Chemical vapor deposition apparatus and control method thereof

Abstract

The application provides a chemical vapor deposition device and a control method thereof, and belongs to the technical field of chemical vapor deposition processes. The chemical vapor deposition device comprises a device body, two groups of pressure components and at least one group of standby components. The device body has a working chamber. The pressure component comprises a working vacuum pump, a first connecting pipeline and a first control valve. The working vacuum pump is connected with the working chamber through the first connecting pipeline and is used for forming a negative pressure environment in the working chamber. The first control valve is arranged on the first connecting pipeline. The standby component comprises a standby vacuum pump, a second connecting pipeline and a second control valve. The standby vacuum pump is connected with the working chamber through the second connecting pipeline. The second control valve is arranged on the second connecting pipeline. When one of the working vacuum pumps fails, the standby vacuum pump can be used to maintain the negative pressure environment in the working chamber, so that the phenomenon of dust backflow is avoided, and the stability of the chemical vapor deposition process is ensured.

Description

Technical Field

[0001] This application belongs to the technical field of chemical vapor deposition equipment, and more specifically, relates to a chemical vapor deposition equipment and its control method. Background Technology

[0002] Chemical vapor deposition (CVD), a core process in semiconductor, photovoltaic, and other fields, is a method for generating thin films by chemically reacting gaseous compounds or elements containing thin-film elements on a substrate surface in a vacuum environment. In CVD processes, the establishment and maintenance of the vacuum environment relies on the coordinated operation of two vacuum pumps. One pump is responsible for evacuating the chamber, while the other dynamically adjusts and maintains a stable process pressure within the chamber, ensuring that the pressure is kept at an ideal level and providing suitable negative pressure conditions for the chemical reaction.

[0003] However, when one of the vacuum pumps malfunctions and the pressure drops significantly or the machine stops, the other vacuum pump alone cannot maintain the negative pressure environment inside the chamber. This leads to an imbalance in the internal pressure of the chamber, which can cause external dust and impurities to be sucked into the chamber and backflow into the chamber. This not only contaminates the precision components inside the machine, but also requires immediate shutdown for cleaning of the inside of the chamber, affecting production efficiency. Summary of the Invention

[0004] The purpose of this application is to provide a chemical vapor deposition apparatus and its control method to solve the problems of pressure imbalance and contamination caused by vacuum pump failure in the prior art.

[0005] To achieve the above objectives, in a first aspect, this application provides a chemical vapor deposition apparatus, comprising:

[0006] The equipment body has a working chamber;

[0007] Two pressure components, each pressure component including a working vacuum pump, a first connecting pipe and a first control valve, wherein the working vacuum pump is connected to the working chamber through the first connecting pipe and the first control valve is disposed on the first connecting pipe;

[0008] At least one set of backup components, the backup components including a backup vacuum pump, a second connecting pipeline and a second control valve, the backup vacuum pump being connected to the working chamber through the second connecting pipeline, and the second control valve being disposed on the second connecting pipeline;

[0009] The controller is communicatively connected to the working vacuum pump, the standby vacuum pump, and the second control valve; the controller is configured to: activate the standby vacuum pump when one of the working vacuum pumps is in a risky operating state, and activate the second control valve when one of the working vacuum pumps is in an abnormal operating state.

[0010] In some embodiments of the first aspect, the backup component further includes a buffer container disposed in the second connecting pipeline, the buffer container being located between the second control valve and the backup vacuum pump, and the buffer container having a buffer chamber connected to the second connecting pipeline.

[0011] In some embodiments of the first aspect, the buffer container includes:

[0012] The container body is hollow inside;

[0013] A partition is slidably disposed inside the container body. The partition has a first surface and a second surface disposed opposite to each other along its sliding direction. The first surface and the inner wall of the container body together form the buffer chamber, and the second surface and the inner wall of the container body together form the installation chamber.

[0014] A driving component, disposed within the mounting chamber and connected to the partition, is used to drive the partition to slide inside the container body.

[0015] In some embodiments of the first aspect, a sliding sealing ring is provided on the periphery of the partition, and the outer wall of the sliding sealing ring slidably abuts against the inner wall of the container body.

[0016] In some embodiments of the first aspect, the backup component further includes a constant pressure pipeline and a constant pressure control valve, the constant pressure pipeline being connected to the buffer container and communicating with the buffer chamber, and the constant pressure control valve being disposed on the constant pressure pipeline for controlling the on / off state of the constant pressure pipeline.

[0017] In some embodiments of the first aspect, the device body is provided with a first pressure sensor for detecting the pressure inside the working chamber;

[0018] The backup component also includes a second pressure sensor, which is disposed in the buffer container and is used to detect the pressure inside the buffer chamber.

