An evaporation system and method of monitoring and cleaning thereof

Abstract

This application provides a vapor deposition system and its monitoring and cleaning method. The vapor deposition system includes a vacuum chamber, a plasma cleaning device, and a monitoring and control system. The monitoring and control system includes a control system and multiple cameras distributed within the vacuum chamber, with at least some of the cameras used to monitor key components. Key components include any one or any combination of a support component for supporting the substrate and mask, a connecting component for fixing the substrate, an alignment marker head, and a conveying component. The control system monitors the contamination level of the vacuum chamber based on the camera images and adjusts the cleaning parameters of the cleaning device according to the contamination level to control the cleaning time and intensity. By monitoring the environment within the vacuum chamber, especially the key components, the contamination level within the chamber can be obtained accurately and promptly, allowing for timely cleaning. Adjusting the cleaning parameters according to the contamination level improves cleaning efficiency and reduces cleaning time while ensuring cleaning intensity.

Description

Technical Field

[0001] This application relates to the field of vapor deposition technology, specifically to a vapor deposition system with a monitoring and control system, and a method for monitoring and cleaning the vapor deposition system. Background Technology

[0002] Evaporation deposition refers to the process of depositing a vapor material (often called the vapor source) onto a substrate surface in a uniform and controllable manner through thermal evaporation, forming a functional layer of the substrate. For example, in light-emitting display devices such as OLED displays, evaporation deposition allows a film layer of appropriate thickness to be formed on a substrate according to a desired pattern.

[0003] Evaporation deposition processes require precise control of parameters such as material concentration, ambient temperature, and pressure; therefore, they are typically performed within a closed chamber. However, with repeated processes, the cleanliness of the closed chamber environment can deteriorate. Impurities such as airborne dust and other materials mixed in with the deposition source can accumulate in the chamber and deposit on the inner walls and deposition components. During the deposition process, these impurities will be deposited onto the substrate with the vapor, affecting the film quality and performance. Frequent cleaning of the chamber, however, results in long downtimes and reduces production efficiency. Summary of the Invention

[0004] In view of this, this application aims to provide a vapor deposition system that monitors the environment inside the vacuum chamber, especially the key components, to obtain the contamination level inside the chamber in a timely manner, cleans it promptly, and adjusts the cleaning parameters according to the contamination level to improve cleaning efficiency and minimize the cleaning time while ensuring cleaning effectiveness.

[0005] This application mainly provides a vapor deposition system, including a vacuum chamber, and a vacuum device, a vapor deposition device, a chamber assembly, a cleaning device, and a monitoring and control system disposed in the vacuum chamber;

[0006] The cleaning device includes a plasma generator, a nozzle, and a nozzle mounted on the nozzle for ejecting plasma into the vacuum chamber; the monitoring and control system includes a camera array and a control system, the camera array including multiple cameras distributed within the vacuum chamber, and at least some of the multiple cameras are used to monitor key components, so as to monitor both the indoor environment of the vacuum chamber and the key components.

[0007] The key components include any one or any combination of the following: a support component for supporting the substrate and the mask; a connecting component for aligning and bonding the substrate and the mask; an alignment marking head for marking the substrate; and a conveying component for conveying the substrate.

[0008] The control system monitors the contamination level of the vacuum chamber based on the images captured by the camera group, and can activate the cleaning device to clean the inner wall of the vacuum chamber and the outer surface of the key components using plasma. The system also adjusts the cleaning parameters of the cleaning device according to the contamination level to control the cleaning duration and intensity.

[0009] The cleaning parameters include at least the plasma injection duration and injection volume.

[0010] In one possible implementation, the control system determines the pollution level by comparing photos taken by the camera group with reference photos pre-stored in the system. The comparison features obtained include any one or any combination of the following: the surface color of the component shown in the photo, the number of clumps in the area, the uniformity and variation of the surface color of the component in the area, and the content of visible particles in the area.

[0011] In one possible implementation, an alarm device is also provided. The control system determines the level of contamination by comparing the photos taken by the camera group with the reference photos stored in the system, and sends a cleaning alarm through the alarm device when a cleaning operation needs to be initiated.

