Transfer device for thin film deposition apparatus, transfer method, and array substrate

Abstract

The application discloses a film deposition equipment transfer device, a transfer method and an array substrate. The transfer device comprises a first chamber, a transfer chamber and at least one second chamber. The first chamber has a first hatch, a second hatch and a vacuum pump. When the first hatch and the second hatch are closed and the vacuum pump is opened, the first chamber can switch between a vacuum atmosphere and an atmospheric atmosphere. The second chamber is used for film deposition process. The second chamber has a third hatch. The transfer chamber is arranged between the first chamber and each second chamber. The transfer chamber is provided with a transfer mechanism and a bearing mechanism. The bearing mechanism is used for receiving a substrate to be processed input from the first chamber. The transfer mechanism is used for transferring the substrate to be processed to the second chamber. The transfer chamber is further provided with a calibration module. The calibration module is used for obtaining position information of the substrate to be processed. At least one of the bearing mechanism and the transfer mechanism is coupled with the calibration module to adjust the posture of the substrate to be processed into the second chamber.

Description

Technical Field

[0001] This application belongs to the field of display device technology, and particularly relates to a transfer device, transfer method and array substrate for thin film deposition equipment. Background Technology

[0002] Thin film deposition technology includes processes such as physical vapor deposition, chemical vapor deposition, and atomic layer deposition, used to prepare micro- and nano-scale homogeneous films. As one of the core processes, it runs through the entire display panel manufacturing process, including the fabrication of thin-film transistors, transparent conductive layers, and encapsulation layers. Therefore, its process quality is directly related to the product quality of the display panel.

[0003] Taking chemical vapor deposition (CVD) as an example, before entering the process chamber, the substrate needs to switch between an atmospheric atmosphere and a vacuum atmosphere in a buffer chamber, and then be transferred from the buffer chamber to the vacuum atmosphere process chamber for coating. However, the substrate is prone to deviation during the transfer process, which can affect the process quality in the process chamber, causing breakage or even equipment damage. Summary of the Invention

[0004] This application provides a transfer device, transfer method, and array substrate for thin film deposition equipment, which can reduce the transfer position difference that may occur on the substrate during the thin film deposition process, thereby improving process accuracy and product quality.

[0005] In a first aspect, embodiments of this application provide a transfer device for a thin-film deposition apparatus, used to prepare an array substrate for a display panel. The transfer device includes a first chamber, a transfer chamber, and at least one second chamber. The first chamber has a first door, a second door, and a vacuum pump. The first door is used for feeding the substrate to be processed into the first chamber, and the second door is used for discharging the substrate to be processed into the thin-film deposition process. When the first door and the second door are closed and the vacuum pump is turned on, the first chamber can switch between a vacuum atmosphere and an atmospheric atmosphere. The second chamber is used for performing the thin-film deposition process and has a third door to switch between opening and closing the second chamber. The transfer chamber is disposed between the first chamber and each of the second chambers. The transfer chamber is provided with a transfer mechanism and a carrying mechanism. The carrying mechanism is used to receive the substrate to be processed input from the first chamber, and the transfer mechanism is used to transfer the substrate to be processed to the second chamber. The transfer chamber is also provided with a calibration module, which is used to obtain the position information of the substrate to be processed. At least one of the carrying mechanism and the transfer mechanism is coupled to the calibration module to adjust the posture of the substrate to be processed as it enters the second chamber.

[0006] In some alternative embodiments, the calibration module includes a visual positioning camera that is positioned toward at least one of the carrying mechanism and the transfer mechanism.

[0007] In some alternative embodiments, the visual positioning camera is positioned between the first chamber and the transfer mechanism.

[0008] In some alternative embodiments, the visual positioning camera is positioned between the first chamber and the support mechanism.

[0009] In some alternative embodiments, at least two visual positioning cameras are provided, and the at least two visual positioning cameras are symmetrically arranged along the support mechanism.

[0010] In some optional embodiments, the visual positioning camera is configured to: automatically start at a first preset time interval, acquire at least two real-time images, and transmit each real-time image to the carrier mechanism and / or transfer mechanism.

[0011] In some optional embodiments, the calibration module further includes a supplementary lighting element that is positioned toward the substrate to be processed.

[0012] In some optional embodiments, the supplementary lighting element is configured to automatically start at a first preset time interval.

[0013] In some optional embodiments, the calibration module includes a distance sensor fixedly connected to the support mechanism, the distance sensor being used to obtain the offset distance between the actual position of the substrate to be processed and the target position.

