Evaporation unit, evaporation source and evaporation device

Abstract

The application provides an evaporation unit, an evaporation source and an evaporation device. The evaporation unit comprises a heating chamber, a diffusion chamber and a temperature control mechanism. The heating chamber comprises a heating shell, a crucible and a heating body. The diffusion chamber comprises a first shell and a second shell. The first shell is connected to the heating shell and is formed with a diffusion cavity, a second communication hole and a spray hole. The second shell surrounds at least part of the first shell. The second shell and the first shell form a first temperature control cavity, an inlet hole and an outlet hole. The temperature control mechanism comprises a temperature controller, a storage chamber and a power source. The storage chamber has a storage cavity connected to the inlet hole and the outlet hole. The storage cavity is used for storing high-temperature fluid. The temperature controller is used for controlling the temperature of the high-temperature fluid within a preset range. The power source is used for flowing the fluid in the storage cavity into the temperature control cavity through the inlet hole and flowing out of the temperature control cavity through the outlet hole. The evaporation unit can make the temperature in the diffusion cavity more uniform by setting the fluid for heating the first shell in the first temperature control cavity, so as to improve the evaporation quality.

Description

Technical Field

[0001] This invention belongs to the field of vacuum evaporation technology, and particularly relates to an evaporation unit, an evaporation source, and an evaporation apparatus. Background Technology

[0002] Current evaporation sources typically have multiple evaporation units, each containing a crucible and a diffusion chamber. The diffusion chamber allows materials that have been evaporated or sublimated by heating the crucible to diffuse and mix. However, heating the diffusion chamber is usually achieved through an electric heating wire, which makes it difficult to control the temperature inside the diffusion chamber, easily causing the substrate temperature to rise and affecting the evaporation quality. Summary of the Invention

[0003] The purpose of this invention is to provide an evaporation unit, an evaporation source, and a vapor deposition apparatus, which aims to solve the technical problem that the electric heating wire in the existing diffusion chamber makes it difficult to control the temperature inside the diffusion chamber, easily causing the substrate temperature to rise and affecting the vapor deposition quality.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] In one aspect, an evaporation unit is provided, including a heating chamber, a diffusion chamber, and a temperature control mechanism;

[0006] The heating chamber includes a heating shell, a crucible, and a heating element. The heating shell has a heating cavity and a first communicating hole that communicates with the heating cavity. The crucible is disposed in the heating cavity, and the heating element is used to heat the crucible.

[0007] The diffusion chamber includes a first housing and a second housing. The first housing is connected to the heating housing and forms a diffusion cavity, a second connecting hole, and a jet hole. The second connecting hole connects to the diffusion cavity and is connected to the first connecting hole. The jet hole is connected to the diffusion cavity and is connected to the external space. The second housing surrounds at least a portion of the first housing. A first temperature control cavity, an inlet hole, and an outlet hole are formed between the second housing and the first housing. The inlet hole and the outlet hole are both connected to the first temperature control cavity.

[0008] The temperature control mechanism includes a temperature controller, a storage chamber, and a power source. The storage chamber has a storage cavity connected to the inlet and the outlet. The storage cavity is used to store high-temperature fluid. The temperature controller is used to control the temperature of the high-temperature fluid within a preset range. The power source is used to direct the fluid in the storage cavity into the temperature control cavity through the inlet and out through the outlet.

[0009] In one embodiment of the first aspect, the temperature controller is used to regulate the liquid temperature in the first temperature control chamber.

[0010] In one embodiment of the first aspect, the diffusion chamber further includes a third housing that surrounds at least a portion of the second housing, a second temperature control cavity is formed between the third housing and the second housing, and the temperature controller is disposed within the second temperature control cavity.

[0011] In one embodiment of the first aspect, the diffusion chamber further includes a fourth housing disposed between the second housing and the first housing, wherein a first gas cavity for filling gas is formed between the fourth housing and the first housing, and a liquid cavity for filling liquid is formed between the fourth housing and the second housing, and both the inlet and the outlet are connected to the liquid cavity.

[0012] In one embodiment of the first aspect, the diffusion chamber further includes a fifth housing disposed between the second housing and the third housing, wherein a second gas cavity for filling gas is formed between the fifth housing and the second housing, and a mounting cavity is formed between the fifth housing and the third housing, and the temperature controller is disposed within the mounting cavity.

[0013] In one embodiment of the first aspect, the fluid includes a liquid, and the evaporation unit further includes a gas supply mechanism connected to the first temperature control chamber, the gas supply mechanism being capable of introducing gas into the liquid within the first temperature control chamber.

