Evaporation apparatus and method of adjustment

Abstract

This application discloses a vapor deposition apparatus and adjustment method, comprising: an evaporation source having a receiving cavity and an evaporation outlet communicating with the receiving cavity; a nozzle disposed on the mounting surface of the evaporation source; an angle adjustment assembly located on at least one side of the nozzle to limit the vapor deposition angle of the nozzle, the angle adjustment assembly being mounted on a bracket, the angle adjustment assembly including a plurality of angle adjustment members arranged in a first direction, the plurality of angle adjustment members being movably connected to allow the angle adjustment assembly to extend and retract in the first direction, thereby adjusting the vapor deposition angle of the nozzle; and a first driving member connected to the bracket for driving the bracket to move closer to or away from the evaporation source to adjust the distance between the bracket and the evaporation source. This application achieves the purpose of adjusting the vapor deposition angle of the nozzle by extending and retracting the plurality of movably connected angle adjustment members in the first direction, and by the first driving member driving the bracket to adjust the distance between the bracket and the evaporation source, thereby improving the adjustable range of the vapor deposition angle.

Description

Technical Field

[0001] This application relates to the field of vapor deposition technology, and in particular to a vapor deposition apparatus and adjustment method. Background Technology

[0002] In related technologies, vapor deposition equipment is usually used to deposit vapor deposition materials onto a substrate. However, the nozzles and angle limiting plates in existing vapor deposition equipment are fixed structures, which cannot be rotated or extended. This means that the vapor deposition equipment can only achieve a single vapor deposition angle, resulting in a limited vapor deposition range for the vapor deposition materials. Summary of the Invention

[0003] This application provides a vapor deposition apparatus and adjustment method, which can solve the problem that the vapor deposition apparatus can only achieve a single vapor deposition angle, resulting in a limited vapor deposition range for the vapor deposition material.

[0004] To solve the above-mentioned technical problems, this application adopts a technical solution: providing a vapor deposition apparatus, the vapor deposition apparatus comprising: an evaporation source, the evaporation source having a receiving cavity for accommodating vapor deposition material and an evaporation outlet communicating with the receiving cavity; a nozzle disposed on the mounting surface of the evaporation source, and the nozzle having a spray hole communicating with the evaporation outlet, the vapor deposition material being sprayed out from the evaporation source through the spray hole after being heated; an angle adjustment assembly located on at least one side of the nozzle, extending along a first direction intersecting the mounting surface to limit the vapor deposition angle of the nozzle, the angle adjustment assembly being mounted on a bracket, the angle adjustment assembly including a plurality of angle adjustment members arranged in the first direction, the plurality of angle adjustment members being movably connected to allow the angle adjustment assembly to be retractable in the first direction, thereby adjusting the vapor deposition angle of the nozzle; and a first driving member connected to the bracket for driving the bracket to move closer to or further away from the evaporation source to adjust the distance between the bracket and the evaporation source.

[0005] The vapor deposition apparatus further includes a second driving component for driving the evaporation source to rotate, thereby adjusting the spray direction of the nozzle.

[0006] The plurality of angle adjustment components include a first angle adjustment component. Among the plurality of angle adjustment components, the first angle adjustment component is closest to the bracket. The first angle adjustment component is movably connected to the bracket so that the extension direction of the angle adjustment component is adjustable.

[0007] Among them, the plurality of angle adjustment components include a second angle adjustment component, and among the plurality of angle adjustment components, the second angle adjustment component is furthest from the bracket, wherein a heating element is embedded inside the second angle adjustment component;

[0008] Preferably, the heating element comprises a resistance wire;

[0009] Preferably, the heating element is embedded inside each of the angle adjustment components.

[0010] The angle adjusting component is a sleeve structure and is sleeved around the nozzle; or, the angle adjusting component is a plate structure and there are two angle adjusting components, which are arranged on opposite sides of the nozzle.

[0011] The plurality of angle adjusting members include a third angle adjusting member and a fourth angle adjusting member arranged adjacent to each other. The third angle adjusting member is provided with a first fixing part extending along the first direction, and the fourth angle adjusting member is provided with a second fixing part. The second fixing part is adjustablely fixed to a selected position of the first fixing part.

[0012] Preferably, the first fixing part is a groove, and the second fixing part is a slider.

[0013] The angle adjustment component further includes a third driving member for driving the second fixing part to move relative to the first fixing part.

[0014] The plurality of angle adjusting members include a third angle adjusting member and a fourth angle adjusting member arranged adjacent to each other. The third angle adjusting member is provided with a plurality of first fixing parts arranged at intervals along the first direction. The fourth angle adjusting member is provided with a second fixing part. The second fixing part is selectively fixed to one of the first fixing parts.

[0015] Preferably, the first fixing part is a threaded hole, and the second fixing part is a stud and a nut.

