Magnetic plate for evaporation and evaporation device

Abstract

The application belongs to the technical field of display panels, and discloses a magnetic plate for evaporation and an evaporation device. The magnetic plate for evaporation comprises a magnetic main plate and a threaded fixing connecting piece. The magnetic main plate is annular and has a first magnetic adsorption surface. The first magnetic adsorption surface is inwardly recessed with a fixing groove. A counterbore is arranged in the fixing groove and corresponds to a fixing screw hole on a support plate. The threaded fixing connecting piece comprises a threaded connecting part and a main body part. The threaded connecting part is connected to the main body part. The threaded connecting part is provided with a threaded section. The threaded connecting part is arranged in the counterbore and is threadedly connected with the fixing screw hole. The main body part has a second magnetic adsorption surface. The first magnetic adsorption surface and the second magnetic adsorption surface are both abutted to a to-be-evaporated substrate. The difference between the cross-sectional areas of the first magnetic adsorption surface and the second magnetic adsorption surface is within a preset range. The above arrangement solves the problem of poor abutment of the to-be-evaporated substrate and a mask plate at the counterbore of the magnetic main plate, and improves the quality of evaporated products.

Description

Technical Field

[0001] This invention relates to the field of display panel manufacturing technology, and in particular to a magnetic plate and vapor deposition apparatus for vapor deposition. Background Technology

[0002] In the manufacturing process of display panels, the desired pattern is formed on a substrate using a vapor deposition method with a mask. The mask and substrate need to be aligned, and a magnetic plate is typically used to ensure a tight fit. The magnetic plate holds the mask in place, with the substrate positioned between them. The magnetic plate is fixed to the frame of the vapor deposition apparatus by screws embedded in countersunk holes. However, because the height of the magnetic plate at the countersunk hole is not at the same level as the magnetic adsorption surface, the substrate portion directly opposite the countersunk hole has a weaker adsorption capacity for the mask. This area is prone to poor adhesion between the mask and substrate, which in turn affects the pattern accuracy of the display panel.

[0003] Therefore, it is necessary to design a magnetic plate and vapor deposition apparatus for vapor deposition to solve the problems existing in the prior art. Summary of the Invention

[0004] The purpose of this invention is to provide a magnetic accumulator plate and a vapor deposition apparatus for vapor deposition, which can improve the magnetic adsorption capability of the magnetic accumulator plate for vapor deposition on the substrate to be vapor deposited, thereby solving the technical problem of poor adhesion between the substrate to be vapor deposited and the mask plate in some areas, and ensuring the coating accuracy of the display panel.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A magnetic chuck for vapor deposition, wherein the magnetic chuck is used in a vapor deposition apparatus and is used to attach a mask to a substrate to be vapor-deposited, the magnetic chuck for vapor deposition comprising:

[0007] A magnetic main board with an annular cross-sectional shape is used to attach the mask to the substrate to be vaporized. The magnetic main board has a fixing groove recessed inward on the first magnetic adsorption surface facing the substrate to be vaporized. The bottom of the fixing groove has a countersunk hole, which corresponds to the fixing screw hole on the support plate above the magnetic main board.

[0008] A threaded fastener includes a threaded connection portion and a main body portion. The threaded connection portion is connected to the main body portion and has a threaded section. The threaded connection portion passes through the countersunk hole and is threadedly connected to the fixing screw hole. The main body portion has a second magnetic adsorption surface. Both the first magnetic adsorption surface and the second magnetic adsorption surface are in contact with the substrate to be vapor-deposited, and the difference between the cross-sectional areas of the first magnetic adsorption surface and the second magnetic adsorption surface is within a preset range.

[0009] Preferably, the main body includes a nut portion and a protrusion portion. The protrusion portion and the threaded connection portion are respectively connected to both sides of the nut portion. The protrusion portion has the second magnetic adsorption surface. When the threaded connection portion is threaded into the fixing screw hole, the nut portion fits against the bottom of the fixing groove, and the protrusion portion abuts against the substrate to be vapor-deposited.

[0010] And / or, the threaded fastener includes a washer, the washer being detachably fitted onto the threaded connection portion, and when the threaded connection portion is threaded into the fixing screw hole, the two sides of the washer respectively abut against the bottom of the fixing groove and the nut portion;

[0011] Preferably, the threaded fastener includes a washer, which is detachably fitted onto the threaded connection portion. The main body portion has a second magnetic adsorption surface on the side away from the threaded connection portion. When the threaded connection portion is threaded into the fixing screw hole, the two sides of the washer respectively abut against the bottom of the fixing groove and the main body portion, and the main body portion abuts against the substrate to be vapor-deposited.

[0012] Preferably, the magnetic main board has a magnetic boss protruding on one side facing the substrate to be vapor-deposited. The magnetic boss extends around the central axis of the magnetic main board and has the first magnetic adsorption surface.

[0013] Preferably, the cross-sectional area of ​​the first magnetic adsorption surface is a, the cross-sectional area of ​​the second magnetic adsorption surface is b, and the relationship between a and b satisfies: 0 ≤ |ab| ≤ 0.2a.

