Grinding device and grinding method

Abstract

The application discloses a grinding device and a grinding method. The grinding device comprises a shell provided with a grinding cavity and an opening communicating with the grinding cavity; a grinding wheel rotatably arranged in the grinding cavity, an outer circumferential surface of the grinding wheel being provided with a grinding groove surrounding the grinding wheel, the grinding groove being exposed from the opening, and the grinding wheel grinding a substrate by using the grinding groove when an edge of the substrate enters the grinding cavity from the opening and the grinding wheel rotates; a driving member connected with the grinding wheel and used for driving the grinding wheel to rotate; a water spraying mechanism arranged in the grinding cavity and located at the opening, and the water spraying mechanism being located at the periphery of the grinding wheel; a liquid discharging device communicating with the grinding cavity and used for discharging waste water in the grinding cavity during grinding of the grinding device; and a negative pressure device communicating with the liquid discharging device and used for generating negative pressure in the liquid discharging device, so that the waste water in the grinding cavity flows to the liquid discharging device and is discharged from the liquid discharging device. In the above manner, the application can timely discharge the waste water generated during grinding of the substrate.

Description

Technical Field

[0001] This application relates to the field of grinding equipment technology, and in particular to a grinding apparatus and grinding method. Background Technology

[0002] During substrate processing, the edges of the substrate need to be ground using a water-cooling method. This grinding process generates wastewater containing dust, and the large amount of wastewater flowing on the substrate surface affects subsequent cleaning processes and the overall particle level of the substrate surface. Therefore, effectively controlling wastewater flow and reducing wastewater pollution has become a key issue in improving substrate processing efficiency and quality. Summary of the Invention

[0003] The main technical problem this application addresses is to provide a grinding apparatus and grinding method that can promptly discharge wastewater generated during the grinding of the substrate.

[0004] To solve the above-mentioned technical problems, this application adopts the following technical solution: A grinding device is provided, comprising: a housing having a grinding chamber and an opening communicating with the grinding chamber; a grinding wheel rotatably disposed in the grinding chamber, the outer circumferential surface of the grinding wheel having a grinding groove surrounding the grinding wheel, the grinding groove being exposed from the opening; when the edge of the substrate enters the grinding chamber through the opening, the grinding wheel grinds the substrate using the grinding groove as the grinding wheel rotates; a driving member connected to the grinding wheel for driving the grinding wheel to rotate; a water spraying mechanism disposed in the grinding chamber and located at the opening, and simultaneously located around the grinding wheel for spraying water during the grinding process; a draining device communicating with the grinding chamber for draining wastewater from the grinding chamber during the grinding process; and a negative pressure device communicating with the draining device for generating negative pressure in the draining device to cause the wastewater in the grinding chamber to flow to and be discharged from the draining device.

[0005] The drainage device includes: a water tank, the top of which is connected to the grinding chamber via a first pipe, and a negative pressure device connected to the water tank to generate negative pressure in the water tank, thereby causing the wastewater in the grinding chamber to flow to the water tank; and a diaphragm pump, which is connected to the bottom of the water tank via a second pipe, wherein the wastewater entering the water tank is discharged sequentially through the second pipe and the diaphragm pump.

[0006] The water tank is equipped with a partition that divides the space in the water tank into a first space and a second space in the horizontal direction. The top of the first space and the second space are connected. The negative pressure device is directly connected to the first space, and the first pipe is directly connected to the second space.

[0007] The negative pressure device includes a fan.

[0008] The water spraying mechanism includes multiple nozzles, which are arranged around the circumference of the grinding wheel.

[0009] The plurality of nozzles includes a first nozzle and a second nozzle, wherein the distance between the second nozzle and the center of the opening is greater than the distance between the first nozzle and the center of the opening, and wherein the orifice diameter of the second nozzle is smaller than the orifice diameter of the first nozzle; preferably, the orifice diameter of the nozzles ranges from 1.0 mm to 2.0 mm; preferably, the first nozzle is located at the center of the opening, and the orifice diameter of the first nozzle ranges from 1.5 mm to 2.0 mm, and the orifice diameter of the second nozzle ranges from 1.0 mm to 1.4 mm; preferably, the greater the distance from the center of the opening, the smaller the orifice diameter of the nozzle.

[0010] When the negative pressure device is not turned on, the water outlet direction of the nozzle is perpendicular to the grinding wheel. After the negative pressure device is turned on, under the action of negative pressure, the water sprayed from the nozzle is directed toward the grinding wheel, and the direction of the water sprayed from the nozzle forms an angle with the grinding wheel, the angle ranging from 30° to 60°.

[0011] There are two water spraying mechanisms, which are spaced apart, and the substrate entering the grinding chamber is located between the two water spraying mechanisms.

[0012] The grinding device further includes a first baffle and a second baffle, which are disposed at the opening. The first baffle and the second baffle are opposite to each other and spaced apart to form a channel for inserting the substrate into the grinding chamber. The first baffle and the second baffle are used to prevent wastewater in the grinding chamber from flowing to the outside from the opening.

