Molecular sieve life monitoring device, molecular sieve apparatus, and molecular sieve life monitoring method

Abstract

The application provides a molecular sieve life monitoring device, a molecular sieve device and a molecular sieve life monitoring method. The molecular sieve life monitoring device comprises a pressure device, a detection device and a control device. The pressure device applies pressure to the molecular sieve. The detection device detects information related to the pressure applied to the molecular sieve by the pressure device. The control device controls the force applied to the molecular sieve by the pressure device according to the detected information related to the pressure applied to the molecular sieve by the pressure device. The device realizes the life monitoring of the molecular sieve by detecting the information related to the pressure applied to the molecular sieve by the pressure device. According to the detected information related to the pressure applied to the molecular sieve by the pressure device, the force applied to the molecular sieve by the pressure device is controlled, so that the molecular sieve maintains a compact state during use, and the service life of the molecular sieve is improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a molecular sieve lifetime monitoring device, molecular sieve equipment, and molecular sieve lifetime monitoring method. Background Technology

[0002] Molecular sieves, as important separation and catalytic materials, are widely used in various industries such as oxygen production, natural gas pretreatment, and chemical processing. In oxygen production equipment, molecular sieve devices are key components, and their performance and service life directly affect the reliability and efficiency of the oxygen production system. However, during use, molecular sieves are prone to pulverization due to factors such as insufficient cover plate compaction or decreased mechanical strength, leading to a decline in the performance of the molecular sieve equipment and a reduction in its service life. Therefore, monitoring the settling state of the molecular sieve and ensuring its compaction are crucial for ensuring the stable operation of the molecular sieve equipment and extending its service life.

[0003] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Summary of the Invention

[0004] The inventors discovered that existing molecular sieve monitoring methods rely on manual experience and periodic replacement, which is not only inefficient but also fails to accurately monitor the settling state of the molecular sieve. This leads to the molecular sieve becoming pulverized due to its inability to be compacted, thus reducing the service life of the molecular sieve equipment.

[0005] To address at least one of the aforementioned technical problems, embodiments of this application provide a molecular sieve life monitoring device, a molecular sieve apparatus, and a molecular sieve life monitoring method. In this molecular sieve life monitoring device, life monitoring of the molecular sieve is achieved by detecting information related to the pressure applied to the molecular sieve by a pressure device. Furthermore, based on the detected information related to the pressure applied to the molecular sieve by the pressure device, the force applied to the molecular sieve by the pressure device is controlled, maintaining the molecular sieve in a compacted state during use and thus extending its service life.

[0006] This application provides a molecular sieve lifetime monitoring device, the molecular sieve lifetime monitoring device comprising:

[0007] A pressure device that applies pressure to the molecular sieve;

[0008] A detection device that detects information related to the pressure applied to the molecular sieve by the pressure device; and

[0009] A control device that controls the force applied to the molecular sieve by the pressure device based on information related to the pressure applied to the molecular sieve by the pressure device.

[0010] In some embodiments, the pressure device includes:

[0011] A pressure application unit applies adjustable pressure to the molecular sieve; and

[0012] The pressure holding part includes a positioning part and a limiting part, wherein the positioning part engages with the limiting part to prevent the pressure applying part from moving in the opposite direction to the pressure.

[0013] In some embodiments, the pressure application portion includes:

[0014] Magnetic components;

[0015] A coil component, when energized, generates a repulsive force with the magnetic component, the repulsive force corresponding to the pressure applied to the molecular sieve; and

[0016] The top plate has the coil component placed on its upper surface and its lower surface attached to the molecular sieve.

[0017] In some embodiments, the detection device detects information related to the pressure applied by the pressure device to the molecular sieve, including at least one of the following:

[0018] The pressure applied to the molecular sieve by the pressure applying part, the moving distance of the pressure applying part, and the number of times or the moving distance of the positioning part relative to the limiting part.

[0019] In some embodiments, the control device includes at least one of the following:

[0020] A microcontroller unit that adjusts a first parameter value provided to the pressure device for generating the pressure based on information related to the pressure applied by the pressure device to the molecular sieve, thereby controlling the force applied by the pressure device to the molecular sieve; and

[0021] An adjustment unit adjusts a second parameter value in the circuit of the pressure device based on information related to the pressure applied to the molecular sieve by the detected pressure device, thereby adjusting the first parameter value to control the force applied to the molecular sieve by the pressure device.