[0014] In some alternative embodiments, the distance sensor includes at least one of a laser sensor, a capacitive sensor, and a photoelectric sensor.

[0015] In some optional embodiments, the calibration module further includes a tilt sensor, which is fixedly connected to the support mechanism. The tilt sensor is used to obtain the offset angle between the actual position of the substrate to be processed and the target position.

[0016] In some alternative embodiments, at least two second chambers are provided, and the third hatch of each second chamber is coupled to the transfer mechanism.

[0017] In some alternative embodiments, each of the second chambers is arranged symmetrically along the support mechanism.

[0018] In some alternative embodiments, each of the second chambers is arranged linearly symmetrically along the support mechanism.

[0019] In some alternative embodiments, the first chamber and each of the second chambers are arranged circumferentially along the transfer chamber.

[0020] In some alternative embodiments, the first chamber and each of the second chambers are adjacent to each other to form a transfer chamber.

[0021] In some alternative embodiments, the first chamber includes a pre-calibration module, which includes at least one clamping member coupled to a vacuum pump.

[0022] In some alternative embodiments, the clamp is configured to automatically start after a second preset time interval when the vacuum pump is turned on.

[0023] In some alternative embodiments, at least two clamping members are provided, each clamping member being symmetrically arranged about the first chamber.

[0024] In some alternative embodiments, the clamping elements are arranged symmetrically about the center of the first chamber.

[0025] In some optional embodiments, the transfer device for the thin film deposition equipment further includes a control module, which is communicatively connected to a calibration module and coupled to a transfer mechanism. The control module is configured to adjust the action of the transfer mechanism based on the position information of the substrate to be processed obtained by the calibration module.

[0026] In some alternative embodiments, the control module is coupled to a carrier mechanism configured to identify the position of the substrate to be processed and provide feedback to the control module.

[0027] Secondly, embodiments of this application provide a method for transferring a thin film deposition apparatus, the method comprising:

[0028] The substrate to be processed is provided to the first chamber, the first chamber is sealed and a vacuum process is performed;

[0029] Transfer the substrate to be processed into the transfer chamber;

[0030] Obtain the position information of the substrate to be processed;

[0031] The substrate to be processed is adjusted based on the position information and transferred to the second chamber.

[0032] In some optional embodiments, adjusting the substrate to be processed based on position information includes:

[0033] Adjust the bearing posture of the substrate to be processed based on the position information; and / or,

[0034] The transfer path of the substrate to be processed is adjusted based on the location information.

[0035] Thirdly, embodiments of this application provide an array substrate, which is fabricated based on a transfer device for a thin film deposition apparatus provided in any embodiment of the first aspect, or the array substrate is fabricated based on a transfer method for a thin film deposition apparatus provided in any embodiment of the second aspect.

[0036] The thin film deposition apparatus provided in this application includes a transfer chamber between a first chamber for switching gas atmospheres and a second chamber for performing the process. The substrate can be temporarily stored in a support mechanism within the transfer chamber before being transferred into the second chamber by a transfer mechanism. Furthermore, the transfer chamber is equipped with a calibration module. This module can adjust the position of the substrate via the support mechanism to ensure accurate substrate gripping by the transfer mechanism, or it can change the movement path of the transfer mechanism to eliminate deviations occurring during the transfer of the substrate from the first chamber to the transfer chamber, thereby improving the positioning accuracy of the substrate entering the second chamber and enhancing process quality. Attached Figure Description

[0037] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0038] Figure 1 This is a schematic diagram of the structure of a transfer device for a thin film deposition apparatus according to an embodiment of this application;

[0039] Figure 2 This is a schematic diagram of the structure of a transfer device for a thin film deposition apparatus according to another embodiment of this application;

[0040] Figure 3 This is a schematic diagram of the structure of a transfer device for a thin film deposition apparatus according to another embodiment of this application;

[0041] Figure 4 This is a schematic flowchart of a thin film deposition apparatus transfer method according to an embodiment of this application;

[0042] Figure 5 This is a schematic diagram of a sub-process of a transfer method according to an embodiment of this application.

[0043] The reference numerals in the detailed embodiments are as follows:

[0044] 100. First chamber; 110. Pre-calibration module;

[0045] 200. Transfer chamber; 210. Carrying mechanism; 220. Transfer mechanism; 230. Calibration module;

[0046] 300. Second chamber. Detailed Implementation

[0047] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0049] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0050] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0051] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0052] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0053] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0054] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0055] Thin film deposition technology includes processes such as physical vapor deposition, chemical vapor deposition, and atomic layer deposition, used to prepare micro- and nano-scale homogeneous films. As one of the core processes, it runs through the entire display panel manufacturing process, including the fabrication of thin-film transistors, transparent conductive layers, and encapsulation layers. Therefore, its process quality is directly related to the product quality of the display panel.