[0014] Preferably, the vertical distance between the second magnetic adsorption surface and the support plate is m, and the vertical distance between the first magnetic adsorption surface and the support plate is n. The relationship between m and n satisfies: 0≤mn≤0.2μm.

[0015] Preferably, the gasket is provided with one or at least two or more.

[0016] Preferably, the nut portion has a plurality of protrusions arranged in an array; or, the nut portion has a plurality of protrusions arranged in a ring; or, the nut portion has a single protrusion.

[0017] Preferably, the protrusion is in the shape of a cuboid, cylinder, cone, or trapezoidal cylinder.

[0018] A vapor deposition apparatus includes a support plate, a mask plate, and a magnetic plate for vapor deposition as described above. The magnetic plate for vapor deposition is disposed on one side of the support plate, and the mask plate is disposed on the side of the magnetic plate for vapor deposition away from the support plate and spaced apart from the magnetic plate for vapor deposition. The magnetic plate for vapor deposition is used to attract the mask plate onto the substrate to be vapor-deposited.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] When the magnetic main board is assembled onto the support plate via threaded fasteners, and the substrate to be deposited is adsorbed onto the magnetic main board, the first magnetic adsorption surface can abut against the substrate, thereby enhancing the magnetic adsorption capacity at the countersunk hole on the magnetic main board. Furthermore, since the adsorption cross-sectional area of ​​the first and second magnetic adsorption surfaces is equal, the magnetic adsorption effect on the annular surface and at the countersunk hole on the magnetic main board is more balanced. This allows the magnetic main board to form a uniform and stable magnetic adsorption surface on the substrate, resulting in a uniform magnetic force on the mask towards the substrate. This ensures a tight fit between the mask and the substrate, resolving the problem of poor adhesion between the substrate and the mask at the countersunk hole on the magnetic main board during the entire evaporation process. This guarantees the stability and precision of the evaporation process, leading to better evaporation results and improved product quality. Attached Figure Description

[0021] Figure 1 This is a cross-sectional schematic diagram of a vapor deposition apparatus provided by existing technology;

[0022] Figure 2 This is an assembly diagram of the magnetic suction plate and support plate for vapor deposition provided in Embodiment 1 of the present invention;

[0023] Figure 3 This is an exploded view of the magnetic suction plate and support plate for vapor deposition provided in Embodiment 1 of the present invention;

[0024] Figure 4 This is an assembly diagram of the magnetic suction plate and support plate for vapor deposition provided in Embodiment 2 of the present invention;

[0025] Figure 5 This is an assembly diagram of the magnetic suction plate and support plate for vapor deposition provided in Embodiment 3 of the present invention.

[0026] In the picture:

[0027] 100. Magnet; 200. Frame; 300. Screw;

[0028] 1. Magnetic plate for vapor deposition; 101. First magnetic adsorption surface; 102. Second magnetic adsorption surface; 11. Magnetic main plate; 111. Fixing groove; 1111. Countersunk hole; 112. Magnetic boss; 12. Threaded fastener; 121. Threaded connection part; 122. Main body part; 1221. Nut part; 1222. Protrusion part; 123. Washer; 2. Support plate; 21. Fixing screw hole. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0030] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0031] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] In the description of this embodiment, the terms "upper," "lower," "right," and "left," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0033] Example 1

[0034] Organic light-emitting diode (OLED) display technology is a promising imaging display technology. Display panels made using this technology have advantages such as self-illumination, ultra-thinness, wide viewing angle, fast response speed, low power consumption, and the ability to achieve flexible displays, and are widely used in the field of display technology. OLED display devices specifically include basic film layers such as an anode, hole transport layer, light-emitting layer, electron transport layer, and cathode. Each film layer is formed on the substrate to be deposited through vacuum evaporation.

[0035] In the process of manufacturing OLED display panels, the desired pattern can be formed on the substrate to be vapor-deposited using a evaporation method through a mask. The mask and the substrate need to be aligned, and to ensure a tight fit, a magnet is typically used to attract and fix the mask to the substrate, ensuring proper alignment. Figure 1 This is a cross-sectional schematic diagram of a vapor deposition apparatus provided by existing technology. (Reference) Figure 1 In a specific setup, a magnet 100 can be placed on one side of the substrate to be vaporized. The magnet 100 is mounted and fixed on the vapor deposition apparatus via a support plate 2. A mask is placed on the other side of the substrate to be vaporized, and the magnet 100, such as a magnetic metal plate, is fixed to the frame 200 of the vapor deposition apparatus by screws 300 embedded in the countersunk hole 1111. However, since the height of the countersunk hole 1111 is not on the same horizontal plane as the height of the magnetic adsorption surface, the adsorption capacity of the mask on the part of the substrate to be vaporized directly opposite the countersunk hole 1111 is weak. In this area, there is a risk of poor adhesion between the mask and the substrate to be vaporized, which in turn affects the pattern accuracy of the display panel.

