Semiconductor package processing wafer dicing device

Abstract

The application relates to the field of wafer slitting equipment, in particular to a semiconductor packaging processing wafer slitting device which comprises a shell, a working cavity is arranged in the front part of the shell, a pump bin is mounted on the inner side wall of the working cavity, a hydraulic rod is arranged on the lower side of the pump bin, a machine head is fixedly connected to the output end of the hydraulic rod, a servo motor is mounted in the machine head, a mounting head is fixedly connected to the driving end of the servo motor, a limiting ring is fixedly connected to the middle part of the outer periphery of the mounting head, a communication bin is arranged on one side of the limiting ring, a saw blade is arranged on the other side of the limiting ring, chip accommodating grooves and rotating grooves which are uniformly distributed are opened on the two sides of the outer periphery of the saw blade, the chip accommodating grooves are communicated through the rotating grooves, and the chip accommodating grooves are provided with uniformly distributed reserved openings, the chip accommodating grooves on the two sides of the saw blade can accommodate the retained chippings in the slitting seam, the chippings extrusion force in the slitting seam can be greatly reduced, and the workpiece edge can be prevented from being extruded and broken.

Description

Technical Field

[0001] This invention relates to the field of wafer slitting equipment, and more particularly to a semiconductor packaging wafer slitting apparatus. Background Technology

[0002] In semiconductor processing, wafers are typically cut along a predetermined path using slitting equipment to form multiple independent wafer units. Existing wafer slitting equipment generally includes a worktable for holding the wafers, a cutting mechanism for driving the saw blade to rotate at high speed, and a cooling system for spraying coolant onto the cutting area. During the slitting process, the wafers are cut using a high-speed rotating saw blade, and the cutting area is cooled and rinsed by coolant.

[0003] However, existing equipment still has certain shortcomings in actual slitting processes. On the one hand, when the saw blade cuts the wafer, it generates a large number of tiny chips. Some of these chips easily remain in the cutting area of ​​the saw blade or adhere to the surface of the saw blade. Simply relying on the coolant flushing around the saw blade is insufficient to remove the chips in time, which can easily cause blockage in the cutting area and further affect the cutting stability of the saw blade and the slitting quality of the wafer. On the other hand, existing cooling structures usually use nozzles with a fixed spray direction to continuously supply coolant to the cutting area, which can easily lead to problems such as coolant concentration in some areas and insufficient coolant supply in others. When the coolant pressure changes, the actual spray state of the nozzles can also easily change, resulting in unstable cooling and chip removal effects. Therefore, it is necessary to improve the saw blade chip removal structure and coolant spray structure of existing wafer slitting equipment to address the problems of chips not being easily removed in time, insufficient flushing on both sides of the saw blade, and difficulty in dynamically adjusting the coolant spray coverage during wafer slitting. Therefore, we propose a semiconductor packaging wafer slitting device to solve the above-mentioned problems. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of the prior art by providing a semiconductor packaging wafer slitting apparatus.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a semiconductor packaging wafer slitting device, comprising a housing, a working chamber provided at the front of the housing, a pump compartment installed on the inner side wall of the working chamber, a hydraulic rod provided on the lower side of the pump compartment, an output end of the hydraulic rod fixedly connected to a machine head, a servo motor installed inside the machine head, an installation head fixedly connected to the drive end of the servo motor, a limiting ring fixedly connected to the middle of the outer periphery of the installation head, a connecting compartment provided on one side of the limiting ring, a saw blade provided on the other side of the limiting ring, chip grooves and rotary grooves evenly distributed on both sides of the outer periphery of the saw blade, the chip grooves being connected to each other through the rotary grooves, and evenly distributed reserved openings on the periphery of the chip grooves, a pump group provided inside the pump compartment, and two connecting hoses fixedly connected to the output end of the pump group, the ends of the connecting hoses away from the pump compartment being located on the machine head. Inside, one of the connecting hoses, at its end furthest from the pump chamber, is fixedly connected to two water outlet pipes via a connector. The other connecting hose, at its end furthest from the pump chamber, is fixedly connected to a water inlet. The bottom of the water inlet is fixedly connected to a top chamber. A guide impeller is installed in the upper part of the top chamber. A fixed frame is rotatably connected to the upper part of the shaft of the guide impeller. The fixed frame is fixedly connected inside the top chamber. A rotating ring is fixedly connected to the lower part of the shaft of the guide impeller. A slot is opened on one side of the lower part of the rotating ring. Both sides of the lower outer periphery of the top chamber are fixedly connected to guide tubes. The ends of the guide tubes furthest from the top chamber are fixedly connected to a connecting ring chamber. A connecting shaft is fixedly connected to the middle of each connecting ring chamber. Both sides of the connecting shaft are rotatably connected to crossbars via sealed bearings. The crossbars are all connected to the inside of the connecting shaft. The crossbars are all located on both sides of the saw blade. The ends of the crossbars that are close to each other are opened with evenly distributed water outlet grooves.

[0006] Preferably, each of the water outlet pipes is fixedly connected to a nozzle, and each nozzle has a cavity inside its wall. The inner wall of each cavity has uniformly distributed trapezoidal openings in the middle, all of which are inverted trapezoids. Each nozzle has a spray nozzle in the middle, and a base plate is fixedly connected to the lower part of each spray nozzle. A top spring is fixedly connected to the upper part of each base plate, and a telescopic tube is fixedly connected to the top of each top spring. The telescopic tube has a corrugated section in the middle, and its top is fixedly connected to the upper part of the spray nozzle. The lower part of the telescopic tube and the corrugated section are slidably connected to the inner wall of the spray nozzle. A uniformly distributed bottom opening is provided on the lower outer periphery of the telescopic tube, and each bottom opening corresponds to a trapezoidal opening. A uniformly distributed slot is provided on the lower part of the inner wall of each cavity, and each slot is located on the lower side of the base plate. The trapezoidal openings are located on the upper side of the base plate. Each slot connects the lower space of the base plate to the cavity, and each trapezoidal opening connects the upper space of the base plate to the cavity.