[0014] In one embodiment of the first aspect, the first housing includes a housing body, a connecting pipe, and an ejector pipe. The housing body has the diffusion cavity, and both the connecting pipe and the ejector pipe are connected to the housing body. The connecting pipe forms the second communicating hole, and the ejector pipe forms the injection hole. The second housing has an inner cavity, and the housing body is disposed in the inner cavity, dividing the inner cavity into the diffusion cavity and the first temperature control cavity. The connecting pipe extends out of the inner cavity and is connected to the first communicating hole, and the ejector pipe extends out of the inner cavity and is connected to the external space.

[0015] In one embodiment of the first aspect, the first housing includes a plurality of housing bodies, the connecting pipe and the injection pipe are connected to the plurality of housing bodies, and the plurality of housing bodies are disposed in the inner cavity.

[0016] Secondly, an evaporation source is provided, comprising at least one evaporation unit as provided in the embodiments described above, wherein a plurality of the evaporation units are arranged side by side in a horizontal direction.

[0017] Thirdly, a vapor deposition apparatus is provided, including a housing and an evaporation source as provided in the above embodiments, wherein the housing has a receiving cavity and the evaporation source is disposed within the receiving cavity.

[0018] The technical advantages of this invention compared to existing technologies are as follows: This vapor deposition unit uses a temperature controller to regulate the fluid temperature within the first temperature control chamber. The fluid in the first temperature control chamber can heat or cool the first shell, which then exchanges heat with the gaseous material in the diffusion chamber to heat or cool the gaseous material, thereby achieving temperature control of the gaseous material in the diffusion chamber. Because the fluid can be evenly distributed within the first temperature control chamber, the temperature of the first shell becomes more uniform. The heat exchange between the first shell and the gaseous material in the diffusion chamber also results in a more uniform temperature of the gaseous material. Since the fluid has a large specific heat capacity, it can store and release a large amount of heat, acting as a buffer and stabilizing agent during heating, reducing temperature fluctuations and providing a stable temperature environment for the vapor deposition process. Furthermore, compared to electric heating wires, the fluid heat conduction heating or cooling process eliminates electrical safety hazards, is less prone to fires or other safety accidents, is less likely to age rapidly due to high temperatures, has a longer service life, and reduces equipment maintenance costs and downtime frequency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the vapor deposition apparatus provided in an embodiment of the present invention;

[0021] Figures 2 to 5 These are cross-sectional views of the evaporation unit provided in different embodiments of the present invention;

[0022] Figure 6 and Figure 7 yes Figure 5 The evaporation unit in the diagram is shown as a cross-sectional view of the diffusion chamber in different embodiments.

[0023] Explanation of reference numerals in the attached figures:

[0024] 100. Evaporation unit; 10. Heating chamber; 11. Heating shell; 12. Crucible; 13. Heating element; 101. Heating cavity; 102. First connecting hole; 20. Diffusion chamber; 21. First shell; 211. Shell body; 212. Connecting pipe; 213. Ejection pipe; 22. Second shell; 23. Third shell; 24. Fourth shell; 25. Fifth shell; 201. Diffusion cavity; 202. Second connecting hole; 203. Ejection hole; 204. First temperature control cavity; 20 4a. Inlet hole; 204b. Outlet hole; 2041. First gas chamber; 2042. Liquid chamber; 205. Second temperature control chamber; 2051. Second gas chamber; 2052. Mounting chamber; 30. Temperature control mechanism; 31. Temperature controller; 32. Storage chamber; 33. Power source; 34. Main unit; 40. Sixth housing; 401. Third gas chamber; 50. Gas supply mechanism; 91. Evaporation material; 92. Substrate; 200. Evaporation source; 300. Outer shell; 3001. Evaporation chamber. Detailed Implementation

[0025] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0026] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0027] Furthermore, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first," "second," "third," "fourth," "fifth," and "sixth" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0030] Please see Figure 1 This invention provides an evaporation unit 100, an evaporation source 200, and a vapor deposition apparatus. The vapor deposition apparatus includes a housing 300, which forms a vapor deposition chamber 3001. The vapor deposition chamber 3001 can be made into a vacuum environment by a vacuum pump. The evaporation source 200 and the substrate 92 to be vapor-deposited can be disposed within the vapor deposition chamber 3001. The evaporation source 200 is responsible for heating the vapor deposition material 91 to cause the material to evaporate or sublimate. The evaporated or sublimated material can adhere to the substrate 92 and form a thin film on the surface of the substrate 92. The evaporation source 200 includes at least one evaporation unit 100, and the vapor deposition material 91 can be placed in each evaporation unit 100. The evaporation source 200 can be configured with a selectable number of evaporation units 100 according to production needs, offering high flexibility. Multiple evaporation units 100 working together can improve the deposition efficiency on the substrate 92. The deposition materials 91 placed in each evaporation unit 100 can be the same or different, and the composition and proportions of the thin film formed on the substrate 92 can be adjusted as needed. The substrate 92 can be a printed circuit board or a semiconductor substrate 92. The deposition materials 91 include, but are not limited to, metallic materials (such as aluminum, silver, gold, copper, etc.), alloy materials (such as nickel-chromium alloys, titanium-aluminum alloys, etc.), compound materials (such as silicon dioxide, titanium oxide, zinc oxide, zinc sulfide, etc.), and organic materials (such as polyethylene terephthalate, polystyrene, organic light-emitting materials, etc.).

