Evaporation source and evaporation machine

Abstract

The application provides an evaporation source and an evaporation machine. The evaporation source comprises a box, a crucible, a shielding piece, a thermal sensor and a control driving part. The box comprises a side surface and opposite front and back surfaces. An avoiding opening is arranged on the front surface of the box, and a heat dissipation opening is arranged on the side surface and / or the back surface of the box. The crucible is accommodated in the box and an evaporation nozzle extends out of the avoiding opening. The crucible is used for accommodating and heating a material to be evaporated. The shielding piece is adjustably installed on the box. By adjusting the position of the shielding piece relative to the heat dissipation opening, the area of the heat dissipation opening shielded by the shielding piece can be adjusted. The thermal sensor is located between the inner surface of the box and the crucible. The control driving part drives the shielding piece to move according to the set target temperature and the temperature fed back by the thermal sensor, so as to adjust the position of the shielding piece relative to the heat dissipation opening. In this way, the temperature control adjustment capability of the evaporation source is better, and the temperature control requirement can be changed complexly and variably, which is beneficial to the film forming quality of the evaporated film layer.

Description

Technical Field

[0001] This application relates to the field of vapor deposition equipment technology, and more particularly to an evaporation source and a vapor deposition machine. Background Technology

[0002] A vapor deposition machine is a device that utilizes physical vapor deposition (PVD) technology. It heats the material to be vaporized through an internal evaporation source, causing it to evaporate and deposit onto the surface of a substrate material to form a thin film. The evaporation source mainly consists of a crucible, a heating structure, and a heat-insulating chamber. The crucible holds the material to be vaporized, and the heating structure heats the crucible, causing the material to evaporate. Evaporation nozzles are located above the crucible; after evaporation at high temperature, the material is ejected through the nozzles onto the substrate surface. The crucible is housed within the heat-insulating chamber, which provides insulation and heat preservation. The top cover of the heat-insulating chamber has clearance holes to allow the evaporation nozzles to extend outside the chamber.

[0003] The heating temperature of the crucible directly affects the evaporation rate of the material to be evaporated, which in turn affects the film quality and thickness of the vapor-deposited film on the substrate. Therefore, in the prior art, the evaporation source usually uses a circulating cooling liquid in an insulated chamber to regulate the crucible temperature, in order to ensure that the vapor-deposited film has good film quality and uniform thickness.

[0004] However, the cooling characteristics of circulating coolant limit its ability to adjust the crucible temperature, making it difficult to meet complex and variable temperature control requirements. Furthermore, the relatively complex structure of the circulating coolant system increases the difficulty of equipment maintenance. Summary of the Invention

[0005] To address the aforementioned problems, embodiments of this application provide an evaporation source and an evaporation deposition machine, which at least partially solve the problems described above.

[0006] In a first aspect, this application provides an evaporation source, the evaporation source comprising:

[0007] The enclosure includes a front and a back facing each other, and a side located between the front and the back. A clearance opening is provided on the front of the enclosure, and a heat dissipation opening is provided on the side and / or the back of the enclosure.

[0008] A crucible is housed in the box, the top of the crucible is connected to the front of the box, the top of the crucible is provided with an evaporation nozzle, the evaporation nozzle extends out of the box through the clearance opening, and the crucible is used to hold and heat the material to be steamed;

[0009] A shielding component is installed on the housing in an adjustable position and corresponds to the heat dissipation opening. By adjusting the position of the shielding component relative to the heat dissipation opening, the area of ​​the heat dissipation opening blocked by the shielding component can be adjusted.

[0010] A thermal sensor is provided, wherein there is a receiving gap between the inner surface of the housing and the crucible, and the thermal sensor is located in the receiving gap;

[0011] The control drive unit is electrically connected to the thermal sensor and is drive-connected to the shielding member. The control drive unit drives the shielding member to move according to the set target temperature and the temperature fed back by the thermal sensor, so as to adjust the position of the shielding member relative to the heat dissipation opening.

[0012] In one optional embodiment, the accommodating gap includes multiple temperature measuring areas, each of the temperature measuring areas is provided with at least one of the thermal sensors and corresponds to at least one of the heat dissipation openings, the number of heat dissipation openings and the number of the shielding members are the same and correspond one-to-one; the control drive unit adjusts the area of ​​the heat dissipation openings blocked by the shielding members according to the temperature feedback from the thermal sensors of different temperature measuring areas.

[0013] In one optional embodiment, the housing is a cuboid, the number of clearance openings is multiple and they are spaced apart along the length of the cuboid, the heat dissipation opening is provided on the back of the cuboid, and the heat dissipation opening is provided on both sides of the cuboid.

