An evaporation apparatus having a cleaning device

Abstract

The embodiment of the present application provides a kind of evaporation equipment with cleaning device, and the evaporation chamber in the evaporation equipment with cleaning device is equipped with cleaning device, and cleaning device includes support, scraper assembly and driving mechanism, scraper assembly is movably connected to support, the fixed end of driving mechanism is connected to support, scraper assembly is drivingly connected with the output end of driving mechanism, scraper assembly can be moved to the position of nozzle under the driving of driving mechanism, to make scraper assembly scrape the evaporation material of the surface of spout and go away.Since the evaporation equipment is equipped with cleaning device, the evaporation material of the surface of spout can be scraped by scraper assembly in cleaning device, so that evaporation material is not easy to accumulate on the surface of spout, reduce the possibility of spout being blocked by evaporation material, so that nozzle can be well into evaporation chamber into evaporation gas, so that evaporation gas in evaporation chamber can be well acted on substrate, it is favorable to improve the quality of evaporation process.

Description

Technical Field

[0001] This application relates to the field of display device manufacturing technology, and in particular to a vapor deposition apparatus with a cleaning device. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] As people's living standards improve, their requirements for the quality of display devices are also increasing. Evaporation deposition, as a crucial manufacturing process in display devices, has a significant impact on their quality. Summary of the Invention

[0004] This application provides a vapor deposition apparatus with a cleaning device, which aims to improve the quality of the vapor deposition process.

[0005] An embodiment of the first aspect of this application provides a vapor deposition apparatus with a cleaning device. This apparatus includes a vaporization device, a vapor deposition chamber, a nozzle, a support device, and a cleaning device. The vaporization device is used to form vapor deposition gas from the vapor deposition material. The vapor deposition chamber is used to contain the vapor deposition gas. The nozzle is disposed in the vapor deposition chamber and communicates with the vaporization device. The nozzle has an outlet for introducing the vapor deposition gas into the vapor deposition chamber. The support device is disposed in the vapor deposition chamber and is used to support the substrate. The cleaning device is disposed in the vapor deposition chamber and includes a support, a scraper assembly, and a drive mechanism. The scraper assembly is movably connected to the support. The fixed end of the drive mechanism is connected to the support. The scraper assembly is drively connected to the output end of the drive mechanism. The scraper assembly can move to the position of the nozzle under the drive of the drive mechanism, so that the scraper assembly scrapes away the vapor deposition material on the surface of the nozzle outlet. Due to the temperature difference between the nozzle and the vaporization device, the vapor deposition gas introduced into the vapor deposition chamber by the nozzle will accumulate on the surface of the nozzle. The vapor deposition material adhering to the surface of the nozzle outlet can easily clog the outlet. In the above structure, since the vapor deposition equipment is equipped with a cleaning device, the scraper assembly in the cleaning device can scrape off the vapor deposition material on the surface where the nozzle is located, so that the vapor deposition material is not easy to accumulate on the surface where the nozzle is located, reducing the possibility of the nozzle being blocked by the vapor deposition material, so that the nozzle can effectively introduce vapor deposition gas into the vapor deposition chamber, and so that the vapor deposition gas in the vapor deposition chamber can effectively act on the substrate, which is beneficial to improving the quality of the vapor deposition process.

[0006] According to some embodiments of this application, the vapor deposition equipment with a cleaning device further includes an image acquisition mechanism and an image processing module. The image acquisition mechanism is disposed in the vapor deposition chamber and is used to acquire images of the surface where the nozzle is located. The image processing module is communicatively connected to the image acquisition mechanism and is used to convert the information of the image into the amount of vapor deposition material on the surface where the nozzle is located.

[0007] According to some embodiments of this application, the vapor deposition apparatus with a cleaning device further includes a first controller, which is communicatively connected to the image processing module and the cleaning device. When the amount of vapor deposition material on the surface of the nozzle is greater than or equal to a first preset value, the first controller can control the drive mechanism to move the scraper assembly to the nozzle position and control the scraper assembly to scrape off the vapor deposition material on the surface of the nozzle.

[0008] According to some embodiments of this application, the vapor deposition apparatus with a cleaning device further includes a light-emitting unit for emitting light onto the surface where the nozzle is located.

[0009] According to some embodiments of this application, the vapor deposition apparatus with a cleaning device includes a scraper assembly comprising a support, a scraper, and a first driver. The support is movably connected to a bracket, the first driver is connected to the support, and the scraper is drivenly connected to the output shaft of the first driver.

