Substrate holding device and exposure apparatus

Abstract

This disclosure provides a substrate holding apparatus and an exposure device. The substrate holding apparatus includes a stage, a clamping member, and a condenser. The stage includes a bearing surface, which includes a first region and a second region surrounding the first region. The first region of the stage is used to hold a substrate to be exposed. The clamping member is located on the bearing surface and surrounds the substrate to be exposed to limit its position. The clamping member includes a clamping body and a plurality of cooling pillars. The clamping body is located in the second region. A vent hole is provided on the side surface of the clamping body facing the first region. The cooling pillars are located on the side surface of the clamping body facing the first region, and when the stage holds the substrate to be exposed, the cooling pillars are located between the clamping body and the substrate to be exposed. The condenser is configured to communicate with the vent hole to output condensed gas to the vent hole. The condensed gas is output from the vent hole and flows into the cooling pillars. The cooling pillars can reduce the risk of immersion liquid overflowing during the exposure process seeping into the back side of the substrate to be exposed.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to a substrate holding device and an exposure apparatus. Background Technology

[0002] In the manufacturing of display panels, such as Organic Light-Emitting Diode (OLED) display panels, photolithography is one of the key technologies, especially the exposure step, which determines the accuracy and quality of pattern transfer. Through the exposure process, the fine patterns on the photomask can be accurately copied onto a substrate coated with photoresist, providing an accurate mask for subsequent etching, coating, and other processes. This enables the precise fabrication of key structures such as OLED pixel electrodes and thin-film transistors (TFTs), which is crucial for improving the resolution, aperture ratio, and display performance of the display panel.

[0003] Immersion lithography is an evolution of traditional lithography techniques. During the photolithography process, a high-refractive-index liquid (the immersion solution) is placed between the optical system of the exposure equipment and the photoresist. According to optical principles, light wavelengths shorten when propagating through a high-refractive-index medium. This shortened wavelength means smaller lithographic feature sizes can be achieved, enabling the fabrication of finer circuit patterns, thus meeting the high-resolution requirements of OLED display panels.

[0004] However, during immersion exposure, the immersion liquid may overflow from the surface of the substrate. If the immersion liquid flows to the back of the substrate, it will degrade the quality of the substrate, thereby affecting the display function of the display panel fabricated based on the substrate. Summary of the Invention

[0005] A first aspect of this disclosure provides a substrate holding apparatus, comprising a stage, a clamping member, and a condenser. The stage includes a bearing surface comprising a first region and a second region surrounding the first region, the first region of which is used to hold a substrate to be exposed. The clamping member is located on the bearing surface and surrounds the substrate to be exposed to limit its position. The clamping member includes a clamping body and a plurality of cooling pillars. The clamping body is located in the second region, and an vent is provided on the side surface of the clamping body facing the first region. The cooling pillars are located on the side surface of the clamping body facing the first region, and when the stage holds the substrate to be exposed, the cooling pillars are located between the clamping body and the substrate to be exposed. The condenser is configured to communicate with the vent to output condensed gas to the vent, the condensed gas being output from the vent and flowing towards the cooling pillars.

[0006] In the process of exposing a substrate, a stage is used to support the substrate to be exposed, and a clamp is used to limit the position of the substrate to be exposed to prevent it from sliding and thus reducing the exposure accuracy. In this exposure process, the immersion method is used to expose the substrate. During this process, the immersion liquid may overflow from the exposure area and enter the gap between the clamp and the substrate to be exposed, causing the substrate to slide and reducing the exposure accuracy. In addition, if the immersion liquid seeps into the back side of the substrate to be exposed (the side opposite to the exposed side), it may cause deformation, contamination, and subsequent degradation of display functions. In the above-disclosed solution, a condenser can inject condensate gas into the gap between the clamp and the substrate to be exposed. The condensate gas cools the cooling column at the gap. If the immersion liquid overflows and enters the gap between the clamp and the substrate to be exposed and comes into contact with the cooling column, the cooling column will cool the immersion liquid to reduce its temperature, thereby reducing the fluidity of the immersion liquid and reducing the risk of the immersion liquid seeping into the back side of the substrate to be exposed.

[0007] In one specific embodiment of the first aspect of this disclosure, one end of the cooling column is connected to the clamping body, and the other end of the cooling column extends toward the substrate to be exposed.

[0008] In one specific embodiment of the first aspect of this disclosure, the cross-sectional area of ​​the second end is larger than that of the first end in a direction perpendicular to both the bearing surface and the length direction of the cooling column. This increases the contact area between the substrate to be exposed and the clamping member when they contact each other, thereby reducing the risk of stress concentration damage to the substrate caused by the external force applied by the cooling column.

[0009] In one specific embodiment of the first aspect of this disclosure, the cooling column is a straight column. This reduces the machining difficulty of the cooling column, thereby reducing the machining cost of the clamping component.

