Mask and method of manufacturing a mask

CN122828271APending Publication Date: 2026-09-29I SMART MARKETING SVCS LTD
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Patent Information

Application Number
CN202512047385.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-12-18
Filing Date
2025-12-31
Publication Date
2026-09-29

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Abstract

The present disclosure relates to a face mask and a method of manufacturing a face mask. In particular, a face mask (10) is provided, more particularly, a face mask (10) for providing a therapeutic and / or cosmetic treatment to a user's face is provided. The face mask (10) comprises a flexible and stretchable base substrate (13); a stretchable electronic circuit (15) mounted directly onto the base substrate (13); at least one treatment element (17) in communication with the stretchable electronic circuit (15); and a flexible and stretchable electrically insulating laminated layer (19) covering the stretchable electronic circuit (15). The present disclosure also provides a method (100, Fig. 4) of manufacturing a face mask for providing a therapeutic and / or cosmetic treatment to a user's face.
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Description

Technical Field

[0001] This disclosure relates to a face mask, and more specifically, to a face mask for providing therapeutic and / or cosmetic treatment to a user's face. Furthermore, this disclosure relates to a method of manufacturing the face mask. Background Technology

[0002] Masks and other treatment devices (also understood herein as "treatment") for providing LED therapy or phototherapy are known. These devices are used to apply therapeutic and / or cosmetic treatments to the skin and / or face, such as by applying light of different wavelengths to the skin to cure a disease or condition or otherwise improve skin condition. Other therapeutic and / or cosmetic treatments that can be applied using a mask may include electromuscular stimulation or ultrasound treatment.

[0003] These face masks typically take the form of a rigid or semi-rigid body, with components mounted or embedded within it. For example, prior art disclosure KR20200035711A describes a face mask with a 3D shape. Because this face mask has a rigid 3D shape, users whose faces do not perfectly match the rigid 3D shape may find the face mask unsuitable and uncomfortable. Given the potentially large differences between users, this inevitably means that a large number of users may find this face mask design unsuitable.

[0004] Furthermore, because the mask is rigid or semi-rigid, it cannot fit snugly against the face. Therefore, existing masks may be uncomfortable to wear. Additionally, because existing masks do not fit snugly against the face, the distance between the mask's processing elements and the face varies. This may lead to variations in the mask's effectiveness across the user's face.

[0005] Existing face masks also have drawbacks related to manufacturing efficiency. Because they are formed from several layers with a specific 3D shape, they may require manufacturing steps such as molding and overmolding. These processes can be labor-intensive and costly. Therefore, the manufacturing process can be inefficient.

[0006] An improved face mask that takes into account at least some of the above problems is needed. Summary of the Invention

[0007] Therefore, a face mask according to claim 1 is provided for providing therapeutic and / or cosmetic treatment to a user's face. The face mask comprises: a flexible and stretchable base substrate; stretchable electronic circuitry directly mounted on the base substrate; at least one processing element in communication with the stretchable electronic circuitry; and a flexible and stretchable electrically insulating laminate covering the stretchable electronic circuitry.

[0008] Because the face mask comprises a flexible and stretchable base substrate onto which the stretchable electronic circuitry is directly mounted, the face mask is made with very few components and can have a thin and flexible overall composition. Furthermore, a stretchable electrically insulating laminate covering the stretchable electronic circuitry ensures that the face mask can make direct contact with the facial skin without the need for other layers.

[0009] Because the base substrate, electronic circuitry, and electrically insulating laminates are all stretchable, materials can be selected to ensure they have the same material response. This allows the mask to be flexible without introducing strain into the various materials, which could lead to delamination or other defects. This allows the mask to be completely flexible.

[0010] The overall effect of these features is a thin and lightweight mask that can be worn on and conforms to the user's facial skin. This results in a comfortable fit for the user. Furthermore, because the mask conforms to the face, the distance between the mask's processing elements and the skin can be relatively uniform, and this distance can be reduced throughout the entire mask area. This leads to optimized uniformity and effectiveness of the mask across the user's face.

[0011] In this disclosure, "stretchable" may mean at least as stretchable as or more stretchable than polyurethane elastomers and / or polyolefin elastomers. Furthermore, and / or alternatively, "stretchable" may mean a material having an elastic modulus of less than 30 MPa.

[0012] In this disclosure, "flexible" may mean at least as flexible as or more flexible than polyurethane elastomers and / or polyolefin elastomers. Additionally and / or alternatively, "flexible" may mean a material having a hardness and / or stiffness below 80 Shore A.

[0013] The base substrate may include multiple substrate layers. Specifically, the base substrate may include at least a first substrate layer, a second substrate layer, and a third substrate layer. A second substrate layer may be disposed between the first and third substrate layers. Therefore, the second substrate layer may be referred to as the "intermediate" substrate layer. The intermediate substrate layer may include an optically reflective surface that can be arranged to reflect emissions from the processing element toward the wearer's skin during use. The first and second substrate layers can be formed of any material, such as thermoplastic polyurethane (TPU).

[0014] The electrically insulating laminate may include an outer cover, which may be formed of TPU, preferably transparent TPU. The outer cover may be thermally insulating.

[0015] A method for manufacturing a face mask for providing therapeutic and / or cosmetic treatment to a user's face, as claimed in claim 17, is also provided. The method includes: providing a flexible and stretchable base substrate; directly mounting stretchable electronic circuitry onto the base substrate; mounting at least one processing element in communication with the stretchable electronic circuitry; and applying a flexible and stretchable electrically insulating laminate over the stretchable electronic circuitry.

[0016] Because this method involves the simple construction of a flexible layer, it can be formed without complex and labor-intensive processes such as overmolding. Therefore, this is a more efficient method than those required for manufacturing devices using existing technologies.

[0017] In embodiments, this disclosure is not limited to face masks, but can more broadly relate to processing devices incorporating the technical features set forth herein, wherein a face mask is a specific example of a processing device. The processing device can be used not only on the face, but also on other parts of the user's body. Therefore, the description of face masks herein can also be applied to processing devices in the same way. Therefore, this disclosure also provides processing devices according to the following clauses: Item 1. A processing device for providing therapeutic and / or cosmetic care to a user's skin, the device comprising: a flexible and stretchable base substrate; stretchable electronic circuitry directly mounted on the base substrate; at least one processing element in communication with the stretchable electronic circuitry; and a flexible and stretchable electrically insulating laminate covering the stretchable electronic circuitry.

[0018] Item 2. The processing apparatus of Item 1, wherein the base substrate comprises thermoplastic polyurethane, preferably wherein the thermoplastic polyurethane has a Shore A hardness of 40 to 60, an elastic modulus of 20 to 40 MPa and / or a tensile strength of 400% to 500%.

[0019] Item 3. The processing apparatus of Item 1 or 2 further includes a non-stick coating applied to the side of the processing apparatus containing the electrically insulating laminate.

[0020] Item 4. The processing apparatus of any one of the preceding items, wherein the stretchable electronic circuit comprises stretchable conductive ink, preferably wherein the stretchable conductive ink comprises a flexible polymer chain material mixed with a liquid metal alloy, preferably wherein the liquid metal alloy comprises silver, carbon, graphite, silver chloride, gold, platinum and / or conductive traces having tortuous paths.