[0016] To solve the above-mentioned technical problems, this application adopts a technical solution: providing an adjustment method applied to a vapor deposition apparatus, the vapor deposition apparatus comprising: an evaporation source, the evaporation source having a receiving cavity for accommodating vapor deposition material and an evaporation outlet communicating with the receiving cavity; a nozzle disposed on the mounting surface of the evaporation source, and the nozzle having a spray hole communicating with the evaporation outlet, the vapor deposition material being sprayed out from the evaporation source through the spray hole after being heated; an angle adjustment assembly located on at least one side of the nozzle, extending along a first direction intersecting the mounting surface to limit the vapor deposition angle of the nozzle, the angle adjustment assembly being mounted on a bracket, the angle adjustment assembly including a plurality of angle adjustment members arranged in the first direction, the plurality of angle adjustment members being movably connected to allow the angle adjustment assembly to be retractable in the first direction, thereby adjusting the vapor deposition angle of the nozzle; and a first driving member connected to the bracket for driving the bracket to move closer to or away from the evaporation source to adjust the distance between the bracket and the evaporation source;

[0017] The method includes:

[0018] The first driving component is controlled to drive the bracket to move relative to the evaporation source, so as to adjust the target distance between the bracket and the evaporation source;

[0019] Control one or more angle adjustment elements in the angle adjustment assembly to extend or retract in the first direction to adjust the target length of the angle adjustment assembly in the first direction.

[0020] The vapor deposition apparatus further includes a second driving component, and the method further includes:

[0021] The second driving element is controlled to drive the evaporation source to rotate, thereby adjusting the spray direction of the nozzle.

[0022] Beneficial effects: This application achieves the purpose of adjusting the nozzle evaporation angle by extending and retracting multiple movable angle adjustment components in the first direction, and by driving the first drive component to adjust the distance between the bracket and the evaporation source. This improves the adjustable range of the evaporation angle, enabling the evaporation device to be adaptively adjusted according to the evaporation characteristics of each evaporation material and the evaporation requirements of the substrate, thereby improving the versatility of the evaporation device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0024] Figure 1 This is a schematic diagram of an existing vapor deposition apparatus;

[0025] Figure 2 This is a simplified structural diagram of a substrate provided in an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the vapor deposition apparatus provided in one embodiment of this application;

[0027] Figure 4 This is a schematic diagram of the vapor deposition apparatus provided in another embodiment of this application;

[0028] Figure 5 This is a schematic diagram of the vapor deposition apparatus provided in another embodiment of this application;

[0029] Figure 6 This is a schematic diagram of the connection structure between the third angle adjusting member and the fourth angle adjusting member provided in an embodiment of this application;

[0030] Figure 7This is a schematic diagram of the connection structure between the third angle adjusting member and the fourth angle adjusting member provided in another embodiment of this application;

[0031] Figure 8 This is a flowchart of an embodiment of the adjustment method provided in this application. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0033] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] In Visionox's intelligent pixelation (ViP) technology, the existing AMOLED technology and processes can be used in the TFT control backplane. After the anode preparation is completed, differentiation is gradually achieved starting from the pixel definition layer (PDL) to form the isolation structure unique to ViP AMOLED. Then, the pixel preparation is carried out in the whole-surface evaporation and photolithography patterning steps to obtain the display body.

[0036] Please refer to Figure 1 In VIP technology, existing ViP products use different vapor deposition materials for each color. However, because the length and angle of the nozzle 102 and angle adjustment component 103 connected to the evaporation source 101 in the vapor deposition device 1 are fixed in the vapor deposition direction, only a fixed and single vapor deposition angle can be achieved. This results in a limited vapor deposition range of the vapor deposition material on the substrate 10 and makes it difficult to precisely control the vapor deposition range of the vapor deposition material. This also leads to a series of problems such as high cathode overlap impedance and leakage current between pixels.

[0037] Therefore, this application provides a novel vapor deposition apparatus that not only retains the process capabilities of traditional line sources but also allows for adjustment of the nozzle deposition angle and improves the adjustable range of the deposition angle. This vapor deposition apparatus can be integrated with ViP technology to achieve better performance in the final display panel.

[0038] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] In this embodiment, a vapor deposition apparatus 100 is provided, which is configured to deposit a vapor deposition film of a predetermined pattern onto a substrate 10.

[0040] In some embodiments, please refer to Figure 2 , Figure 2 This is a simplified structural diagram of a substrate provided in an embodiment of the present application, wherein the substrate 10 includes a substrate 11, a pixel definition layer 12, a first electrode 13, and an isolation structure 14.

[0041] The substrate 11 may include a substrate and a driving circuit layer. The substrate plays a supporting role in the display panel and can be a flexible substrate or a rigid substrate. When the substrate is flexible, its material can be polyimide (PI), or it can be a multilayer structure with alternating organic and inorganic layers. For example, the substrate includes sequentially stacked inorganic, organic, and inorganic layers. In this case, the multilayer structure with alternating organic and inorganic layers can balance the flexibility and strength of the substrate, enabling the display panel to be bent and resist breakage and deformation. When the substrate is rigid, its material can be glass or metal. This application does not limit the structure of the substrate.