[0010] According to some embodiments of this application, the vapor deposition apparatus with a cleaning device has the central axis of the output shaft coinciding with the central axis of the nozzle when the scraper assembly is moved to the position of the nozzle; the scraper rotates under the drive of the output shaft to scrape off the vapor deposition material on the surface of the nozzle.

[0011] According to some embodiments of this application, the vapor deposition equipment with a cleaning device is provided on the support, the support is slidably connected to the slide rail, and the output end of the drive mechanism is drivenly connected to the support.

[0012] According to some embodiments of this application, the vapor deposition apparatus with a cleaning device includes a scraper assembly that further includes an adjustment structure. The adjustment structure is movably connected to the support in a direction perpendicular to the surface where the nozzle is located, and a first driver is fixed to the adjustment structure.

[0013] According to some embodiments of this application, a vapor deposition apparatus with a cleaning device is provided, and a pressure sensor is provided on the output shaft.

[0014] According to some embodiments of this application, the vapor deposition apparatus with a cleaning device includes a scraper assembly further comprising a second driver and a second controller. The second driver is connected to a support, and its output end is drivenly connected to an adjustment structure. The second controller is communicatively connected to the second driver and a pressure sensor. When the measured value of the pressure sensor is greater than or equal to a second preset value, the second controller can control the second driver to move the adjustment structure away from the nozzle. When the measured value of the pressure sensor is less than or equal to a third preset value, the second controller can control the second driver to move the adjustment structure closer to the nozzle, wherein the second preset value is greater than the third preset value.

[0015] The technical solutions provided by the embodiments of this application bring at least the following beneficial effects:

[0016] Some embodiments of this application provide a vapor deposition apparatus with a cleaning device. This apparatus includes a vaporization device, a vapor deposition chamber, a nozzle, a support device, and a cleaning device. The vaporization device is used to form vapor deposition gas from the vapor deposition material. The vapor deposition chamber is used to contain the vapor deposition gas. The nozzle is disposed in the vapor deposition chamber and communicates with the vaporization device. The nozzle has an outlet for introducing the vapor deposition gas into the vapor deposition chamber. The support device is disposed in the vapor deposition chamber and is used to support the substrate. The cleaning device is disposed in the vapor deposition chamber and includes a support, a scraper assembly, and a drive mechanism. The scraper assembly is movably connected to the support. The fixed end of the drive mechanism is connected to the support. The scraper assembly is drively connected to the output end of the drive mechanism. The scraper assembly can move to the nozzle position under the drive of the drive mechanism, so that the scraper assembly scrapes away the vapor deposition material on the surface of the nozzle. Due to the temperature difference between the nozzle and the vaporization device, the vapor deposition gas introduced into the vapor deposition chamber by the nozzle will accumulate on the surface of the nozzle. The vapor deposition material adhering to the surface of the nozzle's outlet can easily clog the outlet. In the above structure, since the vapor deposition equipment is equipped with a cleaning device, the scraper assembly in the cleaning device can scrape off the vapor deposition material on the surface where the nozzle is located, so that the vapor deposition material is not easy to accumulate on the surface where the nozzle is located, reducing the possibility of the nozzle being blocked by the vapor deposition material, so that the nozzle can effectively introduce vapor deposition gas into the vapor deposition chamber, and so that the vapor deposition gas in the vapor deposition chamber can effectively act on the substrate, which is beneficial to improving the quality of the vapor deposition process. Attached Figure Description

[0017] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0018] Figure 1 This is a schematic diagram of the internal structure of a vapor deposition apparatus with a cleaning device in one embodiment;

[0019] Figure 2This is a top view of a cleaning device and nozzle in a vapor deposition apparatus having a cleaning device in one embodiment;

[0020] Figure 3 This is a schematic diagram of a scraper assembly in a vapor deposition apparatus with a cleaning device, as described in one embodiment.

[0021] Figure 4 This is a top view of a scraper in a vapor deposition apparatus having a cleaning device, as described in one embodiment.

[0022] In the picture:

[0023] 1. Vaporization device; 2. Evaporation chamber; 3. Nozzle; 31. Nozzle opening; 32. Nozzle surface; 4. Support device; 5. Substrate; 6. Cleaning device; 61. Support; 62. Scraper assembly; 621. Support; 622. Scraper; 623. First driver; 624. Adjustment structure; 625. Second driver; 63. Drive mechanism; 7. Image acquisition mechanism; 8. Light-emitting unit; X, first direction; Y, second direction. Detailed Implementation

[0024] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0025] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] As OLED and LED-based flat panel display devices gain increasing attention for their advantages such as high image quality, energy saving, and thin body, they are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers. The application range of display panels is becoming wider and wider, and display panels have become the mainstream in display devices.

