Fin-through type air-cooled module for lead-free reflow soldering

Abstract

The present application relates to the technical field of laser welding air cooling, and particularly relates to a FIN-penetrating lead-free reflow soldering air cooling module, which comprises a welding laser, the lower surface of the welding laser is provided with a suction assembly, the outer surface of the welding laser is provided with a cooling assembly, the outer surface of the cooling assembly is provided with a conveying component, the lower end of the cooling assembly is provided with a flow resistance assembly, the cooling assembly comprises a mounting shell, the inner sides of the two supporting arms of the mounting shell are both provided with a heat conduction component, the upper end of the mounting shell is provided with an exhaust component, the lower end of the mounting shell is fixedly connected with a bottom plate, the inside of the mounting shell is fixedly connected with an L-shaped partition plate, the L-shaped partition plate divides the inside of the mounting shell into a containing groove and a mounting groove, and a plurality of groups of heat dissipation fins are fixedly installed on the inner wall of the mounting groove. The cooling assembly and the conveying component improve the heat dissipation efficiency and effect, compared with the existing air cooling and water cooling structure, the consequences of accidental leakage are reduced while the heat dissipation efficiency and effect are improved.

Description

Technical Field

[0001] This invention relates to the field of laser welding air cooling technology, and in particular to a through-fin type lead-free reflow soldering air cooling module. Background Technology

[0002] The through-fin type air-cooling module is an industrial forced air-cooling heat dissipation unit. Its core is integrated with heat pipes, multi-layer stamped heat dissipation fins, and axial flow fans. It relies on the edge-flipped structure of the fin holes to surround the heat pipes to form a large area of ​​mechanically bonded heat conduction surface. Combined with the fan, it forms a forced convection heat exchange loop. When laser lead-free reflow soldering is performed on PCB boards, the laser will generate a lot of waste heat due to continuous high-power operation. The through-fin type heat sink has a large heat exchange area, short heat conduction path, and good structural rigidity, which can quickly dissipate the heat accumulated by the welding laser and suppress temperature rise.

[0003] For example, Chinese Patent No. CN216421392U discloses a laser welder air-cooled heat dissipation module, including: a heat sink, an optical fiber disk, two gratings, two first cladding optical power strippers, and an energy detector placed next to one of the first cladding optical power strippers, two second cladding optical power strippers and a backlight sealing cover placed on the other side of the heat sink, an air inlet sealing baffle placed at the air inlet end of the heat sink, and a fan assembly placed at the air outlet end of the heat sink; the heat sink has a plurality of corrugated heat dissipation teeth arranged side by side; and a sealing mechanism is also provided at the upper end, lower end, left side and right side of the heat sink.

[0004] The aforementioned device achieves heat dissipation for the laser welder through the corrugated heat dissipation teeth. However, when performing lead-free reflow soldering on PCB boards, the temperature of the laser welder gradually rises during the process because the laser welder melts the solder paste applied to the PCB board. Air cooling alone is not effective. If water cooling is used, the existing water cooling structure will have a large amount of coolant circulating rapidly inside, with high pressure and flow rate. After long-term use, coolant leakage is likely to occur, which will not only reduce the heat dissipation effect but also easily damage the laser welder components. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of poor heat dissipation and easy leakage of water cooling structure when performing lead-free reflow soldering on PCB boards in the prior art, and to propose a through-fin type lead-free reflow soldering air cooling module.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a lead-free reflow soldering air-cooled module with a through-fin, including a soldering laser, a suction component is provided on the lower surface of the soldering laser, a cooling component is provided through the adjacent two sides of the outer surface of the soldering laser, two sets of conveying components are provided through the outer surface of the cooling component at intervals, and a flow-blocking component is provided through the lower end of the cooling component. The cooling assembly includes a mounting housing that contacts the outer surface of the welding laser. The mounting housing is an L-shaped, vertically continuous structure. Heat-conducting components are installed through the inner sides of both arms of the mounting housing. Two sets of conveying components are respectively installed through the outer sides of the two arms of the mounting housing. An exhaust component is installed at the upper end of the mounting housing. A base plate is fixedly connected to the lower end of the mounting housing. A flow-blocking component is installed through the base plate. Two sets of second fans are installed at intervals on the base plate, and the two sets of second fans are respectively located below the two arms of the mounting housing. An L-shaped partition plate is fixedly connected inside the mounting housing, dividing the interior of the mounting housing into a smaller receiving groove and a larger mounting groove. The receiving groove contains deionized water. Multiple sets of heat dissipation fins are fixedly installed on the inner wall of the mounting groove. The heat-conducting components penetrate the L-shaped partition plate and the multiple sets of heat dissipation fins.

