Camera device and optical apparatus comprising the same

CN122826518APending Publication Date: 2026-09-25LG INNOTEK CO LTD
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Patent Information

Application Number
CN202580016377.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-02-20
Filing Date
2025-01-20
Publication Date
2026-09-25

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  • Figure CN122826518A_ABST
    Figure CN122826518A_ABST
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Abstract

The present application relates to a camera device and an optical apparatus, the camera device including: a fixed portion; an image sensor; a moving portion including a lens facing the image sensor in an optical axis direction; a tilt guide provided between the fixed portion and the moving portion; a first magnetic body provided on the moving portion; a second magnetic body provided on the fixed portion and generating a holding force through interaction with the first magnetic body; and a driving portion configured to tilt the moving portion with respect to a first axis intersecting the optical axis direction or a second axis intersecting the first axis direction and the first axis, wherein the moving portion and the fixed portion are configured to push the tilt guide with the holding force, the moving portion includes a magnet and a coil that generate an electromagnetic force for moving the lens in the optical axis direction, and the holding force is 1.2 to 25 times the electromagnetic force.
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Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0024262, filed in Korea on February 20, 2024, pursuant to 35 USC § 119, the entire contents of which are incorporated herein by reference as if fully set forth herein. Technical Field

[0003] The embodiments relate to a camera device and an optical device including the camera device. Background Technology

[0004] A camera device is a device configured to capture still photographs or moving images of a subject. Camera devices are mounted on portable devices, drones, vehicles, etc. The camera device may have image stabilization (IS) functions, such as optical image stabilization (OIS) and autofocus (AF). Summary of the Invention

[0005] The embodiments provide a camera device and an optical device that can prevent the performance degradation of OIS operation caused by the tilting of the OIS moving part due to AF driving, and can increase the driving force required for OIS operation.

[0006] A camera device according to one embodiment includes: a fixed part; a movable part including an image sensor and a lens configured to face the image sensor in the optical axis direction; a tilt guide disposed between the fixed part and the movable part; a first magnetic body disposed on the movable part; a second magnetic body disposed on the fixed part to generate a holding force through interaction with the first magnetic body; and a drive part configured to tilt the movable part relative to a first axis intersecting the optical axis direction or a second axis intersecting the first axis, wherein the movable part and the fixed part push the tilt guide by means of the holding force, the movable part including a magnet and a coil that generate an electromagnetic force for moving the lens in the optical axis direction, and the holding force is more than 1.2 times and less than 25 times the electromagnetic force.

[0007] The distance between the magnet and the coil can be less than the distance between the first magnetic body and the second magnetic body. The length of the magnet in the direction facing the coil can be greater than the length of the first magnetic body in the optical axis direction. The length of the magnet in the direction facing the coil can be greater than the length of the second magnetic body in the optical axis direction. The surface area of ​​the first surface of the magnet facing the coil can be greater than the surface area of ​​the first surface of the first magnetic body facing the second magnetic body. The surface area of ​​the first surface of the magnet facing the coil can be greater than the surface area of ​​the first surface of the first magnetic body facing the second magnetic body. The surface area of ​​the first surface of the magnet facing the coil is equal to or greater than the surface area of ​​the first surface of the second magnetic body facing the first magnetic body.

[0008] A camera device according to another embodiment includes: a fixed part; a movable part including an image sensor and a lens configured to face the image sensor in the optical axis direction; a first magnet unit and a second magnet unit disposed on the movable part; a first coil configured to tilt the movable part relative to a first axis intersecting the optical axis direction by interacting with the first magnet unit; and a second coil configured to tilt the movable part relative to a second axis intersecting the first axis and the optical axis direction by interacting with the second magnet unit, wherein the first coil includes a first coil unit and a second coil unit configured to face the first magnet unit, the second coil includes a third coil unit and a fourth coil unit configured to face the second magnet unit, and wherein a first driving signal is applied to the first coil unit, a second driving signal is applied to the second coil unit, a third driving signal is applied to the third coil unit, and a fourth driving signal is applied to the fourth coil unit.

[0009] The camera device may further include a tilting guide disposed between the fixed part and the movable part. The camera device may further include: a first sensor configured to detect the magnetic field of the first magnet unit and output a first output signal; a first controller configured to receive the first output signal and generate a first drive signal and a second drive signal; a second sensor configured to detect the magnetic field of the second magnet unit and output a second output signal; and a second controller configured to receive the second output signal and generate a third drive signal and a fourth drive signal.

[0010] The camera device may further include a circuit board disposed on the fixed part, the circuit board including: a first pad and a second pad electrically connected to the first coil unit and subjected to a first drive signal; a third pad and a fourth pad electrically connected to the second coil unit and subjected to a second drive signal; a fifth pad and a sixth pad electrically connected to the third coil unit and subjected to a third drive signal; and a seventh pad and an eighth pad electrically connected to the fourth coil unit and subjected to a fourth drive signal.

[0011] The camera device may further include: a first sensor configured to detect the magnetic field of a first magnet unit and output a first output signal; a first controller configured to receive the first output signal, generate a first drive signal and a second drive signal, supply the first drive signal to a first pad and a second pad, and supply the second drive signal to a third pad and a fourth pad; a second sensor configured to detect the magnetic field of a second magnet unit and output a second output signal; and a second controller configured to receive the second output signal, generate a third drive signal and a fourth drive signal, supply the third drive signal to a fifth pad and a sixth pad, and supply the fourth drive signal to a seventh pad and an eighth pad.

[0012] The first sensor may include a first Hall sensor configured to detect the magnetic field of the first magnet unit and a first driver configured to generate a second drive signal, and the second sensor may include a second Hall sensor configured to detect the magnetic field of the second magnet unit and a second driver configured to generate a third drive signal and a fourth drive signal.

[0013] The first coil unit and the second coil unit may not be connected to each other, and the third coil unit and the fourth coil unit may not be connected to each other.

[0014] The second coil unit can be disposed between the first coil unit and the first magnet unit, and the fourth coil unit can be disposed between the third coil unit and the second magnet unit.

[0015] The first and second coil units may have overlapping loop shapes, and the third and fourth coil units may have overlapping loop shapes. Attached Figure Description

[0016] The arrangement structure and embodiments will be described in detail below with reference to the accompanying drawings, in which the same reference numerals refer to the same elements, and wherein: Figure 1 This is a perspective view of a camera device according to one embodiment; Figure 2a yes Figure 1 First exploded perspective view of the camera device shown; Figure 2b yes Figure 1 Second exploded perspective view of the camera device shown; Figure 3 It is a perspective view of the camera device without the cover component; Figure 4a It is along Figure 3 A cross-sectional view of the camera device taken by line AB in the diagram; Figure 4b It is along Figure 3 A cross-sectional view of the camera device taken from the CD line; Figure 4c It is along Figure 3 A cross-sectional view of the camera assembly taken along the EF line; Figure 4d It is along Figure 3 A cross-sectional view of the camera device taken by the GH line; Figure 4e This is a cross-sectional view showing the protrusion of the cover component; Figure 5 It is an exploded three-dimensional view of the bobbin, rolling components, and magnet; Figure 6 It is an exploded perspective view of the coil, retainer, circuit board, sensor base, and housing; Figure 7a This is a first exploded perspective view of the retainer, filter, circuit board, sensor base, and magnet. Figure 7b This is a second exploded perspective view of the retainer, filter, circuit board, sensor base, and magnet. Figure 7c This is a 3D view of the sensor base and circuit board assembly; Figure 8 It is a three-dimensional view of the retainer, rolling element, coil, position sensor, circuit board and sensor base; Figure 9a This is a front-view perspective view of the tilting guide component; Figure 9b This is a rear-view perspective view of the tilting guide. Figure 9c This is a front perspective view of a tilting guide according to another embodiment; Figure 9d yes Figure 9c Rear-view perspective view of the tilting guide shown; Figure 9e It is along Figure 4a The AB line in the diagram includes... Figure 9c and Figure 9d A cross-sectional view of the camera device with the tilting guide shown; Figure 9f It is along Figure 4aThe CD line in the middle includes Figure 9c and Figure 9d A cross-sectional view of the camera device with the tilting guide shown; Figure 10a It is a three-dimensional view of the shell; Figure 10b It is an exploded perspective view of the housing, coil, magnet, position sensor, circuit board, and motion suppressor; Figure 10c It is a three-dimensional assembly view of the housing, rolling elements, coil, circuit board, position sensor, magnet, and motion suppressor; Figure 11a It is a perspective view of the cover component, sensor base, retainer, circuit board, magnet, rolling component, tilting guide and reinforcing component; Figure 11b It shows Figure 11a Another embodiment of the reinforcing member shown; Figure 12 It is a three-dimensional view of the shell, magnetic body, magnet, movement suppressor, tilt guide and rolling component; Figure 13 It is a 3D view of the circuit board, the first coil, the second coil, the first controller, and the second controller; Figure 14a The electrical connections between the first controller, the first coil, the first sensor, and the first board are shown. Figure 14b The electrical connections between the second controller, the second coil, the second sensor, and the second board are shown. Figure 15 The electromagnetic force between the coil and the magnet, as well as the holding force applied between the magnetic bodies, are shown. Figure 16a The distance between the coil and the magnet, as well as the distance between the magnetic objects, are shown. Figure 16b The thickness and surface area of ​​the magnetic body are shown. Figure 17a This is a view showing the electromagnetic force generated by the interaction between the magnet unit and the coil unit, as well as the movement of the OIS moving part; Figure 17b It shows the result of Figure 17a The movement of the OIS moving part caused by the electromagnetic force shown; Figure 18 It is a perspective view of a camera assembly including a lens module; Figure 19a The first position of the OIS moving part is shown; Figure 19b The second position of the OIS moving part is shown; Figure 20 The electrical connections between the first to fourth coil units, the first sensor, the second sensor, and the circuit board are shown according to another embodiment. Figure 21a This is a perspective view of the optical device according to this embodiment; Figure 21b This is a perspective view of an optical device according to another embodiment; and Figure 22 It is shown Figure 21a and Figure 21b A view showing the construction of the optical device. Detailed Implementation

[0017] In the following description, embodiments of the present invention that specifically achieve the above objectives will be described with reference to the accompanying drawings.

[0018] In the following description of the embodiments, it will be understood that when an element is referred to as being formed "on" or "below" another element, it can be directly "on" or "below" the other element, or it can be indirectly positioned with one or more intermediate elements in between. Furthermore, it will be understood that "on" or "below" an element can mean based on the upward or downward direction of that element.

[0019] Furthermore, relative terms such as “first,” “second,” “upper,” “lower,” and “below” used in the following description are used to distinguish one substance or element from another without requiring or including any physical or logical relationship or order between these substances or elements. In all the accompanying drawings, the same reference numerals denote the same elements.

[0020] Unless otherwise defined, the terms “comprise,” “include,” or “have” as used in the foregoing description are used to indicate the presence of a feature, step, or combination thereof described in the specification, and should be understood to not exclude the presence or possibility of additionally including one or more different features, steps, or combinations thereof. Furthermore, the terms “correspond,” etc., may include at least one of the meanings of “face” or “overlap.”

[0021] In the following description, a camera module according to an embodiment and an optical device including the camera module will be described with reference to the accompanying drawings. For ease of description, although a quadrilateral coordinate system (x, y, z) is used to describe the camera module according to the embodiment, the lens moving device may be described using certain other coordinate systems, and the embodiments are not limited thereto. In the drawings, the X-axis and Y-axis refer to directions perpendicular to the optical axis OA, i.e., the Z-axis. The Z-axis direction, as the optical axis direction, can be defined as "one of the first directions to the third direction", the X-axis direction can be defined as "another of the first directions to the third direction", and the Y-axis direction can be defined as "the remaining one of the first directions to the third direction". For example, the optical axis direction may be a direction perpendicular to the imaging area of ​​the image sensor.

[0022] Furthermore, the first axis can be an axis perpendicular to the optical axis and extending through it, and the second axis can also be an axis perpendicular to the optical axis and extending through it. For example, the first axis and the second axis can be perpendicular to each other. For example, the X-axis can be defined as one of the first axis and the second axis, and the Y-axis can be defined as the other of the first axis and the second axis.

[0023] The X-axis direction can be defined as one of a first axis direction and a second axis direction, and the Y-axis direction can be defined as the other of a first axis direction and a second axis direction. The optical axis direction can be parallel to this optical axis direction or a direction along the optical axis itself. Furthermore, the optical axis can be the optical axis of a lens mounted on the lens barrel. Alternatively, for example, the optical axis can be an axis perpendicular to the imaging area (or sensor surface) of the image sensor and extending through the center of the imaging area (or sensor surface). In the following description, the term "terminal" may be used interchangeably with "pad," "electrode," or "conductive layer."

[0024] In an embodiment, in the engagement between a protrusion and a hole configured to engage two components, one of the two components may be an engaging protrusion (or an engaging hole), and the other of the two components may be a corresponding engaging hole (or engaging protrusion).

[0025] The camera device according to the embodiment can perform a hand-shake correction function and an autofocus function. The "hand-shake correction function" can be a function that moves the lens in a direction perpendicular to the optical axis or tilts the lens relative to the optical axis to eliminate vibrations (or movements) caused by the user's hand tremors. Furthermore, the term "autofocus function" can refer to a function that moves the lens along the optical axis according to the distance to the object, thereby automatically focusing on the object to obtain a clear image on the image sensor. In the following, the term "camera device" may be used interchangeably with "camera," "actuator," "camera module," "imaging device," or "shooting device."

[0026] Figure 1 This is a perspective view of the camera device 200 according to an embodiment. Figure 2a yes Figure 1 The first exploded perspective view of the camera device 200 shown. Figure 2b yes Figure 1 The second exploded perspective view of the camera device 200 shown. Figure 3 This is a perspective view of the camera device 200 with the cover component 300 removed. Figure 4a It is along Figure 3 The sectional view of camera device 20 taken by line AB. Figure 4b It is along Figure 3 A cross-sectional view of camera device 200 taken from the CD line. Figure 4c It is along Figure 3 A cross-sectional view of camera device 200 taken along the EF line. Figure 4d It is along Figure 3 A cross-sectional view of camera device 200 taken along the GH line. Figure 4e This is a cross-sectional view of the protrusion 311 of the cover member 300. Figure 5 It is an exploded perspective view of the spool 110, the rolling component 21, and the magnet 130. Figure 6 This is an exploded perspective view of the coil 110, retainer 140, circuit board 800, sensor base 270, and housing 210. Figure 7a This is a first exploded perspective view of the retainer 140, filter 610, circuit board 800, sensor base 270, and magnet 31. Figure 7b This is a second exploded perspective view of the retainer 140, filter 610, circuit board 800, sensor base 270, and magnet 31. Figure 7c This is a 3D view of the sensor base 270 and circuit board 800 assembled together. Figure 8 It is a perspective view of the retainer 140, rolling member 21, coil 120, position sensor 170, circuit board 800, and sensor base 270. Figure 9a This is a front-view perspective view of the tilted guide 60. Figure 9b This is a rear-view perspective view of the tilted guide 60. Figure 9c This is a front perspective view of the tilting guide 60-1 according to another embodiment. Figure 9d yes Figure 9c The rear-view perspective view of the tilting guide 60-1 shown. Figure 9e It is along Figure 4a The section intercepted by line AB includes Figure 9c and Figure 9e A cross-sectional view of the camera device according to the embodiment of the tilt guide 60-1 shown. Figure 9f It is along Figure 4b The CD line in the middle is cut off, including Figure 9dThe image shows a cross-sectional view of the camera device according to an embodiment of the tilt guide 60-1. Figure 10a This is a three-dimensional view of the casing 210. Figure 10b It is an exploded perspective view of the housing 210, coil 230, magnet 32, position sensor 240, circuit board 190 and motion suppressor 80. Figure 10c It is a perspective view of the assembly of housing 210, rolling member 63, coil 230, circuit board 190, position sensor 240, magnet 32 ​​and movement suppressor 80. Figure 11a This is a perspective view of the cover component 300, sensor base 270, retainer 140, circuit board 800, magnet 31, rolling component 63, tilting guide 60 and reinforcing component 70. Figure 12 It is a perspective view of the housing 210, the magnetic body 32, the coil 230, the movement suppressor 80, the tilt guide 60, and the rolling member 62.

[0027] Reference Figures 1 to 12 The camera device 200 may include a fixed part, an AF moving part, an OIS moving part 100, and a support part. The OIS moving part 100 may also be referred to as a "motion unit", "shake unit", "moving unit", "moving module" or "tilt module".

[0028] The fixing part can be a fixing element. In other words, the fixing part may not move in the direction of the optical axis. Alternatively, the fixing part may not move or tilt in the direction perpendicular to the optical axis. The component attached to the fixing part may correspond to the fixing part.

[0029] The fixing part may include a housing 210. The fixing part may include a cover member 300. For example, the fixing part may include a component disposed on or attached to the cover member 300. For example, the fixing part may include a coil 230 disposed on the housing 210. The fixing part may include at least one of the magnetic elements 32 of the movement suppressor 80.

[0030] The AF moving part can move relative to the fixed part in the optical axis direction. For example, the AF moving part may include a spool 110. In another embodiment, the AF moving part may also include a component (e.g., a magnet 130) coupled to the spool 110. In another embodiment, the AF moving part may also include a lens module 400 coupled to the spool 110.

[0031] OIS Mobile Unit 100 (see...) Figure 2aThe moving part can move or tilt relative to the fixed part in the left-right direction based on a first axis (e.g., X-axis, for example, pitch) intersecting the optical axis (or the direction of the optical axis). Furthermore, the moving part of the OIS can move or tilt relative to the fixed part in the left-right direction based on a second axis (e.g., Y-axis, for example, yaw) intersecting the optical axis (or the direction of the optical axis). For example, the first axis can intersect the optical axis (or the direction of the optical axis), and the second axis can intersect both the optical axis (or the direction of the optical axis) and the first axis. For example, the first axis can be perpendicular to the direction of the optical axis, and the second axis can be perpendicular to both the direction of the optical axis and the first axis.

[0032] For example, the OIS moving part 100 may include an AF moving part. Furthermore, the OIS moving part 100 may include an image sensor 810. The OIS moving part 100 may include a circuit board 800 on which the image sensor 810 is disposed. Furthermore, the OIS moving part 100 may include a sensor base 270 on which at least a portion of the circuit board 800 is disposed. Furthermore, the OIS moving part 100 may include a retainer 140 coupled to the sensor base 270. The OIS moving part 100 may also be referred to as a "first moving part," and the AF moving part may also be referred to as a "second moving part." For example, the first moving part may include an AF moving part. Furthermore, the OIS moving part 100 may include an image sensor 810. The OIS moving part 100 may include a circuit board 800 on which the image sensor 810 is disposed. Furthermore, the OIS moving part 100 may include a sensor base 270 on which at least a portion of the circuit board 800 is disposed. Furthermore, the OIS moving part 100 may include a retainer 140 coupled to the sensor base 270. The OIS moving part 100 may also be referred to as the "first moving part", and the AF moving part may also be referred to as the "second moving part". For example, the first moving part may include the sensor base 270 and the circuit board 800.

[0033] For example, the OIS moving part 100 may include a magnet 310 corresponding to, facing, or overlapping with the coil 230. The OIS moving part 100 may include components disposed on or combined with at least one of the holder 140, sensor base 270, or circuit board 800. For example, the OIS moving part 100 may include magnets 310 and 130 disposed on the holder 140. For example, the OIS moving part 100 may include a magnet 31 disposed on the sensor base 270. For example, the OIS moving part 100 may include at least one of an image sensor 810, sensor 170, coil 120, gyroscope sensor 820, circuit element 815, or controller 830 disposed on the circuit board 800. In another embodiment, the magnet 310 may be disposed on a fixed part, and the coil 230 may be disposed on the OIS moving part.

[0034] The support portion can support the OIS moving portion relative to the fixed portion. For example, the support portion may include a tilting guide 60. For example, the support portion may include rolling members 62 and 63.

[0035] A spool 110, intended to house a lens or lens barrel, may be disposed on a retainer 140. The spool 110 may also be referred to as a "lens retainer," "lens housing," or "lens carrier." The spool 110 is movable in the optical axis direction. For example, the spool 110 can be moved in a first direction (e.g., the Z-axis direction) by means of the electromagnetic interaction between the coil 120 and the magnet 130. Furthermore, the lens module 400 can be moved in a first direction (e.g., the Z-axis direction) by means of the electromagnetic interaction between the coil 120 and the magnet 130.

[0036] The coil 120 and the magnet 130 can constitute an AF drive unit configured to move or drive the AF moving part. The spool 110 can be included in the OIS moving part, and the spool 110 or the lens module 400 can tilt or rotate by a predetermined angle relative to the first axis or the second axis.