[0036] Based on the problems existing in the prior art, this embodiment provides a magnetic accumulator plate 1 for vapor deposition. Figure 2 This is an assembly diagram of the magnetic accumulator plate and support plate for vapor deposition provided in Embodiment 1 of the present invention. Figure 3 This is an exploded view of the magnetic suction plate and support plate for vapor deposition provided in Embodiment 1 of the present invention. Combined with... Figure 2 and Figure 3As shown, the magnetic accumulator plate 1 for vapor deposition includes a magnetic main plate 11 and a threaded fixing connector 12. The magnetic main plate 11 has an annular cross-sectional shape. In one embodiment, the top surface of the magnetic main plate 11 is connected to the support plate 2 (i.e., the frame 200 in the vapor deposition apparatus), and the bottom surface of the magnetic main plate 11 is set as a first magnetic adsorption surface 101. The substrate to be vapor-deposited can be adsorbed and attached to the first magnetic adsorption surface 101. When the mask is attached to the substrate to be vapor-deposited, the magnetic main plate 11 can adsorb the mask onto the substrate to be vapor-deposited, thereby realizing a detachable connection between the mask and the substrate to be vapor-deposited. When the material to be vapor-deposited is vapor-deposited onto the substrate through the mask pattern on the mask, the mask can be removed from the substrate to facilitate subsequent vapor deposition work.

[0037] refer to Figure 3 As shown, the first magnetic adsorption surface 101 has a recessed fixing groove 111. A countersunk hole 1111, penetrating the magnetic main plate 11, is formed at the bottom of the fixing groove 111. A fixing screw hole 21 is formed on the support plate 2 above the magnetic main plate 11, with the countersunk hole 1111 corresponding to the fixing screw hole 21. In addition, the threaded fixing connector 12 includes a threaded connection portion 121 and a main body portion 122. The threaded connection portion 121 is connected to the main body portion 122 and has a threaded section. The threaded connection portion 121 passes through the countersunk hole 1111 and is threadedly connected to the fixing screw hole 21. The main body portion 122 fits against the bottom of the fixing groove 111, allowing the magnetic main plate 11 to be detachably and securely connected to the support plate 2 via a threaded connection. This ensures a firm connection between the magnetic main plate 11 and the support plate 2 and facilitates maintenance and replacement of the magnetic main plate 11.

[0038] It should be noted beforehand that in this embodiment, the magnetic mainboard 11 is made of magnetic materials, such as permanent magnets (neodymium iron boron magnets, samarium cobalt magnets, etc.) or soft magnetic materials (pure iron, silicon steel, etc.). When using a magnetic mainboard 11 made of soft magnetic materials, the magnetic mainboard 11 generates magnetism when energized and loses magnetism when the power is off. Therefore, the magnetic field of the magnetic mainboard 11 can be controlled by the current, and the magnitude of the magnetic induction intensity of the magnetic mainboard 11 can also be controlled by controlling the magnitude of the current, thus facilitating control and providing more precise control over the magnitude of the magnetic induction intensity. In addition, since the magnetic mainboard 11 made of soft magnetic materials is a component that generates magnetism when energized and demagnetizes when demagnetized, it has a longer service life. During the vapor deposition process, the magnetic mainboard 11 does not need to be replaced frequently, thereby saving on operating costs.

[0039] In this embodiment, the substrate to be deposited is made of materials such as glass or silicon wafers, and a magnetic material, such as an iron sheet or a nickel sheet, is disposed on the side of the substrate facing the magnetic mainboard 11 to facilitate adsorption with the magnetic mainboard 11. Furthermore, taking the deposition of an anode material on the substrate as an example, the substrate may include stacked driving layers, cathode layers, light-emitting layers, and other film layers. Subsequently, an anode layer will be fabricated on the substrate using a vapor deposition apparatus, ultimately resulting in an OLED display panel. Of course, it is understood that this embodiment uses the deposition of an anode material on the substrate as an example; however, in other parallel embodiments, the vapor deposition apparatus of this invention can also achieve the purpose of depositing different materials in different areas or not depositing predetermined materials in predetermined areas.

[0040] In one possible implementation, the mask can be metal. Preferably, in this embodiment, the mask can be an FMM (Fine Metal Mask), which has a high-precision mask pattern, and a magnetic layer is provided on the side of the mask facing the substrate to be vaporized, so that the magnetic main board 11 can attach the mask to the substrate to be vaporized through the magnetic layer of the mask.

[0041] It is understood that the threaded fastener 12 can be a bolt or a screw, and this embodiment is not limited to this.

