Power supply circuit state detection method and electronic device

Abstract

The application discloses a power supply circuit state detection method and electronic equipment, and relates to the technical field of server power supply management. The method comprises the following steps: determining voltage parameters, current parameters and target temperature parameters of a power supply circuit according to sampling data collected by multiple power supply monitoring devices; generating candidate impedance parameters according to the voltage parameters and the current parameters; correcting the candidate impedance parameters according to target temperature parameters and temperature impedance information to obtain target impedance parameters; and detecting the power supply state of the power supply circuit according to the target impedance parameters and reference impedance parameters. The technical problem of low power supply state detection accuracy of the power supply circuit is solved, and the technical effect of improving the power supply state detection accuracy of the power supply circuit is achieved.

Description

Technical Field

[0001] This application relates to the field of server power management technology, and in particular to a power supply circuit status detection method and electronic device. Background Technology

[0002] Servers typically supply power to components such as the motherboard, processor, and graphics processor via power supply circuits. During server production or maintenance, it is usually necessary to check the power supply status of the power supply circuits to troubleshoot potential problems such as poor connections, unstable contacts, or abnormal component installations that may have occurred during server assembly. However, related technologies usually require contact measurements using external testing equipment, or simply comparing basic electrical parameters such as voltage and current with preset thresholds. Once the server is fully assembled, internal test contacts may be obstructed, making contact measurements difficult to implement. Furthermore, simply comparing basic electrical parameters to thresholds cannot accurately reflect the actual power supply status of the power supply circuit, resulting in low accuracy in power supply status detection.

[0003] There is still no effective solution to the problem of low accuracy in power supply status detection of power supply circuits in related technologies. Summary of the Invention

[0004] This application provides a power supply circuit status detection method and electronic device to at least solve the problem of low accuracy in power supply status detection of power supply circuits in related technologies.

[0005] This application provides a power supply circuit status detection method, comprising: determining voltage parameters, current parameters, and target temperature parameters of the power supply circuit based on sampling data collected by multiple power supply monitoring devices, wherein the power supply circuit is used to supply power to server components, multiple power supply monitoring devices are deployed in the power supply circuit, and the multiple power supply monitoring devices are used to control the power output of the power supply circuit according to the sampling data, the voltage parameters are used to indicate the voltage drop generated by the power supply circuit along the power supply direction during the power supply process, the current parameters are used to indicate the current flowing through the power supply circuit, and the target temperature parameters are used to indicate the target temperature state of the power supply circuit when bearing the operating load of the server components; generating candidate impedance parameters based on the voltage parameters and current parameters, the candidate impedance parameters being used to indicate the impedance of the power supply circuit under the target temperature state; correcting the candidate impedance parameters based on the target temperature parameters and temperature impedance information to obtain the target impedance parameters, wherein the temperature impedance information is used to indicate the degree of influence of the temperature state on the impedance of the power supply circuit, and the target impedance parameters are used to indicate the impedance of the power supply circuit under a reference temperature state; detecting the power supply status of the power supply circuit based on the target impedance parameters and the reference impedance parameters, wherein the reference impedance parameters are used to indicate the impedance of the power supply circuit under the reference temperature state and the normal power supply state.

[0006] This application also provides a power supply circuit status detection device, comprising: a determination module, used to determine voltage parameters, current parameters, and target temperature parameters of the power supply circuit based on sampling data collected by multiple power supply monitoring devices, wherein the power supply circuit is used to supply power to server components, multiple power supply monitoring devices are deployed in the power supply circuit, the multiple power supply monitoring devices are used to control the power output of the power supply circuit according to the sampling data, the voltage parameters are used to indicate the voltage drop generated by the power supply circuit along the power supply direction during the power supply process, the current parameters are used to indicate the current flowing through the power supply circuit, and the target temperature parameters are used to indicate the target temperature state of the power supply circuit when bearing the operating load of the server components; a generation module, used to generate candidate impedance parameters based on the voltage parameters and current parameters, the candidate impedance parameters being used to indicate the impedance of the power supply circuit under the target temperature state; a correction module, used to correct the candidate impedance parameters based on the target temperature parameters and temperature impedance information to obtain the target impedance parameters, wherein the temperature impedance information is used to indicate the degree of influence of the temperature state on the impedance of the power supply circuit, and the target impedance parameters are used to indicate the impedance of the power supply circuit under a reference temperature state; and a detection module, used to detect the power supply status of the power supply circuit based on the target impedance parameters and the reference impedance parameters, wherein the reference impedance parameters are used to indicate the impedance of the power supply circuit under a reference temperature state and a normal power supply state.

[0007] This application also provides an electronic device, including: a memory for storing a computer program; and a processor for implementing the state detection method of any of the above-described power supply circuits when executing the computer program.

[0008] This application also provides a computer-readable storage medium storing a computer program, wherein when the computer program is executed by a processor, it implements the steps of any of the above-described power supply circuit state detection methods.

[0009] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of any of the above-described power supply circuit state detection methods.

[0010] This application determines the voltage, current, and target temperature parameters of a power supply circuit based on sampling data collected from multiple power supply monitoring devices. Candidate impedance parameters are generated based on the voltage and current parameters to indicate the impedance of the power supply circuit at the target temperature. These candidate impedance parameters are then corrected based on the target temperature parameters and temperature impedance information to obtain the target impedance parameter indicating the impedance of the power supply circuit at a reference temperature. The power supply status of the power supply circuit is then detected by comparing the target impedance parameter with a reference impedance parameter indicating the impedance of the power supply circuit at the reference temperature and under normal power supply conditions. This allows the impedance of the power supply circuit at the target temperature to be determined using sampling data collected from the power supply monitoring devices deployed within the power supply circuit. The impedance at the target temperature is then corrected to the impedance at the reference temperature. By comparing the target impedance parameter and the reference impedance parameter at the same temperature, the impact of temperature differences on the power supply status detection results is reduced. This avoids the shortcomings of related technologies that rely on external contact measurements or only perform threshold comparisons of basic electrical parameters, resulting in low accuracy in power supply status detection. This achieves the technical effect of improving the accuracy of power supply status detection in power supply circuits. Attached Figure Description

[0011] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the hardware environment for a power supply circuit state detection method according to an embodiment of this application;

[0013] Figure 2 This is a flowchart of a power supply circuit state detection method according to an embodiment of this application;

[0014] Figure 3 This is a schematic diagram of the topology of a power supply circuit according to an embodiment of this application;

[0015] Figure 4 This is a schematic diagram of a power supply circuit state detection process according to an embodiment of this application;

[0016] Figure 5 This is a structural block diagram of a power supply circuit state detection device according to an embodiment of this application. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0018] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0019] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] The power supply circuit state detection method provided in this application embodiment can be executed in a computing device, device terminal, or similar computing device. In an exemplary embodiment, the method can be executed by a controller in a server. Taking the method running on a controller as an example, Figure 1 This is a schematic diagram of the hardware environment for a power supply circuit state detection method according to an embodiment of this application. Figure 1 As shown, the controller may include one or more processors 102. Figure 1 Only one processor 102, a memory 104 for storing data, a transmission device 106 for communication, and an input / output device 108 are shown. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the controller described above. For example, the controller may also include a... Figure 1 Showing more or fewer components, or having with Figure 1 The different configurations shown.

