Separation apparatus and separation method

Abstract

The application provides a separation device and a separation method. The separation device comprises a laser for emitting a laser beam; an energy converging module located on one side of the laser; a workbench located on one side of the energy converging module; and a driving mechanism connected with the workbench for driving the workbench to move so that the laser beam scans and irradiates the workbench; wherein the laser beam irradiates the workbench through the energy converging module, the light spot of the laser beam irradiating the workbench comprises a central region and first and second edge regions symmetrically distributed on both sides of the central region, and the first edge region, the central region and the second edge region are arranged in sequence in the direction of the maximum diameter of the light spot of the laser beam irradiating the workbench; and the energy converging module is used for converging the energy of the laser beam in the first and second edge regions, respectively. The technical scheme provided by the application can improve the production efficiency and is conducive to improving the production capacity.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a separation device and separation method. Background Technology

[0002] With the gradual development of display technology, the manufacturing process of display devices is constantly evolving to meet market demand, leading to an increasing need for equipment capable of precisely separating complex material layers. Currently, high-precision laser beams are typically used to perform the stripping process, ensuring that the material layers of the display device are not damaged during transfer while maintaining their original performance and reliability. However, current laser stripping devices require multiple laser scans during operation to ensure complete stripping of the material layers, resulting in low production efficiency and reduced production capacity. Summary of the Invention

[0003] In view of this, the embodiments of this application aim to provide a separation device and a separation method to solve the problem of low product production efficiency.

[0004] The first aspect of this application provides a separation device, comprising: a laser for emitting a laser beam; an energy focusing module located on the side where the laser emits light; a worktable located on the side where the energy focusing module emits light; and a drive mechanism connected to the worktable for driving the worktable to move so that the laser beam scans and irradiates the worktable; wherein the laser beam passes through the energy focusing module and irradiates the worktable, and the spot of the laser beam irradiating the worktable includes a central region and a first edge region and a second edge region symmetrically distributed on both sides of the central region, and the first edge region, the central region and the second edge region are arranged sequentially in the direction of the maximum diameter of the spot of the laser beam irradiating the worktable; the energy focusing module is used to focus the energy of the laser beam in the first edge region and the second edge region respectively.

[0005] In one embodiment, the energy focusing module includes a convex lens positioned along the transmission direction of the laser beam.

[0006] In one embodiment, the energy of the laser beam in both the first and second edge regions is greater than that in the central region; preferably, the energy distribution of the laser beam in the central region is uniform; and / or, the energy of the laser beam irradiating the energy focusing module attenuates at the edges.

[0007] In one embodiment, the separation device further includes an optical path adjustment module located on the side of the light output of the energy focusing module, for adjusting the optical path of the laser beam; and a beam focusing module located on the side of the light output of the optical path adjustment module, for focusing the laser beam onto the worktable; preferably, the laser beam is used to scan and irradiate the component to be separated located on the worktable, the component to be separated includes a substrate and a separation layer formed on the side of the substrate away from the laser; the component to be separated includes a first end and a second end disposed opposite to each other along a first direction parallel to the worktable, the component to be separated includes a third end and a fourth end disposed opposite to each other along a second direction parallel to the worktable, the first direction and the second direction intersect.

[0008] In one embodiment, the separation device further includes a removal module for separating the separation layer and the substrate after the laser beam scans and irradiates the component to be separated; preferably, the removal module includes a cutter.

[0009] The second aspect of this application provides a separation method applicable to the separation device mentioned in any of the above embodiments. The method includes: placing a component to be separated on a worktable, the component to be separated including a substrate and a separation layer formed on one side of the substrate; emitting a laser beam using a laser; converging the energy of the laser beam in a first edge region and a second edge region using an energy focusing module; driving the worktable to move using a driving mechanism; and scanning and irradiating the component to be separated using the laser beam to separate the separation layer and the substrate.

[0010] In one embodiment, the component to be separated includes a first end and a second end disposed opposite to each other along a first direction parallel to the worktable, and a third end and a fourth end disposed opposite to each other along a second direction parallel to the worktable. The first and second directions intersect. Scanning the component to be separated with a laser beam includes: along the first direction, the laser beam scans from the first end of the component to be separated to the second end of the component to be separated for the first time; wherein the laser beam covers the third end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam; and along the first direction, the laser beam scans from the first end of the component to be separated to the second end of the component to be separated for the second time; wherein the laser beam covers the fourth end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam.