[0019] Secondly, this application also provides a control method for the chemical vapor deposition apparatus described in the first aspect, the control method comprising:

[0020] Obtain the operating parameters of the working vacuum pump;

[0021] Determine whether the working vacuum pump is in an abnormal or risky operating state based on the operating parameters.

[0022] When the working vacuum pump is in the risky operating state, start the vacuum pump to preheat it;

[0023] When the working vacuum pump is in the abnormal operating state, the second control valve is opened.

[0024] In some embodiments of the second aspect, the operating parameters include multiple operating data, and determining whether the working vacuum pump is in an abnormal or risky operating state based on the operating parameters includes:

[0025] Obtain multiple operating data points of the working vacuum pump;

[0026] Calculate the abnormal state score of the working vacuum pump based on multiple operating data.

[0027] When the abnormal state score exceeds the first abnormal state score threshold, the working vacuum pump is determined to be in the risky operating state;

[0028] When the abnormal state score exceeds the second abnormal score threshold, the working vacuum pump is determined to be in the abnormal operating state.

[0029] In some embodiments of the second aspect, starting the vacuum pump to preheat it includes:

[0030] Obtain the first pressure value of the working chamber;

[0031] Obtain the second pressure value of the buffer chamber;

[0032] Start the backup pump so that the difference between the first pressure value and the second pressure value is within the safe range threshold.

[0033] In some embodiments of the second aspect, before opening the second control valve, the method further includes:

[0034] If the difference between the first pressure value and the second pressure value does not reach the safety range threshold;

[0035] Based on the difference between the first pressure value and the second pressure value, the drive component is controlled to operate, so that the partition moves to adjust the buffer chamber to the corresponding volume, thereby making the difference between the first pressure value and the second pressure value reach the safety range threshold.

[0036] The beneficial effects of the chemical vapor deposition equipment and control method provided in this application are as follows: Compared with the prior art, by installing a backup component on the equipment body, when one of the working vacuum pumps fails, it can be switched to the backup vacuum pump in time to maintain the negative pressure environment in the working chamber, avoid dust backflow, thereby preventing contamination of the precision components inside the machine, improving production efficiency, and ensuring the stability of the chemical vapor deposition process. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the chemical vapor deposition apparatus in the embodiments of this application;

[0039] Figure 2 This is a cross-sectional view of the buffer container in an embodiment of this application;

[0040] Figure 3 for Figure 2 Enlarged view of section A;

[0041] Figure 4 This is a schematic diagram of the structure of a chemical vapor deposition apparatus according to another embodiment of this application;

[0042] Figure 5 This is a flowchart of the control method for the chemical vapor deposition apparatus in the embodiments of this application.

[0043] The following are the labeling elements in the figure:

[0044] 100 - Equipment body; 110 - First pressure sensor;

[0045] 200 - Pressure assembly; 210 - Working vacuum pump; 220 - First connecting line; 230 - First control valve;

[0046] 300-Spare component; 310-Spare vacuum pump; 320-Second connecting pipeline; 330-Second control valve; 340-Buffer container; 341-Container body; 3411-Buffer chamber; 3412-Mounting chamber; 342-Baffle; 3421-Sliding sealing ring; 3422-Guide rod; 343-Drive component; 3431-Mounting bracket; 3432-Rotating ring; 3433-Support screw; 3434-Drive motor; 350-Second pressure sensor; 360-Constant pressure pipeline; 370-Constant pressure control valve. Detailed Implementation

[0047] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0048] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0049] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0051] Firstly, this application provides a chemical vapor deposition apparatus, such as... Figure 1 As shown, the chemical vapor deposition equipment includes: the equipment body 100, two sets of pressure components 200 and at least one set of spare components 300.

[0052] The main body of the device 100 has a working chamber for containing reactants and products, providing a reaction environment for the products.

[0053] Two pressure components 200 are connected in parallel within the working chamber to create a negative pressure environment, providing stable reaction conditions for the product. Each pressure component 200 includes a working vacuum pump 210, a first connecting pipe 220, and a first control valve 230. The working vacuum pump 210 is connected to the working chamber via the first connecting pipe 220 to create a negative pressure environment. The first control valve 230 is located on the first connecting pipe 220 to control its on / off state. The working vacuum pump 210 can be a rotary vane vacuum pump or a turbomolecular pump. The first connecting pipe 220 can be a bellows or a flexible metal hose, and both ends of the first connecting pipe 220 can be connected to the equipment body 100 and the working vacuum pump 210 via flange structures. The first control valve 230 can be a manual vacuum valve, an electric vacuum valve, or a pneumatic vacuum valve.

[0054] During normal operation of the chemical vapor deposition (CVD) equipment, the first control valves 230 in both pressure components 200 are open, and the two working vacuum pumps 210 operate simultaneously, creating a negative pressure within the working chamber of the equipment body 100. This allows the reactive gases to smoothly enter the working chamber and undergo a chemical reaction under high temperature, forming a thin film deposited on the product surface. Simultaneously, the second control valve 330 can adjust the pressure in the working chamber according to the operational needs of the CVD equipment to maintain the required stable pressure environment within the working chamber.

