A composite liquid molding cabinet type multi-source sensor data acquisition device

Abstract

The application discloses a kind of composite liquid forming cabinet type multi-source sensor data acquisition device, belong to composite material forming process monitoring technical field.The device integrates temperature acquisition device, vacuum degree acquisition transposition, viscosity flow rate and overall data acquisition device.The device is integrated with three major acquisition devices with cabinet structure, each device includes acquisition, backplane, communication, power supply four modules, and realizes collaborative work through unified power link and data bus.Acquisition module carries high-precision special chip, combined with filtering, isolation and other technologies, accurately convert temperature, vacuum degree, resin state and other multi-source signals into digital quantity;Communication module realizes data local display and host computer transmission through multi-interface protocol conversion.The device captures the parameter change of whole process in real time, provides reliable data support for process optimization and quality traceability, and significantly improves the stability and production efficiency of composite material forming.

Description

Technical Field

[0001] This invention relates to the field of composite material molding process monitoring technology, specifically to a cabinet-type multi-source sensor data acquisition device for liquid molding of composite materials. Background Technology

[0002] Liquid molding is a core manufacturing technology for key components in aerospace and high-end equipment fields. The uniformity of temperature distribution and the stability of vacuum during the molding process directly determine the mechanical properties of the components. Composite material liquid molding technology refers to the process of injecting liquid polymers into a closed mold cavity containing a fiber preform, or heating and melting a resin film pre-placed in the mold cavity, allowing the liquid polymer to flow and fill the mold while simultaneously impregnating the fibers and curing them into a finished product. Insufficient monitoring and control during the injection process can lead to uneven epoxy resin distribution and porosity in the composite structure. Insufficient monitoring during the curing process can result in excessive resin evaporation or shrinkage, causing voids and cracks in the composite product, directly affecting the yield and service performance of subsequent components. Furthermore, the numerous process parameters in each stage of composite material liquid molding, information barriers between different equipment in the injection and curing processes, low levels of process collaboration, lack of accurate real-time process parameter acquisition, and inability to guarantee the quality of manufactured parts lead to low production efficiency, unstable product quality, and significant difficulties in obtaining airworthiness compliance certification.

[0003] Therefore, there is an urgent need to establish an intelligent process monitoring software and hardware data acquisition and analysis platform for composite material structural components of large aircraft. This platform will address issues such as the lack of process parameter monitoring, low degree of collaborative manufacturing, and inaccurate real-time process parameter acquisition in the manufacturing processes of different structural components. It will also break through the bottleneck of resource access and efficient analysis in liquid molding manufacturing processes, enabling online accurate acquisition, detection, analysis, and optimization of manufacturing process parameters for different wing panel structural components of large aircraft. Furthermore, it will establish a data sensing system for multiple devices in different processes such as glue injection and curing in liquid molding, forming a standard system for the acquisition, fusion, and archiving of multi-source heterogeneous data of different process parameters. This will ensure the stable, reliable, real-time, and accurate acquisition and transmission of process parameters, and timely detection and tracking of component process parameters and defects.

[0004] Based on the requirements of liquid forming process for composite materials, this invention proposes a cabinet-type multi-source sensor data acquisition device for liquid forming of composite materials. By integrating sensors for temperature, pressure, viscosity, etc., and data acquisition systems, it realizes real-time monitoring and precise control of process parameters, shortens the data acquisition and feedback time of multiple devices and multiple processes, ensures timely information sharing and collaborative control among multiple devices, thereby improving product quality, shortening the R&D cycle and adapting to changing process environments, and providing a scientific basis for process optimization and decision-making. Summary of the Invention

[0005] To address the aforementioned problems, the present invention discloses that the main objective of this application is to provide a cabinet-type multi-source sensor data acquisition device for composite liquid forming, which aims to solve the technical problems of separate acquisition of temperature and vacuum degree, low acquisition accuracy, weak anti-interference ability and poor adaptability in existing composite liquid forming monitoring.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A cabinet-type multi-source sensor data acquisition device for composite liquid molding includes:

[0008] Temperature acquisition device, used to acquire temperature data of composite liquid molding die;

[0009] Vacuum degree acquisition device is used to acquire vacuum degree data during the vacuuming and pressure holding process of composite material VARI process;

[0010] The integrated data acquisition device is used to acquire data such as resin viscosity, resin balance in the resin tank, and resin flow rate during the VARI process resin dispensing and curing.