[0022] In some embodiments, the molecular sieve lifetime monitoring device further includes at least one of the following devices:

[0023] An alarm device that issues an alarm when the detection device detects that the value of the pressure-related information reaches a threshold; and

[0024] The switching device switches to the off state when the detection device detects that the value of the pressure-related information reaches a threshold.

[0025] This application provides a molecular sieve device, the molecular sieve device comprising:

[0026] Molecular sieve cylinder;

[0027] Molecular sieve, which is located inside the molecular sieve cylinder;

[0028] The molecular sieve lifetime monitoring device as described in any of the above embodiments is disposed above the molecular sieve; and

[0029] A cover plate is disposed above the molecular sieve life monitoring device for mounting the molecular sieve life monitoring device.

[0030] This application provides a method for monitoring the lifetime of molecular sieves, the method comprising:

[0031] Information related to the pressure applied to the molecular sieve by the detection and pressure device; and

[0032] Based on the information related to the detected pressure applied to the molecular sieve, the force applied to the molecular sieve by the pressure device is controlled.

[0033] In some embodiments, controlling the force applied to the molecular sieve by the pressure device based on the detected information related to the pressure applied to the molecular sieve includes:

[0034] Based on the information related to the detected pressure applied to the molecular sieve, the first parameter value in the circuit of the pressure device is adjusted to control the force applied to the molecular sieve by the pressure device.

[0035] One of the beneficial effects of this application embodiment is that: in the molecular sieve life monitoring device, by detecting information related to the pressure applied to the molecular sieve by the pressure device, the life monitoring of the molecular sieve is realized, and based on the detected information related to the pressure applied to the molecular sieve by the pressure device, the force applied to the molecular sieve by the pressure device is controlled, so that the molecular sieve remains in a compacted state during use, thereby improving the service life of the molecular sieve equipment.

[0036] Specific embodiments of this application are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of this application can be adopted. It should be understood that the embodiments of this application are not limited in scope. Within the spirit and scope of the appended claims, embodiments of this application include many changes, modifications, and equivalents.

[0037] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0038] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components. Attached Figure Description

[0039] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without creative effort. In the drawings:

[0040] Figure 1 This is a schematic diagram of the molecular sieve lifetime monitoring device according to an embodiment of this application;

[0041] Figure 2 This is a structural diagram of a molecular sieve lifetime monitoring device according to an embodiment of this application;

[0042] Figure 3 This is a perspective view of the adjustment unit according to an embodiment of this application;

[0043] Figure 4 This is a schematic diagram of the adjustment unit according to an embodiment of this application;

[0044] Figure 5 yes Figure 4 A cross-sectional view of the adjustment unit in the diagram;

[0045] Figure 6 This is another perspective view of the adjustment unit in an embodiment of this application;

[0046] Figure 7 This is a schematic diagram of a switching device according to an embodiment of this application;

[0047] Figure 8 This is a perspective view of a molecular sieve device according to an embodiment of this application;

[0048] Figure 9 This is a schematic diagram of a molecular sieve lifetime monitoring method according to an embodiment of this application;

[0049] Figure 10 This is another schematic diagram of the molecular sieve lifetime monitoring method according to an embodiment of this application. Detailed Implementation

[0050] Referring to the accompanying drawings, the foregoing and other features of the embodiments of this application will become apparent from the following description. Specific embodiments of this application are specifically disclosed in the description and drawings, illustrating partial implementations in which the principles of the embodiments of this application can be adopted. It should be understood that this application is not limited to the described embodiments; rather, the embodiments of this application include all modifications, variations, and equivalents falling within the scope of the appended claims.

[0051] In the embodiments of this application, the terms "first," "second," etc., are used to distinguish different elements by name, but do not indicate the spatial arrangement or chronological order of these elements, and these elements should not be limited by these terms. The term "and / or" includes any one or more of the terms listed in association and all combinations thereof. The terms "comprising," "including," "having," etc., refer to the presence of the stated features, elements, components, or assemblies, but do not exclude the presence or addition of one or more other features, elements, components, or assemblies.