[0007] Preferably, the exhaust component includes a top plate that is detachably and sealed to the upper end of the mounting housing. A bent exhaust pipe is fixedly connected through the top plate. A drain pipe is fixedly installed through the lowest point of the bent exhaust pipe. Both the ends of the bent exhaust pipe and the drain pipe are connected to external processing equipment via flexible hoses.

[0008] Preferably, the heat-conducting component includes a heat-conducting block fixedly connected to the inner side of the mounting housing support arm. Multiple sets of first copper heat pipes are spaced apart between the upper and lower ends of the heat-conducting block. The ends of the multiple sets of first copper heat pipes are all connected through an L-shaped partition plate, which is made of heat-insulating material. The ends of the multiple sets of first copper heat pipes are all interference-fitted with the multiple sets of heat dissipation fins through a fin. A second copper heat pipe is fixedly connected to one side of each of the multiple sets of first copper heat pipes, and the second copper heat pipe penetrates the laser housing and contacts the internal heating element.

[0009] Preferably, the heat-conducting component further includes multiple sets of end caps fixedly connected inside the receiving groove, with the ends of the multiple sets of first copper heat pipes respectively embedded inside the multiple sets of end caps.

[0010] Preferably, the conveying component includes a peristaltic pump fixedly connected to one side of the mounting housing support arm, a water inlet end of the peristaltic pump is fixedly connected to a water pump pipe, and one end of the water pump pipe extends into the lower end of the receiving groove, and a connecting pipe is fixedly connected to the water outlet end of the peristaltic pump, and one end of the connecting pipe is fixedly connected to the inner wall of the mounting housing.

[0011] Preferably, a semi-circular groove is provided at intervals near the upper edge on one side of the heat dissipation fin, and multiple sets of first capillary grooves are radially provided at the lower end of the semi-circular grooves. A second capillary groove is provided at the lower end of the multiple sets of first capillary grooves, and the second capillary groove is L-shaped. Multiple sets of third capillary grooves are inclinedly provided on the inner side of the second capillary groove.

[0012] Preferably, multiple sets of liquid outlet pipes are fixedly connected to the outer surface of the connecting pipe, and the multiple sets of liquid outlet pipes pass through the upper ends of multiple sets of heat dissipation fins and are respectively embedded in the interior of multiple sets of semi-circular grooves.

[0013] Preferably, the flow-blocking assembly includes two sets of electrically operated telescopic rods that are fixedly connected to the base plate. The two sets of electrically operated telescopic rods are respectively mounted on two support arms of the base plate. An L-shaped push plate is fixedly connected to the upper end of the two sets of electrically operated telescopic rods, and a gap is provided between the L-shaped push plate and the base plate to allow gas to flow.

[0014] Preferably, an absorbent sponge is fixedly connected to the upper end of the L-shaped push plate, and a flexible absorbent sheet is fixedly connected obliquely through the L-shaped push plate and the absorbent sponge. The flexible absorbent sheet has a frame structure, and a water-proof film is provided on the contact surface between the flexible absorbent sheet and the absorbent sponge. The upper end of the flexible absorbent sheet is higher than the upper end of the absorbent sponge.

[0015] Preferably, a temperature sensor is installed at the position of the heating element inside the welding laser, and the suction assembly includes a first fan fixedly connected to the lower surface of the welding laser. The lower end of the first fan is sealed and fixedly connected to an exhaust pipe, and a connecting pipe is fixedly connected through the outer surface of the first fan. The connecting pipe is connected to an external exhaust gas treatment device through a flexible hose, and the lower end of the exhaust pipe is close to the nozzle of the welding laser.