[0010] In another specific embodiment of the first aspect of this disclosure, the cooling column is a curved column. This increases the surface area of ​​the cooling column, thereby improving its cooling efficiency for the immersion liquid and further reducing the risk of the immersion liquid seeping into the back side of the substrate to be exposed.

[0011] In one specific embodiment of the first aspect of this disclosure, the cross-sectional shape of the cooling column is circular along a direction perpendicular to both the bearing surface and the length direction of the cooling column. This reduces the machining difficulty of the cooling column, thereby lowering the machining cost of the clamping component.

[0012] In another specific embodiment of the first aspect of this disclosure, the edge shape of the cross-section of the cooling column is curved along a direction perpendicular to the bearing surface and perpendicular to the length direction of the cooling column. This increases the surface area of ​​the cooling column, thereby improving its cooling efficiency for the immersion liquid and further reducing the risk of the immersion liquid seeping into the back side of the substrate to be exposed.

[0013] In one specific embodiment of the first aspect of this disclosure, the stage is provided with an air inlet that communicates with an air outlet, and the condenser is also communicated with the air inlet. In this way, at least a portion of the channel for conveying condensed gas can be disposed in the stage, thereby reducing the structural complexity of the clamping component.

[0014] In one specific embodiment of the first aspect of this disclosure, the air inlet is located on the side of the stage away from the clamping member. This reduces the structural complexity of the side of the stage containing the bearing surface, thereby improving the reliability of the exposure process for the substrate to be exposed.

[0015] In one specific embodiment of the first aspect of this disclosure, multiple vent holes are provided and evenly arranged around the substrate to be exposed. Thus, during the exposure process, the multiple vent holes can improve the output efficiency of the condensate gas and allow the condensate gas to be relatively evenly distributed around the periphery of the substrate to be exposed, enabling each cooling column to be cooled quickly and uniformly.

[0016] In one specific embodiment of the first aspect of this disclosure, cooling columns are arranged in multiple rows on the side surface of the clamping body, with each row having multiple cooling columns, and the direction of the rows being perpendicular to the bearing surface. By providing multiple rows of cooling columns, the cooling efficiency of the immersion liquid can be increased, thereby further reducing the risk of the immersion liquid seeping into the back side of the substrate to be exposed.

[0017] In one specific embodiment of the first aspect of this disclosure, the cooling columns are arranged in multiple rows and columns, with adjacent cooling columns in the same row located in adjacent columns, and adjacent cooling columns in the same column located in adjacent rows.

[0018] In another specific embodiment of the first aspect of this disclosure, the cooling columns in adjacent rows are staggered. This increases the effective range of the cooling columns, allowing coolant passing through the gap between two adjacent cooling columns in the previous row to flow into the cooling columns of the next row, thereby improving the cooling efficiency of the immersion liquid and further reducing the risk of immersion liquid seeping into the back side of the substrate to be exposed.

[0019] In one specific embodiment of the first aspect of this disclosure, the surfaces of all cooling pillars are configured to be hydrophobic. This reduces the amount of immersion liquid entering the gap between the substrate to be exposed and the clamping body, and the hydrophobic properties of the cooling pillars directly impede the flow of the immersion liquid, further reducing the risk of immersion liquid seeping into the back side of the substrate to be exposed.

[0020] In another specific embodiment of the first aspect of this disclosure, the surface of the cooling column closer to the bearing surface is configured to be hydrophobic, while the surface of the cooling column farther from the bearing surface is configured to be hydrophilic. Thus, the immersion liquid entering the gap between the substrate to be exposed and the clamping body is adsorbed by the upper hydrophilic cooling column and repelled by the lower hydrophobic cooling column, thereby preventing the immersion liquid entering the gap between the substrate to be exposed and the clamping body from continuing to flow downwards, thereby further reducing the risk of the immersion liquid seeping into the back side of the substrate to be exposed.

[0021] In one specific embodiment of the first aspect of this disclosure, the clamping member further includes a magnet, and a receiving groove is provided on the side surface of the clamping body facing the stage, with the magnet located in the receiving groove. By providing the magnet, the clamping member can be magnetically attached, facilitating its removal and removal from the stage.

[0022] In one specific embodiment of the first aspect of this disclosure, the substrate holding device further includes an electromagnetic element disposed on the stage to provide magnetic force to the magnet when the clamping member is mounted. By providing the electromagnetic element, a magnetic attraction can be generated between the magnet and the electromagnetic element, and when it is necessary to remove the clamping member, the electromagnetic element can be controlled to eliminate the magnetic force between it and the magnet, thereby making it easier to remove the clamping member.

[0023] In one specific embodiment of the first aspect of this disclosure, a through hole is provided in the stage, corresponding to the electromagnetic element and the receiving groove. Thus, when the electromagnetic element generates a magnetic field, the through hole can prevent the stage from shielding the magnetic field, allowing the electromagnetic element to attract a magnet for fixing the clamping component.

