Evaporation apparatus, display panel and preparation method thereof

Abstract

The application discloses an evaporation equipment, a display panel and a preparation method thereof. The evaporation equipment comprises an evaporation source and an angle limiting plate. The evaporation source comprises at least one nozzle, and is used for spraying cathode evaporation material to one side of a substrate in a display panel through the nozzle to form a cathode on the one side of the substrate. The display panel further comprises an isolation structure on the one side of the substrate, and the cathode and the isolation structure are located on the same side of the substrate. The cathode overlaps the corresponding isolation structure. The angle limiting plate is located on one side of the evaporation source. The angle limiting plate is used for limiting the incident angle of the nozzle when spraying the cathode evaporation material, so as to limit the overlapping position of the cathode on the corresponding isolation structure. The incident angle is the angle between the edge of the spraying track formed when the nozzle sprays the cathode evaporation material and the surface where the exit port of the nozzle is located. The technical scheme of the application can accurately limit the overlapping position of the cathode on the isolation structure.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a vapor deposition apparatus, a display panel, and a method for preparing the same. Background Technology

[0002] With the development of display technology, organic light-emitting diodes (OLEDs) have become one of the most commonly used displays in electronic devices such as mobile phones, tablets, smart TVs, and smart wearable devices due to their advantages such as low power consumption, high brightness, wide viewing angle, and high contrast.

[0003] In the traditional display panel manufacturing process, materials are typically deposited into thin films using evaporation equipment, and the light-emitting elements are patterned using a fine metal mask (FMM). However, existing evaporation equipment has the problem of not being able to accurately control the position of the cathode in the light-emitting element. Summary of the Invention

[0004] This invention provides a vapor deposition apparatus, a display panel, and a method for preparing the same, to solve the problem that vapor deposition apparatus cannot accurately control the position of the cathode in the light-emitting element.

[0005] According to one aspect of the present invention, a vapor deposition apparatus is provided, the vapor deposition apparatus comprising:

[0006] A vapor deposition source; the vapor deposition source includes at least one nozzle, the vapor deposition source being used to spray cathode vapor deposition material onto one side of a substrate in a display panel through the nozzle to form a cathode on one side of the substrate; wherein, the display panel further includes an isolation structure located on one side of the substrate, the cathode and the isolation structure being located on the same side of the substrate; the isolation structure encloses an isolation opening, the cathode being at least partially located in the isolation opening, and the cathode overlapping with the corresponding isolation structure;

[0007] An angle limiting plate; the angle limiting plate is located on one side of the vapor deposition source; the angle limiting plate is used to limit the incident angle when the nozzle sprays the cathode vapor deposition material, so as to limit the overlap position of the cathode on the corresponding isolation structure; wherein, the incident angle is the angle between the edge of the spray trajectory formed when the nozzle sprays the cathode vapor deposition material and the surface where the nozzle outlet is located.

[0008] Optionally, the angle limiting plate includes at least one angle limiting opening, which is configured to correspond one-to-one with the nozzle. The nozzle is used to spray the cathode evaporation material through the angle limiting opening, and the angle limiting opening is used to limit the incident angle of the corresponding nozzle.

[0009] Optionally, the vapor deposition equipment further includes an emission port, through which the vapor deposition source is used to spray cathode vapor deposition material;

[0010] The angle limiting plate is located between the emission port and the vapor deposition source.

[0011] Optionally, the vapor deposition source further includes a vapor deposition crucible, and the nozzle is located on the vapor deposition crucible;

[0012] The orthographic projection of the nozzle on the vapor deposition crucible is located within the orthographic projection of the angle limiting opening on the vapor deposition crucible, such that the angle limiting opening at least limits the incident angle of the nozzle in a first direction and a second direction; wherein the first direction intersects the second direction; the first direction is the extension direction of the vapor deposition crucible;

[0013] Preferably, the vapor deposition source includes a plurality of nozzles, and the plurality of nozzles are arranged along the first direction;

[0014] The angle limiting plate includes a plurality of angle limiting openings, which are arranged along the first direction.

[0015] Optionally, during the formation of the cathode, the angle limiting plate moves synchronously with the evaporation source;

[0016] Preferably, the vapor deposition source and the angle limiting plate move along the second direction.

[0017] Optionally, the incident angle is greater than 0° and less than 90°;

[0018] Preferably, the incident angle is greater than or equal to 20° and less than or equal to 80°;

[0019] Preferably, the incident angle is greater than or equal to 20° and less than or equal to 70°.

[0020] Optionally, the angle-restricting opening is circular, rectangular, triangular, trapezoidal, or parallelogram-shaped;

[0021] Preferably, all the angle-restricting openings have the same shape, or at least two different angle-restricting openings have different shapes.

[0022] Optionally, the vapor deposition equipment does not include a fine metal mask.