[0016] Compared with existing technologies, the advantages of this invention are: 1. This invention, through the arrangement of cooling components and conveying parts, relies on airflow to carry away the heat from the heat sink fins and the first copper heat pipe to form basic air cooling. When the temperature sensor detects that the temperature exceeds the threshold, the heat dissipation is greatly enhanced by water evaporation and heat absorption. Multiple sets of third capillary grooves guide deionized water to be evenly distributed on the surface of the heat sink fins, which can expand the evaporation area and avoid water accumulation between adjacent heat sink fins, thus reducing the heat exchange effect. Compared with conventional circulating water cooling, the water pressure and flow rate are lower through the micro-water supply of the conveying parts, reducing the risk and harm of water leakage. The continuous airflow can not only carry away the heat from the heat sink fins, but also reduce the water vapor concentration to accelerate water evaporation, thereby improving the heat dissipation efficiency and effect. Compared with the existing air cooling and water cooling structures, it not only improves the heat dissipation efficiency and effect, but also reduces the consequences of accidental leakage. When the internal temperature of the equipment rises, the high-temperature airflow can increase the evaporation rate of the water in the third capillary groove, maintain a stable heat dissipation effect, and enable the lead-free reflow soldering equipment to operate safely and continuously for a long time. 2. This invention, through the arrangement of cooling and flow-blocking components, can secondary interception of dripping water droplets, preventing water from affecting the operation of the second fan. The intercepted water can continue to participate in the evaporation process, reducing the waste of deionized water and thus reducing the frequency of water replenishment. At the same time, it can collect and reuse dripping deionized water, which not only avoids the problem of excessive water accumulation on the flexible absorbent plate leading to increased leakage risk, but also allows water to enter the lower end of the third capillary tank to assist in heat dissipation, reducing the water delivery volume of the peristaltic pump, reducing the possibility of peristaltic pump leakage, and improving the safety of equipment use. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a lead-free reflow soldering air-cooled module with a through-fin type, as proposed in this invention. Figure 2 This is a schematic diagram of the welding laser and suction assembly structure of a lead-free reflow soldering air-cooled module proposed in this invention; Figure 3 This is a schematic diagram of the cooling component structure of a lead-free reflow soldering air-cooled module with a through-fin type, as proposed in this invention. Figure 4 This is a structural breakdown diagram of the cooling assembly and flow-blocking component of a lead-free reflow soldering air-cooled module with a through-fin type, as proposed in this invention. Figure 5 This is a top view of a partial structure of a cooling component in a lead-free reflow soldering air-cooled module proposed in this invention. Figure 6 This is a schematic diagram of the cooling component and conveying component of a lead-free reflow soldering air-cooled module with a through-fin type, as proposed in this invention. Figure 7 This is a schematic diagram of the conveying component and heat sink structure of a lead-free reflow soldering air-cooled module with through-fin type according to the present invention. Figure 8 For the present invention Figure 7 Enlarged detail image of point A in the middle; Figure 9 This is a schematic diagram of the base plate, second fan, and flow-blocking component of a lead-free reflow soldering air-cooled module with a through-fin type, as proposed in this invention. Figure 10 This is a cross-sectional view of the flow-blocking component structure of a lead-free reflow soldering air-cooled module proposed in this invention. Figure 11 For the present invention Figure 10 Enlarged detail of section B in the middle.