[0042] Specifically, in this embodiment, combined with Figure 2 and Figure 3 As shown, the main body 122 includes a nut portion 1221 and a protrusion 1222. The protrusion 1222 and the threaded connection portion 121 are respectively connected to both sides of the nut portion 1221. Since the threaded fastening connector 12 is made of a material that can conduct magnetism and has a low coefficient of thermal expansion, such as an iron-nickel alloy, the bottom of the protrusion 1222 in this embodiment defines the second magnetic adsorption surface 102 described above. With the above arrangement, when the threaded connection portion 121 is threaded into the fixing screw hole 21, the nut portion 1221 can fit against the bottom of the fixing groove 111, so that the magnetic main board 11 is limited and clamped by the nut portion 1221 and the support plate 2, thereby preventing the magnetic main board 11 from shaking in the up-down and left-right directions, and ensuring that the first adsorption surface 101 and the second adsorption surface 102 of the magnetic main board 11 can uniformly adsorb the mask onto the substrate to be vaporized.

[0043] In addition, after the substrate to be vapor-deposited is adsorbed onto the magnetic main board 11, the protrusion 1222 can abut against the substrate to be vapor-deposited, thereby enhancing the magnetic adsorption capacity of the magnetic main board 11 at the countersunk hole 1111. Moreover, since the adsorption cross-sectional area of ​​the first magnetic adsorption surface 101 and the second magnetic adsorption surface 102 are equal, the magnetic adsorption effect on the annular surface of the magnetic main board 11 and the magnetic adsorption effect at the countersunk hole 1111 are more balanced. This allows the magnetic main board 11 to form a uniform and stable magnetic adsorption surface on the substrate to be vapor-deposited, thereby subjecting the mask to a uniform magnetic force towards the substrate to be vapor-deposited. This enables the mask and the substrate to be vapor-deposited to a tight fit, solving the problem of poor fit between the substrate and the mask at the countersunk hole 1111 of the magnetic main board 11 during the entire vapor deposition process. This ensures the stability and precision of the vapor deposition process, resulting in better vapor deposition effect on the substrate and improved product quality.

[0044] More preferably, the nut portion 1221 and the protrusion portion 1222 are fixedly connected by an integral molding method, including but not limited to die casting, injection molding, or 3D printing. This ensures a stable connection between the nut portion 1221 and the protrusion portion 1222, preventing deformation and effectively simplifying the manufacturing process of the threaded fastener 12. Therefore, this embodiment of the invention does not limit the fixing method between the nut portion 1221 and the protrusion portion 1222. As long as the structural strength and precision of the threaded fastener 12 can be ensured, and the manufacturing process is simple and low-cost, it is within the protection scope of this invention.

[0045] More preferably, in this embodiment, the protrusion 1222 is cylindrical. The cylindrical protrusion 1222 is quicker and easier to form during processing, thus simplifying the manufacturing process, reducing manufacturing difficulty, and making the threaded fastener 12 more aesthetically pleasing and practical. Of course, it is understood that in other parallel embodiments, the shape of the protrusion 1222 may include, but is not limited to, a cuboid, a cone, or a trapezoidal cylinder. Since the protrusions 1222 of the above shapes all have a bottom plane with a certain cross-sectional area, regardless of the shape adopted, they can meet the requirement of enhancing the magnetic adsorption effect of the magnetic main board 11 at the countersunk hole 1111, without affecting the stability and functionality of the overall structure. Based on the above, since the nut 1221 and the protrusion 1222 are fixed together by integral molding, the threaded fastener 12 can be adapted to the specific requirements of different application scenarios through diverse designs, further improving the product's flexibility and applicability.

[0046] Furthermore, the threaded fastener 12 can select an appropriate number of protrusions 1222 based on the size of the adsorption cross-sectional area of ​​the first magnetic adsorption surface 101 and the second magnetic adsorption surface 102. For example, in this embodiment, a protrusion 1222 is provided on the nut portion 1221, which can meet the requirement that the adsorption cross-sectional areas of the first magnetic adsorption surface 101 and the second magnetic adsorption surface 102 are equal under actual working conditions. In other parallel embodiments, when the adsorption cross-sectional area of ​​the second magnetic adsorption surface 102 is large, and the adsorption cross-sectional areas of the first magnetic adsorption surface 101 and the second magnetic adsorption surface 102 differ significantly, multiple protrusions 1222 can be selected. Multiple protrusions 1222 can be arranged in an array on the nut portion 1221 to ensure that the adsorption cross-sectional areas of the first magnetic adsorption surface 101 and the second magnetic adsorption surface 102 are equal by adding an extra number of protrusions 1222.

[0047] Furthermore, the multiple protrusions 1222 are arranged in a matrix array so that the arrangement shape of the multiple protrusions 1222 is the same as the outer shape of the mask plate; or the multiple protrusions 1222 are arranged in a ring array so that the multiple protrusions 1222 in the threaded fastener 12 can apply a magnetic adsorption force to the mask plate from the center to the periphery.

[0048] Of course, when multiple protrusions 1222 are provided, they can also be arranged in a ring on the nut portion 1221. This also ensures that the magnetic main board 11 has the same magnetic adsorption capacity at the countersunk hole 1111 as the first magnetic adsorption surface 101, and the magnetic adsorption effect is uniform and stable. Therefore, those skilled in the art can select the number and arrangement of protrusions 1222 according to the actual working conditions, and the present invention is not limited in this regard.