[0011] In one embodiment, the component to be separated includes a first end and a second end disposed opposite to each other along a first direction parallel to the worktable, and a third end and a fourth end disposed opposite to each other along a second direction parallel to the worktable. The first and second directions intersect. Scanning the component to be separated with a laser beam includes: along the second direction, using a laser beam to first scan and irradiate from the third end of the component to be separated to the fourth end of the component to be separated; wherein the laser beam covers the first end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam; and along the second direction, using a laser beam to second scan and irradiate from the third end of the component to be separated to the fourth end of the component to be separated; wherein the laser beam covers the second end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam.

[0012] In one embodiment, the separation device further includes a removal module. After the step of irradiating the second end of the component to be separated with a laser beam in a second scan along a first direction from the first end of the component to be separated, the method further includes: cutting the removal module between the substrate and the separation layer from the third end of the component to be separated; moving the removal module along a second direction to the fourth end of the component to be separated, and separating the separation layer and the substrate.

[0013] In one embodiment, the separation device further includes a removal module. After the step of irradiating the fourth end of the component to be separated with a laser beam in a second direction from the third end to the fourth end of the component to be separated, the method further includes: cutting the removal module between the substrate and the separation layer from the first end of the component to be separated; moving the removal module in a first direction to the second end of the component to be separated to separate the separation layer and the substrate.

[0014] The technical solution provided in this application generates and emits a laser beam, which is then transmitted to an energy focusing module. This module adjusts the energy distribution within the laser beam, concentrating and enhancing the energy in both the first and second edge regions. When the laser beam irradiates the worktable after passing through the energy focusing module, not only is the central region of the beam high enough to separate the components, but the edge regions also have sufficiently high energy to enhance the irradiation effect, thus facilitating overall separation. This configuration reduces the number of times the laser beam scans the worktable, improving production efficiency and increasing capacity.

[0015] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 The diagram shown is a structural schematic of a separation device provided in an embodiment of this application.

[0018] Figure 2 The diagram shown is a structural schematic of a separation device provided in another embodiment of this application.

[0019] Figure 3 The diagram shown is a schematic diagram of energy distribution provided in an embodiment of this application.

[0020] Figure 4 The diagram shown is an energy distribution schematic provided in another embodiment of this application.

[0021] Figure 5 The diagram shown is a structural schematic of a separation device provided in another embodiment of this application.

[0022] Figure 6 The diagram shown is a schematic flowchart of a separation method provided in an embodiment of this application.

[0023] Figure 7 The diagram shown is a flowchart of a separation method provided in another embodiment of this application.

[0024] Figure 8 The diagram shown is a top view of a component to be separated according to an embodiment of this application.

[0025] Figure 9 The diagram shown is a flowchart of a separation method provided in another embodiment of this application.

[0026] Figure 10 The diagram shown is a top view of a component to be separated according to another embodiment of this application.

[0027] Figure 11 The diagram shown is a flowchart of a separation method provided in another embodiment of this application.

[0028] Figure 12 The diagram shown is a flowchart of a separation method provided in another embodiment of this application. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0030] Figure 1 The diagram shown is a structural schematic of a separation device provided in an embodiment of this application. Figure 1 As shown, the separation device includes: a laser 10 for emitting a laser beam; an energy focusing module 20 located on the side where the laser 10 emits light; a worktable 30 located on the side where the energy focusing module 20 emits light; and a drive mechanism 40 connected to the worktable 30 for driving the worktable 30 to move so that the laser beam scans and irradiates the worktable 30. The laser beam passes through the energy focusing module 20 and irradiates the worktable 30. The spot of the laser beam irradiating the worktable 30 includes a central region and a first edge region and a second edge region symmetrically distributed on both sides of the central region. The first edge region, the central region, and the second edge region are arranged sequentially in the direction of the maximum diameter of the spot of the laser beam irradiating the worktable 30. The energy focusing module 20 is used to focus the energy of the laser beam in the first edge region and the second edge region, respectively.