[0024] In one specific embodiment of the first aspect of this disclosure, at least a portion of the electromagnetic element is located in a through-hole. This reduces the distance between the electromagnetic element and the magnet, thereby increasing the magnetic attraction between them.

[0025] The second aspect of this disclosure is an exposure apparatus, which includes the substrate holding device described in the first aspect above.

[0026] In one specific embodiment of the second aspect of this disclosure, the exposure apparatus may further include a liquid immersion chamber body, the liquid immersion chamber body including a liquid immersion chamber, a liquid inlet and a liquid outlet, the liquid immersion chamber having a liquid immersion opening facing the stage of the substrate holding device to align with the substrate to be exposed, at least a portion of the orthographic projection of the liquid immersion opening onto the bearing surface of the stage coincides with at least a portion of the orthographic projection of the substrate to be exposed onto the bearing surface of the stage.

[0027] In the above scheme, immersion liquid is injected into the immersion chamber through the inlet. The area of ​​the substrate to be exposed that is covered by the immersion opening is covered by the immersion liquid, thereby exposing this area. By moving the stage and / or the immersion chamber, the immersion opening can scan other areas of the substrate to be exposed, thus completing the exposure of the entire substrate. During this process, the immersion liquid is discharged from the outlet to avoid the accumulation of impurities in the immersion liquid in the immersion chamber, which would reduce the exposure quality. In addition, in the above exposure process, as the stage and the immersion chamber move relative to each other, the immersion liquid may overflow from the gap between the substrate to be exposed and the immersion chamber. After the overflowing immersion liquid reaches the gap between the clamp and the substrate to be exposed, the cooling column, which is cooled by condensing gas injected by the condenser, will cool the overflowing immersion liquid, thereby reducing the fluidity of the immersion liquid and reducing the risk of the immersion liquid seeping into the back side of the substrate to be exposed.

[0028] In one specific embodiment of the second aspect of this disclosure, the exposure apparatus includes a liquid delivery device configured to communicate with an inlet and an outlet to inject immersion liquid into the immersion chamber through the inlet and to output immersion liquid from the immersion chamber through the outlet. Attached Figure Description

[0029] Figure 1 The diagram shown is a structural schematic of an exposure device provided in one embodiment.

[0030] Figure 2 for Figure 1 A schematic diagram of the planar structure of the substrate holding device in the exposure equipment shown.

[0031] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the substrate holding device along M1-N1 in one design.

[0032] Figure 4 for Figure 2 The diagram shows a cross-sectional view of the substrate holding device along M1-N1 in another design.

[0033] Figure 5 for Figure 2 The diagram shows a cross-sectional view of the substrate holding device along M1-N1 in another design.

[0034] Figure 6 for Figure 2 The diagram shows a cross-sectional view of the substrate holding device along M2-N2 in one design.

[0035] Figure 7 for Figure 2 The diagram shows a cross-sectional view of the substrate holding device along M2-N2 in another design.

[0036] Figure 8 for Figure 2A schematic diagram of the internal structure of the substrate holding device shown.

[0037] Figure 9 for Figure 2 The diagram shows a cross-sectional view of the substrate holding device along M2-N2 in another design.

[0038] Figure 10 for Figure 2 The diagram shows a cross-sectional view of the substrate holding device along M1-N1 in another design.

[0039] Figure 11 for Figure 2 The diagram shows a cross-sectional view of the substrate holding device along M1-N1 in another design.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10-Substrate holding device; 100-Stage; 101-First region; 102-Second region; 110-Bearing surface; 121-Adsorption groove; 122-Adsorption channel; 200-Clamping member; 201-Exhaust hole; 202-Inlet hole; 203-Receiving groove; 210-Clamping body; 220-Cooling column; 221-First end; 222-Second end; 230-Magnet; 300-Condenser; P-Gap; 400-Electromagnetic component; 401-Through hole;

[0042] 20 - Liquid immersion chamber body; 21 - Liquid immersion chamber; 22A - Liquid inlet; 22B - Liquid outlet; 23 - Infusion device; 24 - Liquid immersion opening;

[0043] 30 - Mask plate;

[0044] 40 - Substrate to be exposed. Detailed Implementation

[0045] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this specification.

[0046] In the process of immersion exposure, at least a portion of the substrate to be exposed is located in the immersion liquid. As the exposure process proceeds, the substrate to be exposed needs to be moved so that other parts of the substrate to be exposed are also covered by the immersion liquid, thereby achieving full-area exposure of the substrate to be exposed.