[0021] The processor 102 may include, but is not limited to, a microprocessor, microcontroller, central processing unit, or other processing device with data processing capabilities. The memory 104 may be used to store computer programs, such as computer programs, software programs, and program modules corresponding to the power supply circuit state detection method in this embodiment. The processor 102 executes corresponding functions and data processing by running the computer program stored in the memory 104, thereby realizing the power supply circuit state detection method provided in this embodiment. The memory 104 may also be used to store topology information, temperature impedance information, reference impedance parameters, and sampling data collected by the power supply monitoring device of the power supply circuit. The memory 104 may include high-speed random access memory and non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some exemplary embodiments, the memory 104 may also include a memory remotely located relative to the processor 102, which can be connected to the controller via a communication network.

[0022] Transmission device 106 can be used to receive or send data. For example, transmission device 106 can communicate with multiple power supply monitoring devices deployed in the power supply circuit to receive sampling data collected by the multiple power supply monitoring devices. Transmission device 106 can also send the power supply status of the power supply circuit or information corresponding to the power supply status to other devices in the server or management devices outside the server. Transmission device 106 may include a network adapter, communication interface, or communication module, and can transmit data through the communication bus or communication network inside the server. Input / output device 108 can be used to receive input information or output the power supply status of the power supply circuit, alarm information, and other processing results.

[0023] This embodiment provides a method for detecting the status of a power supply circuit. Figure 2 This is a flowchart of a power supply circuit state detection method according to an embodiment of this application, such as... Figure 2 As shown, the process includes the following steps:

[0024] Step S12: Determine the voltage parameters, current parameters, and target temperature parameters of the power supply circuit based on the sampling data collected by multiple power supply monitoring devices. The power supply circuit is used to supply power to the server components. Multiple power supply monitoring devices are deployed in the power supply circuit. The multiple power supply monitoring devices are used to control the power output of the power supply circuit according to the sampling data. The voltage parameter is used to indicate the voltage drop generated by the power supply circuit along the power supply direction during the power supply process. The current parameter is used to indicate the current flowing through the power supply circuit. The target temperature parameter is used to indicate the target temperature state of the power supply circuit when bearing the operating load of the server components.

[0025] Step S14: Generate candidate impedance parameters based on voltage and current parameters. The candidate impedance parameters are used to indicate the impedance of the power supply circuit under the target temperature condition.

[0026] Step S16: Correct the candidate impedance parameters according to the target temperature parameters and temperature impedance information to obtain the target impedance parameters. The temperature impedance information is used to indicate the degree of influence of temperature state on the impedance of the power supply circuit, and the target impedance parameters are used to indicate the impedance of the power supply circuit under the reference temperature state.

[0027] Step S18: Detect the power supply status of the power supply circuit based on the target impedance parameter and the reference impedance parameter, wherein the reference impedance parameter is used to indicate the impedance of the power supply circuit under reference temperature conditions and normal power supply conditions.

[0028] Through the above steps, the impedance of the power supply circuit under the target temperature condition is determined by the sampling data collected by the power supply monitoring device deployed in the power supply circuit. The impedance under the target temperature condition is then corrected to the impedance under the reference temperature condition. The target impedance parameter and the reference impedance parameter are compared under the same temperature condition, thereby reducing the impact of temperature condition differences on the power supply status detection results. This avoids the defects of related technologies that rely on external contact measurement or only perform threshold comparison of basic electrical parameters, resulting in low accuracy of power supply status detection. This achieves the technical effect of improving the accuracy of power supply status detection of the power supply circuit.

[0029] Optionally, in this embodiment, the controller can be a Baseboard Management Controller (BMC). The following description uses the BMC executing the state detection method for the power supply circuit as an example to illustrate this embodiment. It should be noted that the BMC is only an optional execution entity; the method can also be executed by other computing devices or similar processing units in the server that possess data acquisition and processing capabilities. The server may include one or more power supply circuits for supplying power to server components. Each power supply circuit may consist of a power board, power converter, power cables, connectors, power protection devices, and server components. For example, the power supply circuit may be a power supply circuit extending from the power board to the motherboard, or it may be a power supply circuit extending from the power board to a graphics processor adapter board or network card. Server components may include, but are not limited to, a motherboard, processor, graphics processor, memory, hard drive, or network card. The power supply direction is the direction in which electrical energy flows from the power supply to the server components. The power supply circuit may include multiple power supply segments connected sequentially along the power supply direction. Each power supply segment may include at least one of the following: power cables, connectors, terminals, solder joints, or circuit board traces.

[0030] Optionally, in this embodiment, the power supply monitoring device is a device deployed in the power supply circuit that has the ability to acquire electrical parameters and control power output. For example, the power supply monitoring device can be a power converter or a power supply protection device, such as an electronic fuse. The power supply monitoring device can collect sampling data such as voltage, current, or temperature at corresponding locations, and can control the power output of the power supply circuit based on the sampling data. For example, if the sampling data indicates overcurrent, abnormal voltage, or abnormal temperature, the power supply monitoring device can perform control operations such as current limiting, shutdown, or power restoration on the power supply circuit. Multiple power supply monitoring devices are distributed at different locations along the power supply circuit. Thus, by using the sampling data collected by the power supply monitoring devices deployed at different locations, the voltage change generated after the power energy passes through the power supply circuit, the current flowing through the power supply circuit, and the current temperature state of the power supply circuit are determined, avoiding the defects in related technologies where the power supply status is difficult to detect due to reliance on external contact measurement.

[0031] Optionally, the power supply circuit status detection process can be performed after the server has been fully assembled. For example, this detection process can be performed during the server's production testing phase to detect whether there are poor connections, unstable contacts, or abnormal component installations in the power supply circuit; it can also be performed during server operation or maintenance to detect whether abnormal power supply status occurs during continuous operation. The detection can be performed when the server components are under a preset operating load, or it can be performed when the server components are under actual business load.

[0032] In the embodiment provided in step S12 above, the BMC can read the registers in each power supply monitoring device through the communication bus or communication interface inside the server, thereby obtaining the corresponding sampling data.

[0033] Optionally, the voltage parameter can be determined based on the sampling voltage at different locations in the power supply circuit. For example, the voltage parameter can be determined based on the difference between the sampling voltage at the upstream location and the sampling voltage at the downstream location in the power supply direction. A larger voltage parameter indicates a larger voltage drop when electrical energy is transmitted along the power supply circuit. The current parameter can be determined based on the sampling current collected by the power supply monitoring device. For a power supply circuit without branches, any sampling current that can characterize the actual current of the line can be determined as the current parameter; for a power supply circuit with multiple power supply branches, the current parameter flowing through the monitored power supply circuit can be determined based on the sampling current corresponding to the multiple power supply branches. The target temperature parameter can be determined based on the sampling temperature collected by at least one power supply monitoring device. The target temperature parameter can be a parameter expressed as a temperature value, or a parameter expressed as a temperature range or temperature level. For example, the target temperature state of the power supply circuit can be expressed as a low temperature state, a normal temperature state, or a high temperature state. The target temperature parameter can indicate the overall temperature state of the power supply circuit or the temperature state at the location of the power supply monitoring device.

[0034] Optionally, to reduce the impact of transient fluctuations during power supply on the sampling results, sampling data collected by multiple power supply monitoring devices within the same sampling period can be read. The same sampling period can be the same sampling moment or multiple sampling moments with a time difference less than a preset duration. Furthermore, the sampling data collected by the same power supply monitoring device at multiple consecutive sampling moments can be averaged, filtered, or have outlier removed, and the processed data can be used to determine voltage parameters, current parameters, and target temperature parameters.