[0007] Preferably, a cover is provided on the side of the saw blade away from the limiting ring. The cover is engaged with the outer side of the end of the mounting head. A locking post is provided on the end of the cover away from the saw blade. The locking post is installed in the middle of the end of the mounting head through a central threaded post. The cover has evenly distributed straight through openings around its periphery. The straight through openings are connected to one of the sets of openings.

[0008] Preferably, the bottom of the top compartment is fixedly connected to a first connecting port, and the end of the first connecting port away from the top compartment is fixedly connected to a connecting pipe. The connecting compartment is rotatably connected to the mounting head through a sealed bearing. The outer periphery of the mounting head has evenly distributed second connecting ports, and the connecting compartment is connected to the interior of the mounting head through the second connecting port. The upper part of the connecting compartment is fixedly connected to a connecting pipe. The top compartment is located in the upper part of the machine head. The end of the machine head away from the hydraulic rod has a sliding groove. The connecting shaft and the end of the cross frame are both located inside the sliding groove, and the connecting shaft is slidably connected to the sliding groove.

[0009] Preferably, the end of the connecting pipe away from the pump chamber is fixedly connected to a side punch frame. The lower part of the side punch frame, near the wafer, has a parallel opening 1. A slide frame 1 and a slide frame 2 are slidably connected inside the opening 1. Both slide frames 1 and 2 have through-holes in their middle sections. Corrugated seats are fixedly connected to both ends of both slide frames 1 and 2. The ends of the corrugated seats are fixedly connected to the inner wall of the opening 1. Guide bars are fixedly connected to the sides of both slide frames 1 and 2 that are close to each other. Gears are arranged between the guide bars.

[0010] Preferably, each guide bar has a toothed groove at one end near the gear, and the toothed groove is meshed with the gear. A stepper motor is installed at the middle shaft end of the gear, and the stepper motor is installed inside one side of the side punch frame.

[0011] Preferably, a reciprocating lead screw is installed at the top inside the housing, and the moving part of the reciprocating lead screw is fixedly connected to an adsorption slide, which is slidably connected to the rear part inside the housing.

[0012] Preferably, a transfer platform and an electric slide are respectively installed on both sides of the rear part of the housing, and a worktable is installed in front of the electric slide. The electric slide and the transfer platform are both located under the adsorption slide, and the worktable and the transfer platform are both used to support the wafer.

[0013] Preferably, an industrial vision camera is installed at the bottom of the machine head, and a monitoring probe is installed on one side of the machine head, with the bottom detection end of the monitoring probe being level with the top surface of the lower wafer.

[0014] Preferably, the periphery of the housing has multiple connecting windows, all of which are used to connect to the robotic arm in the material transfer process. A control panel is installed in the middle of the front end of the housing, which is used to control the electrical control equipment.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. During the actual slitting process, when the saw blade rotates at high speed, the chip grooves on both sides of the saw blade can collect the chips remaining in the slitting kerf. At the same time, the guide grooves can connect the chip grooves. When the saw blade rotates at high speed, under the action of centrifugal force, excess chips can be guided to adjacent chip grooves or reserved openings, which is convenient for subsequent centrifugal ejection or coolant cleaning, improving the chip removal efficiency in the wafer slitting process. This can significantly reduce the chip compression pressure in the slitting kerf and prevent the workpiece edge from being crushed. Furthermore, the sliding grooves and chip grooves can facilitate the retention and guidance of coolant, thereby further improving the cooling effect on the saw blade edge and the inner wall of the slitting kerf, preventing overheating from affecting the physical properties of the material and the processing quality.

[0016] 2. The pump unit inside the pump compartment can output coolant through connecting hoses and pipes. The connecting pipes can guide the coolant into the side flushing frame, and then the coolant will be sprayed out through the outlet to clean up the debris generated during the cutting process. The outlet is long and narrow, so that the coolant sprays out in a water curtain shape, which can effectively reduce the cleaning dead corners that may exist when the traditional column coolant column is working, and avoid affecting the subsequent cutting work. At the same time, the outlets on slide one and slide two are staggered to complement each other, which can further reduce the cleaning dead corners. In actual use, the stepper motor drives the gear to reciprocate. When the gear rotates, it drives slide one and slide two to move back and forth synchronously through the meshing tooth groove, which can adjust the range of the water curtain sprayed from the outlet and supplement the cleaning dead corners, which is beneficial to the washing of debris during the actual cutting process.

[0017] 3. During the specific slitting process, when processing wafers of different materials, as the water pressure input to the outlet pipe increases, the impact force of the coolant on the telescopic tube increases, and the compression of the top spring increases simultaneously, causing the corrugated section to extend. This results in a relative displacement between the bottom of the telescopic tube and the inside of the nozzle. Because the trapezoidal opening is an inverted trapezoidal design, the greater the input water pressure, the greater the movement of the top spring, and the smaller the opening at the trapezoidal opening corresponding to the bottom outlet. This further limits the output, thereby further increasing the overall output water pressure of the nozzle. Conversely, it can further reduce the output water pressure. This allows for adaptation to the variable load of wafer slitting according to actual working conditions, enabling the flow state of the coolant after entering the nozzle to be adjusted with the supply pressure. This gives the spray flow rate and spray state a certain degree of adaptive adjustment capability, mitigating the adverse effects of supply pressure changes on the cooling effect and improving the adaptability of the coolant spray state.

