Mask plate assembly, manufacturing method thereof, and evaporation device

Abstract

The application provides a mask plate assembly, a manufacturing method thereof, and an evaporation equipment. The mask plate assembly comprises a mask plate frame, a mask plate body, and two alignment strips. The two alignment strips are connected to the upper surface of the mask plate frame. The two alignment strips are arranged on the two sides of the mask plate frame in a first direction. Each alignment strip is provided with an alignment mark at the two ends in a second direction. Each alignment strip comprises a first alignment block, a film thickness alignment block, and a second alignment block arranged in the second direction. The first alignment block, the film thickness alignment block, and the second alignment block are connected to the mask plate frame. The alignment marks are arranged on the first alignment block and the second alignment block. The film thickness opening is arranged on the film thickness alignment block. According to the application, the whole alignment strip is divided into multiple blocks which are independently connected to each other, so as to reduce the contact area with the substrate, thereby improving the alignment accuracy after the substrate is attached to the mask plate assembly.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to a photomask assembly and its fabrication method, and vapor deposition equipment. Background Technology

[0002] As the primary coating equipment for organic light-emitting layers in organic light-emitting display devices, vapor deposition equipment often uses a mask assembly to deposit patterns onto the substrate. The mask openings on the assembly are used to deposit the corresponding patterns onto the substrate. Therefore, the alignment accuracy between the mask assembly and the substrate in the vapor deposition equipment is crucial to the precision of the pattern formed on the substrate. However, because the substrate is prone to deformation due to gravity after being placed in the vapor deposition equipment, the mask assembly may shift during the bonding process with the aligned assembly. This can lead to misalignment between the alignment marks on the mask assembly and the substrate, requiring repeated alignment, resulting in poor alignment accuracy and wasted time. Summary of the Invention

[0003] This application provides a mask assembly and its manufacturing method, as well as a vapor deposition equipment, to improve the alignment accuracy of the substrate and the mask assembly after bonding.

[0004] In a first aspect, a mask assembly is provided, comprising: a mask frame having a cutout area; a mask body connected to the mask frame, with at least a portion of the mask body located in the cutout area, and the mask body having a plurality of mask openings corresponding to the cutout area; two alignment strips connected to the upper surface of the mask frame, the two alignment strips being spaced apart along a first direction on both sides of the mask frame, each alignment strip being partially located in the cutout area, and at least one film thickness opening being provided at the alignment strip located in the cutout area, and each alignment strip having alignment marks at both ends in a second direction, the first direction and the second direction intersecting; wherein, each alignment strip includes a first alignment block, a film thickness alignment block and a second alignment block arranged sequentially and spaced apart along the second direction, the first alignment block, the film thickness alignment block and the second alignment block being respectively connected to the mask frame, the alignment marks being respectively provided on the first alignment block and the second alignment block, and the film thickness opening being provided on the film thickness alignment block.

[0005] In conjunction with the first aspect, in some implementations of the first aspect, the alignment strip is obtained by cutting the alignment mother plate. The alignment mother plate has two first cutting channels arranged at intervals along the second direction. Alignment marks are respectively set on both sides of the first cutting channels. In the vertical projection of the first cutting channel onto the mask frame, the first cutting channel is located on the mask frame. The first cutting channel extends along the first direction to penetrate the alignment mother plate.

[0006] In conjunction with the first aspect, in some implementations of the first aspect, the width of the first cutting slit in the second direction is greater than or equal to 10 mm; and / or, the distance from the first cutting slit to the alignment mark in the second direction is greater than or equal to 5 mm; and / or, the distance from the first cutting slit to the edge of the mask frame enclosing the hollow area in the second direction is greater than or equal to 5 mm.

[0007] In conjunction with the first aspect, in some implementations of the first aspect, the alignment master plate further includes at least one second cutting track, the second cutting track extends along a second direction, the second cutting track is located between two first cutting tracks, and there is a first distance between the second cutting track and the first cutting track, the first distance being greater than or equal to 10 mm, the second cutting track is located on the mask frame in the orthographic projection of the second cutting track in the vertical direction, and the distance from the second cutting track to the film thickness opening in the first direction is greater than or equal to 15 mm.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the alignment strip is welded to the mask frame, and at least one alignment mark in the first alignment block is provided with a plurality of weld points spaced apart along the first direction on the side facing the film thickness alignment block. At least one alignment mark in the second alignment block is provided with a plurality of weld points spaced apart along the first direction on the side facing the film thickness alignment block. The film thickness alignment block is provided with a plurality of weld points at both ends in the second direction.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, multiple solder joints are arranged at equal intervals around the periphery of the alignment mark.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, multiple solder joints are respectively disposed on both sides of the first cutting track in the second direction.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, multiple solder joints are arranged around the periphery of the second cut track.

