An organic gold compound, a resin gold paste, a preparation method and a conductive thin film

Abstract

The application relates to the technical field of semiconductors, sensors and power electrical appliances, and provides an organic gold compound, a resin gold paste, a preparation method and a conductive film. + The application reacts chloroauric acid, an amino sulfide and an alcohol water mixed solvent to obtain an Au + containing solution; the Au + containing solution is mixed with a trithiol to react, and an organic gold compound is obtained. The amino sulfide and the trithiol are used as a composite ligand, the stability and gold content of the organic gold compound can be remarkably improved, the resin gold paste prepared from the organic gold compound has a bright and dense gold film formed through sintering, has good adhesion, has low sheet resistance, and is suitable for electronic component products such as thermal sensitive print heads, capacitive sensors and the like.

Description

Technical Field

[0001] This invention relates to the fields of semiconductor, sensor and power electrical appliance technology, and in particular to an organogold compound, a resin gold paste, a preparation method and a conductive thin film. Background Technology

[0002] Resin gold paste was initially used primarily in the decorative applications of glass and ceramics. With the miniaturization, flexibility, and high performance of electronic devices, its superior conductivity has made it a research hotspot in the field of electronic materials. Resin gold paste typically consists of organometallic compounds, organometallic additives, and organic carriers. It can be uniformly coated onto the surface of substrates such as ceramics and glass using processes such as screen printing, spraying, or spin coating, forming a dense, micron-sized conductive gold film after sintering. Compared to traditional thick-film gold pastes, resin gold paste offers advantages such as uniform film formation, good printability, excellent dispersibility, and controllable cost, thus demonstrating significant application value in fields such as thermal printheads, capacitive sensors, and flexible electronic devices.

[0003] In resin-based gold pastes, organogold compounds serve as the core functional component, and their gold content directly determines the paste's performance, process applicability, and final product reliability. Insufficient gold content in the resin-based gold paste makes it difficult to form continuous conductive pathways during sintering; the pores remaining after the organic carrier volatilizes cannot be fully filled, leading to decreased film density and reliability. Low gold content also forces an increase in the ratio of organic solvent to resin, causing viscosity fluctuations and affecting printing results.

[0004] Therefore, developing organogold compounds with high gold content and corresponding resin gold paste preparation processes is of great significance for promoting the development of advanced electronic manufacturing technology. Summary of the Invention

[0005] In view of this, the present invention provides an organogold compound, a resin gold paste, a preparation method, and a conductive film. The organogold compound provided by the present invention has a high gold content and good stability. The gold film formed by sintering the resin gold paste prepared using the compound is bright, dense, has good adhesion, and low sheet resistance.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solution: A method for preparing an organogold compound includes the following steps: (1) Chloroauric acid, amino sulfide and alcohol-water mixed solvent are reacted to obtain Au-containing... + Solution; (2) The Au-containing + The solution and trithiol were mixed and reacted to yield an organogold compound.

[0007] Preferably, the alcohol in the alcohol-water mixed solvent is ethanol, and the volume ratio of alcohol to water in the alcohol-water mixed solvent is 1~3:1; The molar ratio of the aminosulfide to chloroauric acid is 0.6 to 2.4:1; the aminosulfide includes one or both of 2,2'-diaminodiphenyl sulfide and 4,4'-diaminodiphenyl sulfide. The reaction temperature in step (1) is 70℃~90℃ and the reaction time is 3h~5h.

[0008] Preferably, the molar ratio of the trithiol to chloroauric acid is 0.6 to 1.8:1, and the trithiol includes one or both of trithiocyanate and benzene-1,3,5-trimethylthiol; The reaction temperature in step (2) is 70℃~90℃, and the reaction time is 2h~4h.

[0009] The present invention also provides an organogold compound prepared by the preparation method described above, wherein the gold content of the organogold compound is 45-58 wt%.

[0010] The present invention also provides a resin gold paste, comprising the following components by mass percentage: 40% to 60% of the organogold compound of claim 4, 1% to 10% of the organometallic compound, and 30% to 55% of the organic carrier.

[0011] Preferably, the organometallic compounds include organobismuth, organochromium, organosilicon, and organorhodium; by mass percentage, the resin gold paste includes 1%~5% organobismuth, 0.2%~2% organochromium, 0.1%~1% organosilicon, and 0.1%~2% organorhodium.

