Substrate warpage control apparatus based on torque of clamp driving portion, substrate processing apparatus including the same, and substrate warpage control method using the same

Abstract

A substrate processing apparatus according to an embodiment of the present application includes a support portion configured to support a substrate; a chuck ring configured to press a peripheral portion of the substrate in association with warping of the substrate; a drive portion configured to adjust a pressing force applied to the peripheral portion of the substrate by driving the chuck ring up and down; a torque measurement portion configured to measure a torque on the drive portion when the chuck ring is driven up and down by the drive portion, based on a torque measurement sensor or a power of the drive portion; and a control portion configured to adjust the pressing force of the chuck ring based on a torque measurement value measured by the torque measurement portion.

Description

Technical Field

[0001] This invention relates to a substrate warpage control device and a substrate warpage control method based on the torque of a clamp drive, and more specifically, to a device for controlling substrate warpage based on the torque of a drive unit that applies a clamp load for substrate warpage control, including a substrate processing apparatus and a substrate processing method utilizing the device. This invention was derived from research conducted as part of the Small and Medium Enterprise Technology Innovation Development (Small Enterprise Accounting) project of the Korea Small and Medium Enterprise Administration (Project No.: 1425176307, Specific Project No.: S3300781, Research Project Title: Plasma Processing Apparatus for Fan-Out Semiconductor Packaging, Supervising Agency: PSK Holdings Co., Ltd., Research Period: 2023.01.01~2023.12.31). Background Technology

[0002] Typically, a semiconductor integrated circuit is a very small and thin silicon chip, composed of a variety of electronic components. A semiconductor chip needs to go through various manufacturing processes, including photolithography, etching, deposition, reflow soldering, and packaging, before it leaves the factory.

[0003] As various materials are deposited on semiconductor substrates such as wafers, warpage can occur due to factors such as differing thermal expansion efficiencies. This warpage varies depending on the wafer's material and / or thickness (e.g., silicon, glass, etc.).

[0004] As described above, when plasma processing is performed on a warped wafer, localized plasma is generated on the lower surface of the wafer, which may damage the wafer and components. To prevent this, a clamping ring, called a window clamp, can be placed at the periphery of the wafer, and a clamping load can be applied to the periphery of the wafer by the clamping ring to prevent warpage. A device for driving the clamping ring to move up and down can be provided to adjust the pressure applied to the wafer in a manner that applies pressure to the periphery. However, conventional methods of applying pressure to the periphery of the wafer may cause damage to the substrates and their materials due to the load applied by the clamp and the lifting drive, depending on the degree of warpage of each substrate or the differences in physical properties between substrates and their materials. Summary of the Invention

[0005] The problem the invention aims to solve The present invention provides a warpage control device, a substrate processing apparatus including the device, and a substrate processing method using the device, wherein the warpage of the substrate is controlled based on the torque of a clamp drive unit that applies a clamp load for warpage control.

[0006] In addition, the present invention provides a warpage control device, a substrate processing device, and a warpage control method, which can prevent the substrate from breaking or being damaged due to excessive pressure load applied to the substrate by the clamp drive unit exceeding the set allowable load value, and can suppress the bending of the substrate.

[0007] The technical problems to be solved by the present invention are not limited to those described above. From the following description, those skilled in the art will clearly understand some other unmentioned technical problems.

[0008] means for solving problems A substrate processing apparatus according to an embodiment of the present invention includes: a support for supporting a substrate; a clamping ring configured to apply pressure to a peripheral portion of the substrate in relation to warping of the substrate; a drive unit configured to adjust the pressure applied to the peripheral portion of the substrate by lifting and lowering the clamping ring; a torque measuring unit configured to measure the torque on the drive unit when the clamping ring is lifted and lowered by the drive unit based on a torque measuring sensor or the power of the drive unit; and a control unit configured to adjust the pressure of the clamping ring based on the torque measurement value measured by the torque measuring unit.