[0012] And / or, the control system determines whether it is an abnormal situation based on the level of contamination and the duration of the condition after the most recent cleaning, and if the determination result is yes, it generates an abnormal alarm through the alarm device.

[0013] In one possible implementation, the plasma generator further includes an excitation chamber, a plasma source, an excitation device, and a heating device for heating the excited plasma and / or a compressor for compressing the plasma; the control system is connected to the heating device to regulate the heating duration and heating temperature, and / or connected to the compressor to regulate the plasma ejection pressure and temperature.

[0014] In one possible implementation, the nozzles are arranged in a plurality and spaced apart along the arrangement direction of the support members, and are connected to the side wall or top wall of the vacuum chamber and facing the convergence area of ​​the key components.

[0015] In one possible implementation, the camera includes a base, a rotating frame rotatably mounted on the base, and a camera body rotatably mounted on the rotating frame, the camera body being capable of 360° rotation.

[0016] In one possible implementation, an isolation cover for housing the camera is also provided; the isolation cover is provided with a gate connected to the vacuum chamber to be opened when the camera is performing a shooting operation.

[0017] In one possible implementation, the camera is telescopically mounted inside the isolation cover via a moving mechanism, so that it can extend out of the isolation cover after the gate is opened, and can be moved to a set distance from the target component via the moving mechanism, and can move around the target component in multiple directions to take pictures from multiple directions; the target component is the inner wall of the vacuum chamber and the key component.

[0018] This application also provides a monitoring and cleaning method for a vapor deposition system, applicable to the aforementioned vapor deposition system, wherein the monitoring and cleaning method includes:

[0019] Monitor the status of the vapor deposition apparatus, and when the vacuum chamber is idle, extend each of the cameras out of the isolation cover and photograph the inner wall of the vacuum chamber and the outer surface of the key components;

[0020] Compare the photos taken by the camera group with the reference photos stored in the system and extract the comparison features. The comparison features include any one or any combination of the following: the surface color of the component shown in the photo, the number of clumps in the area, the uniformity and variation of the surface color of the component in the area, and the content of visible particles in the area.

[0021] The pollution level is determined based on the differences in the comparison features.

[0022] Initiate the cleaning procedure and adjust the pressure inside the vacuum chamber to a preset pre-cleaning ambient pressure, which is 10 mbar to 1 × 10⁻³ mbar or less, especially 1 × 10⁻⁴ mbar or less.

[0023] The cleaning parameters of the cleaning device are adjusted according to the pollution level to set a cleaning duration that matches the pollution level. The cleaning parameters include at least the plasma injection duration and injection volume.

[0024] Adjust the plasma ejection rate per unit time to maintain the cleaning pressure in the vacuum chamber within the set purification pressure range, which is 50 mbar to 280 mbar.

[0025] The vapor deposition system provided in this application cleans the vacuum chamber using plasma, ensuring consistent cleaning intensity and ease of operation. Furthermore, multiple cameras are incorporated to monitor the vacuum chamber from multiple angles and directions, specifically monitoring key components near the vapor deposition source. Cleaning is initiated promptly when the cleanliness of the chamber's inner wall and the outer surfaces of key components decreases. Camera feedback accurately measures the level of contamination, allowing for adjustments to cleaning parameters to control cleaning intensity and time. This not only enables precise cleaning of the vacuum chamber's inner wall and key components for better results but also allows for optimal cleaning time, minimizing cleaning duration while maintaining cleaning intensity. This improves cleaning efficiency and saves time, thereby increasing production efficiency by reducing vacuum chamber cleaning time. Attached Figure Description

[0026] Figure 1 The diagram shown is a schematic diagram of the vacuum chamber and its configured components in an embodiment of this application;

[0027] Figure 2 The diagram shown is a schematic representation of the distribution of the camera group within the vacuum chamber in an embodiment of this application.

[0028] Figure 3 The diagram shown is a schematic representation of one arrangement of the isolation shield and camera in an embodiment of this application.

[0029] Figure 4 The diagram shown is a schematic of a camera that can be extended and retracted via a moving mechanism in an embodiment of this application.

[0030] Figure 5 The diagram shown is a structural schematic of the moving mechanism in an embodiment of this application;

[0031] Figure 6 The diagram shown is a schematic representation of the nozzle distribution within a vacuum chamber in some embodiments of this application.