[0021] Item 5. The processing apparatus of any one of the preceding items, wherein the at least one processing element comprises at least one LED emitter, at least one laser, at least one ultrasound emitter, at least one heating / cooling element, at least one TENS element, at least one iontophoresis element and / or the at least one EMS emitter.

[0022] Item 6. The processing apparatus of Item 5, wherein the LED emitter emits light with a wavelength between 400 and 1100 nm.

[0023] Item 7. The processing apparatus of any one of the preceding items, wherein the at least one processing element has a diameter of less than 0.5 mm.

[0024] Item 8. The processing apparatus of any one of the preceding items, wherein the at least one processing element comprises at least six processing elements.

[0025] Item 9. The processing apparatus of Item 8, wherein the processing elements are spaced apart at a distance between 5 and 40 mm.

[0026] Item 10. The processing apparatus of any one of the preceding items, wherein the electrically insulating laminate includes at least one aperture for the at least one processing element to be located therein, and / or the electrically insulating laminate includes a material that transmits emission from the processing apparatus.

[0027] Item 11. The processing apparatus of any one of the preceding items, wherein the electrically insulating laminate comprises thermoplastic polyurethane.

[0028] Item 12. The processing apparatus of any one of the preceding items, wherein the electrically insulating laminate comprises the same material as the base substrate.

[0029] Item 13. The processing apparatus of any one of the preceding items further comprises a processing element protective layer covering the at least one processing element, preferably wherein the processing element protective layer comprises localized silicone droplets or polyurethane acrylate (PUA).

[0030] Item 14. The processing apparatus of Item 13, wherein the protective layer of the processing element comprises a transparent material.

[0031] Item 15. The processing apparatus of any one of the preceding items further includes a strap portion for attaching the processing apparatus to the user, wherein the strap portion is formed of the same material and / or is integral with the base substrate and / or is formed of a different material from the base substrate.

[0032] Item 16. The treatment device according to any one of the preceding items, wherein the treatment device is a face mask, sleeping bag, sports sleeve, kinesisthetic tape, or bandage and / or patch.

[0033] Item 17. The processing apparatus of any one of the preceding items, wherein the processing apparatus further comprises a fabric article to which the stretchable base substrate is mounted.

[0034] Item 18. The processing apparatus of any one of the preceding items, wherein the electrically insulating laminate comprises an outer cover formed of thermoplastic polyurethane (TPU). The outer cover may be thermally insulating.

[0035] This disclosure also provides a method for manufacturing a processing apparatus according to the following numbered items: Item 19. A method of manufacturing a treatment device for providing therapeutic and / or cosmetic treatment to a user's skin, the method comprising: providing a flexible and stretchable base substrate; directly mounting stretchable electronic circuitry onto the base substrate; mounting at least one treatment element in communication with the stretchable electronic circuitry; and applying a flexible and stretchable electrically insulating laminate over the stretchable electronic circuitry.

[0036] The method of item 20.19 further includes cutting around the processing device to remove the processing device from the excess base substrate and form the shape of the processing device.

[0037] The method of Item 21. or Item 19 or 20, wherein the base substrate is mounted on a release paper layer during manufacturing, and the method further includes removing the processing device from the release paper.

[0038] Item 22. The method of any one of Items 19 to 21, wherein mounting the stretchable electronic circuit directly onto the base substrate comprises printing the stretchable electronic circuit on the base substrate using conductive ink.

[0039] The method of any one of items 23 to 22, wherein mounting at least one processing element in communication with the stretchable electronic circuit comprises co-bonding the processing element to the stretchable electronic circuit.

[0040] A method is also provided, the method comprising: providing a face mask comprising a flexible base substrate having different chin strap portions; and thermally bonding the different chin strap portions together to form a uniform chin strap. Optionally, the face mask comprises TPU, and according to the aforementioned face mask, it may include: stretchable electronic circuitry directly mounted on the base substrate; at least one processing element in communication with the stretchable electronic circuitry; and a flexible and stretchable electrically insulating laminate covering the stretchable electronic circuitry.

[0041] Therefore, the present invention has been described so far in conjunction with a face mask or processing device containing a stretchable material. That is, the present invention can also be applied to other materials that are not necessarily stretchable in nature. Therefore, this disclosure also provides a processing device according to the following clause: Item 1. A processing device for providing therapeutic and / or cosmetic care to a user's skin, the device comprising: a flexible base substrate; electronic circuitry directly mounted on the base substrate; at least one processing element in communication with the electronic circuitry; and a flexible electrically insulating laminate covering the electronic circuitry.

[0042] Item 2. The processing apparatus of Item 1, wherein the base substrate comprises thermoplastic polyurethane, preferably wherein the thermoplastic polyurethane has a Shore A hardness of 40 to 60, an elastic modulus of 20 to 40 MPa and / or a tensile strength of 400% to 500%.

[0043] Item 3. The processing apparatus of Item 1 or 2 further includes a non-stick coating applied to the side of the processing apparatus containing the electrically insulating laminate.

[0044] Item 4. The processing apparatus of any one of the preceding items, wherein the electronic circuit comprises conductive ink, preferably wherein the conductive ink comprises a flexible polymer-chained material mixed with a liquid metal alloy, preferably wherein the liquid metal alloy comprises silver, carbon, graphite, silver chloride, gold, platinum and / or conductive traces having tortuous paths, preferably wherein the conductive ink is a stretchable conductive ink.

[0045] Item 5. The processing apparatus of any one of the preceding items, wherein the at least one processing element comprises at least one LED emitter, at least one laser, at least one ultrasound emitter, at least one heating / cooling element, at least one TENS element, at least one iontophoresis element and / or the at least one EMS emitter.

[0046] Item 6. The processing apparatus of Item 5, wherein the LED emitter emits light with a wavelength between 400 and 1100 nm.

[0047] Item 7. The processing apparatus of any one of the preceding items, wherein the at least one processing element has a diameter of less than 0.5 mm.

[0048] Item 8. The processing apparatus of any one of the preceding items, wherein the at least one processing element comprises at least six processing elements.

[0049] Item 9. The processing apparatus of Item 8, wherein the processing elements are spaced apart at a distance between 5 and 40 mm.

[0050] Item 10. The processing apparatus of any one of the preceding items, wherein the electrically insulating laminate includes at least one aperture for the at least one processing element to be located therein, and / or the electrically insulating laminate includes a material that transmits emission from the processing apparatus.

[0051] Item 11. The processing apparatus of any one of the preceding items, wherein the electrically insulating laminate comprises thermoplastic polyurethane.

[0052] Item 12. The processing apparatus of any one of the preceding items, wherein the electrically insulating laminate comprises the same material as the base substrate.

[0053] Item 13. The processing apparatus of any one of items 1 to 10, wherein the electrically insulating laminate comprises cured liquid silicone rubber.

[0054] Item 14. The processing apparatus of any one of items 1 to 10 and 13, wherein the electrically insulating laminate comprises a smooth surface.

[0055] Item 15. The processing apparatus of any one of the preceding items further comprises a processing element protective layer covering the at least one processing element, preferably wherein the processing element protective layer comprises localized silicone droplets.

[0056] Item 16. The processing apparatus of Item 15, wherein the protective layer of the processing element comprises a transparent material.

[0057] Item 17. The processing apparatus of any one of the preceding items further includes a strap portion for attaching the processing apparatus to the user, wherein the strap portion is formed of the same material and / or is integral with the base substrate and / or is formed of a different material from the base substrate.