[0009] The drive unit may include: a clamping shaft configured to engage with the clamping ring and apply pressure to the clamping ring; and a drive motor configured to drive the clamping shaft to move up and down. The torque measuring unit can measure the torque on the drive motor when the clamping shaft is driven to move up and down.

[0010] The substrate processing apparatus according to an embodiment of the present invention may further include: a data analysis unit that compares a torque measurement value measured by the torque measurement unit with a set maximum load value. If the torque measurement value measured by the torque measurement unit exceeds the maximum load value, the control unit may terminate the driving of the actuator of the drive unit. The maximum load value may be set based on physical properties including the thickness and material properties of the substrate and the degree of warpage of the substrate.

[0011] The substrate processing apparatus may further include a clamping device configured to be disposed between the drive unit and the clamping ring, such that as the drive unit descends, the load applied by the clamping ring to the periphery of the substrate is distributed.

[0012] The clamping ring may include: a clamping ring body, which is annular; and a plurality of connecting pieces, which are formed to protrude from the clamping ring body and are provided with insertion holes so that the plurality of clamping devices can be inserted respectively.

[0013] The clamping device may include: a clamping guide portion, which is coupled to the driving portion and raised and lowered by the driving portion, the upper end of the clamping guide portion being provided with a damping groove; a damping member, which is coupled to the clamping guide portion and driven integrally, the lower end of the damping member being accommodated in the damping groove; and a damping guide portion, the lower end of the damping guide portion being inserted into the damping groove, the damping guide portion being disposed between the clamping guide portion and the damping member, and dispersing the pressure applied to the clamping ring by the damping member when the driving portion is lowered.

[0014] The substrate processing method according to an embodiment of the present invention may include: step A, in which a clamping ring is driven by a driving unit to provide pressure to the periphery of a substrate supported by a supporting unit; step B, in which a torque measuring unit measures the torque on the driving unit when the clamping ring is driven up and down by the driving unit based on the power of a torque measuring sensor or the driving unit; and step C, in which a control unit adjusts the pressure of the clamping ring based on the torque measurement value measured by the torque measuring unit.

[0015] The substrate processing method according to an embodiment of the present invention may further include step D: comparing the torque measurement value measured by the torque measurement unit with a set maximum load value by a data analysis unit. Step C may include: terminating the driving of the actuator of the driving unit if the torque measurement value measured by the torque measurement unit exceeds the maximum load value.

[0016] Invention Effects According to embodiments of the present invention, a warping control device and a warping control method can be provided, which control the substrate based on the torque of a clamp drive unit that applies a clamp load to control the warping of the substrate.

[0017] According to an embodiment of the present invention, during the process of applying pressure to the edge of the substrate by the clamping ring through the clamping drive to suppress the warping (bending) of the substrate, the load value applied by the clamping drive is measured in real time to control the application of a load that will not cause the substrate to break or be damaged. This prevents the substrate from breaking or being damaged due to excessive pressure applied to the substrate by the clamping drive exceeding the set allowable load value, and suppresses the bending of the substrate.

[0018] The effects that can be obtained by the present invention are not limited to those mentioned above. Those skilled in the art should be able to clearly understand other effects not mentioned above from the following description. Attached Figure Description

[0019] Figure 1 This is a perspective view of a substrate processing apparatus according to an embodiment of the present invention.

[0020] Figure 2 yes Figure 1 The cross-sectional view of AA shown.

[0021] Figure 3 yes Figure 2 An enlarged view of part B shown in the diagram.

[0022] Figure 4 This is a configuration diagram of a substrate processing apparatus according to an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention.

[0024] Figure 6 This is a cross-sectional view of a substrate processing apparatus according to another embodiment of the present invention.

[0025] Figure 7 It is shown Figure 6 An enlarged view of the first embodiment of section C shown.

[0026] Figure 8 It is shown Figure 6 An enlarged view of the second embodiment of section C shown.

[0027] Figure 9 This is a flowchart of a substrate processing method according to an embodiment of the present invention.