[0052] In the embodiments of this application, the singular forms "a," "the," etc., including the plural forms, should be broadly understood as "a kind" or "a class" rather than limited to the meaning of "an." Furthermore, the term "the" should be understood to include both the singular and plural forms, unless the context explicitly indicates otherwise. Additionally, the term "according to" should be understood as "at least partially based on…," and the term "based on" should be understood as "at least partially based on…," unless the context explicitly indicates otherwise.

[0053] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments. The term "comprising / including" as used herein means the presence of a feature, integral, step, or component, but does not exclude the presence or addition of one or more other features, integrals, steps, or components.

[0054] The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0055] This application provides a molecular sieve lifetime monitoring device.

[0056] Figure 1 This is a schematic diagram of the molecular sieve lifetime monitoring device according to an embodiment of this application. Figure 2 This is a structural diagram of a molecular sieve lifetime monitoring device according to an embodiment of this application. Figure 1 and Figure 2 As shown, the molecular sieve life monitoring device 100 includes: a pressure device 1, a detection device 2, and a control device 3.

[0057] In this application, pressure device 1 applies pressure F1 to molecular sieve 6, detection device 2 detects information related to the pressure F1 applied by pressure device 1 to molecular sieve 6, and control device 3 controls the force F1 applied by pressure device 1 to molecular sieve 6 based on the detected information related to the pressure F1 applied by pressure device 1 to molecular sieve 6.

[0058] According to the above embodiments, in the molecular sieve life monitoring device 100, by detecting information related to the pressure F1 applied by the pressure device 1 to the molecular sieve 6, the sinking state monitoring of the molecular sieve 6 is realized, that is, the life monitoring of the molecular sieve 6 is realized. Furthermore, based on the detected information related to the pressure F1 applied by the pressure device 1 to the molecular sieve 6, the force F1 applied by the pressure device 1 to the molecular sieve 6 is controlled to keep the pressure F1 applied by the pressure device 1 to the molecular sieve 6 constant, thereby maintaining the compacted state of the molecular sieve 6 during use and improving the service life of the molecular sieve 6.

[0059] like Figure 1 and Figure 2 As shown, the molecular sieve life monitoring device 100 also includes at least one of an alarm device 4 and a switching device 5. When the detection device 2 detects that the value of information related to pressure F1 reaches a threshold, the alarm device 4 issues an alarm, and the switching device 5 switches to the off state.

[0060] The pressure device 1 of this application will be described in detail below.

[0061] In some embodiments, the pressure device 1 includes a pressure applying part 11 and a pressure holding part 12.

[0062] The pressure application unit 11 includes a magnetic component 111, a coil component 112, and a top plate 113, applying an adjustable pressure F1 to the molecular sieve 6. The magnetic component 111 is, for example, a ring-shaped magnet with magnetism. The magnetic component 111 can be mounted on the cover plate 7, for example, located on the lower surface of the cover plate 7. The coil component 112 is, for example, one or more electromagnetic coils, disposed on the upper surface of the top plate 113, located below the magnetic component 111. The lower surface of the top plate 113 is in contact with the molecular sieve 6. When the coil component 112 is energized, repulsive forces F2 and F2' are generated between it and the magnetic component 111. The repulsive force F2 causes the coil component 112 to push the top plate 113 towards the molecular sieve 6, and the repulsive force F2 corresponds to the pressure F1 applied by the top plate 113 to the molecular sieve 6.

[0063] The pressure holding part 12 includes a positioning part 121 and a limiting part 122. The positioning part 121 and the limiting part 122 are engaged to prevent the pressure applying part 11 from moving in the opposite direction to the pressure F1.

[0064] The positioning part 121 includes a pin 121a and a spring 121b sleeved on the rear end of the pin 121a. The front end of the pin 121a passes through the opening 711 of the support part 71 below the cover plate 7. The upper side of the front end of the pin 121a is sloped.

[0065] The limiting part 122 is provided on the upper surface of the top plate 113 and includes a plurality of limiting grooves 122a, 122b, 122c and 122d, which are arranged in a vertical direction.

[0066] When the molecular sieve 6 is fully filled, and the top plate 113 compacts the molecular sieve 6, the front end of the pin 121a engages with the bottom limiting groove 122d.