[0011] Furthermore, the temperature acquisition device, vacuum acquisition device, and integrated acquisition device include four main modules: acquisition module, backplane, communication, and power supply.

[0012] Furthermore, the power module is the power source for the entire system, integrating a switching power supply that converts 220V voltage to 24V DC, directly connecting to the backplane via its own connector. The backplane has a dedicated power supply line; the 24V input from the power module is distributed across the backplane via this line. The acquisition module and communication module both draw power directly from the backplane's power supply line, achieving unified power supply from the power module to the backplane and other modules. The acquisition module is the data acquisition source, responsible for converting non-electrical signals from the sensors into electrical signals, and then further into digital quantities. The acquisition module is physically connected to the backplane's socket via its own plug. The converted digital data is transmitted through the backplane's data bus. Simultaneously, the communication module and the front screen are also connected to the backplane's data bus via data cables. The communication module is a data relay node, receiving digital data from all acquisition modules via the backplane's data bus, packaging the data, and sending it to a computer or other host device via an external interface. The front screen can directly obtain sensor data from the backplane's data bus for local data display.

[0013] Furthermore, the acquisition module of the temperature acquisition device includes a connector for connecting to a temperature sensor; and filtering, which addresses the issues of potentially long sensor lines and significant external environmental interference by using a functional inductor to shield against electromagnetic interference in the environment, filtering out noise that affects measurement accuracy and ensuring the accuracy of subsequent data acquisition.

[0014] The acquisition system is equipped with a dedicated thermocouple acquisition chip, which can be directly connected to the thermocouple. It receives the signal after the first part of filtering and directly converts the signal output by the thermocouple into a standardized digital quantity, providing a recognizable digital signal basis for subsequent data transmission to the communication module and screen through the backplane.

[0015] Isolation, through digital isolation chips, completely disconnects the substantial electrical connection between the sensor side and the main control side circuit, and transmits information by electromagnetic or optoelectronic coupling, thereby isolating dangerous factors such as high voltage and protecting the main control chip from being burned or broken down;

[0016] The main controller receives and integrates digital data transmitted from eight acquisition chips, and then sends the integrated unified data to the backplane and system data bus through the 485 transmitter chip, providing support for other modules such as the communication module to read data.

[0017] The power supply receives the 24V voltage transmitted from the backplane and converts it into the 3.3V or 5V adapter voltage required by the acquisition chip, microcontroller and other devices through the power supply circuit, so as to provide a stable power supply for these core electrical devices and ensure their normal operation.

[0018] Optionally, the connector adopts a GX12-4P aviation plug, which corresponds to the 1T+~8T+ and 1T-~8T- thermocouple signal ends, to realize a reliable physical connection and signal transmission between the sensor and the acquisition module;

[0019] Optionally, the filter circuit is equipped with a 75V / 3KA surge protector, a C0805C104M3RACTU type filter capacitor and a DR331-513AE type functional inductor to form a power supply filter network and further improve the anti-interference capability.

[0020] Optionally, eight MAX31856MUD+ chips are used for data acquisition, all connected to the main control chip via SPI bus. Each chip corresponds to one thermocouple signal acquisition channel, realizing 8-channel high-precision data conversion. Moreover, this chip is a high-precision thermocouple digital converter with built-in cold junction compensation and linearization algorithms, which can automatically complete the error correction and temperature linearization of thermocouple signals without the need for additional compensation circuits and fitting algorithms. It also integrates a 19-bit Σ-Δ ADC and configurable digital filtering, and supports multiple types of thermocouple input.

[0021] Optionally, the ADUM series isolation chip is selected to complete the dual isolation of SPI communication signals and 485 signals, ensuring signal transmission integrity and the safety of the main control circuit.

[0022] Optionally, the main control chip is STM32F103RCT6, and the 485 transceiver is MAX13487EESA+, which supports bus protection function to ensure the stability of data transmission on the bus.