[0031] Please see Figure 1 and Figure 2 The evaporation unit 100 in this embodiment of the invention includes a heating chamber 10, a diffusion chamber 20, and a temperature control mechanism 30. The heating chamber 10 is used to heat the vapor deposition material 91, the diffusion chamber 20 is used to diffuse and mix the gas vapor deposited from the heating chamber 10, and the temperature control mechanism 30 is used to control the gas temperature in the diffusion chamber 20, so as to improve the film formation effect on the substrate 92 while suppressing the temperature rise of the substrate 92.

[0032] The heating chamber 10 includes a heating shell 11, a crucible 12, and a heating element 13. The heating shell 11 forms a heating cavity 101 and a first connecting hole 102 connecting the heating cavity 101. The crucible 12 is disposed inside the heating cavity 101, and the heating element 13 is used to heat the crucible 12. A vapor-deposited material 91 can be placed inside the crucible 12. The first connecting hole 102 can be located above the crucible 12. When the heating element 13 heats the crucible 12, the vapor-deposited material 91 can evaporate or sublimate into a gaseous material, which can be discharged through the first connecting hole 102. The heating element 13 can be selected as an encapsulated heater, an electric heating wire, or other components that generate heat through electricity. The heating shell 11 can be made of a heat-insulating material to prevent heat loss from the heating cavity 101 and ensure temperature stability within the heating cavity 101. The materials of the heating shell 11 include, but are not limited to, ceramic fiber, rock wool, and vacuum insulation panels. In other embodiments, the first connecting hole 102 may not be located above the crucible 12, but rather the gas flow path may be set as needed, which is not limited here.

[0033] The diffusion chamber 20 includes a first housing 21 and a second housing 22. The first housing 21 is connected to the heating housing 11, allowing gaseous material vapor-deposited in the heating chamber 101 of the heating housing 11 to enter, exit through the first housing 21, and be sprayed onto the substrate 92. The second housing 22 surrounds the first housing 21, forming a first temperature control chamber 204 between the second housing 22 and the first housing 21. Fluid, including gas or liquid, can flow through the first temperature control chamber 204.

[0034] Specifically, the first housing 21 is connected to the heating housing 11 and has a diffusion cavity 201, a second connecting hole 202, and a spray hole 203. The second connecting hole 202 and the spray hole 203 are spaced apart. The second connecting hole 202 connects to the diffusion cavity 201 and is connected to the first connecting hole 102. The spray hole 203 connects to the diffusion cavity 201 and is connected to the external space. The gaseous material formed in the heating cavity 101 enters the diffusion cavity 201 through the first connecting hole 102 and the second connecting hole 202 in sequence for mixing and diffusion, and then is sprayed onto the substrate 92 through the spray hole 203, thus completing the coating process on the substrate 92.

[0035] The second housing 22 surrounds at least a portion of the first housing 21, meaning the second housing 22 can completely enclose the diffusion cavity 201 without affecting the entry of gaseous material from the heating cavity 101 into the diffusion cavity 201, nor affecting the ejection of gaseous material from the diffusion cavity 201 through the injection hole 203. Alternatively, the second housing 22 can only enclose a portion of the first housing 21, leaving a portion of the first housing 21 exposed. A first temperature control cavity 204, an inlet hole 204a, and an outlet hole 204b are formed between the second housing 22 and the first housing 21. Both the inlet hole 204a and the outlet hole 204b are connected to the first temperature control cavity 204. External fluid can enter the first temperature control cavity 204 through the inlet hole 204a and exit through the outlet hole 204b, achieving fluid flow and renewal within the first temperature control cavity 204. The first temperature control cavity 204 can be a single chamber or multiple spaced-apart chambers; no limitation is made here. The first housing 21 may be made of a material with high thermal conductivity to facilitate heat exchange with the fluid in the first temperature control cavity 204.

