage 3 is a rectangular platform with a holding mechanism (not shown) for holding the substrate 2 to be inspected. It should be noted that the upper surface of the stage 3 is the mounting surface 31 on which the substrate 2 to be inspected is mounted. Figure 2-1 As shown, the substrate 2 to be inspected is held in a designated area of ​​the mounting surface 31 such that the electrode pad portion 2A is exposed. It should be noted that the mounting surface 31 is machined to be flat, but depending on the environment in which the probe device 1A is configured, such as... Figure 2-1 As shown, it is also conceivable that there is a situation where it undulates in a way that bends upwards.

[0036] Furthermore, although discussed later, it is also conceivable that... Figure 3-1 and Figure 3-2As shown in the stage 3, the mounting surface 31 is concave from the center downwards. It should be noted that the probe device 1A of this embodiment, in addition to... Figure 2-1 , Figure 3-1 In addition to the undulations of the mounting surface 31 as shown, appropriate electrical measurements can be performed even in cases of complex undulations. The substrate 2 to be inspected is held such that its lower surface is in close contact with the mounting surface 31 of the stage 3, and the electrode pad portion 2A is exposed.

[0037] like Figure 1 and Figure 2-1 As shown, the probe substrate 4 is made of rectangular insulating resin and is flexible. It should be noted that the probe substrate 4 is designed to prevent breakage or cracking even when bent. A probe forming region 4C is located in the center of the surface (lower surface) 4A of the probe substrate 4, and multiple probes 5 are arranged upright. The probes 5 are simply conductive components formed protruding relative to the probe substrate 4, thus the structure is simple and allows for narrow spacing and miniaturization. The protrusion lengths of these probes 5 from surface 4A are all set to the same dimension.

[0038] The probe substrate holding member 6 has a fixing portion 6A that holds the periphery of the probe substrate 4 so that the probe 5 disposed on the probe substrate 4 is aligned with the electrode pad portion 2A of the inspection object substrate 2 held on the stage 3. Figure 2-1 As shown, when the probe substrate 4 is in a flexed state, both ends of the probe substrate 4 in the X direction are held in the fixing part 6A of the probe substrate holding member 6.

[0039] like Figure 2-1 As shown, the elastic member 7 is disposed on the back side 4B of the probe substrate 4. The elastic member 7 applies force to the probe substrate 4, causing the probe substrate 4 to bulge and bend toward the stage 3. As the constituent material of the elastic member 7, various elastic synthetic resins and rubbers such as polyimide, polyamide, polyester, polyethylene, polyvinyl alcohol, polypropylene, polycarbonate, and polystyrene can be used.

[0040] Furthermore, a gap 8 is formed between the probe substrate holding member 6 and the back surface 4B of the probe substrate 4. The aforementioned elastic member 7 is disposed in the gap 8. The gap 8 allows the probe substrate 4 to bend back from a bulging, flexed state, and the elastic member 7 to deform along with the bending. The surface (imaginary surface) formed by connecting the front ends of each probe 5 abuts in a bent state relative to the inspection target substrate 2.

[0041] Furthermore, the probe substrate holding member 6 is configured to move relative to the stage 3 in a direction perpendicular to the stage 3 (in the direction indicated by arrow Z in the figure). Specifically, the probe substrate holding member 6 is configured to be able to move up and down via a lifting drive mechanism (not shown).

[0042] (The operation, function, and effect of the probe device in this embodiment)

[0043] In this embodiment, the surface (imaginary surface) formed by connecting the front ends of each probe 5 is bent and abuts against the substrate 2 being inspected. Therefore, by moving (lowering) the probe substrate holding member 6 toward the stage 3, the front ends of the probes 5 abut against the electrode pads 2A sequentially, starting from the most protruding top, and further lowering the probe substrate holding member 6, thus... Figure 2-2 As shown, probe 5 abuts against all of the electrode pads 2A.