[0014] In one optional embodiment, the control drive unit includes a controller, a driver, and a transmission component. The controller is electrically connected to the thermal sensor and the driver. The driver is drively connected to the blocking component through the transmission component. The controller drives the blocking component to move through the driver and the transmission component.

[0015] In one alternative embodiment, the transmission component includes a rotating shaft, the shielding component includes a heat sink with heat dissipation holes, the heat sink is connected to the rotating shaft, and the driver drives the heat sink to rotate by driving the rotating shaft to rotate.

[0016] In one alternative embodiment, the size of the heat sink is smaller than the size of the heat dissipation opening, the middle part of the heat sink is connected to the rotating shaft, and as the heat sink rotates with the rotating shaft, one end of the heat sink can extend into the heat dissipation opening.

[0017] In one alternative embodiment, the rotating shaft is located inside the housing, and the thermal sensor is mounted on the rotating shaft.

[0018] In one alternative embodiment, the control drive unit further includes a track, and the driver drives the shield to slide along the track via the transmission member to adjust the position of the shield relative to the heat dissipation opening.

[0019] In one optional embodiment, the shielding member includes a first plate and a second plate, the first plate and the second plate having the same size, and both being greater than or equal to the inner diameter of the heat dissipation opening; the track includes a first slide rail and a second slide rail that are parallel to each other, the first plate being slidably connected to the first slide rail, the second plate being slidably connected to the second slide rail, and the first plate and the second plate corresponding to different drivers; the first plate has a plurality of first heat dissipation holes, and the second plate has a plurality of second heat dissipation holes, the inner diameters of the first heat dissipation holes and the inner diameters of the second heat dissipation holes being different; or, the first plate has a plurality of first heat dissipation holes, and the surface of the second plate facing and / or away from the heat dissipation opening is a seamless integrated finish.

[0020] Secondly, this application provides a vapor deposition machine, which includes the aforementioned evaporation source.

[0021] Based on the evaporation source provided in this application, a thermal sensor can detect the temperature near the crucible and feed it back to the control drive unit in real time. The control drive unit can then compare the real-time temperature fed back by the thermal sensor with the set target temperature. When the real-time temperature fed back by the thermal sensor deviates from the set target temperature, the control drive unit can drive the blocking component to move according to the magnitude or change of the deviation value, thereby adjusting the position of the blocking component relative to the heat dissipation opening. This allows for adjustment of the area of ​​the heat dissipation opening blocked by the blocking component, i.e., adjusting the effective heat dissipation area of ​​the heat dissipation opening. In this way, the heating temperature of the crucible can be automatically adjusted, and the evaporation rate of the material to be evaporated can be adjusted. Therefore, through this technical solution, the temperature control adjustment capability of the evaporation source is good, which can cope with complex and variable temperature control requirements, and is conducive to achieving better film quality and thickness uniformity of the evaporated film layer. Attached Figure Description

[0022] The accompanying drawings are intended only to illustrate and explain this application and do not limit the scope of this application.

[0023] Figure 1 This is a schematic diagram of an evaporation source provided by an exemplary embodiment of this application, wherein the shielding member and the control drive unit are not shown;

[0024] Figure 2 This is a schematic diagram of an evaporation source provided by an exemplary embodiment of this application;

[0025] Figure 3 This is a schematic diagram of an evaporation source provided in an exemplary embodiment of this application, wherein the crucible and evaporation nozzle are not shown;

[0026] Figure 4 This is a schematic diagram of another evaporation source provided by an exemplary embodiment of this application, wherein the crucible and evaporation nozzle are not shown.

[0027] Explanation of reference numerals in the attached figures:

[0028] 10 - Cabinet, 11 - Ventilation opening;

[0029] 20 - Crucible; 21 - Evaporation nozzle;

[0030] 30-Shielding component, 31-Heat dissipation plate, 32-First plate, 33-Second plate;

[0031] 40-Thermal sensor,

[0032] 50-Control drive unit, 51-Driver, 52-Transmission component, 53-Rail, 531-First slide rail, 532-Second slide rail. Detailed Implementation

[0033] To provide a clearer understanding of the technical features, objectives, and effects of the embodiments of this application, the specific implementation methods of the embodiments of this application will now be described with reference to the accompanying drawings.

[0034] In this document, “illustrative” means “serving as an example, illustration or description”, and any illustration or implementation described herein as “illustrative” should not be construed as a more preferred or advantageous technical solution.