[0018] In the diagram: 1. Welding laser; 2. Suction assembly; 21. First fan; 22. Suction pipe; 23. Connecting pipe; 3. Cooling assembly; 31. Mounting housing; 32. Heat-conducting component; 321. Heat-conducting block; 322. First copper heat pipe; 323. Second copper heat pipe; 324. End cap; 33. Exhaust assembly; 331. Top plate; 332. Bent exhaust pipe; 333. Drain pipe; 34. Base plate; 35. Second fan; 36. L-shaped partition plate; 37. Heat dissipation fins; 371. Semicircular groove; 372. First capillary groove; 373. Second capillary groove; 374. Third capillary groove; 38. Receiving groove; 39. Mounting groove; 4. Conveying component; 41. Peristaltic pump; 42. Water suction pipe; 43. Connecting pipe; 44. Liquid outlet pipe; 5. Flow obstruction component; 51. Electric telescopic rod; 52. L-shaped push plate; 53. Absorbent sponge; 54. Flexible absorbent sheet. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] like Figures 1-11 As shown, a through-fin type lead-free reflow soldering air-cooled module includes a soldering laser 1, a suction component 2 disposed on the lower surface of the soldering laser 1, a cooling component 3 disposed through adjacent sides on the outer surface of the soldering laser 1, two sets of conveying components 4 disposed through the outer surface of the cooling component 3 at intervals, and a flow-blocking component 5 disposed through the lower end of the cooling component 3. The suction component 2 is used to suck up and discharge the soldering fumes generated by reflow soldering, preventing the soldering fumes from entering the interior of the cooling component 3. The cooling component 3 and the conveying components 4 are used to reduce the temperature of the heating element inside the soldering laser 1, and the flow-blocking component 5 is used to prevent liquid from flowing downward from the interior of the cooling component 3. The cooling assembly 3 includes a mounting housing 31 that contacts the outer surface of the welding laser 1. The mounting housing 31 is an L-shaped, vertically continuous housing structure. Heat-conducting components 32 are installed through the inner sides of both arms of the mounting housing 31. Two sets of conveying components 4 are respectively installed through the outer sides of the two arms of the mounting housing 31. An exhaust component 33 is installed at the upper end of the mounting housing 31. A base plate 34 is fixedly connected to the lower end of the mounting housing 31. A flow-blocking component 5 is installed through the base plate 34. Two sets of second fans 35 are installed at intervals through the base plate 34, and the two sets of second fans 35 are respectively located below the two arms of the mounting housing 31. An L-shaped partition plate 36 is fixedly connected inside the mounting housing 31. The partition plate 36 divides the interior of the mounting housing 31 into a smaller receiving groove 38 and a larger mounting groove 39. The receiving groove 38 contains deionized water. Multiple sets of heat dissipation fins 37 are fixedly installed on the inner wall of the mounting groove 39. The heat-conducting component 32 passes through the L-shaped partition plate 36 and the multiple sets of heat dissipation fins 37. The heat-conducting component 32 is used to conduct the heat of the heating element inside the welding laser 1 to the multiple sets of heat dissipation fins 37. The exhaust component 33 allows the water vapor inside the mounting housing 31 to be discharged and prevents backflow. The base plate 34 is used to install the flow-blocking component 5 and the second fan 35. The second fan 35 is used to send air into the interior of the mounting housing 31. The L-shaped partition plate 36 is used to divide the space inside the mounting housing 31.

[0021] The exhaust component 33 includes a top plate 331 that is detachably and sealed to the upper end of the mounting housing 31. A bent exhaust pipe 332 is fixedly connected through the top plate 331. A drain pipe 333 is fixedly installed through the lowest point of the bend of the bent exhaust pipe 332. The ends of the bent exhaust pipe 332 and the drain pipe 333 are connected to external processing equipment through flexible hoses. When a mixture of air and water vapor enters the interior of the heat-conducting component 32, the mixture can be discharged to the external processing equipment through the bent exhaust pipe 332. At the same time, the water generated by condensation inside the bent exhaust pipe 332 can be discharged through the drain pipe 333, thereby preventing water backflow.

[0022] The heat-conducting component 32 includes a heat-conducting block 321 fixedly connected to the inner side of the support arm of the mounting housing 31. Multiple sets of first copper heat pipes 322 are spaced apart between the upper and lower ends of the heat-conducting block 321. The ends of the multiple sets of first copper heat pipes 322 are all connected through an L-shaped partition plate 36, which is made of heat-insulating material. The ends of the multiple sets of first copper heat pipes 322 are all interference-fitted with multiple sets of heat dissipation fins 37 through the fins. A second copper heat pipe 323 is fixedly connected to one side of each set of first copper heat pipes 322. The second copper heat pipe 323 passes through the outer shell of the welding laser 1 and contacts the internal heating element. Through the fin-connection, the heat of the internal heating element of the welding laser 1 can be quickly conducted from the second copper heat pipe 323, the first copper heat pipe 322 and the heat-conducting block 321 to the multiple sets of heat dissipation fins 37.

[0023] The heat-conducting component 32 also includes multiple sets of end caps 324 fixedly connected inside the receiving tank 38. The ends of the multiple sets of first copper heat pipes 322 are respectively embedded inside the multiple sets of end caps 324. The end caps 324 and the L-shaped partition plate 36 are used for heat insulation, which reduces the heat exchange between the first copper heat pipes 322 and the deionized water inside the receiving tank 38, and avoids the temperature of the deionized water from rising too much.