[0023] According to another aspect of the present invention, a display panel is provided, the display panel comprising:

[0024] substrate;

[0025] The anode is located on one side of the substrate;

[0026] A pixel definition layer is located on one side of the substrate; the pixel definition layer includes pixel openings that expose at least a portion of the anode;

[0027] An isolation structure is located on the side of the pixel definition layer away from the substrate and is disposed around the pixel opening;

[0028] A light-emitting material layer is located on the surface of the anode away from the substrate; at least a portion of the light-emitting material layer is located within the pixel opening;

[0029] The cathode is located on the surface of the light-emitting material layer away from the substrate; the isolation structure encloses and forms an isolation opening, the cathode is at least partially located in the isolation opening, and the cathode overlaps with the corresponding isolation structure; the cathode is formed by the vapor deposition equipment described in any embodiment of the present invention.

[0030] According to another aspect of the present invention, a method for manufacturing a display panel is provided, the method comprising:

[0031] Provide substrate;

[0032] An anode is formed on one side of the substrate;

[0033] A pixel definition layer is formed on one side of the substrate; the pixel definition layer includes pixel openings that expose at least a portion of the anode;

[0034] An isolation structure is formed on the side of the pixel definition layer away from the substrate; wherein the isolation structure is disposed around the pixel opening;

[0035] A light-emitting material layer is formed on the surface of the anode away from the substrate; wherein at least a portion of the light-emitting material layer is located at the pixel opening;

[0036] Using a vapor deposition apparatus as described in any embodiment of the present invention, a cathode is formed on the surface of the luminescent material layer away from the substrate; wherein the isolation structure encloses an isolation opening, the cathode is at least partially located in the isolation opening, and the cathode overlaps with the corresponding isolation structure.

[0037] The technical solution of this invention, by setting an angle limiting plate in the evaporation equipment, restricts the spray trajectory of the nozzle in the evaporation source, thereby limiting the incident angle of the nozzle and thus limiting the position of the sprayed cathode evaporation material on one side of the substrate. In this way, the size and position of the cathode can be limited, that is, the overlap position of the cathode on the isolation structure can be limited, ensuring that the cathode overlaps with the isolation structure, facilitating the connection of other conductive structures through the isolation structure. It also avoids direct connection between two adjacent cathodes. This allows the evaporation equipment to accurately control the position of the cathode in the light-emitting element.

[0038] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a structural schematic diagram of a vapor deposition machine in related technologies;

[0041] Figure 2 This is a schematic diagram of the structure of a vapor deposition equipment provided in an embodiment of the present invention;

[0042] Figure 3 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention;

[0043] Figure 4 This is a partial schematic diagram of a vapor deposition source provided in an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram of another vapor deposition device provided in an embodiment of the present invention;

[0045] Figure 6 This is a front view of a vapor deposition apparatus provided in an embodiment of the present invention;

[0046] Figure 7 This is a side view of a vapor deposition apparatus provided in an embodiment of the present invention;

[0047] Figure 8 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention;

[0048] Figure 9 This is a top view of a display panel provided in an embodiment of the present invention;

[0049] Figure 10 This is a schematic diagram of another display panel provided in an embodiment of the present invention;

[0050] Figure 11 This is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;

[0051] Figures 12-16 for Figure 11A schematic diagram of the display panel structure corresponding to each step in the process. Detailed Implementation

[0052] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0053] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0054] As mentioned in the background section, existing evaporation equipment suffers from the problem of inaccurately controlling the cathode position in the light-emitting element. The inventors discovered that this problem arises because existing evaporation machines include an evaporation source and a fine metal mask (FMM). The evaporation source deposits material onto the substrate of the display panel through the fine metal mask to form a patterned light-emitting layer. Because the fine metal mask has a tapered angle, the evaporation source needs a relatively large evaporation angle during deposition. Figure 1 This is a structural diagram of a vapor deposition machine in related technologies, such as... Figure 1 As shown, the vapor deposition machine includes an evaporation source 11 and two baffles 12. During vapor deposition, the evaporation source 11 deposits luminescent material onto one side of the substrate through the baffles 12, for example, forming one row of luminescent layers each time. The evaporation source 11 and the baffles 12 move along the scanning direction (Scan), which can form multiple rows of luminescent layers. However, the baffles 12 can only limit the evaporation angle of the evaporation source 11 in the scanning direction (Scan), and cannot limit the evaporation angle of the evaporation source 11 in multiple directions. Therefore, it is impossible to accurately control the position of the luminescent layer of the luminescent element deposited on the substrate, and it is also impossible to accurately control the position of the cathode of the luminescent element formed by vapor deposition.

[0055] To address the aforementioned technical problems, embodiments of the present invention provide a vapor deposition apparatus. Figure 2 This is a schematic diagram of the structure of a vapor deposition equipment provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention, for reference. Figure 2 and Figure 3 Evaporation equipment includes:

[0056] A vapor deposition source 100 is provided. The vapor deposition source 100 includes at least one nozzle 101. The vapor deposition source 100 is used to spray cathode vapor deposition material onto one side of the substrate 301 in the display panel 300 through the nozzle 101 to form a cathode 302 on one side of the substrate 301. The display panel 300 also includes an isolation structure 303 located on one side of the substrate 301. The cathode 302 and the isolation structure 303 are located on the same side of the substrate 301. The isolation structure 303 encloses an isolation opening A1. The cathode 302 is at least partially located in the isolation opening A1. The cathode 302 overlaps with the corresponding isolation structure 303.