[0035] To keep the drawings concise, each drawing only schematically shows the parts relevant to this application, and they do not represent the actual structure of the product. Furthermore, to make the drawings concise and easy to understand, in some drawings, components with the same structure or function are only schematically shown as one or more, or only one or more are labeled.

[0036] Firstly, reference Figures 1 to 2This application first provides an evaporation source that can be used in a vapor deposition machine, enabling flexible and timely adjustment of the heating temperature to adjust the evaporation rate of the material to be evaporated. Specifically, the evaporation source includes a housing 10, a crucible 20, a shielding element 30, a thermal sensor 40, and a control drive unit 50. The housing 10 includes a front and a back side facing each other, and a side side located between the front and back sides. A clearance opening is provided on the front side of the housing 10, and heat dissipation openings 11 are provided on the side and / or back side of the housing 10, that is, heat dissipation openings 11 are provided on at least one of the side and back sides of the housing 10. The crucible 20 is housed in the housing 10, and an evaporation nozzle 21 is provided on the top of the crucible 20. The evaporation nozzle 21 extends out of the housing 10 through the clearance opening. The crucible 20 is used to contain and heat the material to be evaporated. The baffle 30 is adjustablely mounted on the housing 10 and corresponds to the heat dissipation opening 11. By adjusting the position of the baffle 30 relative to the heat dissipation opening 11, the area of ​​the heat dissipation opening 11 blocked by the baffle 30 can be adjusted. There is a receiving gap between the inner surface of the housing 10 and the crucible 20, and the thermal sensor 40 is located in the receiving gap. The control drive unit 50 is electrically connected to the thermal sensor 40, and the control drive unit 50 is drively connected to the baffle 30. The control drive unit 50 drives the baffle 30 to move according to the set target temperature and the temperature fed back by the thermal sensor 40, so as to adjust the position of the baffle 30 relative to the heat dissipation opening 11.

[0037] This technical solution allows the thermal sensor 40 to detect the temperature near the crucible 20 and feed it back to the control drive unit 50 in real time. The control drive unit 50 then compares the real-time temperature fed back by the thermal sensor 40 with a set target temperature. When the real-time temperature fed back by the thermal sensor 40 deviates from the set target temperature, the control drive unit 50 can drive the blocking member 30 to move according to the magnitude or change of the deviation value. This adjusts the position of the blocking member 30 relative to the heat dissipation opening 11, thereby adjusting the area of ​​the heat dissipation opening 11 blocked by the blocking member 30, i.e., adjusting the effective heat dissipation area of ​​the heat dissipation opening 11. The smaller the area of ​​the heat dissipation opening 11 blocked by the blocking member 30, the larger the effective heat dissipation area of ​​the heat dissipation opening 11, and the stronger the heat dissipation capacity, enabling the crucible 20 to dissipate heat quickly. Conversely, the larger the area of ​​the heat dissipation opening 11 blocked by the blocking member 30, the smaller the effective heat dissipation area of ​​the heat dissipation opening 11, and the weaker the heat dissipation capacity, resulting in slower heat dissipation of the crucible 20. In this way, the heating temperature of the crucible 20 can be automatically adjusted based on the real-time temperature feedback from the thermal sensor 40, thereby adjusting the evaporation rate of the material to be evaporated. Therefore, this technical solution provides good temperature control adjustment capability of the evaporation source, which can cope with complex and variable temperature control requirements, and is conducive to achieving better film quality and thickness uniformity of the vapor-deposited film.

[0038] In one example, the evaporation source further includes a heating element located in a receiving gap between the inner surface of the housing 10 and the crucible 20, with a thermal sensor 40 located between the heating element and the inner surface of the housing 10. The heating element can be an electric heating wire wound around the outer surface of the crucible 20, ensuring uniform heating and preventing localized overheating or underheating. Heating the crucible 20 with the electric heating wire allows the material to be evaporated within the crucible 20 to be uniformly heated and evaporated.

[0039] In one alternative embodiment, the shielding member 30 can be made of a material with high temperature resistance and good thermal conductivity, such as graphite or a high-temperature alloy. These materials not only remain stable in high-temperature environments but also effectively transfer heat, improving the heat dissipation efficiency of the evaporation source. Simultaneously, the surface of the shielding member 30 can undergo special treatment, such as spraying a high-temperature resistant coating or performing an oxidation treatment, to improve its high-temperature resistance and oxidation resistance.

[0040] In one possible implementation, refer to Figure 2 The control drive unit 50 includes a controller, a driver 51, and a transmission component 52. The controller is electrically connected to the thermal sensor 40 and the driver 51. The driver 51 is driveably connected to the shielding member 30 via the transmission component 52. The controller drives the shielding member 30 to move via the driver 51 and the transmission component 52. In this way, the controller can obtain the temperature detected by the thermal sensor 40, and then formulate a drive strategy based on the difference between this temperature and the set target temperature, thereby controlling the driver 51 to drive the shielding member 30 to move.