[0012] In conjunction with the first aspect, in certain implementations of the first aspect, the mask frame is provided with a plurality of first grooves, which are disposed at the four corners of the mask frame. When the alignment strip is disposed on the mask frame, the projection of a plurality of solder joints located on at least one side of the alignment mark onto the mask frame in the vertical direction is located within the first groove. The shape of the first groove includes L-shape, U-shape, U-shape, and U-shape. And / or, the mask frame is provided with a plurality of second grooves. When the alignment strip is disposed on the mask frame, the plurality of second grooves are respectively disposed on at least one side of each first kerf in the second direction. In the projection of the alignment strip onto the mask frame in the vertical direction, the plurality of solder joints are located within the second groove. And / or, the mask frame is provided with a plurality of third grooves. When the alignment strip is disposed on the mask frame, the third grooves surround the periphery of the second kerf, and in the projection of the alignment strip onto the mask frame in the vertical direction, the plurality of solder joints are located within the third groove.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, a plurality of alignment marks are arranged at the four corners of the mask frame, and the center of the line connecting the diagonals of the plurality of alignment marks coincides with the center of the mask frame; wherein the shape of the alignment marks includes at least one of a circle, a cross, a U-shape, and a T-shape.

[0014] The second aspect also provides a vapor deposition apparatus, comprising: a first receiving member configured to carry a substrate; and a second receiving member disposed below the first receiving member, the second receiving member being configured to carry the mask assembly described above, wherein at least one of the first receiving member and the second receiving member is movable to align the substrate with the mask assembly.

[0015] The third aspect also provides a method for manufacturing a photomask assembly, applied to the manufacturing of the photomask assembly described above. The alignment strip is obtained by cutting an alignment mother plate, the alignment mother plate including at least a first cutting channel. The manufacturing method includes: obtaining a photomask frame and two alignment mother plates, wherein the alignment mother plates are provided with a first cutting channel; connecting the alignment mother plates to the top of the photomask frame respectively, arranging the two alignment mother plates at intervals along a first direction, such that the portion of the film thickness opening provided on each alignment mother plate is located in the hollow area, and arranging the alignment marks provided at both ends of the alignment mother plate respectively on the photomask frame; cutting along the first cutting channel of the alignment mother plate to form an alignment strip having a first alignment block, a film thickness alignment block and a second alignment block arranged at intervals along a second direction, wherein the first alignment block, the film thickness alignment block and the second alignment block are independently connected to the photomask frame.

[0016] In conjunction with the third aspect, in some implementations of the third aspect, the mask frame is provided with a first groove and a second groove, and the alignment mother plates are respectively connected to the top of the mask frame. The specific manufacturing method includes: taking two alignment mother plates and placing them on the top of the mask frame, adjusting the position of the two alignment mother plates relative to the mask frame so that the intersection of the diagonal lines connecting the four alignment marks on the two alignment mother plates coincides with the center of the mask frame, and making the overlapping area of ​​the two alignment mother plates coincide with the mask frame; welding the two alignment mother plates to the mask frame along the shape of the first groove and the shape of the second groove, and making the weld points at least partially located in the first groove and the second groove.

[0017] In conjunction with the third aspect, in some implementations of the third aspect, the alignment mother plate also includes a second cutting track. After cutting along the first cutting track of the alignment mother plate, the manufacturing method further includes cutting along the second cutting track of the alignment mother plate.

[0018] In conjunction with the third aspect, in some implementations of the third aspect, when the alignment mother plate includes a second cutting track, the mask frame is provided with a third groove, and the alignment mother plates are respectively connected to the top of the mask frame. The specific manufacturing method further includes: welding two alignment mother plates to the mask frame along the shape of the third groove, and making the weld point at least partially located in the third groove.

[0019] This application provides a mask assembly and its manufacturing method, as well as a vapor deposition apparatus. The mask assembly includes: a mask frame with a hollow area; a mask body connected to the mask frame, with at least a portion of the mask body located in the hollow area, and the mask body having multiple mask openings corresponding to the hollow area; two alignment strips connected to the upper surface of the mask frame, the two alignment strips being spaced apart along a first direction on both sides of the mask frame, each alignment strip being partially located in the hollow area, and at least one film thickness opening being provided at the alignment strip located in the hollow area; each alignment strip having alignment marks at both ends in a second direction, the first direction and the second direction intersecting; wherein, each alignment strip includes a first alignment block, a film thickness alignment block and a second alignment block arranged sequentially and spaced apart along the second direction, the first alignment block, the film thickness alignment block and the second alignment block being respectively connected to the mask frame, the alignment marks being respectively provided on the first alignment block and the second alignment block, and the film thickness opening being provided on the film thickness alignment block.

[0020] In this embodiment, by setting alignment marks on the alignment strip and placing the alignment marks on the first and second alignment blocks after cutting, the substrate contacts the first, second, and third alignment blocks after being divided during the bonding process with the mask assembly. This reduces the contact area between the substrate and the alignment strip, thereby reducing the possibility of the alignment strip moving when it contacts the deformed substrate. This ensures that the alignment marks will not shift, thus improving alignment accuracy and avoiding the need for repeated alignment. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of this application and constitute a part of this application, illustrate exemplary embodiments of the application and are used to explain the application, but do not constitute an undue limitation of the application. In the drawings:

[0022] Figure 1 This is a schematic diagram of a mask assembly in one embodiment of this application.