[0018] 4. After the coolant is introduced into the top chamber through the connecting hose, the coolant will first come into contact with the guide impeller. The continuously entering coolant will drive the guide impeller to rotate. When the guide impeller rotates, it will drive the fixed rotating ring at the bottom to rotate synchronously. Then, some coolant will enter the connecting pipe through the bottom connecting port one. Through the connecting pipe, the coolant can be introduced into the connecting chamber. Through the connection through the second connecting port, the coolant can be further introduced into the mounting head. Then, through the two sets of openings two and the straight through port on the mounting head, the coolant can be released to form a full-coverage water curtain jet on both sides of the saw blade, which completes the thorough cleaning of both sides of the saw blade and is conducive to continuous processing.

[0019] 5. Some of the coolant in the top chamber is discharged through the slot two on one side of the rotating ring and enters the conduit on one side. Through the conduit, the connected ring chamber and connecting shaft can further guide the coolant into the crossbeam. The water outlet on the crossbeam can form an oblique jet on both sides of the saw blade, realizing the key cleaning of the pre-reserved opening, chip groove and the inside of the rotary groove on the saw blade. As the rotating ring rotates with the guide impeller, the position of slot two will change accordingly when the rotating ring rotates, thereby synchronously changing the connection path of the coolant and realizing the switching of the connection state of the conduits on both sides. When the coolant enters the different conduits, under the action of water pressure, it will drive the connecting shaft and the crossbeam to tilt to that side. Furthermore, when the rotating ring rotates, due to the continuous switching of the connection state of the conduits on both sides, the crossbeam will continuously reciprocate under the limit of the slide groove, realizing the comprehensive cleaning of the upper area of ​​the saw blade during processing, avoiding stubborn chips stuck in the pre-reserved opening and creating cleaning dead angles due to angle issues, which is beneficial to the actual continuous cutting work. Attached Figure Description

[0020] Figure 1 This is a frontal perspective three-dimensional structural diagram of a semiconductor packaging wafer slitting apparatus according to the present invention; Figure 2 This is a side perspective three-dimensional structural diagram of a semiconductor packaging wafer slitting apparatus according to the present invention; Figure 3 This is a rear view of the internal structure of a semiconductor packaging wafer slitting apparatus according to the present invention; Figure 4 This is a schematic diagram of the internal structure of the working cavity of a semiconductor packaging wafer slitting device according to the present invention; Figure 5 This is a partial structural diagram of an opening in a semiconductor packaging wafer slitting apparatus according to the present invention; Figure 6 This is a partial structural diagram of the tooth groove and gear of a semiconductor packaging wafer slitting device according to the present invention; Figure 7This is a partial structural diagram of the mounting head of a semiconductor packaging wafer slitting apparatus according to the present invention; Figure 8 This is a partial structural diagram of the saw blade of a semiconductor packaging wafer slitting device according to the present invention; Figure 9 This is a schematic diagram of the internal structure of the nozzle of a semiconductor packaging wafer slitting device according to the present invention; Figure 10 This is a partial structural diagram of the trapezoidal opening of a semiconductor packaging wafer slitting apparatus according to the present invention; Figure 11 This is a partial structural diagram of the top compartment of a semiconductor packaging wafer slitting apparatus according to the present invention; Figure 12 This is a partial structural diagram of the two connecting ports of a semiconductor packaging wafer slitting device according to the present invention.

[0021] 101. Housing; 102. Control Panel; 103. Wafer; 104. Head; 105. Adsorption Slide; 106. Electric Carriage; 107. Connecting Window; 108. Reciprocating Screw; 109. Hydraulic Rod; 110. Connecting Hoses; 111. Pump Chamber; 112. Transfer Platform; 113. Workbench; 114. Side Frame; 115. Opening One; 116. Connecting Pipe; 117. Water Outlet Pipe; 118. Nozzle; 119. Locking Column; 120. Monitoring Probe; 121. Carriage One; 122. Water Outlet; 123. Carriage Two; 124. Gear; 125. Gear; 126. Guide Bar; 127. Corrugated Seat; 128. Water Outlet Slot; 129. Horizontal Frame; 130. Connecting Ring Chamber; 31. Top compartment; 132. Inlet; 133. Guide pipe; 134. Connecting port one; 135. Connecting shaft; 136. Connecting pipe; 137. Connecting compartment; 138. Mounting head; 139. Limiting ring; 140. Opening two; 141. Chip groove; 142. Rotary groove; 143. Reserved opening; 144. Saw blade; 145. Sliding groove; 146. Straight through port; 147. Cover; 148. Bottom through port; 149. Trapezoidal opening; 150. Corrugated section; 151. Telescopic pipe; 152. Top spring; 153. Base plate; 154. Cavity; 155. Groove one; 156. Spray nozzle; 157. Guide impeller; 158. Rotary ring; 159. Groove two; 160. Fixing frame; 161. Connecting port two. Detailed Implementation