[0047] During the exposure process, exposure light, such as ultraviolet light, passes through a photomask and illuminates the photoresist layer coated on the substrate to be exposed. Photoresist is a photosensitive material; under light of a specific wavelength, the photosensitizer within it undergoes a photochemical reaction. For example, in the case of positive photoresist, the exposed areas decompose, causing a change in the photoresist's chemical structure, transforming it from insoluble or poorly soluble to soluble. During this process, the change in the photosensitizer's molecular structure may produce small decomposition products, which enter the surrounding immersion solution as impurities. Furthermore, during exposure, ultraviolet light irradiation may cause localized temperature increases in the photoresist on the substrate, generating a thermal effect. This can lead to thermal decomposition or denaturation of some components in the photoresist, resulting in substances different from normal photochemical reaction products. These sites, caused by the thermal effect, also become impurities entering the surrounding immersion solution.

[0048] During the exposure process, as the substrate is moved, the immersion liquid may overflow between the container holding the immersion liquid (e.g., the liquid immersion chamber body described below) and the substrate. If the immersion liquid, especially the immersion liquid containing the aforementioned impurities, flows to the back side of the substrate (the side opposite to the side being exposed), it may cause risks such as substrate slippage, deformation, contamination, and subsequent degradation of display functions.

[0049] At least one embodiment of this disclosure provides a substrate holding apparatus and an exposure device to at least solve the aforementioned technical problems. The substrate holding apparatus includes a stage, a clamping member, and a condenser. The stage includes a bearing surface comprising a first region and a second region surrounding the first region. The first region of the stage is used to hold a substrate to be exposed. The clamping member is located on the bearing surface and surrounds the substrate to be exposed to limit its position. The clamping member includes a clamping body and a plurality of cooling pillars. The clamping body is located in the second region. An exhaust port is provided on the side surface of the clamping body facing the first region. The cooling pillars are located on the side surface of the clamping body facing the first region, and when the stage holds the substrate to be exposed, the cooling pillars are located between the clamping body and the substrate to be exposed. The condenser is configured to communicate with the exhaust port to output condensed gas to the exhaust port. The condensed gas exits from the exhaust port and flows towards the cooling pillars. In the process of exposing a substrate, the stage is used to hold the substrate to be exposed, and the clamping member is used to limit the position of the substrate to be exposed to prevent it from sliding and causing a decrease in exposure accuracy. In this exposure process, an immersion method is used to expose the substrate. During this process, the immersion liquid may overflow from the exposure area and enter the gap between the clamp and the substrate, causing the substrate to slip and reducing exposure accuracy. Furthermore, if the immersion liquid seeps into the back side of the substrate (the side opposite to the exposed side), it can cause substrate deformation, contamination, and subsequent display function degradation. In the solution disclosed above, a condenser injects condensing gas into the gap between the clamp and the substrate. This condensing gas cools the cooling column at the gap. If the immersion liquid overflows and enters the gap between the clamp and the substrate and comes into contact with the cooling column, the cooling column cools the immersion liquid, reducing its temperature and thus its fluidity, thereby reducing the risk of the immersion liquid seeping into the back side of the substrate.

[0050] The structure of the substrate holding apparatus and exposure equipment according to at least one embodiment of the present disclosure will now be described in detail with reference to the accompanying drawings. In these drawings, a spatial rectangular coordinate system is established with the bearing surface of the stage in the substrate holding apparatus as a reference to visually represent the positional relationship of the same structures in different drawings. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the bearing surface of the stage, and the Z-axis is perpendicular to the bearing surface of the stage.

[0051] It should be noted that, since the exposure equipment may include a substrate holding device, the exposure equipment is directly described in the following embodiments in order to simultaneously explain the specific structure of the substrate holding device, its function in the exposure equipment, and the principle of solving the above-mentioned technical problems.

[0052] like Figures 1 to 3As shown, the exposure apparatus includes a substrate holding device 10 and an immersion chamber body 20. In the exposure process, a mask 30 is provided and a substrate 40 to be exposed is mounted on the substrate holding device 10. The light used for exposure passes through the mask 30 and the immersion liquid in the immersion chamber body 20 to create an illuminated area on the substrate 40. The immersion chamber body 20 is used to constrain the immersion liquid so that the immersion liquid covers the illuminated area of ​​the substrate 40, thereby exposing the photoresist on the substrate 40 located in the illuminated area.

[0053] For example, the immersion liquid can be deionized water, etc. The material of the immersion liquid can be selected according to the actual process requirements, and the embodiments disclosed herein do not limit this.

[0054] In at least one embodiment of this disclosure, such as Figures 1 to 3 As shown, the liquid immersion chamber body 20 includes a liquid immersion chamber 21, a liquid inlet 22A and a liquid outlet 22B. The liquid immersion chamber 21 has a liquid immersion opening 24, which faces the stage 100 of the substrate holding device 10 to align with the substrate 40 to be exposed. At least a portion of the liquid immersion opening 24 is projected onto the bearing surface 110 of the stage 100, and at least a portion of the projection of the substrate 40 to be exposed onto the bearing surface 110 of the stage 100 coincides with the projection of the substrate 40 to be exposed onto the bearing surface 110 of the stage 100. In the exposure process of the substrate 40 to be exposed, immersion liquid is injected into the immersion chamber 21 through the liquid inlet 22A. The area of ​​the substrate 40 to be exposed that is covered by the liquid immersion opening 24 is covered by the immersion liquid, thereby exposing the area. By moving the stage 100 and / or the liquid immersion chamber 21, the liquid immersion opening 24 can scan other areas of the substrate 40 to be exposed, thereby completing the exposure of the entire substrate. During this process, the immersion liquid is discharged from the liquid outlet 22B to avoid the accumulation of impurities in the immersion liquid in the liquid immersion chamber 21, which would reduce the quality of the exposure.