[0055] The backup component 300 is activated in case one of the pressure components 200 fails, maintaining a negative pressure environment in the working chamber to ensure continuous reaction. The backup component 300 includes a backup vacuum pump 310, a second connecting pipe 320, and a second control valve 330. The backup vacuum pump 310 is connected to the working chamber via the second connecting pipe 320, and the second control valve 330 is located on the second connecting pipe 320 to control its on / off state. The backup vacuum pump 310 can be a rotary vane vacuum pump or a turbomolecular pump. The second connecting pipe 320 can be a bellows or a flexible metal hose, and both ends of the second connecting pipe 320 can be connected to the equipment body 100 and the backup vacuum pump 310 via flange structures. The second control valve 330 can be a manual vacuum valve, an electric vacuum valve, or a pneumatic vacuum valve.

[0056] During operation, if any pressure component 200 malfunctions, the backup component 300 can be quickly activated. By opening the second control valve 330, the backup vacuum pump 310 is connected to the working chamber via the second connecting pipe 320. The backup vacuum pump 310 works in conjunction with another working vacuum pump 210 that is in good operating condition to ensure a stable negative pressure environment in the working chamber, thereby guaranteeing the continuity of the chemical reaction and the stability of product quality. For a faulty working vacuum pump 210, its connection to the working chamber can be disconnected by closing the corresponding first control valve 230, facilitating subsequent maintenance or replacement.

[0057] The chemical vapor deposition (CVD) equipment also includes a controller (not shown in the figure), which can be a PLC, a microcontroller, or a hardware processor such as a CPU, GPU, FPGA, DSP, or ASIC. The controller monitors the status of each component in real time through a preset program to ensure stable system operation. When the main pressure component 200 malfunctions, the controller automatically switches to the backup component 300 to maintain a negative pressure environment and ensure reaction continuity. Simultaneously, the controller records operating data for subsequent analysis and optimization, improving the overall performance and reliability of the equipment.

[0058] Specifically, the controller can communicate with the working vacuum pump 210, the standby vacuum pump 310 and the second control valve 330, and is used to: turn on the standby vacuum pump 310 when one of the working vacuum pumps 210 is in a risky operating state, and to turn on the second control valve 330 when one of the working vacuum pumps 210 is in an abnormal operating state, so as to maintain the negative pressure environment of the working chamber.

[0059] The "risk operation state" refers to a situation where the operating parameters of the working vacuum pump 210 are close to the preset safety threshold. In this state, both working vacuum pumps 210 can still work together to maintain the negative pressure environment of the working chamber, but continued operation of the working vacuum pumps 210 may lead to performance degradation or malfunction. At this time, the controller starts the backup vacuum pump 310 to preheat it, preparing for connection with the working chamber in case of a failure of the working vacuum pump 210. The "abnormal operation state" refers to a situation where the operating parameters of the working vacuum pump 210 exceed the safety threshold, and the working vacuum pump 210 cannot maintain normal operation. In this state, the controller immediately opens the second control valve 330, connecting the backup vacuum pump 310 to the working chamber.

[0060] Before opening the second control valve 330, the standby vacuum pump 310 is preheated when the working vacuum pump 210 experiences a performance decline. This allows the standby vacuum pump 310 to quickly enter the working state, maintain the negative pressure environment of the working chamber, ensure the stability of the chemical reaction in the working chamber, and avoid reaction interruption or product quality decline caused by negative pressure fluctuations.

[0061] like Figure 1As shown, in some embodiments, the backup component 300 further includes a buffer container 340 disposed in the second connecting pipe 320. The buffer container 340 is located between the second control valve 330 and the backup vacuum pump 310, and the buffer container 340 has a buffer chamber 3411 connected to the second connecting pipe 320.

[0062] It is understandable that when the second control valve 330 is opened, although the standby vacuum pump 310 has been preheating and running for a period of time, the pressure in the second connecting pipe 320 may not be consistent with the pressure in the working chamber. If the second control valve 330 is opened directly, it may cause drastic fluctuations in the negative pressure environment in the working chamber, and may also affect the operation of the standby vacuum pump 310.

[0063] By setting a buffer container 340 between the second control valve 330 and the standby vacuum pump 310, the pressure in the buffer chamber 3411 can be balanced with the pressure in the working chamber during the preheating process of the standby vacuum pump 310. Thus, when the second control valve 330 is opened, the pressure balance on both sides can effectively reduce instantaneous pressure fluctuations and ensure a smooth transition during the switching process.

[0064] The structure of the buffer container 340 can be customized according to actual needs. For example, the buffer container 340 can be designed as a cylinder for ease of processing and installation, and its material can be high-strength, corrosion-resistant stainless steel or alloy materials to ensure good sealing and stability during long-term operation. Furthermore, the volume of the buffer container 340 can be adjusted according to the specific requirements of the chemical vapor deposition equipment to achieve the best buffering effect.