[0028] As the application scope of display panels continues to expand and people's quality of life continues to improve, the market demand for display panels is not only increasing, but the quality requirements for display panels are also becoming higher.

[0029] Evaporation deposition is used to form crucial thin film layers in display panels, especially in Organic Light Emitting Display (OLED) panels, where it plays a vital role in improving the quality and performance of the display panels. Improving the quality of the evaporation deposition process has always been a key research focus for those skilled in the art.

[0030] Vapor deposition is a physical vapor deposition technology that uses vapor deposition to form a vapor deposition gas by evaporating or sublimating a vapor deposition material. This vapor deposition gas then condenses on the substrate surface to form a thin film. For example, in vapor deposition equipment, the line source vapor deposition material is electrically heated from a solid state to a gaseous state. This gas then enters the vapor deposition chamber from the crucible under the guidance of a nozzle, diffuses and propagates within the chamber, and reaches the substrate surface, where it condenses to form a thin film.

[0031] However, due to the temperature difference between the bottom and top of the crucible and between the nozzle and the crucible, the vapor deposition gas tends to condense and adhere to the surface of the nozzle when it enters the vapor deposition chamber from the nozzle. As the vapor deposition material adheres and accumulates, the vapor deposition material accumulated on the surface of the nozzle orifice can easily affect the ability of the nozzle to pass vapor deposition gas. In severe cases, it can even block the nozzle. This not only causes uneven distribution of vapor deposition gas in the vapor deposition chamber, affecting the uniformity of the formed film and reducing the quality of the vapor deposition process, but also easily leads to waste of vapor deposition material and increases the cost of the vapor deposition process.

[0032] Currently, in order to reduce the impact of vapor deposition materials on nozzles, although sintering can be used to clean clogged nozzles in some cases, this requires downtime, which severely impacts production efficiency and schedule.

[0033] To ensure efficient introduction of vapor deposition gas into the vapor deposition chamber through the nozzle and improve the quality of the vapor deposition process, some embodiments of this application provide a vapor deposition apparatus with a cleaning device. This apparatus includes a vaporization device, a vapor deposition chamber, a nozzle, a support device, and a cleaning device. The vaporization device is used to generate vapor deposition gas from the vapor deposition material. The vapor deposition chamber contains the vapor deposition gas. The nozzle is disposed in the vapor deposition chamber and communicates with the vaporization device. The nozzle has an outlet for introducing the vapor deposition gas into the vapor deposition chamber. The support device is disposed in the vapor deposition chamber and supports the substrate. The cleaning device is disposed in the vapor deposition chamber and includes a support, a scraper assembly, and a drive mechanism. The scraper assembly is movably connected to the support. The fixed end of the drive mechanism is connected to the support. The scraper assembly is drively connected to the output end of the drive mechanism. The scraper assembly can move to the nozzle position under the drive of the drive mechanism, so that the scraper assembly scrapes away the vapor deposition material on the surface of the nozzle. In the above structure, since the vapor deposition equipment is equipped with a cleaning device, the scraper assembly in the cleaning device can scrape off the vapor deposition material on the surface where the nozzle is located, so that the vapor deposition material is not easy to accumulate on the surface where the nozzle is located, reducing the possibility of the nozzle being blocked by the vapor deposition material, so that the nozzle can effectively introduce vapor deposition gas into the vapor deposition chamber, and so that the vapor deposition gas in the vapor deposition chamber can effectively act on the substrate, which is beneficial to improving the quality of the vapor deposition process.

[0034] The vapor deposition equipment with a cleaning device described in this application is not only applicable to vapor deposition processes in display panels, but also to vapor deposition processes used in the production of other products. Those skilled in the art can choose according to the actual situation.

[0035] The technical solution of the vapor deposition equipment with a cleaning device provided in this application will be further described below with reference to the accompanying drawings and specific embodiments.

[0036] Some embodiments of this application provide a vapor deposition apparatus with a cleaning device, see reference. Figure 1The vapor deposition equipment with cleaning device 6 includes a vaporization device 1, a vapor deposition chamber 2, a nozzle 3, a support device 4, and a cleaning device 6. The vaporization device 1 is used to form vapor deposition gas from the vapor deposition material. The vapor deposition chamber 2 is used to contain the vapor deposition gas. The nozzle 3 is disposed in the vapor deposition chamber 2 and communicates with the vaporization device 1. The nozzle 3 has an outlet 31 for introducing the vapor deposition gas into the vapor deposition chamber 2. The support device 4 is disposed in the vapor deposition chamber 2 and is used to support the substrate 5. The cleaning device 6 is disposed in the vapor deposition chamber 2 and includes a support 61, a scraper assembly 62, and a drive mechanism 63. The scraper assembly 62 is movably connected to the support 61. The fixed end of the drive mechanism 63 is connected to the support 61. The scraper assembly 62 is driven by the drive mechanism 63 to move to the position of the nozzle 3 so that the scraper assembly 62 scrapes away the vapor deposition material on the surface 32 where the nozzle is located.

