A cycle film removing device and a cycle film removing method

Abstract

This invention relates to the field of tantalum capacitor manufacturing technology, and discloses a circulating film removal device and method. The device includes: a frame with a forward film removal position and a back film removal position; a conveying assembly mounted on the frame for driving tantalum wires from the forward film removal position to the back film removal position; a first galvanometer assembly; a second galvanometer assembly, the laser beam cleaning areas of the first and second galvanometer assemblies jointly covering the circumferential surface of the tantalum wire; and a transfer mechanism mounted on the frame, the transfer mechanism including a transfer line, with a transfer assembly disposed on one side of the transfer line. The method includes the following steps: the tantalum wire is sequentially conveyed to the conveying assembly via the transfer line and the transfer assembly; the tantalum wire undergoes laser film removal via the first and second galvanometer assemblies respectively; the tantalum wires on the conveying assembly are conveyed to the transfer line by the transfer assembly. This invention, through the cooperation of the first and second galvanometer assemblies, effectively removes the formation film on the surface of the tantalum wire, thereby improving the welding quality of the tantalum wire.

Description

Technical Field

[0001] This invention belongs to the field of tantalum capacitor manufacturing technology, specifically relating to a circulating film removal device and a circulating film removal method. Background Technology

[0002] Tantalum capacitors, with their high specific capacitance, low equivalent series resistance, and excellent frequency characteristics, have become core passive components in modern high-frequency circuits and power management modules, and their application demand in fields such as communications, energy, and industrial control continues to grow. Before tantalum capacitors are cut and soldered to lead frames or PCBs, the formation film on the surface of the tantalum wires must be thoroughly removed to ensure the subsequent soldering quality.

[0003] Currently, tantalum wires are mainly treated by laser film removal equipment to remove the chemically formed film on their surface. The laser film removal equipment includes a 2D galvanometer system. The 2D galvanometer system emits a laser beam, which is reflected by the 2D galvanometer and focused onto the surface of the tantalum wire. The 2D galvanometer is deflected to scan the spot trajectory in order to remove the film from the surface of the tantalum wire.

[0004] However, in actual production, incoming products typically consist of multiple tantalum capacitors arranged on the same steel strip by tantalum wires, which are round. The 2D galvanometer system has a fixed focal length and a small working field of view, making it difficult to cover and clean all areas of the tantalum wire surface while the steel strip remains stationary. In particular, there are always blind spots on the sides of the tantalum wire, resulting in residual deposition film. When subsequent tantalum capacitors are cut and the sides of the tantalum wire need to be welded, the residual deposition film severely degrades the welding quality, leading to a decrease in the yield of the tantalum capacitors. Summary of the Invention

[0005] To address the shortcomings of the prior art, the present invention provides a cyclic film removal device and a cyclic film removal method. The first galvanometer assembly and the second galvanometer assembly can achieve full-coverage laser film removal of the circumferential surface of the tantalum wire, and the chemically deposited film on the surface of the tantalum wire is fully removed to ensure the welding quality of the tantalum capacitor.

[0006] The technical effects to be achieved by this invention are realized through the following technical aspects: This invention provides a circulating film removal device, comprising: a frame, which is provided with a front film removal position and a back film removal position; A conveying assembly is mounted on the frame, and the conveying assembly drives tantalum wires to be conveyed from the positive defilm removal position to the back defilm removal position; The first galvanometer assembly is mounted on the frame and is used for laser cleaning of the tantalum wire at the positive defilm removal position; A second galvanometer assembly, mounted on the frame, is used for laser cleaning of the tantalum wire at the back-removal film location. The laser beam cleaning areas of the first and second galvanometer assemblies together cover the circumferential surface of the tantalum wire. A transfer mechanism is provided on the frame. The transfer mechanism includes a transfer line for loading or unloading the tantalum wire, and a transfer component is provided on one side of the transfer line for transferring the tantalum wire between the transfer line and the conveying assembly.

[0007] In some implementations, the tantalum wire is in a first orientation when it is in the positive decoction position and in a second orientation when it is in the negative decoction position. The conveying assembly drives the tantalum wire from the positive decoction position to the negative decoction position, and causes the tantalum wire to flip from the first orientation to the second orientation during conveying.

[0008] In some implementations, the tantalum wire includes a front side and a back side disposed opposite to each other, and a first side side and a second side side connecting the front side and the back side; the first galvanometer assembly includes a front galvanometer and a first side galvanometer, the front galvanometer laser cleaning the front side, and the first side galvanometer laser cleaning the first side side.

[0009] In some implementations, the second galvanometer assembly includes a back galvanometer and a second side galvanometer, wherein the back galvanometer laser cleans the back side and the second side galvanometer laser cleans the second side.

[0010] In some implementations, the conveying assembly includes a ring conveyor line that carries and drives the tantalum wire sequentially through the positive decoction position and the back decoction position, so that the tantalum wire is flipped from the first orientation to the second orientation during conveying.