[0056] Taking chemical vapor deposition (CVD) as an example, before entering the process chamber, the substrate needs to switch between an atmospheric atmosphere and a vacuum atmosphere in a buffer chamber, and then be transferred from the buffer chamber to the vacuum atmosphere process chamber for coating. However, the substrate is prone to deviation during the transfer process, which can affect the process quality in the process chamber, causing breakage or even equipment damage.

[0057] To address the problems of the prior art, embodiments of this application provide a transfer device, transfer method, and array substrate for thin film deposition equipment, which can reduce the transfer position difference that may occur on the substrate during the thin film deposition process, thereby improving process accuracy and product quality. The transfer device for thin film deposition equipment provided in this application embodiment will be described below first.

[0058] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a transfer device for a thin film deposition apparatus according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a transfer device for a thin film deposition apparatus according to another embodiment of this application; Figure 3 This is a schematic diagram of the structure of a transfer device for a thin film deposition apparatus according to another embodiment of this application.

[0059] In a first aspect, embodiments of this application provide a transfer device for a thin-film deposition apparatus, used to fabricate an array substrate for a display panel. The transfer device includes a first chamber 100, a transfer chamber 200, and at least one second chamber 300, with the transfer chamber 200 disposed between the first chamber 100 and each of the second chambers 300. The transfer chamber 200 includes a transfer mechanism 220, a support mechanism 210, and a calibration module 230. The support mechanism 210 receives the substrate to be processed input from the first chamber 100 to the transfer chamber 200. The transfer mechanism 220 transfers the substrate to be processed to the second chamber 300. The calibration module 230 acquires the position information of the substrate to be processed. At least one of the support mechanism 210 and the transfer mechanism 220 is coupled to the calibration module 230 to adjust the orientation of the substrate entering the second chamber 300 according to the position information of the substrate.

[0060] Specifically, the first chamber 100 has a first door, a second door, and a vacuum pump. The first door is used for feeding the substrate to be processed into the first chamber 100. When the first door is opened, the first chamber 100 can be connected to the previous process to complete the transfer of the substrate to be processed from the previous process to the thin film deposition process. The second door is used for discharging the substrate to the transfer chamber 200 and the second chamber 300. When the first door and the second door are closed, the first chamber 100 becomes a sealed environment. When the vacuum pump is turned on to evacuate the gas in the first chamber 100, the first chamber 100 can be switched to a vacuum atmosphere. Alternatively, when the vacuum pump is turned on to pump gas into the first chamber 100, the first chamber 100 can be switched to an atmospheric atmosphere.

[0061] It is understandable that, except for the first chamber 100, the transfer chamber 200 and each of the second chambers 300 maintain a vacuum atmosphere.

[0062] Specifically, the second chamber 300 is used for thin film deposition processes. The second chamber 300 has a third door to switch the opening and closing of the second chamber 300, thereby realizing the transfer of the substrate between the transfer chamber 200 and the second chamber 300 or the thin film deposition of the substrate in the second chamber 300.

[0063] Optionally, when there are two or more second chambers 300, in some embodiments, one transfer mechanism 220 is provided and is used to transport the substrate to be processed to multiple second chambers 300; in other embodiments, multiple transfer mechanisms 220 are provided and are corresponding to each second chamber 300 in a one-to-one or one-to-many manner.

[0064] Therefore, the substrate can be temporarily stored in the carrier mechanism 210 at the transfer chamber 200 before being transported to the second chamber 300. The action of directly transporting the substrate from the buffer chamber to the process chamber is split into two actions: transporting the substrate from the first chamber 100 to the transfer chamber 200 and then transporting it from the transfer chamber 200 to the second chamber 300. Thus, one first chamber 100 can supply the substrate to multiple second chambers 300, thereby improving the transfer efficiency of the thin film deposition process. Furthermore, the transfer chamber 200 is also equipped with a calibration module 230, which is coupled to at least one of the carrier mechanism 210 and the transfer mechanism 220. The position information of the substrate to be processed in the transfer chamber 200 can be identified by the calibration module 230 and the carrier mechanism 210 or the transfer mechanism 220 can be adjusted in a timely manner. For example, the temporary storage position of the substrate to be processed can be adjusted, or the transport route of the substrate to be processed to the second chamber 300 can be adjusted, thereby improving the positioning accuracy of the substrate to be processed entering the second chamber 300, and thus improving the process quality and product quality.