[0057] An angle limiting plate 200; the angle limiting plate 200 is located on one side of the vapor deposition source 100; the angle limiting plate 200 is used to limit the incident angle when the nozzle sprays the cathode vapor deposition material, so as to limit the overlap position of the cathode 302 on the corresponding isolation structure 303; wherein, Figure 4 This is a partial schematic diagram of a vapor deposition source provided in an embodiment of the present invention, for reference. Figure 4 The incident angle α is the angle between the edge L1 of the spray trajectory formed when the nozzle 101 sprays the cathode vapor deposition material and the surface L2 where the nozzle 101 exits.

[0058] The vapor deposition source 100 contains cathode vapor deposition material. By heating the vapor deposition source 100, the cathode vapor deposition material is turned into vapor and ejected from the nozzle 101 of the vapor deposition source 100. The ejected vapor is transported and deposited on one side of the substrate 301 in the display panel 300, for example, on the surface of the light-emitting material layer of the light-emitting element in the display panel 300, forming a cathode 302, thereby facilitating the formation of the light-emitting element. The light-emitting element may include an organic light-emitting diode. The vapor deposition source 100 includes at least one nozzle 101, which can form at least one cathode 302. The isolation structure 303 in the display panel 300 can isolate adjacent cathodes 302, facilitating the provision of different voltages to the cathodes 302 of different light-emitting elements, thereby controlling the light emission sequence and brightness of different light-emitting elements. For example, patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe the relevant content of the isolation structure, which is provided for reference. The isolation structure 303 can separate the light-emitting material layer and the cathode in the light-emitting element, thereby making different light-emitting elements independent of each other, facilitating independent control of the light-emitting elements, and improving crosstalk between adjacent light-emitting elements, thus enhancing the display effect. Furthermore, the independence of adjacent light-emitting elements allows for independent packaging, improving packaging yield.

[0059] When the nozzle 101 sprays the cathode evaporation material, the spray trajectory of the nozzle 101 can form a conical shape. The edge L1 of the spray trajectory formed by the nozzle 101 when spraying the cathode evaporation material is the boundary of the conical shape formed by the spray trajectory of the nozzle 101.

[0060] Specifically, by setting an angle limiting plate 200, the spray trajectory of the nozzle 101 can be restricted, thereby limiting the incident angle α of the nozzle 101, and thus limiting the position of the cathode vaporized material sprayed by the nozzle 101 on one side of the substrate 301. In this way, the size and position of the cathode 302 can be restricted, that is, the overlap position of the cathode 302 on the isolation structure 303 can be limited. For example, within a certain angle range (e.g., 0° to 90°), the larger the incident angle α of the nozzle 101, the smaller the area of ​​the spray trajectory of the nozzle 101, resulting in a smaller area of ​​the formed cathode 302, and thus a smaller overlap area of ​​the cathode 302 on the isolation structure 303. Conversely, the smaller the incident angle α of the nozzle 101, the larger the area of ​​the spray trajectory of the nozzle 101, resulting in a larger area of ​​the formed cathode 302, and thus a larger overlap area of ​​the cathode 302 on the isolation structure 303. Therefore, by limiting the overlap position of the cathode 302 on the isolation structure 303 by the angle limiting plate 200, the size and position of the cathode 302 can be restricted. This prevents the cathode 302 from having a small area, ensuring that the cathode 302 overlaps with the isolation structure 303, facilitating the connection of the cathode 302 to other conductive structures (such as power lines) through the isolation structure 303. It also prevents the cathode 302 from having an excessively large area, thus preventing direct connection between adjacent cathodes 302. This allows the evaporation equipment to accurately control the position of the cathode 302 in the light-emitting element.

[0061] The technical solution of this embodiment, by setting an angle limiting plate in the evaporation equipment, can restrict the spray trajectory of the nozzle in the evaporation source, thereby limiting the incident angle of the nozzle and thus limiting the position of the sprayed cathode evaporation material on one side of the substrate. In this way, the size and position of the cathode can be limited, that is, the overlap position of the cathode on the isolation structure can be limited, ensuring that the cathode overlaps with the isolation structure, facilitating the connection of other conductive structures through the isolation structure. It also avoids direct connection between two adjacent cathodes. This allows the evaporation equipment to accurately control the position of the cathode in the light-emitting element.

[0062] Based on the above technical solutions, such as Figure 2 As shown, the angle limiting plate 200 includes at least one angle limiting opening 201, and the angle limiting opening 201 is arranged in a one-to-one correspondence with the nozzle 101. The nozzle is used to spray cathode evaporation material through the angle limiting opening 201, and the angle limiting opening 201 is used to limit the incident angle α of the corresponding nozzle 101.