[0028] Figure 10 This is a flowchart of a substrate processing method according to an embodiment of the present invention. Detailed Implementation

[0029] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various ways, and the scope of the present invention should not be construed as limited to the following embodiments. These embodiments are provided to illustrate the invention more completely to those skilled in the art. Therefore, the shapes of elements in the drawings may be exaggerated for emphasis on clearer illustration.

[0030] According to preferred embodiments of the present invention and with reference to the accompanying drawings, the invention constitutes a solution to the problem to be solved by the present invention. When assigning reference numerals to constituent elements in the drawings, the same reference numerals may be assigned to the same constituent elements even if they exist in different drawings. It is stated in advance that constituent elements of other drawings may be referenced when describing the current drawings if necessary.

[0031] Figure 1This is a perspective view of a substrate processing apparatus according to an embodiment of the present invention. Figure 2 yes Figure 1 The sectional view of AA shown. Figure 3 yes Figure 2 An enlarged view of part B shown. Figure 4 This is a structural diagram of a substrate processing apparatus according to an embodiment of the present invention. (Refer to...) Figures 1 to 4 According to an embodiment of the present invention, the substrate processing apparatus is an apparatus for performing a process for processing substrate 1.

[0032] The substrate processing apparatus can be an apparatus that performs processes such as packaging processes (e.g., fan-out packaging), plasma processes, reflow processes, etching processes, deposition processes, photolithography processes, or thermal processing processes. The substrate 1 processed by the substrate processing apparatus can be a semiconductor wafer, mask, glass substrate, or liquid crystal display (LCD) panel, but is not limited to these. Although not illustrated, these processes can be performed within the space of the processing substrate inside the cavity, and the interior of the cavity can provide various components required for processing the substrate 1, depending on the type of substrate processing process performed by the substrate processing apparatus.

[0033] The substrate processing apparatus according to an embodiment of the present invention may include a support unit 1000, a clamping ring 2000, a drive unit 3000, a clamping device 4000, a torque measuring unit 5000, a data analysis unit 6000, a warpage prediction unit 7000, and a control unit 8000. The torque measuring unit 5000, the data analysis unit 6000, the warpage prediction unit 7000, and the control unit 8000 belong to a warpage control apparatus according to an embodiment of the present invention.

[0034] The support portion 1000 can be configured as a support substrate. For example, the support portion 1000 may include a support chuck such as an electrostatic chuck on the bottom surface (lower surface) of the support substrate 1, but is not limited thereto. The support portion 1000 can be insulated by an insulator. Although not shown, a plurality of lift pins may be provided in the support portion 1000. As is well known, lift pins are devices for raising and lowering the substrate 1, configured to transfer the substrate 1 and clamping ring 2000 from the end effector hand and lower the substrate 1 and clamping ring 2000 onto the support portion 1000, and raise the processed substrate 1 and clamping ring 2000 from the support portion 1000 to the end effector hand, wherein the substrate 1 and clamping ring 2000 are moved into the cavity via an inlet / outlet by the end effector hand of a substrate handling robot for performing substrate processing.

[0035] When the substrate 1 and the clamping ring 2000 are lifted by multiple lifting pins, the substrate 1 is removed from the cavity by the end effector hand. Then, a new substrate for subsequent processing is moved back into the cavity by the end effector hand, thereby enabling the substrate processing process to be repeated.

[0036] The support portion 1000 may include a guide ring 1100. The guide ring 1100 has an annular shape and can guide the placement of the substrate 1. The guide ring 1100 may include guide protrusions 1110, which can be formed by protruding from the upper surface of the guide ring. At this time, multiple guide protrusions 1110 may be provided at predetermined intervals (angles) along the peripheral direction of the guide ring 1100.

[0037] The substrate 1 can be placed on the guide ring 1100. Specifically, the peripheral portion of the substrate 1 can be placed in the region close to the inner peripheral surface of the guide ring 1100 with reference to the guide protrusion 1110. Therefore, the substrate 1 can be stably supported.