[0037] Reference Figure 5 The spool 110 may include an opening 101 configured to allow the spool 110 to be coupled to the lens module 400. The shape of the opening 101 in the spool 110 may correspond to the shape of the lens module 400 mounted in the spool. For example, the shape of the opening may be circular, elliptical, or polygonal. However, this disclosure is not limited thereto. Although Figure 1 Although not shown, the spool 110 may include at least one stop disposed on at least one of its upper and lower surfaces. The stop of the spool 110 may be configured to protrude from the upper (or lower) surface of the spool 110 in a first direction or an upward (or downward) direction, and prevent the upper surface of the spool 110 from directly colliding with the inner surface of the upper plate 301 of the cover member 300 (or the lower portion of the retainer 140). The spool 110 may include a mounting portion 115 on which a magnet 130 is disposed or disposed. For example, the mounting portion 115 may be a groove recessed from the outer surface of the spool 110.

[0038] Reference Figure 6The spool 110 may include multiple side surfaces or outer surfaces 110A to 110D. For example, the spool 110 may include a first side surface 110A, a second side surface 110B, a third side surface 110C, and a fourth side surface 110D. For example, the second side surface 110B may face the first side surface 110A, or may be located opposite to the first side surface 110A based on the optical axis OA. The third side surface 110C and the fourth side surface 110D may be located between the first side surface 110A and the second side surface 110B. For example, the fourth side surface 110D may face the third side surface 110C, or may be located opposite to the third side surface 110C based on the optical axis OA. Although Figure 6 The spool 110 is shown to include four side surfaces, but in another embodiment, the spool 110 may include three, five or more side surfaces.

[0039] For example, the mounting portion 115 may be formed on the first side surface 110A. For example, the lower portion of the mounting portion 115 may be closed, rather than open towards the lower surface of the spool 110. Furthermore, the upper portion of the mounting portion 115 may be closed, rather than open towards the upper surface of the spool 110. In another embodiment, for example, the mounting portion 115 may include an opening towards at least one of the upper or lower surfaces of the spool 110.

[0040] The spool 110 may include a receiving portion 112 configured to receive at least a portion of the rolling member 21. For example, at least a portion of the receiving portion 112 may be disposed on a first side surface 110A of the spool 110. The receiving portion 112 may be a recess recessed from the outer side surface (e.g., the first side surface 110A) of the spool 110. The receiving portion 112 may also be referred to as a "receiving recess," "groove," or "guide groove." To reduce friction between the rolling member 21 and the receiving portion, a lubricant (e.g., grease) may be disposed in the receiving portion 112 of the spool 110. For example, the spool 110 may include a first receiving portion 112A configured to receive the rolling member 21A therein and a second receiving portion 112B configured to receive the rolling member 21B therein. For example, a placement portion 115 may be disposed between the first receiving portion 112A and the second receiving portion 112B. For example, the first receiving portion 112A (or the second receiving portion 112B) may include an opening toward the upper surface of the spool 110. In another embodiment, the upper portion of each of the receiving portions 112A and 112B may be closed rather than open towards the upper surface of the spool 110. For example, the lower portion of each of the receiving portions 112A and 112B may be closed rather than open towards the lower surface of the spool 110. For example, the receiving portion 112 may extend in the optical axis direction. For example, the receiving portion 112 may extend in the optical axis direction to form between the upper and lower surfaces of the spool 110. For example, when viewed from above, the receiving portion 112 may have a triangular shape. However, the receiving portion 112 is not limited to this and may have a polygonal shape (e.g., a rectangular shape, a pentagonal shape, etc.). When viewed from above, for example, the receiving portion 112 may have a "V" shape or a "U" shape.

[0041] The magnet 130 can be disposed, coupled, or fixed to the spool 110. For example, the magnet 130 can be disposed on or coupled to the first side surface 110A of the spool 110. For example, the magnet 130 can be disposed in or coupled to the mounting portion 115 in the spool 110. For example, the magnet 130 can be disposed between the first rolling member 21A and the second rolling member 21B. The magnet 130 can have a shape corresponding to the first side surface 110A, for example, a cuboid shape. In another embodiment, for example, at least one of the ends of the magnet 130 can have an inclined shape. For example, the magnet 130 can include a first side surface 13A facing the coil 120 and a second side surface 14B opposite to the first side surface 13A. The first side surface 13A of the magnet 130 can be exposed from the first side surface 110A of the spool 110. To increase the electromagnetic force, the magnet 130 can be a quadrupole magnet. For example, magnet 130 can have two N poles and two S poles.

[0042] For example, magnet 130 may include a first magnet having N and S poles, a second magnet having S and N poles, and a partition wall disposed between the first and second magnets. Here, the partition wall is an almost completely non-magnetic portion and may include regions that have almost no polarity. The partition wall may be filled with air or a non-magnetic material and may be referred to as a "neutral region". For example, the first and second magnets may face each other in the optical axis direction such that the different polarities of the first and second magnets face each other in the optical axis direction. In another embodiment, magnet 130 may be a bipolar magnet having two different polarities and a boundary surface naturally formed between the different polarities. In another embodiment, for example, magnet 130 may have one N pole and one S pole.

[0043] For example, magnet 130 may be a bipolar magnet in which the N pole and S pole are separated or arranged in the direction of the optical axis. In another embodiment, magnet 130 may be a magnet in which the N pole and S pole are separated or arranged in a direction perpendicular to the optical axis. In yet another embodiment, magnet 130 may be a bipolar magnet in which the N pole and S pole are separated in a direction perpendicular to the optical axis.

[0044] Retainer 140 may be disposed in cover member 300. Retainer 100 may have a chamber configured to receive spool 110 therein. Retainer 140 may include a hole 30A corresponding to the hole 101 in spool 110. For example, hole 30A may be a through hole and a chamber through which at least a portion of spool 110 (or lens module 400) is exposed. For example, hole 30A in retainer 140 may expose the imaging area of ​​image sensor 810. Retainer 140 may also be referred to as a “housing”. For example, hole 30A may be located at the center or central region of retainer 140. For example, hole 30A in retainer 140 may be a through hole or chamber formed through retainer 140 in the optical axis direction. Hole 30A in retainer 140 may have a shape corresponding to the shape of spool 110, such as a polygonal shape (e.g., a quadrilateral or octagonal shape) or a circular shape (or elliptical shape). However, hole 30A is not limited to these and may have various shapes.

[0045] The retainer 140 may include a plurality of sides 41A to 41D. The retainer 140 may include a corner portion located between two adjacent sides and connecting the two adjacent sides to each other. The retainer 140 may include a first side 41 corresponding to or facing a first side surface 110A of the spool 110, a second side 41B corresponding to or facing a second side surface 110B of the spool 110, a third side 41C corresponding to or facing a third side surface 110C of the spool 110, and a fourth side 41D corresponding to or facing a fourth side surface 110D of the spool 110. Based on the optical axis, the first side portion 41A (or the first side surface or the first outer surface) of the retainer 140 can be located opposite to the second side portion 41B (or the second side surface or the second outer surface) of the retainer 140, and based on the optical axis, the third side portion 41C (or the third side surface or the third outer surface) of the retainer 140 can be located opposite to the fourth side portion 41D (or the fourth side surface or the fourth outer surface) of the retainer 140. Each of the first side portions 41A to the fourth side portions 41D of the retainer 140 can be parallel to a corresponding configuration in the side plate 302 of the cover member 300.

[0046] Reference Figure 7a and Figure 7b The retainer 140 may include a mounting portion 142A, on which the coil 120 is disposed. For example, the mounting portion 142A may be disposed or formed at a first side portion 41A of the retainer 140. For example, the mounting portion 142A may be a through-hole formed through the first side portion 41A of the retainer 140. Since the mounting portion 142A has a through-hole shape, a portion of the retainer 140 may not be located between the coil 120 and the magnet 130, thereby increasing the electromagnetic force between the magnet 130 and the coil 120. Furthermore, since a portion of the retainer 140 is not located between the position sensor 170 and the magnet 130, the output and sensitivity of the position sensor 170 can be improved. In another embodiment, the mounting portion 142A may have a groove shape recessed from the outer (or inner) side surface of the first side portion 41A of the retainer 140.

[0047] The retainer 140 may include placement portions 143A and 143B, with a magnet 310 disposed on the placement portions 143A and 143B. For example, the retainer 140 may include a first placement portion 143A and a second placement portion 143B, with a first magnet unit 310A disposed on the first placement portion 143A and a second magnet unit 310B disposed on the second placement portion 143B. For example, the first placement portion 143A may be disposed or formed at the second side portion 41B of the retainer 140. For example, the first placement portion 143A may be a groove recessed from the outer (or inner) side surface of the second side portion 41B. For example, the second placement portion 143B may be disposed or formed at the third side portion 41C of the retainer 140. For example, the second placement portion 143B may be a groove recessed from the outer side surface of the third side portion 41C of the retainer 140.

[0048] In another embodiment, the first mounting portion 143A may be a through-hole formed through the second side portion 41B of the retainer 140, and the second mounting portion 143B may be a through-hole formed through the third side portion 41C of the retainer 140. Here, since each of the mounting portions 143A and 143B has a through-hole, a portion of the retainer 140 may not be located between the coil 230 and the magnet 210, thereby increasing the electromagnetic force between the magnet 310 and the coil 230. Furthermore, since a portion of the retainer 140 is not located between the position sensor 240 and the magnet 310, the output and sensitivity of the position sensor 240 can be improved.

[0049] For example, the retainer 140 may include a recess 142 in which at least a portion of the circuit board 800 (e.g., the second plate 802) is disposed. Since at least a portion of the second plate 802 is disposed in the recess 142 of the retainer 140, the second plate 802 and the magnetic body 82 may not protrude excessively from the outer surface of the first side portion 41A of the retainer 140. The thickness of the second plate 802 and the magnetic body 82 may protrude from the outer surface of the first side portion 41A. Therefore, it is possible to prevent an increase in the size of the camera device 200 in the direction perpendicular to the optical axis.

[0050] Reference Figure 7a and Figure 7bThe retainer 140 may include a receiving portion 116, in which at least another portion of the rolling member 21 is disposed or received. For example, at least a portion of the receiving portion 116 may be disposed on a first side portion 41A of the retainer 140. The receiving portion 116 may be a recess recessed from the inner side surface of the retainer 140 (e.g., the inner side surface of the first side portion 41A). The receiving portion 116 may also be referred to as a "receiving recess," "groove," or "guide groove." At least a portion of the receiving portion 116 of the retainer 140 may correspond to, face, or overlap with the receiving portion 112d of the bobbin 110. For example, the retainer 140 may include a first receiving portion 116A and a second receiving portion 116B, in which at least other portions of the first rolling members B1 and B2 are received in the first receiving portion 116A, and at least other portions of the second rolling members B3 and B4 are received in the second receiving portion 116B. For example, the placement portion 142A of the retainer 140 may be disposed between the first receiving portion 116A and the second receiving portion 116B of the retainer 140. For example, the first receiving portion 116A (or the second receiving portion 116B) may have an opening toward the upper surface of the retainer 140. In another embodiment, the upper portion of the receiving portion 116 may be closed rather than open toward the upper surface of the retainer 140. For example, the lower portion of the receiving portion 116 may be closed rather than open toward the lower surface of the retainer 140. For example, the receiving portion 116 may extend in the optical axis direction. For example, the receiving portion 116 may extend in the optical axis direction. The receiving portion 116 may be formed between the upper and lower surfaces of the retainer 140 to extend in the optical axis direction.

[0051] When viewed from above, for example, the receiving portion 116 of the retainer 140 may have a triangular shape. However, the receiving portion 116 is not limited to this and may have a polygonal shape (e.g., a quadrilateral shape, a pentagonal shape, etc.). When viewed from above, the receiving portion 116 may have a "V" shape or a "U" shape. When viewed in the optical axis direction or from above, for example, the receiving portion 116 may face or overlap with the upper plate 301 of the cover member 300. For example, at least a portion of the upper plate 301 of the cover member 300 may cover the receiving portion 116.

[0052] The camera device 200 may include a rolling member 21 disposed between the spool 110 and the retainer 140. The rolling member 21 may also be referred to as a "ball member," "ball," or "ball bearing." At least a portion of the rolling member 21 may contact the spool 110 and the retainer 140, and may roll or rotate between the spool 110 and the retainer 140, thereby supporting the movement of the spool 110 in the optical axis direction. When the spool 110 moves in the optical axis direction, the rolling member 21 can reduce the friction between the spool 110 and the retainer 140. By means of the rolling or rotating motion of the rolling member 21, the spool 110 may slide or glide in the optical axis direction while in contact with the rolling member 21.

[0053] Although the rolling member 21 can be made of, for example, a metal, plastic, or resin material, this disclosure is not limited thereto. The rolling member 21 can have a circular shape and a diameter sufficient to support movement of the spool 110 in the optical axis direction. For example, the rolling member 21 can be disposed between the outer side of the spool 110 and the inner side of the retainer 140. For example, the rolling member 21 can be disposed between the first side 110A of the spool 110 and the first side 41A of the retainer 140. For example, the rolling member 21 can be disposed between the receiving portion 112 of the spool 110 and the receiving portion 116 of the retainer 140. For example, at least a portion of the rolling member 21 can contact the receiving portion 112, and at least another portion of the rolling member 21 can contact the receiving portion 116 of the retainer 140.

[0054] The rolling member 21 may include at least one ball member. For example, the rolling member 21 may include two or more ball members B1 to B4. For example, the rolling member 21 may include a first rolling member 21A and a second rolling member 21B, the first rolling member 21A being disposed between the first receiving portion 112A of the roller 110 and the first receiving portion 116A of the retainer 140, and the second rolling member 21B being disposed between the second receiving portion 112B of the roller 110 and the second receiving portion 116B of the retainer 140.

[0055] For example, the first rolling member 21A may include at least one ball. For example, the first rolling member 21A may include multiple balls B1 and B2. The second rolling member 21B may include at least one ball. For example, the second rolling member 21B may include multiple balls B3 and B4. In another embodiment, each of the first rolling member 21A and the second rolling member 21B may include one ball. For example, each of the first rolling member 21A and the second rolling member 21B may include three or more balls. For example, each of the first rolling member 21A and the second rolling member 21B may include an uppermost ball at the highest height, a lowermost ball at the lowest height, and at least one intermediate ball between the uppermost and lowermost balls. For example, the diameter of the uppermost ball may be larger than the diameter of the intermediate ball, and the diameter of the lowermost ball may be larger than the diameter of the intermediate ball. For example, the diameters of the uppermost ball and the lowermost ball may be equal to each other. In another embodiment, the diameters of the uppermost ball, the lowermost ball, and the intermediate ball may be equal to each other.

[0056] For example, each of the first rolling member 21A and the second rolling member 21B may include a first ball (uppermost ball), a second ball (lowermost ball), and a third ball (middle ball) arranged in the optical axis direction, and the diameter of the first ball may be larger than the diameter of the third ball. Furthermore, the diameter of the second ball may be larger than the diameter of the third ball. For example, the diameters of the first ball and the third ball may be equal to each other. In another embodiment, the diameter of the first ball may be larger than the diameter of the second ball. In yet another embodiment, the diameter of the first ball may be smaller than the diameter of the second ball. In still another embodiment, the diameters of the first ball, the second ball, and the third ball may be equal to each other.

[0057] For example, the diameter of each of the first and second balls can be 0.85 mm or more and 0.95 mm or less, and the diameter of the third ball can be 0.75 mm or more and 0.85 mm or more. In another embodiment, each of the first rolling member 21A and the second rolling member 21B can include four balls. Here, the diameter of each of the uppermost and lowermost balls can be 0.85 mm or more and 0.95 mm or less, and the diameter of each of the two intermediate balls can be 0.75 mm or more and 0.85 mm or less.

[0058] When viewed from above, the coil 120 and the magnet 130 can be positioned between the first rolling member 21A and the second rolling member 21B. This is so that the rolling member 21 can stably support the spool 110 without tilting, thereby improving the reliability of autofocus.

[0059] In another embodiment, each of the first rolling member 21A and the second rolling member 21B may be in the form of a shaft or a roller. Alternatively, the first rolling member 21A and the second rolling member 21B may be replaced by a sliding member (e.g., a shaft or a roller).

[0060] The camera device 200 may include a magnetic body 82 that corresponds to, faces, or overlaps with the coil 120 and the magnet 130. For example, the magnetic body 82 may be configured to correspond to, face, or overlap with the magnet 130 in a second direction.

[0061] An attractive force can be applied between the magnetic body 82 and the magnet 130. For example, an attractive force can be applied between the magnetic body 82 and the magnet 130 in a direction perpendicular to the optical axis (or a second direction). For example, the magnetic body 82 can be disposed on the OIS moving part. The magnetic body 82 can be disposed on the holder 140. The magnetic body 82 can be disposed on the circuit board 800 (e.g., the second plate 802). For example, the coil 120 can be disposed on a first surface of the second plate 802 facing the magnet 130, and the magnetic body 82 can be disposed on a second surface of the second plate 802 opposite to the first surface of the second plate 802. The magnetic body 82 can be bonded, attached, or fixed to the second plate 802 by means of an adhesive. In another embodiment, the magnetic body 82 can be disposed on the housing 210.

[0062] The magnetic body 82 can be made of a material that can be attracted by a magnet. For example, the magnetic body 82 can be made of a metallic material that can be attracted by a magnet. For example, the magnetic body 82 can be made of a magnetized metallic material. For example, the magnetic body 82 can be a magnet. The magnetic body 82 can also be referred to as a "yoke". The magnetic body 82 can be used to increase or enhance the electromagnetic force between the magnet 130 and the coil 120.

[0063] Since magnet 130 is disposed on spool 110 and magnetic body 82 is disposed on retainer 140, spool 110 can be attracted toward retainer 140, which includes magnetic body 82, due to the attraction between magnetic body 82 and magnet 130. By means of the attraction between magnetic body 82 and magnet 130, spool 110 and retainer 140 can press against rolling member 21, thereby stably supporting spool 110.

[0064] Magnetic bodies 82 and 130 can be "pressing units" or "pressing members". By means of the pressing units, as the spool 110 moves in the optical axis direction, contact between the spool 110 and the rolling member 21, as well as contact between the retainer 140 and the rolling member 21, can be maintained. In other words, by means of the attractive force between the magnet 130 and the magnetic body 82, the rolling member 21 can stably support the spool 110 relative to the retainer 140.

[0065] In another embodiment, the coil 120 may not be disposed on the retainer 140 or the plate 802, but rather on the housing 210. In another embodiment, the coil 120 may be disposed on the first side 71A of the housing 210. In another embodiment, the plate 802 may be omitted, and the circuit board 190 may further include a third plate (not shown) disposed on the first side (e.g., 71A) of the housing 210. In this embodiment, the coil 120 may be disposed on the third plate of the circuit board 190 and may be electrically connected to the circuit board 190. Here, the yoke 82 may be disposed on the second surface of the third plate opposite to the first surface of the third plate on which the coil 120 is disposed.

[0066] In another embodiment, magnet 130 may be disposed on retainer 140, and coil 120 may be disposed on spool 110. For example, magnetic body 82 may be disposed on retainer 140 together with magnet 130. For example, magnet 130 may be disposed between magnetic body 82 and coil 120. In yet another embodiment, magnetic body 82 may be disposed on spool 110 together with coil 120 so as to face magnet 130 disposed on retainer 140. Camera device 200 may further include conductive member, for example, a conductive member configured to electrically connect coil 120 disposed on spool 110 to second plate 802 of circuit board 800.

[0067] Reference Figure 7b The retainer 140 may include a mounting portion 45A, on which the filter 610 is mounted or disposed. The mounting portion may be disposed or formed on the lower surface of the retainer 140. For example, the mounting portion 45A may be a recessed groove from the lower surface of the retainer 140. For example, the mounting portion 45A may include a bottom surface 5A and a side surface 5B, the bottom surface 5A being stepped relative to the lower surface of the retainer 140 in the optical axis direction, and the side surface 5B connecting the lower surface of the retainer 140 to the bottom surface 5A of the mounting portion 45A. For example, a hole 30A may be formed through the bottom surface 5A of the mounting portion 45A.

[0068] The retainer 140 may include recesses 45B, which are disposed at or formed in the corners of the inner surface of the mounting portion 45A. The recesses 45B may have a structure that recesses from the optical axis toward the corners of the inner surface of the mounting portion 45A. The recesses 45B can prevent adhesives (e.g., UV epoxy) configured to attach or bond the filter 610 to the mounting portion 45A from spilling to the outside.