[0022] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0023] like Figures 1-6The semiconductor packaging wafer slitting apparatus shown includes a housing 101. A reciprocating screw 108 is mounted on the top of the housing 101. A suction slide 105 is fixedly connected to the moving part of the reciprocating screw 108. The suction slide 105 is slidably connected to the rear part of the housing 101. A transfer table 112 and an electric slide 106 are respectively mounted on both sides of the rear part of the housing 101. A worktable 113 is mounted on the front of the electric slide 106. Both the electric slide 106 and the transfer table 112 are located below the suction slide 105. The specific model of the above structure adopts the existing technology and will not be described in detail here. The worktable 113 and the transfer table 112 are used to support the wafer 103. A working cavity is provided in the front part of the housing 101. A pump chamber 111 is installed on the inner side wall of the working cavity. A hydraulic rod 109 is provided on the lower side of the pump chamber 111. The output end of the hydraulic rod 109 is fixedly connected to a machine head 104. A servo motor is installed inside the machine head 104. The servo motor drives... An installation head 138 is fixedly connected to the end. A limiting ring 139 is fixedly connected to the middle of the outer periphery of the installation head 138. A connecting chamber 137 is provided on one side of the limiting ring 139, and a saw blade 144 is provided on the other side of the limiting ring 139. Both sides of the outer periphery of the saw blade 144 have evenly distributed chip grooves 141 and rotary grooves 142. The chip grooves 141 are connected to each other through the rotary grooves 142. The periphery of the chip grooves 141 has evenly distributed reserved openings 143. An industrial vision camera is installed at the bottom of the machine head 104. A monitoring probe 120 is installed on one side of the machine head 104. The bottom detection end of the monitoring probe 120 is kept horizontal with the top surface of the lower wafer 103. The specific model is selected using existing technology, which will not be described in detail here. Multiple connecting windows 107 are opened around the periphery of the housing 101. The connecting windows 107 are used to dock with the robotic arm of the material transfer process. A control panel 102 is installed at the middle of the front end of the housing 101. The control panel 102 is used to control the electrical control equipment. Furthermore, in practical implementation, wafer dicing machines can be used to dic the wafers 103. Specifically, the front-mounted robotic arm places the wafers 103 to be diced onto the transfer table 112 through the connecting window 107. Then, the reciprocating screw 108 moves the adsorption slide 105 to the top of the transfer table 112 to adsorb the wafers 103. Simultaneously, the electric carriage 106 retracts, pulling the worktable 113 back to the rear. At this point, the adsorption slide 105, under the action of the reciprocating screw 108, moves the wafers 103 to the top of the worktable 113 and places them onto the transfer table. The wafer 103 is placed on the upper part of the worktable 113, which enables vacuum adsorption and fixation of the wafer 103. Then, the electric carriage 106 extends to push the worktable 113 and the wafer 103 back into the working chamber for subsequent dicing. During the actual dicing process, the motor inside the worktable 113 drives the top of the worktable 113 and the wafer 103 to rotate. Simultaneously, the hydraulic rod 109 drives the head 104 to move. During this process, the industrial vision camera at the bottom of the head 104 can capture and position the wafer 103 at the bottom, performing some of the subsequent positioning and dicing work. Afterwards, the servo motor in the head 104 is activated. A servo motor drives the mounting head 138 to rotate, which in turn drives the saw blade 144 mounted on its outer periphery to rotate at high speed. During this process, the hydraulic cylinder in the worktable 113 drives the top of the worktable 113 and the wafer 103 to rise and fall. This, combined with the forward and backward movement of the electric carriage 106 and the left and right lateral movement of the hydraulic rod 109, facilitates the saw blade 144's slitting of the wafer 103. During slitting, the monitoring probe 120 can detect the distance between the saw blade 144 and the wafer 103 in real time, ensuring the saw blade 144's cutting depth during slitting, which is beneficial for practical use. During the slitting process, the saw blade 144... 4. When rotating at high speed, the chip grooves 141 on both sides of the saw blade 144 can collect the chips remaining in the slit. At the same time, the guide groove 142 can connect the chip grooves 141. When the saw blade 144 rotates at high speed, under the action of centrifugal force, the excess chips can be guided to the adjacent chip grooves 141 or the reserved opening 143, which can significantly reduce the chip extrusion pressure in the slit and prevent the workpiece edge from being crushed. Furthermore, the groove 142 and the chip grooves 141 can facilitate the retention and guidance of coolant, thereby further improving the cooling effect on the cutting edge of the saw blade 144 and the inner wall of the slit, and preventing overheating from affecting the physical properties of the material and the processing quality.

[0024] The pump chamber 111 houses a pump unit. Two connecting hoses 110 are fixedly connected to the output end of the pump unit via connecting pipes 116 and 116, respectively. The ends of the connecting hoses 110 furthest from the pump chamber 111 are located inside the machine head 104. One end of one connecting hose 110 furthest from the pump chamber 111 is fixedly connected to two water outlet pipes 117 via a connector. Each water outlet pipe 117 is fixedly connected to a nozzle 118. Each nozzle 118 has a cavity 154 inside its wall. The inner wall of each cavity 154 has evenly distributed trapezoidal openings 149, all of which are inverted trapezoids. Each nozzle 118 has a spray nozzle 156 in the middle. A base plate 153 is fixedly connected to the lower part of each spray nozzle 156. A top spring 152 is fixedly connected to the upper part of each base plate 153. All springs 152 are fixedly connected to the top of telescopic tubes 151. The middle part of each telescopic tube 151 is set with a corrugated section 150. The top of each telescopic tube 151 is fixedly connected to the upper part of the spray nozzle 156. The lower part of the telescopic tube 151 and the corrugated section 150 are slidably connected to the inner wall of the spray nozzle 156. The lower part of the outer periphery of the telescopic tube 151 is provided with evenly distributed bottom openings 148. The bottom openings 148 are all corresponding to the trapezoidal openings 149. The lower part of the inner side wall of the cavity 154 is provided with evenly distributed slots 155. The slots 155 are all located on the lower side of the base plate 153. The trapezoidal openings 149 are all located on the upper side of the base plate 153. The slots 155 are all connected to the lower space of the base plate 153 and the cavity 154. The trapezoidal openings 149 are all connected to the upper space of the base plate 153 and the cavity 154. Furthermore, in specific implementation, the pump unit inside the pump compartment 111 can output coolant through the connecting hose 110 and the connecting pipe 116. The connecting hose 110 can guide the coolant output by the pump unit into the machine head 104. One of the connecting hoses 110 guides the coolant into the outlet pipe 117 and sprays it out through the nozzle 118. After entering the nozzle 118, the coolant will first contact the telescopic pipe 151. The top spring 152 at the bottom of the telescopic pipe 151 can provide a continuous pressure to the telescopic pipe 151. Due to the preload, coolant enters the cavity 154 through the bottom port 148 and trapezoidal port 149, and then exits through the slot 155 at the bottom of the cavity 154, finally being sprayed out through the spray nozzle 156. This cleans the saw blade 144 and the wafer 103 slitting groove, preventing debris from accumulating on the saw blade 144 or in the slitting groove and affecting subsequent slitting operations. In actual use, when processing wafers 103 of different materials, especially when slitting wafers 103 with hard substrates, this process ensures that the coolant on the side punch 114 and in the slitting groove is properly cleaned. When debris is ejected, the coolant water pressure is increased. During the slitting of wafers 103 with soft or brittle substrates, to avoid damage to the wafers 103 due to excessive water pressure, the coolant water pressure is reduced. During this process, when the water pressure entering through the outlet pipe 117 increases, the impact force of the coolant on the telescopic pipe 151 increases, and the compression of the top spring 152 increases simultaneously, causing the corrugated section 150 to extend. This results in relative displacement between the bottom of the telescopic pipe 151 and the inside of the nozzle 118. Because the trapezoidal opening 149 has an inverted trapezoidal design, the higher the input water pressure, the greater the compression of the top spring 152. The greater the movement of 52, the smaller the opening at the trapezoidal opening 149 corresponding to the bottom port 148, which further limits the output and thus further increases the overall output water pressure of the nozzle 118. Conversely, the smaller the input water pressure, the smaller the pressure on the top spring 152, the less the displacement of the telescopic tube 151, the larger the opening at the trapezoidal opening 149 corresponding to the bottom port 148, and the greater the output, which further reduces the output water pressure. This allows for adaptation to the changing load of the wafer 103 according to actual working conditions, which is beneficial for practical use.