[0011] In some implementations, the conveying assembly includes a clamp for holding the steel bar, and the annular conveyor line is drivenly connected to the clamp.

[0012] In some implementations, the transfer assembly includes an opening clamping structure for opening or closing the clamp, and a top-feeding structure is provided on one side of the opening clamping structure to convey the tantalum wire between the transfer line and the clamp.

[0013] In some implementations, the frame is provided with multiple positioning points, and both the first galvanometer assembly and the second galvanometer assembly include a vision structure. The vision structure acquires an image of the tantalum wire at the positioning point and positions the tantalum wire.

[0014] In some implementations, a transfer station is provided on the frame, the transfer assembly is located at the transfer station, and the transfer line includes: a feeding assembly for conveying the tantalum wire to the transfer station for feeding the tantalum wire; and an unloading assembly for driving the tantalum wire away from the transfer station to unload the tantalum wire.

[0015] Secondly, the present invention provides a cyclic film removal method, which uses the above-mentioned cyclic film removal device to laser clean the tantalum wire, and the cyclic film removal method includes the following steps: The tantalum wire is sequentially conveyed to the conveying assembly via the transfer line and the transfer assembly; The conveying assembly delivers the tantalum wire to the positive defilm removal position; The tantalum wire undergoes laser removal of the coating via the first galvanometer assembly; The conveying assembly delivers the tantalum wire to the back-removal membrane position; The tantalum wire undergoes laser removal of the coating via the second galvanometer assembly; After laser film removal, the tantalum wire on the conveying assembly is transferred to the transfer line by the transfer assembly.

[0016] In summary, the present invention has at least the following advantages: 1. The circulating film removal device provided by this invention, during the laser film removal process, firstly, a transfer assembly feeds tantalum wires from the transfer line to a conveying assembly. The conveying assembly then sequentially conveys the tantalum wires to the forward film removal position and the reverse film removal position. When the tantalum wire is conveyed to the forward film removal position, a first galvanometer assembly performs laser cleaning on the tantalum wire at the forward film removal position; when the tantalum wire is conveyed to the reverse film removal position, a second galvanometer assembly performs laser cleaning on the tantalum wire at the reverse film removal position, thus achieving laser film removal on all areas of the circumferential surface of the tantalum wire. After the tantalum wire completes laser film removal, the transfer assembly unloads the tantalum wire onto the transfer line.

[0017] Compared to traditional laser film removal equipment, the laser beam cleaning areas of the first and second galvanometer assemblies jointly cover the circumferential surface of the tantalum wire. This solves the problem of blind spots and residual deposits on the tantalum wire caused by the fixed focal length and small working field of view in 2D galvanometer systems, which degrades welding quality. The complete circumferential surface coverage of the tantalum wire eliminates dead angles during film removal, improving the thoroughness of film removal and thus enhancing subsequent welding quality and the production yield of tantalum capacitors.

[0018] 2. The cyclic film removal method provided by this invention performs stepwise laser film removal on the tantalum wire using a first galvanometer assembly and a second galvanometer assembly, ensuring that all areas of the circumferential surface of the tantalum wire are adequately scanned and cleaned by laser. This overcomes the process defect where the sides are difficult to cover by the laser beam due to the limited working field of view of the 2D galvanometer, achieving thorough removal of the film formed on the circumferential surface of the tantalum wire area by area. Simultaneously, the automated connection between the transfer assembly and the conveying assembly eliminates the need for manual intervention throughout the entire process of feeding, film removal, and unloading, improving the production cycle and automation level of tantalum wire film removal. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a circulating membrane removal device according to a specific embodiment of the present invention.

[0020] Figure 2 This is a side view of the first and second galvanometer assemblies according to a specific embodiment of the present invention.

[0021] Figure 3 This is a partial structural schematic diagram of the tantalum wire, steel bar, and tantalum capacitor according to a specific embodiment of the present invention.

[0022] Figure 4 This is a schematic diagram of the structure of the conveying component, the transfer component, and the transfer line according to a specific embodiment of the present invention.

[0023] Figure 5 This is a partial structural diagram of the transfer component according to a specific embodiment of the present invention.

[0024] Figure 6 This is a partial structural diagram of the transfer line and top material structure in a specific embodiment of the present invention.

[0025] Figure 7 This is a partial structural diagram of the transport component according to a specific embodiment of the present invention.