[0042] The driving circuit layer includes a pixel driving circuit, which includes a transistor and a storage capacitor. The transistor includes a semiconductor portion, a gate, a source, and a drain. The capacitor includes a first electrode and a second electrode. The gate and the first electrode may be located in a first conductive layer (e.g., a metal layer), the second electrode may be located in a second conductive layer (e.g., a metal layer), and the source and drain may be located in a third conductive layer (e.g., a metal layer). Interlayer insulating layers are disposed between the first and second conductive layers, and between the second and third conductive layers. The driving circuit layer may also include a fourth conductive layer (e.g., a metal layer), located on the side of the third conductive layer facing away from the substrate, and a signal line is disposed on the fourth conductive layer. A first planarization layer (PLN1) is disposed between the fourth and third conductive layers, and a second planarization layer (PLN2) may be disposed on the surface of the fourth conductive layer facing away from the substrate. The pixel definition layer 12 and the first electrode 13 are specifically disposed on the surface of the second planarization layer (PLN2).

[0043] The pixel driving circuit can be, for example, a 2T1C circuit, a 7T1C circuit, a 7T2C circuit, or a 9T1C circuit, and this application does not limit its specific structure. The "2T1C circuit" refers to a pixel circuit that includes two thin-film transistors (T) and one capacitor (C), and so on for "7T1C circuit", "7T2C circuit", "9T1C circuit", etc.

[0044] The third and fourth conductive layers may include signal lines for transmitting signals to the pixel driving circuit; for example, they may transmit signals such as a first voltage signal (ELVSS), a second voltage signal (ELVDD), or a data signal (DATA). In this embodiment, the third and fourth conductive layers may include signal lines for transmitting the first voltage signal ELVSS.

[0045] In one embodiment, a buffer layer may also be provided between the substrate and the driving circuit layer.

[0046] The pixel definition layer 12 can be formed of organic materials such as polyimide (PI), polyamide, benzocyclobutene (BCB), acrylic resin or phenolic resin, or inorganic materials such as SiNx.

[0047] The pixel definition layer 12 is disposed on the substrate 11. For example, the pixel definition layer 12 is disposed on the surface of the second planarization layer (PLN2) of the substrate 11 and is located on the side of the driving circuit layer away from the substrate. The pixel definition layer 12 includes a pixel definition portion, which surrounds and forms a pixel opening.

[0048] A first electrode 13 is disposed on a substrate 11, and at least a portion of the first electrode 13 is exposed through a pixel opening (not shown). The first electrode 13 may be an anode. The material of the first electrode 13 typically includes indium tin oxide and / or aluminum.

[0049] The isolation structure 14 includes a first isolation portion 141 and a second isolation portion 142. The second isolation portion 142 is disposed on the surface of the first isolation portion 141 facing away from the substrate 11; and the orthographic projection of the side of the first isolation portion 141 away from the substrate 11 onto the substrate 11 lies within the orthographic projection of the second isolation portion 142 onto the substrate 11, that is, the isolation structure 14 has a shape that is wider at the top and narrower at the bottom. The vertical cross-section of the first isolation portion 141 can be trapezoidal to increase support strength; the second isolation portion 142 can be referred to as the crown. The orthographic projection area of ​​the side of the first isolation portion 141 away from the substrate 11 onto the substrate 11 is smaller than the orthographic projection area of ​​the second isolation portion 142 onto the substrate 11. The cross-section of the isolation structure 14 perpendicular to the substrate 11 can be T-shaped.

[0050] The second isolation section 142 includes a conductive material, which may include a metal, such as titanium.

[0051] In one embodiment, the first isolation portion 141 may be made of aluminum; the second isolation portion 142 may be made of titanium (Ti).

[0052] In one embodiment, the substrate 10 further includes an organic layer 15 formed on the first electrode 13 and a second electrode 16 formed on the organic layer 15. The organic layer 15 may include functional layers such as an organic light-emitting layer, a hole injection layer (HIL), an electron transport layer (ETI), an electron emission layer (EML), and a hole transport layer (HTL). The second electrode 16 may be a cathode. The material of the second electrode 16 typically includes aluminum.

[0053] The vapor-deposited film may include one or more of the following: hole injection layer (HIL), hole transport layer (HTL), and charge generation layer (CGL).

[0054] Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A specifically record the isolation structure 14 for reference. The specific structure and function of the vapor deposition apparatus are described below.

[0055] Please see Figure 3In one embodiment of this application, a vapor deposition apparatus 100 is provided. The vapor deposition apparatus 100 includes an evaporation source 20, a nozzle 30, an angle adjustment component 40, and a first driving component 60. The evaporation source 20 is the core part of the vapor deposition apparatus 100, mainly used to contain the vapor deposition material (such as metal, compound, etc.). The nozzle 30 is disposed on the evaporation source 20 and is used to guide the vapor formed after heating the vapor deposition material from the evaporation source 20 to the surface of the substrate 10, and deposit a thin film on the surface of the substrate 10. The angle adjustment component 40 is used to adjust the vapor deposition angle of the nozzle 30, and the first driving component 60 is used to drive the angle adjustment component 40 closer to or further away from the evaporation source 20.