[0024] The conveying component 4 includes a peristaltic pump 41 fixedly connected to one side of the support arm of the mounting housing 31. The water inlet end of the peristaltic pump 41 is fixedly connected to a water pump pipe 42, and one end of the water pump pipe 42 extends into the lower end of the receiving tank 38. The water outlet end of the peristaltic pump 41 is fixedly connected to a connecting pipe 43, and one end of the connecting pipe 43 is fixedly connected to the inner wall of the mounting housing 31. The peristaltic pump 41 can convey the water inside the receiving tank 38 to the inside of the connecting pipe 43.

[0025] Semicircular grooves 371 are spaced apart near the upper edge of one side of the heat dissipation fins 37. Multiple sets of first capillary grooves 372 are radially formed at the lower end of the semicircular grooves 371. Second capillary grooves 373 are formed at the lower end of the multiple sets of first capillary grooves 372. The second capillary grooves 373 are L-shaped. Multiple sets of third capillary grooves 374 are inclinedly formed on the inner side of the second capillary grooves 373. The semicircular grooves 371, first capillary grooves 372, second capillary grooves 373 and third capillary grooves 374 are all used to guide the water flow. While evenly distributing the water, it can prevent the water from accumulating into a continuous water film or dripping rapidly downward.

[0026] Multiple sets of liquid outlet pipes 44 are fixedly connected through the outer surface of the connecting pipe 43. The multiple sets of liquid outlet pipes 44 pass through the upper ends of multiple sets of heat dissipation fins 37 and are respectively embedded in the interior of multiple sets of semi-circular grooves 371. The liquid inside the connecting pipe 43 can enter the interior of the semi-circular grooves 371 through the multiple sets of liquid outlet pipes 44. Under the action of capillary action and gravity, the liquid will be dispersed into the interior of multiple sets of third capillary grooves 374 along the first capillary groove 372 and the second capillary groove 373.

[0027] The flow obstruction assembly 5 includes two sets of electric telescopic rods 51 that are fixedly connected to the base plate 34. The two sets of electric telescopic rods 51 are respectively set on the two support arms of the base plate 34. An L-shaped push plate 52 is fixedly connected to the upper end of the two sets of electric telescopic rods 51. A gap is provided between the L-shaped push plate 52 and the base plate 34 to allow gas to flow. The L-shaped push plate 52 can be controlled to move inside the mounting housing 31 by the two sets of electric telescopic rods 51.

[0028] A water-absorbing sponge 53 is fixedly connected to the upper end of the L-shaped push plate 52. A flexible water-absorbing sheet 54 is fixedly connected obliquely between the L-shaped push plate 52 and the water-absorbing sponge 53. The flexible water-absorbing sheet 54 has a frame structure. A water-proof film is provided on the contact surface between the flexible water-absorbing sheet 54 and the water-absorbing sponge 53. The upper end of the flexible water-absorbing sheet 54 is higher than the upper end of the water-absorbing sponge 53. The second fan 35 can draw air from the lead-free reflow soldering equipment to the space between the L-shaped push plate 52 and the base plate 34. Then the air can pass through multiple sets of flexible water-absorbing sheets 54 and contact multiple sets of heat dissipation fins 37. Due to the oblique setting of the flexible water-absorbing sheet 54, the water dripping from the heat dissipation fins 37 cannot directly pass through the flexible water-absorbing sheet 54.

[0029] A temperature sensor is installed at the position of the heating element inside the welding laser 1. The suction assembly 2 includes a first fan 21 fixedly connected to the lower surface of the welding laser 1. The lower end of the first fan 21 is sealed and fixedly connected to an exhaust pipe 22. A connecting pipe 23 is fixedly connected through the outer surface of the first fan 21. The connecting pipe 23 is connected to an external exhaust gas treatment device through a flexible hose. The lower end of the exhaust pipe 22 is close to the nozzle of the welding laser 1. Since lead-free reflow soldering of PCB board generally melts the solder paste by spot soldering, the amount of smoke generated in a single soldering is small. The first fan 21 can suck and discharge the welding fumes generated during lead-free reflow soldering, effectively reducing the possibility of the fumes entering the mounting housing 31 through the two sets of second fans 35.

