A connecting device with a substrate that vibrates and a frame that does not vibrate

Abstract

This invention relates to a connection device for substrate vibration without outer frame vibration, and pertains to the field of electroplating technology. The invention minimizes the transmission of vibration generated by the vibration generator to the electrical connection between the scraper and the support plate. Even if the scraper vibrates, a constant electrical connection is maintained, improving the uniformity of electroplating. The lower gripper is used to hold the substrate according to its size. This invention allows the lower gripper to be raised and lowered, easily holding the lower part of the substrate according to its size. The upper and lower parts of the substrate vibrate and move at different amplitudes, thereby improving vibration efficiency. The invention also allows for a more robust grip on the substrate through the structure of the clamp, ensuring that the clamp remains constantly open.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and in particular to a connection device that uses a scraper to transmit vibration to the substrate to enhance the electroplating effect, resulting in substrate vibration without vibration of the outer frame. Background Technology

[0002] Printed circuit boards typically have a relatively thick thickness and multiple holes. The surface of the printed circuit board and the holes should also have an electroplated layer of constant and uniform thickness. The fabrication of such printed circuit boards is a collection of many processes, and the steps are very complex. When providing current and voltage to the electronic components, the electroplating process, that is, the metallization process, plays a core role. In particular, as printed circuit boards have recently become thinner and smaller, vias are used to connect metal wiring and electronic components, and the size of vias is gradually decreasing, which requires more uniform electroplating. Furthermore, the electroplating process of printed circuit boards typically uses an electroless chemical plating method to form a seed layer, followed by electrolytic plating to form a metal layer, in order to facilitate the formation of circuits or the plating of vias. To form a uniform electroplating layer on a traditionally thick substrate, the electroplating scraper of the substrate electroplating apparatus is equipped with a vibration device. The vibration generated is transmitted through the scraper to the printed circuit board, forming a uniform electroplating layer on the surface and holes of the printed circuit board. The scraper is supported by a fastened support plate structure. In conventional technology, the connection device where the substrate vibrates but the outer frame does not vibrate directly transmits the vibration generated by the vibration device to the entire scraper supported by the support plate, causing the entire scraper to shake. As a result, the electrical connection at the electrical connection point between the support plate and the scraper is uneven, causing problems with the uniformity of electroplating. Summary of the Invention

[0003] The purpose of this invention is to overcome the above-mentioned drawbacks of conventional technology and provide a connection device that allows the substrate to vibrate while the outer frame remains vibration-free. This device minimizes the transmission of vibration generated by the vibration generator to the electrical connection between the scraper and the support plate. Even if the scraper vibrates, a constant electrical connection can be maintained to improve the uniformity of electroplating.

[0004] To achieve the above objectives, the connection device of the present invention, which allows the substrate to vibrate while the outer frame remains vibration-free, includes: an electroplating tank. Trays are provided on both sides of the electroplating tank; A support rod that extends laterally at the top of the electroplating tank; A horizontal vibrating rod is disposed adjacent to the rear of the support rod and moves independently in the front-back direction relative to the support rod; A vibration generator is installed on the horizontal vibration rod to apply vibration to the horizontal vibration rod, causing the horizontal vibration rod to move in the front-back direction; An upper gripping member, which is installed at the lower part of the horizontal vibration rod, is used to grip the upper part of the substrate; A power connection part is installed on the support rod to electrically connect the support plate to the upper grip; A buffer element is disposed between the support rod and the horizontal vibrating rod to buffer the vibration between them; The support rod includes: The first front part has a through hole formed along the front-back direction; The first bend is bent backward at the upper and lower parts of the first front part; A cover that covers the first front portion and the first bent portion at the location where the through hole is formed, and is fastened to the first front portion and the first bent portion. The horizontal vibrating rod includes: The second rear face is positioned behind the first front face at a distance from it; The second bend is folded forward at the upper and lower parts of the second rear part; The second front portion bends longitudinally at the second bend, parallel to the first front portion. The buffer includes a first buffer, which is disposed between the first front part and the second front part, with one end passing through the through hole and then combined with the cover, and the other end combined with the second front part.