[0025] One of the connecting hoses 110 has an inlet 132 fixedly connected to one end away from the pump compartment 111. A top compartment 131 is fixedly connected to the bottom of the inlet 132. A guide impeller 157 is installed in the upper part of the top compartment 131. A fixed frame 160 is rotatably connected to the upper part of the shaft of the guide impeller 157. The fixed frame 160 is fixedly connected inside the top compartment 131. A rotating ring 158 is fixedly connected to the lower part of the shaft of the guide impeller 157. A slot 159 is opened on one side of the lower part of the rotating ring 158. Both sides of the lower outer periphery of the top compartment 131 are fixedly connected to conduits 133. The ends of the conduits 133 away from the top compartment 131 are fixedly connected to a connecting... The annular chamber 130 is connected to a connecting shaft 135 in the middle. Both sides of the connecting shaft 135 are rotatably connected to a crossbeam 129 through sealed bearings. The crossbeams 129 are connected to the inside of the connecting shaft 135. The crossbeams 129 are set on both sides of the saw blade 144. The ends of the crossbeams 129 that are close to each other are provided with evenly distributed water outlet grooves 128. The top chamber 131 is set in the upper part of the machine head 104. The end of the machine head 104 away from the hydraulic rod 109 is provided with a sliding groove 145. The ends of the connecting shaft 135 and the crossbeams 129 are both set inside the sliding groove 145. The connecting shaft 135 is slidably connected to the sliding groove 145. Furthermore, in specific implementation, the connecting hose 110 introduces coolant into the top chamber 131 through the inlet 132. A portion of the coolant in the top chamber 131 is then discharged through the slot 159 on one side of the rotating ring 158 and enters the conduit 133 on one side. Through the conduit 133, in conjunction with the connected connecting ring chamber 130 and connecting shaft 135, the coolant can be further introduced into the crossbeam 129. The water outlet 128 on the crossbeam 129 forms an oblique jet on both sides of the saw blade 144, achieving focused cleaning of debris from the pre-reserved opening 143, chip groove 141, and vortex groove 142 on the saw blade 144. Since the rotating ring 158 rotates with the guide impeller 157, when… When the rotating ring 158 rotates, the position of the slot 159 changes accordingly, thereby synchronously changing the connection path of the coolant and switching the connection state of the two conduits 133. When the coolant enters the different conduits 133, under the action of water pressure, it will drive the connecting shaft 135 and the crossbeam 129 to tilt to that side. Furthermore, when the rotating ring 158 rotates, due to the continuous switching of the connection state of the two conduits 133, the crossbeam 129 will continuously reciprocate under the limit of the slide groove 145. During the processing, the upper area of ​​the saw blade 144 is thoroughly cleaned, avoiding stubborn debris from getting stuck in the reserved opening 143 and causing cleaning dead angles due to angle issues, which is beneficial for actual continuous cutting work.

[0026] The top compartment 131 has a fixed connection port 134 at its bottom. The end of the connection port 134 away from the top compartment 131 is fixedly connected to a connecting pipe 136. The connecting compartment 137 is rotatably connected to the mounting head 138 through a sealed bearing. The mounting head 138 has evenly distributed connecting ports 161 on its outer periphery. The connecting compartment 137 is connected to the interior of the mounting head 138 through the connecting ports 161. The upper part of the connecting compartment 137 is fixedly connected to the connecting pipe 136. The saw blade 144 has a cover 147 on its side away from the limiting ring 139. The cover 147 is engaged with the outer side of the end of the mounting head 138. The end of the cover 147 away from the saw blade 144 is provided with a locking pin 119. The locking pin 119 is installed in the middle of the end of the mounting head 138 through a central threaded pin. The cover 147 has evenly distributed straight through ports 146 on its periphery. The straight through ports 146 are connected to one of the sets of openings 140. Furthermore, in specific implementation, after the coolant is introduced into the top chamber 131 through the connecting hose 110, the coolant will first come into contact with the guide impeller 157. The continuously entering coolant will drive the guide impeller 157 to rotate. When the guide impeller 157 rotates, it will drive the bottom fixed rotating ring 158 to rotate synchronously. Then, some coolant will enter the connecting pipe 136 through the bottom connecting port 134. The coolant can be introduced into the connecting chamber 137 through the connecting pipe 136. Through the connection of the second connecting port 161, the coolant can be further introduced into the mounting head 138. Then, through the two sets of openings 140 on the mounting head 138 and the straight through port 146, the coolant can be released, forming a full-coverage water curtain jet on both sides of the saw blade 144, completing the comprehensive cleaning of both sides of the saw blade 144, which is conducive to continuous processing.