[0038] The clamping ring 2000 can be configured to apply pressure to the periphery of the substrate 1. Specifically, the clamping ring 2000 can prevent the substrate 1 from warping (bending deformation) during substrate processing by applying a load to the periphery of the substrate 1. The clamping ring 2000 may include a clamping ring body 2100 and a connecting piece 2200. The clamping ring body 2100 is annular in shape, and a guide groove 2110 may be provided on its lower surface. The guide groove 2110 may be a shape corresponding to the guide protrusion 1110. Therefore, the clamping ring 2000 can fit into the guide ring 1100 to apply pressure to the substrate. In addition to being annular, the clamping ring 2000 may also be a rectangular ring or other shapes.

[0039] The connecting piece 2200 can protrude from the clamping ring body 2100. An insertion hole may be provided on the connecting piece 2200. Multiple connecting pieces 2200 are provided so that multiple clamping devices 4000 can be inserted into the insertion holes respectively. This will be explained in conjunction with the clamping device 4000 described later.

[0040] The drive unit 3000 can drive the clamping ring 2000 to rise and fall, thereby adjusting the pressure level provided by the clamping ring 2000 to the substrate 1. Multiple drive units 3000 can be arranged along the circumference of the substrate 1. Each drive unit 3000 can be connected to a multiple clamping device 4000, thereby driving the rise and fall of multiple connecting pieces 2200 respectively. The pressure provided to the substrate 1 by each of the multiple connecting pieces 2200 through the drive unit 3000 can be the same or different, and the pressure level provided to the substrate 1 can also be adjusted.

[0041] A clamping device 4000 is disposed between the drive unit 3000 and the clamping ring 2000, such that as the drive unit 3000 descends, the load applied by the clamping ring 2000 to the periphery of the substrate 1 is distributed. A detailed explanation of this will be provided in [reference needed]. Figures 6 to 8 The details are explained below.

[0042] The torque measuring unit 5000 can be configured to measure the torque on the drive motor when the drive clamp shaft is raised or lowered based on the torque measuring sensor (load sensing sensor) and / or the power of the drive unit. The clamp descends by the force of the drive motor, and the descending clamp presses against the substrate. When the substrate warps, the peripheral portion of the substrate can be pressed by the clamp to prevent warping.

[0043] The torque measurement unit 5000 may include a load sensing sensor called a load cell. The torque measurement unit 5000 can measure the load (torque) exerted on the fixture by the drive motor. The torque measurement value of the fixture drive motor measured by the torque measurement unit 5000 can be input to the data analysis unit 6000.

[0044] The data analysis unit 6000 can determine whether the torque measurement value measured by the torque measurement unit 5000 exceeds the set maximum load value. When the torque measurement value exceeds the maximum load value, the control unit 8000 can stop the drive motor through software control. The maximum load value can be set based on the physical properties of the substrate 1, such as its thickness and material.

[0045] When the thickness, material, and other physical property values ​​of the substrate 1 are input through the input interface, the control unit 8000 can determine the maximum load value based on the input physical property values ​​and a table corresponding to the maximum load value or a preset function. The determined maximum load value is compared with the torque value of the clamp drive motor to control the drive of the actuator that drives the clamping ring.

[0046] Furthermore, the maximum load value, which serves as a reference for controlling the actuator drive of the clamp drive motor, can be set according to the degree of warping of the substrate 1 (warping level or warping prediction level). The maximum load value can be set to increase or decrease linearly or non-linearly proportional to the degree of warping of the substrate 1. This is because the torque value changes due to the warping of the substrate 1, and the permissible load value of the substrate 1 (the load range within which the substrate will not break or be damaged) may change depending on the amount of warping of the substrate 1.

[0047] Since warping may only occur in a specific area of ​​the periphery of the substrate 1, or the degree of warping on the periphery may vary along the circumferential direction, the allowable torque value (maximum load value) of the actuator that drives the clamping ring along the periphery of the substrate 1 can also be set differently when the clamping ring is driven by multiple actuators.

[0048] The control unit 8000 can adjust the drive level of the actuator based on the warpage location and warpage level predicted by the warpage determination unit 7000, and control multiple drive units 3000. At this time, the drive level of the actuator can be determined according to the algorithm (program) of the control unit 8000 as the value required to prevent warpage of the substrate 1 and damage to the substrate 1 during the substrate processing process, based on the physical properties of the substrate.