[0063] Among them, the angle limiting plate 200 is a three-dimensional structure, that is, the angle limiting plate 200 has a certain thickness, so that the angle limiting opening 201 can better limit the spray trajectory of the nozzle 101.

[0064] Specifically, by setting an angle limiting opening 201, the nozzle 101 sprays cathode evaporation material through the angle limiting opening 201, so that the angle limiting opening 201 can limit the spray trajectory of the nozzle 101 in various directions, thereby limiting the incident angle α when the nozzle 101 sprays cathode evaporation material, and thus limiting the overlapping position of the cathode 302 on the corresponding isolation structure 303.

[0065] By setting the angle limiting opening 201 to correspond one-to-one with the nozzle 101, the spray trajectory of each nozzle 101 when spraying cathode evaporation material can be limited, thereby limiting the overlapping position of each cathode 302 on the isolation structure 303.

[0066] Based on the above technical solutions, Figure 5 This is a schematic diagram of another vapor deposition apparatus provided in an embodiment of the present invention. Optionally, refer to... Figure 5 The vapor deposition equipment also includes an emission port 202, and the vapor deposition source 100 is used to spray cathode vapor deposition material through the emission port 202;

[0067] Angle limiting plate 200 is located between emission port 202 and vapor deposition source 100.

[0068] Specifically, the vapor deposition equipment sprays cathode vapor deposition material onto one side of the substrate 301 through the emission port 202. Figure 5 The location of the emission port 202 is shown in the diagram, but its shape and size are not specified. By placing the angle limiting plate 200 between the emission port 202 and the vapor deposition source 100, that is, by placing the angle limiting plate 200 in the spray direction of the nozzle 101, the vapor deposition source 100 will pass through the angle limiting opening 201 of the angle limiting plate 200 when spraying the cathode vapor deposition material. This allows the angle limiting opening 201 to limit the spray trajectory of the nozzle 101 in various directions, thereby limiting the incident angle α when the nozzle 101 sprays the cathode vapor deposition material, and thus limiting the overlap position of the cathode 302 on the corresponding isolation structure 303.

[0069] Figure 6 This is a front view of a vapor deposition apparatus provided in an embodiment of the present invention. Figure 7 This is a side view of a vapor deposition apparatus provided in an embodiment of the present invention. Optionally, as shown... Figure 6 and Figure 7 As shown, the vapor deposition source 100 also includes a vapor deposition crucible 102, and the nozzle 101 is located on the vapor deposition crucible 102;

[0070] The orthographic projection of nozzle 101 onto vapor deposition crucible 102 is located within the orthographic projection of angle limiting opening 201 onto vapor deposition crucible 102, such that angle limiting opening 201 at least limits the incident angle α of nozzle 101 in the first direction X and the second direction Y; wherein the first direction X intersects the second direction Y; the first direction X is the extension direction of vapor deposition crucible 102.

[0071] Specifically, the vapor deposition crucible 102 is a strip-shaped crucible that can extend along the first direction X, facilitating the placement of multiple nozzles 101, thereby enabling the simultaneous fabrication of multiple cathodes 302. The vapor deposition crucible 102 holds cathode vapor deposition material. During the formation of the cathode 302, the vapor deposition crucible 102 is heated, causing the cathode vapor deposition material to turn into vapor, which is then ejected from the nozzles 101. The ejected vapor is transported and deposited on one side of the substrate 301 in the display panel 300, forming the cathode 302.

[0072] Optionally, such as Figure 6 and Figure 7 As shown, the vapor deposition source 100 includes multiple nozzles 101 arranged along a first direction X; the angle limiting plate 200 includes multiple angle limiting openings 201 arranged along the first direction X. This allows multiple nozzles 101 to simultaneously spray cathode vapor deposition material, thereby simultaneously generating multiple cathodes 302, improving preparation efficiency. The angle limiting plate 200, with its multiple angle limiting openings 201, ensures a one-to-one correspondence between the angle limiting openings 201 and the nozzles 101, thus limiting the spray trajectory of each nozzle 101 when spraying cathode vapor deposition material, and consequently limiting the overlap position of each cathode 302 on the isolation structure 303.

[0073] Optionally, during the formation of the cathode, the angle limiting plate 200 moves synchronously with the vapor deposition source 100.

[0074] Specifically, during the fabrication of all the cathodes 302 forming the display panel 300, for example, the display panel 300 is fixed, while the angle limiting plate 200 moves synchronously with the evaporation source 100, meaning the angle limiting plate 200 moves along with the evaporation source 100. For example, the angle limiting plate 200 and the evaporation source 100 are mounted on the same movable support, causing the movable support to drive the angle limiting plate 200 and the evaporation source 100 to move synchronously. Alternatively, the angle limiting plate 200 is mounted on the movable support, and the movable support and the evaporation source 100 move synchronously, thus achieving synchronous movement of the angle limiting plate 200 and the evaporation source 100. This allows for the formation of cathodes 302 multiple times, i.e., multiple rows or columns of cathodes 302 can be formed, facilitating the formation of multiple light-emitting elements arranged in an array.