[0037] The vaporization device 1 can be a device for vaporizing the vapor deposition material to form vapor deposition gas. For example, the vaporization device 1 can melt and evaporate the vapor deposition material in the crucible by heating, which is applicable to low-melting-point materials such as gold, silver, and aluminum; the vaporization device 1 can also evaporate the vapor deposition material at high temperature by bombarding the vapor deposition material in the crucible with a high-energy electron beam, which is applicable to high-melting-point materials such as tungsten and silicon dioxide.

[0038] The vapor deposition chamber 2 can be a chamber structure in the vapor deposition equipment with cleaning device 6 that can provide a sealed space, so that the vapor deposition process can be carried out under low pressure (high vacuum), which can reduce the interference of gas molecules on the vapor deposition process. The vapor deposition chamber 2 is used to contain the vapor deposition gas, so that the vapor deposition gas can form a coating on the substrate 5 in a better manner in the vapor deposition chamber 2.

[0039] Nozzle 3 can be a device used to guide the vapor deposition gas into the vapor deposition chamber 2 and to ensure good transmission and diffusion of the vapor deposition gas in the vapor deposition chamber 2. Nozzle 3 is disposed in the vapor deposition chamber 2 and connected to the vaporization device 1, so that the vapor deposition gas generated by the vaporization device 1 can enter the vapor deposition chamber 2 through nozzle 3 and be transmitted in a straight line under the guidance of nozzle 3, and diffuse towards the surface of the substrate 5.

[0040] For example, refer to Figure 2 The nozzle 3 is provided in multiple groups, and each group of nozzles 3 includes multiple nozzles 3 arranged at equal intervals along the first direction X. The multiple groups of nozzles 3 are arranged at equal intervals along the second direction Y, so that the multiple nozzles 3 in the vapor deposition chamber 2 are evenly arranged, which is beneficial to improving the uniformity of the distribution of vapor deposition gas in the vapor deposition chamber 2.

[0041] The nozzle 31 can be an opening structure in the nozzle 3 for introducing vapor deposition gas into the vapor deposition chamber 2. During the process of the vapor deposition gas being introduced into the vapor deposition chamber 2 from the vaporization device 1 via the nozzle 3, it is affected by temperature differences and condenses to form particles that adhere to the surface of the nozzle 3. Vapor deposition material inevitably adheres to the surface 32 where the nozzle is located. With the continuous adhesion and accumulation of vapor deposition material, the accumulated vapor deposition material on the surface 32 where the nozzle is located can easily affect the ability of the nozzle 31 to allow vapor deposition gas to pass through.

[0042] The carrier device 4 can be a device for supporting the substrate 5. The carrier device 4 is disposed in the vapor deposition chamber 2 and can fix the substrate 5 and control the temperature of the substrate 5 so that the surface of the substrate 5 can be well coated.

[0043] The cleaning device 6 can be a device for cleaning the vapor-deposited material accumulated on the surface 32 where the nozzle is located. By cleaning the vapor-deposited material on the surface 32 where the nozzle is located, it reduces the possibility that the vapor-deposited material will affect the vapor-deposited gas passing through the nozzle 31.

[0044] By placing the cleaning device 6 in the vapor deposition chamber 2, the cleaning device 6 can clean the nozzles 3 located in the vapor deposition chamber 2.

[0045] The bracket 61 can be a frame structure for mounting the cleaning device 6, which supports and bears the weight and load of the cleaning device 6. The scraper assembly 62 can be a component mechanism including a scraper 622, which can directly act on the vapor-deposited material on the surface 32 where the nozzle is located, scraping the vapor-deposited material off the surface 32 where the nozzle is located. By movably connecting the scraper assembly 62 to the bracket 61, the scraper assembly 62 can move in the vapor deposition chamber 2, so that the scraper assembly 62 can act on the nozzles 3 located at different positions by changing its position, so as to scrape off the vapor-deposited material on the surface 32 where the nozzle is located. This allows one scraper assembly 62 to act on multiple nozzles 3 located at different positions, which helps to reduce the number of scraper assemblies 62 required and helps to reduce the cost of the cleaning device 6.