[0049] Figure 5 This is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention. Figure 5 This is a schematic diagram intended to aid in understanding the operation of embodiments of the present invention, and is not intended to limit it. See also... Figures 1 to 5 According to an embodiment of the present invention, the substrate processing apparatus can be divided into a first region R1 to a fourth region R4. For example, each region can be one of a plurality of fan-shaped regions that divide the substrate into a plurality of regions. Figure 5 The first region R1 to the fourth region R4 shown are exaggerated for the purpose of understanding the drawings, and the arcs of the first region R1 to the fourth region R4 preferably coincide with the outer periphery of the substrate.

[0050] Each region may be equipped with clamping rings 2001, 2002, 2003, and 2004; drive units 3001, 3002, 3003, and 3004; and clamping devices 4001, 4002, 4003, and 4004. After providing a reference pressure level to the substrate through the clamping rings 2001, 2002, 2003, and 2004, when warping occurs in the first region R1 and the third region R3 during the substrate processing, the warping determination unit 7000 can predict the occurrence of warping from the torque value changes of the clamp drive motors in the first region R1 and the third region R3.

[0051] The control unit 8000 can control the drive unit 3000 based on the warpage location and warpage level predicted by the warpage determination unit 7000, and adjust the drive level provided by the clamping rings 2001, 2002, 2003, and 2004 to the substrate 1. In the above example, the first drive unit 3001 and the third drive unit 3003 can drive the clamping rings with a drive pressure greater than that of the second drive unit 3002 and the fourth drive unit 3004.

[0052] The control unit 8000 can determine the drive level based on physical properties such as the thickness and material of the substrate. In this embodiment, the control unit 8000 can determine the drive level based on a correspondence table of drive levels corresponding to the thickness and / or material of the substrate 1 stored in a database, or based on a preset function or artificial intelligence. For example, the correspondence table can be preset and stored in the database by repeatedly experimenting to find the optimal pressure level for the substrate thickness and / or material that can prevent warping during the substrate processing process.

[0053] Figure 6 This is a cross-sectional view of a substrate processing apparatus according to another embodiment of the present invention. Figure 7 It is shown Figure 6 An enlarged view of the first embodiment of section C shown. Figure 8 yes Figure 6 An enlarged view of the second embodiment of section C shown. (Refer to...) Figures 6 to 8 According to other embodiments of the present invention, the substrate processing apparatus and Figures 1 to 4 Compared to the substrate processing apparatus shown in the embodiment of the present invention, the clamping device 4000 has a different configuration. Therefore, in the following description, only the configuration with the difference will be described, and detailed descriptions of repeated reference numerals for the same configuration will be omitted.

[0054] A clamping device 4000 is disposed between the drive unit 3000 and the clamping ring 2000, such that as the drive unit 3000 descends, the load applied by the clamping ring 2000 to the periphery of the substrate 1 is distributed. The drive unit 3000 may include a drive frame 3100 and an actuator 3200, and the actuator 3200 allows the drive frame 3100 to be introduced and withdrawn.

[0055] The clamping device 4000 may include a clamp guide 4100, a damping member 4200, and a damping guide 4300. The clamp guide 4100 may be coupled to the drive unit 3000 and raised or lowered via the drive unit 3000. When the clamp guide 4100 rises via the drive unit 3000, the lower surface of the clamping ring 2000 is supported by the clamp guide 4100 and rises. When the clamp guide 4100 descends, the clamping ring 2000 may be positioned on the upper part of the clamp guide 4100.

[0056] A damping groove 4101 may be formed at the upper end of the clamp guide 4100. The upper surface of the damping groove 4101 may have an open shape. The damping member 4200 is combined with and integrally driven by the clamp guide 4100, and its lower end may be accommodated in the damping groove 4101. The damping member 4200 may be made of an elastic material or a non-elastic material. When the damping member 4200 is made of an elastic material, the load applied to the substrate 1 can be distributed through the buffering effect of the damping member 4200.