[0058] Item 18. The treatment device of any one of the preceding items, wherein the treatment device is a face mask, sleeping bag, sports sleeve, motion bandage or bandage and / or patch.

[0059] Item 19. The processing apparatus of any one of the preceding items, wherein the processing apparatus further comprises a fabric article, the base substrate being mounted on the fabric article.

[0060] Item 20. The processing apparatus of any one of the preceding items, wherein the base substrate comprises a plurality of substrate layers.

[0061] Item 21. The processing apparatus of any one of the preceding items, wherein the base substrate comprises at least a first substrate layer, a second substrate layer and a third substrate layer, wherein the second substrate layer is disposed between the first substrate layer and the second substrate layer.

[0062] Item 22. The processing apparatus of Item 21, wherein the second substrate layer is formed of a reflective material, preferably an optically reflective material, and optionally, wherein the first substrate layer and the second substrate layer are each formed of thermoplastic polyurethane.

[0063] Item 23. The processing apparatus of any one of the preceding items, comprising a plurality of holes, preferably wherein each of the plurality of holes extends through each of the substrate, electronic circuitry and electrically insulating laminate, preferably wherein each of the plurality of holes extends from one side to the other (i.e. from the skin side to the non-skin side) through the entire processing apparatus.

[0064] The processing apparatus may be a mask and may include any features discussed in connection with the mask and / or processing apparatus described above, although the material of each layer may not necessarily be stretchable. For example, each of the base substrate, electronic circuitry, and electrically insulating laminates may be stretchable or non-stretchable. It should be understood that in the case where at least one layer is formed of a non-stretchable material, the resulting processing apparatus may be inherently non-stretchable.

[0065] The electrically insulating laminate may include an outer cover, which may be formed of TPU, preferably transparent TPU. The outer cover may be thermally insulating.

[0066] The flexible electrical insulating laminate may comprise liquid silicone rubber (LSR). The flexible electrical insulating laminate can form the skin-side surface of the treatment device. The LSR comprises a smooth surface disposed on the side facing the skin. The use of LSR is advantageous because it can be formed using injection molding techniques and allows it to flow freely over electronic circuitry and at least one treatment element to form a smooth and / or flat surface. This improves the comfort of the treatment device.

[0067] This disclosure also provides a method for manufacturing a processing apparatus according to the following numbered items: Item 24. A method of manufacturing a treatment device for providing therapeutic and / or cosmetic treatment to a user's skin, the method comprising: providing a flexible base substrate; mounting electronic circuitry onto the base substrate; mounting at least one treatment element in communication with the electronic circuitry; and applying a flexible electrically insulating laminate over the electronic circuitry.

[0068] The method of Item 25.24 further includes cutting around the processing device to remove the processing device from the excess base substrate and form the shape of the processing device.

[0069] The method of item 26. or item 24 or 25, wherein the base substrate is mounted on a release paper layer during manufacturing, and the method further includes removing the processing device from the release paper.

[0070] The method of any one of items 27, 24, and 25, wherein mounting the electronic circuit directly onto the base substrate comprises printing the electronic circuit on the base substrate using conductive ink.

[0071] The method of any one of items 28, 24 to 27, wherein mounting at least one processing element in communication with the electronic circuit comprises co-bonding the processing element to the electronic circuit.

[0072] The method of any one of items 24 to 28, wherein applying a flexible electrical insulating laminate over the electronic circuitry comprises providing liquid silicone rubber by injection molding and subsequently allowing the liquid silicone rubber to cure, preferably wherein the liquid silicone rubber cures and has a smooth surface.

[0073] The method of any one of items 30, 24 to 29, further includes the step of providing one or more holes extending through each of the base substrate, the electronic circuitry, and the electrically insulating laminate.

[0074] Embodiments according to this disclosure will now be described by way of example only, with reference to and as illustrated in the accompanying drawings. Brief description of the attached figures Figure 1 This is a schematic exploded view of the face mask disclosed herein; Figure 2 It is assembled. Figure 1 Front view of the mask; Figure 3 yes Figure 1 A side sectional view of a portion of the mask during manufacturing; Figure 4 It is based on an additional implementation method. Figure 1 A side sectional view of a portion of the mask; Figure 5 yes Figure 1 A side sectional view of a portion of the mask; Figure 6 yes Figure 1 A side sectional view of a portion of the mask; Figure 7 yes Figure 1 A side sectional view of the base substrate of the face mask; Figure 8 This is a flowchart of the method disclosed herein; Figures 9a to 9e It is the method for manufacturing face masks; and Figure 10a and Figure 10b This is a schematic diagram of another mask disclosed herein. Detailed Implementation

[0075] Figure 1 A schematic exploded view of the face mask 10 of this disclosure is shown. The face mask 10 is used to provide therapeutic and / or cosmetic treatments to a user's skin, and more specifically to the user's face. Therapeutic treatments refer to treating a disease or condition by using a healing agent or method. Cosmetic treatments refer to treatments aimed at enhancing and reshaping body structures to improve appearance. In the context of this invention, therapeutic and / or cosmetic treatments include phototherapy (performed via, for example, an LED emitter), ultrasound therapy, and / or electromuscular stimulation (EMS) treatments of the face, or any skin treatment method that can be incorporated into the face mask 10.

[0076] The face mask 10 includes a flexible and stretchable base substrate 13, stretchable electronic circuitry 15, at least one processing element 17, and a flexible and stretchable electrically insulating laminate 19.

[0077] The use of stretchable materials can provide certain advantages; however, as an alternative, one or more of the base substrate 13, electronic circuitry 15, and electrically insulating laminate 19 can be formed of any material, and are not necessarily stretchable. For example, at least the electrically insulating laminate 19 can be formed of a non-stretchable material. Furthermore, the circuitry can be formed of a non-stretchable material. It should be understood that forming at least one of the layers from a non-stretchable material would mean that the mask as a whole is inherently non-stretchable, although one or more of the layers can still be formed from a stretchable material.

[0078] Figure 2 The mask 10 is shown in its assembled state; the electrically insulating laminate 19 is omitted for clarity. During assembly, stretchable electronic circuitry 15 is mounted to the base substrate 13, and at least one processing element 17 is in communication with the stretchable electronic circuitry 15. Although Figure 2 Not shown, but the electrically insulating laminate 19 covers the stretchable electronic circuit 15.

[0079] The base substrate 13 provides a substrate on which other components of the face mask 10 can be mounted. The base substrate 13 can be made of a variety of different materials. A non-limiting list of material options includes: polyimide PI, polyester (PET), polyethylene naphtholate (PEN), thermoplastic polyurethane (TPU), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), liquid silicone rubber (LSR), PU elastomer, POE (polyolefin elastomer), and TPE (thermoplastic elastomer).

[0080] Among these materials, the preferred material for the base substrate 13 is thermoplastic polyurethane (TPU), for several reasons, including that it is a stretchable material. It is also suitable for mounting the stretchable circuit 15 thereon. The mounting process may require thermally laminating two substrate layers together, which may require the material of the base substrate 13 to have sufficient adhesive strength, i.e., sufficiently high surface energy. Surface energy is a measure of the attractive forces between the constituent molecules of a material and between molecules of other materials, and is therefore related to adhesion. Furthermore, during the curing process of the stretchable circuit 15, elevated temperatures may be required (ideally between 120-140 degrees Celsius, particularly 130 degrees Celsius). Therefore, the material may need to exhibit sufficient heat resistance, which is the case with TPU, which is capable of withstanding temperatures of approximately 140 degrees Celsius.

