A kind of evaporation equipment
Patent Information
- Application Number
- CN202510369439.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2026-09-29
AI Technical Summary
[0004]本发明提供了一种蒸镀设备，以解决蒸镀周期间形成膜层的厚度及均匀性的偏差较大，导致生产效率降低的问题
[0029]本发明实施例提供的蒸镀设备，在蒸发源本体的喷出材料方向的一侧设置有蒸发源限制部，每两个蒸发源限制部之间间隔设置，且两蒸发源限制部顶部之间的间隔具有预设宽度。蒸发源本体包括的各蒸发源与各间隔一一对应设置，两个蒸发源限制部之间的间隔可对相应蒸发源的蒸镀角度及区域进行单独调整，有利于提高对蒸镀角度及区域调节的精确度。各蒸发源限制部的内部设置有微调整模块，微调整模块与控制模块电连接，控制模块向与设定位置存在较大位置偏差的蒸发源限制部的微调整模块发送调整指令。微调整模块根据调整指令驱动相应的蒸发源限制部进行位置变化，以减小相应蒸发源限制部与设定位置之间的位置偏差，调整间隔的预设宽度。如此在蒸镀周期间对相应蒸发源限制部的位置进行调整，可有效减小蒸镀周期间的蒸镀角度及区域的差异，从而减小蒸镀周期间形成的膜层的厚度差异及均匀性差异，有利于提高生产效率。
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Figure CN122833446A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor device fabrication technology, and in particular to a vapor deposition apparatus. Background Technology
[0002] In recent years, the application of organic light-emitting diode (OLED) screens has exploded, with major manufacturers vigorously developing and producing OLED display screens.
[0003] In the manufacturing process of OLED screens, vapor deposition is a core technology, relying on a linear evaporation source with an angle limiting plate. However, maintaining the angle limiting plate can easily cause slight deformation, resulting in significant deviations in the thickness and uniformity of the film formed during the vapor deposition cycle, leading to reduced production efficiency. Summary of the Invention
[0004] This invention provides a vapor deposition equipment to solve the problem of large deviations in the thickness and uniformity of the film formed during the vapor deposition cycle, which leads to reduced production efficiency.
[0005] According to one aspect of the present invention, a vapor deposition apparatus is provided, comprising:
[0006] An evaporation source body, wherein the evaporation source body includes at least one evaporation source;
[0007] An evaporation source limiting part is disposed on one side of the evaporation source body in the direction of material ejection; the evaporation source limiting part includes at least two parts, and a space with a preset width is formed between the top of each pair of evaporation source limiting parts on the side away from the evaporation source body, and each space is disposed in one-to-one correspondence with each evaporation source; the evaporation source limiting part is used to limit the area range of material ejected by the evaporation source through the space with the preset width; a micro-adjustment module is disposed inside the evaporation source limiting part;
[0008] A control module is electrically connected to the micro-adjustment module; the control module is used to send an adjustment command to the micro-adjustment module before evaporation; the micro-adjustment module is used to control the position change of the evaporation source limiting part according to the adjustment command before evaporation, so as to adjust the preset width of the corresponding interval.
[0009] Optionally, the micro-adjustment module includes a micro-drive unit and an adjustment unit;
[0010] The adjustment unit is fixed to the inner wall of the evaporation source limiting part, and the adjustment unit is mechanically connected to the micro-drive unit;
[0011] The micro-drive unit is used to drive the adjustment unit to move in a preset direction or rotate at a preset angle according to the adjustment command, so as to cause the evaporation source limiting part to change position and adjust the preset width of the interval.
[0012] Optionally, the adjustment unit includes a linear drive shaft, and the micro-drive unit includes a drive rod;
[0013] The micro-drive unit and the adjustment unit constitute a linear transmission structure. The micro-drive unit is used to drive the adjustment unit to move linearly in the preset direction through the transmission structure, so as to drive the evaporation source limiting part to perform position translation.
[0014] Optionally, the adjustment unit includes a rotating shaft, and the micro-drive unit includes a drive rod;
[0015] The micro-drive unit and the adjustment unit constitute a rotating mechanism. The micro-drive unit is used to drive the rotating shaft to rotate within a preset angle range through the rotating mechanism, so as to drive the evaporation source limiting part to rotate.
[0016] Optionally, the micro-drive unit of each of the evaporation source limiting sections is electrically connected to the control module.