[0065] In some embodiments, the buffer container 340 may include: a container body 341, a partition 342, and a driving component 343. The container body 341 is hollow inside, and the partition 342 is slidably disposed inside the container body 341. The partition 342 has a first surface and a second surface disposed opposite to each other along its sliding direction. The first surface and the inner wall of the container body 341 together form a buffer chamber 3411, and the second surface and the inner wall of the container body 341 together form an installation chamber 3412. The driving component 343 is disposed in the installation chamber 3412 and connected to the partition 342 for driving the partition 342 to slide inside the container body 341.

[0066] The container body 341 is a hollow shell or box structure, typically made of high-temperature and corrosion-resistant stainless steel or alloy to withstand the negative pressure environment and the heat and corrosive gases generated during chemical vapor deposition. The container body 341 can have any shape, such as a cylinder, cuboid, or other geometric shapes, to accommodate different equipment installation spaces. The container body 341 should have two connection ports for installation in the second connection pipe 320.

[0067] The partition 342 is a plate-like structure disposed within the container body 341. The extension direction of the partition 342 can be perpendicular to the extension direction of the container body 341. In this embodiment, the container body 341 extends vertically, so the partition 342 can be horizontally disposed inside the container body 341. The shape of the partition 342 matches the internal shape of the container body 341, so that the interior of the container body 341 can be divided into two cavities using the partition 342. The upper and lower surfaces of the partition 342 are respectively the first surface and the second surface, so that the upper part of the partition 342 forms a buffer chamber 3411, and the lower part forms an installation chamber 3412.

[0068] Furthermore, such as Figure 3 As shown, a sliding sealing ring 3421 may be provided on the periphery of the partition 342, and the outer wall of the sliding sealing ring 3421 slidably abuts against the inner wall of the container body 341. An annular sealing groove extending along the periphery of the partition 342 may be formed therein, and the sliding sealing ring 3421 is embedded in the sealing groove, fully filling the gap between the partition 342 and the container body 341, ensuring a good sealing effect during the sliding of the partition 342 and preventing pressure leakage.

[0069] The drive component 343 can be an electric, pneumatic or hydraulically driven lifting structure. The drive component 343 can precisely control the sliding position of the partition 342, thereby dynamically adjusting the volume of the buffer chamber 3411 and thus regulating the pressure inside the buffer chamber 3411.

[0070] like Figure 2 As shown, in this embodiment, the drive component 343 includes a mounting bracket 3431, a rotating ring 3432, a support screw 3433, and a drive motor 3434. The mounting bracket 3431 is a frame-type structure or a plate-type structure fixed in the mounting chamber 3412, providing stable support for the rotating ring 3432, the support screw 3433, and the drive motor 3434.

[0071] The rotating ring 3432 is rotatably connected to the mounting bracket 3431, and the inner side of the rotating ring 3432 is provided with internal threads. The support screw 3433 extends vertically, and the top end of the support screw 3433 is connected to the partition plate 342. The outer side of the support screw 3433 is provided with external threads that match the internal threads in the rotating ring 3432, and the support screw 3433 passes through the inner side of the rotating ring 3432 and engages with its threads.

[0072] The drive motor 3434 is fixed to the mounting bracket 3431 and connected to the rotating ring 3432 via a transmission structure, enabling the drive motor 3434 to drive the rotating ring 3432 to rotate when started. The transmission structure can be a gear drive, belt drive, or chain drive. When the drive motor 3434 is running, it drives the rotating ring 3432 to rotate, which in turn drives the support screw 3433 to move up and down, thus achieving the up and down movement of the partition 342. The bottom of the partition 342 may also be provided with at least one guide rod 3422 extending vertically. The guide rod 3422 is slidably connected to the mounting bracket 3431 to guide and limit the movement of the partition 342, preventing the partition 342 from shifting or jamming during sliding.

[0073] In some embodiments, the backup component 300 may further include a constant pressure line 360 ​​and a constant pressure control valve 370. The constant pressure line 360 ​​is connected to the buffer container 340 and communicates with the buffer chamber 3411. The constant pressure control valve 370 is disposed in the constant pressure line 360 ​​and is used to control the on / off state of the constant pressure line 360.

[0074] Once the malfunctioning working vacuum pump 210 is repaired and functioning normally, the operation of the standby component 300 needs to be stopped. At this time, the second control valve 330 can be closed, and the connection between the standby vacuum pump 310 and the equipment body can be disconnected, allowing the equipment body 100 to resume using the two working vacuum pumps 210 to maintain a negative pressure environment. Then, the operation of the standby vacuum pump 310 should be slowly stopped. After the standby vacuum pump 310 is stopped, the buffer chamber 3411 will still be under negative pressure. At this time, the constant pressure control valve 370 can be opened, and external gas can be slowly introduced into the buffer chamber 3411 through the constant pressure pipeline 360 ​​to balance the pressure, preventing structural deformation or damage caused by the container body 341 being under negative pressure for a long time, and improving its service life.