[0065] According to some embodiments of this application, the calibration module 230 includes a visual positioning camera, which is disposed toward at least one of the carrying mechanism 210 and the transfer mechanism 220.

[0066] Optionally, a visual positioning camera is positioned toward the support mechanism 210 and used to acquire the temporary position of the substrate to be processed, and the offset information between the temporary position and the target position is obtained by comparison.

[0067] Alternatively, the visual positioning camera is coupled to the carrier mechanism 210, which adjusts according to the offset information to send the substrate to be processed back to the target position.

[0068] Optionally, the visual positioning camera is positioned toward the transfer mechanism 220 and used to acquire intermediate position information during the transfer process of the substrate to be processed, and then the movement path of the transfer mechanism 220 is corrected in a timely manner based on the intermediate position information.

[0069] Alternatively, the visual positioning camera is coupled to the transfer mechanism 220, which adjusts the route based on the intermediate position information.

[0070] Therefore, the visual positioning camera can identify the position information of the substrate to be processed and drive the carrying mechanism 210 and / or the transfer mechanism 220 to make corresponding adjustments, thereby eliminating the position difference caused by the transfer of the substrate to be processed from the first chamber 100 to the intermediate chamber 200.

[0071] According to some embodiments of this application, a visual positioning camera is disposed between the first chamber 100 and the transfer mechanism 220.

[0072] Optionally, a visual positioning camera is positioned above the carrier mechanism 210. Exemplarily, the lens of the visual positioning camera is positioned perpendicular to the carrier mechanism 210 to acquire a planar image of the substrate to be processed, improving its accuracy in recognizing the position information of the substrate to be processed at the carrier mechanism 210. It is understood that in some embodiments, the carrier mechanism 210 is provided with marker points for the visual positioning camera to identify the target location.

[0073] This improves the accuracy of the visual positioning camera in identifying the position of the substrate to be processed.

[0074] According to some embodiments of this application, a visual positioning camera is disposed between the first chamber 100 and the support mechanism 210.

[0075] Optionally, a visual positioning camera is positioned on the side of the second hatch facing the transfer chamber 200.

[0076] Optionally, the visual positioning camera is fixedly positioned relative to the support mechanism 210.

[0077] Therefore, the visual positioning camera can acquire the position information of the substrate to be processed in the transfer chamber 200 earlier and predict potential deviations in the temporary storage position or transfer path in advance, reducing the negative impact of subsequent accumulated errors on the positioning accuracy and process quality in the second chamber 300. Furthermore, the visual positioning camera can acquire images of the substrate to be processed at both the carrier mechanism 210 and the transfer mechanism 220, enabling continuous tracking and monitoring through multiple frames, thereby improving recognition accuracy and allowing for timely correction.

[0078] According to some embodiments of this application, at least two visual positioning cameras are provided, and the at least two visual positioning cameras are symmetrically arranged along the support mechanism 210.

[0079] Optionally, each visual positioning camera is arranged symmetrically about the center of the support mechanism 210. For example, there are two visual positioning cameras, one of which is located at the left front of the support mechanism 210 and the other is located at the right rear of the support mechanism 210.

[0080] Optionally, each visual positioning camera is arranged linearly symmetrically with respect to the carrier mechanism 210. For example, two visual positioning cameras are arranged symmetrically along the direction from the first chamber 100 to the transfer chamber 200 of the substrate to be processed.

[0081] Therefore, multiple visual positioning cameras can eliminate blind spots present in a single viewpoint, improve position detection accuracy, and thus improve the return accuracy of the substrate, making it particularly suitable for calibration work of substrates with larger size or relatively complex structure.

[0082] According to some embodiments of this application, the visual positioning camera is configured to: automatically start at a first preset time interval, acquire at least two real-time images, and transmit each real-time image to the carrier mechanism 210 and / or the transfer mechanism 220.

[0083] Optionally, the calibration module 230 also includes a PLC controller, which drives the visual positioning camera to start and acquire real-time images at first preset time intervals. The PLC controller can perform differential analysis based on multiple frames of real-time images to identify the motion path of the substrate. For example, the first preset time interval is 0.5s.

[0084] Thus, the calibration module 230 can identify minute displacements of the substrate to be processed during the transfer process and control the transfer mechanism 220 to respond, thereby improving the accuracy of the correction operation.

[0085] According to some embodiments of this application, the calibration module 230 further includes a supplementary light element, which is disposed toward the substrate to be processed.