[0075] Optionally, the vapor deposition source 100 and the angle limiting plate 200 move along the second direction Y.

[0076] Specifically, for example, the first direction X is the row direction of the display panel 300, and the second direction Y is the column direction of the display panel 300. The vapor deposition source 100 completes one deposition cycle through multiple nozzles 101, forming one row of cathodes 302. Then, the angle limiting plate 200 and the vapor deposition source 100 move along the second direction Y, and the vapor deposition source 100 completes one deposition cycle through multiple nozzles 101, forming the next row of cathodes 302. This process is repeated to form the cathodes 302 of the display panel 300 row by row. Alternatively, the first direction X is the column direction of the display panel 300, and the second direction Y is the row direction of the display panel 300. The vapor deposition source 100 completes one deposition cycle through multiple nozzles 101, forming one column of cathodes 302. Then, the angle limiting plate 200 and the vapor deposition source 100 move along the second direction Y, and the vapor deposition source 100 completes one deposition cycle through multiple nozzles 101, forming the next column of cathodes 302. This process is repeated to form the cathodes 302 of the display panel 300 column by column.

[0077] By setting the vapor deposition source 100 and the angle limiting plate 200 to move synchronously, the vapor deposition source 100 can limit the incident angle α of the nozzle 101 each time it sprays, thereby ensuring that the overlapping position of the cathode 302 on the isolation structure 303 is limited.

[0078] Based on the above technical solutions, the possible range of incident angle α will be described below, but this is not intended to limit this application.

[0079] Optionally, such as Figure 6 or Figure 7 As shown, the incident angle α is greater than 0° and less than 90°.

[0080] Specifically, an incident angle α less than 90° ensures that the nozzle 101 ejects the cathode evaporation material. An incident angle α greater than 0° prevents the cathode evaporation material ejected from all nozzles 101 from forming a cathode trace, thus preventing all cathodes 302 from being directly connected.

[0081] Optionally, such as Figure 6 or Figure 7 As shown, the incident angle α is greater than or equal to 20° and less than or equal to 80°. This avoids the cathode 302 having a small area, ensuring that the cathode 302 overlaps with the isolation structure 303, facilitating the connection of other conductive structures through the isolation structure 303. It also avoids the cathode 302 having an excessively large area, thus preventing direct connection between adjacent cathodes 302. This allows the evaporation equipment to accurately control the position of the cathode 302 in the light-emitting element.

[0082] Optionally, such as Figure 6 or Figure 7As shown, the incident angle α is greater than or equal to 20° and less than or equal to 70°. This further avoids the cathode 302 having a small area and further ensures that the cathode 302 overlaps with the isolation structure 303, facilitating the connection of other conductive structures through the isolation structure 303.

[0083] Based on the above technical solutions, the shape of the angle limiting opening 201 will be described below, but this is not intended to limit the scope of this application.

[0084] Optionally, such as Figure 2 or Figure 5 As shown, the angle-restricting opening 201 is circular, rectangular, triangular, trapezoidal, or parallelogram. That is, the cross-section of the angle-restricting opening 201 is circular, rectangular, triangular, trapezoidal, or parallelogram. In other words, the orthographic projection of the angle-restricting opening 201 onto the vapor deposition source 100 is circular, rectangular, triangular, trapezoidal, or parallelogram.

[0085] Specifically, by setting the angle limiting opening 201 to a circle, rectangle, triangle, trapezoid, or parallelogram (i.e., a closed shape), the spray trajectory of the nozzle 101 in all directions can be limited, thereby limiting the incident angle α of the nozzle 101 in all directions, achieving omnidirectional limitation, and thus limiting the position of the edge of the cathode 302 in all directions. This allows for precise limitation of the overlap position of the cathode 302 on the isolation structure 303, improving the accuracy of cathode 302 fabrication. Therefore, a single angle limiting plate 200 can limit the spray trajectory of each nozzle 101 in all directions, eliminating the need for multiple angle limiting plates 200 and other structures, thereby reducing the cost of the vapor deposition equipment and thus lowering the manufacturing cost of the display panel.

[0086] In some other embodiments, the angle limiting opening 201 may also be of other shapes. The specific shape of the angle limiting opening 201 can be set according to the actual shape of the cathode 302, that is, the angle limiting opening 201 changes with the required shape of the cathode 302, and this embodiment does not limit it.

[0087] Optionally, all angle-restricting openings 201 have the same shape, or at least two different angle-restricting openings 201 have different shapes.

[0088] In some embodiments, all angle-restricting openings 201 have the same shape, which makes the incident angle α when all nozzles 101 spray the cathode vapor deposition material the same, so that the overlap position of the formed cathode 302 on the isolation structure 303 is the same.