[0041] The target temperature can be preset in the controller. The controller can automatically compare the real-time temperature fed back by the thermal sensor 40 with the set target temperature and form a driving strategy based on the comparison result. The driving strategy may include whether and how to adjust the position of the shield 30 relative to the heat dissipation opening 11. The specific processing procedure for forming the driving strategy can be preset in the controller by those skilled in the art according to the actual situation of the evaporation source, and is not limited here. Setting the processing procedure in the controller is also a conventional technical means that is easy for those skilled in the art to implement, and will not be elaborated here.

[0042] In one example, the controller can be an industrial control computer. The driver 51 can be a drive motor. The transmission component 52 can be selected according to the movement pattern of the blocking component 30.

[0043] In one possible implementation, refer to Figure 2The accommodating gap includes multiple temperature measuring zones, each equipped with at least one thermal sensor 40 and corresponding to at least one heat dissipation opening 11. The number of heat dissipation openings 11 and the number of shielding members 30 are the same and correspond one-to-one. The control drive unit 50 adjusts the area of ​​the corresponding heat dissipation opening 11 blocked by the shielding member 30 based on the temperature feedback from the thermal sensors 40 in different temperature measuring zones. In this way, the temperature of the evaporation source can be monitored in zones, and the heat dissipation effect of each temperature measuring zone can be automatically adjusted, thereby linking and adjusting the evaporation rate of different zones, which is beneficial for controlling the uniformity of the vapor-deposited film layer.

[0044] For example, the accommodating gap can be divided into three temperature measuring zones, for example... Figure 2 The system includes three temperature measurement zones, A, B, and C, each equipped with at least one heat dissipation opening 11 and a thermal sensor 40. Thus, when the difference between the temperature fed back by the thermal sensor 40 in a certain temperature measurement zone and the set target temperature exceeds a threshold, the corresponding shielding component 30 can be moved to adjust the effective heat dissipation area of ​​the corresponding heat dissipation opening 11, thereby achieving timely adjustment of the heat dissipation effect and controlling the temperature.

[0045] Alternatively, each temperature measurement area can be equipped with multiple heat dissipation openings 11 and multiple thermal sensors 40. The heat dissipation openings 11 and thermal sensors 40 are set in a one-to-one correspondence. When the difference between the temperature fed back by a certain thermal sensor 40 and the set target temperature exceeds the threshold, the effective heat dissipation area of ​​the heat dissipation opening 11 corresponding to that thermal sensor 40 can be adjusted.

[0046] In one example, the control drive unit 50 may include a controller and multiple drivers 51. The controller can receive temperature feedback from all the thermal sensors 40 and simultaneously control the multiple drivers 51 to execute different drive commands.

[0047] In one example, one driver 51 corresponds to all the shielding elements 30 in a temperature measuring area, that is, the positions of all the shielding elements 30 in a temperature measuring area can be adjusted synchronously.

[0048] Alternatively, in another example, one driver 51 can drive one shield 30. When a temperature measuring area is provided with multiple heat dissipation openings 11, then the temperature measuring area is provided with the same number of drivers 51 so that the shield 30 corresponding to each heat dissipation opening 11 can be adjusted individually.

[0049] Alternatively, in another example, one driver 51 can synchronously drive two shielding elements 30.

[0050] Alternatively, in another example, a shutter 30 may include two separately movable parts, in which case the shutter 30 corresponds to two actuators 51, one actuator 51 driving a separate part of the shutter 30. For example, a shutter 30 may include two sliding windows, each driven separately by a separate actuator 51.

[0051] In one example, the driver 51 can be either a stepper motor or a servo motor. A stepper motor can precisely control the rotation angle and speed, making it suitable for scenarios requiring precise adjustment of the position of the shield 30. A servo motor, on the other hand, offers higher control precision and dynamic response speed, making it suitable for evaporation sources with higher temperature control requirements. In practical applications, the appropriate type of driver 51 can be selected based on the specific needs of the evaporation source and the cost budget.

[0052] The evaporation source provided in this application can be a linear evaporation source. Specifically, the housing 10 is a cuboid with multiple clearance openings spaced apart along its length. A heat dissipation opening 11 is provided on the back of the cuboid, and heat dissipation openings 11 are also provided on both sides of the cuboid. Naturally, the crucible 20 and the housing 10 are shaped to match, and the distribution of the evaporation nozzles 21 on the crucible 20 corresponds to the distribution of the clearance openings, with each evaporation nozzle 21 extending out of the housing through one clearance opening.