[0086] Optionally, the supplementary lighting device and the visual positioning camera are arranged on the same side. For example, both the supplementary lighting device and the visual positioning camera are arranged above the carrying mechanism 210, or both the supplementary lighting device and the visual positioning camera are arranged on the side of the second door facing the transfer chamber 200.

[0087] Optionally, the supplementary lighting component includes multiple LEDs arranged in a circular array around the visual positioning camera.

[0088] Therefore, the supplementary lighting component can provide illumination to the substrate to be processed to improve the contrast of the image acquired by the visual positioning camera, thereby enabling the visual positioning camera to work stably in complex lighting environments and improving the position detection accuracy.

[0089] According to some embodiments of this application, the supplementary lighting element is configured to automatically start at intervals of a first preset duration.

[0090] Optionally, the supplementary lighting component is connected to a PLC controller. The supplementary lighting component is triggered synchronously with the shooting signal from the visual positioning camera, or the supplementary lighting component is triggered before the shooting signal from the visual positioning camera.

[0091] Therefore, while meeting the requirements for high-precision lighting, it also helps to control production energy consumption.

[0092] According to some embodiments of this application, the calibration module 230 includes a distance sensor, which is fixedly connected to the support mechanism 210. The distance sensor is used to obtain the offset distance between the actual position of the substrate to be processed and the target position.

[0093] Optionally, the distance sensor is used to measure at least one of the vertical distance and the horizontal distance between the substrate to be processed and the support mechanism 210.

[0094] Therefore, the calibration module 230 directly obtains the offset between the substrate to be processed and the target position through the distance sensor to obtain the position information of the substrate to be processed at the support mechanism 210.

[0095] According to some embodiments of this application, the distance sensor includes at least one of a laser sensor, a capacitive sensor, and a photoelectric sensor.

[0096] It is understood that in some embodiments, the calibration module 230 includes a single laser sensor, capacitive sensor, or photoelectric sensor; in other embodiments, the calibration module 230 includes at least two of the laser sensor, capacitive sensor, or photoelectric sensor arranged in combination, to acquire position information at least two locations on the substrate to be processed in order to fit the actual position information of the substrate to be processed.

[0097] Therefore, the distance sensor can detect the offset of the substrate at the micrometer level, further improving the position detection accuracy of the substrate to be processed, thereby improving the alignment accuracy and process quality of the array substrate in the thin film deposition process.

[0098] According to some embodiments of this application, the calibration module 230 further includes a tilt sensor, which is fixedly connected to the support mechanism 210. The tilt sensor is used to obtain the offset angle between the actual position of the substrate to be processed and the target position.

[0099] Optionally, the tilt sensor is a MEMS gyroscope and embedded in the center of the support mechanism 210. The MEMS gyroscope can measure the tilt angle of the tilt sensor in multiple axes, thereby improving the detection accuracy.

[0100] Thus, the horizontal offset and deflection angle of the substrate to be processed relative to the target position are obtained simultaneously, so that the carrying mechanism 210 can make more precise adjustments, making the position of the substrate to be processed obtained by the transfer mechanism 220 tend to be the same each time and the posture of entering the second chamber 300 tend to be the same, thereby improving the consistency and process quality of the thin film deposition process.

[0101] According to some embodiments of this application, the second chamber 300 is provided with at least two.

[0102] Optionally, six second chambers 300 are provided, with one first chamber 100 and six second chambers 300 arranged in a ring to form a transfer chamber 200.

[0103] Optionally, the third door of each second chamber 300 is coupled to the transfer mechanism 220. The third door can open in advance in response to the action of the transfer mechanism 220 so that the transfer mechanism 220 does not have to wait. The transfer mechanism 220 can approach the third door in advance after the thin film deposition process is completed in order to obtain the processed substrate.

[0104] Optionally, the time required for the transfer mechanism 220 to transfer the substrate to be processed from the carrier mechanism 210 to the second chamber 300 is less than the time required for the substrate to be processed to pass through the first chamber 100 and enter the carrier mechanism 210.

[0105] Therefore, by utilizing the temporary storage function of the transfer chamber 200, the process of transferring the previous substrate to be processed from the carrier mechanism 210 to the second chamber 300 can be synchronized with the process of transferring the next substrate to be processed from the first chamber 100 to the carrier mechanism 210, thereby significantly improving the production cycle and achieving improved processing efficiency.

[0106] According to some embodiments of this application, each second chamber 300 is symmetrically arranged along the support mechanism 210.