[0017] Optionally, the evaporation source limiting part includes a first limiting part and a second limiting part;
[0018] The second limiting part is disposed on the top of the first limiting part on the side away from the evaporation source body, and the first limiting part and the second limiting part are integral structures;
[0019] The first limiting part is provided with at least one of the aforementioned micro-adjustment modules, which are used to control the overall position movement of the evaporation source limiting part.
[0020] Optionally, the evaporation source limiting part includes a first limiting part and a second limiting part, wherein the second limiting part is disposed on the top of the first limiting part on the side away from the evaporation source body;
[0021] The first limiting part includes at least two sub-limiting parts, which are linearly connected by a connecting axis. Each sub-limiting part is provided with at least one micro-adjustment module inside. The micro-adjustment module is used to move the corresponding sub-limiting part individually.
[0022] Optionally, the evaporation source limiting part includes an evaporation source limiting plate extending in a direction from near the evaporation source body to away from the evaporation source body.
[0023] Optionally, the vapor deposition equipment further includes: a chamber, an image acquisition device, and a host computer;
[0024] The evaporation source body, the evaporation source limiting part, and the control module are disposed inside the chamber, which is used to provide a vacuum environment; the image acquisition device is fixed at a preset position on the inner wall of the chamber; the host computer is disposed outside the chamber, and the image acquisition device is electrically connected to the host computer;
[0025] The image acquisition device is used to acquire a position image of the evaporation source limiting part and send it to the host computer; wherein, the position image represents the current position of the evaporation source limiting part; the host computer is used to compare the current position with a set position based on the position image, determine the evaporation source limiting part whose position difference exceeds a difference threshold, and generate a control signal.
[0026] Optionally, the vapor deposition equipment further includes: a connecting conversion chamber;
[0027] The connection conversion cavity is located on the side of the evaporation source body away from the evaporation source limiting part; the control module is located inside the connection conversion cavity and is electrically connected to the host computer.
[0028] The control module is used to send the adjustment command to the micro-adjustment module of the corresponding evaporation source limiting part according to the control signal issued by the host computer, so as to adjust the position of the evaporation source limiting part; and the control module is also used to feed back the adjusted position of the evaporation source limiting part to the host computer.
[0029] The vapor deposition equipment provided in this invention includes an evaporation source limiting section on one side of the evaporation source body in the direction of material ejection. Each pair of evaporation source limiting sections is spaced apart, and the gap between the tops of the two limiting sections has a preset width. Each evaporation source in the evaporation source body corresponds one-to-one with each gap. The gap between two limiting sections allows for individual adjustment of the vapor deposition angle and area of the corresponding evaporation source, improving the accuracy of angle and area adjustment. Each limiting section contains a micro-adjustment module electrically connected to a control module. The control module sends adjustment commands to the micro-adjustment module of a limiting section with a significant positional deviation from the set position. The micro-adjustment module drives the corresponding limiting section to change position according to the adjustment command, reducing the positional deviation between the limiting section and the set position, and adjusting the preset width of the gap. By adjusting the position of the limiting section during a vapor deposition cycle, the differences in vapor deposition angle and area between cycles can be effectively reduced, thereby reducing the thickness and uniformity differences of the film formed during the cycle and improving production efficiency.
[0030] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description
[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0032] Figure 1 This is a schematic diagram of the structure of a vapor deposition apparatus according to an embodiment of the present invention;
[0033] Figure 2 yes Figure 1 A schematic diagram of the specific structure of an evaporation source limiting section;
[0034] Figure 3 yes Figure 1 A schematic diagram of the specific structure of another type of evaporation source restriction section;
[0035] Figure 4 yes Figure 1 A schematic diagram of the specific structure of another type of evaporation source restriction section;
[0036] Figure 5 This is a schematic diagram of another vapor deposition apparatus provided according to an embodiment of the present invention. Detailed Implementation
[0037] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.
[0038] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0039] As described in the background section, vapor deposition technology is a core process technology in OLED screen manufacturing. The principle of vapor deposition is to uniformly and controllably evaporate organic materials and OLED cathode materials onto the OLED substrate through thermal evaporation, forming the corresponding functional layer of the OLED device. The key equipment for forming the organic light-emitting material film layer using vapor deposition technology is the linear evaporation source. During the vapor deposition process, the linear evaporation source works in conjunction with an angle limiting plate to determine the evaporation area and angle of the organic material. Since the angle limiting plate is a metal processing part, and it requires cleaning and sandblasting after each use, the process can easily cause slight deformation of the angle limiting plate. When used again in the next vapor deposition cycle, this slight deformation of the angle limiting plate exacerbates the loading effect of the linear evaporation source, resulting in significant deviations in the thickness and uniformity of the film layer formed in different vapor deposition cycles, causing the formed OLED device to fail to meet production requirements.
