High-temperature-resistant perovskite photovoltaic packaging material and preparation method thereof

Abstract

The application relates to the packaging technical field of perovskite batteries, and discloses a high-temperature-resistant perovskite photovoltaic packaging material and a preparation method thereof. The prepared perovskite photovoltaic packaging material comprises the following raw materials in parts by weight: modified polyurethane acrylate 45-55 parts, methyl methacrylate 5-10 parts, mixed fillers 5-10 parts, active diluent 2-4 parts, silane coupling agent 1-2 parts, defoaming agent 1-1.5 parts, photoinitiator 1-1.5 parts and organic solvent 10-20 parts; the packaging material not only has excellent high-temperature resistance, but also has excellent heat aging resistance and relatively high bonding performance.

Description

Technical Field

[0001] This invention relates to the field of perovskite solar cell encapsulation technology, specifically to a high-temperature resistant perovskite photovoltaic encapsulation material and its preparation method. Background Technology

[0002] Perovskite solar cells, as a third-generation photovoltaic technology, possess significant advantages such as high photoelectric conversion efficiency, low manufacturing cost, and flexible fabrication capabilities. Their photoelectric conversion efficiency has increased from the initial 3.8% to over 26%, demonstrating broad prospects for industrialization. However, perovskite materials are stacked by coordination bonds, making them extremely sensitive to heat, moisture, and oxygen. They are prone to decomposition and degradation under high temperature and humidity conditions, severely restricting the long-term operational stability and commercialization of these devices. Therefore, developing high-performance encapsulation materials to effectively isolate water and oxygen corrosion and withstand high-temperature aging in service environments has become one of the key technologies urgently needing breakthroughs in the perovskite photovoltaic field.

[0003] Currently, polyurethane acrylate is considered a highly promising encapsulation matrix material due to its advantages such as mild curing process, adjustable optical properties, and excellent mechanical properties. However, existing polyurethane acrylate-based encapsulation materials still have significant shortcomings: their main chain has limited thermal stability, with a thermal decomposition temperature typically between 250 and 280°C. Under the long-term high-temperature operation conditions of photovoltaic modules, they are prone to thermal oxidative degradation, leading to a significant decrease in mechanical properties and adhesive strength. Simultaneously, the molecular chain contains a large number of ester and urethane bonds, making them susceptible to hydrolysis in humid and hot environments, which makes it difficult to meet the reliability requirements of photovoltaic modules with a service life of over 25 years. Furthermore, existing technologies struggle to achieve a synergistic improvement in high-temperature resistance, adhesive performance, and resistance to humid and hot aging. Summary of the Invention To address the aforementioned technical problems, this invention provides a high-temperature resistant perovskite photovoltaic encapsulation material and its preparation method.