[0075] The constant pressure control valve 370 can be a manually operated regulating valve, which is manually opened by the operator during the shutdown of the standby work unit. Alternatively, the constant pressure control valve 370 can be an electrically or pneumatically operated regulating valve, and can be connected to the controller to automatically open when the standby work unit is shut down.

[0076] In some embodiments, the device body 100 is provided with a first pressure sensor 110 for detecting the pressure within the working chamber. The backup component 300 also includes a second pressure sensor 350, which is disposed in the buffer container 340 for detecting the pressure within the buffer chamber 3411.

[0077] The first pressure sensor 110 and the second pressure sensor 350 are both connected to the controller and can transmit the pressure in the working chamber and the buffer chamber 3411 to the controller in real time. The controller can compare the pressure data of the two sensors to determine whether the pressure is balanced before the second control valve 330 is opened. If the pressure difference is still large, the controller controls the drive component 343 to operate, so as to adjust the container in the buffer chamber 3411 by moving the drive partition 342, thereby reducing the pressure difference between the working chamber and the buffer chamber 3411 to a safe range, ensuring a smooth transition of the system, preventing equipment damage caused by sudden pressure changes, and improving the overall safety and reliability of operation.

[0078] like Figure 1 As shown, when a spare component 300 is provided, the second connecting pipe 320 and the two first connecting pipes 220 can be connected in parallel to the periphery of the equipment body 100. That is, one end of the two first connecting pipes 220 and the second connecting pipe 320 can be connected to the equipment body 100 through a flange structure, and the other end is connected to the corresponding working vacuum pump 210 or the spare vacuum pump 310 respectively.

[0079] For example Figure 4 As shown, the number of backup components 300 can be the same as the number of pressure components 200, that is, there are two sets of backup components 300, with each set corresponding to one set of pressure components 200. Furthermore, two main pipelines 120 are connected in parallel on the equipment body 100, and each pressure component 200 and its corresponding backup component 300 are connected in parallel to the main pipeline 120. In use, each backup component 300 serves as a redundant backup for its corresponding pressure component 200.

[0080] In summary, the chemical vapor deposition apparatus provided in the first aspect of this application, by simultaneously equipping the apparatus body 100 with two sets of pressure components 200 and at least one set of backup components 300, can quickly start the backup vacuum pump 310 when the working vacuum pump 210 of one set of pressure components 200 fails, maintaining a stable negative pressure environment in the working chamber and ensuring the continuity of the chemical reaction and product quality. Simultaneously, the backup component 300 includes a buffer container 340, which balances the pressure on both sides before connecting the backup vacuum pump 310 and the working chamber, effectively reducing instantaneous pressure fluctuations and ensuring a smooth transition during the switching process.

[0081] Secondly, this application also provides a control method for the chemical vapor deposition apparatus in the first aspect embodiment, such as... Figure 5 As shown, the control method includes steps S101 to S104.

[0082] In step S101, the operating parameters of the working vacuum pump 210 are obtained.

[0083] As described in the first aspect of the embodiment above, the operating parameters of the working vacuum pump 210 are used to reflect the current operating status and health of the working vacuum pump 210. These parameters include, but are not limited to, flow rate, pressure, temperature, and rotational speed, and can be parameters that fluctuate significantly when a malfunction occurs during actual operation of the working vacuum pump 210. The operating parameters of the working vacuum pump 210 can be obtained through sensors built into the working vacuum pump 210 or sensors added externally to the working vacuum pump 210, on the first connecting pipe 220, or on the device body 100.

[0084] In step S102, the working vacuum pump 210 is determined to be in an abnormal or risky operating state based on the operating parameters.

[0085] The "risk operating state" refers to a situation where the operating parameters of the working vacuum pump 210 are close to but not exceeding the critical state, such as a slight decrease in flow rate, a slight increase in pressure, or a slight fluctuation in temperature. In this state, it can still maintain the negative pressure environment of the working chamber together with the other working vacuum pump 210, but there is a potential risk of failure; it may fail and become inoperable after continuing to operate in this state for a period of time. The "abnormal operating state" refers to a situation where the operating parameters of the working vacuum pump 210 exceed the normal range, such as a sudden decrease in flow rate, a sudden increase in pressure, or abnormal temperature fluctuations. This indicates that the working vacuum pump 210 may have malfunctioned or its performance has deteriorated, and it can no longer maintain the negative pressure environment of the working chamber together with the other working vacuum pump 210.