[0023] Figure 2 This is a schematic diagram of a mask assembly without a mask body in one embodiment of this application.

[0024] Figure 3 This is a schematic diagram of a mask assembly without a mask body in another embodiment of this application.

[0025] Figure 4 This is a schematic diagram of the mask assembly before cutting in one embodiment of this application.

[0026] Figure 5 This is a schematic diagram of the mask assembly before cutting in another embodiment of this application.

[0027] Figure 6 This is a schematic diagram of a mask template frame in one embodiment of this application.

[0028] Figure 7 This is a schematic diagram of a vapor deposition apparatus in one embodiment of this application.

[0029] Figure 8 This is a flowchart illustrating a method for manufacturing a mask template component according to one embodiment of this application.

[0030] Figure 9 This is a flowchart illustrating a method for manufacturing a mask template component in yet another embodiment of this application. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Many specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The features and exemplary embodiments of various aspects of this application will be described in detail below.

[0032] Figure 1 This is a schematic diagram of a mask assembly in one embodiment of this application. Figure 2 This is a schematic diagram of a mask assembly without a mask body in one embodiment of this application. Figure 3 This is a schematic diagram of a mask assembly without a mask body in another embodiment of this application. Figure 4 This is a schematic diagram of the mask assembly before cutting in one embodiment of this application. Figure 5 This is a schematic diagram of the mask assembly before cutting in another embodiment of this application. Figure 6 This is a schematic diagram of a mask template frame in one embodiment of this application. Figure 7 This is a schematic diagram of a vapor deposition apparatus according to an embodiment of this application. Arrow X points to a first direction, arrow Y points to a second direction, and the first direction X and the second direction Y intersect in the horizontal plane. Arrow Z points to a vertical direction, and the first direction X, the second direction Y, and the vertical direction Z intersect each other. Preferably, the first direction X, the second direction Y, and the vertical direction Z are perpendicular to each other, which will not be emphasized separately thereafter.

[0033] like Figures 1 to 5 The mask assembly 10 includes a mask frame 1, a mask body 2, and two alignment strips 3. The mask frame 1 has a cutout area 12. The mask body 2 is connected to the mask frame 1, and at least part of the mask body 2 is located in the cutout area 12. The mask body 2 is provided with a plurality of mask openings 21 corresponding to the cutout area 12. The two alignment strips 3 are connected to the upper surface of the mask frame 1. The two alignment strips 3 are arranged at intervals along the first direction X on both sides of the mask frame 1. Part of each alignment strip 3 is located in the cutout area 12, and at least one film thickness opening 311 is provided at the alignment strip 3 located in the cutout area 12. Alignment marks 4 are provided at both ends of each alignment strip 3 in the second direction Y.

[0034] It is understood that the area where the alignment strip 3 overlaps with the mask frame 1 is the overlap area 11, which is used for the installation and fixing of the alignment strip 3 to the mask frame 1. The size and shape of the overlap area 11 can be adjusted according to actual needs without specific limitations.

[0035] Optionally, such as Figure 6 When the mask assembly 10 is used in the vapor deposition apparatus 100, the vapor deposition apparatus 100 may specifically include a first receiving member 20 and a second receiving member 30. The first receiving member 20 is configured to support the substrate 40 to be vapor deposited, and the second receiving member 30 is disposed below the first receiving member 20 and is configured to support the mask assembly 10. At least one of the first receiving member 20 and the second receiving member 30 is movable to align the substrate 40 with the mask assembly 10.

[0036] Understandably, in the vapor deposition apparatus 100, the first receiving member 20 encloses a vapor deposition area 201 in the middle, and the substrate 40 can be placed on the first receiving member 20 such that a portion of the substrate 40 is located within the vapor deposition area 201. The second receiving member 30 encloses a transmission area in the middle, and the mask assembly 10 can be placed on the second receiving member 30 such that a portion of the mask assembly 10 is located within the transmission area. The substrate 40 is pre-marked, and at least one of the first receiving member 20 and the second receiving member 30 may be provided with a driving member. The driving member can drive relative movement between the connected first receiving member 20 and the second receiving member 30, so that the mark on the substrate 40 is aligned with the alignment mark 4 of the mask assembly 10 in the vertical Z direction.