[0046] The drive mechanism 63 can be a mechanism for driving the scraper assembly 62 to move. By connecting the fixed end of the drive mechanism 63 to the bracket 61 and drivingly connecting the scraper assembly 62 to the output end of the drive mechanism 63, the drive mechanism 63 can drive the scraper assembly 62 to move along the bracket 61, so that the scraper assembly 62 can move to the position where the nozzle 3 to be cleaned is located, and thus the scraper assembly 62 can scrape off the vapor-deposited material on the surface 32 of the nozzle 3 where the nozzle orifice is located.

[0047] For example, the drive mechanism 63 may include a robotic arm with high flexibility and high precision, enabling the drive mechanism 63 to move the scraper assembly 62 to the location of the nozzle 3 that needs to be cleaned in a flexible and relatively accurate manner.

[0048] In the above structure, since the vapor deposition equipment is equipped with a cleaning device 6, the scraper assembly 62 in the cleaning device 6 can scrape off the vapor deposition material on the surface 32 where the nozzle is located, so that the vapor deposition material is not easy to accumulate on the surface 32 where the nozzle is located, reducing the possibility of the nozzle 31 being blocked by the vapor deposition material, so that the nozzle 3 can effectively introduce vapor deposition gas into the vapor deposition chamber 2, and so that the vapor deposition gas in the vapor deposition chamber 2 can effectively act on the substrate 5, which is beneficial to improving the quality of the vapor deposition process.

[0049] In some embodiments, the vapor deposition apparatus with cleaning device 6 further includes an image acquisition mechanism 7 and an image processing module. The image acquisition mechanism 7 is disposed in the vapor deposition chamber 2 and is used to acquire images of the surface 32 where the nozzle is located. The image processing module is communicatively connected to the image acquisition mechanism 7 and is used to convert the information of the image into the amount of vapor deposition material on the surface 32 where the nozzle is located.

[0050] The image acquisition mechanism 7 can be a mechanism for acquiring images of the surface 32 where the nozzle is located in the nozzle 3. The image acquisition mechanism 7 is set in the vapor deposition chamber 2. Specifically, the image acquisition mechanism 7 is located in the vapor deposition chamber 2 and is connected to the support 61, so that the image acquisition mechanism 7 can obtain a relatively clear image of the surface 32 where the nozzle is located.

[0051] For example, the image acquisition mechanism 7 may include a charge-coupled device (CCD) image acquisition unit. The CCD image acquisition unit has advantages such as high sensitivity, strong light resistance, and low distortion, which is beneficial to improving the quality of the image acquired on the surface 32 where the nozzle is located, and to improving the accuracy of the amount of vapor-deposited material on the surface 32 where the nozzle is located obtained by the image processing module.

[0052] The pixel value range of the CCD image acquisition unit can be set to 30 million to 60 million, resulting in high-resolution images acquired by the image acquisition mechanism 7. In some embodiments, the pixel value of the image acquisition unit can be set to 40 million, 50 million, or 60 million, and those skilled in the art can set the pixel value of the image acquisition unit according to actual conditions. For example, setting the pixel value range of the image acquisition unit to 40 million to 50 million not only results in high-resolution images acquired by the image acquisition unit but also reduces the cost increase caused by using excessively high pixel values ​​of the image acquisition unit.

[0053] The image processing module can be an industrial control computer capable of numerical calculations, logical calculations, and storage / memory functions. The image processing module can store and run programs that identify the shapes of areas containing vapor-deposited material in the image, as well as programs that calculate the amount of vapor-deposited material in those areas. This allows the module to generate an estimate of the amount of vapor-deposited material on the nozzle surface 32 based on the image, enabling operators to promptly determine the amount of vapor-deposited material on the nozzle surface 32 and thus decide whether cleaning of a particular nozzle 3 is necessary.

[0054] For example, the calculation program stored and run in the image processing module to extract the shape of the region with vapor-deposited material in the image may include the Sobel operator; the calculation program stored and run in the image processing module to calculate the amount of vapor-deposited material in the region with vapor-deposited material may take advantage of the characteristic that different amounts of vapor-deposited material in the image correspond to different gray values.

[0055] By communicating with the image acquisition mechanism 7, the image processing module can process the image obtained by the image acquisition mechanism 7 in order to obtain the amount of vapor-deposited material on the surface 32 where the nozzle is located.