[0023] Optionally, the power supply circuit is equipped with HT7333 or TPS7A4701RGWT power chips, with dual power supply outputs of D3.3 and A3V3, and a 24V 1.5A fuse connected in series at the input. It is also equipped with 0.1μF and 22μF filter capacitors to achieve power supply regulation and overload protection.

[0024] Furthermore, the acquisition module of the vacuum degree acquisition device includes:

[0025] Connector for connecting the vacuum gauge;

[0026] Filtering addresses the issues of potentially long sensor circuits and significant external environmental interference by using functional inductors to shield against electromagnetic interference in the environment, filtering out noise that affects measurement accuracy and ensuring the accuracy of subsequent data acquisition.

[0027] The data acquisition system receives the 4-20mA analog signal output from the sensor, first converting it into a weak voltage signal of about 0 to 10mV through a resistor; then, the weak voltage is pre-processed and amplified by an operational amplifier to make full use of the ADC's range to improve measurement accuracy; finally, the amplified analog signal is converted into a digital signal by the ADC and sent to the microcontroller to provide a basis for subsequent data processing and transmission to the data bus.

[0028] The power supply provides stable and compatible power support to all electrical components on the circuit board, ensuring the normal operation of each module;

[0029] Optionally, the connector adopts a GX12-4P aviation plug, which corresponds to the 1V+~4V+ and 1V-~4V- vacuum signal terminals, to realize a reliable physical connection between the vacuum gauge and the acquisition module and the transmission of negative pressure signals.

[0030] Optionally, the filter circuit is equipped with a 75V / 3KA surge protector, a C0805C104M3RACTU type filter capacitor and a DR331-513AE type functional inductor, and with the digital ground-analog ground partition layout design, a power supply filter network is constructed to enhance the anti-interference capability of weak negative voltage signals.

[0031] Optionally, four WT-1000P intelligent vacuum gauge chips are selected for data acquisition. Each chip corresponds to one channel of vacuum signal acquisition, and all are independently connected to the STM32 main control chip via the SPI bus. The operational amplifier is a dedicated model adapted for negative pressure signal conditioning, and the ADC function is integrated into the STM32 main control chip to realize integrated processing of signal amplification and analog-to-digital conversion.

[0032] Optionally, the power supply circuit is configured with a dual-channel isolated power supply scheme, using HT7333 and TPS7A4701RGWT power chips, with dual-channel adaptive voltages of D3.3 and A3V3 outputs. The input terminal is connected in series with a 24V 1.5A fuse, and is equipped with 0.1μF and 22μF filter capacitors to achieve power supply voltage regulation, overload protection and power supply noise filtering, which is suitable for the high temperature and anti-interference requirements of composite molding process.

[0033] Furthermore, the acquisition module of the integrated acquisition device includes:

[0034] The interface section is used for connecting external sensors to acquire signals;

[0035] The optocoupler section is used for the NPN open-drain conversion of the sensor, and also realizes the trigger level conversion;

[0036] The power supply section provides multiple power rails for the acquisition board;

[0037] The main control unit is used to collect and process the switching signals from multiple channels of sensors, implement timing and other functions as needed, and send them to the RS485 bus in a packaged manner.

[0038] Optionally, the interface section is equipped with an 8-channel digital input interface and a 75V / 3KA surge protector to resist external surge interference in the composite molding environment; the interface adopts a GX12-4P aviation plug, corresponding to 1DI~8DI signal terminals, to ensure a reliable physical connection between the device and the sensor.

[0039] Optionally, the optocoupler section uses eight PC817 general-purpose optocouplers to achieve electrical isolation between the input switching signals and subsequent circuits, preventing external interference or high voltage from damaging core components. An RC filter network is configured at the rear of the optocoupler to form a signal anti-jitter conditioning circuit, which can eliminate signal jitter of mechanical contact switches. The chip achieves input-output electrical isolation through optical media, with an isolation voltage of up to 5000Vrms, which can effectively block ground loop interference and surge noise in industrial environments, protecting the main control chip and sensor safety.

[0040] Optionally, the power supply section uses a TPS7A4701RGWT power chip to convert the external input voltage into a 3.3V adapter power supply; the power supply circuit integrates a multi-stage filter network to filter out power supply noise.