[0037] In addition, the vapor deposition equipment 100 also includes a pressure plate 50 disposed above the vapor deposition area 201. The pressure plate 50 can be configured as an electrostatic plate. Multiple magnetic blocks 60 are provided on the side of the pressure plate 50 facing the substrate 40, and a cooling plate 70 is provided on the side of the pressure plate 50 away from the substrate 40. The pressure plate 50 and the cooling plate 70 are connected to a lifting assembly 80. The lifting assembly 80 can lower the pressure plate 50 to fit against the substrate 40. After alignment with the substrate 40, the mask assembly 10 can be moved vertically in the Z direction by the second receiving member 30, so that the alignment strip 3 of the mask assembly 10 contacts and engages with the substrate 40. The magnetic blocks 60 attract the metal from the mask assembly 10, thus clamping the substrate 40 between the pressure plate 50 and the mask assembly 10. The specific structure of the vapor deposition equipment 100 is not described in detail.

[0038] Due to the influence of gravity, the substrate 40 will deform to a certain extent when it is supported by the first receiving member 20. Therefore, when aligning the markings on the substrate 40 with the alignment marks 4 on the mask assembly 10, the deformation of the substrate 40 can be taken into account in advance. Even if there is a certain offset between the markings on the substrate 40 and the alignment marks 4 on the mask assembly 10, the markings and alignment marks 4 can achieve a high degree of alignment accuracy after the substrate 40 is clamped between the pressure plate 50 and the mask assembly 10. This will not be described in detail.

[0039] Furthermore, during the process of bonding the aligned mask assembly 10 with the substrate 40, due to the deformation of the substrate 40, the substrate 40 will not directly contact the alignment strip 3 as a whole, but will gradually increase the contact area until it is completely bonded. This causes the alignment mark 4 in the mask assembly 10 to easily shift during this process. Consequently, after the substrate 40 is clamped between the pressure plate 50 and the mask assembly 10, the mark on the substrate 40 and the alignment mark 4 on the mask assembly 10 will have an alignment error, affecting the alignment accuracy of both. Multiple re-alignment is required to eliminate this situation, wasting time and affecting the vapor deposition effect of the substrate 40.

[0040] Based on the above problems, in the mask assembly 10 provided in this application embodiment, each alignment strip 3 includes a first alignment block 33, a film thickness alignment block 31 and a second alignment block 32 arranged sequentially at intervals along the second direction Y. The first alignment block 33, the film thickness alignment block 31 and the second alignment block 32 are respectively connected to the mask frame 1. Alignment marks 4 are respectively set on the first alignment block 33 and the second alignment block 32. The film thickness opening 311 is set on the film thickness alignment block 31.

[0041] In this embodiment, by setting the alignment mark 4 on the alignment strip 3 and positioning the alignment mark 4 at the cut first alignment block 33 and second alignment block 32, the substrate 40, during the bonding process with the mask assembly 10, contacts the alignment strip 3 with the divided first alignment block 33, film thickness alignment block 31 and second alignment block 32, thus reducing the contact area with the substrate 40. This reduces the possibility of the alignment strip 3 moving when it contacts the deformed substrate 40, ensuring that the alignment mark 4 does not shift, thereby improving the alignment accuracy and avoiding the need for repeated alignment.

[0042] Optionally, there is a gap 3a between the first alignment block 33, the film thickness alignment block 31, and the second alignment block 32 after cutting. The size of the gap 3a can be adjusted adaptively according to actual needs and is not specifically limited.

[0043] like Figures 1 to 4As shown, the alignment strip 3 is obtained by cutting the alignment mother plate 30a. The alignment mother plate 30a has two first cutting channels 301 arranged at intervals along the second direction Y. Alignment marks 4 are respectively set on both sides of the first cutting channel 301. In the orthographic projection of the first cutting channel 301 in the vertical direction Z towards the mask frame 1, the first cutting channel 301 is located on the mask frame 1. The first cutting channel 301 extends along the first direction X to penetrate the alignment mother plate 30a. By utilizing the first cutting groove 301 pre-set on the alignment mother plate 30a, after the alignment mother plate 30a is connected to the mask frame 1, it is cut according to the first cutting groove 301. This allows the alignment strip 3, which is divided into independent first alignment blocks 33, film thickness alignment blocks 31, and second alignment blocks 32, to have alignment marks 4 on them. This reduces the misalignment of the first alignment blocks 33 and second alignment blocks 32 caused by the deformation of the substrate 40, thereby improving the alignment accuracy of the alignment marks 4 with the marks on the substrate 40. Furthermore, by assembling the alignment mother plate 30a before cutting it, the relative positions of the first alignment blocks 33, film thickness alignment blocks 31, and second alignment blocks 32 are fixed, which helps to improve the alignment accuracy of the alignment marks 4 and film thickness openings 311 relative to the mask frame 1, thereby improving the installation efficiency and installation accuracy of the mask assembly 10.

[0044] It is understandable that the first cutting track 301 penetrates the alignment mother plate 30a in the first direction X, and the width in the second direction Y is set to be greater than or equal to 10mm, so that the cutter can smoothly achieve cutting.

