Breakage detection system, breakage detection method, and semiconductor apparatus

Abstract

This disclosure relates to the field of semiconductor technology, specifically to a damage detection system, damage detection method, and semiconductor equipment, solving the problem of low accuracy in related technologies that only use laser detection devices to detect damage to transparent substrates. The damage detection system includes a laser detection device, an electromagnetic wave detection device, and a control device. The laser detection device emits a light beam of a first intensity value towards a non-detection area of ​​the transparent substrate, reflects the beam, receives the reflected beam that passes through the detection area of ​​the transparent substrate, and detects and transmits a second intensity value of the received beam. The electromagnetic wave detection device emits electromagnetic waves towards the detection area and transmits a first signal, receives the reflected electromagnetic waves, and transmits a second signal. The control device receives the second intensity value, the first signal, and the second signal, and determines whether the detection area is damaged, thus improving the detection accuracy of the damage detection system.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, specifically to a damage detection system, a damage detection method, and semiconductor equipment. Background Technology

[0002] In the semiconductor industry, to prevent damaged transparent substrates from entering certain production processes, it is usually necessary to perform damage detection on the transparent substrates to determine whether they are damaged.

[0003] Currently, related technologies typically use only laser detection devices to detect the area to be detected on transparent substrates. However, because laser detection devices are easily affected by environmental factors, the accuracy of the detection is poor. Summary of the Invention

[0004] In view of this, the present disclosure provides a damage detection system, a damage detection method, and a semiconductor device, which solves the problem that the accuracy of the related technology is low because it only uses a laser detection device to detect damage to transparent substrates.

[0005] In a first aspect, embodiments of this disclosure provide a damage detection system configured to perform damage detection on a test area of ​​a transparent substrate; the damage detection system includes: a laser detection device having a light emitting part, a light reflecting part, and a light receiving part, wherein the light emitting part is disposed on a first side of the transparent substrate and configured to emit a light beam of a first intensity value toward a non-detection area of ​​the transparent substrate; the light reflecting part is disposed on a second side of the transparent substrate and configured to reflect the light beam passing through the non-detection area, so that the reflected light beam passes through the test area; and the light receiving part is disposed on the first side of the transparent substrate and configured to receive the light beam passing through the test area. The region is a light beam, and a second light intensity value of the light beam is detected and transmitted; the second side of the transparent substrate and the first side of the transparent substrate are disposed opposite to each other in the thickness direction of the transparent substrate; an electromagnetic wave detection device is disposed opposite to the transparent substrate, configured to emit electromagnetic waves toward the region to be detected and transmit a first signal, and receive the reflected electromagnetic waves and transmit a second signal; a control device is communicatively connected to the laser detection device and the electromagnetic wave detection device respectively, and is configured to receive the second light intensity value, the first signal and the second signal, and determine whether the region to be detected is damaged based on the second light intensity value, the first signal and the second signal.

[0006] In some embodiments, the control device includes: a first signal processing module, communicatively connected to the light receiving unit, configured to receive the second light intensity value and determine a first detection result based on the second light intensity value, wherein the first detection result is used to characterize whether the area to be detected, as determined by the laser detection device, is damaged; a second signal processing module, communicatively connected to the electromagnetic wave detection device, configured to receive the first signal and the second signal, and determine a second detection result based on the first signal and the second signal, wherein the second detection result is used to characterize whether the area to be detected, as determined by the electromagnetic wave detection device, is damaged; and a third signal processing module, communicatively connected to the first signal processing module and the second signal processing module, configured to determine a final detection result based on the first detection result and the second detection result, wherein the final detection result is used to characterize whether the area to be detected is damaged.

[0007] In some embodiments, the first signal processing module is further configured to compare the second light intensity value with a preset light intensity value to determine the first detection result; wherein the preset light intensity value is less than the first light intensity value; wherein, when the second light intensity value is greater than or equal to the preset light intensity value, the first detection result is that the area to be detected is damaged, and when the second light intensity value is less than the preset light intensity value, the first detection result is that the area to be detected is undamaged.

[0008] In some embodiments, the electromagnetic wave detection device includes: an electromagnetic wave transmitter located on a first side or a second side of the transparent substrate, configured to emit electromagnetic waves toward the area to be detected and send the first signal to the second signal processing module; wherein, when the area to be detected is undamaged, the area to be detected absorbs a portion of the electromagnetic waves and reflects another portion of the electromagnetic waves, so that the reflected portion of the electromagnetic waves propagates in a direction opposite to the emission direction of the electromagnetic waves; an electromagnetic wave reflector disposed opposite to the electromagnetic wave transmitter and located on opposite sides of the transparent substrate, configured to reflect electromagnetic waves passing through the area to be detected when the area to be detected is damaged, so that the reflected electromagnetic waves pass through the area to be detected in a direction opposite to the emission direction of the electromagnetic waves; and an electromagnetic wave receiver disposed adjacent to the electromagnetic wave transmitter and located on the same side of the transparent substrate, configured to receive the reflected electromagnetic waves and send the second signal to the second signal processing module.

[0009] In some embodiments, the second signal processing module is further configured to calculate a first duration required from receiving the first signal to receiving the second signal, and to compare the first duration with a preset duration to determine the second detection result; wherein the preset duration is the duration required for the electromagnetic wave to propagate from the electromagnetic wave transmitter to the electromagnetic wave reflector, and from the electromagnetic wave reflector to the electromagnetic wave receiver; wherein, if the first duration is equal to the preset duration, the second detection result is that the area to be detected is damaged, and if the first duration is less than the preset duration, the second detection result is that the area to be detected is not damaged.