[0053] In one example, gaps exist between the back and sides of the cuboid and the crucible 20. These gaps can be divided into three temperature measurement zones along the length of the cuboid, for example... Figure 3 The crucible 20 is divided into three temperature measurement zones: A, B, and C. Each temperature measurement zone is equipped with three thermal sensors 40, which are evenly distributed around the crucible 20. That is, in each temperature measurement zone, the three thermal sensors 40 correspond to the back of the crucible 10 and two opposite sides, respectively. Simultaneously, each temperature measurement zone has three heat dissipation openings 11, located on the front of the crucible 10 and two opposite sides. In each temperature measurement zone, the three thermal sensors 40 and the three heat dissipation openings 11 are in a one-to-one correspondence, with each thermal sensor 40 measuring the temperature near its corresponding heat dissipation opening 11. Furthermore, each heat dissipation opening 11 is equipped with a shielding component, and the driver 51 and the shielding component 30 are in a one-to-one correspondence. Therefore, even in the same temperature measurement area, if the difference between the temperature detected by one of the thermal sensors 40 and the set target temperature exceeds a preset threshold, while the difference between the temperature detected by the other two thermal sensors 40 and the set target temperature does not exceed the preset threshold, the driver 51 can independently adjust the position of the shielding member 30 corresponding to the thermal sensor 40, thereby adjusting the area of ​​the corresponding heat dissipation opening 11 blocked by the shielding member 30, and the positions of the shielding members 30 corresponding to the other two thermal sensors 40 do not need to be adjusted.

[0054] In one possible specific implementation, refer to Figure 2 and Figure 3 The transmission component 52 may include a rotating shaft, and the shielding component 30 includes a heat sink 31 with heat dissipation holes. The heat sink 31 is connected to the rotating shaft, and the driver 51 drives the heat sink 31 to rotate by driving the rotating shaft. Based on this technical solution, the area of ​​the heat dissipation opening 11 that is blocked can be adjusted by rotating the heat sink 31, thereby achieving precise control of the heat dissipation efficiency. For example, when the heat sink 31 and the opening direction of the heat dissipation opening 11 are perpendicular, most of the area of ​​the heat dissipation opening 11 can be blocked by the heat sink 31, and the interior of the housing 10 can be ventilated and cooled through the heat dissipation holes on the heat sink 31 and the gap between the edge of the heat sink 31 and the heat dissipation opening 11. At this time, the heat dissipation capacity is the weakest. When the heat sink 31 and the opening direction of the heat dissipation opening 11 are parallel, the effective heat dissipation area of ​​the heat dissipation opening 11 is the largest, and the heat dissipation capacity is the strongest. Taking the box 10 as a cuboid, with the heat dissipation opening 11 and the heat dissipation plate 31 located on the back of the cuboid as an example, when the heat dissipation plate 31 is parallel to the back of the cuboid, the opening direction of the heat dissipation plate 31 and the heat dissipation opening 11 is perpendicular, and the heat dissipation capacity is the weakest at this time; when the heat dissipation plate 31 is perpendicular to the back of the cuboid, the opening direction of the heat dissipation plate 31 and the heat dissipation opening 11 is parallel, and the heat dissipation capacity is the strongest at this time.

[0055] Furthermore, the shape and distribution of the heat dissipation holes on the heat sink 31 can be customized according to actual conditions to adapt to different heat dissipation needs. For example, in areas with high heat dissipation requirements, the number of heat dissipation holes can be increased or their size enlarged to improve heat dissipation efficiency. In areas with low heat dissipation requirements, the number of heat dissipation holes can be reduced or their size decreased accordingly to save materials and reduce manufacturing costs.

[0056] In one possible embodiment, reference Figure 3The size of the heat sink 31 is smaller than the size of the heat dissipation opening 11. The middle part of the heat sink 31 is connected to the rotating shaft. As the heat sink 31 rotates with the rotating shaft, one end of the heat sink 31 can extend into the heat dissipation opening 11. With this technical solution, if the heat sink 31 is located on the outside of the housing 10, during the rotation of the heat sink 31, one end of the heat sink 31 extends into the inside of the housing 10 through the heat dissipation opening 11, and the internal space of the housing 10 can be used to accommodate part of the structure of the heat sink 31, reducing the space required for the evaporation source. If the heat sink 31 is located on the inside of the housing 10, during the rotation of the heat sink 31, one end of the heat sink 31 extends out to the outside of the housing 10 through the heat dissipation opening 11, and the external space of the housing 10 can be used to accommodate part of the structure of the heat sink 31, reducing the volume of the housing 10. Furthermore, by making the size of the heat sink 31 smaller than the size of the heat dissipation opening 11, the heat sink 31 can be allowed to rotate 360°. It is understood that the heat sink 31 may include two opposing ends. After the middle part of the heat sink 31 is connected to the rotating shaft, the two opposing ends can rotate around the rotating shaft while rotating synchronously with it. The middle part of the heat sink 31 refers to the portion located between the two opposing ends.