[0005] As a preferred technical solution of this application, the diameter of the through hole is larger than the diameter of the first buffer member, and the other end of the first buffer member is connected to the second front part through the through hole.

[0006] As a preferred technical solution of this application, one end of the first buffer member protrudes to form a support shaft; The cover includes: a first cover portion disposed on the upper part of the first bent portion; The second cover portion is bent in front of the first cover portion, disposed in front of the first front portion and covering the through hole; The second covering portion is formed as follows: The first movable hole is formed along the longitudinal direction and one end is connected to the outside; The second movable hole is formed at the other end of the first movable hole, and its direction is different from the angle of the first movable hole. When assembling the cover, the support shaft passes through the through hole and moves from the first movable hole to the second movable hole to complete the installation.

[0007] As a preferred technical solution of this application, the cover includes: A first covering portion is disposed on the upper part of the first bending portion; The second cover portion is bent at the first cover portion, disposed in front of the first front portion, and covers the through hole; The third covering portion is bent in the opposite direction to the first covering portion; The buffer further includes a second buffer, one end of which is connected to the second front portion, and the other end of which is connected to the third cover portion.

[0008] As a preferred technical solution of this application, the first buffer and the second buffer are arranged in four groups, and are disposed on the upper left and right sides, and the lower left and right sides of the support rod.

[0009] As a preferred technical solution of this application, the power connection part is composed of the following components: The grounding part has one end fixed to the support rod and the other end in contact with the support plate; The busbar is inserted between the support rod and the horizontal vibration rod, with one end connected to the upper grip and the other end connected to one end of the grounding part. The busbar undergoes elastic deformation under external force.

[0010] The connection device provided by the present invention, which allows the substrate to vibrate while the outer frame remains vibration-free, has the following technical advantages.

[0011] 1. This invention minimizes the transmission of vibration generated by the vibration generator to the electrical connection between the scraper and the support plate. Even if the scraper vibrates, a constant electrical connection can be maintained to improve the uniformity of electroplating. 2. The lower gripper is used to grip the substrate according to its size. The present invention allows the lower gripper to be raised and lowered, so as to easily grip the lower part of the substrate according to its size. 3. The upper and lower parts of the substrate are vibrated and moved at different amplitudes to improve vibration efficiency; 4. The present invention can grip the substrate more firmly through the structure of the clamp, and can keep the clamp in a constant open state at all times; 5. The present invention can adjust the distance between the first gripping rod and the second gripping rod by rotating the second gripping rod. Therefore, regardless of the thickness of the substrate, the substrate can always be firmly gripped to prevent the substrate from separating and detaching. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a connection device in an embodiment of the present invention where the substrate vibrates but the outer frame does not. Figure 2 This is an exploded perspective view of the electroplating tank and scraper in the electroplating apparatus of this embodiment of the invention; Figure 3 This is a perspective view of the scraper in the embodiment of the present invention, showing the state of removing the support rod; Figure 4 This is an exploded perspective view of the support rod and horizontal vibrating rod in the scraper of an embodiment of the present invention. Figure 5 This is an exploded perspective view of the support rod and horizontal vibrating rod in the scraper of an embodiment of the present invention from another direction; Figure 6 yes Figure 2 Cross-sectional view of line AA in the middle; Figure 7 yes Figure 2 Cross-sectional view of the middle BB line; Figure 8 This is a perspective view of the lifting component in the scraper of an embodiment of the present invention; Figure 9 This is a flowchart illustrating the operation of the lifting component in the scraper according to an embodiment of the present invention. Figure 10 This is a perspective view of the clamping device for the electroplating apparatus according to an embodiment of the present invention. Figure 11 This is a perspective view from another direction of the clamping device for the electroplating apparatus according to an embodiment of the present invention; Figure 12 This is a cross-sectional view of the clamping device for the electroplating apparatus according to an embodiment of the present invention; Figure 13 This is a flowchart illustrating the operation of the clamping device for the electroplating apparatus according to an embodiment of the present invention.