[0026] Marked in the image: 1. Frame; 11. Front decoction position; 12. Back decoction position; 13. First positioning point; 14. Second positioning point; 15. Transfer position; 2. First galvanometer assembly; 21. Frontal galvanometer; 22. First side galvanometer; 23. Visual structure; 3. Second galvanometer assembly; 31. Rear galvanometer; 32. Second side galvanometer; 4. Conveying assembly; 41. Circular conveyor line; 42. Fixture; 421. Conveyor seat; 422. Anchor block; 423. Guide wheel; 5. Transfer assembly; 51. Clamping structure; 511. Push rod; 512. Clamping drive component; 52. Material lifting structure; 521. Material lifting clamp; 522. Lifting drive component; 6. Transfer line; 61. Feeding assembly; 611. Base; 612. Feeding drive; 613. Lifting seat; 614. Lifting drive; 615. Clamping plate; 616. Clamping drive; 62. Unloading assembly; 63. Slide rail; 631. Positioning assembly; 632. Feeding point; 633. Unloading point; 7. Handling assembly; 71. Handling seat; 72. Suspension column; 73. First drive component; 74. Second drive component; 75. Material frame trolley; 8. Tantalum wire; 81. Steel bar; 82. Tantalum capacitor; 9. Material frame; 91. Fixing strip; 92. Hanging hole. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are some, but not all, of the embodiments of the present invention.

[0028] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0029] Example 1: Please see Figures 1-3 The circulating film removal device of the present invention includes a frame 1, on which a front film removal position 11 and a back film removal position 12 are provided. A first galvanometer assembly 2 is provided on the frame 1, which is used for laser cleaning of the tantalum wire 8 at the front film removal position 11. A second galvanometer assembly 3 is provided on the frame 1, which is used for laser cleaning of the tantalum wire 8 at the back film removal position 12. The laser beam cleaning areas of the first galvanometer assembly 2 and the second galvanometer assembly 3 together cover the circumferential surface of the tantalum wire 8.

[0030] In a preferred embodiment, the tantalum wire 8 is in a first orientation when it is in the positive decoction position 11, and in a second orientation when it is in the negative decoction position 12. The first galvanometer assembly 2 is used to perform laser decoction on the tantalum wire 8 at the positive decoction position 11 when the tantalum wire 8 is in the first orientation, and the second galvanometer assembly 3 is used to perform laser decoction on the tantalum wire 8 at the negative decoction position 12 when the tantalum wire 8 is in the second orientation.

[0031] During laser film removal, tantalum capacitors 82 are fixed to steel bars 81 by tantalum wires 8. Multiple tantalum wires 8 and tantalum capacitors 82 are arranged on the steel bars 81. Specifically, each tantalum wire 8 includes a front and a back side facing each other, and a first and a second side side connecting the front and back sides. The first and second side sides are arc-shaped surfaces. When the tantalum wire 8 is in a first orientation, its front and first side sides face the first galvanometer assembly 2, so that the laser beam emitted by the first galvanometer assembly 2 can scan the front and first side sides of the tantalum wire 8. When the tantalum wire 8 is in a second orientation, its back and second side sides face the second galvanometer assembly 3, so that the laser beam emitted by the second galvanometer assembly 3 can scan the back and second side sides of the tantalum wire 8. The laser beam cleaning areas of the first and second galvanometer assemblies 2 and 3 together cover the circumferential surface of the tantalum wire 8.

[0032] It is understood that in this specification, the front, back, first side, and second side of the tantalum wire 8 are only used to distinguish different areas of the tantalum wire 8 on its circumferential surface, in order to facilitate the description of film removal operations at different workstations or in different orientations. The above terms do not constitute an absolute spatial limitation on the tantalum wire 8. Those skilled in the art should understand that when performing cyclic film removal, interchange the front and back sides, or interchange the first side and second side, without departing from the protection scope of this invention.

[0033] The frame 1 is equipped with a conveying assembly 4. The conveying assembly 4 drives the tantalum wire 8 from the positive decoction position 11 to the back decoction position 12, and causes the tantalum wire 8 to flip from the first orientation to the second orientation during the conveying. The conveying assembly 4, the first galvanometer assembly 2 and the second galvanometer assembly 3 work together to achieve full coverage decoction treatment of the circumferential surface of the tantalum wire 8.

[0034] Please combine Figure 4 A transfer mechanism is provided on the frame 1. Specifically, the transfer mechanism is located at the bottom of the conveying assembly 4. The transfer mechanism includes a transfer line 6 for loading or unloading tantalum wire 8. A transfer component 5 for transferring tantalum wire 8 between the transfer line 6 and the conveying assembly 4 is provided on the side of the transfer line 6 near the conveying assembly 4.

[0035] When the tantalum wire 8 is laser removed, the transfer line 6 conveys the tantalum wire 8 to be removed to the transfer component 5. The tantalum wire 8 is loaded onto the conveying component 4 through the transfer component 5. The conveying component 4 first drives the tantalum wire 8 to the positive removal position 11. The tantalum wire 8 is in the first orientation. The first galvanometer component 2 emits a laser beam and cleans the chemically formed film on the front and first side of the tantalum wire 8.