[0069] The retainer 140 may include a clearance groove 46 configured to avoid spatial interference with the circuit element 815. For example, the clearance groove 46 may be disposed or formed on the lower surface of the retainer 140. For example, the clearance groove 46 may be recessed from the lower surface of the retainer 140. The clearance groove 46 may correspond to, face, or overlap with the circuit element 815 in the optical axis direction. For example, the clearance groove 46 may be located between the mounting portion 45A and a side portion of the lower surface of the retainer 140. For example, the clearance groove 46 may include a first clearance groove 46A and a second clearance groove 46B, which are positioned relative to each other based on the mounting portion 45A or the filter 610. In another embodiment, the clearance groove 46 may include four clearance grooves disposed between the aperture 30A and four sides of the retainer 140.

[0070] The retainer 140 may include a recess 47 corresponding to the protrusion 216 of the sensor base 270. The protrusion 216 of the sensor base 270 and the recess 47 in the retainer 140 can serve as guides to allow easy assembly of the sensor base 270 with the retainer 140, and can increase the mating surface between the sensor base 270 and the retainer 140, thereby increasing the bonding force between the sensor base 270 and the retainer 140.

[0071] For example, the groove 47 may be recessed from the lower surface of the retainer 140. For example, the groove 47 may be provided or formed in a corner or corner region of the lower surface of the retainer 140. The groove 47 in the retainer 140 may have a shape corresponding to the protrusion 216 of the sensor base 270. The retainer 140 may include a groove or hole 48 corresponding to the protrusion 17 of the sensor base 270. For example, the protrusion 17 of the sensor base 270 may be inserted into or engaged in the groove 48 in the retainer 140. For example, the groove 48 may be provided or formed on the bottom surface of the groove 47. For example, the groove 48 may be recessed from the bottom surface of the groove 47 of the retainer 140.

[0072] In another embodiment, the retainer 140 may include a protrusion projecting from the lower surface of the retainer 140 instead of the recess 47, and the sensor base 270 may include a recess recessing from the upper surface of the sensor base 270 and engaging with the protrusion of the retainer 140 instead of the protrusion 216. In another embodiment, the protrusion 17 may be formed at the retainer 140, and the recess 48 may be formed in the sensor base 270.

[0073] The camera device may include a filter 610 disposed on or attached to the retainer 140. For example, the filter 610 may be disposed below the retainer 140. For example, the filter 610 may be attached to the lower surface of the retainer 140. For example, the filter 610 may be disposed in the mounting portion 45A of the retainer 140. The filter 610 can be used to prevent light of a specific frequency band passing through the lens module 400 from entering the image sensor 810. For example, the filter 610 may be an ultraviolet filter. For example, the filter 610 may be configured to be parallel to a plane perpendicular to the optical axis OA.

[0074] The filter 610 can be bonded to the retainer 140 (or the mounting portion 45A) by means of an adhesive (not shown). For example, the peripheral region of the filter 610 can be bonded to the bottom surface of the mounting portion 45A. For example, the adhesive can be epoxy, thermosetting adhesive, UV-curing adhesive, etc. For example, at least a portion of the filter 610 can correspond to, face, or overlap with the lens module 400 and / or the image sensor 810 in the optical axis direction.

[0075] The sensor base 270 may be disposed below the retainer 140. The sensor base 270 may be disposed within the housing 210. The sensor base 270 may be coupled to the retainer 140. The sensor base 270 may also be referred to as a "retainer". The retainer 140 may also be referred to as a "first housing" (or "first retainer"), and the sensor base 270 may also be referred to as a "second housing" (or "second retainer"). Furthermore, the retainer 140 and the sensor base 270 may be collectively referred to as a single term without distinction, such as "housing", "retainer", or "sensor base". In another embodiment, the sensor base 270 and the retainer 140 may be integrally formed with each other.

[0076] For example, the sensor base 216 may include a protrusion 216 projecting from its upper surface. The protrusion 216 may also be referred to as a "post". For example, the protrusion 216 may correspond to, face, or overlap with a groove 47 in the retainer 140 in the optical axis direction. At least a portion of the protrusion 216 of the sensor base 270 may be inserted into the groove 47 in the retainer 140. For example, at least a portion of the protrusion 216 may be coupled to the groove 47 in the retainer 140. For example, at least a portion of the protrusion 216 may be coupled to the retainer 140 by means of an adhesive.

[0077] For example, the sensor base 270 may include a body 270A and a protrusion 216 projecting from the upper surface of the body 270A. The protrusion 216 may include multiple protrusions. For example, the body 270A may have a shape corresponding to the first plate 801 of the circuit board 800. For example, the protrusion 216 may be disposed in the corner region of the upper surface of the body 270A. For example, the protrusion 216 may include four protrusions 216A to 216D disposed in the four corner regions of the upper surface of the body 270. In another embodiment, the housing 210 may include at least one protrusion disposed in at least one of the four corner regions of the upper surface of the body 270, and the retainer 140 may include at least one groove 48 corresponding to at least one protrusion of the housing 210.

[0078] The sensor base 270 or body 270A may include sides 51A to 51D, which correspond to, face, or overlap with sides 41A to 41D of the retainer 140.

[0079] The sensor base 270 may include a receiving portion 56 in which the gyroscope sensor 820 is disposed, or the receiving portion 56 is configured to avoid spatial interference with the gyroscope sensor 820. For example, the receiving portion 56 may be formed through the sensor base 270 in the optical axis direction. For example, the receiving portion 56 may be formed through the body 270A in the optical axis direction. In another embodiment, the receiving portion 56 may be a recess from the upper surface of the body 270A. The receiving portion 56 may include an opening facing the outer side of the sensor base 270.

[0080] The sensor base 270 may include a receiving portion 155, in which the controller 830 is disposed or received within the receiving portion 155. The receiving portion 155 may be a recessed groove extending from the lower surface of the sensor base 270 or the lower surface of the body 270A. In another embodiment, the receiving portion 155 may be a through hole formed through the sensor base 270 or the body 270A in the optical axis direction.

[0081] The sensor base 270 may include a receiving portion 28A configured to house the magnetic body 31 therein. The receiving portion 28A may be disposed or formed at the lower portion or lower surface of the sensor base 270. For example, the receiving portion 28A may be a recessed groove from the lower portion or lower surface of the sensor base 270. For example, the receiving portion 28A may be disposed or formed on the lower surface of the body 270A. For example, the receiving portion 28A may have a shape corresponding to the magnetic body 31.

[0082] The sensor base 270 may include a mounting portion 25A, in which at least a portion of the tilt guide 60 is disposed, or in which the mounting portion 25A accommodates at least a portion of the tilt guide 60. For example, the mounting portion 25A may be a recessed groove from the lower surface of the sensor base 270. For example, the mounting portion 25A may have a shape corresponding to or overlapping with the tilt guide 60. For example, the mounting portion 25A may include a bottom surface that is stepped relative to the lower surface of the sensor base 270 in the optical axis direction and a side surface connecting the bottom surface to the lower surface of the sensor base 270. For example, the bottom surface of the mounting portion 25A may be located at a position higher than the lower surface of the sensor base 270.

[0083] Reference Figure 4a and Figure 4b Since the mounting portion 25A for inserting or setting at least a portion of the tilt guide 60 is formed on the lower surface of the sensor base 270, the sensor base 270 may include a partition wall (or guide) 272 disposed on the lower surface of the sensor base 270 around the tilt guide 60. The tilt guide 60 may be spaced apart from the partition wall 272, and the partition wall 272 may be configured to surround the tilt guide 60. By means of the partition wall 272, it is possible to prevent the tilt guide 60 from separating from or detaching from the sensor base 270.

[0084] The sensor base 270 may include a protrusion (or projection) 28 protruding from the lower part or lower surface of the sensor base 270. For example, the protrusion 28 may protrude from the bottom surface of the mounting portion 25A of the sensor base 270. For example, the length of the protrusion 28 may be greater than the depth of the mounting portion 25A. For example, the length of the protrusion 28 may be the distance (or the shortest distance) between the bottom surface of the mounting portion 25A and the lower surface (or lower end) of the protrusion 28. The depth of the mounting portion 25A may be the distance (or the shortest distance) between the lower surface of the sensor base 270 and the bottom surface of the mounting portion 25A.

[0085] In another embodiment, the length of the protrusion 28 may be equal to or less than the depth of the placement portion 25A. For example, the protrusion 28 may have a shape that corresponds to or coincides with the hole 60A in the inclined guide 60.

[0086] For example, the protrusion 28 of the sensor base 270 may correspond to, face, or overlap with the hole 60A in the tilt guide 60. For example, at least a portion of the protrusion 28 of the sensor base 270 may be disposed in the hole 60A in the tilt guide 60.

[0087] For example, a receiving portion 28A may be provided or formed at the protrusion 28 of the sensor base 270. The receiving portion 28A may be a groove recessed from the lower surface of the protrusion 28 of the sensor base 270. In another embodiment, the protrusion 28 may be omitted, and the receiving portion 28A may be formed at the lower surface of the sensor base 270.

[0088] For example, the protrusion 28 may be disposed between the ball members 62A and 62B. For example, the protrusion 28 (or the magnetic body 31) may overlap with the ball members 62A and 62B in a direction perpendicular to the optical axis (e.g., in a second direction).

[0089] The sensor base 270 may include a groove 29 in which a rolling member 62 is disposed or accommodated. The groove 29 may be formed in the lower surface of the sensor base 270. For example, the groove 29 may be recessed from the lower surface of the sensor base 270. The number of grooves 29 may be equal to the number of rolling members 62. For example, the groove 29 may include two grooves 29A and 29B spaced apart from each other. For example, the two grooves 29A and 29B may be spaced apart from each other in the X-axis direction. For example, a protrusion 28 of the sensor base 270 may be disposed between the two grooves 29A and 29B in the sensor base 270. The groove 29 may contact the rolling member 62 at at least one location. For example, the groove 29 may include a bottom surface and at least one side surface connected to the bottom surface. The at least one side surface may be an inclined surface. For example, the groove 29 may include a bottom surface and a plurality of inclined surfaces. The shapes of the inclined surfaces of the groove 29 may be identical to each other. In another embodiment, at least one of the inclined surfaces of the groove 29 may have a different shape than the remaining inclined surfaces.

[0090] Reference Figure 7cThe protrusion 216 of the sensor base 270 may include a recess 212A formed therein, into which at least a portion of the first plate 801 of the circuit board 800 is inserted or disposed. For example, a corner of the first plate 801 may be inserted into or engaged with the recess 212A in the protrusion 216 of the sensor base 270. For example, the recess 212A may be formed in the side of the protrusion 216 facing the corner of the circuit board 800. A recess 83 may be formed in at least one corner of the circuit board 800, and the recess 83 is inserted into or engaged with the recess 212A in the protrusion 216. The recess 212A in the protrusion 216 of the sensor base 270 may serve as a bonding guide configured to guide the bonding of the first plate 801 to the sensor base 270 and may be used to prevent the first plate 801 from rotating or from separating from the sensor base 270.

[0091] The circuit board 800 can be disposed, coupled, or fixed to the sensor base 270. For example, the circuit board 800 can be coupled to the sensor base 270 by means of adhesive or fixing members. For example, at least a portion of the circuit board 800 can be coupled or fixed to the retainer 140. The circuit board 800 can be disposed, coupled, or fixed to the body 270A.

[0092] Circuit board 800 may include at least one of rigid PCB, flexible PCB, or rigid-flex PCB. For example, circuit board 800 may include both rigid PCB and flexible PCB. Circuit board 800 may also be referred to as a "board section", "board", or "printed circuit board".

[0093] For example, circuit board 800 may include a first plate (or "first region") 801 disposed, coupled, or fixed to sensor base 270. For example, the first plate 801 may be disposed, coupled, or fixed to body 270A of sensor base 270. For example, the lower surface of the first plate 801 may be coupled to the upper surface of sensor base 270 or the upper surface of body 270A. For example, the lower surface of the first plate 801 may be coupled to the upper surface of sensor base 270 or the upper surface of body 270A by means of adhesive. Circuit board 800 may include a second plate (or second region) 802 connected to the first plate 801 and disposed on a side of retainer 140. For example, the second plate 802 may be disposed, coupled, or fixed to at least one of the sides of retainer 140 (e.g., first side 41A).

[0094] although Figure 7a The circuit board 800 shown includes a second board, but in another embodiment, the circuit board 800 may include multiple boards disposed on each side of the retainer 140.

[0095] For example, the second board 802 may be connected to a first side of the first board 801. For example, the second board 802 may be bent towards a first side 41A of the retainer 140 at the first side of the first board 801. For example, the second board 802 may extend upward from the first board 801. The circuit board 800 may include a third board 803 and a fourth board 804, with a connector 805 disposed on or provided at the third board 803, and the fourth board 804 connecting the first board 802 to the third board 803. For example, the first board 801 may be a printed circuit board. For example, the second board 802 may be a flexible printed circuit board. For example, the third board 803 may be a rigid printed circuit board. For example, the fourth board 804 may be a flexible printed circuit board.

[0096] For example, a rigid printed circuit board may include: a plurality of conductive layers (or circuit patterns) spaced apart from each other in the optical axis direction; and an insulating layer disposed between adjacent conductive layers. For example, a flexible circuit board may include a conductive layer (or a circuit pattern), a first insulating layer disposed on the conductive layer, and a second insulating layer disposed below the conductive layer. In another embodiment, the flexible circuit board may include a first conductive layer, a second conductive layer, a first insulating layer disposed between the first and second conductive layers, a second insulating layer disposed on the first conductive layer, and a third insulating layer disposed below the second conductive layer.

[0097] Image sensor 810 can be mounted on first plate 801. Image sensor 810 can be configured to correspond to, face, or overlap with lens module 400 and / or filter 610 in the optical axis direction.

[0098] Image sensor 810 may include an imaging region configured to detect light. Here, the imaging region may also be referred to as an effective region, a light-receiving region, a sensor surface, or an active region. For example, the imaging region may include multiple pixels forming an image. Image sensor 810 may be conductively or electrically connected to a first plate 801. The imaging region may correspond to, face, or overlap with lens module 400 and / or filter 610 in the optical axis direction.

[0099] The camera device 200 may include circuit elements 815 disposed on the first board 801. For example, the circuit element 815 may include at least one of passive elements (e.g., capacitors or resistors), active elements (e.g., sensors, memory, or driver ICs), or circuit patterns. For example, to avoid spatial interference with the image sensor 810, the circuit element 815 may be disposed between the image sensor 810 and the outer peripheral edge (e.g., side) of the first board 801.

[0100] The camera device 200 may include a controller 830 disposed on a circuit board 800. For example, the controller 830 may be a driver IC. For example, the controller 830 may be disposed on a first board 801. For example, the controller 830 may be disposed below the first board 801. For example, the controller 830 may be disposed, coupled to, or fixed to the lower surface of the first board 801. For example, the controller 830 may be electrically connected to or conductively connected to the first board 801. In another embodiment, the controller 830 may be disposed on a second board 802.

[0101] For example, controller 830 may be electrically connected to or conductively connected to coil 120 to supply a drive signal to coil 120. For example, controller 830 may be electrically connected to or conductively connected to position sensor 170. Position sensor 170 may be a Hall sensor and may include two input terminals and two output terminals. Here, controller 830 may supply power to the two input terminals of position sensor 170. Controller 830 may receive the output signal of position sensor 170 from the two output terminals of position sensor 170 and may use the output signal of position sensor 170 to control the drive signal (e.g., drive current) supplied to coil 120.

[0102] In another embodiment, controller 830 may be omitted. Position sensor 170 may be a driver IC including a Hall sensor. When position sensor 170 is a driver IC including a Hall sensor, controller 830 may be omitted. When position sensor 170 is a driver IC including a Hall sensor, position sensor 170 may include first to sixth terminals electrically connected to circuit board 800. The first and second terminals of position sensor 170 may be terminals configured to receive power signals, the third terminal may be a terminal configured to transmit or receive clock signals (SCL), and the fourth terminal may be a terminal configured to transmit or receive data signals. The fifth and sixth terminals of position sensor 170 may be electrically connected to or connected to the first coil 120 to supply drive signals to the first coil 120.

[0103] The camera device 200 may include a gyroscope sensor 820 disposed on a circuit board 800. For example, the gyroscope sensor 820 may output rotational angular velocity information corresponding to the movement of the camera device 200. The gyroscope sensor 820 may be implemented as a dual-axis or three-axis gyroscope sensor or an angular velocity sensor.

[0104] For example, the gyroscope sensor 820 may be disposed on the first plate 801. For example, the gyroscope sensor 820 may be disposed below the first plate 801. For example, the gyroscope sensor 820 may be disposed, coupled to, or fixed to the lower surface of the first plate 801. For example, the gyroscope sensor 820 may be electrically connected to or conductively connected to the first plate 801. For example, at least one of the gyroscope sensor 820 and the controller 830 may be disposed close to the third plate 803. For example, at least one of the gyroscope sensor 820 and the controller 830 may be disposed close to the first side surface of the first plate 801 adjacent to or connected to the third plate 803. The gyroscope sensor 820 and the controller 830 may be disposed closer to the first side surface of the first plate 801 than to the second side surface of the first plate 801, and the second side surface of the first plate 801 may be disposed opposite to the first side surface of the first plate 801.

[0105] Coil 120 may be disposed, coupled, or fixed to circuit board 800 (e.g., second board 802). For example, coil 120 may be electrically connected to or connected to circuit board 800 (e.g., second board 802). For example, coil 120 may be electrically connected to or connected to circuit board 800 (e.g., second board 802) by means of conductive adhesive or solder. For example, coil 120 may be disposed or coupled to second board 802 and may be electrically connected to or connected to second board 802. Coil 120 may move the AF moving part (e.g., spool) by means of interaction with magnet 130. Coil 120 may be disposed on retainer 140.

[0106] The coil 120 can be configured to correspond to, face, or overlap with the magnet 130 in a direction perpendicular to the optical axis. For example, the coil 120 can be disposed on the holder 140 so as to correspond to, face, or overlap with the magnet 130 in a second direction (e.g., the X-axis direction) or in a direction from the first side 41A of the holder 140 toward the second side 41B. For example, the coil 120 can be disposed on the first side 41A of the holder 140. The coil 120 can also be disposed in the mounting portion 142A of the holder 140.

[0107] For example, coil 120 may include a cavity or a hole. For example, coil 120 may have the form of a loop or a closed curve. Coil 120 may include a loop coil body. For example, coil 120 may have a loop form with a wire wound around an outer surface that is perpendicular to both the optical axis OA and the first side 41A. For example, coil 120 may have a loop form with a length in the horizontal direction (or a third direction) greater than its length in the vertical direction (or the optical axis direction).

[0108] To generate an electromagnetic force through electromagnetic interaction with magnet 130, a drive signal can be applied to coil 120. For example, the drive signal can be applied to coil 120 from circuit board 800 or controller 830. Here, the drive signal supplied to coil 120 can be a DC signal and can be voltage-type or current-type. In another embodiment, for example, the drive signal applied to coil 120 can include at least one of DC and AC signals.

[0109] The coil 120, to which a drive signal is supplied, can electromagnetically interact with the magnet 130 disposed at the line cylinder 110, and the AF moving part can move in a first direction by means of the electromagnetic force generated by the electromagnetic interaction between the coil 120 and the magnet 130. Since the strength and / or direction of the drive signal (e.g., drive current) is controlled by the controller 830, the movement of the AF moving part in the first direction can be controlled, thereby performing autofocus.

[0110] The camera device 200 may include a position sensor 170 for AF feedback operation. The position sensor 170 can detect the position or displacement of the spool 110 in the optical axis direction. For example, the position sensor 170 can detect a magnet 130 disposed on the spool 110. In another embodiment, in addition to the magnet 130, a sensing magnet may be disposed on the spool 110 facing the position sensor 170, and the position sensor 170 can detect the sensing magnet or the magnetic field of the sensing magnet, thereby detecting the displacement of the spool.

[0111] For example, position sensor 170 may be disposed on holder 140. For example, position sensor 170 may be disposed on first side 41A of holder 140. For example, position sensor 170 may be disposed in mounting portion 142A of holder 140. For example, position sensor 170 may be disposed within a cavity in coil 120. In another embodiment, position sensor 170 may be disposed outside a cavity in coil 120.

[0112] For example, position sensor 170 can be disposed on circuit board 800. Position sensor 170 can be coupled to circuit board 800. For example, position sensor 170 can be coupled to circuit board 800 by conductive adhesive or solder. For example, position sensor 170 can be electrically connected to or coupled to second board 802. For example, position sensor 170 can be electrically connected to or coupled to second board 802 by conductive adhesive or solder. For example, position sensor 170 can be disposed, coupled to, or fixed to a first surface of second board 802. For example, position sensor 170 can correspond to, face, or overlap with magnet 130 in a direction perpendicular to the optical axis or in a second direction.

[0113] The position sensor 170 can detect the displacement of the bobbin 110 in the optical axis direction. For example, the position sensor 170 can detect the magnetic field or magnetic field strength of the magnet 130 mounted on the bobbin 110 based on the movement of the bobbin 110, and can output an output signal.