[0055] In at least one embodiment of this disclosure, the immersion chamber body 20 needs to have sufficient strength and rigidity to withstand the pressure of the immersion liquid and various forces during the exposure process, while ensuring good optical transmittance so as not to affect the propagation of lithography light. For example, the immersion chamber body 20 is made of a corrosion-resistant material with good optical properties, such as quartz glass.

[0056] In at least one embodiment of this disclosure, the liquid immersion chamber body 20 is shaped as a cuboid or cube. This shape not only facilitates manufacturing and installation with other components, but also provides a more regular space, which is beneficial for controlling and maintaining the stability of the immersion liquid. In addition, the cuboid or cube structure also facilitates the analysis and optimization of the flow field within the chamber, in order to achieve a more uniform liquid distribution and photolithography performance.

[0057] In at least one embodiment of this disclosure, such as Figures 1 to 3As shown, the exposure equipment may also include a liquid delivery device 23, which is configured to communicate with an inlet 22A and an outlet 22B to inject immersion liquid into the immersion chamber 21 through the inlet 22A and to output immersion liquid from the immersion chamber 21 through the outlet 22B. It should be noted that in actual processes, the number and position of the outlets 22B on the immersion chamber 21 can be designed according to actual needs to improve the applicability of the immersion chamber body 20. For example, the inlet 22A can be equipped with corresponding valves and piping systems to precisely control the input / output flow rate and input / output velocity of the immersion liquid.

[0058] In at least one embodiment of this disclosure, such as Figures 1 to 3 As shown, the substrate holding device 10 includes a stage 100 and a clamping member 200. The stage 100 includes a bearing surface 110, which includes a first region 101 and a second region 102 surrounding the first region 101. The first region 101 of the stage 100 is used to bear the substrate 40 to be exposed. The clamping member 200 is located on the bearing surface 110 and surrounds the substrate 40 to limit the position of the substrate 40. The clamping member 200 is used to limit the position of the substrate 40 to ensure the exposure accuracy of the substrate 40.

[0059] In at least one embodiment of this disclosure, the stage 100 may be configured to have a drive structure so that the stage 100 can move horizontally (e.g. Figure 1 The substrate 40 to be exposed can be exposed by moving (or rotating) along the X-axis or Y-axis.

[0060] During the exposure process, as the stage 100 and the immersion chamber 21 move relative to each other, the immersion liquid may overflow from the gap between the substrate 40 to be exposed and the immersion chamber 21. After the overflowing immersion liquid reaches the gap P between the clamp 200 and the substrate 40 to be exposed, it may seep into the back side of the substrate 40 to be exposed.

[0061] In the exposure process, the immersion method is used to expose the substrate 40. During this process, as the stage 100 and the immersion chamber 21 move relative to each other, the immersion liquid may overflow from the gap between the substrate 40 and the immersion chamber 21 and enter the gap P between the clamp 200 and the substrate 40, thereby causing the substrate to slide and reducing the exposure accuracy. In addition, if the immersion liquid seeps into the back side of the substrate 40 (the side opposite to the side being exposed), it may cause deformation, contamination and subsequent degradation of the display function of the substrate 40.

[0062] In at least one embodiment of this disclosure, such as Figures 1 to 3As shown, the substrate holding device 10 includes a condenser 300. The clamping member 200 includes a clamping body 210 and a plurality of cooling columns 220. The clamping body 210 is located in a second region 102 of the bearing surface 110. An vent 201 is provided on the side surface of the clamping body 210 facing the first region 101 of the bearing surface 110. The cooling columns 220 are located on the side surface of the clamping body 210 facing the first region 101, and when the stage 100 carries the substrate 40 to be exposed, the cooling columns 220 are located between the clamping body 210 and the substrate 40 to be exposed. The condenser 300 is configured to communicate with the vent 201 to output condensed gas to the vent 201. The condensed gas is output from the vent 201 and flows towards the cooling columns 220. In the exposure process, condenser 300 can inject condensing gas into the gap P between the clamp 200 and the substrate 40 to be exposed. The condensing gas will cool the cooling column 220 at the gap P. If the immersion liquid overflows and enters the gap P between the clamp 200 and the substrate 40 to be exposed and comes into contact with the cooling column 220, the cooling column 220 will cool the immersion liquid to reduce its temperature, thereby reducing the fluidity of the immersion liquid and reducing the risk of the immersion liquid seeping into the back side of the substrate 40 to be exposed.