[0036] Subsequently, the conveying assembly 4 transports the tantalum wire 8 to the back film removal position 12. The tantalum wire 8 flips from the first orientation to the second orientation, and the second galvanometer assembly 3 emits a laser beam to clean the formation film on the back and second sides of the tantalum wire 8. The tantalum wire 8 completes laser cleaning of its entire circumferential surface through the first galvanometer assembly 2 and the second galvanometer assembly 3. Specifically, the first galvanometer assembly 2 and the second galvanometer assembly 3 perform a specific length of wire-sweeping film removal on the tantalum wire 8. The distance A between the starting position of the tantalum wire 8 and the tantalum capacitor 82 is ≥0.2mm, and the sweeping length W is controlled between 0.8mm and 1.2mm.

[0037] After the tantalum wire 8 completes laser film removal, the transfer component 5 transfers the tantalum wire 8 from the conveying component 4 to the transfer line 6, and the transfer line 6 unloads the tantalum wire 8.

[0038] Compared with traditional laser film removal equipment, the circulating film removal device of the present invention can solve the problem of residual film on the side of tantalum wire 8 due to the existence of laser blind zone. It is beneficial to improve the film removal efficiency of tantalum wire 8 while reducing the residual film, thereby ensuring the subsequent welding quality of tantalum wire 8.

[0039] Example 2: The difference between this embodiment and Embodiment 1 is that this embodiment further optimizes the structure of the first galvanometer assembly 2 and the second galvanometer assembly 3 of the present invention. Please refer to [link to previous embodiment]. Figure 2 and Figure 3 .

[0040] The first galvanometer assembly 2 in this embodiment includes a front galvanometer 21 and a first side galvanometer 22. The front galvanometer 21 laser cleans the front side of the tantalum wire 8, while the first side galvanometer 22 emits an inclined laser beam to laser clean the first side of the tantalum wire 8. Specifically, the front galvanometer 21 can be disposed above the conveying assembly 4 and emits a laser beam vertically. The first side galvanometer 22 is disposed at an inclination relative to the front galvanometer 21 and emits a laser beam at an inclination to scan the first side of the tantalum wire 8.

[0041] The second galvanometer assembly 3 includes a back galvanometer 31 and a second side galvanometer 32. The back galvanometer 31 laser cleans the back side of the tantalum wire 8, while the second side galvanometer 32 laser cleans the second side of the tantalum wire 8. Specifically, the back galvanometer 31 can be disposed above the conveying assembly 4 and parallel to the front galvanometer 21. The back galvanometer 31 emits a laser beam vertically to scan the bottom tantalum wire 8, while the second side galvanometer 32 is tilted relative to the back galvanometer 31. The second side galvanometer 32 emits an tilted laser beam to scan the second side of the tantalum wire 8.

[0042] In some specific embodiments, the front galvanometer 21, the first side galvanometer 22, the back galvanometer 31, and the second side galvanometer 32 can all be 3D galvanometers. The 3D galvanometer can scan multiple tantalum wires 8 on the steel strip 81 sequentially through dynamic focusing while the steel strip 81 is stationary, thereby improving the film removal efficiency of the tantalum wires 8.

[0043] The frame 1 is provided with multiple positioning points. Specifically, in this embodiment, there are two positioning points: the first positioning point 13 and the second positioning point 14. When the conveying component 4 conveys the tantalum wire 8, the tantalum wire 8 passes through the first positioning point 13, the positive decoction position 11, the second positioning point 14, and the negative decoction position 12 in sequence. Both the first galvanometer assembly 2 and the second galvanometer assembly 3 include a vision structure 23, which is located at the first positioning point 13 and the second positioning point 14. The vision structure 23 acquires images of the tantalum wire 8 to achieve positioning of the tantalum wire 8 and ensure the consistency of the laser wire scanning height.

[0044] The vision structure 23 includes a positioning camera. During the laser film removal process, the conveying assembly 4 first conveys the tantalum wire 8 to the first positioning point 13. The positioning camera collects deviation data of the tantalum wire 8 at the first positioning point 13 and transmits the deviation data to the PLC system. When the conveying assembly 4 conveys the tantalum wire 8 to the positive film removal position 11, the front galvanometer 21 and the first side galvanometer 22 adjust the spot trajectory according to the deviation data to complete the laser film removal of the front and first side of the tantalum wire 8. Similarly, the conveying assembly 4 then conveys the tantalum wire 8 to the second positioning point 14. The positioning camera captures an image of the tantalum wire 8 to collect deviation data. When the conveying assembly 4 conveys the tantalum wire 8 to the back film removal position 12, the back galvanometer 31 and the second side galvanometer 32 adjust the spot trajectory to complete the laser film removal of the back and second sides of the tantalum wire 8.

[0045] Laser cleaning using the first galvanometer assembly 2 and the second galvanometer assembly 3 can improve the film removal accuracy of the tantalum wire 8 and ensure full coverage laser film removal across the entire circumferential surface of the tantalum wire 8.

[0046] Example 3: The difference between this embodiment and the previous embodiment is that this embodiment further optimizes the structure of the conveying component 4 and the transfer component 5 of the present invention. Please refer to [link to previous embodiment]. Figures 4-6 .