[0032] Figure 7 The diagram shown is a schematic of the main nozzle and special nozzle disposed in a vacuum chamber in some other embodiments of this application;

[0033] Figure 8 The diagram shown is a schematic representation of the cleaning method steps in an embodiment of this application.

[0034] Figures 1-8 middle:

[0035] 1. Vacuum chamber; 11. Substrate; 12. Supporting component; 13. Conveying component; 14. Connecting component; 15. Mask plate;

[0036] 2. Vacuum device; 3. Plasma generator; 31. Nozzle; 31a. Main nozzle; 31b. Special nozzle; 32. Main nozzle; 33. Special nozzle;

[0037] 4. Evaporation source; 5. Moving mechanism; 51. Rotary disk; 52. First connecting rod; 53. Second connecting rod; 54. Rotary seat;

[0038] 6. Camera; 61. Camera body; 62. Rotating frame; 6a. First camera; 6b. First camera; 6c. First camera;

[0039] 7. Isolation cover; 71. Gate. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] When performing a vapor deposition process on substrate 11 to deposit a material film on the surface of substrate 11, substrate 11 and mask 15 need to be transported into vacuum chamber 1 sequentially. Then, substrate 11 and mask 15 are aligned and stacked, and alignment marks are made. In some processes, a pressure plate is used to press the two together. For example, mask 15 is suspended and supported by a support member 12, such as a support platform, inside vacuum chamber 1. Substrate 11 is aligned and stacked on mask 15 from above, and then the pressure plate presses the substrate 11 so that each area of ​​substrate 11 is flatly and evenly attached to mask 15 under basically the same pressure. The component that fixes substrate 11 and mask 15 or the aforementioned pressure plate-like pressing component forms the connecting component 14 that aligns and stacks substrate 11 and mask 15. Vapor deposition source 4 can be placed inside vacuum chamber 1 or outside vacuum chamber 1. When placed outside vacuum chamber 1, a separate chamber can be set up for evaporation, and it is connected to vacuum chamber 1 through a pipeline. After the substrate 11 is placed, the vacuum chamber 1 is closed, and the internal pressure is adjusted, the evaporation source 4 is heated to form evaporation vapor. The evaporation vapor permeates the vacuum chamber 1 and is deposited on the substrate 11 through the perforations on the mask 15, thereby forming a specific film layer on the substrate 11. Typically, the evaporation source 4 can be placed inside the vacuum chamber 1, for example, on the bottom wall of the vacuum chamber 1, with a support member 12 above it, so that the mask 15 and the substrate 11 are located above the evaporation source 4.

[0042] It is precisely because of these operations that many components are placed in the vacuum chamber 1 that are close to the vapor deposition source 4 / vapor outlet. As the number of vapor deposition cycles in the vacuum chamber 1 increases, impurities will be deposited on the surface of these components. During the vapor deposition process, affected by the hot vapor of the vapor deposition material, these deposited impurities are easily floated back into the chamber, affecting the vacuum environment. Some may also be deposited on the substrate 11, affecting the vapor deposition quality and the film performance on the substrate 11.

[0043] In the existing technology, the vacuum chamber 1 is usually cleaned regularly. However, manual cleaning is too inefficient, and cleaning with active substances such as plasma takes a long time each time. Frequent cleaning will affect the operating efficiency of the vacuum chamber 1.

[0044] In view of this, this application provides a vapor deposition system with a monitoring and control system, which can monitor and determine the contamination level of the vacuum chamber 1 in a timely manner after each vapor deposition process. Through precise monitoring of the indoor environment of the vacuum chamber 1 and many key components, the system can promptly activate the plasma cleaning device for cleaning when the cleanliness level of the chamber decreases. Furthermore, due to the targeted monitoring of key components, the system can accurately determine the contaminants and perform precise cleaning on the key components, thereby improving the cleaning quality. In particular, based on the monitoring feedback from multiple cameras 6, the system can accurately determine the contamination level of the inner wall of the chamber (including the top wall, side wall, and bottom wall) and many key components. Based on the severity of the contamination, the system can adjust the cleaning parameters and control the cleaning time, thereby using an appropriate cleaning time. This ensures the cleaning effect while minimizing the cleaning time, thus improving cleaning efficiency and achieving the goal of improving production efficiency by reducing the cleaning time of the vacuum chamber 1.