[0081] In particular, the TPU of the base substrate 13 can be a grade of TPU with a Shore A hardness of 40 to 60, an elastic modulus of 20-40 MPa, and / or a tensile strength of 400% to 500%. This grade of TPU can provide high transparency, a soft touch, and / or excellent biocompatibility. Overall, this provides users with a comfortable wearing experience and a good fit. If greater environmental sustainability is required, bio-based TPU can be selected.

[0082] Other materials may compromise tensile strength; or lack sufficient heat resistance, requiring longer curing times; or have low surface energy, necessitating special treatment for adhesion; and other drawbacks. Therefore, TPU is the preferred material. However, other materials can also be used, and composite materials can also provide effective performance.

[0083] Alternatively, the base substrate 13 may comprise another flexible and stretchable material, such as fabric. In particular, the base substrate 13 may advantageously comprise a material capable of mounting and / or attaching the stretchable electronic circuitry 15 thereto. Therefore, the base substrate 13 may preferably not include silicone, as some stretchable electronic circuitry 15 may not be easily mounted directly onto silicone due to its relatively low adhesion and surface energy. The base substrate 13 may be opaque, colored, or alternatively transparent. The base substrate 13 may have a thickness between 0.025 and 1.5 mm.

[0084] The base substrate 13 is stretchable and flexible, which allows the face mask 10 to conform to the user's face. "Stretchable" can mean at least as stretchable as, or more stretchable than, polyurethane and / or polyolefin elastomers. Additionally, and / or alternatively, "stretchable" can mean the material has an elastic modulus of less than 30 MPa. "Flexible" can mean at least as flexible as, or more flexible than, polyurethane and / or polyolefin elastomers. Additionally, and / or alternatively, "flexible" can mean the material has a stiffness of less than 80 Shore A.

[0085] The base substrate 13 includes a first side 31 and a second side 33. The first side 31 is the side on which the stretchable electronic circuitry 15 is mounted, and the second side 33 is the side facing away from the user during use and visible to others. In the depicted embodiment, the base substrate 13 includes apertures 35, specifically a mouth aperture and two eye apertures. The apertures 35 allow the mask 10 to be worn as a face mask because they ensure that the mask 10 does not cover the user's eyes and / or mouth. Furthermore, as depicted, the substrate 13 includes a nose portion 37 in the form of winglets. The winglets 37 ensure that the mask 10 can also apply therapeutic and / or cosmetic treatments to the user's nose, which can protrude further than other parts of the face. If a more general treatment device, rather than the mask 10, is considered for use on other parts of the user's body, the treatment device may include arrays of apertures 35 or winglets 37 that are different from those depicted.

[0086] As shown, the face mask 10, and particularly the base substrate 13, may also include attachment elements 39 for attaching the face mask 10 to a user, which may take the form of strap portions 39. In the depicted embodiment, the face mask 10 includes a face portion 41 in which eye and mouth openings 35 and nose flaps 37 are formed, and the attachment elements 39 include two strap portions extending away from the face portion 41, such that in use, the two strap portions 39 can wrap around and wrap around the user's head, extending away from the user's face / forehead, to attach the face mask 10 to the user. Preferably, the attachment elements 39 are formed of the same material and / or are integral with the base substrate 13. Alternatively, the attachment elements 39 may be formed of a different material (e.g., fabric) and attached to the base substrate 13.

[0087] The stretchable electronic circuit 15 will now be described in more detail.

[0088] The stretchable electronic circuit 15 allows power and signals to be transmitted to at least one processing element 17. The electronic circuit 15 can transmit power and signals from a power source and / or controller 51. A stretchable circuit is used instead of standard circuitry with non-flexible components because stretching or folding of the base substrate 13 would otherwise cause non-stretchable circuitry to fail. The stretchable circuit 15 is able to be stretched or folded while still functioning correctly. As depicted, the stretchable circuit 15 is mounted to a first side 31 of the base substrate 13.

[0089] The controller 51 is preferably mounted to the tape portion 39 and may include a power source (such as a battery), a printed circuit board, and one or more input sections. The power source and / or controller 51 may be mounted to the stretchable electronic circuit 15 and / or connected to the stretchable electronic circuit 15 via wires using magnetic contacts.

[0090] The stretchable electronic circuit 15 preferably comprises stretchable conductive ink. Stretchable conductive ink is typically made of a flexible polymer chain material mixed with a liquid metal alloy, which can be stretched due to the flexible nature of the polymer chain material. The stretchable conductive ink may include metal alloys, particularly alloys comprising silver, and / or alloys formed from silver paste. The conductive ink is preferably a printing ink and may have a thickness between 0.003 and 0.03 mm.

[0091] Additionally and / or alternatively, the stretchable electronic circuit 15 may include conductive traces with tortuous paths. Conductive traces with tortuous paths are stretchable because they can be extended axially without stretching the individual conductors of the conductive trace by changing the relative angles of the wires within the tortuous path of the trace.

[0092] The at least one processing element 17 will now be described in more detail.

[0093] At least one processing element 17 provides therapeutic and / or cosmetic treatment to the user's skin. At least one processing element 17 can emit treatment emission. As depicted, at least one processing element 17 is mounted to a first side 31 of a base substrate 13 such that it is in communication with a stretchable circuit 15.

[0094] At least one processing element 17 preferably includes at least one LED emitter, in which case the processing emission can be light. The at least one LED emitter can be configurable to emit light with wavelengths between 400 nm and 1100 nm. Specifically, the at least one LED emitter can be configured to emit light with combinations of wavelengths, such as 630 nm and 830 nm, 415 nm and 630 nm, 1072 nm, + / - 20 nm (each wavelength can be increased or decreased by 20 nm). Other wavelengths, such as 530 nm, 590 nm, 610 nm, 660 nm, 850 nm, and 940 nm, + / - 20 nm, can also be used. LED phototherapy can be used to provide skin benefits, including: whitening, brightening, wrinkle reduction, reducing sensitivity, improving immunity, improving the skin barrier, anti-aging, aftercare, lifting / firming, reducing acne, wound healing, pigmentation, skin rejuvenation / repair, weight loss, and / or pain management.

[0095] Alternatively and / or additionally, depending on the desired type of treatment, at least one treatment element 17 may include at least one ultrasound transmitter, a heating / cooling element (such as a Peltier element), and / or at least one EMS transmitter. In these cases, the treatment emission may include ultrasound radiation, the emission or removal of thermal energy, and / or electrical current, respectively.

[0096] At least one processing element 17 is connected to the stretchable circuit 15, such that power and signals can be transmitted from the controller 51 to at least one processing element 17. Therefore, the stretchable circuit 15 can be arranged such that it connects between the controller 51 and all processing elements 17.

[0097] At least one processing element 17 may include a width, diameter, and / or maximum size of less than 0.5 mm. Specifically, at least one processing element 17 may be a miniature LED, which is an LED with a width, diameter, and / or maximum size of less than 0.2 mm or between 0.1 and 0.2 mm. At least one processing element 17 may alternatively be a micro LED, which is an LED with a width, diameter, and / or maximum size of less than 0.1 mm or between 0.01 and 0.1 mm. Since processing elements 17 are typically inflexible, their size affects the overall flexibility of the face mask 10. Therefore, the use of at least one small-sized processing element 17 can improve the flexibility of the face mask 10.