[0057] In one example, the heat sink 31 can be linearly symmetrical about the axis of rotation. This symmetry ensures the balance of the heat sink 31 during rotation, reducing vibration and noise caused by imbalance and improving structural stability and reliability. Simultaneously, this design makes installation and removal of the heat sink 31 easier, facilitating user maintenance and upkeep. In another example, the heat sink 31 is rectangular, with its central symmetry line along its width connected to the axis of rotation, or its central symmetry line along its length connected to the axis of rotation, thus making the heat sink 31 linearly symmetrical about the axis of rotation.

[0058] In another possible embodiment, one end of the heat sink 31 can be connected to the rotating shaft, and the other end of the heat sink 31 can rotate around the rotating shaft.

[0059] The rotating shaft can be located inside the housing 10, and the thermal sensor 40 can be mounted on the rotating shaft. This avoids the need for an additional support bracket to carry the thermal sensor, simplifying the structure. In one embodiment, the thermal sensor 40 can be fixed to the rotating shaft via a threaded connection, snap-fit ​​connection, or other suitable connection method to ensure its stability and reliability.

[0060] In another possible specific implementation, refer to Figure 4The control drive unit 50 also includes a track 53. The driver 51 drives the shielding member 30 to slide along the track 53 via a transmission member 52 to adjust the position of the shielding member 30 relative to the heat dissipation opening 11. Based on this technical solution, the area of ​​the heat dissipation opening 11 that is blocked can be adjusted by sliding the shielding member 30 to different positions, thereby achieving precise control of heat dissipation efficiency. For example, when higher heat dissipation efficiency is required, the shielding member 30 can be slid to block a smaller area of ​​the heat dissipation opening 11, allowing more heat to dissipate through the heat dissipation opening 11; when lower heat dissipation efficiency is required, the shielding member 30 can be slid to block a larger area of ​​the heat dissipation opening 11, reducing heat dissipation. This design not only improves the adjustability of heat dissipation efficiency but also increases the flexibility and adaptability of the equipment.

[0061] Furthermore, the design of the track 53 ensures smooth and stable sliding of the shield 30. In practical use, the shield 30 occupies relatively little space, which helps to reduce the volume of the evaporation source. For example, if the housing 10 is a cuboid and the heat dissipation opening 11 is located on the back of the cuboid, the track 53 can be set on the inside of the bottom plate of the cuboid and parallel to the bottom plate, thus making full use of the internal space of the housing 10.

[0062] In practical implementation, the appropriate shape, length, and material of the track 53, as well as the type and specifications of the transmission component 52, can be selected according to the actual needs of the equipment and the working environment to meet the requirements for precise control of heat dissipation efficiency. In one example, multiple heat dissipation components can share a set of tracks 53, or each heat dissipation component can be equipped with a separate set of tracks 53. This set of tracks 53 includes two parallel tracks 53, which can be distributed on opposite sides of the heat dissipation opening 11. The opposite ends of the shielding component 30 are slidably connected to the two tracks 53, thereby increasing structural stability.

[0063] In one possible embodiment, reference Figure 4The shielding member 30 includes a first plate 32 and a second plate 33. The dimensions of the first plate 32 and the second plate 33 are the same, and both are greater than or equal to the inner diameter of the heat dissipation opening 11. The track 53 includes a first slide rail 531 and a second slide rail 532 that are parallel to each other. The first plate 32 is slidably connected to the first slide rail 531, and the second plate 33 is slidably connected to the second slide rail 532. The first plate 32 and the second plate 33 correspond to different drivers 51. The first plate 32 is provided with a plurality of first heat dissipation holes, and the second plate 33 is provided with a plurality of second heat dissipation holes. The inner diameters of the first heat dissipation holes and the second heat dissipation holes are different. Alternatively, the first plate 32 is provided with a plurality of first heat dissipation holes, and the surface of the second plate 33 facing and / or away from the heat dissipation opening 11 is a seamless integrated finish. Based on this technical solution, the first board 32 or the second board 33 can be driven individually by each driver 51, so that the first board 32 and the second board 33 can be adjusted to different positions respectively, thereby allowing for multi-level adjustment of the area blocked by the heat dissipation opening 11.