[0089] In other embodiments, at least two different angle limiting openings 201 have different shapes. That is, the shape of the angle limiting opening 201 can be set according to the different overlapping positions of the cathode 302 on the isolation structure 303, thereby limiting the incident angle α of the corresponding nozzle 101 according to the different overlapping positions of the cathode 302 on the isolation structure 303.

[0090] Optionally, the vapor deposition equipment does not include fine metal masks.

[0091] Specifically, the vapor deposition equipment provided in this embodiment can limit the incident angle α when the nozzle 101 sprays the cathode vapor deposition material by using the angle limiting plate 200, thereby adjusting the overlap position of the cathode 302 on the isolation structure 303. This achieves the limitation of the cathode 302's position, eliminating the need for patterning with a fine metal mask. Furthermore, the isolation structure 303 allows for the formation of multiple spaced light-emitting elements between the light-emitting material layer and the cathode without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel 300 and thus lowering the cost of the vapor deposition equipment.

[0092] This invention also provides a display panel. Figure 8 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention. Figure 9 This is a top view of a display panel provided in an embodiment of the present invention, with reference to... Figure 8 and Figure 9 The display panel 300 includes:

[0093] substrate 301;

[0094] Anode 304 is located on one side of substrate 301;

[0095] A pixel definition layer 305 is located on one side of the substrate 301; the pixel definition layer 305 includes a pixel opening A2, which exposes at least a portion of the anode 304;

[0096] An isolation structure 303 is located on the side of the pixel definition layer 305 away from the substrate 301 and is disposed around the pixel opening A2;

[0097] A light-emitting material layer 306 is located on the surface of the anode 304 away from the substrate 301; at least a portion of the light-emitting material layer 306 is located in the pixel opening A2;

[0098] The cathode 302 is located on the surface of the light-emitting material layer 306 away from the substrate 301; the isolation structure 303 encloses and forms an isolation opening A1, the cathode 302 is at least partially located in the isolation opening A1, and the cathode 302 overlaps with the corresponding isolation structure 303; the cathode 302 is formed by the vapor deposition equipment provided in any embodiment of the present invention.

[0099] The substrate 301 serves to support, protect, and buffer the light. The substrate 301 can be a flexible substrate or a rigid substrate, such as a glass substrate; this embodiment does not limit the type of substrate. The anode 304, the light-emitting material layer 306, and the cathode 302 are stacked to form a light-emitting element D1, which can be an organic light-emitting diode (OLED). By providing a pixel definition layer 305, the pixel opening A2 of the pixel definition layer 305 can define the size of the light-emitting element D1.

[0100] The shape of the isolation structure 303 can be trapezoidal, inverted trapezoidal, or T-shaped, etc., and this embodiment is not limited thereto. By setting the isolation structure 303, the isolation structure 303 can isolate the light-emitting material layer 306 and the cathode 302 in the light-emitting element D1, thereby making different light-emitting elements D1 independent of each other, improving crosstalk between adjacent light-emitting elements D1, and enhancing the display effect. Furthermore, the independence of adjacent light-emitting elements D1 allows for independent packaging, thereby improving the packaging yield.

[0101] Specifically, the cathode 302 is formed by a vapor deposition apparatus provided in any embodiment of the present invention. The vapor deposition apparatus includes a vapor deposition source 100 and an angle limiting plate 200. The angle limiting plate 200 can limit the spray trajectory of the cathode vapor deposition material sprayed by the nozzle 101 in the vapor deposition source 100, thereby limiting the incident angle α of the nozzle 101, and thus limiting the position of the sprayed cathode vapor deposition material on one side of the substrate 301. In this way, the size and position of the cathode 302 can be limited, that is, the overlap position of the cathode 302 on the isolation structure 303 can be limited. This avoids the cathode 302 having a small area, thus ensuring that the cathode 302 overlaps with the isolation structure 303, facilitating the connection of other conductive structures through the isolation structure 303. It also avoids the cathode 302 having an excessively large area, thereby preventing two adjacent cathodes 302 from being directly connected. This allows the vapor deposition apparatus to accurately control the position of the cathode 302 in the light-emitting element.

[0102] Optionally, the display panel 300 may also include a pixel circuit connected to the light-emitting element D1. The pixel circuit can provide driving current to the light-emitting element D1 to drive the light-emitting element D1 to emit light.

[0103] The pixel circuit can be a 2T1C pixel circuit or a variation thereof, or a 7T1C pixel circuit or a variation thereof. The 2T1C pixel circuit may include a driving transistor, a data writing transistor, and a storage capacitor. The 7T1C pixel circuit may include a driving transistor, a data writing transistor, a threshold compensation transistor, a first initialization transistor, a second initialization transistor, a first light-emitting control transistor, a second light-emitting control transistor, and a storage capacitor. The first initialization transistor can be connected to the anode 304 of the light-emitting element D1 to initialize the anode 304 of the light-emitting element D1.