[0045] Optionally, the first cutting groove 301 is configured as a recessed structure with openings at both ends on the alignment mother plate 30a along the first direction X. The depth of the first cutting groove 301 on the alignment mother plate 30a is greater than or equal to one-half the thickness of the alignment mother plate 30a, to facilitate cutting. In the embodiment of this application, the depth of the first cutting groove 301 on the alignment mother plate 30a is equal to two-thirds the thickness of the alignment mother plate 30a.

[0046] Optionally, the distance from the first cutting path 301 to the alignment mark 4 in the second direction Y is greater than or equal to 5 mm. This ensures the integrity of the alignment mark 4 and prevents it from being damaged due to cutting deviation. In this embodiment, the distance from the first cutting path 301 to the alignment mark 4 in the second direction Y is set to 15 mm.

[0047] Optionally, the distance from the first cutting groove 301 to the edge of the mask frame 1 that forms the hollow area 12 in the second direction Y is greater than or equal to 5 mm, providing sufficient overlap area 11 between the cut film thickness alignment block 31 and the mask frame 1 at both ends in the second direction Y, thereby improving the stability and reliability of the alignment strip 3 on the mask frame. In this embodiment, the distance from the first cutting groove 301 to the edge of the mask frame 1 that forms the hollow area 12 in the second direction Y is set to 15 mm.

[0048] In some embodiments, such as Figures 2 to 4 The alignment mother plate 30a also includes at least one second cutting channel 302. The second cutting channel 302 extends along the second direction Y and is located between two first cutting channels 301. The second cutting channel 302 and the first cutting channel 301 have a first distance between them, which is greater than or equal to 10 mm. In the orthogonal projection of the second cutting channel 302 onto the mask frame 1 in the vertical direction Z, the second cutting channel 302 is located on the mask frame 1. The distance from the second cutting channel 302 to the film thickness opening 311 in the first direction X is greater than or equal to 15 mm. The second cutting channel 302 is located in the overlap area 11 between the alignment mother plate 30a and the mask frame 1. By setting the second cutting channel 302, one or more elongated holes 3b extending along the second direction Y and not penetrating the film thickness alignment block 31 are formed on the cut film thickness alignment block 31, further reducing the contact area between the film thickness alignment block 31 and the substrate 40 and further improving the alignment accuracy.

[0049] In addition, by setting the first distance from the second cutting track 302 to the first cutting track 301 to be greater than or equal to 10 mm, and setting the second distance from the second cutting track 302 to the film thickness opening 311 to be greater than or equal to 15 mm, damage to the edge connection is avoided when the cutter cuts along the second cutting track. Furthermore, fasteners for connecting the film thickness alignment block 31 to the mask frame 1 can be provided at intervals on the alignment mother plate 30a.

[0050] Optionally, each alignment mother plate 30a may have two or more second cutting channels 302 (not shown in the figure) arranged at intervals along the first direction X. The distance between adjacent second cutting channels 302 is greater than or equal to 8 mm, so that multiple solder points 5 can be arranged around each second cutting channel. The width of each second cutting channel 302 is greater than or equal to 5 mm. The number, shape and arrangement of the second cutting channels 302 arranged on the alignment mother plate 30a can be adaptively adjusted according to actual needs. The more numerous and more dispersed the second cutting channels are, the smaller the contact area with the substrate 40, which can reduce the offset of the film thickness alignment block 31 during the contact process with the substrate 40, thereby improving the alignment accuracy of the mask assembly 10 and the substrate 40, and thus improving the accuracy of the light-emitting layer fabrication on the substrate 40.

[0051] It is understood that the first cutting channel 301 is configured as a long, closed, strip-shaped recessed structure extending along the second direction Y on the alignment mother plate 30a, and the depth of the second cutting channel 302 on the alignment mother plate 30a is greater than or equal to one-half the thickness of the alignment mother plate 30a, in order to facilitate cutting. In the embodiment of this application, the depth of the second cutting channel 302 on the alignment mother plate 30a is equal to two-thirds the thickness of the alignment mother plate 30a.

[0052] In some embodiments, such as Figure 3 The alignment strip 3 is welded to the mask frame 1. At least one alignment mark 4 in the first alignment block 33 has multiple weld points 5 spaced apart along the first direction X on the side facing the film thickness alignment block 31. At least one alignment mark 4 in the second alignment block 32 has multiple weld points 5 spaced apart along the first direction X on the side facing the film thickness alignment block 31. The film thickness alignment block 31 has multiple weld points 5 at both ends in the second direction Y. Before the alignment strip 3 is cut, i.e., when it is connected to the mask frame 1 in the state of an alignment mother plate 30a, the alignment mother plate 30a is fixedly connected to the mask frame 1 by welding. At this time, in order to ensure that the cut first alignment block 33, film thickness alignment block 31, and second alignment block 32 can be fixed relatively independently to the mask frame 1, each alignment block can have weld points 5, thus improving the stability of the alignment block relative to the mask frame 1.