[0012] Preferably, the organobismuth comprises one or more of bismuth acetate, bismuth isooctanoate, bismuth laurate, and bismuth neodecanoate; the organochromium comprises one or more of chromium acetate, chromium isooctanoate, and chromium neodecanoate; the organosilicon comprises one or more of silicon 2-ethylhexanoate and silicon tetraacetate; and the organorhodium comprises one or more of rhodium acetate, rhodium isooctanoate, and rhodium octanoate.

[0013] Preferably, the organic carrier comprises an organic solvent and a polymeric resin, wherein the organic solvent accounts for 50% to 80% by mass and the polymeric resin accounts for 20% to 50% by mass. The organic solvent includes one or more of terpineol, turpentine oil, rosemary oil, dibutyl phthalate, cyclohexanone, diethylene glycol monobutyl ether, and caryophyllene; the polymer resin includes one or more of phenolic resin, ethyl cellulose, epoxy resin, acrylic resin, butanol-modified urea-formaldehyde resin, and polyvinyl butyral resin.

[0014] The present invention also provides a method for preparing the resin gold paste described above, comprising the following steps: The resin gold paste is obtained by mixing an organometallic compound, an organometallic compound, and an organic carrier.

[0015] The present invention also provides a conductive film, which is prepared from the resin gold paste described in the above scheme or the resin gold paste prepared by the preparation method described in the above scheme.

[0016] This invention provides a method for preparing organogold compounds, comprising the following steps: (1) reacting chloroauric acid, amino sulfide and an alcohol-water mixed solvent to obtain an Au-containing compound. + Solution; (2) The Au-containing solution + The solution and trithiol are mixed and reacted to obtain an organogold compound. This invention uses an aminosulfide and trithiol as a complex ligand, which can significantly improve the stability and gold content of the organogold compound; wherein, the aminosulfide has both a thioether group (S) and an amino group (-NH2) as bifunctional coordination sites, and can react with gold ions (Au). 3+ / Au + The trithiol forms a multidentate chelate structure; after combining with gold ions, it can construct a three-dimensional cross-linked network. The two coordinate synergistically, which not only enhances the stability of organogold compounds but also improves the utilization rate of gold ions, thereby effectively increasing the gold content of organogold compounds.

[0017] This invention also provides a resin gold paste, comprising, by weight percentage: 40%–60% of the organogold compound described above, 1%–10% of an organometallic compound, and 30%–55% of an organic carrier. The resin gold paste prepared using the organogold compound of this invention produces a bright, dense gold film upon sintering, exhibiting good adhesion and a sheet resistance of less than 150 mΩ / □ when the film thickness is 0.5–2 μm. This makes it suitable for electronic components such as thermal printheads and capacitive sensors. Attached Figure Description

[0018] Figure 1 The gold film formed by printing the resin gold paste prepared in Example 5 onto a ceramic sheet under a 325-mesh screen and sintering is shown in the SEM image under a scanning electron microscope. Detailed Implementation

[0019] This invention provides a method for preparing organogold compounds, comprising the following steps: (1) Chloroauric acid, amino sulfide and alcohol-water mixed solvent are reacted to obtain Au-containing... + Solution; (2) The Au-containing + The solution and trithiol were mixed and reacted to yield an organogold compound.

[0020] This invention involves reacting chloroauric acid, amino sulfide, and an alcohol-water mixed solvent to obtain an Au-containing product. + Solution. In this invention, the chloroauric acid is preferably chloroauric acid tetrahydrate; the alcohol in the alcohol-water mixed solvent is preferably ethanol, and the volume ratio of alcohol to water in the alcohol-water mixed solvent is preferably 1~3:1, specifically 1:1, 2:1 or 3:1; the molar ratio of aminosulfide to chloroauric acid is preferably 0.6~2.4:1, specifically 0.6:1, 0.7:1, 1:1, 1.2:1, 1.4:1, 1.5:1, 2:1 or 2.4:1; the aminosulfide preferably includes one or two of 2,2'-diaminodiphenyl sulfide and 4,4'-diaminodiphenyl sulfide. Preferably, the chloroauric acid is first dissolved in the alcohol-water mixed solvent to obtain a chloroauric acid solution, and then the aminosulfide is added for reaction; the concentration of gold in the chloroauric acid solution is preferably 50~200 g / L, specifically 50, 100, 150 or 200 g / L.