[0035] As an optional approach, the voltage, current, and target temperature parameters of the power supply circuit can be determined based on sampling data collected by multiple power supply monitoring devices in the following manner, including: locating a first monitoring device and at least one second monitoring device from among the multiple power supply monitoring devices based on the power supply circuit's topology information, wherein the topology information indicates the connection relationships between the multiple power supply monitoring devices deployed in the power supply circuit, and between the multiple power supply monitoring devices and the server component; the at least one second monitoring device is a power supply monitoring device that supplies power to the server component along the power supply direction and is not connected to any other power supply monitoring device; the first monitoring device is a power supply monitoring device that supplies power to at least one second monitoring device along the power supply direction and is not connected to any other power supply monitoring device; and determining the voltage, current, and target temperature parameters based on the first sampling data collected by the first monitoring device and the second sampling data collected by the at least one second monitoring device, wherein the sampling data includes both the first and second sampling data.

[0036] Optionally, in this embodiment, the topology information can be in the form of a topology table, connection relationship table, device connection list, or other data formats recognizable by the BMC. The topology information may include node information, connection edge information, and power supply direction information. Node information records the node identifier, node type, device address, and register address of the power supply monitoring device and server components; connection edge information records the power supply connection relationship between any two nodes; and power supply direction information indicates the direction of power transmission along the connection edge. Optionally, the topology information can be pre-configured in the BMC's storage area based on the server's power supply circuit design information, or read by the BMC from a configuration file or board information during server initialization.

[0037] Optionally, when the BMC performs a power supply circuit status detection task, the BMC can first obtain the object identifier of the object to be detected, where the object to be detected can be a power supply circuit to be detected, a server component to be detected, or a power supply branch to be detected. Subsequently, the BMC reads the target topology data corresponding to the object to be detected from the topology information based on the object identifier, and determines the combination of power supply monitoring devices corresponding to the object to be detected based on the node type and power supply direction in the target topology data. Specifically, the BMC can use the node corresponding to the server component as the target node in the target topology data, and parse the upstream nodes connected to the target node in the opposite direction of the power supply direction. When a node type of power supply monitoring device is parsed, and there are no other nodes of the same type on the connection path between the power supply monitoring device and the server component, the BMC identifies the power supply monitoring device as a second monitoring device. If there are multiple power supply monitoring devices in the target topology data that supply power to the same server component through different power supply branches, and there are no other power supply monitoring devices between each power supply monitoring device and the server component, then the BMC identifies all of these power supply monitoring devices as second monitoring devices. Furthermore, the BMC uses the node corresponding to at least one second monitoring device as the target node and continues to parse upstream nodes in the opposite direction of the power supply direction. When a node of type power supply monitoring device is parsed, and there are no other nodes of type power supply monitoring device on the connection path between the power supply monitoring device and at least one second monitoring device, the BMC identifies the power supply monitoring device as the first monitoring device.

[0038] Figure 3 This is a schematic diagram of the topology of a power supply circuit according to an embodiment of this application, such as... Figure 3As shown, the BMC determines, based on topology information, that there are no other power supply monitoring devices between power supply monitoring device A1 and server component A, and therefore designates power supply monitoring device A1 as the second monitoring device. Simultaneously, the BMC determines that power supply monitoring device A0 supplies power to power supply monitoring device A1 along the power supply direction, and that there are no other power supply monitoring devices between power supply monitoring device A0 and power supply monitoring device A1, and therefore designates power supply monitoring device A0 as the first monitoring device. For another example, the BMC determines, based on topology information, that there are no other power supply monitoring devices between power supply monitoring devices B1 and B2 and server component B, and therefore designates both power supply monitoring devices B1 and B2 as second monitoring devices. Simultaneously, the BMC determines that power supply monitoring device B0 supplies power to power supply monitoring devices B1 and B2 respectively along the power supply direction, and that there are no other power supply monitoring devices between power supply monitoring device B0 and power supply monitoring devices B1 and B2, and therefore designates power supply monitoring device B0 as the first monitoring device.

[0039] It should be noted that "no other power supply monitoring devices are connected between the second monitoring device and the server component" means that there are no other power supply monitoring devices in the power supply connection path between the second monitoring device and the server component. This does not exclude the possibility of power cables, connectors, terminals, solder joints, circuit board traces, or other power supply structures connecting the second monitoring device and the server component. Similarly, the above description also applies to the connection relationship between the first and second monitoring devices.

[0040] Optionally, after identifying the first monitoring device and at least one second monitoring device, the BMC can read the registers of the first monitoring device and at least one second monitoring device through a communication bus or communication interface, based on the device address and sampling register address recorded in the topology information, to obtain the first sampling data and the second sampling data. Since the first monitoring device is located upstream of the power supply circuit under test, and at least one second monitoring device is located downstream of the power supply circuit under test, the BMC can determine the voltage drop generated in the power supply circuit along the power supply direction based on the difference between the first and second sampling data; it can determine the current flowing through the power supply circuit based on the sampling current collected by at least one second monitoring device; and it can determine the target temperature state of the power supply circuit when bearing the operating load of the server components based on the sampling temperature collected by at least one second monitoring device.

[0041] As an optional approach, the voltage parameters, current parameters, and target temperature parameters can be determined, but are not limited to, by: calculating the difference between the first sampled voltage and the equivalent voltage acquired by the first monitoring device to obtain the voltage parameters, wherein the equivalent voltage is the average voltage of the second sampled voltages acquired by each of the at least one second monitoring device, the first sampled data includes the first sampled voltage, and the second sampled data includes the second sampled voltage, the sampled current, and the sampled temperature; calculating the sum of the sampled currents acquired by each of the second monitoring devices to obtain the current parameters; and determining the target temperature parameters based on the sampled temperatures acquired by each of the second monitoring devices.

[0042] Optionally, in this embodiment, when at least one second monitoring device includes only one second monitoring device, the second sampling voltage, sampling current, and sampling temperature collected by that second monitoring device are respectively determined as the equivalent voltage, current parameter, and target temperature parameter. When at least one second monitoring device includes multiple second monitoring devices, the ratio between the sum of the second sampling voltages collected by the multiple second monitoring devices and the number of second monitoring devices is calculated to obtain the average voltage, and this average voltage is determined as the equivalent voltage. The difference between the first sampling voltage and the equivalent voltage is calculated to obtain the voltage parameter. The sum of the sampling currents collected by each second monitoring device is calculated to obtain the current parameter. The average value of the sampling temperatures collected by each second monitoring device is calculated to obtain the target temperature parameter. In other optional embodiments, the maximum value among the multiple sampling temperatures can also be determined as the target temperature parameter.

[0043] Optionally, if the first sampled voltage is less than the equivalent voltage, an anomaly check can be performed on the voltage relationship between the first sampled voltage and the equivalent voltage. For example, it can detect whether the power supply direction is configured incorrectly, whether the sampled data corresponds to the same sampling period, or whether the power supply monitoring device has experienced a sampling anomaly, in order to avoid generating candidate impedance parameters based on abnormal sampled data.

[0044] Using the above method, the BMC can automatically locate the upstream and downstream positions in the power supply circuit based on pre-stored topology information and read sampling data from the corresponding power supply monitoring devices. Furthermore, the BMC determines voltage parameters, current parameters, and target temperature parameters based on the first sampling data collected by the first monitoring device and the second sampling data collected by at least one second monitoring device. This allows the BMC to utilize existing power supply monitoring devices in the power supply circuit to collect voltage, current, and temperature data at different locations within the circuit, avoiding reliance on manually specified sampling points and the increased hardware costs and complex wiring associated with adding additional sampling devices.