[0013] Figure Labels 100. Electroplating tank; 110. Pallet; 200. Scraper; 210. Support rod; 211. First front part; 211-1. Through hole; 212. First bending part; 213. Cover; 213-1. First cover; 213-2. Second cover; 213-21. First moving hole; 213-22. Second moving hole; 213-3. Third cover; 220. Horizontal vibration rod; 221. Second rear part; 222. Second bending part; 223. Second front part; 230. Vibration generator; 240. Upper grip; 250. Power connection part; 251. Grounding part; 252. Busbar; 260. Buffer; 2 61. First buffer component; 261-1. Support shaft; 262. Second buffer component; 270. Lower grip component; 280. Vertical connecting rod; 281. Fastening groove; 290. Lifting component; 291. Lifting body; 291-1. Lifting hole; 292. Lifting control lever; 292-1. Fastening protrusion; 293. Stop spring; 300. Clamping device; 310. First grip lever; 320. Side bracket; 330. Second grip lever; 331. Pressure application component; 332. Grip control lever; 340. First spring; 350. Lifting block; 351. Hanging protrusion; 360. Connecting rod; 370. Second spring; 380. Leaf spring; 400. Base plate. Detailed Implementation

[0014] According to the present invention, the connection device for vibrating the substrate 400 and not vibrating the outer frame includes an electroplating tank 100 and a scraper 200, such as Figures 1 to 2 As shown; like Figures 1 to 7 As shown, the scraper 200 includes a support rod 210, a horizontal vibration rod 220, a vibration generator 230, an upper grip 240, a power connection part 250, and a buffer 260. like Figure 1 and Figure 2 As shown, the electroplating tank 100 is provided with support plates 110 on both sides.

[0015] The upper part of the electroplating tank 100 is provided with the support rod 210 extending laterally.

[0016] The support rod 210 includes a first front part 211, a first bent part 212, and a cover 213.

[0017] The first front part 211 is provided facing forward, that is, in the opposite direction to the horizontal vibration rod 220, and a through hole 211-1 is formed along the front-back direction.

[0018] The first bent portion 212 is located above and below the first front portion 211, and is bent toward the rear where the horizontal vibration rod 220 is located.

[0019] The cover 213 covers the first front part 211 and the first bent part 212 at the location where the through hole 211-1 is formed, and is fixedly attached to the first front part 211 and the first bent part 212.

[0020] Specifically, the cover 213 includes a first cover 213-1, a second cover 213-2, and a third cover 213-3.

[0021] The first covering portion 213-1 is disposed on the upper part of the first bending portion 212.

[0022] The second cover portion 213-2 is bent at the first cover portion 213-1, disposed in front of the first front portion 211, and covers the through hole 211-1.

[0023] The second cover portion 213-2 has the following: a first movable hole 213-21, which is formed longitudinally and one end is connected to the outside; and a second movable hole 213-22, which is formed at the other end of the first movable hole 213-21 and is formed at an angle different from the first movable hole 213-21.

[0024] The third covering portion 213-3 is bent into the first covering portion and is disposed in the opposite direction to the second covering portion 213-2.

[0025] The horizontal vibration rod 220 is disposed adjacent to the rear of the support rod 210 and moves independently in the front-back direction relative to the support rod 210.

[0026] The horizontal vibration rod 220 includes a second rear section 221, a second bent section 222, and a second front section 223.

[0027] The second rear part 221 is disposed behind the first front part 211 at a distance.

[0028] The second bend 222 bends forward at the upper and lower parts of the second rear part 221.

[0029] The second front portion 223 is bent longitudinally at the second bend portion 222 and is parallel to the first front portion 211.

[0030] The vibration generator 230 is installed on the horizontal vibration rod 220 and applies vibration to the horizontal vibration rod 220, causing the horizontal vibration rod 220 to move in the front-back direction.

[0031] The upper gripper 240 is installed at the lower part of the horizontal vibration rod 220 and is used to grip the upper part of the substrate 400.

[0032] When the horizontal vibration rod 220 moves back and forth, the upper gripping member 240 also moves along the back and forth direction, so that the upper gripped substrate 400 also moves along the back and forth direction.

[0033] The power connection part 250 is installed on the support rod 210, and electrically connects the support plate 110 to the upper grip member 240.

