Sensor cleaning device

Abstract

The present application relates to a sensor cleaning device. The sensor cleaning device includes a housing, a piezoelectric element located within the housing and configured to vibrate, and a cover coupled to the housing and connected to the piezoelectric element. The sensor cleaning device can include at least two piezoelectric elements connected to the cover and configured to vibrate, and a controller configured to apply an alternating voltage of different frequencies to the at least two piezoelectric elements, respectively.

Description

Technical Field

[0001] This application relates to a sensor cleaning device. Background Technology

[0002] Sensors are configured to sense the physical state of the surrounding environment or a target. To maintain stable sensor performance, devices or systems including sensors may include sensor cleaning devices. For example, a vehicle may include sensors configured to assist a driver or enable autonomous driving. The vehicle may also include sensor cleaning devices for the sensors.

[0003] Sensor cleaning devices can clean sensors by using mechanical methods such as squeegees, spraying cleaning fluid or compressed fluid, or applying rotation or vibration to the sensor. Summary of the Invention

[0004] This application aims to solve the aforementioned problems related to related technologies.

[0005] This application aims to provide a sensor cleaning device that includes a simplified and miniaturized structure and is capable of providing effective cleaning performance.

[0006] This application aims to provide a sensor cleaning device that can offer advantages in terms of cost or design layout.

[0007] This application is not limited to the aspects described above. Other aspects not mentioned will become clearer to those skilled in the art through the following description.

[0008] The technical concept disclosed in order to achieve the above aspects of this application and perform the following features of this application is characterized as follows.

[0009] According to various aspects of this application, a sensor cleaning device may include a housing, a piezoelectric element, and a cover, wherein the piezoelectric element is located within the housing and configured to vibrate; the cover is inserted into the housing and connected to the piezoelectric element.

[0010] According to various aspects of this application, a vehicle may include a sensor cleaning device. The sensor cleaning device may include a housing, a piezoelectric element, and a cover, the piezoelectric element being located within the housing and configured to vibrate; the cover is inserted into the housing and connected to the piezoelectric element.

[0011] According to various aspects of this application, a sensor cleaning device may include a cover, at least two piezoelectric elements, and a controller, wherein the at least two piezoelectric elements are connected to the cover and configured to vibrate; and the controller is configured to apply alternating voltages of different frequencies to each piezoelectric element.

[0012] According to this application, a sensor cleaning device can be provided. The sensor cleaning device may include a simplified and miniaturized structure and is capable of providing effective cleaning performance.

[0013] According to this application, a sensor cleaning device can be provided that offers advantages in terms of cost or design layout.

[0014] The sensor cleaning device of this application has effects not limited to those described above. Other effects not mentioned will be more clearly understood by those skilled in the art through the following description.

[0015] Other aspects and various implementations of this application will be discussed below.

[0016] It should be understood that the terms "vehicle" or "of vehicles" or other similar terms used herein generally include motor vehicles. Such motor vehicles can encompass passenger cars (including SUVs, buses, trucks, and various commercial vehicles), watercraft (including various boats and vessels), aircraft, etc. Such motor vehicles can also include hybrid vehicles, electric vehicles, plug-in hybrid electric vehicles, hydrogen fuel cell vehicles, and other alternative fuel vehicles (e.g., fuels derived from resources other than petroleum). As described herein, a hybrid vehicle is a vehicle with two or more power sources, such as a vehicle that combines gasoline and electric power.

[0017] The above-mentioned features and other features of this application will be discussed below. Attached Figure Description

[0018] The above and other features of this application are described in detail with reference to certain embodiments shown in the accompanying drawings. The drawings are given by way of example only and are not intended to limit the application.

[0019] Figure 1 A conceptual diagram of a sensor cleaning device according to an embodiment of this application is shown;

[0020] Figure 2 A perspective view of a sensor cleaning device according to an embodiment of this application is shown;

[0021] Figure 3 To show Figure 2 An exploded perspective view of the sensor cleaning device;

[0022] Figure 4 For along Figure 2 A cross-sectional view of the sensor cleaning device taken by line AA in the diagram;

[0023] Figure 5 A sensor cleaning apparatus with the first housing removed, according to an embodiment of this application, is shown;

[0024] Figure 6 It shows Figure 5 The sensor cleaning device that removes piezoelectric elements and gaskets;

[0025] Figure 7 The image shows the engagement state of the cover removed from the sensor cleaning device according to an embodiment of this application with the piezoelectric element;

[0026] Figures 8 to 11 The diagram shows a partial waveform of vibration generated in the piezoelectric element of the sensor cleaning device according to an embodiment of this application (in chronological order); and

[0027] Figure 12 A graph showing the acceleration based on the position on the cover caused by vibration generated in the sensor cleaning device according to an embodiment of this application is shown.