[0057] The damping member 4200 may include a damping shaft 4210 and a pressure-applying body 4220. The damping shaft 4210 has a length in the vertical direction, and its lower end can be fixedly coupled to the clamp guide 4100. The pressure-applying body 4220 is coupled to the upper end of the damping shaft 4210 and can slide along the inner circumferential surface of the damping guide 4300.

[0058] Specifically, the pressure-applying body 4220 may include a stepped portion 4221 and a pressure-applying body 4222. A detailed description of this will be given later along with the damping guide portion 4300. Thus, the pressure-applying body 4220 directly provides pressure to the damping guide portion 4300, and can provide the pressure distributed through the damping guide portion 4300 to the clamping ring 2000.

[0059] Additionally, the damping member 4200 may also include a spring 4230. The spring 4230 may be disposed between the pressure body 4220 and the bottom surface of the damping groove 4101, thereby buffering the rise and fall of the pressure body 4220.

[0060] For example, when the damping guide 4300 applies a load to the substrate 1 as the damping member 4200 descends, the spring 4230 will be compressed, thereby buffering the load applied to the substrate 1. The spring 4230 may be configured to wrap around the outer peripheral surface of the damping shaft 4210, but is not limited thereto.

[0061] The lower end of the damping guide 4300 is inserted into the damping groove 4101. The damping guide 4300 is disposed between the clamp guide 4100 and the damping member 4200, and can disperse the pressure applied by the damping member 4200 to the clamping ring 2000 when the drive unit 3000 is driven to descend.

[0062] For example, the damping guide 4300 may include a sliding portion 4310 and an engaging portion 4320. The sliding portion 4310 is a cylindrical shape with an open top and may be formed to have a first inner diameter D1. In this case, the first inner diameter D1 may be designed to be the same as the diameter of the damping groove 4101. Therefore, the sliding portion 4310 can be inserted into the damping groove 4101 and move up and down together with it as the clamp guide 4100 moves up and down.

[0063] Additionally, a connecting hole may be formed on the lower surface of the sliding part 4310, into which the damping shaft 4210 is inserted.

[0064] The engaging portion 4320 is formed on the upper part of the sliding portion 4310 and may have a second inner diameter D2 that is larger than the first inner diameter D1, thereby forming a step with the sliding portion 4310. The engaging portion 4320 may be formed to match the stepped portion 4221 of the pressure-applying body 4220, thereby applying pressure to the damping guide portion 4300 when the clamp guide portion 4100, which is fixedly connected to the damping member 4200, descends.

[0065] In other words, when the clamp guide 4100 descends, the damping member 4200 can descend together with the clamp guide 4100. The damping guide 4300 is disposed between the clamp guide 4100 and the pressure body 4220, and can be matched with the step portion 4221 of the pressure body 4220 and descend together with it.

[0066] At this time, the connecting piece 2200 can be disposed between the engaging portion 4320 of the clamp guide portion 4100 and the damping guide portion 4300, and the damping guide portion 4300 can be inserted into the insertion hole provided in the connecting piece 2200. Therefore, the load applied to the substrate 1 by the clamping ring 2000 due to the descent of the drive portion 3000 can be distributed by the clamping device 4000.

[0067] Furthermore, the outer peripheral surface of the damping guide 4300 has a shape corresponding to the inner peripheral surface of the clamp guide 4100, thereby allowing the damping guide 4300 to slide stably along the outer peripheral surface of the clamp guide 4100 as the clamp guide 4100 descends. This provides a buffered pressure level compared to the case where the clamping ring 2000 directly applies pressure to the substrate 1, thus reducing the possibility of damage to the substrate 1.