[0053] Optionally, multiple solder points 5 are arranged at equal intervals around the periphery of the alignment mark 4. The multiple solder points 5 can be arranged as follows: Figure 3 The middle part is arranged in a square shape around the aligning mark 4, or it can be like... Figure 4 The middle part is arranged in a U-shape around the aligning mark 4, or it can be like... Figure 5The solder points 5 are arranged in an L-shape around the alignment mark 4, and can be adjusted adaptively according to actual needs. The more numerous and uniform the solder points 5 are, the higher the stability of the alignment block and the higher the alignment accuracy, without specific limitations. In this embodiment, multiple solder points 5 are arranged in a U-shape around the alignment mark 4 to further improve the stability of the alignment block.

[0054] Optionally, multiple welding points 5 are respectively arranged on both sides of the first cutting track 301 in the second direction Y, so as to further improve the structural stability and strength of the alignment strip 3 connected to the mask frame 1.

[0055] Optionally, such as Figure 3 and Figure 5 Multiple solder points 5 are arranged around the periphery of the second cutting track 302 to improve the structural stability and strength of the film thickness alignment block 31 connected to the mask frame 1 while reducing the area of ​​the film thickness alignment block 31.

[0056] Optionally, when multiple solder points 5 are arranged in different areas of the alignment motherboard 30a, the multiple solder points 5 arranged in each area are evenly spaced.

[0057] In some embodiments, such as Figure 6 The mask frame 1 is provided with a plurality of first grooves 13, which are located at the four corners of the mask frame 1. When the alignment strip 3 is provided on the mask frame 1, the projection of a plurality of solder joints 5 located on at least one side of the alignment mark 4 into the mask frame 1 in the vertical direction Z is located within the first groove 13. The shape of the first groove 13 includes L-shape, U-shape, U-shape, and spiral shape; and / or, the mask frame 1 is provided with a plurality of second grooves 14. When the alignment strip 3 is provided on the mask frame 1, the projection of a plurality of second grooves 14 into the mask frame 1 is located within the first groove 13. Grooves 14 are respectively provided on at least one side of each first cutting track 301 in the second direction Y. In the orthogonal projection of the alignment strip 3 in the vertical direction Z towards the mask frame 1, multiple weld points 5 are located within the second groove 14; and / or, the mask frame 1 is provided with multiple third grooves 15. When the alignment strip 3 is provided on the mask frame 1, the third grooves 15 surround the periphery of the second cutting track 302, and in the orthogonal projection of the alignment strip 3 in the vertical direction Z towards the mask frame 1, multiple weld points 5 are located within the third grooves 15. By using the grooves provided on the mask frame 1, the weld points 5 can be located within the grooves during laser welding, which will not increase the distance between the upper surface of the alignment mother plate 30a and the upper surface of the mask frame 1, thus improving the performance of the mask.

[0058] In some embodiments, such as Figure 4Before welding the two alignment mother plates 30a to the mask frame 1, the placement of the alignment mother plates 30a on the mask frame 1 needs to be adjusted so that multiple alignment marks 4 are arranged at the four corners of the mask frame, and the center of the diagonal line connecting the multiple alignment marks 4 coincides with the center 1a of the mask frame 1, so as to improve the assembly accuracy of the mask assembly 10 and further improve the alignment accuracy of the substrate 40 of the mask assembly 10.

[0059] Optionally, the alignment mark 4 may be shaped as at least one of a circle, a cross, a U, or a T to further improve the alignment accuracy with the mark on the substrate 40. In this embodiment of the present disclosure, the alignment mark 4 is set to a circle, but is not limited thereto.

[0060] Figure 8 This is a flowchart illustrating a method for manufacturing a mask template component according to one embodiment of this application.

[0061] Figure 9 This is a flowchart illustrating a method for manufacturing a mask template component in yet another embodiment of this application.

[0062] This application also provides a method for manufacturing a mask template component, such as... Figure 8 and Figure 9 As shown, the mask assembly 10 can be referred to the relevant descriptions of the above embodiments, and the steps of the method for manufacturing the mask assembly 10 are described below.

[0063] S110: Obtain the mask frame 1 and two alignment mother plates 30a, wherein the alignment mother plates 30a are provided with a first cutting track 301.

[0064] S120: Connect the alignment mother plates 30a to the top of the mask frame 1 respectively, arrange the two alignment mother plates 30a at intervals along the first direction X, so that the part of the film thickness opening 311 provided on each alignment mother plate 30a is located in the hollow area 12, and make the alignment marks 4 provided at both ends of the alignment mother plate 30a located on the mask frame 1.

[0065] S130: Cut along the first cutting path 301 of the alignment mother plate 30a to form an alignment strip 3 having a first alignment block 33, a film thickness alignment block 31 and a second alignment block 32 arranged sequentially at intervals along the second direction Y. The first alignment block 33, the film thickness alignment block 31 and the second alignment block 32 are independently connected to the mask frame 1.