[0067] During the sinking of the molecular sieve 6, when the top plate 113 of the pressure application part 11 compacts the molecular sieve 6, the top plate 113 moves downward with the sinking of the molecular sieve 6, causing the limiting part 122 to move downward. The front end of the pin 121a is subjected to a force F3 applied by the connecting part 122e between the limiting groove 122d and the limiting groove 122c, which squeezes the spring 121b and moves in the direction of the force F3. It moves out of the limiting groove 122d, passes the connecting part 122e, and is subjected to a force opposite to the force F3 applied by the spring 121b, thus engaging with the limiting groove 122c. That is, the pin 121a completes one reciprocating movement. Similarly, as the molecular sieve 6 continues to sink, while the top plate 113 is kept compacting the molecular sieve 6, the top plate 113 continues to move downward with the sinking of the molecular sieve 6, and the front end of the pin 121a engages with the limiting groove 122b and the limiting groove 122a in sequence. When the front end of pin 121a engages with the uppermost limiting groove 122a, pin 121a is locked, preventing the pulverization caused by the continued movement of the molecular sieve due to the reverse movement of the pressure application part 11.

[0068] In some examples, the positioning part 121 can be configured as two symmetrical pins 121a and 121a', which are located on a straight line with their rear ends facing each other. One end of the spring 121b is fitted onto the rear end of the pin 121a, and the other end of the spring 121b is fitted onto the rear end of the pin 121a'. The reciprocating movement of the pin 121a' is the same as that of the pin 121a.

[0069] In some examples, limit portions 122' can be provided symmetrically arranged with limit portions 122. When pin 121a engages and switches with the limit groove of limit portion 122, pin 121a' can engage and switch with the limit groove in the corresponding limit portion 122'.

[0070] In some examples, the pressure application part 11 is replaced by the magnetic system described above with an elastic system made of elastic components.

[0071] The control device 3 of this application will be described in detail below.

[0072] In some embodiments, the control device 3 includes at least one of a microcontroller unit 31 and an adjustment unit 32. The microcontroller unit 31 adjusts a first parameter value provided to the pressure device 1 for generating the pressure F1 based on information about the pressure F1 applied by the pressure device 1 to the molecular sieve 6, thereby controlling the force F1 applied by the pressure device 1 to the molecular sieve 6. The microcontroller unit 31 is, for example, a microcontroller unit (MCU).

[0073] The adjustment unit 32 adjusts the second parameter value in the circuit of the pressure device 1 based on the information related to the pressure F1 applied by the pressure device 1 to the molecular sieve 6, thereby adjusting the first parameter value to control the force F1 applied by the pressure device 1 to the molecular sieve 6.

[0074] In some examples, for the pressure application part 11 composed of a magnetic system, the first parameter value can be the current value and the second parameter value can be the resistance value; for the pressure application part 11 composed of an elastic system, the first parameter value can be the deformation of the elastic member and the second parameter value can be the number of turns of the elastic member.

[0075] The adjustment unit of this application embodiment will be described below using the pressure application part 11, which is composed of a magnetic system, as an example.

[0076] Figure 3 This is a perspective view of the adjustment unit according to an embodiment of this application; Figure 4 This is a schematic diagram of an adjustment unit according to an embodiment of this application. The schematic diagram is along... Figure 3 Obtained by observation in the D2 direction; Figure 5 yes Figure 4 A cross-sectional view of the adjustment unit in the middle, the cross-sectional view is along Figure 4 It is obtained by cutting face A-A' in the middle. Figures 3-5 As shown, the adjustment unit 32 includes a rotating shaft 301, a spring 302 and a rheostat 303, with the rheostat 303 disposed in the circuit of the coil component 112.

[0077] In some examples, the lower end of the rotating shaft 301 is provided with at least one of a first protrusion 3011 and a second protrusion 3012. When the pin 121a is subjected to a force F3 and moves in the same direction as the force F3, the pin 121a overcomes the resistance of the spring 302 and pushes the first protrusion 3011 to move in the same direction as the force F3, causing the rotating shaft 301 to rotate in the direction D1. At the same time, the spring 302 generates torque due to twisting. When the force F3 applied to the pin 121a disappears, the spring 302 releases the torque and returns to its original state, causing the rotating shaft 301 to rotate in the opposite direction to D1 and return to its initial position. The process of the pin 121a' pushing the second protrusion 3012 to rotate the rotating shaft 301 and the process of the rotating shaft 301 returning to its initial position are similar.