[0064] In practical applications, the inner diameter of the first and second heat dissipation holes can be flexibly selected according to different heat dissipation requirements. For example, when higher heat dissipation efficiency is required, a larger inner diameter heat dissipation hole can be selected to increase the heat dissipation area and improve heat dissipation efficiency; while when a certain degree of decoration or dustproof performance is required, a second plate 33 with a smaller inner diameter or a seamless integrated finish can be selected. Furthermore, the heat dissipation holes on the first plate 32 and the second plate 33 can also be designed with different shapes and arrangements to meet different heat dissipation needs. For example, the heat dissipation holes can be designed as circular, square, elliptical, or other shapes, and the arrangement can be designed as regular or irregular to further increase the heat dissipation area and efficiency. At the same time, this design can also improve the strength and stability of the shielding component 30, ensuring its stability and reliability during sliding.

[0065] Of course, in other embodiments, the shielding member 30 may also include a plate with heat dissipation holes. Alternatively, in another example, the shielding member 30 may include three plates, two of which have heat dissipation holes with different inner diameters, and the surface of the third plate facing and / or away from the heat dissipation opening 11 is a seamless, one-piece finish. Each plate corresponds to an independent slide rail, so that each plate can be controlled individually. Those skilled in the art can design the number and type of plates included in the shielding member 30 according to actual needs, which will not be elaborated in this application.

[0066] In one embodiment, the heat sink 31 can be made of a lightweight, high-strength, and high-temperature resistant material, such as titanium alloy or high-temperature alloy. These materials not only meet the requirements of the heat sink 31 for use in high-temperature environments, but also reduce the overall weight and improve the reliability and service life of the evaporation source.

[0067] The evaporation source provided in this application is not limited to a linear evaporation source, but can also be an evaporation source of other shapes and structures. For example, the shape of the box 10 can be circular, square, or other polygonal, and the number and distribution of the clearance openings and heat dissipation openings 11 can also be customized according to actual needs. At the same time, the shape of the crucible 20 and the distribution of the evaporation nozzles 21 can also be adapted to the shape of the box 10 and the distribution of the clearance openings.

[0068] As can be seen from the above, the heat dissipation effect of different areas can be changed arbitrarily by the evaporation source provided in this application, the temperature distribution can be adjusted arbitrarily, the temperature changes of different areas of the evaporation source can be monitored in real time, and the position of the shielding component 30 can be adjusted in conjunction with the temperature changes, thereby adjusting the area of ​​the heat dissipation opening 11 that is shielded. Thus, an evaporation source with good temperature control adjustment capability can be obtained, which can cope with complex and ever-changing temperature control requirements, and is conducive to making the film formation quality of the vapor-deposited film layer better and the thickness uniformity better.

[0069] Secondly, this application also provides a vapor deposition machine, which includes the evaporation source provided in this application. By employing the aforementioned evaporation source, this vapor deposition machine also possesses excellent temperature control adjustment capabilities, enabling it to adapt to various complex temperature control requirements and ensure the film formation quality and thickness uniformity of the vapor-deposited film.

[0070] In addition, the vapor deposition machine also includes a vapor deposition chamber and a substrate support mechanism. Both the substrate support mechanism and the evaporation source are located in the vapor deposition chamber. The substrate support mechanism is used to support the substrate and position the substrate surface to be vaporized facing the evaporation source, with the substrate positioned above the evaporation source. In this way, the material can evaporate upwards and be deposited onto the substrate upon contact with it.

[0071] Furthermore, the vapor deposition machine also includes a vacuum pump to evacuate the vapor deposition chamber, reducing the impact of impurities such as oxygen and water vapor on the deposited film during the vapor deposition process. A heating device can be installed outside the vapor deposition chamber to preheat it, reducing condensation and ensuring a smooth vapor deposition process. The heating device can include heating wires, heating plates, etc., and its specific form can be determined based on the actual structure of the vapor deposition machine and the working environment.

[0072] In summary, by using the evaporation source or vapor deposition machine provided in this application, a vapor deposition film layer with high quality and good thickness uniformity can be obtained by precisely controlling the temperature distribution and heat dissipation efficiency of the evaporation source. This film layer is suitable for forming thin film layers with different functions in display panels, electronic devices, or optical devices.