[0004] The objective of this invention can be achieved through the following technical solutions: A high-temperature resistant perovskite photovoltaic encapsulation material comprises the following raw materials in parts by weight: 45-55 parts modified polyurethane acrylate, 5-10 parts methacrylate, 5-10 parts mixed filler, 2-4 parts reactive diluent, 1-2 parts silane coupling agent, 1-1.5 parts defoamer, 1-1.5 parts photoinitiator, and 10-20 parts organic solvent. Furthermore, the mixed filler is a mixture of spherical alumina, boron nitride nanosheets, and nano-silica in a mass ratio of 1:0.2-0.6:1-2; Furthermore, the active diluent is N-vinyloxazolidinone; Furthermore, the silane coupling agent is KH570; Furthermore, the defoamer is BYK-066N; Furthermore, the photoinitiator is benzoin dimethyl ether; Furthermore, the organic solvent is one of toluene, ethyl acetate, or acetone; The modified polyurethane acrylate is prepared by the following steps: Step A1: Mix hydroxyethyl acrylate evenly in tetrahydrofuran, purge with nitrogen, heat to 45-55℃, then add 1,3-dichloro-1,1,3,3-tetramethyldisiloxane, stir and react for 5 hours, then add petroleum ether to precipitate, filter, and dry to obtain acrylate-based organosilicon. Further, in step A1, the ratio of hydroxyethyl acrylate, tetrahydrofuran, 1,3-dichloro-1,1,3,3-tetramethyldisiloxane and petroleum ether is 0.02-0.0202 mol:100 mL:0.01 mol:50 mL; Step A2: Add 5-hydroxymethyl-1H-benzimidazole and acrylate-based organosilicon to a mixture of methanol and water and stir until homogeneous. These are labeled as solution 1 and solution 2. Mix solution 1 and solution 2 thoroughly and stir until homogeneous. Then, heat the mixture to 60°C and react for 2-3 hours. Remove the solvent by rotary evaporation and dry the mixture to obtain the modifier. Furthermore, in step A2, the volume ratio of solution 1 to solution 2 is 50 mL: 50 mL; Further, in step A2, the ratio of 5-hydroxymethyl-1H-benzimidazole, methanol, and water in solution 1 is 0.2-0.201 mol:25 mL:25 mL, and the ratio of acrylate-based organosilicon, methanol, and water in solution 2 is 0.1 mol:25 mL:25 mL. Furthermore, the reaction mechanism of step A2 is a Michael addition reaction between the secondary amine on 5-hydroxymethyl-1H-benzimidazole and the acrylate structure in the acrylate-based organosilicon. Step A3: Polyethylene adipate (molecular weight 500) and dibutyltin dilaurate are added to the reactor. The oil bath temperature is raised to 60°C, and the mixture is stirred for 10 minutes under a nitrogen atmosphere. Then, isophorone diisocyanate is slowly added dropwise using a constant pressure funnel, and the mixture is stirred for 1 hour to obtain the polyurethane prepolymer. The temperature is then raised to 80°C, and the modifier DMF solution is added. The mixture is stirred and reacted for 2-3 hours. Then, 2,2-dimethylolpropionic acid DMF solution is added and the mixture is stirred and reacted for 5-6 hours to obtain the modified polyurethane prepolymer. Further, in step A3, the ratio of polyethylene adipate, dibutyltin dilaurate, isophorone diisocyanate, DMF modifier solution, and DMF solution of 2,2-dimethylolpropionic acid is 0.025 mol: 0.03-0.06 mL: 0.09-0.1 mol: 20 mL: 10 mL; Furthermore, the modifier DMF solution mentioned in step A3 is prepared by mixing the modifier and DMF in a ratio of 2.6-3g:20mL; Further, the 2,2-dimethylolpropionic acid DMF solution described in step A3 is prepared by mixing 2,2-dimethylolpropionic acid and DMF in a volume ratio of 2-2.3 g: 10 mL; Step A4: Cool the modified polyurethane prepolymer described in Step A3 to 75°C, add dibutyltin dilaurate and p-methylphenol and mix and stir evenly, then add pentaerythritol triacrylate and stir for 5-7 hours, then cool to 55°C, add triethylamine and react for 30 minutes, finally add deionized water and shear emulsify at 1500 rpm / min for 20 minutes to obtain modified polyurethane acrylate. Furthermore, in step A4, the ratio of dibutyltin dilaurate, p-methylphenol, pentaerythritol triacrylate, and triethylamine is 0.01-0.02 mL: 0.004-0.006 g: 0.03-0.06 mol: 0.015-0.03 mol, and the amount of deionized water added is such that the solid content of the modified polyurethane acrylate is 40%.

[0005] A method for preparing a high-temperature resistant perovskite photovoltaic encapsulation material includes the following steps: Weigh the raw materials according to the weight proportions, put each component raw material into a mixer and mix them evenly to obtain the encapsulation adhesive; then apply the encapsulation adhesive to the substrate, irradiate it with 365nm ultraviolet light for 3-5 minutes, and then heat-cur it at 100℃ for 5-10 minutes to obtain the high-temperature resistant perovskite photovoltaic encapsulation material.

[0006] The beneficial effects of this invention are: The perovskite photovoltaic encapsulation material prepared by this invention is made by adding methacrylate, mixed fillers, reactive diluents, silane coupling agents, defoamers, photoinitiators, and organic solvents as functional additives as the main raw material. This encapsulation material not only has excellent high temperature resistance, but also excellent heat aging resistance and high adhesion performance.