[0107] Optionally, each of the second chambers 300 is arranged symmetrically about the center of the support mechanism 210.

[0108] Optionally, the distance from each second chamber 300 to the support mechanism 210 is the same. It should be noted that the same distance means that the numerical range between the minimum and maximum distance between any second chamber 300 and the support mechanism 210 at least partially overlaps with the numerical range between the minimum and maximum distance between any other second chamber 300 and the support mechanism 210.

[0109] This reduces the adjustments required when the transfer mechanism 220 transports the substrate to be processed to different second chambers 300, thereby improving the transfer efficiency of the transfer device.

[0110] According to some embodiments of this application, each second chamber 300 is arranged linearly and symmetrically along the support mechanism 210.

[0111] Optionally, each of the second chambers 300 is arranged symmetrically along the direction from the first chamber 100 to the transfer chamber 200 of the substrate to be processed.

[0112] According to some embodiments of this application, the first chamber 100 and each of the second chambers 300 are arranged circumferentially along the transfer chamber 200.

[0113] As a result, the distances between the first chamber 100 and the carrier mechanism 210 and the second chambers 300 tend to be consistent, thereby improving the synchronicity of the two actions of the first chamber 100 transporting the substrate to be processed to the carrier mechanism 210 and the transfer mechanism 220 transferring the substrate to be processed from the carrier mechanism 210 to the second chamber 300, thus improving the production cycle.

[0114] According to some embodiments of this application, the first chamber 100 and each of the second chambers 300 are adjacent to each other to form a transfer chamber 200.

[0115] This allows for a more compact layout of the transfer device and eliminates the need for a separate transfer chamber 200. The space enclosed by the second door and each of the third doors serves as the transfer chamber 200, making it suitable for high-density production line configurations and helping to control production costs.

[0116] According to some embodiments of this application, the first chamber 100 includes a pre-calibration module 110, which includes at least one clamping member coupled to a vacuum pump.

[0117] Optionally, when the vacuum pump is turned on, the clamping member moves synchronously toward the substrate to be processed in the first chamber 100 to perform a pre-calibration operation, so that the vacuuming operation and the pre-calibration operation in the first chamber 100 can be performed simultaneously, thereby improving the production cycle of the transfer device.

[0118] Optionally, a pneumatic gripper can be used as the clamping element.

[0119] Therefore, the pre-calibration module 110 can complete the preliminary calibration of the substrate to be processed in the first chamber 100, thereby reducing the positional difference that may occur in the transfer chamber 200, reducing the adjustment time required by the carrier mechanism 210 and / or the transfer mechanism 220, avoiding the continuous accumulation of errors during the transfer process, and improving the accuracy of the thin film deposition process and the quality of the product.

[0120] According to some embodiments of this application, the clamping member is configured to automatically start after a second preset time interval when the vacuum pump is turned on.

[0121] Understandably, the second preset duration can be adjusted according to actual production needs. The second preset duration can be 0, meaning that the vacuum pump and the clamping component start synchronously; or, the second preset duration can be any time scale greater than 0, so that the clamping component starts later than the vacuum pump.

[0122] Optionally, the pre-calibration module 110 completes its operation before the vacuum pump.

[0123] This reduces mechanical resonance caused by pressure changes during vacuum pump operation, improves the operational accuracy of the pre-calibration module 110, and reduces the calibration load on the transfer chamber 200.

[0124] According to some embodiments of this application, at least two clamping members are provided, each clamping member being symmetrically arranged about the first chamber 100.

[0125] Optionally, each clamping member is arranged linearly symmetrically about the first chamber 100. For example, each clamping member is arranged axially symmetrically along the movement path of the substrate to be processed into the first chamber 100; or, each clamping member is arranged axially symmetrically along a direction perpendicular to the movement path of the substrate to be processed into the first chamber 100.

[0126] Optionally, each clamping element is arranged symmetrically about the center of the first chamber 100.

[0127] Optionally, the clamping member abuts against the substrate, and each clamping member positions the substrate to be processed by pushing force in multiple different directions.

[0128] This makes the force applied to the substrate by each clamping component more consistent, improving the pre-calibration effect while reducing the possibility of damage caused by uneven force on the substrate.

[0129] According to some embodiments of this application, the transfer device for thin film deposition equipment further includes a control module, which is communicatively connected to the calibration module 230 and coupled to the transfer mechanism 220. The control module is configured to adjust the action of the transfer mechanism 220 based on the position information of the substrate to be processed obtained by the calibration module 230.