[0013] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a grinding method, wherein the method is applied to the grinding apparatus as described in any of the above claims, the method comprising: feeding the edge of the substrate into the grinding chamber through the opening; controlling the rotation of the grinding wheel and controlling the water spraying mechanism to spray water; and activating the negative pressure device to discharge wastewater in the grinding chamber through the drainage device.

[0014] The beneficial effects of this application are as follows: Unlike the prior art, the grinding device in this application has a grinding chamber in its housing. The grinding wheel located in the grinding chamber grinds the substrate through the grinding groove. The water spraying mechanism is located around the grinding wheel and sprays water onto the substrate surface. The grinding chamber is connected to the draining device, which is connected to the negative pressure device. The negative pressure device makes the pressure inside the grinding chamber lower than the pressure outside the grinding chamber. On the one hand, it makes the water jet sprayed by the water spraying mechanism face the substrate, which facilitates the cooling of the substrate and improves the cooling effect, thereby improving the grinding effect of the substrate. At the same time, it reduces the direct friction between the grinding wheel and the substrate, increases the service life of the grinding wheel, and thus increases the service life of the grinding device. On the other hand, it draws the wastewater generated from grinding the substrate into the draining device, avoiding wastewater contamination of the grinding chamber and the substrate, improving the product yield, and avoiding environmental pollution. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0016] Figure 1 This is a schematic diagram of one embodiment of the grinding apparatus of this application;

[0017] Figure 2 This is a flowchart illustrating one embodiment of the grinding method of this application;

[0018] Figure 3 yes Figure 1 A magnified view of a portion of point A in the middle;

[0019] Figure 4 yes Figure 1 Schematic diagram of the grinding wheel and water spray mechanism;

[0020] Figure 5 This is a schematic diagram of another embodiment of the grinding apparatus of this application. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] In the prior art, substrate grinding mostly adopts the "water grinding" method, that is, water is continuously sprayed during the grinding process to cool and hydrolyze the substrate. However, during the grinding process, a large amount of debris is usually splashed onto the substrate surface along with the water, causing product defects. At the same time, a large amount of wastewater in the chamber can easily cause chamber contamination. The equipment components operate in the contaminated chamber, causing the components to age faster and increasing the equipment operating costs. To solve the above problems, this application proposes the following technical solution.

[0023] See Figure 1 , Figure 3 and Figure 4 In one embodiment, the grinding device 1 includes a housing 10, a grinding wheel 20, a drive component (not shown), a water spraying mechanism 30, a draining device 40, and a negative pressure device 50.

[0024] The housing 10 is provided with a grinding cavity 11 and an opening 12 communicating with the grinding cavity 11. The grinding cavity 11 is a cavity formed by the housing 10 surrounding it. The grinding cavity 11 belongs to the grinding area of ​​the grinding substrate 70. The opening 12 of the housing 10 is communicating with the grinding cavity 11, so that the substrate 70 to be ground can enter the grinding cavity 11 from the opening 12.

[0025] The grinding wheel 20 is rotatably disposed in the grinding chamber 11. The outer peripheral surface of the grinding wheel 20 is provided with a grinding groove 21 surrounding the grinding wheel 20. The grinding groove 21 is exposed from the opening 12. When the edge of the substrate 70 enters the grinding chamber 11 from the opening 12, the grinding wheel 20 grinds the substrate 70 with the grinding groove 21 as the grinding wheel 20 rotates. The driving member is connected to the grinding wheel 20 and is used to drive the grinding wheel 20 to rotate.

[0026] Specifically, the grinding wheel 20 is driven to rotate by a driving component, which can be a motor. The grinding wheel 20 is rotated by the motor. The grinding chamber 11 of the housing 10 is used to accommodate the grinding wheel 20. The grinding groove 21 is exposed from the opening 12 of the housing 10, so that the grinding wheel 20 can contact the substrate 70. The grinding groove 21 of the grinding wheel 20 is a groove, so that the substrate 70 can be inserted into the grinding groove 21. After the grinding wheel 20 rotates, the edge of the substrate 70 contacts the grinding groove 21 of the grinding wheel 20, and the edge of the substrate 70 is ground to remove defects such as cracks and chipping from the edge of the substrate 70, so that the edge of the substrate 70 is smooth.

[0027] The water spraying mechanism 30 is installed in the grinding chamber 11 and located at the opening 12. The water spraying mechanism 30 is located around the grinding wheel 20 and is used to spray water during the grinding process. The draining device 40 is connected to the grinding chamber 11 and is used to drain the wastewater in the grinding chamber 11 during the grinding process of the grinding device 1. The negative pressure device 50 is connected to the draining device 40 and is used to generate negative pressure in the draining device 40 so that the wastewater in the grinding chamber 11 flows to the draining device 40 and is discharged from the draining device 40.