[0031] Specifically, the laser beam generated and emitted by laser 10 is generally scattered, with lower energy at its edges compared to the center of the spot. The energy focusing module 20 gathers and focuses the edge rays of the laser beam emitted by laser 10, illuminating the worktable 30 and increasing the energy in the first and second edge regions of the spot formed by the laser beam on the worktable 30. For example, laser 10 may include, but is not limited to, a solid-state laser 10 or a gas laser 10. For example, the shape of the spot illuminating the worktable 30 is circular or elliptical. Because existing laser stripping equipment involves scanning the worktable 30 with a laser beam to carbonize the component 100 fixed on the worktable 30 before stripping it, the edge energy of the laser beam is relatively weak, resulting in insufficient laser energy received by the component 100 and affecting the stripping effect. Therefore, multiple scans are required, thus impacting production efficiency. The energy focusing module 20 enhances the energy of the laser beam in the first and second edge regions, ensuring sufficient laser energy for the component 100, improving the separation effect, reducing scanning steps, and increasing production efficiency. In addition, the drive mechanism 40 is connected to the worktable 30, which can drive the worktable 30 to move in two or more directions according to a preset program, ensuring that the laser beam can scan the entire surface of the worktable 30 along a predetermined path. For example, the drive mechanism 40 includes, but is not limited to, a motor drive mechanism 40 or a cylinder drive mechanism 40.

[0032] The technical solution provided in this embodiment generates and emits a laser beam through a laser 10, which is then transmitted to an energy focusing module 20. The energy focusing module 20 can adjust the energy distribution within the laser beam, concentrating and enhancing the energy of the laser beam in the first and second edge regions. When the laser beam irradiates the worktable 30 after passing through the energy focusing module 20, not only is the energy high in the central region of the beam spot, sufficient to separate the components 100 to be separated, but the energy in its edge regions is also high enough to enhance the irradiation effect on the components 100 to be separated, thus facilitating the overall separation of the components 100 to be separated. This configuration reduces the number of times the laser beam scans and irradiates the worktable 30, improving production efficiency and contributing to increased production capacity.

[0033] Figure 2 The diagram shown is a structural schematic of a separation device provided in another embodiment of this application. Figure 2 As shown, the energy focusing module 20 includes a convex lens 21 arranged along the transmission direction of the laser beam.

[0034] Specifically, the energy focusing module 20 can be configured as a convex lens 21 with its flat surface facing the laser 10 and its convex surface facing away from the laser 10. This allows the convex lens 21 to focus the laser beam when it passes through the laser beam, utilizing its refractive properties to concentrate the energy of the laser beam in both the first and second edge regions. Alternatively, special optical elements such as concave lenses, cylindrical mirrors, or aspherical mirrors can be used to focus and transmit the laser beam in a specific manner; even a lens group consisting of multiple lenses can be used.

[0035] In other embodiments, the energy focusing module 20 may also be a concave lens, cylindrical lens, aspherical lens, or lens group, as long as it can achieve edge energy focusing of the laser beam. This application does not impose specific limitations on this.

[0036] In this embodiment, the convex lens 21 can focus the energy of the laser beam in the preset first edge region and second edge region, thereby increasing the energy density of the first edge region and second edge region. This compensates for the potential energy deficiency in the first edge region and second edge region due to their distance from the center of the laser spot, enabling the laser beam to separate materials more effectively, thereby improving production efficiency and further enhancing production capacity.

[0037] In one embodiment, the energy of the laser beam in both the first and second edge regions is greater than that in the central region; optionally, the energy distribution of the laser beam in the central region is uniform; and / or, the energy of the laser beam irradiated by the laser 10 onto the energy focusing module 20 is attenuated at the edges.

[0038] Specifically, Figure 3 The diagram shown is an energy distribution schematic provided in an embodiment of this application. Figure 4 The diagram shown is a schematic representation of energy distribution according to another embodiment of this application. See also... Figure 3 The laser beam irradiated by laser 10 onto energy focusing module 20 has a Gaussian energy distribution, with strong energy in the center and weak energy at the edges. After passing through energy focusing module 20, the laser beam... (See...) Figure 4 The laser energy, originally located at the edge of the laser beam, is concentrated in the first and second edge regions, resulting in higher energy intensities in both regions compared to the central region, further increasing the edge energy density. Meanwhile, before and after passing through the energy focusing module 20, the laser energy distribution in the central region is uniform, without energy fluctuations.