[0010] Secondly, embodiments of this disclosure provide a damage detection method applied to the damage detection system described in the first aspect, configured to perform damage detection on a region to be detected of a transparent substrate; wherein, the damage detection method includes: receiving a second light intensity value sent by the light receiving unit of the laser detection device of the damage detection system, a first signal and a second signal sent by the electromagnetic wave detection device of the damage detection system; and determining whether the region to be detected is damaged based on the second light intensity value, the first signal and the second signal.

[0011] In some embodiments, determining whether the area to be detected is damaged based on the second light intensity value, the first signal, and the second signal includes: determining a first detection result based on the second light intensity value, wherein the first detection result is used to characterize whether the area to be detected is damaged as determined by the laser detection device; determining a second detection result based on the first signal and the second signal, wherein the second detection result is used to characterize whether the area to be detected is damaged as determined by the electromagnetic wave detection device; and determining a final detection result based on the first detection result and the second detection result, wherein the final detection result is used to characterize whether the area to be detected is damaged.

[0012] In some embodiments, determining the first detection result based on the second light intensity value includes: comparing the second light intensity value with a preset light intensity value; if the second light intensity value is greater than or equal to the preset light intensity value, determining the first detection result as damage to the area to be detected; if the second light intensity value is less than the preset light intensity value, determining the first detection result as no damage to the area to be detected; wherein, determining the second detection result based on the first signal and the second signal includes: receiving the first signal and starting a timer; receiving the second signal and stopping the timer; calculating the first duration required from receiving the first signal to receiving the second signal; comparing the first duration with a preset duration; if the first duration is equal to the preset duration, determining the second detection result as damage to the area to be detected. If the first duration is less than the preset duration, the second detection result is determined to be that the area to be detected is undamaged; wherein, determining the final detection result based on the first detection result and the second detection result includes: receiving the first detection result and the second detection result; determining whether the first detection result and the second detection result are the same; if the first detection result and the second detection result are the same, determining whether both the first detection result and the second detection result indicate that the area to be detected is damaged; if both the first detection result and the second detection result indicate that the area to be detected is damaged, determining that the final detection result indicates that the area to be detected is damaged; if both the first detection result and the second detection result indicate that the area to be detected is undamaged, determining that the final detection result indicates that the area to be detected is undamaged.

[0013] In some embodiments, the range of the first light intensity value is 2000cd-2100cd; the range of the preset light intensity value is 1800cd-1900cd.

[0014] Thirdly, embodiments of this disclosure provide a semiconductor device, including: a cavity having a chamber configured to accommodate a transparent substrate; and a damage detection system as described in the first aspect, configured to perform damage detection on a test area of ​​the transparent substrate, wherein a laser detection device and an electromagnetic wave detection device of the damage detection system are both disposed in the chamber.

[0015] The damage detection system provided in this embodiment utilizes a laser detection device and an electromagnetic wave detection device to jointly detect the area to be detected on a transparent substrate. A control device receives the second light intensity value of the light beam detected and transmitted by the light receiving unit of the laser detection device, as well as the first and second signals transmitted by the electromagnetic wave detection device. Based on the second light intensity value, the first and second signals, it determines whether the area to be detected on the transparent substrate is damaged. This avoids the problem that damage detection systems relying solely on laser detection devices to detect the area to be detected on transparent substrates suffer from low detection accuracy due to environmental factors, thus improving the detection accuracy of the damage detection system. Attached Figure Description

[0016] Figure 1 The diagram shown is an application scenario illustration of a damage detection system provided in an embodiment of this disclosure.

[0017] Figure 2 The diagram shown is a structural schematic of a laser detection device, a control device, and a transparent substrate provided in an embodiment of this disclosure.

[0018] Figure 3 The diagram shown is a structural schematic of an electromagnetic wave detection device, a control device, and a transparent substrate provided in an embodiment of this disclosure.

[0019] Figure 4 The diagram shown is a structural schematic of a transparent substrate provided in an embodiment of this disclosure.

[0020] Figure 5 The diagram shown is a flowchart of a damage detection method provided in an embodiment of this disclosure.

[0021] Figure 6 As shown Figure 5 The flowchart of step 502 in the damage detection method shown is shown.

[0022] Figure 7 As shown Figure 6 The flowchart shown is for step 5021.

[0023] Figure 8 As shown Figure 6 The flowchart shown is for step 5022.

[0024] Figure 9 As shown Figure 6 The flowchart shown is for step 5023.

[0025] Figure 10 The diagram shown is a schematic representation of a semiconductor device and a transparent substrate provided in an embodiment of this disclosure.

[0026] Figure label:

[0027] 1. Semiconductor equipment; 10. Damage detection system; 100. Laser detection device; 110. Light emitting unit; 120. Light reflecting unit; 130. Light receiving unit; 200. Electromagnetic wave detection device; 210. Electromagnetic wave transmitter; 220. Electromagnetic wave reflector; 230. Electromagnetic wave receiver; 300. Control device; 310. First signal processing module; 320. Second signal processing module; 330. Third signal processing module; 20. Cavity; 2001. Chamber; 2. Transparent substrate; 201. Area to be detected; 202. Non-detection area; 21. First side of transparent substrate; 22. Second side of transparent substrate. Detailed Implementation

[0028] In the semiconductor industry, transparent substrates are an important component of semiconductor products. During the production process, transparent substrates usually need to go through multiple production steps. In order to prevent damaged transparent substrates from entering some production steps, it is usually necessary to perform damage detection on the transparent substrates to determine whether the transparent substrates are damaged.

[0029] Currently, related technologies typically use only laser detection devices to detect the area to be detected on transparent substrates. However, because laser detection devices are easily affected by environmental factors, the accuracy of the detection is poor.