[0028] Specifically, the water spraying mechanism 30 and the grinding wheel 20 are both located in the grinding chamber 11. The water spraying mechanism 30 is located around the grinding wheel 20 and at the opening 12 of the housing 10. When the grinding wheel 20 grinds the substrate 70, the water spraying mechanism 30 sprays water onto the surface of the substrate 70. The water jet sprayed by the water spraying mechanism 30 carries away the heat generated by the friction between the substrate 70 and the grinding wheel 20. At this time, the negative pressure device 50 is connected to the draining device 40, and the draining device 40 is connected to the grinding chamber 11. The negative pressure device 50 generates negative pressure on the grinding chamber 11, that is, the pressure outside the grinding chamber 11 is greater than the pressure inside the grinding chamber 11, causing the water jet sprayed by the water spraying mechanism 30 onto the surface of the substrate 70 to deflect towards the grinding groove 21. At the same time, the negative pressure device 50 generates negative pressure on the draining device 40, and the pressure inside the grinding chamber 11 is greater than the pressure inside the draining device 40, causing the wastewater generated during the grinding process to flow from the grinding chamber 11 to the draining device 40 and finally out of the draining device 40.

[0029] In this application, the grinding apparatus 1 has a grinding chamber 11 in the housing 10. The grinding wheel 20 located in the grinding chamber 11 grinds the substrate 70 through the grinding groove 21. The water spraying mechanism 30 is located around the grinding wheel 20 and sprays water onto the surface of the substrate 70. The grinding chamber 11 is connected to the draining device 40 and the draining device 40 is connected to the negative pressure device 50. The negative pressure device 50 makes the pressure inside the grinding chamber 11 lower than the pressure outside the grinding chamber 11. On the one hand, it makes the water jet sprayed by the water spraying mechanism 30 face the substrate 70, which facilitates the cooling of the substrate 70 and improves the cooling effect, thereby improving the grinding effect of the substrate 70. At the same time, it reduces the direct friction between the grinding wheel 20 and the substrate 70, increases the service life of the grinding wheel 20, and thus increases the service life of the grinding apparatus 1. On the other hand, it draws the wastewater generated from grinding the substrate 70 into the draining device 40, avoiding wastewater contamination of the grinding chamber 11 and the substrate 70, improving the product yield, and avoiding environmental pollution.

[0030] In one embodiment, the housing 10 is provided with two grinding chambers 11 and an opening 12 communicating with the corresponding grinding chamber 11. Each grinding chamber 11 contains a grinding wheel 20. In one application scenario, the two grinding wheels 20 grind the edges of both ends of the substrate 70. For example, the grinding wheels 20 can grind the left and right ends of the substrate 70 at the same time, or grind the upper and lower ends of the substrate 70 at the same time, which helps to reduce the grinding steps of the substrate 70 and reduce the grinding time. In another application scenario, the two grinding wheels 20 grind the same end of the substrate 70. For example, both grinding wheels 20 grind the left end of the substrate 70, which helps to reduce the grinding time of the substrate 70 and improve the processing efficiency.

[0031] In one embodiment, the material of the grinding wheel 20 includes at least one of cast iron, stainless steel, aluminum alloy, or ceramic. The material of the grinding wheel 20 may include one or more of these materials. The material of the grinding wheel 20 may be only one of cast iron, stainless steel, aluminum alloy, or ceramic, or it may be a mixture of cast iron and stainless steel, or a mixture of aluminum alloy and ceramic. The specific material selection can be adjusted according to actual application requirements.

[0032] See Figure 2 In one embodiment, the grinding method applied to the grinding apparatus 1 includes:

[0033] S110: The edge of the substrate is fed into the grinding chamber through the opening.

[0034] Specifically, the platform holding the substrate 70 feeds the substrate 70 into the grinding chamber 11 of the housing 10 through the opening 12, while making the edge of the substrate 70 parallel to the grinding wheel 20 located in the grinding chamber 11, so that the edge of the substrate 70 can be put into the grinding groove 21 of the grinding wheel 20, and the position of the substrate 70 to be ground is determined.

[0035] S120: Controls the rotation of the grinding wheel and the water spraying mechanism.

[0036] Specifically, after the polishing wheel 20 is rotated, the substrate 70 is moved so that the edge of the substrate 70 rubs against the polishing groove 21 of the polishing wheel 20. The water spraying mechanism 30 is controlled to spray water onto the surface of the substrate 70 to reduce the temperature caused by the friction between the substrate 70 and the polishing wheel 20, and to reduce the friction between the substrate 70 and the polishing groove 21.

[0037] In one embodiment, the step of "controlling the rotation of the grinding wheel" in S120 includes controlling the rotation speed of the grinding wheel 20 to be between 800 rpm and 2500 rpm. Within this range, burrs on the edge of the substrate 70 are removed or chamfers are machined on the substrate 70.

[0038] S130: Activate the negative pressure device to allow the wastewater in the grinding chamber to be discharged through the drainage device.

[0039] Specifically, the negative pressure device 50 is turned on, and the negative pressure device 50 draws in the gas in the drain device 40. The grinding chamber 11 is connected to the drain device 40. The negative pressure device 50 draws in the gas in the grinding chamber 11, making the pressure in the grinding chamber 11 greater than the pressure in the drain device 40. The pressure in the grinding chamber 11 is less than the pressure outside the grinding chamber 11, making the grinding chamber 11 negative pressure. As a result, the water jet sprayed by the water spraying mechanism 30 is directed toward the grinding wheel 20, and the wastewater generated during the grinding of the substrate 70 can be drawn into the drain device 40.