[0039] In this embodiment, after optimizing the energy distribution of the laser beam through the energy focusing module 20, the energy of the laser beam in the first and second edge regions is increased, providing higher energy to the edge portions of the component 100 to be separated. This allows the edge portions of the component 100 to overcome adhesion forces more effectively under the action of the laser, achieving more thorough separation, reducing edge residue or incomplete separation, and improving the overall quality of the product. Simultaneously, it avoids excessively high energy at the center of the laser beam, preventing damage to the component 100 to be separated. The uniform energy distribution of the laser beam in the central region helps ensure stable processing of the central portion of the component 100 to be separated, avoiding inconsistent separation results in the central portion due to energy fluctuations, and ensuring the stability of the overall separation quality. This configuration further improves production efficiency.

[0040] Figure 5 The diagram shown is a structural schematic of a separation device provided in another embodiment of this application. Figure 5 As shown, the separation device also includes an optical path adjustment module 50, located on the side of the energy converging module 20 from which light is emitted, for adjusting the optical path of the laser beam; and a beam focusing module 60, located on the side of the optical path adjustment module 50 from which light is emitted, for focusing the laser beam onto the worktable 30; optionally, the laser beam is used to scan and irradiate the component 100 to be separated located on the worktable 30, the component 100 to be separated includes a substrate and a separation layer formed on the side of the substrate away from the laser 10; the component 100 to be separated includes a first end 101 and a second end 102 disposed opposite to each other along a first direction F1 parallel to the worktable 30, the component 100 to be separated includes a third end 103 and a fourth end 104 disposed opposite to each other along a second direction F2 parallel to the worktable 30, the first direction F1 and the second direction F2 intersect.

[0041] Specifically, the optical path adjustment module 50 is located on the side of the energy converging module 20 where the light is emitted, see [link / reference]. Figure 3 The optical path adjustment module 50 includes a first scanning mirror 51 and a second scanning mirror 52, used to adjust the propagation path of the laser beam. Specifically, the first scanning mirror 51 and the second scanning mirror 52 convert the laser beam into a moving scanning beam. Exemplarily, the optical path adjustment module 50 may include a galvanometer; the specific structure of the galvanometer can be found in existing technology. To further improve the separation effect, in this embodiment, the optical path adjustment module 50 (such as a high-speed galvanometer) can form a rectangular beam under high-speed movement. The beam focusing module 60 focuses the rectangular beam to form a linear beam that irradiates the surface of the component 100 to be separated on the worktable 30, thereby separating the component 100. Exemplarily, the beam focusing module 60 may include, but is not limited to, a flat-field focusing lens.

[0042] Exemplarily, the component to be separated 100 includes a substrate and a separation layer formed on the side of the substrate opposite to the laser 10. Exemplarily, the substrate material includes glass. The laser beam needs to penetrate the substrate to act on the separation layer to achieve the separation purpose. Meanwhile, the component to be separated 100 has a clear orientation mark on the stage 30, with a first end 101 and a second end 102 disposed opposite each other along a first direction F1 parallel to the stage 30, and a third end 103 and a fourth end 104 disposed opposite each other along a second direction F2 parallel to the stage 30, and the first direction F1 and the second direction F2 intersect. This arrangement helps to accurately determine the position and orientation of the component to be separated 100 during the operation of the separation equipment, thereby more accurately controlling the scanning path of the laser beam. The scanning process of the laser beam is based on the shape, size, and separation requirements of the component to be separated 100. The stage 30 is moved by the drive mechanism 40 so that the laser beam covers at least a portion of the surface of the component to be separated 100, ensuring energy input to the separation layer.

[0043] In this embodiment, by setting an optical path adjustment module 50 and a beam focusing module 60 between the energy converging module 20 and the component to be separated 100, the optical path adjustment module 50 can adjust the optical path of the laser beam, and together with the beam focusing module 60, focus the laser beam onto the component to be separated 100, so that the energy is concentrated on the separation layer, which greatly improves the accuracy of the separation operation. The beam focusing module 60 increases the energy density of the laser beam on the stage 30, so that the separation layer of the component to be separated 100 can receive enough energy to break its internal bonding force, thereby ensuring that the separation layer is completely peeled off from the substrate, which is conducive to improving production efficiency and increasing production capacity.