[0104] Figure 10 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention. Optionally, as shown... Figure 10 As shown, the first initialization transistor T1 includes an active layer T11, a gate T12, a first electrode T13, and a second electrode T14. The second electrode T14 of the first initialization transistor T1 is connected to the anode 304 of the light-emitting element D1, thereby providing an initialization voltage to the anode 304 of the light-emitting element D1. The orthographic projection of the gate T12 onto the substrate 301 at least partially overlaps with the orthographic projection of the channel region of the active layer T11 onto the substrate 301. For example, the first electrode T13 is the source, and the second electrode T14 is the drain. The first electrode T13 is connected to the source region on the active layer T11, and the second electrode T14 is connected to the drain region on the active layer T11. Alternatively, the first electrode T13 is the drain, and the second electrode T14 is the source. The first electrode T13 is connected to the drain region on the active layer T11, and the second electrode T14 is connected to the source region on the active layer T11.

[0105] Figure 10 The structure of the first initialization transistor T1 is used to illustrate a portion of the film structure between the substrate 301 and the anode 304, but it is not limited thereto.

[0106] This invention also provides a method for manufacturing a display panel. Figure 11 This is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Figures 12-16 for Figure 11 A schematic diagram of the display panel structure corresponding to each step in the process. (Reference) Figure 11 The manufacturing methods for the display panel include:

[0107] S110, Provides a substrate.

[0108] For example, such as Figure 12 As shown, a substrate 301 is provided. The substrate 301 has the functions of support, protection and buffer. The substrate 301 can be a flexible substrate or a rigid substrate, such as a glass substrate, etc., and this embodiment does not limit it.

[0109] S120, An anode is formed on one side of the substrate.

[0110] For example, such as Figure 13 As shown, an anode 304 is formed on one side of the substrate 301.

[0111] S130, A pixel definition layer is formed on one side of the substrate; the pixel definition layer includes a pixel opening that exposes at least a portion of the anode.

[0112] For example, such as Figure 14As shown, a pixel definition layer 305 is formed on one side of the substrate 301, and a pixel opening A2 is formed on the pixel definition layer 305, such that the pixel opening A2 includes at least a portion of the anode 304, thereby facilitating the definition of the size of the light-emitting element.

[0113] S140. An isolation structure is formed on the side of the pixel definition layer away from the substrate; wherein the isolation structure is arranged around the pixel opening.

[0114] For example, such as Figure 15 As shown, an isolation structure 303 is formed on the side of the pixel definition layer 305 away from the substrate 301, and the isolation structure 303 is disposed around the pixel opening A2.

[0115] S150, A light-emitting material layer is formed on the surface of the anode away from the substrate; wherein at least a portion of the light-emitting material layer is located at the pixel opening.

[0116] For example, such as Figure 16 As shown, a light-emitting material layer 306 is formed on the surface of the anode 304 away from the substrate 301, and at least a portion of the light-emitting material layer 306 is located in the pixel opening A2.

[0117] S160. Using the vapor deposition apparatus provided in any embodiment of the present invention, a cathode is formed on the surface of the light-emitting material layer away from the substrate; wherein, the isolation structure encloses and forms an isolation opening, the cathode is at least partially located in the isolation opening, and the cathode overlaps with the corresponding isolation structure.

[0118] For example, such as Figure 8 As shown, using the vapor deposition equipment provided in any embodiment of the present invention, a cathode 302 is formed on the surface of the light-emitting material layer 306 away from the substrate 301, and at least a portion of the cathode 302 is located in the pixel opening A2; an isolation structure 303 surrounds and forms an isolation opening A1, in which the cathode 302 is located, and the cathode 302 overlaps with the corresponding isolation structure 303. The anode 304, the light-emitting material layer 306, and the cathode 302 are stacked to form a light-emitting element D1, which can be an organic light-emitting diode.

[0119] The isolation structure 303 can isolate the light-emitting material layer 306 and the cathode 302 in the light-emitting element D1, thereby making different light-emitting elements D1 independent of each other, improving crosstalk between adjacent light-emitting elements D1 and enhancing the display effect. Furthermore, the independence of adjacent light-emitting elements D1 allows for independent packaging, thereby improving packaging yield.

[0120] The cathode 302 is formed by a vapor deposition apparatus provided in any embodiment of the present invention. The vapor deposition apparatus includes a vapor deposition source 100 and an angle limiting plate 200. The angle limiting plate 200 can limit the spray trajectory of the cathode vapor deposition material sprayed by the nozzle 101 in the vapor deposition source 100, thereby limiting the incident angle α of the nozzle 101, and thus limiting the position of the sprayed cathode vapor deposition material on one side of the substrate 301. In this way, the size and position of the cathode 302 can be limited, that is, the overlap position of the cathode 302 on the isolation structure 303 can be limited. This avoids the cathode 302 having a small area, thus ensuring that the cathode 302 overlaps with the isolation structure 303, facilitating the connection of other conductive structures through the isolation structure 303. It also avoids the cathode 302 having an excessively large area, thereby preventing two adjacent cathodes 302 from being directly connected. This allows the vapor deposition apparatus to accurately control the position of the cathode 302 in the light-emitting element.