[0056] Specifically, the evaporation source 20 is provided with a receiving cavity 21 for containing the vapor deposition material and an evaporation outlet 22 connected to the receiving cavity 21. The vapor deposition material is heated in the receiving cavity 21 to evaporate or sublimate to form steam. The evaporation outlet 22 on the evaporation source 20 facilitates the escape of the vapor deposition material steam in the receiving cavity 21.

[0057] The nozzle 30 is disposed on the mounting surface 23 of the evaporation source 20, and the nozzle 30 is provided with a spray hole 31 that connects to the evaporation outlet 22. After being heated, the vapor deposition material is sprayed out from the evaporation source 20 through the spray hole 31. It can be understood that multiple nozzles 30 can be disposed at intervals on the mounting surface 23 of the evaporation source 20, and the size and shape of the nozzles 30 can be adjusted according to the characteristics of the vapor deposition material to optimize the vapor deposition effect.

[0058] An angle adjustment assembly 40 is located on at least one side of the nozzle 30 and extends along a first direction (not shown) intersecting the mounting surface 23 to limit the evaporation angle of the nozzle 30, thereby controlling the deposition method of the vapor-deposited material on the substrate 10. The angle adjustment assembly 40 is mounted on a bracket 50 and includes a plurality of angle adjustment members 41 arranged in the first direction. The plurality of angle adjustment members 41 are movably connected to allow the angle adjustment assembly 40 to extend and retract in the first direction, thereby adjusting the evaporation angle of the nozzle 30 to increase the adjustable range of the evaporation angle. This allows the vapor deposition apparatus 100 to be adaptively adjusted according to the evaporation characteristics of each vapor-deposited material and the evaporation requirements of the substrate 10, improving the versatility of the vapor deposition apparatus 100.

[0059] The first driving component 60 is connected to the bracket 50 and is used to drive the bracket 50 to move closer to or further away from the evaporation source 20, so as to adjust the distance between the bracket 50 and the evaporation source 20, thereby further achieving the purpose of adjusting the evaporation angle of the nozzle 30, and thus improving the adjustable range of the evaporation angle.

[0060] It is understood that when the vapor deposition apparatus 100 includes multiple nozzles 30, the angle adjustment component 40 corresponding to each nozzle 30 can be mounted on the same support 50, so that the first drive member 60 controls all angle adjustment components 40 to synchronously move closer to or away from the evaporation source 20. Alternatively, the angle adjustment component 40 corresponding to each nozzle 30 can be mounted on an independent support 50, and each support 50 can be equipped with a first drive member 60, that is, the first drive member 60 drives one angle adjustment component 40 to move closer to or away from the evaporation source 20 individually.

[0061] In the above-mentioned vapor deposition apparatus 100, the extension and retraction of multiple movable angle adjustment components 41 in the first direction, and the adjustment of the distance between the support 50 and the evaporation source 20 by the first driving component 60, can achieve the purpose of adjusting the vapor deposition angle of the nozzle 30, thereby improving the adjustable range of the vapor deposition angle. This allows the vapor deposition apparatus 100 to be adaptively adjusted according to the evaporation characteristics of each vapor deposition material and the vapor deposition requirements of the substrate 10, thereby improving the versatility of the vapor deposition apparatus 100.

[0062] Please continue reading. Figure 3 In one embodiment, the vapor deposition apparatus 100 further includes a second drive member 70 for driving the evaporation source 20 to rotate, thereby adjusting the spray direction of the nozzle 30 and adjusting the deposition position and angle of the vapor deposition material on the substrate 10. This allows the vapor deposition apparatus 100 to adapt to substrates 10 of different shapes and sizes, especially to achieve uniform coating on complex curved or non-planar substrates 10. For example, for substrates 10 with complex curved surfaces or asymmetrical structures, the rotation function of the second drive member 70 can ensure that the vapor deposition material uniformly covers the entire surface. As another example, in processes requiring multi-layer coating, the second drive member 70 can adjust the spray direction of each layer to achieve layered deposition of different vapor deposition materials. Furthermore, by precisely controlling the spray direction, localized coating can be performed in specific areas of the substrate 10, meeting the customized needs of the vapor deposition process.

[0063] It is understandable that the specific nozzle 30 size can be optimized based on the substrate 10 design and the structural dimensions of the vapor deposition equipment, and no special limitations are imposed here.

[0064] In one embodiment, the second drive element 70 may be an electric motor (such as a stepper motor or servo motor) or a pneumatic device to achieve rotational control of the evaporation source 20. It is understood that the rotation angle range of the evaporation source 20 is 0-180° to meet different process requirements during the vapor deposition process.