[0040] To address the aforementioned problems with vapor deposition technology, the relevant techniques generally employ the following two methods: One method involves not controlling slight deformation of the angle limiting plate and adjusting the film thickness parameters before the next vapor deposition cycle to achieve the target film thickness; this method is estimated to take 5 hours. The other method involves manually fine-tuning the vapor deposition angle and width defined by the installed angle limiting plate before the next vapor deposition cycle to reduce the difference in width defined by the angle limiting plate during the cycle; then adjusting the film thickness parameters to achieve the target film thickness; this method is estimated to take 3 hours. Both methods require a considerable amount of time to ensure consistent film thickness, leading to reduced production efficiency.
[0041] Based on the above-mentioned technical problems, the embodiments of the present invention propose the following technical solutions:
[0042] This invention provides a vapor deposition apparatus. Figure 1This is a schematic diagram of a vapor deposition apparatus provided in an embodiment of the present invention. Figure 1 As shown, the vapor deposition equipment 000 includes: an evaporation source body 100, an evaporation source limiting part 200, and a control module 300.
[0043] The evaporation source body 100 includes at least one evaporation source 101;
[0044] An evaporation source limiting part 200 is disposed on one side of the evaporation source body 100 in the direction of ejected material; the evaporation source limiting part 200 includes at least two parts, and a space with a preset width is formed between the top of each pair of evaporation source limiting parts 200 on the side away from the evaporation source body, and each space is disposed in a one-to-one correspondence with each evaporation source 101; the evaporation source limiting part 200 is used to limit the area range of ejected material from the evaporation source 101 by the space with the preset width; a micro-adjustment module 201 is disposed inside the evaporation source limiting part 200;
[0045] The control module 300 is electrically connected to the micro-adjustment module 201; the control module 300 is used to send an adjustment command to the micro-adjustment module 201 before vapor deposition; the micro-adjustment module 201 is used to control the position change of the evaporation source limiting part 200 according to the adjustment command before vapor deposition, so as to adjust the preset width of the corresponding interval.
[0046] Specifically, the evaporation source body 100 provides the material source for the evaporation deposition equipment 000. The evaporation source body 100 is provided with at least one evaporation source 101, which are arranged at intervals to eject gas containing the corresponding material to the outside, forming a film layer of the corresponding material on the substrate surface. An evaporation source limiting part 200 is provided on the side where the evaporation source 101 ejects material onto the substrate surface, blocking the material gas ejected by the evaporation source 101, thereby limiting the material gas to a certain width area. This allows the material ejected by the evaporation source 101 to deposit in a certain area on the substrate surface, resulting in a film layer with good uniformity.
[0047] Two evaporation source limiting parts 200 are provided at positions corresponding to each evaporation source 101, respectively located on both sides of the material outlet of the evaporation source 101; that is, the two evaporation source limiting parts 200 are arranged at a certain interval, and the interval between the evaporation source 101 and the two evaporation source limiting parts 200 is correspondingly set. The interval between the tops of the two evaporation source limiting parts 200 has a preset width. Under the blocking effect of the evaporation source limiting parts 200, the edge of the maximum range of material gas ejected from the evaporation source 101 is located between the material outlet of the evaporation source 101 and the top of the evaporation source limiting part 200 on the side away from the evaporation source 101. In other words, the area range of material gas ejected from the evaporation source 101 is mainly limited by the interval between the tops of the two evaporation source limiting parts 200. Therefore, by adjusting the preset width of the interval between the tops of the two evaporation source limiting parts 200, the evaporation angle and area of the evaporation source can be adjusted.
[0048] For example, Figure 1 The illustration shows an evaporation source body 100 comprising three evaporation sources 101, with an evaporation source limiting part 200 disposed on both sides of the material outlet of each evaporation source 101, resulting in a total of six evaporation source limiting parts 200. It should be noted that two evaporation source limiting parts 200 can be disposed between two adjacent evaporation sources 101. Each evaporation source limiting part 200 restricts the angle and area of the material gas ejected from the adjacent evaporation source 101, such as... Figure 1 As shown; alternatively, only one evaporation source limiting part 200 may be provided between two adjacent evaporation sources 101 to simultaneously limit the angle and area of the material gas ejected from the two adjacent evaporation sources 101. In this embodiment, the case where two evaporation source limiting parts 200 are provided between two adjacent evaporation sources 101 is described.