[0098] LEDs, mini LEDs, and / or micro LEDs can have any shape, including round or square.

[0099] At least one processing element 17 may include at least six, at least eight, or at least ten processing elements. Additionally and / or alternatively, the processing elements 17 may be spaced apart at intervals between 5 mm and 40 mm, between 5 mm and 30 mm, or between 8 mm and 20 mm. These parameters ensure that the mask 10 has a sufficiently dense distribution and a sufficiently large number of processing elements 17 to ensure adequate effectiveness. However, an overly dense distribution and / or too large a number of processing elements 17 may reduce the overall flexibility of the mask 10, thereby reducing its usefulness. These parameters represent an optimal trade-off between these two considerations.

[0100] The flexible and stretchable electrical insulating laminate 19 is now described in more detail.

[0101] A flexible and stretchable electrically insulating laminate 19 provides a protective covering, allowing the face mask 10 to be worn without causing injury and / or discomfort to the user due to the stretchable circuit 15. The electrically insulating laminate 19 is applied over the stretchable circuit 15 on the side opposite the base substrate 13, preferably by thermoforming the electrically insulating laminate 19. After the stretchable circuit 15 is mounted to the base substrate 13, the electrically insulating laminate 19 can be applied as a layer to a first side 31 of the base substrate 13. The electrically insulating laminate 19 is flexible and stretchable, allowing it to deform along with the other layers of the face mask 10.

[0102] The electrically insulating laminate 19 can be formed of TPU and / or can be formed of the same material as the base substrate 13. This ensures that the electrically insulating laminate 19 has the desired material properties. Additionally, TPU is an example of an electrically insulating material and is therefore suitable as the electrically insulating laminate 19. The electrically insulating laminate 19 can have a thickness between 0.05 and 1.0 mm.

[0103] As shown, the electrically insulating laminate 19 may include at least one aperture 91 for the at least one processing element 17 located therein. This allows for the use of materials that would otherwise reduce the effectiveness of the at least one processing element 17 in the electrically insulating laminate 19. For example, in the case where the at least one processing element 17 includes at least one LED, if the electrically insulating laminate 19 does not include at least one aperture 91 for the at least one processing element 17 located therein, the electrically insulating laminate 19 containing light-blocking materials may reduce the effectiveness of the at least one processing element 17. TPU (as explained above, is a suitable material for the electrically insulating laminate 19) does not have optimal transparency and therefore, if not for the feature of at least one aperture 91, would reduce the effectiveness of the LED. Therefore, the presence of at least one aperture 91 allows for the use of materials that would otherwise reduce the effectiveness of the at least one processing element 17 in the electrically insulating laminate 19.

[0104] Figure 3 A cross-section of a portion of the face mask 10 is shown, in which the features of at least one aperture 91 are more clearly seen. It can be seen that the processing element, or each processing element 17, extends through the aperture 91 or one of the apertures 91. Therefore, the processing emission from the processing element 17 is not blocked by the electrically insulating laminate 19 and can reach the user with maximum efficiency.

[0105] If the electrically insulating laminate 19 contains a material that does not reduce the effectiveness of at least one processing element 17, at least one aperture 91 can be omitted. In other words, if the electrically insulating laminate 19 transmits the therapeutic emission of at least one processing element 17, at least one aperture 91 can be omitted. For example, if at least one processing element 17 includes an ultrasonic transmitter, and the electrically insulating laminate 19 is a good ultrasonic transmitter, at least one aperture 91 can be omitted because it does not affect the processing. Furthermore, if the electrically insulating laminate 19 is transparent and the processing emission of at least one processing element 17 is light, at least one aperture 91 can be omitted. In fact, if the electrically insulating laminate 19 contains a material that does not reduce the effectiveness of at least one processing element 17, omitting at least one aperture 91 may be beneficial for reducing design complexity.

[0106] like Figure 3As shown, the mask may also include a processing element protective layer covering at least one processing element 17 and at least one opening 91, such that at least one processing element 17 is sealed within at least one opening 91. The processing element protective layer 93 can protect at least one processing element 17 from the user's skin or other environmental influences that may damage at least one processing element 17. Preferably, the processing element protective layer 93 contains a material that does not degrade at least one processing element 17. If at least one processing element 17 includes an LED, the processing element protective layer 93 preferably contains a highly transparent material to allow for high light transmittance. Therefore, the processing element protective layer 93 may contain localized silicone droplets, as silicone is highly transparent. Alternatively, the processing element protective layer 93 may comprise polyurethane acrylate (PUA) in the form of localized PUA droplets disposed above each processing element 17. If at least one processing element 17 includes a different type of emitter, the processing element protective layer 93 may contain a material with high transmittance for that type of emission.

[0107] Although Figure 3 In some cases, the processing element protective layer 93 may protrude from the electrically insulating laminate 19, but in cases where a smooth surface is required, the processing element protective layer 93 may be flush with the electrically insulating laminate 19. In a specific example of localized silicone or PUA droplets, the size of each droplet may be designed to fill the corresponding orifice 91 such that the silicone or PUA does not extend above the top of the orifice 91.

[0108] although Figure 3 Not shown, but the electrically insulating laminate 19 may also include an outer cover, which may be configured to cover at least one treatment element 17 and the treatment element protective layer 93. Therefore, the outer cover may extend over the electrically insulating laminate 19 and be positioned on the side of the mask opposite the base substrate. Given that the outer cover may extend over at least one treatment element, the outer cover of the electrically insulating laminate 19 may be formed of TPU, preferably transparent TPU. The outer cover may be formed of a thermally insulating material, thereby insulating the wearer's skin surface from any heat that may be generated by the at least one treatment element 17.

[0109] In the above arrangement where the processing element protective layer 93 is flush with the electrical insulation layer 19, the outer cover of the electrical insulation layer may extend above the processing element protective layer 93 to provide a smooth outer surface.

[0110] The processing element protective layer 93 may contain materials unsuitable for use as the electrical insulating laminate 19. Since the processing element protective layer 93 is applied only to small localized areas, it does not significantly affect the overall flexibility of the mask 10, and therefore may be a substantially non-flexible material, or a rigid or semi-rigid material, and would not be suitable for use in a flexible electrical insulating laminate 19 that covers a larger area.

[0111] This arrangement of the orifice 91 and the processing element protective layer 93 allows the best material to be used as the electrical insulating laminate 19 (such as TPU), even if it reduces the effectiveness of at least one processing element 17, and allows the best material to be used as the processing element protective layer 93, even if it is not suitable as the electrical insulating laminate 19 (such as silicone).

[0112] Figure 3 The diagram also shows a non-stick coating 95 that the face mask 10 may contain. The non-stick coating can be referred to as a good-feel oil and is a functional coating applied to the surface of a material, typically composed of a low surface energy substance (e.g., silicone, fluoropolymers, or special organic compounds). By forming an ultra-thin film, the good-feel oil imparts a soft and smooth feel to the material while providing properties such as non-stick, stain-resistant, and abrasion-resistant properties. The non-stick coating 95 prevents the material of the face mask 10 from adhering to itself, allowing the face mask 10 to be folded when not in use. Additionally, the non-stick coating 95 provides the face mask 10 with a comfortable feel and finish, making it comfortable for the user to wear. The non-stick coating 95 preferably comprises an oil base and may be selected from the following non-limiting list: silicone-based oils, polyurethane (PU)-based oils, fluorocarbon-based oils, acrylic-based oils, nano-coating oils, UV-resistant oils, and environmentally friendly water-based oils, based on the desired material properties.