[0078] In some examples, the upper end of the rotating shaft 301 is connected to the pointer 3032 of the rheostat 303 via a one-way gear (not shown in the figure). When the rotating shaft 301 rotates in the D1 direction, the pointer 3032 slides along the D1 direction on the ring resistor 3031, adjusting the resistance value of the rheostat 303, thereby adjusting the resistance value in the circuit of the coil component 112, thus adjusting the current magnitude, and further adjusting the magnitude of the force F2 applied to the coil component 112 to control the force F1 applied by the pressure device 1 to the molecular sieve 6. When the rotating shaft 301 returns to its initial position, the pointer 3032 does not return to its previous position due to the action of the one-way gear. When the pointer 3032 touches the protrusion 3033 of the rheostat 303, the position of the pointer 3032 is fixed and no longer slides with the rotation of the rotating shaft 301 in the D1 direction.

[0079] In some examples, the rheostat 303 in the adjustment unit 32 can be replaced, for example, with multiple fan blades 304 and a retaining pin 305, and a third protrusion 3013 is provided at the upper end of the rotating shaft 301. When the rotating shaft 301 rotates along the D1 direction, the third protrusion 3013 drives the fan blades 304 to rotate along the D1 direction. The fan blades 304 touch the top surface of the retaining pin 305, applying downward pressure to the retaining pin 305. The retaining pin 305 is pressed downward and moves. When the fan blades 304 pass over the retaining pin 305, the pressure on the retaining pin 305 disappears, and the retaining pin 305 moves upward to return to its original position. That is, the retaining pin 305 completes one reciprocating movement. The adjustment unit 32 sends the cumulative number of reciprocating movements or the cumulative distance of reciprocating movements of the retaining pin 305 to the microcontroller unit 31 to indirectly adjust the current in the circuit of the coil component 112.

[0080] In some examples, the length of one side 3051 of the locking pin 305 is greater than the length of the other side 3052. One side 3051 of the locking pin 305 is used to rotate the fan blade 304 to the top surface of the locking pin 305 and apply downward pressure to the locking pin 305. The other side 3052 of the locking pin 305 is used to prevent the fan blade 304 from rotating in the opposite direction to D1. The top surface of the locking pin 305 can be set as an elliptical inclined surface.

[0081] In some examples, the mechanical system of the aforementioned regulating unit 32 can be replaced by an electric system or a hydraulic system.

[0082] The switching device 5 of this application will now be described in detail.

[0083] Figure 7 This is a schematic diagram of a switching device according to an embodiment of this application. Figure 7 As shown, the switching device 5 can be configured as a wire 702, which connects the coil component 112 and the power supply (not shown in the figure). When the molecular sieve 6 is in its initial state and has not sunk, the pressure application part 11 does not move downward, and the pin 121a engages with the lowermost limiting groove 122d. At this time, the wire 702 is in a bent state and has a margin, such as the length of the four limiting grooves in the vertical direction, allowing the wire 702 to elastically move. When the molecular sieve 6 sinks to its limit state, the pressure application part 11 moves downward to the lowest point, and the pin 121a engages with the uppermost limiting groove 122a. The wire 702 straightens and disconnects, de-energizing the coil component 112 and triggering the alarm device 4 to sound an alarm. The pin 121a locks, preventing the pressure application part 11 from moving upward, thereby ensuring that the molecular sieve 6 is in a compacted state.

[0084] In some examples, the switching device 5 can also be an analog switching element.

[0085] In some examples, the alarm device 4 may issue an alarm by emitting a sound through a speaker, displaying predetermined text and / or patterns on a monitor, or flashing or illuminating an alarm light at a certain frequency.

[0086] The detection device 2 of this application will be described in detail below.

[0087] In some examples, the detection device 2 can be configured as a mechanical structure of the pressure holding part 12, or it can be replaced with a commonly used distance sensor, such as an ultrasonic sensor, an infrared rangefinder, a laser rangefinder, a capacitive sensor, an optical triangulation sensor, a millimeter-wave radar sensor, a laser detection and ranging (LIDAR) sensor, and an ultra-wideband (UWB) rangefinder.