[0049] Compared to related technologies that use multiple limiting structures to limit the deposition area and deposition angle of multiple evaporation sources, the embodiments of the present invention limit and adjust the angle and area range of the material gas ejected from a corresponding evaporation source 101 by using the gap formed at the top of the two evaporation source limiting parts 200. This allows for individual adjustment of the deposition angle and area of each evaporation source 101, which helps to improve the accuracy of the deposition angle and area adjustment, thereby reducing the thickness and uniformity differences of the formed film.
[0050] Each evaporator source limiting unit 200 is internally equipped with a micro-adjustment module 201, and each micro-adjustment module 201 is electrically connected to the control module 300. For evaporator source limiting units 200 that have undergone minor deformation due to cleaning and sandblasting, there may be a significant deviation between their installation position and the set position. The set position is a pre-defined target position for the evaporator source limiting unit 200. The set position can be set by the user according to actual needs, and there are no restrictions here. The control module 300 can send adjustment commands to the micro-adjustment modules 201 of evaporator source limiting units 200 with significant positional deviations; these adjustment commands can move the evaporator source limiting unit 200 a certain distance or rotate it by a certain angle. The micro-adjustment module 201 drives the evaporation source restriction part 200 to move its position or rotate its angle according to the received adjustment command. It adjusts the position of the evaporation source restriction part 200 with large position deviations so that the position of the evaporation source restriction part 200 is close to the set position. This adjusts the preset width of the interval between the tops of the corresponding evaporation source restriction parts 200 so that it is close to the target width. This ensures that the evaporation angle and regional differences between evaporation cycles are small, thereby reducing the thickness and uniformity differences of the film layer formed during the evaporation cycle, which is beneficial to improving production efficiency.
[0051] The vapor deposition equipment provided in this invention includes an evaporation source limiting section on one side of the evaporation source body in the direction of material ejection. Each pair of evaporation source limiting sections is spaced apart, and the gap between the tops of the two limiting sections has a preset width. Each evaporation source in the evaporation source body corresponds one-to-one with each gap. The gap between two limiting sections allows for individual adjustment of the vapor deposition angle and area of the corresponding evaporation source, improving the accuracy of angle and area adjustment. Each limiting section contains a micro-adjustment module electrically connected to a control module. The control module sends adjustment commands to the micro-adjustment module of a limiting section with a significant positional deviation from the set position. The micro-adjustment module drives the corresponding limiting section to change position according to the adjustment command, reducing the positional deviation between the limiting section and the set position, and adjusting the preset width of the gap. By adjusting the position of the limiting section during a vapor deposition cycle, the differences in vapor deposition angle and area between cycles can be effectively reduced, thereby reducing the thickness and uniformity differences of the film formed during the cycle and improving production efficiency.
[0052] Based on the above embodiments, Figure 2 yes Figure 1 A schematic diagram of the specific structure of an evaporation source confinement section is shown. For example... Figure 2 As shown, optionally, the micro-adjustment module 201 includes a micro-drive unit 202 and an adjustment unit 203.
[0053] The adjustment unit 203 is fixed to the inner wall of the evaporation source limiting part 200, and the adjustment unit 203 is mechanically connected to the micro-drive unit 202;
[0054] The micro-drive unit 202 is used to drive the adjustment unit 203 to move in a preset direction or rotate at a preset angle according to the adjustment command, so as to cause the evaporation source limiting part 200 to change position and adjust the preset width of the interval.
[0055] Specifically, the micro-adjustment module 201 inside the evaporation source limiting section 200 may include two parts: a micro-drive unit 202 and an adjustment unit 203. The adjustment unit 203 is mechanically connected to the micro-drive unit 202. The micro-drive unit 202 can be connected to a motor or receive an electrical signal for startup, and performs corresponding transmission under the drive of the motor or electrical signal. Thus, with this cooperative structure between the adjustment unit 203 and the micro-drive unit 202, the adjustment unit 203 can perform corresponding movements under the transmission of the micro-drive unit 202.
[0056] The adjustment unit 203 is fixed to the inner wall of the evaporation source restriction part 200, meaning that the adjustment unit 203 and the evaporation source restriction part 200 are fixed as an integral structure. Therefore, while the micro-drive unit 202 drives the adjustment unit 203 to move accordingly and change its position, the adjustment unit 203 can also cause the evaporation source restriction part 200 to change its position accordingly, thereby adjusting the position of the evaporation source restriction part 200, reducing the positional deviation between the position of the evaporation source restriction part 200 and the set position, and making the preset width between the tops of the two evaporation source restriction parts 200 close to the target width, thereby reducing the difference in the thickness and uniformity of the film layer formed during the evaporation cycle and improving production efficiency.
