Pressing device for attaching a focus ring to an electrostatic chuck

Abstract

The present invention is a device for forming an internal vacuum by combining on the upper side of a chamber of a semiconductor device and attaching a focusing ring to an electrostatic chuck, and more particularly, the present invention is characterized by including: a press cover (100, 200) combined on the upper portion of the chamber for sealing the inside of the chamber; a press cylinder (220) located at the center of the press cover; a plurality of press rods (230) provided at the lower portion inside the chamber and at the upper portion outside the chamber, moved in the up-and-down direction by the press cylinder being pressurized; a press ring (240) in the shape of a ring attached to the lower end of the press rod, moved in the up-and-down direction by the press rod and pressurizing the upper portion of the focusing ring; and an exhaust portion located on the upper surface of the press cover for releasing the internal vacuum of the chamber, the press ring pressurizing the upper surface of the focusing ring with a force of a prescribed size in a state in which the internal vacuum of the chamber is formed.

Description

Technical Field

[0001] This invention relates to a pressing apparatus for attaching a focusing ring with a cooling pad attached to one side to an electrostatic chuck under vacuum conditions, belonging to a type of semiconductor equipment for manufacturing semiconductor devices. Specifically, it relates to a pressing apparatus for attaching the focusing ring with the cooling pad attached to one side facing down to an electrostatic chuck, the attachment process being performed under vacuum conditions. Background Technology

[0002] Typically, in semiconductor manufacturing processes, semiconductor wafers undergo film deposition processes such as exposure, chemical vapor deposition (CVD), and sputtering, or micromachining, etching, and dicing. All of these processes require holding devices to fix and hold the semiconductor wafers in designated locations on the processing equipment. In particular, in order to form fine patterns on semiconductor wafers to create integrated circuits that form multiple semiconductor devices, the semiconductor wafers must be reliably held on a flat surface.

[0003] Electrostatic chucks (ESCs) are used to hold semiconductor wafers and other substrates in various types of process equipment, including plasma process chambers. ESCs typically include one or more conductive electrodes beneath a dielectric (insulating) or semiconductor ceramic layer, through which an electrostatic clamping field is applied. Unlike mechanical clamping devices, ESCs expose the entire surface of the substrate to plasma.

[0004] On the other hand, manufacturing semiconductor devices requires various processes such as chemical mechanical polishing (CMP) or etching, each using its own dedicated CMP or etching equipment. Furthermore, these CMP or etching equipment may be equipped with a focusing ring, and to improve cooling, a cooling pad is attached to one side of the focusing ring; this cooling pad needs to be replaced periodically.

[0005] The present invention particularly relates to a technique for attaching a focusing ring of an etching process apparatus installed in a semiconductor device to an electrostatic chuck, wherein the apparatus is a device for attaching the focusing ring to the electrostatic chuck with a cooling plate attached to one side of the focusing ring.

[0006] The focusing ring attachment process of existing methods is as follows: Figure 1 and Figure 2 As shown.

[0007] Reference Figure 1 and Figure 2In the prior art, an electrostatic chuck 20 (ESC) is built into the cavity 10 that constitutes the outer casing. The cavity 10 is under normal pressure, and the ESC is located inside it, with a cooling fin 40 attached to the underside of the focusing ring 30. With the cooling fin 40 attached, the focusing ring 30 is placed on the ESC 20. Furthermore, an attachment fixture 50 is provided on the ESC, and a weight fixture 60 is placed on the attachment fixture 50, applying a load downwards for a predetermined time. Figure 1 ).

[0008] After applying a load to the weight fixture, the weight fixture and attachment fixture are removed after a specified necessary time. Furthermore, a vacuum cover 70 is installed on the chamber to maintain a vacuum inside the chamber for a specified time. Figure 2 ).

[0009] After removing the vacuum cover, the interior of the chamber is converted to atmospheric pressure. The attachment status of the focusing ring and cooling plate is checked by visual inspection. If air bubbles are observed on the attachment surface of the patch, the above attachment process is repeated (setting attachment fixtures and weight fixtures, etc.).

[0010] The existing technology described above has the following problems.

[0011] First, the load required during the focusing ring attachment process is applied by pressing with a fixture, which causes a deviation in the load applied to the focusing ring. In order to increase the load, new weight fixtures need to be stacked, which is very inconvenient to operate.