[0045] In the embodiment provided in step S14 above, candidate impedance parameters of the power supply circuit under the current target temperature state can be determined based on the voltage drop indicated by the voltage parameter and the current indicated by the current parameter. The candidate impedance parameter can represent the equivalent impedance formed by the power supply cables, connectors, terminals, solder joints, and circuit board traces in the power supply circuit.

[0046] Optionally, to improve the stability of the candidate impedance parameters, multiple candidate impedance sub-parameters can be generated based on the voltage and current parameters corresponding to multiple sampling times, and then the candidate impedance parameter can be determined based on the average or median of the multiple candidate impedance sub-parameters. Alternatively, candidate impedance parameters can be generated when the current parameter reaches a preset current condition, thereby reducing the impact of sampling errors on the impedance calculation results when the current flowing through the power supply circuit is too small.

[0047] Optionally, the reference temperature state can be a pre-selected baseline temperature state used to uniformly compare the impedance of different power supply circuits or the same power supply circuit at different testing times. For example, the reference temperature state can be the temperature state corresponding to the server production test environment, or it can be the standard temperature state corresponding to the normal operation of the power supply circuit.

[0048] In the embodiment provided in step S16 above, the temperature impedance information can be pre-stored in the BMC's storage space, or it can be obtained by the BMC from other storage devices in the server. The temperature impedance information can be pre-determined based on the temperature characteristics of the conductive materials, power cables, connectors, or circuit board traces used in the power supply circuit, or it can be obtained by testing the power supply circuit under normal power supply conditions. The temperature impedance information can take the form of parameters, mapping relationships, data tables, fitting curves, or calculation models, and is used to indicate the impedance changes of the power supply circuit under different temperature conditions. Based on the target temperature state indicated by the target temperature parameter, the BMC can find or calculate the corresponding impedance change relationship between the target temperature state and the reference temperature state from the temperature impedance information, and use this impedance change relationship to correct the candidate impedance parameters to obtain the target impedance parameters, thereby reducing the impact of impedance parameter differences caused by different temperature states on the power supply status detection results.

[0049] It is understandable that when the impedance of a power supply circuit increases with temperature, directly comparing the candidate impedance parameter obtained at a higher temperature with the reference impedance parameter at a reference temperature might misjudge a power supply circuit that is actually functioning normally as having an abnormal power supply. Conversely, when the target temperature is lower than the reference temperature, the candidate impedance parameter decreases with decreasing temperature, potentially missing the actual problem of excessive impedance in the power supply circuit. Compared to detection methods that do not consider the effect of temperature on impedance, the embodiments of this application utilize temperature impedance information to correct the candidate impedance parameter to the reference temperature state, enabling the target impedance parameter and the reference impedance parameter to be compared at the same temperature, thereby reducing misjudgments caused by temperature changes and improving the accuracy of power supply status detection.

[0050] As an optional approach, the candidate impedance parameters can be corrected based on the target temperature parameters and temperature impedance information to obtain the target impedance parameters, but not limited to the following methods: Determine the temperature difference parameter based on the target temperature parameters and the reference temperature parameters, where the reference temperature parameter indicates the reference temperature state, and the temperature difference parameter indicates the temperature difference between the target temperature state and the reference temperature state; calculate the correction parameter based on the temperature difference parameter and the temperature resistance parameter, where the temperature impedance information includes the temperature resistance parameter, which indicates the degree of impedance change of the power supply circuit under a unit temperature difference; correct the candidate impedance parameters based on the correction parameter to obtain the target impedance parameters.

[0051] Optionally, in this embodiment, the reference temperature parameter is used to indicate a pre-selected reference temperature state. Both the target temperature parameter and the reference temperature parameter can be represented by specific temperature values, or by temperature ranges or temperature levels. When the target temperature parameter or reference temperature parameter is represented by a temperature range, temperature level, or similar format, representative temperatures corresponding to the target temperature state and the reference temperature state can be determined separately, and a temperature difference parameter can be determined based on the two representative temperatures. For example, the middle or average temperature of the temperature range can be determined as the representative temperature of the corresponding temperature state. The BMC can calculate the difference between the target temperature indicated by the target temperature parameter and the reference temperature indicated by the reference temperature parameter to obtain the temperature difference parameter.

[0052] Optionally, the temperature resistance parameter can represent the change or proportion of impedance change in the power supply circuit when the temperature changes by one degree Celsius. The temperature resistance parameter can be predetermined based on the temperature characteristics of the power supply cables, connectors, terminals, solder joints, or circuit board traces included in the power supply circuit, or it can be obtained by temperature testing of the power supply circuit under normal power supply conditions. It is understood that due to differences in the power supply cables, connectors, terminals, solder joints, or circuit board traces included in different power supply circuits, the temperature resistance parameters of different power supply circuits may differ. Therefore, the corresponding power supply circuits and temperature resistance parameters can be stored in the BMC. When correcting candidate impedance parameters, the BMC can obtain the temperature resistance parameter corresponding to the currently detected power supply circuit.

[0053] Optionally, the BMC can calculate correction parameters based on the product of the temperature difference parameter and the temperature resistance parameter, or other preset operational relationships. Correction parameters can be used to represent the difference between the impedance at the target temperature and the impedance at the reference temperature. Correction parameters can be in the form of impedance change or impedance change ratio. For example, when the temperature resistance parameter is used to represent the impedance change of the power supply circuit per unit temperature difference, the product of the temperature difference parameter and the temperature resistance parameter can be determined as the correction parameter. As another example, when the temperature resistance parameter is used to represent the relative change in impedance of the power supply circuit per unit temperature difference, the impedance change ratio corresponding to the impedance at the target temperature relative to the impedance at the reference temperature can be determined based on the temperature difference parameter and the temperature resistance parameter, and this impedance change ratio can be determined as the correction parameter.

[0054] As an optional approach, the target impedance parameter can be obtained by correcting the candidate impedance parameter according to the correction parameter in the following manner, but not limited to: calculating the difference between the candidate impedance parameter and the correction parameter to obtain the target impedance parameter, wherein the correction parameter is used to indicate the impedance difference between the impedance of the power supply circuit under the target temperature condition and the impedance of the power supply circuit under the reference temperature condition, and the correction parameter includes the correction parameter.

[0055] Optionally, the correction parameter can be the difference between the impedance of the power supply circuit at the target temperature and the impedance of the power supply circuit at the reference temperature. The target impedance parameter can be calculated using the following formula: ,in, Indicates the target impedance parameter. Indicates the candidate impedance parameter. Indicates the correction parameter. This represents the temperature resistance parameter, indicating the change in impedance of the power supply circuit for every degree Celsius increase in temperature compared to the impedance before the temperature increase, expressed in ohms per degree Celsius. Indicates the target temperature parameter. This indicates the reference temperature parameter.

[0056] As an alternative approach, the target impedance parameter can also be obtained by correcting the candidate impedance parameter according to the correction parameter in the following way, but not limited to: calculating the ratio between the candidate impedance parameter and the correction ratio parameter, wherein the correction ratio parameter is used to indicate the impedance ratio between the impedance of the power supply circuit under the target temperature condition and the impedance of the power supply circuit under the reference temperature condition, and the correction parameter includes the correction ratio parameter.

[0057] Optionally, the correction ratio parameter can be the ratio between the impedance of the power supply circuit at the target temperature and the impedance of the power supply circuit at the reference temperature. The target impedance parameter can also be calculated using the following formula: ,in, This indicates the correction ratio parameter. This is a temperature resistance parameter, representing the percentage change in impedance of the power supply circuit compared to its previous impedance before the temperature increase, expressed in units of 1 / degree Celsius.