[0047] In this embodiment, the conveying assembly 4 includes a ring conveyor line 41. The ring conveyor line 41 carries and drives the tantalum wire 8 to pass sequentially through a first positioning point 13, a positive film removal position 11, a second positioning point 14, and a negative film removal position 12 along a ring path. During the conveying process, the tantalum wire 8 flips from a first orientation to a second orientation. Specifically, the ring conveyor line 41 can be an elliptical conveying path. The positive film removal position 11 and the negative film removal position 12 are respectively located at the ends of the long axis of the ring conveyor line 41 to ensure that the laser film removal of the first galvanometer assembly 2 and the second galvanometer assembly 3 is unobstructed. Specifically, the ring conveyor line 41 is a magnetically levitated conveyor line to improve the conveying efficiency of the tantalum wire 8.

[0048] In some specific embodiments, the annular conveyor line 41 is drivenly connected to a clamp 42 for holding the steel bar 81. Multiple clamps 42 can be provided, and multiple clamps 42 can achieve continuous laser removal of the tantalum wire 8 to further improve the efficiency of laser removal. Specifically, the clamp 42 includes a conveyor seat 421 and a clamping block 422 for cooperating in holding the steel bar 81. The conveyor seat 421 is drivenly connected to the annular conveyor line 41. An elastic element is provided between the conveyor seat 421 and the clamping block 422. The elastic element is preferably, but not limited to, a spring. Under the action of elastic force, the elastic element drives the clamping block 422 to abut against the conveyor seat 421, so that the clamping block 422 and the conveyor seat 421 cooperate to clamp the steel bar 81, thus fixing the tantalum wire 8.

[0049] In a preferred embodiment, the frame 1 is provided with a transfer position 15 for loading or unloading tantalum wire 8. Specifically, the transfer position 15 is located below the positive decoction position 11 and the back decoction position 12. Specifically, the transfer component 5 is located at the transfer position 15. The transfer component 5 loads the tantalum wire 8 onto the clamp 42 or removes the tantalum wire 8 from the clamp 42.

[0050] Before laser film removal, the fixture 42 is in the intermediate position 15. The intermediate line 6 conveys the tantalum wire 8 to be removed to the intermediate assembly 5. The intermediate assembly 5 loads the tantalum wire 8 onto the fixture 42. Specifically, the intermediate assembly 5 inserts a steel bar 81 between the abutment block and the conveyor seat 421. The abutment block and the conveyor seat 421 clamp the steel bar 81, thus loading the tantalum wire 8. The circular conveyor line 41 then drives the fixture 42 to move to the first positioning point 13. The vision structure 23 performs visual positioning of the tantalum wire 8 at the first positioning point 13. The circular conveyor line 41 then conveys the fixture 42 to the positive film removal position 11. At this time, the tantalum wire 8 is in the first orientation, and the first galvanometer assembly 2 can perform laser film removal on the front and first side of the tantalum wire 8.

[0051] Subsequently, the circular conveyor line 41 conveys the fixture 42 to the second positioning point 14. The vision structure 23 performs visual positioning of the tantalum wire 8 at the second positioning point 14. The circular conveyor line 41 then conveys the fixture 42 to the back film removal position 12. The tantalum wire 8 is flipped to the second orientation. The second galvanometer assembly 3 can perform laser film removal on the back and second side of the tantalum wire 8.

[0052] In a preferred embodiment, the transfer assembly 5 includes an opening clamping structure 51 for opening the clamp 42. Specifically, the opening clamping structure 51 includes a push rod 511, which is connected to an opening clamping drive 512. The opening clamping drive 512 is preferably, but not limited to, a cylinder. The opening clamping drive 512 drives the push rod 511 to insert between the conveyor seat 421 and the abutment block, which can separate the conveyor seat 421 and the abutment block, and the clamp 42 opens. When the opening clamping drive 512 drives the push rod 511 to pull out from between the conveyor seat 421 and the abutment block, the abutment block is reset under the elastic force of the elastic member, and the abutment block and the conveyor seat 421 abut against each other, and the clamp 42 closes, so that the clamp 42 clamps the steel bar 81 when closed, or releases the steel bar 81 when the clamp 42 opens. Furthermore, the push rod 511 is provided with a guide surface, and both the conveying seat 421 and the abutment block are provided with guide wheels 423. The push rod 511 is pushed into the space between the two guide wheels 423 via the guide surface. The guide surface and the guide wheels 423 work together to provide a certain guiding effect, which can improve the smoothness of the movement of the push rod 511 during the operation of opening or closing the clamp 42.

[0053] In some specific embodiments, the transfer component 5 also includes a top clamp 521. Specifically, there are two top clamps 521, which are used for loading and unloading tantalum wire 8 respectively. The top clamps 521 can be located at the bottom of the clamp 42. The top clamps 521 are connected to a lifting drive 522. The lifting drive 522 is preferably, but not limited to, a cylinder. The piston rod end of the cylinder is connected to the top clamp 521. When the piston rod end of the cylinder extends, it can drive the top clamp 521 to rise and approach the clamp 42. When the piston rod end of the cylinder retracts, it can drive the top clamp 521 to fall back to its original position and move away from the clamp 42.