[0034] As a result, current is transmitted through the tray 110, and the transmitted current is transmitted to the substrate 400 through the power connection part 250 and the upper grip member 240.

[0035] As described above, the power connection part 250 includes a grounding part 251 and a busbar 252.

[0036] One end of the grounding part 251 is fixed to the support rod 210, and the other end contacts the support plate 110.

[0037] The busbar 252 is inserted between the support rod 210 and the horizontal vibration rod 220, with one end connected to the upper grip 240 and the other end connected to one end of the grounding part 251.

[0038] As described above, the busbar 252 is flat and its material can be elastically deformed by external force.

[0039] As described above, the grounding part 251 and the upper gripper 240 are connected by the busbar 252, so that a large capacity of electrical energy that is transported to the grounding part 251 through the tray 110 can be smoothly transported to the substrate 400 via the upper gripper 240. Furthermore, the busbar 252 elastically deforms when the horizontal vibrating rod 220 moves back and forth to improve durability.

[0040] The buffer 260 is disposed between the support rod 210 and the horizontal vibration rod 220 to buffer the vibration between them.

[0041] When the vibration generator 230 causes the horizontal vibration rod 220 to vibrate, the vibration can be suppressed from being transmitted to the support rod 210 by the buffer 260.

[0042] The buffer 260 includes a second buffer 262 and a second buffer 262.

[0043] The first buffer 261 is disposed between the first front part 211 and the second front part 223, which are spaced apart. In this state, one end passes through the through hole 211-1 and is combined with the cover 213, and the other end is combined with the second front part 223.

[0044] The diameter of the through hole 211-1 is larger than the diameter of the first buffer member 261. The other end of the first buffer member 261 is outside the support rod 210 and is connected to the second front part 223 through the through hole 211-1.

[0045] As a result, the assembly of the first buffer 261 becomes easier.

[0046] The first buffer 261 is combined with the cover 213, and one end of the first buffer 261 protrudes to form a support shaft 261-1.

[0047] With the other end of the first buffer 261 combined with the second front part 223, the cover 213 is assembled to the outside of the support rod 210.

[0048] When assembling the cover 213, the support shaft 261-1 passes through the through hole 211-1. In this state, it moves from the first moving hole 213-21 to the second moving hole 213-22 to complete the installation.

[0049] That is, the cover 213 is lowered and then moved laterally, so that the support shaft 261-1 moves from the first moving hole 213-21 to the second moving hole 213-22 formed laterally, to complete the installation.

[0050] Then, the cover 213 is fixed to the support rod 210 by bolts, screws, etc.

[0051] One end of the second buffer 262 is combined with the second front part 223, and the other end is combined with the third cover part 213-3.

[0052] One end of the second buffer 262 is joined to the second front part 223. In this state, the cover 213 is assembled. Then, the other end of the second buffer 262 is joined to the cover 213 by screws or the like, thereby completing the assembly.

[0053] Because of the cover 213, the second buffer 262 is not exposed.

[0054] As described above, the first buffer 261 and the second buffer 262 are arranged in at least four groups, respectively disposed on the upper left and right sides, and the lower left and right sides of the support rod 210.

[0055] With the above-described configuration and structure, the present invention can prevent vibration from being applied to the support rod 210 when the horizontal vibration rod 220 moves in the front-back direction by means of the buffer member 260. This can prevent the grounding part 251 in contact with the support plate 110 from shaking, which would cause the power supply between the support plate 110 and the grounding part 251 to be unsmooth.

[0056] This allows for a constant electrical connection, improving the uniformity of electroplating.

[0057] Furthermore, it can suppress the transmission of vibrations generated by the vibration generator 230 to the electroplating tank 100 and frame, which are connected to the tray 110.

[0058] According to the present invention, the scraper 200 further includes a lower gripper 270, a vertical connecting rod 280, and a lifting member 290.

[0059] The lower gripper 270 is disposed below the upper gripper 240 and is used to grip the lower part of the substrate 400.

[0060] The upper end of the vertical connecting rod 280 is fixedly connected to the support rod 210, and the other end is connected to the lower grip 270.