[0030] In this invention, during lead-free reflow soldering of a PCB board, the first fan 21 removes and exhausts the welding fumes generated during soldering. Simultaneously, the heat generated by the internal heating element of the soldering laser 1 during processing is conducted to multiple sets of heat dissipation fins 37 through the heat-conducting component 32. Two sets of second fans 35 draw air from inside the lead-free reflow soldering equipment into the mounting housing 31. The air passes through multiple sets of heat dissipation fins 37 and is then discharged from the equipment through the bent exhaust pipe 332 and the drain pipe 333. During this process, the air carries away the heat from the surfaces of the multiple sets of heat dissipation fins 37 and the first copper heat pipe 322, thereby reducing the temperature of both the heat dissipation fins 37 and the first copper heat pipe 322. This reduces the temperature of the internal heating element of the soldering laser 1, achieving heat dissipation for the soldering laser 1. When the temperature sensor inside the welding laser 1 detects that the temperature exceeds the threshold, the peristaltic pump 41 slowly delivers the deionized water stored in the receiving tank 38 to the connecting pipe 43. Subsequently, the deionized water can enter the interior of multiple semi-circular tanks 371 through multiple sets of outlet pipes 44. Under the action of capillary action and gravity, the deionized water can be dispersed into multiple sets of third capillary tanks 374. By controlling the flow rate of the water, the deionized water is prevented from filling the bottom of the multiple sets of third capillary tanks 374, and the heat from the heat dissipation fins 37 can continuously evaporate the deionized water inside the third capillary tanks 374. Water, especially deionized water, absorbs a large amount of heat during evaporation, effectively reducing the temperature of the heat dissipation fins 37 and improving their heat dissipation effect. This, in turn, effectively enhances the heat dissipation of the welding laser 1. Simultaneously, the multiple sets of third capillary grooves 374 effectively guide the water, allowing the deionized water to distribute on the surface of the heat dissipation fins 37. This not only expands the evaporation area and improves the heat dissipation effect but also prevents excessive water from connecting adjacent heat dissipation fins 37, which could reduce the heat dissipation effect. Furthermore, the delivery component 4 provides a small amount of water... When conveying deionized water, the working water pressure is lower and the flow rate of deionized water is also lower compared to the circulating water cooling structure, which effectively reduces the possibility and damage of water leakage. With the continuous air circulation, the air carries away the heat from the surface of the heat dissipation fins 37 and blows the water vapor between the multiple heat dissipation fins 37 away from the inside of the mounting housing 31, effectively reducing the water vapor concentration inside the mounting housing 31 and accelerating the evaporation efficiency of the deionized water inside the third capillary tank 374, further improving the heat dissipation efficiency and effect. Compared with the existing air-cooled and water-cooled structures, while improving the heat dissipation efficiency and effect, it also reduces the consequences of accidental leakage. When the air temperature inside the lead-free reflow soldering equipment rises, the air temperature entering the mounting housing 31 will also increase. At this time, the heat carried away directly from the surface of the heat dissipation fins 37 by the air will be reduced. However, due to the increased air temperature, the evaporation efficiency of the deionized water inside the third capillary tank 374 will also be accelerated, so that it can still effectively dissipate heat when the air temperature is high, reduce the temperature of the heating element inside the welding laser 1, and enable the lead-free reflow soldering equipment to be used safely for a long time. When deionized water flows through the outlet pipe 44, semi-circular groove 371, first capillary groove 372, second capillary groove 373, and third capillary groove 374, a small amount of deionized water overflows and slides down the surface of the heat dissipation fins 37. During this process, the heat from the heat dissipation fins 37 continuously evaporates the water droplets. Meanwhile, the multiple sets of inclined third capillary grooves 374 are not completely filled with deionized water; some water droplets can be captured and retained by the third capillary grooves 374 as they slide down, reducing the possibility of water droplets falling. This portion of water can also participate in the evaporation and heat dissipation process. If some water still slides down, because the flexible absorbent plate 54 is inclined, the