[0040] In one embodiment, step S130 includes turning on the blower 510 so that the wastewater in the grinding chamber 11 is discharged to the water tank 410 through the first pipe 4120, and discharged from the water tank 410 to the diaphragm pump 420 through the second pipe 4210.

[0041] Continue reading Figure 1 The drainage device 40 includes a water tank 410 and a diaphragm pump 420.

[0042] The top of the water tank 410 is connected to the grinding chamber 11 through the first pipe 4120. At the same time, the negative pressure device 50 is connected to the water tank 410 to generate negative pressure in the water tank 410, so that the wastewater in the grinding chamber 11 flows to the water tank 410. The diaphragm pump 420 is connected to the bottom of the water tank 410 through the second pipe 4210. The wastewater entering the water tank 410 is discharged through the second pipe 4210 and the diaphragm pump 420 in sequence.

[0043] Specifically, the negative pressure device 50 generates negative pressure in both the water tank 410 and the grinding chamber 11, and the pressure in the grinding chamber 11 is greater than the pressure in the pipe and the water tank 410. Therefore, the wastewater generated by grinding the substrate 70 in the grinding chamber 11 is sucked into the water tank 410 through the first pipe 4120 located at the top of the water tank 410. The diaphragm pump 420 generates suction on the wastewater in the second pipe 4210. The wastewater stored at the bottom of the water tank 410 flows into the diaphragm pump 420 through the second pipe 4210 and is then discharged from the diaphragm pump 420.

[0044] In one embodiment, a diaphragm pump 420 is connected to a collection device (not shown) via a pipe to ensure that wastewater generated during the grinding process can be discharged into the collection device in a timely and effective manner. The diaphragm pump 420 ensures rapid flow of wastewater, quickly discharging wastewater containing dust and particles generated during the grinding process, preventing wastewater from lingering on the surface of the substrate 70 or in the working environment, and reducing wastewater pollution. Simultaneously, the design of the collection device allows for centralized collection of wastewater, preventing it from spreading and ensuring environmental cleanliness. This approach not only effectively controls wastewater pollution but also facilitates subsequent wastewater treatment or recycling, further improving the environmental friendliness and sustainability of the entire grinding process. Furthermore, the close cooperation between the diaphragm pump 420 and the collection device ensures the stability and reliability of wastewater discharge, providing a more efficient and cleaner operating environment for the substrate 70 processing.

[0045] In one embodiment, the collection device is connected to a wastewater treatment device (not shown) via a pipeline. After entering the wastewater treatment device, the wastewater undergoes multiple filtration and chemical treatment steps to effectively remove chemicals, particulate matter, and other pollutants. The wastewater treatment device employs advanced technologies, such as activated carbon adsorption, ion exchange, and precipitation, to ensure the complete removal of harmful substances from the wastewater. Once the treated wastewater meets environmental discharge standards, it can be safely discharged or reused, significantly reducing environmental pollution and improving resource recycling efficiency.

[0046] Continue reading Figure 1 The water tank 410 is equipped with a partition 4110, which divides the space in the water tank 410 into a first space 411 and a second space 412 in the horizontal direction X. The top of the first space 411 and the second space 412 are connected. The negative pressure device 50 is directly connected to the first space 411, and the first pipe 4120 is directly connected to the second space 412.

[0047] Specifically, the first space 411 of the water tank 410 is connected to the negative pressure device 50. The negative pressure device 50 creates a negative pressure in the first space 411 of the water tank 410. Since the top of the first space 411 is connected to the top of the second space 412, the second space 412 of the water tank 410 is also under negative pressure. Wastewater in the grinding chamber 11 can enter the space of the water tank 410. However, due to the obstruction of the partition 4110 and the direct connection between the first pipe 4120 and the second space 412, the wastewater in the grinding chamber 11 enters the second space 412 of the water tank 410 through the first pipe 4120 instead of the first space 411, thereby preventing wastewater from contaminating the negative pressure device 50.

[0048] In one embodiment, the partition 4110 is movably disposed within the water tank 410, allowing its position to be adjusted. This enables flexible adjustment of the volumes of the first space 411 and the second space 412 to meet varying wastewater treatment needs. To ensure smooth and stable movement of the partition 4110, a slide rail (not shown) is provided at the bottom of the water tank 410. The slide rail design ensures smooth movement of the partition 4110, preventing jamming due to excessive friction or resistance. The partition 4110 is mounted on the slide rail via a bracket (not shown). The bracket structure is simple and robust, ensuring the partition 4110 remains stable during movement and preventing deviation that could affect its performance. This design not only improves the adjustability and flexibility of the water tank 410 but also optimizes space allocation according to actual needs, resulting in more efficient and energy-saving wastewater treatment. Furthermore, the slide rail and bracket are made of corrosion-resistant and wear-resistant materials, ensuring long-term stable operation of the system and reducing maintenance costs. In another embodiment, a drive unit can be provided to drive the partition 4110 to move along the slide rail.