[0044] As described above, starting with the probe 5 that abuts against the electrode pad portion 2A, a reaction force is sequentially received from the electrode pad portion 2A, and the elastic member 7 deforms accordingly. That is, the elastic member 7 deforms as the probe substrate 4 bends back. At this time, the gap 8 set in the probe substrate holding member 6 has sufficient capacity to absorb the amount of deformation of the elastic member 7. Therefore, the surface (imaginary surface) formed by connecting the front ends of multiple probes 5 can be varied in a manner that mimics the surface where the front ends of the electrode pad portion 2A are connected, and all probes 5 reliably contact the corresponding electrode pad portion 2A, thereby enabling electrical measurement.

[0045] Figure 3-1 and Figure 3-2 This indicates that in the probe device 1A of the first embodiment of the present invention, the mounting surface 31 of the stage 3 is a concave curved surface. According to the probe device 1A of this embodiment, as... Figure 3-2 As shown, reliable contact between the probe 5 and the electrode pad portion 2A can be ensured. That is, even when the electrode pad portion 2A of the inspection target substrate 2 placed on the mounting surface 31 is disposed at the bottom of a recess on the surface of the inspection target substrate 2, contact with the electrode pad portion 2A can be ensured because the probe substrate 4 has a plurality of probes 5 bulging downward.

[0046] According to this embodiment, since the simple probe 5 is formed in a way that protrudes from the probe substrate 4, it has the effect of being able to set a short interval according to the spacing between the electrode pad portions 2A on the substrate side of the object being inspected.

[0047] like Figure 2-2 and Figure 3-2As shown, in this embodiment, the probe 5 has a buffering property by means of the elastic member 7, which absorbs the reaction force from the electrode pad portion 2A, thus preventing damage to the probe 5 and the electrode pad portion 2A. Therefore, according to this embodiment, it is not necessary to use a probe with a mechanical structure that applies force by a spring coil as in the past, thereby improving the stability and precision of the inspection.

[0048] [Second Implementation]

[0049] Next, use Figures 4-1 to 4-4 The structure of the probe device 1B according to the second embodiment of the present invention will be described below.

[0050] The substrate 2 used for electrical measurement using the probe device 1B of this embodiment is made of an insulating and flexible resin, and a plurality of electrode pads 2A are arranged in a predetermined area to be inspected on the substrate surface. Wiring (not shown) is connected to each electrode pad 2A.

[0051] The probe device 1B includes: a probe substrate 4, which holds a probe 5 in an upright manner within a probe forming area (not shown) on surface 4A; a probe substrate holding member 6, which holds the probe substrate 4; a stage 3A, which has a fixing part 9, which holds the peripheral portion 2C of the substrate 2 to be inspected, such that the electrode pad portion 2A faces the probe substrate holding member 6; and an elastic member 7, which is disposed on the back side 2B of the substrate 2 to be inspected.

[0052] like Figure 4-1 As shown, in this embodiment, the elastic member 7 applies force to the substrate 2 to be inspected, causing the substrate 2 to bulge and bend toward the probe substrate holding member 6.

[0053] In addition, in this embodiment, the probe substrate holding member 6 is configured to be able to move relative to the stage 3A in a direction perpendicular to the stage 3A (vertical direction).

[0054] The stage 3A has a gap 10 formed between the mounting surface 32 and the substrate 2 to be inspected. An elastic member 7 is disposed in the gap 10. Figure 4-1 Towards Figure 4-2 The elastic member 7 is allowed to deform due to the change in state of the substrate 2 being inspected, which is accompanied by the bending.

[0055] In this embodiment, the elastic member 7 is also made of an elastic resin material, and the gap 10 is set to a capacity that can absorb the deformation of the elastic member 7.

[0056] Next, the operation, function, and effects of the probe device 1B in this embodiment will be explained.

[0057] like Figure 4-1 As shown, in this embodiment, the probe device 1B positions the probe 5 above the electrode pad portion 2A, causing the probe substrate holding member 6 to descend, as... Figure 4-2 As shown, the probe 5 is brought into contact with the electrode pad portion 2A to enable electrical measurement.