[0058] Based on the temperature impedance characteristics of the power supply circuit, one of the two correction methods mentioned above can be selected to correct the candidate impedance parameter, converting the candidate impedance parameter under the target temperature condition into the target impedance parameter under the reference temperature condition, thereby improving the accuracy of the target impedance parameter.

[0059] In the embodiment provided in step S18 above, the reference impedance parameter can be predetermined based on the impedance of the power supply circuit in a normal power supply state at a reference temperature state, and stored in the BMC. The reference impedance parameter can be an impedance value, or it can be a parameter that can characterize the impedance distribution of the power supply circuit in a normal power supply state. Optionally, a normal power supply state can mean that the power supply circuit does not have impedance anomalies caused by poor connection, unstable contact, abnormal device installation, or line abnormalities.

[0060] As an optional approach, before detecting the power supply status of the power supply circuit based on the target impedance parameter and the reference impedance parameter, the following steps may be performed, but are not limited to: detecting the impedance parameters of multiple power supply circuit samples under a reference temperature condition and normal power supply condition, obtaining multiple impedance parameter samples, wherein each power supply circuit sample is used to power the server component sample; detecting the average impedance parameter and standard deviation parameter of the multiple impedance parameter samples, wherein the average impedance parameter is used to indicate the average value of the multiple impedance parameter samples, and the standard deviation parameter is used to indicate the degree of dispersion of the multiple impedance parameter samples relative to the average impedance parameter; calculating the impedance deviation parameter based on the standard deviation parameter and a preset confidence parameter, wherein the impedance deviation parameter is used to indicate the allowable deviation of the impedance parameter of the power supply circuit from the average impedance parameter under a reference temperature condition and normal power supply condition; calculating the difference between the average impedance parameter and the impedance deviation parameter to obtain the lower limit impedance parameter, and calculating the sum between the average impedance parameter and the impedance deviation parameter to obtain the upper limit impedance parameter, wherein the reference impedance parameter includes the lower limit impedance parameter and the upper limit impedance parameter.

[0061] Optionally, in this embodiment, the power supply circuit samples can be power supply circuits that are pre-determined to be in a normal power supply state. Server component samples may include, but are not limited to, motherboards, processors, graphics processors, memory, hard drives, or network cards. Multiple power supply circuit samples can be power supply circuits with the same or similar structures. For example, multiple power supply circuit samples can use the same type of power cables, connectors, and power monitoring devices, and supply power to the same type of server component samples. This reduces the impact of differences in power supply circuit structure on impedance parameter samples, enabling multiple impedance parameter samples to reflect the impedance distribution of the same type of power supply circuit under normal power supply conditions.

[0062] In one alternative implementation, sampling data of each power supply circuit sample can be directly acquired and impedance parameter samples calculated under a reference temperature condition. In another alternative implementation, candidate impedance parameters can be calculated when the power supply circuit sample is at other temperature conditions, and then the candidate impedance parameters can be corrected to the impedance parameter samples under the reference temperature condition based on the corresponding target temperature parameters and temperature impedance information.

[0063] Optionally, when detecting impedance parameter samples, multiple power supply circuit samples can be controlled to be at a reference temperature, and the corresponding server component samples can be controlled to bear the same or similar operating loads. The BMC can determine the voltage and current parameters of the power supply circuit sample based on the sampled voltage and current collected by multiple power supply monitoring devices in the power supply circuit sample, and generate impedance parameter samples based on the voltage and current parameters. Optionally, impedance detection can be performed once or multiple times on the same power supply circuit sample, and the average or median of the multiple detection results can be determined as the impedance parameter sample corresponding to that power supply circuit sample, thereby reducing the impact of transient voltage fluctuations, sampling errors, or operating load fluctuations on the impedance parameter samples.

[0064] Optionally, in this embodiment, the ratio between the sum of multiple impedance parameter samples and the number of impedance parameter samples can be determined as the average impedance parameter. The standard deviation parameter can be determined based on the difference between each impedance parameter sample and the average impedance parameter. For example, the difference between each impedance parameter sample and the average impedance parameter can be calculated separately, the sum of squares of multiple differences can be averaged, and the standard deviation parameter can be determined based on the square root of the result. A smaller standard deviation parameter indicates a more concentrated impedance parameter distribution among multiple power supply circuit samples under normal power supply conditions; a larger standard deviation parameter indicates a greater difference between the impedance parameters of multiple power supply circuit samples. Optionally, before calculating the average impedance parameter and the standard deviation parameter, the validity of the multiple impedance parameter samples can be checked. For example, invalid impedance parameter samples obtained due to missing sampling data, insufficient sampling current, or abnormal operating conditions of the power supply circuit samples can be removed.

[0065] Optionally, in this embodiment, the confidence parameter is a coefficient determined according to a preset confidence level, used to limit the allowable deviation range of the impedance parameter relative to the average impedance parameter under normal power supply conditions. The higher the preset confidence level, the larger the confidence parameter can be, and the larger the corresponding impedance deviation parameter can be; the lower the preset confidence level, the smaller the confidence parameter can be, and the smaller the corresponding impedance deviation parameter can be.

[0066] It should be noted that the specific value of the confidence parameter can be preset based on the distribution of the impedance parameter samples, the detection accuracy requirements of the power supply circuit, and the sensitivity requirements for anomaly detection. For example, a larger confidence parameter can be set when it is necessary to reduce the probability of a normal power supply circuit being misjudged as an abnormal power supply circuit; a smaller confidence parameter can be set when it is necessary to improve the detection sensitivity for minor impedance anomalies.

[0067] Optionally, in this embodiment, the BMC can store the lower limit impedance parameter and the upper limit impedance parameter corresponding to the power supply circuit.

[0068] By using the above method, the impedance distribution is statistically obtained from multiple normal power supply circuit samples, and the upper and lower limits are determined using the average value and standard deviation. This allows the reference impedance parameters to truly reflect the normal impedance range, avoiding misjudgments caused by fixed thresholds, thereby improving the accuracy of power supply status detection.

[0069] As an optional approach, the power supply status of the power supply circuit can be detected based on the target impedance parameter and the reference impedance parameter in the following ways: detecting whether the target impedance parameter falls within the reference parameter range, wherein the reference parameter range includes impedance parameters that are greater than or equal to the lower limit impedance parameter and less than or equal to the upper limit impedance parameter, and the reference impedance parameter includes the lower limit impedance parameter and the upper limit impedance parameter; if the target impedance parameter falls within the reference parameter range, it is determined that the power supply circuit is in a normal power supply state; if the target impedance parameter does not fall within the reference parameter range, it is determined that the power supply circuit is in an abnormal power supply state.

[0070] Optionally, in this embodiment, the reference parameter range is used to represent the allowable impedance range of the power supply circuit under a reference temperature state and in a normal power supply state. The lower boundary of the reference parameter range is the lower limit impedance parameter, and the upper boundary of the reference parameter range is the upper limit impedance parameter. If the target impedance parameter falls within the reference parameter range, it indicates that the target impedance parameter is greater than or equal to the lower limit impedance parameter and less than or equal to the upper limit impedance parameter. When the target impedance parameter falls within the reference parameter range, it is determined that the target impedance parameter matches the impedance range of the power supply circuit under normal power supply state, thereby determining that the power supply circuit is in a normal power supply state. If the target impedance parameter does not fall within the reference parameter range, it is determined that the target impedance parameter does not match the impedance range of the power supply circuit under normal power supply state, thereby determining that the power supply circuit is in an abnormal power supply state.