[0065] In practical applications, the second driving component 70 works in conjunction with the angle adjustment component 40 to enable adjustment of the nozzle 30 in multiple dimensions. The angle adjustment component 40 controls the evaporation angle, while the second driving component 70 controls the spray direction. The combination of the two can achieve more complex evaporation modes, precisely control the evaporation range of the evaporation material, and improve problems such as cathode overlap impedance and inter-pixel leakage during the evaporation process, thereby improving the evaporation quality.

[0066] Please refer to the following: Figure 3 and Figure 4 In one embodiment, the angle adjustment member 41 is a sleeve structure and is sleeved around the nozzle 30. The sleeve structure of the angle adjustment member 41 covers the entire periphery of the nozzle 30, which can more accurately control and adjust the vapor deposition angle of the nozzle 30, reduce the deviation of adjusting the vapor deposition angle of the nozzle 30, and thus improve the uniformity and consistency of the vapor deposition material ejected from the nozzle 30.

[0067] In one embodiment, the cross-sectional shape of the sleeve-structured angle adjustment member 41 includes a rectangular, trapezoidal, or other irregular shape.

[0068] Please continue reading. Figure 3 and Figure 4 In one embodiment, the angle adjustment component 41 has a plate-like structure, and there are two angle adjustment components 40. The two angle adjustment components 40 are arranged on opposite sides of the nozzle 30. The two angle adjustment components 40 can work together to achieve precise control of the vapor deposition angle of the nozzle 30 by synchronously or independently adjusting the extension and retraction of each angle adjustment component 40.

[0069] In one embodiment, an angle adjustment member 41 with a plate-like structure may be provided only on one side of the nozzle 30 to accommodate the special vapor deposition angle requirements of the nozzle 30.

[0070] It is understood that in the multiple angle adjustment components 40 corresponding to the multiple nozzles 30, the angle adjustment elements 41 in all angle adjustment components 40 can be sleeve structures or plate structures, or the angle adjustment elements 41 in some angle adjustment components 40 can be sleeve structures and the angle adjustment elements 41 in other angle adjustment components 40 can be plate structures, without any restrictions.

[0071] Please refer to the following: Figure 3 and Figure 5In one embodiment, the plurality of angle adjustment members 41 includes a first angle adjustment member 42. Among the plurality of angle adjustment members 41, the first angle adjustment member 42 is closest to the bracket 50. The first angle adjustment member 42 is movably connected to the bracket 50 so that the extension direction of the angle adjustment assembly 40 is adjustable. That is, the first angle adjustment member 42 serves as the "starting point" of the angle adjustment assembly 40, and through its movable connection, the extension direction of the entire angle adjustment assembly 40 is adjusted, thereby indirectly adjusting the vapor deposition angle of the nozzle 30.

[0072] In one embodiment, the movable connection between the first angle adjustment member 42 and the bracket 50 includes, but is not limited to, a hinged connection, a ball joint connection, or a shaft connection.

[0073] It is understandable that when the first angle adjusting member 42 and the bracket 50 are connected by a hinge or shaft, a damping (not shown) can be provided between the first angle adjusting member 42 and the bracket 50. The damping is used to generate a damping force to maintain the required rotation angle after the first angle adjusting member 42 rotates relative to the bracket 50 to a predetermined angle.

[0074] In one embodiment, the movable connection of the first angle adjustment member 42 can be achieved by manual adjustment or electric drive (such as a small motor or hydraulic assembly) to meet the needs of different scenarios.

[0075] In one embodiment, an angle sensor (not shown) can be installed on the first angle adjustment member 42 to monitor and provide feedback on the adjustment angle of the first angle adjustment member 42 in real time, thereby improving the accuracy of the adjustment angle and ensuring that the vapor deposition angle of the nozzle 30 after adjustment can meet the requirements of the vapor deposition process.

[0076] Please continue reading. Figure 3 and Figure 5 In one embodiment, the plurality of angle adjustment members 41 includes a second angle adjustment member 43. Among the plurality of angle adjustment members 41, the second angle adjustment member 43 is the furthest from the support 50, that is, the second angle adjustment member 43 is the one furthest from the support 50 among the plurality of angle adjustment members 41. It is usually located at the end of the angle adjustment assembly 40 and is used to further refine the vapor deposition angle adjustment of the nozzle 30. The second angle adjustment member 43 is internally equipped with a heating element (not shown), which can locally heat the vapor deposition material close to the second angle adjustment member 43, reducing the risk that the vapor deposition material will solidify on the second angle adjustment member 43 due to temperature drop during the spraying process, thereby ensuring the continuity and stability of the vapor deposition process.

[0077] For example, for high-melting-point vapor deposition materials, the heating function of the second angle adjustment element 43 ensures that the vapor deposition material remains liquid during spraying, preventing clogging of the nozzle 30. As another example, when vapor deposition on a substrate 10 with a complex shape, the heating function of the second angle adjustment element 43 optimizes the flowability and deposition effect of the vapor deposition material, improving the uniformity of the coating on the substrate 10. Furthermore, in processes requiring multi-layer coatings, the heating function of the second angle adjustment element 43 ensures temperature consistency for each layer, thereby improving the adhesion between layers.