[0088] In some embodiments, the detection device 2 detects information related to the pressure F1 applied by the pressure device 1 to the molecular sieve 6, including at least one of the following: the pressure F1 applied by the pressure application part 11 to the molecular sieve 6, the moving distance of the limiting part 122, and the number of times or the moving distance of the positioning part 121 relative to the limiting part 122.

[0089] In some examples, the formula for calculating the force F2 applied to the pressure application part 11 is as follows:

[0090] F2=N·I 2 ·A·μ0 / 2·g 2

[0091] Wherein, N represents the number of turns of coil component 112, I represents the current in the circuit of coil component 112 in amperes, A represents the cross-sectional area of ​​coil component 112 in square meters, μ0 represents the vacuum permeability, calculated as 4π×10-7N / A2, and g represents the distance or gap (meters) between coil component 112 and electromagnetic component 111. g can be calculated from the change in pressure (amperes) applied to molecular sieve 6 by pressure application part 11 or the number of times or distance of movement of positioning part 121 relative to limiting part 122.

[0092] For example, if the initial value of g is a and the initial value of the current is I, when the pressure application part 11 moves down one limit groove, the value of g becomes 2a, the degree of pulverization reaches 2.5%, and the current needs to be doubled, i.e., set to 2I, to ensure that the pressure on the molecular sieve remains unchanged. When the pressure application part 11 moves down three limit grooves, the value of g becomes 4a, the degree of pulverization reaches 10%, the wire 702 is disconnected, the power supply to the coil component 112 is stopped, and at the same time, the alarm device 4 is triggered to issue an alarm, indicating that the life of the molecular sieve 6 has reached the limit value. The pin 121a is locked to prevent the pressure application part 11 from moving upward, thereby preventing the molecular sieve from moving again and causing frictional pulverization.

[0093] The following is a detailed description of the force F1 applied to the molecular sieve by the pressure device 1 based on information related to pressure F1 in this application.

[0094] When the molecular sieve 6 is fully filled, and the pressure application part 11 compacts the molecular sieve 6, the front end of the pin 121a engages with the bottommost limiting groove 122d, and the pressure F1 applied by the pressure application part 11 to the molecular sieve 6 remains constant.

[0095] During the sinking process of the molecular sieve 6, the pressure applying part 11 moves downward by the distance of a limiting groove 122d. The pin 121a is subjected to a force F3 applied by the connecting part 122e, resulting in one reciprocating movement. The pressure F1 applied by the pressure applying part 11 to the molecular sieve 6 changes, for example, becoming F11. Figure 3In the structure of the adjustment unit 32 shown, the adjustment unit 32 adjusts the resistance value in the coil component 112 circuit according to at least one of the following: the downward movement distance of the pressure application part 11, the cumulative number of reciprocating movements or the cumulative reciprocating distance of the pin 121a, and the change value F11 of the pressure applied by the pressure application part 11 to the molecular sieve 6. The adjusted resistance value is then sent to the microcontroller unit 31. The microcontroller unit 31 adjusts the current value supplied to the pressure device 2 for generating pressure F1 according to at least one of the following: the downward movement distance of the pressure application part 11, the cumulative number of reciprocating movements or the cumulative reciprocating distance of the pin 121a, the change value F11 of the pressure applied by the pressure application part 11 to the molecular sieve 6, and the adjusted resistance value. This controls the force F2 applied to the coil component 112 in the pressure device 1, thereby controlling the force F1 applied by the pressure device 1 to the molecular sieve 6. Alternatively, in... Figure 6 In the structure of the adjustment unit 32 shown, the fan blade 304 rotates and causes the locking pin 305 to reciprocate based on at least one of the following: the downward movement of the pressure application part 11, the cumulative reciprocating movement of the pin 121a, and the change in pressure applied by the pressure application part 11 to the molecular sieve 6. The cumulative number of reciprocating movements or the cumulative distance of the locking pin 305 is positively correlated with the distance the pressure application part 11 moves downward, the cumulative number of reciprocating movements or the cumulative distance of the pin 121a, and the change in pressure applied by the pressure application part 11 to the molecular sieve 6, F11. The adjustment unit 32 accumulates the value of the locking pin 305. The number of reciprocating movements or the cumulative distance of reciprocating movements are sent to the microcontroller unit 31. The microcontroller unit 31 adjusts the current value supplied to the pressure device 2 to generate pressure F1 based on at least one of the following: the downward movement distance of the pressure application part 11, the cumulative number of reciprocating movements or the cumulative distance of reciprocating movements of the pin 121a, the change value F11 of the pressure applied by the pressure application part 11 to the molecular sieve 6, and the cumulative number of reciprocating movements or the cumulative distance of reciprocating movements of the locking pin 305. This controls the force F2 applied to the coil component 112 in the pressure device 1, and thus controls the force F1 applied by the pressure device 1 to the molecular sieve 6.