[0056] In some embodiments, the vapor deposition equipment with cleaning device 6 further includes a first controller, which is communicatively connected to the image processing module and the cleaning device 6. When the amount of vapor deposition material on the surface 32 where the nozzle is located is greater than or equal to a first preset value, the first controller can control the drive mechanism 63 to move the scraper assembly 62 to the position of the nozzle 3 and control the scraper assembly 62 to scrape off the vapor deposition material on the surface 32 where the nozzle is located.

[0057] The first controller can be a device used to receive signals from the image processing module and control the operation of the cleaning device 6. By communicating with the image processing module and the cleaning device 6, the first controller can control the cleaning device 6 to operate when the amount of vapor-deposited material on the nozzle surface 32 obtained by the image processing module is greater than or equal to a first preset value. This causes the scraper assembly 62 to move to the position of the nozzle 3 (the nozzle 3 to be cleaned) where the amount of vapor-deposited material on the nozzle surface 32 is greater than or equal to the first preset value. The scraper assembly 62 can then clean the nozzle 3 to remove the vapor-deposited material on the nozzle surface 32, reducing the possibility of further accumulation of vapor-deposited material on the nozzle surface 32. This allows the vapor-deposited material on the nozzle surface 32 to be cleaned to be removed in a timely and automatic manner, which improves the automation level of the vapor deposition equipment of the cleaning device 6 in cleaning the nozzle 3 and reduces the labor intensity of the workers.

[0058] In some embodiments, the first controller may be a centralized or distributed controller. For example, the first controller may be a single microcontroller or may be composed of multiple distributed microcontrollers. The microcontroller may run a control program to control the cleaning device 6 to perform its functions.

[0059] In some embodiments, the vapor deposition apparatus having the cleaning device 6 further includes a light-emitting unit 8, which emits light onto the surface 32 where the nozzle is located.

[0060] The light-emitting unit 8 can be an optical device for emitting light outward. By emitting light onto the nozzle surface 32 through the light-emitting unit 8, the nozzle surface 32 can receive and reflect the light emitted by the light-emitting unit 8. This ensures that the light reflected from the nozzle surface 32 has sufficient intensity to be acquired by the image acquisition unit, which helps improve the accuracy of the image acquired by the image acquisition mechanism 7. In turn, it helps improve the accuracy of the amount of vapor-deposited material on the nozzle surface 32 obtained by the image processing module.

[0061] For example, the light-emitting unit 8 may include a lampshade and a light-emitting diode (LED), with the LED disposed inside the lampshade. The opening of the lampshade faces the surface 32 where the nozzle is located in the nozzle 3, and is used to supplement the light on the surface 32 where the nozzle is located. In some embodiments, multiple light-emitting units 8 may be provided so that the surface 32 where the nozzle is located in the nozzle 3 can obtain light of sufficient intensity.

[0062] In some embodiments, reference Figure 3 The scraper assembly 62 includes a support 621, a scraper 622, and a first driver 623. The support 621 is movably connected to the bracket 61, the first driver 623 is connected to the support 621, and the scraper 622 is drivenly connected to the output shaft of the first driver 623.

[0063] The support 621 can be a seat structure in the scraper assembly 62, which is used to provide a mounting seat for other components in the scraper assembly 62, so as to facilitate the support or load-bearing of other components in the scraper assembly 62, improve the structural integrity of the scraper assembly 62, and enable the components in the scraper assembly 62 to move synchronously along the bracket 61.

[0064] The scraper 622 can be a tool used to directly contact the surface 32 where the nozzle is located and scrape off the vapor-deposited material on the surface 32 where the nozzle is located. By connecting the first driver 623 to the support 621 and drivingly connecting the scraper 622 to the output shaft of the first driver 623, the scraper 622 can move under the drive of the first driver 623, so that the scraper 622 can act on the vapor-deposited material on the surface 32 where the nozzle is located, and scrape off the vapor-deposited material from the surface 32 where the nozzle is located.

[0065] The first driver 623 can be a driver that drives the scraper 622 to move, providing power for the movement of the scraper 622. For example, the first driver 623 can be an electric motor or a hydraulic motor, and those skilled in the art can choose according to the actual situation.

[0066] For example, refer to Figure 4 The scraper 622 can be configured as a blade with an arc-shaped blade, which can achieve a better cutting effect on the vapor-deposited material on the surface 32 where the nozzle is located.

[0067] In some embodiments, when the scraper assembly 62 is moved to the position of the nozzle 3, the central axis of the output shaft coincides with the central axis of the nozzle 3; the scraper 622 rotates under the drive of the output shaft to scrape off the vapor-deposited material on the surface 32 where the nozzle is located.