[0078] In one embodiment, the heating element includes a resistance wire to provide uniform temperature control for the second angle adjustment element 43. In other embodiments, the heating element may also include a ceramic heater or infrared heating, without limitation.

[0079] In one embodiment, a temperature sensor (not shown) can be installed within the second angle adjustment member 43, and the heating element can be integrated with the temperature sensor and an external control system to adjust the temperature according to the different characteristics of the vapor deposition material, adapting to the vapor deposition requirements of various vapor deposition materials. Simultaneously, precise temperature adjustment can ensure that the vapor deposition material maintains an appropriate temperature during spraying, reducing the risk of solidification or uneven deposition of the vapor deposition material due to temperature drops.

[0080] In one embodiment, each angle adjustment element 41 is embedded with a heating element to uniformly heat the vapor deposition material sprayed from the nozzle 30, thereby compensating for the insufficient heating capacity of the evaporation source 20, especially in the vapor deposition process over long distances or through complex paths, ensuring the stability of the vapor deposition process.

[0081] In one embodiment, the second angle adjustment member 43 works in conjunction with other angle adjustment members 41 (such as the first angle adjustment member 42 described above). Through the extension and retraction between the first angle adjustment member 42 and the second angle adjustment member 43, the relative movement between the entire angle adjustment assembly 40 and the evaporation source 20, and the rotation of the entire angle adjustment assembly 40, the precise control of the evaporation angle of the nozzle 30 can be achieved.

[0082] Please refer to the following: Figure 3 , Figure 5 and Figure 6In one embodiment, the plurality of angle adjusting members 41 include a third angle adjusting member 44 and a fourth angle adjusting member 45 arranged adjacent to each other. The third angle adjusting member 44 has a first fixing part 441 extending along a first direction, and the fourth angle adjusting member 45 has a second fixing part 451. The second fixing part 451 is adjustablely fixed to a selected position of the first fixing part 441. The third angle adjusting member 44 and the fourth angle adjusting member 45 are movably connected by an adjustable fixing method, so that the fourth angle adjusting member 45 can be fixed at different positions on the first fixing part 441, thereby flexibly adjusting the extension length of the angle adjusting assembly 40 to adapt to the needs of different vapor deposition processes and improve the flexibility of the vapor deposition apparatus 100.

[0083] In one embodiment, the first fixing part 441 is a groove, and the second fixing part 451 is a slider. The second fixing part 451 adjusts its position by sliding and locking, thereby adjusting the position of the fourth angle adjusting member 45.

[0084] In other embodiments, the first fixing part 441 may also be a guide rod, and the second fixing part 451 may be a slider, which slides on the guide rod to adjust the position of the fourth angle adjusting member 45.

[0085] In one embodiment, when the second fixing part 451 moves to the preset position of the first fixing part 441 and is ready to be fixed, the second fixing part 451 and the first fixing part 441 can be fixed in an adjustable manner by means of bolts, buckles or magnetic connection, etc. The specific setting is set according to the requirements and is not limited here.

[0086] In one embodiment, the angle adjustment assembly 40 further includes a third driving member (not shown) for driving the second fixing part 451 to move relative to the first fixing part 441 to adjust the position of the fourth angle adjustment member 45 relative to the third angle adjustment member 44, thereby achieving automated adjustment.

[0087] In one embodiment, the driving method of the third driving member includes electric drive, pneumatic drive or hydraulic drive.

[0088] In one embodiment, a position sensor (not shown) can be installed on the first fixing part 441 to monitor the position of the fourth angle adjustment member 45 in real time, so as to ensure the accuracy of adjustment.

[0089] Please refer to the following: Figure 3 , Figure 5 and Figure 7In one embodiment, the plurality of angle adjustment members 41 include a third angle adjustment member 44 and a fourth angle adjustment member 45 arranged adjacent to each other to further refine the vapor deposition angle adjustment of the nozzle 30. The third angle adjustment member 44 is provided with a plurality of first fixing portions 441 arranged at intervals along a first direction, and the fourth angle adjustment member 45 is provided with a second fixing portion 451. The second fixing portion 451 is selectively fixed to a first fixing portion 441, thereby flexibly adjusting the extension length of the angle adjustment assembly 40 to adapt to the needs of different vapor deposition processes and improve the flexibility of the vapor deposition apparatus 100.

[0090] In one embodiment, the first fixing part 441 is a threaded hole, and the second fixing part 451 is a stud and a nut. The stud is selected from any threaded hole and fixed with the nut to realize the position adjustment of the fourth angle adjusting member 45.

[0091] In other embodiments, the first fixing part 441 may be a slot and the second fixing part 451 may be a block; or the first fixing part 441 may be a magnetic connection point and the second fixing part 451 may be a magnetic connector.