[0030] To address the aforementioned problems, embodiments of this disclosure provide a damage detection system, comprising a laser detection device, an electromagnetic wave detection device, and a control device. The laser detection device has a light emitting section, a light reflecting section, and a light receiving section. The light emitting section is disposed on a first side of a transparent substrate and configured to emit a light beam of a first intensity value toward a non-detection area of ​​the transparent substrate. The light reflecting section is disposed on a second side of the transparent substrate and configured to reflect the light beam passing through the non-detection area, so that the reflected light beam passes through the detection area. The light receiving section is disposed on the first side of the transparent substrate and configured to receive the light beam passing through the detection area, and detect and transmit a second intensity value of the light beam. The second side of the transparent substrate and the first side of the transparent substrate are disposed opposite to each other in the thickness direction of the transparent substrate. The electromagnetic wave detection device is disposed opposite to the transparent substrate and configured to emit electromagnetic waves toward the detection area and transmit a first signal, and to receive the reflected electromagnetic waves and transmit a second signal. The control device is communicatively connected to both the laser detection device and the electromagnetic wave detection device. It is configured to receive a second light intensity value, a first signal, and a second signal, and determine whether the area to be detected is damaged based on the second light intensity value, the first signal, and the second signal. This avoids the problem that the damage detection system, which only uses the laser detection device to detect the area to be detected on the transparent substrate, has low detection accuracy due to environmental factors, thus improving the detection accuracy of the damage detection system.

[0031] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0032] Figure 1 The diagram shown illustrates an application scenario of a damage detection system provided in an embodiment of this disclosure. Figure 1 As shown, the damage detection system 10 is configured to perform damage detection on the inspection area 201 of the transparent substrate 2. The damage detection system 10 includes a laser detection device 100, an electromagnetic wave detection device 200, and a control device 300. The laser detection device 100 has a light emitting part 110, a light reflecting part 120, and a light receiving part 130. The light emitting part 110 is disposed on the first side 21 of the transparent substrate and is configured to emit a light beam with a first light intensity value toward the non-inspection area 202 of the transparent substrate 2. The light reflecting part 120 is disposed on the second side 22 of the transparent substrate and is configured to reflect the light beam passing through the non-inspection area 202 so that the reflected light beam passes through the inspection area 201. The light receiving part 130 is disposed on the first side 21 of the transparent substrate and is configured to receive the light beam passing through the inspection area 201, and detect and transmit a second light intensity value of the light beam. The second side 22 of the transparent substrate and the first side 21 of the transparent substrate are disposed opposite each other in the thickness direction of the transparent substrate 2. The electromagnetic wave detection device 200 is disposed opposite to the transparent substrate 2 and is configured to emit electromagnetic waves toward the area to be detected 201 and send a first signal, and to receive reflected electromagnetic waves and send a second signal. The control device 300 is communicatively connected to the laser detection device 100 and the electromagnetic wave detection device 200, and is configured to receive a second light intensity value, the first signal and the second signal, and determine whether the area to be detected 201 is damaged based on the second light intensity value, the first signal and the second signal.

[0033] The damage detection system 10 uses a laser detection device 100 and an electromagnetic wave detection device 200 to jointly detect the area 201 to be detected on the transparent substrate 2. The control device 300 receives the second light intensity value of the light beam detected and transmitted by the light receiving unit 130 of the laser detection device 100, as well as the first signal and the second signal transmitted by the electromagnetic wave detection device 200. Based on the second light intensity value, the first signal and the second signal, it determines whether the area 201 to be detected on the transparent substrate 2 is damaged. This avoids the problem that the damage detection system 10 has low detection accuracy due to environmental factors when it only uses the laser detection device 100 to detect the area 201 to be detected on the transparent substrate 2. This improves the detection accuracy of the damage detection system 10.

[0034] For example, the transparent substrate 2 may be a glass substrate, a silicon wafer, etc. For example, the shape of the transparent substrate 2 may be rectangular, parallelogram, other polygonal, or irregular.

[0035] For example, the light reflecting part 120 may be a metal mirror, an optical mirror, etc.

[0036] For example, the light receiving unit 130 can be a photoelectric sensor, which can be a slotted photoelectric sensor, a through-beam photoelectric sensor, etc., that has a light intensity detection function.

[0037] The positions of the light emitting part 110, the light reflecting part 120, and the light receiving part 130 of the laser detection device 100, the direction of the light beam emitted by the light emitting part 110, and the reflection angle of the light beam by the light reflecting part 120 can be set according to actual production needs. As long as the light beam emitted by the light emitting part 110 can pass through the non-detection area 202 and illuminate the light reflecting part 120, and the light beam reflected by the light reflecting part 120 can pass through the detection area 201 and be received by the light receiving part 130, it is acceptable.

[0038] For example, such as Figure 1 As shown, the light reflecting part 120 is arranged parallel to the transparent substrate 2, and the light emitting part 110 is arranged opposite to the light reflecting part 120. The direction of the light beam emitted by the light emitting part 110 is perpendicular to the transparent substrate 2. The angle between the light beam reflected by the light reflecting part 120 and the light beam emitted by the light emitting part 110 is an acute angle. The light beam reflected by the light reflecting part 120 can pass through the detection area 201 and be received by the light receiving part 130.

[0039] For example, the light reflecting part 120 is arranged parallel to the transparent substrate 2, and the light emitting part 110 and the light reflecting part 120 are arranged facing each other. The angle between the direction of the light beam emitted by the light emitting part 110 and the transparent substrate 2 is an obtuse angle. The angle between the light beam reflected by the light reflecting part 120 and the light beam emitted by the light emitting part 110 is a right angle, an acute angle, or an obtuse angle. The light beam reflected by the light reflecting part 120 can pass through the detection area 201 and be received by the light receiving part 130.