[0021] In this invention, the reaction temperature in step (1) is preferably 70℃~90℃, specifically 70℃, 80℃ or 90℃, and the reaction time is preferably 3h~5h, specifically 3, 4 or 5h; the reaction is carried out under stirring conditions, and the stirring speed is preferably 800~1800 r / min. During the reaction, aminosulfide reacts with Au in the solution. 3+ Restore to Au + And form Au + -Aminothioether chelates.

[0022] After obtaining the gold-containing solution, the present invention will... + A solution and trithiol are mixed and reacted to obtain an organogold compound. In this invention, the molar ratio of trithiol to chloroauric acid is preferably 0.6~1.8:1, specifically 0.6:1, 0.8:1, 1:1, 1.15:1, 1.4:1, 1.6:1, or 1.8:1. The trithiol preferably includes one or both of trithiocyanate and benzene-1,3,5-trimethylthiol. The reaction temperature is preferably 70℃~90℃, specifically 70℃, 80℃, or 90℃, and the reaction time is preferably 2h~4h, specifically 2, 3, or 4h. The reaction is carried out under stirring conditions, and the stirring speed is preferably 800~1800 r / min. During the reaction, Au... + - An amino sulfide chelate and a trithiol form a three-dimensional cross-linked gold complex.

[0023] After the reaction in step (2) is completed, the present invention preferably allows the obtained reaction solution to stand at room temperature for 1 to 5 hours to obtain a dark brown precipitate and a supernatant. The dark brown precipitate is poured into ethanol and washed repeatedly several times, and then filtered and dried to obtain an organogold compound.

[0024] The present invention also provides an organogold compound prepared by the preparation method described above, wherein the gold content of the organogold compound is preferably 45-58 wt%.

[0025] The present invention also provides a resin gold paste, which, by mass percentage, comprises the following components: 40% to 60% of the organogold compound described in the above scheme, 1% to 10% of the organometallic compound, and 30% to 55% of the organic carrier.

[0026] The resin gold paste provided by the present invention comprises 40% to 60% organogold compounds by weight percentage, specifically 40%, 45%, 50%, 55% or 60%; the organogold compounds are the organogold compounds described in the above scheme, and will not be repeated here.

[0027] The resin gold paste provided by the present invention comprises 1% to 10% organometallic compounds by weight percentage, specifically 1%, 4%, 5%, 8%, or 10%; the organometallic compounds preferably include organobismuth, organochromium, organosilicon, and organorhodium; the resin gold paste preferably comprises 1% to 5% organobismuth, specifically 2%, 2.3%, 2.8%, 2.9%, 3.3%, or 4% by weight percentage, organochromium 0.2% to 2%, specifically 0.3%, 0.5%, 1.3%, 1.5%, 1.6%, 1.8%, or 2%, organosilicon 0.1% to 1%, specifically 0.3%, 0.4%, 0.5%, or 0.8%, and organorhodium 0.1% to 2%, specifically 0.4%, 0.6%, 1%, 1.5%, or 1.8%.

[0028] In this invention, the organobismuth preferably includes one or more of bismuth acetate, bismuth isooctanoate, bismuth laurate, and bismuth neodecanoate; the organochromium preferably includes one or more of chromium acetate, chromium isooctanoate, and chromium neodecanoate; the organosilicon preferably includes one or more of 2-ethylhexanoate and tetraacetic acid; and the organorhodium preferably includes one or more of rhodium acetate, rhodium isooctanoate, and rhodium octanoate. This invention, by adding organometallic compounds, can generate a stable oxide dispersion phase during sintering, filling the micropores inside the gold film, refining the gold grain size, thereby improving the density, hardness, wear resistance, and bonding strength between the gold film and the substrate.