[0092] Please refer to the following: Figure 3 and Figure 8 This application also provides an adjustment method applied to a vapor deposition apparatus 100. The vapor deposition apparatus 100 includes an evaporation source 20, a nozzle 30, an angle adjustment component 40, and a first driving component 60. The evaporation source 20 is the core part of the vapor deposition apparatus 100, mainly used to contain vapor deposition materials (such as metals, compounds, etc.). The nozzle 30 is disposed on the evaporation source 20 and is used to guide the vapor formed after heating the vapor deposition material from the evaporation source 20 to the surface of the substrate 10, and deposit a thin film on the surface of the substrate 10. The angle adjustment component 40 is used to adjust the vapor deposition angle of the nozzle 30, and the first driving component 60 is used to drive the angle adjustment component 40 closer to or further away from the evaporation source 20.

[0093] Specifically, the evaporation source 20 is provided with a receiving cavity 21 for containing the vapor deposition material and an evaporation outlet 22 connected to the receiving cavity 21. The vapor deposition material is heated in the receiving cavity 21 to evaporate or sublimate to form steam. The evaporation outlet 22 on the evaporation source 20 facilitates the escape of the vapor deposition material steam in the receiving cavity 21.

[0094] The nozzle 30 is disposed on the mounting surface 23 of the evaporation source 20, and the nozzle 30 is provided with a spray hole 31 that connects to the evaporation outlet 22. After being heated, the vapor deposition material is sprayed out from the evaporation source 20 through the spray hole 31. It can be understood that multiple nozzles 30 can be disposed at intervals on the mounting surface 23 of the evaporation source 20, and the size and shape of the nozzles 30 can be adjusted according to the characteristics of the vapor deposition material to optimize the vapor deposition effect.

[0095] An angle adjustment assembly 40 is located on at least one side of the nozzle 30 and extends along a first direction intersecting the mounting surface 23 to limit the evaporation angle of the nozzle 30, thereby controlling the deposition method of the vapor-deposited material on the substrate 10. The angle adjustment assembly 40 is mounted on a bracket 50 and includes a plurality of angle adjustment members 41 arranged in the first direction. The plurality of angle adjustment members 41 are movably connected to allow the angle adjustment assembly 40 to extend and retract in the first direction, thereby adjusting the evaporation angle of the nozzle 30 to increase the adjustable range of the evaporation angle. This allows the vapor deposition apparatus 100 to be adaptively adjusted according to the evaporation characteristics of each vapor-deposited material and the evaporation requirements of the substrate 10, improving the versatility of the vapor deposition apparatus 100.

[0096] The first driving component 60 is connected to the bracket 50 and is used to drive the bracket 50 to move closer to or further away from the evaporation source 20, so as to adjust the distance between the bracket 50 and the evaporation source 20, thereby further achieving the purpose of adjusting the evaporation angle of the nozzle 30, and thus improving the adjustable range of the evaporation angle.

[0097] Adjustment methods include:

[0098] S200: Control the first driving element 60 to drive the bracket 50 to move relative to the evaporation source 20, so as to adjust the target distance between the bracket 50 and the evaporation source 20.

[0099] Specifically, based on the characteristics of the vapor deposition material and the requirements of the substrate 10, the target distance between the support 50 and the evaporation source 20 is determined, and the first driving component 60 is controlled to drive the support 50 to move until the target distance is reached.

[0100] Understandably, the distance between the bracket 50 and the evaporation source 20 can be monitored in real time by setting a distance sensor to ensure the accuracy of the distance adjustment process.

[0101] S210: Control one or more angle adjustment members 41 in the angle adjustment assembly 40 to extend or retract in a first direction to adjust the target length of the angle adjustment assembly 40 in the first direction.

[0102] Specifically, based on the required evaporation angle, the target length of the angle adjustment component 40 is determined, and the extension and retraction of the angle adjustment component 41 are controlled until the angle adjustment component 40 reaches the target length.

[0103] In the above adjustment method, the extension and retraction of multiple movable angle adjustment components 41 in the first direction, and the adjustment of the distance between the support 50 and the evaporation source 20 by the first driving component 60, can achieve the purpose of adjusting the vapor deposition angle of the nozzle 30, thereby improving the adjustable range of the vapor deposition angle. This allows the vapor deposition device 100 to be adaptively adjusted according to the evaporation characteristics of each vapor deposition material and the vapor deposition requirements of the substrate 10, thereby improving the versatility of the vapor deposition device 100.

[0104] In one embodiment, the vapor deposition apparatus 100 further includes a second drive member 70, and the method further includes:

[0105] S220: Control the second drive unit 70 to drive the evaporation source 20 to rotate, so as to adjust the spray direction of the nozzle 30.

[0106] Specifically, the second drive unit 70 can drive the evaporation source 20 to adjust the spray direction of the nozzle 30, thereby adjusting the deposition position and angle of the vapor deposition material on the substrate 10. This allows the vapor deposition apparatus 100 to adapt to substrates 10 of different shapes and sizes, especially achieving uniform coating on complex curved or non-planar substrates 10. For example, for substrates 10 with complex curved surfaces or asymmetrical structures, the rotation function of the second drive unit 70 ensures that the vapor deposition material uniformly covers the entire surface. As another example, in processes requiring multi-layer coating, the second drive unit 70 can adjust the spray direction of each layer to achieve layered deposition of different vapor deposition materials. Furthermore, by precisely controlling the spray direction, localized coating can be performed in specific areas of the substrate 10, meeting the customized needs of the vapor deposition process.