[0041] The communication module is based on the Model Bus master-slave bus communication algorithm to build the core control logic, and also integrates a bus non-interference monitoring relay algorithm to adapt to the dual-end data requirements of local display and upper computer transmission.

[0042] Optionally, in the communication module, the Model Bus master-slave bus communication algorithm limits the local display screen to the only bus master and each acquisition module to the bus slave. Only the master is allowed to initiate polling commands and the slaves passively respond. When there are no commands, the bus remains silent to prevent multi-master bus conflicts.

[0043] Optionally, the bus-free listening relay algorithm is implemented through an independent pure receiving listening unit. This unit establishes an electrical connection with the Model Bus and only has the ability to receive bus data. It has no bus command or data transmission functions. It can listen to and collect all transmitted data such as the host's query command and the slave's response data on the bus in real time, and relay the collected standardized digital data to the host computer through a dedicated transmission link to achieve synchronous acquisition and non-disruptive transmission of data between local display and host computer transmission.

[0044] Optionally, during the initialization of the monitoring unit, the main control chip starts the pure receiver monitoring unit, configures it in bus read-only mode, disables the function of all transmit pins to ensure that it does not output any electrical signals to the bus, and establishes an independent transmission link between the monitoring unit and the host computer.

[0045] Optionally, the host sends a query command from the acquisition module to the bus according to the polling cycle. After receiving the command, the corresponding slave device sends digital data back to the bus. The monitoring unit captures the query commands and response data on the bus in real time and performs data format standardization processing.

[0046] This invention also includes an operation method for any one of the three acquisition devices, the operation method comprising the following steps:

[0047] Step 1: Connect each process sensor to the corresponding temperature acquisition device, vacuum acquisition device, or integrated acquisition device interface; Step 2: Start the acquisition device and acquire the digital data converted by each acquisition module through the unified backplane data bus; Step 3: Pack the acquired data and send it to the computer host through the communication module.

[0048] The beneficial effects of this invention are:

[0049] 1. By integrating temperature acquisition devices, vacuum acquisition devices, and comprehensive acquisition devices, real-time acquisition of various parameters can be achieved, including core process parameters such as temperature, pressure, viscosity, and resin flow state. The acquisition devices of this invention are equipped with high-precision sensors and dedicated acquisition chips to record parameter changes throughout the entire process of glue dispensing and curing, improving upon the problems of incomplete process parameter monitoring and delayed data acquisition in traditional methods. Each acquisition device adopts a standardized architecture of acquisition modules, backplane, communication modules, and power modules. Furthermore, the acquisition channels in the acquisition modules can be connected to sensors via plug-and-play aviation connectors, allowing for flexible increases or decreases in the number of channels to adapt to the molding processes of different specifications of composite components.

[0050] 2. The temperature acquisition device uses a dedicated thermocouple acquisition chip with a digital isolation circuit, and has built-in cold junction compensation and linearization algorithms to ensure temperature acquisition accuracy and suppress electromagnetic interference on site. The vacuum acquisition device amplifies and digitizes weak analog signals through sampling resistors, operational amplifiers, and analog-to-digital converters, improving the detection sensitivity of minute changes in vacuum. The integrated acquisition device uses optocoupler isolation circuits to achieve electrical isolation and level conversion of switch signals, ensuring stable acquisition of switch signals such as resin balance and flow rate.

[0051] 3. The backplane module has a built-in unified power supply line and data bus, providing a standardized power supply and data transmission channel for each acquisition module, which can effectively avoid signal interference and wiring chaos between multiple modules; the communication module reads information from the data bus and uploads it to the host computer, while working with the local display screen to realize real-time display of parameters, effectively solving the problems of data dispersion and low transmission efficiency caused by independent acquisition by multiple devices, and making it convenient for process personnel to view and analyze in real time. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the system architecture and data transmission link of the acquisition device described in this invention;

[0053] Figure 2 This is a block diagram of the modules included in the data acquisition device of the present invention;

[0054] Figure 3 This is a system architecture diagram of the signal acquisition and transmission of the acquisition device described in this invention;