[0114] For example, position sensor 170 may be a Hall sensor. Here, position sensor 170 may include two input terminals to which a drive signal is applied and two output terminals from which an output signal is output. Circuit board 800 may be electrically connected to the two input terminals and the two output terminals of position sensor 170. Circuit board 800 or controller 830 may supply drive signals to the two input terminals of position sensor 170, and the output signals output from the two input terminals of position sensor 170 may be transmitted to circuit board 800 or controller 830.

[0115] In another embodiment, the position sensor 170 can be implemented as a driver IC type that includes a Hall sensor. For example, when the position sensor 170 is a driver IC that includes a Hall sensor, the position sensor 170 can send and receive data with external devices via data communication using protocols such as I2C communication.

[0116] For example, if the position sensor 170 is a driver IC that includes a Hall sensor, the position sensor 170 can send and receive data with an external device via data communication using a protocol such as I2C communication.

[0117] For example, if the position sensor 170 is a driver IC that includes a Hall sensor, the position sensor 170 may include: a first terminal and a second terminal for receiving an input power signal or drive signal; a third terminal for a clock signal; a fourth terminal for a data signal; and a fifth and a sixth terminal for supplying a drive signal to the coil 120. The first to sixth terminals of the position sensor 170 may be electrically connected to or conductively connected to the circuit board 800.

[0118] The magnet 310 may be disposed on or attached to the OIS moving part 100. For example, the magnet 310 may be disposed on or attached to the holder 140. The magnet 310 may include a first magnet unit 310A disposed on the second side 41B of the holder 140 and a second magnet unit 310B disposed on the third side 41C of the holder 140.

[0119] For example, a first magnet unit 310A may be disposed on a first mounting portion 143A of the holder 140, and a second magnet unit 310B may be disposed on a second mounting portion 143B of the holder 140. For example, the first magnet unit 310A and the second magnet unit 310B may be positioned offset from each other in a second or third direction. For example, the first magnet unit 310A and the second magnet unit 310B may be disposed on a moving portion (e.g., the holder 140) so that they do not overlap each other in a second or third direction. For example, the first magnet unit 310A and the second magnet unit 310B may be disposed on two different sides of the holder 140 so that they do not overlap each other in a second or third direction.

[0120] In another embodiment, the magnet 310 may be disposed on the housing 210, and the coil 230 may be disposed on the holder 140. For example, the magnet 310 and the coil 230 may be configured such that... Figure 3 The positions of the central magnet 310 and the coil 230 are opposite to each other. Here, the camera device 200 may include additional conductive parts, such as a circuit board, circuit components, or conductive components, which are configured to electrically connect or electrically connect the second coil 230 to the circuit board 800.

[0121] Each of the first magnet unit 310A and the second magnet unit 310B can be a bipolar magnet comprising an N pole and a S pole. For example, each of the first magnet unit 310A and the second magnet unit 310B can be a bipolar magnet divided into an N pole and an S pole in the optical axis direction. For example, the N pole (or S pole) of each of the first magnet unit 310A and the second magnet unit 310B can be set higher than the S pole (or N pole).

[0122] In another embodiment, each of the first magnet unit 310A and the second magnet unit 310B may be a bipolar magnet divided into N poles and S poles in a direction perpendicular to the optical axis. In yet another embodiment, each of the first magnet unit 310A and the second magnet unit 310B may be a quadrupole magnet including two N poles and two S poles.

[0123] Reference Figure 10a and Figure 10b The housing 210 may include a cavity configured to house the OIS moving part 100. For example, the housing 210 may have a shape corresponding to the OIS moving part 100 (e.g., the holder 140 or the sensor base 270), such as a polygonal shape (e.g., a quadrilateral or octagonal shape) or a circular shape (or an elliptical shape). However, the housing 210 is not limited to this and may have various shapes. The housing 210 may also be referred to as a "base".

[0124] The housing 210 may include a plurality of sides 71A to 71D corresponding to the sides 41A to 41D of the retainer 140 or the sides 51A to 51D of the sensor base 270. The housing 210 may include a corner located between two adjacent sides.

[0125] The housing 210 may include a lower portion (or lower plate) 42 disposed below the sides 71A to 71D. The lower portion 42 may be connected to the sides 71A to 71D. For example, the lower portion 42 may also be referred to as the "bottom," "bottom surface," or "body." For example, the sides 71A to 71D may extend upward from or protrude from the lower portion 42.

[0126] Reference Figure 10a The housing 210 may include: a first side portion 71A, which corresponds to, faces, or overlaps with the first side portion 41A of the retainer 140; a second side portion 71B, which corresponds to, faces, or overlaps with the second side portion 41B of the retainer 140; a third side portion 71C, which corresponds to, faces, or overlaps with the third side portion 41C of the retainer 140; and a fourth side portion 71D, which corresponds to, faces, or overlaps with the fourth side portion 41D of the retainer 140. The first side portion (or first side surface or first outer surface) 71A of the housing 210 may be configured to face the second side portion (second side surface or second outer surface) 71B of the housing 210, and the third side portion (or third side surface or fourth outer surface) 71C of the housing 210 may be configured to face the fourth side portion (or fourth side surface or fourth outer surface) 71D of the housing 210. For example, each of the first side portion 71A to the fourth side portion 71D of the housing 210 may be configured to be parallel to the corresponding one of the side plates 302 of the cover member 300.

[0127] The housing 210 may include a step 411 disposed on the lower portion of at least one of the sides 71A to 71D. For example, the step 411 may protrude from the outer surface of at least one of the sides 71A to 71D of the housing 210 in a direction perpendicular to the optical axis. For example, the step 411 may face or overlap with the side plate 302 of the cover member 300 in the optical axis direction. For example, the step 411 may be bonded to the side plate 302 of the cover member 300 by an adhesive.

[0128] The housing 210 may include mounting portions 141A and 141B, in which the coil 230 is disposed or housed. For example, each of the mounting portions 141A and 141B may be a through hole formed through a side portion of the housing 210. In another embodiment, each of the mounting portions 141A and 141B may be a recess recessed from a side portion of the housing 210.

[0129] The housing 210 may include a first mounting portion 141A in which a first coil 230A is disposed, and a second mounting portion 141B in which a second coil 310B is disposed. For example, the first mounting portion 141A may be disposed or formed at a second side portion 71B of the housing 210, and the second mounting portion 141B may be disposed or formed at a third side portion 71C of the housing 210. For example, the first mounting portion 141A may be formed through the second side portion 71B, and the second mounting portion 141B may be formed through the third side portion 71C of the housing 210. The first mounting portion 141A may include an opening toward the upper surface of the second side portion 71B of the housing 210, and the second mounting portion 141B may include an opening toward the upper surface of the third side portion 71C of the housing 210. In another embodiment, the first mounting portion (or the second mounting portion) may not include an opening toward the second side portion (or the third side portion) of the housing 210.

[0130] The housing 210 may include a receiving portion 49A configured to receive a magnetic body 32 therein. The receiving portion 49A may be disposed or formed at the lower portion 42 of the housing 210. The receiving portion 49A may also be disposed or formed on the upper surface of the lower portion 41. For example, the receiving portion 49A may be a recessed groove from the upper surface of the lower portion 42 of the housing 210. The receiving portion 49A may have a shape corresponding to the magnetic body 32, such as a quadrilateral shape or a circular shape. For example, the receiving portion 49A of the housing 210 may correspond to, face, or overlap with the receiving portion 28A of the sensor base 270.

[0131] although Figure 10b Although not shown, at least another portion of the tilt guide 60 may be disposed on the lower portion 142 of the housing 210, or a groove configured to receive at least another portion of the tilt guide 60 may be formed in the lower portion 142 of the housing 210.

[0132] The housing 210 may include a groove 55 disposed or accommodated therein by a rolling member 63. The groove 55 may be formed in the upper surface of the lower portion 42 of the housing 210. For example, the groove 55 may be recessed from the upper surface of the lower portion 42 of the housing 210. The number of grooves 55 in the housing 210 may be equal to the number of rolling members 63. For example, the groove 55 may include two grooves 55A and 55B spaced apart from each other. For example, the two grooves 55A and 55B may be spaced apart from each other in the Y-axis direction. For example, the direction in which the two grooves 55A and 55B in the housing 210 are spaced apart from each other may be perpendicular to the direction in which the two grooves 29A and 29B in the sensor base 270 are spaced apart from each other. For example, a receiving portion 49A may be disposed between the two grooves 55A and 55B in the housing 210.

[0133] The groove 55 in the housing 210 can contact the rolling member 63 at at least one point. For example, the groove 55 may include a bottom surface and at least one side surface connected to the bottom surface. At least one side surface of the groove 55 may be an inclined surface. For example, the groove 55 may include a bottom surface and a plurality of inclined surfaces. The inclined surfaces of the groove 55 may have the same shape. In another embodiment, at least one of the inclined surfaces of the groove 55 may have a different shape from the remaining inclined surfaces.

[0134] The housing 210 may include a protrusion 215 projecting in a direction perpendicular to the optical axis. For example, the protrusion 215 may project from a side of the housing 210. For example, the protrusion 215 may project from the outer surface of the fourth side portion 71D of the housing 210. For example, the protrusion 215 may be formed such that at least a portion of the fourth side portion 71D projects in a direction parallel to a line extending through and perpendicular to the optical axis. For example, the protrusion 215 may include a groove (or cavity) 16A, in which at least a portion of the fourth plate 804 is disposed or received. For example, the groove 16A in the protrusion 215 may include an upward-facing opening.

[0135] Reference Figure 10b The groove 16A in the protrusion 215 may be provided with engaging grooves 215A and 215B, in which the movement suppressor 80 is inserted, engaged, or fixed. For example, engaging grooves 215A and 215B may be formed in two facing inner surfaces of the groove 16A in the protrusion 215. For example, engaging grooves 215A and 215B may extend in the optical axis direction. For example, to facilitate easy insertion or engagement of the movement suppressor 80 from above, each of the engaging grooves 215A and 215B may include an opening toward the upper surface of the protrusion 215.

[0136] The maximum length of the protrusion 215 in the optical axis direction can be less than the maximum length of the housing 210 in the optical axis direction. With this construction, the space required for the circuit board 800 to extend outward can be easily ensured, and a compact camera device can be achieved.

[0137] The coil 230 can be mounted on the fixed part. For example, the coil 230 can be mounted on the housing 210. The coil 230 can interact with the magnet 310 mounted on the OIS moving part 100 to tilt or rotate the OIS moving part 100 by a predetermined angle relative to a first axis (e.g., the X-axis) or a second axis (e.g., the Y-axis).

[0138] Coil 230 may include a first coil 230A corresponding to, facing, or overlapping the first magnet unit 310A. Coil 230 may include a second coil 230B corresponding to, facing, or overlapping the second magnet unit 310B.

[0139] For example, the first coil 230A may correspond to, face, or overlap with the first magnet unit 310A in the second direction, and the second coil 230B may correspond to, face, or overlap with the second magnet unit 310B in the third direction. For example, the first coil 230A may correspond to, face, or overlap with the coil 120 in the second direction. For example, the first coil 230A may be disposed on the second side 71B of the housing 210, and the second coil 230B may be disposed on the third side 71C of the housing 210.

[0140] The first coil 230A may include multiple coil units. The second coil 230B may include multiple coil units. Although in Figure 13 The first coil 230A includes two coil units 27A and 27B and the second coil 230B includes two coil units 27C and 27D. However, in another embodiment, each of the first coil 230A and the second coil 230B may include three or more coil units.

[0141] Each of coil units 27A to 27D may include a cavity or a hole. For example, each of coil units 27A and 27B may have a toroidal or closed-curve shape. Each of coil units 27A and 27B may be a toroidal coil body.

[0142] The second coil unit 27B can be disposed between the first coil unit 27A and the magnet unit 310A, and the fourth coil unit 27D can be disposed between the third coil unit 27C and the magnet unit 310B.

[0143] The coil units 27A and 27B of the first coil 230A can overlap each other to define a single toroidal shape. The coil units 27C and 27D of the second coil 230B can overlap each other to define a single toroidal shape.

[0144] Each of the coil units 27A and 27B of the first coil 230A may have an annular shape with a wire wound around the outer surface of the second side 71B, which is perpendicular to both the optical axis OA and the housing 210. Each of the coil units 27C and 27D of the second coil 230B may have an annular shape with a wire wound around the outer surface of the third side 71C, which is perpendicular to both the optical axis OA and the housing 210. Each of the coil units 27A and 27B of the first coil 230A may have an annular shape with a wire wound around a direction perpendicular to the optical axis OA and parallel to the X-axis. Each of the coil units 27C and 27D of the second coil 230B may have an annular shape with a wire wound around a direction perpendicular to the optical axis OA and parallel to the Y-axis. Alternatively, each of the coil units 27A and 27B of the first coil 230A may have an annular shape with a wire wound around a first axis. Each of the coil units 27C and 27D of the second coil 230B may have an annular shape with a wire wound around a second axis.

[0145] For example, each of the coil units 27A and 27B of the first coil 230A may have an annular shape with a length in the horizontal direction (or Y-axis direction) greater than its length in the vertical direction (or optical axis direction). For example, each of the coil units 27C and 27D of the second coil 230B may have an annular shape with a length in the horizontal direction (or X-axis direction) greater than its length in the vertical direction (or optical axis direction).

[0146] The camera device 200 may include a circuit board 190 disposed on or attached to a mounting portion. For example, the circuit board 190 may be disposed on or attached to a housing 210. For example, the circuit board 190 may be disposed on a side portion of the housing 210. For example, the circuit board 190 may be disposed on or attached to at least one of the sides 71A to 71D of the housing 210.

[0147] Reference Figure 10b For example, circuit board 190 may include a first plate 191 disposed on a second side 71B of housing 210 and a second plate 192 disposed on a third side 71C of housing 210. The second plate 192 may be bent at one side of the first plate 191. Circuit board 190 may be electrically or conductively connected to the second coil 230. Circuit board 190 may be electrically or conductively connected to the position sensor 240.

[0148] The housing 210 may include recesses 19A and 19B therein for disposing of or accommodating the circuit board 190. Recesses 19A and 19B in the housing 210 may be recessed from the outer surface of a side portion of the housing 210. Recesses 19A and 19B in the housing 210 may be formed in at least one of the side portions 71A to 71D. For example, the housing 140 may include a first recess 19A formed in a second side portion 71B and a second recess 19B formed in a third side portion 71C of the housing 210. For example, a first plate 191 of the circuit board 190 may be disposed in the first recess 19A of the housing 210, and a second plate 192 of the circuit board 190 may be disposed in the first recess 195 of the housing 210.

[0149] For example, the second recess 19B may be disposed above the step 411. The first recess 19A may extend to the lower surface of the second side portion 71B. For example, the step 411 may not be formed below the first recess 19A. For example, the first plate 191 of the circuit board 190 may extend to the lower part, lower end, or lower surface of the second side portion 71B of the housing 210. For example, at least a portion of the terminal unit 85 disposed on the lower part of the first plate 191 of the circuit board 190 may be configured to overlap with the step 411 of the housing 210 in a direction perpendicular to the optical axis. The terminal unit 85 may not protrude beyond the step 411 of the housing 210. This is to facilitate electrical connection between the terminal unit 85 and an external device by means of, for example, soldering. The terminal unit 85 may include a plurality of terminals P1 to Pn.

[0150] The housing 210 may include one or more protrusions 9A and 9B. The one or more protrusions 9A and 9B may be disposed on a side of the housing 210. For example, the one or more protrusions 9A and 9B may protrude from the bottom surfaces of recesses 19A and 19B in the housing 210. The circuit board 190 may include one or more holes 7A and 7B that engage with the protrusions 9A and 9B of the housing 210. For example, each of the holes 7A and 7B may be a through hole. For example, the housing 210 may include a first protrusion 9A disposed on a second side 71B. The housing 210 may include a second protrusion 9B disposed on a third side 71C. The first plate 91 of the circuit board 190 may include a first hole 7A engaged with the first protrusion 9A. The second plate 192 of the circuit board 190 may include a second hole 7B engaged with the second protrusion 9B.

[0151] Coil 230 can be disposed on a fixing part. Coil 230 can be disposed on housing 210. Coil 230 can be disposed on or attached to circuit board 190. For example, first coil 230A can be disposed on first plate 191 of circuit board 190, and second coil 230B can be disposed on second plate 192 of circuit board 190. For example, first coil 230A can be electrically connected to first plate 191 of circuit board 190, and second coil 230B can be electrically connected to second plate 192 of circuit board 190. For example, first plate 191 can correspond to, face, or overlap with first magnet unit 310A in a second direction, and second plate 192 can correspond to, face, or overlap with second magnet unit 310B in a third direction.

[0152] Figure 13 It is a three-dimensional view of circuit board 190, first coil 230A, second coil 230B, first controller 835A and second controller 835B. Figure 14a The electrical connections of the first controller 835A, the first coil 230A, the first sensor 240A, and the first board 191 are shown. Figure 14b The electrical connections of the second controller 835B, the second coil 230B, the second sensor 240B, and the second board 192 are shown.

[0153] Reference Figure 13 , Figure 14a and Figure 14b The first board 191 may include a first pad A1 and a second pad A2 that are electrically connected to the coil unit 27A of the first coil 230A. The first pad A1 may be connected to one end of the coil unit 27A of the first coil 230A, and the second pad A2 may be connected to the other end of the coil unit 27A of the first coil 230A. The first board 191 may include a third pad A3 and a fourth pad A4 that are electrically connected to the coil unit 27B of the first coil 230A. The third pad A3 may be connected to one end of the coil unit 27B of the first coil 230A, and the fourth pad A4 may be connected to the other end of the coil unit 27B of the first coil 230A.

[0154] Coil units 27A and 27B of the first coil 230A may not be connected to each other. Coil units 27A and 27B of the first coil 230A may not be electrically connected to each other.

[0155] In another embodiment, the first board 191 may include pads corresponding to the number of coil units included in the first coil 230A. For example, the first board 191 may include two pads corresponding to one coil unit. The second board 192 may include a fifth pad A5 and a sixth pad A6 that are electrically connected to or conductively connected to coil units 27C of the second coil 230B. The fifth pad A5 may be connected to one end of coil unit 27C of the second coil 230B, and the sixth pad A6 may be connected to the other end of coil unit 27C of the second coil 230B. The second board 192 may include a seventh pad A7 and an eighth pad A8 that are electrically connected to or conductively connected to coil units 27D of the second coil 230B. The seventh pad A7 may be connected to one end of coil unit 27D of the second coil 230B, and the eighth pad A8 may be connected to the other end of coil unit 27D of the second coil 230B.

[0156] Coil units 27C and 27D of the second coil 230B may not be connected to each other. Coil units 27C and 27D of the second coil 230B may not be electrically connected to each other.

[0157] In another embodiment, the second board 192 may include pads corresponding to the number of coil units included in the second coil 230B. For example, the second board 192 may include two pads corresponding to one coil unit.

[0158] The camera device 200 may include a position sensor 240 for OIS feedback operation. The position sensor 240 can detect displacement or angular displacement of the OIS moving part corresponding to tilting or rotation of the OIS moving part. For example, the position sensor 240 may include a first sensor 240A and a second sensor 240B. For example, the first sensor 240A may include both a first sensor 240A and a second sensor 240B. For example, the first sensor 240A may correspond to, face, or overlap with the first magnet unit 310A, and the second sensor 240B may correspond to, face, or overlap with the second magnet unit 310B. For example, at least a portion of the first sensor 240A may correspond to, face, or overlap with at least a portion of the first magnet unit 310A in a second direction. For example, the center of the first sensor 240A may overlap with the first magnet unit 310A in the second direction. At least a portion of the second sensor 240B may correspond to, face, or overlap with at least a portion of the second magnet unit 310B in a third direction. For example, the center of the second sensor 240A may overlap with the second magnet unit 310B in a third direction.

[0159] For example, the first sensor 240A can detect the magnetic field of the first magnet unit 310a. For example, the second sensor 240B can detect the magnetic field of the second magnet unit 310B.

[0160] For example, the first sensor 240A can detect the position (or displacement) or angle of the OIS moving part that is tilted relative to the second axis (e.g., the Y-axis). The second sensor 240B can detect the position (or displacement) or angle of the OIS moving part that is tilted relative to the first axis (e.g., the X-axis).

[0161] Despite Figure 4d In one embodiment, the number of each of the first sensor 240A and the second sensor 240B is one, but in another embodiment, the number of each of the first sensor 240A and the second sensor 240B can be two or more. For example, two or more first sensors can be arranged spaced apart from each other in the second axial direction. For example, two or more first sensors can be arranged in a cavity in the first coil 230A. For example, two or more second sensors can be spaced apart from each other in the first axial direction. For example, two or more second sensors can be arranged in a cavity in the second coil 230B.