[0061] The upper grip 240 is connected to the horizontal vibration rod 220 and moves in the front-back direction, while the lower grip 270 is connected to the support rod 210 through the vertical connecting rod 280 and does not move in the front-back direction.

[0062] Therefore, when the horizontal vibration rod 220 and the upper grip 240 move along the front-back direction via the vibration generator 230, the upper part of the substrate 400 held by the upper grip 240 moves along the front-back direction, but the lower part of the substrate 400 held by the lower grip 270 does not move along the front-back direction or vibrates less in the front-back direction compared to the upper grip 240.

[0063] Therefore, the substrate 400 does not move as a whole along the front-back direction, but the upper and lower parts move relative to each other along the front-back direction. As a result, bubbles and other debris attached to the substrate 400 can be removed more effectively, and a uniform electroplating layer can be formed on the surface of the substrate 400.

[0064] like Figure 8 and Figure 9 As shown, the lifting member 290 is movably mounted on the vertical connecting rod 280 along the vertical direction and is combined with the lower grip member 270.

[0065] Therefore, when the lifting member 290 moves longitudinally along the vertical link 280, the lower grip 270 moves longitudinally together with the lifting member 290, and adjusts the distance between the upper grip 240 and the lower grip 270.

[0066] Thus, substrates 400 of different sizes can be held by the upper gripper 240 and the lower gripper 270.

[0067] The lifting component 290 includes a lifting body 291, a lifting control lever 292, and a stop spring 293.

[0068] The lifting body 291 has a lifting hole 291-1 formed longitudinally, and the lower grip 270 is attached laterally. The lifting hole 291-1 is used to insert the vertical connecting rod 280.

[0069] The middle portion of the lifting control lever 292 is rotatably hinged to the lifting body 291.

[0070] One end of the stop spring 293 is connected to the lifting body 291, and the other end is connected to the other end of the lifting control lever 292, thereby applying external force in a free state, causing the other end of the lifting control lever 292 to abut against the vertical connecting rod 280.

[0071] The vertical connecting rod 280 has multiple fastening grooves 281 formed along the longitudinal direction.

[0072] The other end of the lifting control lever 292 has a fastening protrusion 292-1, which is inserted into the fastening groove 281.

[0073] like Figure 9 As shown in (a), in the free state, due to the elastic force of the stop spring 293, the lifting control lever 292 rotates along the direction in which the fastening protrusion 292-1 is inserted into the fastening groove 281, so that the lifting member 290 remains engaged with the vertical connecting rod 280.

[0074] At this time, the lower grip 270 of the lifting member 290 cannot move longitudinally along the vertical connecting rod 280.

[0075] like Figure 8 As shown in (b), when an external force presses one end of the lifting control lever 292, the stop spring 293 becomes loose and disengages from the fastening groove 281 of the fastening protrusion 292-1, thereby allowing the lifting member 290 to move longitudinally along the vertical link 280.

[0076] Through the above-described configuration and operation, the lower gripper 270 can be easily moved longitudinally and securely fixed.

[0077] And, as Figures 10 to 13 As shown, the clamping device 300 of the electroplating apparatus of the present invention is installed on the upper gripping member 240 and includes a first gripping rod 310, a side bracket 320, a second gripping rod 330, a first spring 340, a lifting block 350, a connecting rod 360 and a second spring 370.

[0078] The first gripping rod 310 extends downward and engages with the electroplating apparatus fixture for mounting the substrate 400, namely the upper gripping member 240 described in this embodiment, with one end contacting one side of the substrate 400.

[0079] The side bracket 320 is attached to both sides of the first grip rod 310 and protrudes forward.

[0080] The second gripping rod 330 is rotatably hinged to the side bracket 320 along the longitudinal direction, with one end contacting the other side of the substrate 400.

[0081] The second grip lever 330 consists of a pressure-applying member 331 and a grip control lever 332.

[0082] The pressure-applying member 331 is rotatably attached to the side bracket 320 and contacts the other side of the substrate 400.

[0083] The substrate 400 is inserted between the pressure member 331 and the first gripping rod 310.