[0113] The non-stick coating 95 is preferably applied to the side of the mask 10 that includes the electrically insulating laminate 19, and may be applied to the electrically insulating laminate 19 and the processing element protective layer 93 (if present). Alternatively, the non-stick coating 95 may be applied to the second side 33 of the base substrate 13, so that the entire mask 10 is coated.

[0114] Figure 4 The additional and / or alternative structures of the mask 10 are shown. Figure 4 The face mask 10 also includes a flexible and stretchable base substrate 13; stretchable electronic circuitry (not shown) directly mounted on the base substrate; at least one processing element 17 in communication with the stretchable electronic circuitry; and a flexible and stretchable electrically insulating laminate 19 covering the stretchable electronic circuitry. Additional layers may exist between the flexible and stretchable base substrate 13, the stretchable electronic circuitry, and the flexible and stretchable electrically insulating laminate 19. The face mask 10 may also include a non-stick coating 95.

[0115] exist Figure 4 In the example, the face mask 10 includes an adhesive layer 97. A flexible and stretchable electrical insulating laminate 19 is mounted to stretchable electronic circuitry and / or a flexible and stretchable base substrate 13 via and / or using the adhesive layer 97. The adhesive layer 97 allows the electrical insulating laminate 19 to be mounted to other components of the face mask 10 using alternative and / or additional methods such as thermoforming.

[0116] The adhesive layer 97 is preferably an optically clear adhesive (OCA). OCA can be a transparent solid adhesive film commonly used for bonding transparent components (e.g., in electronic displays). OCA can include high transparency and durability, and can bond materials together without forming bubbles. OCA can be formed from a silicone or acrylic substrate. OCA can be highly transparent and can have a light transmittance greater than 90%.

[0117] Because the OCA is transparent, the flexible and stretchable base substrate 13 and the flexible and stretchable electrically insulating laminate 19 can be formed from transparent materials, making the face mask 10 transparent as a whole. The transparent face mask 10 can allow for an enhanced user experience because it can provide the user with improved peripheral vision during use.

[0118] The adhesive layer 97 preferably includes orifices 99. The orifices 99 are arranged for at least one processing element 17 located therein. Figure 4 As shown, this arrangement allows for a symmetrical sandwich structure around at least one processing element 17, wherein a flexible and stretchable base substrate 13 and a stretchable electrically insulating laminate 19 serve as continuous sheets on either side of the at least one processing element 17. Since the stretchable base substrate 13 and the stretchable electrically insulating laminate 19 are continuous sheets without openings, they can be selected to have similar and / or identical material properties. Therefore, the mask 10 can be stretched and / or flexed as a single sheet without introducing undesirable stress into the material. This, in turn, improves the durability of the mask 10.

[0119] Additionally, the thickness of the adhesive layer 97 can be equal to or similar to the thickness of at least one processing element 17. This allows the mask 10 to have a smooth, protrusion-free surface despite the presence of at least one processing element 17. This can enhance the user experience and also improve the durability of the mask 10.

[0120] Figure 5 Describing something similar to Figure 4Another arrangement of the described mask 10 includes a plurality of holes 101. Each hole 101 extends through the layers of the mask 10 such that it extends from the non-skin side of the mask to the skin side. The plurality of holes 101 may be evenly distributed across the mask 10 and are arranged to allow airflow to the skin surface when the mask 10 is in use, and thus improve the breathability of the mask 10. It should be understood that, in this context, the plurality of holes 101 is intended to refer to holes other than those necessary for accommodating the user's eyes, nose, and mouth.

[0121] Each of one or more holes 101 may be formed individually within each layer of the mask 10 and then aligned during the assembly of the mask 10. Alternatively, each of one or more holes 101 may be formed when the layers of the mask 10 have been assembled together.

[0122] Figure 6 A stack of masks 10, including an alternative arrangement of an electrically insulating layer 19, is depicted. (As shown from...) Figure 3 Understood, using the processing element protective layer 93 to provide protection to the processing element 17 can result in protrusions extending from the surface of the mask 10. These protrusions can extend from the skin side of the mask and may therefore cause an undesirable sensation on the mask surface during use.

[0123] Therefore, the electrical insulating layer 19 may comprise liquid silicone rubber (LSR), instead of the aforementioned... Figure 3 The TPU described. Specifically, the LSR can be disposed on the surface of the base substrate 13 or the electronic circuitry 15, and can include a smooth and / or flat surface on the side of the face mask 10 arranged facing the user's skin. This results in the face mask 10 being more comfortable for the user to wear due to its smooth surface, which is consistent with the above. Figure 3 The protrusions depicted in the text are different. Figure 6 All other features of the mask 10 depicted in the image can be described as above regarding... Figure 3 As described. It should be understood that LSR is typically considered a non-stretchable material, therefore when compared with the above... Figure 3 When the stretchable materials described in the mask 10 depicted are used in combination, the resulting mask may therefore not be stretchable in nature. Therefore, it should be understood that the remaining layers of mask 10 may optionally contain non-stretchable materials, or alternatively, they may still contain stretchable materials as described above. In particular, the base substrate may be formed of a non-stretchable material, and the electronic circuitry may contain non-stretchable conductive ink.

[0124] The LSR of the electrical insulating layer 19 may extend over at least one processing element, such that at least one processing element is completely enclosed within the LSR.

[0125] At least one processing element 17 can be fixed to the surface of the electronic circuit and / or the base substrate 13 using adhesive 103. Furthermore, at least one processing element 17 can be disposed within a recess (not shown) in the surface of the electronic circuit 15 and / or the base substrate 13. Using the recess combined with adhesive 103 to accommodate at least one processing element 17 reinforces the position of at least one processing element 17 and prevents any undesired movement of at least one processing element 17 within the mask 10.

[0126] LSRs can be formed using molding techniques, preferably high-pressure injection molding, and are free-flowing under gravity. Therefore, during the manufacturing process (see below regarding...) Figure 8 and 9a (Discussed in more detail up to 9e), with appropriate molds, LSR can fill the area and settle, so that it can have a flat upper surface upon curing.

[0127] exist Figure 6 In this embodiment, the processing element protective layer 93 may comprise silicone droplets as described above. Additionally, adhesive droplets may be applied to the electronic circuit 15, to which at least one processing element 17 may be mounted. The adhesive droplets may provide reinforcement and prevent movement of at least one processing element 17. The processing element protective layer 93 in the form of silicone droplets may then be applied to at least one processing element 17.

[0128] Electronic circuit 15 can be as described above regarding... Figure 3 As described. Specifically, the electronic circuit 15 preferably comprises conductive ink, which can be stretchable or non-stretchable conductive ink. The conductive ink is typically made of a flexible polymer chain material mixed with a liquid metal alloy, which can be stretched due to the flexible nature of the polymer chain material. The conductive ink may include a metal alloy, particularly an alloy comprising silver, and / or an alloy formed from silver paste. The conductive ink is preferably a printing ink and may have a thickness between 0.003 and 0.03 mm.

[0129] Face mask 10 may include the features described above. Figure 3 and / or Figure 4 The non-stick coating 95.