[0045] Please refer to the attached document. Figures 1-7 The vapor deposition system provided in this application includes a vacuum chamber 1, and a vacuum device 2, a vapor deposition apparatus, a chamber assembly, a cleaning device, and a monitoring and control system disposed in the vacuum chamber 1. The vacuum device 2 is used to create a vacuum environment within the vacuum chamber 1, and includes a pipeline connected to the vacuum chamber 1 and a vacuum pump installed on the pipeline. The vapor deposition apparatus includes a vapor deposition source 4 and a vapor deposition assembly for heating the vapor deposition source 4, and fills the vacuum chamber 1 with coating material vapor. The vapor deposition source 4 can be placed inside the vacuum chamber 1, for example, on the bottom wall of the vacuum chamber 1, or the vapor deposition source 4 can be located in an evaporation chamber outside the vacuum chamber 1. The evaporation chamber is connected to the vacuum chamber 1 via a pipeline, and a vapor outlet for the coating material vapor to flow into the vacuum chamber 1 is provided on the vacuum chamber 1.

[0046] The chamber assembly is disposed within the vacuum chamber 1 and includes a support member 12 for supporting the substrate 11 and the mask 15, a connecting member 14 for aligning and bonding the substrate 11 and the mask 15, an alignment mark head for marking the substrate 11, and a conveying member 13 for conveying the substrate 11, etc. Figure 1 As shown, a conveying component 13, such as a conveyor track or conveyor belt, is typically installed inside the vacuum chamber 1. A support component 12 is mounted on the conveying component 13, and a mask plate 15 is placed on the support component 12. After the substrate 11 is transferred into the vacuum chamber 1 by a robotic arm or similar component, it can be transferred and aligned and stacked on top of the mask plate 15 by an adsorption or clamping component. An alignment marking head marks the substrate 11 according to the pattern on the mask plate 15, for example, marking base points. The connecting component 14 can be a clamping component or a pressing component, such as a pressure plate, that presses the substrate 11 to make it substantially in contact with the mask plate 15. A support component 12 for supporting the substrate 11 and the mask plate 15 is provided above the evaporation source 4 or the vapor outlet, and the support component 12 is mounted on the conveying component 13. These components are all close to the evaporation source 4, and impurities can easily be deposited on their outer surfaces.

[0047] The cleaning device includes a plasma generator 3 (typically including an excitation chamber, a plasma source, and an exciter), a nozzle connected to the plasma generator 3 via a pipeline, and a nozzle 31 mounted on the nozzle; the nozzle 31 is used to extend into the vacuum chamber 1 and eject plasma into the chamber.

[0048] The monitoring and control system includes a camera array and a control system. The camera array comprises multiple cameras 6, distributed across multiple areas of the vacuum chamber 1. At least some of the cameras 6 are used to monitor key components. These key components include any one or any combination of the support component 12, connecting component 14, alignment marker head, and conveying component 13 in the aforementioned chamber assembly. Preferably, the key components include all the components listed in the aforementioned chamber assembly. The multiple cameras 6 work collaboratively, with some capturing images of the indoor environment, some capturing images of the inner walls of the chamber, and some specifically capturing images of the outer surfaces of these key components. In this way, the multiple cameras 6 not only comprehensively capture images of the indoor environment and inner walls of the vacuum chamber 1 from multiple directions but also accurately monitor many key components.

[0049] The camera array captures photos and transmits them to the control system. The control system compares the captured photos with pre-stored reference photos. By acquiring comparison features, such as the surface color of the components shown in the photos, the number of clumps in the area, the uniformity and variation of the surface color of the components in the area, and the content of visible particles in the area, the control system determines the degree of difference between the captured photos and the reference photos. Based on the degree of difference, the pollution level is determined. Specifically, the pollution level can be determined based on the number of different features in the comparison features, such as the number of clumps, particle content, and the number of areas with color variation in the area.