[0068] Figure 9 This is a flowchart of a substrate processing method according to an embodiment of the present invention. Figures 1 to 4 Reference in the same place Figure 9 The substrate processing method according to an embodiment of the present invention may include: a step of driving a clamping ring to provide pressure to the periphery of a substrate supported by a support portion (step S10); a step of measuring the torque on the drive portion as the clamping ring is driven up and down by the drive portion (step S20); a step of comparing the torque measurement value measured by the torque measurement unit with a set maximum load value (step S30); and a step of adjusting the pressure of the clamping ring based on the torque measurement value measured by the torque measurement unit and the comparison result of the data analysis unit (step S40). When the torque measurement value measured by the torque measurement unit exceeds the maximum load value, the control unit may terminate the driving of the actuator of the drive portion.

[0069] The substrate processing apparatus according to embodiments of the present invention can employ a structure that combines a drive motor with a torque measuring unit, and these components are connected and coupled to all clamping shafts. However, it can also employ a structure that combines a separate torque measuring unit and a drive motor on each clamping shaft. In this case, the applied load on each shaft can be measured by the separate torque measuring unit coupled to each clamping shaft.

[0070] In addition to a drive motor, the actuator can also be a hydraulic cylinder. In an embodiment of the invention, the clamping pressure part is driven up and down by a drive motor, but a hydraulic cylinder can also be used instead of a drive motor to drive the clamping pressure part.

[0071] In addition, in the embodiments of the present invention, although the torque measuring unit is combined with the drive motor to measure the load applied to the substrate, it is also possible to use a structure of a drive motor and a control device that can control the current, without using the torque measuring unit, and control the actuator drive of the clamp drive motor based on the power of the drive motor.

[0072] When position control is applied to a drive motor, power is used until a specific position is reached. The power used can increase proportionally to the external resistance generated up to the target position. For example, when a substrate warps, the power consumption of the drive motor applying pressure to the substrate may increase due to the external resistance generated by the bending shape. This is because the power consumption of the drive motor is proportional to the magnitude of the external resistance. Therefore, the actuator drive of the drive motor can be controlled based on the power of the drive motor, similar to torque measurements.

[0073] Figure 10 This is a flowchart illustrating the process of clamping control of the substrate according to an embodiment of the present invention. (Refer to...) Figure 10 First, the maximum load value (allowable load value) for each substrate is stored and set (step S101). The maximum load value for each substrate type can be determined by testing or based on information provided by the equipment manufacturer. Then, when the equipment user inputs the characteristics (material, thickness, warpage, etc.) of the substrate to be used in the substrate processing process (step S102), the substrate type most similar to the substrate targeted for substrate processing is selected from the previously stored substrate types (step S103).

[0074] Next, the substrate is placed between the lifting pin and the clamping ring (step S104), and the drive motor and actuator of the drive unit are driven to lower the clamping ring (steps S105, S106). During this process, the torque measurement value is obtained by measuring the load (load) transmitted between the substrate and the clamping ring (steps S107, S108). When the torque measurement value is obtained in real time, it is confirmed whether the real-time collected torque value is close to the maximum load value set for the substrate type corresponding to the substrate (step S109). When the torque measurement value reaches a certain value, the actuator speed is reduced, and when the allowable load value is reached, the drive motor and actuator are stopped (step S110), and the clamping ring is stopped (step S111).

[0075] Figure 11 This is a flowchart illustrating the process of warping occurring on a sensing substrate according to an embodiment of the present invention. (Refer to...) Figure 11 The substrate is placed in the drive unit (step S201), and the drive motor and actuator of the drive unit are driven to lower the clamping ring (steps S202, S203). During this process, the torque measurement value is obtained by measuring the load (load) transmitted between the substrate and the clamping ring (steps S204, S205, S206). When the torque measurement value is obtained in real time, it is determined whether warping has occurred based on the real-time collected torque value (step S207). If the torque measurement value exceeds the set reference torque value during the execution of the process, it may be judged that warping has occurred and an alarm will be issued (steps S208, S209).

[0076] According to an embodiment of the present invention, during the process of applying pressure to the edge of the substrate by the clamping ring through the drive unit to suppress the warping (bending) of the substrate, the load value applied by the drive unit is measured in real time to control the application of a load that will not cause the substrate to break or be damaged. This can prevent the substrate from breaking or being damaged due to excessive pressure applied by the drive unit to the substrate beyond the set allowable load value and suppress the bending of the substrate.