[0055] Figure 4 This is a circuit diagram of the temperature acquisition module of the present invention;

[0056] Figure 5 This is a circuit diagram of the vacuum degree acquisition module of the present invention;

[0057] Figure 6 This is a circuit diagram of the integrated data acquisition module of the present invention;

[0058] Figure 7 This is a circuit schematic diagram of the communication module of the present invention;

[0059] Figure 8 This is a three-dimensional schematic diagram of the temperature acquisition module board of the present invention;

[0060] Figure 9 This is a three-dimensional schematic diagram of the vacuum degree acquisition module board of the present invention;

[0061] Figure 10 This is a three-dimensional schematic diagram of the integrated acquisition module board of the present invention;

[0062] Figure 11This is a three-dimensional schematic diagram of the communication module board of the present invention. Detailed Implementation

[0063] The present invention will be further illustrated below with reference to the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, and the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0064] like Figure 1-11 As shown, a cabinet-type multi-source sensor data acquisition device for composite liquid molding includes a temperature acquisition device, a vacuum degree acquisition device, and a comprehensive acquisition device. The device uses a cabinet-type unit as its carrier, integrating four functional modules: acquisition system 1 (temperature acquisition device), acquisition system 2 (vacuum degree acquisition device), acquisition system 3 (comprehensive acquisition device), and the main acquisition system. Each acquisition system connects to the array inputs of sensor types 1, 2, and 3 respectively via its internal RS485 data bus. The main acquisition system collects the acquired data from each acquisition system via its internal RS485 data bus, connects to a user-interactive external display via HDMI and USB-C interfaces, and simultaneously establishes a data storage link with the NAS local database.

[0065] like Figure 2 As shown, each acquisition system includes four main modules: acquisition module, backplane, communication, and power supply. The power supply module integrates a switching power supply, which converts 220V to 24V DC and connects to the backplane. The backplane distributes power through a dedicated line, and both the acquisition and communication modules draw power from the backplane. The acquisition module converts the sensor signals into digital quantities and transmits them via the backplane data bus. The communication module receives data from the bus, packages it, and sends it to the host computer. The screen also receives data from the bus for local display.

[0066] like Figure 3 As shown, the temperature acquisition module circuit board uses an STM32F103RCT6 as the main control chip, paired with eight MAX31856MUD thermocouple-specific acquisition chips, supplemented by an ADUM3153 isolation chip, a MAX13487EESA+RS485 transceiver, and a 75V / 3KA surge protector. External connections are achieved through a GX12-4P aviation connector. The thermocouple interfaces correspond to the 1T+~8T+ and 1T-~8T- signal terminals, ensuring the integrity of temperature signal transmission.

[0067] The power supply module circuit board adopts a dual-channel isolated voltage regulation design. The backplane input voltage is converted into a D3.3V digital power supply and an A3.3V analog power supply via TPS7A4701RGWT and HT7333 power chips, respectively powering digital and analog components to avoid noise crosstalk. A 24V 1.5A fuse and multi-specification filter capacitors are connected in series at the input end to form a protection and filtering network to ensure stable power supply. Signal acquisition and conversion are the core components. After the K-type thermocouple is connected via an aviation connector, its temperature micro-voltage signal based on the Seebeck effect is filtered for interference by a surge protector. The corresponding MAX31856MUD chip completes cold junction compensation and analog-to-digital conversion. All eight chips communicate with the main controller via the SPI bus. The DRDY pin provides feedback on data readiness, and the FAULT pin indicates acquisition abnormalities.

[0068] The isolation module uses the ADUM3153 chip to achieve complete electrical isolation between the sensor side and the main control side, covering SPI and RS485 communication signals. It transmits information via electromagnetic coupling, isolating high voltage and ground loop currents to protect the core circuitry. The ADUM3153 is a high-speed digital isolation chip with a high isolation withstand voltage of 2.5kVrms, effectively isolating the ground potential difference and electromagnetic interference between the main control and acquisition ends, while ensuring reliable transmission of SPI communication signals. The STM32F103RCT6 main control chip coordinates the entire chain operation, reading eight channels of digital temperature data via the SPI bus, performing integration, anomaly detection, and format standardization, while sending control commands to each module. Temporary data storage supports local traceability. The communication module uses a MAX13487EESA+ transceiver to convert the processed data into RS485 differential signals and upload them to the internal data bus of the acquisition system, supporting subsequent data interaction.