water droplets cannot directly pass through it. The water droplets fall onto the flexible absorbent plate 54 and the absorbent plate... When water is absorbed by the sponge 53, it prevents water droplets from passing through the flexible absorbent sheet 54 and contacting the second fan 35. Since the second fan 35 continuously supplies air into the mounting housing 31, it prevents excessive humidity inside the lead-free reflow soldering equipment from affecting the laser welding process. After the water diffuses on the flexible absorbent sheet 54, the air passing through simultaneously dries the sheet, preventing water accumulation and dripping. When the peristaltic pump 41 operates, it intermittently moves the L-shaped push plate 52 upward via the electric telescopic rod 51, causing the bottom of multiple sets of heat dissipation fins 37 and the L-shaped push plate 52 to slowly squeeze the absorbent sponge 53 together. The water inside the absorbent sponge 53 is slowly squeezed out and comes into contact with the bottom of the heat dissipation fins 37. The flexible absorbent sheet 54 and the absorbent sponge 53 are separated by a water-blocking film, preventing water from overflowing from the flexible absorbent sheet 54. Under capillary action, the water is drawn into the third capillary groove 374, where it is continuously evaporated by the heat dissipation fins 37. This allows the water in the flexible absorbent sheet 54 to continuously enter the third capillary groove 374, further promoting heat dissipation from the heat dissipation fins 37 and preventing excessive accumulation of water in the absorbent sponge 53. After a period of time, the L-shaped pusher plate 52 resets. When the temperature of the heating element inside the welding laser 1 drops to the standard range, the peristaltic pump 41 stops pumping, and the heat dissipation fins 37 are dried by airflow, preventing the third capillary action from causing further water accumulation. The residual water inside the capillary tank 374 can be further intercepted by the flow-blocking component 5 and the heat dissipation fins 37 through the third capillary tank 374 and the flexible water-absorbing plate 54. This prevents the water from affecting the operation of the second fan 35, and the intercepted water can continue to participate in the evaporation process, reducing the waste of deionized water and thus reducing the frequency of water replenishment. At the same time, the dripping deionized water can be collected and reused. This not only avoids the problem of excessive accumulation of water in the flexible water-absorbing plate 54, which would increase the risk of leakage, but also allows the water to enter the lower end of the third capillary tank 374 to assist in heat dissipation, reducing the water delivery volume of the peristaltic pump 41, reducing the possibility of leakage of the peristaltic pump 41, and improving the safety of equipment use.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A lead-free reflow soldering air-cooled module with a through-fin design, comprising a soldering laser (1), characterized in that, The welding laser (1) is provided with a suction component (2) on its lower surface, and a cooling component (3) is provided through the adjacent two sides of the outer surface of the welding laser (1). Two sets of conveying components (4) are provided through the outer surface of the cooling component (3) at intervals, and a flow-blocking component (5) is provided through the lower end of the cooling component (3). The cooling assembly (3) includes a mounting housing (31) that contacts the outer surface of the welding laser (1). The mounting housing (31) is an L-shaped, vertically continuous housing structure. Heat-conducting components (32) are provided through the inner sides of the two arms of the mounting housing (31). Two sets of conveying components (4) are respectively provided through the outer sides of the two arms of the mounting housing (31). An exhaust component (33) is provided at the upper end of the mounting housing (31). A base plate (34) is fixedly connected to the lower end of the mounting housing (31). A flow-blocking component (5) is provided through the base plate (34). The base plate (34) is spaced apart. Two sets of second fans (35) are provided through the mounting housing (31), and the two sets of second fans (35) are respectively located below the two arms of the mounting housing (31). An L-shaped partition plate (36) is fixedly connected inside the mounting housing (31). The L-shaped partition plate (36) divides the inside of the mounting housing (31) into a smaller receiving groove (38) and a larger mounting groove (39). The receiving groove (38) contains deionized water. Multiple sets of heat dissipation fins (37) are fixedly installed on the inner wall of the mounting groove (39). The heat conduction component (32) passes through the L-shaped partition plate (36) and the multiple sets of heat dissipation fins (37).