[0130] Figure 7 A detailed view of the base substrate 13 used in the face mask 10 is shown, which can be used with... Figure 3 , 4 Or any of the 10 mask combinations depicted in 5 are available.

[0131] The substrate 13 includes a plurality of substrate layers 13a, 13b, and 13c, which together form the substrate 13. The substrate 13 includes at least a first substrate layer 13a, a second substrate layer 13b, and a third substrate layer 13c. It should be understood that additional layers may also be provided.

[0132] In this arrangement, the second substrate layer 13b may be disposed between the first substrate layer 13a and the third substrate layer 13c. The first substrate layer 13a and the third substrate layer 13c are formed of any material such as TPU, and the second substrate layer 13b is formed of a reflective material, preferably an optically reflective material.

[0133] The reflective material in the second substrate layer 13b is arranged to reflect any emission from at least one processing element 17 toward the skin side of the mask. For example, in the case where at least one processing element 17 is a light source (specifically an LED), the optical reflective material of the base substrate 13 is configured to reflect light from at least one processing element 17 toward the skin side surface of the mask 10. Therefore, it is advantageous to use an optical reflective material within the base substrate 13 because it prevents any emission from at least one processing element from “leaking” through the base substrate 13 on the non-skin side of the mask 10, and thus leads to a more improved and effective treatment.

[0134] Alternatively and / or in addition to face masks, this disclosure can be applied to treatment devices in general, intended not only for the face but also for other parts of a user's body. For example, treatment devices may include various devices such as eye patches, acne patches, dermatitis patches, neck patches, or devices for treating any part of the body, wherein the device is used to apply treatment to a user's skin. Furthermore, treatment devices may be incorporated into other objects, such as articles including sleeping bags, exercise sleeves, kinesiology bands, or bandages and / or patches. In this application, the base substrate 13 may be mounted to the fabric surface of the article. In this case, the second side 33 of the base substrate 13 will be mounted, attached, and / or bonded to the article, and this can be achieved by thermoforming. Treatment devices may also be incorporated into medical fabric face masks as chin-only patches, rather than the entire face mask. For example, the portion of a medical fabric face mask located below the chin during use may contain the treatment device.

[0135] It should be understood that a typical processing device may include any of the features described with respect to the mask 10.

[0136] Now for reference Figure 8 A method 100 for manufacturing a face mask 10 is described, which includes a base substrate providing step 103, a circuit mounting step 105, a processing element mounting step 107, an electrical insulating layer applying step 109, an optional processing element protective layer applying step 111, and an optional cutting step 113.

[0137] In step 103, a flexible and stretchable base substrate 13 is provided. The base substrate 13 may be provided and / or mounted on the release paper layer 131 during manufacturing (e.g., Figure 3 and Figures 9a to 9e As shown in the figure. The release paper layer 131 restricts the deformation of the stretchable base substrate 13 during the manufacturing process to ensure manufacturing accuracy and also provides protection during production.

[0138] In circuit mounting step 105, the stretchable electronic circuit 15 is directly mounted onto the base substrate 13. Step 105 preferably includes printing the stretchable electronic circuit 15 onto the base substrate 13 using conductive ink. This printing may include filament printing.

[0139] At the processing element mounting step 107, at least one processing element 17 is mounted in communication with the stretchable electronic circuit 15. Preferably, at least one processing element 17 is mounted to the base substrate 13 itself and / or the circuit 15. The processing element mounting step 107 preferably includes co-bonding the processing element 17 to the stretchable electronic circuit 15. Co-bonding refers to the process of placing at least one processing element 17 (such as at least one mini-LED) directly onto the corresponding pad location on the stretchable circuit 15 before the stretchable circuit 15 is cured. Subsequently, both the stretchable circuit 15 and the processing element 17 may be heated together (e.g., at approximately 140 degrees Celsius). Once the stretchable circuit 15 is cured, it forms a reliable connection with at least one processing element 17.

[0140] Alternatively, the processing component mounting step 107 may include mounting the processing component 17 to the stretchable electronic circuit 15 using surface mounting technology (SMT) or low-temperature SMT. For this method, due to the limited temperature resistance of the thin-film substrates used to mount the components, the processing component mounting method preferably meets two key requirements: 1) a low temperature below 140 degrees Celsius; and 2) good solder strength. Therefore, co-bonding is a particularly preferred method because it meets both requirements. However, other mounting processes can also be implemented.

[0141] In the electrically insulating laminate application step 109, a flexible and stretchable electrically insulating laminate 19 is applied over the stretchable electronic circuit 15. Step 109 can be performed by hot-pressing the electrically insulating laminate application step 109 onto the base substrate 13 and / or the stretchable electronic circuit 15 to bond them together.

[0142] In practice, the electrical insulating laminate application step 109 can preferably be performed before or simultaneously with the processing element mounting step 107. This is especially possible if at least one aperture 91 of the electrical insulating laminate 19 is present. If so, the processing element mounting step 107 may include inserting at least one processing element 17 through at least one aperture 91 to mount at least one processing element 17 in communication with the stretchable electronic circuitry 15.

[0143] exist Figures 9a to 9e An alternative method for applying the electrical insulating laminate step 109 is described. Specifically, steps 103, 105, 107, 111, and 113 are as previously described. However, once the circuitry 15 (e.g., conductive ink 15) and at least one processing element 17 have been applied to the base substrate 13 and a protective cover 93 has been provided, a molding technique, preferably high-pressure injection molding, is used to provide liquid silicone rubber. The method then includes the step of curing the liquid silicone rubber to form a smooth upper surface, wherein this upper surface is arranged on the side of the face mask 10 facing the skin of use, i.e., the skin side of the face mask 10. Once the liquid silicone rubber 19 has cured, the release paper 131 can be removed. The release paper 131 is required up to this step to provide sufficient rigidity to the face mask 10 to allow for the injection of the liquid silicone rubber.

[0144] exist Figure 8 In one embodiment, the electrically insulating laminate application step 109 may include applying an adhesive layer 97 over the stretchable electronic circuit 15 and applying an electrically insulating laminate 19 on top of the adhesive layer 97. The method may include curing the adhesive layer 97 to form an adhesion between the stretchable electronic circuit 15 and / or the base substrate 13 and the electrically insulating laminate 19. The curing process may include UV light, heat, and / or pressure.

[0145] The electrical insulating laminate application step 109 may include cutting orifices 99 in the adhesive layer 97 before applying the adhesive layer 97 over the stretchable electronic circuit 15. The orifices 99 may be cut into the adhesive layer 97 based on the location of at least one processing element 17.

[0146] Method 100 may further include a process element protective layer application step 111: applying a process element protective layer 93 over at least one process element 17 and / or at least one orifice 91. This can thereby ensure that at least one process element 17 is sealed within at least one orifice 91 and protected from environmental influences, and thus protected as explained above. The process element protective layer application step 111 may include: adding localized silicone droplets or other protective materials to each of at least one process element 17 and / or at least one orifice 91, and allowing the localized protective material to dry and / or cure.

[0147] Method 100 may further include a cutting step 113, which involves forming the face mask 10 from the base substrate 13 by cutting the shape of the face mask 10 to remove it from the excess base substrate 13. This can thereby form the face mask shape, such as Figure 1 As shown. Cutting may include cutting the orifice 35 and the fin 37 simultaneously or separately. Cutting may include laser cutting.