[0050] Based on feedback from the camera array, the control system activates the cleaning device when the cleanliness level in vacuum chamber 1 falls below a preset threshold, i.e., when the contamination level reaches a preset critical level, and when the vapor deposition device is off and vacuum chamber 1 is idle (i.e., before or after the vapor deposition process). The system adjusts the cleaning parameters according to the contamination level to control the cleaning intensity and duration. These parameters include the plasma jet duration and volume. This allows for timely monitoring and assessment of the contamination level in vacuum chamber 1 after each vapor deposition process. Targeted monitoring of the chamber's inner walls and key components ensures accurate results, enabling timely cleaning when the contamination level necessitates cleaning. This ensures precise cleaning of vacuum chamber 1 and key components near the vapor deposition source 4, guaranteeing accurate and effective cleaning. Furthermore, the system adjusts cleaning parameters based on the contamination level, controlling the cleaning time to avoid excessive cleaning time or number of cleaning cycles that could negatively impact production efficiency.

[0051] As can be seen from the above, this application uses plasma to clean the vacuum chamber 1, ensuring cleaning intensity and ease of operation. Simultaneously, this application employs multiple cameras 6 to monitor the vacuum chamber 1 from multiple angles and directions, specifically monitoring key components near the vapor deposition source 4 within the chamber. When the surface cleanliness of the chamber wall and key components decreases, timely cleaning is performed. Furthermore, feedback from the cameras 6 allows for precise measurement of the contamination level, enabling adjustments to cleaning parameters based on this level to control cleaning intensity and time. This not only achieves precise cleaning of the inner wall and key components of the vacuum chamber 1 for better cleaning results but also allows for appropriate cleaning time, minimizing cleaning time while maintaining cleaning intensity, thus improving cleaning efficiency. This reduces the cleaning time of the vacuum chamber 1, thereby increasing production efficiency.

[0052] The camera 6 includes a base, a rotating frame 62 rotatably mounted on the base, and a camera body 61 rotatably mounted on the rotating frame 62 via a rotating shaft. The axis of the rotating frame 62 and the rotating shaft are perpendicular to each other, so that the camera body 61 can rotate 360°. Each camera 6 can take pictures from multiple angles, which can improve the accuracy of the control system in determining the pollution level.

[0053] like Figure 2 and Figure 3As shown, to prevent the screen of the camera 6 from being contaminated by the vapor-deposited material, resulting in unclear images, an isolation cover 7 for housing the camera 6 is provided inside or outside the vacuum chamber 1. The isolation cover 7 is equipped with a gate 71 connected to the vacuum chamber 1, which is opened when the camera 6 is taking pictures. This avoids the tedious operation of frequent cleaning due to frequent contamination of the camera 6. Furthermore, the gate 71 connects the isolation cover 7 and the vacuum chamber 1, allowing them to form the same pressure environment.

[0054] Furthermore, in some embodiments, such as Figure 4 As shown, the camera 6 is retractably mounted inside the isolation chamber 7 via a moving mechanism 5, so that after the gate 71 is opened, it can extend out of the isolation chamber 7 and move to a set distance from the target component via the moving mechanism 5 to take close-up pictures of the key component. The target component is the inner wall of the vacuum chamber 1 and several key components inside the chamber.

[0055] For example, such as Figure 2 As shown, the first camera 6a is disposed on the top wall of the vacuum chamber 1 and is centrally located, for photographing the four side walls and bottom wall of the vacuum chamber 1; the second camera 6b is disposed on the bottom wall of the vacuum chamber 1, for photographing the top wall of the vacuum chamber 1; the third camera 6c is disposed on the side wall or top wall of the vacuum chamber 1, for photographing the connecting component 14 and / or the pressing component used to press against the basic components; there are multiple third cameras 6c, one third camera 6c corresponds to one row of supporting components 12, or corresponds to multiple supporting components 12 in one area.

[0056] Furthermore, a rotating base 54 is provided at the end of the moving mechanism 5, and the base of the camera 6 is connected to the rotating base 54, so that it can move in multiple directions and take pictures from multiple angles around the target component. In this way, it can not only take pictures at close range, but also take pictures from multiple angles and directions, so as to improve the accuracy of pollution level determination.