[0007] The perovskite photovoltaic encapsulation material of this invention is based on modified polyurethane acrylate, with the introduction of modifiers to introduce Si-O bonds, benzimidazole structures, and multi-double-bond acrylate end caps into the main chain structure. These three elements work synergistically to improve the material's high-temperature resistance, adhesion, and resistance to damp heat aging at three levels: molecular skeleton, functional additives, and cross-linking network. Firstly, the introduction of high-energy Si-O bonds into the main chain requires higher energy to break them, thus endowing the material with excellent thermal stability. Secondly, under high-temperature conditions, polymer molecular chains are prone to thermal oxidative breakage, generating alkyl and peroxy radicals, which trigger chain degradation reactions. The benzimidazole structure introduced into the main chain contains NH groups and a conjugated system, which can effectively capture and stabilize these radicals, thereby "interrupting" the degradation chain reaction and inhibiting thermal oxidative degradation. Simultaneously, the nitrogen atom of benzimidazole can act as a coordination site, complexing metal ions and preventing them from catalyzing and accelerating the oxidative degradation of the polymer at high temperatures. Furthermore, the rigid fused-ring structure of benzimidazole has a large conjugated system, which can absorb and dissipate some heat energy, improving the thermal stability of the main chain structure. Finally, the crosslinked network formed after the multi-double-bond acrylate end-capping curing in the modified polyurethane acrylate has an extremely high crosslinking density, greatly restricting the segment movement and slippage of the polymer molecular chains at high temperatures, further improving the high-temperature resistance of the matrix. Furthermore, the presence of modified polyurethane acrylate improves the adhesion and resistance to humid heat aging of the matrix; the multiple terminal double bonds provide more reaction sites, and after curing, they form more chemical bonds with the surface of the substrate (glass, ITO, perovskite layer); benzimidazole can enhance the coordination interaction with perovskite, thereby improving the adhesion of the matrix; Si-O endows the material with intrinsic hydrophobicity, hindering the penetration of water molecules, and the highly cross-linked network forms a dense barrier layer that resists water and oxygen erosion, thereby improving the resistance to humid heat aging of the matrix. Detailed Implementation

[0008] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0009] Example 1: The modified polyurethane acrylate was prepared by the following steps: Step A1: Mix 0.02 mol of hydroxyethyl acrylate in 100 mL of tetrahydrofuran until homogeneous, purge with nitrogen, heat to 45 °C, add 0.01 mol of 1,3-dichloro-1,1,3,3-tetramethyldisiloxane, stir and react for 5 h, then add 50 mL of petroleum ether to precipitate, filter, and dry to obtain acrylate-based organosilicon. Step A2: Add 0.2 mol of 5-hydroxymethyl-1H-benzimidazole and 0.1 mol of acrylate-based organosilicon to a mixture of 25 mL of methanol and 25 mL of water, respectively, and stir until homogeneous. These are labeled as solution 1 and solution 2. Mix 50 mL of solution 1 and 50 mL of solution 2 and stir until homogeneous. Then, heat the mixture to 60 °C and react for 2 hours. Remove the solvent by rotary evaporation and dry the mixture to obtain the modifier. Step A3: Add 0.025 mol of polyethylene adipate (molecular weight 500) and 0.03 mL of dibutyltin dilaurate to the reactor, heat the oil bath to 60°C, stir for 10 min under a nitrogen atmosphere, then slowly add 0.09 mol of isophorone diisocyanate using a constant pressure funnel, stir for 1 h to obtain the polyurethane prepolymer; then heat to 80°C, add 20 mL of modifier DMF solution and continue stirring for 2 h, then add 10 mL of 2,2-dimethylolpropionic acid DMF solution and stir for 5 h to obtain the modified polyurethane prepolymer. The modifier DMF solution is prepared by mixing the modifier and DMF in a ratio of 2.6 g: 20 mL, and the 2,2-dimethylolpropionic acid DMF solution is prepared by mixing 2,2-dimethylolpropionic acid and DMF in a ratio of 2 g: 10 mL. Step A4: Cool the modified polyurethane prepolymer described in Step A3 to 75°C, add 0.01 mL of dibutyltin dilaurate and 0.004 g of p-methylphenol, mix and stir evenly, then add 0.03 mol of pentaerythritol triacrylate and stir for 5 h. Then cool to 55°C, add 0.015 mol of triethylamine and react for 30 min. Finally, add deionized water and shear emulsify at 1500 rpm / min for 20 min to obtain the modified polyurethane acrylate. The amount of deionized water added is such that the solid content of the modified polyurethane acrylate is 40%.