[0044] In one embodiment, the separation device further includes a removal module for separating the separation layer and the substrate after the laser beam scans and irradiates the component 100 to be separated; optionally, the removal module includes a cutter.

[0045] Specifically, after the laser beam completes the scanning irradiation of the component 100 to be separated, the removal module performs the separation operation between the separation layer and the substrate. Exemplarily, the removal module uses a cutter as its core execution component. The cutter's design is based on in-depth research into the interface characteristics between the separation layer and the substrate after laser action. For example, the cutter can have a sharp cutting edge shape to ensure smooth cutting into the weak area between the separation layer and the substrate. Furthermore, the cutter material can be a material with high hardness, strong wear resistance, and a certain degree of toughness, such as a special alloy or high-strength ceramic. Exemplarily, the initial position where the removal module cuts into the separation layer and the substrate corresponds to the area with higher laser beam energy intensity, i.e., the first edge region or the second edge region.

[0046] In this embodiment, by setting a removal module to separate the separation layer and the substrate after scanning and irradiating the component 100 to be separated, the separation layer is completely removed from the substrate. The cutter can accurately cut into the interface between the laser-treated separation layer and the substrate, and use mechanical cutting force to achieve separation of the two, ensuring product quality and consistency, and further improving product production efficiency.

[0047] Figure 6 The diagram shown is a schematic flowchart of a separation method provided in one embodiment of this application. This separation method is applicable to the separation equipment mentioned in any of the above embodiments. Figure 6 As shown, the method includes:

[0048] S110, The component to be separated is placed on the worktable. The component to be separated includes a substrate and a separation layer formed on one side of the substrate.

[0049] Specifically, before the separation process begins, the component 100 to be separated (including the substrate and the separation layer) is placed on the stage 30 in preparation for laser separation. For example, the component 100 to be separated is placed at the center of the upper surface of the stage 30.

[0050] S120 uses a laser to emit a laser beam.

[0051] Specifically, laser 10 is activated to emit a high-energy laser beam. As the energy source for the entire separation process, laser 10 emits a laser beam with high energy density and good directionality. The parameters of laser 10, such as wavelength, power, and pulse width, can be precisely adjusted according to factors such as the material of the component 100 to be separated and the bonding strength between the separation layer and the substrate, to meet different separation requirements.

[0052] S130 utilizes an energy focusing module to focus the energy of the laser beam in the first and second edge regions, respectively.

[0053] Specifically, the energy distribution of the laser beam is adjusted by the energy focusing module 20 (such as the convex lens 21), so that the energy of the laser beam is focused and enhanced in the first and second edge regions of the spot that illuminates the component to be separated 100.

[0054] S140 uses a drive mechanism to move the worktable.

[0055] Specifically, the drive mechanism 40 moves the worktable 30 according to a preset program, so that the laser beam can scan the component 100 to be separated along a specific path.

[0056] S150 uses a laser beam to scan and irradiate the component to be separated, so as to separate the separation layer and the substrate.

[0057] Specifically, a laser beam is used to scan the separation component 100 along a preset path, and the energy of the laser beam causes the separation layer to separate from the substrate.

[0058] The technical solution of this embodiment involves fixing the component to be separated on a worktable, emitting a laser beam, and using an energy focusing module to focus the energy of the laser beam in the first and second edge regions. A drive mechanism moves the worktable, and the laser beam scans and irradiates the component to be separated, ensuring separation of the separation layer from the substrate. When the laser beam irradiates the worktable after passing through the energy focusing module, not only is the central region of the laser spot high enough to separate the component, but the edge regions also have sufficiently high energy to enhance the irradiation effect, thus facilitating overall separation. This configuration reduces the number of times the laser beam scans the worktable, improving production efficiency and increasing production capacity.

[0059] Figure 7 The diagram shown is a schematic flowchart of a separation method provided in another embodiment of this application. This separation method is applicable to the separation equipment mentioned in any of the above embodiments. Figure 7 As shown, the components to be separated are scanned and irradiated using a laser beam, including:

[0060] S210, along the first direction, the laser beam scans from the first end of the component to be separated to the second end of the component to be separated; wherein the laser beam covers the third end 103 of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam.