[0162] Position sensor 240 can be disposed on circuit board 190. Position sensor 240 can be electrically connected to circuit board 190. For example, first sensor 240A can be disposed, coupled to, or fixed to first plate 191 of circuit board 190, and second sensor 240B can be disposed, coupled to, or fixed to second plate 192 of circuit board 190. For example, first sensor 240A can be electrically connected to first plate 191 of circuit board 190, and second sensor 240B can be electrically connected to second plate 192 of circuit board 190. For example, first sensor 240A can be disposed in a cavity (or hole) in first coil 230A, and second sensor 240B can be disposed in a cavity (or hole) in second coil 230B. In another embodiment, first sensor 240A can be disposed outside the cavity (or hole) in first coil 230A, and second sensor 240B can be disposed outside the cavity (or hole) in second coil 230B.

[0163] For example, each of the first sensor 240A and the second sensor 240B may be a Hall sensor. For example, each of the first sensor 240A and the second sensor 240B may be a Hall sensor including a first input terminal and a second input terminal, as well as a first output terminal and a second output terminal. For example, the first and second input terminals, as well as the first and second output terminals of the first sensor 240A, may be electrically connected to or connected to the first board 191, and the first and second input terminals, as well as the first and second output terminals of the second sensor 240B, may be electrically connected to or connected to the second board 192.

[0164] The camera device 200 may include a controller 835 disposed on a circuit board 190. The controller 835 may be electrically connected to or electrically coupled to the circuit board 190. For example, the controller 835 may be a driver IC. The controller 835 may be electrically connected to or electrically coupled to a coil 230. The controller 835 may supply drive signals to the coil 230. The controller 835 may be electrically connected to or electrically coupled to a position sensor 240. The controller 835 may supply power or drive signals to the position sensor 240. The controller 835 may receive output from the position sensor 240.

[0165] The controller 835 may include a first controller 835A and a second controller 835B. Figure 13 In this embodiment, each of the first controller 835A and the second controller 835B can be implemented as a separate driver IC. In another embodiment, the first controller 835A and the second controller 835B can be implemented as a single driver IC.

[0166] The first controller 835A can supply power or a drive signal to the first sensor 240A. The first controller 835A can receive output HV1 from the first sensor 240A. The second controller 835B can supply power or a drive signal to the second sensor 240B. The second controller 835B can receive output HV2 from the second sensor 240B. In embodiments where the first sensor includes a plurality of first sensors and the second sensor includes a plurality of second sensors, multiple outputs from the first sensors can be received by the first controller 835A, and multiple outputs from the second sensors can be received by the second controller 835B.

[0167] For example, the first controller 836A may be disposed on the first plate 191 of the circuit board 190. The second controller 835B may be disposed on the second plate 192 of the circuit board 190. The first controller 835A may be disposed, coupled, or fixed to the first surface of the first plate 191. The second controller 835B may be disposed, coupled, or fixed to the first surface of the second plate 192. Each of the first surfaces of the first plate 191 and the second plate 192 may be a surface facing the magnet units 310A and 310B or the OIS moving part (e.g., the lens module 400).

[0168] The first controller 835A may include terminals K1 to K4 for data communication (e.g., I2C communication) with an external device or host. The external device or host may be the controller 830 of the camera module 200 or the controller 780 of the optical device 200A. The terminal unit 85 of the circuit board 190 may include terminals P1 to P4 electrically connected to the terminals K1 to K4 of the first controller 835A.

[0169] The first controller 835A can perform data communication (e.g., I2C communication) with the host via terminals P1 to P4 of circuit board 190. For example, terminal P1 of circuit board 190 can be used to send and receive data SDA, terminal P2 can be used to send and receive clock signal SCL, and terminals P3 and P4 can be used to receive power signals VDD and VSS. The power signal VSS can be the ground signal GND.

[0170] The power signals VDD and VSS, or drive signals configured to drive the first controller 835A, can be supplied from the host computer via terminals P1 and P2 of the circuit board 190. Data SDA may include control signals configured to control the first controller 835A.

[0171] The first controller 835A can supply drive signals to the first coil 230A. The first controller 835A can supply drive signals to each of the coil units of the first coil 230A.

[0172] For example, the first controller 835A can supply a first drive signal ID1 to the first coil unit 27A of the first coil 230A, and can supply a second drive signal ID2 to the second coil unit 27B of the first coil 230A. For example, the first controller 835A can supply the first drive signal ID1 to the first pad A1 and the second pad A2 of the circuit board 190, and can supply the second drive signal ID2 to the third pad A3 and the fourth pad A4 of the circuit board 190.

[0173] The first controller 835A may include terminals 3A and 3B configured to supply a first drive signal ID1 to a first coil unit 27A of the first coil 230A. The first controller 835A may include terminals 3C and 3D configured to supply a second drive signal ID2 to a second coil unit 27B of the first coil 230A. The number of terminals of the first controller 835A configured to supply independent drive signals may correspond to the number of coil units of the first coil 230A.

[0174] The first controller 835A can perform analog-to-digital conversion of the output signal HV1 of the first sensor 240A, generate a code value (or "digital value"), and generate a first drive signal ID1 configured to drive the first coil unit 27A and a second drive signal ID2 configured to drive the second coil unit 27B based on a comparison between the code value (hereinafter referred to as the "first code value") and a target value (hereinafter referred to as the "first digital value"). The first controller 835A can store an algorithm, program, or function configured to generate drive signals ID1 and ID2 using the first code value. The first controller 835A may include an analog-to-digital converter that performs analog-to-digital conversion from the output signal HV1 of the first sensor 240A and generates the first code value. The first controller 835A may include a digital processor that generates a first control signal configured to generate drive signals for driving the first coil unit 27A and the second coil unit 27B based on a comparison between the first code value and the first target value. The first controller 835A may include a driver (or amplifier) ​​configured to generate a first drive signal ID1 and a second drive signal ID2 based on a first control signal. The first target value may be a reference code value from the output of the first sensor 240A, which corresponds to a target position or angle of the OIS moving part tilted relative to the second axis. Here, the reference code value can be preset by calibrating the relationship between the displacement (or angle) of the OIS moving part tilted relative to the second axis and the output from the first sensor 240A. The reference code value of the first sensor 240A may be stored in the first controller 835A or an additional memory. In embodiments where the first sensor includes multiple first sensors, the first drive signal and the second drive signal may be generated using the output from the first sensor.

[0175] The second controller 835B may include terminals M1 to M4 for data communication (e.g., I2C communication) with external devices or a host. Each of terminals M1 to M4 of the second controller 835B may be electrically connected to a corresponding terminal P1 to P4 of the circuit board 190.

[0176] The first controller 835B can perform data communication (e.g., I2C communication) with the host via terminals P1 to P4 of the circuit board 190. Power signals VDD and VSS, or drive signals, configured to drive the second controller 835B, can be supplied from the host via terminals P1 and P2 of the circuit board 190. Data SDA may include control signals configured to control the second controller 835B.

[0177] Data from the first controller 835A and the second controller 835B can be transmitted and received in a time-division manner via terminals P1 and P2 of the circuit board 190. In data communication between the host 700 and the first controller 835A and the second controller 835B, the host 700 can correspond to a master device, the first controller 835A can correspond to a first slave device, and the second controller 835B can correspond to a second slave device. Different addresses or identification codes can be provided to the first controller 835A and the second controller 835B. Data can be transmitted and received in a time-division manner between each of the first controller 835A and the second controller 835B and the host 700 via wiring (or lines or circuit patterns) connected to terminal P1.

[0178] The second controller 835A can supply drive signals to the second coil 230B. The second controller 835B can supply drive signals to each of the coil units of the second coil 230B.

[0179] For example, the second controller 835B can supply a third drive signal ID3 to the third coil unit 27C of the second coil 230B, and can supply a fourth drive signal ID4 to the fourth coil unit 27D of the second coil 230B. For example, the second controller 835B can supply the third drive signal ID3 to the fifth pad A5 and the sixth pad A6 of the circuit board 190, and can supply the fourth drive signal ID4 to the seventh pad A7 and the eighth pad A8 of the circuit board 190.

[0180] The second controller 835B may include terminals 4A and 4B configured to supply a third drive signal ID3 to a third coil unit 27C of the second coil 230B. The second controller 835B may also include terminals 4C and 4D configured to supply a fourth drive signal ID4 to a fourth coil unit 27D of the second coil 230B. The number of terminals of the second controller 835B configured to supply independent drive signals may correspond to the number of coil units of the second coil 230B.

[0181] The second controller 835B can perform analog-to-digital conversion on the output signal HV2 of the second sensor 240B, generate a code value (or "digital value"), and generate a third drive signal ID3 configured to drive the third coil unit 27C and a fourth drive signal ID4 configured to drive the fourth coil unit 27D based on a comparison between the code value (hereinafter referred to as the "second code value") and a target value (hereinafter referred to as the "second target value"). The second controller 835B can store an algorithm, program, or function configured to generate drive signals ID3 and ID4 using the second code value. The second controller 835B may include an analog-to-digital converter that performs analog-to-digital conversion on the output signal HV2 of the second sensor 240B and generates the second code value.

[0182] The second controller 835B may include a digital processor that generates a second control signal configured to generate drive signals for driving the third coil unit 27C and the fourth coil unit 27D based on a comparison between a second code value and a second target value. The second controller 835B may include a driver (or amplifier) ​​configured to generate a third drive signal ID3 and a fourth drive signal ID4 based on the first control signal. The second target value may be a reference code value from the output of the second sensor 240B, corresponding to a target position or angle of the OIS moving part tilted relative to the first axis. Here, the reference code value can be preset by calibrating the relationship between the displacement (or angle) of the OIS moving part tilted relative to the second axis and the output from the second sensor 240B. The reference code value of the second sensor 240B may be stored in the second controller 835B or an additional memory. In embodiments where the second sensor includes multiple second sensors, the third and fourth drive signals may be generated using the output from the second sensors.

[0183] Circuit board 190 may include terminal unit 85. Terminal unit 85 may include a plurality of terminals P1 to Pn (n is a natural number greater than 1). For example, the plurality of terminals P1 to Pn may be disposed on at least one of the first plate 191 and the second plate 192 of circuit board 190. For example, the plurality of terminals P1 to Pn may be disposed on the lower part of the first plate 191 of circuit board 190. For example, the plurality of terminals P1 to Pn may be exposed from the side plate 302 of the cover member 300. At least one of the plurality of terminals P1 to Pn may be electrically connected or electrically connected to the first controller 835A and the second controller 835B.

[0184] The camera device 200 may include an additional circuit board (not shown) that is electrically connected to or conductively connected to a plurality of terminals P1 to Pn. For example, the additional circuit board may include terminals disposed below the housing 210 and electrically connected to the plurality of terminals P1 to Pn by means of conductive adhesive. For example, circuit board 800 may be referred to as one of the first to third circuit boards (e.g., the first circuit board), circuit board 190 may be referred to as another of the first to third circuit boards (e.g., the second circuit board), and the additional circuit board may be referred to as the remaining one of the first to third circuit boards (e.g., the third circuit board).

[0185] The camera device 200 may include a movement suppressor 80 coupled to at least a portion of the housing 210. The movement suppressor 80 may suppress deformation of at least a portion of the fourth plate 804 by suppressing movement or motion of at least a portion of the fourth plate 804.

[0186] Reference Figure 7c , Figure 8 and Figure 11a The fourth board 804 of the circuit board 800 may include a first portion 804A (or a first region) connected to the first board 801, a second portion 804B connected to the first portion 804A and bent at the end of the first portion 804A, and a third portion 804C connected to the second portion 804B and bent at the end of the second portion 804B. In another embodiment, at least one of the first portion 804A and the second portion 804B may be omitted.

[0187] The first portion 804A may extend in a direction parallel to the first plate 801. For example, the second portion 804B may be bent at the end of the first portion 804A and may extend upward from the first portion 804A. For example, the third portion 804C may extend from the second portion 804B in a direction opposite to the first portion 804A. For example, the fourth plate 804 may include a first bend 804D connecting the first portion 804A to the second portion 804B. Furthermore, the fourth plate 804 may include a second bend 804E connecting the second portion 804B to the third portion 804C. Each of the first bend 804D and the second bend 804E may be angular. For example, the first portion 804D and the second bend 804E may be perpendicular to each other. In another embodiment, each of the first bend 804D and the second bend 804E may be rounded. In yet another embodiment, the included angle between the first portion 804A and the second portion 804B may be an acute angle or an obtuse angle.

[0188] By means of the first bend 804D and the second bend 804E, an increase in the length of the camera device 200 in the direction perpendicular to the optical axis can be prevented. Furthermore, since the first bend 804D and the second bend 804E are located between the upper surface of the camera device 200 (e.g., the upper surface of the cover member 300) and the lower surface of the camera device 200 (e.g., the lower surface of the housing 210), an increase in the length of the camera device 200 in the optical axis direction can be prevented, thereby achieving miniaturization of the camera device 200. For example, the third portion 804C can be a plate or a flat surface perpendicular to the optical axis. For example, the third portion 804C can have a serrated or corrugated shape. For example, the third portion 804C can include at least one bend or curved region. For example, the bend or curved region of the third portion 804C can be bent upwards in a second direction or a third direction perpendicular to the optical axis. Alternatively, the bend or curved region of the third portion 804C can extend in a direction perpendicular to the optical axis. For example, when viewed from above, the third portion 804C may include a U-shaped or V-shaped region. For example, the third portion 804C may be spaced apart from the housing 210. For example, the third portion 804C may be spaced apart from the protrusion 215 of the housing 210. In another embodiment, for example, at least a portion of the third portion 804C may contact the protrusion 215 of the housing 210. At least a portion of the second portion 804B of the fourth plate 804 may be disposed in the protrusion 215 of the housing 210. At least a portion of the second portion 804B of the fourth plate 804 may be disposed in a groove 16A in the protrusion 215 of the housing 210. For example, at least a portion of the first portion 804A of the fourth plate 804 may be disposed in a groove 16A in the protrusion 215. The third portion 804B of the fourth plate 804 may be disposed outside the protrusion 215 of the housing 210. For example, the third portion 804B of the fourth plate 804 may be disposed higher than the protrusion 215 of the housing 210. The third part 804B of the fourth plate 804 can be configured to be higher than the upper surface of the protrusion 215 of the housing 210.

[0189] Connector 805 can be coupled to or connected to another external connector of camera device 200, or to an external device. Connector 805 connected to another external connector can correspond to a fixed portion that is not movable during OIS operation. Since the third portion 804C of the fourth plate 804 includes at least one bending or curved area, the third portion 804C can flexibly support the camera device 200 or the OIS moving part and absorb external impacts. In other words, the third portion 804C of the fourth plate 804 can be used as a spring configured to absorb impacts. Furthermore, since the third portion 804C of the fourth plate 804 is used to flexibly support the OIS moving part, the driving force or driving power required for OIS operation can be reduced.

[0190] The camera device 200 may include a reinforcing member 70 disposed on, coupled to, or attached to at least a portion of the fourth plate 804. The reinforcing member 70 may be disposed on, coupled to, or attached to at least one of a first portion 804A and a second portion 804B of the fourth plate 804. For example, the reinforcing member 70 may be disposed on, coupled to, or attached to at least a portion of the first portion 804A or at least a portion of the second portion 804B of the fourth plate 804.

[0191] Reference Figure 11a For example, the reinforcing member 70 may be disposed, coupled, or attached to the lower surface of the first portion 804A or the lower surface of the second portion 804B of the fourth plate 804. For example, the reinforcing member 70 may include a first region 70A disposed, coupled, or attached to the first portion 804A and a second region 70B disposed, coupled, or attached to the second portion 804B. The second region 70B may be bent upward from the end of the first region 70A. For example, the bend may be formed between the first region 70A and the second region 70B. For example, the surface area of ​​the second region 70B may be greater than the surface area of ​​the first region 70A. In another embodiment, the surface area of ​​the second region 70B may be equal to or less than the surface area of ​​the first region 70A. For example, the reinforcing member 70 may be spaced apart from the third portion 804C of the fourth plate 804. For example, the second region 70B of the reinforcing member 70 may be spaced apart from the third portion 804C of the fourth plate 804. In another embodiment, at least a portion of the second region 70B of the reinforcing member 70 may contact the third portion 804C of the fourth plate 804.

[0192] In another embodiment, the reinforcing member 70 may be disposed, coupled, or attached to the upper surface of the first portion 804A or the upper surface of the second portion 804B of the fourth plate 804. In another embodiment, for example, the reinforcing member 70 may include a first region disposed on the upper surface of the first portion 804A of the fourth plate 804 and a second region disposed on the upper surface of the second portion 804B. In yet another embodiment, the reinforcing member 70 may be disposed, coupled, or attached to at least a portion of the second portion 804B and at least a portion of the third portion 804C of the fourth plate 804. In another embodiment, for example, the reinforcing member 70 may be disposed, coupled, or attached to both the second portion 804B and the third portion 804C of the fourth plate 804. For example, the reinforcing member 70 may include a first region disposed, coupled, or attached to the second portion 804B of the fourth plate 804 and a second region disposed, coupled, or attached to the third portion 804C of the fourth plate 804, and a bending portion may be formed between the first and second regions. The first region of the reinforcing member 70 may be disposed on the lower surface (or upper surface) of the second part 804B, and the second region of the reinforcing member 70 may be disposed on the lower surface (or upper surface) of the third part 804C.

[0193] The reinforcing member 70 prevents damage, deformation, or breakage of the fourth plate 804 caused by impact or external force. Furthermore, the reinforcing member 70 can be used to suppress deformation and shape recovery of the fourth plate 804 caused by forces applied to the fourth plate 804 due to the tilting of the OIS moving part 100. For example, the reinforcing member 70 may include at least one of a metallic material and an injection molding material. For example, the reinforcing member 70 may be disposed in a groove 16A in the protrusion 215 of the housing 210. For example, at least a portion of the reinforcing member 70 may contact the groove 15A in the protrusion 215 of the housing 210. For example, the reinforcing member 70 may not be bonded to the housing 210 (e.g., the protrusion 215). In another embodiment, for example, the reinforcing member 70 may also be bonded to the housing 210 (e.g., the protrusion 215) by means of an adhesive.

[0194] Figure 11b It shows Figure 11a Another embodiment of the reinforcing member shown is the reinforcing member 70-1.

[0195] Reference Figure 11bThe reinforcing member 70-1 may include an opening 73. The opening 73 in the reinforcing member 70-1 may open or expose at least a portion of the fourth plate 804 of the circuit board 800. For example, the opening 73 may open or expose at least a portion of the first portion 804A (or “first region”) and the second portion 804B (or “second region”) of the fourth plate 804. The opening 73 in the reinforcing member 70-1 may be a hole, a through-hole, or a cavity. The opening 73 may be formed in at least one of the first region 70A and the second region 70B of the reinforcing member 70-1. For example, the opening 73 may be formed in both the first region 70A and the second region 70B of the reinforcing member 70-1. Furthermore, the opening 73 may open or expose at least a portion of the first bend 804D. In another embodiment, the opening may be formed only in one of the first region 70A and the second region 70B of the reinforcing member 70-1. The opening may not expose the first bend 804D. By means of the opening 73, the elastic coefficient of the second plate 802 of the circuit board 800, which is attached to the reinforcing member 70-1, can be reduced, allowing the OIS moving part to move easily during OIS operation. In other words, by means of the opening 73, the elasticity of the circuit board 800 (e.g., the second plate 802) supporting the OIS moving part can be reduced. Therefore, easy OIS operation can be achieved with low driving force, thereby reducing power consumption. Here, the driving force can be the force caused by the interaction between the coil 230 and the magnet 310.

[0196] The movement suppressor 80 can be coupled to the protrusion 215 of the housing 210. For example, the movement suppressor 80 can be coupled to the engaging grooves 215A and 215B in the protrusion 215 of the housing 210. See reference. Figure 3 At least a portion of the second part 804B of the fourth plate 804 may be disposed between the movement suppressor 80 and the protrusion 215 of the housing 210. For example, at least a portion of the reinforcing member 80 may be disposed between the movement suppressor 80 and the inner surface of the protrusion 215 of the housing 210. The movement suppressor 80 may be spaced apart from the circuit board 800 in a second direction (X-axis direction) or in a third direction (Y-axis direction). For example, the movement suppressor 80 may be spaced apart from the circuit board 800 in the optical axis direction or in a direction perpendicular to the optical axis. In other words, the movement suppressor 80 may be used to maintain the shape of the bent portions 804D and 804E of the fourth plate 804, which is a flexible plate. For example, the movement suppressor 80 may be injection molded from a non-magnetic material, resin, etc. In another embodiment, the movement suppressor 80 may contact at least a portion of the fourth plate 804 of the circuit board 800.