[0029] The resin gold paste provided by the present invention comprises 30% to 55% organic carrier by weight percentage, specifically 35%, 36%, 44%, 45%, or 54%; the organic carrier preferably comprises organic solvent and polymer resin, wherein the organic solvent preferably accounts for 50% to 80% by weight, specifically 57.8%, 59%, 59.25%, 60%, or 77.8%, and the polymer resin preferably accounts for 20% to 50% by weight, specifically 22.2%, 40%, 40.75%, 41%, or 42.2%; the organic solvent preferably comprises one or more of terpineol, turpentine oil, rosemary oil, dibutyl phthalate, cyclohexanone, diethylene glycol monobutyl ether, and caryophyllene; and the polymer resin preferably comprises one or more of phenolic resin, ethyl cellulose, epoxy resin, acrylic resin, butanol-modified urea-formaldehyde resin, and polyvinyl butyral resin. The present invention preferably uses the above-mentioned organic carrier, which can impart suitable viscosity and rheological properties to the resin gold paste, enabling it to have good leveling properties during screen printing and improving the printability of the resin gold paste.

[0030] In this invention, the resin gold paste operates at a low shear rate D = 10~30s. -1 The viscosity is 50~90 Pa·s at low shear rates and 80~100 s⁻¹ at high shear rates. -1 The viscosity is 20-35 Pa·s. The gold content of the resin gold paste is 20-28 wt%.

[0031] The present invention also provides a method for preparing the resin gold paste described above, comprising the following steps: The resin gold paste is obtained by mixing an organometallic compound, an organometallic compound, and an organic carrier.

[0032] In this invention, the preferred method for preparing the organic carrier is to dissolve the polymer resin in an organic solvent under heating conditions to obtain the organic carrier.

[0033] In this invention, the mixing is preferably carried out by stirring and mixing the organometallic compound, the organometallic compound, and the organic carrier in an agate mortar, followed by rolling; the rolling is preferably carried out in a three-roll mill; the mixing temperature is preferably room temperature; this invention does not have special requirements for the stirring and rolling time, as long as the components are fully and evenly mixed.

[0034] The present invention also provides a conductive thin film prepared from the resin paste described in the above scheme.

[0035] In this invention, the conductive film has a thickness of 0.5~2μm, preferably 0.5~1μm, and a sheet resistance of ≤150mΩ / □, preferably 100~130mΩ / □.

[0036] In this invention, the preferred method for preparing the conductive film is as follows: printing resin gold paste on the surface of a substrate, followed by leveling and sintering to obtain the conductive film; the printing is preferably screen printing; the substrate is preferably a ceramic substrate; the sintering preferably includes a first stage sintering and a second stage sintering, wherein the temperature of the first stage sintering is preferably 125°C and the holding time is preferably 15 minutes, and the temperature of the second stage sintering is preferably 850°C and the holding time is preferably 30 minutes.

[0037] The technical solutions of this invention will be clearly and completely described below with reference to the embodiments thereof. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0038] Example 1: Preparation of organogold compound 1# (1) Add ethanol and deionized water (hereinafter referred to as alcohol-water mixed solvent) to the reaction vessel, wherein the volume ratio of ethanol to water is 1:1. Dissolve 10.42g of chloroauric acid tetrahydrate completely in 100mL of alcohol-water mixed solvent to make the gold mass concentration in the mixed solution 50g / L, and obtain chloroauric acid solution.

[0039] (2) Under heating and stirring conditions at 75℃, 8g of 4,4'-diaminodiphenyl sulfide ligand was added to the chloroauric acid solution. The reaction time was 3h, and the stirring speed was 1500 r / min, so that the Au concentration in the solution increased. 3+ Restored to Au + Obtain Au-containing + Solution.

[0040] (3) The Au-containing product obtained from the reaction + 5.4 g of trithiocyanate reagent was added to the solution, and the reaction time was 4 h. The reaction temperature was 75 °C, and the stirring speed was 1500 r / min. After the reaction was completed, the product was poured into ethanol, and after repeated washing and filtration, a stable dark brown powder was obtained. After drying at 80 °C, an organogold compound powder was obtained. The gold content of the obtained powder was calculated to be 46.0 wt% after sintering at 800 °C.

[0041] Example 2: Preparation of organogold compound 2# (1) Add ethanol and deionized water (hereinafter referred to as alcohol-water mixed solvent) to the reaction vessel, wherein the volume ratio of ethanol to water is 1:1. Dissolve 10.42g of chloroauric acid tetrahydrate completely in 50mL of alcohol-water mixed solvent to make the gold mass concentration in the mixed solution 100g / L, and obtain chloroauric acid solution.