[0012] Furthermore, if problems such as air bubbles are found during visual inspection, the fixture needs to be repeatedly disassembled and reassembled, which increases the time required and reduces work efficiency.

[0013] Furthermore, in the existing operation, as the initial stage of focusing ring attachment is carried out under normal pressure, the problem of a large number of residual bubbles in the cooling plate is difficult to solve.

[0014] Existing technical documents

[0015] Patent documents

[0016] Korean Patent No. 10-2644272: Electrostatic chuck assembly and semiconductor manufacturing apparatus having the same Summary of the Invention

[0017] The object of this invention is to provide a technique that makes attaching a focusing ring to an electrostatic chuck easier and prevents air bubbles from forming on the attachment surface of the cooling fin, thereby improving the attachment quality. Specifically, the object of this invention is to provide a technique that not only minimizes the time and cost required for focusing ring attachment but also improves the attachment quality of the focusing ring and allows for easy replacement and applicability to focusing rings of different specifications.

[0018] This invention relates to a pressing device that creates an internal vacuum by attaching a focusing ring to an electrostatic chuck under vacuum conditions. More specifically, the invention is characterized by comprising: pressing covers 100 and 200, attached to the upper part of the cavity for sealing the interior of the cavity; a pressing cylinder 220 located at the center of the pressing cover; a plurality of pressure rods 230, with their lower parts disposed inside the cavity and their upper parts disposed outside the cavity, moving vertically by pressure applied by the pressing cylinder; a pressure ring 240, annular in shape, attached to the lower end of the pressure rods, moving vertically by the pressure rods and applying pressure to the upper part of the focusing ring; and an exhaust section located on the upper surface of the pressing cover, injecting air into the cavity to release the internal vacuum. Under the vacuum conditions created inside the cavity, the pressure ring applies pressure to the upper surface of the focusing ring with a predetermined force.

[0019] The press-fit cover can be integrally formed from a single component or from two separable components. That is, the press-fit cover may include: a first press-fit cover 100, which is directly attached to the upper part of the chamber; and a second press-fit cover 200, which is fastened to a fastening hole 110 formed vertically through the center of the first press-fit cover.

[0020] The pressing cylinder 220 is located on the upper center of the second pressing cover, and the pressure rod 230 passes through the second pressing cover and is set vertically.

[0021] The invention also includes: a cylinder rod 222, located above the pressing cylinder 220, which moves vertically via the pressing cylinder; and a radial plate 224, which is radially arranged and attached to the upper end of the cylinder rod, moving vertically together with the cylinder rod. The outer periphery of the radial plate is connected to the upper end of the pressure rod. The force of the pressing cylinder is transmitted to the pressure rod. A connecting component 150 is provided around the fastening hole 110. The connecting component 150 connects the first pressing cover and the second pressing cover by pressing the outer periphery of the second pressing cover.

[0022] The present invention includes: a first handle 170 formed on the upper surface of the first pressing cover 100; and a second handle 270 formed on the upper surface of the second pressing cover 200, wherein the first pressing cover and the second pressing cover are separable and coupled to the upper side of the chamber.

[0023] The present invention may also include a movable body 300, which has a receiving groove formed on the upper part for accommodating the press-fit cover, wheels provided on the lower part for movement, and a vacuum unit for applying vacuum pressure to the chamber inside, so as to improve the ease of movement and use.

[0024] The present invention, through the aforementioned structure, not only allows for easy attachment of the focusing ring to the electrostatic chuck, but also improves the attachment quality of the focusing ring and enables it to be applied to focusing rings of different sizes. Attached Figure Description

[0025] Figure 1 and Figure 2 This illustrates the process of attaching a focusing ring to an electrostatic chuck in the prior art.

[0026] Figure 3 This is an overall view of the device for attaching a focusing ring to an electrostatic chuck according to the present invention.

[0027] Figure 4 This diagram shows the separation of the pressing cover, which is the upper structure, and the moving body, which is the lower structure, in the device of the present invention.

[0028] Figure 5 This is an example diagram of a focusing ring attached to an electrostatic chuck by the device of the present invention.

[0029] Figure 6 A diagram showing the press-fit cover that constitutes the upper structure of the device of the present invention.