[0040] For example, the light reflecting part 120 is arranged parallel to the transparent substrate 2, and the light reflecting part 120 is located between the light emitting part 110 and the light receiving part 130. The angle between the direction of the light beam emitted by the light emitting part 110 and the transparent substrate 2 is an obtuse angle. The angle between the light beam reflected by the light reflecting part 120 and the light beam emitted by the light emitting part 110 is a right angle, an acute angle, or an obtuse angle. The light beam reflected by the light reflecting part 120 can pass through the detection area 201 and be received by the light receiving part 130.

[0041] For example, the light emitting part 110 is disposed on the second side 22 of the transparent substrate, the light reflecting part 120 is disposed on the first side 21 of the transparent substrate, and the light receiving part 130 is disposed on the second side 22 of the transparent substrate.

[0042] In some embodiments, such as Figure 2 and Figure 3 As shown, the control device 300 includes a first signal processing module 310, a second signal processing module 320, and a third signal processing module 330. The first signal processing module 310 is communicatively connected to the light receiving unit 130 and is configured to receive a second light intensity value and determine a first detection result based on the second light intensity value. The first detection result is used to characterize whether the area to be detected 201, determined by the laser detection device 100, is damaged. The second signal processing module 320 is communicatively connected to the electromagnetic wave detection device 200 and is configured to receive a first signal and a second signal, and determine a second detection result based on the first signal and the second signal. The second detection result is used to characterize whether the area to be detected 201, determined by the electromagnetic wave detection device 200, is damaged. The third signal processing module 330 is communicatively connected to the first signal processing module 310 and the second signal processing module 320 and is configured to determine a final detection result based on the first and second detection results. The final detection result is used to characterize whether the area to be detected 201 is damaged.

[0043] The control device 300 described above has a simple and reliable method for determining whether the area 201 to be detected is damaged.

[0044] For example, the control device 300 may be a programmable logic controller, server, processor, computer, tablet, etc.

[0045] In some embodiments, the first signal processing module 310 is further configured to compare a second light intensity value with a preset light intensity value to determine a first detection result, wherein the preset light intensity value is less than the first light intensity value. If the second light intensity value is greater than or equal to the preset light intensity value, the first detection result is that the area to be detected 201 is damaged; if the second light intensity value is less than the preset light intensity value, the first detection result is that the area to be detected 201 is not damaged.

[0046] The first signal processing module 310 described above determines whether the area to be detected 201 is damaged or not based on the second light intensity value sent by the laser detection device 100 in a simple and reliable manner.

[0047] Since the non-detection area 202 of the transparent substrate 2 absorbs a portion of the emitted light beam, the light intensity of the light beam passing through the non-detection area 202 is less than the first light intensity of the light beam emitted by the light emitting unit 110. Furthermore, since the light reflecting unit 120 also absorbs a portion of the light beam when reflecting it, the light intensity of the light beam reflected by the light reflecting unit 120 decreases again. When the detection area 201 is intact, the light beam reflected by the light reflecting unit 120 passes through the detection area 201, and the detection area 201 absorbs a portion of the reflected light beam, causing the light intensity of the light beam received by the light receiving unit 130 to decrease again. Conversely, when the detection area 201 is damaged, the light beam reflected by the light reflecting unit 120 passes directly through the damaged detection area 201, and therefore, the light intensity of the light beam received by the light receiving unit 130 does not decrease again. The first signal processing module 310 sets a preset light intensity value, compares the second light intensity value with the preset light intensity value, and determines whether the area to be detected 201 is damaged or not based on the comparison result.

[0048] In some embodiments, such as Figure 3 As shown, the electromagnetic wave detection device 200 includes an electromagnetic wave transmitter 210, an electromagnetic wave reflector 220, and an electromagnetic wave receiver 230. The electromagnetic wave transmitter 210 is located on either the first side 21 or the second side 22 of the transparent substrate and is configured to emit electromagnetic waves toward the detection area 201 and send a first signal to the second signal processing module 320. When the detection area 201 is intact, it absorbs a portion of the electromagnetic waves and reflects another portion, causing the reflected portion to propagate in a direction opposite to the emission direction of the electromagnetic waves. The electromagnetic wave reflector 220 is disposed opposite to the electromagnetic wave transmitter 210 and is located on opposite sides of the transparent substrate 2. It is configured to reflect electromagnetic waves passing through the detection area 201 when the detection area 201 is damaged, causing the reflected electromagnetic waves to pass through the detection area 201 in a direction opposite to the emission direction of the electromagnetic waves. The electromagnetic wave receiver 230 is disposed adjacent to the electromagnetic wave transmitter 210 and is located on the same side of the transparent substrate 2. It is configured to receive reflected electromagnetic waves and send a second signal to the second signal processing module 320.

[0049] The electromagnetic wave detection device 200 described above has a simple structure and a simple and reliable detection method.

[0050] For example, the electromagnetic wave reflector 220 can be a prism, a metal mesh, a flat metal plate, etc.

[0051] The positions of the electromagnetic wave transmitter 210, electromagnetic wave reflector 220, and electromagnetic wave receiver 230 of the electromagnetic wave detection device 200, the direction of the electromagnetic wave emitted by the electromagnetic wave transmitter 210, and the reflection angle of the electromagnetic wave by the electromagnetic wave reflector 220 can be set according to actual production needs. As long as the electromagnetic wave emitted by the electromagnetic wave transmitter 210 can propagate to the area to be detected 201, the electromagnetic wave reflected by the area to be detected 201 can be received by the electromagnetic wave receiver 230; or, the electromagnetic wave emitted by the electromagnetic wave transmitter 210 can pass through the area to be detected 201 and propagate to the electromagnetic wave reflector 220, and the electromagnetic wave reflected by the electromagnetic wave reflector 220 can also pass through the area to be detected 201 and be received by the electromagnetic wave receiver 230.