[0028] It should be understood that the accompanying drawings are not necessarily drawn to scale and show slightly simplified depictions of various features illustrating the basic principles of this application. The specific design features of this application disclosed herein (including, for example, specific dimensions, orientations, positions, and shapes) will be determined in part by the specific target application and the environment in which it is used.

[0029] In the accompanying drawings, the same reference numerals throughout the multiple drawings refer to the same or equivalent parts of this application. Detailed Implementation

[0030] The specific structural or functional descriptions presented in the embodiments shown and described herein are merely for illustrative purposes of illustrating embodiments according to the concepts of this application. Embodiments according to the concepts of this application can be implemented in various forms. Furthermore, this application should not be construed as being limited to the embodiments described in the specification. It should be understood that embodiments of this application include all modifications, equivalents, or alternatives encompassed within the spirit and scope of this application.

[0031] In this application, terms such as "first" and / or "second" may be used to describe various components, but the component is not limited by these terms. For example, the above terms are used only for the purpose of distinguishing one component from another and do not depart from the scope of this application based on the disclosed technical concept. A first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component.

[0032] When a component is described as "connected" or "joined" to another component, it should be understood that this component can be directly connected or joined to the other component, or that other components may be placed between them. On the other hand, when a component is described as "directly connected" or "directly joined" to another component, it should be understood that no other components are placed between them. Other terms describing the relationship between components, such as "between" and "directly between," or "adjacent to" and "directly adjacent to," should be interpreted in the same way.

[0033] The same reference numerals throughout the specification refer to the same components. The terminology used in the specification is for describing embodiments and is not intended to limit the application. In the specification, unless otherwise specified, the singular form includes the plural form. As used herein, terms such as “comprising” and / or “including” mean that the described components, steps, operations, and / or elements do not exclude the possibility of adding one or more other components, steps, operations, and / or elements. This also applies to other similar terms such as “having,” “comprising,” and variations thereof.

[0034] The technical concepts and embodiments of this application are described in detail below with reference to the accompanying drawings. When components, devices, units, modules, controllers, sensors, elements, etc., of this application are described as having a purpose or performing an operation or function, such component, device, unit, module, controller, sensor, or element should be considered as "configured" to satisfy that purpose or perform that operation or function. This application describes a controller for a sensor cleaning device. The controller or other such components may be implemented separately or may include a processor and memory (e.g., non-transitory computer-readable medium) as part of the controller or component.

[0035] like Figure 1 As shown, the sensor cleaning device 100 is configured to perform cleaning of the sensor 10. In one embodiment, the sensor cleaning device 100 can clean the sensor 10 by vibration. For example, the sensor cleaning device 100 can clean the sensor 10 by utilizing vibrations induced by ultrasonic waves. The sensor cleaning device 100 may include a piezoelectric element 110 and clean the sensor 10 by vibrations generated by the piezoelectric element 110. The piezoelectric element 110 can generate vibrations by applying an alternating current (AC) voltage. For example, a controller 120 operatively connected to the piezoelectric element 110 can be configured to apply an AC voltage to the piezoelectric element 110 and can adjust the applied AC voltage.

[0036] In one embodiment, the sensor cleaning device 100 may be configured to communicate with the sensor 10. For example, the sensor cleaning device 100 may perform cleaning of the sensor 10 based on determining that the sensor 10 is dirty. For example, whether the sensor 10 is dirty can be detected by known methods. Based on determining that the sensor 10 is dirty, the controller 120 may generate vibration in the piezoelectric element 110. In another embodiment, the sensor cleaning device 100 may clean the sensor 10 independently of communication with or from the sensor 10. For example, the sensor cleaning device 100 may automatically perform cleaning of the sensor 10 based on preset conditions. In some examples, the preset conditions may be a preset time. The controller 120 may be configured to apply an AC voltage to the piezoelectric element 110 at the preset time. In some examples, the preset conditions may be a request to activate the operation of the sensor cleaning device 100. Based on the input of the request to activate the operation of the sensor cleaning device 100, the controller 120 may apply an AC voltage to the piezoelectric element 110 to perform cleaning of the sensor 10. A request to activate the sensor cleaning device 100 can be generated using an operation button (which is used to turn the sensor cleaning device 100 on or off).