[0057] like Figure 5As shown, this application provides an example of a moving mechanism 5, which includes a base, a rotating disk 51 rotatably mounted on the base, a first connecting rod 52 hinged to the rotating disk 51 via a first rotating shaft, a second connecting rod 53 hinged to the first connecting rod 52 via a second rotating shaft, and a rotating seat 54 hinged to the end of the second connecting rod 53 via a third rotating shaft. The axial directions of the rotating disk 51, the first rotating shaft, and the second rotating shaft can be perpendicular to each other, for example, in the spatial X, spatial Y, and spatial Z directions. The rotating disk 51, the first rotating shaft, the second rotating shaft, and the third rotating shaft are each equipped with their own power components, such as motors or cylinders, and can rotate independently. The rotating disk 51 can rotate 360° around its own axis. Thus, by controlling the rotation angle of the rotating disk 51 and the rotation angle of each rotating shaft, the camera 6 located at the end can move in multiple directions, accurately moving to the target position, which is beneficial for adjusting the shooting distance between the camera 6 and the target component, and allows the camera 6 to shoot around the key component from multiple angles.

[0058] Meanwhile, the moving mechanism 5 is set as a multi-link robotic arm structure, which facilitates small-volume shrinkage and allows it to retract into the isolation cover 7 as a whole, thus reducing the volume of the isolation cover 7.

[0059] In some embodiments, the vapor deposition system is also equipped with an alarm device. The control system determines the contamination level by comparing photos taken by the camera array with pre-stored reference photos in the system, and sends a cleaning alarm via the alarm device when a cleaning operation is required, such as sounding a horn and / or flashing lights. The cleaning alarm enables production line workers to be promptly informed that the vacuum chamber 1 needs cleaning, thereby allowing for appropriate production control.

[0060] In some embodiments, the control system can also determine whether an abnormal situation exists based on the level of contamination and the duration of contamination since the last cleaning. If the determination is positive, an abnormal alarm will be generated via an alarm device. Thus, if a relatively serious contamination occurs again shortly after cleaning, it indicates an abnormal factor. An abnormal alarm allows staff to promptly investigate and avoid safety risks. Abnormal alarms can be distinguished from cleaning alarms, such as by different alarm types or, although the alarms are of the same type, different numbers of alarm messages. For example, a cleaning alarm might be a flashing light, while an abnormal alarm might be a siren; or a cleaning alarm might be a single siren, while an abnormal alarm might be two or more siren sounds.

[0061] The control system can regulate the cleaning parameters by controlling the plasma generator 3. Alternatively, the plasma generator 3 can include, in addition to the excitation chamber, plasma source, and excitation device, a heating device for heating the excited plasma and / or a compressor for compressing the plasma. The control system is connected to the heating device to regulate the heating duration and temperature, and / or connected to the compressor to regulate the plasma ejection pressure and temperature. Heating the plasma can regulate its temperature, and controlling the compressor to compress the plasma can regulate its ejection pressure and temperature (compressing the plasma can also increase its temperature).

[0062] The heating device can be specifically located inside the excitation chamber, within the chamber wall, or outside the nozzle, encasing it. The heating component can be a heating mesh composed of multiple heating tubes arranged in a crisscross pattern, laid within the chamber wall or wrapped around the nozzle. Each heating tube can be composed of multiple heating wires. A thermally conductive material can be filled between the heating mesh and the wall panel forming the chamber wall or the nozzle wall.

[0063] The compressor can be connected to the nozzle or directly to the excitation chamber via a pipeline.

[0064] like Figure 6 As shown, the cleaning device has multiple nozzles 31, which can be fixedly installed inside the vacuum chamber 1 and arranged at intervals along the arrangement direction of the support member 12. The nozzles 31 can be connected to the side wall or top wall of the vacuum chamber 1 and face the convergence area of ​​the critical components. In this way, by using multiple nozzles 31 to perform targeted, close-range cleaning of numerous critical components, the cleaning power and cleaning effect can be improved.

[0065] In some embodiments, such as Figure 7 As shown, the multiple nozzles 31 include a main nozzle 31a and multiple special nozzles 31b. The nozzle system includes a main nozzle 32 and a special nozzle 33. The main nozzle 31a is disposed on the main nozzle and located in the middle region of the top wall of the vacuum chamber 1 or above the middle of the vapor deposition region. The main nozzle 32 can be connected to the top wall of the chamber. The special nozzle 33 is connected to the side wall of the chamber and located on one side of the support member 12. Multiple special nozzles 31b are disposed and arranged at intervals along the arrangement direction of the support member 12 on the special nozzle 33, and are located on the side of the special nozzle 33 facing the support member 12 and towards key components such as the support member 12 and the connecting member 14. When the support member 12, the conveying member 13, etc. of the vacuum chamber 1 have multiple rows, two sets of special nozzles 33 and special nozzles 31b can be disposed, arranged on both sides of the chamber.

