A method of peeling a DLC film

Abstract

The application discloses a peeling method of a DLC film, which comprises the following steps: irradiating a DLC film to be peeled by using a laser beam; adjusting the energy density and pulse width of the laser beam to selectively peel the DLC film to be peeled; and removing the peeled DLC film by using a mechanical or chemical method. The technical scheme of the application can completely peel the DLC film from a substrate without damaging the substrate, and can quickly and efficiently peel the DLC film.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a method for peeling off DLC films. Background Technology

[0002] Diamond-like carbon (DLC) films are widely used in various fields due to their high hardness, low coefficient of friction, and good chemical inertness. However, in some cases, it is necessary to peel the DLC film off the substrate, such as when the DLC film is damaged or needs to be replaced. However, traditional DLC film peeling methods suffer from drawbacks such as incomplete peeling, substrate damage, and low efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide a method for peeling DLC ​​film, which can completely peel the DLC film from the substrate without damaging the substrate, and can also achieve rapid and efficient peeling of DLC film.

[0004] To achieve the above objectives, embodiments of the present invention provide a method for peeling off a DLC film, comprising:

[0005] The DLC film to be peeled off is irradiated with a laser beam;

[0006] The energy density and pulse width of the laser beam are adjusted to selectively peel off the DLC film to be peeled off;

[0007] Remove the peeled DLC film using mechanical or chemical methods.

[0008] Furthermore, the wavelength of the laser beam is 1064 nm.

[0009] Furthermore, the energy density of the laser beam is 1–10 J / cm². 2 .

[0010] Furthermore, the pulse width of the laser beam is 10 to 100 ns.

[0011] Furthermore, the area of ​​the DLC film to be peeled is 100 cm². 2 The peeling time is less than 1 minute.

[0012] Compared with existing technologies, this invention provides a method for peeling off DLC films. First, a laser beam is used to irradiate the DLC film to be peeled off. Then, the energy density and pulse width of the laser beam are adjusted to selectively peel off the DLC film. Finally, mechanical or chemical methods are used to remove the peeled DLC film. This invention, by using a laser peeling method to peel off DLC films, can completely peel the DLC film from the substrate without damaging the substrate, and can also achieve rapid and efficient peeling of the DLC film. Attached Figure Description

[0013] Figure 1 This is a flowchart of a preferred embodiment of a DLC film peeling method provided by the present invention. Detailed Implementation

[0014] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0015] This invention provides a method for peeling off a DLC film, see [link to relevant documentation]. Figure 1 The diagram shown is a flowchart of a preferred embodiment of a DLC film peeling method provided by the present invention, the method comprising steps S11 to S13:

[0016] Step S11: Irradiate the DLC film to be peeled off using a laser beam;

[0017] Step S12: Adjust the energy density and pulse width of the laser beam to selectively peel off the DLC film to be peeled off;

[0018] Step S13: Remove the peeled DLC film using mechanical or chemical methods.

[0019] In practice, firstly, a laser beam is used to irradiate the DLC film to be peeled off on the substrate. Then, during the laser irradiation process, the energy density of the laser beam is adjusted to selectively peel off only the DLC film without damaging the substrate. At the same time, the pulse width of the laser beam is adjusted to generate a high-stress wave, thereby promoting the peeling of the DLC film from the substrate. Finally, mechanical or chemical methods are used to remove the peeled DLC film from the substrate.

[0020] For example, the laser beam used in the embodiments of the present invention can be generated by a laser, such as an Nd:YAG laser.

[0021] It should be noted that the wavelength, energy density, and pulse width of the laser beam have been optimized to achieve selective stripping of the DLC film.

[0022] For example, mechanical methods include, but are not limited to, using a scraper, blade, or abrasive to remove the peeled DLC film, and chemical methods include, but are not limited to, using an acidic or alkaline solution to dissolve the peeled DLC film.

[0023] In one alternative embodiment, the wavelength of the laser beam is 1064 nm.

[0024] Specifically, in conjunction with the above embodiments, the wavelength of the laser beam used in the embodiments of the present invention can be 1064nm. That is, the embodiments of the present invention can use a laser beam with a wavelength of 1064nm to irradiate the DLC film to be peeled off on the substrate.

[0025] In one alternative embodiment, the energy density of the laser beam is 1–10 J / cm². 2 .

[0026] Specifically, in conjunction with the above embodiments, the energy density of the laser beam used in the embodiments of the present invention can be 1 J / cm². 2 ~10J / cm 2 That is, embodiments of the present invention can use a wavelength of 1064 nm and an energy density of 1 J / cm². 2 ~10J / cm 2 The laser beam irradiates the DLC film to be peeled off on the substrate.

[0027] It is understood that, in performing step S12 above, the embodiments of the present invention can achieve a flow rate of 1 J / cm. 2 ~10J / cm 2 The energy density of the laser beam is adjusted within the range of values.

[0028] For example, the energy density of the laser beam can be 1 J / cm². 2 2J / cm 2 3J / cm 2 4J / cm 2 5J / cm 2 6J / cm 2 7J / cm 2 8J / cm 2 9J / cm 2 or 10J / cm 2 The settings can also be configured according to actual needs, and the embodiments of the present invention do not impose specific limitations.

[0029] In one alternative embodiment, the pulse width of the laser beam is 10 to 100 ns.