[0010] Example 2: The modified polyurethane acrylate was prepared by the following steps: Step A1: Mix 0.0201 mol of hydroxyethyl acrylate in 100 mL of tetrahydrofuran until homogeneous, purge with nitrogen, heat to 50 °C, then add 0.01 mol of 1,3-dichloro-1,1,3,3-tetramethyldisiloxane, stir and react for 5 h, then add 50 mL of petroleum ether to precipitate, filter, and dry to obtain acrylate-based organosilicon. Step A2: Add 0.2005 mol of 5-hydroxymethyl-1H-benzimidazole and 0.1 mol of acrylate-based organosilicon to a mixture of 25 mL of methanol and 25 mL of water, respectively, and stir until homogeneous. These are labeled as solution 1 and solution 2. Mix 50 mL of solution 1 and 50 mL of solution 2 and stir until homogeneous. Then, heat the mixture to 60 °C and react for 2.5 h. Remove the solvent by rotary evaporation and dry the mixture to obtain the modifier. Step A3: Add 0.025 mol of polyethylene adipate (molecular weight 500) and 0.045 mL of dibutyltin dilaurate to the reactor, heat the oil bath to 60°C, stir for 10 min under a nitrogen atmosphere, then slowly add 0.095 mol of isophorone diisocyanate using a constant pressure funnel, stir for 1 h to obtain the polyurethane prepolymer; then heat to 80°C, add 20 mL of modifier DMF solution and continue stirring for 2.5 h, then add 10 mL of 2,2-dimethylolpropionic acid DMF solution and stir for 5.5 h to obtain the modified polyurethane prepolymer. The modifier DMF solution is prepared by mixing the modifier and DMF in a ratio of 2.8 g: 20 mL, and the 2,2-dimethylolpropionic acid DMF solution is prepared by mixing 2,2-dimethylolpropionic acid and DMF in a ratio of 2.15 g: 10 mL. Step A4: Cool the modified polyurethane prepolymer described in Step A3 to 75°C, add 0.015 mL of dibutyltin dilaurate and 0.005 g of p-methylphenol, mix and stir evenly, then add 0.045 mol of pentaerythritol triacrylate and stir for 6 h. Then cool to 55°C, add 0.023 mol of triethylamine and react for 30 min. Finally, add deionized water and shear emulsify at 1500 rpm / min for 20 min to obtain the modified polyurethane acrylate. The amount of deionized water added is such that the solid content of the modified polyurethane acrylate is 40%.

[0011] Example 3: The modified polyurethane acrylate was prepared by the following steps: Step A1: Mix 0.0202 mol of hydroxyethyl acrylate in 100 mL of tetrahydrofuran until homogeneous, purge with nitrogen, heat to 55 °C, then add 0.01 mol of 1,3-dichloro-1,1,3,3-tetramethyldisiloxane, stir and react for 5 h, then add 50 mL of petroleum ether to precipitate, filter, and dry to obtain acrylate-based organosilicon. Step A2: Add 0.201 mol of 5-hydroxymethyl-1H-benzimidazole and 0.1 mol of acrylate-based organosilicon to a mixture of 25 mL of methanol and 25 mL of water, respectively, and stir until homogeneous. These are labeled as solution 1 and solution 2. Mix 50 mL of solution 1 and 50 mL of solution 2 and stir until homogeneous. Then, heat the mixture to 60 °C and react for 3 hours. Remove the solvent by rotary evaporation and dry the mixture to obtain the modifier. Step A3: Add 0.025 mol of polyethylene adipate (molecular weight 500) and 0.06 mL of dibutyltin dilaurate to the reactor, heat the oil bath to 60°C, stir for 10 min under a nitrogen atmosphere, then slowly add 0.1 mol of isophorone diisocyanate dropwise using a constant pressure funnel, stir for 1 h to obtain the polyurethane prepolymer; then heat to 80°C, add 20 mL of modifier DMF solution and continue stirring for 3 h, then add 10 mL of 2,2-dimethylolpropionic acid DMF solution and stir for 6 h to obtain the modified polyurethane prepolymer. The modifier DMF solution is prepared by mixing the modifier and DMF in a ratio of 3 g: 20 mL, and the 2,2-dimethylolpropionic acid DMF solution is prepared by mixing 2,2-dimethylolpropionic acid and DMF in a ratio of 2.3 g: 10 mL. Step A4: Cool the modified polyurethane prepolymer described in Step A3 to 75°C, add 0.02 mL of dibutyltin dilaurate and 0.006 g of p-methylphenol, mix and stir evenly, then add 0.06 mol of pentaerythritol triacrylate and stir for 7 h. Then cool to 55°C, add 0.03 mol of triethylamine and react for 30 min. Finally, add deionized water and shear emulsify at 1500 rpm / min for 20 min to obtain the modified polyurethane acrylate. The amount of deionized water added is such that the solid content of the modified polyurethane acrylate is 40%.