[0066] Alternatively, there may be multiple special nozzles 33, each of which is located above or to one side of a conveying component 13 or a row of support components 12. Multiple special nozzles 31b are arranged on the special nozzles 33 at intervals along the arrangement direction of the support components 12, with each special nozzle 31b located above or to one side of the support component 12 or the mask plate 15.

[0067] This application also provides a monitoring and cleaning method applicable to the above-mentioned vapor deposition system, the monitoring and cleaning method comprising:

[0068] S1, monitor the status of the vapor deposition device. When the vacuum chamber 1 is idle, open the isolation cover so that the camera group can take pictures of the inner wall of the vacuum chamber 1 and the outer surface of multiple key components inside the chamber.

[0069] S2. Compare the photos taken by the camera group with the reference photos stored in the system and extract the comparison features. The comparison features include any one or any combination of the following: the surface color of the component shown in the photo, the number of clumps in the area, the uniformity and variation of the surface color of the component in the area, and the content of visible particles in the area.

[0070] S3, determine the pollution level based on the differences in the comparison features;

[0071] S4, start the cleaning program and adjust the pressure inside vacuum chamber 1 to the preset pre-cleaning ambient pressure, which is 10 mbar to 1 × 10⁻⁶ mbar. -3 At pressures of millibars or below, especially at 1×10 -4 At pressures of millibars or below;

[0072] S5, adjust the cleaning parameters of the cleaning device according to the pollution level to set the cleaning duration that matches the pollution level. The cleaning parameters include at least the plasma jetting duration and jetting volume.

[0073] S6, adjust the plasma ejection rate per unit time to maintain the cleaning pressure in the vacuum chamber 1 within the set purification pressure range, which is 50 mmB to 280 mmB.

[0074] This method enables timely monitoring and assessment of the contamination level of vacuum chamber 1 after each vapor deposition process. Targeted monitoring of the chamber's inner wall and numerous key components allows for accurate determination of the contamination level. When the contamination level reaches a point requiring cleaning, timely cleaning is performed. Furthermore, based on the contamination level assessment, cleaning parameters can be adjusted to control the appropriate cleaning time. This approach shortens the cleaning time while ensuring cleaning effectiveness, thereby reducing the time spent in the cleaning process of vacuum chamber 1 and improving production efficiency by extending the operation time of the vapor deposition process in vacuum chamber 1.

[0075] Meanwhile, before performing plasma cleaning on vacuum chamber 1, the pressure inside the chamber is adjusted to an extremely low pressure. On the one hand, this can remove the gas inside the chamber and remove floating objects. On the other hand, it can promote plasma diffusion. During the cleaning process, by adjusting the plasma injection pressure and the injection volume per unit time, the cleaning pressure inside vacuum chamber 1 is maintained within the set purification pressure range. This can maintain an effective cleaning process, ensure plasma mobility, improve the final cleaning intensity and effect, and also shorten the cleaning time.

[0076] Note: 1 millibar (mbar) = 100 pascals (Pa).

[0077] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0078] The components and devices described in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the accompanying drawings. As those skilled in the art will recognize, these components and devices can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the words “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0079] It should also be noted that in the apparatus and equipment of this application, the components can be disassembled and / or reassembled. These disassemblies and / or reassemblies should be considered as equivalent solutions of this application.