[0049] In one embodiment, a sealing strip (not shown) is provided between the water tank 410 and the partition 4110 to enhance the sealing performance of the partition 4110 and prevent wastewater from flowing from the second space 412 into the first space 411. The sealing strip is made of corrosion-resistant and wear-resistant material to ensure stable sealing performance during long-term use. Through the design of the sealing strip, not only is the airtightness of the water tank 410 improved and the risk of wastewater leakage reduced, but different areas can also be effectively isolated to ensure safer and more environmentally friendly wastewater management, which helps to improve the overall service life and operating efficiency of the grinding device 1.

[0050] In one embodiment, the water tank 410 is equipped with multiple sensors (not shown). These sensors are mounted on the side wall of the water tank 410 and can monitor changes in water level or pressure in the water tank 410 in real time. By accurately measuring fluctuations in water level or pressure, the sensors can promptly reflect the accumulation of wastewater in the water tank 410. This data is transmitted to the control system, which automatically adjusts the wastewater discharge through intelligent algorithms. When the water level exceeds the set safety value or the pressure reaches the warning standard, the system automatically activates the discharge mechanism to ensure that the water tank 410 does not overflow or damage the grinding device 1 due to excessive water accumulation. At the same time, the real-time monitoring by the sensors also allows operators to receive alarms when the water level is abnormal, thereby taking preventive measures. This intelligent management system not only improves the efficiency and safety of wastewater discharge but also effectively reduces the frequency of manual intervention, enhances the operational stability and automation level of the grinding device 1, and ensures that the grinding device 1 operates efficiently while minimizing environmental pollution and maintenance costs.

[0051] In one embodiment, the negative pressure device 50 includes a fan 510. Specifically, after the fan 510 is started, the motor in the fan 510 rotates at high speed, and the motor shaft of the motor rotates at high speed, driving the impeller sleeved on the motor shaft to rotate. Since the blades of the impeller are curved, when the blades rotate, a low-pressure area is formed on the suction side of the fan 510 due to the acceleration of the gas and the local thinning of the airflow, so that the gas is drawn into the fan 510. That is, the negative pressure device 50 draws in gas on the side near the drain device 40, so that the grinding chamber 11 is under negative pressure.

[0052] In one embodiment, the fan 510 can be selected as at least one of a centrifugal fan and an axial fan. Specifically, the fan 510 system can be configured with only one centrifugal fan, suitable for applications requiring higher pressure and flow; or it can be configured with only one axial fan, suitable for environments with higher airflow requirements and lower pressure. Furthermore, the system can also be configured with a combination of one axial fan and one centrifugal fan. By flexibly selecting and combining the fans 510, optimal airflow and airflow control can be achieved according to actual needs, ensuring efficient operation and energy efficiency optimization of the grinding device 1.

[0053] In one embodiment, the negative pressure device 50 includes multiple fans 510. The coordinated operation of these fans significantly enhances the suction force on the wastewater within the grinding chamber 11. The parallel operation of the multiple fans 510 not only improves the suction effect but also ensures that the wastewater is quickly and effectively removed, preventing it from stagnating within the grinding chamber 11 and thus reducing contamination of the grinding chamber 11 and the substrate 70. This configuration better maintains a clean working environment, reduces corrosion of the grinding device 1 by wastewater, and improves the precision and efficiency of the grinding process.

[0054] Furthermore, in one embodiment, the multiple fans 510 may be of the same type, such as centrifugal fans, or the multiple fans 510 may be of different types, such as multiple centrifugal fans and multiple axial fans.

[0055] See Figure 3 There are two water spraying mechanisms 30, which are spaced apart. The substrate 70 that enters the grinding chamber 11 is located between the two water spraying mechanisms 30.

[0056] Specifically, two water spraying mechanisms 30 are spaced apart at the opening 12 of the housing 10. During the grinding process of the substrate 70, the two water spraying mechanisms 30 spray water on the upper and lower surfaces of the substrate 70 simultaneously. Since the grinding chamber 11 is under negative pressure, the water jets sprayed by the two water spraying mechanisms 30 are inclined towards the grinding groove 21 of the grinding wheel 20. By setting two water spraying mechanisms 30, the amount of water during the grinding process of the substrate 70 can be increased, thereby improving the cooling effect on the substrate 70. At the same time, since the water spraying mechanisms 30 are distributed on both sides of the substrate 70, the water jets sprayed by the water spraying mechanisms 30 can uniformly cool the substrate 70, preventing defects such as edge burning caused by overheating of the substrate 70 during the grinding process.

[0057] In one embodiment, the water spraying mechanism 30 is arc-shaped. Since the contact position between the substrate 70 and the grinding wheel 20 is a small cross-section when grinding the substrate 70, the arc-shaped water spraying mechanism 30 can fully cover the contact surface between the substrate 70 and the grinding wheel 20, effectively reducing the size of the water spraying mechanism 30 and thus improving the space utilization of the housing 10.