[0069] like Figure 4 As shown, the vacuum acquisition module circuit board uses STM32F103RCT6 as the main control core, and is equipped with AD4115BCPZ high-precision analog-to-digital converter chip, INA821IDR operational amplifier and other components. It can realize high-precision acquisition of 4-channel vacuum gauge 4-20mA analog signals, which can meet the monitoring needs of key negative pressure areas in composite molding process.

[0070] The power supply module is connected to the backplane via a GX12-4P aviation connector and 24V voltage. Input protection is achieved through fuses and surge protectors. The voltage is then converted to D3.3V digital power and A3.3V analog power by a TPS7A4701RGWT regulator. Dual-channel isolated power supply avoids noise crosstalk. Multi-stage filtering capacitors and voltage indicator lights are also configured to ensure stable power supply to core components and support status visualization. The signal acquisition and conditioning module converts the 4-20mA signal output from the vacuum gauge into a weak voltage through a 10KΩ high-precision sampling resistor. After filtering by a DR331-513AE inductor, it is amplified to the appropriate range by an INA821 operational amplifier and then connected to an AD4115BCPZ chip to complete 16-bit analog-to-digital conversion. This chip communicates with the main controller via the SPI bus to ensure real-time data transmission.

[0071] The main control module uses STM32F103RCT6 as its core. After reading the digital value from AD4115, it restores it to the physical value of vacuum degree, and simultaneously completes outlier rejection and temperature compensation. Then, it blocks the interference path through ADUM1201 isolation chip, and finally converts it into RS485 differential signal through MAX13487EESA transceiver, and connects to the internal data bus of the acquisition system to realize data upload.

[0072] like Figure 5 As shown, the integrated acquisition module circuit board of the integrated acquisition device uses an STM32F103RCT6 as the main control chip, paired with eight PC817 general-purpose linear optocouplers, supplemented by an ADUM1201 digital isolation chip, a MAX13487EESA+RS485 transceiver, and a 75V / 3KA surge protector. External connections are achieved through a GX12-4P aviation connector. The switch interface corresponds to channels CH1~CH8, ensuring reliable access and isolation transmission integrity of switch signals. The chip achieves input and output electrical isolation through optical media, with an isolation voltage of up to 5000Vrms, which can effectively block ground loop interference and surge noise in industrial environments, protecting the main control chip and sensor safety.

[0073] The interface section is equipped with an 8-channel GX12-4P aviation connector, with a series 2KΩ current-limiting resistor to control the input current in the range of 5~10mA. It also integrates a 75V / 3KA surge protector to suppress transient surge voltages in industrial environments.

[0074] The optocoupler section uses eight PC817 general-purpose linear optocouplers, achieving complete electrical isolation between the input and output circuits through an electro-optical-electro-electrical conversion mechanism. The isolation resistance is >10¹²Ω and the parasitic capacitance is <1pF, effectively blocking 10kV / μs transient common-mode interference. Each optocoupler's input side is connected to the interface VCC-L terminal via a current-limiting resistor, and its output side is connected to the main control GPIO pin via a 4.7KΩ pull-up resistor, forming a stable output level circuit. Simultaneously, the pull-up resistor and PCB parasitic capacitance form an RC filter network, which, combined with subsequent software anti-bounce algorithms, effectively eliminates contact bounce of the mechanical switches.

[0075] The power supply section provides a stable energy supply for the entire module. The external 24V DC voltage is connected through a 24V 1.5A fuse, and then initially stepped down by a TPS54560DDA switching power supply chip and further regulated by a TPS7A4701RGWT low dropout regulator. The output is a D3.3V digital power supply and a VCC-L isolated power supply. The dual power supply is electrically isolated to avoid digital noise crosstalk.