[0061] Specifically, the laser beam starts from the first end 101 of the component to be separated 100 and scans for the first time along a first direction F1 parallel to the component to be separated 100 to the second end 102 of the component to be separated 100. It can be understood that, in another embodiment, the first scan of the laser beam may start from the second end 102 of the component to be separated 100 and scan along the opposite direction of the first direction F1 to the first end 101 of the component to be separated 100.

[0062] During the initial scan, the first edge region (or second edge region) of the laser beam covers the third end 103 of the component 100 to be separated, and the remaining region covers at least a portion of the surface of the component 100 to be separated facing the laser beam.

[0063] S220, along the first direction, a laser beam is used to scan and irradiate the second end of the component to be separated from the first end of the component to be separated to the second end of the component to be separated; wherein the laser beam covers the fourth end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam.

[0064] Specifically, after the first scan is completed, the laser beam starts again from the first end 101 and scans a second time along the first direction F1 to the second end 102. It can be understood that, in another embodiment, the second scan of the laser beam can start from the second end 102 of the component to be separated and scan in the opposite direction of the first direction F1 to the first end 101 of the component to be separated.

[0065] During the second scan, the second edge region (or the first edge region) of the laser beam covers the fourth end 104 of the component 100 to be separated, and the remaining region covers at least a portion of the surface of the component 100 facing the laser beam. The laser beam spot formed on the component 100 by the two scans completely covers the surface of the component 100 to be separated, meaning that the separation device can complete the scanning of the component 100 to be separated in at most two scans, so that the separation layer and the substrate are completely separated.

[0066] For example, Figure 8 The diagram shown is a top view of a component to be separated according to an embodiment of this application. See also... Figure 8 The maximum diameter d1 of the laser beam spot illuminating the worktable 30 is 750 mm. In the first direction F1, the width d2 of the component 100 to be separated is 925 mm. Exemplarily, along the direction of the maximum diameter of the laser beam, the width d3 of the first edge region is 100 mm, and the width d4 of the second edge region is 100 mm.

[0067] In this embodiment, a laser beam scans twice along a first direction from the first end of the component to be separated to the second end of the component to be separated. After two scans, the laser beam completely covers the surface of the component to be separated, achieving complete separation. Compared with existing technologies, this configuration reduces the number of times the laser beam scans the component to be separated, improving production efficiency and increasing production capacity.

[0068] Figure 9 The diagram shown is a schematic flowchart of a separation method provided in another embodiment of this application. This separation method is applicable to the separation equipment mentioned in any of the above embodiments. Figure 9 As shown, the components to be separated are scanned and irradiated using a laser beam, including:

[0069] S310, along the second direction, a laser beam is used to scan and irradiate from the third end of the component to be separated to the fourth end of the component to be separated for the first time; wherein the laser beam covers the first end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam.

[0070] Specifically, the laser beam starts from the third end 103 of the component 100 to be separated and scans for the first time along a second direction F2 parallel to the component 100 to be separated to the fourth end 104 of the component 100 to be separated. It can be understood that, in another embodiment, the first scan of the laser beam may start from the fourth end 104 of the component 100 to be separated and scan along the opposite direction of the second direction F2 to the third end 103 of the component 100 to be separated.

[0071] During the initial scan, the first edge region (or second edge region) of the laser beam covers the first end 101 of the component 100 to be separated, and the remaining region covers at least a portion of the surface of the component 100 facing the laser beam. During the scan, the laser 10 continuously emits a laser beam, while the drive mechanism 40 moves the stage 30 in the first direction F1 according to a preset speed and path.

[0072] S320, along the second direction, a laser beam is used to scan and irradiate the fourth end of the component to be separated from the third end of the component to be separated in a second scan; wherein the laser beam covers the second end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam.

[0073] Specifically, after the first scan is completed, the laser beam starts again from the third end 103 and scans a second time along the second direction F2 to the fourth end 104. It can be understood that, in another embodiment, the second scan of the laser beam can start from the fourth end 104 of the component to be separated 100 and scan along the opposite direction of the second direction F2 to the third end 103 of the component to be separated 100.