[0077] The above detailed description is an example of the present invention. Furthermore, the above content illustrates preferred embodiments of the invention, which can be used in various combinations, modifications, and environments. That is, changes or modifications can be made to the concept and scope of the invention disclosed in this specification, the scope equivalent to the written disclosure, and / or the scope of technology or knowledge in the art. The written embodiments illustrate the optimal state for implementing the technical idea of ​​the invention, and various required modifications can be made to the specific application field and use of the invention. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Furthermore, the appended claims should be interpreted as including other embodiments.

Claims

1. A substrate processing apparatus, characterized in that, include: Support section, used to support the substrate. The clamping ring is configured to apply pressure to the periphery of the substrate in relation to the warping of the substrate. The driving unit is configured to adjust the pressure applied to the periphery of the substrate by driving the clamping ring to move up and down. The torque measuring unit is configured to measure the torque on the drive unit when the clamping ring is lifted and lowered by the drive unit, based on the power of the torque measuring sensor or the drive unit. The control unit is configured to adjust the pressure of the clamping ring based on the torque measurement value measured by the torque measuring unit.

2. The substrate processing apparatus according to claim 1, characterized in that, The drive unit includes: The clamping shaft is configured to engage with the clamping ring and apply pressure to the clamping ring, and The drive motor is configured to drive the clamp shaft to move up and down. The torque measuring unit is configured to measure the torque on the drive motor when the clamp shaft is lifted and lowered.

3. The substrate processing apparatus according to claim 1, characterized in that, Also includes: The data analysis unit compares the torque measurement value measured by the torque measurement unit with the set maximum load value; When the torque measurement value measured by the torque measurement unit exceeds the maximum load value, the control unit terminates the drive of the actuator of the drive unit.

4. The substrate processing apparatus according to claim 3, characterized in that, The maximum load value is set based on the thickness of the substrate, the physical properties of the material, and the degree of warping of the substrate.

5. The substrate processing apparatus according to claim 1, characterized in that, Also includes: The clamping device is configured to be disposed between the drive unit and the clamping ring, such that as the drive unit descends, the load applied by the clamping ring to the periphery of the substrate is distributed.

6. The substrate processing apparatus according to claim 5, characterized in that, The clamping ring includes: The clamping ring body is ring-shaped, and Multiple connecting pieces are configured to protrude from the clamping ring body and are provided with insertion holes so that the multiple clamping devices can be inserted into the insertion holes respectively.

7. The substrate processing apparatus according to claim 5, characterized in that, The clamping device includes: The clamp guide is coupled to the drive unit and is raised and lowered by the drive unit. The upper end of the clamp guide is provided with a damping groove. A damping member is integrated with and driven integrally with the clamp guide portion; the lower end of the damping member is accommodated in the damping groove. A damping guide portion, the lower end of which is inserted into the damping groove, is disposed between the clamping guide portion and the damping member, and disperses the pressure applied to the clamping ring by the damping member when the driving portion is driven to descend.

8. A substrate processing method, characterized in that, include: Step A involves the clamping ring being driven by the driving unit to apply pressure to the periphery of the substrate supported by the supporting unit. Step B involves measuring the torque on the drive unit when the clamping ring is lifted and lowered by the drive unit, based on the power of the torque measurement sensor or the drive unit, using a torque measurement unit. Step C involves adjusting the pressure of the clamping ring based on the torque measurement value measured by the torque measuring unit via the control unit.

9. The substrate processing method according to claim 8, characterized in that, Also includes: Step D involves comparing the torque measurement value measured by the torque measurement unit with the set maximum load value through the data analysis unit; Step C includes: if the torque measurement value measured by the torque measurement unit exceeds the maximum load value, then terminating the driving of the actuator of the drive unit.

10. The substrate processing method according to claim 9, characterized in that, The maximum load value is set based on the thickness of the substrate, the physical properties of the material, and the degree of warping of the substrate.

Images