[0058] See Figure 4 The water spraying mechanism 30 includes a plurality of nozzles 310, which are arranged around the grinding wheel 20 along the circumference of the grinding wheel 20.

[0059] Specifically, during the polishing process of substrate 70, the water spraying mechanism 30 sprays water from nozzles 310 onto the surface of substrate 70. The nozzles 310 are arranged along the circumference of polishing wheel 20, that is, the nozzles 310 are distributed in a ring on the water spraying mechanism 30, so that the water jets sprayed from the nozzles 310 are also distributed in a ring, and the water jets fall evenly onto the surface of substrate 70, reducing the direct friction between polishing wheel 20 and substrate 70, reducing wear, and improving the service life of polishing wheel 20. At the same time, it avoids overheating of the polishing position of substrate 70, reduces the thermal stress of substrate 70 caused by temperature difference, and reduces the risk of breakage.

[0060] In one embodiment, the material of nozzle 310 includes at least one of stainless steel, ceramic, plastic, and copper alloy. The material of nozzle 310 may include one or more of stainless steel, ceramic, copper alloy, or plastic. Nozzle 310 may be made solely of stainless steel or a mixture of stainless steel and ceramic. Stainless steel has excellent corrosion resistance and mechanical strength; using stainless steel as the material of nozzle 310 improves the mechanical strength and service life of nozzle 310. Ceramic has excellent wear resistance and high-temperature resistance; using ceramic as the material of nozzle 310 can also improve the service life of nozzle 310. It should be noted that this application does not limit the material of nozzle 310.

[0061] See Figure 4 The plurality of nozzles 310 include a first nozzle 3110 and a second nozzle 3120. The distance between the second nozzle 3120 and the center of the opening 12 is greater than the distance between the first nozzle 3110 and the center of the opening 12. The aperture of the second nozzle 3120 is smaller than the aperture of the first nozzle 3110.

[0062] Specifically, the distance between the second nozzle 3120 and the center of the opening 12 is greater than the distance between the first nozzle 3110 and the center of the opening 12. In other words, the first nozzle 3110 is closer to the center of the opening 12 than the second nozzle 3120, which is the central area of ​​the water spraying mechanism 30. Since the center of the opening 12 is the main position of the edge of the substrate 70, and the two sides of the center of the opening 12 are the chamfer positions of the substrate 70, the water spraying mechanism 30 is mainly used to grind the edge of the substrate 70 during the grinding process. The central area of ​​the water spraying mechanism 30 corresponds to the center of the opening 12. The aperture of the first nozzle 3110 is set to be larger than the aperture of the second nozzle 3120. That is, in the same time, the amount of water sprayed by the first nozzle 3110 is greater than the amount of water sprayed by the second nozzle 3120. The amount of water closer to the main position of the substrate 70 is greater than the amount of water at other positions. Therefore, the heat generated during the grinding process of the substrate 70 can be quickly removed. On the basis of meeting the water requirements of the substrate 70, the cooling effect of the substrate 70 is not only improved, but also the waste of water resources is avoided.

[0063] In one embodiment, the orifice diameter of the nozzle 310 ranges from 1.0 mm to 2.0 mm.

[0064] Specifically, the orifice diameter of nozzle 310 can be 1.0 mm, 1.5 mm, 1.8 mm, or 2.0 mm. It should be noted that this application does not strictly limit the orifice diameter of nozzle 310. An orifice diameter within the range of 1.0 mm to 2.0 mm ensures optimal spraying results. Furthermore, this application does not impose specific limitations on the orifice diameter of nozzle 310; the orifice diameter can be flexibly adjusted according to specific application requirements.

[0065] In one embodiment, the first nozzle 3110 is located at the center of the opening 12, that is, the first nozzle 3110 is located in the central region of the water spraying mechanism 30, and the second nozzle 3120 is located on both sides of the central region of the water spraying mechanism 30. The diameter of the first nozzle 3110 is larger than the diameter of the second nozzle 3120. That is, the aperture of the nozzle 310 located in the central region of the water spraying mechanism 30 is larger than the aperture of the nozzles 310 located on both sides of the central region, which facilitates effective heat dissipation of the substrate 70 during grinding and improves the heat dissipation efficiency of the substrate 70.

[0066] In another embodiment, a nozzle 310 is provided at the center of the opening 12, that is, only the first nozzle 3110 is provided. In other words, the water spraying mechanism 30 sprays water at the main position near the grinding substrate 70, while no water is sprayed at other positions. This is applicable to the grinding device 1 that only grinds the edge of the substrate 70 and not the chamfer of the substrate 70.

[0067] Furthermore, the orifice diameter of the first nozzle 3110 ranges from 1.5 mm to 2.0 mm, and the orifice diameter of the second nozzle 3120 ranges from 1.0 mm to 1.4 mm. This means that the orifice diameter of the first nozzle 3110 can be 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, or 2.0 mm, and the orifice diameter of the second nozzle 3120 can be 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, or 1.4 mm. It should be noted that this application does not strictly limit the orifice diameters of the first nozzle 3110 and the second nozzle 3120; the specific orifice diameters can be adjusted according to actual needs.