[0148] Additionally, method 100 may also include the step of removing the mask 10 from the release paper layer 131.

[0149] Method 100 may also include the step of assembling the controller 51 to the base substrate 13. The controller 51 may be assembled, for example, via a magnetic connection.

[0150] If the face mask 10 is designed to contain other materials, the method 100 may also include the step of thermally transferring a base substrate 13 (such as a TPU base substrate 13 having stretchable electronic circuitry 15 and other components) onto a fabric.

[0151] As explained above, this disclosure is not limited to face masks, but can also be applied to more general treatment devices designed to apply treatment to other parts of the body. Therefore, method 100 can be used to manufacture both the treatment device and the face mask 10.

[0152] like Figure 10a and 10b The invention also describes another method for manufacturing the face mask 200.

[0153] The method includes providing a face mask 200 comprising a base substrate 203, which may comprise TPU. As depicted, the face mask 200 may include a face portion 241 in which eye and mouth openings 235 and nose flaps 237 are formed, and an attachment element 239 includes a strap portion extending away from the face portion 41 such that, in use, the strap portion 239 wraps around and covers the user's head, extending away from the user's face / forehead, to attach the face mask 200 to the user. Preferably, the attachment element 239 is formed of the same material and / or is integral with the base substrate 203.

[0154] In addition, the mask 200 includes different chin strap portions, namely a first chin strap portion 255a and a second chin strap portion 255b.

[0155] The method also includes thermally bonding different chin band portions 255a, 255b together to form a uniform chin band 257, such as Figure 10b As shown. The thermal bonding of different chin strap portions may include thermally pressing chin strap portions 255a and 255b together to form a uniform chin strap 257.

[0156] Preferably, the face mask 200 includes the same features as the face mask 10 described above, such that the description of the face mask 10 also applies to the face mask 200. Therefore, the face mask 200 may include stretchable electronic circuitry directly mounted to a base liner; at least one processing element in communication with the stretchable electronic circuitry; and / or a flexible and stretchable electrically insulating laminate covering the stretchable electronic circuitry.

Claims

1. A face mask for providing therapeutic and / or cosmetic treatment to a user's face, the face mask comprising: Flexible and stretchable base substrate; Stretchable electronic circuitry directly mounted onto the base substrate; At least one processing element connected to the stretchable electronic circuit; as well as A flexible and stretchable electrically insulating laminate covering the stretchable electronic circuit.

2. The face mask according to claim 1, wherein the base substrate comprises thermoplastic polyurethane, preferably wherein the thermoplastic polyurethane has a Shore A hardness of 40 to 60, an elastic modulus of 20 to 40 MPa, and / or a tensile strength of 400% to 500%.

3. The face mask according to claim 1 or 2, further comprising a non-stick coating applied to the side of the face mask containing the electrically insulating laminate.

4. The face mask according to any one of the preceding claims, wherein the stretchable electronic circuit comprises stretchable conductive ink, preferably wherein the stretchable conductive ink comprises a flexible polymer chain material mixed with a liquid metal alloy, preferably wherein the liquid metal alloy comprises silver, carbon, graphite, silver chloride, gold, platinum and / or conductive traces having tortuous paths.

5. The face mask according to any one of the preceding claims, wherein the at least one processing element comprises at least one LED emitter, at least one laser, at least one ultrasound emitter, at least one heating / cooling element, at least one TENS element, at least one iontophoresis element and / or the at least one EMS emitter.

6. The face mask according to claim 5, wherein the LED emitter emits light with a wavelength between 400 and 1100 nm.

7. The face mask according to any one of the preceding claims, wherein the at least one processing element has a diameter of less than 0.5 mm.

8. The face mask according to any one of the preceding claims, wherein the at least one processing element comprises at least six processing elements.

9. The face mask of claim 8, wherein the processing elements are spaced apart at a distance between 5 and 30 mm.

10. The face mask according to any one of the preceding claims, wherein the electrically insulating laminate includes at least one aperture for the at least one processing element to be located therein, and / or the electrically insulating laminate includes a material that transmits emission from the at least one processing element.

11. The face mask according to any one of the preceding claims, wherein the electrically insulating laminate and the flexible and stretchable base substrate comprise a transparent material.

12. The face mask according to any one of the preceding claims, wherein the electrically insulating laminate is mounted to the stretchable electronic circuitry and / or the flexible and stretchable base substrate via an adhesive layer, the adhesive layer optionally comprising a layer of optically clarifying adhesive.

13. The face mask of claim 12, wherein the adhesive layer includes at least one aperture for the at least one processing element to be located therein.

14. The face mask according to any one of the preceding claims, wherein the electrically insulating laminate comprises thermoplastic polyurethane.

15. The face mask according to any one of the preceding claims, wherein the electrically insulating laminate comprises the same material as the base substrate.

16. The face mask according to any one of claims 1 to 13, wherein the electrically insulating laminate comprises cured liquid silicone rubber (LSR).

17. The face mask of claim 16, wherein the electrically insulating laminate comprises a smooth surface.

18. The face mask according to any one of the preceding claims further comprises a processing element protective layer covering the at least one processing element, preferably wherein the processing element protective layer comprises localized silicone droplets or polyurethane acrylate.

19. The face mask of claim 18, wherein the protective layer of the processing element comprises a transparent material.

20. The face mask according to any one of the preceding claims further includes a strap portion for attaching the face mask to the user, wherein the strap portion is formed of the same material and / or is integral with the base substrate.

21. The face mask according to any one of the preceding claims, wherein the face mask further comprises a fabric article to which the stretchable base substrate is mounted.

22. The face mask according to any one of the preceding claims, wherein the base substrate comprises a plurality of substrate layers, including at least one layer formed of an optically reflective material.

23. The face mask according to any one of the preceding claims, comprising one or more holes extending through each of the base substrate, electronic circuitry, and electrically insulating laminate.

24. The face mask according to any of the preceding claims, wherein the electrically insulating laminate comprises an outer cover formed of thermoplastic polyurethane (TPU).

25. A method of manufacturing a face mask for providing therapeutic and / or cosmetic treatment to a user's face, the method comprising: Provides a flexible and stretchable base substrate; Stretchable electronic circuits are directly mounted onto the base substrate; At least one processing element is installed in communication with the stretchable electronic circuit; as well as A flexible and stretchable electrical insulating laminate is applied over the stretchable electronic circuit.

26. The method of claim 25, further comprising cutting around the mask to remove the mask from excess base substrate and form the shape of the mask.

27. The method of claim 25 or 26, wherein the base substrate is mounted on a release paper layer during manufacturing, and the method further comprises removing the mask from the release paper.

28. The method according to any one of claims 25 to 27, wherein mounting the stretchable electronic circuit directly onto the base substrate comprises printing the stretchable electronic circuit on the base substrate using conductive ink.

29. The method according to any one of claims 25 to 28, wherein mounting at least one processing element in communication with the stretchable electronic circuit comprises co-bonding the processing element to the stretchable electronic circuit.

30. A face mask for providing therapeutic and / or cosmetic care to a user's face, the face mask comprising: Flexible base substrate; Electronic circuits mounted on the base substrate; At least one processing element connected to the electronic circuit; and A flexible electrically insulating laminate covering the stretchable electronic circuit.

31. The face mask of claim 30, wherein the electrically insulating laminate comprises cured liquid silicone rubber having a smooth surface.