[0052] For example, such as Figure 3 As shown, the electromagnetic wave transmitter 210 and the electromagnetic wave receiver 230 are both located on the second side 22 of the transparent substrate, and the electromagnetic wave reflector 220 is located on the first side 21 of the transparent substrate.

[0053] For example, the electromagnetic wave transmitter 210 and the electromagnetic wave receiver 230 are both located on the first side 21 of the transparent substrate, and the electromagnetic wave reflector 220 is located on the second side 22 of the transparent substrate.

[0054] For example, such as Figure 3 As shown, the electromagnetic wave reflector 220 is arranged parallel to the transparent substrate 2, and the electromagnetic wave transmitter 210 and electromagnetic wave receiver 230 are both positioned directly opposite the electromagnetic wave reflector 220. The electromagnetic wave emitted by the electromagnetic wave transmitter 210 is perpendicular to the detection area 201 of the transparent substrate 2. When the detection area 201 is intact, it absorbs part of the electromagnetic wave and reflects the rest. The reflected portion of the electromagnetic wave returns in a direction perpendicular to the detection area 201 and is received by the electromagnetic wave receiver 230. When the detection area 201 is damaged, the electromagnetic wave emitted by the electromagnetic wave transmitter 210 passes perpendicularly through the detection area 201 and propagates to the electromagnetic wave reflector 220. The reflective surface of the electromagnetic wave reflector 220 is a plane, so that the electromagnetic wave reflected by the electromagnetic wave reflector 220 can pass perpendicularly through the area to be detected 201 and be received by the electromagnetic wave receiver 230; or, the reflective surface of the electromagnetic wave reflector 220 is a curved surface, so that the angle between the electromagnetic wave reflected by the electromagnetic wave reflector 220 and the electromagnetic wave propagating to the electromagnetic wave reflector 220 is an acute angle, and the electromagnetic wave reflected by the electromagnetic wave reflector 220 can pass obliquely through the area to be detected 201 and be received by the electromagnetic wave receiver 230.

[0055] For example, the angle between the electromagnetic wave reflector 220 and the transparent substrate 2 is an acute angle, and the reflective surface of the electromagnetic wave reflector 220 is a plane or a curved surface. The direction of the electromagnetic wave emitted by the electromagnetic wave transmitter 210 is perpendicular to the detection area 201 of the transparent substrate 2. In the event of damage to the detection area 201, the electromagnetic wave emitted by the electromagnetic wave transmitter 210 passes perpendicularly through the detection area 201 and propagates to the electromagnetic wave reflector 220, where it is reflected. The angle between the electromagnetic wave reflected by the electromagnetic wave reflector 220 and the electromagnetic wave propagating to the electromagnetic wave reflector 220 is an acute angle, and the electromagnetic wave reflected by the electromagnetic wave reflector 220 can pass obliquely through the detection area 201 and be received by the electromagnetic wave receiver 230.

[0056] Because the factors causing damage to the inspection area 201 of the transparent substrate 2 vary, the location, number, shape, and extent of the inspection area 201 will differ. For example, the inspection area 201 may be located in the edge or middle region of the transparent substrate 2, and the extent of the inspection area 201 can be set according to actual needs. For example, as... Figure 4 As shown, the transparent substrate 2 is rectangular in shape, and the detection area 201 is located at the edge of the transparent substrate 2. The detection area 201 is a square with a side length of 2 mm. Exemplarily, the transparent substrate 2 can also be circular, parallelogram, other polygonal, or irregular in shape. Exemplarily, the number of detection areas 201 can be one, two, or even more. The number of laser detection devices 100 and electromagnetic wave detection devices 200 is adapted to the number of detection areas 201.

[0057] In some embodiments, the second signal processing module 320 is further configured to calculate a first duration required from receiving the first signal to receiving the second signal, and to compare the first duration with a preset duration to determine a second detection result. The preset duration is the time required for the electromagnetic wave to propagate from the electromagnetic wave transmitter 210 to the electromagnetic wave reflector 220, and then from the electromagnetic wave reflector 220 to the electromagnetic wave receiver 230. If the first duration equals the preset duration, the second detection result is that the area to be detected 201 is damaged; if the first duration is less than the preset duration, the second detection result is that the area to be detected is not damaged.

[0058] The second signal processing module 320 described above determines whether the area to be detected 201 is damaged or not based on the first and second signals sent by the electromagnetic wave detection device 200 in a simple and reliable manner.

[0059] When the area to be tested 201 is damaged, electromagnetic waves can pass through the area to be tested 201 and continue to propagate towards the electromagnetic wave reflector 220 until they reach the electromagnetic wave reflector 220. The electromagnetic wave reflector 220 reflects the electromagnetic waves, causing the reflected electromagnetic waves to propagate towards the electromagnetic wave receiver 230 until the electromagnetic wave receiver 230 receives the electromagnetic waves. Conversely, when the area to be tested 201 is not damaged, the area to be tested 201 reflects the electromagnetic waves, causing the reflected electromagnetic waves to propagate towards the electromagnetic wave receiver 230 until the electromagnetic wave receiver 230 receives the electromagnetic waves. Since the electromagnetic wave reflector 220 is located on the side of the transparent substrate 2 away from the electromagnetic wave transmitter 210 and the electromagnetic wave receiver 230, the propagation path of the electromagnetic waves from emission to reception is different when the area to be tested 201 is damaged versus when the area to be tested 201 is not damaged. This results in different propagation times for the electromagnetic waves even when the propagation speed is the same. When the area to be tested, 201, is undamaged, the propagation path of electromagnetic waves is shorter and the propagation time is shorter.