[0068] In one embodiment, the greater the distance from the center of the opening 12, the smaller the aperture of the nozzle 310. Specifically, the greater the distance between the nozzle 310 and the center of the opening 12, the farther the water droplets sprayed by the nozzle 310 will contact the grinding position on the substrate 70 during the grinding process, and therefore the weaker the effect of the nozzle 310. Setting the diameter of the nozzle 310 to be small can avoid wasting water resources.

[0069] Combination Figure 1 and Figure 3In one embodiment, when the negative pressure device 50 is not turned on, the water outlet direction of the nozzle 310 is perpendicular to the grinding wheel 20. After the negative pressure device 50 is turned on, under the action of negative pressure, the water sprayed from the nozzle 310 is directed toward the grinding wheel 20, and the direction of the water sprayed from the nozzle 310 forms an angle θ with the grinding wheel 20, the angle θ being in the range of 30° to 60°.

[0070] Specifically, after the negative pressure device 50 is activated, the grinding chamber 11 of the housing 10 is under negative pressure, causing the water sprayed from the nozzle 310 to face the grinding wheel 20. That is, the water droplets from the nozzle 310 are tilted towards the grinding wheel 20. The angle θ between the direction of the water sprayed from the nozzle 310 and the grinding wheel 20 can be 30°, 35°, 40°, 45°, 50°, 55°, or 60°, with the angle θ ranging from 30° to 60°. This helps optimize the contact between the water column and the grinding wheel 20, allowing the water to more effectively lubricate the substrate 70. Furthermore, the evenly distributed water column effectively reduces the temperature of the substrate 70, thereby improving heat dissipation and reducing damage or performance degradation of the substrate 70 caused by high temperatures. This ensures the stability and precision of the grinding process, further improving the grinding quality. It should be noted that this application does not limit the angle θ between the water sprayed from the nozzle 310 and the grinding wheel 20.

[0071] In one embodiment, the water supply line of the nozzle 310 is equipped with a valve. The valve can be electrically controlled to adjust the water flow rate. Therefore, by controlling the electrical signal of the valve, the opening degree of the valve can be adjusted as needed, thereby controlling the water flow rate of the nozzle 310.

[0072] See Figure 5 In one embodiment, the grinding apparatus 1 further includes a first baffle 610 and a second baffle 620. The first baffle 610 and the second baffle 620 are disposed at the opening 12. The first baffle 610 and the second baffle 620 are opposite to each other and spaced apart to form a channel for inserting the substrate 70 into the grinding chamber 11. The first baffle 610 and the second baffle 620 are used to prevent wastewater in the grinding chamber 11 from flowing to the outside from the opening 12.

[0073] Specifically, the first baffle 610 and the second baffle 620 are located on both sides of the opening 12. During the grinding process, the water sprayed by the water spraying mechanism 30 mixes with the particles generated by the grinding substrate 70 to form wastewater that splashes onto the surface of the substrate 70 that does not need to be ground. The first baffle 610 and the second baffle 620 are spaced apart and located on both sides of the substrate 70 to prevent the wastewater from overflowing from the opening 12, thereby preventing the wastewater from splashing out of the grinding chamber 11 onto the surface of the substrate 70 and maintaining the cleanliness around the grinding device 1, thus preventing the ground outside the grinding device 1 from becoming slippery or damaging external facilities.

[0074] In one embodiment, the first baffle 610 and the second baffle 620 are inclined relative to the grinding chamber 11, that is, the first baffle 610 and the second baffle 620 are inclined relative to the horizontal direction X. Since the splashing direction of wastewater is irregular, the first baffle 610 and the second baffle 620 are inclined relative to the substrate 70, which can increase the blocking area of ​​the first baffle 610 and the second baffle 620 and increase the contact area between the first baffle 610 and the second baffle 620 and the wastewater, thereby improving the wastewater blocking effect, reducing wastewater splashing to the outside of the grinding chamber 11, and keeping the non-grindable areas on the surface of the substrate 70 clean.

[0075] Furthermore, in one embodiment, the angle between the first baffle 610 and the horizontal direction X (not shown) is equal to the angle between the second baffle 620 and the horizontal direction X (not shown), thereby simplifying the design and assembly process, and reducing complex structural calculations and adjustments during the production of the grinding device 1, improving production efficiency and reducing the manufacturing cost of the grinding device 1.

[0076] In one embodiment, the first baffle 610 is movably mounted at the opening 12, so that the angle between the first baffle 610 and the horizontal direction X is adjustable. This adjustable angle design improves the adaptability and operational flexibility of the first baffle 610, enabling the grinding device 1 to achieve ideal working effects and performance under different working conditions. In another embodiment, the second baffle 620 is movably mounted at the opening 12, so that the angle between the second baffle 620 and the horizontal direction X is adjustable, further improving the adaptability and operational flexibility of the second baffle 620.