[0042] (2) Under heating and stirring conditions at 80℃, 6.6 g of 4,4'-diaminodiphenyl sulfide ligand was added to the chloroauric acid solution. The reaction time was 3 h, and the stirring speed was 1500 r / min, so that the Au concentration in the solution increased. 3+ Restore to Au + Obtain Au-containing + Solution.

[0043] (3) The Au-containing product obtained from the reaction + 4.3 g of trithiocyanate reagent was added to the solution, and the reaction time was 4 h. The reaction temperature was 80 °C, and the stirring speed was 1500 r / min. After the reaction was completed, the product was poured into ethanol, and after repeated washing and filtration, a stable dark brown powder was obtained. After drying at 80 °C, an organogold compound powder was obtained. The gold content of the obtained powder was calculated to be 56.0 wt% after sintering at 800 °C.

[0044] Example 3: Preparation of organogold compound 3# (1) In a reaction vessel, 10.42 g of chloroauric acid tetrahydrate was completely dissolved in 33.3 mL of alcohol-water mixed solvent with ethanol and deionized water (hereinafter referred to as alcohol-water mixed solvent), wherein the volume ratio of ethanol to water was 1:1, so that the gold mass concentration in the mixed solution was 150 g / L, and a chloroauric acid solution was obtained.

[0045] (2) Under heating and stirring conditions at 70℃, 4g of 2,2'-diaminodiphenyl sulfide ligand was added to the chloroauric acid solution. The reaction time was 3h, and the stirring speed was 1500 r / min, so that the Au concentration in the solution increased. 3+ Restore to Au + Obtain Au-containing + Solution.

[0046] (3) The Au-containing product obtained from the reaction + 7.6 g of benzene-1,3,5-trimethylthiol was added to the solution, and the reaction time was 4 h. The reaction temperature was 70 °C, and the stirring speed was 1500 r / min. After the reaction was completed, the product was poured into ethanol, and after repeated washing and filtration, a stable dark brown powder was obtained. After drying at 80 °C, an organogold compound powder was obtained. The gold content of the obtained powder was calculated to be 51.0 wt% after sintering at 800 °C.

[0047] Examples 4-9: Preparation of Resin Gold Paste 1#-6# (1) According to the formula in Table 1, the organic solvent and the polymer resin are first mixed and dissolved to obtain the organic carrier; (2) Weigh the organic gold compound, the organometallic compound, and the organic carrier into an agate mortar in proportion and stir and mix them. Then, use a three-roll mill to mix them thoroughly to obtain resin gold paste.

[0048] Table 1: Formulation of Resin Gold Paste

[0049] Test case The following tests were performed on the No. 1 to No. 6 resin gold pastes obtained in Examples 4 to 9: (1) Viscosity: The viscosity of the resin paste was measured by a viscometer at 10 rpm and 25°C. (2) Printability: The resin gold paste in Table 1 was printed onto the ceramic substrate using a 325-mesh screen, and the printing status was observed. (3) Leveling property: After the printed film is left at room temperature for 10 minutes, observe the leveling property; (4) Gold film adhesion: Apply resin gold paste at a depth of 1 cm Print a 1cm size onto a polished alumina substrate, dry and sinter it, then scrape it with a blade or lint-free paper to observe the gold film peeling. If the gold film does not peel off, it is considered to meet the standard. (5) Sintering and sintered film performance test: The printed resin gold paste was sintered in a muffle furnace (held at 125℃ for 15 minutes, then heated to 850℃ and held for 30 minutes), and removed after cooling. The state of the sintered film was observed by visual inspection and optical microscope; (6) Testing the thickness of the sintered film: The thickness was measured by scanning electron microscopy; (7) Sheet resistance: The sheet resistance is measured using a four-probe sheet resistance meter. The sample is placed horizontally on the measuring stage, and the four probes of the instrument are pressed down vertically to contact the sample surface to obtain the sheet resistance value.

[0050] The test results are shown in Table 2.