[0054] Specifically, during the feeding of tantalum wire 8, the top clamp 521 first clamps the steel strip 81. The clamping structure 51 opens the clamp 42, and the lifting drive 522 drives the top clamp 521 to rise and approach the clamp 42. The top clamp 521 can insert the steel strip 81 between the conveyor seat 421 and the abutment block. The clamping structure 51 then closes the clamp 42, which clamps and fixes the steel strip 81. The circular conveyor line 41 conveys the clamp 42, and the tantalum wire 8 undergoes laser film removal. After the tantalum wire 8 completes laser film removal, the circular conveyor line 41 conveys the clamp 42 back to the transfer position 15. The clamping structure 51 opens the clamp 42 again, and the steel strip 81 clamped by the clamp 42 falls onto the top clamp 521. The lifting drive 522 drives the top clamp 521 to descend, and the tantalum wire 8 completes the unloading operation. The transfer component 5 realizes automatic feeding and unloading of tantalum wire 8, which helps to improve the film removal efficiency of tantalum wire 8.

[0055] Example 4: The difference between this embodiment and the above embodiments is that this embodiment makes further structural optimizations to the transfer mechanism of the present invention. Please refer to [link to relevant documentation]. Figures 4-6 .

[0056] In this embodiment, the transfer line 6 includes a feeding component 61 and an unloading component 62. The feeding component 61 conveys tantalum wire 8 to the transfer position 15 and above. The top clamp 521 then transfers the tantalum wire 8 to the clamp 42 at the transfer position 15. The transfer component 5 and the feeding component 61 cooperate to feed the tantalum wire 8. The unloading component 62 drives the tantalum wire 8 away from the transfer position 15 to unload the tantalum wire 8. After the tantalum wire 8 is laser-removed, the ring conveyor line 41 conveys the clamp 42 to the transfer position 15. The clamping structure 51 opens the clamp 42, and the steel bar 81 held by the clamp 42 falls onto the top clamp 521. The top clamp 521 conveys the steel bar 81 to the unloading component 62, and the unloading component 62 can unload the tantalum wire 8.

[0057] In a preferred embodiment, the material frame 9 serves as a carrier for transferring tantalum capacitors 82 and tantalum wires 8. The material frame 9 is equipped with fixing bars 91, which have multiple slots. Steel bars 81 are inserted into these slots, thus securing the tantalum capacitors 82 and tantalum wires 8 to the material frame 9. The transfer mechanism includes a slide rail 63 for conveying the material frame 9. The slide rail 63 is located at the bottom of the transfer assembly 5. The feeding assembly 61 and the unloading assembly 62 are both located inside the slide rail 63. During the loading and unloading operations of the tantalum wires 8, the material frame 9 slides along the slide rail 63 to enter or leave the transfer position 15.

[0058] In some specific embodiments, the feeding assembly 61 includes a base 611, and the base 611 is connected to a feeding drive 612. The feeding drive 612 preferably, but not limited to, adopts a linear module. The feeding drive 612 drives the base 611 to enter the transfer position 15. The base 611 conveys the material frame 9 to the transfer position 15, and the tantalum wire 8 can be fed through the transfer assembly 5.

[0059] A lifting seat 613 is provided on the base 611. The lifting seat 613 moves up and down relative to the base 611. The lifting seat 613 is driven by a lifting drive component 614, which can be a cylinder. A clamping plate 615 is slidably provided on the lifting seat 613. The clamping plate 615 and the lifting seat 613 cooperate to clamp the material frame 9. The clamping plate 615 is driven by a clamping drive component 616, which can be a cylinder. When the material frame 9 is placed on the slide rail 63, the lifting drive 614 drives the lifting seat 613 and the clamping plate 615 to rise, and the clamping drive 616 drives the clamping plate 615 to move closer to the lifting seat 613. The clamping plate 615 and the lifting seat 613 can cooperate to clamp the edge of the material frame 9. When the feeding drive 612 drives the base 611 to enter the intermediate position 15, the lifting seat 613 and the clamping plate 615 pull the material frame 9 to move along the slide rail 63 until the tantalum wire 8 to be defilmed moves to the top clamp 521. When the top clamp 521 pushes the tantalum wire 8 onto the clamp 42, the tantalum wire 8 completes the feeding process.

[0060] In a preferred embodiment, the structure of the unloading component 62 can be the same as that of the feeding component 61. After all the tantalum wires 8 in the material frame 9 are fed onto the circular conveyor line 41 by the top clamp 521, the unloading component 62 can be handed over to the feeding component 61. That is, the feeding component 61 releases the material frame 9 and returns to its original position, while the unloading component 62 rises and clamps the material frame 9. After the tantalum wires 8 that have completed laser film removal are transferred to the material frame 9 by the top clamp 521, the unloading component 62 drives the material frame 9 to leave the transfer position 15 to realize the unloading of the tantalum wires 8.