[0060] Figure 5 The diagram shows a flowchart of a damage detection method provided in an embodiment of this disclosure. The damage detection method provided in this embodiment is applied to the damage detection system 10 mentioned in the above embodiment and is configured to perform damage detection on the area 201 to be detected of the transparent substrate 2.

[0061] The damage detection method includes the following steps.

[0062] Step 501: Receive the second light intensity value sent by the light receiving unit 130 of the laser detection device 100 of the damage detection system 10, and the first signal and the second signal sent by the electromagnetic wave detection device 200 of the damage detection system 10.

[0063] Specifically, the light intensity value represents the luminous intensity of a light beam in a specific propagation direction.

[0064] Specifically, the first signal processing module 310 of the control device 300 receives the second light intensity value sent by the light receiving unit 130.

[0065] Step 502: Determine whether the area to be detected 201 is damaged based on the second light intensity value, the first signal and the second signal.

[0066] Specifically, the first signal processing module 310 of the control device 300 determines whether the area to be detected 201 is damaged based on the second light intensity value, and the second signal processing module 320 of the control device 300 determines whether the area to be detected 201 is damaged based on the first signal and the second signal sent by the electromagnetic wave detection device 200.

[0067] In some embodiments, such as Figure 6As shown, determining whether the area to be detected 201 is damaged based on the second light intensity value, the first signal, and the second signal includes the following steps.

[0068] Step 5021: Determine the first detection result based on the second light intensity value.

[0069] Specifically, the first detection result is used to characterize whether the area 201 to be detected, determined by the laser detection device 100, is damaged.

[0070] Specifically, the first signal processing module 310 of the control device 300 determines the first detection result based on the second light intensity value.

[0071] Step 5022: Determine the second detection result based on the first signal and the second signal.

[0072] Specifically, the second detection result is used to characterize whether the area to be detected 201, determined by the electromagnetic wave detection device 200, is damaged.

[0073] Specifically, the second signal processing module 320 of the control device 300 determines the second detection result based on the first signal sent by the electromagnetic wave transmitter 210 of the electromagnetic wave detection device 200 and the second signal sent by the electromagnetic wave receiver 230.

[0074] Step 5023: Determine the final test result based on the first test result and the second test result.

[0075] Specifically, the final test results are used to characterize whether the area to be tested, 201, is damaged.

[0076] Specifically, the third signal processing module 330 of the control device 300 determines the final detection result based on the first detection result determined by the first signal processing module 310 and the second detection result determined by the second signal processing module 320.

[0077] In some embodiments, such as Figure 7 As shown, determining the first detection result based on the second light intensity value includes the following steps.

[0078] Step 5121: Compare the second light intensity value with the preset light intensity value to determine whether the second light intensity value is greater than or equal to the preset light intensity value.

[0079] Specifically, the first signal processing module 310 compares the second light intensity value with the preset light intensity value to determine whether the second light intensity value is greater than or equal to the preset light intensity value.

[0080] You can set a preset light intensity value according to actual needs.

[0081] Step 5221: If the second light intensity value is greater than or equal to the preset light intensity value, determine the first detection result as the area to be detected 201 is damaged.

[0082] Step 5321: If the second light intensity value is less than the preset light intensity value, determine that the first detection result is that the area to be detected 201 is undamaged.

[0083] In some embodiments, such as Figure 8 As shown, determining the second detection result based on the first signal and the second signal includes the following steps.

[0084] Step 5122: Receive the first signal and start timing.

[0085] Specifically, the second signal processing module 320 receives the first signal sent by the electromagnetic wave transmitter 210 and starts timing.

[0086] Step 5222: Receive the second signal and stop timing.

[0087] Specifically, the second signal processing module 320 receives the second signal sent by the electromagnetic wave receiver 230 and stops the timing.

[0088] Step 5322: Calculate the first time required from receiving the first signal to receiving the second signal.

[0089] Specifically, the second signal processing module 320 calculates the first time required from receiving the first signal to receiving the second signal.

[0090] Step 5422: Compare the first duration with the preset duration to determine whether the first duration is less than the preset duration.

[0091] Specifically, the second signal processing module 320 compares the first duration with the preset duration to determine whether the first duration is less than the preset duration.

[0092] Specifically, the preset duration is the time required for the electromagnetic wave to propagate from the electromagnetic wave transmitter 210 to the electromagnetic wave reflector 220, and then from the electromagnetic wave reflector 220 to the electromagnetic wave receiver 230.

[0093] The distance between the electromagnetic wave transmitter 210 and the electromagnetic wave reflector 220, and the distance between the electromagnetic wave reflector 220 and the electromagnetic wave receiver 230 can be set as needed to determine the preset duration.

[0094] Step 5522: If the first duration is equal to the preset duration, determine the second detection result as damage to the area to be detected 201.

[0095] Step 5622: If the first duration is less than the preset duration, determine the second detection result as no damage to the area to be detected 201.

[0096] In some embodiments, such as Figure 9 As shown, the final test result is determined based on the first test result and the second test result, including the following steps.

[0097] Step 5123: Receive the first and second detection results.

[0098] Specifically, the third signal processing module 330 receives the first detection result sent by the first signal processing module 310 and the second detection result sent by the second signal processing module 320.

[0099] Step 5223: Determine whether the first test result and the second test result are the same.

[0100] Specifically, the third signal processing module 330 determines whether the first detection result and the second detection result are the same.