[0058] Next, as Figure 4-3 As shown, after the probe substrate holding member 6 is raised in the direction of arrow Z, the fixing part 9 on the stage 3A is raised in the direction of arrow D, thereby making the fixing part 9 able to move laterally relative to the stage 3A.

[0059] Figure 4-4 This indicates that the fixing part 9 has moved in the direction of arrow E. This action can also move the substrate 2 to be inspected in the direction of arrow E, so that the other electrode pads 2A are aligned with the probe 5.

[0060] According to this embodiment, the inspected area of ​​the substrate 2 on which the electrode pad portion 2A is formed can be flexed toward the probe substrate holding member 6 by means of the elastic member 7.

[0061] Therefore, even if there are undulations on the surface (imaginary surface) where the front ends of the multiple probes 5 are connected to each other, the surface (imaginary surface) where the front ends of the electrode pads 2A in the area to be inspected are connected to each other is flexed in a bulging manner. Therefore, the reaction force absorption effect of the elastic member 7 can make the electrode pads 2A and the front ends of the probes 5 reliably contact each other.

[0062] That is, since the surfaces (imaginary surfaces) where the front ends of the electrode pads 2A are connected to each other bulge upwards, the components on the stage 3A side will not interfere with the probe substrate 4 side, and the probe 5 can reliably contact the electrode pads 2A.

[0063] [Other Implementation Methods]

[0064] The first and second embodiments of the present invention have been described above, but it should not be construed as limiting the present invention by the discussion and drawings that constitute a part of the disclosure of the embodiments. Based on this disclosure, those skilled in the art will understand various alternative embodiments, examples, and techniques.

[0065] In this invention, the substrate 2, which is the object of inspection, can also be applied to various substrates such as packaging substrates, printed wiring substrates, flexible substrates, multilayer wiring substrates, and thin film carriers, which have multiple electrode pads on their surface or back.

[0066] For example, in the first embodiment, a structure is formed in which a pair of side edges of the probe substrate 4 are held by the fixing portion 6A of the probe substrate holding member 6, but it can also be formed in a structure that holds all four sides of the probe substrate 4. Similarly, in the second embodiment, a structure can also be formed in which the four sides of the inspection target substrate 2 are held by the fixing portion 9.

[0067] In the first embodiment described above, an elastic member 7 is disposed on the back surface 4B side of the probe substrate 4, but as Figure 5 As shown in the modified example, on the surface 4A of the probe substrate 4, a plurality of ( Figure 5 When two groups of probes 5 are provided in one area, an elastic member 7 may also be provided in the area corresponding to each group of probes 5 on the back surface 4B of the probe substrate 4. Furthermore, as... Figure 5 As shown, it can also be configured such that piezoelectric actuators 11A and 11B are sandwiched between each elastic member 7 and the probe substrate holding member 6. By configuring it in this way, the applied voltage to the piezoelectric actuator 11A can be controlled, thereby controlling the bulge 12 (see reference 11B). Figure 5 The protruding dimension P1 (protruding dimension in the direction of arrow B) of the bulge 13 can be controlled by controlling the applied voltage to the piezoelectric actuator 11B. Similarly, the protruding dimension P2 (protruding dimension in the direction of arrow C) of the bulge 13 can be controlled. In this way, by forming a structure with multiple bulges 12, 13, the probe 5 can reliably contact the electrode pad portions 2A that exist in multiple inspection areas 14, 15 in the substrate 2 being inspected.

[0068] like Figure 5 As shown, even when the mounting surface 31 of the stage 3 has undulations, and when the surface of the substrate 2 being inspected has undulations, by appropriately setting the protrusion dimensions P1 and P2 of each bulge 12 and 13, the probe 5 can reliably contact the electrode pad portion 2A, and interference between the stage 3 and the probe substrate holding member 6 can be prevented. It should be noted that... Figure 5 The probe device 1A shown is configured to have two protrusions 12 and 13, but it can also be configured to have three or more protrusions.