[0066] In this embodiment, the alignment mother plate 30a connected to the mask frame 1 is cut along a pre-set cutting track. While ensuring the assembly efficiency and accuracy of the mask, the alignment strip 3 is formed into three independent alignment blocks, which reduces the contact area between the alignment block where the alignment mark 4 is located and the substrate 40. This avoids the situation where the alignment mark 4 is misaligned during the bonding process between the substrate 40 and the mask assembly 10, and improves the alignment accuracy.

[0067] In some embodiments, the alignment mother plates 30a are respectively connected to the top of the mask frame 1. The specific manufacturing method includes the following steps:

[0068] S121: Take two alignment mother plates 30a and place them on top of the mask frame 1 respectively. Adjust the position of the two alignment mother plates 30a relative to the mask frame 1 so that the intersection of the diagonal lines connecting the four alignment marks 4 on the two alignment mother plates 30a coincides with the center 1a of the mask frame 1, and make the overlapping area 11 of the two alignment mother plates 30a coincide with the mask frame 1.

[0069] S122: Weld two alignment mother plates 30a to the mask frame 1 along the shape of the first groove 13 and the shape of the second groove 14, and make the weld point 5 at least partially located in the first groove 13 and the second groove 14.

[0070] In this embodiment, the groove provided on the mask frame 1 allows the weld point 5 to be located within the groove during laser welding, thus preventing an increase in the distance between the upper surface of the alignment mother plate 30a and the upper surface of the mask frame 1.

[0071] In some optional embodiments, after cutting along the first cutting path 301 of the alignment mother plate 30a, the manufacturing method further includes cutting along the second cutting path 302 of the alignment mother plate 30a.

[0072] Optionally, two alignment mother plates 30a are welded to the mask frame 1 along the shape of the third groove 15, and the weld point 5 is located at least partially within the third groove 15.

[0073] This application also provides a vapor deposition apparatus 100, such as... Figure 7 The vapor deposition apparatus 100 includes a first receiving member 20 and a second receiving member 30. The first receiving member 20 is configured to support a substrate 40, and the second receiving member 30 is disposed below the first receiving member 20 and configured to support a mask assembly 10. At least one of the first receiving member 20 and the second receiving member 30 is movable to align the substrate 40 with the mask assembly 10.

[0074] Optionally, the vapor deposition equipment 100 may further include a pressure plate 50 disposed above the vapor deposition area 201. The pressure plate 50 may be configured as an electrostatic plate. Multiple magnetic blocks 60 are provided on the side of the pressure plate 50 facing the substrate 40, and a cooling plate 70 is provided on the side of the pressure plate 50 away from the substrate 40. The pressure plate 50 and the cooling plate 70 are connected to a lifting assembly 80. The lifting assembly 80 can drive the pressure plate 50 to descend so as to fit against the substrate 40. After being aligned with the substrate 40, the mask assembly 10 can be driven by the second receiving member 30 to move in the vertical direction Z so that the alignment strip 3 of the mask assembly 10 contacts and engages with the substrate 40, and the metal mask assembly 10 is attracted by the magnetic force of the magnetic blocks 60 so that the substrate 40 is clamped between the pressure plate 50 and the mask assembly 10.

[0075] It is understood that the relevant structures and mating relationships of the mask assembly 10 and the vapor deposition equipment 100 can be referred to the relevant descriptions of the above embodiments, and will not be repeated here.

[0076] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings of this application for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it may be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0077] Furthermore, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0078] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A mask assembly, characterized in that, include: Mask template frame with openwork areas; A mask template body is connected to the mask template frame, and the mask template body is at least partially located in the hollow area. The mask template body is provided with a plurality of mask openings corresponding to the hollow area. Two alignment strips are connected to the upper surface of the mask frame. The two alignment strips are arranged at intervals on both sides of the mask frame along a first direction. A portion of each alignment strip is located in the hollow area, and at least one film thickness opening is provided at the alignment strip located in the hollow area. Alignment marks are provided at both ends of each alignment strip in a second direction. The first direction and the second direction intersect. Each alignment strip includes a first alignment block, a film thickness alignment block, and a second alignment block arranged sequentially at intervals along the second direction. The first alignment block, the film thickness alignment block, and the second alignment block are respectively connected to the mask frame. Alignment marks are respectively disposed on the first alignment block and the second alignment block. The film thickness opening is disposed on the film thickness alignment block.

2. The mask assembly according to claim 1, characterized in that, The alignment strip is obtained by cutting the alignment mother plate. The alignment mother plate has two first cutting channels arranged at intervals along the second direction. The alignment marks are respectively set on both sides of the first cutting channels. In the vertical projection of the first cutting channel onto the mask frame, the first cutting channel is located on the mask frame. The first cutting channel extends along the first direction to penetrate the alignment mother plate.

3. The mask assembly according to claim 2, characterized in that, The width of the first cutting groove in the second direction is greater than or equal to 10 mm; and / or, The distance from the first cutting ridge to the alignment mark in the second direction is greater than or equal to 5 mm; and / or, The distance from the first cutting path in the second direction to the edge of the mask frame that encloses the hollow area is greater than or equal to 5 mm.