[0096] When at least one of the following reaches a threshold: the distance the pressure applying part 11 moves downward, the cumulative number of reciprocating movements of the pin 121a or the cumulative reciprocating movement distance, or the change value F11 of the pressure applied by the pressure applying part 11 to the molecular sieve 6, the molecular sieve 6 sinks to the limit position, which can trigger the alarm device 4 to issue an alarm and cause the switch device 5 to open, stopping the power supply to the electromagnetic component 111, so as to eliminate the repulsive forces F2 and F2' between the coil component 112 and the electromagnetic component 111.

[0097] In some examples, the molecular sieve life monitoring device 100 may not include the adjustment unit 32. The microcontroller unit 31 adjusts the current value supplied to the pressure device 2 to generate the pressure F1 based on at least one of the following: the downward movement distance of the pressure application part 11, the cumulative number of reciprocating movements or the cumulative reciprocating distance of the pin 121a, and the change value F11 of the pressure applied by the pressure application part 11 to the molecular sieve 6. This controls the force F2 applied to the coil component 112 in the pressure device 1, and thus controls the force F1 applied by the pressure device 1 to the molecular sieve 6.

[0098] In some examples, the molecular sieve lifetime monitoring device 100 may not include the microcontroller unit 31, and the adjustment unit 32 may be adopted in, for example, Figure 3 The structure shown allows for adjustment of the current value by adjusting the resistance value in the circuit of the coil component 112, thereby controlling the force F2 applied to the coil component 112 in the pressure device 1, and further controlling the force F1 applied by the pressure device 1 to the molecular sieve 6.

[0099] This application provides a molecular sieve device.

[0100] Figure 8 This is a perspective view of a molecular sieve device according to an embodiment of this application. Figure 2 and Figure 8 As shown, the molecular sieve equipment 200 includes: a molecular sieve cylinder 60, a molecular sieve 6, a molecular sieve life monitoring device 100, and a cover plate 7.

[0101] The molecular sieve cylinder 60 has a bottom 61 and a cylinder body 62. The upper opening 63 of the molecular sieve cylinder 60 is fitted with a cover plate 7, thereby forming a receiving space 64. The molecular sieve 6 is disposed within this receiving space 64. A molecular sieve life monitoring device 100 is disposed above the molecular sieve 6, applies pressure F1 to the molecular sieve 6, and detects the lifespan of the molecular sieve 6. The cover plate 7 is disposed above the molecular sieve life monitoring device 100 for mounting the molecular sieve life monitoring device 100, for example, as shown in the image. Figure 2 As shown: the magnetic component 111 can be installed on the lower surface of the cover plate 7; the support part 71 is installed on the cover plate 7 and is located below the cover plate 7; in addition, the positioning part 121 of the pressure device 1 of the molecular sieve life monitoring device 100 can also be movably installed on the cover plate 7.

[0102] This application provides a method for monitoring the lifetime of molecular sieves.

[0103] Figure 9 This is a schematic diagram of a molecular sieve lifetime monitoring method according to an embodiment of this application. Figure 9 As shown, the methods for monitoring the lifetime of molecular sieves include:

[0104] Operation 901: Detect information related to the pressure F1 applied by the pressure device 1 to the molecular sieve 6;

[0105] Operation 902: Based on the information related to the pressure F1 applied to the molecular sieve 6 detected, control the force F1 applied to the molecular sieve 6 by the pressure device 1.

[0106] Figure 10 This is another schematic diagram of the molecular sieve lifetime monitoring method according to an embodiment of this application. Figure 10 As shown, molecular sieve lifetime monitoring methods include, for example... Figure 9 Operation 901 in the document also includes:

[0107] Operation 1001: Based on the information related to the pressure F1 applied to the molecular sieve 6 detected, adjust the first parameter value in the circuit of the pressure device 1 to control the force F1 applied to the molecular sieve 6 by the pressure device 1.