[0197] By means of the movement suppressor 80, the movement or motion of at least a portion of the second part 804B of the fourth plate 804 disposed in the groove 16A in the protrusion 215 can be restricted, and the second part 804B can be suppressed or prevented from disengaging outward from the groove 16A in the protrusion 215. Therefore, the restoring force of the fourth plate 804 on the OIS moving part can be suppressed or prevented during OIS operation. Thus, accurate OIS operation can be performed, and the reliability of OIS operation can be improved. The movement suppressor 80 can also be referred to as a "clamp".

[0198] The cover member 300 may define an accommodating space together with the housing 210, and the OIS moving part may be disposed in the accommodating space. For example, the cover member 300 may be in the form of a box with an open lower surface. For example, the cover member 300 may include an upper plate 301 and a side plate 302 connected to the upper plate 301. The lower end of the side plate 302 of the cover member 300 may be coupled to the housing 210. The upper plate 302 of the cover member 300 may have a polygonal shape (e.g., a quadrilateral or octagonal shape) or a circular shape. The upper plate 302 of the cover member 300 may include a hole 303 through which a lens (not shown) is exposed to external light. The hole 303 may be a through hole formed through the upper plate 302 of the cover member 300 in the optical axis direction. For example, the side plate of the cover member 300 may include multiple side plates. The cover member 300 may be made of a non-magnetic material. In another embodiment, the cover member 300 may be made of a magnetic material. For example, the cover member 300 can be molded from resin or made of metal.

[0199] The cover member 300 may include an opening 304 disposed or formed in the side plate 302 to avoid spatial interference with the protrusion 215 of the housing 210. For example, the protrusion 216 of the housing 210 may pass through the opening 304 in the cover member 300 and may protrude from the side plate 302 of the cover member 300. The cover member 300 may include a protrusion 305 disposed above the opening 304 and protruding from the side plate 302. The protrusion 305 may have a plate shape. For example, the protrusion 305 of the cover member 300 may be disposed on the protrusion 215 of the housing 210. For example, the protrusion 305 may be disposed in the upper part of the groove 16A in the protrusion 215. For example, the protrusion 305 may be disposed above the movement suppressor 80. For example, the protrusion 305 may overlap with the movement suppressor 80 in the optical axis direction. For example, the protrusion 305 may overlap with the first portion 804A of the fourth plate 804 in the optical axis direction. The protrusion 305 can suppress or prevent the separation of the movement suppressor 80 and can protect the movement suppressor 80 and the fourth plate 804 from impact.

[0200] Reference Figure 4eThe cover member 300 may include a protrusion 311 projecting from the upper plate 301. For example, the protrusion 311 may project from the inner surface of the upper plate 301 of the cover member 300 toward the spool 110 or the rolling member 21. For example, the protrusion 311 may face or overlap with the receiving portion 116 of the spool 110. At least a portion of the protrusion 311 may be inserted into or disposed in the receiving portion 116 of the spool 110. The protrusion 311 may be disposed on the rolling member 21. For example, the cover member 300 may include a first protrusion 311A ​​that corresponds to, faces, or overlaps with the first receiving portion 116A of the first rolling member 21A or the first receiving portion 116A of the spool 110. For example, the cover member 300 may include a second protrusion 311B that corresponds to, faces, or overlaps with the second receiving portion 116B of the second rolling member 21B or the second receiving portion 116B of the spool 110. For example, the protrusion 311 may include a groove recessed from the upper surface of the upper plate 301 of the cover member 330. In another embodiment, the protrusion 311 may not include the groove.

[0201] Because the cover member 300 includes a protrusion 311, this embodiment can prevent the rolling member 21 from disengaging from the receiving portion 116 of the spool 110. Furthermore, the protrusion 311 can be used as a stop configured to prevent the spool 110 from moving upwards beyond a restricted range.

[0202] Next, the support section will be described.

[0203] A support portion may be disposed between the fixed portion and the OIS moving portion. The support portion can connect the fixed portion to the OIS moving portion. The support portion can support the OIS moving portion relative to the fixed portion. For example, the support portion may be disposed between the sensor base 270 and the housing 210, and can support the sensor base 270 relative to the housing 210. The support portion may include a tilting guide 60 disposed between the sensor base 270 and the housing 210. Furthermore, the support portion may include a rolling member 62 disposed between the tilting guide 60 and the sensor base 270. Additionally, the support portion may include a rolling member 63 disposed between the tilting guide 60 and the housing 210.

[0204] The tilt guide 60 can be disposed between the fixed part and the OIS moving part. The tilt guide 60 connects the fixed part to the OIS moving part. The tilt guide 60 can support the OIS moving part relative to the fixed part. The tilt guide 60 may also be referred to as a "moving plate," "moving element," "moving element plate," "drive plate," "plate," "rotating plate," "tilting plate," or "support plate." The tilt guide 60 can rotate or tilt by a predetermined angle relative to a first axis or a second axis.

[0205] For example, a first axis may be formed between the first surface of the tilt guide 60 facing the sensor base 270 and the OIS moving part, and a second axis may be formed between the second surface of the tilt guide 60 facing the housing 210 and the fixing part. For example, the tilt guide 60 may be disposed between the lower part (or lower surface) of the sensor base 270 and the lower part 42 of the housing 210. For example, at least a portion of the tilt guide 60 may be disposed in the mounting portion 25A of the sensor base 270. Since the tilt guide 60 is disposed on the mounting portion 25A, the length or height of the camera device 200 in the optical axis direction can be reduced.

[0206] The tilt guide 60 may include a body. The tilt guide 60 may be in the form of a plate. For example, the length of the tilt guide 60 in the horizontal direction perpendicular to the optical axis (e.g., in the horizontal or vertical direction) may be greater than the length of the tilt guide 60 in the optical axis direction.

[0207] Reference Figure 9a The tilt guide 60 may include a groove in which at least a portion of the rolling member 62 is disposed. A groove 65 may be disposed or formed on a first surface 6A of the tilt guide 60. The first surface 6A may be a surface opposite to or facing the sensor base 270. The groove 65 may recess from the first surface 6A of the tilt guide 60. For example, the tilt guide 60 may include a first groove 65A in which at least a portion of a first ball member 62A is disposed, and a second groove 65B in which at least a portion of a second ball member 62B is disposed. For example, grooves 65A and 65B may be spaced apart from each other in a second direction (e.g., the X-axis direction). For example, ball members 62A and 62B may be spaced apart from each other in a second direction (e.g., the X-axis direction). In another embodiment, the grooves in the tilt guide 60 in which ball members 62A and 62B are disposed may be spaced apart from each other in a third direction (e.g., the Y-axis direction). In other words, in another embodiment, the ball members of the rolling member 62 may be spaced apart from each other in a third direction. The groove 65 may contact the rolling member 62 at at least one point. For example, the groove 65 may include a bottom surface and at least one side surface connected to the bottom surface. The at least one side surface of the groove 65 may be an inclined surface. For example, the groove 65 may include a bottom surface and a plurality of inclined surfaces. The inclined surfaces of the groove 65 may have the same shape as each other. In another embodiment, at least one of the inclined surfaces of the groove 65 may have a different shape than the remaining inclined surfaces.

[0208] Reference Figure 9bThe tilting guide 60 may include a groove 66 in which at least a portion of the rolling member 63 is disposed. The groove 66 may be disposed or formed in a second surface 6B. The second surface 6B may be a surface opposite to or facing the housing 210. Furthermore, the second surface 6B may be the surface opposite to the first surface 6A of the tilting guide 60. The groove 66 may be recessed from the second surface 6B of the tilting guide 60.

[0209] For example, the tilt guide 60 may include a first groove 66A in which at least a portion of a first ball member 63A is disposed, and a second groove 66B in which at least a portion of a second ball member 63B is disposed. For example, grooves 66A and 66B may be spaced apart from each other in a third direction (e.g., the Y-axis direction). For example, ball members 63A and 63B may be spaced apart from each other in a third direction (e.g., the Y-axis direction). In another embodiment, the grooves in the tilt guide 60 in which ball members 63A and 63B are disposed may be spaced apart from each other in a second direction (e.g., the X-axis direction). In other words, in another embodiment, the ball members of the rolling member 63 may be spaced apart from each other in a second direction. The groove 66 may contact the rolling member 63 at at least one point. For example, the groove 66 may include a bottom surface and at least one side surface connected to the bottom surface. For example, the groove 66 may include a bottom surface and a plurality of tilted surfaces. The tilted surfaces of the groove 66 may have the same shape as each other. In another embodiment, at least one of the tilted surfaces of the groove 66 may have a different shape than the remaining tilted surfaces.

[0210] The tilt guide 60 may include a first clearance portion 61A configured to avoid spatial interference with the gyroscope sensor 820. Furthermore, the tilt guide 60 may include a second clearance portion disposed at a position corresponding to or symmetrical to the first clearance portion 61A. The second clearance portion 61B may act as a counterweight relative to the first clearance portion 61A to ensure balanced tilting or rotation of the tilt guide 60, thereby improving the reliability of OIS operation.

[0211] For example, the first clearance portion 61A may be a recessed groove from a region of the outer surface of the inclined guide 60. The second clearance portion 61B may be a recessed groove from another region of the outer surface of the inclined guide 60. For example, the inclined guide 60 may include four corner portions (or corner regions). Here, the first clearance portion 61A may be formed at a first corner of the inclined guide 60, and the second clearance portion 61B may be formed at a second corner positioned opposite the first corner. Although each of the third and fourth corner portions may have a circular shape, in another embodiment, at least one of the first to fourth corner portions may have a right-angled shape.

[0212] The tilt guide 60 may include a hole 60A that corresponds to, faces, or overlaps with the magnetic body 31 and / or magnetic body 32. For example, the hole 60A may correspond to, face, or overlap with the protrusion 28 of the sensor base 270. By means of the hole 60A, the weight of the tilt guide 60 can be reduced, thereby reducing the weight of the camera device 200.

[0213] For example, the hole 6A in the tilt guide 60 can be formed at a position corresponding to the protrusion 28 of the sensor base 270 to avoid spatial interference with the protrusion 28 of the sensor base 270. Furthermore, the hole 60A can be formed to avoid spatial interference with the magnetic body 31 and the protrusion 28 of the sensor base 270. For example, the hole 60A in the tilt guide 60 can be a through hole. For example, the hole 60A can be formed through the tilt guide 60 in a first direction (Z-axis direction) or in the optical axis direction. For example, at least a portion of the hole 60A in the tilt guide 60 can have a shape corresponding to the protrusion 28 of the sensor base 270. For example, the hole 60A can have a circular shape, an elliptical shape, or a polygonal shape, such as a quadrilateral shape. For example, the horizontal length of the hole 60A can be greater than the horizontal length of the protrusion 28 of the sensor base 270. In another embodiment, the horizontal length of the hole 60A can be equal to the horizontal length of the protrusion 28 of the sensor base 270. The vertical length of the hole 60A can be greater than the vertical length of the protrusion 28 of the sensor base 270. In another embodiment, the vertical length of the hole 60A can be equal to the vertical length of the protrusion 28 of the sensor base 270.

[0214] At least a portion of the protrusion 28 of the sensor base 270 may be disposed in the hole 60A in the tilt guide 60. For example, the protrusion 28 of the sensor base 270 may overlap with the hole 60A in the tilt guide 60. For example, the protrusion 28 of the sensor base 270 may overlap with the tilt guide 60 in a direction perpendicular to the optical axis. Therefore, the length or height of the camera device 200 in the optical axis direction can be reduced. For example, the hole 60A may be disposed between the grooves 65A and 65B in the tilt guide 60. Furthermore, the hole 60A may be disposed between the grooves 66A and 66B in the tilt guide 60.

[0215] For example, the tilt guide 60 may be an injection-molded product. For example, the tilt guide 60 may be made of plastic, resin, or ceramic. In another embodiment, the tilt guide 60 may include a metal, such as stainless steel. Furthermore, the tilt guide 60 may be a non-magnetic material. In another embodiment, the tilt guide 60 may be a magnetic material.

[0216] Rolling members 62 and 63 can be arranged in directions that intersect or are perpendicular to each other. With the aid of rolling member 62, the OIS moving part can rotate, rotate along its axis, or tilt based on one of the second direction and the third direction. With the aid of rolling member 63, the OIS moving part can rotate, rotate along its axis, or tilt based on the other of the second direction and the third direction.

[0217] The rolling member 62 may be disposed between the sensor base 270 and the tilt guide 60. The rolling member 62 may include one or more ball bearings. Although in Figure 2a The rolling member 62 includes two ball bearings, but in another embodiment, the rolling member 62 may include three or more ball bearings. The ball bearings 62A and 62B of the rolling member 62 may form a first shaft. For example, the rolling member 62 may be disposed between the lower portion (or lower surface) of the sensor base 270 and the first surface 6A of the tilt guide 60. For example, the rolling member 62 may be disposed between a groove 29 in the sensor base 270 and a groove 65 in the tilt guide 60. To reduce friction, a lubricant may be disposed in at least one of the grooves 29 in the sensor base 270 and 65 in the tilt guide 60.

[0218] The rolling member 63 may be disposed between the tilting guide 60 and the housing 210. The rolling member 63 may include one or more ball bearings. Although in Figure 2a The rolling member 63 includes two ball bearings, but in another embodiment, the rolling member 63 may include three or more ball bearings. The ball bearings 63A and 63B of the rolling member 63 may form a second shaft. For example, the rolling member 63 may be disposed between the second surface 6B of the inclined guide 60 and the lower portion 42 of the housing 210. For example, the rolling member 63 may be disposed between a groove 66 in the inclined guide 60 and a groove 55 in the housing 55. To reduce friction, a lubricant may be provided between the groove 66 in the inclined guide 60 and the groove 55 in the housing 210.

[0219] Each of the rolling elements 62 and 63 can be a rolling element. For example, each of the rolling elements 62 and 63 can also be referred to as a "ball," "ball member," or "ball bearing." Although each of the rolling elements 62 and 63 includes two rolling elements in this embodiment, in another embodiment each of the rolling elements 62 and 63 may include one or three rolling elements. Because the rolling elements 62 and 63 perform rolling or sliding motion, friction can be relatively reduced, thereby reducing the current or power consumption required for OIS operation.

[0220] Reference Figure 4dThe rolling member 21 may not overlap with the inclined guide 60 in the optical axis direction. For example, as Figure 4c As shown, the rolling member 21 may not overlap with the inclined guide 60 in a direction perpendicular to the optical axis. For example, the direction in which the first rolling member 21A and the second rolling member 21B are spaced apart may be perpendicular to or intersect with the direction in which the ball members 61A and 62B are spaced apart. In another embodiment, the preceding and following directions may be parallel to each other. For example, the direction in which the first rolling member 21A and the second rolling member 21B are spaced apart may be parallel to or intersect with the direction in which the ball members 63A and 63B are spaced apart. In another embodiment, the preceding and following directions may be perpendicular to each other.

[0221] Viewed from above, for example, the distance between ball members 63A and 63B may be less than the distance between the first rolling member 21A and the second rolling member 21B. In another embodiment, the distance between ball members 63A and 63B may be equal to or greater than the distance between the first rolling member 21A and the second rolling member 21B. Viewed from above, for example, the distance between ball members 62A and 62B may be less than the distance between the first rolling member 21A and the second rolling member 21B. In another embodiment, the distance between ball members 62A and 62B may be equal to or greater than the distance between the first rolling member 21A and the second rolling member 21B.

[0222] Reference Figures 4a to 4d The tilt guide 60 may be disposed below the image sensor 810. At least a portion of the tilt guide 60 may overlap with the image sensor 810 in the optical axis direction. At least a portion of the tilt guide 60 may overlap with the lens module 400 (e.g., a lens) in the optical axis direction. For example, at least a portion of the aperture 60A in the tilt guide 60 may overlap with the image sensor 810 in the optical axis direction. At least a portion of the aperture 60A in the tilt guide 60 may overlap with the lens module 400 in the optical axis direction. For example, at least a portion of the rolling members 62 and 63 may overlap with the image sensor 810 in the optical axis direction. At least a portion of the rolling members 62 and 63 may overlap with the lens module 400 in the optical axis direction.

[0223] Since the image sensor 810 is positioned above the tilt guide 60, the size or arrangement of the image sensor 810 (or lens module 400) is not limited by the shape or size of the tilt guide 60. Therefore, this embodiment enables a camera device capable of mounting a large-diameter lens module 400 and a large-size image sensor 810, while exhibiting ultra-high image quality. Furthermore, since at least a portion of the tilt guide 60 overlaps with the image sensor 810 in the optical axis direction, the tilt guide 60 stably supports the OIS moving part and improves the tilt accuracy of the OIS moving part during OIS operation, thereby enhancing the reliability of shake correction (or image stabilization correction).

[0224] The support portion may include a magnetic body 31 disposed on the OIS moving portion and a magnetic body 32 disposed on the fixed portion. For example, the magnetic body 31 may be disposed on the sensor base 270 and the magnetic body 32 may be disposed on the housing 210. Each of the magnetic body 31 and the magnetic body 32 may also be referred to as a "magnet", "yoke" or "holding magnet".

[0225] For example, the magnetic body 31 may be disposed in or combined with a groove 28A in the protrusion 28 of the sensor base 270. At least a portion of the magnetic body 31 may be disposed in a hole 60A in the tilt guide 60. For example, the magnetic body 31 may face or overlap with the hole 60A in the tilt guide 60 in the optical axis direction. For example, the magnetic body 31 may not overlap with the tilt guide 60 in the optical axis direction. For example, at least a portion of the magnetic body 31 may overlap with the tilt guide 60 in a direction perpendicular to the optical axis.

[0226] Magnetic body 31 may correspond to, face, or overlap with magnetic body 32 along the optical axis. For example, magnetic body 31 may be a bipolar magnet divided into N poles and S poles. For example, magnetic body 31 may be a bipolar magnet divided into N poles and S poles along the optical axis, or a bipolar magnet in which the N poles and S poles are arranged along the optical axis. In another embodiment, magnetic body 31 may be a bipolar magnet divided into N poles and S poles in a direction perpendicular to the optical axis, or a bipolar magnet in which the N poles and S poles are arranged in a direction perpendicular to the optical axis. In yet another embodiment, magnetic body 31 may be a quadrupole magnet including two N poles and two S poles.

[0227] Magnetic body 32 may be disposed below magnetic body 31. Magnetic body 32 may be disposed in a recess 46 in the housing 210. For example, magnetic body 32 may be coupled to the recess 46 in the housing 210. Magnetic body 32 may overlap with the hole 60A in the inclined guide 60 in the optical axis direction. Magnetic body 32 may not overlap with the inclined guide 60 in the optical axis direction. Magnetic body 32 may not overlap with the inclined guide 60 in the direction perpendicular to the optical axis. In another embodiment, magnetic body 32 may overlap with the inclined guide 60 in the direction perpendicular to the optical axis.

[0228] When viewed from above, the surface area of ​​the hole 60A in the tilt guide 60 can be greater than the surface area of ​​the upper (or lower) surface of the magnetic body 31. Furthermore, when viewed from above, the surface area of ​​the hole 60A in the tilt guide 60 can be greater than the surface area of ​​the upper (or lower) surface of the magnetic body 32.

[0229] For example, a holding force can be applied between magnetic bodies 32 and 31. The holding force can be the force exerted by the fixing portion and the OIS moving portion on the tilt guide 60. The holding force can be the force exerted by the sensor base 270 and the housing 210 on the tilt guide 60. The holding force can be a force that maintains support for the OIS moving portion relative to the fixing portion. The holding force can be a pressing force. For example, the holding force can be an attractive force applied between magnetic bodies 32 and 31 in the optical axis direction (or a first direction). This attractive force can be applied between magnetic bodies 32 and 31 in the optical axis direction or in the first direction.

[0230] The magnetic body 32 can be made of a material that can be attracted by the magnetic body 31. For example, the magnetic body 32 can be made of a material that can be attracted by a magnet. For example, the magnetic body 32 can be made of a magnetized metal. For example, the magnetic body 32 can be a magnet. The magnetic body 32 can also be referred to as a "yoke". In another embodiment, the magnetic body 31 can be a yoke, and the magnetic body 32 can be a magnet. In yet another embodiment, each of the magnetic body 31 and the magnetic body 32 can be a magnet.

[0231] By means of the attractive force between magnets 32 and 31, sensor base 270 and housing 210 can push tilt guide 60, and tilt guide 60 and rolling members 62 and 63 can be in close contact with sensor base 270 and / or housing 210. By means of the attractive force between magnets 32 and 31, tilt guide 60 and rolling members 62 and 63 can stably support OIS moving part relative to fixed part, and can perform stable OIS operation.