[0069] Furthermore, in the second embodiment described above, an elastic member 7 is disposed on the back surface 2B of the substrate 2 to be inspected. However, it is also possible to form a structure in which the elastic member 7 is sandwiched between the substrate 2 and the stage 3A at multiple locations on the back surface 2B of the substrate 2. Additionally, it is also possible to form a structure where each elastic member 7 is disposed between itself and the mounting surface 31 of the stage 3. Figure 5The piezoelectric actuators 11A and 11B shown have the same structure. By forming such a structure, the inspected area (not shown) where the electrode pad portion 2A is formed can be appropriately positioned (see reference). Figure 5 The protruding deformation of the inspected areas 14 and 15) and the shape corresponding to the surface 4A of the probe substrate 4. It should be noted that, in addition to piezoelectric actuators 11A and 11B, various actuators can be used as the mechanism for displacing the elastic member 7.

[0070] Symbol explanation:

[0071] 1A and 1B probe devices

[0072] 2. Inspect the substrate

[0073] 2A Electrode Pad Section

[0074] 2B Back

[0075] 2C Peripheral

[0076] 3. 3A Stage

[0077] 4. Probe substrate

[0078] 4A surface

[0079] 4B Back

[0080] 4C probe formation region

[0081] 5 probes

[0082] 6. Probe substrate holding component

[0083] 6A Fixing Part

[0084] 7. Elastic Components

[0085] 8 gaps

[0086] 9. Fixing part

[0087] 10 gaps

[0088] 11A, 11B piezoelectric actuators

[0089] 12, 13 Drum section

[0090] Areas 14 and 15 to be inspected

[0091] 31 mounting surfaces

[0092] 32 mounting surfaces

Claims

1. A probe device for performing electrical measurements on a substrate to be inspected, wherein electrode pads are disposed in the area to be inspected, characterized in that, The probe device includes: A stage that holds the substrate to be inspected in a manner that exposes the electrode pads. The probe substrate is flexible; A probe, which is erected in the probe forming region on the surface of the probe substrate; A probe substrate holding member has a fixing portion that holds the peripheral portion of the probe substrate so that the probe is opposed to the electrode pad portion of the inspection object substrate held on the stage. as well as An elastic member is disposed on the back side of the probe substrate. The elastic member applies force to the probe substrate, causing the probe substrate to bulge and bend towards the stage. The probe substrate holding member is configured to move relative to the stage in a direction perpendicular to the stage.

2. The probe device according to claim 1, wherein, A gap is formed between the probe substrate holding member and the probe substrate, the elastic member is disposed in the gap, and the elastic member is allowed to deform in conjunction with the bending of the probe substrate.

3. The probe device according to claim 2, wherein, The elastic member is made of an elastic resin material, and the voids are configured to absorb the amount of deformation of the elastic member.

4. A probe device for performing electrical measurements on an inspection substrate having electrode pads disposed in the inspection area on its surface, characterized in that, The probe device includes: A probe substrate in which probes are arranged in an upright manner in the probe forming area on the surface; A probe substrate holding member that holds the probe substrate; A stage having a fixing part that holds the periphery of the substrate to be inspected so that the electrode pads face the probe substrate holding member; as well as An elastic member is disposed on the back side of the substrate being inspected. The elastic member applies force to the substrate to be inspected, causing the substrate to bulge and bend towards the probe substrate holding member. The probe substrate holding member is configured to move relative to the stage in a direction perpendicular to the stage.

5. The probe device according to claim 4, wherein, A gap is formed between the stage and the substrate to be inspected, and the elastic member is disposed in the gap, allowing the elastic member to deform in conjunction with the bending of the substrate to be inspected.

6. The probe device according to claim 5, wherein, The elastic member is made of an elastic resin material, and the voids are configured to absorb the amount of deformation of the elastic member.

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