[0057] An evaporation source limiting section 200 may contain a micro-adjustment module 201 for controlling the positional movement of the evaporation source limiting section 200 in one dimension; alternatively, at least two micro-adjustment modules 201 may be provided, with each micro-adjustment module 201 driving the evaporation source limiting section 200 to move in a different dimension. For example, see [link to example]. Figure 2This illustrates a feasible arrangement of a micro-drive unit 202 and an adjustment unit 203 within an evaporation source limiting section 200. As can be seen, the micro-drive unit 202 can be a rod-shaped structure, and the adjustment unit 203 can slide slightly left and right along a direction perpendicular to the micro-drive unit 202 to cause a slight left-right slide in the evaporation source limiting section 200. Alternatively, another micro-adjustment module 201 can be provided, and the adjustment unit 203 can slide slightly up and down along the extension direction of the micro-drive unit 202 to cause a slight up-down slide in the evaporation source limiting section 200. Alternatively, another micro-adjustment module 201 can be provided, and the adjustment unit 203 can rotate or tilt around the micro-drive unit 202 at a certain angle to cause a slight rotation or tilt in the evaporation source limiting section 200. This allows the slightly deformed evaporation source limiting section 200 to be adjusted in multiple dimensions, reducing positional deviation from the set position and ensuring minimal differences in the thickness and uniformity of the film formed during different evaporation cycles.
[0058] The mechanical cooperation structure between the micro-drive unit 202 and the adjustment unit 203 can include a variety of possible configurations. The following embodiments will exemplarily illustrate the possible mechanical structures of the micro-drive unit 202 and the adjustment unit 203.
[0059] Based on the above embodiments, see below. Figure 1 and Figure 2 Optionally, the adjustment unit 203 includes a linear drive shaft, and the micro-drive unit 202 includes a drive rod.
[0060] The micro-drive unit 202 and the adjustment unit 203 constitute a linear transmission structure. The micro-drive unit 202 is used to drive the adjustment unit 203 to move linearly in a preset direction through the transmission structure, so as to drive the evaporation source limiting part 200 to perform position translation.
[0061] For example, the micro-drive unit 202 can be configured as a drive rod, the bottom of which can be connected to a motor or receive electrical signals transmitted by the control module 300 to realize the movement of the drive rod. The adjustment unit 203 can be configured as a linear drive shaft, forming a linear transmission structure with the drive rod. The linear drive shaft is connected to one end of the drive rod through the linear transmission structure, and through mechanical transmission, the linear drive shaft can make a small linear sliding along the drive rod in a preset direction. For example, the preset direction can be any of the X, Y, or Z directions in a three-dimensional coordinate system, depending on actual needs, and is not limited here. It should be noted that one micro-adjustment module 201 can only perform a small position adjustment in one direction.
[0062] Based on the above embodiments, see below. Figure 1 and Figure 2 Optionally, the adjustment unit 203 includes a rotating shaft, and the micro-drive unit 202 includes a drive rod.
[0063] The micro-drive unit 202 and the adjustment unit 203 constitute a rotating mechanism. The micro-drive unit 202 is used to drive the rotating shaft to rotate within a preset angle range through the rotating mechanism, so as to drive the evaporation source limiting part 200 to rotate.
[0064] For example, the micro-drive unit 202 can be configured as a drive rod, the bottom of which can be connected to a motor or receive electrical signals transmitted by the control module 300 to realize the movement of the drive rod. The adjustment unit 203 can also be configured as a rotating shaft, which forms a rotating mechanism with the drive rod. The rotating shaft is mechanically connected to one end of the drive rod through the rotating mechanism, and the rotating shaft can rotate slightly on the drive rod within a certain preset angle range through mechanical transmission. For example, the preset angle range can include the rotation angle range in the horizontal plane, or it can include the tilt angle range in a plane perpendicular to the horizontal plane, without limitation.