[0030] Figure 7 for Figure 6 The diagram shows the press-fit cap separated into a first press-fit cap and a second press-fit cap.

[0031] Figure 8 This is a perspective view of the bottom surface of the first pressing cover of the present invention.

[0032] Figure 9 A cross-sectional view showing the state in which the focusing ring of the press-fit cap of the present invention is attached inside the chamber.

[0033] Figure 10 To show only Figure 7 A cross-sectional view of the press-fit cap of the present invention.

[0034] Figure 11 To show Figure 7 A diagram showing the working state of the pressure cap inside the chamber for attaching the focusing ring. Detailed Implementation

[0035] The objectives, specific advantages, and novel features of this invention will become clearer with reference to the preferred embodiments described in detail with reference to the accompanying drawings. Furthermore, the terminology used is defined in consideration of the functional definition of this invention, which may vary depending on the intent or convention of the user or operator. Therefore, such terminology should be defined based on the entire contents of this specification.

[0036] Furthermore, when describing the structural elements of the present invention, different reference numerals may be assigned to structural elements with the same name according to the accompanying drawings, and the same reference numerals may be assigned even in different drawings. However, this does not mean that the corresponding structural elements have different functions according to the embodiments or have the same function in different embodiments. The function of each structural element should be determined based on the description related to the respective structural elements in the corresponding embodiments.

[0037] Furthermore, unless otherwise defined in this specification, the technical terms used herein should be interpreted as meaning commonly understood by one of ordinary skill in the art to which this invention pertains, and should not be construed as having an excessively broad or excessively narrow meaning. Also, in this specification, unless the context otherwise requires, singular expressions include plural expressions.

[0038] Figure 3 This is an overall view of the device for attaching a focusing ring to an electrostatic chuck according to the present invention. Figure 4 This diagram shows the separation of the pressing cover, which is the upper structure, and the moving body, which is the lower structure, in the device of the present invention. Figure 5 This is an example diagram of a focusing ring attached to an electrostatic chuck using the device of the present invention. Figure 6 A diagram showing the pressing cover that constitutes the upper structure of the device of the present invention. Figure 7 for Figure 6 The diagram shown illustrates the separation of the press-fit cap into a first press-fit cap and a second press-fit cap. Figure 8 This is a perspective view of the bottom surface of the first pressing cover of the present invention. Figure 9 A cross-sectional view showing the state in which the focusing ring is attached to the press-fit cap inside the chamber according to the present invention. Figure 10 To show only Figure 7 A cross-sectional view of the press-fit cap of the present invention. Figure 11 To show Figure 7 A diagram showing the working state of the pressure cap inside the chamber for attaching the focusing ring.

[0039] The present invention will now be described in detail with reference to the accompanying drawings.

[0040] First, such as Figure 3 and Figure 4 As shown, the overall structure of the device of the present invention includes: pressing covers 100 and 200, installed in the semiconductor device chamber for pressurizing the focusing ring and attaching it to the electrostatic chuck; and a movable body 300, which can accommodate the pressing covers from above and move them. A receiving groove 350 is provided on the upper side of the movable body, and the pressing covers are placed in the receiving groove. The movable body is provided with wheels at the bottom for movement, and internally accommodates tools required for installing the focusing ring, such as power devices.

[0041] When a semiconductor device has an internal electrostatic chuck and a focusing ring needs to be installed on the upper side of the electrostatic chuck, the user can push a movable body to the vicinity of the semiconductor device. Furthermore, the user can detach the pressing cover from the upper part of the movable body, lift it, and move it to the upper side of the semiconductor device for installation. After creating a vacuum inside the semiconductor device, the following operations can be performed. Creating a vacuum inside the semiconductor device is done using a vacuum pump inherent in the semiconductor device itself.

[0042] Since the core structure of this invention lies in the pressing covers 100 and 200, the following description will mainly focus on the structure of the pressing covers. The pressing covers can be integrally formed from a single component, or they can be composed of two separable components. That is, the pressing covers may include: a first pressing cover 100, directly attached to the upper part of the chamber; and a second pressing cover 200, fastened to a fastening hole 110 formed vertically through the center of the first pressing cover. The following description will use a separable structure as an example.