[0012] Example 4: A method for preparing a high-temperature resistant perovskite photovoltaic encapsulation material includes the following steps: Example 1 prepared 45 parts of modified polyurethane acrylate, 5 parts of methacrylate, 5 parts of mixed filler, 2 parts of reactive diluent, 1 part of silane coupling agent, 1 part of defoamer, 1 part of photoinitiator, and 10 parts of organic solvent. Preferably, the mixed filler is a mixture of spherical alumina, boron nitride nanosheets, and nano-silica in a mass ratio of 1:0.2:2; Preferably, the reactive diluent is N-vinyloxazolidinone, the silane coupling agent is KH570, the defoamer is BYK-066N, and the photoinitiator is benzoin dimethyl ether; Preferably, the organic solvent is toluene; Weigh the raw materials according to the weight proportions, put each component raw material into a mixer and mix them evenly to obtain the encapsulation adhesive; then apply the encapsulation adhesive to the substrate, irradiate it with 365nm ultraviolet light for 3 minutes, and then heat-cur it at 100℃ for 5 minutes to obtain the high-temperature resistant perovskite photovoltaic encapsulation material.

[0013] Example 5: A method for preparing a high-temperature resistant perovskite photovoltaic encapsulation material includes the following steps: Example 2 prepared 50 parts of modified polyurethane acrylate, 7.5 parts of methacrylate, 7.5 parts of mixed filler, 3 parts of reactive diluent, 1.5 parts of silane coupling agent, 1.3 parts of defoamer, 1.3 parts of photoinitiator, and 15 parts of organic solvent. Preferably, the mixed filler is a mixture of spherical alumina, boron nitride nanosheets, and nano-silica in a mass ratio of 1:0.4:1.5; Preferably, the reactive diluent is N-vinyloxazolidinone, the silane coupling agent is KH570, the defoamer is BYK-066N, and the photoinitiator is benzoin dimethyl ether; Preferably, the organic solvent is ethyl acetate; Weigh the raw materials according to the weight proportions, put each component raw material into a mixer and mix them evenly to obtain the encapsulation adhesive; then apply the encapsulation adhesive to the substrate, irradiate it with 365nm ultraviolet light for 4 minutes, and then heat cure it at 100℃ for 8 minutes to obtain the high temperature resistant perovskite photovoltaic encapsulation material.

[0014] Example 6: A method for preparing a high-temperature resistant perovskite photovoltaic encapsulation material includes the following steps: Example 3 prepared 55 parts of modified polyurethane acrylate, 10 parts of methacrylate, 10 parts of mixed filler, 4 parts of reactive diluent, 2 parts of silane coupling agent, 1.5 parts of defoamer, 1.5 parts of photoinitiator, and 20 parts of organic solvent. Preferably, the mixed filler is a mixture of spherical alumina, boron nitride nanosheets, and nano-silica in a mass ratio of 1:0.6:1.2; Preferably, the reactive diluent is N-vinyloxazolidinone, the silane coupling agent is KH570, the defoamer is BYK-066N, and the photoinitiator is benzoin dimethyl ether; Preferably, the organic solvent is acetone; Weigh the raw materials according to the weight proportions, put each component raw material into a mixer and mix them evenly to obtain the encapsulation adhesive; then apply the encapsulation adhesive to the substrate, irradiate it with 365nm ultraviolet light for 5 minutes, and then heat-cur it at 100℃ for 10 minutes to obtain the high-temperature resistant perovskite photovoltaic encapsulation material.