[0027] The connecting pipe 116 is fixedly connected to a side punch 114 at the end away from the pump compartment 111. The lower part of the side punch 114, near the wafer 103, has a parallel opening 115. Slide 121 and slide 2 123 are slidably connected inside the opening 115. Both slide 121 and slide 2 123 have through-holes 122 in the middle. Corrugated seats 127 are fixedly connected to both ends of slide 121 and slide 2 123. The ends of the corrugated seat 127 are fixedly connected to the inner wall of the opening 115. Guide bars 126 are fixedly connected to the side of the slide 121 and slide 2 123 that are close to each other. Gears 125 are arranged between the guide bars 126. The end of the guide bar 126 that is close to the gear 125 is provided with a tooth groove 124. The tooth groove 124 is meshed with the gear 125. A stepper motor is installed at the middle shaft end of the gear 125. The stepper motor is installed inside the side punch 114. Furthermore, in specific implementation, coolant can be introduced into the side flushing frame 114 through the connecting pipe 116, and then the coolant will be sprayed out through the outlet 122 to clean up the debris generated during the cutting process. The outlet 122 is elongated, so that the coolant sprays out in a water curtain shape, which can effectively reduce the cleaning dead angles that may exist when the traditional columnar coolant column is working, and avoid affecting the subsequent cutting work. At the same time, the outlets 122 on the first slide 121 and the second slide 123 are staggered to form a complementary arrangement, which can further reduce the cleaning dead angles. In specific use, the stepper motor can drive the gear 125 to reciprocate. When the gear 125 rotates, it will drive the first slide 121 and the second slide 123 to move synchronously through the meshing tooth groove 124, which can adjust the range of the water curtain sprayed from the outlet 122 and supplement the cleaning dead angles, which is beneficial to the washing of debris during the actual cutting process.