2. The lead-free reflow soldering air-cooled module with through-fin as described in claim 1, characterized in that, The exhaust component (33) includes a top plate (331) that is detachably and sealed to the upper end of the mounting housing (31). A bent exhaust pipe (332) is fixedly connected through the top plate (331). A drain pipe (333) is fixedly installed through the lowest point of the bend of the bent exhaust pipe (332). The ends of the bent exhaust pipe (332) and the drain pipe (333) are both connected to external processing equipment through hoses.

3. A lead-free reflow soldering air-cooled module with through-fin type according to claim 1, characterized in that, The heat-conducting component (32) includes a heat-conducting block (321) fixedly connected to the inner side of the support arm of the mounting housing (31). Multiple sets of first copper heat pipes (322) are spaced between the upper and lower ends of the heat-conducting block (321). The ends of the multiple sets of first copper heat pipes (322) are all connected through an L-shaped partition plate (36). The L-shaped partition plate (36) is made of heat-insulating material. The ends of the multiple sets of first copper heat pipes (322) are all connected to the multiple sets of heat dissipation fins (37) through FIN interference fit. A second copper heat pipe (323) is fixedly connected to one side of the multiple sets of first copper heat pipes (322). The second copper heat pipe (323) passes through the outer shell of the welding laser (1) and contacts the internal heating element.

4. A lead-free reflow soldering air-cooled module with through-fin type according to claim 3, characterized in that, The heat-conducting component (32) also includes multiple sets of end caps (324) fixedly connected inside the receiving groove (38), with the ends of the multiple sets of the first copper heat pipes (322) respectively embedded inside the multiple sets of end caps (324).

5. A lead-free reflow soldering air-cooled module with through-fin type according to claim 1, characterized in that, The conveying component (4) includes a peristaltic pump (41) fixedly connected to one side of the support arm of the mounting housing (31). The inlet end of the peristaltic pump (41) is fixedly connected to a water pump pipe (42), and one end of the water pump pipe (42) extends into the lower end of the receiving groove (38). The outlet end of the peristaltic pump (41) is fixedly connected to a connecting pipe (43), and one end of the connecting pipe (43) is fixedly connected to the inner wall of the mounting housing (31).

6. A lead-free reflow soldering air-cooled module with through-fin type according to claim 5, characterized in that, The heat dissipation fins (37) are provided with semi-circular grooves (371) at intervals near the upper edge on one side. Multiple sets of first capillary grooves (372) are radially provided at the lower end of the semi-circular grooves (371). Second capillary grooves (373) are provided at the lower end of the multiple sets of first capillary grooves (372). The second capillary grooves (373) are L-shaped. Multiple sets of third capillary grooves (374) are inclinedly provided on the inner side of the second capillary grooves (373).

7. A lead-free reflow soldering air-cooled module with a through-fin design according to claim 6, characterized in that, The outer surface of the connecting pipe (43) is fixedly connected to multiple sets of liquid outlet pipes (44), which penetrate the upper ends of multiple sets of heat dissipation fins (37) and are respectively embedded in the interior of multiple sets of semi-circular grooves (371).

8. A lead-free reflow soldering air-cooled module with a through-fin design according to claim 1, characterized in that, The flow-blocking assembly (5) includes two sets of electric telescopic rods (51) that are fixedly connected to the base plate (34). The two sets of electric telescopic rods (51) are respectively set on two support arms of the base plate (34). An L-shaped push plate (52) is fixedly connected to the upper end of the two sets of electric telescopic rods (51). A gap is provided between the L-shaped push plate (52) and the base plate (34) to allow gas to flow.

9. A lead-free reflow soldering air-cooled module with through-fin type according to claim 8, characterized in that, The upper end of the L-shaped push plate (52) is fixedly connected to a water-absorbing sponge (53). A flexible water-absorbing sheet (54) is fixedly connected between the L-shaped push plate (52) and the water-absorbing sponge (53) at an incline. The flexible water-absorbing sheet (54) has a frame structure. A water-proof film is provided on the contact surface between the flexible water-absorbing sheet (54) and the water-absorbing sponge (53). The upper end of the flexible water-absorbing sheet (54) is higher than the upper end of the water-absorbing sponge (53).

10. A lead-free reflow soldering air-cooled module with through-fin type according to claim 1, characterized in that, A temperature sensor is installed at the position of the heating element inside the welding laser (1). The suction assembly (2) includes a first fan (21) fixedly connected to the lower surface of the welding laser (1). The lower end of the first fan (21) is sealed and fixedly connected to a suction pipe (22). A connecting pipe (23) is fixedly connected through the outer surface of the first fan (21). The connecting pipe (23) is connected to an external waste gas treatment device through a hose. The lower end of the suction pipe (22) is close to the nozzle of the welding laser (1).

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