[0043] The press-fit caps 100 and 200 of the present invention are coupled to a semiconductor device ( Figure 9 On the upper side of the semiconductor device 400, the internal chamber S of the semiconductor device 400 can be sealed to create a vacuum state inside. The vacuum pressure required to create the vacuum can be achieved using a vacuum pump provided with the semiconductor device.

[0044] A pressing cylinder 220 is disposed at the center of the pressing cover of the present invention, and a pressure rod 230 for pressurizing the focusing ring is located at this position as the pressing cylinder moves. The pressure rod 230, as a component that penetrates the pressing cover vertically and moves vertically, has its lower part disposed inside the chamber S and its upper part disposed outside the chamber. Multiple pressure rods are arranged radially and move downwards under the pressure of the pressing cylinder, applying appropriate force to the focusing ring. For this purpose, an annular pressure ring 240 is disposed at the lower end of the pressure rod. The pressure ring moves downwards via the pressure rod, directly pressurizing the upper part of the focusing ring. Furthermore, an exhaust section is disposed on the upper surface of the pressing cover to inject external air during the process of releasing the internal vacuum of the chamber. That is, after attaching the focusing ring while the chamber is under vacuum, air is injected into the chamber through the exhaust section during the process of restoring the chamber to normal pressure. In this invention, the exhaust section is located on the upper side of the chamber. This is to allow externally injected air to be supplied from the upper side, thereby minimizing the airflow inside the chamber and preventing the flow of dust.

[0045] exist Figure 5 The image exemplarily illustrates a focusing ring 420 and a cooling plate 430 attached to the upper surface of an electrostatic chuck using the apparatus of the present invention. Figure 5 Part (a) shows the state where the focusing ring 420 is separated from the cooling plate 430. Figure 5 Part (b) shows the state in which the focusing ring 420 and the cooling plate 430 are attached. The device of the present invention is to... Figure 5 The device in part (b) of which the focusing ring with a cooling plate is attached to an electrostatic chuck has a cooling plate mounted on its lower part, and a suitable adhesive may be applied to the lower surface of the cooling plate.

[0046] Reference Figure 6 and Figure 7 As an example of the present invention, the pressing cover is shown to have a structure consisting of a first pressing cover 100 and a second pressing cover 200. Furthermore, a pressing cylinder 220 is disposed on the upper center side of the second pressing cover for applying pressing force. The power required for pressing is supplied by a power source (electricity, etc.) disposed inside the movable body 300. To receive this power, the pressing cover and the movable body can be interconnected via a cable, etc. This connection device is omitted in the figures for ease of explanation.

[0047] Furthermore, the pressure rod 230 passes through the second pressing cover and is vertically arranged, receiving the force of the pressing cylinder 220 and moving up and down. In this invention, in order to enable multiple pressure rods 230 to move up and down simultaneously, cylinder rod 222 and radiation plate 224 are used.

[0048] The cylinder rod 222 is located above the pressing cylinder 220. It is subjected to force by the pressing cylinder and moves vertically. The center of the radial plate 224 is connected to the cylinder rod, and it has radially arranged peripheral plates that are attached to the upper end of the cylinder rod and move vertically together with the cylinder rod. In addition, the peripheral part of the radial plate is connected to the upper end of the pressure rod. The force of the pressing cylinder is transmitted to the pressure rod, causing the pressure rod to move vertically. Finally, the pressure ring 240 attached to the lower end of the pressure rod presses the upper part of the focusing ring, causing it to attach to the electrostatic chuck.

[0049] Furthermore, the present invention provides a connecting component 150 for connecting the first pressing cover and the second pressing cover together. The connecting component 150 is disposed around the fastening hole 110, and the first pressing cover and the second pressing cover are firmly connected by pressing the outer periphery of the second pressing cover.