[0051] Table 2: Test results of resin-based gold pastes prepared in Examples 4-9

[0052] The results in Table 2 show that the resin gold pastes 1# to 6# prepared in each embodiment of the present invention exhibit excellent comprehensive performance. All resin gold pastes showed no screen sticking under 325-mesh screen printing; the printed films were smooth, with good leveling properties and no defects such as bubbles, indicating that the paste of the present invention has excellent printability. After sintering, the gold films all exhibited a bright gold color, were glossy and dense without cracking, and showed no peeling in adhesion tests. The sheet resistance was controlled within a low range of 119~129 mΩ / □, confirming that the formulation system of the resin gold paste of the present invention has a good synergistic effect, and can simultaneously achieve the comprehensive goals of high adhesion, low resistance, and excellent film quality.

[0053] Figure 1 The gold film formed by printing the resin gold paste prepared in Example 5 onto a ceramic sheet under a 325-mesh screen and sintering is shown in the SEM image under a scanning electron microscope. Figure 1The results show that after sintering, the resin gold paste forms a bright and dense gold film with a smooth surface and no obvious defects. It has good film-forming properties, as well as good fluidity and dispersibility, and can flow quickly and spread evenly on the ceramic sheet to form a gold film to be sintered.

[0054] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for preparing an organogold compound, characterized in that, Includes the following steps: (1) Chloroauric acid, amino sulfide and alcohol-water mixed solvent are reacted to obtain Au-containing... + Solution; (2) The Au-containing + The solution and trithiol were mixed and reacted to yield an organogold compound.

2. The preparation method according to claim 1, characterized in that, The alcohol in the alcohol-water mixed solvent is ethanol, and the volume ratio of alcohol to water in the alcohol-water mixed solvent is 1~3:1; The molar ratio of the aminosulfide to chloroauric acid is 0.6 to 2.4:1; the aminosulfide includes one or both of 2,2'-diaminodiphenyl sulfide and 4,4'-diaminodiphenyl sulfide. The reaction temperature in step (1) is 70℃~90℃ and the reaction time is 3h~5h.

3. The preparation method according to claim 1, characterized in that, The molar ratio of the trithiol to chloroauric acid is 0.6 to 1.8:1, and the trithiol includes one or both of trithiocyanate and benzene-1,3,5-trimethylthiol. The reaction temperature in step (2) is 70℃~90℃, and the reaction time is 2h~4h.

4. The organogold compound prepared by the preparation method according to any one of claims 1 to 3, characterized in that, The gold content of the organogold compound is 45-58 wt%.

5. A resin-based gold paste, characterized in that, The product comprises, by mass percentage, the following components: 40% to 60% of the organogold compound of claim 4, 1% to 10% of the organometallic compound, and 30% to 55% of the organic carrier.

6. The resin gold paste according to claim 5, characterized in that, The organometallic compounds include organobismuth, organochromium, organosilicon, and organorhodium; by mass percentage, the resin gold paste includes 1%~5% organobismuth, 0.2%~2% organochromium, 0.1%~1% organosilicon, and 0.1%~2% organorhodium.

7. The resin gold paste according to claim 6, characterized in that, The organic bismuth includes one or more of bismuth acetate, bismuth isooctanoate, bismuth laurate, and bismuth neodecanoate; the organic chromium includes one or more of chromium acetate, chromium isooctanoate, and chromium neodecanoate; the organic silicon includes one or more of silicon 2-ethylhexanoate and silicon tetraacetate; and the organic rhodium includes one or more of rhodium acetate, rhodium isooctanoate, and rhodium octanoate.

8. The resin gold paste according to claim 5, characterized in that, The organic carrier comprises an organic solvent and a polymeric resin, wherein the organic solvent accounts for 50% to 80% by mass and the polymeric resin accounts for 20% to 50% by mass. The organic solvent includes one or more of terpineol, turpentine oil, rosemary oil, dibutyl phthalate, cyclohexanone, diethylene glycol monobutyl ether, and caryophyllene; the polymer resin includes one or more of phenolic resin, ethyl cellulose, epoxy resin, acrylic resin, butanol-modified urea-formaldehyde resin, and polyvinyl butyral resin.

9. The method for preparing the resin gold paste according to any one of claims 5 to 8, characterized in that, Includes the following steps: The resin gold paste is obtained by mixing an organometallic compound, an organometallic compound, and an organic carrier.

10. A conductive thin film, characterized in that, It is prepared from the resin gold paste according to any one of claims 5 to 8 or the resin gold paste prepared by the preparation method according to claim 9.

Images