[0121] This invention also provides a display device, which includes the display panel provided in any embodiment of this invention. The display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, or digital photo frame. Since the display device includes the display panel provided in any embodiment of this invention, it possesses the same beneficial effects as the display panel provided in any embodiment of this invention, and will not be described further here.

[0122] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0123] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A vapor deposition apparatus, characterized in that, include: Evaporation source; The vapor deposition source includes at least one nozzle, which is used to spray cathode vapor deposition material onto one side of a substrate in the display panel through the nozzle to form a cathode on one side of the substrate; wherein, the display panel also includes an isolation structure located on one side of the substrate, the cathode and the isolation structure are located on the same side of the substrate; the isolation structure encloses to form an isolation opening, the cathode is at least partially located in the isolation opening, and the cathode overlaps with the corresponding isolation structure; An angle limiting plate; the angle limiting plate is located on one side of the vapor deposition source; the angle limiting plate is used to limit the incident angle when the nozzle sprays the cathode vapor deposition material, so as to limit the overlap position of the cathode on the corresponding isolation structure; wherein, the incident angle is the angle between the edge of the spray trajectory formed when the nozzle sprays the cathode vapor deposition material and the surface where the nozzle outlet is located.

2. The vapor deposition equipment according to claim 1, characterized in that, The angle limiting plate includes at least one angle limiting opening, which is configured to correspond one-to-one with the nozzle. The nozzle is used to spray the cathode evaporation material through the angle limiting opening, and the angle limiting opening is used to limit the incident angle of the corresponding nozzle.

3. The vapor deposition equipment according to claim 1, characterized in that, The vapor deposition equipment also includes an emission port, and the vapor deposition source is used to spray cathode vapor deposition material through the emission port; The angle limiting plate is located between the emission port and the evaporation source.

4. The vapor deposition equipment according to claim 2, characterized in that, The vapor deposition source also includes a vapor deposition crucible, and the nozzle is located on the vapor deposition crucible; The orthographic projection of the nozzle on the vapor deposition crucible is located within the orthographic projection of the angle limiting opening on the vapor deposition crucible, such that the angle limiting opening at least limits the incident angle of the nozzle in a first direction and a second direction; wherein the first direction intersects the second direction; the first direction is the extension direction of the vapor deposition crucible; Preferably, the vapor deposition source includes a plurality of nozzles, and the plurality of nozzles are arranged along the first direction; The angle limiting plate includes a plurality of angle limiting openings, which are arranged along the first direction.

5. The vapor deposition equipment according to claim 4, characterized in that, During the formation of the cathode, the angle limiting plate moves synchronously with the evaporation source; Preferably, the vapor deposition source and the angle limiting plate move along the second direction.

6. The vapor deposition equipment according to claim 1, characterized in that, The incident angle is greater than 0° and less than 90°; Preferably, the incident angle is greater than or equal to 20° and less than or equal to 80°; Preferably, the incident angle is greater than or equal to 20° and less than or equal to 70°.

7. The vapor deposition equipment according to claim 2, characterized in that, The angle-restricted opening can be circular, rectangular, triangular, trapezoidal, or parallelogram. Preferably, all the angle-restricting openings have the same shape, or at least two different angle-restricting openings have different shapes.

8. The vapor deposition equipment according to any one of claims 1-7, characterized in that, The vapor deposition equipment does not include fine metal masks.

9. A display panel, characterized in that, The display panel includes: substrate; The anode is located on one side of the substrate; A pixel definition layer is located on one side of the substrate; the pixel definition layer includes pixel openings that expose at least a portion of the anode; An isolation structure is located on the side of the pixel definition layer away from the substrate and is disposed around the pixel opening; A light-emitting material layer is located on the surface of the anode away from the substrate; at least a portion of the light-emitting material layer is located within the pixel opening; A cathode is located on the surface of the light-emitting material layer away from the substrate; the isolation structure encloses an isolation opening, the cathode is at least partially located in the isolation opening, and the cathode overlaps with the corresponding isolation structure; the cathode is formed by the vapor deposition apparatus according to any one of claims 1-8.

10. A method for manufacturing a display panel, characterized in that, The method for manufacturing the display panel includes: Provide substrate; An anode is formed on one side of the substrate; A pixel definition layer is formed on one side of the substrate; the pixel definition layer includes pixel openings that expose at least a portion of the anode; An isolation structure is formed on the side of the pixel definition layer away from the substrate; wherein the isolation structure is disposed around the pixel opening; A light-emitting material layer is formed on the surface of the anode away from the substrate; wherein at least a portion of the light-emitting material layer is located at the pixel opening; Using a vapor deposition apparatus as described in any one of claims 1 to 9, a cathode is formed on the surface of the luminescent material layer away from the substrate; wherein the isolation structure encloses an isolation opening, at least a portion of the cathode is located in the isolation opening, and the cathode overlaps with the corresponding isolation structure.

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