[0015] Comparative Example 1: This comparative example is a perovskite photovoltaic encapsulation material. The difference between it and Example 6 is that acrylate-modified polyurethane-1 is used instead of the modified polyurethane acrylate prepared in Example 3. The difference between acrylate-modified polyurethane-1 and the modified polyurethane acrylate prepared in Example 3 is that methacrylate is used instead of pentaerythritol triacrylate. All other aspects are the same.

[0016] Comparative Example 2: This comparative example is a perovskite photovoltaic encapsulation material. The difference between it and Example 6 is that acrylate-modified polyurethane-2 is used instead of the modified polyurethane acrylate prepared in Example 3. The difference between acrylate-modified polyurethane-2 and the modified polyurethane acrylate prepared in Example 3 is that hydroquinone dihydroxyethyl ether is used instead of the modifier. All other aspects are the same.

[0017] The perovskite photovoltaic encapsulation materials prepared in Examples 4-6 and Comparative Examples 1-2 were subjected to performance testing: Peel strength: The 180° peel strength of SUS steel sheet was tested according to GB / T 2792-2014; Resistance to damp heat aging: The perovskite photovoltaic encapsulation material sample was placed in an environment of 90℃ and 95% relative humidity for 150 hours. After cooling to room temperature, the 180° peel strength was tested again according to the peel strength method, and the retention rate of 180° peel strength was calculated. The higher the value, the better the resistance to damp heat aging.

[0018] High temperature resistance: Each test sample was placed in an aging chamber at 150°C for 2 hours. After cooling to room temperature, the 180° peel strength was tested according to the method in the peel strength test, and the retention rate of the 180° peel strength was calculated. The higher the value, the better the high temperature resistance.

[0019] The test results are shown in Table 1: Table 1: Performance Test Results As can be seen from Table 1, the perovskite photovoltaic encapsulation material prepared by this invention not only has excellent high temperature resistance, but also excellent resistance to damp heat aging and adhesion.

[0020] The above content is merely an example and illustration of the concept of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the scope defined by the inventive concept, they should all fall within the protection scope of the present invention.

Claims

1. A high-temperature resistant perovskite photovoltaic encapsulation material, characterized in that, The raw materials include the following parts by weight: 45-55 parts modified polyurethane acrylate, 5-10 parts methacrylate, 5-10 parts mixed filler, 2-4 parts reactive diluent, 1-2 parts silane coupling agent, 1-1.5 parts defoamer, 1-1.5 parts photoinitiator, and 10-20 parts organic solvent. The modified polyurethane acrylate is prepared by end-capping a modified polyurethane prepolymer with pentaerythritol triacrylate and then neutralizing it with triethylamine; the modified polyurethane prepolymer is prepared by reacting a polyurethane prepolymer with a modifier and 2,2-dimethylolpropionic acid in sequence; the polyurethane prepolymer is prepared by reacting polyethylene adipate and isophorone diisocyanate under the action of a catalyst; the modifier is prepared by Michael addition reaction of 5-hydroxymethyl-1H-benzimidazole and acrylate-based organosilicon; the acrylate-based organosilicon is prepared by reacting hydroxyethyl acrylate with 1,3-dichloro-1,1,3,3,-tetramethyldisiloxane.