[0036] The temperature control mechanism 30 includes a temperature controller 31, a storage chamber 32, and a power source 33. The storage chamber 32 has a storage cavity connected to an inlet port 204a and an outlet port 204b. The storage cavity is used to store high-temperature fluid. The temperature controller 31 is used to control the temperature of the high-temperature fluid within a preset range. The power source 33 is used to direct the fluid in the storage cavity into the first temperature control cavity 204 through the inlet port 204a and out through the outlet port 204b. When the heating element 13 heats the crucible 12, the power source 33 can be turned on simultaneously, so that the fluid in the storage cavity can enter the first temperature control cavity 204 through the inlet port 204a and then flow back into the storage cavity through the outlet port 204b, thereby realizing fluid circulation. The temperature controller 31 can control the fluid temperature by controlling the fluid temperature in the storage cavity or by controlling the fluid temperature in the first temperature control cavity 204. The aforementioned control of the high-temperature fluid temperature within the preset range refers to adjusting the fluid temperature to the preset range by heating or cooling. For example, when the temperature of the gaseous material in the diffusion chamber 201 is lower than a preset range, the temperature controller 31 can heat the fluid to raise the temperature of the gaseous material in the diffusion chamber 201. When the temperature of the gaseous material in the diffusion chamber 201 is higher than the preset range, the fluid, being lower than the temperature of the gaseous material, can automatically absorb the heat from the gaseous material to cool the fluid, or the temperature controller 31 can cool the fluid to quickly lower the temperature of the gaseous material in the diffusion chamber 201. The storage chamber can be one or more cavities capable of storing a large amount of fluid, or it can be a pipe connected to the inlet port 204a and the outlet port 204b; there are no restrictions here.

[0037] It should be noted that the temperature of the temperature controller 31 can be adjusted by an externally configured host 34.

[0038] The vapor deposition unit uses a temperature controller 31 to regulate the fluid temperature within the first temperature control chamber 204. The fluid in the first temperature control chamber 204 heats or cools the first housing 21, which then exchanges heat with the gaseous material in the diffusion chamber 201 to heat or cool the gaseous material, thus achieving temperature control of the gaseous material in the diffusion chamber 20. Because the fluid is evenly distributed within the first temperature control chamber 204, the temperature of the first housing 21 becomes more uniform. The heat exchange between the first housing 21 and the gaseous material in the diffusion chamber 201 also contributes to a more uniform temperature of the gaseous material. Due to the fluid's large specific heat capacity, it can store and release a significant amount of heat, acting as a buffer and stabilizing agent during heating, reducing temperature fluctuations and providing a stable temperature environment for the vapor deposition process. Furthermore, compared to electric heating wires, fluid heat conduction heating or cooling eliminates electrical safety hazards, reducing the risk of fires and other accidents. It is also less prone to rapid aging due to high temperatures, resulting in a longer service life and reduced equipment maintenance costs and downtime frequency.

[0039] In some embodiments, the fluid in the first temperature control chamber 204 is a liquid. Liquids generally have a much higher specific heat capacity than gases, meaning that for the same mass of liquid and gas, raising the temperature by the same amount results in the liquid absorbing more heat. Therefore, the liquid, as a heating fluid, can carry more heat, providing a more stable and sustained heat source for the diffusion chamber 20, helping to maintain temperature stability within the diffusion chamber 20 and reducing temperature fluctuations. Liquids typically have higher thermal conductivity than gases; during heat transfer, the distance between liquid molecules is relatively small, making intermolecular heat conduction more efficient. Simultaneously, the liquid generates natural convection or circulates through forced convection during heating, allowing heat to be transferred more quickly and evenly to all parts of the diffusion chamber 20, improving heating uniformity and ensuring consistency in processes such as vapor deposition and product quality. Furthermore, liquids have extremely low compressibility, resulting in very small volume changes during heating and transport. This allows the liquid to maintain a relatively stable flow rate and pressure within the system, facilitating precise control of the heating process.

[0040] Please see Figure 1 and Figure 2In some embodiments, the temperature controller 31 is used to regulate the liquid temperature within the storage chamber. This allows for temperature regulation of the liquid before it enters the first temperature-controlled chamber 204, enabling precise temperature control within a relatively small and dedicated space. High-precision heating equipment and temperature sensors allow for more accurate adjustment of the liquid temperature to the desired set value, reducing temperature fluctuations. Furthermore, since the liquid temperature entering the temperature-controlled chamber is precisely controlled, there is no thermal shock to the chamber walls from the high-temperature liquid, thus extending the service life of the temperature-controlled chamber walls and reducing the risk of damage due to overheating or uneven temperature. Simultaneously, placing the heating and temperature regulation equipment outside the temperature-controlled chamber facilitates maintenance, repair, and replacement by personnel, without affecting the working environment inside the temperature-controlled chamber, and also reduces potential safety hazards associated with operations within the temperature-controlled chamber.

[0041] Please see Figure 1 and Figure 3 In some embodiments, the temperature controller 31 is used to regulate the liquid temperature within the first temperature control chamber 204. This allows for real-time control of the liquid temperature within the chamber by adjusting the chamber wall temperature based on the actual temperature within the chamber 204, providing a rapid response to temperature changes, particularly suitable for situations requiring frequent temperature adjustments. Furthermore, it eliminates the need to consider heat dissipation issues during long-distance pipeline transport, avoiding temperature fluctuations caused by pipeline heat dissipation and enabling more direct control of the liquid temperature within the temperature control chamber.