[0086] In some embodiments, operating parameters may include multiple operating data. Determining whether the working vacuum pump 210 is in an abnormal or risky operating state based on the operating parameters may include:

[0087] Acquire multiple operating data of the working vacuum pump 210;

[0088] The abnormal state score of the working vacuum pump 210 is calculated based on multiple working data.

[0089] When the abnormal state score exceeds the first abnormal state score threshold, the working vacuum pump 210 is determined to be in a risky operating state.

[0090] When the abnormal state score exceeds the second abnormal score threshold, the working vacuum pump 210 is determined to be in an abnormal operating state.

[0091] The operating data refers to various parameter information generated by the working vacuum pump 210 during operation, such as the pressure value in the first connecting pipe 220 or the working chamber, the rotational speed of the working vacuum pump 210, the temperature of the working vacuum pump 210, or the vibration amplitude of the working vacuum pump 210. These data can directly reflect the working status and performance of the working vacuum pump 210.

[0092] In practice, the real-time monitoring data can be compared with the rated operating data of the working vacuum pump 210, and the abnormal state score can be calculated using the ratio of the real-time operating data to the rated operating data.

[0093] Specifically, the formula for calculating the anomaly score can be:

[0094] S=n1×P1+n2×P2+n3×P3+……+n n ×P4

[0095] Where, n1……n n The weight ratio of each working data point is given by n1 + n2 + n3 + ... + n. n =1; P1……P n This is the ratio of the actual measured value to the rated value for each working data point.

[0096] For example, S = 0.4 × P1 + 0.3 × P2 + 0.2 × P3 + 0.1 × P4

[0097] Where P1 is the pressure ratio, P1 = P 压力测量值 / P 压力额定值 ;

[0098] P2 is the speed ratio, P2 = P 转速测量值 / P转速额定值 ;

[0099] P3 is the vibration amplitude ratio, P3 = P 振幅测量值 / P 振幅额定值 ;

[0100] P4 is the temperature ratio, P4 = P 温度测量值 / P 温度额定值 .

[0101] The first and second abnormality score thresholds can be set according to the actual working conditions. Their scores should be less than 1, and the second abnormality score threshold should be higher than the first abnormality score threshold. For example, the first abnormality score threshold is 0.6, and the second abnormality score threshold is 0.8. When the calculated abnormality score is 0.5, the working vacuum pump can be determined to be in a normal state; when the abnormality score is 0.7, the working vacuum pump 210 can be determined to be in a risky operating state; if the abnormality score reaches 0.9, the working vacuum pump 210 can be determined to be in an abnormal operating state, at which point the working vacuum pump 210 can no longer maintain a normal negative pressure environment.

[0102] In step S103, when the working vacuum pump 210 is in a risky operating state, the standby vacuum pump 310 is started to preheat it.

[0103] Specifically, if the abnormal state score of the working vacuum pump 210 calculated in step S102 exceeds the first abnormal score threshold, it is determined that the working vacuum pump 210 is in a risky operating state. The controller can then send a start-up signal to the standby vacuum pump 310, causing the standby vacuum pump 310 to start operating. After preheating, the standby vacuum pump 310 can quickly and promptly reach the required operating conditions when the working vacuum pump 210 changes from a risky operating state to an abnormal operating state, avoiding large pressure fluctuations in the working chamber due to start-up delays. The preheating time of the standby vacuum pump 310 can be preset based on factors such as the model of the standby vacuum pump 310, the operating environment, and historical operating data to ensure that the standby vacuum pump 310 can operate stably and efficiently after preheating.

[0104] In some embodiments, starting a standby vacuum pump to preheat it may include:

[0105] Obtain the first pressure value of the working chamber;

[0106] Obtain the second pressure value of buffer chamber 3411;

[0107] Start the backup vacuum pump to bring the difference between the first and second pressure values ​​within the safe threshold range.

[0108] The first pressure value is monitored in real time by the first pressure sensor 110 and transmitted to the controller, while the second pressure value is acquired by the second pressure sensor 350. When the backup vacuum pump 310 is turned on, since the second control valve 330 is in the closed state, the backup vacuum valve will first evacuate the buffer chamber 3411 to a negative pressure environment until the second pressure value of the buffer chamber 3411 is close to or equal to the first pressure value of the working chamber, reaching a preset safety threshold.

[0109] The size of the safety range threshold can be set according to the actual operating conditions of the working vacuum pump 210 and the performance of the standby vacuum pump 310, so as to ensure that the pressure difference between the working chamber and the buffer chamber 3411 will not affect the chemical reaction in the working chamber after the standby vacuum pump 310 is started.

[0110] Furthermore, before opening the second control valve 330, the following may also be included:

[0111] If the difference between the first pressure value and the second pressure value does not reach the safe range threshold;

[0112] Based on the difference between the first pressure value and the second pressure value, the drive component 343 is controlled to operate, so that the partition 342 moves to adjust the buffer chamber 3411 to the corresponding volume, thereby making the difference between the first pressure value and the second pressure value reach the safe range threshold.