[0028] Working principle: In practical use, wafer dicing machines can be used to dice wafers 103. Specifically, the front robotic arm places the wafer 103 to be diced onto the transfer table 112 through the connecting window 107. Then, the reciprocating screw 108 drives the adsorption slide 105 to move, allowing it to reach the top of the transfer table 112 and adsorb the wafer 103 on it. Simultaneously, the electric carriage 106 retracts, pulling the worktable 113 back to the rear. At this point, the adsorption slide 105, under the action of the reciprocating screw 108, moves the wafer 103 to the top of the worktable 113 and places it there. The worktable 113 then enables the dicing of the wafer 103. The wafer 103 is vacuum-adsorbed and fixed. Then, the electric carriage 106 extends to push the worktable 113 and wafer 103 back into the working chamber for subsequent dicing. During the actual dicing process, the motor inside the worktable 113 drives the top of the worktable 113 and the wafer 103 to rotate. Simultaneously, the hydraulic rod 109 moves the head 104. During this process, the industrial vision camera at the bottom of the head 104 can capture and position the wafer 103 at the bottom, performing some of the subsequent positioning and dicing work. Afterward, the servo motor in the head 104 is activated, driving the mounting head 138 to rotate. The mounting head 138 then drives the peripherally mounted saw blade 144 to rotate at high speed. During the rotation, the hydraulic cylinder in the worktable 113 drives the top of the worktable 113 and the wafer 103 to rise and fall. This, combined with the forward and backward movement of the electric carriage 106 and the left and right lateral movement of the hydraulic rod 109, facilitates the saw blade 144's slitting of the wafer 103. During the slitting process, when the saw blade 144 rotates at high speed, the chip grooves 141 on both sides of the saw blade 144 can collect the chips remaining in the slitting kerf. Simultaneously, the guide groove 142 connects the various chip grooves 141. Under centrifugal force, excessive chips in certain areas can be guided to adjacent chip grooves 141 or pre-drilled openings 143 during the high-speed rotation of the saw blade 144, thereby significantly reducing the chip compression pressure within the slitting kerf. To prevent workpiece edges from being crushed, the swirl groove 142 and chip groove 141 facilitate coolant retention and guidance, thereby further improving the cooling effect on the cutting edge of the saw blade 144 and the inner wall of the slit, preventing overheating from affecting the physical properties of the material and the processing quality. The pump unit inside the pump chamber 111 can output coolant through the connecting hose 110 and connecting pipe 116. The connecting pipe 116 can guide the coolant into the side punch 114, and then the coolant will be sprayed out through the outlet 122 to clean up the debris generated during slitting. The outlet 122 is elongated, so that the coolant is sprayed out in a water curtain shape, which can effectively reduce the cleaning dead corners that may exist when the traditional columnar coolant column is working.To avoid affecting subsequent slitting operations, the water outlets 122 on slide 121 and slide 223 are staggered to complement each other, further reducing cleaning dead zones. In actual use, the stepper motor drives the gear 125 to reciprocate. When the gear 125 rotates, it drives slide 121 and slide 223 to move synchronously through the meshing tooth groove 124. This allows for adjustment of the water spray range from the water outlet 122 and supplementation of cleaning dead zones, which is beneficial for washing away debris during actual slitting. During actual slitting, the monitoring probe 120 can detect the distance between the probe and the wafer 103 in real time, thus ensuring the cutting depth of the saw blade 144 during slitting, which is beneficial for actual use. The coolant pumped from the pump unit can be introduced into the machine head 104 through the connecting hoses 110. One connecting hose 110 introduces the coolant into the top chamber 131 through the inlet 132, while the other connecting hose 110 introduces the coolant into the outlet pipe 117. The coolant is then sprayed out through the nozzle 118. After entering the nozzle 118, the coolant first contacts the telescopic pipe 151. The top spring 152 at the bottom of the telescopic pipe 151 provides a continuous preload. The coolant then enters the cavity 154 through the bottom opening 148 and the trapezoidal opening 149, and is then discharged through the slot 155 at the bottom of the cavity 154, finally being sprayed out through the spray nozzle 156, thus achieving the cutting of the saw blade 144 and the wafer. Cleaning the slitting groove 103 prevents debris from accumulating on the saw blade 144 or in the slitting groove, which could affect subsequent slitting operations. In actual use, when processing wafers 103 of different materials, when slitting wafers 103 with hard substrates, the coolant pressure is increased to ensure that debris on the side punch 114 and in the slitting groove is flushed out. When slitting wafers 103 with soft or brittle substrates, the coolant pressure is decreased to avoid damaging the wafers 103 with excessively high water pressure. During this process, when the water pressure input to the outlet pipe 117 increases, the impact force of the coolant on the telescopic pipe 151 increases, and the compression of the top spring 152 increases simultaneously, causing the corrugated section 150 to extend. This results in relative displacement between the bottom of the telescopic pipe 151 and the inside of the nozzle 118. Because the trapezoidal opening 149 is an inverted trapezoidal design, the greater the input water pressure, the greater the movement of the top spring 152, and the smaller the opening at the trapezoidal opening 149 corresponding to the bottom opening 148. This further limits the output, thereby increasing the overall output water pressure of the nozzle 118. Conversely, when the input water pressure is lower, the pressure on the top spring 152 is smaller, the displacement of the telescopic tube 151 is less, the opening at the trapezoidal opening 149 corresponding to the bottom opening 148 is larger, and the output is greater, thus further reducing the output water pressure. This allows for adaptation to the variable load of the wafer 103 according to actual working conditions, which is beneficial for practical use. Furthermore, after the coolant is introduced into the top chamber 131 through the connecting hose 110, the coolant will first contact the guide impeller 157.The continuously flowing coolant drives the guide impeller 157 to rotate, which in turn drives the fixed rotating ring 158 at the bottom to rotate synchronously. Some of the coolant then enters the connecting pipe 136 through the bottom connecting port 134. The connecting pipe 136 guides the coolant into the connecting chamber 137. Through the connecting port 161, the coolant is further guided into the mounting head 138. Then, through the two sets of openings 140 on the mounting head 138 and the straight through-hole 146, the coolant is released, forming a full-coverage water curtain jet on both sides of the saw blade 144, thoroughly cleaning both sides of the saw blade 144 and facilitating continuous processing. Furthermore, some coolant in the top chamber 131 is discharged through the slot 159 on one side of the rotating ring 158 and enters the conduit 133 on one side. Through the conduit 133, in conjunction with the connected connecting ring chamber 130 and the connecting shaft 135, the coolant is further guided into the crossbeam 129. The water outlet 128 on the crossbeam 129 forms an oblique jet on both sides of the saw blade 144, achieving focused cleaning of debris inside the pre-reserved opening 143, chip groove 141, and swirl groove 142 on the saw blade 144. Since the rotating ring 158 rotates with the guide impeller 157, the position of the second groove 159 changes accordingly, thus synchronously altering the coolant's connection path and switching the connection state of the two conduits 133. When the coolant enters different conduits 13... 3. Inside, under water pressure, the connecting shaft 135 and the crossbeam 129 tilt to that side. Furthermore, as the rotating ring 158 rotates, the continuous switching of the connection state between the two guide tubes 133 causes the crossbeam 129 to continuously reciprocate under the constraint of the sliding groove 145. This achieves comprehensive cleaning of the upper area of ​​the saw blade 144 during processing, preventing stubborn debris from getting stuck in the pre-reserved opening 143 and creating cleaning dead zones due to angle issues, which is beneficial for continuous cutting operations.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention. The scope of protection claimed by the appended claims and their equivalents is defined.

Claims

1. A semiconductor packaging wafer slitting apparatus, comprising a housing (101), characterized in that: A working chamber is provided at the front of the housing (101). A pump chamber (111) is installed on the inner side wall of the working chamber. A hydraulic rod (109) is provided on the lower side of the pump chamber (111). The output end of the hydraulic rod (109) is fixedly connected to a machine head (104). A servo motor is installed inside the machine head (104). An installation head (138) is fixedly connected to the drive end of the servo motor. A limit ring (139) is fixedly connected to the middle of the outer periphery of the installation head (138). A connecting chamber (137) is provided on one side of the limit ring (139). A saw blade (144) is provided on the other side of the limit ring (139). 44) Both sides of the outer perimeter are provided with uniformly distributed chip grooves (141) and swirl grooves (142). The chip grooves (141) are connected to each other through the swirl grooves (142). The periphery of the chip grooves (141) is provided with uniformly distributed reserved openings (143). The pump chamber (111) is provided with a pump set. The output end of the pump set is respectively fixedly connected to two connecting hoses (110) via connecting pipes (116). The ends of the connecting hoses (110) away from the pump chamber (111) are all located inside the machine head (104). One end of the connecting hose (110) away from the pump chamber (111) is fixed by a connector. Two water outlet pipes (117) are connected. The other connecting hose (110) is fixedly connected to an inlet (132) at one end away from the pump compartment (111). The bottom of the inlet (132) is fixedly connected to a top compartment (131). A guide impeller (157) is provided in the upper part of the top compartment (131). A fixed frame (160) is rotatably connected to the upper part of the shaft of the guide impeller (157). The fixed frame (160) is fixedly connected to the inside of the top compartment (131). A rotating ring (158) is fixedly connected to the lower part of the shaft of the guide impeller (157). A slot (159) is opened on one side of the lower part of the rotating ring (158). The top chamber (131) has a guide tube (133) fixedly connected to both sides of the lower outer periphery. The end of the guide tube (133) away from the top chamber (131) is fixedly connected to a connecting ring chamber (130). The middle of the connecting ring chamber (130) is fixedly connected to a connecting shaft (135). The two sides of the connecting shaft (135) are rotatably connected to a cross frame (129) through a sealed bearing. The cross frame (129) is connected to the inside of the connecting shaft (135). The cross frame (129) is set on both sides of the saw blade (144). The ends of the cross frame (129) that are close to each other are provided with evenly distributed water outlet grooves (128).