[0076] The main control unit is based on the STM32F103RCT6. It receives the switching signals output by the optocoupler through the GPIO pin, and is equipped with an 8MHz passive crystal oscillator and reset circuit to ensure stable operation of the chip. It integrates an ADUM1201 digital isolation chip to block communication link interference. It is paired with a MAX13487EESA+RS485 transceiver to convert the processed switching data into differential signals and connect to the internal data bus of the acquisition system to achieve long-distance transmission.

[0077] like Figure 6 As shown, the communication module uses STM32F103RCT6 as the main control core and undertakes three major functions: data reception, protocol conversion, and data forwarding. It connects to peripheral USB, RS485, and RS232 transceiver chips through pins, and after receiving data from multiple interfaces, it completes format conversion and packet processing, and finally schedules the bidirectional interaction between the host computer and the internal data bus of the acquisition system.

[0078] The communication module integrates three external interface circuits and one internal bus interface. The USB interface uses the CH340N chip to convert the host computer's USB protocol to the STM32 serial port protocol. The external RS485 interface uses the MAX13487EESA+ chip to complete differential signal communication. The RS232 interface uses the ADM3215EARWZ chip to achieve traditional serial communication. The internal data bus of the acquisition system establishes an RS485 differential communication link with the STM32 through another MAX13487EESA+ chip to complete the access of the acquisition system data.

[0079] Data from the acquisition system is transmitted to the STM32 via the internal bus interface, processed, and then transmitted to the host computer via USB / external RS485 / RS232 interface; instructions or data from the host computer are transmitted to the STM32 via the aforementioned external interfaces, processed, and then forwarded to the acquisition system via the internal bus interface.

[0080] In the specific implementation process, the three acquisition devices mentioned above can monitor the entire process of composite liquid molding from vacuuming, pressure holding, glue injection to curing in real time.

[0081] Specifically, during the vacuuming and pressure holding stages, the temperature acquisition device synchronously collects the temperature of each area of ​​the mold through multiple thermocouples, and provides real-time feedback on the mold's heating rate and temperature distribution uniformity; the vacuum acquisition device is connected to a vacuum gauge to accurately capture the pressure change of the vacuum chamber from atmospheric pressure to -98KPa throughout the entire process, continuously monitors the vacuum fluctuation during the pressure holding stage, and promptly identifies abnormal problems such as poor sealing and leakage of the vacuum bag.

[0082] Specifically, during the resin injection stage, the temperature acquisition device continuously monitors the mold temperature and determines the resin front position by measuring the change in temperature gradient before and after resin flow. It also synchronously captures temperature fluctuations in various areas of the mold using multiple thermocouple acquisition channels, providing real-time feedback on the resin flow and propulsion status within the mold cavity. The integrated acquisition device simultaneously collects the remaining resin volume, viscosity, and flow rate in the resin tank. It performs real-time statistics and monitors the remaining resin volume consumption, calculates the resin flow rate by switching the resin flow rate, and then obtains the resin flow front propulsion speed. Combined with viscosity data, it reflects the resin's reaction state within the molding die in real time. This achieves high-precision monitoring of the resin state throughout the entire composite liquid molding process, effectively avoiding process defects such as dry spots and resin overload caused by insufficient resin supply or abnormal flow.

[0083] During the curing stage, the temperature acquisition device focuses on monitoring the temperature rise and fall of the mold and the uniformity of the mold temperature distribution during the curing process; the vacuum acquisition device continuously monitors the vacuum status during the curing stage to prevent the formation of pores in the component due to vacuum abnormalities.

[0084] The technical means disclosed in this invention are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features.

Claims

1. A cabinet-type multi-source sensor data acquisition device for composite liquid molding, characterized in that, include: Temperature acquisition device, used to acquire temperature data of composite liquid molding die; Vacuum degree acquisition device is used to acquire vacuum degree data during the vacuuming and pressure holding process of composite material VARI process; The integrated data acquisition device is used to acquire data on resin viscosity, resin balance in the resin tank, and resin flow rate during the VARI process resin dispensing and curing.

2. The composite liquid forming cabinet-type multi-source sensor data acquisition device according to claim 1, characterized in that, The temperature acquisition device, vacuum acquisition device, and integrated acquisition device all include four major modules: acquisition module, backplane, communication, and power supply.