[0113] Understandably, when the pressure difference between the working chamber and the buffer chamber 3411 is large, or when the preset time of the standby vacuum pump 310 is insufficient to pump the buffer chamber 3411 to a pressure value close to that of the working chamber before opening the second control valve, the controller can control the drive component 343 to operate and adjust the position of the partition 342, thereby changing the volume of the buffer chamber 3411 and achieving rapid adjustment of the pressure in the buffer chamber 3411.

[0114] Specifically, when the first pressure value is greater than the second pressure value, the controller can control the drive component 343 to drive the partition 342 to move away from the working chamber, increasing the volume of the buffer chamber 3411 to reduce the pressure inside the buffer chamber 3411. Conversely, when the first pressure value is less than the second pressure value, the controller controls the drive component 343 to drive the partition 342 to move closer to the working chamber, decreasing the volume of the buffer chamber 3411 to increase the pressure inside the buffer chamber 3411. Through this repeated adjustment, until the difference between the first and second pressure values ​​reaches a safe threshold, it ensures that the standby vacuum pump 310 can smoothly connect to the working chamber after startup, reducing the adverse effects of pressure fluctuations on the equipment body and chemical reaction.

[0115] In step S104, when the operating parameters of the working vacuum pump 210 are in an abnormal operating state, the second control valve 330 is opened.

[0116] Specifically, when the controller detects that the operating status of the working vacuum pump 210 has deteriorated from a risky operating state to an abnormal operating state, the controller will control the second control valve 330 to open rapidly, connecting the standby vacuum pump 310 to the working chamber through the buffer container 340 and the second connecting pipe 320. Since the standby vacuum pump 310 has been preheated and the pressure on both sides is balanced by the buffer container 340, no large pressure fluctuation will occur at the moment the second control valve 330 opens, achieving a smooth connection between the standby vacuum pump 310 and the working chamber. The standby vacuum pump 310 works in conjunction with the other working vacuum pump 210, which is in good operating condition, to maintain the negative pressure environment in the working chamber, ensuring the continuous and stable operation of the chemical vapor deposition process.

[0117] For the malfunctioning working vacuum pump 210, its connection to the equipment body can be disconnected by closing the corresponding first control valve 230, and it can then be repaired. After repair, the working vacuum pump 210 can be reconnected to the first connecting pipe 220, and its operation can be adjusted according to the actual needs of the system. Specifically, the first control valve 230 can be opened to connect the working vacuum pump 210 to the working chamber, and the working vacuum pump 210 can be run at low power. The power of the standby vacuum pump 310 can be gradually reduced while the power of the working vacuum pump 210 can be gradually increased until the working vacuum pump 210 completely takes over the maintenance of the negative pressure environment. The standby vacuum pump 310 will then gradually stop running. Finally, the second control valve 330 can be closed to disconnect the standby vacuum pump 310 from the working chamber, putting the standby vacuum pump 310 into standby mode. Furthermore, if the performance of the working vacuum pump 210 does not recover after repair, a new working vacuum pump 210 can be considered to ensure the stability and reliability of the system.

[0118] It should be noted that the control method for the chemical vapor deposition (CVD) apparatus described above can be implemented programmatically. This program can be stored in one or more computer-readable storage media, including but not limited to flash memory, hard disk storage, read-only memory (ROM), random access memory (RAM), disk storage, optical disk storage, and any other type of memory suitable for storing program instructions. When the program instructions are executed on one or more processors, the program instructions can cause the processor to perform the control method for the CVD apparatus described above. Furthermore, in conjunction with the CVD apparatus and its control method described in the above embodiments, this application can also be implemented as a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the steps of the control method for the CVD apparatus described above. It is understood that computers, processors, microprocessor controllers, or programmable hardware include storage components capable of storing or receiving software or computer code. When the software or computer code is accessed and executed by the computer, processor, or hardware, the control method shown in the above embodiments is implemented.

[0119] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A chemical vapor deposition apparatus, characterized in that, include: The equipment body (100) has a working chamber; Two pressure components (200) are provided. Each pressure component (200) includes a working vacuum pump (210), a first connecting pipe (220), and a first control valve (230). The working vacuum pump (210) is connected to the working chamber through the first connecting pipe (220), and the first control valve (230) is located in the first connecting pipe (220). At least one set of backup components (300) includes a backup vacuum pump (310), a second connecting pipe (320) and a second control valve (330). The backup vacuum pump (310) is connected to the working chamber through the second connecting pipe (320), and the second control valve (330) is disposed in the second connecting pipe (320). The controller is communicatively connected to the working vacuum pump (210), the standby vacuum pump (310), and the second control valve (330); the controller is configured to: activate the standby vacuum pump (310) when one of the working vacuum pumps (210) is in a risky operating state, and activate the second control valve (330) when one of the working vacuum pumps (210) is in an abnormal operating state.