2. The semiconductor packaging wafer slitting apparatus according to claim 1, characterized in that: Each of the water outlet pipes (117) is fixedly connected to a nozzle (118). Each nozzle (118) has an interior cavity (154). Each cavity (154) has a uniformly distributed trapezoidal opening (149) in the middle of its inner sidewall. Each trapezoidal opening (149) is an inverted trapezoid. Each nozzle (118) has a spray nozzle (156) in the middle. Each spray nozzle (156) has a fixed base plate (153) in the lower part of its inner side. Each base plate (153) has a fixed top spring (152) in the upper part of its upper side. Each top spring (152) has a fixed telescopic tube (151) in the top of its upper side. Each telescopic tube (151) has a corrugated section (150) in the middle. Each telescopic tube (151) has a fixed top connection to the spray nozzle. 156) The lower part of the telescopic tube (151) and the corrugated section (150) are slidably connected to the inner wall of the spray nozzle (156). The lower part of the outer periphery of the telescopic tube (151) is provided with uniformly distributed bottom openings (148). The bottom openings (148) are all corresponding to the trapezoidal openings (149). The lower part of the inner side wall of the cavity (154) is provided with uniformly distributed slots (155). The slots (155) are all located on the lower side of the bottom plate (153). The trapezoidal openings (149) are all located on the upper side of the bottom plate (153). The slots (155) are all connected to the lower space of the bottom plate (153) and the cavity (154). The trapezoidal openings (149) are all connected to the upper space of the bottom plate (153) and the cavity (154).

3. The semiconductor packaging wafer slitting apparatus according to claim 1, characterized in that: A cover (147) is provided on the side of the saw blade (144) away from the limiting ring (139). The cover (147) is engaged on the outer side of the end of the mounting head (138). A locking pin (119) is provided on the end of the cover (147) away from the saw blade (144). The locking pin (119) is installed in the middle of the end of the mounting head (138) through a central threaded pin. The cover (147) has evenly distributed straight through openings (146) around its periphery. The straight through openings (146) are connected to one of the two sets of openings (140).

4. The semiconductor packaging wafer slitting apparatus according to claim 1, characterized in that: The bottom of the top chamber (131) is fixedly connected to a first connecting port (134). The end of the first connecting port (134) away from the top chamber (131) is fixedly connected to a connecting pipe (136). The connecting chamber (137) is rotatably connected to the mounting head (138) through a sealed bearing. The mounting head (138) has a uniformly distributed second connecting port (161) on its outer periphery. The connecting chamber (137) is connected to the interior of the mounting head (138) through the second connecting port (161). The upper part of the connecting chamber (137) is fixedly connected to a connecting pipe (136). The top chamber (131) is located in the upper part of the machine head (104). The end of the machine head (104) away from the hydraulic rod (109) is provided with a sliding groove (145). The ends of the connecting shaft (135) and the cross frame (129) are both located inside the sliding groove (145). The connecting shaft (135) is slidably connected to the sliding groove (145).

5. The semiconductor packaging wafer slitting apparatus according to claim 1, characterized in that: The end of the connecting pipe (116) away from the pump chamber (111) is fixedly connected to a side punch (114). The side punch (114) has a parallel opening (115) on the side near the wafer (103) at the bottom. The inner side of the opening (115) is slidably connected to a slide (121) and a slide (123). The middle of the slide (121) and the slide (123) is open and closed with a through outlet (122). The two ends of the slide (121) and the slide (123) are fixedly connected to a corrugated seat (127). The ends of the corrugated seats (127) are fixedly connected to the inner wall of the opening (115). The sides of the slide (121) and the slide (123) that are close to each other are fixedly connected to a guide bar (126). A gear (125) is provided between the guide bars (126).

6. The semiconductor packaging wafer slitting apparatus according to claim 5, characterized in that: The guide bar (126) has a toothed groove (124) at one end near the gear (125), and the toothed groove (124) is meshed with the gear (125). A stepper motor is installed at the middle shaft end of the gear (125), and the stepper motor is installed inside the side punch (114).

7. The semiconductor packaging wafer slitting apparatus according to claim 1, characterized in that: A reciprocating screw (108) is installed at the top inside the housing (101). The moving part of the reciprocating screw (108) is fixedly connected to an adsorption slide (105). The adsorption slide (105) is slidably connected to the rear part inside the housing (101).

8. The semiconductor packaging wafer slitting apparatus according to claim 7, characterized in that: The housing (101) has a transfer platform (112) and an electric slide (106) installed on both sides of the rear part. The electric slide (106) has a worktable (113) installed at the front. The electric slide (106) and the transfer platform (112) are both located under the adsorption slide (105). The worktable (113) and the transfer platform (112) are both used to support the wafer (103).

9. The semiconductor packaging wafer slitting apparatus according to claim 1, characterized in that: An industrial vision camera is installed at the bottom of the machine head (104), and a monitoring probe (120) is installed on one side of the machine head (104). The bottom detection end of the monitoring probe (120) is kept horizontal with the top surface of the lower wafer (103).

10. A semiconductor packaging wafer slitting apparatus according to claim 1, characterized in that: The housing (101) has multiple connecting windows (107) around its periphery. The connecting windows (107) are all used to connect to the robotic arm of the material transfer process. A control panel (102) is installed in the middle of the front end of the housing (101). The control panel (102) is used to control the electrical control equipment.

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