[0037] The piezoelectric element 110 is configured to generate vibration. For example, the piezoelectric element 110 can generate vibration by the application of an alternating voltage. Based on the application of an alternating voltage to the piezoelectric element 110 by the controller 120, the piezoelectric element 110 can convert the applied electrical energy into mechanical energy and vibrate. Therefore, the sensing area 12 of the sensor 10 (see...) Figure 4 Foreign objects present on the surface can be removed by the vibration of the piezoelectric element 110.

[0038] In one embodiment, the piezoelectric element 110 may include piezoelectric ceramic. As a non-limiting example, the piezoelectric element 110 may include lead zirconate titanate (PZT), barium titanate, or lead titanate.

[0039] This document does not intend to limit the type of sensor 10 that can be cleaned by the sensor cleaning device 100. In one embodiment, the sensor 10 may be a sensor configured to sense the presence of a target or the surrounding environment. As a non-limiting example, the sensor 10 may include a lidar (LiDAR) sensor, a radar sensor, or a camera. In one embodiment, the sensor (e.g., a LiDAR sensor, radar sensor, or camera) may be mounted on a vehicle.

[0040] See Figures 2 to 4In one embodiment, the sensor cleaning device 100 may include a housing 130. The housing 130 may include a bracket 132 that enables the housing 130 to be mounted onto a target structure. The bracket 132 may be provided with a mating hole 132a. Fasteners (e.g., bolts) may be inserted through the mating hole 132a to engage the bracket 132 with the target structure to which the housing 130 is to be mounted, thereby engaging the housing 130 with the target structure to secure the housing 130 to the target structure.

[0041] The housing 130 can accommodate the sensor 10 to enable cleaning of any type of sensor 10. The sensor 10 can be located within the housing 130 and can be removed from the housing 130. In one embodiment, the housing 130 may include a space 134. The sensor 10 can be disposed within the space 134. The sensor 10 can be located within the space 134 and can be removed from the housing 130.

[0042] Sensor 10 may be protected by sensor cleaning device 100. In one embodiment, sensor cleaning device 100 may include a cover 140. Cover 140 may be configured to cover sensor 10 located within space 134. Cover 140 may prevent foreign objects from the external environment from adhering to sensor 10. Furthermore, cover 140 may be configured to allow vibration to be applied to cover 140 by piezoelectric element 110. In one embodiment, cover 140 may be configured to be in direct contact with piezoelectric element 110.

[0043] In one embodiment, the cover 140 may include a body 142 and a flange 144. The flange 144 may be configured to extend from an edge of the body 142. In one embodiment, the body 142 may have a dome shape, and the flange 144 may extend radially outward from the body 142. The cover 140 with the flange 144 may also include a support function in addition to protecting the sensor 10.

[0044] The cover 140 can be supported by the housing 130. In one embodiment, the housing 130 may include a first housing 130a and a second housing 130b, which are separable from each other. A gap 136 may be formed between the upper portion of the first housing 130a and the second housing 130b (see...). Figure 4 The cover 140 can be supported within the gap 136 by the upper part of the housing 130. In one embodiment, the flange 144 can be inserted into the gap 136 so that the cover 140 can be supported by the housing 130.

[0045] In one embodiment, the cover 140 may be secured relative to the housing 130 within the gap 136. For example, the thickness of the flange 144 may correspond to the thickness of the gap 136. Mounting the cover 140 to the housing 130 can be achieved by filling the gap 136 with the flange 144.

[0046] The sensor cleaning device 100 may include a sealing element 150. In one embodiment, the cover 140 may be secured to the housing 130 by the sealing element 150, or the cover 130 may be secured to the housing 130 by the sealing element 150 disposed within the gap 136. Accordingly, the thickness of the flange 144 may be less than the thickness of the gap 136. Furthermore, the sealing element 150 is configured to seal the gap 136, i.e., to form a seal within the gap 136. According to one embodiment, the sealing element 150 may include a first sealing member 152 and a second sealing member 154. The first sealing member 152 may be located between the first housing 130a and the cover 140. The second sealing member 154 may be located between the cover 140 and the second housing 130b. Specifically, the first sealing member 152 may be located between the first housing 130a and a first surface of the flange 144, and the second sealing member 154 may be located between the second housing 130b and a second surface of the flange 144. Accordingly, gap 136 can be sealed by sealing element 150 and cover 140 to prevent foreign matter from being introduced into housing 130 through gap 136. In some embodiments, sealing element 150 can be integrally formed with cover 140 or flange 144 of cover 140. In some embodiments, sealing element 150 can be formed separately from cover 140.