[0130] Therefore, the control module can at least realize the signal transmission between the calibration module 230 and the transfer mechanism 220, so that the transfer mechanism 220 can make route adjustments in response to the position information obtained by the calibration module 230, improve the coordination of the transfer device, and thus improve the transfer efficiency and process accuracy.

[0131] According to some embodiments of this application, the control module is coupled to the carrier mechanism 210, which is configured to: identify the position of the substrate to be processed and provide feedback to the control module.

[0132] Optionally, the support mechanism 210 includes at least one of a pressure sensor, a photoelectric sensor, and an ultrasonic probe to achieve positioning identification of the substrate to be processed.

[0133] Thus, the control module can promptly know the signal that the substrate to be processed has arrived at the carrier mechanism 210, and drive the calibration module 230 to start based on the signal, obtain the real-time image or offset of the substrate to be processed, and then make adjustments to the carrier mechanism 210 or the transfer mechanism 220 according to the real-time image or offset of the substrate to be processed.

[0134] Secondly, please refer to Figure 4 , Figure 4 This is a schematic flowchart of a transfer method for a thin film deposition apparatus according to an embodiment of this application. This application provides a transfer method for a thin film deposition apparatus, the transfer method including:

[0135] S100: Provide the substrate to be processed to the first chamber 100, seal the first chamber 100 and perform vacuuming;

[0136] S200: Transfer the substrate to be processed into the transfer chamber 200;

[0137] S300: Obtain the position information of the substrate to be processed;

[0138] S400: Adjust the substrate to be processed based on the position information and transfer the substrate to be processed to the second chamber 300.

[0139] Please see Figure 5 , Figure 5 This is a schematic diagram of a sub-process of a transfer method according to an embodiment of this application.

[0140] According to some embodiments of this application, step S300 includes:

[0141] S310. Check if the substrate to be processed is in place.

[0142] Optionally, the positioning of the substrate to be processed can be identified by setting a sensor at the carrier mechanism 210 or the transfer mechanism 220.

[0143] Alternatively, the sensor may be selected from at least one of a pressure sensor, a photoelectric sensor, and an ultrasonic probe to detect the arrival of the substrate to be processed.

[0144] According to some embodiments of this application, step S300 further includes:

[0145] S320. After the substrate to be processed is in place, the visual positioning camera is turned on to obtain a real-time image of the substrate to be processed. The real-time image is compared with the target image to obtain the position information of the substrate to be processed.

[0146] Optionally, in step S320, the supplementary lighting component is activated simultaneously with the activation of the visual positioning camera.

[0147] Optionally, in step S320, the visual positioning camera acquires at least two real-time images of the substrate to be processed.

[0148] According to some embodiments of this application, step S400 includes:

[0149] S410. Adjust the bearing posture of the substrate to be processed based on the position information.

[0150] Optionally, the position information includes at least one of the horizontal offset and the deflection angle of the substrate to be processed.

[0151] According to some embodiments of this application, step S400 includes:

[0152] S420: Adjust the transfer path of the substrate to be processed based on the location information.

[0153] Optionally, the position information includes at least one of the horizontal offset and the deflection angle of the substrate to be processed.

[0154] It is understood that steps S410 and S420 can be implemented individually or together. When steps S410 and S420 are implemented together, step S410 is implemented before step S420. In other words, the transfer device first adjusts the temporary storage position of the substrate to be processed through the carrying mechanism 210 so that the transfer mechanism 220 can accurately grasp the substrate to be processed. Then, it tracks the route of the transfer mechanism 220 to transfer the substrate to be processed to the second chamber 300 and makes timely correction adjustments, thereby reducing the positioning deviation of the substrate to be processed in the second chamber 300 and improving the process accuracy and product quality.

[0155] Thirdly, embodiments of this application provide an array substrate, which is fabricated based on a transfer device for a thin film deposition apparatus provided in any embodiment of the first aspect, or the array substrate is fabricated based on a transfer method for a thin film deposition apparatus provided in any embodiment of the second aspect.

[0156] Fourthly, embodiments of this application provide a display panel, which includes the array substrate provided in any embodiment of the third aspect.

[0157] Fifthly, embodiments of this application provide a display device, which includes the display panel provided in any of the embodiments of the fourth aspect above. Specifically, the display device provided in embodiments of this application includes, but is not limited to, devices with display functions such as mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, and control consoles.