[0101] If the first test result and the second test result are different, manually check whether the area to be tested, 201, is damaged or not.

[0102] Step 5323: If the first test result and the second test result are the same, determine whether both the first test result and the second test result indicate that the area to be tested 201 is damaged.

[0103] Step 5423: If both the first and second test results indicate that the area to be tested 201 is damaged, then the final test result is determined to be that the area to be tested 201 is damaged.

[0104] Step 5523: If both the first and second test results show that the area to be tested 201 is undamaged, then the final test result is determined to be that the area to be tested 201 is undamaged.

[0105] In some embodiments, the range of the first light intensity value is 2000cd-2100cd, and the range of the preset light intensity value is 1800cd-1900cd.

[0106] The first light intensity value can be set according to actual needs. For example, the first light intensity value can be 2000cd, 2010cd, 2060cd, etc.

[0107] A preset light intensity value can be set according to actual needs. For example, the preset light intensity value can be 1870cd, 1880cd, 1890cd, etc.

[0108] Figure 10 The diagram shown is a structural schematic of a semiconductor device and a transparent substrate provided in an embodiment of this disclosure. Figure 10As shown, the semiconductor device 1 includes the damage detection system 10 and the cavity 20 mentioned in the above embodiments. The cavity 20 has a chamber 2001, which is configured to accommodate the transparent substrate 2. The damage detection system 10 is configured to perform damage detection on the area 201 to be detected of the transparent substrate 2, and both the laser detection device 100 and the electromagnetic wave detection device 200 of the damage detection system 10 are disposed in the chamber 2001.

[0109] For example, the light reflecting part 120 of the laser detection device 100 is detachably connected to the side wall of the chamber 2001 to facilitate loading and unloading of the light reflecting part 120. For example, the light emitting part 110 and the light receiving part 130 of the laser detection device 100 can both be placed in the chamber 2001, or both can be detachably connected to the side wall of the chamber 2001. The light emitting part 110 and the light receiving part 130 can be arranged relatively independently, or they can be placed in a receiving device at the same time to facilitate the simultaneous loading and unloading of the light emitting part 110 and the light receiving part 130 into the chamber 2001.

[0110] Exemplarily, the electromagnetic wave transmitter 210 and electromagnetic wave receiver 230 of the electromagnetic wave detection device 200 can both be placed in the chamber 2001, or both can be detachably connected to the side wall of the chamber 2001, so as to facilitate the installation and removal of the electromagnetic wave transmitter 210 and electromagnetic wave receiver 230. Exemplarily, the electromagnetic wave reflector 220 is detachably connected to the side wall of the chamber 2001, so as to facilitate the installation and removal of the electromagnetic wave reflector 220. Exemplarily, a portion of the side wall of the chamber 2001 can be used as the electromagnetic wave reflector 220, which eliminates the need for a separate electromagnetic wave reflector 220, thereby saving manufacturing costs of the electromagnetic wave detection device 200.

[0111] For example, the control device 300 of the damage detection system 10 can be located in the chamber 2001 or outside the chamber 20. Figure 10 The control device 300 shown is located outside the cavity 20, which can prevent the control device 300 from being damaged when the cavity 2001 is under high temperature and high pressure.

[0112] By improving the detection accuracy of the damage detection system 10 on the detection area 201 of the transparent substrate 2, the number of false alarms from the control device 300 can be reduced, thereby further reducing the impact on the production capacity of the semiconductor equipment 1 caused by the shutdown of the semiconductor equipment 1 due to false alarms.

[0113] For example, semiconductor device 1 may be a chemical vapor deposition device, such as an array chemical vapor deposition device, an ultra-high vacuum chemical vapor deposition device, etc.

[0114] Since the semiconductor device 1 includes the damage detection system 10, all the technical features and effects of the damage detection system 10 are not described here.

[0115] In the embodiments of this disclosure, unless otherwise specified, the connection can be a detachable connection using bolts, nuts, screws, clips, magnets, etc. In some connections where there is no particular requirement for a detachable fit, a non-detachable connection can be achieved through welding, bonding, etc.

[0116] The terms "an embodiment" or "embodiment" used in this specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Additionally, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0117] It should be understood that “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0118] Furthermore, for ease of explanation, spatial relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of a component or feature relative to other components or features as shown in the figures. Spatial relative terms are intended to encompass different orientations of components in use or operation other than those shown in the figures. Devices may have other orientations (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0119] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0120] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Any modifications or equivalent substitutions made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A damage detection system, characterized in that, Configured to perform damage detection on a region of a transparent substrate to be inspected; the damage detection system includes: A laser detection device includes a light emitting unit, a light reflecting unit, and a light receiving unit. The light emitting unit is disposed on a first side of a transparent substrate and configured to emit a light beam of a first intensity value toward a non-detection area of ​​the transparent substrate. The light reflecting unit is disposed on a second side of the transparent substrate and configured to reflect the light beam passing through the non-detection area, so that the reflected light beam passes through the detection area. The light receiving unit is disposed on the first side of the transparent substrate and configured to receive the light beam passing through the detection area, and to detect and transmit a second intensity value of the light beam. The second side of the transparent substrate and the first side of the transparent substrate are disposed opposite each other in the thickness direction of the transparent substrate. An electromagnetic wave detection device is disposed opposite to the transparent substrate and is configured to emit electromagnetic waves toward the area to be detected and send a first signal, and to receive the reflected electromagnetic waves and send a second signal. The control device is communicatively connected to the laser detection device and the electromagnetic wave detection device, respectively, and is configured to receive the second light intensity value, the first signal and the second signal, and determine whether the area to be detected is damaged based on the second light intensity value, the first signal and the second signal.