[0071] Optionally, the cause of the power supply circuit's abnormal state can also be determined based on the parameter relationship between the target impedance parameter and the upper and lower limit impedance parameters. For example, if the target impedance parameter is greater than the upper limit impedance parameter, it indicates that the power supply circuit impedance is too high, suggesting possible poor connections, unstable contacts, or abnormal device installation. If the target impedance parameter is less than the lower limit impedance parameter, it indicates that the power supply circuit impedance is too low, suggesting possible abnormal continuity or other circuit abnormalities.

[0072] Optionally, in this embodiment, the power supply circuit may include multiple power supply branches connected in parallel. These multiple power supply branches can jointly power the same server component, and a second monitoring device can be deployed in each power supply branch. The difference in current carried by different power supply branches can reflect the current distribution among the multiple power supply branches.

[0073] As an optional approach, after determining that the power supply circuit is in a normal power supply state, the following steps may be performed, but are not limited to: Locating at least one second monitoring device from multiple power supply monitoring devices based on the power supply circuit's topology information, wherein the topology information is used to indicate the connection relationships between the multiple power supply monitoring devices deployed in the power supply circuit, and between the multiple power supply monitoring devices and the server components; the at least one second monitoring device is a power supply monitoring device that supplies power to the server components along the power supply direction and is not connected to any other power supply monitoring device between itself and the server components; In the case where the at least one second monitoring device includes multiple second monitoring devices, detecting the shunt abnormality state of the power supply branch corresponding to each second monitoring device based on the sampling current collected by each of the multiple second monitoring devices, wherein the shunt abnormality state is used to indicate whether there is a shunt abnormality in the corresponding power supply branch, and the sampling data includes the sampling current.

[0074] Optionally, in this embodiment, if the at least one second monitoring device found includes multiple second monitoring devices, it can be determined that the power supply circuit includes multiple power supply branches that supply power to the server components from the second monitoring devices. The BMC can acquire the sampling current collected by the multiple second monitoring devices respectively, and detect whether there is a current shunting abnormality in each power supply branch based on the relationship between the multiple sampling currents. A current shunting abnormality can indicate that the current borne by at least one of the multiple power supply branches does not match the current that the power supply branch should bear under normal current shunting conditions. For example, if the line structure and power supply capacity of the multiple power supply branches are the same or similar, the current normally borne by the multiple power supply branches can be the same or similar. If the sampling current of a certain power supply branch is significantly larger or smaller than the sampling current of other power supply branches, it can be determined that there is a current shunting abnormality in that power supply branch. If the at least one second monitoring device found includes only one second monitoring device, the current shunting abnormality detection is not performed.

[0075] For example, the power supply circuit includes two parallel power supply branches, which supply power to server component B through a second monitoring device B1 and a second monitoring device B2, respectively. The BMC can locate the second monitoring device B1 and the second monitoring device B2 based on the topology information and obtain the sampled current from each. If the circuit structures of the two power supply branches are the same or similar, but the sampled current collected by the second monitoring device B1 is significantly greater than that collected by the second monitoring device B2, it can be determined that the power supply branch corresponding to either the second monitoring device B1 or the second monitoring device B2 may have a current shunting anomaly.

[0076] It should be noted that if the target impedance parameter of the power supply circuit falls within the reference parameter range, it indicates that the overall impedance of the power supply circuit meets the normal power supply requirements, but it does not necessarily mean that all the parallel power supply branches in the power supply circuit are in a normal current shunting state. For example, if one power supply branch carries a larger current than another power supply branch carries a smaller current, the overall impedance of the power supply circuit may still fall within the reference parameter range. Therefore, after determining that the power supply circuit is in a normal power supply state, further detection of the abnormal current shunting state of each power supply branch based on the sampling current collected by multiple second monitoring devices can provide a more comprehensive status monitoring of the power supply circuit.

[0077] As an optional solution, the shunt anomaly status of the power supply branch corresponding to each second monitoring device can be detected in the following ways, but not limited to: calculating the absolute value of the difference between the sampled current collected by the second monitoring device and the reference current to obtain the current deviation parameter, wherein the reference current is the current when there is no shunt anomaly in the power supply branch, and the reference current is determined based on the sampled current collected by each of the multiple second monitoring devices; if the current deviation parameter is greater than a preset parameter threshold, the shunt anomaly status is determined to indicate that there is a shunt anomaly in the power supply branch; if the current deviation parameter is less than or equal to the preset parameter threshold, the shunt anomaly status is determined to indicate that there is no shunt anomaly in the power supply branch.

[0078] Optionally, in this embodiment, the reference current is used to represent the current that each power supply branch should bear when the multiple power supply branches are normally shunted. Optionally, when the line structure, power supply capacity, and rated current of the multiple power supply branches are the same or similar, the average value of the sampling current collected by the multiple second monitoring devices can be calculated to obtain the reference current.

[0079] For any second monitoring device, the BMC can calculate the difference between the sampled current acquired by the second monitoring device and the reference current, and take the absolute value of the difference to obtain the current deviation parameter corresponding to the second monitoring device. The current deviation parameter is used to indicate the degree of deviation between the actual current borne by the corresponding power supply branch and the current that should be borne under normal shunt conditions. The larger the current deviation parameter, the greater the difference between the actual current of the corresponding power supply branch and the current under normal shunt conditions.

[0080] Optionally, a preset parameter threshold is used to limit the allowable current deviation range of the power supply branch when there is no shunt anomaly. The preset parameter threshold can be pre-set according to the rated current of the power supply branch, sampling accuracy, normal current fluctuation range, and shunt anomaly detection accuracy requirements, and stored in the BMC. The preset parameter threshold can be represented by a fixed current value. For example, if the power supply circuit includes four parallel power supply branches with sampling currents of 10.2A, 9.8A, 10.1A, and 5.9A respectively, and an average value of 9.0A, then the corresponding current deviation parameters for the four power supply branches are 1.2A, 0.8A, 1.1A, and 3.1A respectively; if the preset parameter threshold is 2A, it can be determined that the first three power supply branches do not have a shunt anomaly, while the fourth power supply branch has a shunt anomaly.

[0081] Optionally, if a shunt anomaly is detected in a power supply branch, the BMC can record the corresponding server component identifier, the second monitoring device identifier, the sampled current, the reference current, and the current deviation parameter to locate the power supply branch with the shunt anomaly.

[0082] Optionally, in this embodiment, in order to better understand the status detection process of the power supply circuit described above, the above embodiment will be described in conjunction with the scenario of BMC monitoring the line loss of multiple power supply lines in the server, but this is not intended to limit the technical solution of the embodiment of this application.

[0083] Upon receiving a testing request after server production or assembly, or upon reaching the scheduled testing time during server operation, the BMC triggers the power supply circuit status monitoring process. For example, the BMC can trigger a periodic test every 24 hours. Through periodic testing, it can promptly detect increased impedance, performance degradation, or short circuits caused by line aging and notify maintenance personnel for repairs. Figure 4 This is a schematic diagram of a power supply circuit state detection process according to an embodiment of this application, such as... Figure 4 As shown, the main steps include the following:

[0084] Step S401: Determine the power supply circuit to be tested and the corresponding power supply monitoring device. BMC can determine the line loss circuits (equivalent to power supply circuits) such as PDB power board to CX8 board, PDB power board to MB motherboard, and PDB power board to GPU Riser card based on the pre-stored topology information, and find the power brick (equivalent to the first monitoring device) located upstream of the power supply circuit to be tested and one or more electronic fuses (equivalent to at least one second monitoring device) located on the power supply side of the server component.