[0042] Optionally, the diffusion chamber 20 further includes a third housing 23, which surrounds at least a portion of the second housing 22. Specifically, the third housing 23 may completely surround the second housing 22, such that the second housing 22 is entirely located within the third housing 23, or it may partially surround the second housing 22, with the second housing 22 partially exposed outside the third housing 23. No limitation is made here. A second temperature control cavity 205 is formed between the third housing 23 and the second housing 22, and a temperature controller 31 is disposed within the second temperature control cavity 205. Thus, the temperature controller 31 can heat the liquid in the first temperature control cavity 204 by heating the second housing 22. This temperature controller 31 includes, but is not limited to, electric heating wires, heating tubes, infrared heaters, microwave heaters, etc.

[0043] Please see Figure 1 and Figure 4In some embodiments, to improve the temperature uniformity within the first temperature control cavity 204, a fourth housing 24 is further provided between the second housing 22 and the first housing 21. The fourth housing 24 divides the first temperature control cavity 204 into a first gas cavity 2041 and a liquid cavity 2042. The first gas cavity 2041 is formed between the fourth housing 24 and the first housing 21, and the liquid cavity 2042 is formed between the fourth housing 24 and the second housing 22. The first gas cavity 2041 is filled with other materials, and the liquid cavity 2042 is filled with liquid. The gas in the first gas cavity 2041 can act as a heat buffer medium. When the temperature of the liquid in the liquid cavity 2042 fluctuates, the gas in the first gas cavity 2041 can absorb or release heat, mitigating the direct impact of temperature changes on the diffusion cavity 201, making the temperature changes in the diffusion cavity 201 more gradual, and thus improving temperature uniformity. Furthermore, the heat conduction of the gas is relatively uniform. When the gas in the first gas cavity 2041 is heated or cooled, it will transfer heat more evenly to the surface of the diffusion cavity 201 through heat conduction. Compared to directly contacting the liquid with the first housing 21, the first gas chamber 2041 avoids temperature unevenness caused by excessively fast or slow local heat conduction. Simultaneously, the gas in the first gas chamber 2041 can undergo natural convection. When the liquid in the liquid chamber 2042 heats the air in the first gas chamber 2041, the gas near the liquid chamber 2042 experiences a temperature increase and a decrease in density, causing it to rise; the gas near the diffuser chamber 201 has a relatively lower temperature and a higher density, causing it to fall, thus forming natural convection. This convection motion allows for a more uniform heat distribution within the first gas chamber 2041, thereby transferring heat more evenly to the diffuser chamber 201. The first gas chamber 2041 can be a closed chamber or equipped with a pressure regulating structure to adjust the gas pressure within it.

[0044] Please see Figure 1 and Figure 4In some embodiments, a fifth housing 25 is further provided between the third housing 23 and the second housing 22. The fifth housing 25 divides the second temperature control chamber into a mounting cavity 2052 and a second air cavity 2051. The second air cavity 2051 is formed between the second housing 22 and the fifth housing 25, and the mounting cavity 2052 is formed between the fifth housing 25 and the third housing 23. The temperature controller 31 is disposed in the mounting cavity 2052, and the second air cavity 2051 is filled with gas. Air is a medium with relatively low thermal conductivity. The second air cavity 2051 forms an air layer, which can act as a heat insulation layer, reducing the direct heat loss generated by the temperature controller 31. At the same time, it can also buffer the influence of the liquid temperature fluctuation in the buffer cavity 2042 on the temperature controller 31, making the liquid temperature more stable and helping to improve the uniformity and stability of the temperature in the diffusion chamber 20. In addition, due to the presence of the air layer, the second housing 22 and the third housing 23 can have a certain buffer space during thermal expansion and contraction, reducing the thermal stress caused by different thermal deformations, reducing the risk of equipment damage, and extending the service life of the equipment. Meanwhile, during equipment maintenance, the structural condition of the second housing 22 and the third housing 23 can be inspected more conveniently without worrying about liquid leakage or other issues interfering with inspection and maintenance. The second air chamber 2051 can be a sealed chamber or equipped with a pressure regulating structure to adjust the air pressure within it.