[0065] The mechanically coupled structure achievable by the micro-drive unit 202 and adjustment unit 203 as exemplarily described in the above embodiments allows the adjustment unit 203 to drive the evaporation source limiting part 200 to achieve minute positional adjustments in multiple dimensions under the control of the micro-drive unit 202. This reduces the positional deviation between the slightly deformed evaporation source limiting part 200 and the set position, making the preset width of the gap between the tops of the two evaporation source limiting parts 200 close to the target width, thus ensuring that the difference in the thickness and uniformity of the film layer formed during the evaporation cycle is small.
[0066] Based on the above embodiments, see below. Figure 1 and Figure 2 Optionally, the micro-drive unit 202 of each evaporation source limiting section 200 is electrically connected to the control module 300.
[0067] Specifically, the micro-drive units 202 of at least one micro-adjustment module 201 disposed inside each evaporation source limiting part 200 are all electrically connected to the same control module 300. That is, the same control module 300 can send adjustment commands to all micro-drive units 202 to achieve individual position adjustment of each evaporation source limiting part 200. Compared with setting multiple control modules to control each micro-drive unit 202, the embodiments of the present invention can reduce the amount of wiring harness used and the hardware manufacturing cost.
[0068] Based on the above embodiments, Figure 3 yes Figure 1 A schematic diagram of the specific structure of another type of evaporation source confinement section. See also... Figure 2 and Figure 3 Optionally, the evaporation source restriction section 200 includes a first restriction section 210 and a second restriction section 220.
[0069] The second limiting part 220 is disposed on the top of the first limiting part 210 on the side away from the evaporation source body 100, and the first limiting part 210 and the second limiting part 220 are integral structures.
[0070] The first limiting part 210 is provided with at least one micro-adjustment module 201, which is used to control the overall position movement of the evaporation source limiting part 200.
[0071] For example, the evaporation source limiting portion 200 includes an evaporation source limiting plate extending in a direction from near the evaporation source body 100 to away from the evaporation source body 100. A first limiting portion 210 of the evaporation source limiting plate is disposed near the evaporation source body 100 and extends in a direction away from the evaporation source body 100. A second limiting portion 220 is located at the end of the first limiting portion 210 away from the evaporation source body 100, and the orthographic projection of the second limiting portion 220 onto the evaporation source body 100 completely covers the orthographic projection of the first limiting portion 210 onto the evaporation source body 100. At least one side of the second limiting portion 220 protrudes from the first limiting portion 210. For example, see [link to relevant documentation]. Figure 2 This shows the second limiting part 220 protruding from the first limiting part 210 on the right; see also Figure 3 This shows that the left and right sides of the second limiting part 220 protrude from the first limiting part 210. It can be seen that the two evaporation source limiting parts 200 mainly limit the evaporation angle and area of the evaporation source 101 by the preset width of the gap formed between the second limiting parts 220.
[0072] If the first limiting part 210 and the second limiting part 220 are configured as an integral structure, then when the at least one micro-adjustment module 201 disposed in the first limiting part 210 adjusts the position of the evaporation source limiting part 200, the adjustment unit 203 in the micro-adjustment module 201 drives the integrally disposed first limiting part 210 and the second limiting part 220 to perform a small positional movement together, so as to reduce the positional deviation between the position of the evaporation source limiting part 200 and the set position, and reduce the difference between the evaporation angle and the area of the evaporation source 101 during the evaporation cycle.
[0073] Based on the above embodiments, Figure 4 yes Figure 1 A schematic diagram of the specific structure of another type of evaporation source confinement section. See also... Figure 2 and Figure 4Optionally, the evaporation source limiting part 200 includes a first limiting part 210 and a second limiting part 220, with the second limiting part 220 disposed on the top of the first limiting part 210 on the side away from the evaporation source body 100;
[0074] The first limiting part 210 includes at least two sub-limiting parts 211, which are linearly connected by a connecting shaft 212. Each sub-limiting part 211 is provided with at least one micro-adjustment module 201. The micro-adjustment module 201 is used to move the corresponding sub-limiting part 211 individually.
[0075] Specifically, the first limiting part 210 can be configured as a multi-section connected structure, that is, the first limiting part 210 includes at least two sub-limiting parts 211, each sub-limiting part 211 is arranged linearly in sequence along the direction from near the evaporation source body 100 to away from the evaporation source body 100, and adjacent sub-limiting parts 211 can be connected by a connecting shaft 212. In this way, the two evaporation source limiting parts 200 used to limit the evaporation angle and area of one evaporation source 101 are configured as a multi-section structure, and each sub-limiting part 211 is provided with at least one micro-adjustment module 201. The micro-drive unit 202 in each micro-adjustment module 201 is electrically connected to the same control module 300, which can realize the individual adjustment of the position of each sub-limiting part 211, thereby improving the adjustment accuracy of the position of each evaporation source limiting part 200, minimizing the difference in thickness and uniformity of the film layer formed during the evaporation cycle, and effectively improving production efficiency.