[0232] Furthermore, since at least a portion of the magnetic body 31 is disposed in the hole 60A in the inclined guide 60, the distance between the magnetic body 31 and the magnetic body 32 can be reduced, thereby increasing the attractive force between the magnetic body 31 and the magnetic body 32, and the OIS moving part can be stably supported relative to the fixed part. Moreover, since the magnetic body 31 can be disposed in the central region of the lower surface of the sensor base 270, and the magnetic body 32 is disposed in the center of the lower part 42 of the housing 210, the attractive force between the magnetic body 31 and the magnetic body 32 can be concentrated in the center of the sensor base 270 and the center of the housing 210, thereby efficiently and stably supporting the OIS moving part.

[0233] In another embodiment, the protrusion of the sensor base 270 can be omitted, and the magnetic body 31 can be disposed on the lower surface of the sensor base 270. Furthermore, the housing 210 may include a protrusion disposed on the lower portion 42 of the housing 210 to correspond to, face, or overlap with the hole 60A in the tilt guide 60, and the magnetic body 32 can be disposed on the protrusion of the housing 210. In this case, the mounting portion 25A of the sensor base 270 can be omitted, and a mounting portion corresponding to or identical to the mounting portion 25A of the sensor base 270 can be formed on the upper surface of the lower portion 42 of the housing 210. Furthermore, the tilt guide 60 can be disposed on the mounting portion of the housing 210, and this protrusion can protrude from the bottom surface of the mounting portion of the housing 210. Additionally, a groove in which the magnetic body 32 is disposed can be formed in the protrusion of the housing 210, and a groove in which the magnetic body 31 is disposed can be formed in the lower surface of the sensor base 270. In another embodiment, at least a portion of the protrusion of the housing 210 may be disposed in the hole 60A in the tilt guide 60, and may overlap with the tilt guide 60 in a direction perpendicular to the optical axis. In yet another embodiment, the magnetic body 32 may be disposed on the protrusion of the housing 210 (or disposed in a groove in the protrusion of the housing 210), and the magnetic body 31 may be disposed on the sensor base 270 (or disposed in a groove in the sensor base 270). In yet another embodiment, the magnetic body 32 may overlap with the tilt guide 60 in a direction perpendicular to the optical axis.

[0234] In another embodiment, the holding force may be a repulsive force applied between the magnetic body disposed on the fixed part and the magnetic body disposed on the movable part. In yet another embodiment, the repulsive force may be applied between the magnetic body disposed on the fixed part and the magnetic body disposed on the movable part, and the sensor base and housing may use this repulsive force to push the tilt guide 60, and the tilt guide 60 may support the OIS movable part.

[0235] Figure 9c This is a front perspective view of a tilting guide 60-1 according to another embodiment of the present disclosure. Figure 9d yes Figure 9c The rear-view perspective view of the tilting guide 60-1 shown.

[0236] exist Figure 9c and Figure 9d In the illustrated embodiment, the following can be omitted: Figure 2a The rolling members 62 and 63 are shown, and the tilting guide 60-1 may include... Figure 2a At least one protrusion 65-1 corresponding to the rolling member 62 shown, and with Figure 2a The rolling member 63 shown corresponds to at least one protrusion 66-1. For example, protrusion 65-1 may include multiple protrusions, and protrusion 66-1 may include multiple protrusions. For example, protrusion 65-1 may include two first protrusions 65A1 and 65B1 spaced apart from each other and two second protrusions 66A1 and 66B1 spaced apart from each other. The first protrusions may protrude from the first surface 6A of the inclined guide 60-1, and the second protrusions 66A1 and 66B1 may protrude from the second surface 6B of the inclined guide 60-1. For example, each of the first protrusions 65A1 and 65B1 may have a hemispherical or dome shape, and each of the second protrusions 66A1 and 66B1 may have a hemispherical, semi-elliptical, or dome shape.

[0237] For example, the tilt guide 60-1 may include a main body and first protrusions 65A1 and 65B1 and second protrusions 66A1 and 66B1 projecting from the main body. Here, the main body, the first protrusions 65A1 and 65B1, and the second protrusions 66A1 and 66B1 may be integrally formed with each other. At least a portion of the protrusions 65-1 of the tilt guide 60-1 may be disposed in a groove 29 in the sensor base 270. At least a portion of the protrusions 66-1 of the tilt guide 60-1 may be disposed in a groove 55 in the housing 210. The protrusions 65-1 of the tilt guide 60-1 may slide in the groove 29 in the sensor base 270, and the protrusions 66-1 of the tilt guide 60-1 may slide in the groove 55 in the housing 210. This reduces the friction between the tilt guide 60-1 and the sensor base 270 and / or the friction between the tilt guide 60-1 and the housing 210, and also reduces the current or power consumption required for OIS operation.

[0238] First protrusions 65A1 and 65B1 can form a first shaft, and second protrusions 66A1 and 66B2 can form a second shaft. Figure 2aThe description of the arrangement of the ball bearings 62A and 62B shown can be applied, with or without modification, to the first protrusions 65A1 and 65B1 of the tilt guide 60-1, and the description of the arrangement of the ball bearings 63A and 63B can be applied, with or without modification, to the second protrusions 66A1 and 66B1 of the tilt guide 60-1. For example, at least a portion of the first protrusions 65A1 and 65B1 of the tilt guide 60-1 can overlap with the image sensor 810 in the optical axis direction. For example, at least a portion of the first protrusions 65A1 and 65B1 of the tilt guide 60-1 can overlap with the lens module 400 in the optical axis direction. For example, at least a portion of the second protrusions 66A1 and 66B2 can overlap with the image sensor 810 in the optical axis direction. For example, at least a portion of the second protrusions 66A1 and 66B2 of the tilt guide 60-1 can overlap with the lens module 400 in the optical axis direction.

[0239] Figure 15 The electromagnetic force Fa between coil 120 and magnet 130 and the holding force FH applied between magnet 31 and magnet 32 ​​are shown. Figure 16a The distance d1 between coil 120 and magnet 130 and the distance between magnetic body 21 and magnetic body 32 are shown. Figure 16b The thickness T1 and surface area AREA1 of magnetic body 31, the thickness T2 and surface area AREA2 of magnetic body 130, and the thickness T3 and surface area AREA3 of magnetic body 32 are shown.

[0240] Reference Figure 15 , Figure 16a and Figure 16b The holding force FH applied between magnetic bodies 31 and 32 can be greater than the electromagnetic force Fa between coil 120 and magnet 130. The holding force FH can be a force in the optical axis direction or in the first direction. The holding force FH can be more than 1.2 times and less than 25 times the electromagnetic force Fa.

[0241] The holding force FH can be more than 5 times the weight W of the OIS moving part and less than 100 times the weight W of the OIS moving part (5×W≤FH≤100×W). In another embodiment, 10×W≤FH≤50×W can be achieved.

[0242] The weight W of the OIS moving part may include the weight of the OIS moving part and the weight of the lens module 400. In another embodiment, the weight W of the OIS moving part may include the tensile force (or elastic force) Ft of the circuit board 800 that connects the fixing part to the OIS moving part. The elastic force Ft of the circuit board 800 may be the product of the elastic coefficient K of the circuit board 800 and the displacement x of the circuit board 800 during OIS operation (Ft=K×x).

[0243] When the holding force FH is less than 1.2 times the electromagnetic force Fa, the holding force FH may be too low, which will cause excessive tilting of the OIS moving part caused by the electromagnetic force Fa during AF operation, resulting in deterioration of the OIS performance and image resolution of the camera device 200.

[0244] When the holding force FH exceeds 25 times the electromagnetic force Fa, a large driving force may be required to tilt the OIS moving part due to the excessive force pushing the tilting guide 60, and thus the power consumption may increase during OIS operation.

[0245] In another embodiment, the holding force FH can be more than 3 times the electromagnetic force Fa and less than 20 times the electromagnetic force Fs. Therefore, tilting of the OIS moving part caused by the electromagnetic force Fa during AF operation can be stably prevented, and the increase in power consumption required for tilting of the OIS moving part can be prevented. In yet another embodiment, the holding force FH can be more than 5 times the electromagnetic force Fa and less than 10 times the electromagnetic force Fa.

[0246] In order to make the holding force FH more than 1.2 times and less than 25 times the electromagnetic force Fa, the distance d1 between coil 120 and magnet 130 and the distance d2 between magnetic body 31 and magnetic body 32 can be designed as follows.

[0247] The first distance d1 can be less than the second distance d2. In another embodiment, the first distance d1 can be equal to the second distance d2 (d1 = d2). For example, the second distance d2 can be more than 1 times the first distance d1 and less than 4.5 times the first distance d1 (d1 ≤ d2 ≤ 4.5 × d1). In another embodiment, the second distance d2 can be more than 1.5 times the first distance d1 and less than 3 times the first distance d1 (1.5 × d1 ≤ d2 ≤ 3 × d1).

[0248] When the first distance d1 is greater than the second distance d2, the tilt compensation angle of the OIS moving part used for OIS operation may be limited, and the power consumption required for OIS operation may increase because the holding force FH is excessively applied.

[0249] Furthermore, when the second distance d2 exceeds 4.5 times the first distance d1, in order to obtain sufficient holding force FH, the size of the first magnetic body 31 and the size of the second magnetic body 32 may be increased, thereby increasing the weight of the OIS drive unit and the size of the camera device.

[0250] The thickness T2 of magnet 130 can be greater than the thickness T1 of magnet 31 (T2 > T1). In another embodiment, thickness T2 can be equal to thickness T1. Thickness T1 can be the length of magnet 31 in the optical axis direction or in a first direction. Thickness T3 can be the length of magnet 32 ​​in the optical axis direction or in the first direction. Thickness T2 can be the length of magnet 130 in the direction facing coil 120.

[0251] The thickness T2 of magnet 130 can be greater than the thickness T1 of magnet 31 (T2 > T1).

[0252] For example, the thickness T2 can be more than 1.5 times the thickness T1 and less than 4 times the thickness T1 (1.5 × T1 ≤ T2 ≤ 4 × T1). In another embodiment, 2 × T1 ≤ T2 ≤ 3 × T1 can be true.

[0253] When the thickness T2 is less than 1.5 times the thickness T1, the holding force FH may be too high, thereby increasing the power consumption required for OIS operation. When the thickness exceeds 4 times the thickness T1, the holding force FH may decrease, resulting in tilting of the OIS moving part during AF operation.

[0254] In another embodiment, thickness T2 can be equal to thickness T3.

[0255] The thickness T2 of magnet 130 can be greater than the thickness T3 of magnet 32 ​​(T2 > T3).

[0256] For example, the thickness T2 can be more than 3 times the thickness T3 and less than 9 times the thickness T3 (3 × T3 ≤ T2 ≤ 9 × T1). In another embodiment, 4 × T3 ≤ T2 ≤ 6 × T1 can be true.

[0257] When the thickness T2 is less than 3 times the thickness T3, the holding force FH may be too high, thereby increasing the power consumption required for OIS operation. When the thickness T2 exceeds 9 times the thickness T3, the holding force FH may decrease, resulting in tilting of the OIS moving part during AF operation.

[0258] The thickness T1 of the magnetic body 31 can be greater than the thickness T3 of the magnetic body 32 (T1 > T3).

[0259] For example, the thickness T1 can be more than 1.5 times the thickness T3 and less than 7 times the thickness T3 (1.5 × T3 ≤ T1 ≤ 7 × T3). In another embodiment, 3 × T3 ≤ T1 ≤ 5 × T3 can be true.

[0260] The surface area AREA2 of the first (or second) surface of magnet 130 can be greater than the surface area AREA1 of the first (or second) surface of magnet 31 (AREA2 > AREA1). In the following text, surface area AREA1 may be referred to as the "first surface area" and surface area AREA2 may be referred to as the "second surface area".

[0261] The first surface of the magnet 130 may be a surface facing the coil 120 or opposite to the coil 120, and the second surface of the magnet 130 may be a surface opposite to the first surface of the magnet 130.

[0262] The first surface of the magnetic body 31 can be a surface facing the magnetic body 32 or opposite to the magnetic body 32 in the optical axis direction, and the second surface of the magnetic body 31 can be a surface opposite to the first surface of the magnetic body 31.

[0263] The second surface area AREA2 can be more than twice the first surface area AREA1 and less than ten times the first surface area AREA1 (2 × AREA1 ≤ AREA2 ≤ 10 × AREA1). In another embodiment, 3 × AREA1 ≤ AREA2 ≤ 8 × AREA1 is possible. In another embodiment, 4 × AREA1 ≤ AREA2 ≤ 6 × AREA1 is possible.

[0264] When the second surface area AREA2 is less than twice the first surface area AREA1, the holding force FH may be too high, thereby increasing the power consumption required for OIS operation. On the other hand, when the second surface area AREA2 exceeds 10 times the first surface area AREA1, the holding force FH may decrease, thereby causing the OIS moving part to tilt during AF operation.

[0265] The second surface area AREA2 can be equal to or greater than the surface area AREA3 of the first (or second) surface of the magnetic body 32 (AREA2 ≥ AREA3). In the following text, the surface area AREA3 of the magnetic body 32 can be referred to as the "third surface area". The first surface of the magnetic body 32 can be a surface facing or opposite to the magnetic body 31 in the optical axis direction, and the second surface of the magnetic body 32 can be a surface opposite to the first surface of the magnetic body 32.

[0266] The second surface area AREA2 can be more than 1 times and less than 9 times the third surface area AREA3 (1 × AREA3 ≤ AREA2 ≤ 9 × AREA3). In another embodiment, 2 × AREA3 ≤ AREA2 ≤ 7 × AREA3 is possible. In yet another embodiment, 3 × AREA3 ≤ AREA2 ≤ 5 × AREA3 is possible.

[0267] When the second surface area AREA2 is less than 1 times the third surface area AREA3, the holding force FH may be too high, thereby increasing the power consumption required for OIS operation. When the second surface area AREA2 exceeds 9 times the third surface area AREA3, the holding force FH may decrease, resulting in tilting of the OIS moving part during AF operation.

[0268] The third surface area AREA3 can be equal to or greater than the first surface area AREA1 (AREA3 ≥ AREA1). The third surface area AREA3 can be more than 1 times the first surface area AREA1 and less than 15 times the first surface area AREA1 (1 × AREA1 ≤ AREA3 ≤ 15 × AREA1). In another embodiment, 3 × AREA1 ≤ AREA3 ≤ 10 × AREA1 is possible. In yet another embodiment, 4 × AREA1 ≤ AREA3 ≤ 8 × AREA1 is possible.

[0269] Figure 17a The electromagnetic forces F1 and F2 generated by the interaction between magnet units 310A and 310B and coil units 27A to 27D, as well as the movement of the OIS moving part, are shown. Figure 17b It shows the result of Figure 17a The movement of the OIS moving part 100 caused by the electromagnetic force shown.

[0270] Reference Figure 17a and Figure 17b The diagram illustrates the movement of the OIS moving part caused by the OIS drive unit. The OIS drive unit may be referred to as a "drive unit". The OIS drive unit can tilt the OIS moving part (e.g., a moving module) relative to a fixed part (e.g., housing 210). The OIS drive unit may include a coil 230 and a magnet 310. Furthermore, the OIS drive unit may include a position sensor 240.

[0271] The first electromagnetic force F1 can be generated by the interaction between the first magnet unit 310A and the first coil 230A. For example, the first electromagnetic force F1 can be applied in the optical axis direction, for example, in the upward or downward direction. The first electromagnetic force F1 can include a first electromagnetic force F11 generated by the interaction between the first coil unit 27A and the first magnet unit 310A, and a second electromagnetic force F12 generated by the interaction between the second coil unit 27B and the first magnet unit 310A. The number of turns of the first coil unit 27A can be equal to the number of turns of the second coil unit 27B. Here, the number of turns can be the number of times each of the coil units 27A and 27B is wound. The first electromagnetic force F1 can be the sum of the first electromagnetic force F11 and the second electromagnetic force F12. For example, the first electromagnetic force F11 can be different from the second electromagnetic force F12. For example, the second electromagnetic force F12 can be higher than the first electromagnetic force F11.

[0272] In another embodiment, the first electromagnetic force F12 of the second coil unit may be equal to or lower than the first electromagnetic force F11 of the first coil unit. In another embodiment, the number of turns of the first coil unit 27A may be different from the number of turns of the second coil unit 27B.

[0273] With the aid of a first electromagnetic force F1, the OIS moving part can tilt relative to a second axis (e.g., the Y-axis or the ball bearing member 63). For example, with the aid of the first electromagnetic force F1, the OIS moving part can tilt about the second axis. Here, tilting about the second axis (Y-axis) can mean tilting the OIS moving part relative to the second axis (Y-axis), or rotating the OIS moving part about the second axis (Y-axis) by a predetermined angle. For example, with the aid of the first electromagnetic force F1, the tilting guide 60 can tilt relative to the second axis (e.g., the Y-axis or the ball bearing member 63). For example, with the aid of the first electromagnetic force F1, the tilting guide 60 can tilt about the second axis.

[0274] A second electromagnetic force F2 can be generated by the interaction between the second magnet unit 310B and the second coil 230B. For example, the second electromagnetic force F2 can be applied in an upward or downward direction. The second electromagnetic force F2 can include a first second electromagnetic force F21 generated by the interaction between the third coil unit 27C and the second magnet unit 310B, and a second second electromagnetic force F22 generated by the interaction between the fourth coil unit 27D and the second magnet unit 310B. The number of turns of the third coil unit 27C can be equal to the number of turns of the fourth coil unit 27D. The second electromagnetic force F2 can be the sum of the first second electromagnetic force F21 and the second second electromagnetic force F22. For example, the first second electromagnetic force F21 can be different from the second second electromagnetic force F22. For example, the second second electromagnetic force F22 can be greater than the first second electromagnetic force F21.

[0275] In another embodiment, the second electromagnetic force F22 of the second coil unit can be equal to or lower than the second electromagnetic force F21 of the first coil unit. In another embodiment, the number of turns of the third coil unit 27C can be different from the number of turns of the fourth coil unit 27D.

[0276] The number of turns of the first coil unit 27A to the fourth coil unit 27D can be equal to each other. In another embodiment, the number of turns of the first coil unit 27A to the fourth coil unit 27D can be different from each other. In yet another embodiment, the number of turns of at least two of the first coil units 27A to the fourth coil unit 27D can be equal to each other.

[0277] With the aid of a second electromagnetic force F2, the OIS moving part can tilt relative to a first axis (e.g., the X-axis or the ball bearing member 62). For example, the OIS moving part can tilt about the first axis with the aid of the second electromagnetic force F2. Here, tilting about the first axis (X-axis) can mean tilting the OIS moving part relative to the first axis (X-axis), or rotating the OIS moving part about the first axis (X-axis) by a predetermined angle.

[0278] although Figure 17a An embodiment is shown in which each of the first coil 230A and the second coil 230B includes two coil units, but the first electromagnetic force F1 can be increased proportionally to the number of coil units included in the first coil 230A, and the second electromagnetic force F2 can be increased proportionally to the number of coil units included in the second coil 230B.

[0279] In this embodiment, since independent drive signals ID1 to ID4 are supplied to independent coil units 27A to 27D, the driving force required for OIS driving can be increased. Furthermore, in this embodiment, since coil units 27A and 27B are arranged to overlap each other in a first axial direction (e.g., the X-axis direction) and in a second axial direction (e.g., the Y-axis direction), the electromagnetic force required for OIS driving can be increased without increasing the size of the camera device in the optical axis direction.

[0280] In another embodiment, the first electromagnetic force generated by the interaction between the first magnet unit and the first coil, and the second electromagnetic force generated by the interaction between the second magnet unit and the second coil, can be applied in a direction different from the optical axis (e.g., in a direction perpendicular to the optical axis, such as the X-axis or Y-axis direction).

[0281] In this embodiment, by designing the distance d1 between the coil 120 and the magnet 130, the distance d2 between the magnetic bodies, the thickness T2 of the magnet 130, the thicknesses T1 and T3 of the magnetic bodies, the surface area AREA2 of the magnet 130, and the surface areas AREA1 and AREA3 of the magnetic bodies, the tilting of the OIS moving part attributable to AF drive can be suppressed. In this embodiment, performance degradation of OIS operation and image resolution degradation of the camera device caused by AF drive can be prevented.

[0282] In this embodiment, to increase the driving force required to tilt the OIS moving part relative to the second axis, multiple coil units (e.g., 27A and 27B) can be arranged to overlap each other in the direction of the first axis. Independent drive signals ID1 and ID2 can be supplied to the multiple coil units (e.g., 27A and 27B).

[0283] In this embodiment, to increase the driving force required to tilt the OIS moving part relative to the first axis, multiple coil units (e.g., 27C and 27D) can be arranged to overlap each other in the direction of the second axis. Independent drive signals ID3 and ID4 can be supplied to the multiple coil units (e.g., 27C and 27D).

[0284] Furthermore, in this embodiment, a larger number of turns of the first coil 230A and the second coil 230B can be ensured, and the OIS driving force can be increased without increasing the size.