[0074] During the second scan, the second edge region (or the first edge region) of the laser beam covers the second end 102 of the component 100 to be separated, and the remaining region covers at least a portion of the surface of the component 100 facing the laser beam. The laser beam spots formed on the component 100 by the two scans completely cover the surface of the component 100, meaning the separation device can complete the scan of the component 100 to be separated in at most two scans, thus ensuring complete separation of the separation layer and the substrate. For example, Figure 10 The diagram shown is a top view of the component to be separated according to another embodiment of this application. See also... Figure 10 In the second direction F2, the width d5 ​​of the component to be separated 100 is 1500mm.

[0075] In this embodiment, the laser beam scans twice along the second direction from the third end of the component to be separated to the fourth end of the component. After two scans, the laser beam completely covers the surface of the component, achieving complete separation. Compared with existing technologies, this configuration reduces the number of times the laser beam scans the component, improving production efficiency and increasing production capacity.

[0076] Figure 11 The diagram shown is a schematic flowchart of a separation method provided in another embodiment of this application. This separation method is applicable to the separation equipment mentioned in any of the above embodiments. Figure 11 As shown, after the step of using a laser beam to perform a second scan along the first direction from the first end of the component to be separated to the second end of the component 100, the method further includes:

[0077] S410, the removal module is cut from the third end of the component to be separated between the substrate and the separation layer.

[0078] Specifically, after the laser beam completes a second scan irradiation along the first direction F1, a removal module (such as a cutter) is used to cut between the substrate and the separation layer from the third end 103 of the component to be separated (i.e. the part of the component to be separated 100 that was scanned and irradiated by the first edge region of the laser beam).

[0079] S420, the removal module is moved along the second direction to the fourth end of the component to be separated, separating the separation layer and the substrate.

[0080] Specifically, after the removal module successfully cuts in, it is moved along the second direction F2 until it reaches the fourth end 104 of the component to be separated 100. During the movement of the removal module, it completely separates the separation layer from the substrate, completing the final separation process.

[0081] In this embodiment, the removal module is inserted between the substrate and the separation layer from the third end of the component to be separated. The third end is scanned and irradiated by the first edge region of the laser beam, receiving higher laser energy, which facilitates the insertion of the removal module. By moving the removal module along the second direction to the fourth end of the component to be separated, the separation layer and the substrate are completely separated. This configuration facilitates complete separation of the separation layer and the substrate, thus improving product yield.

[0082] Figure 12 The diagram shown is a schematic flowchart of a separation method provided in another embodiment of this application. This separation method is applicable to the separation equipment mentioned in any of the above embodiments. Figure 12 As shown, after the step of using a laser beam to perform a second scan from the third end of the component to be separated to the fourth end of the component along the second direction, the method further includes:

[0083] S510, the removal module is cut from the first end of the component to be separated between the substrate and the separation layer.

[0084] Specifically, after the laser beam completes the second scan, the laser scan has applied energy to the surface of the component to be separated 100, disrupting the bonding force between the substrate and the separation layer. The removal module is then inserted between the substrate and the separation layer from the first end 101 of the component to be separated 100 (i.e., the portion of the component to be separated 100 that is scanned by the second edge region of the laser beam).

[0085] S520, the removal module is moved along the first direction to the second end of the component to be separated, and the separation layer and the substrate are separated.

[0086] Specifically, after the removal module successfully cuts in, it is moved along the first direction F1 until it reaches the second end 102 of the component to be separated 100. During the movement, the removal module continuously applies a separation force to the interface between the substrate and the separation layer, just as a cutter uses the cutting force of its blade to separate the two when it moves, completely separating the separation layer from the substrate.

[0087] In this embodiment, the removal module is inserted between the substrate and the separation layer from the first end of the component to be separated. The first end is scanned and irradiated by the second edge region of the laser beam, receiving higher laser energy, which facilitates the insertion of the removal module and avoids uneven or incomplete separation due to initial position deviation. By moving the removal module along the first direction to the second end of the component to be separated, the separation layer and the substrate are completely separated. This configuration facilitates complete separation of the separation layer and the substrate, thus improving product yield.

[0088] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this application can be achieved, and this is not limited herein.

[0089] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A separation device, characterized in that, include: A laser for emitting a laser beam; An energy focusing module is located on the side where the laser emits light; The workbench is located on the side where the energy converging module emits light; and A drive mechanism, connected to the worktable, is used to drive the worktable to move so that the laser beam scans and irradiates the worktable; The laser beam shines on the worktable through the energy focusing module. The spot of the laser beam on the worktable includes a central region and a first edge region and a second edge region symmetrically distributed on both sides of the central region. The first edge region, the central region and the second edge region are arranged in sequence in the direction of the maximum diameter of the spot of the laser beam on the worktable. The energy focusing module is used to focus the energy of the laser beam in the first edge region and the second edge region respectively.