[0030] Specifically, in conjunction with the above embodiments, the pulse width of the laser beam used in the embodiments of the present invention can be 10ns to 100ns, that is, the embodiments of the present invention can use a wavelength of 1064nm and an energy density of 1J / cm². 2 ~10J / cm 2 A laser beam with a pulse width of 10ns to 100ns is used to irradiate the DLC film to be peeled off on the substrate.

[0031] It is understood that, in performing step S12 above, the pulse width of the laser beam can be adjusted within the range of 10ns to 100ns in this embodiment of the invention.

[0032] For example, the pulse width of the laser beam can be 10ns, 20ns, 30ns, 40ns, 50ns, 60ns, 70ns, 80ns, 90ns or 100ns, and can also be set according to actual needs. This embodiment of the invention does not make specific limitations.

[0033] In one optional embodiment, the area of ​​the DLC film to be peeled is 100 cm². 2 The peeling time is less than 1 minute.

[0034] Specifically, in conjunction with the above embodiments, when the area of ​​the DLC film to be peeled is 100 cm² 2 When the peeling process was carried out using the embodiments of the present invention, it was verified by experiments that the required peeling time was less than 1 minute. It can be seen that the peeling speed of the embodiments of the present invention is fast and can quickly and efficiently peel off the DLC film.

[0035] It should be noted that by selectively peeling the DLC film on the steel substrate using the embodiments of the present invention, experimental verification shows that the DLC film can be completely peeled off without damaging the steel substrate.

[0036] It should be noted that, compared with the traditional DLC film peeling method, the embodiments of the present invention have lower costs and higher efficiency.

[0037] Based on all the above embodiments, the implementation process of this solution will be described below through the first specific embodiment, including: (1) using a wavelength of 1064nm and an energy density of 1J / cm 2(1) A laser beam with a pulse width of 100ns is used to irradiate the DLC film to be peeled off on the substrate; (2) During the laser irradiation process, the energy density of the laser beam is adjusted to selectively peel off only the DLC film to be peeled off without damaging the substrate. At the same time, the pulse width of the laser beam is adjusted to generate a high stress wave, thereby promoting the peeling of the DLC film to be peeled off from the substrate; (3) The peeled DLC film is removed from the substrate by mechanical or chemical methods.

[0038] Based on all the above embodiments, the implementation process of this solution will be described below through a second specific embodiment, including: (1) using a wavelength of 1064nm and an energy density of 5J / cm 2 (1) A laser beam with a pulse width of 50 ns is used to irradiate the DLC film to be peeled off on the substrate; (2) During the laser irradiation process, the energy density of the laser beam is adjusted to selectively peel off only the DLC film to be peeled off without damaging the substrate. At the same time, the pulse width of the laser beam is adjusted to generate a high stress wave, thereby promoting the peeling of the DLC film to be peeled off from the substrate; (3) The peeled DLC film is removed from the substrate by mechanical or chemical methods.

[0039] Based on all the above embodiments, the implementation process of this solution will be described below through a third specific embodiment, including: (1) using a wavelength of 1064nm and an energy density of 10J / cm². 2 (1) A laser beam with a pulse width of 10 ns is used to irradiate the DLC film to be peeled off on the substrate; (2) During the laser irradiation process, the energy density of the laser beam is adjusted to selectively peel off only the DLC film to be peeled off without damaging the substrate. At the same time, the pulse width of the laser beam is adjusted to generate a high stress wave, thereby promoting the peeling of the DLC film to be peeled off from the substrate; (3) The peeled DLC film is removed from the substrate by mechanical or chemical methods.

[0040] In summary, the DLC film peeling method provided by this invention involves first irradiating the DLC film to be peeled with a laser beam; then, adjusting the energy density and pulse width of the laser beam to selectively peel off the DLC film; and finally, removing the peeled DLC film using mechanical or chemical methods. This invention, by using a laser peeling method to peel off the DLC film, has the following beneficial effects:

[0041] (1) Selective peeling: The embodiments of the present invention can selectively peel off the DLC film, thereby enabling the DLC film to be completely peeled off from the substrate without damaging the substrate;

[0042] (2) High efficiency: The peeling speed of the embodiments of the present invention is fast, thereby enabling rapid and efficient peeling of DLC film;

[0043] (3) Low cost: The embodiments of the present invention have low cost and high efficiency;

[0044] (4) The operation of the embodiments of the present invention is simple, easy to implement, and suitable for large-scale production applications.

[0045] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for peeling off a DLC film, characterized in that, include: The DLC film to be peeled off is irradiated with a laser beam; The energy density and pulse width of the laser beam are adjusted to selectively peel off the DLC film to be peeled off; Remove the peeled DLC film using mechanical or chemical methods.

2. The method for peeling off the DLC film as described in claim 1, characterized in that, The wavelength of the laser beam is 1064 nm.

3. The method for peeling off the DLC film as described in claim 1, characterized in that, The energy density of the laser beam is 1–10 J / cm². 2 .

4. The method for peeling off the DLC film as described in claim 1, characterized in that, The pulse width of the laser beam is 10 to 100 ns.

5. The method for peeling off the DLC film as described in claim 1, characterized in that, The area of ​​the DLC film to be peeled off is 100 cm². 2 The peeling time is less than 1 minute.

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