[0285] In a comparative example (hereinafter referred to as the "first comparative example") that uses a coil unit and a magnet unit to tilt the OIS moving part relative to each of the first and second axes, the drive IC can supply a drive signal to the coil unit via a channel. In the case of increasing the size of the image sensor and the weight of the lens module to achieve high resolution, the electromagnetic force in the first comparative example may be insufficient. In the first comparative example, when the size of the magnet and coil is increased to compensate for the insufficient electromagnetic force, the size of the lens moving device may increase, thereby limiting the freedom of design in arranging other components.

[0286] In the comparative example (hereinafter referred to as the "second comparative example"), two coil units are connected in series with each other to tilt the OIS moving part relative to each of the first and second axes, and a drive signal can be supplied to the coil units via a channel. Since the two coil units are connected in series with each other in the second comparative example, the resistance of the first or second coil may increase, thereby reducing the electromagnetic force between the magnet unit and the coil.

[0287] Since the first coil unit 27A and the second coil unit 27B of the first coil 230A are not connected to each other in this embodiment, the resistance of the first coil 230A (or the second coil 230B) does not need to be increased compared to the second comparative example. In this embodiment, the first coil unit 27A and the second coil unit 27B can be driven by two independent channels, and the third coil unit 27C and the fourth coil unit 27D can be driven by two independent channels. Here, the term "channel" can mean the path or pathway through which the independent drive signal is supplied.

[0288] In this embodiment, the current of the drive signal and the resistance of the channel can be freely used in each channel.

[0289] In this embodiment, since magnet units 310A and 310B are arranged to overlap with multiple coil units (27A and 27B or 27C and 27D), the driving force generated by the interaction between magnet unit 310A and coil units 27A and 27B, as well as the driving force (or Lorentz force) generated by the interaction between magnet unit 310B and coil units 27C and 27D, can be increased. In this embodiment, because the electromagnetic force (or Lorentz force) generated by the interaction between the magnet units and coil units is increased, a heavy and large-diameter lens module can be driven, and a high-resolution camera device can be realized.

[0290] A camera device where the image sensor is fixed and the lens is moved in a direction perpendicular to the optical axis for image stabilization (hereinafter referred to as the "Third Comparative Example") may cause image distortion. Furthermore, a camera device where the lens is immovably fixed and the image sensor is moved or tilted for image stabilization (hereinafter referred to as the "Comparative Example") may cause image distortion at the periphery or corners of the image sensor. As described above, since the image sensor and lens are separated from each other in the Third and Fourth Comparative Examples, and only one of the image sensor and lens is movable or tiltable, image distortion may occur during image stabilization, and image stabilization at ultra-wide-angle lenses may be difficult.

[0291] In this embodiment, the OIS driving unit can tilt the OIS moving unit relative to the first axis and the second axis, and can rotate the OIS moving unit within a predetermined angle range to perform hand shake correction. In this embodiment, since the OIS moving unit includes a lens module 400 and an image sensor 810, the tilt direction (or rotation direction) and tilt angle (or rotation angle) of the lens module 400 (e.g., a lens, a lens module, or a spool 110) can be equal to or almost equal to the tilt direction (or rotation direction) and tilt angle (or rotation angle) during OIS driving.

[0292] In this embodiment, the lens module 400 (or the spool 110) and the image sensor 810 can tilt or rotate together during OIS driving to obtain full image resolution without image distortion, and hand shake correction under ultra-wide angle is possible.

[0293] Furthermore, in this embodiment, since the OIS moving part, including the lens module 400 (or the spool 110) and the image sensor 810, is tilted or rotated, hand shake correction under ultra-wide-angle conditions can be achieved. Moreover, in this embodiment, since distortion-free image correction is performed mechanically, current consumption can be reduced compared to Comparative Examples 1 and 2 due to the reduced load applied during image processing.

[0294] Furthermore, in this embodiment, since the tilting guide 60 is used for tilting the OIS moving part, the OIS moving part can be tilted in a stable, accurate and precise manner compared to examples that only use ball bearings or shaft bearings, thereby improving the reliability of the OIS drive.

[0295] Furthermore, in this embodiment, the power consumption required for OIS driving can be reduced by means of the bent portions 804D and 804E of the fourth plate 804, which is a flexible plate of the circuit board 800, and the third portion 804C.

[0296] Furthermore, in this embodiment, since the tilt guide 60 is provided on the mounting portion 25A of the sensor base 270, and the protrusion 28 of the sensor base 270 overlaps with the hole 60A in the tilt guide 60, the height or length of the camera device 200 in the optical axis direction can be reduced.

[0297] Furthermore, in this embodiment, since at least a portion of the magnetic body 31 is disposed in the hole 60A in the inclined guide 60, the distance between the magnetic body 31 and the magnetic body 32 can be reduced, thereby increasing the attractive force or holding force for supporting the OIS moving part, thereby performing stable OIS driving.

[0298] Figure 18 This is a perspective view of a camera device 200 including a lens module 400.

[0299] Reference Figure 18 The lens module 400 can be integrated with the wire tube 100. The lens module 400 can move together with the wire tube 110 in the optical axis direction. For example, the lens module 400 may include at least one of a lens and a lens tube.

[0300] In this embodiment, the lens module 400 and the image sensor 810 can simultaneously perform X-axis tilt or Y-axis tilt in the same direction and at the same angle during hand shake correction or hand shake adjustment.

[0301] Figure 19a The first position of the OIS moving part 100 is shown. Figure 19b The second position of the OIS moving part 100 is shown.

[0302] Reference Figure 19a and Figure 19b By means of the force F1 generated by the interaction between the first magnet unit 310A and the first coil 230A, the OIS moving part 100 can tilt by a predetermined angle θ1.

[0303] Specifically, when the OIS moving unit 100 moves from the first position to the second position, both the image sensor 810 and the lens module 400 can tilt simultaneously by a predetermined angle θ1. Furthermore, when the OIS moving unit 100 moves from the first position to the second position, the tilting guide 60 can tilt together with the image sensor 810 and the lens module 400 relative to (or around) a second axis (e.g., the Y-axis) by a predetermined angle θ1.

[0304] Therefore, this embodiment can obtain full-image resolution without image distortion and can perform hand-shake correction in ultra-wide-angle situations. Figure 19a and Figure 19b The description can be applied, with or without modification, to the tilt of the OIS moving part relative to the first axis (e.g., the X-axis).

[0305] Figure 20 Electrical connections between the first coil unit 27A to the fourth coil unit 27D, the first sensor 240A, the second sensor 240B, and the circuit board 190 are shown according to another embodiment.

[0306] exist Figure 20 In this configuration, each of the first sensor 240A and the second sensor 240B may be a driver IC including a Hall sensor. The first sensor 240A may include a first Hall sensor and a first driver. The second sensor 240B may include a second Hall sensor and a second driver.

[0307] The first sensor can use the detection result of the magnetic field of the magnet unit 310A to generate a first driving signal ID1 configured to drive the first coil unit 27A and a second driving signal ID2 configured to drive the second coil unit 27B. The second sensor 240B can use the detection result of the magnetic field of the magnet unit 310B to generate a third driving signal ID3 configured to drive the third coil unit 27C and a fourth driving signal ID4 configured to drive the fourth coil unit 27D.

[0308] The Hall sensor of the first sensor 240A can detect the magnetic field of the magnet unit 310A and can output a first output signal. The second Hall sensor of the second sensor 240B can detect the magnetic field of the magnet unit 310B and can output a second output signal. The first driver of the first sensor 240A can use the output signal of the first Hall sensor to generate a first drive signal ID1 configured to drive the first coil unit 27A and a second drive signal ID2 configured to drive the second coil unit 27B. Figure 14a The description of the first controller 835A using the output signal HV1 of the first sensor 240A to generate the first drive signal ID1 and the second drive signal ID2 can be applied to the first driver of the first sensor 240A with or without modification. Furthermore, Figure 14b The description of the second controller 835B using the output signal HV2 of the second sensor 240A to generate the third drive signal ID3 and the fourth drive signal ID4 can be applied to the second driver of the second sensor 240B with or without modification.

[0309] The first driver of the first sensor 240A can receive clock signal SCL, data signal SDA, and power or power signals VCC and GND from the host 700 via data communication using a protocol (e.g., I2C communication). Similarly, the second driver of the second sensor 240B can receive clock signal SCL, data signal SDA, and power or power signals VCC and GND from the host 700 via data communication using a protocol (e.g., I2C communication). For example, the host 700 can be the controller 830 of the camera device 200 or the controller 780 of the optical device 200A.

[0310] The first sensor 240A may include terminals K3 and K4 for inputting power signals VDD and VSS, and terminal K2 for transmitting and receiving clock signal SCL. Each of terminals K1 to K4 of the first sensor 240A may be electrically connected to a corresponding terminal P1 to P4 of the circuit board 190. The circuit board 190 may include first wiring (or circuit pattern) connecting terminals K1 to K4 of the first sensor 240A to terminals P1 to P4 of the circuit board 190. Furthermore, the first sensor 240A may include terminals R1 and R2 through which a first drive signal ID1 is supplied to the first coil unit 27A, and terminals R3 and R4 through which a second drive signal ID2 is supplied to the second coil unit 27B.

[0311] Terminal R1 of the first sensor 240A can be electrically connected to the first pad A1 of the circuit board 190, and terminal R2 of the first sensor 240A can be electrically connected to the second pad A2 of the circuit board 190. Terminal R3 of the first sensor 240A can be electrically connected to the third pad A3 of the circuit board 190, and terminal R4 of the first sensor 240A can be electrically connected to the fourth pad A4 of the circuit board 190. The first sensor 240A can supply a first drive signal ID1 to the first pad A1 and the second pad A2 of the circuit board 190, and can supply a second drive signal ID2 to the third pad A3 and the fourth pad A4 of the circuit board 190.

[0312] The second sensor 240B may include terminals M1 and M2 to which power signals VDD and VSS are input, terminal M4 to which data is transmitted and received, and terminal M3 to which clock signal SCL is transmitted and received. Each of terminals M1 to M4 of the second sensor 240B may be electrically connected to a corresponding terminal P1 to P4 of the circuit board 190. The circuit board 190 may include a second wiring (or circuit pattern) to connect terminals M1 to M4 of the second sensor 240B to terminals P1 to P4 of the circuit board 190. For example, each of the second wires may be electrically connected or conductively connected to a corresponding wire in the first wiring. In addition, the second sensor 240B may include terminals Q1 and Q2 configured to supply a drive signal ID3 to the third coil unit 27C, and terminals Q3 and Q4 configured to supply a fourth drive signal ID4 to the fourth coil unit 27D.

[0313] Terminal Q1 of the second sensor 240B can be electrically connected to the fifth pad A5 of the circuit board 190, and the second terminal Q2 of the second sensor 240B can be electrically connected to the sixth pad of the circuit board 190. Terminal Q3 of the second sensor 240B can be electrically connected to the seventh pad A7 of the circuit board 190, and the second terminal Q4 of the second sensor 240B can be electrically connected to the eighth pad A8 of the circuit board 190.

[0314] The second sensor 240B can supply a third drive signal ID3 to the fifth pad A5 and the sixth pad A6 of the circuit board 190, and can supply a fourth drive signal ID4 to the seventh pad A7 and the eighth pad A8 of the circuit board 190.

[0315] Each of the first sensor 240A and the second sensor 240B can perform data communication with the host 700 via terminals P1 to P4 of the circuit board 190. Data from the first sensor 240A and the second sensor 240B can be sent and received in a time-division manner via terminals P1 and P2 of the circuit board 190. In the data communication between the host 700 and the first sensor 240A and the second sensor 240B, the host 700 can correspond to a master device, the first sensor 240A can correspond to a first slave device, and the second sensor 240B can correspond to a second slave device. Different addresses or identification codes can be assigned to the first sensor 240A and the second sensor 240B. Data can be sent and received in a time-division manner between each of the first sensor 240A and the second sensor 240B and the host 700 via wiring (or lines) connected to terminal P1.

[0316] The camera device 200 according to an embodiment may include an optical instrument designed to form an image of an object in space using the properties of light (such as reflection, refraction, absorption, interference, diffraction, etc.) to extend vision, record or reproduce images obtained through a lens, perform optical measurements, or transmit or propagate images. For example, although the optical instrument according to the embodiment may be a mobile phone, cellular phone, smartphone, portable smart device, digital camera, laptop computer, digital broadcast terminal, PDA (personal digital assistant), PMP (portable multimedia player), navigation device, etc., this disclosure is not limited thereto. Furthermore, any device capable of capturing images or taking photographs is possible.

[0317] Figure 21a This is a perspective view of the optical device 200A according to an embodiment. Figure 21b This is a perspective view of an optical device 200X according to another embodiment. Figure 22 It is shown Figure 21a and Figure 21b A view showing the construction of the optical device.

[0318] For example, Figure 21a The illustrated embodiment may include a front-facing camera, in which the lens module 400 of the camera module 200 is configured to face the front surface of the subject 850. Although Figure 21b An optical device with two rear cameras is shown, but in another embodiment, one or more rear cameras may be provided on the optical device. In yet another embodiment, the camera module 200 may be used for both front and rear cameras.

[0319] Reference Figure 21a , Figure 21b and Figure 22The optical device 200A (hereinafter referred to as the "portable terminal") may include a main body 850, a wireless communication unit 710, an audio / video (A / V) input unit 720, a sensing unit 740, an input / output unit 750, a storage unit 760, an interface unit 770, a controller 780, and a power supply unit 790.

[0320] The main body 850 has a strip shape, but is not limited to it, and can be any of various types, such as sliding, folding, swinging, or rotating, wherein two or more sub-bodies are combined to be movable relative to each other.

[0321] The wireless communication unit 710 may include one or more modules that enable wireless communication between the terminal 200A and the wireless communication system or between the terminal 200A and the network where the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a near-field communication module 714, and a location information module 715.

[0322] The A / V input unit 720 is used to input audio or video signals, and may include, for example, a camera 721 and a microphone 722.

[0323] Camera 721 may include camera device 200 according to an embodiment.

[0324] The sensing unit 740 can sense the current state of the terminal 200A, such as whether the terminal 200A is on or off, the position of the terminal 200A, whether the user is touching it, the orientation of the terminal 200A, or the acceleration / deceleration of the terminal 200A, and can generate sensing signals to control the operation of the terminal 200A. When the terminal 200A is, for example, a slider cellular phone, the sensing unit 740 can sense whether the slider cellular phone is on or off. In addition, the sensing unit 740 can sense the power supply from the power supply unit 790, the connection between the interface unit 770 and external devices, etc.

[0325] The input / output unit 750 is used to generate, for example, visual, auditory, or tactile inputs or outputs. The input / output unit 750 can generate input data for controlling the operation of the terminal 200A and can display the information processed in the terminal 200A.

[0326] The input / output unit 750 may include a keyboard unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 730 can generate input data in response to input on the keyboard.

[0327] Display module 751 may include a plurality of pixels whose colors change in response to an electrical signal applied thereto. For example, display module 751 may include at least one of liquid crystal display, thin-film transistor liquid crystal display, organic light-emitting diode, flexible display, and 3D display.

[0328] The audio output module 752 can output audio data received from the wireless communication unit 710, for example, in call signal receiving mode, call mode, recording mode, voice recognition mode or broadcast receiving mode, or it can output audio data stored in the storage unit 760.

[0329] The touchscreen panel 753 can convert the capacitance change caused by the user touching a specific area of ​​the touchscreen into an electrical input signal.

[0330] Storage unit 760 can temporarily store programs for processing and control by controller 780, as well as input / output data (e.g., telephone numbers, messages, audio data, still images, moving images, etc.). For example, storage unit 760 can store images captured by camera 721, such as photographs or moving images.

[0331] Interface unit 770 serves as a path for the lens moving device to connect to an external device connected to terminal 200A. Interface unit 770 can receive power or data from external components and transmit it to various components within terminal 200A, or it can transmit data from within terminal 200A to external components. For example, interface unit 770 may include a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting to a device equipped with an identification module, an audio input / output (I / O) port, a video input / output (I / O) port, a headphone port, etc.

[0332] The controller 780 can control the overall operation of the terminal 200A. For example, the controller 780 can perform control and processing related to, for example, voice calls, data communications, and video calls.

[0333] The controller 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented in the controller 180 or may be implemented separately from the controller 780.

[0334] The controller 780 can perform pattern recognition processing, which can recognize handwritten or drawing inputs made on the touch screen as characters and images, respectively.

[0335] The power supply unit 790, under the control of the controller 780, can supply the power required to operate each component when it receives external or internal power.

[0336] As is evident from the above description, the embodiments are able to prevent performance degradation of OIS operation and image resolution degradation of the camera device caused by tilting of the OIS moving part driven by AF.

[0337] Furthermore, the embodiments can increase the electromagnetic force (or Lorentz force) generated by the interaction between the magnet unit and the coil unit to drive a heavy-duty lens module with a large diameter and achieve a high-resolution camera device.

[0338] The features, configurations, effects, etc., described above in the embodiments are included in at least one embodiment, but the present invention is not limited to these embodiments. Furthermore, the features, configurations, effects, etc., illustrated in the embodiments can be combined or modified by those skilled in the art with other embodiments. Therefore, the content related to these combinations and modifications should be interpreted as falling within the scope of the embodiments.

Claims

1. A camera device, comprising: Fixing part; The moving part includes an image sensor and a lens configured to face the image sensor in the optical axis direction; An inclined guide is disposed between the fixed part and the movable part; A first magnetic body is disposed on the movable part; A second magnetic body is disposed on the fixing part so as to generate a retaining force through interaction with the first magnetic body; as well as A driving unit is configured to tilt the moving unit relative to a first axis intersecting the optical axis direction or a second axis intersecting both the optical axis direction and the first axis. in: The moving part and the fixed part push the tilting guide member by means of the holding force. The moving part includes a magnet and a coil, which generate an electromagnetic force for moving the lens in the direction of the optical axis. The holding force is more than 1.2 times and less than 25 times the electromagnetic force.

2. The camera device according to claim 1, wherein: The distance between the magnet and the coil is less than the distance between the first magnet and the second magnet, and The length of the magnet in the direction facing the coil is greater than the length of the first magnet in the direction of the optical axis.

3. The camera device according to claim 1, wherein: The distance between the magnet and the coil is less than the distance between the first magnet and the second magnet, and The length of the magnet in the direction facing the coil is greater than the length of the second magnet in the direction of the optical axis.

4. The camera device according to claim 1, wherein: The distance between the magnet and the coil is less than the distance between the first magnet and the second magnet, and The surface area of ​​the first surface of the magnet facing the coil is greater than the surface area of ​​the first surface of the first magnet facing the second magnet.

5. The camera device according to claim 1, wherein: The distance between the magnet and the coil is less than the distance between the first magnet and the second magnet, and The surface area of ​​the first surface of the second magnetic body facing the first magnetic body is greater than or equal to the surface area of ​​the first surface of the first magnetic body facing the second magnetic body.

6. The camera device according to claim 1, wherein: The distance between the magnet and the coil is less than the distance between the first magnet and the second magnet, and The surface area of ​​the first surface of the magnet facing the coil is equal to or greater than the surface area of ​​the first surface of the second magnet facing the first magnet.

7. A camera device, comprising: Fixing part; The moving part includes an image sensor and a lens configured to face the image sensor in the optical axis direction; A first magnet unit and a second magnet unit are disposed on the moving part; A first coil, configured to tilt the moving part relative to a first axis intersecting the optical axis direction through interaction with the first magnet unit; as well as The second coil is configured to cause the moving part to tilt relative to a second axis that intersects the first axis and the optical axis direction through interaction with the second magnet unit. The first coil includes a first coil unit and a second coil unit configured to face the first magnet unit, and the second coil includes a third coil unit and a fourth coil unit configured to face the second magnet unit. A first driving signal is applied to the first coil unit, a second driving signal is applied to the second coil unit, a third driving signal is applied to the third coil unit, and a fourth driving signal is applied to the fourth coil unit.

8. The camera device according to claim 7 further includes an inclined guide disposed between the fixed part and the movable part.

9. The camera device according to claim 7, further comprising: A first sensor is configured to detect the magnetic field of the first magnet unit and output a first output signal. A first controller is configured to receive the first output signal and generate the first drive signal and the second drive signal. The second sensor is configured to detect the magnetic field of the second magnet unit and output a second output signal; as well as A second controller is configured to receive the second output signal and generate the third drive signal and the fourth drive signal.

10. The camera device according to claim 7, further comprising a circuit board disposed on the fixing portion, in, The circuit board includes: The first and second pads are electrically connected to the first coil unit and are to which the first drive signal is applied; The third and fourth pads are electrically connected to the second coil unit and are subject to the second drive signal; The fifth and sixth pads, electrically connected to the third coil unit and to which the third drive signal is applied; and The seventh and eighth pads are electrically connected to the fourth coil unit and are subject to the fourth drive signal.

Citation Information

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