[0045] Please see Figure 1 and Figure 4 In some embodiments, the evaporation unit 100 further includes a sixth housing 40, which surrounds the diffusion chamber 20 and forms a third gas cavity 401 with the diffusion chamber 20. The third gas cavity 401 can be filled with gas. The thermal conductivity of gases is generally much lower than that of solid materials. Common gases such as air and nitrogen, in a static state, have a relatively slow rate of heat conduction through the gas. Therefore, the third gas cavity 401 can act as a thermal resistance layer, reducing heat transfer between the first temperature control cavity 204 and the external environment. In addition, the third gas cavity 401 can hinder direct convective heat transfer between the diffusion chamber 20 and the outside air, preventing heat on the surface of the diffusion chamber 20 from being rapidly transferred to the surrounding air through thermal convection. The presence of this third gas cavity 401 is equivalent to setting up a barrier between the diffusion chamber 20 and the outside air, making the thermal convection process more complex, requiring slow convection of the gas within the cavity to achieve heat transfer, thereby reducing the efficiency of thermal convection. Although the gas has a weak ability to absorb and emit thermal radiation, the gas in the diffusion chamber 20 can scatter and absorb some of the thermal radiation emitted from the diffusion chamber 20, reducing its direct radiative heat dissipation to the external environment. In addition, the presence of the third gas cavity 401 also increases the propagation path of thermal radiation, causing the radiated heat to be reflected and scattered multiple times within the gas cavity, further reducing the effectiveness of radiative heat dissipation.

[0046] Please see Figure 1 and Figure 4 In some embodiments, the evaporation unit 100 further includes a gas supply mechanism 50 connected to the first temperature control chamber 204. The gas supply mechanism 50 can introduce gas into the liquid within the first temperature control chamber 204. This gas can be a high-temperature gas. When the high-temperature gas is introduced into the liquid, it mixes with the liquid, increasing the convection current within the liquid. As the high-temperature gas rises, it drives the surrounding liquid to flow, making the heat transfer within the liquid more uniform, reducing local temperature differences, and thus improving the heat diffusion effect to a certain extent. This results in a more uniform temperature within the diffusion chamber 20, which is beneficial for improving the uniformity of the vapor deposition process.

[0047] In some embodiments, the cross-sectional dimension of the diffusion cavity 201 is smaller than that of the heating cavity 101. When the hot airflow in the heating cavity 101 enters the diffusion cavity 201, the cross-sectional width of the diffusion cavity 201 decreases, and according to the principle of fluid continuity, the cross-sectional area of ​​the airflow decreases, resulting in a lower airflow velocity. The slower airflow carries relatively less heat, and the heat exchange efficiency with the substrate 92 surface is also reduced. Simultaneously, the lower airflow velocity also helps reduce thermal shock to the substrate 92 surface, making the temperature rise of the substrate 92 more gradual and thus helping to suppress a rapid temperature rise in the substrate 92.

[0048] Please see Figure 1 and Figure 2 In some embodiments, the first housing 21 includes a housing body 211, a connecting pipe 212, and an ejector pipe 213. The housing body 211 has a diffusion cavity 201. The connecting pipe 212 and the ejector pipe 213 are both connected to the housing body 211. The connecting pipe 212 forms a second connecting hole 202, and the ejector pipe 213 forms a spray hole 203. The second housing 22 has an inner cavity. The housing body 211 is disposed in the inner cavity and divides the inner cavity into the diffusion cavity 201 and the first temperature control cavity 204. The connecting pipe 212 extends out of the inner cavity and is connected to the first connecting hole 102. The ejector pipe 213 extends out of the inner cavity and is connected to the external space. That is, the second housing 22 encloses the entire diffusion cavity 201 to achieve uniform heating or cooling of the gaseous material in the diffusion cavity 201. The cross-sectional dimensions of the second connecting hole 202 and the ejection hole are both smaller than those of the diffusion cavity 201. The smaller inlet and outlet lengthens the residence time of the airflow in the diffusion chamber 20, increases the heat exchange path between the airflow and the wall of the diffusion chamber 20 and the heating element, thereby improving the heat exchange efficiency and making the temperature in the diffusion cavity 201 more uniform and stable. This is beneficial for accurately controlling the temperature of the substrate 92 and improving the quality of the vapor-deposited film.

[0049] Optionally, the connecting pipe 212 and the ejector pipe 213 are arranged facing each other in the vertical direction. The airflow can form a relatively regular flow path in the diffusion cavity 201, flowing vertically upward from the second connecting hole 202 to the diffusion hole, which helps to reduce the deflection and turbulence of the airflow, making the airflow more evenly distributed in the diffusion cavity 201, thereby improving the uniformity of parameters such as temperature and concentration of the gaseous material in the diffusion cavity 201.

[0050] Optionally, the shell body 211 is spaced apart from the cavity wall of the inner cavity so that the shell body 211 can be completely surrounded by fluid, thereby allowing the diffusion cavity 201 to be heated or cooled by the fluid in a comprehensive and uniform manner.