[0076] Based on the above embodiments, Figure 5 This is a schematic diagram of another vapor deposition apparatus provided in an embodiment of the present invention. See also... Figure 5 Optionally, the vapor deposition equipment 000 also includes: a chamber 400, an image acquisition device 500, and a host computer 600;
[0077] The evaporation source body 100, the evaporation source limiting part 200 and the control module 300 are disposed inside the chamber 400, which is used to provide a vacuum environment; the image acquisition device 500 is fixed at a preset position on the inner wall of the chamber 400; the host computer 600 is disposed outside the chamber 400, and the image acquisition device 500 is electrically connected to the host computer 600.
[0078] The image acquisition device 500 is used to acquire the position image of the evaporation source restriction unit 200 and send it to the host computer 600; wherein, the position image represents the current position of the evaporation source restriction unit 200; the host computer 600 is used to compare the current position with the set position according to the position image, determine the evaporation source restriction unit 200 whose position difference exceeds the difference threshold, and generate a control signal.
[0079] Specifically, a chamber 400 is provided inside the vapor deposition equipment 000, and the number of chambers 400 may include at least one. The chamber 400 is the area where the vapor deposition process is performed, and the evaporation source body 100, the evaporation source confinement part 200, and the control module 300 are all located within the chamber 400. During the vapor deposition process, a vacuum environment is maintained within the chamber 400 to prevent external water and oxygen from affecting the vapor deposition process and the material being vaporized. A preset position is reserved at a certain height on the inner sidewall of the chamber 400. This preset position is used to install an image acquisition device 500, enabling the image acquisition device 500 to capture complete image data of the evaporation source confinement part 200, i.e., a position image. Exemplarily, the image acquisition device 500 may include a camera, scanner, industrial camera, etc., and is not limited thereto. The position images of the evaporation source limiting parts 200 acquired by the image acquisition device 500 can be transmitted to the host computer 600. The host computer 600 reads the current position of each evaporation source limiting part 200 in the position image and compares the current position of each evaporation source limiting part 200 with a set position in turn to obtain the corresponding position difference. Then, the position difference is compared with a difference threshold. If the position difference exceeds the difference threshold, it indicates that the deviation between the position of the evaporation source limiting part 200 and the set position is large, and position adjustment is required; if the position difference is within the difference threshold, it indicates that the deviation between the position of the evaporation source limiting part 200 and the set position is small, and position adjustment is not required. The host computer 600 can generate corresponding control signals based on the comparison and analysis results.
[0080] Based on the above embodiments, see below. Figure 5 Optionally, the vapor deposition equipment 000 also includes: a connecting conversion chamber 700;
[0081] The connecting conversion cavity 700 is located on the side of the evaporator source body 100 away from the evaporator source limiting part 200; the control module 300 is located inside the connecting conversion cavity 700 and is electrically connected to the host computer 600.
[0082] The control module 300 is used to send adjustment instructions to the micro-adjustment module 201 of the corresponding evaporation source limiting part 200 according to the control signal issued by the host computer 600, and adjust the position of the evaporation source limiting part 200; and the control module 300 is also used to feed back the adjusted position of the evaporation source limiting part 200 to the host computer 600.
[0083] Specifically, for the device within the vacuum chamber 400 of the vapor deposition equipment 000 that needs to be connected to external equipment via wiring harnesses, the connection conversion chamber 700 provides space for this connection. The connection conversion chamber 700 maintains a normal atmospheric environment. The control module 300 is located inside the connection conversion chamber 700 and is electrically connected to the host computer 600. The host computer 600 can send a control signal, determined by the position image, to the control module 300 to adjust the corresponding evaporation source limiting part 200. Based on the control signal, the control module 300 sends an adjustment command to the micro-adjustment module 201 of the corresponding evaporation source limiting part 200 with a large positional deviation. This causes the micro-adjustment module 201 to drive the corresponding evaporation source limiting part 200 to make a small positional adjustment, so that the adjusted position of the evaporation source limiting part 200 is close to the set position. Furthermore, the control module 300 can also transmit the adjusted position information of the evaporation source limiting part 200 back to the host computer 600 for recording and display.
[0084] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.