[0085] Step S402: Read the sampling data from the first monitoring device and at least one second monitoring device. The BMC can read the first sampling data collected by the power supply brick and the second sampling data collected by the electronic fuse from the registers of the power supply brick and the electronic fuse, respectively. The first sampling data may include the output voltage and output current of the power supply brick, and the second sampling data may include the input voltage, output voltage, input current, output current, and sampling temperature of the electronic fuse.

[0086] Step S403: Determine the cable voltage drop, cable current, and cable temperature based on the first and second sampling data. The BMC calculates the difference between the first sampling voltage collected by the power supply block and the second sampling voltage collected by at least one electronic fuse to obtain the cable voltage drop (equivalent to a voltage parameter). In the presence of multiple electronic fuses, the average value of the multiple second sampling voltages can be used as the equivalent voltage, and the cable voltage drop is calculated based on the difference between the first sampling voltage and the equivalent voltage. The BMC sums the sampling currents collected by each electronic fuse to obtain the cable current (equivalent to a current parameter), and determines the cable temperature (equivalent to a target temperature parameter) based on the average, maximum, or weighted value of the sampling temperatures collected by each second monitoring device.

[0087] Step S404: Calculate the line loss impedance (equivalent to candidate impedance parameter) at the current cable temperature based on the cable voltage drop and cable current. The BMC can calculate the line loss impedance at the current cable temperature by the ratio between the cable voltage drop and the cable current.

[0088] Step S405: Perform temperature correction on the line loss impedance based on the current cable temperature to obtain the line loss impedance at the reference cable temperature. The BMC can calculate the temperature difference between the current cable temperature and the reference cable temperature (equivalent to a reference temperature parameter), calculate the correction parameter based on the temperature difference and the temperature resistance parameter, and perform temperature correction on the line loss impedance based on the correction parameter.

[0089] Step S406: Detect whether the line loss impedance falls within the reference impedance range (equivalent to the reference parameter range). If the line loss impedance falls within the reference impedance range, it is determined that the power supply circuit is in a normal power supply state, and step S408 is executed; if the line loss impedance does not fall within the reference impedance range, it is determined that the power supply circuit is in an abnormal power supply state, and step S407 is executed.

[0090] Step S407: Generate and output anomaly information. A sensor named "Impedance" can be configured internally within the BMC. When an abnormal power supply circuit or a shunt anomaly is detected in a power supply branch, the BMC can control the Impedance sensor to generate a "Transition to Non-critical from OK" SEL log. The sensor's evtdata2 field records the monitoring point where the anomaly occurred, the power supply circuit identifier, or the power supply branch identifier. The BMC can also output the SEL log, anomaly location, line loss impedance, reference impedance range, sampling voltage, sampling current, sampling temperature, or shunt detection results to the server management interface or maintenance management equipment.

[0091] Step S408: Check if the status detection of all power supply circuits is complete. If the status detection of all power supply circuits is not yet complete, the BMC selects the next power supply circuit to be tested and returns to step S401; if the status detection of all power supply circuits is complete, the current detection ends. In the case of this detection being a production stage detection, the detection result of the entire machine's power supply circuit can be output; in the case of this detection being a periodic detection during server operation, the status detection of the power supply circuit can be triggered again at the next periodic detection time.

[0092] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

[0093] Based on this understanding, the technical solution of this application, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods of the various embodiments of this application.

[0094] This embodiment also provides a power supply circuit state detection device, which is used to implement the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0095] Figure 5 This is a structural block diagram of a power supply circuit state detection device according to an embodiment of this application, such as... Figure 5 As shown, the device includes:

[0096] The determination module 502 is used to determine the voltage parameters, current parameters, and target temperature parameters of the power supply circuit based on the sampling data collected by multiple power supply monitoring devices. The power supply circuit is used to supply power to the server components. Multiple power supply monitoring devices are deployed in the power supply circuit. The multiple power supply monitoring devices are used to control the power output of the power supply circuit based on the sampling data. The voltage parameters are used to indicate the voltage drop generated by the power supply circuit along the power supply direction during the power supply process. The current parameters are used to indicate the current flowing through the power supply circuit. The target temperature parameters are used to indicate the target temperature state of the power supply circuit when it is carrying the operating load of the server components.

[0097] The generation module 504 is used to generate candidate impedance parameters based on voltage and current parameters. The candidate impedance parameters are used to indicate the impedance of the power supply circuit under the target temperature condition.

[0098] The correction module 506 is used to correct the candidate impedance parameters according to the target temperature parameters and temperature impedance information to obtain the target impedance parameters. The temperature impedance information is used to indicate the degree of influence of the temperature state on the impedance of the power supply circuit, and the target impedance parameters are used to indicate the impedance of the power supply circuit under the reference temperature state.

[0099] The detection module 508 is used to detect the power supply status of the power supply circuit based on the target impedance parameter and the reference impedance parameter, wherein the reference impedance parameter is used to indicate the impedance of the power supply circuit under the reference temperature state and the normal power supply state.

[0100] The state detection device provided in the embodiments of this application is also configured to perform the steps in any of the above-described embodiments of the state detection method for the power supply circuit, which will not be repeated here. For a description of the features in the embodiments corresponding to the state detection device for the power supply circuit, please refer to the relevant descriptions in the embodiments corresponding to the state detection method for the power supply circuit, which will not be repeated here.

[0101] It should be noted that the above modules can be implemented by software or hardware. For the latter, they can be implemented in the following ways, but are not limited to: all the above modules are located in the same processor; or, the above modules are located in different processors in any combination.

[0102] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to perform the steps in any of the above-described embodiments of the power supply circuit state detection method.

[0103] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0104] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0105] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above-described embodiments of the power supply circuit state detection method when running.

[0106] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0107] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above-described embodiments of the power supply circuit state detection method.

[0108] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above-described power supply circuit state detection method embodiments.

[0109] Any of the components, modules, units, parts, methods, and operations described herein can be implemented using software, firmware, hardware (e.g., fixed logic circuitry), manual processing, or any combination thereof. Alternatively or additionally, any functionality described herein can be performed at least in part by one or more hardware logic components, such as, but not limited to, CPUs, FPGAs, Application-Specific Integrated Circuits (ASICs), Application-Specific Standard Products (ASSPs), Systems on Chips (SoCs), Complex Programmable Logic Devices (CPLDs), Microcontroller Units (MCUs), etc. The terms "system," "computing device," or "apparatus" used herein encompass various means, devices, and machines for processing data, including, for example, one or more programmable processors, computers, SoCs, or combinations thereof. The apparatus may also include code that creates an execution environment for the computer program in question, such as code constituting processor firmware, protocol stacks, database management systems, operating systems, cross-platform runtime environments, virtual machines, or combinations thereof. The aforementioned computer program (also known as a program, software, software application, application (APP), script, or code) can be written in any form of programming language, including compiled or interpreted languages, declarative or procedural languages, and can be deployed in any form, including as a standalone program or as a module, component, subroutine, object, or other unit suitable for a computing environment.

[0110] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0111] The foregoing has provided a detailed description of a power supply circuit state detection method and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and its core ideas. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A method for detecting the state of a power supply circuit, characterized in that, include: The voltage, current, and target temperature parameters of the power supply circuit are determined based on sampling data collected by multiple power supply monitoring devices. The power supply circuit is used to supply power to server components. The multiple power supply monitoring devices are deployed in the power supply circuit and are used to control the power output of the power supply circuit according to the sampling data. The voltage parameter is used to indicate the voltage drop generated by the power supply circuit along the power supply direction during the power supply process. The current parameter is used to indicate the current flowing through the power supply circuit. The target temperature parameter is used to indicate the target temperature state of the power supply circuit when bearing the operating load of the server components. Candidate impedance parameters are generated based on the voltage parameters and the current parameters, and the candidate impedance parameters are used to indicate the impedance of the power supply circuit under the target temperature condition; The candidate impedance parameters are corrected based on the target temperature parameters and temperature impedance information to obtain the target impedance parameters. The temperature impedance information is used to indicate the degree of influence of temperature state on the impedance of the power supply circuit, and the target impedance parameters are used to indicate the impedance of the power supply circuit under reference temperature state. The power supply status of the power supply circuit is detected based on the target impedance parameter and the reference impedance parameter, wherein the reference impedance parameter is used to indicate the impedance of the power supply circuit under the reference temperature state and the normal power supply state.