[0073] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0074] It should be understood that although specific embodiments of this application have been described in detail with reference to the accompanying drawings, this should not be construed as limiting the scope of protection of this application. Various modifications and variations that can be made by those skilled in the art without inventive effort within the scope described in the claims still fall within the scope of protection of this application. Although this specification describes various embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An evaporation source, characterized in that, The evaporation source includes: The enclosure (10) includes a front and a back facing each other, and a side facing between the front and the back. A clearance opening is provided on the front of the enclosure (10), and a heat dissipation opening (11) is provided on the side and / or the back of the enclosure (10). A crucible (20) is housed in the box (10). An evaporation nozzle (21) is provided on the top of the crucible (20). The evaporation nozzle (21) extends out of the box (10) through the clearance opening. The crucible (20) is used to hold and heat the material to be steamed. A shielding member (30) is installed on the housing (10) in an adjustable position and corresponds to the heat dissipation opening (11). By adjusting the position of the shielding member (30) relative to the heat dissipation opening (11), the area of ​​the heat dissipation opening (11) blocked by the shielding member (30) can be adjusted. A thermal sensor (40) is provided, wherein there is a receiving gap between the inner surface of the housing (10) and the crucible (20), and the thermal sensor (40) is located in the receiving gap; The control drive unit (50) is electrically connected to the thermal sensor (40), and the control drive unit (50) is drively connected to the shielding member (30). The control drive unit (50) drives the shielding member (30) to move according to the set target temperature and the temperature fed back by the thermal sensor (40) to adjust the position of the shielding member (30) relative to the heat dissipation opening (11).

2. The evaporation source according to claim 1, characterized in that, The accommodating gap includes multiple temperature measuring areas, each of which is provided with at least one of the thermal sensors (40) and corresponds to at least one of the heat dissipation openings (11). The number of heat dissipation openings (11) and the number of shielding members (30) are the same and correspond one-to-one. The control drive unit (50) adjusts the area of ​​the heat dissipation opening (11) blocked by the shielding member (30) according to the temperature feedback from the thermal sensor (40) in different temperature measurement areas.

3. The evaporation source according to claim 1, characterized in that, The box (10) is a cuboid, and the number of the clearance openings is multiple and distributed at intervals along the length of the cuboid. The heat dissipation opening (11) is provided on the back of the cuboid, and the heat dissipation opening (11) is provided on both sides of the cuboid.

4. The evaporation source according to any one of claims 1-3, characterized in that, The control drive unit (50) includes a controller, a driver (51) and a transmission component (52). The controller is electrically connected to the thermal sensor (40) and the driver (51). The driver (51) is connected to the shielding component (30) via the transmission component (52). The controller drives the shielding component (30) to move via the driver (51) and the transmission component (52).

5. The evaporation source according to claim 4, characterized in that, The transmission component (52) includes a rotating shaft, the shielding component (30) includes a heat sink (31), the heat sink (31) is provided with heat dissipation holes, the heat sink (31) is connected to the rotating shaft, and the driver (51) drives the heat sink (31) to rotate by driving the rotating shaft to rotate.

6. The evaporation source according to claim 5, characterized in that, The size of the heat sink (31) is smaller than the size of the heat dissipation opening (11). The middle part of the heat sink (31) is connected to the rotating shaft. During the process of the heat sink (31) rotating with the rotating shaft, one end of the heat sink (31) can extend into the heat dissipation opening (11).

7. The evaporation source according to claim 5, characterized in that, The rotating shaft is located inside the housing (10), and the thermal sensor (40) is mounted on the rotating shaft.

8. The evaporation source according to claim 4, characterized in that, The control drive unit (50) also includes a track (53), and the driver (51) drives the shield (30) to slide along the track (53) through the transmission member (52) to adjust the position of the shield (30) relative to the heat dissipation opening (11).

9. The evaporation source according to claim 8, characterized in that, The shielding member (30) includes a first plate (32) and a second plate (33). The size of the first plate (32) and the size of the second plate (33) are the same, and both are greater than or equal to the inner diameter of the heat dissipation opening (11). The track (53) includes a first slide rail (531) and a second slide rail (532) that are parallel to each other. The first plate (32) is slidably connected to the first slide rail (531), and the second plate (33) is slidably connected to the second slide rail (532). The first plate (32) and the second plate (33) correspond to different drivers (51). The first plate (32) is provided with a plurality of first heat dissipation holes, and the second plate (33) is provided with a plurality of second heat dissipation holes. The inner diameters of the first heat dissipation holes and the second heat dissipation holes are different. or, The first plate (32) is provided with a plurality of first heat dissipation holes, and the surface of the second plate (33) facing and / or away from the heat dissipation opening (11) is a seamless integrated finish.

10. A vapor deposition machine, characterized in that, The vapor deposition machine includes the evaporation source described in any one of claims 1-9.

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