[0051] Please see Figure 5 and Figure 6 In some embodiments, the first housing 21 includes multiple housing bodies 211, with connecting pipes and spray pipes all connected to the multiple housing bodies 211, and all housing bodies 211 are disposed within the inner cavity. The arrangement of multiple housing bodies 211 increases the contact area between the high-temperature fluid and the first housing 21, resulting in more uniform heat transfer. Each housing body 211 can absorb heat relatively uniformly, thereby reducing temperature gradients and avoiding localized overheating or overcooling, which is beneficial for improving the quality of processes such as vapor deposition, and making the performance of products such as thin films on the substrate 92 more stable and consistent. Furthermore, the gaseous material discharged from the heating chamber 101 is introduced into the multiple housing bodies 211 through connecting pipes 212, allowing the gaseous material to diffuse within different diffusion chambers 201, effectively increasing the path and space for gas diffusion. After multiple diffusions and mixing in multiple diffusion chambers, the gaseous material converges and flows out in the diffusion pipe, enabling a more uniform distribution of the components in the gaseous material, improving the diffusion efficiency and uniformity. The number of housing bodies 211 can be flexibly adjusted according to process requirements.

[0052] Optionally, the two adjacent shell bodies 211 are spaced apart to further increase the contact area between the first shell 21 and the fluid in the first temperature control cavity 204, thereby improving the temperature uniformity and stability of the gaseous material in each diffusion cavity 201.

[0053] Please see Figure 5In some embodiments, the cross-sectional size of the diffusion cavity 201 first increases and then decreases along the direction from the connecting pipe to the injection pipe, that is, the diffusion cavity 201 first expands and then contracts along the gas flow direction. In the initial stage when the gaseous material enters the diffusion cavity 201 through the second connecting hole 202, the increasing cross-sectional size of the diffusion cavity 201 provides a larger space for the gaseous particles, allowing them to move freely, collide with each other, and collide with the cavity wall. This gradually expanding space is conducive to the diffusion and mixing of particles in the initial stage, allowing gaseous particles with different velocities and directions entering from the heating cavity 101 to be initially homogenized in a more relaxed environment, laying the foundation for further mixing. As the cross-sectional size of the diffusion cavity 201 decreases, the flow channel of the gaseous material narrows, the density of gaseous particles increases, and the collision frequency increases significantly. According to the theory of gas kinetics, in a narrow space, collisions between particles and between particles and the cavity wall are more frequent, which makes the particle motion direction and velocity more diverse, thereby further enhancing the mixing effect. Meanwhile, the shrinkage section of the diffuser 201 has a certain compression effect on the gaseous material, which will increase the gas flow speed. This accelerated flow also helps the gas in different regions to mix fully.

[0054] Please see Figure 6 In some embodiments, the diffuser cavity 201 has a circular cross-section. The regular geometry of a circular cross-section makes it easier to ensure precision and surface quality during manufacturing, and the cost is relatively low. Furthermore, the circular cross-section ensures more uniform flow resistance in all directions during vertical gas flow, reducing the likelihood of significant deflection or turbulence and maintaining a more stable flow state, which is beneficial for precise control and simulation of gas flow. Simultaneously, when gas flows within the circular cross-section diffuser cavity 201, the pressure distribution on the cavity wall is relatively uniform. This helps reduce the risk of deformation or damage to the cavity wall due to excessive local pressure, improving the structural strength and stability of the diffuser cavity 201 and extending its service life.

[0055] Please see Figure 7In some embodiments, the diffuser cavity 201 has an elliptical cross-section. Compared to a circular cross-section, an elliptical cross-section expands the space along its major axis, allowing more space for gas to flow vertically. This increases the longitudinal space of the gas flow, providing a longer flow path and increasing the contact time and interaction opportunities between the gas and its surroundings. This is beneficial for gas diffusion and mixing in the vertical direction, improving process efficiency. Furthermore, the larger longitudinal space facilitates the formation of a significant vertical temperature or concentration gradient, promoting gas convection. The natural convection phenomenon of hot gas rising and cold gas sinking is more likely to occur in the elliptical cross-section diffuser cavity 201. This convection further enhances the vertical mixing effect, resulting in more uniform gas composition and temperature. Meanwhile, the elliptical cross-section has different dimensions along its major and minor axes. After entering the diffusion chamber 201, the gas is more restricted along the minor axis, resulting in a relatively narrow flow space, increased airflow velocity, obstructed gas flow, and relatively high pressure. The curvature along the minor axis is greater, leading to a thicker boundary layer and greater obstruction of airflow. Conversely, along the major axis, the space is relatively open, the airflow velocity is relatively slower, the pressure is relatively lower, the curvature is smaller, and the boundary layer is thinner, resulting in less obstruction of airflow. Therefore, the gas tends to diffuse along the major axis, guiding its vertical flow with a certain degree of directional bias. In other words, the asymmetry of the elliptical cross-section can provide some directional guidance for vertically flowing gas, making it more inclined to flow along a specific path within the diffusion chamber 201. This enhances gas movement in the vertical direction, improves diffusion efficiency, and meets process requirements with strict demands on gas diffusion direction and uniformity.