2. The separation device according to claim 1, characterized in that, The energy focusing module includes a convex lens positioned along the transmission direction of the laser beam.

3. The separation device according to claim 1, characterized in that, The energy of the laser beam in both the first edge region and the second edge region is greater than the energy in the central region; Preferably, the laser beam has a uniform energy distribution in the central region; And / or, the energy of the laser beam irradiated by the laser onto the energy focusing module attenuates at the edges.

4. The separation device according to claim 1, characterized in that, Also includes: An optical path adjustment module, located on the side of the energy focusing module from which the light is emitted, is used to adjust the optical path of the laser beam; and A beam focusing module, located on the side of the light output of the optical path adjustment module, is used to focus the laser beam onto the worktable; Preferably, the laser beam is used to scan and irradiate the component to be separated located on the worktable. The component to be separated includes a substrate and a separation layer formed on the side of the substrate opposite to the laser. The component to be separated includes a first end and a second end disposed opposite to each other along a first direction parallel to the worktable. The component to be separated includes a third end and a fourth end disposed opposite to each other along a second direction parallel to the worktable. The first direction and the second direction intersect.

5. The separation device according to claim 4, characterized in that, It also includes a removal module, which is used to separate the separation layer and the substrate after the laser beam scans and irradiates the component to be separated; Preferably, the removal module includes a cutter.

6. A separation method, characterized in that, The method, applicable to the separation apparatus according to any one of claims 1 to 5, comprises: A component to be separated is placed on the worktable. The component to be separated includes a substrate and a separation layer formed on one side of the substrate. The laser beam is emitted using the laser; The energy focusing module is used to focus the energy of the laser beam in the first edge region and the second edge region, respectively. The worktable is moved by the drive mechanism. The laser beam is used to scan and irradiate the component to be separated, so as to separate the separation layer and the substrate.

7. The separation method according to claim 6, characterized in that, The component to be separated includes a first end and a second end disposed opposite to each other along a first direction parallel to the worktable, and a third end and a fourth end disposed opposite to each other along a second direction parallel to the worktable. The first direction and the second direction intersect. The step of scanning and irradiating the component to be separated using the laser beam includes: Along the first direction, the laser beam first scans and illuminates the second end of the component to be separated from the first end of the component to be separated; wherein the laser beam covers the third end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam; Along the first direction, the laser beam is used to irradiate the second end of the component to be separated from the first end of the component to be separated in a second scan; wherein the laser beam covers the fourth end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam.

8. The separation method according to claim 6, characterized in that, The component to be separated includes a first end and a second end disposed opposite to each other along a first direction parallel to the worktable, and a third end and a fourth end disposed opposite to each other along a second direction parallel to the worktable. The first direction and the second direction intersect. The step of scanning and irradiating the component to be separated using the laser beam includes: Along the second direction, the laser beam is used to first scan and irradiate from the third end of the component to be separated to the fourth end of the component to be separated; wherein the laser beam covers the first end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam; Along the second direction, the laser beam is used to irradiate the fourth end of the component to be separated from the third end of the component to be separated in a second scan; wherein the laser beam covers the second end of the component to be separated and at least a portion of the surface of the component to be separated facing the laser beam.

9. The separation method according to claim 7, characterized in that, The separation device further includes a removal module. After the step of using the laser beam to perform a secondary scan along the first direction from the first end of the component to be separated to the second end of the component to be separated, the method further includes: The removal module is cut into the space between the substrate and the separation layer from the third end of the component to be separated; The removal module is moved along the second direction to the fourth end of the component to be separated, thereby separating the separation layer from the substrate.

10. The separation method according to claim 8, characterized in that, The separation device further includes a removal module. After the step of using the laser beam to perform a secondary scan along the second direction from the third end of the component to be separated to the fourth end of the component to be separated, the method further includes: The removal module is cut from the first end of the component to be separated between the substrate and the separation layer; The removal module is moved along the first direction to the second end of the component to be separated, thereby separating the separation layer and the substrate.

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