[0084] The lower end of the grip lever 332 is hinged to the pressure member 331, and its upper and lower ends are hinged to the side bracket 320.

[0085] The first spring 340 is disposed between the first grip rod 310 and the second grip rod 330, specifically between the first grip rod 310 and the grip control lever 332. It is used to apply elastic force so that the lower end of the second grip rod 330, that is, the pressure member 331, moves toward one end of the first grip rod 310.

[0086] The structure and operation of the clamp 300 constructed with the above-described structure have been described in detail in the applicant's application No. 10-2024-0075854, and detailed descriptions thereof are omitted here.

[0087] The lifting block 350 is mounted on the side bracket 320 in a longitudinally movable manner at a position higher than the first spring 340.

[0088] One end of the connecting rod 360, the other end of the second gripping rod 330, specifically, the other end of the gripping control lever 332 is hinged to the upper end of the gripping control lever 332, and the other end of the connecting rod 360 is hinged to the lifting block 350.

[0089] The second spring 370 elastically supports the lifting block 350 downwards.

[0090] The lifting block 350 descends due to the elastic force of the second spring 370. As the lifting block 350 descends, the connecting rod 360 pushes the other end of the second gripping rod 330. Specifically, it pushes the other end of the gripping control lever 332 away from the first gripping rod 310, thereby causing one end of the second gripping rod 330 to abut against one end of the first gripping rod 310.

[0091] The second spring 370 is disposed between the upper end of the side bracket 320 and the upper part of the lifting block 350, and elastically supports the lifting block 350 downward.

[0092] In its free state, the second spring 370 presses the lifting block 350 downwards, thereby... Figure 12As shown, this further prevents the other end (upper end) of the grip lever 332 from moving arbitrarily toward the first grip lever 310 together with the first spring 340, so that one end (lower end) of the pressure member 331 and one end of the first grip lever 310 are firmly maintained in their state when gripping the base plate 400.

[0093] On the lifting block 350, a hook protrusion 351 is formed protruding in the opposite direction (i.e., rear) of the connecting rod 360.

[0094] A leaf spring 380 is mounted longitudinally at the rear of the first grip bar 310.

[0095] The lower end of the leaf spring 380 is fixed to the rear of the first gripping rod 310, while the upper end is left as a free end.

[0096] The hook protrusion 351 can be positioned behind the first grip rod 310 to avoid the first grip rod 310. Preferably, the hook protrusion 351 is positioned to pass through the first grip rod 310.

[0097] like Figure 12 As shown, in a free state where no external force is applied, as described above, the first gripping rod 310 and the second gripping rod 320 are configured to hold the base plate 400 inserted therebetween. At this time, the leaf spring 380 is spaced apart from the hook protrusion 351.

[0098] like Figure 13 As shown in (a), when an external force presses the grip lever 332, the connecting rod 360 and the lifting block 350 rise in the direction of lifting the second spring 370, and the pressure member 331 is separated from the first grip lever 310 and releases the grip of the base plate 400.

[0099] At this time, the hook protrusion 351 installed on the lifting block 350 also rises to a position higher than the upper end of the leaf spring 380.

[0100] Furthermore, in this state, when an external force is applied to press the leaf spring 380 in the direction of the first grip lever 310, the upper end of the leaf spring 380 bends in the direction of the hook protrusion 351. Then, when the external force pressing the grip lever 332 is released, the lifting block 350 and the hook protrusion 351 descend due to the elastic restoring force of the second spring 370.

[0101] When the lower part of the hook-up protrusion 351 contacts the upper end of the leaf spring 380, if the external force pressing the leaf spring 380 is released, due to the elastic restoring force of the leaf spring 380 returning to its original state, the leaf spring 380 hooks onto the lower part of the hook-up protrusion 351, as... Figure 13As shown in (b) of the diagram.

[0102] When the hook protrusion 351 is hooked to the leaf spring 380, even if the elastic force of the second spring 370 is in effect, the lifting block 350 will not further descend as caused by the second spring 370.