[0056] Please see Figure 2 In some embodiments, the horizontal height of the discharge port 204b is greater than the horizontal height of the inlet port 204a. This way, after the fluid enters the first temperature control chamber 204 through the inlet port 204a, it will converge from bottom to top within the first temperature control chamber 204, preventing insufficient filling of the first temperature control chamber 204 and facilitating proper fluid filling.

[0057] In some embodiments, the evaporation source 200 includes a plurality of evaporation units 100 arranged side by side in a horizontal direction. This reduces differences in evaporation rates caused by vertical temperature gradients or uneven heating, making the evaporation conditions of each evaporation unit 100 more consistent, thereby improving the stability and repeatability of the evaporation process. In addition, the gas generated by each evaporation unit 100 can diffuse relatively independently and uniformly, avoiding mutual interference and helping to improve the uniformity of the distribution of the evaporated substance throughout the system.

[0058] Optionally, the diffusion chambers 20 of the multiple evaporation units 100 are arranged at intervals, so that an air gap is formed between two adjacent diffusion chambers 20 to prevent the temperature of different diffusion chambers 20 from affecting each other, causing the temperature inside the diffusion chamber 20 to rise and affect the film formation of the substrate 92.

[0059] The above descriptions are merely several specific embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention, as well as other specific embodiments of the present invention that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present invention.

Claims

1. An evaporation unit, characterized in that, include: A heating chamber includes a heating shell, a crucible, and a heating element. The heating shell has a heating cavity and a first communicating hole that communicates with the heating cavity. The crucible is disposed in the heating cavity, and the heating element is used to heat the crucible. A diffusion chamber includes a first housing and a second housing. The first housing is connected to the heating housing and forms a diffusion cavity, a second connecting hole, and a jet hole. The second connecting hole connects to the diffusion cavity and is connected to the first connecting hole. The jet hole is connected to the diffusion cavity and is connected to the external space. The second housing surrounds at least a portion of the first housing. A first temperature control cavity, an inlet hole, and an outlet hole are formed between the second housing and the first housing. The inlet hole and the outlet hole are both connected to the first temperature control cavity. A temperature control mechanism includes a temperature controller, a storage chamber, and a power source. The storage chamber has a storage cavity connected to the inlet and the outlet. The storage cavity is used to store a high-temperature fluid. The temperature controller is used to control the temperature of the high-temperature fluid within a preset range. The power source is used to direct the fluid in the storage cavity into the temperature control cavity through the inlet and out through the outlet.

2. The evaporation unit as described in claim 1, characterized in that, The temperature controller is used to regulate the fluid temperature in the first temperature control chamber.

3. The evaporation unit as described in claim 1, characterized in that, The diffusion chamber further includes a third housing that surrounds at least a portion of the second housing, and a second temperature control cavity is formed between the third housing and the second housing, with the temperature controller disposed within the second temperature control cavity.

4. The evaporation unit as described in claim 1, characterized in that, The diffusion chamber further includes a fourth housing, which is disposed between the second housing and the first housing. A first gas cavity for filling gas is formed between the fourth housing and the first housing, and a liquid cavity for filling liquid is formed between the fourth housing and the second housing. Both the inlet and the outlet are connected to the liquid cavity.

5. The evaporation unit as described in claim 3, characterized in that, The diffusion chamber further includes a fifth housing, which is disposed between the second housing and the third housing. A second gas cavity for filling gas is formed between the fifth housing and the second housing, and an installation cavity is formed between the fifth housing and the third housing. The temperature controller is disposed in the installation cavity.

6. The evaporation unit as described in claim 1, characterized in that, The fluid includes a liquid, and the evaporation unit further includes a gas supply mechanism connected to the first temperature control chamber, which can introduce gas into the liquid in the first temperature control chamber.

7. The evaporation unit as described in claim 1, characterized in that, The first housing includes a housing body, a connecting pipe, and an ejector pipe. The housing body has the diffusion cavity. The connecting pipe and the ejector pipe are both connected to the housing body. The connecting pipe forms the second communicating hole, and the ejector pipe forms the injection hole. The second housing has an inner cavity. The housing body is disposed in the inner cavity and divides the inner cavity into the diffusion cavity and the first temperature control cavity. The connecting pipe extends out of the inner cavity and is connected to the first communicating hole. The ejector pipe extends out of the inner cavity and is connected to the external space.

8. The evaporation unit as described in claim 7, characterized in that, The first housing includes multiple housing bodies, and the connecting pipe and the injection pipe are all connected to the multiple housing bodies, and the multiple housing bodies are all disposed in the inner cavity.

9. An evaporation source, characterized in that, It includes at least one evaporation unit as described in any one of claims 1 to 8, and a plurality of the evaporation units are arranged side by side in a horizontal direction.

10. A vapor deposition apparatus, characterized in that, It includes a housing and an evaporation source as described in claim 9, wherein the housing has a vapor deposition chamber and the evaporation source is disposed within the vapor deposition chamber.

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