[0158] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A transfer device for a thin film deposition apparatus, characterized in that, An array substrate used to fabricate a display panel includes: The first chamber has a first door, a second door, and a vacuum pump. The first door is used for feeding the substrate to be processed into the first chamber, and the second door is used for discharging the substrate to be processed into the thin film deposition process. When the first door and the second door are closed and the vacuum pump is turned on, the first chamber can switch between a vacuum atmosphere and an atmospheric atmosphere. At least one second chamber for performing a thin film deposition process, the second chamber having a third door to switch the second chamber open and closed; A transfer chamber is disposed between the first chamber and each of the second chambers. The transfer chamber is provided with a transfer mechanism and a carrying mechanism. The carrying mechanism is used to receive the substrate to be processed input from the first chamber, and the transfer mechanism is used to transfer the substrate to be processed to the second chamber. The transfer chamber is further equipped with a calibration module, which is used to obtain the position information of the substrate to be processed. At least one of the carrying mechanism and the transfer mechanism is coupled to the calibration module to adjust the posture of the substrate to be processed as it enters the second chamber.

2. The transfer device for thin film deposition equipment according to claim 1, characterized in that, The calibration module includes a visual positioning camera, which is positioned toward at least one of the carrying mechanism and the transfer mechanism. Preferably, the visual positioning camera is disposed between the first chamber and the transfer mechanism; Preferably, the visual positioning camera is disposed between the first chamber and the supporting mechanism; Preferably, at least two visual positioning cameras are provided, and the at least two visual positioning cameras are symmetrically arranged along the supporting mechanism; Preferably, the visual positioning camera is configured to: automatically start at a first preset time interval, acquire at least two real-time images, and transmit each of the real-time images to the carrying mechanism and / or the transfer mechanism.

3. The transfer device for thin film deposition equipment according to claim 2, characterized in that, The calibration module also includes a supplementary lighting element, which is positioned toward the substrate to be processed. Preferably, the supplementary lighting element is configured to automatically start at a first preset time interval.

4. The transfer device for thin film deposition equipment according to claim 1, 2, or 3, characterized in that, The calibration module includes a distance sensor, which is fixedly connected to the support mechanism. The distance sensor is used to obtain the offset distance between the actual position and the target position of the substrate to be processed. Preferably, the distance sensor includes at least one of a laser sensor, a capacitive sensor, and a photoelectric sensor; Preferably, the calibration module further includes a tilt sensor, which is fixedly connected to the support mechanism. The tilt sensor is used to obtain the offset angle between the actual position of the substrate to be processed and the target position.

5. The transfer device for thin film deposition equipment according to claim 1, characterized in that, The second chamber is provided in at least two forms, and the third door of each second chamber is coupled to the transfer mechanism; Preferably, each of the second chambers is arranged symmetrically along the supporting mechanism; Preferably, each of the second chambers is arranged linearly and symmetrically along the supporting mechanism; Preferably, the first chamber and each of the second chambers are arranged circumferentially along the transfer chamber; Preferably, the first chamber and each of the second chambers are adjacent to each other to form the transfer chamber.

6. The transfer device for thin film deposition equipment according to claim 1, characterized in that, The first chamber includes a pre-calibration module, which includes at least one clamping member coupled to the vacuum pump. Preferably, the clamping member is configured to automatically start after a second preset time interval when the vacuum pump is turned on; Preferably, at least two clamping members are provided, and each clamping member is symmetrically arranged about the first chamber; Preferably, each of the clamping members is arranged symmetrically about the center of the first chamber.

7. The transfer device for thin film deposition equipment according to claim 1, characterized in that, The transfer device for the thin film deposition equipment also includes a control module, which is communicatively connected to the calibration module and coupled to the transfer mechanism. The control module is configured to adjust the action of the transfer mechanism based on the position information of the substrate to be processed obtained by the calibration module. Preferably, the control module is coupled to the support mechanism, and the support mechanism is configured to: identify the position of the substrate to be processed and provide feedback to the control module.

8. A method for transferring a thin film deposition apparatus, characterized in that, include: The substrate to be processed is provided to the first chamber, the first chamber is sealed and a vacuum process is performed; Transfer the substrate to be processed into the transfer chamber; Obtain the position information of the substrate to be processed; The substrate to be processed is adjusted based on the position information and transferred to the second chamber.

9. The transfer method of the thin film deposition apparatus according to claim 8, characterized in that, The adjustment of the substrate to be processed based on position information includes: Adjust the bearing posture of the substrate to be processed based on the position information; and / or, The transfer path of the substrate to be processed is adjusted based on the location information.

10. An array substrate, characterized in that, It is manufactured based on the transfer device for thin film deposition equipment as described in any one of claims 1 to 7, or based on the transfer method for thin film deposition equipment as described in claim 8 or 9.

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