4. The mask assembly according to claim 2, characterized in that, The alignment master plate further includes at least one second cutting channel, which extends along the second direction. The second cutting channel is located between two first cutting channels and has a first distance between it and the first cutting channel. The first distance is greater than or equal to 10 mm. In the orthogonal projection of the second cutting channel onto the mask frame in the vertical direction, the second cutting channel is located on the mask frame. The distance from the second cutting channel to the film thickness opening in the first direction is greater than or equal to 15 mm.

5. The mask assembly according to claim 4, characterized in that, The alignment strip is welded to the mask frame. At least one alignment mark in the first alignment block is provided with a plurality of weld points spaced apart along the first direction on the side facing the film thickness alignment block. At least one alignment mark in the second alignment block is provided with a plurality of weld points spaced apart along the first direction on the side facing the film thickness alignment block. The film thickness alignment block is provided with a plurality of weld points at both ends in the second direction. Preferably, the plurality of solder joints are arranged at equal intervals around the periphery of the alignment mark; Preferably, the plurality of solder joints are respectively disposed on both sides of the first cutting track in the second direction; Preferably, the plurality of solder joints are arranged around the periphery of the second cutting track.

6. The mask assembly according to claim 5, characterized in that, The mask frame is provided with a plurality of first grooves, which are disposed at the four corners of the mask frame. When the alignment strip is disposed on the mask frame, the orthographic projection of a plurality of solder joints located on at least one side of the alignment mark onto the mask frame in the vertical direction lies within the first groove. The shape of the first groove includes L-shape, U-shape, U-shape, and spiral shape; and / or, The mask frame is provided with a plurality of second grooves. When the alignment strip is disposed on the mask frame, the plurality of second grooves are respectively disposed on at least one side of each of the first cutting kerfs in the second direction. In the vertical projection of the alignment strip onto the mask frame, the plurality of solder joints are located within the second grooves; and / or, The mask frame is provided with a plurality of third grooves. When the alignment strip is provided on the mask frame, the third grooves surround the periphery of the second cutting track, and in the vertical projection of the alignment strip onto the mask frame, a plurality of the solder joints are located within the third grooves.

7. The mask assembly according to any one of claims 1-6, characterized in that, Multiple alignment marks are arranged at the four corners of the mask frame, and the center of the line connecting the diagonals of the multiple alignment marks coincides with the center of the mask frame; The shape of the alignment mark includes at least one of the following: circle, cross, U, and T.

8. A vapor deposition apparatus, characterized in that, include: The first receiving component is configured to support the substrate; A second receiving member is disposed below the first receiving member, the second receiving member being configured to carry the mask assembly as described in any one of claims 1-7, at least one of the first receiving member and the second receiving member being movable to align the substrate with the mask assembly.

9. A method for manufacturing a mask assembly, characterized in that, Applied to the fabrication of the mask assembly according to any one of claims 1-7, wherein the alignment strip is obtained by cutting an alignment mother plate, the alignment mother plate including at least a first cutting track, the fabrication method comprising: Obtain a mask frame and two alignment master plates, wherein the alignment master plates are provided with a first cutting track; The alignment master plates are respectively connected to the top of the mask frame. The two alignment master plates are arranged at intervals along the first direction, so that the part of the film thickness opening provided on each alignment master plate is located in the hollow area, and the alignment marks provided at both ends of the alignment master plates are located on the mask frame. Cut along the first cutting path of the alignment master plate to form an alignment strip having a first alignment block, a film thickness alignment block and a second alignment block arranged sequentially at intervals along the second direction. The first alignment block, the film thickness alignment block and the second alignment block are independently connected to the mask frame.

10. The method for manufacturing the mask assembly according to claim 9, characterized in that, The mask template frame is provided with a first groove and a second groove. The specific manufacturing method of connecting the alignment mother plates to the top of the mask template frame includes: Take two alignment mother plates and place them above the mask frame. Adjust the position of the two alignment mother plates relative to the mask frame so that the intersection of the diagonal lines connecting the four alignment marks on the two alignment mother plates coincides with the center of the mask frame, and make the overlapping area of ​​the two alignment mother plates coincide with the mask frame. Two alignment mother plates are welded to the mask frame along the shape of the first groove and the shape of the second groove, with the weld points at least partially located in the first groove and the second groove; Preferably, the alignment mother plate further includes a second cutting groove, and after cutting along the first cutting groove of the alignment mother plate, the manufacturing method further includes: cutting along the second cutting groove of the alignment mother plate; Preferably, when the alignment mother plate includes the second cutting channel, the mask frame is provided with a third groove. The specific manufacturing method of connecting the alignment mother plates to the top of the mask frame further includes: welding two alignment mother plates to the mask frame along the shape of the third groove, and making the weld point at least partially located in the third groove.

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