[0049] Optionally, in this embodiment, the magnetic main board 11 has a magnetic boss 112 protruding from the side facing the substrate to be vapor-deposited. The magnetic boss 112 is annular in shape and extends around the central axis of the magnetic main board 11. Both the magnetic boss 112 and the magnetic main board 11 are metal parts with magnetic conductivity, and the bottom surface of the magnetic boss 112 is configured as the first magnetic adsorption surface 101 described above. By setting the magnetic boss 112, the adsorption cross-sectional area between the magnetic main board 11 and the substrate to be vapor-deposited is reduced. On the one hand, this effectively improves the magnetic adsorption strength, ensuring that the two are tightly attached and preventing displacement during high-temperature vapor deposition. On the other hand, the setting of the magnetic boss 112 can form an assembly gap between the substrate to be vapor-deposited and the magnetic main board 11, which facilitates the quick installation and removal of the substrate to be vapor-deposited and improves production efficiency.

[0050] It should be noted that in this embodiment, the vertical cross-sectional shape of the magnetic boss 112 is square. Of course, other shapes, such as circular or trapezoidal, can be selected according to the actual situation to adapt to the geometric characteristics of different substrates to be vapor-deposited, ensuring optimal magnetic attraction. In addition, the height and width of the magnetic boss 112 can also be adjusted according to actual needs to optimize the magnetic attraction force and assembly convenience.

[0051] Furthermore, in this embodiment, the magnetic boss 112 and the magnetic main board 11 are integrally formed. Exemplarily, in the manufacturing process of the magnetic main board 11, after a fixing groove 111 and a countersunk hole 1111 are formed in the middle of the blank metal plate, an annular protrusion 112 is cut on the annular surface of the blank metal plate using a lathe. This allows the magnetic boss 112 to be integrally formed and fixedly connected to the magnetic main board 11. The above manufacturing method is simple and convenient, simplifying the manufacturing process of the magnetic main board 11 and the magnetic boss 112. It also effectively ensures the structural strength and precision of the magnetic boss 112 and the magnetic main board 11, and guarantees that the dimensions, surface finish, and flatness of the magnetic boss 112 meet the requirements of the first magnetic adsorption surface 101 under actual working conditions.

[0052] In this embodiment, the cross-sectional area of ​​the first magnetic adsorption surface 101 is set as 'a', and the cross-sectional area of ​​the second magnetic adsorption surface 102 is set as 'b'. The relationship between 'a' and 'b' is: 0 ≤ |ab| ≤ 0.2a. In this embodiment, |ab| can be any value between 0 and 0.2a, or a range between any two values, such as 0, 0.05a, 0.1a, 0.15a, 0.2a, etc. Once the specific value of the cross-sectional area 'a' of the first magnetic adsorption surface 101 is determined, the specific value of the cross-sectional area 'b' of the second magnetic adsorption surface 102 can be calculated according to the relationship. This allows for precise control of the specific dimensions of the protrusion 1222, achieving similar cross-sectional areas for the first and second magnetic adsorption surfaces 101, thereby ensuring that the magnetic adsorption forces of the first and second magnetic adsorption surfaces 101 are essentially equal. Preferably, the relationship between 'a' and 'b' is: |ab| = 0.1a, and 'a' can be less than or greater than 'b'.

[0053] In this embodiment, reference Figure 1As shown, the vertical distance between the first magnetic adsorption surface 101 and the support plate 2 is set to m, and the vertical distance between the second magnetic adsorption surface 102 and the support plate 2 is set to n. The relationship between m and n must satisfy: 0 ≤ mn ≤ 0.2 μm. By adjusting the relationship between m and n, the magnetic adsorption performance of the magnetic main board 11 at the countersunk hole 1111 can be further precisely adjusted. When m is greater than n, the magnetic field of the magnetic main board 11 at the countersunk hole 1111 is more concentrated, resulting in a higher magnetic field strength at the countersunk hole 1111, which allows for a more secure adsorption of the substrate to be deposited, and consequently, a more secure adsorption of the mask plate at the countersunk hole 1111. Furthermore, since the area of ​​the countersunk hole 1111 is lower than the annular surface of the magnetic main board 11, the height difference can be filled by setting the protrusion 1222, ensuring that the gap between the substrate to be vapor-deposited and the magnetic main board 11 at the countersunk hole 1111 is zero. This avoids the situation where the protrusion 1222 cannot effectively fit and abut against the substrate to be vapor-deposited due to manufacturing errors after setting the protrusion 1222, thereby reducing magnetic field leakage and ensuring the adsorption effect of the magnetic main board 11 on the substrate to be vapor-deposited.

[0054] It should be noted that, in this embodiment, the difference between m and n can be any value between 0 and 0.2 μm or any range between any two values, such as 0, 0.04 μm, 0.08 μm, 0.12 μm, 0.16 μm, 0.2 μm, etc.