[0080] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0081] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0082] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A vapor deposition system, characterized in that, It includes a vacuum chamber, and a vacuum device, a vapor deposition device, a chamber assembly, a cleaning device, and a monitoring and control system disposed in the vacuum chamber; The cleaning device includes a plasma generator, a nozzle, and a nozzle mounted on the nozzle for ejecting plasma into the vacuum chamber. The monitoring and control system includes a camera group and a control system. The camera group includes multiple cameras distributed within the vacuum chamber, and at least some of the multiple cameras are used to monitor key components within the chamber, so as to monitor both the indoor environment of the vacuum chamber and the key components. The key components include any one or any combination of the following: a support component for supporting the substrate and the mask; a connecting component for aligning and bonding the substrate and the mask; an alignment marking head for marking the substrate; and a conveying component for conveying the substrate. The control system monitors the contamination level of the vacuum chamber based on the images captured by the camera group, and can activate the cleaning device to clean the inner wall of the vacuum chamber and the outer surface of the key components using plasma. The system also adjusts the cleaning parameters of the cleaning device according to the level of contamination to control the cleaning duration and intensity. The cleaning parameters include at least the plasma injection duration and injection volume.

2. The vapor deposition system as described in claim 1, characterized in that, The control system determines the pollution level by comparing photos taken by the camera group with reference photos stored in the system. The comparison features obtained include any one or any combination of the following: the surface color of the component shown in the photo, the number of clumps in the area, the uniformity and variation of the surface color of the component in the area, and the content of visible particles in the area.

3. The vapor deposition system as described in claim 1, characterized in that, An alarm device is also provided. The control system determines the level of contamination by comparing the photos taken by the camera group with the reference photos stored in the system, and sends a cleaning alarm through the alarm device when a cleaning operation needs to be initiated. And / or, the control system determines whether it is an abnormal situation based on the level of contamination and the duration of the condition after the most recent cleaning, and if the determination result is yes, it generates an abnormal alarm through the alarm device.

4. The vapor deposition system as described in claim 1, characterized in that, The plasma generator also includes an excitation chamber, a plasma source, an excitation device, a heating device for heating the excited plasma, and / or a compressor for compressing the plasma. The control system is connected to the heating device to regulate the heating duration and heating temperature, and / or connected to the compressor to regulate the plasma injection pressure and temperature.

5. The vapor deposition system as described in claim 1, characterized in that, The nozzles are arranged in multiples and spaced apart along the arrangement direction of the support components, and are connected to the side wall or top wall of the vacuum chamber and facing the convergence area of ​​the key components.

6. The vapor deposition system as described in claim 1, characterized in that, The camera includes a base, a rotating frame rotatably mounted on the base, and a camera body rotatably mounted on the rotating frame, the camera body being capable of 360° rotation.

7. The vapor deposition system as described in claim 1 or 6, characterized in that, It is also equipped with an isolation enclosure to house the camera; The isolation cover is equipped with a gate that communicates with the vacuum chamber, which is opened when the camera is taking pictures.

8. The vapor deposition system as described in claim 7, characterized in that, The camera is telescopically mounted inside the isolation cover via a moving mechanism, so that it can extend out of the isolation cover after the gate is opened, and can move to a set distance from the target component via the moving mechanism, and can move around the target component in multiple directions to take pictures from multiple directions; the target component is the inner wall of the vacuum chamber and the key component.

9. A method for monitoring and cleaning a vapor deposition system, characterized in that, The monitoring and cleaning method applicable to the vapor deposition system of any one of claims 1-8 includes: Monitor the status of the vapor deposition apparatus. When the vacuum chamber is idle, open the isolation cover to allow the camera group to photograph the inner wall of the vacuum chamber and the outer surfaces of multiple key components inside the chamber. Compare the photos taken by the camera group with the reference photos stored in the system and extract the comparison features. The comparison features include any one or any combination of the following: the surface color of the component shown in the photo, the number of clumps in the area, the uniformity and variation of the surface color of the component in the area, and the content of visible particles in the area. The pollution level is determined based on the differences in the comparison features. Initiate the cleaning procedure and adjust the pressure within the vacuum chamber to a preset pre-cleaning ambient pressure, which is 10 mbar to 1 × 10⁻⁶ mbar. -3 At pressures of millibars or below, especially at 1×10 -4 At pressures of millibars or below; The cleaning parameters of the cleaning device are adjusted according to the pollution level to set a cleaning duration that matches the pollution level. The cleaning parameters include at least the plasma injection duration and injection volume. Adjust the plasma ejection rate per unit time to maintain the cleaning pressure in the vacuum chamber within the set purification pressure range, which is 50 mbar to 280 mbar.

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