[0063] In at least one embodiment of this disclosure, such as Figures 1 to 3 As shown, an adsorption tank 121 and an adsorption pipe 122 can be provided in the stage 100. The adsorption tank 121 and the adsorption pipe 122 are connected to each other. The adsorption pipe 122 is used to connect to a device that provides vacuum adsorption, so as to provide vacuum adsorption to the substrate 40 to be exposed in the exposure process, so that the substrate 40 to be exposed is fixed on the stage 100.

[0064] In at least one embodiment of this disclosure, such as Figures 1 to 3 As shown, one end (first end 221) of the cooling column 220 is connected to the clamping body 210, and the other end (second end 222) of the cooling column 220 extends toward the substrate 40 to be exposed. In this way, the effective range of the cooling column 220 can be increased to improve the cooling efficiency of the immersion liquid.

[0065] In at least one embodiment of this disclosure, such as Figure 4 As shown, along a direction perpendicular to the bearing surface 110 and perpendicular to the length direction of the cooling column 220 (e.g.) Figure 4(in the X-axis direction), the cross-sectional area of ​​the second end 222 is larger than that of the first end 221. In the exposure process, if the substrate 40 to be exposed slides, the clamping member 200 needs to block the substrate 40 to be exposed, that is, the cooling column 220 of the clamping member 200 will be in direct contact with the substrate 40 to be exposed. In the above-described solution of this disclosure, when the substrate 40 to be exposed contacts the clamping member 200, the relatively large cross-sectional area of ​​the second end 222 can increase the contact area between the clamping member 200 and the substrate 40 to be exposed, thereby reducing the risk of stress concentration damage to the substrate 40 due to the external force applied by the cooling column 220; in addition, this design can increase the surface area of ​​the cooling column 220, thereby improving the cooling efficiency of the immersion liquid.

[0066] In the embodiments disclosed herein, the overall shape of the cooling column 220 is not limited and can be selected according to the actual process requirements.

[0067] In some embodiments of this disclosure, such as Figure 3 or Figure 4 As shown, the cooling column 220 is a straight column. This reduces the machining difficulty of the cooling column 220, thereby reducing the machining cost of the clamping part 200.

[0068] In other embodiments of this disclosure, such as Figure 5 As shown, the cooling column 220 is a curved column. This increases the surface area of ​​the cooling column 220, thereby improving its cooling efficiency for the immersion liquid and further reducing the risk of the immersion liquid seeping into the back side of the substrate 40 to be exposed.

[0069] In the embodiments of this disclosure, the cross-sectional shape of the cooling column 220 is not limited and can be selected according to the actual process requirements.

[0070] In some embodiments of this disclosure, such as Figure 6 As shown, the cross-sectional shape of the cooling column 220 is circular along a direction perpendicular to the bearing surface 110 and perpendicular to the length direction of the cooling column 220. This reduces the machining difficulty of the cooling column 220, thereby reducing the machining cost of the clamping part 200.

[0071] In other embodiments of this disclosure, such as Figure 7 As shown, the edge shape of the cross-section of the cooling column 220 is curved along a direction perpendicular to the bearing surface 110 and perpendicular to the length direction of the cooling column 220. In this way, the surface area of ​​the cooling column 220 can be increased to improve the cooling efficiency of the cooling column 220 for the immersion liquid, thereby further reducing the risk of the immersion liquid seeping into the back side of the substrate 40 to be exposed.

[0072] It should be noted that "curved shape" refers to any shape other than a circle. When the cross-sectional shape of the cooling column 220 is curved, the specific shape of that curve is not limited and can be, but is not limited to, other shapes. Figure 7 The shape shown. For example, the curve can be a shape formed by the sides of a triangle, rectangle, or polygon, or the edges of the cross-sectional shape can be wavy, etc.

[0073] See again for at least one embodiment of this disclosure. Figures 1 to 3 As shown, the stage 100 is provided with an air inlet 202, which communicates with an air outlet 201, and the condenser 300 is also connected to the air inlet 202. In this way, at least a portion of the channel for conveying condensed gas can be provided in the stage 100, thereby reducing the structural complexity of the clamping member 200.

[0074] In at least one embodiment of this disclosure, such as Figures 1 to 3 As shown, the air inlet 202 is located on the side of the stage 100 away from the clamping member. In this way, the structural complexity of the side of the stage 100 where the bearing surface 110 is located can be reduced, thereby improving the reliability of the exposure process of the substrate 40 to be exposed.

[0075] In at least one embodiment of this disclosure, such as Figure 8 As shown, multiple vent holes 201 are provided and are evenly arranged around the substrate 40 to be exposed. In this way, during the exposure process, multiple vent holes 201 can improve the output efficiency of condensed gas and make the condensed gas relatively evenly distributed around the substrate 40 to be exposed, so that each cooling column 220 can be cooled quickly and evenly.