[0050] Furthermore, the present invention includes a first handle 170 and a second handle 270. The first handle 170 is formed on the upper surface of the first pressing cover 100, and the second handle 270 is formed on the upper surface of the second pressing cover 200. The first pressing cover and the second pressing cover are separable and attached to the upper side of the chamber. When the user finds that the overall load of the first pressing cover and the second pressing cover placed on the moving body 300 is too heavy, they can be carried separately in their separated state, which is more convenient. That is, when it is difficult to install the entire first pressing cover and the second pressing cover at once when it is necessary to attach the focusing ring to the device, they can be separated and carried one by one for installation. Moreover, by adopting a structure in which the pressing cover can be separated into a first pressing cover and a second pressing cover, even if it is necessary to change the structure and size according to the specifications of the semiconductor device, only the size and structure of either the first pressing cover or the second pressing cover need to be improved to continue using it, thus having the advantage of being flexible and applicable to focusing rings of different sizes.

[0051] Figure 11 Show Figure 7 The pressure cap inside the chamber is in operation to attach the focusing ring, showing the process of the pressure ring 240 moving downward a predetermined distance d and pressurizing the upper part of the focusing ring.

[0052] The device of the present invention, through the aforementioned structure, can easily attach the focusing ring to the electrostatic chuck. Since the focusing ring is attached to the electrostatic chuck in a vacuum state, it has the advantage of preventing air bubbles from forming on the surface of the cooling plate, thereby improving the attachment quality.

[0053] While the preferred embodiments of the present invention have been described in detail above, the scope of protection of the claims of the present invention is not limited thereto. Various modifications and improvements made by those skilled in the art using the basic concepts of the present invention as defined in the appended claims also fall within the scope of protection of the claims of the present invention.

Claims

1. An apparatus for attaching a focusing ring to an electrostatic chuck, belonging to a pressing apparatus that attaches the focusing ring to the electrostatic chuck under vacuum by creating an internal vacuum on the upper side of a chamber of a semiconductor device, characterized in that... include: A pressure cap (100, 200) is attached to the upper part of the chamber to seal the interior of the chamber; A pressing cylinder (220) is located at the center of the pressing cover; Multiple pressure rods (230), with their lower parts disposed inside the chamber and their upper parts disposed outside the chamber, move vertically by being pressurized by the pressing cylinder; and A pressure ring (240), which is annular in shape, is attached to the lower end of the pressure rod. The pressure rod moves vertically and applies pressure to the upper part of the focusing ring. With a vacuum created inside the chamber, the pressure ring applies pressure to the upper surface of the focusing ring with a specified force, causing it to adhere to the electrostatic chuck. The device for attaching the focusing ring to the electrostatic chuck further includes an exhaust section located on the upper surface of the pressing cover, for injecting air into the interior of the chamber after the focusing ring is attached to release the internal vacuum of the chamber.

2. The apparatus for attaching a focusing ring to an electrostatic chuck according to claim 1, characterized in that, The press-fit cap includes: The first press-fit cap (100) is directly attached to the upper part of the chamber; and The second press-fit cover (200) is fastened to the fastening hole (110) formed vertically through the center of the first press-fit cover. The pressing cylinder (220) is located on the upper center side of the second pressing cover. The pressure rod (230) passes through the second pressing cover and is set vertically.

3. The apparatus for attaching a focusing ring to an electrostatic chuck according to claim 2, characterized in that, include: The cylinder rod (222), located above the pressing cylinder (220), moves vertically via the pressing cylinder; and The radial plate (224), in a radial shape, is attached to the upper end of the cylinder rod and moves together with the cylinder rod in the vertical direction. The outer periphery of the radiation plate is connected to the upper end of the pressure rod, and the force of the pressing cylinder is simultaneously transmitted to the multiple pressure rods.

4. The apparatus for attaching a focusing ring to an electrostatic chuck according to claim 2, characterized in that, It also includes a connecting component (150) disposed around the fastening hole (110) to connect the first pressing cover and the second pressing cover by pressing the outer periphery of the second pressing cover.

5. The apparatus for attaching a focusing ring to an electrostatic chuck according to claim 4, characterized in that, include: A first handle (170) is formed on the upper surface of the first press-fit cap (100); and The second handle (270) is formed on the upper surface of the second press-fit cover (200). The first and second press-fit caps are separable and can be attached to the upper side of the chamber.

6. The apparatus for attaching a focusing ring to an electrostatic chuck according to claim 1 or 2, characterized in that, It also includes a movable body (300) having a receiving groove formed on the upper part for accommodating the press-fit cover, wheels provided on the lower part for movement, and a vacuum unit housed inside for applying vacuum pressure to the chamber.

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