[0061] The automated loading and unloading of tantalum wire 8 through the feeding assembly 61 and the unloading assembly 62 is beneficial to improving the film removal efficiency of tantalum wire 8.

[0062] Example 5: The difference between this embodiment and the above embodiments is that, please refer to [link / reference needed]. Figure 1 , Figure 4 and Figure 7 In this embodiment, the slide rail 63 is provided with a feeding point 632 and a discharging point 633. The material frame 9 is fed onto the slide rail 63 at the feeding point 632 and removed from the slide rail 63 at the discharging point 633. The slide rail 63 is provided with positioning components 631 at both the feeding point 632 and the discharging point 633. The positioning components 631 clamp and fix the material frame 9 to restrict the material frame 9 from sliding freely along the slide rail 63. Specifically, the positioning component 631 includes a positioning plate, which is drivenly connected to a positioning cylinder. When the positioning cylinder drives the positioning plate to abut against the material frame 9, the positioning plate presses the material frame 9 against the slide rail 63 to restrict the movement of the material frame 9. When the positioning component 631 releases the material frame 9, the feeding component 61 or the discharging component 62 can drive the material frame 9 to move along the slide rail 63.

[0063] In a preferred embodiment, the slide rail 63 is equipped with a conveying component 7 for transporting the material frame 9 at both the feeding point 632 and the unloading point 633. At the feeding point 632, the conveying component 7 can transport the material frame 9 onto the slide rail 63, and at the unloading point 633, the conveying component 7 can move the material frame 9 away from the slide rail 63. A material frame trolley 75 is provided on one side of the conveying component 7. The material frames 9 fully loaded with steel bars 81 are stacked on the material frames 9, and the material frame trolley 75 transfers the material frames 9.

[0064] In some specific embodiments, the conveying assembly 7 includes a conveying seat 71, on which a suspension column 72 is slidably disposed. A hanging hole 92 is provided on the material frame 9. A suspension drive is tractively connected to the suspension column 72. When the suspension drive drives the suspension column 72 to extend, the suspension column 72 passes through the hanging hole 92, and the material frame 9 is suspended from the suspension column 72 onto the conveying seat 71. Preferably, but not limited to, the suspension drive is a cylinder. Conversely, when the suspension drive drives the suspension column 72 to retract, the material frame 9 can be released.

[0065] The transport seat 71 is connected to a first driving member 73, which drives the transport seat 71 to move up and down. A second driving member 74 is provided on one side of the first driving member 73, which drives the first driving member 73 and the transport seat 71 to move horizontally. After the transport seat 71 suspends the material frame 9 through the suspension column 72, the material frame 9 can be transported from the material frame trolley 75 to the slide rail 63 through the cooperation of the first driving member 73 and the second driving member 74, thus loading the material frame 9. Similarly, the transport assembly 7 at the unloading point 633 can move the material frame 9 away from the slide rail 63 and stack it on the material frame trolley 75.

[0066] Example 6: This embodiment, based on the above embodiments, provides a cyclic film removal method. This method uses the aforementioned cyclic film removal device to remove the film from the tantalum wire 8. Please refer to [link to previous embodiment]. Figure 2 , Figure 3 and Figure 4 The cyclic membrane removal method of the present invention includes the following steps: The tantalum wire 8 is sequentially conveyed to the conveying assembly 4 via the transfer line 6 and the transfer component 5. Specifically, the feeding assembly 61 conveys the material frame 9 to the transfer position 15. After the clamping structure 51 opens the clamp 42, the top material structure 52 lifts the tantalum wire 8 onto the clamp 42, and the clamp 42 holds the tantalum wire 8. The conveying component 4 conveys the tantalum wire 8 to the first positioning point 13, and the vision structure 23 captures an image of the tantalum wire 8 to position the tantalum wire 8. The conveying assembly 4 then conveys the tantalum wire 8 to the positive film removal position 11; The tantalum wire 8 undergoes laser removal via the first galvanometer assembly 2, wherein the front galvanometer 21 laser cleans the front side of the tantalum wire 8, and the first side galvanometer 22 laser cleans the first side of the tantalum wire 8. The conveying assembly 4 conveys the tantalum wire 8 to the second positioning point 14, and the vision structure 23 captures an image of the tantalum wire 8 to reposition the tantalum wire 8. Conveying assembly 4 conveys tantalum wire 8 to the back-removal membrane position 12; The tantalum wire 8 undergoes laser film removal via the second galvanometer assembly 3, wherein the back galvanometer 31 laser cleans the back side of the tantalum wire 8, and the second side galvanometer 32 laser cleans the second side of the tantalum wire 8. After laser film removal, the conveying component 4 conveys the tantalum wire 8 to the transfer position 15. The clamping structure 51 opens the clamp 42, and the top material structure 52 receives the tantalum wire 8 and transfers it to the transfer line 6. Specifically, the top material structure 52 transfers the tantalum wire 8 to the unloading component 62, and the unloading component 62 unloads the tantalum wire 8.