[0076] In at least one embodiment of this disclosure, such as Figure 6 and Figure 7 As shown, the cooling columns 220 are arranged in multiple rows on the side surface of the clamping body 210, with each row having multiple cooling columns 220, and the direction of the rows is perpendicular to the bearing surface 110. By setting multiple rows of cooling columns 220, the cooling efficiency of the immersion liquid can be increased, thereby further reducing the risk of the immersion liquid seeping into the back side of the substrate 40 to be exposed.

[0077] In the embodiments disclosed herein, the arrangement of the cooling columns 220 is not limited and can be selected according to the actual process requirements.

[0078] In some embodiments of this disclosure, such as Figure 6 and Figure 7 As shown, the cooling columns 220 are arranged in multiple rows and columns. Adjacent cooling columns 220 in the same row are located in adjacent columns, and adjacent cooling columns 220 in the same column are located in adjacent rows. That is, the cooling columns 220 are arranged in a matrix.

[0079] In other embodiments of this disclosure, such as Figure 9 As shown, the cooling columns 220 in adjacent rows are arranged in an alternating pattern. This increases the effective range of the cooling columns 220, and the coolant passing through the gap P between two adjacent cooling columns 220 in the previous row will flow to the cooling column 220 in the next row, thereby improving the cooling efficiency of the immersion liquid and further reducing the risk of the immersion liquid seeping into the back side of the substrate 40 to be exposed.

[0080] In embodiments of this disclosure, the surface energy of at least a portion of the cooling column 220 can be adjusted (to exhibit hydrophobicity or hydrophilicity) to adjust the flow effect of the immersion liquid on the cooling column 220.

[0081] In some embodiments of this disclosure, the surfaces of all cooling pillars 220 are configured to be hydrophobic. This reduces the amount of immersion liquid entering the gap P between the substrate 40 to be exposed and the clamping body 210, and the hydrophobic properties of the cooling pillars 220 can directly impede the flow of immersion liquid, further reducing the risk of immersion liquid seeping into the back side of the substrate 40 to be exposed.

[0082] In other embodiments of this disclosure, the surface of the cooling column 220 closer to the bearing surface 110 is configured to be hydrophobic, while the surface of the cooling column 220 farther from the bearing surface 110 is configured to be hydrophilic. Thus, the immersion liquid entering the gap P between the substrate to be exposed 40 and the clamping body 210 is adsorbed by the upper hydrophilic cooling column 220 and repelled by the lower hydrophobic cooling column 220, thereby preventing the immersion liquid entering the gap P between the substrate to be exposed 40 and the clamping body 210 from continuing to flow downwards, thereby further reducing the risk of the immersion liquid seeping into the back side of the substrate to be exposed 40.

[0083] In the embodiments of this disclosure, there are no restrictions on the manner in which the cooling column 220 possesses hydrophobic or hydrophilic properties, and the choice can be made according to the actual process. For example, the cooling column 220 can be directly made of materials with hydrophobic or hydrophilic properties, such as hydrophilic materials like quartz and titanium, or hydrophobic materials like polytetrafluoroethylene and acrylic resins; or, the surface of the cooling column 220 can be subjected to hydrophobic or hydrophilic treatment, for example, by coating the cooling column 220 with the aforementioned hydrophobic materials or forming hydrophilic materials such as magnesium fluoride, alumina, and silicon dioxide on the surface of the cooling column 220.

[0084] In at least one embodiment of this disclosure, such as Figure 10 As shown, the clamping member 200 also includes a magnet 230, and a receiving groove 203 is provided on the side surface of the clamping body 210 facing the stage 100, in which the magnet 230 is located. By providing the magnet 230, the clamping member can be magnetically attached, so that the clamping member 200 can be detached from the stage 100.

[0085] In at least one embodiment of this disclosure, such as Figure 10 As shown, the substrate holding device 10 also includes an electromagnetic element 400, which is disposed on the stage 100 to provide magnetic force to the magnet 230 when the clamping member 200 is installed. By providing the electromagnetic element 400, a magnetic attraction can be generated between the magnet 230 and the electromagnetic element 400. Moreover, when it is necessary to remove the clamping member, the electromagnetic element 400 can be controlled to eliminate the magnetic force between it and the magnet 230, thereby making it easier to remove the clamping member 200.

[0086] In at least one embodiment of this disclosure, such as Figure 11 As shown, the stage 100 is provided with a through hole 401, which corresponds to the electromagnetic element 400 and the receiving groove 203. In this way, when the electromagnetic element 400 generates a magnetic field, the through hole 401 can prevent the stage 100 from shielding the magnetic field, so that the electromagnetic element 400 can attract the magnet 230 for fixing the clamping member 200.