[0107] The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A vapor deposition apparatus, characterized in that, The vapor deposition apparatus includes: An evaporation source, wherein the evaporation source is provided with a receiving cavity for accommodating vapor deposition material and an evaporation outlet communicating with the receiving cavity; A nozzle is disposed on the mounting surface of the evaporation source, and the nozzle is provided with a spray hole that communicates with the evaporation outlet. The vapor-deposited material is sprayed out from the evaporation source through the spray hole after being heated. An angle adjustment assembly is located on at least one side of the nozzle and extends along a first direction intersecting the mounting surface to limit the vapor deposition angle of the nozzle. The angle adjustment assembly is mounted on a bracket and includes a plurality of angle adjustment members arranged in the first direction. The plurality of angle adjustment members are movably connected to allow the angle adjustment assembly to extend and retract in the first direction, thereby adjusting the vapor deposition angle of the nozzle. A first driving component, connected to the bracket, is used to drive the bracket to move closer to or further away from the evaporation source, so as to adjust the distance between the bracket and the evaporation source.

2. The vapor deposition apparatus according to claim 1, characterized in that, The vapor deposition apparatus also includes: The second driving component is used to drive the evaporation source to rotate, so as to adjust the spray direction of the nozzle.

3. The vapor deposition apparatus according to claim 1, characterized in that, The plurality of angle adjustment components includes a first angle adjustment component, wherein the first angle adjustment component is closest to the bracket and is movably connected to the bracket so that the extension direction of the angle adjustment component is adjustable.

4. The vapor deposition apparatus according to claim 1, characterized in that, The plurality of angle adjustment members include a second angle adjustment member, wherein the second angle adjustment member is furthest from the bracket, and a heating element is embedded inside the second angle adjustment member; Preferably, the heating element comprises a resistance wire; Preferably, the heating element is embedded inside each of the angle adjustment components.

5. The vapor deposition apparatus according to claim 1, characterized in that, The angle adjusting component has a sleeve structure and is sleeved around the nozzle. Alternatively, the angle adjusting member has a plate-like structure, and there are two angle adjusting components, which are arranged on opposite sides of the nozzle.

6. The vapor deposition apparatus according to claim 1, characterized in that, The plurality of angle adjusting members include a third angle adjusting member and a fourth angle adjusting member arranged adjacent to each other. The third angle adjusting member is provided with a first fixing part extending along the first direction, and the fourth angle adjusting member is provided with a second fixing part. The second fixing part is adjustablely fixed to a selected position of the first fixing part. Preferably, the first fixing part is a groove, and the second fixing part is a slider.

7. The vapor deposition apparatus according to claim 6, characterized in that, The angle adjustment component also includes: The third driving member is used to drive the second fixing part to move relative to the first fixing part.

8. The vapor deposition apparatus according to claim 1, characterized in that, The plurality of angle adjusting members include a third angle adjusting member and a fourth angle adjusting member arranged adjacent to each other. The third angle adjusting member is provided with a plurality of first fixing parts arranged at intervals along the first direction. The fourth angle adjusting member is provided with a second fixing part, and the second fixing part is selectively fixed to one of the first fixing parts. Preferably, the first fixing part is a threaded hole, and the second fixing part is a stud and a nut.

9. A method for adjusting an evaporation deposition apparatus, characterized in that, The vapor deposition apparatus includes: an evaporation source having a receiving cavity for accommodating vapor deposition material and an evaporation outlet communicating with the receiving cavity; a nozzle disposed on a mounting surface of the evaporation source and having a spray hole communicating with the evaporation outlet, wherein the vapor deposition material is sprayed out from the evaporation source through the spray hole after being heated; an angle adjustment assembly located on at least one side of the nozzle and extending along a first direction intersecting the mounting surface to limit the vapor deposition angle of the nozzle, the angle adjustment assembly being mounted on a bracket and including a plurality of angle adjustment members arranged in the first direction, the plurality of angle adjustment members being movably connected to allow the angle adjustment assembly to extend and retract in the first direction, thereby adjusting the vapor deposition angle of the nozzle; and a first driving member connected to the bracket for driving the bracket to move closer to or away from the evaporation source to adjust the distance between the bracket and the evaporation source. The method includes: The first driving component is controlled to drive the bracket to move relative to the evaporation source, so as to adjust the target distance between the bracket and the evaporation source; Control one or more angle adjustment elements in the angle adjustment assembly to extend or retract in the first direction to adjust the target length of the angle adjustment assembly in the first direction.

10. The method according to claim 9, characterized in that, The vapor deposition apparatus further includes a second driving component, and the method further includes: The second driving element is controlled to drive the evaporation source to rotate, thereby adjusting the spray direction of the nozzle.

Images