[0108] By using the above method, the lifespan of the molecular sieve 6 is monitored by detecting information related to the pressure F1 applied to the molecular sieve 6 by the pressure device 1. Furthermore, based on the detected information related to the pressure F1 applied to the molecular sieve 6 by the pressure device 1, the force applied to the pressure device 1 is controlled to keep the molecular sieve 6 in a compacted state during use, thereby extending the service life of the molecular sieve equipment 200.

[0109] Preferred embodiments of this application have been described above with reference to the accompanying drawings. Many features and advantages of these embodiments are apparent from this detailed description, and therefore the appended claims are intended to cover all such features and advantages of these embodiments that fall within their true spirit and scope. Furthermore, since many modifications and alterations will readily occur to those skilled in the art, the embodiments of this application are not intended to be limited to the precise structures and operations illustrated and described, but rather to encompass all suitable modifications and equivalents falling within their scope.

Claims

1. A molecular sieve lifetime monitoring device, characterized in that, The molecular sieve lifetime monitoring device includes: A pressure device that applies pressure to the molecular sieve; A detection device that detects information related to the pressure applied to the molecular sieve by the pressure device; and A control device that controls the force applied to the molecular sieve by the pressure device based on information related to the pressure applied to the molecular sieve by the pressure device.

2. The molecular sieve lifetime monitoring device according to claim 1, characterized in that, The pressure device includes: A pressure application unit applies adjustable pressure to the molecular sieve; and The pressure holding part includes a positioning part and a limiting part, wherein the positioning part engages with the limiting part to prevent the pressure applying part from moving in the opposite direction to the pressure.

3. The molecular sieve lifetime monitoring device according to claim 2, characterized in that, The pressure application unit includes: Magnetic components; A coil component, when energized, generates a repulsive force with the magnetic component, the repulsive force corresponding to the pressure applied to the molecular sieve; and The top plate has the coil component placed on its upper surface and its lower surface attached to the molecular sieve.

4. The molecular sieve lifetime monitoring device according to claim 2, characterized in that, The detection device detects information related to the pressure applied to the molecular sieve by the pressure device, including at least one of the following: The pressure applied to the molecular sieve by the pressure applying part, the moving distance of the pressure applying part, and the number of times or the moving distance of the positioning part relative to the limiting part.

5. The molecular sieve lifetime monitoring device according to claim 1, characterized in that, The control device includes at least one of the following: A microcontroller unit adjusts a first parameter value provided to the pressure device for generating the pressure based on information related to the pressure applied by the pressure device to the molecular sieve, so as to control the force applied by the pressure device to the molecular sieve. as well as An adjustment unit adjusts a second parameter value in the circuit of the pressure device based on information related to the pressure applied to the molecular sieve by the detected pressure device, thereby adjusting the first parameter value to control the force applied to the molecular sieve by the pressure device.

6. The molecular sieve lifetime monitoring device according to claim 1, characterized in that, The molecular sieve lifetime monitoring device further includes at least one of the following: An alarm device that issues an alarm when the detection device detects that the value of the pressure-related information reaches a threshold; and The switching device switches to the off state when the detection device detects that the value of the pressure-related information reaches a threshold.

7. A molecular sieve device, characterized in that, The molecular sieve equipment includes: Molecular sieve cylinder; Molecular sieve, which is located inside the molecular sieve cylinder; The molecular sieve lifetime monitoring device as claimed in any one of claims 1 to 6 is disposed above the molecular sieve; and A cover plate is disposed above the molecular sieve life monitoring device for mounting the molecular sieve life monitoring device.

8. A method for monitoring the lifetime of a molecular sieve, characterized in that, The method includes: Information related to the pressure applied to the molecular sieve by the detection and pressure device; and Based on the information related to the detected pressure applied to the molecular sieve, the force applied to the molecular sieve by the pressure device is controlled.

9. The method according to claim 8, characterized in that, Based on the information related to the detected pressure applied to the molecular sieve, controlling the force applied to the molecular sieve by the pressure device includes: Based on the information related to the detected pressure applied to the molecular sieve, the first parameter value in the circuit of the pressure device is adjusted to control the force applied to the molecular sieve by the pressure device.

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