2. The chemical vapor deposition apparatus according to claim 1, characterized in that, The backup component (300) further includes a buffer container (340) disposed in the second connecting pipe (320), the buffer container (340) being located between the second control valve (330) and the backup vacuum pump (310), and the buffer container (340) having a buffer chamber (3411) connected to the second connecting pipe (320).

3. The chemical vapor deposition apparatus according to claim 2, characterized in that, The buffer container (340) includes: The container body (341) is hollow inside; A partition (342) is slidably disposed inside the container body (341). The partition (342) has a first surface and a second surface disposed opposite to each other along its sliding direction. The first surface and the inner wall of the container body (341) together form the buffer chamber (3411), and the second surface and the inner wall of the container body (341) together form the installation chamber (3412). A drive component (343) is disposed in the mounting chamber (3412) and connected to the partition (342) for driving the partition (342) to slide inside the container body (341).

4. The chemical vapor deposition apparatus according to claim 3, characterized in that, A sliding sealing ring (3421) is provided on the periphery of the partition (342), and the outer wall of the sliding sealing ring (3421) is slidably abutting against the inner wall of the container body (341).

5. The chemical vapor deposition apparatus according to claim 2, characterized in that, The backup component (300) further includes a constant pressure pipeline (360) and a constant pressure control valve (370). The constant pressure pipeline (360) is connected to the buffer container (340) and communicates with the buffer chamber (3411). The constant pressure control valve (370) is disposed on the constant pressure pipeline (360) and is used to control the on / off state of the constant pressure pipeline (360).

6. The chemical vapor deposition apparatus according to claim 2, characterized in that, The device body (100) is provided with a first pressure sensor (110) for detecting the pressure inside the working chamber; The backup component (300) further includes a second pressure sensor (350), which is disposed in the buffer container (340) and is used to detect the pressure inside the buffer chamber (3411).

7. A control method for a chemical vapor deposition (CVD) apparatus, the CVD apparatus comprising: The device includes a main body (100), a pressure assembly (200), and a backup assembly (300). The main body (100) has a working chamber. The pressure assembly (200) includes a working vacuum pump (210), a first connecting pipe (220), and a first control valve (230). The working vacuum pump (210) is connected to the working chamber through the first connecting pipe (220), and the first control valve (230) is located in the first connecting pipe (220). The backup assembly (300) includes a backup vacuum pump (310), a second connecting pipe (320), and a second control valve (330). The backup vacuum pump (310) is connected to the working chamber through the second connecting pipe (320), and the second control valve (330) is located in the second connecting pipe (320). The control method is characterized by comprising: Obtain the operating parameters of the working vacuum pump (210); Determine whether the working vacuum pump (210) is in an abnormal or risky operating state based on the operating parameters. When the working vacuum pump (210) is in the risky operating state, start the vacuum pump to preheat it; When the working vacuum pump (210) is in the abnormal operating state, the second control valve (330) is opened.

8. The control method for the chemical vapor deposition equipment according to claim 7, characterized in that, The operating parameters include multiple operating data. The step of determining whether the working vacuum pump (210) is in an abnormal or risky operating state based on the operating parameters includes: Acquire multiple operating data of the working vacuum pump (210); Based on multiple operational data points, calculate the abnormal state score of the operational vacuum pump (210); When the abnormal state score exceeds the first abnormal state score threshold, the working vacuum pump (210) is determined to be in the risky operating state; When the abnormal state score exceeds the second abnormal score threshold, the working vacuum pump (210) is determined to be in the abnormal operating state.

9. The control method for a chemical vapor deposition apparatus according to claim 8, wherein the backup component (300) further comprises a buffer container (340) disposed in the second connecting pipeline (320), and the buffer container (340) has a buffer chamber (3411); Its features are, The step of starting the vacuum pump to preheat it includes: Obtain the first pressure value of the working chamber; Obtain the second pressure value of the buffer chamber (3411); Start the backup pump so that the difference between the first pressure value and the second pressure value is within the safe range threshold.

10. The control method of the chemical vapor deposition apparatus according to claim 9, wherein the buffer container (340) includes a container body (341), a partition (342) slidably disposed inside the container body (341), and a driving component (343) disposed inside the container body (341), wherein the partition (342) and the inner wall of the container body (341) together form the buffer chamber (3411), and the driving component (343) is used to drive the partition (342) to slide inside the container body (341); Its features are, Before opening the second control valve (330), the following steps are also included: If the difference between the first pressure value and the second pressure value does not reach the safety range threshold; Based on the difference between the first pressure value and the second pressure value, the drive component (343) is controlled to operate so that the partition (342) moves to adjust the buffer chamber (3411) to the corresponding volume, thereby making the difference between the first pressure value and the second pressure value reach the safety range threshold.

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