2. The method according to claim 1, characterized in that, The step of correcting the candidate impedance parameter based on the target temperature parameter and temperature impedance information to obtain the target impedance parameter includes: A temperature difference parameter is determined based on the target temperature parameter and the reference temperature parameter, wherein the reference temperature parameter is used to indicate the reference temperature state, and the temperature difference parameter is used to indicate the temperature difference between the target temperature state and the reference temperature state; Correction parameters are calculated based on the temperature difference parameter and the temperature resistance parameter, wherein the temperature resistance information includes the temperature resistance parameter, which is used to indicate the degree of change of the impedance of the power supply circuit under a unit temperature difference. The candidate impedance parameter is corrected according to the correction parameter to obtain the target impedance parameter.

3. The method according to claim 2, characterized in that, The step of correcting the candidate impedance parameter according to the correction parameter to obtain the target impedance parameter includes: The difference between the candidate impedance parameter and the correction parameter is calculated to obtain the target impedance parameter, wherein the correction parameter is used to indicate the impedance difference between the impedance of the power supply circuit at the target temperature and the impedance of the power supply circuit at the reference temperature, and the correction parameter includes the correction parameter. Alternatively, the target impedance parameter can be obtained by calculating the ratio between the candidate impedance parameter and the correction ratio parameter, wherein the correction ratio parameter is used to indicate the impedance ratio between the impedance of the power supply circuit at the target temperature and the impedance of the power supply circuit at the reference temperature, and the correction parameter includes the correction ratio parameter.

4. The method according to claim 1, characterized in that, The step of determining the voltage parameters, current parameters, and target temperature parameters of the power supply circuit based on sampling data collected from multiple power supply monitoring devices includes: Based on the topology information of the power supply circuit, a first monitoring device and at least one second monitoring device are located from the plurality of power supply monitoring devices. The topology information is used to indicate the connection relationship between the plurality of power supply monitoring devices deployed in the power supply circuit and between the plurality of power supply monitoring devices and the server component. The at least one second monitoring device is a power supply monitoring device that supplies power to the server component along the power supply direction and is not connected to the server component by any other power supply monitoring device. The first monitoring device is a power supply monitoring device that supplies power to the at least one second monitoring device along the power supply direction and is not connected to the at least one second monitoring device by any other power supply monitoring device. The voltage parameter, the current parameter, and the target temperature parameter are determined based on the first sampling data collected by the first monitoring device and the second sampling data collected by the at least one second monitoring device, wherein the sampling data includes the first sampling data and the second sampling data.

5. The method according to claim 4, characterized in that, The step of determining the voltage parameter, the current parameter, and the target temperature parameter based on the first sampling data collected by the first monitoring device and the second sampling data collected by at least one second monitoring device includes: The voltage parameter is obtained by calculating the difference between the first sampling voltage and the equivalent voltage collected by the first monitoring device, wherein the equivalent voltage is the average voltage of the second sampling voltage collected by each of the at least one second monitoring device, the first sampling data includes the first sampling voltage, and the second sampling data includes the second sampling voltage, the sampling current and the sampling temperature; The sum of the sampled currents collected by each of the second monitoring devices is calculated to obtain the current parameters; The target temperature parameter is determined based on the sampling temperature collected by each of the second monitoring devices.

6. The method according to claim 1, characterized in that, The step of detecting the power supply status of the power supply circuit based on the target impedance parameter and the reference impedance parameter includes: Detect whether the target impedance parameter falls within the reference parameter range, wherein the reference parameter range includes impedance parameters that are greater than or equal to the lower limit impedance parameter and less than or equal to the upper limit impedance parameter, and the reference impedance parameter includes the lower limit impedance parameter and the upper limit impedance parameter; If the target impedance parameter falls within the reference parameter range, the power supply circuit is determined to be in the normal power supply state. If the target impedance parameter does not fall within the reference parameter range, the power supply circuit is determined to be in an abnormal power supply state.

7. The method according to claim 6, characterized in that, After determining that the power supply circuit is in the normal power supply state, the method further includes: At least one second monitoring device is located from the plurality of power supply monitoring devices according to the topology information of the power supply circuit, wherein the topology information is used to indicate the connection relationship between the plurality of power supply monitoring devices deployed in the power supply circuit and between the plurality of power supply monitoring devices and the server component, and the at least one second monitoring device is the power supply monitoring device that supplies power to the server component along the power supply direction and is not connected to the server component by any other power supply monitoring device. When the at least one second monitoring device includes multiple second monitoring devices, the shunt abnormality status of the power supply branch corresponding to each of the multiple second monitoring devices is detected based on the sampling current collected by each of the multiple second monitoring devices, wherein the shunt abnormality status is used to indicate whether there is a shunt abnormality in the corresponding power supply branch, and the sampling data includes the sampling current.

8. The method according to claim 7, characterized in that, The step of detecting the shunt abnormality status of the power supply branch corresponding to each of the plurality of second monitoring devices based on the sampling current collected by each of the second monitoring devices includes: The absolute value of the difference between the sampled current collected by the second monitoring device and the reference current is calculated to obtain the current deviation parameter. The reference current is the current when there is no shunt abnormality in the power supply branch. The reference current is determined based on the sampled current collected by each of the plurality of second monitoring devices. When the current deviation parameter is greater than a preset parameter threshold, the current shunt abnormality state is determined to indicate that there is a current shunt abnormality in the power supply branch; If the current deviation parameter is less than or equal to the preset parameter threshold, the current shunt abnormality state is determined to indicate that there is no current shunt abnormality in the power supply branch.

9. The method according to claim 1, characterized in that, Before detecting the power supply state of the power supply circuit based on the target impedance parameter and the reference impedance parameter, the method further includes: The impedance parameters of multiple power supply circuit samples are detected at the reference temperature and under the normal power supply condition to obtain multiple impedance parameter samples, wherein each power supply circuit sample is used to supply power to the server component sample. The average impedance parameter and standard deviation parameter of the plurality of impedance parameter samples are detected, wherein the average impedance parameter is used to indicate the average value of the plurality of impedance parameter samples, and the standard deviation parameter is used to indicate the degree of dispersion of the plurality of impedance parameter samples relative to the average impedance parameter; The impedance deviation parameter is calculated based on the standard deviation parameter and the preset confidence parameter, wherein the impedance deviation parameter is used to indicate the degree of allowable deviation of the impedance parameter of the power supply circuit relative to the average impedance parameter under the reference temperature state and the normal power supply state. The difference between the average impedance parameter and the impedance deviation parameter is calculated to obtain the lower limit impedance parameter, and the sum between the average impedance parameter and the impedance deviation parameter is calculated to obtain the upper limit impedance parameter. The reference impedance parameter includes the lower limit impedance parameter and the upper limit impedance parameter.

10. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor, configured to implement the steps of the state detection method for the power supply circuit as described in any one of claims 1 to 9 when executing the computer program.

Images