[0067] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0068] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0069] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0070] In this invention, unless otherwise expressly specified and limited, "above or below" a first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" the first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0071] Although the description of the invention has been given in conjunction with the specific embodiments described above, it will be apparent to those skilled in the art that many substitutions, modifications, and variations can be made based on the foregoing. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.

Claims

1. A circulating membrane removal device, characterized in that, include: The frame (1) is provided with a front defilm removal position (11) and a back defilm removal position (12). A conveying assembly (4) is provided on the frame (1). The conveying assembly (4) drives the tantalum wire (8) to be conveyed from the positive decoction position (11) to the back decoction position (12). The first galvanometer assembly (2) is mounted on the frame (1) and is used for laser cleaning of the tantalum wire (8) at the positive decoction position (11). The second galvanometer assembly (3) is mounted on the frame (1) and is used for laser cleaning of the tantalum wire (8) at the back removal film position (12). The laser beam cleaning areas of the first galvanometer assembly (2) and the second galvanometer assembly (3) together cover the circumferential surface of the tantalum wire (8). as well as A transfer mechanism is provided on the frame (1). The transfer mechanism includes a transfer line (6) for loading or unloading the tantalum wire (8). A transfer component (5) is provided on one side of the transfer line (6) for transferring the tantalum wire (8) between the transfer line (6) and the conveying component (4).

2. The circulating membrane removal device according to claim 1, characterized in that, When the tantalum wire (8) is in the positive decoction position (11), it is in the first orientation; when the tantalum wire (8) is in the back decoction position (12), it is in the second orientation. The conveying assembly (4) drives the tantalum wire (8) to be conveyed from the positive decoction position (11) to the back decoction position (12), and causes the tantalum wire (8) to be flipped from the first orientation to the second orientation during the conveying.

3. The circulating membrane removal device according to claim 2, characterized in that, The tantalum wire (8) includes a front side and a back side disposed opposite to each other, and a first side side and a second side side connecting the front side and the back side; The first galvanometer assembly (2) includes a front galvanometer (21) and a first side galvanometer (22). The front galvanometer (21) laser-cleans the front side, and the first side galvanometer (22) laser-cleans the first side.

4. The circulating membrane removal device according to claim 2, characterized in that, The second galvanometer assembly (3) includes a back galvanometer (31) and a second side galvanometer (32). The back galvanometer (31) laser-cleans the back side, and the second side galvanometer (32) laser-cleans the second side.

5. The circulating membrane removal device according to claim 2, characterized in that, The conveying assembly (4) includes an annular conveying line (41) that carries and drives the tantalum wire (8) through the positive decoction position (11) and the back decoction position (12) in sequence, so that the tantalum wire (8) is flipped from the first orientation to the second orientation during conveying.

6. The circulating membrane removal device according to claim 5, characterized in that, The conveying assembly (4) includes a clamp (42) for holding the steel bar (81), and the annular conveyor line (41) is connected to the clamp (42) in a driving connection.

7. The circulating membrane removal device according to claim 6, characterized in that, The transfer assembly (5) includes an opening clamping structure (51) for opening or closing the clamp (42), and a top material structure (52) is provided on one side of the opening clamping structure (51). The top material structure (52) transmits the tantalum wire (8) between the transfer line (6) and the clamp (42).

8. The circulating membrane removal device according to claim 1, characterized in that, The frame (1) is provided with multiple positioning points. The first galvanometer assembly (2) and the second galvanometer assembly (3) both include a vision structure (23). The vision structure (23) acquires an image of the tantalum wire (8) at the positioning point and positions the tantalum wire (8).

9. The circulating membrane removal device according to claim 1, characterized in that, A transfer station (15) is provided on the frame (1), the transfer assembly (5) is located at the transfer station (15), and the transfer line (6) includes: The feeding assembly (61) conveys the tantalum wire (8) to the intermediate transfer position (15) to feed the tantalum wire (8); and The unloading assembly (62) drives the tantalum wire (8) away from the intermediate position (15) to unload the tantalum wire (8).

10. A cyclic membrane removal method, characterized in that, The tantalum wire (8) is laser-cleaned using the circulating film removal device according to any one of claims 1-9. The circulating film removal method includes the following steps: The tantalum wire (8) is sequentially conveyed to the conveying assembly (4) via the transfer line (6) and the transfer assembly (5); The conveying assembly (4) conveys the tantalum wire (8) to the positive defilm removal position (11). The tantalum wire (8) undergoes laser removal via the first galvanometer assembly (2); The conveying assembly (4) conveys the tantalum wire (8) to the back removal film position (12). The tantalum wire (8) undergoes laser removal via the second galvanometer assembly (3); After laser film removal, the tantalum wire (8) on the conveying assembly (4) is transferred to the transfer line (6) by the transfer assembly (5).

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