[0055] This embodiment also provides a vapor deposition apparatus capable of vapor deposition on a substrate to be vaporized. The apparatus includes a support plate 2, a mask plate, and the aforementioned magnetic stabilizing plate 1 for vapor deposition. Vapor deposition is generally performed under vacuum conditions, where a material is heated by an evaporation source to evaporate and vaporize, and then condenses on the substrate to be vaporized to form a thin film. During the vapor deposition process, a mask plate is used to control the shape and position of the thin film, and the mask plate has a mask pattern; only masks corresponding to the mask pattern can form a thin film. The magnetic stabilizing plate 1 is disposed on the support plate 2 on the side away from the substrate to be vaporized. One side of the magnetic stabilizing plate 1 is fixedly connected to the support plate 2 on the side closer to the substrate to be vaporized via a threaded fastener 12. The mask plate is disposed on the magnetic stabilizing plate 1 on the side closer to the substrate to be vaporized, and is spaced apart from the magnetic stabilizing plate 1. The substrate to be vaporized is sandwiched between the mask plate and the magnetic stabilizing plate 1, and the magnetic stabilizing plate 1 attracts the mask plate onto the substrate to be vaporized.

[0056] In the above setup, the mask plate is adsorbed onto the substrate to be vaporized using the magnetic evaporation plate 1. Since the threaded fastener 12 of the magnetic evaporation plate 1 has a protrusion 1222 on its nut portion 1221 protruding towards the substrate to be vaporized, after the magnetic evaporation plate 1 adsorbs the substrate, the first magnetic adsorption surface 101 on the magnetic main board 11 and the second magnetic adsorption surface 102 on the protrusion 1222 can both adhere and abut against the substrate to be vaporized. The difference between the cross-sectional areas of the adsorption surfaces 102 is within a preset range, thereby ensuring that the adsorption force of the magnetic absorbing plate 1 for evaporation on the substrate to be evaporated is evenly distributed at the first magnetic adsorption surface 101 and the second magnetic adsorption surface 102. This solves the problem of insufficient magnetic adsorption capacity of the magnetic absorbing plate 1 for evaporation at the countersunk hole 1111, and ensures that the area of ​​the substrate to be evaporated that is directly opposite the countersunk hole 1111 of the magnetic absorbing plate 1 for evaporation has good magnetic adsorption capacity. This ensures the tightness and uniformity of the substrate to be evaporated in bonding with the mask, and prevents poor bonding between the two.

[0057] The vapor deposition apparatus provided in this embodiment of the invention will be described in detail below, taking into account its use under actual working conditions. The vapor deposition method using the vapor deposition apparatus provided in this embodiment includes the following steps:

[0058] Step 1. Provide an evaporation source and a substrate to be deposited, positioned above the evaporation source;

[0059] Step 2. A mask is placed between the evaporation source and the substrate to be evaporated. The mask pattern of the mask is used to align with the area to be evaporated on the substrate to obtain the evaporated thin film layer.

[0060] Step 3. Place the magnetic stabilizing plate 1 for evaporation as described in this embodiment above the side of the substrate to be evaporated away from the mask plate. The magnetic force generated by the magnetic stabilizing plate 1 attracts the mask plate to the substrate to be evaporated, ensuring that the substrate to be evaporated and the magnetic stabilizing plate 1 are tightly attached, keeping the mask plate flat, reducing the sagging of the mask plate, and allowing the mask plate to be evenly unfolded and laid flat on the substrate to be evaporated. This ensures that the mask plate and the substrate to be evaporated are closely aligned and attached, without forming gaps, thereby reducing the risk of color mixing.

[0061] It is understood that in step 3, since the magnetic absorbing plate 1 for vapor deposition provided in this embodiment is provided with a threaded fixing connector 12 at the countersunk hole 1111, and the threaded fixing connector 12 includes a protrusion 1222, a second magnetic adsorption surface 102 is provided on the side of the protrusion 1222 facing the substrate to be vapor-deposited, the second magnetic adsorption surface 102 and the first magnetic adsorption surface 101 can both fit and abut against the substrate to be vapor-deposited, and the difference in adsorption cross-sectional area between the second magnetic adsorption surface 102 and the first magnetic adsorption surface 101 located in the annular surface area of ​​the magnetic absorbing plate 1 for vapor deposition is within a preset range, so that the magnetic absorbing plate 1 for vapor deposition has a magnetic adsorption capacity similar to that of the magnetic absorbing main plate 11 at the countersunk hole 1111, thereby having a relatively uniform magnetic adsorption force at the center and annular surface of the magnetic absorbing plate 1 for vapor deposition. Through the above settings, the adsorption of the mask plate by the magnetic absorbing plate 1 for vapor deposition is more uniform, and the adsorption effect is improved and enhanced.

[0062] Step 4. Heat the evaporation source so that the evaporation material is deposited on the substrate to be evaporated through the mask pattern of the mask plate to form an evaporated thin film layer.

[0063] The size of the mask and the magnetic chuck 1 for evaporation varies according to the size of the substrate to be evaporated. In other words, the size of the magnetic chuck 1 and the mask is set according to the requirements of the substrate to be evaporated. When the substrate to be evaporated is large, the mask and the magnetic chuck 1 are set to a large size structure to correspond to the size of the substrate to be evaporated.