[0047] Furthermore, the sealing element 150 may include a third sealing element 156. The third sealing element 156 may be located between the housing 130 and the sensor 10. For example, the third sealing element 156 may be located between the second housing 130b and the sensor 10. The third sealing element 156 can prevent foreign objects from being introduced into the sensor 10. Thus, the sensor cleaning device 100 may include a sealing element 150 comprising multiple sealing elements or various sealing elements, such as the first sealing element 152, the second sealing element 154, and the third sealing element 156 described above, to prevent foreign objects from being introduced into the sensor cleaning device 100 and to effectively protect the sensor 10.

[0048] The piezoelectric element 110 can be disposed within the housing 130. For example, the piezoelectric element 110 can be supported by the cover 140 and the housing 130. Furthermore, refer to... Figures 5 to 7The piezoelectric element 110 can be interference-fitted to the housing 140. The housing 140 may include a structure for receiving the piezoelectric element 110 via the interference fit. In one embodiment, the housing 140 may include a plurality of legs 146. The legs 146 are configured to extend vertically downward, i.e., upright or vertically extending from the flange 144. The piezoelectric element 110 may be adapted to the legs 146. In one embodiment, the legs 146 may form a recess 148 into which the piezoelectric element 110 can be inserted. Furthermore, the piezoelectric element 110 may engage with a second housing 130b. The second housing 130b may form a recess 137. The piezoelectric element 110 may be engaged with the recess 137 of the second housing 130b via a gasket 160. As a non-limiting example, the gasket 160 may be an adhesive foam or a sheet with adhesive properties. In one embodiment, the second housing 130b may be provided with a protrusion 139 configured to support the side of the piezoelectric element 110. This allows for the application of an adapter structure to the engagement of the piezoelectric element 110 with the cover 140 and the housing 130, thereby providing structural stability and excellent vibration transmission.

[0049] In one embodiment, the piezoelectric element 110 may include multiple elements, each of which may have a plate shape. Each piezoelectric element 110 may be oriented in the same direction (Y-axis direction) as the sensing area 12 of the sensor 10 faces. The piezoelectric element 110 may be configured to vibrate along the Y-axis direction and may transmit the vibration to the cover 140. Accordingly, the cover 140 may vibrate along the Y-axis direction in response to the applied frequency band, thereby removing contaminants from the body 142 corresponding to the sensing area 12 of the sensor 10. In other words, the piezoelectric element 110 may be oriented substantially perpendicular to the X-axis direction or longitudinal direction of the cover 140. Vibration of the piezoelectric element 110 in the Y-axis direction or longitudinal direction may cause the cover 140 to vibrate along the Y-axis direction.

[0050] In one embodiment, the sensor cleaning device 100 may include at least two piezoelectric elements 110. The piezoelectric elements 110 may be positioned opposite each other at opposite ends or sides of the housing 140. The AC voltage applied to each piezoelectric element 110 can be independently controlled. In one embodiment, the piezoelectric elements 110 may operate at different frequencies and phases. Therefore, the generated heat and the presence of dead zones can be minimized, and foreign matter adhering to the housing 140 can be effectively removed.

[0051] The controller 120 is configured to control the AC voltage applied to each piezoelectric element 110. In other words, the frequency or phase of the AC voltage applied to each piezoelectric element 110 can be adjusted. In one embodiment, the piezoelectric elements 110 may be configured to vibrate at different frequencies and have a phase difference with each other.

[0052] The vibration generated by the piezoelectric element 110 can form a standing wave in the housing 140. Such a standing wave includes nodes and antinodes, and the vibration does not propagate at the nodes. Therefore, this application allows two piezoelectric elements 110 to vibrate at different frequencies with a phase difference, thereby minimizing the node region that becomes a dead zone and amplifying the vibration intensity. In this document, a dead zone refers to a region where the Y-axis value remains fixed at zero.

[0053] refer to Figures 8 to 11 According to an embodiment of this application, controller 120 can be configured to apply an AC voltage of a first frequency (e.g., 40 kHz to 50 kHz) to a first piezoelectric element in piezoelectric element 110 and an AC voltage of a second frequency (e.g., 140 kHz to 160 kHz) to a second piezoelectric element in piezoelectric element 110. A first standing wave can be generated in housing 140 by the first frequency and, for example, can form a single dead zone except for the endpoints. Furthermore, a second standing wave can be generated in housing 140 by the second frequency and, for example, can form six dead zones except for the endpoints. According to this application, it can be confirmed that the two standing waves can be combined to drive an output waveform that does not include dead zones (i.e., the output waveform does not include dead zones except for the endpoints). In the illustrated embodiment, the amplitude of the vibration reaches a maximum of approximately 2.28 micrometers (μm), confirming an amplitude increase of approximately 14% compared to the case where only the first frequency is used for driving.