[0087] In at least one embodiment of this disclosure, such as Figure 11 As shown, at least a portion of the electromagnetic element 400 is located in the through hole 401. This reduces the distance between the electromagnetic element 400 and the magnet 230, thereby increasing the magnetic attraction between them.

[0088] It should be noted that the connection between the clamp 200 and the stage 100 is not limited to the magnetic adsorption mentioned above, but can also be set to snap-fit ​​connection, plug-in connection, etc.

[0089] This disclosure also provides a substrate, which is obtained by performing an exposure process on a substrate to be exposed using the exposure equipment provided in the above embodiments.

[0090] For example, the exposure process of this substrate includes, but is not limited to, the fabrication of thin-film transistors and electrodes for OLED devices.

[0091] This disclosure also provides a display panel, which includes the substrate described in the above embodiments. The display panel can be any product or component with a display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator.

[0092] This understanding allows for the use of various process formats shown above, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0093] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A substrate holding device, characterized in that, include: A stage, including a bearing surface, wherein the bearing surface includes a first region and a second region surrounding the first region, the first region of the stage being used to bear a substrate to be exposed; A clamping member is located on the bearing surface and surrounds the substrate to be exposed to limit the substrate to be exposed. The clamping member includes a clamping body and a plurality of cooling pillars. The clamping body is located in the second region. An air vent is provided on the side surface of the clamping body facing the first region. The cooling pillars are located on the side surface of the clamping body facing the first region. When the stage carries the substrate to be exposed, the cooling pillars are located between the clamping body and the substrate to be exposed. A condenser is configured to communicate with the outlet to output condensed gas to the outlet, the condensed gas being output from the outlet and flowing toward the cooling column.

2. The substrate holding device according to claim 1, characterized in that, The first end of the cooling column is connected to the clamping body, and the second end of the cooling column extends toward the substrate to be exposed; Preferably, in a direction perpendicular to the bearing surface and perpendicular to the length direction of the cooling column, the area of ​​the cross-section at the second end is greater than the area of ​​the cross-section at the first end. Preferably, The cooling column is a straight column; or The cooling column is a curved column.

3. The substrate holding device according to claim 1, characterized in that, The cross-sectional shape of the cooling column is circular along a direction perpendicular to the bearing surface and perpendicular to the length direction of the cooling column; or Along a direction perpendicular to the bearing surface and perpendicular to the length direction of the cooling column, the edge shape of the cross-section of the cooling column is curved.

4. The substrate holding device according to claim 1, characterized in that, The platform is provided with an air inlet, which is connected to the air outlet, and the condenser is connected to the air inlet. Preferably, the air inlet is located on the side of the stage away from the clamping member.

5. The substrate holding device according to any one of claims 1 to 4, characterized in that, The air vents are configured as multiple vents and are evenly arranged around the substrate to be exposed.

6. The substrate holding device according to any one of claims 1 to 4, characterized in that, The cooling columns are arranged in multiple rows on the side surface of the clamping body, with each row having multiple cooling columns, and the direction of the row is perpendicular to the bearing surface; Preferably, The cooling columns are arranged in multiple rows and columns, with adjacent cooling columns in the same row located in adjacent columns, and adjacent cooling columns in the same column located in adjacent rows; or The cooling columns in adjacent rows are arranged in an alternating pattern.

7. The substrate holding device according to any one of claims 1 to 4, characterized in that, All of the cooling columns have surfaces that are hydrophobic; or The surface of the cooling column closer to the bearing surface is configured to be hydrophobic, while the surface of the cooling column farther from the bearing surface is configured to be hydrophilic.

8. The substrate holding device according to any one of claims 1 to 4, characterized in that, The clamping member further includes a magnet, and a receiving groove is provided on the side surface of the clamping body facing the stage, and the magnet is located in the receiving groove; Preferably, the substrate holding device further includes an electromagnetic element disposed on the platform to provide magnetic force to the magnet when the clamping member is installed; Preferably, the stage is provided with a through hole, which corresponds to the electromagnetic element and the receiving groove; Preferably, at least a portion of the electromagnetic element is located in the through hole.

9. An exposure apparatus, characterized in that, The substrate holding device includes any one of claims 1 to 8.

10. The exposure apparatus according to claim 9, characterized in that, It also includes a liquid immersion chamber body, wherein the liquid immersion chamber body includes a liquid immersion chamber, a liquid inlet, and a liquid outlet, the liquid immersion chamber having a liquid immersion opening facing the stage of the substrate holding device for alignment with the substrate to be exposed, and At least a portion of the liquid immersion opening has its orthographic projection on the bearing surface of the stage coincides with at least a portion of the orthographic projection of the substrate to be exposed on the bearing surface of the stage. Preferably, the exposure device includes a liquid delivery device configured to communicate with the inlet and the outlet to inject immersion liquid into the immersion chamber through the inlet and to output immersion liquid from the immersion chamber through the outlet.

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