3. The composite liquid forming cabinet-type multi-source sensor data acquisition device according to claim 2, characterized in that: The power supply module converts externally input AC power into DC power and supplies power to the backplane module through an electrical connection. The backplane module has power supply lines and a data bus, which distribute the DC power input from the power supply module to the acquisition module and the communication module, and provide data transmission channels for them. The acquisition module is pluggably connected to the backplane module, converts incoming sensor signals into digital data, and sends the digital data to the data bus of the backplane module. The communication module is connected to the data bus of the backplane module, acquires digital data from the data bus, and uploads it to the host computer.

4. The composite liquid forming cabinet-type multi-source sensor data acquisition device according to claim 2, characterized in that: The temperature acquisition module of the temperature acquisition device includes: A temperature sensor interface is used to connect to a thermocouple; a filter circuit is connected to the temperature sensor interface to suppress electromagnetic interference; a data acquisition circuit, equipped with a dedicated thermocouple acquisition chip and connected to the filter circuit, is used to convert thermocouple signals into digital temperature data; an isolation circuit is connected to the acquisition circuit to achieve electrical isolation between the sensor side and the main control side; a main control circuit is connected to the isolation circuit to receive and integrate multiple channels of digital temperature data and transmit them through the data bus of the backplane module; and a power supply circuit is connected to the power supply line of the backplane module to provide an appropriate operating voltage for the acquisition module.

5. The composite liquid forming cabinet-type multi-source sensor data acquisition device according to claim 2, characterized in that, The acquisition module of the vacuum degree acquisition device includes: a vacuum gauge interface for connecting a vacuum gauge; a filter circuit connected to the vacuum gauge interface for suppressing electromagnetic interference; an acquisition circuit connected to the filter circuit for converting the 4-20mA analog signal output by the vacuum gauge into digital vacuum degree data; a main control circuit connected to the acquisition circuit for processing the digital vacuum degree data and transmitting it through the data bus of the backplane module; and a power supply circuit connected to the power supply line of the backplane module for providing an appropriate operating voltage for the acquisition module.

6. The composite liquid forming cabinet-type multi-source sensor data acquisition device according to claim 5, characterized in that, The acquisition circuit includes a sampling resistor, an operational amplifier, and an analog-to-digital converter. The operational amplifier is used to amplify the weak voltage signal before inputting it into the analog-to-digital converter.

7. The composite liquid forming cabinet-type multi-source sensor data acquisition device according to claim 2, characterized in that, The acquisition module of the integrated acquisition device includes: a switch sensor interface for connecting a sensor that outputs switch signals; an optocoupler isolation circuit connected to the switch sensor interface for electrical isolation and level conversion; a main control circuit connected to the optocoupler isolation circuit for acquiring and processing multiple switch signals and transmitting them through the data bus of the backplane module; and a power supply circuit connected to the power supply line of the backplane module for providing multi-rail power supply to the acquisition module.

8. A cabinet-type multi-source sensor data acquisition device for composite liquid forming according to claim 1, characterized in that, It also includes a local display screen, which is connected to the data bus of the backplane module, for displaying sensor data acquired by each acquisition device in real time.

9. A cabinet-type multi-source sensor data acquisition device for composite liquid forming according to claim 3, characterized in that, The communication module has a built-in Model Bus master-slave communication algorithm and a bus data monitoring algorithm. The communication module integrates a master-slave interaction unit and a pure receiver monitoring unit. The master-slave interaction unit matches the Model Bus master-slave communication protocol. The pure receiver monitoring unit is electrically connected to the Model Bus bus and has no bus data transmission function. It only realizes the full acquisition and relay of bus data.

10. A method for acquiring data from a multi-source sensor in a cabinet-type composite liquid forming system, based on a multi-source sensor data acquisition device in a cabinet-type composite liquid forming system according to any one of claims 1-9, characterized in that: Specifically, the steps are as follows: Step 1: Connect each process sensor to the interface of the corresponding temperature acquisition device, vacuum acquisition device, or integrated acquisition device; Step 2: Start the acquisition device and acquire the digital data converted by each acquisition module through the unified backplane data bus; Step 3: Pack the acquired data and send it to the computer host through the communication module.

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