2. The high-temperature resistant perovskite photovoltaic encapsulation material according to claim 1, characterized in that, The modified polyurethane acrylate is prepared by the following steps: Step A1: Mix hydroxyethyl acrylate evenly in tetrahydrofuran, purge with nitrogen, heat to 45-55℃, then add 1,3-dichloro-1,1,3,3-tetramethyldisiloxane, stir and react for 5 hours, then add petroleum ether to precipitate, filter, and dry to obtain acrylate-based organosilicon. Step A2: Add 5-hydroxymethyl-1H-benzimidazole and acrylate-based organosilicon to a mixture of methanol and water and stir until homogeneous. These are labeled as solution 1 and solution 2. Mix solution 1 and solution 2 thoroughly and stir until homogeneous. Then, heat the mixture to 60°C and react for 2-3 hours. Remove the solvent by rotary evaporation and dry the mixture to obtain the modifier. Step A3: Add polyethylene adipate and dibutyltin dilaurate to the reactor, heat the oil bath to 60°C, stir for 10 min under a nitrogen atmosphere, then slowly add isophorone diisocyanate dropwise using a constant pressure funnel, stir for 1 h to obtain polyurethane prepolymer; then heat to 80°C, add DMF solution as modifier and continue stirring for 2-3 h, then add DMF solution of 2,2-dimethylolpropionic acid and stir for 5-6 h to obtain modified polyurethane prepolymer; Step A4: Cool the modified polyurethane prepolymer described in Step A3 to 75°C, add dibutyltin dilaurate and p-methylphenol and mix and stir evenly, then add pentaerythritol triacrylate and stir for 5-7 hours, then cool to 55°C, add triethylamine and react for 30 minutes, finally add deionized water and shear emulsify at 1500 rpm / min for 20 minutes to obtain modified polyurethane acrylate.

3. The high-temperature resistant perovskite photovoltaic encapsulation material according to claim 2, characterized in that, In step A1, the ratio of hydroxyethyl acrylate, tetrahydrofuran, 1,3-dichloro-1,1,3,3-tetramethyldisiloxane and petroleum ether is 0.02-0.0202 mol:100 mL:0.01 mol:50 mL.

4. The high-temperature resistant perovskite photovoltaic encapsulation material according to claim 2, characterized in that, In step A2, the volume ratio of solution 1 to solution 2 is 50 mL: 50 mL. In solution 1, the volume ratio of 5-hydroxymethyl-1H-benzimidazole, methanol, and water is 0.2-0.201 mol: 25 mL: 25 mL. In solution 2, the volume ratio of acrylate-based organosilicon, methanol, and water is 0.1 mol: 25 mL: 25 mL.

5. The high-temperature resistant perovskite photovoltaic encapsulation material according to claim 2, characterized in that, In step A3, the ratio of polyethylene adipate, dibutyltin dilaurate, isophorone diisocyanate, DMF solution as a modifier, and DMF solution as 2,2-dimethylolpropionic acid is 0.025 mol: 0.03-0.06 mL: 0.09-0.1 mol: 20 mL: 10 mL.

6. The high-temperature resistant perovskite photovoltaic encapsulation material according to claim 2, characterized in that, The modifier DMF solution mentioned in step A3 is prepared by mixing the modifier and DMF in a ratio of 2.6-3g:20mL, and the 2,2-dimethylolpropionic acid DMF solution is prepared by mixing 2,2-dimethylolpropionic acid and DMF in a ratio of 2-2.3g:10mL.

7. The high-temperature resistant perovskite photovoltaic encapsulation material according to claim 2, characterized in that, In step A4, the ratio of dibutyltin dilaurate, p-methylphenol, pentaerythritol triacrylate, and triethylamine is 0.01-0.02 mL: 0.004-0.006 g: 0.03-0.06 mol: 0.015-0.03 mol, and the amount of deionized water added is such that the solid content of the modified polyurethane acrylate is 40%.

8. The high-temperature resistant perovskite photovoltaic encapsulation material according to claim 1, characterized in that, The mixed filler is composed of spherical alumina, boron nitride nanosheets and nano-silica in a mass ratio of 1:0.2-0.6:1-2.

9. The high-temperature resistant perovskite photovoltaic encapsulation material according to claim 1, characterized in that, The active diluent is N-vinyloxazolidinone, the silane coupling agent is KH570, the defoamer is BYK-066N, the photoinitiator is benzoin dimethyl ether, and the organic solvent is one of toluene, ethyl acetate, or acetone.

10. A method for preparing the high-temperature resistant perovskite photovoltaic encapsulation material according to any one of claims 1-9, characterized in that, Includes the following steps: Weigh the raw materials according to the weight proportions, put each component raw material into the mixer and mix them evenly to obtain the encapsulating adhesive; The encapsulating adhesive is then applied to the substrate, irradiated with 365nm ultraviolet light for 3-5 minutes, and then heat-cured at 100℃ for 5-10 minutes to obtain the high-temperature resistant perovskite photovoltaic encapsulating material.

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