[0068] By aligning the central axis of the output shaft with the central axis of the nozzle 3 when the scraper assembly 62 is in the position of the nozzle 3, the output shaft extends in a direction perpendicular to the surface 32 where the nozzle is located. The output shaft can drive the scraper 622 to move along the surface 32 where the nozzle is located, so that the scraper 622 can easily scrape off the vapor-deposited material on the surface 32 where the nozzle is located under the drive of the first driver 623.

[0069] The scraper 622 rotates under the drive of the output shaft to scrape off the vapor-deposited material on the surface 32 where the nozzle is located. This allows the first driver 623 to be a servo motor that provides rotational power, enabling the first driver 623 to control the angle and speed of the scraper 622 more accurately, which is beneficial for the scraper 622 to effectively remove the vapor-deposited material on the surface 32 where the nozzle is located.

[0070] In some embodiments, the bracket 61 is provided with a slide rail, the support 621 is slidably connected to the slide rail, and the output end of the drive mechanism 63 is drively connected to the support 621.

[0071] The slide rail can be a component used to reduce the resistance encountered by the scraper assembly 62 during its movement relative to the bracket 61. By providing a slide rail on the bracket 61 and slidably connecting the support 621 to the slide rail, the support 621 can move on the bracket 61 by sliding.

[0072] By connecting the output end of the drive mechanism 63 to the support 621, the drive mechanism 63 can drive the support 621 to move smoothly on the bracket 61.

[0073] In some embodiments, the scraper assembly 62 further includes an adjustment structure 624, which is movably connected to the support 621 in a direction perpendicular to the surface 32 where the nozzle is located, and the first driver 623 is fixed to the adjustment structure 624.

[0074] The adjustment structure 624 can be a structure for adjusting the position of the scraper 622 relative to the nozzle surface 32 in a direction perpendicular to the nozzle surface 32. By setting the adjustment structure 624 to be movably connected to the support 621 in a direction perpendicular to the nozzle surface 32, and fixing the first driver 623 to the adjustment structure 624, the first driver 623 and the scraper 622 connected to the output shaft of the first driver 623 can move in a direction perpendicular to the nozzle surface 32, thereby enabling adjustment of the pressure exerted by the scraper 622 on the nozzle surface 32.

[0075] In some embodiments, a pressure sensor is provided on the output shaft.

[0076] The pressure sensor can be used to measure the pressure exerted by the scraper 622 on the nozzle surface 32. By mounting the pressure sensor on the output shaft and aligning the central axis of the output shaft with the central axis of the nozzle 3 when the scraper assembly 62 is in the position of the nozzle 3, the force measured by the pressure sensor is the pressure exerted by the scraper 622 on the nozzle surface 32. This allows the operator to promptly know the pressure applied to the nozzle surface 32 by the scraper 622 when scraping off the vapor-deposited material, and facilitates the operator to adjust the position of the scraper 622 in a direction perpendicular to the nozzle surface 32.

[0077] In some embodiments, the scraper assembly 62 further includes a second driver 625 and a second controller. The second driver 625 is connected to the support 621, and the output end of the second driver 625 is drivenly connected to the adjustment structure 624. The second controller is communicatively connected to the second driver 625 and the pressure sensor. When the measured value of the pressure sensor is greater than or equal to a second preset value, the second controller can control the second driver 625 to move the adjustment structure 624 away from the nozzle 3. When the measured value of the pressure sensor is less than or equal to a third preset value, the second controller can control the second driver 625 to move the adjustment structure 624 closer to the nozzle 3, where the second preset value is greater than the third preset value.

[0078] The second actuator 625 can be used to adjust the position of the scraper 622 in a direction perpendicular to the surface 32 where the nozzle is located. By fixing the second actuator 625 to the support 621 and drivingly connecting the output end of the second actuator 625 to the adjustment structure 624, the second actuator 625 can drive the scraper 622 to move in a direction perpendicular to the surface 32 where the nozzle is located, thereby moving the scraper 622 closer to or further away from the surface 32 where the nozzle is located.

[0079] For example, the second actuator 625 may be an electric lead screw, which can accurately control the distance by which the scraper 622 approaches or moves away from the surface 32 where the nozzle is located in a direction perpendicular to the surface 32 where the nozzle is located, so as to accurately adjust the pressure applied by the scraper 622 to the surface 32 where the nozzle is located.