2. The damage detection system according to claim 1, characterized in that, The control device includes: A first signal processing module, communicatively connected to the light receiving unit, is configured to receive the second light intensity value and determine a first detection result based on the second light intensity value. The first detection result is used to characterize whether the area to be detected is damaged based on the laser detection device. The second signal processing module is communicatively connected to the electromagnetic wave detection device and is configured to receive the first signal and the second signal, and determine a second detection result based on the first signal and the second signal. The second detection result is used to characterize whether the area to be detected is damaged based on the electromagnetic wave detection device. The third signal processing module, which is communicatively connected to the first signal processing module and the second signal processing module, is configured to determine a final detection result based on the first detection result and the second detection result, wherein the final detection result is used to characterize whether the area to be detected is damaged.

3. The damage detection system according to claim 2, characterized in that, The first signal processing module is further configured to compare the second light intensity value with a preset light intensity value to determine the first detection result; wherein the preset light intensity value is less than the first light intensity value; Wherein, if the second light intensity value is greater than or equal to the preset light intensity value, the first detection result is that the area to be detected is damaged; if the second light intensity value is less than the preset light intensity value, the first detection result is that the area to be detected is undamaged.

4. The damage detection system according to claim 2, characterized in that, The electromagnetic wave detection device includes: An electromagnetic wave transmitter, located on a first side or a second side of the transparent substrate, is configured to emit electromagnetic waves toward the area to be detected and send the first signal to the second signal processing module; wherein, if the area to be detected is undamaged, the area to be detected absorbs part of the electromagnetic waves and reflects another part of the electromagnetic waves, so that the reflected part of the electromagnetic waves propagates in a direction opposite to the emission direction of the electromagnetic waves. An electromagnetic wave reflector is disposed opposite to the electromagnetic wave transmitter and is located on both sides of the transparent substrate. It is configured to reflect the electromagnetic waves passing through the area to be detected when the area to be detected is damaged, so that the reflected electromagnetic waves pass through the area to be detected in a direction opposite to the emission direction of the electromagnetic waves. An electromagnetic wave receiver, disposed adjacent to the electromagnetic wave transmitter and located on the same side of the transparent substrate, is configured to receive the reflected electromagnetic waves and send the second signal to the second signal processing module.

5. The damage detection system according to claim 4, characterized in that, The second signal processing module is further configured to calculate the first duration required from receiving the first signal to receiving the second signal, and to compare the first duration with a preset duration to determine the second detection result; The preset duration is the time required for the electromagnetic wave to propagate from the electromagnetic wave transmitter to the electromagnetic wave reflector, and from the electromagnetic wave reflector to the electromagnetic wave receiver. Wherein, if the first duration is equal to the preset duration, the second detection result is that the area to be detected is damaged; if the first duration is less than the preset duration, the second detection result is that the area to be detected is undamaged.

6. A damage detection method, characterized in that, The damage detection system described in any one of claims 1 to 5 is configured to perform damage detection on the area to be detected of a transparent substrate. The damage detection method includes: The system receives a second light intensity value sent by the light receiving unit of the laser detection device of the damage detection system, and a first signal and a second signal sent by the electromagnetic wave detection device of the damage detection system. The detection area is determined to be damaged based on the second light intensity value, the first signal, and the second signal.

7. The damage detection method according to claim 6, characterized in that, The step of determining whether the area to be detected is damaged based on the second light intensity value, the first signal, and the second signal includes: A first detection result is determined based on the second light intensity value, and the first detection result is used to characterize whether the area to be detected is damaged based on the laser detection device. A second detection result is determined based on the first signal and the second signal. The second detection result is used to characterize whether the area to be detected is damaged based on the electromagnetic wave detection device. The final detection result is determined based on the first detection result and the second detection result, and the final detection result is used to characterize whether the area to be detected is damaged.

8. The damage detection method according to claim 7, characterized in that, The determination of the first detection result based on the second light intensity value includes: The second light intensity value is compared with the preset light intensity value; If the second light intensity value is greater than or equal to the preset light intensity value, the first detection result is determined to be damage to the area to be detected. If the second light intensity value is less than the preset light intensity value, the first detection result is determined to be that the area to be detected is undamaged. The step of determining the second detection result based on the first signal and the second signal includes: Receive the first signal and start timing; Receive the second signal and stop timing; Calculate the first time duration required from receiving the first signal to receiving the second signal; Compare the first duration with the preset duration; If the first duration is equal to the preset duration, the second detection result is determined to be damage to the area to be detected; If the first duration is less than the preset duration, the second detection result is determined to be that the area to be detected is undamaged; The step of determining the final detection result based on the first detection result and the second detection result includes: Receive the first detection result and the second detection result; Determine whether the first detection result and the second detection result are the same; If the first detection result and the second detection result are the same, determine whether both the first detection result and the second detection result indicate that the area to be detected is damaged. If both the first and second detection results indicate that the area to be detected is damaged, then the final detection result is determined to be that the area to be detected is damaged. If both the first and second detection results indicate that the area to be detected is undamaged, then the final detection result is determined to be that the area to be detected is undamaged.

9. The damage detection method according to claim 8, characterized in that, The range of the first light intensity value is 2000cd-2100cd; The preset light intensity value ranges from 1800 cd to 1900 cd.

10. A semiconductor device, characterized in that, include: A cavity, having a chamber, is configured to accommodate a transparent substrate; The damage detection system according to any one of claims 1 to 5 is configured to perform damage detection on the area to be detected of the transparent substrate, wherein both the laser detection device and the electromagnetic wave detection device of the damage detection system are disposed in the cavity.

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