[0064] After the vapor deposition is completed, the mask is unloaded from the substrate to be vapor deposited, and the magnetic force of the vapor deposition magnetic plate 1 on the vapor-deposited substrate is eliminated, and the vapor-deposited substrate is unloaded from the vapor deposition magnetic plate 1.

[0065] Example 2

[0066] Figure 4 This is an assembly diagram of the magnetic suction plate and support plate for vapor deposition provided in Embodiment 2 of the present invention. (Reference) Figure 4 As shown, this embodiment provides a magnetic accumulator plate 1 for vapor deposition. The structure of the magnetic accumulator plate 1 for vapor deposition is roughly the same as that of the magnetic accumulator plate 1 for vapor deposition in Embodiment 1. The difference is that in this embodiment, the threaded fixing connector 12 also includes a washer 123. The washer 123 is detachably sleeved on the threaded connection part 121. When the threaded connection part 121 is threadedly connected to the fixing screw hole 21, the two sides of the washer 123 respectively abut against the bottom of the fixing groove 111 and the nut part 1221, so as to raise the nut part 1221 by adding the washer 123, so that the nut part 1221 can move closer to the substrate to be vapor-deposited.

[0067] By setting the gasket 123, when the substrate to be vapor-deposited is adsorbed onto the magnetic main board 11, but there is still a gap between the protrusion 1222 and the substrate to be vapor-deposited, causing the second magnetic adsorption surface 102 to not be in close contact with the substrate to be vapor-deposited, the distance between the protrusion 1222 and the substrate to be vapor-deposited can be shortened by fitting the gasket 123 on the threaded connection 121 to increase the distance between the nut 1221 and the bottom of the fixing groove 111. This ensures that the second magnetic adsorption surface 102 is tightly connected to the substrate to be vapor-deposited, eliminates the gap between the protrusion 1222 and the substrate to be vapor-deposited, and further ensures the vapor deposition quality.

[0068] It is understood that the present invention does not limit the number or thickness of the gaskets 123. In this embodiment, one gasket 123 is provided, which satisfies the requirement of m≥n. In other parallel embodiments, the thickness of the selected gaskets 123 can be equal to or different from the thickness of the gaskets 123 in this embodiment. The thickness of the gaskets 123 can be any value between 2μm and 10μm. At least two gaskets 123 can also be selected, and the thickness of the selected multiple gaskets 123 can be equal or unequal. Those skilled in the art can flexibly adjust the specific size and number of the stored gaskets 123 and the gap between the protrusion 1222 and the substrate to be vaporized, as long as the second magnetic adsorption surface 102 can be tightly attached to the substrate to be vaporized and m≥n, it is within the scope of protection of the present invention.

[0069] Furthermore, the gasket 123 is also manufactured using a material with a low coefficient of thermal expansion to reduce the possibility of deformation of the gasket 123 due to the influence of high temperature environment, thereby ensuring the stability and reliability of the entire threaded fastener 12 during use.

[0070] Example 3

[0071] Figure 5 This is an assembly diagram of the magnetic suction plate and support plate for vapor deposition provided in Embodiment 3 of the present invention. (Reference) Figure 5As shown, this embodiment provides a magnetic accumulator plate 1 for vapor deposition. The structure of the threaded fastener 12 in this embodiment differs from that in Embodiment 2 in that: in this embodiment, the threaded fastener 12 consists only of a threaded connection portion 121, a main body portion 122, and a washer 123, and the main body portion 122 only includes a nut portion 1221. Thus, the threaded fastener 12 can only achieve the purpose of the second magnetic adsorption surface 102 adhering to the substrate to be vapor-deposited by setting the washer 123. At this time, the second magnetic adsorption surface 102 is formed on the side surface of the nut portion 1221 facing the substrate to be vapor-deposited. Referring to Embodiment 2, the nut portion 1221 can be adhered to the substrate to be vapor-deposited by flexibly adjusting the thickness and number of washer 123.

[0072] Compared with the threaded fasteners 12 provided in Embodiments 1 and 2, the threaded fastener 12 provided in this embodiment has the advantage of eliminating the process step of additionally setting the protrusion 1222 on the nut portion 1221, thereby reducing the complexity and cumbersomeness of the production of the threaded fastener 12. In specific assembly, a shim 123 of appropriate thickness can be selected first and fitted onto the threaded connection portion 121. Then, the threaded fastener 12 is assembled onto the magnetic main board 11 and the support plate 2. When it is found that there is still a gap between the protrusion 1222 and the substrate to be vapor-deposited, or the difference between m and n exceeds 0.2 μm, it indicates that the thickness of the selected shim 123 is inaccurate. To address the issue of a gap remaining between the protrusion 1222 and the substrate to be deposited, a thicker spacer 123 can be selected based on the size of the gap. This allows for a tighter fit between the protrusion 1222 and the substrate. Alternatively, multiple spacers 123 can be fitted together to achieve a tighter fit between the protrusion 1222 and the substrate. Figure 5 The middle layer is provided with three gaskets 123; for cases where the difference between m and n exceeds 0.2μm, a thinner gasket 123 can be selected according to the excess value, so that the difference between m and n can be less than 0.2μm by using a thinner gasket 123.