[0077] In one embodiment, the material of the first baffle 610 includes at least one of stainless steel, aluminum alloy, polyethylene, and rubber. The material of the first baffle 610 may include one or more of stainless steel, aluminum alloy, polyethylene, and rubber. The material of the first baffle 610 may be only one of stainless steel, aluminum alloy, polyethylene, or rubber, or a mixture of stainless steel and aluminum alloy, or a mixture of polyethylene and rubber. In another embodiment, the material of the second baffle 620 includes at least one of stainless steel, aluminum alloy, polyethylene, and rubber. The material of the second baffle 620 may be only one of stainless steel, aluminum alloy, polyethylene, or rubber, or a mixture of stainless steel and aluminum alloy, or a mixture of polyethylene and rubber. It should be noted that this application does not limit the materials of the first baffle 610 and the second baffle 620.

[0078] In one embodiment, the first baffle 610 and the second baffle 620 are made of the same material, which effectively reduces the number of material types involved in the preparation process, thereby reducing the frequency of material switching during production. By simplifying the complexity of material use, not only is the production process of the grinding device 1 optimized, but the overall efficiency of the grinding device 1 is also improved, which brings positive effects to production efficiency and cost control.

[0079] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A grinding apparatus, characterized in that, include: The housing has a grinding chamber and an opening communicating with the grinding chamber; A grinding wheel is rotatably disposed in the grinding chamber. The outer circumferential surface of the grinding wheel is provided with a grinding groove surrounding the grinding wheel. The grinding groove is exposed from the opening. When the edge of the substrate enters the grinding chamber from the opening, the grinding wheel grinds the substrate using the grinding groove as the grinding wheel rotates. A driving component, connected to the grinding wheel, is used to drive the grinding wheel to rotate; A water spraying mechanism is disposed in the grinding chamber and located at the opening, and the water spraying mechanism is located on the periphery of the grinding wheel for spraying water during the grinding process; A draining device, connected to the grinding chamber, is used to drain wastewater from the grinding chamber during the grinding process of the grinding device; A negative pressure device, connected to the drainage device, is used to generate negative pressure in the drainage device so that the wastewater in the grinding chamber flows to and is discharged from the drainage device.

2. The grinding apparatus according to claim 1, characterized in that, The drainage device includes: A water tank, the top of which is connected to the grinding chamber via a first pipe, and a negative pressure device connected to the water tank to generate negative pressure in the water tank, thereby causing the wastewater in the grinding chamber to flow to the water tank; A diaphragm pump is connected to the bottom of the water tank via a second pipe, wherein wastewater entering the water tank is discharged sequentially through the second pipe and the diaphragm pump.

3. The grinding apparatus according to claim 2, characterized in that, The water tank is equipped with a partition that divides the space in the water tank into a first space and a second space in the horizontal direction. The top of the first space and the second space are connected. The negative pressure device is directly connected to the first space, and the first pipe is directly connected to the second space.

4. The grinding apparatus according to claim 1, characterized in that, The negative pressure device includes a fan.

5. The grinding apparatus according to claim 1, characterized in that, The water spraying mechanism includes multiple nozzles, which are arranged around the periphery of the grinding wheel along the circumference of the grinding wheel.

6. The grinding apparatus according to claim 5, characterized in that, The plurality of nozzles includes a first nozzle and a second nozzle, wherein the distance between the second nozzle and the center of the opening is greater than the distance between the first nozzle and the center of the opening, and wherein the orifice diameter of the second nozzle is smaller than the orifice diameter of the first nozzle; Preferably, the nozzle aperture ranges from 1.0 mm to 2.0 mm; Preferably, the first nozzle is located at the center of the opening, the orifice diameter of the first nozzle is in the range of 1.5 mm to 2.0 mm, and the orifice diameter of the second nozzle is in the range of 1.0 mm to 1.4 mm; Preferably, the greater the distance from the center of the opening, the smaller the orifice diameter of the nozzle.

7. The grinding apparatus according to claim 5, characterized in that, When the negative pressure device is not turned on, the water outlet direction of the nozzle is perpendicular to the grinding wheel. After the negative pressure device is turned on, under the action of negative pressure, the water sprayed from the nozzle is directed toward the grinding wheel, and the direction of the water sprayed from the nozzle forms an angle with the grinding wheel, the angle being between 30° and 60°.

8. The grinding apparatus according to claim 1, characterized in that, There are two water spraying mechanisms, which are spaced apart, and the substrate entering the grinding chamber is located between the two water spraying mechanisms.

9. The grinding apparatus according to claim 1, characterized in that, The grinding apparatus further includes: A first baffle and a second baffle are disposed at the opening. The first baffle and the second baffle are opposite to each other and spaced apart to form a channel for inserting the substrate into the grinding chamber. The first baffle and the second baffle are used to prevent wastewater in the grinding chamber from flowing to the outside from the opening.

10. A grinding method, characterized in that, The method, applied to the grinding apparatus as described in any one of claims 1 to 9, comprises: The edge of the substrate is fed into the grinding chamber through the opening; Controlling the rotation of the grinding wheel and controlling the water spraying mechanism to spray water; Turn on the negative pressure device so that the wastewater in the grinding chamber can be discharged through the drainage device.

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