[0103] As described above, the hooking protrusion 351 is hooked onto the leaf spring 380, causing the lifting block 350 to not descend completely, thus, as Figure 13 As shown in (b), one end of the first gripping rod 310, specifically, the pressure-applying member 331 and one end of the second gripping rod 330 can always remain separated.

[0104] Furthermore, the clamp 300 of the present invention can adjust the distance between the first gripping rod 310 and the pressure member 331 by rotating the gripping control lever 332. Therefore, regardless of the thickness of the substrate 400, the substrate 400 can always be firmly gripped to prevent the substrate 400 from separating and detaching.

[0105] Additionally, the electroplating apparatus uses a clamp to hold the substrate 400 of the present invention, which includes: a frame; and the clamp 300, which is mounted on the upper part of the frame for holding the upper part of the substrate 400.

[0106] The connection device for substrate 400 vibration without outer frame vibration described in this invention is not limited to the above embodiments, and various modifications can be implemented within the scope allowed by the technical concept of this invention.

Claims

1. A connection device for substrate vibration without outer frame vibration, characterized in that, include: Electroplating tank; Trays are provided on both sides of the electroplating tank; A support rod that extends laterally at the top of the electroplating tank; A horizontal vibrating rod is disposed adjacent to the rear of the support rod and moves independently in the front-back direction relative to the support rod; A vibration generator is installed on the horizontal vibration rod to apply vibration to the horizontal vibration rod, causing the horizontal vibration rod to move in the front-back direction; An upper gripping member, which is installed at the lower part of the horizontal vibration rod, is used to grip the upper part of the substrate; A power connection part is installed on the support rod to electrically connect the support plate to the upper grip; A buffer element is disposed between the support rod and the horizontal vibrating rod to buffer the vibration between them; The support rod includes: The first front part has a through hole formed along the front-back direction; The first bend is bent backward at the upper and lower parts of the first front part; A cover that covers the first front portion and the first bent portion at the location where the through hole is formed, and is fastened to the first front portion and the first bent portion. The horizontal vibrating rod includes: The second rear face is positioned behind the first front face at a distance from it; The second bend is folded forward at the upper and lower parts of the second rear part; The second front portion bends longitudinally at the second bend, parallel to the first front portion. The buffer includes a first buffer, which is disposed between the first front part and the second front part, with one end passing through the through hole and then combined with the cover, and the other end combined with the second front part.

2. The connecting device for substrate vibration and frame non-vibration according to claim 1, characterized in that, The diameter of the through hole is larger than the diameter of the first buffer member, and the other end of the first buffer member is connected to the second front part through the through hole.

3. The connecting device for substrate vibration and frame non-vibration according to claim 1, characterized in that, One end of the first buffer member has a protrusion forming a support shaft; The cover includes: a first cover portion disposed on the upper part of the first bent portion; The second cover portion is bent in front of the first cover portion, disposed in front of the first front portion and covering the through hole; The second covering portion is formed as follows: The first movable hole is formed along the longitudinal direction and one end is connected to the outside; The second movable hole is formed at the other end of the first movable hole, and its direction is different from the angle of the first movable hole. When assembling the cover, the support shaft passes through the through hole and moves from the first movable hole to the second movable hole to complete the installation.

4. The connecting device for substrate vibration and frame non-vibration according to claim 1, characterized in that, The cover includes: A first covering portion is disposed on the upper part of the first bending portion; The second cover portion is bent at the first cover portion, disposed in front of the first front portion, and covers the through hole; The third covering portion is bent in the opposite direction to the first covering portion; The buffer further includes a second buffer, one end of which is connected to the second front portion, and the other end of which is connected to the third cover portion.

5. The connecting device for substrate vibration and frame non-vibration according to claim 4, characterized in that, The first and second buffer components are arranged in four groups, on the upper left and right sides, and the lower left and right sides of the support rod.

6. The connecting device for substrate vibration and frame non-vibration according to claim 1, characterized in that, The power connection part consists of the following components: The grounding part has one end fixed to the support rod and the other end in contact with the support plate; The busbar is inserted between the support rod and the horizontal vibration rod, with one end connected to the upper grip and the other end connected to one end of the grounding part. The busbar undergoes elastic deformation under external force.

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