[0073] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0074] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A magnetic chuck for vapor deposition, characterized in that, The magnetic chuck (1) for vapor deposition is used in the vapor deposition apparatus and is used to adsorb the mask onto the substrate to be vapor deposited. The magnetic chuck (1) for vapor deposition includes: A magnetic main board (11) has an annular cross-sectional shape. The magnetic main board (11) is used to adsorb the mask onto the substrate to be vaporized. The magnetic main board (11) has a fixing groove (111) recessed inward on the first magnetic adsorption surface (101) facing the substrate to be vaporized. The bottom of the fixing groove (111) has a countersunk hole (1111). The countersunk hole (1111) is correspondingly set with a fixing screw hole (21) opened on the support plate (2) located above the magnetic main board (11). A threaded fastener (12) includes a threaded connection part (121) and a main body part (122). The threaded connection part (121) is connected to the main body part (122). The threaded connection part (121) is provided with a threaded section. The threaded connection part (121) passes through the countersunk hole (1111) and is threadedly connected to the fixing screw hole (21). The main body part (122) has a second magnetic adsorption surface (102). The first magnetic adsorption surface (101) and the second magnetic adsorption surface (102) are both in contact with the substrate to be vapor-deposited, and the difference between the cross-sectional areas of the first magnetic adsorption surface (101) and the second magnetic adsorption surface (102) is within a preset range.

2. The magnetic accumulator for vapor deposition according to claim 1, characterized in that, The main body (122) includes a nut (1221) and a protrusion (1222). The protrusion (1222) and the threaded connection (121) are respectively connected to both sides of the nut (1221). The protrusion (1222) has the second magnetic adsorption surface (102). When the threaded connection (121) is threaded into the fixing screw hole (21), the nut (1221) fits against the bottom of the fixing groove (111), and the protrusion (1222) abuts against the substrate to be vapor-deposited. And / or, the threaded fastener (12) includes a washer (123), which is detachably fitted onto the threaded connection part (121). When the threaded connection part (121) is threaded into the fixing screw hole (21), the two sides of the washer (123) respectively abut against the bottom of the fixing groove (111) and the nut part (1221).

3. The magnetic chuck for vapor deposition according to claim 1, characterized in that, The threaded fastener (12) includes a washer (123), which is detachably fitted onto the threaded connection portion (121). The main body portion (122) has a second magnetic adsorption surface (102) on the side away from the threaded connection portion (121). When the threaded connection portion (121) is threaded into the fixing screw hole (21), the two sides of the washer (123) respectively abut against the bottom of the fixing groove (111) and the main body portion (122), and the main body portion (122) abuts against the substrate to be vapor-deposited.

4. The magnetic plate for vapor deposition according to claim 2 or 3, characterized in that, The magnetic main board (11) has a magnetic boss (112) protruding on one side facing the substrate to be vaporized. The magnetic boss (112) extends around the central axis of the magnetic main board (11) and has the first magnetic adsorption surface (101).

5. The magnetic chuck for vapor deposition according to claim 4, characterized in that, The cross-sectional area of ​​the first magnetic adsorption surface (101) is a, and the cross-sectional area of ​​the second magnetic adsorption surface (102) is b. The relationship between a and b satisfies: 0 ≤ |ab| ≤ 0.2a.

6. The magnetic chuck for vapor deposition according to claim 4, characterized in that, The vertical distance between the second magnetic adsorption surface (102) and the support plate (2) is m, and the vertical distance between the first magnetic adsorption surface (101) and the support plate (2) is n. The relationship between m and n satisfies: 0≤mn≤0.2μm.

7. The magnetic chuck for vapor deposition according to claim 2 or 3, characterized in that, The gasket (123) is provided with one or at least two.

8. The magnetic plate for vapor deposition according to claim 2, characterized in that, The nut portion (1221) has a plurality of protrusions (1222) arranged in an array; or, the nut portion (1221) has a plurality of protrusions (1222) arranged in a ring; or, the nut portion (1221) has a single protrusion (1222).

9. The magnetic plate for vapor deposition according to claim 2, characterized in that, The protrusion (1222) is in the shape of a cube, cylinder, cone or trapezoidal cylinder.

10. A vapor deposition apparatus, characterized in that, The device includes a support plate (2), a mask plate, and a magnetic absorbing plate (1) for vapor deposition as described in any one of claims 1-9. The magnetic absorbing plate (1) for vapor deposition is disposed on one side of the support plate (2), and the mask plate is disposed on the side of the magnetic absorbing plate (1) for vapor deposition away from the support plate (2) and spaced apart from the magnetic absorbing plate (1). The magnetic absorbing plate (1) for vapor deposition is used to adsorb the mask plate onto the substrate to be vapor-deposited.

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