[0054] In addition, such as Figure 12 As shown, a graph of acceleration based on position on shroud 140 is illustrated, with acceleration occurring throughout the entire area of ​​shroud 140, which can more effectively remove contaminants. In other words, this application may include two piezoelectric elements 110 located at opposite ends of the sensing region 12 of sensor 10, and a blind-zone-free waveform can be generated by finely tuning the frequency and phase difference applied to the piezoelectric elements 110.

[0055] According to an embodiment of this application, the sensor cleaning device can be configured to clean environmental sensors, such as LiDAR sensors, radar sensors, or cameras installed in a vehicle.

[0056] This application may provide a sensor cleaning device that includes a simplified and miniaturized structure compared to cleaning devices based on fluid jet methods.

[0057] According to an embodiment of this application, the sensor cleaning device can be used as a cleaning device for rear parking cameras of vehicles, etc. Based on its use as a cleaning device for such individual cameras, the sensor cleaning device offers advantages, particularly in terms of cost and design layout.

[0058] This application is not limited to the above-described embodiments and figures. It will be apparent to those skilled in the art that various substitutions, modifications, and alterations can be made without departing from the spirit of this application.

Claims

1. A sensor cleaning device, comprising: case; A piezoelectric element, located within the housing and configured to vibrate; as well as The cover is attached to the housing and connected to the piezoelectric element.

2. The sensor cleaning device according to claim 1, wherein, The housing includes a gap, and the cover is accommodated within the gap.

3. The sensor cleaning device according to claim 2, wherein, The housing includes a first housing and a second housing, the gap being defined between the first housing and the second housing, and the flange of the cover being clamped between the first housing and the second housing within the gap.

4. The sensor cleaning apparatus of claim 2, further comprising a sealing element configured to form a seal between the housing and the cover at the gap.

5. The sensor cleaning device according to claim 1, wherein, The housing includes a space in which a sensor is housed, and the sensing area of ​​the sensor is configured to be adjacent to the housing.

6. The sensor cleaning apparatus of claim 5, further comprising a sealing element located between the sensor and the housing.

7. The sensor cleaning device according to claim 1, wherein, The cover includes legs, and the piezoelectric element is attached to the legs.

8. The sensor cleaning device according to claim 7, wherein, The leg is provided with a groove, and the piezoelectric element is adapted to the groove.

9. The sensor cleaning device according to claim 1, wherein, The piezoelectric element is attached to a recessed portion formed in the housing via a gasket.

10. The sensor cleaning device according to claim 1, wherein, The housing includes a plurality of protrusions configured to support the piezoelectric element.

11. The sensor cleaning device according to claim 1, wherein: The piezoelectric element includes at least two piezoelectric elements; The piezoelectric element is configured to receive AC voltages of different frequencies.

12. The sensor cleaning device according to claim 11, wherein, The AC voltages applied to the at least two piezoelectric elements have a phase difference.

13. The sensor cleaning apparatus according to claim 11, wherein, The frequency of the AC voltage applied to the first piezoelectric element of the at least two piezoelectric elements is greater than the frequency of the AC voltage applied to the second piezoelectric element of the at least two piezoelectric elements.

14. A vehicle comprising a sensor cleaning device, wherein the sensor cleaning device includes: case; A piezoelectric element, located within the housing and configured to vibrate; as well as The cover is attached to the housing and connected to the piezoelectric element.

15. The vehicle according to claim 14, wherein, The sensor cleaning device is configured and arranged as a lidar sensor, radar sensor, or camera installed in the cleaning vehicle.

16. A sensor cleaning device, comprising: cover; At least two piezoelectric elements are connected to the cover and configured to vibrate; as well as A controller configured to apply AC voltages of different frequencies to the at least two piezoelectric elements.

17. The sensor cleaning apparatus according to claim 16, wherein, The AC voltages applied to the at least two piezoelectric elements have a phase difference.

18. The sensor cleaning apparatus according to claim 16, wherein, The frequency of the first AC voltage applied to the first piezoelectric element of the at least two piezoelectric elements is greater than the frequency of the second AC voltage applied to the second piezoelectric element of the at least two piezoelectric elements.

19. The sensor cleaning apparatus according to claim 16, wherein, Each of the at least two piezoelectric elements is plate-shaped.

20. The sensor cleaning apparatus according to claim 16, wherein, The at least two piezoelectric elements are respectively connected to opposite ends of the cover.

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