Claims
1. A vapor deposition apparatus, characterized in that, include: An evaporation source body, wherein the evaporation source body includes at least one evaporation source; An evaporation source limiting part is disposed on one side of the evaporation source body in the direction of material ejection; the evaporation source limiting part includes at least two parts, and a space with a preset width is formed between the top of each pair of evaporation source limiting parts on the side away from the evaporation source body, and each space is disposed in one-to-one correspondence with each evaporation source; the evaporation source limiting part is used to limit the area range of material ejected by the evaporation source through the space with the preset width; a micro-adjustment module is disposed inside the evaporation source limiting part; A control module is electrically connected to the micro-adjustment module; the control module is used to send an adjustment command to the micro-adjustment module before evaporation; the micro-adjustment module is used to control the position change of the evaporation source limiting part according to the adjustment command before evaporation, so as to adjust the preset width of the corresponding interval.
2. The vapor deposition equipment according to claim 1, characterized in that, The micro-adjustment module includes a micro-drive unit and an adjustment unit; The adjustment unit is fixed to the inner wall of the evaporation source limiting part, and the adjustment unit is mechanically connected to the micro-drive unit; The micro-drive unit is used to drive the adjustment unit to move in a preset direction or rotate at a preset angle according to the adjustment command, so as to cause the evaporation source limiting part to change position and adjust the preset width of the interval.
3. The vapor deposition equipment according to claim 2, characterized in that, The adjustment unit includes a linear drive shaft, and the micro-drive unit includes a drive rod; The micro-drive unit and the adjustment unit constitute a linear transmission structure. The micro-drive unit is used to drive the adjustment unit to move linearly in the preset direction through the transmission structure, so as to drive the evaporation source limiting part to perform position translation.
4. The vapor deposition equipment according to claim 2, characterized in that, The adjustment unit includes a rotating shaft, and the micro-drive unit includes a drive rod; The micro-drive unit and the adjustment unit constitute a rotating mechanism. The micro-drive unit is used to drive the rotating shaft to rotate within a preset angle range through the rotating mechanism, so as to drive the evaporation source limiting part to rotate.
5. The vapor deposition equipment according to claim 2, characterized in that, Each of the micro-drive units of the evaporation source limiting section is electrically connected to the control module.
6. The vapor deposition equipment according to claim 1, characterized in that, The evaporation source restriction section includes a first restriction section and a second restriction section; The second limiting part is disposed on the top of the first limiting part on the side away from the evaporation source body, and the first limiting part and the second limiting part are integral structures; The first limiting part is provided with at least one of the aforementioned micro-adjustment modules, which are used to control the overall position movement of the evaporation source limiting part.
7. The vapor deposition equipment according to claim 1, characterized in that, The evaporation source limiting part includes a first limiting part and a second limiting part, wherein the second limiting part is disposed on the top of the first limiting part on the side away from the evaporation source body; The first limiting part includes at least two sub-limiting parts, which are linearly connected by a connecting axis. Each sub-limiting part is provided with at least one micro-adjustment module inside. The micro-adjustment module is used to move the corresponding sub-limiting part individually.
8. The vapor deposition equipment according to claim 6 or 7, characterized in that, The evaporation source limiting part includes an evaporation source limiting plate extending in a direction from close to the evaporation source body to far away from the evaporation source body.
9. The vapor deposition equipment according to claim 1, characterized in that, Also includes: Chamber, image acquisition device, and host computer; The evaporation source body, the evaporation source limiting part, and the control module are disposed inside the chamber, which is used to provide a vacuum environment; the image acquisition device is fixed at a preset position on the inner wall of the chamber; the host computer is disposed outside the chamber, and the image acquisition device is electrically connected to the host computer; The image acquisition device is used to acquire a position image of the evaporation source limiting part and send it to the host computer; wherein, the position image represents the current position of the evaporation source limiting part; the host computer is used to compare the current position with a set position based on the position image, determine the evaporation source limiting part whose position difference exceeds a difference threshold, and generate a control signal.
10. The vapor deposition equipment according to claim 9, characterized in that, Also includes: Connect the conversion chamber; The connection conversion cavity is located on the side of the evaporation source body away from the evaporation source limiting part; the control module is located inside the connection conversion cavity and is electrically connected to the host computer. The control module is used to send the adjustment command to the micro-adjustment module of the corresponding evaporation source limiting part according to the control signal issued by the host computer, so as to adjust the position of the evaporation source limiting part; and the control module is also used to feed back the adjusted position of the evaporation source limiting part to the host computer.