[0080] The second controller can be a device used to receive signals from the pressure sensor and control the operation of the second driver 625. By communicating with the second controller, the second driver 625, and the pressure sensor, the second controller can control the second driver 625 to move the adjustment structure 624 away from the nozzle 3 when the pressure sensor's measured value (the pressure exerted by the scraper 622 on the nozzle surface 32) is greater than or equal to a second preset value. This reduces the pressure exerted by the scraper 622 on the nozzle surface 32. Furthermore, the second controller can control the second driver 625 to move the adjustment structure 624 closer to the nozzle 3 when the pressure sensor's measured value (the pressure exerted by the scraper 622 on the nozzle surface 32) is less than or equal to a third preset value. This increases the pressure exerted by the scraper 622 on the nozzle surface 32, maintaining the pressure between the second and third preset values. This not only prevents the scraper 622 from damaging the nozzle 3 due to excessive pressure but also prevents the scraper 622 from reducing the removal efficiency of the vapor-deposited material due to insufficient pressure on the nozzle 3.

[0081] While this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A vapor deposition apparatus with a cleaning device, characterized in that, include: A vaporization device used to generate vapor deposition gas from vapor deposition materials; A vapor deposition chamber for containing the vapor deposition gas; A nozzle is disposed in the vapor deposition chamber and communicates with the vaporization device. The nozzle is provided with an outlet for introducing the vapor deposition gas into the vapor deposition chamber. A support device is disposed in the vapor deposition chamber and is used to support the substrate; A cleaning device is disposed in the vapor deposition chamber. The cleaning device includes a support, a scraper assembly, and a drive mechanism. The scraper assembly is movably connected to the support, and the fixed end of the drive mechanism is connected to the support. The scraper assembly is driven by the output end of the drive mechanism. The scraper assembly can move to the position of the nozzle under the drive of the drive mechanism so that the scraper assembly scrapes away the vapor deposition material on the surface of the nozzle.

2. The vapor deposition equipment with a cleaning device according to claim 1, characterized in that, The vapor deposition equipment with a cleaning device further includes an image acquisition mechanism and an image processing module. The image acquisition mechanism is disposed in the vapor deposition chamber and is used to acquire images of the surface where the nozzle is located. The image processing module is communicatively connected to the image acquisition mechanism and is used to convert the information of the image into the amount of vapor deposition material on the surface where the nozzle is located.

3. The vapor deposition equipment with a cleaning device according to claim 2, characterized in that, The vapor deposition equipment with a cleaning device further includes a first controller, which is communicatively connected to the image processing module and the cleaning device. When the amount of vapor deposition material on the surface where the nozzle is located is greater than or equal to a first preset value, the first controller can control the drive mechanism to move the scraper assembly to the position of the nozzle and control the scraper assembly to scrape off the vapor deposition material on the surface where the nozzle is located.

4. The vapor deposition equipment with a cleaning device according to claim 2, characterized in that, The vapor deposition equipment with a cleaning device also includes a light-emitting unit, which is used to emit light onto the surface where the nozzle is located.

5. The vapor deposition equipment with a cleaning device according to claim 1, characterized in that, The scraper assembly includes a support, a scraper, and a first driver. The support is movably connected to the bracket, the first driver is connected to the support, and the scraper is drivenly connected to the output shaft of the first driver.

6. The vapor deposition equipment with a cleaning device according to claim 5, characterized in that, When the scraper assembly is moved to the position of the nozzle, the central axis of the output shaft coincides with the central axis of the nozzle; the scraper rotates under the drive of the output shaft to scrape off the vapor-deposited material on the surface of the nozzle.

7. The vapor deposition equipment with a cleaning device according to claim 5, characterized in that, The bracket is provided with a slide rail, the support is slidably connected to the slide rail, and the output end of the drive mechanism is drivenly connected to the support.

8. The vapor deposition equipment with a cleaning device according to claim 5, characterized in that, The scraper assembly further includes an adjustment structure, which is movably connected to the support in a direction perpendicular to the surface where the nozzle is located, and the first driver is fixed to the adjustment structure.

9. The vapor deposition equipment with a cleaning device according to claim 8, characterized in that, A pressure sensor is installed on the output shaft.

10. The vapor deposition equipment with a cleaning device according to claim 9, characterized in that, The scraper assembly further includes a second driver and a second controller. The second driver is connected to the support, and the output end of the second driver is driven to the adjustment structure. The second controller is communicatively connected to the second driver and the pressure sensor. When the measured value of the pressure sensor is greater than or equal to a second preset value, the second controller can control the second driver to move the adjustment structure away from the nozzle; when the measured value of the pressure sensor is less than or equal to a third preset value, the second controller can control the second driver to move the adjustment structure closer to the nozzle, wherein the second preset value is greater than the third preset value.

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